Schedule management device and schedule management system

Abstract

In the schedule management device (300), a performance data acquisition unit (310) acquires performance data (DC) indicating the progress of processing from each processing device. A progress management unit (340) uses the performance data (DC) acquired from the processing devices by the performance data acquisition unit (310) and the schedule data (DA1) set for the processing devices to determine whether or not the schedule data (DA1) set for at least one of the processing devices should be re-created. When it is determined that the schedule data (DA1) should be re-created, a schedule re-creation unit (350) re-creates the schedule data (DA1) into modified schedule data (DA2) in which the time of completion of processing of the target object is advanced beyond the time specified in the schedule data (DA1).

Description

Technical Field

[0001] The present disclosure relates to a schedule management device and a schedule management system.

Background Art

[0002] As disclosed in Patent Document 1, there is known a schedule management system including a cleaning device that performs cleaning as a treatment on an object, and a creation device that creates schedule data representing a schedule of the cleaning performed by the cleaning device. The cleaning device advances the cleaning of the object with the schedule represented by the schedule data as a target.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a schedule management device and a schedule management system capable of recreating once-created schedule data according to the progress of processing.

Means for Solving the Problems

[0005] In the schedule management device according to the present disclosure, the performance data acquisition unit is a processing device group composed of a plurality of processing devices that each perform processing on an object, and each processing device advances processing with the schedule represented by the schedule data set for the processing device as a target. The performance data acquisition unit acquires, from each processing device constituting the processing device group, performance data representing the progress of the processing in the processing device. The progress management unit uses the actual data acquired from the processing unit by the actual data acquisition unit and the schedule data set for that processing unit to determine whether or not the schedule data set for at least one of the processing units in the processing unit group should be recreated. The schedule recreation unit, when the progress management unit determines that the schedule data set for at least one of the processing units in the processing unit group should be recreated, recreates the schedule data set for that processing unit into modified schedule data in which the completion time of the processing of the target object is earlier than the time specified in the original schedule data. The processing unit, having recreated the schedule data into modified schedule data, proceeds with processing using the schedule represented by the modified schedule data as its target. The progress management unit includes a deviation time identification unit and a determination unit. The lag time identification unit uses the actual data acquired from the processing unit by the actual data acquisition unit and the schedule data set for that processing unit to identify the lag time of the processing progress relative to the target schedule for each processing unit. The lag time refers to the delay time, which represents the degree of delay in processing if the processing is behind schedule, and the progress time, which represents the degree of progress in processing if the processing is ahead of schedule. The determination unit determines whether the total value of the lag time in each processing unit, when summed up for the processing unit group, exceeds a predetermined allowable lag time, under the condition that lag time is positive and lead time is negative. If the total value exceeds the allowable lag time, it determines that the schedule data for at least one of the processing units in the processing unit group should be recreated. [Effects of the Invention]

[0006] With the above configuration, the schedule data, once created, can be recreated according to the progress of the processing. [Brief explanation of the drawing]

[0007] [Figure 1] Conceptual diagram showing the configuration of the schedule management system according to Embodiment 1 [Figure 2] Conceptual diagram showing the configuration of the cleaning device according to Embodiment 1 [Figure 3] Conceptual diagram showing the functions of the schedule management device according to Embodiment 1 [Figure 4] Conceptual diagram showing the configuration of the schedule management device according to Embodiment 1 [Figure 5] Flowchart of the schedule management process according to Embodiment 1 [Figure 6] Conceptual diagram showing the functions of the schedule regeneration unit according to Embodiment 1 [Figure 7] Flowchart of the schedule recreation process according to Embodiment 1 [Figure 8] Conceptual diagram illustrating the contents of the schedule data and modified schedule data according to Embodiment 1. [Figure 9] Conceptual diagram showing the arrangement of multiple cleaning device groups according to Embodiment 2 [Figure 10] Flowchart of the schedule management process according to Embodiment 2 [Modes for carrying out the invention]

[0008] The following description of the schedule management device and schedule management system according to the embodiment will be given as a specific example, with reference to the drawings, where the treatment applied to the object is cleaning. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

[0009] [Embodiment 1] As shown in Figure 1, the schedule management system 600 according to this embodiment includes a group of cleaning devices 200, which consists of a plurality of cleaning devices 100. Each cleaning device 100 cleans an object according to the device recipe ER. Each cleaning device 100 is an example of a processing device according to the present disclosure. The group of cleaning devices 200 is an example of a group of processing devices according to the present disclosure. In this embodiment, the object is a wafer. The wafer is used in the manufacture of semiconductor devices.

[0010] Furthermore, the schedule management system 600 includes a transport device 400 that supplies uncleaned wafers to each cleaning device 100, a schedule management device 300 that manages the progress of wafer cleaning in each cleaning device 100, and a production management device 500 that manages the entire semiconductor device production process, including wafer cleaning.

[0011] The production management device 500 creates schedule data DA1. The schedule data DA1 represents the schedule for wafer cleaning in the cleaning device 100 (hereinafter simply referred to as the schedule). The cleaning performed by each cleaning device 100 includes a plurality of sub - processes. The schedule in the cleaning device 100 has the meaning of a timetable that can specify the time as the target for completing each sub - process in that cleaning device 100.

[0012] The production management device 500 selects an optimal cleaning device 100 so that the load of the cleaning devices 100 in the cleaning device group 200 is leveled and creates the schedule data DA1. The production management device 500 provides the created schedule data DA1 to the schedule management device 300 and the transfer device 400.

[0013] The schedule management device 300 performs control to advance the cleaning according to the schedule represented by the schedule data DA1 for each cleaning device 100.

[0014] Also, the schedule management device 300 monitors the wafer cleaning in each cleaning device 100. Then, the schedule management device 300 creates a job recipe JR1 from the schedule data DA1 to control the cleaning device 100 or the cleaning device group 200 with the device recipe ER. When the delay in the progress of cleaning exceeds the allowable range, the schedule management device 300 determines that the schedule data DA1 to be created should be set for at least one of the cleaning devices 100 in the cleaning device group 200 in order to reduce the overall delay of the cleaning device group 200, and re - creates the schedule data DA1. Further, the schedule management device 300 also re - creates the job recipe JR1 from the re - created schedule data DA1.

[0015] Based on the schedule data DA1, the transfer device 400 transfers the unwashed wafers to each cleaning device 100 under the condition of minimizing the waiting period of the cleaning device 100 and the waiting period of the transfer device 400. Note that the transfer device 400 is an Automated Guided Vehicle (AGV) capable of autonomous transfer. The Automated Guided Vehicle may be an Overhead hoist Transport (OHT).

[0016] Here, the "waiting period of the cleaning device 100" means the period during which the cleaning device 100 has to wait for the arrival of the transfer device 400 as a result of the interruption of the supply of unwashed wafers to the cleaning device 100. Also, the "waiting period of the transfer device 400" means the period during which the transfer device 400 has to wait for the cleaning device 100 to receive the unwashed wafers as a result of an excessive supply of unwashed wafers to the cleaning device 100.

[0017] Hereinafter, the configuration of each cleaning device 100 in the cleaning device group 200 will be described.

[0018] As shown in FIG. 2, each cleaning device 100 includes a processing tank group 110 including a plurality of processing tanks for wafer cleaning, a transfer and monitoring device group 120 for transferring wafers to each processing tank constituting the processing tank group 110, and a control device 130 for controlling the transfer and monitoring device group 120 and the processing tank group 110.

[0019] The cleaning performed by each cleaning device 100 may include a plurality, specifically, in this embodiment, up to 5 sub-processes. The processing tank group 110 includes A tank 111, B tank 112, C tank 113, D tank 114, and E tank 115 as a plurality of processing tanks responsible for those sub-processes.

[0020] Tank A 111 is a storage tank for the first chemical solution. Tank B 112 is a storage tank for the first rinse solution. Tank C 113 is a storage tank for the second chemical solution. Tank D 114 is a storage tank for the second rinse solution. Tank E 115 is a drying tank that defines the space for drying the wafer.

[0021] The cleaning apparatus 100 performs the above-described partial processing for each wafer group, which is a group of objects composed of multiple wafers. Specifically, the partial processing performed by tank A 111 is the process of immersing the wafer group in the first chemical solution. The partial processing performed by tank B 112 is the process of immersing the wafer group in the first rinsing solution. The partial processing performed by tank C 113 is the process of immersing the wafer group in the second chemical solution. The partial processing performed by tank D 114 is the process of immersing the wafer group in the second rinsing solution. The partial processing performed by tank E 115 is the process of drying the wafer group.

[0022] The conveying and monitoring equipment group 120 works in cooperation with the processing tank group 110 to perform the multiple partial processing tasks described above. The conveying and monitoring equipment group 120 includes multiple conveying and monitoring devices 121-125.

[0023] The transport and monitoring equipment 121, which is installed for tank A 111, loads wafers into tank A 111 and unloads wafers from tank A 111. The transport and monitoring equipment 121 also functions as a status data output unit, outputting a status data DB in real time each time a partial processing task performed by tank A 111 is completed.

[0024] The transport and monitoring equipment 122, provided for tank B 112, is responsible for loading wafer groups into and out of tank B 112. The transport and monitoring equipment 122 also functions as a status data output unit, outputting a status data DB in real time each time a partial processing task performed by tank B 112 is completed.

[0025] The transport and monitoring equipment 123, which is installed for tank C 113, loads wafers into tank C 113 and unloads wafers from tank C 113. The transport and monitoring equipment 123 also functions as a status data output unit, outputting a status data DB in real time each time a partial processing task performed by tank C 113 is completed.

[0026] The transport and monitoring equipment 124, which is installed for tank D 114, loads wafers into tank D 114 and unloads wafers from tank D 114. The transport and monitoring equipment 124 also functions as a status data output unit, outputting status data DB in real time each time a partial processing task performed by tank D 114 is completed.

[0027] The transport and monitoring equipment 125, provided for the E tank 115, is responsible for loading wafer groups into the E tank 115 and unloading wafer groups from the E tank 115. The transport and monitoring equipment 125 also functions as a status data output unit, outputting a status data DB in real time each time a partial processing task performed by the E tank 115 is completed.

[0028] The control device 130 has a sub-control unit 131 that controls the transport and monitoring equipment group 120 and the processing tank group 110. The sub-control unit 131 receives control from the schedule management device 300 shown in Figure 1 and, aiming for the schedule represented by the schedule data DA1 set for the cleaning device 100, causes the transport and monitoring equipment group 120 and the processing tank group 110 to proceed with cleaning the wafer group.

[0029] The cleaning of the wafer group proceeds in the following order: partial processing by tank A 111 → partial processing by tank B 112 → partial processing by tank C 113 → partial processing by tank D 114 → partial processing by tank E 115. Depending on the type or lot of the wafer group, one of these partial processing steps may be omitted. The schedule specifies the target time for the completion of each partial processing step.

[0030] Specifically, the lower control unit 131 acquires status data DB in real time from the transport and monitoring equipment 121-125, and uses the acquired status data DB to understand the progress of cleaning in the cleaning device 100.

[0031] The lower control unit 131 then controls the transport and monitoring equipment group 120 and the processing tank group 110 under conditions that the progress it grasps in this way follows the progress of the target represented by the schedule. In other words, the lower control unit 131 uses the status data DB to control the cleaning in the cleaning device 100 so that it proceeds according to the schedule set for the cleaning device 100.

[0032] The following describes the schedule data DA1, which represents the target schedule for the cleaning device 100.

[0033] The upper part of Figure 8 shows an example of the contents of schedule data DA1. Schedule data DA1 specifies the type and lot of wafers to be cleaned.

[0034] Specifically, in this schedule data DA1, "a1" refers to the first lot of wafers of type "a". "a2" refers to the second lot of wafers of the same type "a". "a3" refers to the third lot of wafers of the same type "a".

[0035] Furthermore, “b1” refers to the first batch of wafers of type “b”. “b2” refers to the second batch of wafers of type “b”. “c1” refers to the first batch of wafers of type “c”. “c2” refers to the second batch of wafers of type “c”.

[0036] Furthermore, in the upper section of Figure 8, the width of each cell (ce11) represents the time duration. For ease of understanding, each cell in the top row is numbered according to the flow of time. Schedule data DA1 specifies the order of the aforementioned partial processing to be applied to each wafer group, for each wafer group whose type and lot have been identified.

[0037] Specifically, this schedule data DA1 specifies that for each of the wafer groups a1-a3, the cleaning should proceed in the following order: partial processing by tank A 111 → partial processing by tank B 112 → partial processing by tank C 113 → partial processing by tank D 114 → partial processing by tank E 115.

[0038] In the following, we will assume that the width of one grid cell represents a time duration of 10 minutes. As an example, we will explain the specifications for wafer group a1. This schedule data DA1 specifies that after 10 minutes are required for loading wafer group a1, partial processing of wafer group a1 in tank A 111, partial processing in tank B 112, partial processing in tank C 113, partial processing in tank D 114, and partial processing in tank E 115 will be performed for 10 minutes each. Furthermore, after the partial processing in tank E 115, 10 minutes are required for unloading wafer group a1.

[0039] Furthermore, after partial processing of wafer group a1 in tank A 111, it is stipulated that tank A 111 itself be cleaned for 30 minutes in preparation for cleaning the next wafer group a2 in tank A 111. The cleaning of tank A 111 is performed in parallel with the partial processing in tank B 112, tank C 113, and tank D 114. Hereafter, the cleaning of the processing tank itself will be referred to as "in-tank cleaning".

[0040] As another example, let's explain the specifications for wafer group b1. This schedule data DA1 specifies that it takes 10 minutes to load wafer group b1, and then 10 minutes each for partial processing of wafer group b1 in tank A 111, partial processing in tank B 112, and partial processing in tank E 115. After the partial processing in tank E 115, it takes 10 minutes to unload wafer group b1.

[0041] Furthermore, following partial treatment in tank A 111, tank A 111 is cleaned for 30 minutes; following partial treatment in tank B 112, tank B 112 is cleaned for 30 minutes; and following partial treatment in tank E 115, tank E 115 is cleaned for 30 minutes.

[0042] However, wafer group b1 is not subjected to partial processing in tank C 113 or tank D 114. Therefore, in cleaning wafer group b1, in-tank cleaning of tanks C 113 and D 114 is unnecessary. The same applies to wafer group b2.

[0043] As another example, let's explain the specifications for wafer group c1. This schedule data DA1 specifies that after 10 minutes are required for loading wafer group c1, partial processing of wafer group c1 in tank C 113, partial processing in tank D 114, and partial processing in tank E 115 will each take 10 minutes. Furthermore, after the partial processing in tank E 115, 10 minutes are required for unloading wafer group c1.

[0044] Furthermore, following partial treatment in tank C 113, tank C 113 is cleaned for 30 minutes; following partial treatment in tank D 114, tank D 114 is cleaned for 30 minutes; and following partial treatment in tank E 115, tank E 115 is cleaned for 30 minutes.

[0045] However, wafer group c1 is not subjected to partial processing in tank A 111 or tank B 112. Therefore, in cleaning wafer group c1, in-tank cleaning of tanks A 111 and B 112 is unnecessary. The same applies to wafer group c2.

[0046] As described above, the schedule data DA1 specifies, for each group of wafers whose type and lot have been identified, which partial processing will be applied to that group of wafers, the order in which the partial processing will be applied to that group of wafers, and the timing of the completion of each of those partial processing processes.

[0047] In the upper part of Figure 8, for ease of understanding, an example is shown where the completion timing of each sub-process is identified as a relative time based on the start time of the time interval represented by the cell numbered "1". According to the actual schedule data DA1, the start time mentioned above can also be identified, and the absolute time of completion of each sub-process can also be identified.

[0048] The schedule data DA1 described above is recreated as needed by the schedule management device 300 shown in Figure 1. The schedule management device 300 in Figure 1 determines whether or not to recreate the schedule data DA1 based on the actual progress of cleaning in the cleaning device 100 shown in Figure 2. If the schedule management device 300 decides to create the schedule data DA1, it similarly recreates the job recipe JR1.

[0049] Therefore, the cleaning device 100 shown in Figure 2 also has a configuration and function for reporting the progress of cleaning to the schedule management device 300 shown in Figure 1.

[0050] Returning to Figure 2, the configuration and operation of the cleaning device 100 for reporting the progress of cleaning will be described below.

[0051] The control device 130, like the lower control unit 131, has a time data annotation unit 132 that acquires status data DB in real time from each of the transport and monitoring devices 121-125, which serve as status data output units.

[0052] When the time data annotation unit 132 acquires the status data DB, it appends a timestamp representing the time of acquisition as time data, and outputs the status data DB with the time data appended as actual data DC to the schedule management device 300 shown in Figure 1.

[0053] As previously described, each of the transport and monitoring devices 121-125 outputs a status data DB in real time each time it completes the part of processing it is responsible for. The time data annotation unit 132 then acquires the status data DB in real time. Therefore, the time of completion of the part of processing represented by the status data DB can be identified by the timestamp, which is the time data attached to the status data DB.

[0054] Specifically, according to the time data appended to the status data DB output by the transport / monitoring device 121, the time when the partial processing performed by tank A 111 is completed can be identified. According to the time data appended to the status data DB output by the transport / monitoring device 122, the time when the partial processing performed by tank B 112 is completed can be identified. According to the time data appended to the status data DB output by the transport / monitoring device 123, the time when the partial processing performed by tank C 113 is completed can be identified. According to the time data appended to the status data DB output by the transport / monitoring device 124, the time when the partial processing performed by tank D 114 is completed can be identified. According to the time data appended to the status data DB output by the transport / monitoring device 125, the time when the partial processing performed by tank E 115 is completed can be identified.

[0055] As described above, the time data appended to the status data DB allows us to identify the completion time of the partial processing represented by that status data DB. Therefore, the actual data DC, which is the status data DB with the time data appended, represents the progress of cleaning by the cleaning device 100.

[0056] Next, the schedule management device 300 will be described. The schedule management device 300 receives reports on the progress of cleaning from each cleaning device 100 by acquiring performance data DC from each cleaning device 100.

[0057] As shown in Figure 3, the schedule management device 300 has a performance data acquisition unit 310 that acquires performance data DC. The performance data DC is acquired from each cleaning device 100 in the cleaning device group 200. The performance data DC acquired from the cleaning device 100 represents the actual cleaning progress in that cleaning device 100.

[0058] Furthermore, the schedule management device 300 has a schedule acquisition unit 320 that acquires schedule data DA1 from the production management device 500. The schedule data DA1 represents the target progress of cleaning in each cleaning device 100.

[0059] Furthermore, the schedule management device 300 has a higher-level control unit 330 that controls the cleaning device 100 using the schedule data DA1 acquired by the schedule acquisition unit 320.

[0060] The upper control unit 330 creates a job recipe JR1 for controlling the cleaning device 100 using the device recipe ER from the schedule data DA1 provided by the schedule acquisition unit 320. This job recipe JR1 is data that links the cleaning device 100 specified in the schedule data DA1 with the device recipe ER stored in that cleaning device 100.

[0061] Furthermore, the upper control unit 330 instructs each cleaning device 100 to perform cleaning according to the created job recipe JR1. The lower control unit 131 of each cleaning device 100 receives control from the upper control unit 330 and proceeds with cleaning the wafer according to the device recipe ER of the job recipe JR1 set for that cleaning device 100.

[0062] Furthermore, the schedule management device 300 has a progress management unit 340 that determines whether or not the schedule data DA1 should be recreated. The progress management unit 340 uses the actual data DC acquired from the cleaning device 100 by the actual data acquisition unit 310 and the schedule data DA1 acquired by the schedule acquisition unit 320 to determine whether or not the schedule data DA1 set for at least one of the cleaning devices 100 in the cleaning device group 200 should be recreated.

[0063] This decision is made based on a comparison between the time data included in the actual data DC, which represents the completion time of the partial processing, and the target time by which that partial processing should be completed, which is represented in the schedule data DA1.

[0064] Specifically, the progress management unit 340 has a deviation time identification unit 341 that identifies the deviation time from the target for the actual progress in each cleaning device 100.

[0065] The deviation time identification unit 341 uses the actual data DC acquired from the cleaning device 100 by the actual data acquisition unit 310 and the schedule data DA1 set for the cleaning device 100 to identify the deviation time of the cleaning progress relative to the target schedule for each cleaning device 100.

[0066] The deviation time in the cleaning device 100 refers to the delay time, which represents the degree of delay in cleaning when the cleaning is behind schedule, when considering the entire process including all partial processing performed in the cleaning device 100, and the advance time, which represents the degree of progress in cleaning when the cleaning is ahead of schedule.

[0067] Furthermore, the progress management unit 340 has a determination unit 342 that determines whether or not the schedule data DA1 should be recreated based on the deviation time identified by the deviation time identification unit 341. Specifically, the determination unit 342 performs the first determination process and the second determination process described below.

[0068] The first determination process is a process that determines whether the deviation time in each cleaning device 100 exceeds a predetermined first allowable delay time.

[0069] Here, the first allowable delay time refers to the allowable value (threshold) of delay time set for the cleaning device group 200. The cleaning device group 200 (the so-called cleaning line) accumulates and cancels out the delay times of each individual cleaning device 100 to set the cleaning delay time for the cleaning device group 200 as an allowable value, and this delay time is called the first allowable delay time. For this reason, the measurement point for the first allowable delay time is the measurement point at the output of the cleaning device group 200 (cleaning line).

[0070] The second determination process is a process that determines whether the total value of the deviation times in each cleaning device 100, when summed for the group of cleaning devices 200, exceeds a predetermined second allowable delay time, under the condition that delay time is positive and advance time is negative.

[0071] Here, the second allowable delay time refers to the allowable value (threshold) of delay time set for the total value obtained by summing the deviation times of each individual cleaning device 100 for the cleaning device group 200. The range of the cleaning device group 200 for which the delay time and lead time are accumulated can be set according to desired conditions. If all cleaning device groups 200 are set as the desired range, the second allowable delay time will be the same value as the first allowable delay time. If a specific cleaning device 100 is set as the desired range, the delay time of that specific cleaning device 100 becomes the second allowable delay time. By setting the second allowable delay time, delays can be detected earlier compared to setting only the first allowable delay time. This is because the first allowable delay time is measured at the output, so delays cannot be detected until the output is obtained, whereas the second allowable delay time is calculated by accumulating the delay time, making it possible to detect delays during the output process. In particular, by setting the second allowable delay time precisely, delays that would be critical at the time of output can be detected early.

[0072] If the determination unit 342 determines in the first determination process that the deviation time in any of the cleaning devices 100 exceeds the first allowable delay time, or if the determination unit 342 determines in the second determination process that the above total value exceeds the second allowable delay time, it determines that the schedule data DA1 for at least one of the cleaning devices 100 in the cleaning device group 200 should be recreated.

[0073] Furthermore, the schedule management device 300 has a schedule recreation unit 350 that performs schedule recreation processing to recreate the schedule data DA1.

[0074] The schedule recreation process is a process in which, when the determination unit 342 of the progress management unit 340 determines that the schedule data DA1 set for at least one of the cleaning devices 100 in the cleaning device group 200 should be recreated, the schedule data DA1 set for that cleaning device 100 is recreated as a different new schedule data (hereinafter referred to as modified schedule data) DA2.

[0075] The time for wafer cleaning completion specified in the modified schedule data DA2 is earlier than the time for wafer cleaning completion specified in the original schedule data DA1.

[0076] Furthermore, the schedule recreation unit 350 performs a presentation process to present the newly created modified schedule data DA2 to the user for user confirmation, and an acceptance process to receive an operation from the user who has confirmed the modified schedule data DA2 to approve the application of the modified schedule data DA2.

[0077] Furthermore, the schedule management device 300 has a post-processing confirmation unit 360 that determines whether or not the change from schedule data DA1 to modified schedule data DA2 is acceptable, taking into account the impact of the change on subsequent processes. Here, "post-processing" refers to the processes that follow the cleaning of wafers performed by the cleaning equipment group 200 in the semiconductor device production process.

[0078] The post-processing verification unit 360, upon receiving an operation in the above acceptance process indicating approval for the reflection of the modified schedule data DA2, investigates the impact of changing the schedule data DA1 to the modified schedule data DA2 on the post-processing verification unit. The post-processing verification unit 360 then determines whether the change from schedule data DA1 to the modified schedule data DA2 is acceptable in the post-processing verification unit.

[0079] One reason for making such a determination is that even if the wafer cleaning process is completed earlier by changing the schedule data DA1 to the modified schedule data DA2, if the subsequent processes cannot keep up with that advancement, a waiting time will ultimately occur in one of the subsequent processes, rendering the creation of the modified schedule data DA2 pointless.

[0080] Furthermore, the schedule management device 300 has a modified schedule reflection unit 370 that reflects changes made to the modified schedule data DA2 from the schedule data DA1.

[0081] If the downstream process confirmation unit 360 determines that the change from schedule data DA1 to modified schedule data DA2 is acceptable, the modified schedule reflection unit 370 provides the production control device 500 with an instruction to reflect the change and the modified schedule data DA2.

[0082] The production management device 500 changes the schedule data DA1, which it manages, to the modified schedule data DA2 in accordance with the above instructions from the modified schedule reflection unit 370.

[0083] As a result, the modified schedule data DA2 is provided from the production management device 500 to the schedule acquisition unit 320, representing the schedule for the cleaning device 100 (hereinafter referred to as the cleaning device to be modified) for which the schedule data DA1 was set.

[0084] The higher-level control unit 330 then creates a modified job recipe JR2 from the modified schedule data DA2. The higher-level control unit 330 then performs control based on the modified job recipe JR2. A new device recipe ER of the modified job recipe JR2 is set for the cleaning device 100 that is subject to modification.

[0085] Figure 4 shows the hardware configuration of the schedule management device 300 described above. The schedule management device 300 has a communication device 300a that is responsible for data communication with each cleaning device 100 and with the production management device 500.

[0086] Furthermore, the schedule management device 300 has an output device 300b that presents the modified schedule data DA2 to the user for user confirmation in the presentation process described above. The output device 300b may be a display device that presents the modified schedule data DA2 by display, or it may be a printing device that presents the modified schedule data DA2 by printing.

[0087] Furthermore, the schedule management device 300 has an input device 300c on which the user performs an operation to acknowledge the reflection of the modified schedule data DA2 in the acceptance process described above. The input device 300c is composed of a mouse, keyboard, etc. Alternatively, the input device 300c and the output device 300b may be composed of a touch screen.

[0088] Furthermore, the schedule management device 300 includes a storage device 300d that stores a schedule management program 300e that defines the procedures for the operations performed by the schedule management device 300, and a processor 300f that executes the schedule management program 300e.

[0089] The processor 300f executes the schedule management program 300e, thereby realizing the functions of each component shown in Figure 3. The schedule management processes realized by each component shown in Figure 3 are summarized below.

[0090] As shown in Figure 5, first, the schedule acquisition unit 320 acquires the latest schedule data DA1 for each cleaning device 100 from the production management device 500, and the actual data acquisition unit 310 acquires actual data DC from each cleaning device 100 (step S11).

[0091] Here, "latest schedule data DA1" refers to the modified schedule data DA2 if it has been reflected in step S17 described later, and to the schedule data DA1 created by the production control device 500 otherwise.

[0092] Next, the deviation time identification unit 341 identifies the deviation time for each cleaning device 100 using the actual data DC acquired from the cleaning device 100 and the schedule data DA1 set for the cleaning device 100 (step S12).

[0093] Next, the determination unit 342 compares the deviation time in each cleaning device 100 with the first allowable delay time and determines whether the deviation time in any of the cleaning devices 100 exceeds the first allowable delay time (step S13). This determination is the first determination process described above.

[0094] If the determination unit 342 determines in the first determination process that the deviation time in any of the cleaning devices 100 does not exceed the first allowable delay time (step S13; NO), it then performs the second determination process described above (step S14). That is, the determination unit 342 determines whether the total value of the deviation times in the cleaning device group 200 exceeds the second allowable delay time.

[0095] If the second determination process determines that the total value of the delay time does not exceed the second allowable delay time (step S14; NO), the process returns to step S11.

[0096] On the other hand, if the second determination process determines that the total value of the deviation times exceeds the second allowable delay time (step S14; YES), or if the first determination process determines that the deviation time in any of the cleaning devices 100 exceeds the first allowable delay time (step S13; YES), the process proceeds to step S15. Note that either the determination in step S13 or the determination in step S14 may be omitted.

[0097] In step S15, the schedule recreation process described above is performed. That is, the schedule recreation unit 350 recreates the schedule data DA1 set for at least one of the cleaning devices 100 in the cleaning device group 200 into modified schedule data DA2 (step S15).

[0098] In step S15, it is optional which cleaning device 100 the schedule data DA1 set for is recreated. If "YES" is determined in step S13, the schedule data DA1 of the cleaning device 100 for which the deviation time was determined to exceed the first allowable delay time in step S13 may be recreated. Alternatively, even if "YES" is determined in step S13, the schedule data DA1 of a different cleaning device 100 from the one for which the deviation time was determined to exceed the first allowable delay time in step S13 may be recreated. The schedule data DA1 that can be recreated into the modified schedule data DA2 will be automatically selected.

[0099] Then, in the acceptance process described above, if the user performs an operation to acknowledge the reflection of the modified schedule data DA2, and the subsequent process confirmation unit 360 determines that the reflection of the modified schedule data DA2 is acceptable (step S16; YES), the modified schedule reflection unit 370 causes the production management device 500 to perform the reflection of the modified schedule data DA2 (step S17). After that, the process returns to step S11.

[0100] On the other hand, if the user does not perform an action to acknowledge the reflection of the modified schedule data DA2 in the aforementioned acceptance process, or if the post-processing confirmation unit 360 determines that the reflection of the modified schedule data DA2 is unacceptable (step S16; NO), the modified schedule reflection unit 370 discards the modified schedule data DA2 (step S18). The process then returns to step S11.

[0101] The schedule recreation process performed by the schedule recreation unit 350 in step S15 described above will be explained below.

[0102] As shown in Figure 6, the schedule recreation unit 350 includes a change search unit 351 that searches for changes to the schedule data DA1 into the modified schedule data DA2.

[0103] As shown in the upper part of Figure 8, the schedule data DA1 defines the arrangement of cells representing partial processing and cells representing tank cleaning on the time axis. The “search for changes” mentioned above means searching for the possibility of changing the arrangement of these cells, that is, the possibility of changing the time periods in which partial processing is performed and the time periods in which tank cleaning is performed.

[0104] Furthermore, the schedule recreation unit 350 has a fixed rule holding unit 352 that holds a plurality of fixed rules referenced in the above search. A fixed rule represents the order in which the arrangement of cells is defined by the schedule data DA1 and should not be changed.

[0105] Specifically, as shown in the upper part of Figure 8, the schedule data DA1 specifies the order of partial processing between different types of wafers, and the order of partial processing between different lots of the same type, for multiple wafer groups, each with its own specified type and lot. In this embodiment, the order of completion of partial processing between different types is defined as the first fixed rule, and the order of completion of partial processing between different lots of the same type is defined as the second fixed rule.

[0106] In other words, the first fixed rule indicates that the order of type a → type b → type c should not be changed. The second fixed rule indicates that the order of lot a1 → lot a2 → lot a3 should not be changed, the order of lot b1 → lot b2 should not be changed, and the order of lot c1 → lot c2 should not be changed.

[0107] Furthermore, a priority order is established among the multiple fixed rules held by the fixed rule holding unit 352 according to the importance of compliance. In this embodiment, the second fixed rule has a higher priority than the first fixed rule.

[0108] The change search unit 351 recreates the schedule data DA1 into modified schedule data DA2, under the conditions that at least the second fixed rule, which has a relatively higher priority than the first fixed rule, is observed, and the number of wafers constituting each of the multiple wafer groups is maintained.

[0109] Referring to Figure 7, the schedule recreation process performed by the change search unit 351 and the fixed rule holding unit 352 will be explained.

[0110] First, the change search unit 351 searches for various possibilities for changes to the time periods during which partial processing is performed and the time periods during which tank cleaning is performed, as defined in the schedule data DA1 to be modified, under the condition that the number of wafers constituting each of the multiple wafer groups, as defined in the schedule data DA1, is maintained.

[0111] Then, the change search unit 351 determines, based on the results of its search, whether it is possible to create the modification schedule data DA2 under the conditions that all fixed rules, i.e., the order represented by each of the first fixed rule and the second fixed rule, are maintained, and the number of wafers constituting each of the multiple wafer groups is maintained (step S21).

[0112] Specifically, in step S21, the change search unit 351 determines whether it is possible to create the modified schedule data DA2 under the conditions that the order in which the cleaning of wafer groups of different types is completed, and the order in which the cleaning of wafer groups of the same type is completed, as defined by the schedule data DA1, is maintained, and the number of wafers constituting each of the multiple wafer groups is maintained.

[0113] If it is determined in step S21 that it is possible to create the modified schedule data DA2 (step S21; YES), the change search unit 351 recreates the schedule data DA1 into the modified schedule data DA2 under the conditions that the order represented by the first fixed rule and the second fixed rule is maintained, and the number of wafers constituting each of the multiple wafer groups is maintained (step S22), and then completes the schedule recreation process.

[0114] The middle section of Figure 8 shows an example of the modified schedule data DA2a created in step S22. In this modified schedule data DA2a, the time at which the cleaning of all wafer groups is completed is earlier than the time set by the schedule data DA1 shown in the upper section of Figure 8.

[0115] Furthermore, regarding the completion time of cleaning for each wafer group, the order of type a → type b → type c, as defined by the schedule data DA1 shown in the upper part of Figure 8, is maintained in the modified schedule data DA2a as well.

[0116] Furthermore, regarding the completion time of cleaning for each wafer group, the order specified by the schedule data DA1 shown in the upper part of Figure 8—lot a1 → lot a2 → lot a3, lot b1 → lot b2, and lot c1 → lot c2—is maintained in the modified schedule data DA2a.

[0117] On the other hand, if it is determined in step S21 that it is impossible to create the modified schedule data DA2 (step S21; NO), the change search unit 351 creates the modified schedule data DA2 under the condition that only the fixed rules with relatively high priority are followed and the number of wafers constituting each of the multiple wafer groups is maintained (step S23), and then finishes the schedule recreation process.

[0118] Specifically, in step S23, the change search unit 351 creates the modified schedule data DA2 by adhering only to the second fixed rule, which has a relatively higher priority than the first fixed rule. In other words, the change search unit 351 creates the modified schedule data DA2 under the condition that changes in the order of cleaning completion between different types of products are permitted, while the order of cleaning completion between different lots of the same type is maintained, as defined in the schedule data DA1.

[0119] The lower part of Figure 8 shows an example of the modified schedule data DA2b created in step S23. In this modified schedule data DA2b, the completion time for cleaning all wafer groups is earlier than the time specified in the schedule data DA1 shown in the upper part of Figure 8.

[0120] According to this modified schedule data DA2b, the cleaning of the wafer groups is completed in the order of type b → type c → type a. In other words, the order of type a → type b → type c, as defined by the schedule data DA1 shown in the upper part of Figure 8, is not maintained in the modified schedule data DA2b regarding the completion time of cleaning for each wafer group. This is because the first fixed rule was ignored in step S23 described above.

[0121] However, regarding the completion time of cleaning for each wafer group, the order specified by the schedule data DA1 shown in the upper part of Figure 8—lot a1 → lot a2 → lot a3, lot b1 → lot b2, and lot c1 → lot c2—is maintained in the modified schedule data DA2b. In other words, the second fixed rule is adhered to.

[0122] As described above, according to this embodiment, the schedule data DA1 created by the production management device 500 can be recreated by the schedule management device 300 according to the progress of cleaning in the cleaning device group 200.

[0123] If the cleaning progress in the cleaning device group 200 is behind schedule compared to the target, that is, if "YES" is determined in step S13 or step S14 in Figure 5, the schedule data DA1 set for at least one of the cleaning devices 100 in the cleaning device group 200 is recreated as modified schedule data DA2. As a result, the cleaning device group 200 as a whole can either catch up on the delay in cleaning progress or reduce the delay in cleaning progress as a whole.

[0124] In the determination in step S14 of Figure 5, not only the delay time, which represents the degree of delay in cleaning in the cleaning device 100, but also the progress time, which represents the degree of progress in cleaning in the cleaning device 100, is taken into consideration. Therefore, it is less likely that unnecessarily modified schedule data DA2 will be created.

[0125] In the schedule regeneration process, if it is impossible to create the modified schedule data DA2 while adhering to all fixed rules, the number of fixed rules that must be followed is reduced. This reduces the possibility of failure in creating the modified schedule data DA2.

[0126] As shown in Figure 2, in each cleaning device 100, the state data DB, which is normally used by the lower control unit 131 to control the operation of the cleaning device 100, is used as performance data DC to report the progress of cleaning in the cleaning device 100. Because the configuration is streamlined in this way, it is possible to keep the complexity of the configuration of each cleaning device 100 down when equipping each cleaning device 100 with a function to report the progress of cleaning.

[0127] [Embodiment 2] Figure 1 shows one group of cleaning devices 200, but the schedule management system 600 may have multiple groups of cleaning devices 200. A detailed explanation follows.

[0128] Figure 9 shows a configuration in which multiple cleaning device groups 200, specifically cleaning device groups 200a-200o, each constituting a cleaning line, are arranged. In the schedule management process according to this embodiment, a third determination process is further performed to determine whether the sum of the deviation times of the multiple cleaning device groups 200a-200j exceeds a third allowable delay time.

[0129] Here, the third allowable delay time is the allowable delay time when the cleaning device group 200 in multiple embodiments 1 is set up as a further cleaning device group 200. The method for setting the third allowable delay time is based on the first allowable delay time or the second allowable delay time.

[0130] Figure 10 shows a flowchart of the schedule management process according to this embodiment. In this embodiment, if the determination unit 342 determines in the first determination process of step S13 that the deviation time in any of the cleaning devices 100 does not exceed the first allowable delay time (step S13; NO), it performs a second determination process to determine whether the total value of the deviation times in any group of cleaning devices 200 exceeds the second allowable delay time (step S31).

[0131] In the second determination process, if it is determined that there is a group of cleaning devices 200 whose total deviation time exceeds the second allowable delay time (step S31; YES), the schedule recreation process described above (step S15 in Figure 5) is performed, which is the same as in the first embodiment. Figure 9 conceptually shows, as an example, the case in which the total deviation time in the cleaning device group 200o exceeds the second allowable delay time.

[0132] On the other hand, if the second determination process in step S31 determines that the sum of the deviation times of any of the cleaning device groups 200 does not exceed the second allowable delay time (step S31; NO), the determination unit 342 performs a third determination process to determine whether the sum of the deviation times of the multiple cleaning device groups 200a-200j exceeds the third allowable delay time (step S32).

[0133] If the determination unit 342 determines in the third determination process that the total value of the deviation times for the multiple cleaning device groups 200a-200j exceeds the third allowable delay time (step S32; YES), it performs the schedule recreation process (step S15 in Figure 5). On the other hand, if the total value of the deviation times for the multiple cleaning device groups 200a-200j is less than or equal to the third allowable delay time (step S32; NO), the process returns to step S11. The other processes are the same as the schedule management process shown in Figure 5.

[0134] Figure 9 conceptually illustrates a case where the third determination process in step S32 determines the result to be YES. Specifically, the determination unit 342, for example, performs the schedule re-creation process described above (step S15 in Figure 5) if, even if the sum of the delay times in each of the cleaning device groups 200d, 200f, and 200h is less than or equal to the second allowable delay time, the sum of the deviation times for the entire set of cleaning device groups 200a-200j exceeds the third allowable delay time.

[0135] This makes it possible to recover from or reduce delays in the overall cleaning progress of the multiple cleaning device groups 200a-200j.

[0136] Embodiments 1 and 2 have been described above. The following modifications are also possible.

[0137] In embodiments 1 and 2 described above, the example of a case where the treatment applied to the wafer as the object is cleaning in the semiconductor manufacturing process was explained. While it is particularly preferable that the treatment is a process related to semiconductor manufacturing, it is not limited to cleaning. The treatment may be something other than cleaning in the semiconductor manufacturing process, for example, film deposition, resist coating, exposure, development, impurity injection, etching, etc. Furthermore, the treatment may be something other than a process related to semiconductor manufacturing.

[0138] Schedule data DA1 may be created for each group of cleaning devices 200 that make up the cleaning line. Furthermore, whenever it is determined that the total value of the delay time in a group of cleaning devices 200 exceeds the second allowable delay time, the schedule data DA1 for that group of cleaning devices 200 may be updated to a state that can recover from or reduce the delay in the overall cleaning progress of that group of cleaning devices 200.

[0139] By installing the schedule management program 300e shown in Figure 4 onto an existing computer, that computer can be made to function as the schedule management device 300 according to the embodiment. The schedule management program 300e may be distributed via a communication network, or it may be distributed by storing it on a computer-readable non-temporary recording medium.

[0140] This disclosure allows for various embodiments and modifications without departing from the broad spirit and scope of this disclosure. The embodiments described above are for illustrative purposes only and do not limit the scope of this disclosure. The scope of this disclosure is indicated by the claims, not by the embodiments. Various modifications made within the scope of the claims and the equivalent significance of the disclosure are deemed to be within the scope of this disclosure. [Explanation of Symbols]

[0141] 100 Washing device (processing device), 110 Processing tank group, 111 Tank A, 112 Tank B, 113 Tank C, 114 Tank D, 115 Tank E, 120 Transport / monitoring equipment group, 121-125 Transport / monitoring equipment (status data output unit), 130 Control device, 131 Lower control unit, 132 Time data annotation unit, 200, 200a-200o Washing device group (processing device group), 300 Schedule management device, 300a Communication device, 300b Output device, 300c Input device, 300d Storage device, 300e Schedule management program, 300f Processor, 310 Actual data acquisition unit, 320 Schedule acquisition unit, 330 Upper control unit, 340 Progress management unit, 341 Deviation time identification unit, 342 Judgment unit, 350 Schedule recreation unit, 351 Change search unit, 352 Fixed rule holding unit, 360 Post-process confirmation unit, 370 Modified schedule reflection unit, 400 Conveying device, 500 Production management device, 600 Schedule management system, DA1 Schedule data, DA2, DA2a, DA2b Modified schedule data, DB Status data, DC Actual data, JR1 Job recipe, JR2 Modified job recipe, ER Device recipe.

Claims

1. a processing device group composed of a plurality of processing devices each performing processing on an object, each of the processing devices progressing with the processing being targeted for a schedule represented by schedule data set for the processing device; and a performance data acquisition unit that acquires performance data representing the progress of the processing in each of the processing devices constituting the processing device group; a progress management unit that uses the performance data acquired from the processing device by the performance data acquisition unit and the schedule data set for the processing device to determine whether or not the schedule data set for at least one of the processing devices in the processing device group should be re-created; a schedule re-creation unit which, when it is determined by the progress management unit that the schedule data set for at least one of the processing devices in the processing device group should be re-created, re-creates the schedule data set for the processing device into modified schedule data in which the time of completion of the processing of the object is brought forward from the time defined by the schedule data; Equipped with the processing device, in which the schedule data has been re-created into the modified schedule data by the schedule re-creation unit, proceeds with the processing with the schedule represented by the modified schedule data as a goal; The progress management unit a lag time specifying unit that specifies a lag time of the progress of the processing with respect to the schedule as a target in each of the processing devices, using the performance data acquired from the processing devices by the performance data acquiring unit and the schedule data set for the processing devices, the lag time indicating a delay time that represents a degree of the delay of the processing when the processing is behind schedule, and indicating a progress time that represents a degree of the progress of the processing when the processing is ahead of schedule; a determination unit which determines whether or not a total value of the deviation times in each of the processing devices in the processing device group exceeds a predetermined allowable delay time under the condition that the delay time is positive and the advance time is negative, and determines that the schedule data for at least any of the processing devices in the processing device group should be re-created when the total value exceeds the allowable delay time; having Schedule management device.

2. a processing device group composed of a plurality of processing devices each performing processing on an object, each of the processing devices progressing with the processing being targeted for a schedule represented by schedule data set for the processing device; and a performance data acquisition unit that acquires performance data representing the progress of the processing in each of the processing devices constituting the processing device group; a progress management unit that uses the performance data acquired from the processing device by the performance data acquisition unit and the schedule data set for the processing device to determine whether or not the schedule data set for at least one of the processing devices in the processing device group should be re-created; a schedule re-creation unit which, when it is determined by the progress management unit that the schedule data set for at least one of the processing devices in the processing device group should be re-created, re-creates the schedule data set for the processing device into modified schedule data in which the time of completion of the processing of the object is brought forward from the time defined by the schedule data; Equipped with the processing device, in which the schedule data has been re-created into the modified schedule data by the schedule re-creation unit, proceeds with the processing with the schedule represented by the modified schedule data as a goal; The process performed by each of the processing devices includes a plurality of sub-processes, Each of the processing devices comprises: a status data output unit that outputs status data representing completion of each of the partial processes; a lower level control unit that uses the status data to control the processing in the processing device to proceed with the schedule represented by the schedule data set for the processing device; a time data appending unit that appends time data specifying a time of completion of the partial process represented by the status data to the status data and outputs the status data to which the time data has been appended as the performance data to the performance data acquiring unit; having the progress management unit determines whether or not the schedule data set for at least any of the processing devices in the processing device group should be re-created based on a comparison between a time of completion of the partial processing represented by the time data included in the performance data and a target time for completing the partial processing represented by the schedule data; Schedule management device.

3. a processing device group composed of a plurality of processing devices each performing processing on an object, each of the processing devices progressing with the processing being targeted for a schedule represented by schedule data set for the processing device; and a performance data acquisition unit that acquires performance data representing the progress of the processing in each of the processing devices constituting the processing device group; a progress management unit that uses the performance data acquired from the processing device by the performance data acquisition unit and the schedule data set for the processing device to determine whether or not the schedule data set for at least one of the processing devices in the processing device group should be re-created; a schedule re-creation unit which, when it is determined by the progress management unit that the schedule data set for at least one of the processing devices in the processing device group should be re-created, re-creates the schedule data set for the processing device into modified schedule data in which the time of completion of the processing of the object is brought forward from the time defined by the schedule data; Equipped with the processing device, in which the schedule data has been re-created into the modified schedule data by the schedule re-creation unit, proceeds with the processing with the schedule represented by the modified schedule data as a goal; The process performed by each of the processing devices includes a plurality of sub-processes, each of the processing devices performs a plurality of the partial processes for each object group configured with a plurality of the objects; the schedule data specifies an order of the partial processing among different types of the plurality of groups of objects, each of which has a specified type and lot, and an order of the partial processing among different lots of the same type; The schedule re-creation unit regenerating the schedule data into the modified schedule data under a condition that the order of completion of the processing among the different lots of the same type, as specified by the schedule data, is maintained; Schedule management device.

4. The schedule re-creation unit determining whether or not the modified schedule data can be created under a condition that the order of completion of the processing among different types and the order of completion of the processing among different lots of the same type, which are specified by the schedule data, are maintained; if it is determined in the judgment that it is impossible to create the modified schedule data, the modified schedule data is created under a condition that a change in the order of completion of the processing between the different types, as specified by the schedule data, is permitted, while the order of completion of the processing between the different lots of the same type is maintained. The schedule management device according to claim 3.

5. each of the schedule data and the modified schedule data defines a number of the objects constituting each of the plurality of object groups; The schedule re-creation unit recreating the schedule data into the modified schedule data under the condition that the number of the objects constituting each of the plurality of object groups is maintained; The schedule management device according to claim 3.

6. a post-process confirmation unit that, when the schedule data is re-created into the modified schedule data by the schedule re-creation unit, determines whether or not a change of the schedule data to the modified schedule data is acceptable, taking into consideration an effect of the change on a post-process that is performed following the processing of the object; Further equipped with When the post-process confirmation unit determines that the change is acceptable, the change of the schedule data is reflected in the modified schedule data. The schedule management device according to any one of claims 1 to 5.

7. A schedule management device according to any one of claims 1 to 5; The processing device group; a production management device that creates the schedule data set for each of the processing devices in the processing device group; A schedule management system.

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