Electronic device

Abstract

This electronic device is provided with a first electronic component, a sealing resin, and a first lead that comprises a first inner part and a first outer part. The first inner part comprises a first die pad part on which the first electronic component is mounted, and a first connection part that connects the first outer part and the first die pad part to each other. The first outer part is disposed on one side in a first direction with respect to the first die pad part. The first connection part is connected to a first side surface of the first die pad part. In a second direction, the center of the first outer part is located further toward one side in the second direction than the center of the first die pad part. The first side surface comprises a connection region that is connected to the first connection part, and a pair of side regions that are located on both sides of the connection region in the second direction.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Conventionally, semiconductor devices manufactured using lead frames are known as one type of electronic device. An example of such a semiconductor device is described in Patent Document 1. The semiconductor device described in this document is surface-mounted on a wiring substrate of an inverter device and includes a first semiconductor element, a conductive support member, and a sealing resin. The conductive support member is formed from a single lead frame. The conductive support member includes a first die pad and multiple input terminals. The first semiconductor element is mounted on the first die pad. Some of the multiple input terminals are connected to the first die pad.

[0003] Japanese Patent Application Laid-Open No. 2022-55599

[0004] [Summary] Some conventional electronic devices, such as the semiconductor device described in Patent Document 1, have electronic components mounted on a lead frame. To improve reliability, such electronic devices require, for example, suppression of lead frame deformation. If the lead frame were to deform and the position of the die pad (the portion on which the electronic component is mounted) were to change, this would impede bonding between the electronic component and the die pad.

[0005] An object of the present disclosure is to provide an improved semiconductor device compared to conventional semiconductor devices. In particular, in view of the above circumstances, an object of the present disclosure is to provide an electronic device that can suppress deformation of a lead frame.

[0006] An electronic device provided by a first aspect of the present disclosure comprises an electronic component, a sealing resin covering the electronic component, and a first lead including a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin, wherein the first inner portion includes a first die pad portion on which the electronic component is mounted and a first connecting portion connecting the first outer portion and the first die pad portion, the first outer portion being arranged on one side in a first direction perpendicular to a thickness direction of the electronic component with respect to the first die pad portion, the first die pad portion having a first side surface facing a side on which the first outer portion is located in the first direction, the first connecting portion being connected to the first side surface, and in a second direction perpendicular to the first direction, a center of the first outer portion being arranged on one side of the second direction relative to a center of the first die pad portion, and the first side surface includes a connecting region connected to the first connecting portion and a pair of lateral regions arranged on both sides of the connecting region in the second direction.

[0007] FIG. 1 is a plan view showing an electronic device according to a first embodiment. FIG. 2 is a view showing the sealing resin in the plan view of FIG. 1 with imaginary lines. FIG. 3 is an enlarged plan view of a main portion obtained by enlarging a portion of FIG. 2. FIG. 4 is an enlarged plan view of a main portion obtained by enlarging a portion of FIG. 2. FIG. 5 is a front view showing an electronic device according to the first embodiment. FIG. 6 is a rear view showing an electronic device according to the first embodiment. FIG. 7 is a left side view showing an electronic device according to the first embodiment. FIG. 8 is a right side view showing an electronic device according to the first embodiment. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 2. FIG. 10 is a cross-sectional view taken along line X-X in FIG. 2. FIG. 11 is an enlarged perspective view of a main portion showing a first die pad portion and a first electronic component of the electronic device according to the first embodiment. FIG. 12 is an enlarged perspective view of a main portion showing a second die pad portion and a second electronic component of the electronic device according to the first embodiment. FIG. 13 is a diagram showing the circuit configuration of the first electronic component and the second electronic component of the electronic device according to the first embodiment. FIG. 14 is a plan view showing a step in manufacturing the electronic device according to the first embodiment. FIG. 15 is a plan view showing an electronic device according to a first modified example of the first embodiment, in which the sealing resin is shown by imaginary lines. FIG. 16 is a front view showing an electronic device according to a first modified example of the first embodiment. FIG. 17 is a rear view showing an electronic device according to a first modified example of the first embodiment. FIG. 18 is a plan view showing an electronic device according to a second modified example of the first embodiment, in which the sealing resin is shown by imaginary lines. FIG. 19 is a plan view showing an electronic device according to a third modified example of the first embodiment, in which the sealing resin is shown by imaginary lines. FIG. 20 is a plan view showing an electronic device according to a fourth modified example of the first embodiment, in which the sealing resin is shown by imaginary lines. FIG. 21 is a diagram showing the circuit configuration of a first electronic component and a second electronic component of an electronic device according to a fourth modified example of the first embodiment. FIG. 22 is a plan view showing an electronic device according to another configuration of the fourth modified example of the first embodiment, in which the sealing resin is shown by imaginary lines. FIG. 23 is an enlarged plan view of a main part of the electronic device according to the second embodiment. FIG. 24 is an enlarged plan view of a main part of an electronic device according to the second embodiment.

[0008] DETAILED DESCRIPTION A preferred embodiment of an electronic device according to the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals, and redundant description will be omitted. Terms such as "first," "second," and "third" in this disclosure are used merely as labels and are not intended to necessarily assign any rank to their objects.

[0009] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an) object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an) object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on (an) object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an) object B" includes "a certain object A is in contact with a certain object B and is located on (an) object B" and "a certain object A is located on (an) object B with another object interposed between the certain object A and the certain object B." Furthermore, "object A overlaps object B when viewed in a certain direction" includes "object A overlaps the entire object B" and "object A overlaps a part of object B," unless otherwise specified. Furthermore, "object A (its material) contains material C" includes "object A (its material) is made of material C" and "object A (its material) is mainly composed of material C." Furthermore, "a surface A faces in a certain direction B (one side or the other side of a certain direction B)," unless otherwise specified, is not limited to the case where surface A is at a 90° angle with respect to direction B, but also includes the case where surface A is tilted with respect to direction B. Furthermore, "a surface A is perpendicular to a surface B," unless otherwise specified, is not limited to the case where surface A is at a 90° angle with respect to surface B, but also includes the case where surface A is tilted with respect to surface B.

[0010] FIGS. 1 to 13 illustrate an electronic device A10 according to a first embodiment. The electronic device A10 includes a first lead 1, a second lead 2, multiple third leads 3, a pair of fourth leads 4, a first electronic component 51, a second electronic component 52, multiple connecting members 61 to 66, and a sealing resin 7. In the illustrated example, the electronic device A10 includes eleven third leads 3, but the number of third leads 3 is not limited. The specific use of the electronic device A10 is not limited, but may be, for example, to detecting the battery voltage of an electric vehicle. The electronic device A10 does not necessarily detect the battery voltage of an electric vehicle; it may also detect voltages other than those used in electric vehicles, or may detect voltages used in industrial equipment, home appliances, power supplies, or the like. The electronic device A10 is a surface-mount semiconductor package, and in this embodiment, it is an SOP (Small Outline Package) type, as shown in FIGS. 1 and 5 to 8.

[0011] For ease of explanation, the thickness direction z, the first direction y, and the second direction x are referred to as being orthogonal to one another. The thickness direction z corresponds to the thickness direction of the electronic device A10 (first electronic component 51). "Planar view" refers to the view in the thickness direction z. The first direction y is orthogonal to the thickness direction z. The second direction x is orthogonal to the thickness direction z and the first direction y. One side of the first direction y is referred to as the y1 side of the first direction y, and the other side of the first direction y is referred to as the y2 side of the first direction y. One side of the second direction x is referred to as the x1 side of the second direction x, and the other side of the second direction x is referred to as the x2 side of the second direction x. One side of the thickness direction z is referred to as the z1 side of the thickness direction z, and the other side of the thickness direction z is referred to as the z2 side of the thickness direction z. The z2 side of the thickness direction z is sometimes referred to as the upper side, and the z1 side of the thickness direction z is sometimes referred to as the lower side. The terms "top," "bottom," "upper," "lower," "top surface," and "bottom surface" indicate the relative positional relationship of each part in the thickness direction z, and do not necessarily define the relationship with the direction of gravity.

[0012] The first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 include a metal such as Cu (copper), Ni (nickel), or Fe (iron). The first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 are formed from the same lead frame (lead frame 9, described below). The first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 are formed, for example, by processing a metal plate material selected from punching, bending, etching, and the like. Furthermore, a plating layer made of Ag (silver), Ni, Au (gold), or the like may be provided at appropriate locations on each of the first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4, as needed.

[0013] The first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 are electrically connected to the first electronic component 51 or the second electronic component 52 and form a conductive path in the electronic device A10. The first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 are spaced apart from one another. The first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 each have a portion covered with the sealing resin 7 and a portion exposed from the sealing resin 7.

[0014] The first lead 1 includes a first outer portion 11 and a first inner portion 12. The first outer portion 11 and the first inner portion 12 are connected to each other and formed integrally. The boundary between the first outer portion 11 and the first inner portion 12 overlaps the periphery of the sealing resin 7 in a plan view.

[0015] The first outer portion 11 is a portion of the first lead 1 that is exposed from the sealing resin 7. The first outer portion 11 protrudes from the sealing resin 7 toward the y2 side in the first direction y. The first outer portion 11 has a rectangular shape in a plan view with the first direction y as its longitudinal direction. The first outer portion 11 is bent in a gull-wing shape when viewed in the second direction x. A dimension W11 (see FIG. 1 ) of the first outer portion 11 along the second direction x is not limited in any way and is, for example, 0.1 mm or more and 1.5 mm or less. The first outer portion 11 includes a first mounting portion 111, a first root portion 112, and a first relay portion 113.

[0016] The first mounting portion 111 is a tip portion of the first outer portion 11. The first mounting portion 111 is a portion that is joined to a circuit board when the electronic device A10 is mounted on the circuit board. As shown in FIGS. 1 and 2 , the first mounting portion 111 is located at the end opposite the sealing resin 7 in the first direction y. Therefore, the first mounting portion 111 is located farther from the sealing resin 7 in the first direction y than the first root portion 112 and the first relay portion 113. The first mounting portion 111 is located lower in the thickness direction z than the first root portion 112.

[0017] The first root portion 112 is a root portion of the first outer part 11. As shown in Figures 1 and 2, the first root portion 112 is located at the end of the first outer part 11 that is closer to the sealing resin 7 in the first direction y. Therefore, the first root portion 112 is located closer to the sealing resin 7 in the first direction y than the first mounting part 111 and the first relay part 113. The first root portion 112 is located higher in the thickness direction z than the first mounting part 111 and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0018] The first relay portion 113 connects the first mounting portion 111 and the first root portion 112. When viewed in the second direction x, the first relay portion 113 is inclined with respect to the first mounting portion 111 and the first root portion 112. In the present embodiment, the first relay portion 113 is inclined with respect to the thickness direction z.

[0019] The first inner portion 12 is a portion of the first lead 1 that is covered with the sealing resin 7. The first inner portion 12 extends from the first outer portion 11 inward of the sealing resin 7. The first inner portion 12 includes a first connecting portion 13 and a first die pad portion 14.

[0020] The first connecting portion 13 extends from the first outer portion 11 inward of the sealing resin 7. The first connecting portion 13 is connected to the first die pad portion 14. Therefore, the first connecting portion 13 connects the first inner portion 12 and the first die pad portion 14.

[0021] The first die pad portion 14 has a first electronic component 51 mounted thereon and supports the first electronic component 51. A first connecting portion 13 is connected to the first die pad portion 14 and is supported by the first connecting portion 13. The first die pad portion 14 is located on the y1 side of the first outer portion 11 in the first direction y. Therefore, the first outer portion 11 is located on the y2 side of the first die pad portion 14 in the first direction y. Furthermore, the center of the first die pad portion 14 in the second direction x is located on the x2 side of the center of the first outer portion 11 in the second direction x. Therefore, in the second direction x, the center of the first outer portion 11 is located on the x1 side of the center of the first die pad portion 14 in the second direction x. In this embodiment, as shown in FIG. 2 , a portion of the first root portion 112 overlaps the first die pad portion 14 when viewed in the first direction y. Unlike this configuration, the entire first root portion 112 may overlap the first die pad portion 14 when viewed in the first direction y. Alternatively, the entire first root portion 112 may not overlap the first die pad portion 14. Therefore, the first outer portion 11 may be disposed outward from the first die pad portion 14 in the second direction x (on the x1 side of the second direction x). The first die pad portion 14 has a main surface 141, a back surface 142, and a first side surface 143.

[0022] The main surface 141 and the back surface 142 are spaced apart in the thickness direction z. The main surface 141 faces upward in the thickness direction z, and the back surface 142 faces downward in the thickness direction z. The first side surface 143 is connected to the main surface 141 and the back surface 142. The first side surface 143 faces in the first direction y toward the side where the first outer part 11 is located (the y2 side in the first direction y). The first connecting portion 13 is connected to the first side surface 143. The inclination angle α1 of the first connecting portion 13 with respect to the first side surface 143 is not limited in any way, but is, for example, between 10° and 89°, and in this embodiment, the inclination angle α1 is 45°.

[0023] The first side surface 143 includes a connecting region 143a and a pair of side regions 143b and 143c. The connecting region 143a is a region of the first side surface 143 that connects to the first connecting portion 13. The connecting region 143a is in contact with the first connecting portion 13. The pair of side regions 143b and 143c are individually arranged on both sides of the connecting region 143a in the second direction x. The side region 143b is located on the x1 side of the connecting region 143a in the second direction x, and the side region 143c is located on the x2 side of the connecting region 143a in the second direction x (the same side as the second lead 2). The pair of side regions 143b and 143c are in contact with the sealing resin 7.

[0024] In the illustrated example, the connecting region 143a is disposed on the x1 side of the first side surface 143 in the second direction x from the center in the second direction x. Therefore, the dimension of the lateral region 143b in the second direction x is smaller than the dimension of the lateral region 143c in the second direction x. In contrast to this configuration, the connecting region 143a may be disposed on the x2 side of the first side surface 143 in the second direction x from the center in the second direction x. In other words, the dimension of the lateral region 143b in the second direction x may be the same as the dimension of the lateral region 143c in the second direction x or may be larger than the dimension of the lateral region 143c in the second direction x.

[0025] In the illustrated example, the first die pad portion 14 has a rectangular shape in plan view, and has a first corner 149a, a second corner 149b, and two other corners 149c and 149d.

[0026] 3 , the first corner 149a is located on the y2 side in the first direction y and the x1 side in the second direction x of the four corners of the first die pad portion 14 in a plan view. The first corner 149a is closest to the first outer portion 11 of the four corners of the first die pad portion 14 in a plan view. The second corner 149b is located on the y1 side in the first direction y and the x2 side in the second direction x of the four corners of the first die pad portion 14 in a plan view. The second corner 149b is diagonally opposite the first corner 149a. The second corner 149b is farthest from the first outer portion 11 of the four corners of the first die pad portion 14. The corner 149c is located on the y2 side in the first direction y and the x2 side in the second direction x of the four corners of the first die pad portion 14 in a plan view. The corner 149d is located on the y1 side in the first direction y and the x1 side in the second direction x among the four corners of the first die pad portion 14 in a plan view. The corner 149d is diagonally opposite the corner 149c. The first corner 149a and the corner 149c are opposite ends of the first side surface 143 in the second direction x.

[0027] The second lead 2 includes a second outer portion 21 and a second inner portion 22. The second outer portion 21 and the second inner portion 22 are connected to each other and formed integrally. The boundary between the second outer portion 21 and the second inner portion 22 overlaps the periphery of the sealing resin 7 in a plan view.

[0028] The second outer portion 21 is a portion of the second lead 2 that is exposed from the sealing resin 7. The second outer portion 21 protrudes from the sealing resin 7 toward the y2 side in the first direction y (the same side as the first outer portion 11). The second outer portion 21 has a rectangular shape in plan view with the first direction y as its longitudinal direction. In this embodiment, the shape of the second outer portion 21 in plan view is congruent with the shape of the first outer portion 11 in plan view. However, unlike this configuration, these shapes do not have to be congruent with each other in plan view. The second outer portion 21 is bent in a gull-wing shape when viewed in the second direction x. The second outer portion 21 overlaps the first outer portion 11 when viewed in the second direction x. A dimension W21 (see FIG. 1 ) of the second outer portion 21 along the second direction x is not limited in any way and is, for example, 0.1 mm or more and 1.5 mm or less. In this embodiment, the dimension W21 of the second outer portion 21 is the same as the dimension W11 of the first outer portion 11, but unlike this configuration, the dimension W21 and the dimension W11 may be different. The second outer portion 21 includes a second mounting portion 211, a second root portion 212, and a second relay portion 213.

[0029] The second mounting portion 211 is a tip portion of the second outer portion 21. The second mounting portion 211 is a portion that is joined to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in FIGS. 1 and 2 , the second mounting portion 211 is located at the end opposite the sealing resin 7 in the first direction y. Therefore, the second mounting portion 211 is located farther from the sealing resin 7 in the first direction y than the second root portion 212 and the second relay portion 213. The second mounting portion 211 is located lower in the thickness direction z than the second root portion 212. The second mounting portion 211 is located at the same position as the first mounting portion 111 in the thickness direction z.

[0030] The second root portion 212 is a root portion of the second outer portion 21. As shown in FIGS. 1 and 2 , the second root portion 212 is located at the end of the second outer portion 21 that is closer to the sealing resin 7 in the first direction y. Therefore, the second root portion 212 is located closer to the sealing resin 7 in the first direction y than the second mounting portion 211 and the second relay portion 213. The second root portion 212 is located higher in the thickness direction z than the second mounting portion 211 and protrudes from the center of the sealing resin 7 in the thickness direction z. The second root portion 212 is located at the same position as the first root portion 112 in the thickness direction z.

[0031] The second relay portion 213 connects the second mounting portion 211 and the second root portion 212. The second relay portion 213 is inclined with respect to the first mounting portion 111 and the first root portion 112 when viewed in the second direction x. In the present embodiment, the second relay portion 213 is inclined with respect to the thickness direction z.

[0032] The second inner portion 22 is a portion of the second lead 2 that is covered with the sealing resin 7. The second inner portion 22 is connected to the second outer portion 21 and extends from the second outer portion 21 inward into the sealing resin 7. The second inner portion 22 extends from the second outer portion 21 inward into the sealing resin 7 so as to approach the first die pad portion 14.

[0033] Each of the multiple third leads 3 includes a third outer portion 31 and a third inner portion 32. Thus, the electronic device A10 includes multiple third outer portions 31 and multiple third inner portions 32. In each third lead 3, the third outer portion 31 and the third inner portion 32 are connected to each other and formed integrally. In each third lead 3, the boundary between the third outer portion 31 and the third inner portion 32 overlaps the periphery of the sealing resin 7 in a plan view. The third outer portion 31 and the third inner portion 32 described below are common to all third leads 3 unless otherwise specified.

[0034] The third outer portion 31 is a portion of each third lead 3 that is exposed from the sealing resin 7. Each third outer portion 31 protrudes from the sealing resin 7 toward the y1 side in the first direction y (the opposite side to the first outer portion 11 and the second outer portion 21). In a plan view, each third outer portion 31 has a strip shape with the first direction y as its longitudinal direction. The multiple third outer portions 31 are arranged at equal intervals along the second direction x. Each third outer portion 31 is bent in a gull-wing shape as viewed in the second direction x. The multiple third outer portions 31 overlap each other as viewed in the second direction x. The dimension W31 (see FIG. 1 ) of the third outer portion 31 along the second direction x is not limited in any way and is, for example, 0.15 mm or more and 0.5 mm or less. The dimension W31 of the third outer portion 31 is smaller than the dimension W11 of the first outer portion 11 and the dimension W21 of the second outer portion 21. The third outer part 31 includes a third mounting part 311, a third root part 312, and a third relay part 313. Thus, the electronic device A10 has a plurality of third mounting parts 311, a plurality of third root parts 312, and a plurality of third relay parts 313. The third mounting parts 311, the third root parts 312, and the third relay parts 313 described below are common to all third outer parts 31 unless otherwise specified.

[0035] The third mounting portion 311 is a tip portion of the third outer portion 31. The third mounting portion 311 is a portion that is joined to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in FIGS. 1 and 2 , the third mounting portion 311 is located at the end opposite the sealing resin 7 in the first direction y. Therefore, the third mounting portion 311 is located farther from the sealing resin 7 in the first direction y than the third root portion 312 and the third relay portion 313. The third mounting portion 311 is located lower in the thickness direction z than the third root portion 312. The multiple third mounting portions 311 are arranged at the same position in the thickness direction z. The multiple third mounting portions 311 are arranged at equal intervals along the second direction x.

[0036] The third root portion 312 is a root portion of the third outer portion 31. As shown in FIGS. 1 and 2 , the third root portion 312 is located at the end of the third outer portion 31 that is on the sealing resin 7 side in the first direction y. Therefore, the third root portion 312 is located closer to the sealing resin 7 in the first direction y than the third mounting portion 311 and the third relay portion 313. The third root portion 312 is located higher in the thickness direction z than the third mounting portion 311 and protrudes from the center of the sealing resin 7 in the thickness direction z. The multiple third root portions 312 are arranged at the same positions as each other in the thickness direction z.

[0037] The third relay portion 313 connects the third mounting portion 311 and the third root portion 312. The third relay portion 313 is inclined with respect to the third mounting portion 311 and the third root portion 312 when viewed in the second direction x. In the present embodiment, the third relay portion 313 is inclined with respect to the thickness direction z.

[0038] The third inner portion 32 is a portion of each third lead 3 that is covered with the sealing resin 7. The third inner portion 32 is connected to the third outer portion 31 and extends from the third outer portion 31 inward into the sealing resin 7. In each third lead 3, the third inner portion 32 extends from the third outer portion 31 inward into the sealing resin 7 so as to approach a part (second die pad portion 44) of a fourth lead 4A described below.

[0039] The pair of fourth leads 4 are arranged on both sides of the plurality of third leads 3 in the second direction x. In the following description, one of the pair of fourth leads 4 may be referred to as the "fourth lead 4A" and the other of the pair of fourth leads 4 may be referred to as the "fourth lead 4B." The fourth lead 4A is arranged on the x1 side of the plurality of third leads 3 in the second direction x, and the fourth lead 4B is arranged on the x2 side of the plurality of third leads 3 in the second direction x. In the illustrated example, the shape of the fourth lead 4A in a plan view is congruent with the shape of the first lead 1 in a plan view, but these do not have to be congruent. Also, in the illustrated example, the shape of the fourth lead 4B in a plan view is congruent with the shape of the second lead 2 in a plan view, but these do not have to be congruent. Each of the pair of fourth leads 4 (the pair of fourth leads 4A, 4B) includes a fourth outer portion 41 and a fourth inner portion 42. In each fourth lead 4, the fourth outer portion 41 and the fourth inner portion 42 are connected to each other and formed integrally. In each fourth lead 4, the boundary between the fourth outer portion 41 and the fourth inner portion 42 overlaps the periphery of the sealing resin 7 in a plan view. The fourth outer portion 41 and the fourth inner portion 42 described below are common to all fourth leads 4 unless otherwise specified.

[0040] The fourth outer portion 41 is a portion of the fourth lead 4 that is exposed from the sealing resin 7. The fourth outer portion 41 protrudes from the sealing resin 7 to the other side in the first direction y. The fourth outer portion 41 of the fourth lead 4A is located on the x1 side in the second direction x relative to the multiple third outer portions 31, and the fourth outer portion 41 of the fourth lead 4B is located on the x2 side in the second direction x relative to the multiple third outer portions 31. The fourth outer portion 41 is bent in a gull-wing shape when viewed in the second direction x. The fourth outer portion 41 overlaps each of the third outer portions 31 when viewed in the second direction x. The fourth outer portion 41 has a rectangular shape with its longitudinal direction aligned with the first direction y in a plan view. In this embodiment, the shape of the fourth outer portion 41 in a plan view is congruent with the shape of the first outer portion 11 in a plan view; however, unlike this configuration, these shapes do not have to be congruent with each other when viewed in a plan view. The fourth outer portion 41 of the fourth lead 4A overlaps the first outer portion 11 when viewed in the first direction y, and the fourth outer portion 41 of the fourth lead 4B overlaps the second outer portion 21 when viewed in the first direction y. A dimension W41 (see FIG. 1 ) of the fourth outer portion 41 along the second direction x is not limited in any way and is, for example, 0.1 mm or more and 1.5 mm or less. In this embodiment, the dimension W41 of the fourth outer portion 41 is the same as the dimension W11 of the first outer portion 11 and the dimension W21 of the second outer portion 21. However, unlike this configuration, the dimension W41 of the fourth outer portion 41 may be different from the dimension W11 of the first outer portion 11 and the dimension W21 of the second outer portion 21. The fourth outer portion 41 includes a fourth mounting portion 411, a fourth root portion 412, and a fourth relay portion 413. The fourth mounting portion 411, the fourth root portion 412, and the fourth link portion 413 described below are common to the fourth outer portion 41 of each fourth lead 4 unless otherwise specified.

[0041] The fourth mounting portion 411 is a tip portion of the fourth outer portion 41. The fourth mounting portion 411 is a portion that is bonded to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in FIGS. 1 and 2 , the fourth mounting portion 411 is located at the end opposite the sealing resin 7 in the first direction y. Therefore, the fourth mounting portion 411 is located farther from the sealing resin 7 in the first direction y than the fourth root portion 412 and the fourth relay portion 413. The fourth mounting portion 411 is located lower in the thickness direction z than the fourth root portion 412. The fourth mounting portion 411 is located at the same position as each third mounting portion 311 in the thickness direction z. The fourth mounting portion 411 of the fourth lead 4A is adjacent to the third mounting portions 311 on the x1 side in the second direction x. The fourth mounting portion 411 of the fourth lead 4B is adjacent to the third mounting portions 311 in the second direction x on the x2 side in the second direction x. The fourth mounting portion 411 of the fourth lead 4A overlaps the first mounting portion 111 of the first lead 1 when viewed in the first direction y. The fourth mounting portion 411 of the fourth lead 4B overlaps the second mounting portion 211 of the second lead 2 when viewed in the first direction y.

[0042] The fourth root portion 412 is a root portion of the fourth outer portion 41. As shown in FIGS. 1 and 2 , the fourth root portion 412 is located at the end of the fourth outer portion 41 that is closer to the sealing resin 7 in the first direction y. Therefore, the fourth root portion 412 is located closer to the sealing resin 7 in the first direction y than the fourth mounting portion 411 and the fourth relay portion 413. The fourth root portion 412 is located higher in the thickness direction z than the fourth mounting portion 411 and protrudes from the center of the sealing resin 7 in the thickness direction z. The fourth root portion 412 is located at the same position as each third root portion 312 in the thickness direction z.

[0043] The fourth relay portion 413 connects the fourth mounting portion 411 and the fourth root portion 412. When viewed in the second direction x, the fourth relay portion 413 is inclined with respect to the fourth mounting portion 411 and the fourth root portion 412. In the present embodiment, the fourth relay portion 413 is inclined with respect to the thickness direction z.

[0044] The fourth inner portion 42 is a portion of the corresponding fourth lead 4 that is covered with the sealing resin 7. The fourth inner portion 42 is connected to the fourth outer portion 41 and extends from the fourth outer portion 41 inward into the sealing resin 7. The fourth inner portion 42 of the fourth lead 4B extends from the fourth outer portion 41 inward into the sealing resin 7 so as to approach the second die pad portion 44. The fourth inner portion 42 of the fourth lead 4A includes a second connecting portion 43 and the second die pad portion 44.

[0045] In the fourth lead 4A, the second connecting portion 43 extends from the fourth outer portion 41 inwardly of the sealing resin 7. The second connecting portion 43 is connected to the second die pad portion 44. Therefore, in the fourth lead 4A, the second connecting portion 43 connects the fourth outer portion 41 and the second die pad portion 44.

[0046] The second die pad portion 44 has a second electronic component 52 mounted thereon and supports the second electronic component 52. A second connecting portion 43 is connected to the second die pad portion 44 and is supported by the second connecting portion 43. The second die pad portion 44 is spaced apart from the first die pad portion 14. The first die pad portion 14 and the second die pad portion 44 are aligned in the first direction y, and the second die pad portion 44 is located on the y1 side in the first direction y relative to the first die pad portion 14. The second die pad portion 44 is located on the y2 side in the first direction y of the fourth outer portion 41. Therefore, the fourth outer portion 41 is located on the y1 side in the first direction y relative to the second die pad portion 44. The center of the second die pad portion 44 in the second direction x is located on the x2 side in the second direction x relative to the center of the fourth outer portion 41 of the fourth lead 4A in the second direction x. Therefore, in the second direction x, the center of the fourth outer portion 41 of the fourth lead 4A is located on the x1 side in the second direction x relative to the center of the second die pad portion 44. In the present embodiment, as shown in FIG. 2 , a part of the fourth root portion 412 of the fourth lead 4A overlaps the second die pad portion 44 when viewed in the first direction y. Alternatively, the entire fourth root portion 412 of the fourth lead 4A may overlap the second die pad portion 44 when viewed in the first direction y. Alternatively, the entire fourth root portion 412 of the fourth lead 4A may not overlap the second die pad portion 44. Therefore, in the fourth lead 4A, the fourth outer portion 41 may be located outward (on the x1 side in the second direction x) from the second die pad portion 44 in the second direction x. The second die pad portion 44 has a main surface 441, a back surface 442, and a second side surface 443.

[0047] The main surface 441 and the back surface 442 are spaced apart in the thickness direction z. The main surface 441 faces upward in the thickness direction z, and the back surface 442 faces downward in the thickness direction z. The second side surface 443 is connected to the main surface 441 and the back surface 442. The second side surface 443 faces in the first direction y toward the side where the fourth outer portion 41 of the fourth lead 4A is located (the y1 side in the first direction y). The second connecting portion 43 is connected to the second side surface 443. The inclination angle β1 of the second connecting portion 43 with respect to the second side surface 443 is not limited in any way, but is, for example, not less than 10° and not more than 89°, and in this embodiment, the inclination angle β1 is 45°.

[0048] The second side surface 443 includes a connecting region 443a and a pair of side regions 443b and 443c. The connecting region 443a is a region of the second side surface 443 that connects to the second connecting portion 43. The connecting region 443a is in contact with the second connecting portion 43. The pair of side regions 443b and 443c are individually arranged on both sides of the connecting region 443a in the second direction x. The side region 443b is located on the x1 side of the connecting region 443a in the second direction x, and the side region 443c is located on the x2 side of the connecting region 443a in the second direction x (the same side as the fourth lead 4B). The pair of side regions 443b and 443c are in contact with the sealing resin 7.

[0049] In the illustrated example, the connecting region 443a is disposed on the x1 side of the second side surface 443 relative to the center in the second direction x. Therefore, the dimension in the second direction x of the lateral region 443b is smaller than the dimension in the second direction x of the lateral region 443c. Alternatively, the connecting region 443a may be disposed on the x2 side of the second side surface 443 relative to the center in the second direction x. That is, the dimension in the second direction x of the lateral region 443b may be the same as the dimension in the second direction x of the lateral region 443c or may be larger than the dimension in the second direction x of the lateral region 443c.

[0050] In the illustrated example, the second die pad portion 44 has a rectangular shape in plan view and has four corners 449a, 449b, 449c, and 449d.

[0051] As shown in FIG. 4 , among the four corners of the second die pad portion 44 in plan view, the corner 449a is located on the y1 side in the first direction y and the x1 side in the second direction x. Of the four corners of the second die pad portion 44, the corner 449a is closest to the fourth outer portion 41 of the fourth lead 4A. Of the four corners of the second die pad portion 44, the corner 449b is located on the y2 side in the first direction y and the x2 side in the second direction x. The corner 449b is diagonally opposite the corner 449a. Of the four corners of the second die pad portion 44, the corner 449b is farthest from the fourth outer portion 41 of the fourth lead 4A. The corner 449c is located on the y1 side in the first direction y and the x2 side in the second direction x. The corner 449d is located on the y2 side in the first direction y and the x1 side in the second direction x among the four corners of the second die pad portion 44 in a plan view. The corner 449d is diagonally opposite the corner 449c. The corners 449a and 449c are both ends of the second side surface 443 in the second direction x.

[0052] In the electronic device A10, the first outer portion 11 and the first inner portion 12 are adjacent to each other with a distance d12 (see FIG. 6 ) in the second direction x. The multiple third outer portions 31 are arranged with a spacing d3 (see FIG. 5 ) in the second direction x. The spacing d12 (see FIG. 6 ) between the first outer portion 11 and the first inner portion 12 in the second direction x is greater than the spacing d3 (see FIG. 5 ) between adjacent third outer portions 31 in the second direction x. For example, the spacing d12 is 10 to 20 times the spacing d3. In this embodiment, the spacing d12 is, for example, 5 mm to 10 mm, and the spacing d3 is, for example, 0.25 mm to 5 mm. When the potential difference between the first outer portion 11 and the second outer portion 21 is approximately 800 V, the spacing d12 is preferably 4 mm or greater to prevent short circuits between the first outer portion 11 and the second outer portion 21. The distance d34A (see Figure 5) in the second direction x between the fourth outer portion 41 of the fourth lead 4A and the third outer portion 31 adjacent to the fourth outer portion 41, and the distance d34B (see Figure 5) in the second direction x between the fourth outer portion 41 of the fourth lead 4B and the third outer portion 31 adjacent to the fourth outer portion 41, are each the same as the arrangement distance d3.

[0053] In the electronic device A10, the shape and positional relationship between each of the first die pad portion 14 and the second die pad portion 44 and each of the first inner portion 12, the second inner portion 22, each third inner portion 32 and each fourth inner portion 42 are not limited to the example shown in the figure, and can be changed as appropriate depending on the specifications of the electronic device A10.

[0054] The first electronic component 51 and the second electronic component 52 are elements that perform electrical functions in the electronic device A 10. While the specific functions of the first electronic component 51 and the second electronic component 52 are not limited in any way, in this embodiment, the first electronic component 51 and the second electronic component 52 have a function of detecting voltage.

[0055] The first electronic component 51 is bonded to the first die pad portion 14 by a bonding material (e.g., solder or sintered silver) not shown, and is mounted on the first die pad portion 14. In the example shown, the first electronic component 51 and the connection region 143a of the first die pad portion 14 are arranged along the first direction y in a plan view. In this embodiment, the first electronic component 51 outputs a first signal corresponding to the potential of the first lead 1 and a second signal corresponding to the potential of the second lead 2 to the second electronic component 52. The first electronic component 51 has a plurality of electrodes 511, 512, and 513 arranged on its upper surface in the thickness direction z.

[0056] The second electronic component 52 is bonded to the second die pad portion 44 by a bonding material (e.g., solder or sintered silver) not shown, and is mounted on the second die pad portion 44. In the illustrated example, the second electronic component 52 and the connection region 443a of the second die pad portion 44 are arranged along the first direction y in a plan view. In this embodiment, the second electronic component 52 receives the first signal and the second signal from the first electronic component 51 and outputs a third signal corresponding to the potential difference between the first lead 1 and the second lead 2. In other words, the second electronic component 52 outputs a detection signal (third signal) of the voltage applied between the first lead 1 and the second lead 2. The second electronic component 52 has a plurality of electrodes 521, 522 arranged on its upper surface in the thickness direction z.

[0057] In the electronic device A10, the first electronic component 51 and the second electronic component 52 have, for example, the circuit configuration shown in Fig. 13. As shown in Fig. 13, the first electronic component 51 includes a plurality of resistor elements R1 to R4, and the second electronic component 52 includes an operational amplifier OP and a resistor element R5. The circuit configuration of the first electronic component 51 and the second electronic component 52 is not limited to the example shown in Fig. 13.

[0058] The two resistor elements R1 and R2 are connected in series. The two resistor elements R1 and R2 divide the voltage at terminal T1 (the potential difference between the potential at terminal T1 and the reference potential of ground GND). In this embodiment, terminal T1 corresponds to a plurality of electrodes 512. The connection point between the two resistor elements R1 and R2 is connected to the non-inverting input terminal of an operational amplifier OP. The two resistor elements R3 and R4 are connected in series. The two resistor elements R3 and R4 divide the voltage at terminal T2 (the potential difference between the potential at terminal T2 and the reference potential of ground GND). In this embodiment, terminal T2 corresponds to a plurality of electrodes 511. The connection point between the two resistor elements R3 and R4 is connected to the inverting input terminal of the operational amplifier OP. When the electronic device A10 detects the voltage of a battery installed in an electric vehicle, one of terminal T1 and terminal T2 is electrically connected to the high-potential terminal of the battery, and the other is electrically connected to the low-potential terminal.

[0059] The operational amplifier OP receives a first signal corresponding to the potential of the terminal T1 (in this embodiment, a signal obtained by dividing the voltage at the terminal T1) and a second signal corresponding to the potential of the terminal T2 (in this embodiment, a signal obtained by dividing the voltage at the terminal T2), and outputs a third signal corresponding to the potential difference between the terminals T1 and T2. The resistive element R5 is an element (feedback resistor) for determining the amplification gain of the operational amplifier OP, and one end of the resistive element R5 is connected to the inverting input terminal of the operational amplifier OP, and the other end is connected to the output terminal of the operational amplifier OP. The second electronic component 52 does not need to include the resistive element R5.

[0060] Each of the multiple connection members 61 to 66 electrically connects parts spaced apart from one another. In the illustrated example, each of the multiple connection members 61 to 66 is a bonding wire. Each of the multiple connection members 61 to 66 may be a plate-shaped metal member instead of a bonding wire. Each of the multiple connection members 61 to 66 contains any of Au, Al (aluminum), and Cu.

[0061] 2 , the connection member 61 is joined to the electrode 511 of the first electronic component 51 and the second inner portion 22, electrically connecting the first electronic component 51 and the second lead 2. Therefore, the second outer portion 21 of the second lead 2 is electrically connected to the first electronic component 51 via the second inner portion 22 and the connection member 61.

[0062] 2 , the connection member 62 is joined to the electrode 512 of the first electronic component 51 and the first coupling portion 13 (first inner portion 12), electrically connecting the first electronic component 51 and the first lead 1. Therefore, the first outer portion 11 of the first lead 1 is electrically connected to the first electronic component 51 via the first coupling portion 13 and the connection member 62.

[0063] 2 , each of the plurality of connection members 63 is joined to the electrode 521 of the second electronic component 52 and one of the plurality of third inner portions 32, electrically connecting the second electronic component 52 to one of the plurality of third leads 3. Thus, each of the third outer portions 31 of the plurality of third leads 3 is electrically connected to the second electronic component 52 via the corresponding third inner portion 32 and the corresponding connection member 63.

[0064] 2 , the connection member 64 is joined to the electrode 521 of the second electronic component 52 and the fourth inner portion 42 of the fourth lead 4B, electrically connecting the second electronic component 52 and the fourth lead 4B. Therefore, the fourth outer portion 41 of the fourth lead 4B is electrically connected to the second electronic component 52 via the fourth inner portion 42 of the fourth lead 4B and the connection member 64.

[0065] 2 , the connection member 65 is joined to the electrode 521 of the second electronic component 52 and the second coupling portion 43 (fourth inner portion 42), electrically connecting the second electronic component 52 and the fourth lead 4A. In other words, the fourth outer portion 41 of the fourth lead 4A is electrically connected to the second electronic component 52 via the second coupling portion 43 of the fourth lead 4A and the connection member 65.

[0066] 2 , the plurality of connection members 66 are joined to the electrodes 513 of the first electronic component 51 and the electrodes 522 of the second electronic component 52, electrically connecting the first electronic component 51 and the second electronic component 52. Thus, the plurality of connection members 66 are transmission paths for the first signal and the second signal.

[0067] The sealing resin 7 covers the first lead 1, the second lead 2, portions of the plurality of third leads 3, and portions of the pair of fourth leads 4, the first electronic component 51, the second electronic component 52, and the plurality of connecting members 61-66. The sealing resin 7 includes an insulating material such as epoxy resin. Preferably, the sealing resin 7 is made of a resin material with a comparative tracking index (CTI) of 600 V or higher. The method for forming the sealing resin 7 is not particularly limited, but may be, for example, molding. The sealing resin 7 has, for example, a rectangular parallelepiped shape. The dimension of the sealing resin 7 along the second direction x is, for example, 5 mm to 10 mm, and the dimension along the first direction y is, for example, 3 mm to 13 mm. The sealing resin 7 has a resin main surface 71, a resin back surface 72, a first resin side surface 731, a second resin side surface 732, and two resin side surfaces 733 and 734.

[0068] The resin main surface 71 and the resin back surface 72 are spaced apart from each other in the thickness direction z. The resin main surface 71 faces the z2 side in the thickness direction z, and the resin back surface 72 faces the z1 side in the thickness direction z. The resin main surface 71 is the upper surface of the sealing resin 7, and the resin back surface 72 is the lower surface of the sealing resin 7.

[0069] The first resin side surface 731 and the second resin side surface 732 are spaced apart from each other in the first direction y. The first resin side surface 731 faces the y2 side in the first direction y, and the second resin side surface 732 faces the y1 side in the first direction y. The two resin side surfaces 733 and 734 are spaced apart from each other in the second direction x. The resin side surface 733 faces the x2 side in the second direction x, and the resin side surface 734 faces the x1 side in the second direction x.

[0070] 1 to 3 and 6 to 10, the first outer portion 11 and the second outer portion 21 each protrude from the first resin side surface 731. As shown in FIGS. 1, 2, 4, 5 and 7 to 10, each third outer portion 31 of the multiple third leads 3 and each fourth outer portion 41 of the pair of fourth leads 4 each protrude from the second resin side surface 732.

[0071] In the electronic device A10 configured as described above, the sum of the distance d11 (see FIG. 3 ) from the first connection point 191 to the second connection point 192 and the distance d12 (see FIG. 3 ) from the second connection point 192 to the second corner 149b is shorter than in the following configuration. In this configuration, for example, the first connection point 13 is connected to a first corner 149a (the corner closest to the first outer part 11) among the four corners of the first die pad part 14. As shown in FIG. 3 , the first connection point 191 is the center of the boundary between the first inner part 12 and the first outer part 11 (hereinafter referred to as the "first boundary"). In this embodiment, in a plan view, the first boundary is a line segment extending along the second direction x, as shown in FIG. 3 , and the center of the first boundary is the center of the line segment in the second direction x. As shown in FIG. 3 , the second connection point 192 is the center of the boundary between the first connection point 13 and the first die pad part 14 (hereinafter referred to as the "second boundary"). 3 , the second boundary is a line segment that extends along the second direction x in plan view, and the center of the second boundary is the center of the line segment in the second direction x. Furthermore, the distance d11 is the shortest distance from the first connecting point 191 to the second connecting point 192 that passes over the first connecting portion 13, and the distance d12 is the shortest distance from the second connecting point 192 to the second corner portion 149 b that passes over the first die pad portion 14.

[0072] Furthermore, in the electronic device A10, the sum of the distance d21 (see FIG. 4 ) from the connection point 491 to the connection point 492 and the distance d22 (see FIG. 4 ) from the connection point 492 to the corner 449b is shorter than in the following configuration. In this configuration, for example, the second connection portion 43 is connected to a corner 449a (the corner closest to the fourth outer portion 41 of the fourth lead 4A) among the four corners of the second die pad portion 44. As shown in FIG. 4 , the connection point 491 is the center of the boundary (hereinafter referred to as the “third boundary”) between the fourth inner portion 42 of the fourth lead 4A and the fourth outer portion 41 of the fourth lead 4A. In this embodiment, in a plan view, the third boundary is a line segment extending along the second direction x, as shown in FIG. 4 , and the center of the third boundary is the center of the line segment in the second direction x. 4, the connection point 492 is the center of the boundary (hereinafter referred to as the "fourth boundary") between the second connection portion 43 and the second die pad portion 44. In this embodiment, in a plan view, the fourth boundary is a line segment along the second direction x, as shown in FIG. 4, and the center of the fourth boundary is the center of the line segment in the second direction x. Furthermore, the distance d21 is the shortest distance from the connection point 491 to the connection point 492 that passes over the second connection portion 43, and the distance d22 is the shortest distance from the connection point 492 to the corner portion 449b that passes over the second die pad portion 44.

[0073] FIG. 14 shows a process in the manufacture of the electronic device A10. FIG. 14 shows the state before the sealing resin 7 is formed. During the manufacturing process of the electronic device A10, as shown in FIG. 14 , the first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 are connected to one another by tie bars 91 and are included in a single lead frame 9. The tie bars 91 are connected to, for example, the first outer portion 11 of the first lead 1, the second outer portion 21 of the second lead 2, the third outer portions 31 of the plurality of third leads 3, and the fourth outer portions 41 of the pair of fourth leads 4. In this lead frame 9 state, the first inner portion 12 is supported by the tie bars 91 at the connection point C1 shown in FIG. 14 . The fourth inner portion 42 of the fourth lead 4A is supported by the tie bars 91 at the connection point C2 shown in FIG. 14 .

[0074] 14, the first electronic component 51 and the second electronic component 52 are mounted (joined) on the lead frame 9, and the connecting members 61 to 66 are formed (wire bonded) and then the sealing resin 7 is formed by, for example, molding. Thereafter, the first lead 1, the second lead 2, the plurality of third leads 3, and the pair of fourth leads 4 are each cut off from the tie bar 91, and the first outer part 11, the second outer part 21, the third outer parts 31, and the fourth outer parts 41 are each bent, thereby manufacturing the electronic device A10.

[0075] The functions and effects of the electronic device A10 are as follows.

[0076] In the electronic device A10, the center of the first outer part 11 is disposed on the x1 side of the center of the first die pad part 14 in the second direction x. That is, the first outer part 11 is shifted from the first die pad part 14 in both directions in the second direction x. With such a positional relationship between the first outer part 11 and the first die pad part 14, if the first linking part 13 were connected to the first die pad part 14 so as to be connected to the edge of the first die pad part 14 in the second direction x, the connection position of the first linking part 13 with respect to the first die pad part 14 would be farther from the center of the first die pad part 14. In contrast, in the electronic device A10, the first side surface 143 includes a linking region 143a connected to the first linking part 13 and a pair of side regions 143b and 143c disposed on both sides of the linking region 143a in the second direction x. In this configuration, the connection position of the first coupling portion 13 to the first die pad portion 14 is closer to the center in the second direction x than to the edge of the first die pad portion 14 in the second direction x, and therefore the connection position is closer to the center of the first die pad portion 14. Therefore, in the electronic device A10, the weight of the first die pad portion 14 can reduce stress applied to the connection portion between the first coupling portion 13 and the first die pad portion 14. In other words, the electronic device A10 can reduce deformation of the first lead 1, i.e., deformation of the lead frame.

[0077] The same applies to the second die pad portion 44. That is, in the electronic device A10, the second side surface 443 includes a connecting region 443a connected to the second connecting portion 43 and a pair of lateral regions 443b, 443c arranged on both sides of the connecting region 443a in the second direction x, and therefore the connection position of the second connecting portion 43 with the second die pad portion 44 approaches the center of the second die pad portion 44. That is, in the electronic device A10, the weight of the second die pad portion 44 can reduce stress applied to the connection portion between the second connecting portion 43 and the second die pad portion 44, and therefore deformation of the fourth lead 4A, i.e., deformation of the lead frame, can be reduced.

[0078] In the electronic device A10, the sum of the distances d11 and d12 is smaller than in a configuration in which the first coupling portion 13 is connected to the first corner 149a (the corner closest to the first outer portion 11) of the four corners of the first die pad portion 14. This configuration reduces deformation of the first lead 1. As shown in FIG. 14 , during manufacturing of the electronic device A10, the first inner portion 12 is supported by the tie bar 91 at the connection point C1. In this configuration, a bending moment occurs at the connection point C1 due to an external force applied to the first die pad portion 14. During the manufacturing process of the electronic device A10, the external force is applied to the first die pad portion 14, for example, during transport of the lead frame 9, during bonding of the first electronic component 51 to the first die pad portion 14, and during bonding of the connection members 61 and 62 to the first electronic component 51. The larger this bending moment, the greater the possibility of deformation (bending) at connection point C1, but the smaller the sum of distance d11 and distance d12, the smaller this bending moment. In the electronic device A10, as described above, the sum of distance d11 and distance d12 is smaller than in a configuration in which, for example, first coupling portion 13 is connected to first corner 149a (the corner closest to first outer portion 11) of the four corners of first die pad portion 14. In other words, in the electronic device A10, the bending moment acting on connection point C1 can be reduced, thereby reducing deformation of the first lead 1.

[0079] The same applies to the second die pad portion 44. That is, in the electronic device A10, the sum of the distances d21 and d22 is smaller than in a configuration in which the second coupling portion 43 is connected to, for example, a corner 449a (the corner of the fourth lead 4A closest to the fourth outer portion 41) among the four corners of the second die pad portion 44. That is, in the electronic device A10, the bending moment acting on the connection point C2 can be reduced, and therefore deformation of the fourth lead 4A can be reduced.

[0080] In the electronic device A10, the side surface of the first die pad portion 14, except for the connecting region 143a, is in contact with the sealing resin 7. The side surface of the first die pad portion 14 is the surface of the first die pad portion 14 that is connected to and sandwiched between the main surface 141 and the back surface 142, and a portion of the side surface is the first side surface 143. With this configuration, only the first connecting portion 13 is connected to the first die pad portion 14 and the first die pad portion 14 is supported solely by the first connecting portion 13. This increases the stress load on the connection point C1. Therefore, in the electronic device A10 configured in this manner, reducing the sum of the distance d11 and the distance d12 is preferable in terms of reducing deformation of the first lead 1.

[0081] In the electronic device A10, the inclination angle α1 of the first connecting portion 13 with respect to the first side surface 143 is 10° or greater and 89° or less. For example, if the inclination angle α1 is less than 10° (the lower limit of the aforementioned range), the first connecting portion 13 is connected to the first side surface 143 at an acute angle. This reduces the strength at the second boundary, increasing the likelihood of deformation at the second boundary. On the other hand, if the inclination angle α1 is less than 89° (the upper limit of the aforementioned range), the second boundary approaches the first corner 149a. This increases the sum of the distances d11 and d12, increasing the likelihood of deformation at the connection point C1. Therefore, by setting the inclination angle α1 within the above range, the electronic device A10 can appropriately reduce deformation at the second boundary and the connection point C1, which is preferable for reducing deformation of the first lead 1. In particular, by setting the inclination angle α1 to 45°, deformation at the second boundary and deformation at the connection point C1 are suppressed in a balanced manner, which is more preferable in terms of reducing deformation of the first lead 1.

[0082] The same applies to the second die pad portion 44. That is, in the electronic device A10, the inclination angle β1 of the second coupling portion 43 with respect to the second side surface 443 is equal to or greater than 10° and equal to or less than 89°, which can appropriately reduce deformation at the fourth boundary and at the connection point C2, and is therefore preferable in terms of reducing deformation of the fourth lead 4A. In particular, setting the inclination angle β1 to 45° reduces deformation at the fourth boundary and at the connection point C2 in a balanced manner, which is even more preferable in terms of reducing deformation of the fourth lead 4A.

[0083] In the electronic device A10, the connecting region 143a is disposed on the x1 side in the second direction x (i.e., the side where the center in the second direction x of the first outer part 11 is located and where the first corner part 149a is located) of the first side surface 143. This configuration is preferable in terms of setting the inclination angle α1 of the first connecting part 13 with respect to the first side surface 143 to be 30° or more and 45° or less.

[0084] In the electronic device A10, the connecting region 443a is arranged on the x1 side of the second side surface 443 in the second direction x from the center in the second direction x (i.e., the side where the center in the second direction x of the fourth outer portion 41 of the fourth lead 4A is located, and where the corner portion 449a is located). This configuration is preferable in terms of setting the inclination angle β1 of the second connecting portion 43 with respect to the second side surface 443 to be between 30° and 45°. Furthermore, in the electronic device A10, this is preferable in terms of ensuring an area for arranging multiple third leads 3 between a pair of fourth leads 4.

[0085] In the electronic device A10, the first outer portion 11 and the second outer portion 21 are adjacent to each other in the second direction x at a distance d12, and the multiple third outer portions 31 are arranged at an interval d3 in the second direction x. The interval d12 is greater than the interval d3. With this configuration, the creepage distance (the distance along the surface of the sealing resin 7) between the first outer portion 11 and the second outer portion 21 is greater than the creepage distance (the distance along the surface of the sealing resin 7) between the multiple third outer portions 31. Therefore, even when a high voltage is applied between the first outer portion 11 and the second outer portion 21, discharge between the first outer portion 11 and the second outer portion 21 is less likely to occur. Therefore, the electronic device A10 can reduce discharge between the first outer portion 11 and the second outer portion 21 while miniaturizing the device. In other words, the electronic device A10 has a package structure that is preferable for reducing discharge between the first outer part 11 and the second outer part 21.

[0086] Other embodiments and modifications of the electronic device of the present disclosure will be described below. The configurations of the components in each embodiment and each modification can be combined with each other to the extent that no technical contradiction occurs.

[0087] 15 to 17 show an electronic device A11 according to a first modified example of the first embodiment. The electronic device A11 differs from the electronic device A10 in the following respects: the first lead 1, the second lead 2, and the pair of fourth leads 4 have different configurations.

[0088] As shown in FIGS. 15 and 17 , the first lead 1 of the electronic device A11 includes two first outer portions 11 that are separated from each other. Unlike the illustrated example, the number of first outer portions 11 may be three or more. Each of the two first outer portions 11 includes a first mounting portion 111, a first root portion 112, and a first relay portion 113. As shown in FIG. 17 , the two first outer portions 11 are adjacent to each other with a distance d1 in the second direction x. The distance d1 is, for example, the same as the arrangement distance d3, but they may be different. With this configuration, the first inner portion 12 of the first lead 1 is bifurcated at the end connected to each first outer portion 11. Therefore, the two first outer portions 11 are electrically connected to each other by the first inner portions 12 and are at the same potential. Furthermore, since the first lead 1 includes two first outer portions 11, the first lead 1 includes two first boundaries. In this example, the first connection point 191 may be the midpoint between the two first boundaries, as shown in FIG.

[0089] As shown in FIGS. 15 and 17 , the second lead 2 of the electronic device A11 includes two second outer portions 21 that are separated from each other. Unlike the illustrated example, the number of second outer portions 21 may be three or more. Each of the two second outer portions 21 includes a second mounting portion 211, a second root portion 212, and a second relay portion 213. As shown in FIG. 17 , the two second outer portions 21 are adjacent to each other in the second direction x, spaced apart by a distance d2. The distance d2 is, for example, the same as the arrangement distance d3, but may be different. Due to this configuration, the second inner portion 22 of the second lead 2 has a bifurcated end connected to each second outer portion 21. Therefore, the two second outer portions 21 are electrically connected to each other by the second inner portions 22 and are at the same potential.

[0090] As shown in FIGS. 15 and 16 , each fourth lead 4 of the electronic device A11 includes two fourth outer portions 41 that are separated from each other. Unlike the illustrated example, the number of fourth outer portions 41 may be three or more. In each fourth lead 4, the two fourth outer portions 41 each include a fourth mounting portion 411, a fourth root portion 412, and a fourth relay portion 413. As shown in FIG. 16 , the two fourth outer portions 41 are adjacent to each other in the second direction x, spaced apart by a distance d41. The distance d41 is, for example, the same as the arrangement distance d3, but may be different. Due to this configuration, the fourth inner portion 42 of each fourth lead 4 is bifurcated at the end connected to the corresponding fourth outer portion 41. Therefore, in each fourth lead 4, the two fourth outer portions 41 are electrically connected to each other by the fourth inner portion 42 and therefore have the same potential. Furthermore, the fourth lead 4A includes two of the third boundaries because the fourth lead 4A includes two of the fourth outer portions 41. In this example, the connection point 491 may be set to the midpoint between the two third boundaries, as shown in FIG.

[0091] Similarly to the electronic device A10, the electronic device A11 can also reduce deformation of the first lead 1 and the fourth lead 4A, i.e., deformation of the lead frame. In addition, the electronic device A11 has the same configuration as the electronic device A10, and thereby achieves the same effects.

[0092] In the above first modified example, the first lead 1, the second lead 2, and the pair of fourth leads 4 are each described as being bifurcated inside the sealing resin 7, but at least one of these does not have to be bifurcated, as in the electronic device A10.

[0093] 18 shows an electronic device A12 according to a second modification of the first embodiment. The electronic device A12 differs from the electronic device A10 in the following respect: a plurality of third leads 3 are further disposed between the first lead 1 and the second lead 2.

[0094] 18 , the multiple third leads 3 arranged between the first lead 1 and the second lead 2 protrude from the first resin side surface 731. The third outer portions 31 of the multiple third leads 3 are arranged between the first outer portion 11 and the second outer portion 21 in the second direction x. The first outer portion 11 is arranged on the x1 side in the second direction x with respect to the third outer portions 31 of the multiple third leads 3. The first outer portion 11 is positioned furthest to the x1 side in the second direction x among the first outer portion 11, the second outer portion 21, and the multiple third outer portions 31 protruding from the first resin side surface 731. This configuration can be employed, for example, when each of the first electronic component 51 and the second electronic component 52 is an IC (Integrated Circuit).

[0095] As with the electronic device A10, the electronic device A12 can also reduce deformation of the first lead 1 and the fourth lead 4A, i.e., deformation of the lead frame. In addition, the electronic device A12 has the same configuration as the electronic devices A10 and A11, and thereby achieves the same effects.

[0096] 19 shows an electronic device A13 according to a third modification of the first embodiment. The electronic device A13 differs from the electronic device A10 in the following respect: the electronic device A13 does not include any of the plurality of third leads 3.

[0097] As with the electronic device A10, the electronic device A13 can also reduce deformation of the first lead 1 and the fourth lead 4A, i.e., deformation of the lead frame. In addition, the electronic device A13 has a common configuration with the electronic devices A10 to A12, and thereby achieves the same effects.

[0098] 20 and 21 show an electronic device A14 according to a fourth modified example of the first embodiment. The electronic device A14 differs from the electronic device A10 in the following respect: the functions of the first electronic component 51 and the second electronic component 52 are different.

[0099] In the electronic device A14, the first electronic component 51 and the second electronic component 52 have a power conversion function rather than a voltage detection function. In this modification, the first electronic component 51 and the second electronic component 52 are each a switching element. In this modification, as shown in FIG. 21 , the first electronic component 51 and the second electronic component 52 are each an IGBT (Insulated Gate Bipolar Transistor), but instead of an IGBT, they may be other transistors such as a MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) or a bipolar transistor.

[0100] 21 , the first electronic component 51 has three electrodes 511, 512, and 513. In an example where the first electronic component 51 is an IGBT, the electrode 511 is a gate, the electrode 512 is an emitter, and the electrode 513 is a collector. The first electronic component 51 has, for example, a vertical structure, with the two electrodes 511 and 512 arranged on its upper surface (the surface facing upward in the thickness direction z) and the electrode 513 arranged on its lower surface (the surface facing downward in the thickness direction z). The first electronic component 51 is bonded to the first die pad portion 14 by a conductive bonding material (e.g., solder) not shown. The electrode 513 provided on the lower surface of the first electronic component 51 is electrically connected to the first die pad portion 14 via the conductive bonding material.

[0101] As shown in FIG. 21 , the second electronic component 52 has three electrodes 521, 522, and 523. In an example where the second electronic component 52 is an IGBT, the electrode 521 is a gate, the electrode 522 is an emitter, and the electrode 523 is a collector. The second electronic component 52 has, for example, a vertical structure, with two electrodes 521 and 522 arranged on its upper surface (the surface facing upward in the thickness direction z) and an electrode 523 arranged on its lower surface (the surface facing downward in the thickness direction z). As shown in FIG. 21 , the second electronic component 52 is bonded to the second die pad portion 44 by a conductive bonding material (e.g., solder) (not shown). The electrode 523 provided on the lower surface of the second electronic component 52 is electrically connected to the second die pad portion 44 (the fourth lead 4A) via the conductive bonding material.

[0102] The first electronic component 51 and the second electronic component 52 may each have a horizontal structure instead of a vertical structure. In this case, the electrode 513 is disposed on the upper surface of the first electronic component 51, and the electrode 523 is disposed on the upper surface of the second electronic component 52. In this example, the electrode 513 and the first inner portion 12 are electrically connected by a bonding wire or a plate-shaped metal member, and the electrode 523 and the fourth inner portion 42 of the fourth lead 4A are electrically connected by a bonding wire or a plate-shaped metal member.

[0103] The electronic device A14 includes a plurality of connection members 67 in addition to the plurality of connection members 61 to 66. The plurality of connection members 67 are bonding wires, similar to the connection members 61 to 66. In the electronic device A14, the connection members 61 to 67 are bonded as follows.

[0104] In the electronic device A14, the multiple connection members 61 are each bonded to the electrode 512 and the second die pad portion 44, electrically connecting them. As a result, the second die pad portion 44 (the fourth inner portion 42 of the fourth lead 4A) is electrically connected to the electrode 512 via the multiple connection members 61. The multiple connection members 64 are each bonded to the electrode 522 and the second inner portion 22 of the second lead 2, electrically connecting them. As a result, the second lead 2 is electrically connected to the electrode 522 via the multiple connection members 64. The multiple connection members 67 are bonded to the second die pad portion 44 and the fourth inner portion 42 of the fourth lead 4B, electrically connecting them. As a result, the fourth lead 4B is electrically connected to the fourth lead 4A via the multiple connection members 67. In the electronic device A14, the fourth lead 4A is electrically connected to the electrode 523, and therefore the fourth lead 4B is electrically connected to the electrode 523.

[0105] In the electronic device A14, the connection member 62 is joined to the electrode 511 and the third inner portion 32 of any one of the multiple third leads 3, electrically connecting them. The third outer portion 31 of the third lead 3 to which the connection member 62 is joined is a signal input terminal that inputs a drive signal for the first electronic component 51. The connection member 63 is joined to the electrode 512 and the third inner portion 32 of any one of the multiple third leads 3, electrically connecting them. The third outer portion 31 of the third lead 3 to which the connection member 63 is joined is a detection terminal for detecting a current (emitter current in the electronic device A14) flowing through the first electronic component 51.

[0106] In the electronic device A14, the connection member 65 is joined to the electrode 521 and the third inner portion 32 of any one of the multiple third leads 3, electrically connecting them. The third outer portion 31 of the third lead 3 to which the connection member 65 is joined is a signal input terminal that inputs a drive signal for the second electronic component 52. The connection member 66 is joined to the electrode 522 and the third inner portion 32 of any one of the multiple third leads 3, electrically connecting them. The third outer portion 31 of the third lead 3 to which the connection member 66 is connected is a detection terminal for detecting a current (emitter current in the electronic device A14) flowing through the second electronic component 52.

[0107] In the electronic device A14, a power supply voltage (e.g., a DC voltage) is applied to the first outer part 11 (first lead 1) and the second outer part 21 (second lead 2), and the power supply voltage is converted into a predetermined voltage (e.g., an AC voltage) by the switching operations of the first electronic component 51 and the second electronic component 52. This converted voltage is output from each fourth outer part 41 of the pair of fourth leads 4 (the pair of fourth leads 4A, 4B).

[0108] In the electronic device A14, some of the multiple third leads 3 are not electrically connected to either the first electronic component 51 or the second electronic component 52, and therefore the electronic device A14 does not need to include such third leads 3. Furthermore, in the electronic device A14, the signal input terminal and detection terminal for the first electronic component 51 may be any of the multiple third leads 3 arranged between the pair of fourth leads 4. In this case, neither of the two third leads 3 between the first lead 1 and the second lead 2 need be provided.

[0109] As with the electronic device A10, the electronic device A14 can also reduce deformation of the first lead 1 and the fourth lead 4A, i.e., deformation of the lead frame. In addition, the electronic device A14 has a common configuration with the electronic devices A10 to A13, and thereby achieves the same effects.

[0110] In the fourth modified example, both the first electronic component 51 and the second electronic component 52 are switching elements. Alternatively, for example, the second electronic component 52 may be a control IC that controls the driving of the first electronic component 51, rather than a switching element. FIG. 22 shows an electronic device according to such a modified example of the fourth embodiment. In the electronic device shown in FIG. 22 , the second electronic component 52 outputs a drive signal to the first electronic component 51 via a connecting member 66. The second electronic component 52 detects the current flowing through the first electronic component 51 via a connecting member 67. In the electronic device shown in FIG. 22 , the multiple connecting members 61 are joined to the electrodes 512 and the second inner portion 22. An electronic device configured in this manner also achieves the same effects as the electronic device A14.

[0111] As can be understood from the above-described variations of the first embodiment, in the electronic device of the present disclosure, the function of the first electronic component 51 and the second electronic component 52 is not limited to a voltage detection function. Furthermore, in the electronic device of the present disclosure, the first electronic component 51 and the second electronic component 52 include semiconductor elements made of semiconductor materials. In other words, the electronic device of the present disclosure includes a semiconductor device including semiconductor elements as the first electronic component 51 and the second electronic component 52. Furthermore, as can be understood from the above-described variations of the first embodiment, in the electronic device of the present disclosure, the arrangement and number of the plurality of third leads 3 and the arrangement and number of the plurality of connecting members 61 to 67 are not limited to the illustrated configurations and can be changed as appropriate depending on the specifications of the electronic device.

[0112] 23 and 24 show an electronic device A20 according to the second embodiment. The electronic device A20 differs from the electronic device A10 in the following respects. First, in the electronic device A20, the first connection point 191, the second connection point 192, and the second corner 149b are aligned in a straight line. Second, in the electronic device A20, the connection point 491, the connection point 492, and the corner 449b are aligned in a straight line.

[0113] In the electronic device A20, like the electronic device A10, the first side surface 143 includes a connecting region 143a and a pair of side regions 143b, 143c. Therefore, like the electronic device A10, the electronic device A20 can reduce deformation of the first lead 1, i.e., deformation of the lead frame. Also, like the electronic device A10, in the electronic device A20, the second side surface 443 includes a connecting region 443a and a pair of side regions 443b, 443c. Therefore, like the electronic device A10, the electronic device A20 can reduce deformation of the fourth lead 4A, i.e., deformation of the lead frame. In addition, the electronic device A20 achieves common effects with the electronic device A10 due to the configuration that is common to the electronic device A10.

[0114] In the electronic device A20, the first connection point 191, the second connection point 192, and the second corner 149b are aligned in a straight line. This configuration minimizes the sum of the distance d11 between the first connection point 191 and the second connection point 192 and the distance d12 between the second connection point 192 and the second corner 149b. Therefore, the electronic device A20 can reduce deformation of the first lead 1 more than the electronic device A10.

[0115] In the electronic device A20, the connection points 491 and 492 and the corner 449b are aligned in a straight line. This configuration minimizes the sum of the distance d21 between the connection points 491 and 492 and the distance d22 between the connection point 492 and the corner 449b. Therefore, the electronic device A20 can reduce deformation of the fourth lead 4A more than the electronic device A10.

[0116] The electronic device of the present disclosure is not limited to one including both the first electronic component 51 and the second electronic component 52, but may be configured to include only one of the first electronic component 51 and the second electronic component 52. For example, a configuration including the first electronic component 51 but not the second electronic component 52 may not include either the multiple third leads 3 or the pair of fourth leads 4. Similarly, for example, a configuration including the second electronic component 52 but not the first electronic component 51 may not include either the first lead 1 or the second lead 2.

[0117] The electronic device according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the electronic device according to the present disclosure can be freely modified in various ways. For example, the electronic device according to the present disclosure includes the following embodiments. Supplementary Note 1. an electronic device comprising: an electronic component; a sealing resin covering the electronic component; and a first lead including a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin, wherein the first inner portion includes a first die pad portion on which the electronic component is mounted and a first connecting portion connecting the first outer portion and the first die pad portion, the first outer portion is arranged with respect to the first die pad portion on one side in a first direction orthogonal to a thickness direction of the electronic component, the first die pad portion has a first side surface facing the side on which the first outer portion is located in the first direction, the first connecting portion is connected to the first side surface, and in a second direction orthogonal to the first direction, a center of the first outer portion is arranged on one side of the second direction with respect to the center of the first die pad portion, and the first side surface includes a connecting region connected to the first connecting portion and a pair of side regions arranged on both sides of the connecting region in the second direction. The electronic device according to Supplementary Note 1, wherein the first die pad portion is rectangular when viewed in the thickness direction, and the first die pad portion has a first corner portion that is on one side in the first direction and on one side in the second direction when viewed in the thickness direction, and a second corner portion that is diagonally opposite the first corner portion when viewed in the thickness direction.Supplementary Note 3. The electronic device according to Supplementary Note 2, wherein a first connection point is a center of a boundary between the first inner portion and the first outer portion, and a second connection point is a center of a boundary between the first connection portion and the first die pad portion, and the first connection portion, the second connection point, and the second corner portion are aligned in a straight line when viewed in the thickness direction.Supplementary Note 4. The electronic device according to Supplementary Note 1 or Supplementary Note 2, wherein the connection region is located on one side in the second direction of the first side surface relative to a center in the second direction.Supplementary Note 5. The electronic device according to any one of Supplementary Notes 1 to 4, wherein the connection region and the electronic component are arranged along the first direction when viewed in the thickness direction.Appendix 6. The electronic device according to any one of Appendixes 1 to 5, wherein the first connecting portion is inclined with respect to the first side surface when viewed in the thickness direction. Appendix 7. The electronic device according to Appendix 6, wherein the inclination angle of the first connecting portion with respect to the first side surface is 10° or more and 89° or less. Appendix 8. The electronic device according to any one of Appendixes 1 to 7, further comprising: a second lead spaced apart from the first lead; and a conductive member joined to the second lead and the electronic component, wherein the second lead includes a second inner portion covered with the sealing resin and a second outer portion exposed from the sealing resin, and the conductive member is covered with the sealing resin and joined to the second inner portion. Appendix 9. The electronic device according to Appendix 8, wherein the sealing resin has a first resin side surface facing one of the first directions, and the first lead and the second lead protrude from the first resin side surface. Appendix 10. The electronic device of Appendix 9 further includes a plurality of third leads, each spaced apart from the first lead and the second lead, and each of the plurality of third leads includes a third inner portion covered with the sealing resin and a third outer portion exposed from the sealing resin. Appendix 11. The electronic device of Appendix 10, wherein each of the plurality of third leads protrudes from the first resin side surface, and the first outer portion is arranged on one side in the second direction relative to the second outer portion and the third outer portions of each of the plurality of third leads. Appendix 12. The electronic device of Appendix 10, wherein the sealing resin has a second resin side surface facing opposite to the first resin side surface in the first direction, and each of the plurality of third leads protrudes from the second resin side surface when viewed in the thickness direction. Appendix 13. The electronic device described in Appendix 12, wherein the first outer portion and the second outer portion are adjacent to each other with a first interval in the second direction, the third outer portions of the multiple third leads are arranged with a second interval in the second direction, and the first interval is larger than the second interval.Appendix 14. The electronic device of Appendix 13, further comprising a pair of fourth leads, each including a fourth inner portion covered with the sealing resin and a fourth outer portion exposed from the sealing resin, wherein each of the pair of fourth leads is spaced apart from the first lead, the second lead, and the multiple third leads and protrudes from the second resin side surface when viewed in the thickness direction, and the fourth outer portion of each of the pair of fourth leads is disposed on both sides of the third outer portions of the multiple third leads in the first direction. Appendix 15. The electronic device of Appendix 14, wherein the electronic component is a first electronic component and further comprises a second electronic component, wherein the pair of fourth leads are spaced apart from each other, and in one of the pair of fourth leads, the fourth inner portion includes a second die pad portion on which the second electronic component is mounted and a second coupling portion connecting the fourth outer portion and the second die pad portion. Appendix 16. The electronic device described in Appendix 15, wherein the second die pad portion has a second side surface facing the side where the one of the pair of fourth leads is located in the first direction, the second connecting portion is connected to the second side surface, and in the second direction, the center of the one of the pair of fourth leads is shifted in the second direction from the center of the second die pad portion.

[0118] A10 to A14, A20: Electronic device 1: First lead 11: First outer part 111: First mounting part 112: First root part 113: First relay part 12: First inner part 13: First connecting part 14: First die pad part 141: Main surface 142: Back surface 143: First side surface 143a: Connecting region 143b, 143c: Side region 149a: First corner part 149b: Second corner part 149c, 149d: Corner part 191: First connecting point 192: Second connecting point 2: Second lead 21: Second outer part 211: Second mounting part 212: Second root part 213: Second relay part 22: Second inner part 3: Third lead 31: Third outer part 311: Third mounting portion 312: Third root portion 313: Third relay portion 32: Third inner portion 4: Fourth lead 4A: Fourth lead 4B: Fourth lead 41: Fourth outer portion 411: Fourth mounting portion 412: Fourth root portion 413: Fourth relay portion 42: Fourth inner portion 43: Second connecting portion 44: Second die pad portion 441: Main surface 442: Back surface 443: Second side surface 443a: Connecting region 443b, 443c: Side regions 449a to 449d: Corners 491, 492: Connecting points 51: First electronic component 511, 512, 513: Electrodes 52: Second electronic component 521, 522, 523: Electrodes 61 to 67: Connecting member 7: Sealing resin 71: Main resin surface 72: Back resin surface 731: First resin side surface 732: Second resin side surface 733, 734: Resin side surfaces 9: Lead frame 91: Tie bars C1, C2: Connection points GND: Ground OP: Operational amplifier R1 to R5: Resistive elements T1, T2: Terminals

Claims

1. Electronic components and, A sealing resin covering the aforementioned electronic component, A first lead including a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin, Equipped with, The first inner portion includes a first die pad portion on which the electronic component is mounted, and a first connecting portion that connects the first outer portion and the first die pad portion. The first outer portion is positioned relative to the first die pad portion in one of the first directions perpendicular to the thickness direction of the electronic component. The first die pad portion has a first side surface that faces the side where the first outer portion is located in the first direction, The first connecting portion is connected to the first side surface, In a second direction perpendicular to the first direction, the center of the first outer portion is positioned in one direction relative to the center of the first die pad portion. The first side surface includes a connecting region connected to the first connecting portion and a pair of lateral regions arranged on both sides of the connecting region in the second direction, an electronic device.

2. The first die pad portion is rectangular when viewed in the thickness direction, The electronic device according to claim 1, wherein the first die pad portion has a first corner portion which, when viewed in the thickness direction, is on one side in the first direction and on one side in the second direction, and a second corner portion which, when viewed in the thickness direction, is located diagonally opposite the first corner portion.

3. The center of the boundary between the first inner portion and the first outer portion is defined as the first connecting point. The center of the boundary between the first connecting portion and the first die pad portion is taken as the second connecting point. The electronic device according to claim 2, wherein, when viewed in the thickness direction, the first connecting portion, the second connecting point, and the second corner portion are aligned in a straight line.

4. The electronic device according to claim 1, wherein the connecting region is located on one side of the first side surface in the second direction, from the center in the second direction.

5. The electronic device according to claim 1, wherein the connecting region and the electronic component are arranged along the first direction when viewed in the thickness direction.

6. The electronic device according to claim 1, wherein, when viewed in the thickness direction, the first connecting portion is inclined with respect to the first side surface.

7. The electronic device according to claim 6, wherein the inclination angle of the first connecting portion with respect to the first side surface is 10° or more and 89° or less.

8. A second lead that is separated from the first lead, The device further comprises a conductive member joined to the second lead and the electronic component, The second lead includes a second inner portion covered by the sealing resin and a second outer portion exposed from the sealing resin. The electronic device according to any one of claims 1 to 7, wherein the conductive member is covered with the sealing resin and joined to the second inner portion.

9. The sealing resin has a first resin side surface facing one of the first directions, The electronic device according to claim 8, wherein the first lead and the second lead protrude from the side surface of the first resin.

10. The device further comprises a plurality of third leads, each spaced apart from the first and second leads, The electronic device according to claim 9, wherein each of the plurality of third leads includes a third inner portion covered by the sealing resin and a third outer portion exposed from the sealing resin.

11. Each of the plurality of third leads protrudes from the side surface of the first resin, The electronic device according to claim 10, wherein the first outer portion is positioned on one side in the second direction from the second outer portion and the third outer portion of each of the plurality of third leads.

12. The sealing resin has a second resin side facing the opposite side of the first resin side in the first direction. The electronic device according to claim 10, wherein each of the plurality of third leads protrudes from the second resin side surface when viewed in the thickness direction.

13. The first outer portion and the second outer portion are adjacent to each other in the second direction with a first gap between them. The third outer portions of the plurality of third leads are arranged with a second spacing in the second direction. The electronic device according to claim 12, wherein the first interval is greater than the second interval.

14. The present invention further comprises a pair of fourth leads, each including a fourth inner portion covered by the sealing resin and a fourth outer portion exposed from the sealing resin, Each of the pair of fourth leads is spaced apart from the first lead, the second lead and the plurality of third leads, and protrudes from the second resin side surface when viewed in the thickness direction. The electronic device according to claim 13, wherein the fourth outer portion of each of the pair of fourth leads is arranged on both sides of the third outer portions of the plurality of third leads in the first direction.

15. The aforementioned electronic component is designated as the first electronic component, and the system further comprises a second electronic component. The pair of fourth leads are spaced apart from each other. The electronic device according to claim 14, wherein in one of the pair of fourth leads, the fourth inner portion includes a second die pad portion on which the second electronic component is mounted and a second connecting portion that connects the fourth outer portion and the second die pad portion.

16. The second die pad portion has a second side surface that faces the side where one of the pair of fourth leads is located in the first direction. The second connecting portion is connected to the second side surface, The electronic device according to claim 15, wherein, in the second direction, the center of one of the fourth outer portions of the pair of fourth leads is offset in the second direction from the center of the second die pad portion.