Resin composition, pellet, and molded article

Abstract

Provided are: a resin composition capable of providing a molded article having a low YI value and high light transmittance in a visible region; a pellet; and a molded article. This resin composition contains 0.01-1.5 parts by mass of a compound represented by formula (1) and 0.01-1.5 parts by mass of an epoxy compound and / or an oxetane compound with respect to 100 parts by mass of a polycarbonate resin, wherein the content of a phosphate compound having the structure represented by formula (P) is 0% by mass or more but less 0.01% by mass of the resin composition.

Description

Resin composition, pellets, and molded products

[0001] The present invention relates to a resin composition, a pellet, and a molded article, and more particularly to a resin composition containing a polycarbonate resin as a main component.

[0002] Polycarbonate resins have traditionally been widely used in a variety of applications due to their excellent performance. In particular, one application of polycarbonate resins is their active use in components requiring transparency, such as power covers, lighting lenses, lighting covers, and light-guiding components. For example, Patent Document 1 discloses polycarbonate resin composition pellets containing a polycarbonate resin (A), an aromatic compound (B) represented by the following formula, and a phosphorus-based stabilizer (C), wherein the content of the aromatic compound (B) in the pellets is 0.001 to 1 mass %, and the content of the phosphorus-based stabilizer (C) is 0.003 to 0.5 mass %. (In the formula, Y is an organic group containing no nitrogen, sulfur, or halogen, or a hydrogen atom. When Y is a hydrogen atom, X is an alkyl group or an aryl group which may have a substituent, and when Y is an organic group containing no nitrogen, sulfur, or halogen, X is an organic group containing no nitrogen, sulfur, or halogen, and in this case, X and Y may be the same or different. g represents an integer of 1 or 2. n represents an integer of 0 to 5, and when n is 2 or more, n Xs may be the same or different. k represents an integer of 1 to 4, and when k is 2 or more, Y is two or more -(CH ２ ) ｇ The OY groups may be the same or different, provided that n+k is 6 or less.

[0003] International Publication No. 2019 / 198321

[0004] Here, resin molded articles used in components requiring transparency, such as power covers, lighting lenses, lighting covers, and light-guiding members, are required to have a low YI value and high transmittance. In this regard, molded articles formed from the resin composition described in Patent Document 1 have an excellent YI value. However, the present inventors have conducted research and found that molded articles formed from the resin composition described in Patent Document 1 are not necessarily suitable for applications requiring high light transmittance in the visible range. The present invention aims to solve this problem by providing a resin composition, pellets, and molded articles that can provide molded articles having a low YI value and high light transmittance in the visible range.

[0005] In light of the above-mentioned problems, the present inventors have conducted studies and found that the above-mentioned problems can be solved by blending substantially no predetermined phosphite compound and further blending a predetermined amount of an epoxy compound and / or an oxetane compound. Specifically, the above-mentioned problems have been solved by the following means. <1> A resin composition containing, per 100 parts by mass of a polycarbonate resin, 0.01 to 1.5 parts by mass of a compound represented by formula (1) and 0.01 to 1.5 parts by mass of an epoxy compound and / or an oxetane compound, wherein the content of the phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition. (In formula (1), R １ ~R ３ are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R ４ represents a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or -OR ５ is a group represented by R ５ is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 2. <2> In the formula (1), R １ ~R ３ are each independently a hydrogen atom or a methyl group, and R ４ represents a hydrogen atom, a methyl group, or —OR ５is a group represented by R ５ is a hydrogen atom or a methyl group. <3> The resin composition according to <1>, wherein in formula (1), n ​​is 1. <4> The resin composition according to <1>, wherein formula (1) is represented by formula (1-1). (In formula (1-1), R １１ ~R ３１ are each independently a hydrogen atom or a methyl group, and R ４１ represents a hydrogen atom, a methyl group, or —OR ５１ is a group represented by R ５１ is a hydrogen atom or a methyl group. １１ is a hydrogen atom or a methyl group, and R ２１ is a hydrogen atom or a methyl group, and R ３１ <6> The resin composition according to any one of <1> to <5>, wherein the compound represented by formula (1) is a compound selected from the following: <7> Pellets of the resin composition according to any one of <1> to <6>. <8> A molded article formed from the resin composition according to any one of <1> to <6>. <9> A molded article formed from the pellets according to <7>.

[0006] According to the present invention, it is possible to provide a resin composition, pellets, and molded articles that can provide molded articles having a low YI value and high light transmittance in the visible region.

[0007] Hereinafter, a mode for carrying out the present invention (hereinafter simply referred to as "the present embodiment") will be described in detail. Note that the following present embodiment is an example for explaining the present invention, and the present invention is not limited to only this embodiment. Note that in this specification, the word "to" is used to mean that the numerical values ​​written before and after it are included as lower and upper limits. In this specification, various physical property values ​​and characteristic values ​​are those at 23°C unless otherwise specified. When the measurement methods etc. described in the standards shown in this specification vary depending on the fiscal year, they are based on the standards as of January 1, 2023, unless otherwise specified.

[0008] The resin composition of the present embodiment is a resin composition containing 0.01 to 1.5 parts by mass of a compound represented by formula (1) and 0.01 to 1.5 parts by mass of an epoxy compound and / or an oxetane compound, and is characterized in that the content of the phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition. (In formula (1), R １ ~R ３ are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R ４ represents a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or -OR ５ is a group represented by R ５ is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 2.

[0009] By adopting such a constitution, a resin composition can be obtained which can provide a molded article having a low YI value and a high light transmittance in the visible region. In particular, a resin composition can be obtained which can provide a molded article having a low initial YI value and a low YI value after heating. Furthermore, a resin composition can be obtained which can provide a molded article having a small ΔYI value (YI value after heating - initial YI value). That is, in this embodiment, an improvement in hue is achieved by blending a compound represented by formula (1). The benzene ring -CH of the compound represented by formula (1) ２ It is believed that the portion undergoes a reduction reaction, suppressing an increase in hue. On the other hand, the epoxy compound and / or oxetane compound can also suppress a decrease in light transmittance of visible light. Furthermore, the epoxy compound and / or oxetane compound can moderate the degree of increase in the YI value during heating. In addition, in this embodiment, the content of the phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass of the resin composition. In other words, the resin composition does not contain, or substantially does not contain, a phosphite compound having a structure represented by formula (P). By adopting such a configuration, a resin composition can be obtained that can provide a molded product with high light transmittance in the visible region. The resin composition of this embodiment will be described below.

[0010] <Polycarbonate Resin> The resin composition of this embodiment contains a polycarbonate resin. The polycarbonate resin is not particularly limited as long as it contains an -[O-R-OC(=O)]- unit (where R is an organic group, preferably a hydrocarbon group, more preferably an aliphatic group, an aromatic group, or one containing both an aliphatic group and an aromatic group, and further one having a linear or branched structure) that contains a carbonate bond in the molecular main chain. In this embodiment, the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton. By using such a polycarbonate resin, the obtained molded article achieves better heat resistance and toughness. In the present embodiment, the polycarbonate resin having a bisphenol skeleton preferably has 90 mol % or more of all structural units that have a bisphenol skeleton, more preferably 90 mol % or more of all structural units that have at least one skeleton of bisphenol A, bisphenol C, and bisphenol AP, and even more preferably 90 mol % or more of all structural units that have a bisphenol A skeleton.

[0011] The viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By setting it to the lower limit or more, the durability of the obtained molded article tends to be further improved. The upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, even more preferably 30,000 or less, still more preferably 25,000 or less, and even more preferably 20,000 or less. By setting it to the upper limit or less, the molding processability of the molded article tends to be further improved. The viscosity average molecular weight (Mv) is determined by using methylene chloride as a solvent and an Ubbelohde viscometer to determine the intrinsic viscosity [η] (unit: dL / g) at a temperature of 25°C, and then calculating the viscosity average molecular weight (Mv) using Schnell's viscosity formula, i.e., η = 1.23 × 10 -４ ×Mv ０．８３When two or more types of polycarbonate resins are used, the viscosity average molecular weight is the viscosity average molecular weight of the mixture.

[0012] The method for producing the polycarbonate resin is not particularly limited, and polycarbonate resins produced by the conventionally known phosgene method (interfacial polymerization method) or melt method (ester interchange method) can be used. When the melt method is used, a polycarbonate resin in which the amount of OH groups in the terminal groups has been adjusted can be used.

[0013] The polycarbonate resin used in this embodiment may be a recycled polycarbonate resin product (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or a waste material from thermoplastic resin molding.

[0014] In addition to the above, for details of the polycarbonate resin, please refer to the descriptions in paragraphs 0013 to 0041 of JP-A-2021-084942 and paragraphs 0030 to 0035 of JP-A-2021-119211, the contents of which are incorporated herein by reference.

[0015] The content of the polycarbonate resin in the resin composition of this embodiment is preferably 85% by mass or more of the resin composition, more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 98% by mass or more. The upper limit of the content of the polycarbonate resin in the resin composition is the amount such that the total of the polycarbonate resin, the compound represented by formula (1), and the epoxy compound and / or oxetane compound is 100% by mass. The resin composition of this embodiment may contain only one type of polycarbonate resin, or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0016] <Compound Represented by Formula (1)> The resin composition of this embodiment contains 0.01 to 1.5 parts by mass of the compound represented by Formula (1) relative to 100 parts by mass of the polycarbonate resin. By containing the compound represented by Formula (1), the YI value of the obtained molded article can be reduced. (In formula (1), R １ ~R３ are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R ４ represents a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or -OR ５ is a group represented by R ５ is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 0 to 2.

[0017] In formula (1), R １ ~R ３ are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, preferably a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, still more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 3 carbon atoms, and even more preferably a hydrogen atom or a methyl group.

[0018] In formula (1), R ４ represents a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or -OR ５ and is a group represented by the formula: ５ and is preferably a hydrogen atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, or a group represented by -OR ５ and more preferably a hydrogen atom, an unsubstituted alkyl group having 1 to 3 carbon atoms, or a group represented by -OR ５ More preferably, the group is a hydrogen atom, a methyl group, or a group represented by -OR ５ In formula (1), R is more preferably a group represented by the formula (1) (preferably a methoxy group). ５represents a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, is preferably a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, is more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, is more preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 3 carbon atoms, and is further preferably a hydrogen atom or a methyl group.

[0019] In formula (1), n ​​is an integer of 0 to 2, preferably 0 or 1, and more preferably 1.

[0020] Formula (1) is preferably represented by formula (1-1). (In formula (1-1), R １１ ~R ３１ are each independently a hydrogen atom or a methyl group, and R ４１ represents a hydrogen atom, a methyl group, or —OR ５１ is a group represented by R ５１ is a hydrogen atom or a methyl group.

[0021] In formula (1-1), R １１ is preferably a hydrogen atom or a methyl group, and R ２１ is preferably a hydrogen atom or a methyl group, and R ３１ is preferably a methyl group or a methoxy group. ４１ is preferably a hydrogen atom, a methyl group, or a methoxy group.

[0022] In this embodiment, the number of hydrogen atoms directly bonded to a carbon atom bonded to an aromatic ring of the compound represented by formula (1) is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. By making the number equal to or greater than the lower limit, the transmittance in the short wavelength range tends to be further improved. Furthermore, the upper limit of the number of hydrogen atoms directly bonded to a carbon atom bonded to an aromatic ring of the compound represented by formula (1) is preferably 5 or less, and more preferably 4 or less. By making the number equal to or less than the upper limit, the transmittance in the short wavelength range tends to be further improved. The total number of hydrogen atoms directly bonded to a carbon atom bonded to an aromatic ring of the compound represented by formula (1) and the number of hydrogen atoms bonded to hydroxyl groups directly bonded to a carbon atom bonded to an aromatic ring of the compound represented by formula (1) is preferably 3 or more, more preferably 4 or more, even more preferably 5 or more, and even more preferably 6 or more. By making the number equal to or greater than the lower limit, the transmittance in the short wavelength range tends to be further improved. Furthermore, the upper limit of the total number of hydrogen atoms directly bonded to a carbon atom bonded to an aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms bonded to a hydroxyl group directly bonded to a carbon atom bonded to an aromatic ring of the compound represented by formula (1) is preferably 6 or less. By setting the total number to be equal to or less than the upper limit, the transmittance in the short wavelength range tends to be further improved. When the resin composition of this embodiment contains two or more compounds represented by formula (1), the total number of hydrogen atoms is the sum of the number of hydrogen atoms (or the number of hydrogen atoms at benzyl positions) of each compound represented by formula (1) and the addition concentration.

[0023] Examples of the compound represented by formula (1) are listed below. It goes without saying that the compound represented by formula (1) in this embodiment is not limited to these.

[0024] The content of the compound represented by formula (1) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, even more preferably 0.1 parts by mass or more, still more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of polycarbonate resin. By setting the content at or above the lower limit, transmittance in the short wavelength range tends to be further improved. Furthermore, the content of the compound represented by formula (1) is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, even more preferably 1.1 parts by mass or less, still more preferably 1.0 part by mass or less, and even more preferably 0.9 parts by mass or less, relative to 100 parts by mass of polycarbonate resin. By setting the content at or below the upper limit, the effect of reducing mold deposits tends to be further improved. The resin composition of this embodiment may contain only one type of compound represented by formula (1), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0025] <Epoxy Compound and / or Oxetane Compound> The resin composition of the present embodiment contains an epoxy compound and / or an oxetane compound. By containing an epoxy compound and / or an oxetane compound, it is possible to reduce the YI value and the YI value after heating, and to obtain a molded product with excellent light transmittance in the visible light range.

[0026] The epoxy compound refers to a compound containing an epoxy group, and may contain only one epoxy group or two or more epoxy groups in one molecule, but preferably contains one to four, more preferably one to three, and even more preferably two. The oxetane compound refers to a compound containing an oxetanyl group, and may contain only one oxetanyl group or two or more oxetanyl groups in one molecule, but preferably contains one to four, more preferably one to three, and even more preferably two. In this embodiment, it is preferable to contain at least an epoxy compound.

[0027] The molecular weight of the epoxy compound and / or oxetane compound is not particularly limited, but is preferably 100 or more, and is preferably 1500 or less, more preferably 1000 or less, even more preferably 800 or less, and may be 500 or less.

[0028] The epoxy compound and / or oxetane compound is preferably an alicyclic epoxy compound and / or an alicyclic oxetane compound.

[0029] The alicyclic epoxy compound and / or alicyclic oxetane compound used in this embodiment is preferably a compound represented by formula (2), a compound represented by formula (3), or a compound represented by formula (4), more preferably a compound represented by formula (2) and / or a compound represented by formula (4), and even more preferably a compound represented by formula (2). (In formula (2), A 1 represents a divalent organic group.

[0030] In formula (2), A 1 is preferably a hydrocarbon group having 1 to 10 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, and more preferably an alkylene group having 1 to 10 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups. The alkylene group may be linear, branched, or cyclic, and is preferably linear or branched, and more preferably linear. Preferred examples of the compound represented by formula (2) include the following compounds. Formula (3) (In formula (3), A 2 and A 3 each independently represents a divalent organic group.

[0031] In formula (3), A ２ are each independently preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and more preferably an alkylene group having 1 to 3 carbon atoms. ３is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, and even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, or a group consisting of a combination of two or more of the above groups. 3 The end (next to the oxygen atom) of is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, and even more preferably an alkylene group having 1 to 10 carbon atoms. Preferred examples of the compound represented by formula (3) include the following compounds. n is any integer, preferably 1 to 11.

[0032] Formula (4) (In formula (4), A ４ and A ５ R each independently represents a divalent organic group. a is an alkyl group having 1 to 5 carbon atoms, and nb is 0 or 1.

[0033] In formula (4), A 4 are each independently preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group consisting of a combination of two or more of the above groups, still more preferably an alkylene group having 1 to 10 carbon atoms, even more preferably an alkylene group having 1 to 3 carbon atoms, and still more preferably an ethylene group or a methylene group. 5is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, and even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group consisting of a combination of two or more of the above groups. 5 The end (next to the oxygen atom) of is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, even more preferably an alkylene group having 1 to 10 carbon atoms, and still more preferably an alkylene group having 1 to 3 carbon atoms.

[0034] R ａ is preferably an alkyl group having 1 to 3 carbon atoms, and is preferably a methyl group or an ethyl group. nb is preferably 1. Preferred examples of the compound represented by formula (4) include the following compounds.

[0035] In addition to the above, preferred examples of the epoxy compound and / or oxetane compound used in this embodiment include the compounds described in paragraphs 0043 to 0069 of JP-A-2021-038306 and paragraphs 0023 to 0037 of JP-A-2021-031658, the contents of which are incorporated herein by reference.

[0036] The content of the epoxy compound and / or oxetane compound (preferably the epoxy compound) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, even more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin. By setting the content at or above the lower limit, long-term thermal stability tends to be further improved. Furthermore, the content of the epoxy compound and / or oxetane compound (preferably the epoxy compound) is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, even more preferably 1.1 parts by mass or less, even more preferably 1.0 part by mass or less, and even more preferably 0.9 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin. By setting the content at or below the upper limit, the mold deposit reduction effect tends to be further improved. The resin composition of the present embodiment may contain only one epoxy compound and oxetane compound (preferably an epoxy compound), or may contain two or more kinds. When two or more kinds are contained, it is preferable that the total amount is in the above range.

[0037] <Stabilizer> The resin composition of the present embodiment may contain a stabilizer other than the phosphite compound having a structure represented by formula (P). Examples of the stabilizer include a heat stabilizer and an antioxidant. Examples of the stabilizer include phenol-based, amine-based, phosphorus-based, and thioether-based stabilizers. Among these, in the present embodiment, it is preferable to contain a phosphorus-based heat stabilizer.

[0038] Any known phosphorus-based heat stabilizer can be used. Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds other than those having a structure represented by formula (P) being particularly preferred.

[0039] Examples of the organic phosphite compound include triphenyl phosphite, tris(mononylphenyl) phosphite, tris(mononyl / dinonyl phenyl) phosphite, tris(2,4-di-tert-butylphenyl) phosphite, monooctyldiphenyl phosphite, dioctyl monophenyl phosphite, monodecyldiphenyl phosphite, didecyl monophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite. Specific examples of such organic phosphite compounds include "ADK STAB (registered trademark; the same applies hereinafter) 1178," "ADK STAB 2112," and "ADK STAB HP-10" manufactured by ADEKA Corporation; "JP-351," "JP-360," and "JP-3CP" manufactured by Johoku Chemical Industry Co., Ltd.; and "IRGAFOS (registered trademark; the same applies hereinafter) 168" manufactured by BASF.

[0040] In addition to the above, the phosphorus-based heat stabilizer used in this embodiment can be found in paragraphs 0127 to 0133 of JP-A-2022-067329, the contents of which are incorporated herein by reference.

[0041] As the phenol-based antioxidant, a hindered phenol-based antioxidant is preferably used. Specific examples of the hindered phenol-based antioxidant include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 4,6-bis(octyl methylthiomethyl)-o-cresol, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, and the like.

[0042] Among these, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol-based antioxidants include "Irganox (registered trademark; the same applies hereinafter) 1010" and "Irganox 1076" manufactured by BASF, and "ADK STAB AO-50" and "ADK STAB AO-60" manufactured by ADEKA Corporation.

[0043] The content of the stabilizer (preferably a phosphorus-based stabilizer other than a phosphite compound having a structure represented by formula (P)) in the resin composition of this embodiment is usually 0.001 part by mass or more, preferably 0.005 part by mass or more, more preferably 0.01 part by mass or more, and usually 1 part by mass or less, preferably 0.5 part by mass or less, more preferably 0.3 part by mass or less, relative to 100 parts by mass of the polycarbonate resin. By setting the content of the stabilizer within the above range, the effect of adding the stabilizer can be more effectively exerted. The resin composition of this embodiment may contain only one type of stabilizer, or may contain two or more types. When two or more types are contained, it is preferable that the total amount be in the above range.

[0044] In the resin composition of this embodiment, the content of the phosphite compound having a structure represented by formula (P) is 0% by mass or more and less than 0.01% by mass, preferably less than 0.001% by mass, and more preferably less than 0.0001% by mass of the resin composition. In this way, by configuring the resin composition to be substantially free of the compound represented by formula (P), a molded article having excellent light transmittance for visible light can be obtained.

[0045] Examples of the compound represented by formula (P) include distearyl pentaerythritol diphosphite, bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, and bis(nonylphenyl)pentaerythritol diphosphite.

[0046] <Release Agent> The resin composition of this embodiment may contain a release agent. Adding a release agent can further improve releasability. Examples of release agents include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds with a number-average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred. For details about release agents, see paragraphs 0055 to 0061 of JP 2018-095706 A, the contents of which are incorporated herein by reference. When the resin composition of this embodiment contains a release agent, the content thereof is preferably 0.01 to 3 mass% of the resin composition. The resin composition of this embodiment may contain only one type of release agent, or two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0047] <Other Components> The resin composition of this embodiment may contain other components in addition to those described above, as necessary, as long as the desired physical properties are not significantly impaired. Examples of other components include various resin additives. Examples of resin additives include ultraviolet absorbers, colorants (dyes, pigments), antistatic agents, flame retardants, flame retardant assistants, anti-dripping agents, anti-fogging agents, anti-blocking agents, flow improvers, plasticizers, dispersants, and antibacterial agents. Note that one type of resin additive may be contained, or two or more types may be contained in any combination and ratio.

[0048] <Physical Properties of Resin Composition> The resin composition of this embodiment preferably has a low YI value when molded into a 300 mm long optical path molded article. Specifically, the YI value when the resin composition of this embodiment is molded into a 300 mm long optical path molded article is preferably 17.4 or less, more preferably 15.0 or less, and even more preferably 13.0 or less. Furthermore, while 0 is the ideal lower limit of the YI value, a value of 1.0 or more, even 5.0 or more, and particularly 10.0 or more sufficiently satisfies the required performance. Such a low YI value is achieved by incorporating a compound represented by formula (1). The resin composition of this embodiment preferably has a low YI value when molded into a 300 mm long optical path molded article and heated. Specifically, the ΔYI value when the resin composition of this embodiment is molded into a 300 mm long optical path molded article and heated at 120°C for 500 hours is preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less. The lower limit of the YI value is ideally 0, but the required performance is sufficiently satisfied even if the YI value is 1.0 or more, further 5 or more, and particularly 15 or more. Such a low YI value is achieved by blending the compound represented by formula (1) with an epoxy compound and / or an oxetane compound.

[0049] The resin composition of this embodiment, when molded into a 300 mm long optical path molded article, preferably has a light transmittance at a wavelength of 400 nm of 40% or more, more preferably 42% or more, more preferably 48% or more, even more preferably 50% or more, and even more preferably 52% or more. There is no particular upper limit to the light transmittance at a wavelength of 400 nm, but 42% or less is practical, and even 40% or less sufficiently meets the required performance. The resin composition of this embodiment, when molded into a 300 mm long optical path molded article, preferably has a light transmittance at a wavelength of 420 nm of 52% or more, more preferably 55% or more, more preferably 59% or more, even more preferably 61% or more, and even more preferably 63% or more. There is no particular upper limit to the light transmittance at a wavelength of 420 nm, but 52% or less is practical, and even 50% or less sufficiently meets the required performance. The resin composition of this embodiment preferably has a light transmittance at a wavelength of 500 nm when molded into a 300 mm long optical path molded product of 57% or more, more preferably 60% or more, more preferably 63% or more, even more preferably 66% or more, and even more preferably 69% or more. There is no particular upper limit for the light transmittance at a wavelength of 500 nm, but 57% or less is practical, and even 55% or less fully satisfies the required performance. The YI value and light transmittance are measured according to the methods described in the Examples below.

[0050] <Method of Manufacturing Resin Composition> The method of manufacturing the resin composition of this embodiment is not limited, and a wide variety of known methods for manufacturing resin compositions can be used. For example, a method can be used in which the polycarbonate resin, the compound represented by formula (1), the epoxy compound and / or the oxetane compound, and other components that are added as needed are premixed using various mixers such as a tumbler or a Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender mixer, a single-screw kneading extruder, a twin-screw kneading extruder, or a kneader. The melt-kneading temperature is not particularly limited, but is usually in the range of 240 to 320°C.

[0051] <Molded Article> The molded article of this embodiment is formed from the resin composition or pellets of this embodiment. The above-mentioned resin composition (e.g., pellets) is molded into a molded article by various molding methods. The shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article. Examples include film-like, rod-like, cylindrical, ring-like, circular, elliptical, polygonal, irregular-shaped, hollow, frame-like, box-like, panel-like, and button-like shapes.

[0052] The method for molding the molded article is not particularly limited, and conventionally known molding methods can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, blow molding, gas-assisted blow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding), rotational molding, multilayer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding. The resin composition of this embodiment is particularly suitable for molded articles obtained by injection molding, injection compression molding, and extrusion molding. However, it goes without saying that the resin composition of this embodiment is not limited to molded articles obtained by these methods.

[0053] The molded article of this embodiment can be widely used for molded articles containing polycarbonate resin, particularly optical components. Specifically, it is preferably used in electrical and electronic equipment / components, office automation equipment / components, information terminal equipment / components, machine parts, home appliances, vehicle parts, building materials, various containers, leisure goods / miscellaneous goods, lighting equipment, etc., and more specifically, it is preferably used for power covers, lighting lenses, lighting covers, light guiding members, etc. More specifically, it can be used for light guides and lenses that guide light from light sources such as LEDs in vehicle headlamps (headlamps) or rear lamps, fog lamps, etc. for automobiles or motorcycles. For uses of the resin composition of this embodiment, in addition to the above, the descriptions of 0098 to 0105 of JP 2020-189992 A can be referred to, the contents of which are incorporated herein by reference.

[0054] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

[0055] 1. Raw Materials The materials shown in Table 1 below were used.

[0056] 2. Examples 1 to 11 and Comparative Examples 1 to 4 <Compounds> The components listed in Table 1 were blended in the proportions (all parts by mass) listed in Tables 2 to 4 and mixed uniformly in a tumbler mixer to obtain a mixture. This mixture was fed to a single-screw extruder "VS40-32V" manufactured by Tanabe Plastics Machinery Co., Ltd., kneaded under conditions of a screw rotation speed of 80 rpm, a discharge rate of 20 kg / hr, and a barrel temperature of 250°C, and extruded in the form of a strand from the tip of the extrusion nozzle. The extrudate was quenched in a water bath and cut and pelletized using a pelletizer to obtain pellets of the resin composition.

[0057] <Measurement of Light Transmittance> Each resin composition (pellet) obtained above was dried at 120°C for 4 to 8 hours in a hot air circulation dryer, and then molded into 300 mm long optical path molded articles (6 mm x 4 mm x 300 mm, L / d = 50) at 280°C using an injection molding machine (FANUC Corporation, "S-2000i 150B"). The 300 mm long optical path molded articles obtained above were used as test pieces, and the light transmittance was measured at wavelengths of 400 nm, 420 nm, 440 nm, 460 nm, 480 nm, and 500 nm over a 300 mm length using a long optical path spectrophotometer with a C light source and a 2°C field of view. The long optical path spectrophotometer used was an "ASA1" manufactured by Nippon Denshoku Industries Co., Ltd.

[0058] <Measurement of YI Value> Each resin composition (pellet) obtained above was dried at 120°C for 4 to 8 hours in a hot air circulation dryer, and then molded into a 300 mm long optical path molded product (6 mm x 4 mm x 300 mm, L / d = 50) at a temperature of 280°C using an injection molding machine (FANUC Corporation, "S-2000i 150B"). The YI (Yellow Index) value of this molded product was measured using a long optical path spectrophotometer with a C light source and a 2°C field of view. The long optical path spectrophotometer used was an "ASA1" manufactured by Nippon Denshoku Industries Co., Ltd.

[0059]

[0060]

[0061]

[0062]

[0063] In the table above, "compounds of formula (1), etc." refers to compounds represented by formula (1) or comparative compounds. In the table above, "number of protons at benzylic positions" refers to the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1). Furthermore, "number of protons at benzylic positions (including OH groups)" refers to the sum of the number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the number of hydrogen atoms bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1). Furthermore, "relative proton number" refers to the sum of the number of protons at benzylic positions and the additive concentration of each compound represented by formula (1). As is clear from the above results, the resin composition of this embodiment produced molded articles with low YI values ​​and high light transmittance. In contrast, when compounds other than the compound represented by formula (1) were used, the YI value was high even when compounds with similar structures were used. Furthermore, in Examples 1 to 9, when the stabilizer was replaced from Adekastab 2112 to Adekastab PEP-36 (manufactured by ADEKA Corporation, a phosphite compound having a structure represented by formula (P)), and the other conditions were the same, the YI value became relatively high.

[0064] Furthermore, when DOVERPHOS S-9228 (registered trademark) manufactured by DOVER Chemical Company is used as the phosphite compound having the structure represented by formula (P), the YI value also becomes relatively high.

Claims

1. Per 100 parts by mass of polycarbonate resin, 0.01 to 1.5 parts by mass of the compound represented by formula (1), A resin composition comprising 0.01 to 1.5 parts by mass of an epoxy compound and / or an oxetane compound, A light guide member formed from a resin composition, wherein the content of a phosphite compound having the structure represented by formula (P) is 0% by mass or more and less than 0.001% by mass of the resin composition. 【Chemistry 1】 (In formula (1), R １ ~R ３ Each is independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R ４ is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or -OR ５ It is a group represented by R ５ (where n is a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer from 0 to 2.) 【Chemistry 2】

2. In the formula (1), R １ to R ３ are each independently a hydrogen atom or a methyl group, and R ４ is a hydrogen atom, a methyl group, or a group represented by -OR ５ , and R ５ is a hydrogen atom or a methyl group. The light guide member according to claim 1.

3. The light guide member according to claim 1, wherein n is 1 in formula (1).

4. The light guide member according to claim 1, wherein formula (1) is represented by formula (1-1). 【Transformation 3】 (In formula (1-1), R １１ ~R ３１ Each is independently a hydrogen atom or a methyl group, and R ４１ is a hydrogen atom, a methyl group, or -OR ５１ It is a group represented by R ５１ (This is either a hydrogen atom or a methyl group.)

5. In the above formula (1-1), R １１ is a hydrogen atom or a methyl group, R ２１ is a hydrogen atom or a methyl group, R ３１ The light guide member according to claim 4, wherein is a methyl group or a methoxy group.

6. The light guide member according to claim 1, wherein the compound represented by formula (1) is a compound selected from the following. 【Chemistry 4】

7. The light guide member according to claim 1, wherein the compound represented by formula (1) is a compound selected from the following, and the content of polycarbonate resin in the resin composition is 97% by mass or more. 【Chemistry 4】

8. A headlamp having a light guide member and a light source according to any one of claims 1 to 7.

9. A rear lamp having a light guide member and a light source according to any one of claims 1 to 7.

10. A fog lamp having a light guide member and a light source according to any one of claims 1 to 7.

11. Per 100 parts by mass of polycarbonate resin, 0.01 to 1.5 parts by mass of the compound represented by formula (1), A resin composition comprising 0.01 to 1.5 parts by mass of an epoxy compound and / or an oxetane compound, A resin composition for use as a light guide member, wherein the content of a phosphite compound having the structure represented by formula (P) is 0% by mass or more and less than 0.001% by mass of the resin composition. 【Chemistry 1】 (In formula (1), R1 to R3 are each independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, R4 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms or a group represented by -OR5, R5 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and n is an integer from 0 to 2.) 【Chemistry 2】

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