Electronic device

Abstract

This electronic device comprises an electronic chip, a mounting part on which the electronic chip is mounted, and a bonding part for bonding the electronic chip to the mounting part. The electronic chip has a first dimension along the thickness direction of 150 μm or less. The bonding part has an interposed portion and an outer peripheral portion and, when viewed along the thickness direction, overlaps 80% or more of the peripheral edge of the electronic chip. The interposed portion is interposed between the electronic chip and the mounting part. The outer peripheral portion is in contact with at least the lower end edges of the side surfaces of the chip. The outer peripheral portion has a second dimension along the thickness direction, which is up to 2 / 3 times the first dimension.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Conventionally, semiconductor devices including semiconductor elements have been known as one type of electronic device including an electronic chip. For example, Patent Document 1 discloses an example of a conventional semiconductor device. The semiconductor device described in this document includes a semiconductor element, multiple leads, a bonding material, a wire, and a sealing resin. The semiconductor element has a main surface and electrodes arranged on the main surface. The semiconductor element is mounted on one of the multiple leads. The semiconductor element is bonded to the lead by a bonding material. The bonding material is, for example, solder, silver paste, or sintered silver. A wire is bonded to another of the multiple leads and the electrode of the semiconductor element, electrically connecting them. The sealing resin covers the semiconductor element.

[0003] Japanese Patent Application Laid-Open No. 2022-118411

[0004] In a structure in which an electronic chip is bonded with a bonding material, as in the semiconductor device described in Patent Document 1, as the height of the electronic chip becomes lower, there is a risk that the bonding material may creep up to the top surface of the electronic chip. Such creeping of the bonding material may cause an unintended short circuit on the top surface of the electronic chip.

[0005] An object of the present disclosure is to provide an electronic device that is improved over conventional devices. In particular, in view of the above circumstances, an object of the present disclosure is to provide an electronic device that can suppress unintended short circuits via a bonding material even when a thin electronic chip is used.

[0006] An electronic device provided by a first aspect of the present disclosure includes an electronic chip, a mounting portion on which the electronic chip is mounted, and a bonding portion that bonds the electronic chip to the mounting portion. The electronic chip has a chip main surface facing one side in a thickness direction, a chip back surface facing the other side in the thickness direction, and a chip side surface interposed between the chip main surface and the chip back surface in the thickness direction. A first dimension in the thickness direction of the electronic chip is greater than 0 μm and less than 150 μm. The bonding portion has an intermediate portion and an outer peripheral portion, and overlaps 80% to 100% of the periphery of the electronic chip as viewed in the thickness direction. The intermediate portion is interposed between the chip back surface and the mounting portion. The outer peripheral portion is in contact with at least the other edge of the chip side surface in the thickness direction. A second dimension in the thickness direction of the outer peripheral portion is greater than 0 and less than 2 / 3 times the first dimension.

[0007] FIG. 1 is a perspective view showing an electronic device according to a first embodiment. FIG. 2 is a perspective view showing an electronic device according to the first embodiment. FIG. 3 is a view in which a sealing member is omitted from the perspective view shown in FIG. 1. FIG. 4 is a plan view showing an electronic device according to the first embodiment. FIG. 5 is a front view showing an electronic device according to the first embodiment. FIG. 6 is a side view showing an electronic device according to the first embodiment. FIG. 7 is a bottom view showing an electronic device according to the first embodiment. FIG. 8 is a view in which a sealing member is indicated by imaginary lines in the plan view shown in FIG. 5. FIG. 9 is a cross-sectional view taken along line IX-IX of FIG. 8. FIG. 10 is a cross-sectional view taken along line X-X of FIG. 8. FIG. 11 is an enlarged plan view of a portion of FIG. 8, in which an electronic chip is indicated by imaginary lines and multiple connecting members are omitted. FIG. 12 is an enlarged front view of a portion of FIG. 5, in which a sealing member is indicated by imaginary lines. FIG. 13 is an enlarged cross-sectional view of a portion of FIG. 10. FIG. 14 is a plan view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 15 is a plan view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 16 is a plan view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 17 is a plan view showing a step of a manufacturing method for an electronic device according to the first embodiment. FIG. 18 is a cross-sectional view showing an electronic device according to a first modified example of the first embodiment. FIG. 19 is a cross-sectional view showing an electronic device according to a second modified example of the first embodiment. FIG. 20 is an enlarged plan view of a main part of an electronic device according to the second embodiment. FIG. 21 is an enlarged plan view of a main part of an electronic device according to a modified example of the second embodiment. FIG. 22 is a front view showing an electronic device according to a third embodiment, in which a sealing member is shown by imaginary lines. FIG. 23 is a front view showing an electronic device according to a modified example of the third embodiment, in which a sealing member is shown by imaginary lines.

[0008] DETAILED DESCRIPTION A preferred embodiment of an electronic device according to the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals, and redundant description will be omitted. Terms such as "first," "second," and "third" in this disclosure are merely used as labels and are not intended to necessarily assign any order to their objects.

[0009] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an) object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an) object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on (an) object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an) object B" includes "a certain object A is in contact with a certain object B and is located on (an) object B" and "a certain object A is located on (an) object B with another object interposed between the certain object A and the certain object B." Unless otherwise specified, "object A overlaps object B when viewed in a certain direction" includes "object A overlaps the entire object B" and "object A overlaps part of object B." "Object A (its material) contains material C" includes "object A (its material) is made of material C" and "object A (its material) is mainly composed of material C." "A surface A faces in a certain direction B (one side or the other side of a certain direction B)" does not necessarily mean that surface A is at a 90° angle with respect to direction B, but also includes surface A being tilted relative to direction B. "A surface A is perpendicular to surface B" does not necessarily mean that surface A is at a 90° angle with respect to surface B, but also includes surface A being tilted relative to surface B, unless otherwise specified.

[0010] 1 to 13 show an electronic device A10 according to a first embodiment. The electronic device A10 includes a plurality of leads 1, 2, and 3, an electronic chip 4, a joint 5, a plurality of connection members 61 and 62, and a sealing member 7. The package structure of the electronic device A10 is not limited in any way, but in the illustrated example, it is a small outline package (SOP). The package structure of the electronic device A10 may also be a leadless type.

[0011] For ease of explanation, reference will be made to the thickness direction z, the first direction x, and the second direction y, which are perpendicular to each other. The thickness direction z corresponds to the thickness direction of the electronic device A10. "Planar view" refers to the view in the thickness direction z. The first direction x is perpendicular to the thickness direction z. The second direction y is perpendicular to the thickness direction z and the first direction x. Hereinafter, one side of the thickness direction z may be referred to as "upper," and the other side of the thickness direction z may be referred to as "lower." Terms such as "upper," "lower," "upper," "lower," "top surface," and "bottom surface" indicate the relative positional relationship of each component, etc. in the thickness direction z, and do not necessarily define the relationship with the direction of gravity.

[0012] The lead 1 supports the electronic chip 4. The lead 1 is formed by cutting, bending, and the like, a metal plate material such as copper (Cu) or a Cu alloy. As shown in FIGS. 1 to 3, 5, and 7 to 11, the lead 1 of this embodiment includes a mounting portion 11 and two extending portions 12. The extending portions 12 are not shown in FIG. 12.

[0013] As shown in Figures 3 and 8 to 10, an electronic chip 4 is mounted on the mounting portion 11. The planar shape of the mounting portion 11 is not limited in any way, but in the illustrated example, it is rectangular. As shown in Figures 9 and 10, the mounting portion 11 has a main mounting surface 111 and a back mounting surface 112. The main mounting surface 111 faces one side in the thickness direction z (upward in the thickness direction z). The main mounting surface 111 is covered by the sealing member 7. The back mounting surface 112 faces the other side in the thickness direction z (downward in the thickness direction z). As shown in Figures 7, 9, and 10, the back mounting surface 112 is exposed from the sealing member 7. This can promote heat dissipation from the electronic chip 4.

[0014] As shown in Figures 8 and 9, the two extension portions 12 extend outward from the mounting portion 11 in both directions in the second direction y. The lead 1 may include two or more extension portions 12. For example, the lead 1 includes four extension portions 12, and the four extension portions 12 extend outward in the second direction y from near the four corners of the mounting portion 11 in a plan view. As shown in Figures 8 and 9, each of the two extension portions 12 includes a tip portion 121 and a connection portion 122. Unless otherwise specified, the tip portion 121 and the connection portion 122 described below are common to all extension portions 12.

[0015] 8 and 9 , the tip portion 121 is located on both outer sides of the mounting portion 11 in the second direction y, and is located on the side of the mounting portion 11 where the main mounting surface 111 faces (upper in the thickness direction z) in the thickness direction z. The shape of the tip portion 121 is not limited in any way, but in the illustrated example, it has a shape with a constant (or approximately constant) dimension (width) in the first direction x. The dimension of the tip portion 121 in the first direction x is smaller than the dimension of the mounting portion 11 in the first direction x.

[0016] 8 and 9, the connection portion 122 is connected to and connects the mounting portion 11 and the tip portion 121. The connection portion 122 is covered with a sealing member 7. In the illustrated example, the connection portion 122 is inclined with respect to the second direction y (xy plane). The dimension of the connection portion 122 in the first direction x is not limited in any way, but is, for example, the same as the dimension of the tip portion 121 in the first direction x.

[0017] The leads 2 and 3 are used as terminals for mounting the electronic device A10 and are electrically connected to the electronic chip 4. Each of the leads 2 and 3 is formed by subjecting a metal plate material such as Cu or a Cu alloy to cutting and bending processes. As shown in FIGS. 8 and 10 , each of the leads 2 and 3 is spaced apart from the mounting portion 11.

[0018] As shown in FIG. 8 , each of the multiple leads 2 is arranged on one side of the first direction x with respect to the mounting portion 11. The multiple leads 2 are arranged at equal pitches along the second direction y. The dimension of each lead 2 in the thickness direction z is not limited in any way, but may be the same as the dimension of the lead 1 in the thickness direction z, for example. As shown in FIGS. 4 to 8 and 10 , each of the multiple leads 2 includes a portion covered by the sealing member 7 and a portion exposed from the sealing member 7. The portion of each lead 2 exposed from the sealing member 7 is formed in a gull-wing shape as shown in FIGS. 5 and 10 . Each of the multiple leads 2 includes a first pad portion 21, a strip portion 22, a terminal portion 23, and a connection portion 24. Unless otherwise specified, the first pad portion 21, the strip portion 22, the terminal portion 23, and the connection portion 24 described below are common to all leads 2.

[0019] As shown in FIGS. 8 and 10 , the first pad portion 21 is covered with a sealing member 7. The first pad portion 21 is located on the side of the mounting portion 11 in the thickness direction z where the main mounting surface 111 faces (upper in the thickness direction z). The first pad portion 21 has a first pad surface 211. The first pad surface 211 faces one side in the thickness direction z (upper in the thickness direction z). A connecting member 61 is bonded to the first pad surface 211. The first pad surface 211 and the main mounting surface 111 are offset in the thickness direction z. In this embodiment, the first pad surface 211 is located on the side of the main mounting surface 111 in the thickness direction z where the main mounting surface 111 faces (upper in the thickness direction z).

[0020] 8 and 10 , the strip portion 22 extends from the first pad portion 21 outward from the sealing member 7. The strip portion 22 includes a portion covered by the sealing member 7 and a portion exposed from the sealing member 7. The dimension of the strip portion 22 in the second direction y is not limited in any way, but is, for example, smaller than the dimension of the first pad portion 21 in the second direction y. Unlike this example, the dimension of the first pad portion 21 in the second direction y and the dimension of the strip portion 22 in the second direction y may be the same.

[0021] 8 and 10 , the terminal portion 23 is located outward in the first direction x with respect to the first pad portion 21 and the strip portion 22. In the thickness direction z, the terminal portion 23 is located on the other side in the thickness direction z (below the thickness direction z) with respect to the first pad portion 21 and the strip portion 22. The terminal portion 23 is exposed from the sealing member 7. The dimension of the terminal portion 23 in the second direction y is not limited in any way, but is, for example, the same as the dimension of the strip portion 22 in the second direction y. In the illustrated example, the terminal portion 23 overlaps the mounting portion 11 when viewed in the first direction x.

[0022] 8 and 10 , the connection portion 24 is interposed between the strip portion 22 and the terminal portion 23. The connection portion 24 is connected to the strip portion 22 and the terminal portion 23 and connects them. The connection portion 24 is exposed from the sealing member 7. The connection portion 24 is inclined with respect to the first direction x (xy plane). The dimension of the connection portion 24 in the second direction y is not limited in any way, but may be the same as the dimension of the strip portion 22 in the second direction y and the dimension of the terminal portion 23 in the second direction y, for example.

[0023] As shown in FIG. 8 , each of the leads 3 is arranged on the other side of the mounting portion 11 in the first direction x. Therefore, the leads 3 are arranged on the opposite side of the leads 2 in the first direction x, sandwiching the mounting portion 11 therebetween. The leads 3 are arranged at equal intervals along the second direction y. The dimension of each lead 3 in the thickness direction z is not limited, but may be the same as the dimension of each lead 2 in the thickness direction z, for example. As shown in FIGS. 4 , 5 , 7 , 8 , and 10 , each of the leads 3 includes a portion covered by the sealing member 7 and a portion exposed from the sealing member 7. The portion of each lead 3 exposed from the sealing member 7 is formed in a gull-wing shape, as shown in FIGS. 5 and 10 . Each of the leads 3 includes a second pad portion 31, a strip portion 32, a terminal portion 33, and a connection portion 34. The second pad portion 31, the strip portion 32, the terminal portion 33, and the connection portion 34 described below are common to all leads 3 unless otherwise specified.

[0024] As shown in FIGS. 8 and 10 , the second pad portion 31 is covered with a sealing member 7. The second pad portion 31 is located on the side of the mounting portion 11 in the thickness direction z where the main mounting surface 111 faces (upward in the thickness direction z). The second pad portion 31 has a second pad surface 311. The second pad surface 311 faces one side in the thickness direction z (upward in the thickness direction z). A connecting member 62 is bonded to the second pad surface 311. The second pad surface 311 and the main mounting surface 111 are offset in the thickness direction z. In this embodiment, the second pad surface 311 is located on the side of the main mounting surface 111 where the main mounting surface 111 faces (upward in the thickness direction z) in the thickness direction z. The second pad surface 311 is located at the same position as the first pad surface 211 in the thickness direction z.

[0025] 8 and 10 , the strip-shaped portion 32 extends from the second pad portion 31 outward from the sealing member 7. The strip-shaped portion 32 includes a portion covered by the sealing member 7 and a portion exposed from the sealing member 7. The dimension of the strip-shaped portion 32 in the second direction y is not limited in any way, but is smaller than the dimension of the second pad portion 31 in the second direction y. Unlike this example, the dimension of the second pad portion 31 in the second direction y and the dimension of the strip-shaped portion 32 in the second direction y may be the same.

[0026] 8 and 10 , the terminal portion 33 is located outward in the first direction x with respect to the second pad portion 31 and the strip portion 32. In the thickness direction z, the terminal portion 33 is located on the other side in the thickness direction z (below the thickness direction z) with respect to the second pad portion 31 and the strip portion 32. The terminal portion 33 is exposed from the sealing member 7. The dimension of the terminal portion 33 in the second direction y is not limited in any way, but is, for example, the same as the dimension of the strip portion 22 in the second direction y. In the illustrated example, the terminal portion 33 overlaps the mounting portion 11 when viewed in the first direction x.

[0027] 8 and 10 , the connection portion 34 is interposed between the strip portion 32 and the terminal portion 33. The connection portion 34 is connected to the strip portion 32 and the terminal portion 33, and connects them. The connection portion 34 is exposed from the sealing member 7. The connection portion 34 is inclined with respect to the first direction x (xy plane). The dimension of the connection portion 34 in the second direction y is not limited in any way, but may be the same as the dimension of the strip portion 32 in the second direction y and the dimension of the terminal portion 33 in the second direction y, for example.

[0028] The electronic chip 4 is an element that performs the main electrical functions of the electronic device A10. Specific examples of the electronic chip 4 include, but are not limited to, an LSI, an IC, or the like. Unlike this example, the electronic chip 4 may be a discrete component such as a diode, an inductor, or a transistor. The specific shape and size of the electronic chip 4 are not limited to, but as shown in FIGS. 3 and 8 , in this embodiment, the electronic chip 4 is, for example, rectangular in plan view and smaller than the mounting portion 11. Since the shape of the electronic chip 4 in plan view is rectangular, the periphery 44 of the electronic chip 4 in plan view is also rectangular. The first dimension d1 of the electronic chip 4 in the thickness direction z is, for example, greater than 0 μm and less than 150 μm. The first dimension d1 of the electronic chip 4 may be greater than 0 μm and less than 100 μm.

[0029] As shown in FIGS. 9 to 13 , the electronic chip 4 has a chip main surface 41, a chip back surface 42, and multiple chip side surfaces 43. As shown in FIGS. 9 and 10 , the chip main surface 41 faces one side in the thickness direction z (upward in the thickness direction z). The chip back surface 42 faces the other side in the thickness direction z (downward in the thickness direction z). The chip back surface 42 faces the main mounting surface 111. Each of the multiple chip side surfaces 43 is interposed between the chip main surface 41 and the chip back surface 42 in the thickness direction z. The multiple chip side surfaces 43 include a pair of chip side surfaces 43 facing both sides in the first direction x and a pair of chip side surfaces 43 facing both sides in the second direction y. Each chip side surface 43 is perpendicular to the chip main surface 41 and the chip back surface 42.

[0030] 8 and 10 , a plurality of electrode pads 411, 412 are provided on the chip main surface 41. The plurality of electrode pads 411 are arranged on the chip main surface 41 along the second direction y. The plurality of electrode pads 411 are arranged on the chip main surface 41 on the side of the leads 2 in the first direction x. The plurality of electrode pads 412 are arranged on the chip main surface 41 along the second direction y. The plurality of electrode pads 412 are arranged on the chip main surface 41 on the side of the leads 3 in the first direction x.

[0031] 11 , the electronic chip 4 includes, in plan view, a plurality of corners 45. In an example where the shape of the electronic chip 4 in plan view is rectangular, the electronic chip 4 includes four corners 45. Each corner 45 is a boundary between two chip side surfaces 43 that are connected to each other.

[0032] The bonding portion 5 bonds the electronic chip 4 to the mounting portion 11. The bonding portion 5 is, for example, silver paste. The bonding portion 5 may be other conductive bonding materials such as solder or sintered silver instead of silver paste. As shown in FIG. 11 , the bonding portion 5 overlaps 80% to 100% of the periphery 44 of the electronic chip 4 in a planar view. In the electronic device A10, as shown in FIG. 8 , the bonding portion 5 overlaps the entire periphery 44 of the electronic chip 4 (i.e., 100%) in a planar view. The bonding portion 5 includes an interposed portion 51 and an outer peripheral portion 52.

[0033] 9 and 10 , the interposed portion 51 is interposed between the chip back surface 42 and the main mounting surface 111. The third dimension d3 of the interposed portion 51 in the thickness direction z is not particularly limited, but is, for example, not less than 20 μm and not more than 30 μm.

[0034] As shown in FIG. 11 , the outer peripheral portion 52 is disposed around the interposed portion 51 over the entire periphery thereof in a planar view. The outer peripheral portion 52 is connected to the interposed portion 51. The outer peripheral portion 52 is disposed outward of the electronic chip 4 in a planar view. The outer peripheral portion 52 contacts at least the lower edge of each chip side surface 43 in the thickness direction z. In this embodiment, the outer peripheral portion 52 contacts a portion of the lower side of each chip side surface 43 in the thickness direction z. The outer peripheral portion 52 creeps upward in the thickness direction z along each chip side surface 43. The second dimension d2 of the outer peripheral portion 52 in the thickness direction z is, for example, 0 to 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, in an example in which the first dimension d1 of the electronic chip 4 is 100 μm, the second dimension d2 of the outer peripheral portion 52 is 0 to 66.6 μm. The second dimension d2 (in the thickness direction z) of the outer peripheral portion 52 is the dimension (creep-up dimension) of the portion that creeps up in the thickness direction z from the lower end of the electronic chip 4 in the thickness direction z, as shown in Figures 9, 12, and 13.

[0035] As shown in FIGS. 11 and 13 , the outer peripheral portion 52 includes a plurality of side covering portions 521 and a plurality of ridge covering portions 522. The plurality of side covering portions 521 contact at least the lower edge in the thickness direction z of a corresponding one of the plurality of chip side surfaces 43, and cover a portion of the corresponding chip side surface 43. Each side covering portion 521 extends from the lower edge in the thickness direction z along the corresponding chip side surface 43 to partway along the thickness direction z. The plurality of ridge covering portions 522 individually cover portions of the plurality of corner portions 45. Each ridge covering portion 522 extends from the lower edge in the thickness direction z along the corresponding corner portion 45 to partway along the thickness direction z. The plurality of side covering portions 521 and the plurality of ridge covering portions 522 are connected.

[0036] The multiple connection members 61, 62 each electrically connect portions spaced apart from each other. In the illustrated example, the multiple connection members 61, 62 are each bonding wires. The multiple connection members 61, 62 may be metal plates instead of bonding wires. Each of the multiple connection members 61, 62 includes, for example, gold, aluminum, or copper. As shown in FIGS. 8 and 10 , the multiple connection members 61 are individually bonded to the multiple electrode pads 411 and the first pad portions 21 (first pad surfaces 211) of the multiple leads 2. As shown in FIGS. 8 and 10 , the multiple connection members 62 are individually bonded to the multiple electrode pads 412 and the second pad portions 31 (second pad surfaces 311) of the multiple leads 3.

[0037] 1, 2, and 4 to 10, sealing member 7 covers a portion of lead 1, portions of each of the plurality of leads 2, portions of each of the plurality of leads 3, electronic chip 4, joint portion 5, and a plurality of connection members 61, 62. Sealing member 7 is made of insulating resin, such as black epoxy resin containing filler. Sealing member 7 has a resin main surface 71, a resin back surface 72, a pair of resin side surfaces 73, and a pair of resin side surfaces 74.

[0038] As shown in Figures 9 and 10, the resin main surface 71 faces one side in the thickness direction z (upward in the thickness direction z). The resin back surface 72 faces the other side in the thickness direction z (downward in the thickness direction z). In this embodiment, the resin main surface 71 is rectangular in plan view. The mounting back surface 112 is exposed from the resin back surface 72, and the resin back surface 72 has an annular shape in plan view. The outer edge of the resin back surface 72 is rectangular.

[0039] As shown in Figures 4 to 7 and 9, the pair of resin side surfaces 73 are located between the resin main surface 71 and the resin back surface 72, and are located on both sides in the second direction y. The pair of resin side surfaces 73 face opposite each other in the second direction y. Each of the pair of resin side surfaces 73 has an upper region 731, a lower region 732, and an intermediate region 733. The upper region 731, lower region 732, and intermediate region 733 described below are common to each resin side surface 73, unless otherwise specified.

[0040] 5, 6, and 9, the upper region 731 is a region located in the thickness direction z between the resin main surface 71 and the intermediate region 733. In the illustrated example, the upper region 731 is inclined with respect to a plane (x-z plane) perpendicular to the second direction y, but the upper region 731 may also be parallel to the x-z plane.

[0041] 5, 6, and 9, the lower region 732 is a region located between the resin rear surface 72 and the intermediate region 733 in the thickness direction z. In the illustrated example, the lower region 732 is inclined with respect to a plane (x-z plane) perpendicular to the second direction y, but the lower region 732 may be parallel to the x-z plane.

[0042] As shown in FIGS. 5, 6, and 9, the intermediate region 733 is a region located between the upper region 731 and the lower region 732 in the thickness direction z. The intermediate region 733 is parallel to a plane (x-z plane) perpendicular to the second direction y. The intermediate region 733 is located outside the resin main surface 71 and the resin back surface 72 in the second direction y. As shown in FIG. 5, the upper edge of the intermediate region 733 in the thickness direction z is located at the same position in the thickness direction z as the upper edge of the tip portion 121 in the thickness direction z. The lower edge of the intermediate region 733 in the thickness direction z is located at the same position in the thickness direction z as the lower edge of the tip portion 121 in the thickness direction z. Therefore, the dimension of the intermediate region 733 in the thickness direction z is the same as the dimension of the tip portion 121 in the thickness direction z.

[0043] As shown in FIGS. 4 to 7 and 10 , the pair of resin side surfaces 74 are located between the resin main surface 71 and the resin back surface 72, and are located on both sides of the first direction x. One of the pair of resin side surfaces 74 faces opposite the other in the first direction x. Each of the pair of resin side surfaces 74 has an upper region 741, a lower region 742, and an intermediate region 743. The upper region 741, lower region 742, and intermediate region 743 described below are common to each resin side surface 74, unless otherwise specified.

[0044] 5, 6, and 10, the upper region 741 is a region located in the thickness direction z between the resin main surface 71 and the intermediate region 743. In the illustrated example, the upper region 741 is inclined with respect to a plane (y-z plane) perpendicular to the first direction x, but the upper region 741 may also be parallel to the y-z plane.

[0045] 5, 6, and 10, the lower region 742 is a region located between the resin rear surface 72 and the intermediate region 743 in the thickness direction z. In the illustrated example, the lower region 742 is inclined with respect to a plane (y-z plane) perpendicular to the first direction x, but the lower region 742 may be parallel to the y-z plane.

[0046] As shown in FIGS. 5, 6, and 10, the intermediate region 743 is a region located between the upper region 741 and the lower region 742 in the thickness direction z. The intermediate region 743 is parallel to a plane (y-z plane) perpendicular to the first direction x. The intermediate region 743 is located outside the resin main surface 71 and the resin back surface 72 in the first direction x. As shown in FIGS. 5 and 6, the upper edge of the intermediate region 743 in the thickness direction z is located at the same position in the thickness direction z as the upper edge of each strip portion 22, 32 in the thickness direction z. The lower edge of the intermediate region 743 in the thickness direction z is located at the same position in the thickness direction z as the lower edge of each strip portion 22, 32 in the thickness direction z. Therefore, the dimension of the intermediate region 743 in the thickness direction z is the same as the dimension of each strip portion 22, 32 in the thickness direction z.

[0047] Next, an example of a method for manufacturing the electronic device A10 will be described with reference to Figures 14 to 17. Figures 14 to 17 are plan views showing one step in the method for manufacturing the electronic device A10.

[0048] FIG. 14 shows a lead frame LF, an example of a component used in manufacturing the electronic device A10. The lead frame LF includes a frame F and a lead 10, a plurality of leads 20, and a plurality of leads 30 connected to the frame F. The lead 10, the plurality of leads 20, and the plurality of leads 30 are portions of the lead frame LF that are cut from the frame F and bent to become lead 1, a plurality of leads 2, and a plurality of leads 3. In the state shown in FIG. 14 , the lead 10 includes a mounting portion 110 and two extending portions 120. The mounting portion 110 is the portion that will become the mounting portion 11 of the electronic device A10, and the two extending portions 120 are the portions that will become the two extending portions 12 of the electronic device A10. In the state of the lead frame LF, each extending portion 120 is bent downward in the thickness direction z. Therefore, in the lead frame LF, the mounting portion 110 is located below the plurality of leads 20, the plurality of leads 30, and the frame F in the thickness direction z.

[0049] Next, as shown in FIG. 15 , a paste-like bonding material 50 is applied onto the mounting portion 11. The paste-like bonding material 50 is, for example, a silver paste. The paste-like bonding material 50 is not limited to silver paste, but may be a solder paste or a sintered silver paste. The paste-like bonding material 50 is applied linearly, for example, along six application trajectories L1 to L6 shown in FIG. 15 , using a dispenser. Each of the six application trajectories L1 to L6 is the trajectory of the paste-like bonding material 50 applied by the dispenser. The application trajectories L1 and L2 are trajectories that follow the diagonal of the electronic chip 4 to be mounted later. In the example shown in FIG. 15 , the start and end points of the application trajectories L1 and L2 are located within a range that overlaps the electronic chip 4, but they may also overlap the four corners of the electronic chip 4 or may be located outside the four corners of the electronic chip 4. Each application trajectory L4 to L6 is a trajectory that is shifted by a predetermined angle from the intersection of the application trajectories L1 and L2. Therefore, the amount of the paste bonding material 50 applied is large at the intersection of the application trajectories L1 and L2, and the applied paste bonding material 50 spreads out widely near the intersection due to its fluidity. The application trajectories of the dispenser shown in FIG. 15 are merely an example and are not limiting. For example, there may be more application trajectories, or only the application trajectories L1 and L2 may be used. The greater the number of application trajectories of the dispenser (six application trajectories L1 to L6 in the example shown in FIG. 15), the smaller the amount of application on each application trajectory is preferably (the thinner the thickness of the applied paste bonding material 50 is, the better).

[0050] Next, as shown in FIG. 16 , the electronic chip 4 is placed on the bonding material paste 50, and the bonding material paste 50 is solidified. When the electronic chip 4 is placed on the bonding material paste 50, the weight of the electronic chip 4 spreads the bonding material paste 50. The bonding material paste 50 may be spread not only by the weight of the electronic chip 4 but also by the pressing force of a die bonder that places the electronic chip 4. As shown in FIG. 16 , the spread bonding material paste 50 has a shape that protrudes outward over the entire periphery of the electronic chip 4 in a plan view. That is, the bonding material paste 50 at this time has the same (or substantially the same) planar shape as the bonding portion 5 of the electronic device A10. Thereafter, the bonding material paste 50 is heat-treated to solidify the bonding material paste 50, thereby forming the bonding portion 5.

[0051] Next, as shown in FIG. 17 , a plurality of connection members 61, 62 are formed. The plurality of connection members 61, 62 are formed using a well-known wire bonder. Thereafter, the sealing member 7 shown by the imaginary line (two-dot chain line) in FIG. 17 is formed, for example, by molding. Then, each of the leads 10, 20, and 30 is cut from the frame F along cutting lines CL (one-dot chain lines), and each of the leads 20 and 30 is bent. This completes the manufacture of the electronic device A10 shown in FIGS. 1 to 13 .

[0052] The functions and effects of the electronic device A10 are as follows.

[0053] In the electronic device A10, the first dimension d1 in the thickness direction z of the electronic chip 4 is greater than 0 μm and less than or equal to 150 μm. The bonding portion 5 includes an outer periphery 52 that contacts the chip side surface 43, and the second dimension d2 in the thickness direction z of the outer periphery 52 is greater than or equal to 0 times and less than or equal to 2 / 3 times the first dimension d1 of the electronic chip 4. With this configuration, the outer periphery 52 of the bonding portion 5 does not creep up to the chip main surface 41 of the electronic chip 4. Therefore, the electronic device A10 can prevent unintended short circuits via the bonding portion 5 even in a thin electronic chip 4. In particular, the thinner the electronic chip 4, the higher the likelihood that the bonding portion 5 will creep up to the chip main surface 41 of the electronic chip 4. Therefore, when the first dimension d1 of the electronic chip 4 is greater than 0 μm and less than or equal to 100 μm, the likelihood of the bonding portion 5 creeping up to the chip main surface 41 of the electronic chip 4 is higher than when the first dimension d1 is 150 μm. Therefore, in the electronic device A10, it is preferable to configure the second dimension d2 of the outer peripheral portion 52 to be greater than 0 times and less than 2 / 3 times the first dimension d1 of the electronic chip 4 in order to prevent unintentional short circuits through the joint 5.

[0054] In the electronic device A10, the bonding portion 5 overlaps 80% to 100% of the periphery 44 of the electronic chip 4 in the thickness direction z. This configuration allows for proper visual inspection of whether the electronic chip 4 is bonded to the mounting portion 11 by the bonding portion 5. This configuration ensures an appropriate bonding strength of the bonding portion 5 to the electronic chip 4 to the mounting portion 11.

[0055] In the electronic device A10, the second dimension d2 of the outer periphery 52 is greater than 0 times the first dimension d1 of the electronic chip 4 at the corner 45 of the electronic chip 4 as viewed in the thickness direction z. According to this configuration, fillets are formed in the joints 5 at the corners 45 of the electronic chip 4. That is, the outer periphery 52 includes edge covering portions 522 that cover a portion of the corner 45 of the electronic chip 4. When the electronic chip 4 is energized, thermal stress due to the difference in linear expansion coefficients between the electronic chip 4 and the mounting portion 11 is applied to the joints 5. The thermal force applied to the joints 5 is greatest near the four corners on the lower side in the thickness direction z of the electronic chip 4. In particular, when the four corners on the lower side in the thickness direction z of the electronic chip 4 are exposed from the joints 5, peeling and damage of the electronic chip 4 are likely to occur near the four corners on the lower side in the thickness direction z of the electronic chip 4. However, in the electronic device A10, as described above, the outer peripheral portion 52 includes the edge covering portions 522 that cover part of the corners 45 of the electronic chip 4, which improves the resistance to peeling and damage of the bonding portions 5 near the four corners on the lower side in the thickness direction z of the electronic chip 4. Therefore, the electronic device A10 can suppress peeling and damage of the bonding portions 5, thereby improving reliability.

[0056] In the electronic device A10, the third dimension d3 of the interposition portion 51 in the thickness direction z is 20 μm or more and 30 μm or less. With this configuration, it is possible to ensure an appropriate bonding strength between the electronic chip 4 and the mounting portion 11.

[0057] In the manufacturing method of the electronic device A10, the paste-like bonding material 50 is applied using a dispenser. Alternatively, the paste-like bonding material 50 can be applied using a printing mask. However, in the electronic device A10, the first pad surface 211 of the first pad portion 21 is located in the thickness direction z above the main mounting surface 111 of the mounting portion 11, in the direction in which the main mounting surface 111 faces (above the thickness direction z). Therefore, in an application method using a printing mask, the printing mask comes into contact with the first pad portion 21, making it impossible to properly apply the paste-like bonding material 50. On the other hand, in the manufacturing method of the electronic device A10, the paste-like bonding material 50 is applied using a dispenser. Therefore, the paste-like bonding material 50 can be properly applied even in a structure in which the mounting portion 11 is located lower in the thickness direction z than the first pad portion 21.

[0058] In the electronic device A10, the first pad surface 211 of the first pad portion 21 and the second pad surface 311 of the second pad portion 31 are disposed at the same position in the thickness direction z, and the first pad portion 21 and the second pad portion 31 are disposed on opposite sides of the mounting portion 11 in the first direction x. This makes application using the printing mask described above even more difficult. Therefore, applying the paste-like bonding material 50 using a dispenser is particularly preferable for properly applying the paste-like bonding material 50.

[0059] Other embodiments and modifications of the electronic device of the present disclosure will be described below. The configurations of the components in each embodiment and each modification can be combined with each other to the extent that no technical contradiction occurs.

[0060] 18 shows an electronic device A11 according to a first modified example of the first embodiment. The electronic device A11 differs from the electronic device A10 in the following respect: in the electronic device A11, the main mounting surface 111, the first pad surface 211, and the second pad surface 311 are located at the same position in the thickness direction z.

[0061] 18 , in the electronic device A11, the first pad portion 21 of each lead 2 overlaps the mounting portion 11 when viewed in the first direction x. The second pad portion 31 of each lead 3 overlaps the mounting portion 11 when viewed in the first direction x. The main mounting surface 111 is not misaligned with the first and second pad surfaces 211 and 311 in the thickness direction z.

[0062] In the electronic device A11, similar to the electronic device A10, the second dimension d2 in the thickness direction z of the outer periphery 52 of the joint 5 is between 0 and 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, similar to the electronic device A10, the outer periphery 52 of the joint 5 of the electronic device A11 does not extend up to the chip main surface 41 of the electronic chip 4, so that unintended short circuits via the joint 5 can be suppressed even with a thin electronic chip 4. In addition, the electronic device A11 has a common configuration with the electronic device A10, and thereby achieves the same effects as the electronic device A10.

[0063] 19 shows an electronic device A12 according to a second modified example of the first embodiment. The electronic device A12 differs from the electronic device A10 in the following respect: In the electronic device A12, the main mounting surface 111 is positioned higher in the thickness direction z than the first pad surface 211 and the second pad surface 311 in the direction in which the main mounting surface 111 faces (i.e., higher in the thickness direction z).

[0064] 19 , in the electronic device A12, the first pad portion 21 of each lead 2 is disposed below the mounting portion 11 in the thickness direction z. The second pad portion 31 of each lead 3 is disposed below the mounting portion 11 in the thickness direction z. In the illustrated example, each lead 2 and each lead 3 is not bent and is rectangular when viewed in the second direction y, but may be bent similarly to the electronic device A10.

[0065] In the electronic device A12, similar to the electronic device A10, the second dimension d2 in the thickness direction z of the outer periphery 52 of the joint 5 is between 0 and 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, similar to the electronic device A10, the outer periphery 52 of the joint 5 of the electronic device A12 does not extend up to the chip main surface 41 of the electronic chip 4, so that unintended short circuits via the joint 5 can be suppressed even with a thin electronic chip 4. In addition, the electronic device A12 has a configuration in common with the other electronic devices A10 and A11, and thus achieves the same effects as the electronic devices A10 and A11.

[0066] 20 shows an electronic device A20 according to a second embodiment. The electronic device A20 differs from the electronic device A10 in the shape of the joint 5 in a plan view.

[0067] In the electronic device A20, the peripheral edge 53 of the joint 5 includes a pair of edges 531 and a pair of edges 532. As shown in FIG. 20 , the pair of edges 531 are spaced apart from each other in the first direction x. Each of the pair of edges 531 extends in the second direction y. A central portion of each edge 531 in the second direction y is recessed into the electronic chip 4 in a planar view. As shown in FIG. 20 , the pair of edges 532 are spaced apart from each other in the second direction y. Each of the pair of edges 532 extends in the first direction x. A central portion of each edge 532 in the first direction x is recessed into the electronic chip 4 in a planar view.

[0068] In the electronic device A20, the proportion of the joint 5 that overlaps the periphery 44 of the electronic chip 4 in a plan view is 80% or more but less than 100%. In this way, even if the joint 5 does not overlap 100% of the periphery 44 of the electronic chip 4 in a plan view, as long as it overlaps 80% or more, it is possible to confirm by visual inspection whether the electronic chip 4 is joined to the mounting portion 11 by the joint 5.

[0069] 15 , the amount of the paste-like bonding material 50 applied on both sides in the first direction x and in the center in the second direction y, and the amount of the paste-like bonding material 50 applied on both sides in the second direction y and in the center in the first direction x, are not relatively smaller than those in other portions. Therefore, when the paste-like bonding material 50 is spread out by placing the electronic chip 4, the center of each edge 531 in the second direction y may be recessed into the electronic chip 4 in a plan view, and the center of each edge 532 in the first direction x may be recessed into the electronic chip 4 in a plan view.

[0070] In the electronic device A20, similar to the electronic device A10, the second dimension d2 in the thickness direction z of the outer periphery 52 of the joint 5 is between 0 and 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, similar to the electronic device A10, the outer periphery 52 of the joint 5 of the electronic device A20 does not extend up to the chip main surface 41 of the electronic chip 4, so that unintended short circuits via the joint 5 can be suppressed even with a thin electronic chip 4. Additionally, the electronic device A20 has a configuration in common with the other electronic devices A10 to A12, and thus achieves the same effects as the electronic devices A10 to A12.

[0071] 21 shows an electronic device A21 according to a modification of the second embodiment. The electronic device A21 differs from the electronic device A20 in the following respect: the entire edge 532 is located outside the electronic chip 4 in plan view.

[0072] In the electronic device A21, the center of each edge 531 in the second direction y is recessed inward of the electronic chip 4 in plan view, similar to the electronic device A20. In contrast, as described above, the center of each edge 532 in the first direction x is located outward of the electronic chip 4 in plan view, unlike the electronic device A20. In the electronic device A21, similar to the electronic device A20, the proportion of the joint 5 that overlaps with the periphery 44 of the electronic chip 4 in plan view is 80% or more but less than 100%. The joint 5 in the electronic device A21 has the illustrated shape for the same reasons as the joint 5 in the electronic device A20.

[0073] In the electronic device A21, similar to the electronic device A20 (A10), the second dimension d2 in the thickness direction z of the outer periphery 52 of the joint 5 is between 0 and 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, similar to the electronic device A20 (A10), the outer periphery 52 of the joint 5 of the electronic device A21 does not extend up to the chip main surface 41 of the electronic chip 4, so that unintended short circuits via the joint 5 can be suppressed even with a thin electronic chip 4. Additionally, the electronic device A21 has a configuration in common with the other electronic devices A10 to A12, A20, and thereby achieves the same effects as the electronic devices A10 to A12, A20.

[0074] As can be understood from the above electronic devices A20 and A21, the planar shape of the joint 5 of the electronic device of the present disclosure is not limited in any way as long as the overlapping ratio with the periphery 44 of the electronic chip 4 in a planar view is 80% or more and 100% or less.

[0075] Third Embodiment: Figure 22 shows an electronic device A30 according to a third embodiment. The electronic device A30 differs from the electronic device A10 in the following respect: In the electronic device A30, the outer periphery 52 of the bonding portion 5 contacts only the lower edge of each chip side surface 43 in the thickness direction z. In Figure 22, the extension portion 12 is omitted.

[0076] In the electronic device A30, the second dimension d2 of the outer periphery 52 of the joint 5 is 0 μm, which is 0 times the first dimension d1 of the electronic chip 4. In other words, the outer periphery 52 does not extend beyond the electronic chip 4. As can be seen from FIG. 22 , the upper edge of the outer periphery 52 in the thickness direction z is at the same position in the thickness direction z as the lower edge of each chip side surface 43 in the thickness direction z. The planar shape of the joint 5 of the electronic device A30 may be the same as the planar shape of the joint 5 of the electronic device A10 (see FIG. 11 ), or the same as the planar shape of the joint 5 of the electronic device A20 (see FIG. 20 ), or the planar shape of the joint 5 of the electronic device A21 (see FIG. 21 ).

[0077] In the electronic device A30, similar to the electronic device A10, the second dimension d2 in the thickness direction z of the outer periphery 52 of the joint 5 is between 0 and 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, similar to the electronic device A10, the outer periphery 52 of the joint 5 of the electronic device A30 does not extend up to the chip main surface 41 of the electronic chip 4, so that unintended short circuits via the joint 5 can be suppressed even with a thin electronic chip 4. Additionally, the electronic device A30 has a configuration in common with the other electronic devices A10 to A12, A20, and A21, and thus achieves the same effects as the electronic devices A10 to A12, A20, and A21.

[0078] 23 shows an electronic device A31 according to a modified example of the third embodiment. The electronic device A31 differs from the electronic device A30 in the following respects. The bonding portion 5 of the electronic device A31 includes a portion where the second dimension d2 of the outer periphery 52 is 0 times the first dimension d1 of the electronic chip 4, and a portion where the second dimension d2 of the outer periphery 52 is greater than 0 times the first dimension d1 of the electronic chip 4. The extension portion 12 is not shown in FIG. 23.

[0079] 23 , the portion where the second dimension d2 of the outer periphery 52 is 0 times the first dimension d1 of the electronic chip 4 is the center in the first direction x. In this way, the second dimension d2 of the outer periphery 52 does not have to be the same size around the entire periphery 44 of the electronic chip 4.

[0080] In the electronic device A31, similar to the electronic device A30 (A10), the second dimension d2 in the thickness direction z of the outer periphery 52 of the joint 5 is between 0 and 2 / 3 times the first dimension d1 of the electronic chip 4. Therefore, similar to the electronic device A30 (A10), the outer periphery 52 of the joint 5 of the electronic device A31 does not extend up to the chip main surface 41 of the electronic chip 4, so that even with a thin electronic chip 4, unintended short circuits via the joint 5 can be suppressed. In addition, the electronic device A31 has a configuration in common with the other electronic devices A10 to A12, A20, A21, and A30, and thereby achieves the same effects as the electronic devices A10 to A12, A20, A21, and A30.

[0081] In the first to third embodiments, the mounting portion 11 is formed from a metal plate (lead 1), but this is not limiting. The mounting portion 11 may be formed from an insulating substrate such as a semiconductor substrate, a glass substrate, or a ceramic substrate, and a wiring pattern formed on the insulating substrate. Similarly, the first pad portion 21 and the second pad portion 31 are not limited to being formed from a metal plate (each lead 2 or each lead 3), and may be formed from an insulating substrate and a wiring pattern formed on the insulating substrate.

[0082] The electronic device according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the electronic device according to the present disclosure can be freely designed in various ways. For example, the present disclosure includes the embodiments described in the following appendices. Appendix 1. An electronic device comprising: an electronic chip; a mounting portion on which the electronic chip is mounted; and a bonding portion that bonds the electronic chip to the mounting portion, wherein the electronic chip has a chip main surface facing one side in a thickness direction, a chip back surface facing the other side in the thickness direction, and a chip side surface interposed between the chip main surface and the chip back surface in the thickness direction, wherein a first dimension in the thickness direction of the electronic chip is greater than 0 μm and not greater than 150 μm, wherein the bonding portion has an intermediate portion and an outer peripheral portion and overlaps 80% to 100% of the periphery of the electronic chip as viewed in the thickness direction, wherein the intermediate portion is interposed between the chip back surface and the mounting portion, wherein the outer peripheral portion is in contact with at least the other edge in the thickness direction of the chip side surface, and wherein a second dimension in the thickness direction of the outer peripheral portion is 0 to 2 / 3 times the first dimension. The electronic device of Appendix 1 further includes a first pad portion spaced apart from the mounting portion, the mounting portion having a mounting surface facing the back surface of the chip, the first pad portion having a first pad surface facing the same direction as the mounting surface in the thickness direction, and the mounting surface and the first pad surface being offset in the thickness direction. Appendix 3. The electronic device of Appendix 2, wherein the first pad surface is positioned in the thickness direction in a direction in which the mounting surface faces rather than the mounting surface. Appendix 4. The electronic device of Appendix 2 or Appendix 3 further includes connection members that individually and electrically connect the electronic chip and the first pad portion, the electronic chip having main surface electrodes arranged on the chip main surface, and the connection members being bonded to the main surface electrodes and the first pad portion, respectively. Appendix 5. 5. The electronic device of claim 2, further comprising a second pad portion spaced apart from the mounting portion and the first pad portion, wherein the first pad portion and the second pad portion are arranged on opposite sides of the mounting portion in a first direction perpendicular to the thickness direction.Appendix 6. The electronic device of Appendix 5, wherein the second pad portion has a second pad surface facing the same direction as the mounting surface in the thickness direction, and the first pad surface and the second pad surface are arranged at the same position as each other in the thickness direction. Appendix 7. The electronic device of any of Appendixes 1 to 6, wherein a third dimension in the thickness direction of the interposition portion is 20 μm or more and 30 μm or less. Appendix 8. The electronic device of any of Appendixes 1 to 7, wherein the electronic chip is rectangular when viewed in the thickness direction. Appendix 9. The electronic device of Appendix 8, wherein the second dimension is greater than 0 times the first dimension at corners of the electronic chip when viewed in the thickness direction. Appendix 10. The electronic device of any of Appendixes 1 to 9, wherein the first dimension is 100 μm or less. Appendix 11. The electronic device of any of Appendixes 1 to 10, wherein the joint portion includes a conductive material. Appendix 12. Appendix 11. The electronic device according to Appendix 11, wherein the joint portion contains silver paste. Appendix 13. The electronic device according to any one of Appendix 1 to Appendix 12, wherein the mounting portion contains copper. Appendix 14. The electronic device according to any one of Appendix 1 to Appendix 13, further comprising a sealing member that covers the electronic chip, at least a portion of the mounting portion, and the joint portion. Appendix 15. The electronic device according to Appendix 14, wherein the mounting portion has a mounting back surface facing the other side in the thickness direction, and the mounting back surface is exposed from the sealing member.

[0083] A10, A11, A12, A20, A21, A30, A31: Electronic device 1, 10: Lead 11, 110: Mounting portion 111: Main mounting surface 112: Back mounting surface 120: Extension portion 121: Tip portion 122: Connection portion 12: Extension portion 2, 20: Lead 21: First pad portion 211: First pad surface 22: Strip portion 23: Terminal portion 24: Connection portion 3: Lead 30: Lead 31: Second pad portion 311: Second pad surface 32: Strip portion 33: Terminal portion 34: Connection portion 4: Electronic chip 41: Main chip surface 42: Back chip surface 43: Side surface of chip 44: Edge 45: Corner portion 411, 412: Electrode pad 5: Joint portion 50: Paste-like joining material 51: Interposition portion 52: Outer periphery 521: Side covering portion 522: Ridge covering portion 53: Periphery 531, 532: Edge 61: Connection member 62: Connection member 7: Sealing member 71: Resin main surface 72: Resin back surface 73, 74: Resin side surface 731, 741: Upper region 732, 742: Lower region 733, 743: Middle region CL: Cutting line F: Frame L1 to L6: Coating orbit LF: Lead frame d1: First dimension d2: Second dimension d3: Third dimension

Claims

1. Electronic chips and, The mounting section on which the aforementioned electronic chip is mounted, A bonding portion for bonding the electronic chip to the mounting portion, Equipped with, The electronic chip has a main chip surface facing one direction in the thickness direction, a back chip surface facing the other direction in the thickness direction, and a side chip surface interposed between the main chip surface and the back chip surface in the thickness direction. The first dimension of the electronic chip in the thickness direction is greater than 0 μm and 150 μm or less. The aforementioned joint portion has an intervening portion and an outer peripheral portion, and overlaps with the peripheral edge of the electronic chip by 80% to 100% when viewed in the thickness direction. The intervening portion is interposed between the back surface of the chip and the mounting portion. The outer periphery is in contact with at least the other edge of the chip side surface in the thickness direction, An electronic device in which the second dimension in the thickness direction of the outer periphery is 0 times or more and 2 / 3 times or less of the first dimension.

2. The first pad portion is further provided, which is spaced apart from the aforementioned mounting portion. The mounting portion has a mounting surface facing the back surface of the chip, The first pad portion has a first pad surface that faces the same direction as the mounting surface in the thickness direction, The electronic device according to claim 1, wherein the mounting surface and the first pad surface are offset in the thickness direction.

3. The electronic device according to claim 2, wherein the first pad surface is located in the thickness direction in a direction that is more toward the mounting surface than the mounting surface.

4. The system further includes connecting members that individually electrically connect the electronic chip and the first pad portion, The electronic chip has a main surface electrode arranged on the main surface of the chip, The electronic device according to claim 2, wherein the connecting member is joined to the main surface electrode and the first pad portion, respectively.

5. The system further comprises a second pad portion spaced apart from the mounting portion and the first pad portion, The electronic device according to claim 2, wherein the first pad portion and the second pad portion are arranged on opposite sides of the mounting portion in a first direction perpendicular to the thickness direction.

6. The second pad portion has a second pad surface that faces the same direction as the mounting surface in the thickness direction, The electronic device according to claim 5, wherein the first pad surface and the second pad surface are arranged at the same position relative to each other in the thickness direction.

7. The electronic device according to any one of claims 1 to 6, wherein the third dimension in the thickness direction of the intervening portion is 20 μm or more and 30 μm or less.

8. The electronic device according to any one of claims 1 to 6, wherein the electronic chip is rectangular when viewed in the thickness direction.

9. The electronic device according to claim 8, wherein the second dimension is greater than zero times the first dimension at the corner of the electronic chip as viewed in the thickness direction.

10. The electronic device according to any one of claims 1 to 6, wherein the first dimension is 100 μm or less.

11. The electronic device according to any one of claims 1 to 6, wherein the joint portion includes a conductive material.

12. The electronic device according to claim 11, wherein the joint portion includes silver paste.

13. The mounting portion comprises copper, as described in any one of claims 1 to 6.

14. The electronic device according to any one of claims 1 to 6, further comprising a sealing member that covers the electronic chip, at least a part of the mounting portion, and the joint portion.

15. The mounting portion has a mounting surface facing the other direction in the thickness direction, The electronic device according to claim 14, wherein the mounting surface is exposed from the sealing member.