Film adhesion test method, production method for structure, and production method for electronic component device

Abstract

This film adhesion test method comprises: forming, in a film formed on a base, notches reaching the base; attaching an adhesive sheet to a surface of the film in which the notches have been formed; and peeling the sheet off the film. The notches are formed by irradiating of the film with laser light.

Description

Film adhesion test method, structure manufacturing method, and electronic component device manufacturing method

[0001] The present disclosure relates to a method for testing adhesion of a film, a method for manufacturing a structure, and a method for manufacturing an electronic component device.

[0002] BACKGROUND ART Resin materials containing resins such as epoxy resins are widely used as sealing materials for protecting the periphery of electronic components in electronic component devices such as semiconductor packages (see, for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2021-027315

[0004] In recent years, electronic devices have become smaller and more functional, resulting in an increased density of electronic components within electronic component devices. As a result, noise generated by electronic component devices can cause electromagnetic interference between the devices and surrounding electronic devices. To address this issue, electronic component devices are typically covered with a metal film to suppress electromagnetic interference. The metal film of an electronic component device is typically provided on the surface of a sealing material that protects the periphery of the electronic components. To effectively suppress electromagnetic interference, it is desirable for the metal film to have high adhesion to the sealing material.

[0005] The cross-cut method, which conforms to JIS-K5600-5-6:1999, is widely used to test the adhesion of metal films to sealing materials. In the cross-cut method, a grid-like pattern of notches (e.g., 25 squares) is formed in a film formed on a substrate, and then adhesive tape is applied to the film. The adhesion of the film is evaluated based on the number of squares that peel off from the substrate when the adhesive tape is peeled off.

[0006] In the cross-cut method, cuts are made manually in the membrane using a utility knife. This means that the condition of the cuts made in the membrane is prone to variability. If the condition of the cuts varies greatly, the reliability of the test may be reduced.

[0007] In view of the above circumstances, one embodiment of the present disclosure aims to provide a highly reliable film adhesion testing method, a method for manufacturing a structure with excellent film adhesion, and a method for manufacturing an electronic component device with excellent film adhesion.

[0008] Specific means for solving the above problems include the following aspects. <1> A method for testing the adhesion of a film, comprising: forming slits in a film formed on a substrate, the slits reaching the substrate; attaching an adhesive sheet to the surface of the film with the slits formed thereon; and peeling the sheet from the film, wherein the slits are formed by irradiating the film with laser light. <2> The method for testing the adhesion of a film according to <1>, wherein the slits are formed in a grid pattern. <3> The method for testing the adhesion of a film according to <1> or <2>, wherein the film contains a metal. <4> The method for testing the adhesion of a film according to any one of <1> to <3>, wherein the substrate contains a resin. <5> The method for testing the adhesion of a film according to any one of <1> to <4>, wherein the substrate is a sealant. <6> A method for manufacturing a structure having a substrate and a film formed on the substrate, the method comprising selecting the type of the substrate or the film based on information obtained from the method for testing the adhesion of a film according to any one of <1> to <5>. <7> A method for manufacturing an electronic component device comprising a support member, an element arranged on the support member, a resin material arranged around the element, and a metal film arranged around the resin material, the method including selecting the type of the resin material or the metal film based on information obtained from a film adhesion test method described in any one of <1> to <5>.

[0009] According to one embodiment of the present disclosure, there are provided a highly reliable film adhesion testing method, a method for manufacturing a structure with excellent film adhesion, and a method for manufacturing an electronic component device with excellent film adhesion.

[0010] 1 is a photograph of a test piece after a cross-cut test in an example and a comparative example.

[0011] In the present disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another staged numerical range. Furthermore, in numerical ranges described in the present disclosure, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple corresponding substances. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, each component may contain multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0012] <Method for testing adhesion of a film> A first embodiment of the present disclosure is a method for testing adhesion of a film, comprising: forming a notch in a film formed on a substrate, the notch reaching the substrate; attaching an adhesive sheet to the surface of the film on which the notch has been formed; and peeling the sheet from the film, wherein the notch is formed by irradiating the film with laser light.

[0013] In this embodiment, the notches are formed in the film by laser irradiation. Therefore, the variation in the notch state can be reduced compared to when the notches are formed manually using a cutter knife. This increases the reliability of the test results. Furthermore, compared to when the variation in the notch state is leveled out by increasing the number of test pieces, the test can be performed efficiently with a smaller number of test pieces. Furthermore, the test can be performed even when the film is made of a material that is difficult to cut with a cutter knife. Furthermore, cutter knives are easily worn when forming notches in the film and require frequent replacement, making them expensive. Using laser light instead of a cutter knife reduces the cost of the adhesion test.

[0014] In this embodiment, the pattern of the notches formed in the film is not particularly limited. From the viewpoint of facilitating classification of the test results, it is preferable to form the notches in a grid pattern. That is, this embodiment is preferably carried out by the cross-cut method. When the notches formed in the film are in a grid pattern, the pattern may be a pattern specified in the cross-cut method in accordance with JIS-K5600-5-6:1999, or any other pattern.

[0015] The line width of the notches formed in the film is not particularly limited and can be selected depending on the material, thickness, etc. of the film. For example, the line width of the notches may be selected from 10 μm to 1000 μm. The depth of the notches formed in the film is not particularly limited as long as it reaches the substrate. The line width and depth of the notches formed in the film can be adjusted by the type, output, spot size, etc. of the laser light used to form the notches.

[0016] The type of laser light source (laser) used to form the notches in the film is not particularly limited, and can be selected depending on the material, thickness, etc. of the film. Specific examples of the type of laser include YAG laser, YVO ４Examples of laser sources include solid-state lasers such as lasers, fiber lasers, and semiconductor lasers, and gas lasers such as carbon dioxide lasers, excimer lasers, and He-Ne lasers. The wavelength of the laser light used to form the notches in the film is not particularly limited and can be selected depending on the material and thickness of the film. From the viewpoint of forming highly precise notches, the laser light is preferably a laser light having a wavelength of 532 nm (green laser) or a laser light having a wavelength of 1064 nm, and more preferably a laser light having a wavelength of 532 nm. A green laser can be obtained, for example, by converting the wavelength of laser light generated using a YAG laser or the like from 1064 nm to half that wavelength. The wavelength of the laser light can be converted using an oxide single crystal such as lithium borate (LBO).

[0017] The intensity of the laser light used to form the notches in the film is not particularly limited and can be selected depending on the material, thickness, etc. of the film. From the viewpoint of forming highly precise notches while minimizing damage to the film or substrate, the intensity of the laser light is preferably 0.5 W / cm. ２ ~10 W / cm ２ and preferably 1 W / cm ２ ~7 W / cm ２ More preferably, it is 2 W / cm ２ ~5 W / cm ２ It is more preferable that:

[0018] In this embodiment, the material of the film is not particularly limited as long as it can form a notch by irradiation with laser light. Specific examples of the film material include metals, resins, glass, carbon, semiconductors, etc. Specific examples of metals include copper, silver, gold, iron, nickel, aluminum, titanium, vanadium, chromium, and alloys containing these metals. Specific examples of resins include epoxy resins, phenolic resins, urea resins, melamine resins, unsaturated polyester resins, urethane resins, silicone resins, maleimide resins, polyolefins, polyesters, polyamides, polystyrenes, acrylic resins, polyvinyl chloride, ABS (acrylonitrile butadiene styrene) resins, thermoplastic elastomers, and thermosetting elastomers (including rubber). The film may be made of a single material or may be made of two or more layers of different materials. The thickness of the film is not particularly limited and can be selected, for example, from the range of 10 nm to 10,000 nm.

[0019] In this embodiment, the material of the substrate is not particularly limited as long as a film can be formed on the surface. Specific examples of the substrate material include metal, resin, glass, carbon, semiconductor, ceramic, wood, and stone.

[0020] In some implementations of this embodiment, the film includes a metal, and the substrate includes a resin. When the film includes a metal, the proportion of the metal may be 30% by mass to 100% by mass, 50% by mass to 100% by mass, or 100% by mass. When the substrate includes a resin, the proportion of the resin may be 30% by mass to 100% by mass, 50% by mass to 100% by mass, or 100% by mass. In some implementations of this embodiment, the substrate may be an encapsulant. In the present disclosure, an encapsulant refers to a material that is disposed around an element included in an electronic component device.

[0021] In this embodiment, the type of adhesive sheet to be attached to the surface of the film having the slits formed thereon is not particularly limited, and can be selected depending on the material, thickness, etc. As the adhesive sheet, adhesive tape such as cellophane tape may be used.

[0022] In this embodiment, the method for peeling the sheet attached to the surface of the film from the film is not particularly limited and can be selected depending on the material, thickness, etc. of the film. The angle at which the sheet attached to the surface of the film is peeled from the film is not particularly limited. For example, the angle may be selected from the range of 30° to 90°, or may be the angle (60°) specified in the cross-cut method in accordance with JIS-K5600-5-6:1999.

[0023] In this embodiment, the test piece may be pretreated as needed before forming the notch in the film. Specific examples of pretreatment include a test in which the test piece is stored in a high temperature and / or high humidity environment, a test in which the test piece is treated with chemicals, etc.

[0024] In one embodiment, a pretreatment may be performed in the following order: (1) a treatment in which the test specimen is kept in an environment of 60°C to 100°C and a relative humidity of 60% to 100°C for 15 hours or more (hereinafter also referred to as moisture absorption treatment), and (2) a treatment in which the test specimen is heated under conditions such that the maximum temperature reached is 200°C or higher (hereinafter also referred to as heat treatment).

[0025] In the moisture absorption treatment, the test piece is kept in an environment of 60°C to 100°C and a relative humidity of 60% to 100°C for 15 hours or more. The temperature of the moisture absorption treatment is not particularly limited as long as it is within the range of 60°C to 100°C, and may be, for example, 80°C to 100°C or 85°C. The relative humidity of the moisture absorption treatment is not particularly limited as long as it is within the range of 60% to 100°C, and may be, for example, 80% to 100% or 85%. The time of the moisture absorption treatment is not particularly limited as long as it is 15 hours or more, and may be, for example, 15 hours to 200 hours, 20 hours to 100 hours, or 24 hours.

[0026] In the heat treatment, the test piece is heated under conditions such that the maximum temperature reached is 200°C or higher. The maximum temperature reached in the heat treatment is not particularly limited as long as it is 200°C or higher, and may be, for example, 200°C to 300°C, 150°C to 300°C, or 260°C. The heat treatment may be carried out in the air or in an inert atmosphere such as nitrogen. When the film is made of a metal that is easily oxidized, such as copper, the heat treatment is preferably carried out in an inert atmosphere. The number of times the heat treatment is carried out is not particularly limited. From the viewpoint of test accuracy, it is preferable to carry out the heat treatment two or more times, and more preferably three or more times.

[0027] <Method for manufacturing a structure> A second embodiment of the present disclosure is a method for manufacturing a structure having a substrate and a film formed on the substrate, the method including selecting the type of the substrate or the film based on information obtained from the above-described method for testing adhesion of a film.

[0028] In this embodiment, a structure is manufactured using a substrate or a film selected based on information obtained from the method of the first embodiment. Therefore, the structure obtained in this embodiment has excellent adhesion of the film to the substrate. The form of the structure is not particularly limited as long as it includes a substrate and a film formed on the substrate.

[0029] In this embodiment, "selecting the type of substrate or film" includes selecting a film to be used with a substrate that has been decided to be used in the manufacture of a structure, selecting a substrate to be used with a film that has been decided to be used in the manufacture of a structure, and selecting a substrate and a film that have not been decided to be used in the manufacture of a structure.

[0030] <Method for manufacturing electronic component device> A third embodiment of the present disclosure is a method for manufacturing an electronic component device including a support member, an element arranged on the support member, a resin material arranged around the element, and a metal film arranged around the resin material, the method including selecting the type of the resin material or the metal film based on information obtained from the above-described film adhesion test method.

[0031] In this embodiment, an electronic component device is manufactured using a resin material or a metal film selected based on information obtained from the method of the first embodiment. Therefore, the electronic component device obtained in this embodiment has excellent adhesion of the metal film to the resin material. If the purpose of providing the metal film on the electronic component device is to suppress electromagnetic interference, the electronic component device obtained in this embodiment effectively suppresses electromagnetic interference.

[0032] In this embodiment, "selecting the type of resin material or metal film" includes selecting a metal film to be used together with a resin material that has been decided to be used in the manufacture of an electronic component device, selecting a resin material to be used together with a metal film that has been decided to be used in the manufacture of an electronic component device, and selecting a resin material and a metal film that have not been decided to be used in the manufacture of an electronic component device.

[0033] The term "resin material" used in this embodiment refers to a material containing at least a resin. The resin material may consist of only a resin, or may contain a resin and a component other than the resin. In one embodiment, the resin material contains a thermosetting resin as the resin. The thermosetting resin may be selected from epoxy resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, urethane resin, silicone resin, and maleimide resin. In one embodiment, the thermosetting resin may be an epoxy resin.

[0034] When the resin material contains components other than resin, examples of the components other than resin include fillers, curing agents, curing accelerators, coupling agents, ion exchangers, release agents, flame retardants, and colorants.

[0035] The type of support member included in the electronic component device is not particularly limited and can be selected depending on the type of electronic component device. The support member may be, for example, an inorganic material such as silicon, metal, or carbon, an organic material such as resin, or a composite of an inorganic material and an organic material.

[0036] Specific examples of electronic component devices include devices obtained by mounting elements (active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils) on a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, and then sealing the resulting element portion with a resin material. More specifically, DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead package), TSOP (Thin Small Outline Package), TQFP (Thin Quad Flat Package), etc., have a structure in which an element is fixed on a lead frame, and terminals of the element such as bonding pads are connected to leads by wire bonding, bumps, etc., and then sealed using a resin material by transfer molding or the like. Examples of such a device include a general resin-sealed IC such as a TCP (Tape Carrier Package); a TCP (Tape Carrier Package) having a structure in which elements connected to a tape carrier by bumps are sealed with a resin material; a COB (Chip On Board) module, hybrid IC, multi-chip module, etc. having a structure in which elements connected by wire bonding, flip chip bonding, solder, or the like to wiring formed on a support member are sealed with a resin material; and a BGA (Ball Grid Array), CSP (Chip Size Package), MCP (Multi Chip Package) having a structure in which elements are mounted on the surface of a support member having terminals for connecting a wiring board formed on the back side, and the elements are connected to the wiring formed on the support member by bumps or wire bonding, and then the elements are sealed with a resin material.

[0037] The present invention will be described in more detail below with reference to examples, but the scope of the present invention is not limited to these examples.

[0038] <Preparation of Test Specimens> Test specimens were prepared using an encapsulant for electronic device devices containing an epoxy resin. Specifically, a molded body of the encapsulant was formed on a substrate at a mold temperature of 175°C for a molding time of 120 seconds. The substrate was then peeled off from the molded body, and post-curing was performed at 175°C for 5 hours to obtain a cured product measuring 235 mm x 65 mm x 0.7 mm. A copper film (thickness: 500 nm) was formed by sputtering on one of the main surfaces and a side surface of the obtained cured product to obtain a test specimen. The test specimen was subjected to a moisture absorption treatment in which it was held in an environment of 85°C and a relative humidity of 85% for 24 hours. Thereafter, a heat treatment was performed three times in a nitrogen atmosphere, with a maximum temperature of 260°C.

[0039] Example 1 Cross-Cut Test Using Green Laser A laser marking device was used to mark the copper film of the test piece with laser light (type: green laser, wavelength: 532 nm, intensity: 3 W / cm ２ ) to form notches. The notch pattern was a grid pattern as defined by the cross-cut method in accordance with JIS-K5600-5-6:1999. The number of squares constituting the grid was 25 in total, 5 vertically and 5 horizontally, and the size of each grid was 1 mm x 1 mm. The formation of notches was carried out on three test pieces (N1, N2, and N3).

[0040] An adhesive tape was applied to the copper film with the notch formed thereon, and within 5 minutes of application, the tape was quickly peeled off at an angle of 60° within 0.5 to 1.0 seconds.

[0041] Example 2 Cross-Cut Test Using YAG Laser A laser beam (type: YAG laser, wavelength: 1064 nm, intensity: 3 W / cm) was applied to the copper film of the test piece using a laser marking device. ２ ) to form notches. The notch pattern was a grid pattern as defined by the cross-cut method in accordance with JIS-K5600-5-6:1999. The number of squares constituting the grid was 25 in total, 5 vertically and 5 horizontally, and the size of each grid was 1 mm x 1 mm. The formation of notches was carried out on three test pieces (N1, N2, and N3).

[0042] An adhesive tape was applied to the copper film with the notch formed thereon, and within 5 minutes of application, the tape was quickly peeled off at an angle of 60° within 0.5 to 1.0 seconds.

[0043] Comparative Example 1: Cross-cut test using a cutter knife Cuts were made in the copper film of the test piece using a cutter knife. The cut pattern was the same as in the example. The cuts were made in three test pieces (N1, N2, and N3).

[0044] An adhesive tape was applied to the copper film with the notch formed thereon, and within 5 minutes of application, the tape was quickly peeled off at an angle of 60° within 0.5 to 1.0 seconds.

[0045] <Observation of Test Pieces After Cross-Cut Test> Photographs of the test pieces after the cross-cut test in Examples 1 and 2 and Comparative Example 1 are shown in Fig. 1. As shown in Fig. 1, the test pieces after the cross-cut test using laser light showed less variation in the state of the copper film after the test than the test pieces after the cross-cut test using a cutter knife.

[0046] The disclosure of International Application No. PCT / JP2023 / 028324 is incorporated herein by reference in its entirety. All publications, patent applications, and technical standards mentioned herein are incorporated by reference to the same extent as if each individual publication, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A method for testing the adhesion of a film, comprising: forming a slit in a film formed on a substrate, the slit reaching the substrate; attaching an adhesive sheet to the surface of the film with the slit formed therein; and peeling off the sheet from the film, wherein the slit is formed by irradiating the film with laser light.

2. The method for testing adhesion of a film according to claim 1, wherein the notches are formed in a lattice pattern.

3. The method for testing adhesion of a film according to claim 1, wherein the film includes a metal.

4. The method for testing adhesion of a film according to claim 1, wherein the substrate comprises a resin.

5. The method for testing adhesion of a film according to claim 1, wherein the substrate is a sealing material.

6. A method for manufacturing a structure having a substrate and a film formed on the substrate, comprising selecting the type of the substrate or the film based on information obtained from the method for testing adhesion of a film according to any one of claims 1 to 5.

7. A method for manufacturing an electronic component device comprising a support member, an element arranged on the support member, a resin material arranged around the element, and a metal film arranged around the resin material, the method including selecting the type of the resin material or the metal film based on information obtained from a film adhesion test method described in any one of claims 1 to 5.