Method for producing semiconductor device, and semiconductor device

Abstract

A method for producing a semiconductor device according to the present invention comprises a first step, a second step, a third step, and a fourth step. In the third step, a pad part is exposed from the bottom surface of a sealing resin. In the third step, the dimensions of the sealing resin from the bottom surface to a second surface of a first support part in a first direction are made smaller than the dimensions of the sealing resin from the top surface of the sealing resin to a first surface of the first support part in the first direction. In the fourth step, the first support part is cut by applying a compressive force to the top surface while supporting the second surface with a support body. In the fourth step, a first end surface that faces one side of a second direction and that is exposed from the sealing resin is formed on the first support part.