Jig for stage and method for manufacturing stage

JPWO2025053019A1Pending Publication Date: 2025-03-13
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Patent Information

Application Number
JP2025544290
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2023-09-04
Filing Date
2024-08-28
Publication Date
2025-03-13
Patent Text Reader

Abstract

This jig for a stage is used in the step of processing a thermal spray coating of the stage, and comprises: a body including a first surface on which the stage is placed, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface; a flow path provided inside the body and through which a fluid flows; a flow path entry portion allowing the fluid to flow into the flow path; a flow path exit portion provided on the first surface of the body and allowing the fluid to flow out of the flow path; and a through hole penetrating the substrate from the first surface to the second surface.
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Description

Stage jig and stage manufacturing method

[0001] An embodiment of the present invention relates to a stage jig used in a stage manufacturing process, and also to a stage manufacturing method using the stage jig.

[0002] Semiconductor devices are found in almost all electronic devices and play an important role in their functionality. Semiconductor devices utilize the semiconducting properties of silicon and other materials. Semiconductor devices are constructed by stacking semiconductor, insulating, and conductive films on a substrate and then patterning these films. These films are deposited using methods such as evaporation, sputtering, chemical vapor deposition (CVD), or chemical reactions on the substrate, and then patterned using a photolithography process. The photolithography process involves forming a resist on the films to be patterned, exposing the resist, developing the resist to light, forming a resist mask by etching, partially removing the films, and finally removing the resist mask.

[0003] The characteristics of the above-mentioned films are significantly influenced by the conditions for forming the film or the conditions for etching the film. One of these conditions is the voltage applied to a stage (hereinafter referred to as a stage) on which a substrate is placed. With the recent trend toward miniaturization of semiconductor devices, the ratio between the diameter of the hole to the thickness of the film to be processed has increased, leading to a tendency for the voltage applied to a stage included in, for example, an etching apparatus to increase. As the voltage applied to the stage increases, the voltage resistance of components included in the stage must be improved. Examples of components included in the stage include a cooling plate and an electrostatic chuck. Patent Documents 1 and 2 disclose stages with improved voltage resistance, in which an insulating film (sprayed film) is formed on the surface by ceramic spraying, a thermal spraying method.

[0004] Patent No. 6027407 Registered Utility Model No. 2600558

[0005] A thermal sprayed film containing ceramic has low thermal conductivity, which can make it difficult to control the temperature of a substrate placed on a stage. Therefore, a gas flow path is provided on the stage, and the temperature of the substrate is controlled not only by a heater but also by a gas (e.g., a cooling gas) flowing through the gas flow path. In this case, a porous body exposed from the thermal sprayed film is provided at the outlet of the gas flow path to prevent particles from entering the gas flow path.

[0006] However, in the stage containing the porous body, the porous body may discolor or become clogged, resulting in poor quality and reduced performance.

[0007] In view of the above problem, one embodiment of the present invention aims to suppress quality defects in the porous body of a stage during the manufacturing process of the stage, which includes a porous body exposed from a sprayed film.

[0008] A stage jig according to one embodiment of the present invention is a stage jig used in a process of processing a thermal sprayed film on a stage, and includes a main body including a first surface on which the stage is placed, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface, a flow path provided inside the main body through which a fluid flows, a flow path inlet portion through which the fluid flows into the flow path, a flow path outlet portion provided on the first surface of the main body through which the fluid flows out of the flow path, and a through hole that penetrates the substrate from the first surface to the second surface.

[0009] The opening diameter of the through-hole may be larger than the opening diameter of the outlet portion of the flow path.

[0010] The stage jig may further include a groove provided on the second surface and connected to the through hole. The groove may extend to the third surface.

[0011] The flow channel inlet may be provided on the third surface.

[0012] The fluid may be a gas.

[0013] The stage and the base material may be fastened together by inserting a screw into the through hole.

[0014] The fluid flowing out from the outlet of the flow path may be supplied to a gas flow path provided in the stage.

[0015] The first surface may be covered by a protective member, which may be black.

[0016] A method for manufacturing a stage according to one embodiment of the present invention comprises placing a substrate having a gas flow path formed therein, one end of the gas flow path being open at the bottom surface, a porous body embedded at the other end of the gas flow path at the top surface, and a sprayed film formed on the top surface so as to cover the porous body, on a stage jig having a flow path formed therein for circulating a fluid, and grinding away the sprayed film while supplying a fluid to the gas flow path through the flow path in the stage jig, thereby exposing the porous body from the sprayed film.

[0017] The substrate may be placed on the stage jig so that one end of the gas flow path overlaps with the flow path outlet portion of the flow path formed in the stage jig.

[0018] According to a stage jig according to one embodiment of the present invention, in a stage including a porous body exposed from a thermal sprayed film, quality defects of the porous body can be suppressed, thereby improving the yield of the stage.

[0019] 1 is a perspective view of a stage jig according to one embodiment of the present invention; FIG. 2 is a top view of a stage jig according to one embodiment of the present invention; FIG. 3 is a bottom view of a stage jig according to one embodiment of the present invention; FIG. 4 is a schematic cross-sectional view of a stage jig according to one embodiment of the present invention; FIG. 5 is a schematic perspective view showing a modified through hole of a stage jig according to one embodiment of the present invention; FIG. 6 is a schematic perspective view showing a modified through hole of a stage jig according to one embodiment of the present invention; FIG. 7 is a schematic perspective view showing a modified through hole of a stage jig according to one embodiment of the present invention; FIG. 8 is a perspective view showing a configuration of a stage manufactured using a stage jig according to one embodiment of the present invention; FIG. 9 is a perspective view showing a configuration of a stage manufactured using a stage jig according to one embodiment of the present invention; FIG. 10 is a flowchart showing a method of manufacturing a stage according to one embodiment of the present invention; FIG. 11 is a flowchart showing the step of thermal spray film processing in the method of manufacturing a stage according to one embodiment of the present invention; FIG. 12 is a schematic cross-sectional view illustrating the step of thermal spray film processing in the method of manufacturing a stage according to one embodiment of the present invention; FIG. 13 is a schematic cross-sectional view illustrating the step of thermal spray film processing in the method of manufacturing a stage according to one embodiment of the present invention.

[0020] Hereinafter, each embodiment of the invention disclosed in this application will be described with reference to the drawings. However, the present invention can be embodied in various forms without departing from the spirit of the invention, and should not be construed as being limited to the description of the embodiments exemplified below.

[0021] In order to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and drawings, components having the same functions as those explained with reference to the previous drawings may be assigned the same reference numerals, and duplicate explanations may be omitted.

[0022] In the present invention, when a single film is processed to form multiple films, these multiple films may have different functions and roles. However, these multiple films originate from films formed as the same layer in the same process, and have the same layer structure and the same material. Therefore, these multiple films are defined as existing in the same layer.

[0023] 1 to 4, the configuration of a stage jig 10 according to one embodiment of the present invention will be described. As will be described in detail later, the stage jig 10 is a jig used to process a sprayed film formed on a stage used in a semiconductor device or the like.

[0024] 1 to 3 are respectively a perspective view, a top view, and a bottom view of a stage jig 10 according to one embodiment of the present invention. Also, Fig. 4 is a schematic cross-sectional view of the stage jig 10 according to one embodiment of the present invention. The cross-sectional view of the stage jig 10 shown in Fig. 4 does not exactly correspond to the cross-sectional view of the stage jig 10 shown in Figs. 1 to 3, but Fig. 4 shows a schematic cross-sectional view of the stage jig 10 to make it easier to understand the internal configuration of the stage jig 10.

[0025] The stage jig 10 includes a main body 100, in which a flow path 110, a through hole 120, and a groove 130 are formed.

[0026] [1-1. Configuration of Main Body 100] The main body 100 includes a first surface 101 on which a stage is placed, a second surface 102 opposite the first surface 101, and a third surface 103 connecting the first surface 101 and the second surface 102 (see FIGS. 1 to 3). The first surface 101, the second surface 102, and the third surface 103 are the top surface, the bottom surface, and the side surface, respectively. The main body 100 has a disk shape, but the shape of the main body 100 is not limited thereto. The main body 100 may also have an elliptical or polygonal shape. Furthermore, the main body 100 may be composed of a single member or multiple members. When the main body 100 is composed of multiple members, it may be composed of a combination of multiple members made of the same material, or may be composed of a combination of multiple members made of different materials. The material of the main body 100 may be, for example, a metal such as an aluminum alloy or stainless steel, but the material of the main body 100 is not limited to these.

[0027] Although not shown, a protective member may be provided on the first surface 101 of the main body 100. Since a stage is placed on the first surface 101, providing a protective member on the first surface 101 can prevent the stage from being damaged. For example, masking tape can be used as the protective member. In addition, the protective member is preferably black. If the protective member is black, it becomes easier to visually check particles (e.g., chips from the thermal spray coating) remaining on the protective member.

[0028] [1-2. Configuration of the Flow Channel 110] The flow channel 110 is provided inside the main body 100 (see FIG. 4). A flow channel inlet 111 is provided on the third surface 103, and a flow channel outlet 112 is provided on the first surface 101. A fluid flows through the flow channel 110. That is, the fluid flows in through the flow channel inlet 111, flows through the flow channel 110, and flows out through the flow channel outlet 112. The cross-sectional shape of the flow channel 110, the opening shape of the flow channel inlet 111, and the opening shape of the flow channel outlet 112 are each, for example, circular; however, the cross-sectional shape of the flow channel 110, the opening shape of the flow channel inlet 111, and the opening shape of the flow channel outlet 112 are not limited thereto. The cross-sectional shape of the flow channel 110, the opening shape of the flow channel inlet 111, and the opening shape of the flow channel outlet 112 may also be elliptical or polygonal. Furthermore, the cross-sectional shape of the flow channel 110, the opening shape of the flow channel inlet 111, and the opening shape of the flow channel outlet 112 may be the same or different.

[0029] The main body 100 may have one or more flow paths 110 provided therein. Here, "multiple flow paths 110" refers to a configuration in which the multiple flow paths 110 allow fluid to circulate independently of each other and are not connected to each other. When two flow paths are connected, they may be described as one flow path 110 for convenience.

[0030] The flow path inlet 111 is connected to a fluid supply unit (e.g., a compressor), and the fluid supplied from the fluid supply unit flows in through the flow path inlet 111. The flow path inlet 111 may be provided on a surface other than the third surface 103. If the main body 100 is larger than the stage, the flow path inlet 111 can also be provided on the first surface 101. Furthermore, if a fluid supply unit is provided on the base of a processing machine that processes the sprayed film on the stage, the flow path inlet 111 can also be provided on the second surface 102 to match the position of the fluid supply unit.

[0031] The third surface 103 of the main body 100 may be provided with one flow path inlet 111 or with multiple flow path inlet parts 111. When multiple flow paths 110 are provided inside the main body 100, multiple flow path inlet parts 111 may be provided to correspond to the multiple flow paths 110. The number of flow path inlet parts 111 may be the same as the number of flow paths 110, or may be different. For example, when the number of flow path inlet parts 111 is greater than the number of flow paths 110, one flow path 110 having branches is provided inside the main body 100, and fluids flowing in from the multiple flow path inlet parts 111 flow through the single flow path 110 via the branches.

[0032] The flow channel outlet 112 is provided on the first surface 101 so that, when the stage is placed on the stage jig 10, the position of one open end (hereinafter sometimes referred to as the "open end") of the gas flow channel of the stage corresponds to the position of the flow channel outlet 112 (in other words, the open end of the gas flow channel of the stage and the flow channel outlet 112 overlap). When a plurality of open ends of the gas flow channel are provided on the stage, it is preferable that a plurality of flow channel outlets 112, the same number as the plurality of open ends of the gas flow channel of the stage, are provided on the first surface 101.

[0033] The fluid flowing through the flow path 110 is, for example, a liquid such as water or a gas such as air, but is preferably a gas. As will be described in detail later, if the fluid is a gas, the grinding fluid used in processing the thermal sprayed film on the stage will not be diluted.

[0034] [1-3. Configuration of the through hole 120] The through hole 120 is provided so as to penetrate the main body 100 from the first surface 101 to the second surface 102 (see FIGS. 2 and 3). Within the main body 100, the through hole 120 is not connected to the flow path 110. The cross-sectional shape of the through hole 120 is, for example, circular, but is not limited to this. The cross-sectional shape of the through hole 120 may be elliptical or polygonal. Furthermore, the opening diameter of the through hole 120 in the first surface 101 and the opening diameter of the through hole 120 in the second surface 102 may be the same or different.

[0035] The main body 100 may be provided with one through-hole 120 or may be provided with a plurality of through-holes 120. When the main body 100 is provided with a plurality of through-holes 120, the shapes and sizes of the plurality of through-holes 120 may be the same or different.

[0036] The positions at which the through holes 120 are provided are not particularly limited, but it is preferable that some of the multiple through holes 120 are provided at positions near the flow path outlet 112. Furthermore, it is preferable that the opening diameter of the through holes 120 in the first surface 101 and the opening diameter of the through holes 120 in the second surface 102 are larger than the opening diameter of the flow path outlet 112.

[0037] The through hole 120 is preferably configured to allow a screw such as a bolt or a screw to be inserted from the second surface 102. In this case, a step is provided on the inner wall of the through hole 120, and the head of the screw is engaged by the step within the through hole 120. The step may be provided so as to have a convex shape near the middle of the inner wall of the through hole 120, or may be provided across the middle of the inner wall of the through hole 120 so that the opening diameter of the through hole 120 in the first surface 101 and the opening diameter of the through hole 120 in the second surface 102 are different. In the latter case, the opening diameter of the through hole 120 in the first surface 101 is smaller than the opening diameter of the through hole 120 in the second surface 102. The threaded portion of the screw is inserted into and screwed into a screw hole provided in the stage. As a result, the stage is fastened and fixed to the stage jig 10. Since the second surface 102 of the stage jig 10 is placed on the base of a processing machine that processes the thermal sprayed film of the stage, it is preferable that the heads of the screws are embedded in the through holes 120 without protruding from the through holes 120. Furthermore, when multiple through holes 120 are provided in the main body 100, it is not necessary for all of the multiple through holes 120 to be configured to allow screws to be inserted. It is sufficient that some of the multiple through holes 120 are configured to allow screws to be inserted.

[0038] The function of the through-hole 120 in the stage jig 10 will be described in detail in the stage manufacturing method described later.

[0039] Here, through-holes 120A, 120B, and 120C, which are modifications of through-hole 120, will be described with reference to FIGS.

[0040] 5 to 7 are schematic perspective views showing modified examples of the through hole 120 of the stage jig according to one embodiment of the present invention. Specifically, Fig. 5, Fig. 6, and Fig. 6 show top perspective views of the through hole 120A, the through hole 120B, and the through hole 120C, respectively, as viewed from the first surface 101 side of the stage jig 10.

[0041] 5, a thread groove 120a is provided on the inner wall of the through hole 120A. In this case, a screw inserted into the through hole 120A from the second surface 102 is inserted into a screw hole provided in the stage while its threaded portion threadably engages with the thread groove 120a of the through hole 120A. By providing the thread groove 120a in the through hole 120A, the stage can be firmly fixed to the stage jig 10. Furthermore, since the surface area inside the through hole 120A increases, the gap inside the through hole 120A also tends to increase.

[0042] 6, the inner wall of the through hole 120B is provided with not only the thread groove 120a but also a groove 120b extending in the direction of penetration of the through hole 120B. That is, the direction of the groove 120b intersects with the direction of the thread groove 120a. By providing the groove 120b, the gap within the through hole 120B increases. For example, even if a screw is threaded into the thread groove 120a, the groove 120b can function as a flow path for a fluid to flow from the first surface 101 to the second surface 102.

[0043] The through hole 120B shown in FIG. 6 has a rectangular shape when viewed from above. However, the shape of the through hole 120B when viewed from above is not limited to this. For example, the through hole 120C shown in FIG. 7 has a groove 120c with curved side walls, and the shape of the through hole 120C when viewed from above is semicircular. The through hole 120C can be formed using a rotary cutting tool such as a drill, and is easy to process. In this way, the through hole 120 can have a variety of shapes when viewed from above, including modified examples such as the through holes 120A to 120C.

[0044] [1-4. Configuration of Groove 130] The groove 130 is provided on the second surface 102 of the main body 100 (see FIG. 3). The groove 130 is connected to the through-hole 120 and extends outward from the through-hole 120 (toward the third surface 103). That is, the groove 130 is provided so as to connect the through-hole 120 and the third surface 103. The groove 130 may extend so that one end is connected to the third surface 103, and the other end of the groove 130 may extend beyond the through-hole 120 to the center of the second surface 102. In other words, the groove 130 is provided so as to overlap the through-hole 120. The groove 130 is not connected to the flow path 110. The groove 130 may extend linearly or curvedly. Furthermore, the width of the groove 130 in a direction perpendicular to the extension direction may be the same or different. For example, the width of the groove 130 at the portion connected to the third surface 103 may be larger than the width of the groove 130 at the portion connected to the through-hole 120. The cross-sectional shape of the groove 130 is, for example, rectangular, but the cross-sectional shape of the groove 130 is not limited thereto. The cross-sectional shape of the groove 130 may be semicircular, semi-elliptical, or a polygonal shape other than rectangular. The depth of the groove 130 is not particularly limited.

[0045] A plurality of grooves 130 may be provided corresponding to a plurality of through holes 120. That is, as shown in Fig. 3, one groove 130 may be provided that is connected to each of the plurality of through holes 120. However, the plurality of grooves 130 may be connected to each other.

[0046] The function of the grooves 130 in the stage jig 10 will be described in detail in the stage manufacturing method described later.

[0047] The configuration of the stage jig 10 has been described above, but the configuration of the stage jig 10 is not limited to the above configuration. The configuration of the stage jig 10 can be modified as appropriate to match the configuration of the stage or the processing machine that processes the sprayed film on the stage.

[0048] 2. Configuration of Stage 20 The stage jig 10 is used in one of the processes for manufacturing the stage 20. Before describing the method for manufacturing the stage 20, the configuration of the stage 20 will be described with reference to FIGS.

[0049] 8 and 9 are perspective views showing the configuration of a stage 20 fabricated using the stage jig 10 according to one embodiment of the present invention. Specifically, Fig. 8 is a perspective view of the stage 20 viewed from above, and Fig. 9 is a perspective view of the stage 20 viewed from below.

[0050] The stage 20 includes a substrate 200 , a sprayed film 210 , a gas flow passage 220 , a porous body 230 , and a screw hole 240 .

[0051] The substrate 200 has a structure in which two circular flat plate members of different sizes are joined together. The two flat plate members are joined together by, for example, brazing. The substrate 200 may be made of a metal material such as titanium, aluminum, or an alloy thereof. Note that the substrate 200 may also be made of three or more flat plate members joined together.

[0052] The sprayed film 210 is provided to cover the upper and side surfaces of the substrate 200. The sprayed film 210 is formed by spraying a spray material. For example, a ceramic powder containing at least one element selected from the group consisting of alkaline earth metals, rare earth metals, aluminum, tantalum, and silicon can be used as the spray material. In other words, the sprayed film 210 is a ceramic film. Note that there are portions on the upper surface of the substrate 200 where the sprayed film 210 is not provided, and a porous body 230 is provided in those portions. In other words, on the upper surface of the substrate 200, the porous body 230 is not covered by the sprayed film 210 and is exposed from the sprayed film 210.

[0053] The gas flow channel 220 is provided inside the substrate 200. The gas flow channel 220 is provided so as to penetrate from the bottom surface to the top surface of the substrate 200. One end of the gas flow channel 220 at the bottom surface of the substrate 200 is open, and gas is supplied into the gas flow channel 220 from the one end. Meanwhile, the other end of the gas flow channel 220 at the bottom surface of the substrate 200 is blocked by a porous body 230. That is, the gas flow channel 220 has an open end and a blocked end including the porous body 230. However, the porous body 230 contains many pores and has a lower density than the thermal sprayed film 210. Therefore, the gas flowing through the gas flow channel 220 passes through the porous body 230 and is released to the outside. The blocked end of the gas flow channel 220 is provided at one or more positions on the top surface of the substrate 200 depending on the usage state of the semiconductor device on which the stage 20 is installed. Similarly, the open end of the gas flow channel 220 is provided at one or more positions on the bottom surface of the substrate 200.

[0054] As described above, the porous body 230 is provided so as to close the other end of the gas flow path 220 on the upper surface (i.e., it is embedded in the closed end of the gas flow path 220) and is exposed from the sprayed film 210. The closed end of the gas flow path 220 including the porous body 230 can prevent particles from entering the gas flow path 220 of the stage 20 when the stage 20 is in use. The porous body 230 can be made of a ceramic similar to the material of the sprayed film 210.

[0055] The screw holes 240 are provided on the bottom surface of the base material 200. By inserting and threading screws into the screw holes 240, the stage 20 is fastened and fixed to the stage jig 10.

[0056] Although the configuration of the stage 20 has been described above, the configuration of the stage 20 is not limited to the above configuration.

[0057] 8, 10 to 12, and 14, a method for manufacturing a stage according to one embodiment of the present invention will be described. The stage jig 10 is used in one of the steps for manufacturing the stage 20.

[0058] 8 and 10 are flowcharts showing a method for manufacturing the stage 20 according to one embodiment of the present invention. The method for manufacturing the stage 20 shown in the flowcharts of FIGS. 8 and 10 includes four steps (step S100, step S200, step S300, and step S400). Steps S100 to S400 will be described in order below.

[0059] Step S100 is a brazing process. For example, the base material 200 of the stage 20 is formed by joining a plurality of flat plate members by brazing. Grooves and through holes are formed in the flat plate members in advance. Therefore, by joining the plurality of flat plate members, the base material 200 is formed, and the gas flow path 220 is also formed within the base material 200.

[0060] Step S200 is a process of processing the substrate. For example, chamfering can be performed to remove brazing material remaining at corners of steps in the substrate 200. Also, drilling can be performed to form screw holes 240 in the bottom surface of the substrate 200.

[0061] Furthermore, in step S200, porous body 230 is embedded in the other end of gas flow path 220 on the upper surface of substrate 200. At this time, porous body 230 is not completely embedded in the other end of gas flow path 220, but is embedded so as to protrude from the upper surface of substrate 200.

[0062] Step S300 is a thermal spraying process. For example, a thermal spraying machine is used to spray a thermal spray material onto the upper and side surfaces of the substrate 200, thereby forming a thermal sprayed film 210 on the upper and side surfaces of the substrate 200. In step S300, the thermal sprayed film 210 is formed so as to cover the porous body 230 protruding from the upper surface of the substrate 200. In other words, after step S300 is performed, the porous body 230 is not exposed from the thermal sprayed film 210.

[0063] Step S400 is a sprayed film processing step. The stage jig 10 is used in step S400. Step S400 will now be described in detail with reference to FIGS. 9, 11 to 12, and 14.

[0064] Figures 9 and 11 are flowcharts showing the sprayed film processing step in a method for manufacturing the stage 20 according to one embodiment of the present invention. Figures 10, 12, 13, 14 are schematic cross-sectional views illustrating the sprayed film processing step in a method for manufacturing the stage 20 according to one embodiment of the present invention. The sprayed film processing step shown in the flowcharts of Figures 9 and 11 includes three steps (step S410, step S420, and step S430). Steps S410 to S430 will be described below in order with reference to Figures 10, 12, 13, 14, 15, and 16.

[0065] In step S410, the stage 20 on which the processes up to step S300 have been performed is placed on the stage jig 10. The stage 20 is placed on the stage jig 10 so that the open ends of the gas flow paths 220 of the stage 20 overlap with the flow path outlets 112 of the flow paths 110 of the stage jig 10. In other words, the bottom surface of the stage 20 and the first surface 101 of the stage jig 10 come into contact, and the gas flow paths 220 of the stage 20 and the flow paths 110 of the stage jig 10 are connected to each other.

[0066] Furthermore, screws 140 are inserted through the through holes 120 of the stage jig 10. The screws 140 are inserted into and screwed into the screw holes 240 provided in the stage 20. As a result, the stage 20 is fastened to the stage jig 10 and fixed.

[0067] Furthermore, the stage jig 10 fastened to the stage 20 is placed on the base 30 of the grinding machine.

[0068] In step S420, a fluid is supplied to the stage jig 10. The fluid is supplied by a fluid supply device (not shown), and the fluid flows in from the flow path inlet 111 of the flow path 110 of the stage jig 10. As will be described in detail later, a grinding fluid is used in step S430, which will be described later. If the fluid is a gas, the grinding fluid will not be diluted and the grinding conditions will not change. For this reason, a gas such as air is preferable as the fluid rather than a liquid such as water. For convenience, the following description will be given assuming that the fluid is air.

[0069] Even when the stage 20 and the stage jig 10 are fastened together, the gap between the stage 20 and the stage jig 10 is not completely sealed. Therefore, a gap exists between the stage 20 and the stage jig 10. The sprayed film 210 is dense and dense. Therefore, the sprayed film 210 covering the porous body 230 blocks the air supplied to the gas flow path 220 of the stage 20, and almost no air is released to the outside from the closed end of the gas flow path 220. When the pressure of the air supplied to the gas flow path 220 of the stage 20 increases, the air flows into the gap without passing through the sprayed film 210. In other words, the air supplied from the stage jig 10 passes through the gap and is released to the outside. Additionally, as another air flow path, the air supplied from the stage jig 10 passes through the gap, the through-hole 120, and the groove 130, and is released to the outside. That is, the through holes 120 and the grooves 130 function as a circulation path for the excess air that has flowed in from the flow path inlet portion 111. In the stage jig 10, the provision of the through holes 120 and the grooves 130 ensures an air circulation path, making it easy to control the air flow.

[0070] Furthermore, in through hole 120A or through hole 120B, which is a modified example of through hole 120, the gap within through hole 120A or through hole 120B is increased, making it easier for air to flow through through hole 120A or through hole 120B, and allowing for better control of the air flow.

[0071] As described above, excess air flowing out from flow path outlet 112 flows into the gap and passes through through hole 120. For this reason, it is preferable that through hole 120 be provided in the vicinity of flow path outlet 112. Furthermore, it is preferable that the opening diameter of through hole 120 in first surface 101 and the opening diameter of through hole 120 in second surface 102 be larger than the opening diameter of flow path outlet 112 so that excess air flowing out from flow path outlet 112 can also pass through through hole 120 into which screw 140 is inserted.

[0072] In step S430, the sprayed film 210 on the stage 20 is ground. As a result, the sprayed film 210 covering the porous body 230 and the upper portion of the porous body 230 are scraped off, and the porous body 230 is exposed from the sprayed film 210. Air is supplied to the gas flow path 220 of the stage 20, but when the porous body 230 is exposed, the flow path of the air supplied from the stage jig 10 changes, and the air passes through the porous body 230 and is released to the outside. In other words, the porous body 230 is constantly supplied with air.

[0073] A grinding fluid is used in grinding the sprayed film 210. The air passing through the porous body 230 can prevent the grinding fluid from entering the porous body 230. Therefore, even after step S430 is performed, the grinding fluid is less likely to remain in the porous body 230. Furthermore, the air passing through the porous body 230 can prevent chips generated by grinding the sprayed film 210 from entering the porous body 230. Therefore, even after step S430 is performed, the chips are less likely to remain in the porous body 230.

[0074] The grinding fluid remaining in the porous body 230 can cause the porous body to discolor. Furthermore, the chips remaining in the porous body 230 can cause the performance of the porous body to deteriorate. In other words, the grinding fluid and chips remaining in the porous body 230 can cause the porous body 230 to have poor quality. After step S430 is performed, the stage 20 is cleaned, but even if cleaning is performed, it is difficult to remove the grinding fluid and chips remaining in the porous body 230. Furthermore, it is difficult to evaluate whether the grinding fluid and chips have been removed from the porous body 230.

[0075] In this embodiment, by using the stage jig 10, the grinding fluid and chips are prevented from entering the porous body 230 in step S430. Therefore, the grinding fluid and chips are less likely to remain in the porous body 230. Therefore, discoloration and performance degradation of the porous body 230 of the stage 20 can be prevented.

[0076] As described above, by fabricating the stage 20 using the stage jig 10, grinding fluid is less likely to remain in the porous body 230 of the stage 20, making it possible to prevent discoloration of the porous body 230. Furthermore, chips are less likely to remain in the porous body 230 of the stage 20, making it possible to prevent a decrease in the performance of the porous body 230. Therefore, quality defects in the porous body of the stage 20 are suppressed, and the yield of the stage 20 is improved.

[0077] Furthermore, in this embodiment, the stage jig 10 can be replaced in accordance with the type of configuration of the stage 20, without changing the configuration of the grinding machine. Therefore, the yield of the stage 20 is improved, and the manufacturing cost of the stage 20 can be reduced.

[0078] The above-described embodiments of the present invention may be combined as appropriate as long as they are not mutually inconsistent. Furthermore, even if a person skilled in the art appropriately adds or deletes components or modifies the design based on each embodiment, the addition, deletion, or modification of components is included in the scope of the present invention as long as the gist of the present invention is maintained.

[0079] Furthermore, even if there are other effects and advantages different from those brought about by the above-mentioned embodiments, those that are clear from the description in this specification or that can be easily predicted by a person skilled in the art are naturally understood to be brought about by the present invention.

[0080] 10: Stage jig, 20: Stage, 30: Base, 100: Main body, 101: First surface, 102: Second surface, 103: Third surface, 110: Flow path, 111: Flow path inlet portion, 112: Flow path outlet portion, 120, 120A, 120B: Through hole, 120a: Thread groove, 120b: Groove, 130: Groove, 140: Screw, 200: Base material, 210: Thermal sprayed film, 220: Gas flow path, 230: Porous body, 240: Screw hole

Claims

1. A stage jig used in a process of processing a thermal sprayed film on a stage, comprising: a main body including a first surface on which the stage is placed, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface; a flow path provided inside the main body through which a fluid flows; a flow path inlet portion for allowing the fluid to flow into the flow path; a flow path outlet portion provided on the first surface of the main body and for allowing the fluid to flow out of the flow path; and a through hole penetrating the main body from the first surface to the second surface.

2. The stage jig according to claim 1, wherein the opening diameter of the through hole is larger than the opening diameter of the flow channel outlet portion.

3. The stage jig according to claim 1, further comprising a groove provided on said second surface and connected to said through hole.

4. A stage fixture as claimed in claim 3, wherein said groove extends to said third surface.

5. A stage jig as claimed in claim 1, wherein said flow path inlet portion is provided on said third surface.

6. The stage fixture according to claim 1, wherein the fluid is a gas.

7. The stage jig according to claim 1, wherein the stage and the main body are fastened together by inserting a screw into the through hole.

8. The stage fixture according to claim 1, wherein the fluid flowing out from the flow passage outlet is supplied to a gas flow passage provided in the stage.

9. The stage jig according to claim 1, wherein the first surface is covered with a protective member.

10. The stage jig according to claim 9, wherein the protective member is black in color.

11. A method for manufacturing a stage, comprising placing a substrate having a gas flow path formed therein, one end of the gas flow path being open at the bottom surface, a porous body embedded in the other end of the gas flow path at the top surface, and a sprayed film formed on the top surface so as to cover the porous body, on a stage jig in which a flow path for flowing a fluid is formed, and grinding away the sprayed film while supplying the fluid to the gas flow path through the flow path of the stage jig, to expose the porous body from the sprayed film.

12. A method for manufacturing a stage as described in claim 11, wherein the base material is placed on the stage jig so that the one end of the gas flow path and a flow path outlet portion of the flow path formed in the stage jig overlap each other.

13. The method of claim 11, wherein the fluid is a gas.

Citation Information

Patent Citations

  • Conduit for flow of heat conduction fluid to electrostatic chuck surface

    JP1998050813A

  • Electrostatic chuck

    JP2014209615A

  • Member for semiconductor manufacturing device

    JP2023106929A

  • Fiber-reinforced resin master batch, resin composition, method for producing fiber-reinforced resin master batch, and method for producing resin composition

    JP2023115611A

  • Stage, and method for manufacturing stage

    WO2020179539A1