Jig for stage and method for manufacturing stage

Abstract

This jig for a stage is used in the step of processing a thermal spray coating of the stage, and comprises: a body including a first surface on which the stage is placed, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface; a flow path provided inside the body and through which a fluid flows; a flow path entry portion allowing the fluid to flow into the flow path; a flow path exit portion provided on the first surface of the body and allowing the fluid to flow out of the flow path; and a through hole penetrating the substrate from the first surface to the second surface.

Description

Technical Field

[0001] One embodiment of the present invention relates to a jig for a stage used in the manufacturing process of a stage. Another embodiment of the present invention relates to a method for manufacturing a stage using the jig for a stage.

Background Art

[0002] Almost all electronic devices are equipped with semiconductor devices, which play an important role in the functions of electronic devices. A semiconductor device is a device that utilizes semiconductor characteristics possessed by silicon or the like. A semiconductor device is composed of a semiconductor film, an insulating film, and a conductive film laminated on a substrate, and these films are patterned. These films are laminated using a vapor deposition method, a sputtering method, a chemical vapor deposition (CVD) method, or a chemical reaction of the substrate, and these films are patterned by a photolithography process. The photolithography process includes formation of a resist on these films to be patterned, exposure of the resist, formation of a resist mask by development, partial removal of these films by etching, and removal of the resist mask.

[0003] The characteristics of the above-described films are greatly influenced by the conditions for forming the films or the conditions for etching the films. One of the conditions is the voltage applied to a mounting table (hereinafter referred to as a stage) for mounting the substrate. With the recent miniaturization of semiconductor devices, the ratio of the diameter of the hole to be processed to the thickness of the film to be processed has increased. Therefore, for example, the voltage applied to the stage included in an etching apparatus tends to increase. As the voltage applied to the stage increases, an improvement in the breakdown voltage of the members included in the stage is required. The members included in the stage are, for example, a cooling plate, an electrostatic chuck, and the like. Patent Documents 1 and 2 disclose a stage in which an insulating film (sprayed film) is formed on the surface by ceramic spraying, which is one of the spraying methods, to improve the breakdown voltage.

Prior Art Documents

Patent Documents

[0004] [Patent Document 1] Patent No. 6027407 [Patent Document 2] Registered Utility Model No. 2600558 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] Thermal spray coatings containing ceramics have low thermal conductivity, which can make it difficult to control the temperature of the substrate placed on the stage. Therefore, the stage is equipped with a gas channel, and the temperature of the substrate is controlled not only by a heater but also by the gas flowing through the gas channel (e.g., cooling gas). In this case, to prevent particles from entering the gas channel, a porous material exposed from the thermal spray coating is provided at the outlet of the gas channel.

[0006] However, in stages containing porous materials, quality defects occurred such as discoloration of the porous material or clogging of the porous material, resulting in reduced performance.

[0007] One embodiment of the present invention, in view of the above problems, aims to suppress defects in the quality of the porous material of a stage in the process of manufacturing a stage that includes a porous material exposed from a thermal spray coating. [Means for solving the problem]

[0008] A stage jig according to one embodiment of the present invention is a stage jig used in a process of processing a thermal spray coating on a stage, comprising: a body including a first surface on which the stage is placed, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface; a flow path provided inside the body through which fluid flows; a flow path inlet for the fluid to flow into the flow path; a flow path outlet provided on the first surface of the body for the fluid to flow out of the flow path; and from the first surface to the second surface Main unit It includes a through hole penetrating the [unclear].

[0009] The diameter of the through-hole may be larger than the diameter of the outlet of the flow path.

[0010] The stage fixture may further include a groove on the second surface that connects to a through hole. The groove may extend to a third surface.

[0011] The channel inlet may be located on the third surface.

[0012] The fluid may also be a gas.

[0013] By inserting a screw into the through hole, the stage and Main unit An agreement may be concluded.

[0014] The fluid discharged from the flow path outlet may be supplied to a gas flow path provided on the stage.

[0015] The first surface may be covered by a protective member. The protective member may be black.

[0016] A method for manufacturing a stage according to one embodiment of the present invention involves placing a substrate, which has a gas channel formed inside, with one end of the gas channel open at the bottom surface, a porous body embedded at the other end of the gas channel at the top surface, and a thermal spray coating formed on the top surface so as to cover the porous body, on a stage jig which has a fluid channel formed therein, grinding the thermal spray coating while supplying fluid to the gas channel through the channel of the stage jig, and exposing the porous body from the thermal spray coating.

[0017] The base material may be placed on the stage jig such that one end of the gas flow path and the outlet of the flow path formed in the stage jig overlap. [Effects of the Invention]

[0018] According to a stage jig of one embodiment of the present invention, in a stage that includes a porous body exposed from a thermal spray coating, it is possible to suppress defects in the quality of the porous body and improve the yield of the stage. [Brief explanation of the drawing]

[0019] [Figure 1] The perspective view of the jig for a stage according to an embodiment of the present invention. [Figure 2] The top view of the jig for a stage according to an embodiment of the present invention. [Figure 3] The bottom view of the jig for a stage according to an embodiment of the present invention. [Figure 4] The schematic cross-sectional view of the jig for a stage according to an embodiment of the present invention. [Figure 5] The schematic perspective view showing a modification example of the through-hole of the jig for a stage according to an embodiment of the present invention. [Figure 6] The schematic perspective view showing a modification example of the through-hole of the jig for a stage according to an embodiment of the present invention. [Figure 7] The schematic perspective view showing a modification example of the through-hole of the jig for a stage according to an embodiment of the present invention. [Figure 8] The perspective view showing the configuration of a stage manufactured using the jig for a stage according to an embodiment of the present invention. [Figure 9] The perspective view showing the configuration of a stage manufactured using the jig for a stage according to an embodiment of the present invention. [Figure 10] The flowchart showing the manufacturing method of a stage according to an embodiment of the present invention. [Figure 11] In the manufacturing method of a stage according to an embodiment of the present invention, it is a flowchart showing the step of thermal spraying film processing. [Figure 12] In the manufacturing method of a stage according to an embodiment of the present invention, it is a schematic cross-sectional view explaining the step of thermal spraying film processing. [Figure 13] In the manufacturing method of a stage according to an embodiment of the present invention, it is a schematic cross-sectional view explaining the step of thermal spraying film processing. [Figure 14] In the manufacturing method of a stage according to an embodiment of the present invention, it is a schematic cross-sectional view explaining the step of thermal spraying film processing.

Embodiments for Carrying Out the Invention

[0020] The embodiments of the invention disclosed in this application will be described below with reference to the drawings. However, the present invention can be implemented in various forms without departing from its spirit, and is not to be construed as being limited to the embodiments described below.

[0021] While drawings may schematically represent the width, thickness, shape, etc., of each part compared to the actual embodiment in order to clarify the explanation, they are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and drawings, components having the same function as those described with respect to previously shown figures may be denoted by the same reference numerals, and redundant explanations may be omitted.

[0022] In this invention, when a single film is processed to form multiple films, these multiple films may have different functions and roles. However, these multiple films originate from a single film formed as the same layer in the same process, and have the same layer structure and the same material. Therefore, these multiple films are defined as existing in the same layer.

[0023] [1. Configuration of the stage fixture] Referring to Figures 1 to 4, the configuration of the stage jig 10 according to one embodiment of the present invention will be described. As will be described in detail later, the stage jig 10 is a jig used for processing a thermal spray coating formed on a stage used in semiconductor devices and the like.

[0024] Figures 1 to 3 are perspective views, top views, and bottom views, respectively, of a stage jig 10 according to one embodiment of the present invention. Figure 4 is a schematic cross-sectional view of the stage jig 10 according to one embodiment of the present invention. The cross-sectional view of the stage jig 10 shown in Figure 4 is not an exact cross-sectional view corresponding to the stage jig 10 shown in Figures 1 to 3, but a schematic cross-sectional view of the stage jig 10 is shown in Figure 4 to make it easier to understand the internal structure of the stage jig 10.

[0025] The stage jig 10 includes a main body 100, the main body 100 having a flow path 110, a through hole 120, and a groove 130 formed therein.

[0026] [1-1. Configuration of the main unit 100] The main body 100 includes a first surface 101 on which the stage is placed, a second surface 102 opposite the first surface 101, and a third surface 103 connecting the first surface 101 and the second surface 102 (see Figures 1 to 3). The first surface 101, the second surface 102, and the third surface 103 are the top surface, bottom surface, and side surface, respectively. The main body 100 has a disc shape, but the shape of the main body 100 is not limited to this. The main body 100 may have an elliptical or polygonal shape. The main body 100 may be composed of one component or of multiple components. When the main body 100 is composed of multiple components, it may be a configuration in which multiple components having the same material are combined, or a configuration in which multiple components having different materials are combined. As the material of the main body 100, for example, metals such as aluminum alloy or stainless steel can be used, but the material of the main body 100 is not limited to these.

[0027] Although not shown in the diagram, a protective member may be provided on the first surface 101 of the main body 100. Since a stage is placed on the first surface 101, providing a protective member on the first surface 101 prevents the stage from being damaged. For example, masking tape can be used as the protective member. Furthermore, it is preferable that the protective member be black. If the protective member is black, it becomes easier to visually check for particles remaining on the protective member (for example, chips from the thermal spray coating).

[0028] [1-2. Configuration of the flow path 110] The flow path 110 is located inside the main body 100 (see Figure 4). A flow path inlet 111 is provided on the third surface 103, and a flow path outlet 112 is provided on the first surface 101. Fluid flows through the flow path 110. That is, the fluid flows in from the flow path inlet 111, flows through the flow path 110, and flows out from the flow path outlet 112. The cross-sectional shape of the flow path 110, the opening shape of the flow path inlet 111, and the opening shape of the flow path outlet 112 are, for example, circular, but are not limited to this. The cross-sectional shape of the flow path 110, the opening shape of the flow path inlet 111, and the opening shape of the flow path outlet 112 may be elliptical or polygonal. Furthermore, the cross-sectional shape of the flow path 110, the opening shape of the flow path inlet 111, and the opening shape of the flow path outlet 112 may be the same or different.

[0029] The main body 100 may have one flow path 110 or multiple flow paths 110. Here, multiple flow paths 110 refer to a configuration in which multiple flow paths 110 independently circulate fluid and are not connected to each other. When two flow paths are connected, they may be described as one flow path 110 for convenience.

[0030] The flow channel inlet 111 is connected to a fluid supply unit (for example, a compressor), and the fluid supplied from the fluid supply unit flows in through the flow channel inlet 111. The flow channel inlet 111 may be provided on a surface other than the third surface 103. If the main body 100 is larger than the stage, the flow channel inlet 111 can also be provided on the first surface 101. Furthermore, if a fluid supply unit is provided on the base of the processing machine that processes the thermal spray coating on the stage, the flow channel inlet 111 can also be provided on the second surface 102 to match the position of the fluid supply unit.

[0031] The third surface 103 of the main body 100 may have one flow channel inlet 111, or it may have multiple flow channel inlet 111s. If multiple flow channels 110 are provided inside the main body 100, multiple flow channel inlet 111s may be provided to correspond to the multiple flow channels 110. The number of flow channel inlet 111s may be the same as the number of flow channels 110, or it may be different. For example, if the number of flow channel inlet 111s is greater than the number of flow channels 110, one flow channel 110 with branches is provided inside the main body 100, and fluids flowing in from multiple flow channel inlet 111s circulate through the one flow channel 110 via the branches.

[0032] The flow path outlet portion 112 is provided on the first surface 101 such that when the stage is placed on the stage jig 10, the position of the open end of the gas flow path of the stage (hereinafter sometimes referred to as the "open end") corresponds to the position of the flow path outlet portion 112 (in other words, the open end of the gas flow path of the stage and the flow path outlet portion 112 overlap). If the stage is provided with multiple open ends of the gas flow path, it is preferable that the same number of flow path outlet portions 112 as the number of open ends of the gas flow path of the stage are provided on the first surface 101.

[0033] The fluid flowing through the channel 110 is, for example, a liquid such as water or a gas such as air, but it is preferably a gas. As will be explained in more detail later, if the fluid is a gas, the grinding fluid used in processing the thermal spray coating on the stage will not be diluted.

[0034] [1-3. Configuration of the through hole 120] The through-hole 120 is provided so as to penetrate the main body 100 from the first surface 101 to the second surface 102 (see Figures 2 and 3). Within the main body 100, the through-hole 120 is not connected to the flow path 110. The cross-sectional shape of the through-hole 120 is, for example, circular, but is not limited to this. The cross-sectional shape of the through-hole 120 may be elliptical or polygonal. Furthermore, the opening diameter of the through-hole 120 on the first surface 101 and the opening diameter of the through-hole 120 on the second surface 102 may be the same or different.

[0035] The main body 100 may have one through hole 120, or it may have multiple through holes 120. If the main body 100 has multiple through holes 120, the shape and size of the multiple through holes 120 may be the same or different.

[0036] The location of the through-holes 120 is not particularly limited, but it is preferable that some of the multiple through-holes 120 be located near the flow outlet 112. Furthermore, it is preferable that the opening diameters of the through-holes 120 on the first surface 101 and the through-holes 120 on the second surface 102 are larger than the opening diameter of the flow outlet 112.

[0037] Preferably, the through-hole 120 is configured to allow the insertion of a bolt or screw from the second surface 102. In this case, a step is provided on the inner wall of the through-hole 120, and the head of the screw is locked in the through-hole 120 by the step. The step may be provided so as to have a convex shape near the middle of the inner wall of the through-hole 120, and may be provided over the vicinity of the middle of the inner wall of the through-hole 120 so that the opening diameter of the through-hole 120 on the first surface 101 is different from the opening diameter of the through-hole 120 on the second surface 102. In the latter case, the opening diameter of the through-hole 120 on the first surface 101 is smaller than the opening diameter of the through-hole 120 on the second surface 102. The threaded portion of the screw is inserted into a screw hole provided in the stage and screwed in. As a result, the stage is fastened and fixed to the stage jig 10. Furthermore, since the stage jig 10 has a second surface 102 that rests on the base of a processing machine that processes the thermal spray coating of the stage, it is preferable that the screw heads are embedded in the through holes 120 without protruding from them. Also, if the main body 100 is provided with multiple through holes 120, it is not necessary for all of the multiple through holes 120 to be configured to allow screw insertion. It is sufficient if some of the multiple through holes 120 are configured to allow screw insertion.

[0038] The details of the function of the through-hole 120 in the stage jig 10 will be explained later in the section on the stage manufacturing method.

[0039] Here, with reference to Figures 5 to 7, modified examples of the through-hole 120, namely through-hole 120A, through-hole 120B, and through-hole 120C, will be described.

[0040] Figures 5 to 7 are schematic perspective views showing modified examples of the through-hole 120 of a stage jig according to one embodiment of the present invention. Specifically, Figures 5, 6, and 7 show... 7 The diagram shows top perspective views of the through holes 120A, 120B, and 120C, respectively, as viewed from the first surface 101 side of the stage jig 10.

[0041] In the through-hole 120A shown in Figure 5, a screw groove 120a is provided on the inner wall of the through-hole 120A. In this case, a screw inserted into the through-hole 120A from the second surface 102 is inserted into a screw hole provided in the stage, with the threaded portion engaging with the screw groove 120a of the through-hole 120A. By providing a screw groove 120a in the through-hole 120A, the stage can be firmly fixed to the stage jig 10. In addition, since the surface area inside the through-hole 120A increases, the gap inside the through-hole 120A also tends to increase.

[0042] In the through-hole 120B shown in Figure 6, the inner wall of the through-hole 120B is provided not only with a screw groove 120a but also with a groove 120b that runs in the direction of penetration of the through-hole 120B. That is, the direction of groove 120b intersects with the direction of screw groove 120a. The presence of groove 120b increases the gap within the through-hole 120B. For example, even when a screw is threaded into screw groove 120a, groove 120b can function as a flow path for fluid to flow from the first surface 101 to the second surface 102.

[0043] The through hole 120B shown in Figure 6 Groove 120b The top view shape is rectangular. However, the through hole 120B Groove 120bThe top view shape is not limited to this. For example, in the through hole 120C shown in Figure 7, a groove 120c with a curved side wall is provided. , Kan Through hole 120C Groove 120c The top view shape is semicircular. The through hole 120C can be formed using a rotary cutting tool such as a drill, making it easy to process. Thus, the through hole 120 can have various top view shapes, including variations such as through holes 120A to 120C.

[0044] [1-4. Structure of Groove 130] The groove 130 is provided on the second surface 102 of the main body 100 (see Figure 3). The groove 130 is connected to the through hole 120 and extends outward from the through hole 120 (towards the third surface 103). That is, the groove 130 is provided to connect the through hole 120 and the third surface 103. The groove 130 only needs to extend so that one end is connected to the third surface 103, and the other end of the groove 130 may extend beyond the through hole 120 to the center of the second surface 102. In other words, the groove 130 is provided so as to overlap the through hole 120. The groove 130 is not connected to the flow path 110. The groove 130 may extend in a straight line or in a curved line. Also, the width of the groove 130 in the direction perpendicular to the direction of extension may be the same or different. For example, the width of the portion of the groove 130 connected to the third surface 103 may be greater than the width of the portion of the groove 130 connected to the through hole 120. The cross-sectional shape of the groove 130 is, for example, rectangular, but is not limited to this. The cross-sectional shape of the groove 130 may be semicircular, semi-elliptical, or a polygonal shape other than rectangular. The depth of the groove 130 is not particularly limited.

[0045] Multiple grooves 130 may be provided corresponding to multiple through holes 120. That is, as shown in Figure 3, multiple through holes 120 each It is connected to multiple A groove 130 may be provided. However, multiple grooves 130 may be connected to each other.

[0046] The details of the function of the groove 130 in the stage jig 10 will be explained later in the section on the method for manufacturing the stage.

[0047] The configuration of the stage jig 10 has been described above, but the configuration of the stage jig 10 is not limited to the above configuration. The configuration of the stage jig 10 can be appropriately modified to match the configuration of the stage or the processing machine used to process the thermal spray coating on the stage.

[0048] [2. Stage 20 Structure] The stage jig 10 is used in one of the processes for manufacturing the stage 20. Before describing the manufacturing method of the stage 20, the configuration of the stage 20 will be described with reference to Figures 8 and 9.

[0049] Figures 8 and 9 are perspective views showing the configuration of a stage 20 manufactured using a stage jig 10 according to one embodiment of the present invention. Specifically, Figure 8 is a perspective view of the stage 20 viewed from the top, and Figure 9 is a perspective view of the stage 20 viewed from the bottom.

[0050] Stage 20 includes a base material 200, a thermal spray coating 210, a gas channel 220, a porous body 230, and screw holes 240.

[0051] The base material 200 has a structure in which two circular flat plate members of different sizes are joined together. The two flat plate members are joined together, for example, by brazing. As the material of the base material 200, metallic materials such as titanium, aluminum, or alloys thereof can be used. The base material 200 may also have three or more flat plate members joined together.

[0052] The thermal spray coating 210 is provided so as to cover the top and sides of the substrate 200. The thermal spray coating 210 is formed by thermal spraying a thermal spray material. As the thermal spray material, for example, a ceramic powder containing at least one element from alkaline earth metals, rare earth metals, aluminum, tantalum, and silicon can be used. In other words, the thermal spray coating 210 is a ceramic film. There is a portion of the top surface of the substrate 200 where the thermal spray coating 210 is not provided, and a porous body 230 is provided in that portion. That is, on the top surface of the substrate 200, the porous body 230 is not covered by the thermal spray coating 210 and is exposed from the thermal spray coating 210.

[0053] The gas passage 220 is located inside the base material 200. The gas passage 220 is provided to penetrate from the bottom surface to the top surface of the base material 200. One end of the gas passage 220 at the bottom surface of the base material 200 is open, and gas is supplied into the gas passage 220 from that end. On the other hand, the base material 200 top surface The other end of the gas channel 220 is closed by the porous body 230. That is, the gas channel 220 has an open end and a closed end including the porous body 230. However, the porous body 230 contains many pores and has a lower density than the thermal spray film 210. Therefore, the gas flowing through the gas channel 220 passes through the porous body 230 and is released to the outside. The closed end of the gas channel 220 is provided at one or more positions on the upper surface of the substrate 200, depending on the usage state of the semiconductor device on which the stage 20 is installed. Similarly, the open end of the gas channel 220 is provided at one or more positions on the bottom surface of the substrate 200.

[0054] As described above, the porous body 230 is provided so as to close the other end of the gas channel 220 on its upper surface (i.e., it is embedded in the closed end of the gas channel 220) and is exposed from the thermal spray coating 210. The closed end of the gas channel 220 including the porous body 230 can prevent particles from entering the gas channel 220 of the stage 20 when the stage 20 is used. The porous body 230 can be made of the same ceramic material as the thermal spray coating 210.

[0055] The screw holes 240 are provided on the bottom surface of the base material 200. When a screw is inserted into the screw holes 240 and screwed in, the stage 20 is fastened and fixed to the stage jig 10.

[0056] The above describes the configuration of Stage 20, but the configuration of Stage 20 is not limited to the configuration described above.

[0057] [3. How to create Stage 20] figure 10 ~Figure Referring to 14, a method for manufacturing a stage according to one embodiment of the present invention will be described. The stage jig 10 is used in one of the steps for manufacturing the stage 20.

[0058] figure Figure 10 is a flowchart showing a method for manufacturing a stage 20 according to one embodiment of the present invention. .figure The method for creating Stage 20, as shown in flowchart 10, includes four steps (steps S100, S200, S300, and S400). Steps S100 to S400 will be explained below in order.

[0059] Step S100 is a brazing process. For example, the base material 200 of the stage 20 is formed by joining multiple flat plate members by brazing. Grooves and through holes are formed in the flat plate members in advance. Therefore, when multiple flat plate members are joined together, the base material 200 is formed, and a gas flow path 220 is also formed within the base material 200.

[0060] Step S200 is a base material processing step. For example, chamfering can be performed to remove any brazing material remaining on the corners of the stepped areas of the base material 200. In addition, drilling can be performed to form screw holes 240 on the bottom surface of the base material 200.

[0061] Furthermore, in step S200, the porous body 230 is embedded in the other end of the gas channel 220 on the upper surface of the base material 200. At this time, the porous body 230 is not completely embedded in the other end of the gas channel 220, but is embedded so as to protrude from the upper surface of the base material 200.

[0062] Step S300 is a thermal spraying process. For example, a thermal spraying machine is used to spray thermal spray material onto the top and sides of the substrate 200, thereby forming a thermal spray film 210 on the top and sides of the substrate 200. In step S300, the thermal spray film 210 is formed so as to cover the porous body 230 that protrudes from the top surface of the substrate 200. That is, after step S300 is performed, the porous body 230 is not exposed from the thermal spray film 210.

[0063] Step S400 is the thermal spray coating process. The stage jig 10 is used in step S400. ,figure 11 ~Figure Refer to section 14 to describe step S400 in detail.

[0064] figure Figure 11 is a flowchart showing the process of thermal spray coating in a method for manufacturing a stage 20 according to one embodiment of the present invention. .figure 12 ~Figure 14 is a schematic cross-sectional view illustrating the process of thermal spray coating in a method for manufacturing a stage 20 according to one embodiment of the present invention. .figure The thermal spray coating process shown in flowchart 11 includes three steps (steps S410, S420, and S430). ,figure 12 ~Figure Steps S410 to S430 will be explained in order, referring to Section 14.

[0065] In step S410, the stage 20, on which the processes up to step S300 have been carried out, is placed on the stage jig 10. The stage 20 is placed on the stage jig 10 such that the open end of the gas flow path 220 of the stage 20 overlaps with the flow path outlet 112 of the flow path 110 of the stage jig 10. In other words, the bottom surface of the stage 20 and the first surface 101 of the stage jig 10 come into contact, and the gas flow path 220 of the stage 20 and the flow path 110 of the stage jig 10 are connected.

[0066] Furthermore, a screw 140 is inserted through the through hole 120 of the stage jig 10. The screw 140 is inserted into a screw hole 240 provided in the stage 20 and screwed in. In this way, the stage 20 is fastened and fixed to the stage jig 10.

[0067] Furthermore, the stage jig 10, which is fastened to the stage 20, is placed on the base 30 of the grinding machine.

[0068] In step S420, fluid is supplied to the stage jig 10. The fluid is supplied by a fluid supply device (not shown), and the fluid flows in from the inlet 111 of the flow path 110 of the stage jig 10. As will be described in detail later, grinding fluid is used in step S430, which will be described later. If the fluid is a gas, the grinding fluid will not be diluted and the grinding conditions will not change. For this reason, a gas such as air is preferable to a liquid such as water. For convenience, the following explanation will assume that the fluid is air.

[0069] Even though the stage 20 and the stage fixture 10 are fastened together, the space between the stage 20 and the stage fixture 10 is not completely sealed. Therefore, a gap exists between the stage 20 and the stage fixture 10. The thermal spray coating 210 is dense and compact. As a result, the thermal spray coating 210 covering the porous body 230 shields the air supplied to the gas channel 220 of the stage 20, and very little air is released to the outside from the closed end of the gas channel 220. When the pressure of the air supplied to the gas channel 220 of the stage 20 increases, the air flows into the gap without passing through the thermal spray coating 210. In other words, the air supplied from the stage fixture 10 passes through the gap and is released to the outside. Alternatively, as another air flow path, the air supplied from the stage fixture 10 passes through the gap, through the through-hole 120 and groove 130, and is released to the outside. In other words, the through-holes 120 and grooves 130 function as flow paths for excess air that flows in from the flow path inlet 111. In the stage jig 10, the air flow paths are secured by the through-holes 120 and grooves 130, making it easier to control the airflow.

[0070] Furthermore, in the through-hole 120A or through-hole 120B, which are variations of the through-hole 120, the gap within the through-hole 120A or through-hole 120B is increased, allowing air to circulate more easily through the through-hole 120A or through-hole 120B and enabling better control of the airflow.

[0071] As described above, excess air flowing out from the flow path outlet 112 flows into the gap and circulates through the through hole 120. For this reason, it is preferable that the through hole 120 is located near the flow path outlet 112. Furthermore, in order to allow excess air flowing out from the flow path outlet 112 to circulate through the through hole 120 into which the screw 140 is inserted, it is preferable that the opening diameter of the through hole 120 on the first surface 101 and the opening diameter of the through hole 120 on the second surface 102 are larger than the opening diameter of the flow path outlet 112.

[0072] In step S430, the thermal spray coating 210 of stage 20 is ground down. This removes the thermal spray coating 210 and the upper part of the porous body 230 that are covering the porous body 230, exposing the porous body 230 from the thermal spray coating 210. Although air is supplied to the gas passage 220 of stage 20, once the porous body 230 is exposed, the air flow path supplied from the stage jig 10 changes, and the air passes through the porous body 230 and is released to the outside. In other words, the porous body 230 is continuously supplied with air.

[0073] In grinding the thermal spray coating 210, a grinding fluid is used. Air passing through the porous body 230 can suppress the entry of the grinding fluid into the porous body 230. Therefore, even after step S430, it is difficult for grinding fluid to remain in the porous body 230. In addition, air passing through the porous body 230 can suppress the entry of chips generated by grinding the thermal spray coating 210 into the porous body 230. Therefore, even after step S430, it is difficult for chips to remain in the porous body 230.

[0074] Grinding fluid remaining in the porous material 230 can cause discoloration of the porous material. Furthermore, chips remaining in the porous material 230 can degrade its performance. In other words, the grinding fluid and chips remaining in the porous material 230 lead to poor quality of the porous material 230. Although cleaning of stage 20 is performed after step S430, even with cleaning, it is difficult to remove the grinding fluid and chips remaining in the porous material 230. It is also difficult to evaluate whether the grinding fluid and chips have been removed from the porous material 230.

[0075] In this embodiment, by using the stage jig 10, grinding fluid and chips are prevented from entering the porous body 230 in step S430. Therefore, grinding fluid and chips are less likely to remain in the porous body 230. Consequently, discoloration and performance degradation of the porous body 230 of the stage 20 can be prevented.

[0076] As explained above, by manufacturing the stage 20 using the stage jig 10, grinding fluid is less likely to remain in the porous body 230 of the stage 20, and discoloration of the porous body 230 can be prevented. In addition, chips are less likely to remain in the porous body 230 of the stage 20, and a deterioration in the performance of the porous body 230 can be prevented. Therefore, quality defects of the porous body of the stage 20 are suppressed, and the yield of the stage 20 is improved.

[0077] Furthermore, in this embodiment, the stage jig 10 can be replaced to match the type of stage 20 configuration without changing the configuration of the grinding machine. Therefore, the yield of the stage 20 can be improved, thereby reducing the manufacturing cost of the stage 20.

[0078] The embodiments described above as examples of the present invention can be combined and implemented as appropriate, insofar as they do not contradict each other. Furthermore, any additions, deletions, or design modifications made by those skilled in the art based on these embodiments are also included within the scope of the present invention, as long as they retain the essence of the present invention.

[0079] Furthermore, any effects or benefits other than those brought about by the embodiments described above, if they are clear from the description herein or easily predictable to those skilled in the art, are naturally understood to be brought about by the present invention. [Explanation of Symbols]

[0080] 10: Stage jig, 20: Stage, 30: Base, 100: Main body, 101: First surface, 102: Second surface, 103: Third surface, 110: Flow channel, 111: Flow channel inlet, 112: Flow channel outlet, 120, 120A, 120B: Through hole, 120a: Screw groove, 120b: Groove, 130: Groove, 140: Screw, 200: Base material, 210: Thermal spray coating, 220: Gas flow channel, 230: Porous material, 240: Screw hole

Claims

1. A stage jig used in a process of processing a thermal sprayed film on a stage, comprising: a main body including a first surface on which the stage is placed, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface; a flow path provided inside the main body through which a fluid flows; a flow path inlet portion for allowing the fluid to flow into the flow path; a flow path outlet portion provided on the first surface of the main body and for allowing the fluid to flow out of the flow path; and a through hole penetrating the main body from the first surface to the second surface.

2. The stage jig according to claim 1, wherein the opening diameter of the through hole is larger than the opening diameter of the flow channel outlet portion.

3. The stage jig according to claim 1, further comprising a groove provided on said second surface and connected to said through hole.

4. A stage fixture as claimed in claim 3, wherein said groove extends to said third surface.

5. A stage jig as claimed in claim 1, wherein said flow path inlet portion is provided on said third surface.

6. The stage fixture according to claim 1, wherein the fluid is a gas.

7. The stage jig according to claim 1, wherein the stage and the main body are fastened together by inserting a screw into the through hole.

8. The stage fixture according to claim 1, wherein the fluid flowing out from the flow passage outlet is supplied to a gas flow passage provided in the stage.

9. The stage jig according to claim 1, wherein the first surface is covered with a protective member.

10. The stage jig according to claim 9, wherein the protective member is black in color.

11. A method for manufacturing a stage, comprising placing a substrate having a gas flow path formed therein, one end of the gas flow path being open at the bottom surface, a porous body embedded in the other end of the gas flow path at the top surface, and a sprayed film formed on the top surface so as to cover the porous body, on a stage jig in which a flow path for flowing a fluid is formed, and grinding away the sprayed film while supplying the fluid to the gas flow path through the flow path of the stage jig, to expose the porous body from the sprayed film.

12. A method for manufacturing a stage as described in claim 11, wherein the base material is placed on the stage jig so that the one end of the gas flow path and a flow path outlet portion of the flow path formed in the stage jig overlap each other.

13. The method of claim 11, wherein the fluid is a gas.