Exposure apparatus

Abstract

This exposure apparatus exposes a pattern onto a substrate. The exposure apparatus comprises a holder that holds the substrate or a mask on which the pattern is formed, an X-ray ionizer that emits X-rays and removes static electricity built up on the mask or the substrate, a shutter that shields the mask or the substrate from irradiation with the X-rays, and a first control unit that controls the opening and the closing of the shutter. The first control unit controls the shutter to open at a moment in time when the mask or the substrate is moving relative to the holder.

Description

exposure equipment

[0001] This relates to an exposure device.

[0002] In the photolithography process for manufacturing semiconductor elements, liquid crystal display elements, etc., a step-and-repeat projection exposure apparatus (a so-called stepper) or a step-and-scan projection exposure apparatus (a so-called scanning stepper (also called a scanner)) is mainly used to transfer a pattern formed on a mask or reticle onto a glass substrate or wafer, etc., via a projection optical system.

[0003] In such an exposure apparatus, various countermeasures against static electricity have been taken to remove static electricity that has accumulated on the substrate (for example, see Japanese Patent Application Laid-Open No. 2003-144998).

[0004] Japanese Patent Application Laid-Open No. 2000-21726

[0005] According to a first aspect of the disclosure, the exposure apparatus is an exposure apparatus that exposes a pattern onto a substrate, and includes a holding unit that holds a mask or the substrate on which the pattern is formed, an X-ray ionizer that emits X-rays and removes static electricity charged on the mask or the substrate, a shutter that blocks the X-rays from being irradiated onto the mask or the substrate, and a first control unit that controls the opening and closing of the shutter, wherein the first control unit controls the opening of the shutter at a timing when the mask or the substrate moves relative to the holding unit.

[0006] The configurations of the embodiments described below may be modified as appropriate, and at least a portion of the configuration may be replaced with other components. Furthermore, components that are not particularly limited in terms of their placement may be placed in any position that can achieve their function, not limited to the placement disclosed in the embodiments.

[0007] FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus according to an embodiment. FIG. 2 is a schematic diagram showing the configuration of a static elimination unit. FIGS. 3A and 3B are diagrams showing the time change in output of a soft X-ray ionizer and the static elimination period. FIG. 4 is a timing chart for explaining control when the soft X-ray ionizer is not housed in a housing. FIGS. 5A and 5B are timing charts for explaining another example of control when the soft X-ray ionizer is not housed in a housing. FIG. 6 is a timing chart for explaining control in this embodiment. FIG. 7 is a schematic diagram showing the configuration of the housing of a static elimination unit according to a modified example.

[0008] An exposure apparatus EX according to one embodiment will be described with reference to Figures 1 to 6. Figure 1 is a diagram that shows schematically the configuration of an exposure apparatus EX according to one embodiment.

[0009] The exposure apparatus EX is used, for example, when manufacturing an organic EL display, to form a TP (Touch Panel) circuit or a CF (Color Filter) circuit on the upper surface of a substrate P. The substrate P is, for example, a glass plate on which TFTs (Thin Film Transistors) are formed by vapor deposition or the like and then sealed, but is not limited to this.

[0010] The exposure apparatus EX includes an exposure main body 100 and a box-shaped, highly airtight chamber CMB installed on a floor F. The chamber CMB has an opening OPN, and an opening / closing part SH that covers the opening OPN is provided in the opening OPN. The opening / closing part SH is, for example, a shutter or a door, and moves, for example, in the direction of arrow AR3 to open and close the opening OPN.

[0011] The exposure main body 100 includes an illumination system 112, a mask stage 114 that holds a mask M on which a circuit pattern or the like is formed, a projection optical system 116, an optical base 118, a substrate stage device 120 that holds a substrate P, a discharge unit 200, and a control device CNT.

[0012] In the following description, the direction in which the mask M and the substrate P are scanned relative to the projection optical system 116 during exposure will be referred to as the X-axis direction, the direction perpendicular to the X-axis in the horizontal plane as the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis as the Z-axis direction, and the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis will be referred to as the θx, θy, and θz directions, respectively.

[0013] The illumination system 112 has a configuration similar to that of the illumination system disclosed in, for example, U.S. Patent No. 5,729,331, etc. The illumination system 112 irradiates the mask M with light emitted from a light source (e.g., a mercury lamp) (not shown) as exposure illumination light (illumination light) IL via a reflecting mirror, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, etc. (not shown).

[0014] The mask stage 114 holds a light-transmitting mask M. The mask stage 114 drives the mask M by a predetermined stroke in the X-axis direction (scanning direction) relative to the illumination system 112 (illumination light IL) via a drive system (not shown) including, for example, a linear motor, and also drives the mask M slightly in the Y-axis direction and the θz direction. Position information of the mask M in the horizontal plane is obtained by a mask stage position measurement system (not shown) including, for example, a laser interferometer or an encoder.

[0015] The projection optical system 116 is disposed below the mask stage 114. The projection optical system 116 is a so-called multi-lens projection optical system having a configuration similar to that of the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775, and includes, for example, a plurality of optical systems that form an erect, normal image in a double-telecentric, equal-magnification system.

[0016] In the exposure main body 100, when an illumination area on the mask M is illuminated by illumination light IL from the illumination system 112, the illumination light that has passed through the mask M forms a projected image (partial erect image) of the circuit pattern of the mask M within that illumination area via the projection optical system 116 in an illumination light irradiation area (exposure area) that is conjugate to the illumination area on the substrate P. Then, as the mask M moves relative to the illumination area (illumination light IL) in the scanning direction and the substrate P moves relative to the exposure area (illumination light IL) in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to that shot area.

[0017] The optical surface plate 118 supports the mask stage 114 and the projection optical system 116 .

[0018] The substrate stage device 120 is used to position the substrate P with high precision relative to the projection optical system 116 (illumination light IL), and includes a substrate holder 121 that holds the substrate P, and a substrate stage 122 .

[0019] The substrate stage 122 is driven by a drive device (not shown) at a predetermined stroke along a horizontal plane (X-axis direction and Y-axis direction), and is also finely driven in six degrees of freedom. The configuration of the substrate stage device 120 is not particularly limited, but it is preferable to use a stage device with a so-called coarse / fine movement configuration, which includes a gantry-type two-dimensional coarse movement stage and a fine movement stage that is finely driven relative to the two-dimensional coarse movement stage, as disclosed in, for example, Japanese Patent Laid-Open No. 2004-14915 or U.S. Patent Application Publication No. 2012 / 0057140.

[0020] An X-movable mirror (bar mirror) 124X having a reflective surface perpendicular to the X-axis is fixed to the -X-side side of the substrate stage 122, and a Y-movable mirror (not shown) having a reflective surface perpendicular to the Y-axis is fixed to the +Y-side side.

[0021] First and second laser interferometers (not shown) are attached to the optical surface plate 118 to measure the position in the X-axis direction and the Y-axis direction, respectively, of a substrate holder 121 that holds the substrate P.

[0022] The first laser interferometer irradiates a measurement beam onto X movable mirror 124X and an X fixed mirror (not shown) that is fixed near projection optical system 116. The first laser interferometer measures position information of substrate holder 121 in the X axis direction using the position of the X fixed mirror as a reference.

[0023] The second laser interferometer also irradiates a measurement beam onto a Y movable mirror (not shown) and a Y fixed mirror (not shown) fixed near the projection optical system 116. The second laser interferometer measures position information of the substrate holder 121 in the Y axis direction using the position of the Y fixed mirror as a reference.

[0024] The control device CNT drives the substrate stage 122 based on the position information (including rotation information (yawing amount (rotation amount θz in the θz direction), pitching amount (rotation amount θy in the θy direction), and rolling amount (rotation amount θx in the θx direction))) of the substrate stage 122 in the XY plane measured by the first laser interferometer and the second laser interferometer.

[0025] In the exposure main body 100, alignment measurement (e.g., EGA, etc.) is performed prior to exposure, and the results are used to expose the substrate P in the following procedure. First, the mask stage 114 and the substrate stage 122 are synchronously driven in the X-axis direction in accordance with instructions from a control device (not shown). This performs scanning exposure on the first shot area on the substrate P. When scanning exposure on the first shot area is completed, the control device (not shown) moves (steps) the substrate stage 122 to a position corresponding to the second shot area. Then, scanning exposure is performed on the second shot area. The control device (not shown) similarly repeats stepping between shot areas on the substrate P and scanning exposure on the shot areas to transfer the pattern of the mask M to all shot areas on the substrate P.

[0026] After the exposure process is completed, when the exposed substrate P placed on the substrate holder 121 is removed (separated, peeled off) from the substrate holder 121, static electricity is likely to build up on the substrate P. If the static electricity charged on the substrate P is discharged, there is a risk that devices such as TFTs formed on the substrate P will be destroyed by the discharge phenomenon. For this reason, the exposure main body 100 is provided with a static elimination unit 200 to remove static electricity charged on the substrate P. Note that in this embodiment, even when the substrate P before exposure is mounted on the substrate holder 121, the static elimination unit 200 eliminates static electricity charged on the substrate P.

[0027] 2 is a schematic diagram showing the configuration of the static elimination unit 200. The static elimination unit 200 includes a soft X-ray ionizer 201 that emits soft X-rays, and a housing 210 that houses the soft X-ray ionizer 201.

[0028] The soft X-ray ionizer 201 emits a light having a wavelength of 1.3×10 －４ ~4.1 × 10 －４ This static electricity removal device uses soft X-rays, which are light beams with a wavelength of 1 μm. The ionizing effect of the soft X-rays generates a high concentration of ions in the space within the irradiation range, thereby instantly removing static electricity from a charged object. When soft X-rays are emitted from the soft X-ray ionizer 201, electrons are ejected from stable atoms and molecules in and around the soft X-ray optical path, generating positive ions. The ejected electrons then attach to stable atoms and molecules, generating negative ions. Since the positive and negative ions generated in this even balance are generated in the area where the soft X-rays are irradiated and all around the optical path, the positive or negative ions generated near the substrate P absorb the charge on the substrate P and neutralize it. Meanwhile, the other generated ions return to their original stable state.

[0029] The housing 210 has an opening 210a that transmits the soft X-rays emitted by the soft X-ray ionizer 201, and a shutter 210b that covers the opening 210a. The housing 210 is made of a material that does not transmit the soft X-rays.

[0030] Like the housing 210, the shutter 210b is also made of a material that is opaque to soft X-rays. In this embodiment, the shutter 210b moves in the direction of arrow AR1 to open and close the opening 210a. When the shutter 210b covers (closes) the opening 210a, the substrate P is blocked from being irradiated with soft X-rays. In other words, the shutter 210b functions as a shielding member that blocks the substrate P from being irradiated with soft X-rays.

[0031] The opening and closing of the shutter 210b is controlled by the control device CNT. The control device CNT opens the opening 210a of the housing 210 so that soft X-rays can be irradiated onto the substrate P during the period in which static electricity charged on the substrate P is being removed. Specifically, the control device CNT controls the shutter 210b to open, thereby opening the opening 210a, at the timing when the substrate P is peeled off from the substrate holder 121 (the timing when the substrate P moves relative to the substrate holder 121). This allows soft X-rays to be irradiated onto the substrate P. When the period for removing static electricity charged on the substrate P has ended, the control device CNT closes the opening 210a with the shutter 210b.

[0032] The on / off of the soft X-ray ionizer 201 is controlled by the control device CNT. The control device CNT turns on the soft X-ray ionizer 201 before the timing to start removing static electricity. More specifically, the control device CNT turns on the soft X-ray ionizer 201 a predetermined time before the timing to start removing static electricity so that the output of the soft X-ray ionizer 201 becomes a predetermined output at the timing to start removing static electricity. The predetermined output is, for example, maximum output (100%) or an output that can be stably obtained by turning on the soft X-ray ionizer 201. Generally, soft X-ray ionizers are controlled only by on / off and the output level cannot be adjusted. However, if the output level of the soft X-ray ionizer 201 can be adjusted, the output of the soft X-ray ionizer 201 does not necessarily have to be maximum output (100%). For example, the predetermined output may be 98% output. The predetermined output may be any output that removes static electricity charged on substrate P to a predetermined value or less within the time (discharge period) that substrate P is irradiated with soft X-rays. The discharge period can be adjusted in relation to the takt time or plate processing time. If the output of the soft X-ray ionizer 201 is insufficient, the takt time or plate processing time can be extended to ensure a long discharge period, thereby discharging substrate P to an appropriate level. Therefore, the soft X-ray ionizer 201 may have an output that can remove static electricity charged on substrate P to an acceptable level within an acceptable takt time or plate processing time. Note that the following description will be given assuming that the predetermined output is the maximum output.

[0033] 3A and 3B are diagrams showing the change over time in the output of the soft X-ray ionizer 201 and the static elimination period P1. In Fig. 3A, when the soft X-ray ionizer 201 is turned on at time T1, the output of the soft X-ray ionizer 201 gradually increases over time and reaches a maximum output at time T2.

[0034] Here, the period for removing static electricity charged on the substrate P is designated as P1. As shown in FIG. 3A, if the soft X-ray ionizer 201 is turned on at the start of period P1, there is a period (between time T1 and time T2) during which the output is not at maximum output, and therefore there is a risk that the static electricity charged on the substrate P will not be sufficiently removed.

[0035] Therefore, as shown in FIG. 3B, in order to maximize the output of the soft X-ray ionizer 201 from the start of the period P1, it is conceivable to turn on the soft X-ray ionizer 201 at time T3, which is a predetermined time before the period P1, and start neutralization at time T4 when the output reaches the maximum.

[0036] FIG. 4 is a timing chart showing an example of control performed in the exposure apparatus EX when the soft X-ray ionizer 201 is not housed in the housing 210.

[0037] 4 shows a case where the soft X-ray ionizer 201 is turned off while the opening / closing part SH of the chamber CMB is open. As shown in Fig. 4, the opening / closing part SH is open while the exposed substrate P is being carried out of the chamber CMB and the unexposed substrate P is being carried into the chamber CMB (t10 to t11). If the soft X-ray ionizer 201 is turned on at this time, there is a risk that soft X-rays will leak out of the chamber CMB, so the soft X-ray ionizer 201 is turned off.

[0038] Then, at time t11, when the loading of the pre-exposure substrate P into the chamber CMB is completed, the opening / closing part SH is closed and the soft X-ray ionizer 201 is turned on. Then, when the substrate P is mounted on the substrate holder 121, a process of removing static electricity from the substrate P is carried out (t11 to t12). At this time, the output of the soft X-ray ionizer 201 gradually increases from time t11 and reaches its maximum output, but there is a period during the removal period (t11 to t12) when the output is not at its maximum output. Therefore, there is a risk that the static electricity on the substrate P will not be removed sufficiently.

[0039] After the exposure process, a process of removing static electricity from substrate P is also performed when substrate P is removed from substrate holder 121 (t13 to t14). Because soft X-ray ionizer 201 remains on during the exposure period, soft X-rays can be irradiated onto substrate P with maximum output when static elimination begins.

[0040] The exposed substrate P is removed from the substrate holder 121 and then carried out of the chamber CMB. At time t14, the opening / closing part SH of the chamber CMB is opened in order to carry the exposed substrate P out of the chamber CMB and to carry the unexposed substrate P into the chamber CMB. At this time, if the soft X-ray ionizer 201 is in the on state, there is a risk that soft X-rays will leak out of the chamber CMB, so the soft X-ray ionizer 201 is turned off.

[0041] In this way, if the soft X-ray ionizer 201 is turned off while the opening / closing part SH of the chamber CMB is open, there is a period during the charge removal period after the substrate P is unloaded / loaded in during which the output of the soft X-ray ionizer 201 is not at maximum output, which may result in insufficient charge removal.

[0042] 5A and 5B are timing charts showing another example of control performed in the exposure apparatus EX when the soft X-ray ionizer 201 is not housed in the housing 210. Figures 5A and 5B show a case where the soft X-ray ionizer 201 is turned on in advance so that the output of the soft X-ray ionizer 201 reaches its maximum output when the neutralization process starts.

[0043] First, the case of Fig. 5(A) will be described. In the control shown in Fig. 5(A), in order to maximize the output of the soft X-ray ionizer 201 when the static elimination process of the substrate P mounted on the substrate holder 121 is started (time t22), the soft X-ray ionizer 201 is turned on at time t21 during the period (time t20 to time t22) in which the opening / closing part SH of the chamber CMB is open. As a result, the output of the soft X-ray ionizer 201 becomes the maximum output when static elimination of the substrate P starts (time t22), and therefore the static electricity charged on the substrate P can be sufficiently eliminated.

[0044] 5A, however, the soft X-ray ionizer 201 is turned on while the opening / closing part SH of the chamber CMB is open, which may cause soft X-rays to leak from the chamber CMB. In this case, an area larger than the chamber CMB must be set as the X-ray controlled area, which makes it difficult to manage workers who enter the X-ray controlled area.

[0045] 5B, the soft X-ray ionizer 201 is turned on at time t31 when the opening / closing part SH of the chamber CMB is closed to prevent soft X-rays from leaking out of the chamber CMB, and the neutralization process is started at time t32 when the output of the soft X-ray ionizer 201 reaches its maximum output. However, in this case, a waiting time occurs until the output of the soft X-ray ionizer 201 reaches its maximum output, which reduces the throughput of the entire exposure apparatus EX.

[0046] Therefore, in this embodiment, the soft X-ray ionizer 201 is housed in the housing 210 so as to be able to sufficiently remove static electricity from the substrate P while preventing a decrease in productivity and an expansion of the X-ray controlled area.

[0047] In this embodiment, the soft X-ray ionizer 201 is turned on in advance or is always turned on so that its output reaches the maximum output at the start of the static elimination period P1.

[0048] FIG. 6 is a timing chart showing an example of control in the exposure apparatus EX according to this embodiment.

[0049] 6 , the opening / closing part SH is open while the exposed substrate P is being unloaded from the chamber CMB and the unexposed substrate P is being loaded into the chamber CMB (time t0 to time t2). The control device CNT turns on the soft X-ray ionizer 201 at time t1 during the period (time t0 to time t2) when the substrate P is being loaded and unloaded. The control device CNT turns on the soft X-ray ionizer 201 a predetermined time before the timing to start removing static electricity so that the output of the soft X-ray ionizer 201 reaches its maximum output at the timing to start removing static electricity from the substrate P mounted on the substrate holder 121. Here, the predetermined time is, for example, the time required for the soft X-ray ionizer 201 to reach its maximum output after being turned on.

[0050] Furthermore, control device CNT covers opening 210a of housing 210 with shutter 210b while substrate P is being carried in and out (time t0 to time t2).

[0051] Then, when the static elimination process for the substrate P mounted on the substrate holder 121 is started (time t2), the control device CNT controls the shutter 210b to open, thereby opening the opening 210a of the housing 210. As a result, the soft X-rays are irradiated onto the substrate P at maximum output, so that the static electricity charged on the substrate P can be sufficiently eliminated.

[0052] When the exposure process is started, the control device CNT closes the shutter 210b to cover the opening 210a of the housing 210 (time t3). Note that the control device CNT may keep the shutter 210b open, leaving the opening 210a of the housing 210 open.

[0053] After the exposure process is completed, when the substrate P is to be peeled (separated) from the substrate holder 121 (time t4), the control device CNT controls the shutter 210b to open, thereby opening the opening 210a of the housing 210. As a result, the soft X-rays are irradiated onto the substrate P with maximum output, and therefore static electricity charged on the substrate P can be sufficiently removed.

[0054] When the process of removing static electricity from the substrate P is completed (time t5), the control device CNT closes the shutter 210b, and the shutter 210b covers the opening 210a of the housing 210. This confines the soft X-rays within the housing 210. Thereafter, the opening / closing part SH of the chamber CMB is opened, and the exposed substrate P is unloaded and the unexposed substrate P is loaded.

[0055] In the exposure apparatus EX according to this embodiment, while the opening OPN of the chamber CMB is open, the opening 210a of the housing 210 is closed, and the soft X-rays are confined within the housing 210, so that the soft X-rays do not leak out of the chamber CMB. Also, while the opening 210a of the housing 210 is open, the opening OPN of the chamber CMB is closed. Therefore, an X-ray controlled area can be set within the chamber CMB.

[0056] Furthermore, the soft X-ray ionizer 201 has a maximum output when neutralization starts (time t2, time t4). Since soft X-rays with a maximum output (for example, 100% output) can be irradiated onto the substrate P, static electricity charged on the substrate P can be sufficiently neutralized.

[0057] Furthermore, in the exposure apparatus EX, while the opening 210a of the housing 210 is closed, the soft X-rays are confined within the housing 210, and the opening / closing part SH of the chamber CMB can be opened and closed freely, thereby suppressing a decrease in productivity.

[0058] In this way, in the exposure apparatus EX, the soft X-ray ionizer 201 is housed in a housing 210 having an opening 210a and a shutter 210b that opens and closes the opening 210a, so that the substrate P can be sufficiently de-electrified while preventing the expansion of the X-ray controlled area and a decrease in productivity.

[0059] 6, the soft X-ray ionizer 201 may be turned off at the start of the exposure process (time t5) and then turned on a predetermined time before time t4 when the next charge removal process is started. By doing so, it is possible to reduce power consumption more than in the case of FIG.

[0060] As explained in detail above, according to this embodiment, the exposure apparatus EX comprises the substrate holder 121 that holds the substrate P, the soft X-ray ionizer 201 that emits soft X-rays and removes static electricity that has accumulated on the substrate P, the shutter 210b that blocks the soft X-ray irradiation of the substrate P, and the control device CNT that controls the opening and closing of the shutter 210b. The control device CNT controls the shutter 210b to open at the timing when the substrate P is peeled off (separated) from the substrate holder 121. This makes it possible to shorten the soft X-ray irradiation time compared to when the shutter 210b is always controlled to be open, and therefore the time over which soft X-ray control is required in an X-ray controlled area can be shortened.

[0061] Furthermore, in this embodiment, the control device CNT controls the on / off of the soft X-ray ionizer 201, and turns on the soft X-ray ionizer 201 before the timing at which the shutter 210b is controlled to open. This allows the substrate P to be irradiated with soft X-rays of a higher output than when the soft X-ray ionizer 201 is turned on at the timing at which the shutter 210b is controlled to open, and therefore static electricity charged on the substrate P can be removed more efficiently than when the soft X-ray ionizer 201 is turned on at the timing at which the shutter 210b is controlled to open.

[0062] Furthermore, in this embodiment, the control device CNT turns on the soft X-ray ionizer 201 a predetermined time before the timing at which the shutter 210b is controlled to open so that the soft X-ray ionizer 201 is at maximum output at the timing at which the shutter 210b is controlled to open. This allows the substrate P to be irradiated with soft X-rays at maximum output, and therefore static electricity charged on the substrate P can be removed in a shorter time than when soft X-rays with an output less than the maximum output are irradiated.

[0063] Furthermore, in this embodiment, the exposure apparatus EX includes a housing 210 that houses the soft X-ray ionizer 201 and has an opening 210a that transmits soft X-rays, and a shutter 210b is provided in the housing 210 to open and close the opening 210a that transmits soft X-rays. As a result, when the shutter 210b is closed, the soft X-rays can be confined within the housing 210.

[0064] Furthermore, in this embodiment, the exposure apparatus EX is equipped with a chamber CMB that houses an exposure device main body 100 that exposes the substrate P, and an opening / closing unit SH that opens and closes an opening OPN provided in the chamber CMB, and the control device CNT closes the opening 210a of the housing 210 with a shutter 210b to prevent soft X-rays from leaking from the housing 210 while the opening OPN of the chamber CMB is open. While the opening / closing unit SH of the chamber CMB is open, the opening 210a of the housing 210 is closed, and the soft X-rays are confined within the housing 210, so that the soft X-rays do not leak out of the chamber CMB. Therefore, an X-ray controlled area can be set within the chamber CMB.

[0065] In the above embodiment, the opening 210a is opened and closed by moving the shutter 210b in the direction of the arrow AR1 in Fig. 2, but this is not limited to this. Fig. 7 is a diagram showing a modified example of the housing 210 of the static removal unit 200. As shown in Fig. 7, the shutter 210b may be rotated in the direction of the arrow AR2 around the rotation axis 210c, for example, to open and close the opening 210a.

[0066] Furthermore, in the above embodiment, an example has been described in which the static elimination unit 200 eliminates static electricity that has accumulated on the substrate P when the substrate P is peeled off from the substrate holder 121, but the static elimination unit 200 may also eliminate static electricity that has accumulated on the mask M when the mask M mounted on the mask stage 114 is peeled off from the mask stage 114. In this case, the static elimination unit 200 may be provided near the mask stage 114.

[0067] Furthermore, in the above embodiment, the soft X-ray ionizer 201 is housed in the housing 210, but as long as the soft X-rays can be prevented from leaking to the outside while being shielded, the soft X-ray ionizer 201 does not have to be housed in the housing 210. For example, a shutter 210b may be attached to the emission port of the soft X-ray ionizer 201 so that the emission port is completely blocked when the shutter 210b is closed. Furthermore, in the above embodiment, the entire soft X-ray ionizer 201 is housed in the housing 210, but the housing 210 may house only a part of the soft X-ray ionizer.

[0068] Furthermore, in the above embodiment and its modified examples, the exposure apparatus EX has been described as an exposure apparatus that uses a mask M, but the exposure apparatus EX may also be a so-called maskless exposure apparatus that forms a pattern using, for example, a spatial light modulator instead of a mask M.

[0069] In the above embodiment and its modifications, the exposure apparatus has been described as being used to manufacture liquid crystal display devices (flat panel displays), but the exposure apparatus may also be used to manufacture semiconductors by exposing silicon wafers.

[0070] The above-described embodiment is a preferred example of the present invention, but the present invention is not limited to this and can be modified in various ways without departing from the spirit of the present invention.

[0071] 100 Exposure main body 114 Mask stage 121 Substrate holder 201 Soft X-ray ionizer 210 Housing 210a Opening 210b Shutter EX Exposure device CNT Control device CMB Chamber M Mask OPN Opening P Substrate SH Opening / closing part

Claims

1. An exposure apparatus for exposing a pattern onto a substrate, A holding portion for holding a mask or substrate on which the pattern is formed, An X-ray ionizer that emits X-rays to remove static electricity charged on the mask or the substrate, A shutter that shields the X-ray irradiation of the mask or the substrate, A first control unit that controls the opening and closing of the shutter, Equipped with, The first control unit controls the opening of the shutter at the timing when the mask or the substrate moves relative to the holding part. Exposure apparatus.

2. The first control unit controls the opening of the shutter at the timing when the mask or the substrate separates from the holding unit. The exposure apparatus according to claim 1.

3. The system includes a second control unit that controls the on / off state of the X-ray ionizer, The second control unit turns on the X-ray ionizer before the timing at which the first control unit controls the shutter to open. The exposure apparatus according to claim 1 or 2.

4. The second control unit turns on the X-ray ionizer a predetermined time before the timing at which the first control unit controls the shutter to open, so that the X-ray ionizer has a predetermined output at the timing at which the first control unit controls the shutter to open. The exposure apparatus according to claim 3.

5. The predetermined time is the time required from the time the X-ray ionizer is turned on until the predetermined output is reached. The exposure apparatus according to claim 4.

6. The predetermined output is the maximum output of the X-ray ionizer. The exposure apparatus according to claim 4.

7. The predetermined output is an output that removes the static electricity accumulated on the substrate during the time the substrate is irradiated with the X-rays to a predetermined value or less. The exposure apparatus according to claim 4.

8. The housing comprises the aforementioned X-ray ionizer and has an opening through which the X-rays pass, The shutter is provided in the housing to open and close the aperture through which the X-rays pass. The exposure apparatus according to claim 1 or 2.

9. A chamber housing an exposure unit for exposing the aforementioned substrate, An opening / closing mechanism for opening and closing an opening provided in the chamber, Equipped with, The first control unit closes the opening of the housing with the shutter so as not to leak the X-rays from the housing while the opening of the chamber is open. The exposure apparatus according to claim 8.