Material selection assistance device, method for manufacturing circuit board, circuit board core, and circuit board

JPWO2025075181A1Undetermined Publication Date: 2025-04-10

Patent Information

Authority / Receiving Office: JP · JP
Patent Type: Applications
Filing Date: 2024-10-04
Publication Date: 2025-04-10

AI Technical Summary

Technical Problem

It is challenging to select a circuit board core with appropriate physical properties that match the substrate of a semiconductor package, which is essential for improving solder reliability due to differences in thermal expansion coefficients and elastic moduli.

Method used

A material selection support device is developed, which includes a relationship estimating unit, a reception unit, a reliability estimating unit, and a calculation unit. This device estimates the correspondence between the thermal expansion coefficient and elastic modulus of the circuit board core and the circuit board, accepts the thermal expansion coefficient of the substrate, estimates the solder reliability, and calculates the range of combinations for the circuit board core that ensures reliability equal to or greater than a predetermined value.

Benefits of technology

The device effectively supports the selection of materials for the circuit board core that enhance solder reliability by identifying the appropriate range of thermal expansion coefficient and elastic modulus combinations, thereby improving the bonding reliability between the substrate and the circuit board.

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Abstract

A relationship estimation unit (32) estimates a correspondence relationship between a combination of a coefficient of thermal expansion and an elastic modulus of a circuit board core and a combination of a coefficient of thermal expansion and an elastic modulus of a circuit board using the circuit board core. A reception unit (34) receives a coefficient of thermal expansion of a substrate joined to the circuit board by solder. A reliability estimation unit (36) estimates, for each combination of the coefficient of thermal expansion and the elastic modulus of the circuit board, the reliability of the solder when the substrate and the circuit board are joined by solder. A calculation unit (38) calculates, on the basis of the correspondence relationship, the range of the combination of the coefficient of thermal expansion and the elastic modulus of the circuit board core corresponding to the combination of the coefficient of thermal expansion and the elastic modulus of the circuit board having a reliability greater than or equal to a prescribed value.

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