Pickup system, joining device, sorting device, and control method

Abstract

A pickup system (100) comprises: a pickup unit (14) that includes a pickup nozzle (14a) and an ultrasonic wave generation unit (152a) that vibrates the pickup nozzle (14a) and thereby generates ultrasonic waves; a negative pressure generation unit (153); a rotational movement mechanism (15b) that rotates the pickup unit (14); and a control unit (101). The control unit (101) controls the negative pressure generation unit (153) and the ultrasonic wave generation unit (152a) under a first condition when the pickup nozzle (14a) picks up a chip (6a) in a non-contact manner and controls the negative pressure generation unit (153) and the ultrasonic wave generation unit (152a) under a second condition when the rotational movement mechanism (15b) rotates the pickup unit (14), the repulsion of the chip (6a) by the ultrasonic wave generation unit (152a) under the second condition being weaker than the repulsion of the chip (6a) by the ultrasonic wave generation unit (152a) under the first condition.

Description

Pickup system, joining device, sorting device, and control method

[0001] The present disclosure relates to a system for picking up parts, etc.

[0002] To improve the functionality of semiconductor packages, hybrid bonding that does not use bumps or bonding materials is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or other device using hydrogen bonding or other methods while the surface of the semiconductor chip is kept clean. Therefore, in hybrid bonding, the surface of the semiconductor chip must be kept highly clean from the time it is picked up from the adhesive sheet dicing tape until it is bonded.

[0003] To address this issue, a die pickup module that uses a non-contact picker to non-contactly hold a semiconductor chip called a die lifted from under the dicing tape, and a die bonding apparatus that includes the die pickup module have been proposed (see, for example, Patent Document 1). Such a die pickup module is also called a pickup system that picks up the die as a component, the non-contact picker is also called a pickup unit, and the die bonding apparatus is also called a bonding apparatus. The die pickup module of Patent Document 1 uses ultrasonic waves and suction force to non-contactly hold a semiconductor chip lifted from under the dicing tape.

[0004] US Patent Application Publication No. 2021 / 0060798

[0005] However, the die pickup module (i.e., pickup system) of Patent Document 1 has a problem in that it is difficult to properly hold the semiconductor chip, which is a component.

[0006] Therefore, the present disclosure provides a pickup system and the like that can hold components appropriately without contact.

[0007] A pickup system according to one aspect of the present disclosure comprises a pickup unit including a nozzle having an opening and holding a component, and an ultrasonic generator that generates ultrasonic waves by vibrating the nozzle; a negative pressure generator that generates negative pressure around the opening of the nozzle; a rotation mechanism that rotates the pickup unit; and a control unit that controls the negative pressure generator, the ultrasonic generator, and the rotation mechanism, wherein the nozzle holds the component in a non-contact manner based on a repulsive force that pulls the component away from the nozzle, generated by the ultrasonic waves of the ultrasonic generator, and a suction force that attracts the component to the nozzle, generated by the negative pressure of the negative pressure generator, and the control unit controls the negative pressure generator and the ultrasonic generator under a first condition when the nozzle picks up the component in a non-contact manner, and controls the negative pressure generator and the ultrasonic generator under a second condition when the rotation mechanism rotates the pickup unit, and the repulsive force of the ultrasonic generator on the component under the second condition is weaker than the repulsive force of the ultrasonic generator on the component under the first condition.

[0008] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

[0009] The pickup system of the present disclosure is capable of holding components in a suitable non-contact manner.

[0010] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and configurations described in the specification and drawings, but not necessarily all of the configurations.

[0011] FIG. 1 is a perspective view of a component mounting apparatus according to a first embodiment. FIG. 2 is a diagram for explaining the operation of the component mounting apparatus according to the first embodiment to mount a chip on a substrate. FIG. 3 is a diagram showing an example of the configuration of a pickup system according to the first embodiment. FIG. 4A is a diagram showing, by example, a portion of the operation of the pickup system according to the first embodiment to pick up a chip using a pickup nozzle and transfer it to the component mounting nozzle. FIG. 4B is a diagram showing, by example, the remaining portion of the operation of the pickup system according to the first embodiment to pick up a chip using a pickup nozzle and transfer it to the component mounting nozzle. FIG. 5 is a diagram showing an example of the relationship between the required ranges of repulsive force and suction force required to hold a chip in a non-contact manner and the set values ​​of repulsive force and suction force set for non-contact holding of the chip. FIG. 6 is a flowchart showing an example of the processing operation of the pickup system according to the first embodiment. FIG. 7 is a diagram showing an example of the configuration of a pickup system according to a second embodiment. FIG. 8 is a diagram for explaining the pickup nozzle according to the second embodiment. FIG. 9 is a diagram for explaining another example of the pickup nozzle according to the second embodiment.

[0012] (Findings that Form the Basis of the Present Disclosure) The present inventors have discovered the following problems with the die pickup module of Patent Document 1 described in the "Background Art" section. The die pickup module of Patent Document 1 inverts the non-contact picker to transfer the die picked up by the non-contact picker from the non-contact picker to the bonding head. Even if the operation and state of the non-contact picker change, if the output of the ultrasonic waves used to hold the die non-contactly remains constant, the die may come into contact with the non-contact picker, slip out of the non-contact picker, or become detached from the non-contact picker. In other words, it is difficult to properly hold the die. This is particularly true when the die is thin.

[0013] In order to solve such problems, a pickup system according to a first aspect of the present disclosure comprises a pickup unit including a nozzle having an opening and holding a component, and an ultrasonic generator that generates ultrasonic waves by vibrating the nozzle; a negative pressure generator that generates negative pressure around the opening of the nozzle; a rotation mechanism that rotates the pickup unit; and a control unit that controls the negative pressure generator, the ultrasonic generator, and the rotation mechanism, wherein the nozzle holds the component in a non-contact manner based on a repulsive force that pulls the component away from the nozzle, generated by the ultrasonic waves of the ultrasonic generator, and a suction force that attracts the component to the nozzle, generated by the negative pressure of the negative pressure generator, and the control unit controls the negative pressure generator and the ultrasonic generator under a first condition when the nozzle picks up the component in a non-contact manner, and controls the negative pressure generator and the ultrasonic generator under a second condition when the rotation mechanism rotates the pickup unit, and the repulsive force applied to the component by the ultrasonic generator under the second condition is weaker than the repulsive force applied to the component by the ultrasonic generator under the first condition.

[0014] As a result, when the pickup unit, which holds a component in a non-contact manner using the nozzle, rotates, the repulsive force generated by the ultrasonic generator is weaker than when the nozzle picks up the component. Therefore, even if centrifugal force acts on the component during rotation of the pickup unit, attempting to separate the component from the nozzle, the repulsive force generated by the ultrasonic generator is weakened, preventing the component from falling off the nozzle and allowing the component to be properly held in a non-contact manner. Furthermore, because the repulsive force has relatively good responsiveness, i.e., the repulsive force can be quickly weakened in response to control or commands from the control unit, the operating speed from component pickup to rotation of the pickup unit can be increased. As a result, the takt time (the time from picking up a component to mounting or bonding it to another component) can be shortened.

[0015] In the pickup system according to the second aspect, the suction force applied to the component by the negative pressure generator under the second condition may be stronger than the suction force applied to the component by the negative pressure generator under the first condition. Note that the pickup system according to the second aspect may be subordinate to the pickup system according to the first aspect.

[0016] As a result, when the pickup unit, which holds the component contactlessly with the nozzle, rotates, the suction force of the negative pressure generator is stronger than when the nozzle picks up the component. Therefore, even if centrifugal force acts on the component as the pickup unit rotates, attempting to pull the component away from the nozzle, the suction force of the negative pressure generator is strengthened, further preventing the component from coming off the nozzle and allowing the component to be held more appropriately in a contactless manner.

[0017] In a pickup system according to a third aspect, the control unit may control the negative pressure generator and the ultrasonic generator under a third condition after the rotation mechanism rotates and inverts the pickup unit, and when a holding force with which the nozzle holds the component is defined as a force obtained by subtracting the repulsive force from the suction force, the holding force on the component under the third condition may be weaker than the holding force on the component under the first condition. Note that the pickup system according to the third aspect may be subordinate to the pickup system according to the first or second aspect.

[0018] As a result, when the pickup unit rotates and reverses from a state in which the nozzle of the pickup unit is picking up a component from above, the component is positioned above the nozzle, and the holding force on the component is weakened. Therefore, after the pickup unit is reversed, even if the component tries to be attracted to the nozzle below due to its own weight, the holding force is weakened, so the component can be prevented from coming into contact with the nozzle and can be held appropriately without contact.

[0019] In the pickup system according to the fourth aspect, the suction force applied to the component by the negative pressure generator under the third condition may be weaker than the suction force applied to the component by the negative pressure generator under the first condition. The pickup system according to the fourth aspect may be subordinate to the pickup system according to the third aspect.

[0020] This reduces the suction force, thereby weakening the holding force, thereby reducing energy consumption for the suction force.

[0021] In the pickup system according to the fifth aspect, the repulsive force applied to the component by the ultrasonic generator under the third condition may be stronger than the repulsive force applied to the component by the ultrasonic generator under the first condition. The pickup system according to the fifth aspect may be subordinate to the pickup system according to the third or fourth aspect.

[0022] This weakens the holding force by strengthening the repulsive force. Also, since the repulsive force has a relatively good response, that is, the repulsive force can be strengthened quickly in response to control or commands from the control unit, the operating speed until the pickup unit reverses and stops can be increased. As a result, the takt time can be shortened.

[0023] In the pickup system according to a sixth aspect, the ultrasonic generator may have an ultrasonic vibrator, and the controller may adjust the repulsive force on the component by controlling a voltage applied to the ultrasonic vibrator. Note that the pickup system according to the sixth aspect may be subordinate to the pickup system according to any one of the first to fifth aspects.

[0024] This allows the repulsive force on the component to be adjusted effectively.

[0025] In the pickup system according to a seventh aspect, the negative pressure generating unit may have an adjustment valve that adjusts the negative pressure, and the control unit may adjust the suction force on the component by controlling the adjustment valve. Note that the pickup system according to the seventh aspect may be subordinate to the pickup system according to any one of the first to sixth aspects.

[0026] This allows for effective adjustment of the suction force on the component.

[0027] In a pickup system according to an eighth aspect, the nozzle may further include a suction path for sucking the component and a component-facing surface facing the component to be picked up, and the nozzle opening may include a plurality of outer suction holes in the component-facing surface connected to the suction path, and an inner suction hole in the component-facing surface surrounded by the plurality of outer suction holes and connected to the suction path. Note that the pickup system according to the eighth aspect may be subordinate to the pickup system according to any one of the first to seventh aspects.

[0028] As a result, multiple outer and inner suction holes are formed on the component-facing surface of the nozzle, which reduces warping or distortion of the component being picked up and allows the component to be held properly without contact.

[0029] In the pickup system according to a ninth aspect, at least one of the plurality of outer suction holes may be connected to the suction path at an angle with respect to a direction perpendicular to the component-facing surface. Note that the pickup system according to the ninth aspect may be subordinate to the pickup system according to the eighth aspect.

[0030] This allows the width of the suction path to be reduced, preventing the nozzle from becoming too large and ensuring a wide range of adjustment for the nozzle weight, thereby increasing the degree of freedom in adjusting the vibration characteristics, making it easy to set the vibration characteristics that are optimal for the part.

[0031] In a pickup system according to a tenth aspect, the nozzle may include a nozzle body and a protrusion that protrudes from the nozzle body toward the component and has the component-facing surface at its tip, and the weight of the nozzle may be adjusted by changing the shape of the nozzle body. Note that the pickup system according to the tenth aspect may be subordinate to the pickup system according to the eighth or ninth aspect.

[0032] This allows the weight of the nozzle to be adjusted regardless of the shape and size of the protrusion.

[0033] In the pickup system according to an eleventh aspect, each of the outer suction holes and the inner suction hole may have a circular shape, and the radius of the circle of the inner suction hole may be larger than the radius of the circle of each of the outer suction holes. Note that the pickup system according to the eleventh aspect may be subordinate to the pickup system according to any one of the eighth to tenth aspects.

[0034] This allows the radius of the inner suction hole to be larger than the radius of the outer suction holes, thereby increasing the suction force on the center of the component, effectively preventing the component from warping or warping in a way that would cause the center of the component to be farther away from the nozzle than the periphery. As a result, the component can be held more appropriately without contact.

[0035] In the pickup system according to the twelfth aspect, the plurality of outer suction holes may be four outer suction holes, and the four outer suction holes may be provided at positions corresponding to four corners of the rectangular component on the component-facing surface. Note that the pickup unit according to the twelfth aspect may be subordinate to the pickup system according to any one of the eighth to eleventh aspects.

[0036] This allows the four corners of the periphery of the rectangular part to be attracted toward the nozzle, effectively suppressing warping or distortion of the part.

[0037] In the pickup system according to the thirteenth aspect, the inner suction hole may be made up of a plurality of holes. The pickup system according to the thirteenth aspect may be subordinate to the pickup system according to any one of the eighth to twelfth aspects.

[0038] This allows the suction force acting on the central portion of the component to be dispersed, effectively suppressing local warping or distortion of the component.

[0039] In the pickup system according to the fourteenth aspect, the component-facing surface of the nozzle may be formed with grooves connected to each of the outer suction holes and the inner suction hole. Note that the pickup system according to the fourteenth aspect may be subordinate to the pickup system according to any one of the eighth to thirteenth aspects.

[0040] As a result, suction is performed through the groove, so that the part between the center and peripheral edge of the part can also be attracted toward the nozzle, effectively suppressing warping or distortion of the part.

[0041] In a pickup system according to a fifteenth aspect, the nozzle may have a convex portion at a tip end having the component-facing surface, the component-facing surface having a shape corresponding to the rectangular shape of the component, and the outer suction holes and the inner suction hole may pass through the convex portion. Note that the pickup system according to the fifteenth aspect may be subordinate to the pickup system according to any one of the eighth to fourteenth aspects.

[0042] This allows the component-facing surface at the tip of the convex portion to have a shape corresponding to the shape of the component, thereby preventing other components adjacent to the component to be picked up from coming into contact with the nozzle. In other words, when the nozzle descends to pick up the component to be picked up and the component-facing surface approaches the component to be picked up, the nozzle can pick up the component to be picked up without coming into contact with other components. Note that the shape and size of the component-facing surface may be substantially the same as the shape and size of the component.

[0043] A joining device according to a first aspect of the present disclosure includes the pickup system according to any one of the first to fifteenth aspects, and a joining unit that receives the component from the pickup unit after the rotation mechanism rotates the pickup unit and joins the received component to another component. Note that the other component may be a substrate.

[0044] As a result, the joining device according to the first aspect can achieve the same effect as that achieved by any one of the pickup systems according to the first to fifteenth aspects.

[0045] Furthermore, a sorting device according to the first aspect of the present disclosure includes a pickup system according to any one of the first to fifteenth aspects, and the parts are held by the pickup system.

[0046] As a result, the sorting device according to the first aspect can achieve the same effect as that achieved by any one of the pickup systems according to the first to fifteenth aspects.

[0047] In addition, a pickup unit according to a first aspect of the present disclosure is a pickup unit for picking up rectangular components without contact, and includes a nozzle and an ultrasonic generator that generates ultrasonic waves by vibrating the nozzle, and the nozzle has a suction path for sucking the component, a component-facing surface that faces the component to be picked up, a plurality of outer suction holes in the component-facing surface that are connected to the suction path, and an inner suction hole in the component-facing surface that is located at a position surrounded by the plurality of outer suction holes and is connected to the suction path.

[0048] As a result, the nozzle's component-facing surface is formed with not only an inner suction hole but also multiple outer suction holes surrounding the inner suction hole. Therefore, when a component is held in a non-contact manner facing the component-facing surface of the nozzle by ultrasonic waves from the ultrasonic generator and suction of the component, not only the center but also the periphery of the component can be attracted toward the nozzle. This prevents warping or distortion of the picked-up component, allowing the component to be held appropriately in a non-contact manner.

[0049] In the pickup unit according to the second aspect, each of the plurality of outer suction holes and the inner suction hole may have a circular shape, and the radius of the circle of the inner suction hole may be larger than the radius of the circle of each of the plurality of outer suction holes. Note that the pickup unit according to the second aspect may be subordinate to the pickup unit according to the first aspect.

[0050] This allows the radius of the inner suction hole to be larger than the radius of the outer suction holes, thereby increasing the suction force on the center of the component, effectively preventing the component from warping or warping in a way that would cause the center of the component to be farther away from the nozzle than the periphery. As a result, the component can be held more appropriately without contact.

[0051] In the pickup unit according to the third aspect, the plurality of outer suction holes may be four, and the four outer suction holes may be provided at positions corresponding to four corners of the rectangular component on the component-facing surface. Note that the pickup unit according to the third aspect may be subordinate to the pickup unit according to the first or second aspect.

[0052] This allows the four corners of the periphery of the rectangular part to be attracted toward the nozzle, effectively suppressing warping or distortion of the part.

[0053] In the pickup unit according to the fourth aspect, the inner suction hole may be made up of a plurality of holes. The pickup unit according to the fourth aspect may be subordinate to any one of the pickup units according to the first to third aspects.

[0054] This allows the suction force acting on the central portion of the component to be dispersed, effectively suppressing local warping or distortion of the component.

[0055] In the pickup unit according to the fifth aspect, the component-facing surface of the nozzle may be formed with grooves connected to each of the outer suction holes and the inner suction hole. The pickup unit according to the fifth aspect may be subordinate to the pickup unit according to any one of the first to fourth aspects.

[0056] As a result, suction is performed through the groove, so that the part between the center and peripheral edge of the part can also be attracted toward the nozzle, effectively suppressing warping or distortion of the part.

[0057] In a sixth aspect of the present invention, the nozzle may have a protrusion at its tip end that has the component-facing surface, the component-facing surface having a shape corresponding to the shape of the rectangular component, and the outer suction holes and the inner suction holes may pass through the protrusion. Note that the sixth aspect of the present invention may be subordinate to the pickup unit of any one of the first to fifth aspects.

[0058] This allows the component-facing surface at the tip of the convex portion to have a shape corresponding to the shape of the component, thereby preventing other components adjacent to the component to be picked up from coming into contact with the nozzle. In other words, when the nozzle descends to pick up the component to be picked up and the component-facing surface approaches the component to be picked up, the nozzle can pick up the component to be picked up without coming into contact with other components. Note that the shape and size of the component-facing surface may be substantially the same as the shape and size of the component.

[0059] A joining device according to a second aspect of the present disclosure includes the pickup unit according to any one of the first to sixth aspects, and a joining unit that receives the component from the pickup unit and joins the received component to another component, which may be a substrate.

[0060] As a result, the joining device according to the second aspect can achieve the same effect as that achieved by any one of the pickup units according to the first to sixth aspects.

[0061] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0062] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step sequences shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components not recited in the independent claims that represent the highest concepts are described as optional components. Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, the same components are designated by the same reference numerals in each figure. Furthermore, in the following embodiments, expressions such as "approximately X% (X is an arbitrary number)" are used. For example, "approximately X%" does not only mean exactly X% but also means that it is substantially X%, including an error of, for example, a few percent. Furthermore, "approximately X%" means X% within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately."

[0063] Furthermore, the pickup system in the following embodiment 1 is a system that can appropriately hold components in a non-contact manner with a pickup unit, and in particular, is a system that can prevent components from coming off or coming into contact with the pickup unit. Furthermore, the pickup system in the following embodiment 2 is a system that can appropriately hold components in a non-contact manner with a pickup unit, and in particular, includes a pickup unit that can pick up components without warping or distorting them. The pickup systems of the present disclosure will be described below in the order of embodiment 1 and embodiment 2.

[0064] (Embodiment 1) FIG. 1 is a perspective view of a component mounting apparatus according to this embodiment.

[0065] The component mounting apparatus 1 in this embodiment picks up components and mounts the picked-up components on the substrate 7. Therefore, the component mounting apparatus 1 in this embodiment is equipped with a pickup system that picks up components. Mounting components on the substrate 7 is also referred to as bonding the components to the substrate 7. Therefore, the component mounting apparatus 1 is also referred to as a bonding apparatus. The substrate 7 in this embodiment is not limited to a specific type of substrate and may be a silicon substrate, a component, a silicon chip, or the like. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, a direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, left-right direction, or lateral direction, and a direction perpendicular to the Y-axis direction in the perpendicular plane is referred to as the X-axis direction or depth direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In this disclosure, the positive side in the X-axis direction is the rear side or back, and the negative side in the X-axis direction is the front side or front. An example of a component is a semiconductor chip or chips. In this disclosure, "pickup" refers to the action of holding a component, or, among the actions of holding a component, particularly the action of picking up a component from an adhesive sheet such as dicing tape.

[0066] The component mounting device 1 includes a base 2, a component supply unit 3, a board holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is the base of the component mounting device 1 and supports each of the components included in the component mounting device 1.

[0067] The component supply unit 3 is placed on the base 2 and supplies components to the component holder 15. The component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a movable plate 32, and multiple support members 33. The holding table 3a holds the semiconductor wafer unit 6 aligned horizontally. The semiconductor wafer unit 6 includes an adhesive sheet 6b and multiple chips 6a. The multiple chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet also known as dicing tape. The multiple chips 6a are affixed to the upper surface of the adhesive sheet 6b. Each of the multiple support members 33 is a columnar member placed on the movable plate 32 so as to stand upright from the movable plate 32. The multiple support members 33 support the holding table 3a while separating the semiconductor wafer unit 6 held by the holding table 3a above the movable plate 32. The movable plate 32 is a plate placed on the XY table mechanism 31. The XY table mechanism 31 moves the movable plate 32 in the X-axis direction and the Y-axis direction. As the movable plate 32 moves, the semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction. In other words, the multiple chips 6a move along the XY plane.

[0068] The pickup camera 21 is disposed above the component supply section 3 and captures an image of the chip 6 a to be picked up from the semiconductor wafer unit 6 .

[0069] The substrate holder 5 holds the substrate 7 in a horizontally aligned state. Such a substrate holder 5 is provided with transport rails 5a. The substrate holder 5 positions and holds the substrate 7 transported by the transport rails 5a at a mounting position. The mounting position is a position where the chip 6a is mounted.

[0070] The component holder 15 includes an arm 15a, a rotational movement mechanism 15b, and a pickup unit 14. The arm 15a is a columnar member that is attached to the rotational movement mechanism 15b along the X-axis direction. That is, one longitudinal end (i.e., the base end) of the arm 15a is attached to the rotational movement mechanism 15b. The pickup unit 14 is attached to the other end (i.e., the tip end) of the arm 15a.

[0071] The rotational movement mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis, Y-axis, and Z-axis directions. Furthermore, the rotational movement mechanism 15b rotates the arm 15a around a central axis along the longitudinal direction of the arm 15a. In other words, the rotational movement mechanism 15b rotates the arm 15a around the X-axis. The pickup unit 14 is attached to the tip of the arm 15a as described above. The pickup unit 14 also includes a pickup nozzle 14a, made of, for example, metal, that holds the chip 6a non-contact by vacuum suction and ultrasonic waves. Note that vacuum suction is an action of sucking air and is also simply referred to as suction. Therefore, the pickup nozzle 14a is driven by the rotational movement mechanism 15b to move in the X-axis, Y-axis, and Z-axis directions and rotate around the X-axis. The rotational movement mechanism 15b also moves the pickup nozzle 14a based on the image captured by the pickup camera 21. This allows rotational movement mechanism 15b to lower pickup nozzle 14a so that it can accurately approach the top surface of chip 6a to be picked up. Note that pickup nozzle 14a in this embodiment is also referred to simply as a nozzle, and has an opening for holding chip 6a in a non-contact manner using vacuum suction and ultrasonic waves.

[0072] The frame 11 is disposed on the positive side of the X-axis direction on the base 2, and includes two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support the Y-axis frame 11b while the Y-axis frame 11b is aligned along the Y-axis direction and spaced above the top surface of the base 2. In other words, the Y-axis frame 11b is suspended by the two support posts 11a. As described above, the rotational movement mechanism 15b is suspended from this Y-axis frame 11b.

[0073] Y-axis drive mechanism 12 is attached to the surface of Y-axis frame 11b on the negative side in the X-axis direction, and moves component mounting section 13 in the Y-axis direction. Component mounting section 13 includes a mounting unit 20. Component mounting section 13 receives chip 6a held by pickup nozzle 14a using mounting unit 20, and mounts chip 6a on board 7 positioned at the mounting position.

[0074] FIG. 2 is a diagram for explaining the operation of component mounting apparatus 1 to mount chip 6 a on substrate 7 .

[0075] The component mounting device 1 picks up a chip 6a that is positioned at a predetermined pick-up work position P in the XY plane from among multiple chips 6a attached to an adhesive sheet 6b, and mounts the chip 6a on a substrate 7.

[0076] Specifically, the XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to place the chip 6 a to be picked up at the pick-up work position P. The chip 6 a to be picked up that has been placed at the pick-up work position P is pushed up by the push-up section 34.

[0077] 2, the component mounting apparatus 1 in this embodiment is provided with a push-up unit 34 arranged at the pick-up operation position P. The push-up unit 34 may also be provided in the component supply unit 3. The push-up unit 34 pushes up the chip 6a attached to the adhesive sheet 6b from below to above via the adhesive sheet 6b. Specifically, the push-up unit 34 pushes up the chip 6a to be picked up that is arranged at the pick-up operation position P.

[0078] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. The pickup camera 21 captures an image of the pickup operation position P and its surroundings among the multiple chips 6a attached to the adhesive sheet 6b from above the component supply unit 3. This captures an image of the chip 6a to be picked up, and the position of the chip 6a to be picked up is recognized based on the image capture result. In other words, the position of the chip 6a is recognized.

[0079] The pickup nozzle 14a of the pickup unit 14 is lowered by the rotational movement mechanism 15b, approaches the chip 6a from above, the position of which has been recognized based on the image capture results of the pickup camera 21, and holds the chip 6a. The pickup nozzle 14a then rises while holding the chip 6a, and further moves, for example, to the negative side in the Y-axis direction. Here, the pickup nozzle 14a faces upward with the lower surface (i.e., the bottom surface) of the held chip 6a as a result of the rotation of the arm 15a by the rotational movement mechanism 15b. As a result, the chip 6a is held by the pickup nozzle 14a in an upside-down state.

[0080] 2, the component mounting section 13 includes not only the mounting unit 20 but also a movable plate 13a, an elevating mechanism 13b, and an elevating plate 13c. The movable plate 13a is attached to the Y-axis driving mechanism 12 so as to be movable in the Y-axis direction. In other words, the movable plate 13a moves in the Y-axis direction by being driven by the Y-axis driving mechanism 12.

[0081] The lifting mechanism 13b is attached to the front of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a, which holds the chip 6a in an upside-down state, for example. For example, the component mounting nozzle 20a is moved above the chip 6a by the driving of the Y-axis drive mechanism 12 and the lifting mechanism 13b, and holds the chip 6a by, for example, vacuum suction. Then, while holding the chip 6a, the component mounting nozzle 20a moves toward the substrate 7 along the Y-axis direction and mounts the chip 6a on the substrate 7.

[0082] Component mounting section 13 in this embodiment is an example of a bonding unit that bonds chip 6 a held by pickup unit 14 of component holding section 15 to another component such as substrate 7. Therefore, the bonding device that is component mounting apparatus 1 in this embodiment includes pickup unit 14 and a bonding unit that receives chip 6 a from pickup unit 14 and bonds the received chip 6 a to another component. Furthermore, when receiving chip 6 a, the bonding unit in this embodiment receives chip 6 a from pickup unit 14 after rotational movement mechanism 15 b rotates pickup unit 14.

[0083] FIG. 3 is a diagram showing an example of the configuration of a pickup system according to this embodiment.

[0084] The pickup system 100 in this embodiment is a system provided in the component mounting apparatus 1, and includes, for example, the component holding unit 15, the push-up unit 34, and the control unit 101 described above.

[0085] The component holder 15 includes a pickup unit 14, a negative pressure generator 153, and a rotational movement mechanism 15b. The pickup unit 14 also includes a pickup nozzle 14a, an ultrasonic generator 152a, and an ultrasonic horn 152b.

[0086] The ultrasonic generator 152a has an ultrasonic vibrator, such as a Langevin vibrator, and vibrates (i.e., generates ultrasonic vibrations) in response to the voltage applied to the ultrasonic vibrator. The ultrasonic horn 152b amplifies the vibrations of the ultrasonic generator 152a and transmits them to the pickup nozzle 14a. As a result, ultrasonic waves are generated around the opening 14b of the pickup nozzle 14a. In other words, the pickup nozzle 14a ultrasonically vibrates in the vertical direction, transmitting the vibrations to the air in contact with the underside of the pickup nozzle 14a. For example, the ultrasonic generator 152a ultrasonically vibrates the pickup nozzle 14a with a maximum amplitude of approximately 10 to 20 μm. In this way, the ultrasonic generator 152a in this embodiment generates ultrasonic waves by vibrating the pickup nozzle 14a.

[0087] Negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a. In this embodiment, negative pressure generator 153 is configured as, for example, a vacuum pump. Negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a by creating a negative pressure in suction path 14c, an air flow path formed within pickup nozzle 14a and communicating with opening 14b. In other words, negative pressure generator 153 generates negative pressure around opening 14b by sucking air around opening 14b through suction path 14c. Negative pressure generator 153 also has an adjustment valve that adjusts the negative pressure, and generates negative pressure of a magnitude corresponding to the opening of the adjustment valve.

[0088] Pick-up nozzle 14a has opening 14b and holds tip 6a. Specifically, pickup nozzle 14a holds tip 6a in a non-contact manner around opening 14b based on a repulsive force that pulls tip 6a away from pickup nozzle 14a, which is generated by the ultrasonic waves of ultrasonic generator 152a, and a suction force that attracts tip 6a to pickup nozzle 14a, which is generated by the negative pressure of negative pressure generator 153. Note that the repulsive force is a force generated by the formation of a squeeze film by the ultrasonic waves.

[0089] The rotational movement mechanism 15b includes, for example, a motor and moves the pickup nozzle 14a in the X-axis, Y-axis, and Z-axis directions. The rotational movement mechanism 15b also rotates the arm 15a, thereby rotating the pickup nozzle 14a of the pickup unit 14 attached to the tip of the arm 15a. The time required for the pickup nozzle 14a to rotate 180 degrees, i.e., the time required for the pickup nozzle 14a to reverse, is, for example, less than 0.5 seconds. The rotational movement mechanism 15b in this embodiment is an example of a rotation mechanism that rotates the pickup unit 14.

[0090] The push-up unit 34 has a plurality of push-up pins 34a, and raises and lowers the plurality of push-up pins 34a. The plurality of push-up pins 34a rise and push up the adhesive sheet 6b, thereby pushing up the chips 6a attached to the adhesive sheet 6b.

[0091] The control unit 101 controls the push-up unit 34 and the component holder 15. That is, the control unit 101 controls the push-up unit 34, the ultrasonic generator 152a, the negative pressure generator 153, and the rotational movement mechanism 15b. For example, the control unit 101 adjusts the repulsive force on the chip 6a by controlling the voltage applied to the ultrasonic vibrator of the ultrasonic generator 152a. The control unit 101 also adjusts the suction force on the chip 6a by controlling the adjustment valve of the negative pressure generator 153. This makes it possible to effectively adjust the repulsive force and suction force on the chip 6a.

[0092] In this embodiment, the component holder 15 includes the ultrasonic wave generator 152a and the negative pressure generator 153, but the ultrasonic wave generator 152a and the negative pressure generator 153 do not have to be included in the component holder 15. In this embodiment, the ultrasonic horn 152b and the pick-up nozzle 14a are separate bodies, but they may be configured as an integrated unit.

[0093] 4A and 4B are diagrams showing an example of the operation of the pickup system 100 in this embodiment, in which the pickup nozzle 14a is used to pick up the chip 6a and deliver it to the component mounting nozzle 20a.

[0094] For example, when the XY table mechanism 31 moves the movable plate 32, the adhesive sheet 6b held on the holding table 3a moves in the X-axis direction and the Y-axis direction. This movement of the adhesive sheet 6b causes the chip 6a to be picked up to be positioned at the pick-up operation position P, as shown in (a) of Figure 4A. That is, the chip 6a to be picked up is positioned on the multiple push-up pins 34a of the push-up unit 34.

[0095] Next, as shown in (b) of FIG. 4A, the push-up unit 34 raises the multiple push-up pins 34a, pushing up the chip 6a through the adhesive sheet 6b. Then, as shown in (c) of FIG. 4A, the pickup nozzle 14a descends, the ultrasonic generator 152a generates ultrasonic waves, and the negative pressure generator 153 generates negative pressure. Specifically, under the control of the control unit 101, the ultrasonic generator 152a vibrates the pickup nozzle 14a via the ultrasonic horn 152b, generating ultrasonic waves from around the opening 14b of the pickup nozzle 14a. The ultrasonic waves generated by the ultrasonic generator 152a are generated by the pickup nozzle 14a vibrating at a vibration speed of, for example, 10 mm / s or more and 1000 mm / s or less. Furthermore, the negative pressure generator 153 suctions air under the control of the control unit 101. This generates negative pressure around the opening 14b of the pickup nozzle 14a. As a result, control unit 101 causes pickup nozzle 14a to hold tip 6a in a non-contact manner, using the suction force caused by the negative pressure around opening 14b and the repulsive force caused by the ultrasonic waves around opening 14b. In other words, pickup nozzle 14a holds tip 6a in a non-contact manner, using the suction force that draws tip 6a toward opening 14b of pickup nozzle 14a and the repulsive force that moves tip 6a away from opening 14b. In this non-contact holding, a gap of, for example, about 20 to 60 μm in width is generated between pickup nozzle 14a and tip 6a.

[0096] Then, as shown in (a) of FIG. 4B, the control unit 101 controls the rotational movement mechanism 15b to raise the pickup nozzle 14a. In other words, the chip 6a is peeled off from the adhesive sheet 6b and rises. Furthermore, as shown in (b) of FIG. 4B, the control unit 101 controls the rotational movement mechanism 15b to rotate the pickup nozzle 14a. That is, as shown in (b) and (c) of FIG. 4B, the rotational movement mechanism 15b rotates the arm 15a, thereby rotating the pickup nozzle 14a by 180 degrees so that the opening 14b of the pickup nozzle 14a faces upward. In other words, as the arm 15a rotates, the pickup unit 14 attached to the tip of the arm 15a is inverted. As a result, the pickup nozzle 14a included in the pickup unit 14 is inverted. This also inverts the chip 6a held in a non-contact state by the pickup nozzle 14a, and the lower surface of the chip 6a, which was attached to the adhesive sheet 6b, faces upward. Before inverting the pickup nozzle 14a, the rotational movement mechanism 15b may move the pickup nozzle 14a in the X-axis direction and the Y-axis direction to a chip transfer position where the chip 6a is transferred to the component mounting nozzle 20a.

[0097] 4B(c), the component mounting nozzle 20a picks up the inverted chip 6a from above, and as a result, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0098] FIG. 5 shows an example of the relationship between the required range of repulsive force and attractive force required for non-contact holding of tip 6a and the set values ​​of repulsive force and attractive force set for non-contact holding of tip 6a. Note that (a) of FIG. 5, i.e., (a1) to (a3), shows an example of set values ​​of repulsive force and attractive force in a comparative example, and (b) of FIG. 5, i.e., (b1) to (b3), shows an example of set values ​​of repulsive force and attractive force in this embodiment. Also, (a1) to (a3) ​​and (b1) to (b3) of FIG. 5 each show a graph. The graph shows the ultrasonic output of ultrasonic generator 152a, i.e., repulsive force, on the horizontal axis, and the attractive force obtained by the negative pressure of negative pressure generator 153 on the vertical axis.

[0099] For example, in the comparative example, as shown in FIG. 5A, the set values ​​B of the repulsive and attractive forces are maintained constant and do not follow fluctuations in the required range for non-contact holding. Specifically, the pickup nozzle 14a picks up the chip 6a, flips it over, and transfers the chip 6a to the component mounting nozzle 20a. When picking up the chip 6a, repulsive and attractive forces within the required range A1 shown in FIG. 5A1 are required. When flipping the chip 6a, repulsive and attractive forces within the required range A2 shown in FIG. 5A2 are required. Within the required range A2, the repulsive force is weaker and the attractive force is stronger than within the required range A1. This is because centrifugal force acts on the chip 6a when the pickup nozzle 14a flips. In other words, the force that moves the chip 6a away from the pickup nozzle 14a is stronger than when the chip 6a is picked up. Furthermore, when transferring the chip 6a, repulsive and attractive forces within the required range A3 shown in FIG. 5A3 are required. The suction force in the required range A3 is weaker than that in the required range A1. This is because when the tip 6a is handed over, the tip 6a is located above the pickup nozzle 14a, and therefore a force corresponding to the weight of the tip 6a, i.e., a force that attracts the tip 6a to the pickup nozzle 14a, acts on the tip 6a. In this way, the required range for non-contact holding varies depending on the operation and state of the pickup nozzle 14a and the tip 6a. However, in the comparative example, the set values ​​B of the repulsive force and suction force are kept constant regardless of the operation and state of the pickup nozzle 14a and the tip 6a.

[0100] Therefore, for example, as shown in (a3) ​​of Figure 5, there is a high possibility that the set value B will fall outside the required range A3, causing the tip 6a to come into contact with the pick-up nozzle 14a. Alternatively, as shown in (a1) and (a2) of Figure 5, even if the set value B is within the required range A1 or A2, if it is close to the boundary of the required range, there is a possibility that the tip 6a will come into contact with or fall outside the pick-up nozzle 14a.

[0101] Here, the above-mentioned required range is also called the optimal process window for holding the chip 6 a in a non-contact manner. The optimal process window can also be said to indicate the balance between the repulsive force and the attractive force required for non-contact holding of the chip 6 a. In other words, the optimal process window differs for each process of picking up, inverting, and transferring the chip 6 a. However, in the comparative example, the set value B is kept constant. In other words, the control conditions for the ultrasonic waves and the attractive force are fixed. Therefore, it is difficult to appropriately pick up and transfer the chip 6 a in a non-contact manner.

[0102] Therefore, in this embodiment, as shown in FIG. 5B, the control unit 101 adjusts the set value B of the repulsive force and suction force to follow fluctuations in the required range for non-contact holding. In the example of FIG. 5B, as in the example of FIG. 5A, the required range changes in the order of required range A1, required range A2, and required range A3 depending on the operation and state of the pickup nozzle 14a and the tip 6a. When the tip 6a is picked up, the control unit 101 in this embodiment positions the set value B at the center of the required range A1, as shown in FIG. 5B1, for example. The control unit 101 then controls the ultrasonic generator 152a and the negative pressure generator 153 to obtain the repulsive force and suction force of the set value B. When the tip 6a is inverted, the control unit 101 changes the set value B to the center of the required range A2, as shown in FIG. 5B1, for example. In other words, the control unit 101 changes the set value B so that the repulsive force is weaker and the suction force is stronger. The control unit 101 then controls the ultrasonic wave generator 152a and the negative pressure generator 153 so that the repulsive force and suction force of the set value B are obtained. Next, when the tip 6a is handed over, the control unit 101 changes the set value B to the center of the required range A3, for example, as shown in (b3) of FIG. 5 . In other words, the control unit 101 changes the set value B so that the repulsive force is strong and the suction force is weak. The control unit 101 then controls the ultrasonic wave generator 152a and the negative pressure generator 153 so that the repulsive force and suction force of the set value B are obtained.

[0103] Thus, in this embodiment, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a under different control conditions when the pickup nozzle 14a picks up the chip 6a and when the pickup nozzle 14a rotates. Specifically, as shown in (b1) and (b2) of FIG. 5, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a under a first condition when the pickup nozzle 14a picks up the chip 6a in a non-contact manner, and controls the negative pressure generator 153 and the ultrasonic generator 152a under a second condition when the rotational movement mechanism 15b rotates the pickup unit 14. The first and second conditions are the control conditions described above. The repulsive force exerted by the ultrasonic generator 152a on the chip 6a under the second condition is weaker than the repulsive force exerted by the ultrasonic generator 152a on the chip 6a under the first condition. The first condition may be, for example, a control condition for placing the set value B within the required range A1 shown in (b1) of Fig. 5 or at the center of the required range A1. The second condition may be, for example, a control condition for placing the set value B within the required range A2 shown in (b2) of Fig. 5 or at the center of the required range A2. The repulsive force under the second condition may be, for example, approximately 90% of the repulsive force under the first condition.

[0104] As a result, when the pickup unit 14, which holds the chip 6a without contact with the pickup nozzle 14a, rotates, the repulsive force of the ultrasonic generator 152a is weaker than when the pickup nozzle 14a picks up the chip 6a. Therefore, even if centrifugal force acts on the chip 6a during rotation of the pickup unit 14, attempting to separate the chip 6a from the pickup nozzle 14a, the weakened repulsive force of the ultrasonic generator 152a prevents the chip 6a from being detached from the pickup nozzle 14a, allowing the chip 6a to be appropriately held without contact. Furthermore, because the repulsive force has better responsiveness than the suction force, the repulsive force can be quickly weakened in response to control or commands from the control unit 101. Therefore, when the repulsive force is weakened without adjusting the suction force, the operating speed from picking up the chip 6a to rotating the pickup unit 14 can be increased compared to when the suction force is adjusted. As a result, the takt time (the time from picking up the chip 6a to mounting or bonding it to another component) can be shortened.

[0105] Furthermore, in this embodiment, as shown in (b1) and (b2) of Figure 5, the suction force applied to the tip 6a by the negative pressure generating unit 153 under the second condition is stronger than the suction force applied to the tip 6a by the negative pressure generating unit 153 under the first condition.

[0106] As a result, when the pickup unit 14, which holds the chip 6a without contact with the pickup nozzle 14a, rotates, the suction force of the negative pressure generator 153 is stronger than when the pickup nozzle 14a picks up the chip 6a. Therefore, even if centrifugal force acts on the chip 6a when the pickup unit 14 rotates, attempting to pull the chip 6a away from the pickup nozzle 14a, the suction force of the negative pressure generator 153 is strengthened, further preventing the chip 6a from coming off the pickup nozzle 14a and allowing the chip 6a to be held more appropriately without contact.

[0107] In this embodiment, as shown in (b3) of FIG. 5, after the rotary movement mechanism 15b rotates and reverses the pickup unit 14, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a under the third condition. Here, if the holding force with which the pickup nozzle 14a holds the tip 6a is defined as the force obtained by subtracting the repulsive force from the suction force, then, as shown in (b1) and (b3) of FIG. 5, the holding force on the tip 6a under the third condition is weaker than the holding force on the tip 6a under the first condition. The third condition is a control condition for controlling the negative pressure generator 153 and the ultrasonic generator 152a, and may be, for example, a control condition for positioning the set value B within the required range A3 shown in (b3) of FIG. 5 or at the center of the required range A3. The holding force is a force acting in a direction in which the pickup nozzle 14a and the tip 6a face each other when the pickup nozzle 14a holds the tip 6a.

[0108] As a result, when the pickup unit 14 rotates and turns over from a state in which the pickup nozzle 14a of the pickup unit 14 is picking up the chip 6a from above, the chip 6a is positioned above the pickup nozzle 14a, and the holding force on the chip 6a is weakened. Therefore, after the pickup unit 14 turns over, even if the chip 6a tries to be attracted to the pickup nozzle 14a below due to its own weight, the holding force is weakened, so the chip 6a is prevented from coming into contact with the pickup nozzle 14a, and the chip 6a can be held appropriately without contact.

[0109] Furthermore, in this embodiment, as shown in (b1) and (b3) of Figure 5, the suction force applied to the tip 6a by the negative pressure generating unit 153 under the third condition is weaker than the suction force applied to the tip 6a by the negative pressure generating unit 153 under the first condition.

[0110] This reduces the suction force, thereby weakening the holding force, thereby reducing energy consumption for the suction force.

[0111] Here, the repulsive force exerted by the ultrasonic generator 152a on the tip 6a under the third condition may be stronger than the repulsive force exerted by the ultrasonic generator 152a on the tip 6a under the first condition.

[0112] As a result, the holding force is weakened by strengthening the repulsive force. Furthermore, since the responsiveness of the repulsive force is relatively better than that of the suction force, the repulsive force can be strengthened quickly in response to control or commands from the control unit 101. Therefore, when the repulsive force is strengthened without adjusting the suction force, the operating speed until the pickup unit 14 reverses and stops can be increased compared to when the suction force is adjusted. As a result, the takt time can be shortened.

[0113] The control unit 101 may control the negative pressure generator 153 and the ultrasonic generator 152a so that both the suction force and the repulsion force are different between all of the steps, i.e., the pickup step, the inversion step, and the transfer step. Alternatively, the control unit 101 may control the negative pressure generator 153 and the ultrasonic generator 152a so that only one of the suction force and the repulsion force is different between all of the steps. Furthermore, the control unit 101 may control the negative pressure generator 153 and the ultrasonic generator 152a so that both the suction force and the repulsion force are different only between one or more predetermined steps among all of the steps, and so that only one of the suction force and the repulsion force is different between the remaining one or more steps.

[0114] FIG. 6 is a flowchart showing an example of the processing operation of the pickup system 100 in this embodiment.

[0115] In this embodiment, the control unit 101 of the pickup system 100 first controls the push-up unit 34 to push up the tip 6a (step S1). Next, the control unit 101 controls the pickup nozzle 14a to pick up the tip 6a in a non-contact manner using the repulsive and attractive forces that satisfy the first condition (step S2). At this time, the control unit 101 controls the ultrasonic generator 152a to generate ultrasonic waves and the negative pressure generator 153 to generate negative pressure. As a result, the repulsive and attractive forces that satisfy the first condition are obtained. Furthermore, at this time, the control unit 101 controls the rotational movement mechanism 15b to lower the pickup nozzle 14a.

[0116] Note that the timing at which ultrasonic wave generator 152a starts generating ultrasonic waves to generate a repulsive force and the timing at which negative pressure generator 153 starts generating negative pressure to generate a suction force may be any timing. Furthermore, the timing at which rotational movement mechanism 15b starts lowering pickup nozzle 14a may also be any timing.

[0117] Next, the control unit 101 controls the rotational movement mechanism 15b to raise the pickup nozzle 14a (step S3). The control unit 101 then reverses the pickup unit 14 with a repulsive force and an attractive force that satisfy the second condition (step S4). At this time, the control unit 101 changes the output of the ultrasonic waves generated by the ultrasonic generator 152a and the magnitude of the negative pressure generated by the negative pressure generator 153. This results in a repulsive force and an attractive force that satisfy a second condition, which is different from the first condition. In this embodiment, as described above, the repulsive force that satisfies the second condition is weaker than the repulsive force that satisfies the first condition. Then, when a repulsive force and an attractive force that satisfy the second condition are obtained, the control unit 101 controls the rotational movement mechanism 15b to reverse the arm 15a and the pickup unit 14. This causes the pickup nozzle 14a and the tip 6a held in contact with the pickup nozzle 14a to reverse. At this time, since the repulsive force is weakened, the chip 6a is not dislodged from the pick-up nozzle 14a by centrifugal force, and the chip 6a can be inverted while being held appropriately without contact.

[0118] Next, when the inversion in step S4 is completed, that is, when the chip 6a is inverted and positioned above the pickup nozzle 14a, the control unit 101 causes the pickup nozzle 14a to hold the chip 6a without contact with the chip 6a using repulsive and attractive forces that satisfy the third condition. As a result, the pickup nozzle 14a delivers the chip 6a to the component mounting nozzle 20a (step S5). At this time, the control unit 101 changes the output of the ultrasonic waves generated by the ultrasonic generator 152a and the magnitude of the negative pressure generated by the negative pressure generator 153. This results in repulsive and attractive forces that satisfy the third condition, which is different from the second condition. Here, in this embodiment, as described above, the holding force that satisfies the third condition is weaker than the holding force that satisfies the first condition. This prevents the chip 6a from coming into contact with the pickup nozzle 14a due to its own weight, and allows the chip 6a to be delivered to the component mounting nozzle 20a while being appropriately held without contact.

[0119] As described above, in the control method for the pickup system 100 of this embodiment, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a under the first condition when the pickup nozzle 14a picks up the chip 6a in a non-contact manner, as in step S2 of FIG. 6 . Then, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a under the second condition when the rotational movement mechanism 15b rotates the pickup unit 14, as in step S4 of FIG. 6 . Here, the repulsive force exerted on the chip 6a by the ultrasonic generator 152a under the second condition is weaker than the repulsive force exerted on the chip 6a by the ultrasonic generator 152a under the first condition. This allows the chip 6a to be properly held in a non-contact manner even when the pickup unit 14 rotates.

[0120] Alternatively, the control unit 101 may read from memory a table indicating the first, second, and third conditions for each outer shape and thickness of the chip 6a and switch the control conditions according to the table. For example, the control unit 101 retrieves the outer shape and thickness of the chip 6a to be picked up from a database and searches the table for the first, second, and third conditions associated with the outer shape and thickness. Then, when the chip 6a to be picked up is picked up, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a according to the retrieved first condition. Next, when the pickup nozzle 14a, which is holding the chip 6a in a non-contact manner, is reversed, the control unit 101 controls the negative pressure generator 153 and the ultrasonic generator 152a according to the retrieved second condition. Furthermore, after the pickup nozzle 14a is inverted, when the control unit 101 transfers the chip 6a held non-contact by the pickup nozzle 14a to the component mounting nozzle 20a, it controls the negative pressure generating unit 153 and the ultrasonic wave generating unit 152a according to the searched third condition.

[0121] Second Embodiment A pickup system 100 according to the present embodiment includes a pickup unit that can pick up the chip 6a in a non-contact manner without warping or distorting the chip 6a.

[0122] 7 is a diagram showing an example of the configuration of a pickup system 100 according to this embodiment. Note that, among the components of this embodiment, the same components as those in embodiment 1 are denoted by the same reference numerals as those in embodiment 1, and detailed description thereof will be omitted.

[0123] The pickup system 100 of this embodiment is provided in the component mounting apparatus 1 together with the component mounting unit 13, as in the first embodiment. The pickup system 100 of this embodiment also includes a component holding unit 15, as in the first embodiment. The component holding unit 15 of this embodiment also includes a pickup unit 140 instead of the pickup unit 14 of the first embodiment. The pickup unit 140 includes a pickup nozzle 141 for picking up the chip 6a in a non-contact manner without warping or distorting the chip 6a. Although the ultrasonic horn 152b and the pickup nozzle 141 are separate bodies in this embodiment, they may also be configured as an integrated unit. The pickup nozzle 141 may be made of a metal such as stainless steel, titanium, or aluminum. The shape of the chip 6a to be picked up is, for example, rectangular.

[0124] Like the pickup nozzle 14a of the first embodiment, the pickup nozzle 141 of the present embodiment is formed with a suction path 14c, which serves as a flow path for air to suck the chip 6a. This suction path 14c is connected to the negative pressure generator 153, for example, via a hole and a tube in the ultrasonic horn 152b. The width of the suction path 14c in the direction along the XY plane may be 20 to 50% of the width of the pickup nozzle 141. The pickup nozzle 141 also has a protrusion 142 with a component-facing surface 143 at its tip. Furthermore, the component-facing surface 143 of the pickup nozzle 141 has multiple suction holes 144 connected to the suction path 14c. The component-facing surface 143 is, for example, a rectangular flat surface facing the chip 6a to be picked up in a non-contact manner. In this embodiment, at least one of the multiple suction holes 144, the inner suction hole 144b, is located in a position surrounded by the remaining multiple suction holes 144, the outer suction holes 144a. In this embodiment, the outer suction holes 144a may be inclined with respect to the Z-axis direction so that they approach the inner suction holes 144b as they move toward the positive side in the Z-axis direction.

[0125] Thus, the pickup unit 140 in this embodiment is a unit (i.e., a mechanism) for picking up rectangular chips 6a in a non-contact manner, and includes a pickup nozzle 141 and an ultrasonic generator 152a that generates ultrasonic waves by vibrating the pickup nozzle 141. The pickup nozzle 141 has a suction path 14c for sucking the chips 6a, a component-facing surface 143 that faces the chips 6a to be picked up, a plurality of outer suction holes 144a, and an inner suction hole 144b. The outer suction holes 144a are located in the component-facing surface 143 and connected to the suction path 14c. The inner suction hole 144b is located in the component-facing surface 143 and is surrounded by the outer suction holes 144a, and is connected to the suction path 14c.

[0126] Figure 8 is a diagram illustrating pick-up nozzle 141 according to this embodiment. Figures 8(a) and 8(b) show comparative examples of pick-up nozzles, and Figure 8(c) shows an example of pick-up nozzle 141 according to this embodiment. The upper rows of Figures 8(a) to 8(c) show the pick-up nozzle as seen from below, and the lower rows show a cross section of the pick-up nozzle as seen from the X-axis direction.

[0127] For example, the comparative pickup nozzle 201a shown in FIG. 8A has a protrusion 142 with a rectangular component-facing surface 143 at its tip. A shallow recess 204c is formed in the center of the rectangular component-facing surface 143, and a suction hole 204b connected to the suction path 14c is formed in the center of the recess 204c. However, no suction holes are provided around the recess 204c. Therefore, when the pickup nozzle 201a picks up a chip 6a without contact, the center of the chip 6a is strongly attracted to the recess 204c. As a result, the chip 6a may warp or distort so that its center protrudes upward. In other words, the center of the chip 6a is strongly attracted toward the pickup nozzle 201a by air suction through the recess 204c and the suction hole 204b, but the peripheral edge of the chip 6a is not strongly attracted toward the pickup nozzle 201a due to the weak air suction force. Furthermore, the thickness of the area around the recess 204c in the convex portion 142 is thicker than that of the recess 204c. Therefore, the vibrations transmitted from the ultrasonic generator tend to be stronger around the recess 204c than at the recess 204c. Therefore, the peripheral portion of the chip 6a is more likely to receive a stronger repulsive force than the central portion. This may cause the chip 6a to be distorted as described above. In particular, if the chip 6a is a silicon chip and has a thickness of 100 μm or less, the chip 6a is more likely to be distorted, and the thinner the chip 6a, the greater the possibility of distortion.

[0128] On the other hand, the comparative pickup nozzle 201b shown in FIG. 8B also has a protrusion 142 with a rectangular component-facing surface 143 at its tip. Here, suction holes 204a connected to the suction path 14c are formed at each of the four corners of the rectangular component-facing surface 143. However, no suction hole is provided in the center of the component-facing surface 143. Therefore, when the pickup nozzle 201b picks up a chip 6a without contact, the chip 6a may warp or distort, causing the central portion of the chip 6a to protrude downward. In other words, the peripheral portion of the chip 6a is strongly attracted toward the pickup nozzle 201b by the suction of air through the suction holes 204a, but the central portion of the chip 6a is not strongly attracted toward the pickup nozzle 201b due to the weaker air suction force. Furthermore, the vibrations transmitted from the ultrasonic generator tend to be stronger in the central portion of the protrusion 142 of the pickup nozzle 201b than in the peripheral portion of the protrusion 142. Therefore, the central portion of the chip 6a is more likely to receive a stronger repulsive force than the peripheral portion, which may cause the chip 6a to be distorted as described above. In particular, if the chip 6a is a silicon chip and has a thickness of 100 μm or less, the chip 6a is more likely to be distorted, and the thinner the chip 6a, the greater the possibility of distortion.

[0129] Therefore, in pickup nozzle 141 of this embodiment, as shown in Fig. 8(c), the multiple suction holes 144 formed in rectangular component-facing surface 143 include four outer suction holes 144a and one inner suction hole 144b. Note that in pickup nozzle 141 of this embodiment, the multiple outer suction holes 144a and the multiple inner suction holes 144b are not arranged on the same YZ plane, but for ease of understanding, the cross-sectional view in Fig. 8(c) shows these suction holes 144 as being arranged on the same YZ plane.

[0130] The four outer suction holes 144a are located at the four corners of the rectangular component-facing surface 143, and the inner suction hole 144b is located at the center of the component-facing surface 143. As a result, compared to the example of FIG. 8A, the peripheral portion of the chip 6a is more strongly drawn toward the pickup nozzle 141 by air suction through the four outer suction holes 144a. Also, compared to the example of FIG. 8B, the central portion of the chip 6a is more strongly drawn toward the pickup nozzle 141 by air suction through the inner suction holes 144b. Therefore, the chip 6a can be picked up without contact and without warping or distorting. In the example of FIG. 8C, the inner suction hole 144b is located at the center or center of the component-facing surface 143, but this location is not limited thereto and may be any location surrounded by the four outer suction holes 144a.

[0131] In this manner, the component-facing surface 143 of the pickup nozzle 141 of the pickup unit 140 in this embodiment is formed with not only an inner suction hole 144b but also a plurality of outer suction holes 144a surrounding the inner suction hole 144b. Therefore, when the chip 6a is held in a non-contact state facing the component-facing surface 143 of the pickup nozzle 141 by the ultrasonic waves from the ultrasonic generator 152a and the suction of the chip 6a, not only the central portion but also the peripheral portion of the chip 6a can be attracted toward the pickup nozzle 141. In other words, the component-facing surface 143 of the pickup nozzle 141 of the pickup unit 140 in this embodiment is formed with not only a plurality of outer suction holes 144a but also an inner suction hole 144b at a position surrounded by the plurality of outer suction holes 144a. Therefore, when the chip 6a is held in a non-contact state facing the component-facing surface 143 of the pickup nozzle 141 by the ultrasonic waves from the ultrasonic generator 152a and the suction of the chip 6a, not only the peripheral portion but also the center portion of the chip 6a can be attracted toward the pickup nozzle 141. Therefore, warping or distortion of the picked-up chip 6a can be suppressed, and the chip 6a can be held appropriately in a non-contact state.

[0132] Furthermore, in the pickup unit 140 of this embodiment, the plurality of outer suction holes 144a are four outer suction holes 144a, and the four outer suction holes 144a are provided at positions corresponding to the four corners of the rectangular chip 6a on the component-facing surface 143. In other words, when the chip 6a is held by the pickup nozzle 141 in a non-contact manner, the four outer suction holes 144a are located at positions facing the four corners of the chip 6a, respectively.

[0133] This allows the four corners of the periphery of the rectangular chip 6a to be attracted toward the pickup nozzle 141, effectively preventing the chip 6a from warping or distorting.

[0134] In this embodiment, pickup nozzle 141 of pickup unit 140 has a protrusion 142 with a component-facing surface 143 at its tip, which has a shape corresponding to the shape of rectangular chip 6a. A plurality of outer suction holes 144a and inner suction holes 144b penetrate protrusion 142.

[0135] As a result, the component-facing surface 143 at the tip of the convex portion 142 has a shape corresponding to the shape of the chip 6a, which prevents other chips 6a adjacent to the chip 6a to be picked up from coming into contact with the pickup nozzle 141. In other words, when the pickup nozzle 141 descends to pick up the chip 6a to be picked up and the component-facing surface 143 approaches the chip 6a to be picked up, the pickup nozzle 141 can pick up the chip 6a to be picked up without coming into contact with other chips 6a. Note that the shape and size of the component-facing surface 143 may be substantially the same as the shape and size of the chip 6a.

[0136] 8B, the central portion of the tip 6a is not strongly drawn to the pickup nozzle 141 because the air suction force is weak. As a result, depending on the thickness of the tip 6a, the tip 6a may be warped or distorted so that the central portion of the tip 6a protrudes downward.

[0137] Therefore, the inner suction hole 144b may be larger than the outer suction hole 144a. That is, in the pickup unit 140 of the present embodiment, each of the outer suction holes 144a and the inner suction hole 144b has a circular shape, and the radius of the circle of the inner suction hole 144b may be larger than the radius of the circle of the outer suction holes 144a. For example, the radius of the inner suction hole 144b may be 0.30 mm, and the radius of the outer suction hole 144a may be 0.25 mm.

[0138] As a result, the radius of the inner suction hole 144b is larger than the radius of the multiple outer suction holes 144a, so the suction force on the center of the chip 6a can be increased. As a result, warping or distortion of the chip 6a, which would cause the center of the chip 6a to be farther away from the pickup nozzle 141 than the peripheral edge of the chip 6a, can be effectively suppressed. In other words, warping or distortion of the chip 6a, which would cause the center of the chip 6a to protrude downward, can be effectively suppressed. As a result, the chip 6a can be held more appropriately without contact.

[0139] The ratio of the area S1 of the inner suction hole 144b to the area S2 of all the outer suction holes 144a may be limited to a specified range. The area S1 is the area of ​​the opening of the inner suction hole 144b on the component-facing surface 143, and the area S2 is the sum of the areas of the openings of all the outer suction holes 144a on the component-facing surface 143. This specified range may be determined based on various environmental conditions, such as the shape and size of the chip 6a, the shape and size of the pickup nozzle 141, and the magnitude and distribution of the vibrations used to generate ultrasonic waves. For example, under certain environmental conditions, the specified range may be 0.25≦S1 / S2≦4. In other words, if S1 / S2 is less than 0.25, the chip 6a may warp so that its center protrudes downward. If S1 / S2 is greater than 4, the chip 6a may warp so that its center protrudes upward. Therefore, by setting the specified range to 0.25≦S1 / S2≦4, it is possible to suppress such warpage of the chip 6a.

[0140] The diameter of the inner suction hole 144b may be limited to 20% or less of the length of the long side of the rectangular component-facing surface 143. For example, if the diameter of the inner suction hole 144b is large, it is not possible to apply an appropriate repulsive force to the chip 6a due to the ultrasonic waves, but by limiting the diameter as described above, it is possible to apply an appropriate repulsive force to the chip 6a.

[0141] In this embodiment, as shown in FIG. 8C, the four outer suction holes 144a are connected to the suction path 14c at an angle relative to the perpendicular direction of the component-facing surface 143 (i.e., the Z-axis direction). Specifically, each of the four outer suction holes 144a is inclined so that the further it moves from the component-facing surface 143 toward the positive Z-axis direction, the closer it approaches the center of the XY plane of the pickup nozzle 141. Each of the four outer suction holes 144a, along with the inner suction holes 144b, is connected to the lower end of the suction path 14c. In this embodiment, the pickup nozzle 141 includes a nozzle main body 145 and a protrusion 142 that protrudes from the nozzle main body 145 toward the chip 6a and has the component-facing surface 143 at its tip. The suction path 14c is formed in the center of the XY plane of the nozzle main body 145 so as to extend along the Z-axis direction. Each of the four outer suction holes 144 a is inclined with respect to the Z-axis direction, formed to penetrate the convex portion 142 , and connected to a suction path 14 c in the nozzle main body 145 .

[0142] This allows the width of the suction path 14c to be reduced. For example, if each of the four outer suction holes 144a is formed without tilting along the Z-axis direction, they will not be closer to each other on the positive side of the Z-axis direction than if they were formed with a tilt. Therefore, if each of the four outer suction holes 144a is formed without tilting along the Z-axis direction, the width of the suction path 14c connected to those outer suction holes 144a needs to be increased. However, in this embodiment, the width of the suction path 14c can be reduced by tilting each of the four outer suction holes 144a with respect to the Z-axis direction.

[0143] Therefore, the nozzle body 145 can be prevented from becoming larger while ensuring a wide range of thickness adjustment. The thickness is the cross-sectional thickness of the nozzle body 145 in the XY plane, and is the distance in the X-axis direction or the Y-axis direction between the inner surface of the suction path 14c and the outer surface of the nozzle body 145. Adjusting the thickness of the nozzle body 145 can also be considered adjusting the shape of the nozzle body 145. The shape and size of the protrusion 142 are restricted by the shape and size of the tip 6a. Therefore, in this embodiment, the weight of the pickup nozzle 141 is adjusted by the shape of the nozzle body 145. This allows the nozzle body 145 to be prevented from becoming larger while ensuring a wide range of weight adjustment for the pickup nozzle 141, regardless of the shape and size of the protrusion 142.

[0144] The vibration characteristics of ultrasonic horn 152b and pickup nozzle 141 depend on the weight of pickup nozzle 141. The vibration characteristics include the amount of vibration amplification, the vibration resonance point (or fulcrum), and the resonance frequency. Therefore, in this embodiment, a wide range of adjustment for the weight of pickup nozzle 141 can be secured, thereby increasing the degree of freedom in adjusting the vibration characteristics. As a result, optimal vibration characteristics can be easily set for tip 6a.

[0145] In this embodiment, all of the four outer suction holes 144a are inclined with respect to the Z-axis direction, but at least one of the four outer suction holes 144a may be inclined.

[0146] That is, in this embodiment, at least one of the outer suction holes 144a is connected to the suction path 14c at an angle relative to the perpendicular direction (i.e., the Z-axis direction) of the component-facing surface 143. This allows the width of the suction path 14c to be reduced, preventing the nozzle body 145 from becoming larger while ensuring a wide range of adjustment for the weight of the pickup nozzle 141, thereby increasing the degree of freedom in adjusting the vibration characteristics. As a result, it is possible to easily set the vibration characteristics optimal for the chip 6a.

[0147] Furthermore, in this embodiment, the weight of pick-up nozzle 141 is adjusted by the shape of nozzle body 145. This allows the weight of pick-up nozzle 141 to be adjusted regardless of the shape and size of convex portion 142.

[0148] FIG. 9 is a diagram for explaining another example of pickup nozzle 141 in this embodiment.

[0149] 9A, the inner suction hole 144b may be made up of a plurality of holes, for example, four holes. In other words, the inner suction hole 144b is made up of a plurality of holes. This allows the suction force acting on the central portion of the chip 6a to be dispersed, effectively suppressing local warping or distortion of the chip 6a.

[0150] In this case, the area S1 of the inner suction hole 144b is the total area of ​​the multiple holes. Furthermore, if the inner suction hole 144b consists of multiple holes, each of the multiple holes can also be considered an inner suction hole 144b. As a result, when multiple holes are formed on the component-facing surface 143 so that 0.25≦S1 / S2≦4 is satisfied, each hole must be distinguished as either an outer suction hole 144a or an inner suction hole 144b. Therefore, whether a hole is an outer suction hole 144a or an inner suction hole 144b may be distinguished based on whether the hole is closer to a vertex of the convex hull formed by all the multiple holes or to the center of the convex hull. A hole located at a vertex of the convex hull or closer to the vertex than the center of the convex hull is treated as an outer suction hole 144a. Conversely, a hole located at the center of the convex hull or closer to the center than a vertex of the convex hull is treated as an inner suction hole 144b. The center of the convex hull may be the center of gravity.

[0151] 9B, one or more grooves 144c may be formed in the component-facing surface 143. For example, the one or more grooves 144c are formed to connect four outer suction holes 144a and four inner suction holes 144b. Negative pressure is also generated in and around the grooves 144c. That is, in this embodiment, the component-facing surface 143 of the pickup nozzle 141 of the pickup unit 140 is formed with grooves 144c that connect each of the outer suction holes 144a and the inner suction hole 144b. Suction is thus performed through the grooves 144c, so that the portion of the chip 6a between the center and the periphery can also be attracted toward the pickup nozzle 141, effectively suppressing warping or distortion of the chip 6a.

[0152] In the above example, the outer suction holes 144a and the inner suction holes 144b are each circular in the XY plane, but they may be rectangular or have other shapes. Also, in the above example, the four outer suction holes 144a are disposed at the four corners of the rectangular component-facing surface 143, but they may be disposed at other positions. For example, the four outer suction holes 144a may be disposed near the centers of the four sides of the rectangular component-facing surface 143 so as to form a cross.

[0153] While the pickup system 100 according to one or more aspects has been described above based on several embodiments, the present disclosure is not limited to these embodiments. As long as it does not deviate from the spirit of the present disclosure, various modifications conceivable by a person skilled in the art to the above embodiments and configurations constructed by combining multiple embodiments may also be included in the present disclosure.

[0154] For example, the second embodiment may be combined with the first embodiment. In this case, opening 14b of pickup nozzle 14a can be said to consist of a plurality of outer suction holes 144a and inner suction holes 144b. Also, unlike pickup system 100 of the first embodiment, pickup system 100 of the second embodiment does not require changes to the control conditions of negative pressure generator 153 and ultrasonic generator 152a.

[0155] Furthermore, in the first and second embodiments, the pickup nozzle 14a or 141 holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may also hold the chip 6a in a non-contact manner, similar to the pickup nozzle 14a or 141.

[0156] Furthermore, in the first and second embodiments, the pickup system 100 is provided in the component mounting apparatus 1, which is a bonding apparatus. However, the pickup system 100 may be provided in other apparatuses. An example of such other apparatus is a semiconductor chip sorter, but this is not limiting. When the other apparatus is a semiconductor chip sorter, the term "pickup" in the first and second embodiments refers to, for example, the action of picking up semiconductor chips from a tray. Thus, even when the pickup system 100 is provided in other apparatuses such as a semiconductor chip sorter, it can appropriately hold components without contact by having a configuration similar to that of the first and second embodiments. In other words, the semiconductor chip sorter may be a sorting apparatus that includes the pickup system 100 and holds semiconductor chips using the pickup system 100.

[0157] In the first embodiment, the control unit 101 and the like may be configured with dedicated hardware, or may be realized by executing a software program suitable for the control unit 101. The control unit 101 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software realizing the control unit 101 and the like causes a computer to execute, for example, each step of the flowchart shown in FIG. 6.

[0158] The following cases are also included in this disclosure:

[0159] (1) Specifically, the control unit 101 may be a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The control unit 101 achieves its functions by the microprocessor operating in accordance with the computer program. Here, the computer program is composed of a combination of multiple instruction codes that indicate commands to the computer to achieve a predetermined function.

[0160] (2) The control unit 101 may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions by the microprocessor operating in accordance with the computer program.

[0161] (3) The control unit 101 may be configured as a removable IC card or a standalone module. The IC card or module is a computer system configured with a microprocessor, ROM, RAM, etc. The IC card or module may include the ultra-multifunctional LSI described above. The IC card or module achieves its functions when the microprocessor operates in accordance with a computer program. This IC card or module may be tamper-resistant.

[0162] (4) The present disclosure may be embodied as the methods described above, a computer program that implements these methods on a computer, or a digital signal that includes the computer program.

[0163] The present disclosure may also be a computer program or a digital signal recorded on a computer-readable recording medium, such as a flexible disk, a hard disk, a CD (Compact Disc)-ROM, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. Alternatively, the present disclosure may be a digital signal recorded on such a recording medium.

[0164] The present disclosure may also be applied to transmitting a computer program or digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0165] Furthermore, the program or digital signal may be recorded on a recording medium and transferred, or the program or digital signal may be transferred via a network or the like, so that the program or digital signal may be implemented by another independent computer system.

[0166] The present disclosure is applicable to, for example, devices, units, systems, and the like that pick up parts and perform work using those parts.

[0167] REFERENCE SIGNS LIST 1 Component mounting device (bonding device) 2 Base 3 Component supply unit 3a Holding table 5 Substrate holding unit 5a Transport rail 6 Semiconductor wafer unit 6a Chip (component) 6b ​​Adhesive sheet 7 Substrate 11 Frame 11a Support post 11b Y-axis frame 12 Y-axis drive mechanism 13 Component mounting unit 13a Moving plate 13b Lifting mechanism 13c Lifting plate 14, 140 Pickup unit 14a, 141, 201a, 201b Pickup nozzle (nozzle) 14b Opening 14c Suction path 15 Component holding unit 15a Arm 15b Rotational movement mechanism (rotation mechanism) 20 Mounting unit 20a Component mounting nozzle 21 Pickup camera 31 XY table mechanism 32 Moving plate 33 Support member 34 Push-up unit 34a Push-up pin 100 Pick-up system 101 Control unit 142 Convex portion 143 Component facing surface 144, 204a, 204b Suction hole 144a Outer suction hole 144b Inner suction hole 145 Nozzle main body 152a Ultrasonic wave generating unit 152b Ultrasonic wave horn 153 Negative pressure generating unit 204c Concave portion

Claims

1. A pickup system comprising: a pickup unit including a nozzle having an opening for holding a component, and an ultrasonic generating unit which generates ultrasonic waves by vibrating the nozzle; a negative pressure generating unit which generates negative pressure around the opening of the nozzle; a rotation mechanism which rotates the pickup unit; and a control unit which controls the negative pressure generating unit, the ultrasonic generating unit, and the rotation mechanism, wherein the nozzle holds the component in a non-contact manner based on a repulsive force which pulls the component away from the nozzle, generated by ultrasonic waves from the ultrasonic generating unit, and a suction force which attracts the component to the nozzle, generated by the negative pressure from the negative pressure generating unit, and the control unit controls the negative pressure generating unit and the ultrasonic generating unit under a first condition when the nozzle picks up the component in a non-contact manner, and controls the negative pressure generating unit and the ultrasonic generating unit under a second condition when the rotation mechanism rotates the pickup unit, and the repulsive force of the ultrasonic generating unit on the component under the second condition is weaker than the repulsive force of the ultrasonic generating unit on the component under the first condition.

2. The pickup system according to claim 1, wherein the suction force applied to the component by the negative pressure generating unit under the second condition is stronger than the suction force applied to the component by the negative pressure generating unit under the first condition.

3. The pickup system described in claim 1, wherein the control unit controls the negative pressure generating unit and the ultrasonic generating unit under a third condition after the rotation mechanism rotates and inverts the pickup unit, and when the holding force with which the nozzle holds the part is defined as the force obtained by subtracting the repulsive force from the suction force, the holding force on the part under the third condition is weaker than the holding force on the part under the first condition.

4. The pickup system according to claim 3, wherein the suction force applied to the component by the negative pressure generating unit under the third condition is weaker than the suction force applied to the component by the negative pressure generating unit under the first condition.

5. A pickup system as described in claim 3, wherein the repulsive force exerted on the component by the ultrasonic generating unit under the third condition is stronger than the repulsive force exerted on the component by the ultrasonic generating unit under the first condition.

6. The pickup system according to claim 1, wherein the ultrasonic generating unit has an ultrasonic vibrator, and the control unit adjusts the repulsive force on the component by controlling a voltage applied to the ultrasonic vibrator.

7. The pickup system according to claim 2, wherein the negative pressure generating unit has an adjustment valve that adjusts the negative pressure, and the control unit adjusts the suction force on the component by controlling the adjustment valve.

8. A pickup system as described in claim 1, wherein the nozzle further has a suction path for sucking the component, and a component-facing surface facing the component to be picked up, and the opening of the nozzle comprises a plurality of outer suction holes located on the component-facing surface and connected to the suction path, and an inner suction hole located on the component-facing surface at a position surrounded by the plurality of outer suction holes and connected to the suction path.

9. The pickup system according to claim 8, wherein at least one of the plurality of outer suction holes is connected to the suction path at an angle with respect to a direction perpendicular to the component-facing surface.

10. A pickup system as described in claim 9, wherein the nozzle includes a nozzle body and a convex portion that protrudes from the nozzle body toward the component and has the component-facing surface at its tip, and the weight of the nozzle is adjusted by the shape of the nozzle body.

11. The pickup system of claim 8, wherein each of the plurality of outer suction holes and the inner suction hole has a circular shape, and a radius of the circular shape of the inner suction hole is greater than a radius of the circular shape of each of the plurality of outer suction holes.

12. A pickup system as described in claim 8, wherein the plurality of outer suction holes are four outer suction holes, and the four outer suction holes are provided at positions corresponding to four corners of the rectangular component on the component-facing surface.

13. The pickup system of claim 8, wherein the inner suction hole comprises a plurality of holes.

14. The pickup system according to claim 8, wherein the component-facing surface of the nozzle is formed with grooves connected to each of the plurality of outer suction holes and the inner suction hole.

15. A pickup system as described in claim 8, wherein the nozzle is formed with a convex portion at its tip having the component-facing surface, the component-facing surface having a shape corresponding to the rectangular shape of the component, and the plurality of outer suction holes and the inner suction hole penetrate the convex portion.

16. A joining device comprising: a pickup system according to any one of claims 1 to 15; and a joining unit that receives the component from the pickup unit after the rotation mechanism rotates the pickup unit, and joins the received component to another component.

17. A sorting device comprising a pickup system according to any one of claims 1 to 15, wherein the parts are held by the pickup system.

18. A control method for a pick-up system, the pick-up system comprising: a pick-up unit including a nozzle having an opening and holding a component, and an ultrasonic generating unit that generates ultrasonic waves by vibrating the nozzle; a negative pressure generating unit that generates negative pressure around the opening of the nozzle; and a rotation mechanism that rotates the pick-up unit, the nozzle holds the component in a non-contact manner based on a repulsive force that pulls the component away from the nozzle, obtained by ultrasonic waves from the ultrasonic generating unit, and a suction force that attracts the component to the nozzle, obtained by negative pressure from the negative pressure generating unit, the control method comprising: controlling the negative pressure generating unit and the ultrasonic generating unit under a first condition when the nozzle picks up the component in a non-contact manner; and controlling the negative pressure generating unit and the ultrasonic generating unit under a second condition when the rotation mechanism rotates the pick-up unit, the repulsive force of the ultrasonic generating unit on the component under the second condition being weaker than the repulsive force of the ultrasonic generating unit on the component under the first condition.