Adhesive composition, connection structure, and method for producing connection structure
JPWO2025089237A1Undetermined Publication Date: 2025-05-01
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Filing Date
- 2024-10-21
- Publication Date
- 2025-05-01
AI Technical Summary
Technical Problem
Anisotropic conductive films used in devices like micro OLEDs for AR/VR applications face challenges with high connection resistance due to adhesive component residues between electrodes and conductive particles, especially when cured at low temperatures.
Method used
The adhesive composition is formulated to have a narrow temperature range between the start and end of curing, allowing the adhesive to flow longer and reducing residue formation, with a curing end temperature of 130°C or lower and a start temperature of 85°C or higher.
Benefits of technology
This approach effectively suppresses connection resistance between electrodes by minimizing adhesive residue and ensuring adequate flow of the adhesive during thermal compression bonding at low temperatures.
✦ Generated by Eureka AI based on patent content.
Abstract
The purpose of the present invention is to provide an adhesive composition which is capable of forming an anisotropic conductive film that is capable of suppressing the connection resistance between electrodes to a low level. The present invention provides an adhesive composition wherein the difference between the curing start temperature and the curing end temperature is 20°C or less.
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