Semiconductor production device and installation method

Abstract

According to the present invention, a semiconductor production device that produces semiconductors includes: an accommodated object that is provided inside a device frame of the semiconductor production device; and a holding member that is accommodated inside the device frame with the accommodated object and holds the accommodated object. The holding member comprises a base body, an attachment body that is attached to a lower part of the accommodated object, and a floating structure that is provided between the base body and the attachment body and raises the attachment body from the base body.

Description

Semiconductor manufacturing equipment and installation method

[0001] The present disclosure relates to semiconductor manufacturing equipment and installation methods.

[0002] Japanese Patent Application Laid-Open No. 2006-103663 discloses a semiconductor manufacturing apparatus equipped with multiple multi-chamber process modules. In this semiconductor manufacturing apparatus, a gas box for supplying gas to the process modules and an electrical box for supplying power are housed in a storage space below each process module. The gas box and the electrical box are equipped with casters at their bottoms, allowing them to be pulled out to the outside of the process modules.

[0003] U.S. Patent No. 9,312,155

[0004] The present disclosure provides a technique for easily installing items contained in semiconductor manufacturing equipment.

[0005] According to one aspect of the present disclosure, there is provided a semiconductor manufacturing apparatus for manufacturing semiconductors, the semiconductor manufacturing apparatus including: a container placed inside an equipment frame of the semiconductor manufacturing apparatus; and a holding member that is housed inside the equipment frame together with the container and holds the container, the holding member including a base body, a mounting body attached to a lower part of the container, and a floating structure that is provided between the base body and the mounting body and raises the mounting body from the base body.

[0006] According to one aspect, the contents of the semiconductor manufacturing device can be easily installed.

[0007] 2A is a schematic side view showing a state in which a power supply of a plasma processing system is housed in an apparatus frame. FIG. 2B is a perspective view showing a state in which the power supply is being installed. FIG. 2B is a perspective view showing a state in which the power supply is being installed. FIG. 3A is an exploded perspective view of the holding member of FIG. 3 according to an embodiment. FIG. 3B is a perspective view showing a state in which a power supply housing is held by the holding member. FIG. 3C is a side view illustrating adjustment of the height position of the holding member. FIG. 7A is a flowchart showing the steps of an installation method for installing a power supply housing in an apparatus frame. FIG. 7B is a flowchart showing the steps of a removal method for removing the power supply housing from the apparatus frame. FIG. 8A is a first perspective view showing a step in installing a power supply housing 60. FIG. 8B is a second perspective view showing a step subsequent to FIG. 8A. FIG. 8C is a third perspective view showing a step subsequent to FIG. 8B.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0009] First, a plasma processing system including a capacitively coupled plasma processing apparatus 1, which is an example of a semiconductor manufacturing apparatus according to an embodiment, will be described with reference to Fig. 1. Fig. 1 is a diagram schematically illustrating the plasma processing system according to an embodiment.

[0010] The plasma processing system includes a capacitively coupled plasma processing apparatus 1 and a controller 2. The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one process gas into the plasma processing chamber 10. The gas inlet includes a showerhead 13. The substrate support 11 is disposed within the plasma processing chamber 10. The showerhead 13 is disposed above the substrate support 11. In one embodiment, the showerhead 13 forms at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the showerhead 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 has at least one gas inlet for supplying at least one processing gas to the plasma processing space 10s and at least one gas outlet for exhausting gas from the plasma processing space 10s. The sidewall 10a is grounded. The showerhead 13 and the substrate support 11 are electrically insulated from the plasma processing chamber 10 housing.

[0011] The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region (substrate support surface) 111a for supporting a substrate (wafer) W and an annular region (ring support surface) 111b for supporting the ring assembly 112. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a plan view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. In one embodiment, the main body 111 includes a base and an electrostatic chuck. The base includes a conductive member. The conductive member of the base functions as a lower electrode. The electrostatic chuck is disposed on the base. The upper surface of the electrostatic chuck has the substrate support surface 111a. The ring assembly 112 includes one or more annular members. At least one of the one or more annular members is an edge ring. Although not shown, the substrate support 11 may also include a temperature control module configured to adjust at least one of the electrostatic chuck, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path. The substrate support 11 may also include a heat transfer gas supply unit configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 111 a.

[0012] The showerhead 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The process gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The showerhead 13 also includes a conductive member. The conductive member of the showerhead 13 functions as an upper electrode. In addition to the showerhead 13, the gas inlet may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 10a.

[0013] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from a corresponding gas source 21 to the showerhead 13 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply unit 20 may include one or more flow modulation devices to modulate or pulse the flow rate of the at least one process gas.

[0014] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to the conductive member of the substrate support 11 and / or the conductive member of the showerhead 13. This causes plasma to be formed from at least one process gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least a part of a plasma generating unit configured to generate plasma from one or more process gases in the plasma processing chamber 10. Furthermore, by supplying a bias RF signal to the conductive member of the substrate support 11, a bias potential is generated on the substrate W, thereby attracting ion components in the formed plasma to the substrate W.

[0015] In one embodiment, the RF power supply 31 includes a first RF generator 31a and a second RF generator 31b. The first RF generator 31a is coupled to the conductive members of the substrate support 11 and / or the conductive members of the showerhead 13 via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 13 MHz to 150 MHz. In one embodiment, the first RF generator 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to the conductive members of the substrate support 11 and / or the conductive members of the showerhead 13. The second RF generator 31b is coupled to the conductive members of the substrate support 11 via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 400 kHz to 13.56 MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies, and the generated bias RF signals or signals may be supplied to the conductive members of the substrate support 11. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0016] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to a conductive member of the substrate support 11 and configured to generate a first DC signal. The generated first bias DC signal is applied to the conductive member of the substrate support 11. In one embodiment, the first DC signal may be applied to another electrode, such as an electrode in an electrostatic chuck. In one embodiment, the second DC generator 32b is connected to a conductive member of the showerhead 13 and configured to generate a second DC signal. The generated second DC signal is applied to the conductive member of the showerhead 13. In various embodiments, at least one of the first and second DC signals may be pulsed. The first and second DC generating units 32a and 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided instead of the second RF generating unit 31b.

[0017] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is regulated by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0018] The controller 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform the various processes described in this disclosure. The controller 2 may be configured to control each element of the plasma processing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the controller 2 may be included in the plasma processing apparatus 1. The controller 2 may include, for example, a computer 2a. The computer 2a may include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a storage unit 2a2, and a communication interface 2a3. The processing unit 2a1 may be configured to perform various control operations based on programs stored in the storage unit 2a2. The storage unit 2a2 may include a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0019] 2A is a schematic side view showing the power supply 30 of the plasma processing apparatus 1 housed in the apparatus frame 50. FIG. 2B is a perspective view showing the state in which the power supply 30 is being installed. As shown in FIG. 2A, the plasma processing apparatus 1 is assembled into an integrated unit by installing the power supply 30 below the apparatus frame 50, which houses the plasma processing chamber 10 (see FIG. 1). The apparatus frame 50 houses each component of the plasma processing apparatus 1 inside and in the vertical direction, thereby defining the installation range of the plasma processing apparatus 1 in the width direction. This allows a multi-chamber substrate processing system having multiple plasma processing apparatuses 1 to be installed without the plasma processing apparatuses 1 contacting each other.

[0020] The apparatus frame 50 according to the embodiment is formed by assembling a pair of side frames 51 extending vertically and a plurality of bridging frames 52 that bridge the pair of side frames 51 horizontally. Each side frame 51 and each bridging frame 52 can be made of a member such as a rectangular cylindrical bar or panel. By fastening each side frame 51 and each bridging frame 52 to each other by fastening means such as screws or welding, the apparatus frame 50 can firmly support each component of the plasma processing apparatus 1 inside. The space below the plasma processing chamber 10 of the apparatus frame 50 and surrounded by the pair of side frames 51 and the upper and lower bridging frames 52 forms an accommodation space 50s that accommodates the power supply housing 60 of the power supply 30.

[0021] The power supply housing 60 is a housing that houses part or all of the above-mentioned power supply 30. For example, the power supply housing 60 houses an RF power supply 31 (see FIG. 1 ) that supplies power to the substrate support 11 of the plasma processing chamber 10, a DC power supply 32 (see FIG. 1 ), etc. The power supply housing 60 may also house other power sources that supply power to each component of the plasma processing apparatus 1 (such as a power source that supplies power to an electrostatic chuck or a temperature control module). Note that the other components of the power supply 30 that supplies power to the shower head 13 of the plasma processing chamber 10 may be located above the plasma processing chamber 10.

[0022] The power supply housing 60 includes a main housing 61 that houses the RF power supply 31 and the DC power supply 32 themselves, and a sub-housing 62 that houses an impedance matching circuit. The impedance matching circuit matches the impedance on the load side (substrate support portion 11 side) of the RF power supply 31 to the output impedance of the RF power supply 31. The sub-housing 62 is formed smaller than the main housing 61 and is fixed onto the top plate of the main housing 61, for example.

[0023] The size (width, depth, height, etc.) of this power supply housing 60 changes depending on the performance such as the maximum voltage supplied by the power supply 30. For this reason, the housing space 50s of the device frame 50 that houses the power supply housing 60 has a size that is somewhat larger than the power supply housing 60 to be housed therein.

[0024] As described above, the device frame 50 forms an accommodation space 50s for accommodating the power supply housing 60 using a pair of side frames 51 and two upper and lower bridge frames 52. Hereinafter, the lower bridge frame 52 will be referred to as the bottom frame 521, and the upper bridge frame 52 will be referred to as the middle frame 522. In addition, a control box 53 that accommodates a control board for controlling the power supply 30 is installed on one of the pair of side frames 51.

[0025] The lower portions of the pair of side frames 51 and the bottom frame 521 are provided with a plurality of fixing structures 54 for fixing the device frame 50 to the floor. Each fixing structure 54 includes a level adjuster 541 and a fixing jig 542 fixed to the side of the level adjuster 541. Each level adjuster 541 is attached to the lower portion of the bottom frame 521 and is height adjustable. By adjusting the height of each level adjuster 541, each bridge frame 52 including the bottom frame 521 is installed so that it is parallel to the horizontal direction. Each fixing jig 542 is formed in a right triangle and is connected to each of the pair of side frames 51 of the device frame 50 whose height has been adjusted by each level adjuster 541, thereby supporting the upright posture of the device frame 50.

[0026] As shown in FIGS. 2A and 2B , when installing the power supply housing 60 in the accommodation space 50s, a dolly 70 and a lifting jig 75 are used. That is, an operator loads the power supply housing 60 onto the dolly 70 and inserts the power supply housing 60 into the accommodation space 50s by moving the power supply housing 60 and dolly 70. FIG. 2A illustrates the power supply housing 60 loaded on the dolly 70. Then, the operator inserts the lifting jig 75 shown in FIG. 2B between the upper surface of the bottom frame 521 and the lower surface of the dolly 70, and uses the lifting jig 75 to raise the power supply housing 60 and dolly 70. Furthermore, with the power supply housing 60 in the raised position, the operator inserts a pair of holding members 80 and holds the power supply housing 60 with each holding member 80. After the power supply housing 60 is held by each holding member 80, the lifting jig 75 is removed from the device frame 50. The dolly 70 may be integrated with the power supply housing 60 or may be detached from the power supply housing 60 and removed from the device frame 50 .

[0027] The dolly 70 has a flat panel base 71 and a plurality of casters 72 attached to the bottom of the panel base 71. An inclined frame 55, on which the dolly 70 carrying the power supply housing 60 can move, is attached to the opening side of the bottom frame 521 facing the storage space 50s. The inclined frame 55 may be attached to the bottom frame 521 when the dolly 70 is used to store the power supply housing 60 in the storage space 50s, and may be removed after the storage.

[0028] The lifting jig 75 includes a main body 76, a platform 77 that is above the main body 76 and directly contacts the power supply housing 60, and a handle 78 that protrudes from the main body 76. The main body 76 has an internal lifting mechanism (not shown) that raises the platform 77 based on rotation of the handle 78 in a first direction and lowers the platform 77 based on rotation of the handle 78 in a second direction.

[0029] The vertical height of the accommodation space 50s is formed to be higher than the overall height of the power supply housing 60, which is made up of the main housing 61 and the sub-housing 62 stacked on top of each other. Therefore, the plasma processing apparatus 1 is configured so that the height position of the power supply housing 60 is maintained by the pair of holding members 80 by sliding and inserting the pair of holding members 80 relative to the power supply housing 60. The power supply housing 60 is stably held within the accommodation space 50s by the pair of holding members 80, and the lifting jig 75 and the cart 70 can be smoothly removed from the power supply housing 60.

[0030] FIG. 3 is a perspective view showing a holding member 80 according to an embodiment. FIG. 4 is an exploded perspective view of the holding member 80 of FIG. 3. As shown in FIGS. 3 and 4, the pair of holding members 80, assembled with multiple components, form a long jig that is inserted in the depth direction of the apparatus frame 50 through the opening of the accommodation space 50s (see FIG. 2B). Specifically, the holding member 80 includes a base body 81 provided below, a mounting body 82 attached to the power supply housing 60 above the base body 81, and a floating structure 83 provided between the base body 81 and the mounting body 82 to raise the mounting body 82 above the base body 81. Note that, although the mounting body 82 according to the embodiment is attached to the power supply housing 60 via a lower jig 90 (see FIG. 5), which will be described later, the plasma processing apparatus 1 may also be configured such that the mounting body 82 is directly attached to the power supply housing 60.

[0031] The base body 81 is formed in a rectangular cylindrical shape that is thicker than the mounting body 82 and the floating structure 83, and extends linearly. The length of the base body 81 in the extension direction (longitudinal direction) is set to be slightly shorter than the length of the storage space 50s in the depth direction.

[0032] One end of the top surface of the base body 81 is formed with a screw hole 811 and an engagement hole 812 for attaching the levitation structure 83. The end of the base body 81 having the screw hole 811 and the engagement hole 812 forms a stepped surface 81a that is lower than the other portions. Furthermore, a guide groove 813 for guiding the levitation structure 83 is formed on the top surface of the base body 81 at a position adjacent to the stepped surface 81a. The guide groove 813 extends from the stepped surface 81a to a midpoint in the extension direction of the base body 81.

[0033] A connecting part 89 for connecting the holding member 80 to each side frame 51 (see FIG. 2B ) of the device frame 50 is attached to one end of the base body 81. The connecting part 89 is formed in an L-shape by bending a long plate. The connecting part 89 includes a base body side connecting part 891 that is connected to the base body 81, and a frame side connecting part 892 that is connected to the base body side connecting part 891 so as to be perpendicular to the base body side connecting part 891, extends in the width direction of the base body 81, and is connected to the side frame 51.

[0034] A pair of left and right side surfaces at one end of the base body 81 are formed with through-holes 814 for screwing the base body side coupling portion 891 of the coupling part 89. For example, the base body side coupling portion 891 of the coupling part 89 is screwed to the left side surface of the base body 81, causing the frame side coupling portion 892 to protrude to the right side of the base body 81 (see FIG. 3 ). This allows the frame side coupling portion 892 to be coupled (screwed) to the right side frame 51. Conversely, the base body side coupling portion 891 of the coupling part 89 is screwed to the right side surface of the base body 81, causing the frame side coupling portion 892 to protrude to the left side of the base body 81. This allows the frame side coupling portion 892 to be coupled (screwed) to the left side frame 51.

[0035] The base body 81 also has a positioning portion 815 at the other end opposite to the one end for positioning the base body 81 in the depth direction when accommodating the holding member 80 in the accommodation space 50s. The positioning portion 815 according to the embodiment is formed by cutting out corners of the other end surface and the bottom surface of the base body 81.

[0036] On the other hand, the mounting body 82 is formed in a rectangular cylindrical shape like the base body 81 and extends linearly. The length of the mounting body 82 in the extension direction (longitudinal direction) is shorter than the length of the base body 81 in the extension direction. For example, the length of the mounting body 82 in the extension direction matches the length of the lower jig 90 attached to the lower part of the power supply housing 60 in the extension direction (see FIG. 5). One end of the mounting body 82 is provided with a screw hole 824 for screwing to the lower jig 90.

[0037] A through-hole 821 that penetrates in the vertical direction is formed in a certain range in the middle of the mounting body 82. The other end of the support 84 of the floating structure 83 is inserted into the through-hole 821. The portion of the mounting body 82 where the through-hole 821 is formed is in a state where a pair of left and right extension plates 822 extend along the longitudinal direction. Each extension plate 822 is formed with a connecting hole 823 for connecting to the support 84 of the floating structure 83. The pair of left and right connecting holes 823 are located exactly in the middle of the mounting body 82 in the extension direction.

[0038] The floating structure 83 is a structure provided between the base body 81 and the mounting body 82. The floating structure 83 includes a support body 84 and a height adjustment member 85 that is connected to one end of the support body 84 and is also connected to the base body 81. The floating structure 83 also has a connecting pin 86 that connects the support body 84 and the height adjustment member 85, and a connecting pin 87 that connects the support body 84 and the mounting body 82.

[0039] The support body 84 is formed in a rectangular tube shape that is slightly thinner than the mounting body 82, and extends in an arc-like curve along the longitudinal direction. A pin hole 841 that penetrates in the left-right direction is formed at one end of the support body 84. Furthermore, a pin hole 842 that penetrates in the left-right direction is formed at the other end of the support body 84.

[0040] The other end of the support body 84 is inserted into the through-hole 821 of the mounting body 82, and the connecting pin 87 is inserted with the connecting hole 823 of the mounting body 82 aligned with the pin hole 842, thereby connecting the mounting body 82 to the mounting body 82. The connecting pin 87 is prevented from coming off by a retaining part 87a. The mounting body 82 is connected to the support body 84 so as to be rotatable (free state), and the angle between the mounting body 82 and the support body 84 can be freely changed.

[0041] On the other hand, the height adjustment member 85 is formed in a U-shape in plan view that allows it to sandwich the support body 84. Specifically, the height adjustment member 85 has a block-shaped base 851, a pair of protruding pieces 852 that protrude slightly from the base 851 toward the other end, and an engagement pin 853 that protrudes downward from the underside of the base 851. The height adjustment member 85 also has a height adjustment screw 88 (see FIG. 5 ), and this height adjustment screw 88 is inserted into an insertion hole 854 at one end of the base 851 (the opposite side to the protruding pieces 852 (the connection points that are connected to the support body 84) that sandwich the engagement pin 853).

[0042] A pair of protruding pieces 852 of the height adjustment member 85 accommodate one end of the support body 84 therebetween. A connecting hole 855 is formed through each of the pair of protruding pieces 852. One end of the support body 84 is inserted between the pair of protruding pieces 852 of the height adjustment member 85, and the connecting pin 86 is inserted with each connecting hole 855 overlapping the pin hole 842, thereby connecting the support body 84 to the height adjustment member 85. The connecting pin 86 is prevented from coming off by a retaining part 87a. The height adjustment member 85 and the support body 84 are connected to each other so as to be rotatable (free state).

[0043] The engagement pin 853 of the height adjustment member 85 is inserted into the engagement hole 812 of the base body 81 and engages with the base body 81. The engagement pin 853 is formed slightly thicker than the engagement hole 812, and as the height of the height adjustment member 85 is adjusted, the distance between the height adjustment member 85 and the base body 81 can be changed and the height can be maintained.

[0044] 5 is a perspective view showing the state in which the power supply housing 60 is held by the holding member 80. As shown in FIG. 5, when the holding member 80 holds the power supply housing 60, the height of the mounting body 82 is adjusted via the support body 84 by inserting a height adjustment screw 88 into the insertion hole 854 and screwing it into the screw hole 811 (see FIG. 4) of the base body 81. The height of the height adjustment screw 88 can be changed in the vertical direction by adjusting the degree of engagement of the nut 88n or the screw hole 811. Therefore, the height adjustment member 85 can adjust the height of one end of the support body 84 based on the degree of engagement of the height adjustment screw 88.

[0045] The support body 84 is supported by the guide groove 813 of the base body 81 at an intermediate position between one end connected to the height adjustment member 85 and the other end connected to the mounting body 82. More specifically, the underside of the support body 84 near one end contacts the bottom surface of the guide groove 813, and the other end of the support body 84 extends obliquely upward from this contact portion as the support body 84 curves, thereby supporting the mounting body 82. The contact portion of the support body 84 serves as a fulcrum for supporting the mounting body 82 and the power supply housing 60.

[0046] In other words, the floating structure 83 supports the mounting body 82 by the principle of a lever, with the contact portion of the support body 84 as the fulcrum, one end of the support body 84 (the connection portion with the height adjustment member 85) as the force point, and the other end of the support body 84 (the connection portion with the mounting body 82) as the point of application. In other words, the support body 84 is a continuous member having a force point, a fulcrum, and a point of application. This allows the worker installing the power supply housing 60 to easily adjust the height position of the mounting body 82 connected to the point of application by operating the height adjustment member 85 on one end side of the holding member 80.

[0047] The holding member 80 also holds the power supply housing 60 via a lower jig 90. The lower jig 90 is formed in an L-shape that holds the left and right corners of the power supply housing 60 when viewed from the front of the power supply housing 60, and extends in the depth direction of the power supply housing 60. The lower jig 90 and the mounting body 82 of the holding member 80 are fixed to each other by threading a fastening bolt 91 into a screw hole 824 (see FIG. 3 ) formed on one end of the mounting body 82. In other words, the worker can also connect the mounting body 82 and the lower jig 90 at one end of the holding member 80, making it possible to easily install the power supply housing 60.

[0048] 6A and 6B are side views illustrating adjustment of the height position of the holding member 80. FIG. 6A shows a configuration in which the mounting body 82 is positioned high, and FIG. 6B shows a configuration in which the mounting body 82 is positioned low. As shown in FIG. 6A, when the height position of the mounting body 82 supporting the lower jig 90 and the power supply housing 60 (see FIG. 5) is set high, the height adjustment screw 88 is deeply screwed into the nut 88n or the base body 81. The height adjustment member 85 pressed by this height adjustment screw 88 is displaced to a lower position overall. In other words, the height adjustment member 85 is positioned so that the gap between the base body 81 and the base portion 851 of the height adjustment member 85 is narrowed. As a result, one end of the support body 84 connected to the height adjustment member 85 is also pushed down to a lower position.

[0049] The support body 84, one end of which is pushed down by the height adjustment member 85, extends in a generally straight line from the one end (point of force) to a certain range, and this portion forms a fulcrum (support range) when it comes into contact with the base body 81. The curved portion of the support body 84 extends at a relatively steep angle when it moves away from the fulcrum, allowing the mounting body 82 connected to the other end (point of action) to be positioned at a higher position.

[0050] On the other hand, as shown in Figure 6 (B), when the height position of the mounting body 82 is set low, the height adjustment screw 88 is shallowly screwed into the nut 88n or the base body 81. The height adjustment member 85 pressed by this height adjustment screw 88 is displaced to a higher position overall. In other words, the height adjustment member 85 is positioned so that the gap between the base body 81 and the base portion 851 of the height adjustment member 85 is widened. As a result, one end of the support body 84 connected to the height adjustment member 85 is also pushed up to a higher position.

[0051] The support 84, one end of which is pushed up by the height adjustment member 85, extends downward from the one end (point of force) in a slightly curved manner. The curved extending portion of the support 84 comes into contact with the base body 81, forming a fulcrum (support range). The fulcrum of the support 84 in this case is located at a position shifted in the depth direction from the fulcrum of the support 84 in FIG. 6A. The length of the curved portion of the support 84 from this fulcrum to the mounting body 82 to which the other end (point of action) is connected is shortened, allowing the mounting body 82 to be positioned at a lower position.

[0052] In this way, the holding member 80 can easily adjust the height position of the mounting body 82 supported by the support body 84 using the height adjustment member 85 and height adjustment screw 88 on one end side. As a result, the holding member 80 can absorb mechanical differences and assembly errors of the power supply housing 60, and can position the power supply housing 60 at an appropriate position in the accommodation space 50s.

[0053] The semiconductor manufacturing apparatus (plasma processing apparatus 1) according to the embodiment is basically configured as described above. An installation method for installing the power supply housing 60 in the equipment frame 50 will now be described. FIG. 7A is a flowchart showing the steps of the installation method for installing the power supply housing 60 in the equipment frame 50. FIG. 7B is a flowchart showing the steps of the removal method for removing the power supply housing 60 from the equipment frame 50. FIG. 8A is a first perspective view showing a step during installation of the power supply housing 60. FIG. 8B is a second perspective view showing a step subsequent to FIG. 8A. FIG. 8C is a third perspective view showing a step subsequent to FIG. 8B.

[0054] As shown in FIG. 7A , in the installation method, the power supply housing 60 is first mounted and integrated onto the dolly 70, and then the power supply housing 60 and the dolly 70 are moved into the accommodation space 50s of the equipment frame 50 (step S101). The lower jig 90 (see FIG. 5 ) may be attached to the power supply housing 60 after the dolly 70 is mounted, or the lower jig 90 may be attached in advance before the dolly 70 is mounted. The dolly 70 climbs the inclined frame 55 of the equipment frame 50, then moves over the bottom frame 521 to enter the accommodation space 50s. This allows the worker to smoothly place the power supply housing 60 in the accommodation space 50s.

[0055] Next, the worker inserts the lifting jig 75 into the accommodation space 50s of the device frame 50 and below the power supply housing 60 supported by the dolly 70, and further raises the power supply housing 60 using the lifting jig 75 (step S102). Specifically, as shown in FIG. 8A , the lifting jig 75 is inserted from the opening of the accommodation space 50s into the space between the bottom frame 521 and the panel base 71 of the dolly 70. The lifting jig 75 is positioned at approximately the middle position in the width direction of the power supply housing 60. Thereafter, the worker rotates the handle 78 of the lifting jig 75 to raise the base 77, bringing the base 77 into contact with the panel base 71 of the dolly 70, and continues to raise the power supply housing 60.

[0056] After the power supply housing 60 is raised by the lifting jig 75, the worker inserts a pair of holding members 80 into the lower portion of the power supply housing 60 in the accommodation space 50s and installs each holding member 80 on the device frame 50 (step S103). As shown in FIG. 8B , the worker aligns the extension direction of each holding member 80 so that it extends from the opening of the accommodation space 50s toward the depth direction, and inserts each holding member 80 in a straight line. As shown in FIG. 5 , a guide member 56 is fixed to the upper surface of the bottom frame 521 of the device frame 50 to guide the insertion direction of the holding members 80 and restrict movement of the holding members 80 in the depth direction. When the holding members 80 are inserted in the depth direction, a positioning portion 815 cut out at the bottom of the other end of the holding member 80 engages with the guide member 56. This positions the holding members 80 relative to the bottom frame 521.

[0057] Thereafter, the worker lifts the mounting body 82 from the base body 81, fixes the lower jig 90 of the power supply housing 60 to the mounting body 82, and then screws in the height adjustment screws 88 of the height adjustment members 85, thereby lifting the power supply housing 60 from the lifting jig 75 (step S104). As shown in Fig. 8C, the pair of holding members 80 lift the power supply housing 60, so that the power supply housing 60 is held by each holding member 80 alone.

[0058] As shown in Fig. 2A, the power supply housing 60 may be fixed to the device frame 50 by fixing members 58 while being held by a pair of holding members 80. Fig. 2A shows a state in which the sub-housing 62 and the intermediate frame 522 are fixed by the fixing members 58. However, the fixing means between the device frame 50 and the power supply housing 60 is not limited to this, and for example, the main housing 61 and the device frame 50 (such as the side frame 51) may be connected to each other.

[0059] Finally, the worker removes the lifting jig 75 from the equipment frame 50, removes the dolly 70 from under the power supply housing 60 that has been raised by the pair of holding members 80, and moves the dolly 70 back from the equipment frame 50 (step S105 in FIG. 7). This allows the worker to efficiently establish a state in which the power supply housing 60 and each holding member 80 are housed in the housing space 50s of the equipment frame 50.

[0060] During maintenance work on the plasma processing apparatus 1, the power supply housing 60 is removed from the apparatus frame 50 to perform inspection, repair, replacement, etc. The power supply housing 60 can be easily removed from the apparatus frame 50 by following the reverse procedure of the installation method, as shown in FIG.

[0061] Specifically, the worker first inserts the cart 70 and the lifting jig 75 into the lower part of the power supply housing 60, which is suspended by a pair of holding members 80 within the device frame 50, and supports the power supply housing 60 with the base 77 of the lifting jig 75 (step S111).

[0062] The worker then operates the height adjustment screws 88 on one end side (the opening side of the accommodation space 50s) of the holding members 80 to release the lift of the power supply housing 60 caused by the holding members 80 (step S112). At this time, the worker releases the fixation between the mounting body 82 and the lower jig 90 and reduces the engagement of the height adjustment screws 88. This allows each holding member 80 to smoothly descend relative to the lower jig 90 of the power supply housing 60.

[0063] Thereafter, the worker detaches each of the pair of holding members 80 from the device frame 50 (step S113). That is, each holding member 80 is detachably housed in the power supply housing 60 while the power supply housing 60 is positioned inside the device frame 50, and therefore can be removed at a different time from the power supply housing 60.

[0064] The worker then operates the handle 78 of the lifting jig 75 to lower the platform 77, thereby bringing the casters 72 of the cart 70 carrying the power supply housing 60 into contact with the bottom frame 521 (step S114). The worker further lowers the platform 77 to separate the lifting jig 75 from the cart 70, making it possible to remove the lifting jig 75. This allows the worker to detach the lifting jig 75 from the device frame 50.

[0065] Finally, the worker moves the cart 70 backward to pull out the power supply housing 60 from the equipment frame 50 (step S115). This removal method allows the worker to smoothly remove the power supply housing 60 from the equipment frame 50.

[0066] As described above, the plasma processing apparatus 1 can easily position and fix the power supply housing 60, which is an item housed in the apparatus frame 50, by using the holding members 80. This allows the plasma processing apparatus 1 to improve the efficiency of workers' installation and removal of the power supply housing 60 inside the apparatus frame 50. In particular, the plasma processing apparatus 1 can stably hold the power supply housing 60 within the apparatus frame 50 by holding the power supply housing 60 with the pair of holding members 80.

[0067] Furthermore, by using the principle of leverage to lift the power supply housing 60, the holding member 80 allows the operator to operate it at one end of the holding member 80, thereby avoiding the need to operate it at the back of the device frame 50. Furthermore, by realizing the principle of leverage with a series of supports 84, the holding member 80 can increase the strength with which it holds the power supply housing 60. In particular, the supports 84 have a curved shape near the fulcrum, which further increases their strength. Furthermore, by operating the height adjustment screw 88 of the height adjustment member 85, the operator can easily adjust the height of the mounting body 82.

[0068] The technology of the present disclosure is not limited to the above embodiment and may take various forms. For example, the contents housed inside the equipment frame 50 are not limited to the power supply housing 60, and may be applied to various configurations of semiconductor manufacturing equipment. In this case, too, by using the holding member 80 in the configuration of the semiconductor manufacturing equipment, the configuration can be installed in a floating form.

[0069] Furthermore, the semiconductor manufacturing apparatus is not limited to the above-mentioned plasma processing apparatus 1, but can also be applied to various apparatuses that perform substrate processing such as film formation, etching, cleaning, temperature adjustment, bonding, peeling, etc., or to apparatuses that inspect substrates W, and apparatuses that transport substrates W.

[0070] Furthermore, the number of holding members 80 housed in the device frame 50 is not limited to a pair, and may be one, three, or more. For example, when one holding member 80 is used, the base body 81, the mounting body 82, and the support body 84 may be widened in the width direction, or the number of base bodies 81, the mounting body 82, and the support body 84 may be increased.

[0071] The embodiments disclosed above include, for example, the following aspects. [Supplementary Note 1] A semiconductor manufacturing apparatus for manufacturing semiconductors, comprising: a container placed inside an equipment frame of the semiconductor manufacturing apparatus; and a holding member housed inside the equipment frame together with the container and holding the container, the holding member comprising: a base body; a mounting body attached to a lower part of the container; and a levitation structure provided between the base body and the mounting body and raising the mounting body from the base body. [Supplementary Note 2] The semiconductor manufacturing apparatus according to Supplementary Note 1, wherein the levitation structure is a structure that raises the mounting body by the principle of leverage. [Supplementary Note 3] The semiconductor manufacturing apparatus according to Supplementary Note 2, wherein the levitation structure comprises a series of supports having a force point, a fulcrum supported by the base body, and a point of action connected to the mounting body. [Supplementary Note 4] The semiconductor manufacturing apparatus according to Supplementary Note 3, wherein the levitation structure comprises a series of supports having a force point, a fulcrum supported by the base body, and a point of action connected to the mounting body. [Supplementary Note 5] The semiconductor manufacturing apparatus according to Supplementary Note 4, wherein the height adjustment member has a height adjustment screw that screws into the base body at an end opposite to the connection point where it is connected to the support body. [Supplementary Note 6] The semiconductor manufacturing apparatus according to any one of Supplements 3 to 5, wherein the support body extends in a curved manner from the force point toward the application point. [Supplementary Note 7] The semiconductor manufacturing apparatus according to any one of Supplements 3 to 6, wherein the support body is rotatably connected to the attachment body at the application point. [Supplementary Note 8] The semiconductor manufacturing apparatus according to any one of Supplements 1 to 7, wherein the holding member is attachable to and detachable from the stored item when the stored item is positioned inside the equipment frame. [Supplementary Note 9] The semiconductor manufacturing apparatus according to Supplementary Note 8, wherein the holding member has a positioning portion that slides relative to the equipment frame to be positioned on the equipment frame. [Supplementary Note 10] The semiconductor manufacturing apparatus according to any one of Supplements 1 to 9, wherein the holding members are installed in pairs below the stored item. [Supplementary Note 11] The semiconductor manufacturing apparatus according to any one of Supplementary Notes 1 to 10, wherein the container is a power supply housing that houses a power supply applied to the semiconductor manufacturing apparatus.[Supplementary Note 12] An installation method for installing a contained object in semiconductor manufacturing equipment for manufacturing semiconductors, comprising: (A) a step of accommodating the contained object inside an equipment frame of the semiconductor manufacturing equipment; (B) a step of accommodating a holding member inside the equipment frame and below the contained object after the step (A); and (C) a step of operating a floating structure provided between a base body of the holding member and a mounting body attached to the lower part of the contained object, to raise the mounting body relative to the base body after the step (B).

[0072] The semiconductor manufacturing apparatus and installation method according to the presently disclosed embodiments are illustrative in all respects and are not limiting. The embodiments may be modified and improved in various ways without departing from the spirit and scope of the appended claims. The features described in the above embodiments may be configured differently and may be combined within the scope of the present invention.

[0073] The substrate processing apparatus of the present disclosure can be applied to any type of apparatus, including atomic layer deposition (ALD) apparatus, capacitively coupled plasma (CCP), inductively coupled plasma (ICP), radial line slot antenna (RLSA), electron cyclotron resonance plasma (ECR), and helicon wave plasma (HWP).

[0074] This application claims priority from Japanese Patent Application No. 2023-187933, filed on November 1, 2023, with the Japan Patent Office, the entire contents of which are incorporated herein by reference.

[0075] REFERENCE SIGNS LIST 1 Plasma processing apparatus 50 Apparatus frame 60 Power supply housing 80 Holding member 81 Base body 82 Mounting body 83 Floating structure

Claims

1. A semiconductor manufacturing apparatus for manufacturing semiconductors, comprising: an object to be placed inside an equipment frame of the semiconductor manufacturing apparatus; and a holding member that is contained inside the equipment frame together with the object and holds the object, the holding member comprising a base body, a mounting body that is attached to a lower part of the object, and a levitation structure that is provided between the base body and the mounting body and that raises the mounting body from the base body.

2. The semiconductor manufacturing device according to claim 1, wherein the floating structure is a structure that raises the mounting body by using the principle of a lever.

3. The semiconductor manufacturing device according to claim 2, wherein the floating structure comprises a series of supports having a force point, a fulcrum supported by the base body, and a point of action connected to the mounting body.

4. The semiconductor manufacturing device according to claim 3, wherein the floating structure has a height adjustment member connected to the force point of the support and for adjusting the height of the force point.

5. The semiconductor manufacturing device according to claim 4, wherein the height adjustment member has a height adjustment screw that is screwed into the base body at an end opposite to a connection point where the height adjustment member is connected to the support body.

6. The semiconductor manufacturing device according to claim 3, wherein the support extends in a curved manner from the force point to the action point.

7. The semiconductor manufacturing device according to claim 3, wherein the support is rotatably connected to the mounting body at the point of application.

8. The semiconductor manufacturing equipment according to any one of claims 1 to 7, wherein the holding member is detachable from the stored object while the stored object is positioned inside the equipment frame.

9. The semiconductor manufacturing equipment according to claim 8, wherein the holding member has a positioning portion that is positioned on the equipment frame by sliding relatively to the equipment frame.

10. The semiconductor manufacturing device according to any one of claims 1 to 7, wherein the holding members are installed in a pair below the contained object.

11. The semiconductor manufacturing equipment according to any one of claims 1 to 7, wherein the container is a power supply housing that houses a power supply applied to the semiconductor manufacturing equipment.

12. An installation method for installing an object in a semiconductor manufacturing equipment for manufacturing semiconductors, comprising: (A) a step of accommodating the object inside an equipment frame of the semiconductor manufacturing equipment; (B) after step (A), a step of accommodating a holding member inside the equipment frame and below the object; and (C) after step (B), a step of operating a floating structure provided between a base body of the holding member and a mounting body attached to the lower part of the object, to raise the mounting body relative to the base body.