Photosensitive resin composition, dry film, cured product, and electronic component

Abstract

[Problem] To provide a photosensitive resin composition which is excellent in terms of resolution and is capable of forming a cured product having a high blackness (OD value) as seen by human eyes. [Solution] A photosensitive resin composition according to the present invention comprises (A) a colorant, (B) an alkali-soluble resin, (C) a photopolymerization initiator, and (D) a photopolymerizable monomer. The photosensitive resin composition is characterized in that the ratio of the absorbance at 405 nm to the absorbance at 555 nm for a dry coating film of the composition is 0.60 or less.

Description

Photosensitive resin composition, dry film, cured product, and electronic component

[0001] The present invention relates to a photosensitive resin composition, a dry film, a cured product, and an electronic component.

[0002] In recent years, development has been progressing on self-emissive displays, or so-called micro LED or mini LED displays, which incorporate tiny LED chips into the pixels of a circuit board, as next-generation display devices. While conventional displays create contrast by varying the brightness of the LEDs, self-emissive displays express a range of colors from bright to black by completely turning the LEDs on and off. For this reason, micro LED or mini LED displays are expected to be next-generation display devices with high contrast.

[0003] In micro LED displays or mini LED displays, a black matrix is ​​used to prevent color mixing between adjacent LED chips. In these displays, the LEDs are turned off to display black, so the base color of the substrate using the black matrix is ​​black. Therefore, to achieve high contrast, it is necessary to develop a black material that has a high blackness as seen by the human eye, i.e., a high OD value.

[0004] Patent Document 1 proposes a black photosensitive resin composition that contains at least one black colorant selected from the group consisting of carbon black, perylene black, aniline black, and titanium black, as a black photosensitive resin composition that has high deep curing properties despite its black color and whose cured product has high matte properties.

[0005] Japanese Patent Application Laid-Open No. 2022-154993

[0006] However, when a photosensitive resin composition containing a large amount of a black colorant such as carbon black is used to realize a photosensitive resin composition with a higher blackness, such as an OD value of 3 or more, the composition absorbs a large amount of ultraviolet light during exposure, making it difficult for the light to reach deep within the solder resist coating film. As a result, photocuring deep within the solder resist coating film becomes insufficient, leaving room for improvement in terms of resolution, etc.

[0007] On the other hand, in terms of visual sensitivity, the human eye perceives green light of 555 nm as the brightest, so in order to create a black that is highly black to the human eye, it is thought that a combination of colorants that have strong absorption around 555 nm is effective.

[0008] Therefore, an object of the present invention is to provide a photosensitive resin composition which can give a cured product having a high degree of blackness (OD value) as seen by the human eye and which has excellent resolution.

[0009] As a result of intensive research aimed at achieving the above-mentioned object, the present inventors have found that the above-mentioned problem can be solved by adjusting the ratio of the absorbance at 405 nm to the absorbance at 555 nm of a dried coating film of a photosensitive resin composition containing (A) a colorant, (B) an alkali-soluble resin, (C) a photopolymerization initiator, and (D) a photopolymerizable monomer to fall within a specific numerical range, and have thus completed the present invention.

[0010] That is, the present invention provides the following: [1] A photosensitive resin composition comprising: (A) a colorant; (B) an alkali-soluble resin; (C) a photopolymerization initiator; and (D) a photopolymerizable monomer, wherein a ratio of the absorbance at 405 nm to the absorbance at 555 nm of a dried coating film of the photosensitive resin composition is 0.60 or less. [2] The photosensitive resin composition according to [1], wherein the (A) colorant comprises an anthraquinone blue pigment, a perylene red pigment, and an anthraquinone yellow pigment. [3] The photosensitive resin composition according to [2], wherein the amount of the anthraquinone blue pigment is 45 parts by mass or more and 65 parts by mass or less, the amount of the perylene red pigment is 25 parts by mass or more and 45 parts by mass or less, and the amount of the anthraquinone yellow pigment is 1 part by mass or more and 15 parts by mass or less, relative to a total 100 parts by mass of the anthraquinone blue pigment, the perylene red pigment, and the anthraquinone yellow pigment. [4] The photosensitive resin composition according to any one of [1] to [3], wherein the amount of the (A) colorant is 1% by mass or more and 80% by mass or less, calculated as a solid content based on the total amount of the photosensitive resin composition. [5] The photosensitive resin composition according to any one of [1] to [4], wherein the amount of the (B) alkali-soluble resin is 20% by mass or more and 80% by mass or less, calculated as a solid content based on the total amount of the photosensitive resin composition. [6] The photosensitive resin composition according to any one of [1] to [5], wherein the blending amount of the (C) photopolymerization initiator is 0.01% by mass or more and 2.0% by mass or less, calculated as solid content based on the total amount of the photosensitive resin composition. [7] The photosensitive resin composition according to any one of [1] to [6], wherein the blending amount of the (D) photopolymerizable monomer is 3% by mass or more and 40% by mass or less, calculated as solid content based on the total amount of the photosensitive resin composition. [8] A dry film comprising a first film and a resin layer formed on the first film, the resin layer being a dried coating film of the photosensitive resin composition according to any one of [1] to [7]. [9] A cured product obtained by curing the photosensitive resin composition according to any one of [1] to [7].

[10] A cured product obtained by curing the resin layer of the dry film according to [8].

[11] An electronic component comprising the cured product according to [9].

[12] An electronic component comprising the cured product according to

[10] .

[0011] According to the present invention, a photosensitive resin composition can be provided that can produce a cured product with a high degree of blackness (OD value) as seen by the human eye and excellent resolution. In particular, the photosensitive resin composition of the present invention has a high transmittance of light with a wavelength of 405 nm (h-line) and strongly absorbs light around 555 nm, which is perceived as the brightest by the human eye. This allows for the production of a cured product with a high degree of blackness (OD value) while maintaining good resolution. Therefore, the photosensitive resin composition of the present invention can be suitably used as a resin layer in a dry film. Furthermore, the cured product obtained by curing the resin layer of the dry film is also useful as a black matrix for self-luminous LED displays of electronic components.

[0012] [Photosensitive Resin Composition] The photosensitive resin composition of the present invention contains at least (A) a colorant, (B) an alkali-soluble resin, (C) a photopolymerization initiator, and (D) a photopolymerizable monomer, and may further contain a curing catalyst and other components.

[0013] In a dried coating film of such a photosensitive resin composition, the ratio of the absorbance at 405 nm to the absorbance at 555 nm is 0.60 or less, preferably 0.01 or more and 0.50 or less, and more preferably 0.01 or more and 0.40 or less. The photosensitive resin composition of the present invention has a high transmittance of light with a wavelength of 405 nm (h-line) through a dried coating film, and also strongly absorbs light around 555 nm, which is perceived as the brightest by the human eye. Therefore, it is possible to obtain a cured product with high blackness (OD value) while maintaining good resolution.

[0014] Each component constituting the photosensitive resin composition of the present invention will be described below.

[0015] (A) Colorant) The colorant is not particularly limited as long as it can adjust the ratio of the absorbance at 405 nm to the absorbance at 555 nm of a dried coating film of the photosensitive resin composition to fall within the above-mentioned range. For example, known colorants such as blue, red, and yellow can be used as the colorant, and any of pigments, dyes, and coloring matters can be used. However, from the viewpoint of reducing the environmental load and the effects on the human body, it is preferable that the colorant does not contain halogen.

[0016] Examples of blue colorants include anthraquinone-based and phthalocyanine-based pigments. For example, Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, and 60. Examples of dye-based pigments that can be used include Solvent Blue 35, 63, 68, 70, 83, 87, 94, 97, 122, 136, 67, and 70. In addition to the above, metal-substituted or unsubstituted phthalocyanine compounds can also be used. In particular, in the present invention, it is preferable to use an anthraquinone-based blue pigment in order to adjust the ratio of the absorbance at 405 nm to the absorbance at 555 nm of the dried coating film of the photosensitive resin composition to within the above-mentioned range.

[0017] Examples of red colorants include perylene-based, monoazo-based, disazo-based, azo-lake-based, benzimidazolone-based, diketopyrrolopyrrole-based, condensed azo-based, anthraquinone-based, quinacridone-based, etc. Examples of perylene-based red colorants include Solvent Red 135, 179, Pigment Red 123, 149, 166, 178, 179, 190, 194, and 224. Examples of monoazo red colorants include Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, and 269. Examples of disazo red colorants include Pigment Red 37, 38, and 41. Examples of monoazo lake-based red colorants include Pigment Red 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 52:2, 53:1, 53:2, 57:1, 58:4, 63:1, 63:2, 64:1, and 68. Examples of benzimidazolone-based red colorants include Pigment Red 171, 175, 176, 185, and 208. Examples of diketopyrrolopyrrole-based red colorants include Pigment Red 254, 255, 264, 270, and 272. Condensed azo red colorants include Pigment Red 220, 144, 166, 214, 220, 221, and 242. Anthraquinone red colorants include Pigment Red 168, 177, and 216, and Solvent Red 149, 150, 52, and 207. Quinacridone red colorants include Pigment Red 122, 202, 206, 207, and 209. In particular, in the present invention, it is preferable to use a perylene red pigment in order to adjust the ratio of the absorbance at 405 nm to the absorbance at 555 nm of a dried coating film of the photosensitive resin composition to within the above-mentioned range.

[0018] Examples of yellow colorants include anthraquinone-based, monoazo-based, disazo-based, condensed azo-based, benzimidazolone-based, and isoindolinone-based colorants. Examples of anthraquinone-based yellow colorants include Solvent Yellow 163, Pigment Yellow 24, 108, 193, 147, 199, and 202. Examples of monoazo-based yellow colorants include Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62:1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116, 167, 168, 169, 182, and 183. Examples of disazo yellow colorants include Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, and 198. Examples of condensed azo yellow colorants include Pigment Yellow 93, 94, 95, 128, 155, 166, and 180. Examples of benzimidazolone yellow colorants include Pigment Yellow 120, 151, 154, 156, 175, and 181. Examples of isoindolinone yellow colorants include Pigment Yellow 110, 109, 139, 179, and 185. In particular, in the present invention, it is preferable to use an anthraquinone yellow pigment in order to adjust the ratio of the absorbance at 405 nm to the absorbance at 555 nm of the dried coating film of the photosensitive resin composition to fall within the above-mentioned range.

[0019] Other colorants such as purple, orange, brown, etc. may also be used. Specific examples include C.I. Pigment Black 1, 6, 7, 8, 9, 10, 11, 12, 13, 18, 20, 25, 26, 28, 29, 30, 31, 32, C.I. Pigment Violet 19, 23, 29, 32, 36, 38, 42, Solvent Violet 13, 36, C.I. Pigment Orange 1, 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 61, 63, 64, 71, 73, and C.I. Pigment Brown 23 and 25.

[0020] The amount of the colorant blended is, in terms of solid content, preferably 1% by mass to 80% by mass, more preferably 2% by mass to 60% by mass, even more preferably 3% by mass to 50% by mass, and still more preferably 4% by mass to 40% by mass. When the amount of the colorant blended is within the above range, good deep curing is achieved.

[0021] In a preferred embodiment of the present invention, the colorant preferably contains an anthraquinone-based blue pigment, a perylene-based red pigment, and an anthraquinone-based yellow pigment. In particular, relative to 100 parts by mass of the total of the anthraquinone-based blue pigment, the perylene-based red pigment, and the anthraquinone-based yellow pigment, the amount of the anthraquinone-based blue pigment is preferably 45 parts by mass or more and 65 parts by mass or less, more preferably 48 parts by mass or more and 62 parts by mass or less, and even more preferably 50 parts by mass or more and 60 parts by mass or less; the amount of the perylene-based red pigment is preferably 25 parts by mass or more and 45 parts by mass or less, more preferably 28 parts by mass or more and 42 parts by mass or less, and even more preferably 30 parts by mass or more and 40 parts by mass or less; and the amount of the anthraquinone-based yellow pigment is preferably 1 part by mass or more and 15 parts by mass or less, more preferably 2 parts by mass or more and 12 parts by mass or less, and even more preferably 3 parts by mass or more and 10 parts by mass or less. When the amounts of the pigments are within the above numerical ranges, deep curing is favorable.

[0022] In a preferred embodiment of the present invention, from the viewpoint of resolution and the like, it is preferable to reduce the amount of black colorant in the photosensitive resin composition, and more preferably, the photosensitive resin composition is substantially free of black colorant. This is because light is less likely to reach deep into the coating film when the photosensitive resin composition is exposed to light. Examples of black colorants include carbon black and perylene black. From the viewpoint of resolution and the like, the amount of black colorant in the photosensitive resin composition is preferably less than 0.05 mass%, more preferably less than 0.01 mass%, even more preferably less than 0.005 mass%, or even 0 mass% in terms of solids content. Furthermore, from the viewpoint of resolution and the like, the amount of black colorant in the photosensitive resin composition is preferably less than 3 mass%, more preferably less than 2 mass%, even more preferably less than 1 mass%, or even 0 mass% in terms of solids content.

[0023] ((B) Alkali-Soluble Resin) The alkali-soluble resin may be any resin that is alkali-soluble, and known resins may be used. One type of alkali-soluble resin may be used alone, or two or more types may be used in combination. Examples of alkali-soluble resins include water-soluble resins such as carboxyl group-containing resins and phenolic hydroxyl group-containing resins. Among these, carboxyl group-containing resins and phenolic hydroxyl group-containing resins are preferred due to their excellent developability, and carboxyl group-containing resins are more preferred. By including a carboxyl group in the alkali-soluble resin, it is possible to make the resin alkali-developable. Furthermore, by having an ethylenically unsaturated double bond in the molecule in addition to the carboxyl group, the resin can be made photosensitive. As the ethylenically unsaturated double bond, those derived from acrylic acid or methacrylic acid or derivatives thereof are preferred.

[0024] Specific examples of carboxyl group-containing resins include the following compounds (which may be either oligomers or polymers): In this specification, (meth)acrylate is a general term for acrylates, methacrylates, and mixtures thereof, and the same applies to other similar expressions.

[0025] (1) Carboxylic acid-containing photosensitive urethane resins obtained by polyaddition reaction of diisocyanates with partially acid anhydride-modified products of reaction products of bifunctional epoxy resins such as bisphenol A epoxy resins, hydrogenated bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, bixylenol epoxy resins, and biphenol epoxy resins with monocarboxylic acid compounds having ethylenically unsaturated double bonds such as (meth)acrylic acid, carboxylic acid-containing dialcohol compounds, and diol compounds.

[0026] (2) Carboxylic acid-containing urethane resins obtained by the polyaddition reaction of diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates with carboxyl-containing dialcohol compounds such as dimethylolpropionic acid and dimethylolbutanoic acid, and diol compounds such as polycarbonate polyols, polyether polyols, polyester polyols, polyolefin polyols, acrylic polyols, bisphenol A alkylene oxide adduct diols, and compounds having a phenolic hydroxyl group and an alcoholic hydroxyl group, or carboxyl-containing photosensitive urethane resins obtained by adding a compound having one hydroxyl group and one or more (meth)acryloyl groups in the molecule, such as a hydroxyalkyl (meth)acrylate, during the synthesis of the resin of (1) above, to obtain (meth)acrylic-terminated carboxyl-containing photosensitive urethane resins.

[0027] (3) Carboxylic acid-containing urethane resins obtained by the polyaddition reaction of diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates with carboxyl-containing dialcohol compounds such as dimethylolpropionic acid and dimethylolbutanoic acid, and diol compounds such as polycarbonate polyols, polyether polyols, polyester polyols, polyolefin polyols, acrylic polyols, bisphenol A alkylene oxide adduct diols, and compounds having a phenolic hydroxyl group and an alcoholic hydroxyl group, or carboxyl-containing photosensitive urethane resins obtained by adding, during the synthesis of the resin of (1), a compound having one isocyanate group and one or more (meth)acryloyl groups in the molecule, such as an equimolar reaction product of isophorone diisocyanate and pentaerythritol triacrylate, to form terminal (meth)acrylates.

[0028] (4) A carboxyl group-containing photosensitive resin obtained by reacting a difunctional or more polyfunctional (solid) epoxy resin with (meth)acrylic acid and adding a dibasic acid anhydride to the hydroxyl group present in the side chain.

[0029] (5) A carboxyl group-containing photosensitive resin obtained by reacting a polyfunctional epoxy resin in which the hydroxyl groups of a bifunctional (solid) epoxy resin are further epoxidized with epichlorohydrin with (meth)acrylic acid, and then adding a dibasic acid anhydride to the resulting hydroxyl groups.

[0030] (6) A carboxyl group-containing photosensitive resin obtained by reacting an epoxy compound having multiple epoxy groups in one molecule with a compound having at least one alcoholic hydroxyl group and one phenolic hydroxyl group in one molecule, such as p-hydroxyphenethyl alcohol, and an unsaturated group-containing monocarboxylic acid, such as (meth)acrylic acid, and then reacting the alcoholic hydroxyl groups of the resulting reaction product with a polybasic acid anhydride, such as maleic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, or adipic acid.

[0031] (7) A carboxyl group-containing photosensitive resin obtained by reacting a compound having multiple phenolic hydroxyl groups in one molecule with an alkylene oxide such as ethylene oxide or propylene oxide, reacting the resulting reaction product with an unsaturated group-containing monocarboxylic acid, and then reacting the resulting reaction product with a polybasic acid anhydride.

[0032] (8) A carboxyl group-containing photosensitive resin obtained by reacting a compound having multiple phenolic hydroxyl groups in one molecule with a cyclic carbonate compound such as ethylene carbonate or propylene carbonate, reacting the resulting reaction product with an unsaturated group-containing monocarboxylic acid, and then reacting the resulting reaction product with a polybasic acid anhydride.

[0033] (9) A carboxyl group-containing photosensitive resin obtained by adding a compound having one epoxy group and one or more (meth)acryloyl groups in one molecule to the resins (1) to (8).

[0034] The amount of the alkali-soluble resin is, in terms of solid content, preferably 20% by mass or more and 80% by mass or less, more preferably 25% by mass or more and 75% by mass or less, even more preferably 30% by mass or more and 70% by mass or less, and still more preferably 35% by mass or more and 65% by mass or less, based on the total amount of the photosensitive resin composition. When the amount of the alkali-soluble resin is within the above range, good resolution is obtained.

[0035] (Photopolymerization initiator (C)) The photopolymerization initiator (C) is used to react the alkali-soluble resin or the photopolymerizable monomer by exposure to light. Any known photopolymerization initiator can be used. One type of photopolymerization initiator may be used alone, or two or more types may be used in combination.

[0036] Specific examples of the photopolymerization initiator include bis-(2,6-dichlorobenzoyl)phenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-2,5-dimethylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-4-propylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-1-naphthylphosphine oxide, bis-(2,6-dimethoxybenzoyl)phenylphosphine oxide, and bis-(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide. bisacylphosphine oxides such as sphingonitrile, bis-(2,6-dimethoxybenzoyl)-2,5-dimethylphenylphosphine oxide, and bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylphosphinic acid methyl ester, 2-methylbenzoyldiphenylphosphine oxide, and pivaloylphenylphosphinic acid methyl ester; monoacylphosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide, ethyl phenyl(2,4,6-trimethylbenzoyl)phosphinate, 1-hydroxy-cyclohexyl phenyl ketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 2-hydroxy Hydroxyacetophenones such as 2-methyl-1-phenylpropan-1-one; benzoins such as benzoin, benzil, benzoin methyl ether, benzoin ethyl ether, benzoin n-propyl ether, benzoin isopropyl ether, and benzoin n-butyl ether; benzoin alkyl ethers; benzophenones such as benzophenone, p-methylbenzophenone, Michler's ketone, methylbenzophenone, 4,4'-dichlorobenzophenone, and 4,4'-bisdiethylaminobenzophenone;Acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl)-1-[4-(4-morpholinyl)phenyl]-1-butanone acetophenones such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; anthraquinone, chloroanthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, Anthraquinones such as 2-aminoanthraquinone; ketals such as acetophenone dimethyl ketal and benzil dimethyl ketal; benzoic acid esters such as ethyl-4-dimethylaminobenzoate, 2-(dimethylamino)ethyl benzoate and p-dimethylbenzoic acid ethyl ester; 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyl oxime esters such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium and titanocenes such as bis(cyclopentadienyl)-bis[2,6-difluoro-3-(2-(1-pyr-1-yl)ethyl)phenyl]titanium; phenyl disulfide 2-nitrofluorene, butyroin, anisoin ethyl ether, azobisisobutyronitrile, tetramethylthiuram disulfide, and the like.

[0037] The amount of the photopolymerization initiator is, in terms of solid content, preferably 0.01% by mass or more and 2.0% by mass or less, more preferably 0.03% by mass or more and 1.5% by mass or less, even more preferably 0.05% by mass or more and 1.2% by mass or less, and even more preferably 0.10% by mass or more and 1.0% by mass or less, based on the total amount of the photosensitive resin composition. When the amount of the alkali-soluble resin is within the above numerical range, good curability is obtained.

[0038] ((D) Photopolymerizable Monomer) The (D) photopolymerizable monomer is a monomer having an ethylenically unsaturated double bond. Examples of such photopolymerizable monomers include alkyl (meth)acrylates such as 2-ethylhexyl (meth)acrylate and cyclohexyl (meth)acrylate; hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; mono- or di(meth)acrylates of alkylene oxide derivatives such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol; hexanediol, trimethylolpropane, pentaerythritol, ditrimethylolpropane, and dipentaerythritol; Examples of photopolymerizable monomers include polyhydric (meth)acrylates derived from polyhydric alcohols such as methyl acrylate and trishydroxyethyl isocyanurate, or polyhydric (meth)acrylates derived from their ethylene oxide or propylene oxide adducts; (meth)acrylates of ethylene oxide or propylene oxide adducts of phenols such as phenoxyethyl (meth)acrylate and polyethoxydi(meth)acrylate of bisphenol A; (meth)acrylates derived from glycidyl ethers such as glycerin diglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanurate; and melamine (meth)acrylate. Photopolymerizable monomers may be used alone or in combination of two or more. Such photopolymerizable monomers may also be used as reactive diluents.

[0039] The amount of the photopolymerizable monomer is, in terms of solid content, preferably 3% by mass or more and 40% by mass or less, more preferably 5% by mass or more and 35% by mass or less, even more preferably 7% by mass or more and 30% by mass or less, and even more preferably 9% by mass or more and 25% by mass or less, based on the total amount of the photosensitive resin composition. When the amount of the photopolymerizable monomer is within the above range, good curability is obtained.

[0040] (Thermosetting Component) The photosensitive resin composition of the present invention may contain a thermosetting component in addition to the components described above. Examples of the thermosetting component include known and commonly used components such as epoxy resins, isocyanate compounds, blocked isocyanate compounds, amino resins, maleimide compounds, benzoxazine resins, carbodiimide resins, cyclocarbonate compounds, oxetane compounds, and episulfide resins. Among these, the preferred thermosetting component is an epoxy resin.

[0041] Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol A type epoxy resins, brominated bisphenol A type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol A novolac type epoxy resins, biphenyl type epoxy resins, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, and triphenylmethane type epoxy resins. These may be used alone or in combination of two or more.

[0042] Examples of commercially available epoxy resins include jER 806, 807, 828, 834, YX8000, YX8034, and 834 manufactured by Mitsubishi Chemical Corporation; YD-128, YDF-170, ZX-1059, and ST-3000 manufactured by Nippon Steel Chemical & Material Co., Ltd.; EPICLON 830, 835, 840, 850, N-730A, and N-695 manufactured by DIC Corporation; and RE-306 manufactured by Nippon Kayaku Co., Ltd.

[0043] The amount of the thermosetting component, calculated as solid content based on the total amount of the photosensitive resin composition, is preferably 3% by mass to 50% by mass, more preferably 5% by mass to 45% by mass, even more preferably 7% by mass to 40% by mass, still more preferably 9% by mass to 35% by mass, and most preferably 10% by mass to 30% by mass. If the amount of the thermosetting component is within the above range, the strength of the cured product will be good.

[0044] (Curing Catalyst) When a thermosetting component is included in the photosensitive resin composition, the photosensitive resin composition may contain a thermosetting catalyst for accelerating the curing of the thermosetting component. Examples of the curing catalyst include imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; amine compounds such as dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, and 4-methyl-N,N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; and phosphorus compounds such as triphenylphosphine. Commercially available compounds include, for example, 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, and 2P4MHZ (all of which are trade names of imidazole-based compounds) manufactured by Shikoku Chemicals Corporation, and U-CAT 3513N (a trade name of a dimethylamine-based compound), DBU, DBN, and U-CAT SA 102 (all of which are bicyclic amidine compounds and salts thereof) manufactured by San-Apro Co., Ltd. Also usable are S-triazine derivatives such as guanamine, acetoguanamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine·isocyanuric acid adduct, and 2,4-diamino-6-methacryloyloxyethyl-S-triazine·isocyanuric acid adduct, and these compounds that also function as adhesion promoters are preferably used in combination with a heat curing catalyst.The heat curing catalyst may be used alone or in combination of two or more types.

[0045] The amount of the curing catalyst is preferably 0.01% by mass or more and 5.0% by mass or less, more preferably 0.05% by mass or more and 3.0% by mass or less, and even more preferably 0.1% by mass or more and 1.0% by mass or less, in terms of solid content, based on the total amount of the photosensitive resin composition. When the amount of the curing catalyst is within the above numerical range, good curability is obtained.

[0046] (Organic Solvent) The photosensitive resin composition may contain an organic solvent for the purpose of preparing the composition or adjusting the viscosity when applying the composition to the first film. Examples of the organic solvent include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, diethylene glycol monomethyl ether acetate, and tripropylene glycol monomethyl ether; esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, diethylene glycol monoethyl ether acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate; aliphatic hydrocarbons such as octane and decane; and petroleum-based solvents such as petroleum ether, petroleum naphtha, and solvent naphtha. These organic solvents may be used alone or in combination of two or more.

[0047] The amount of the organic solvent to be added is not particularly limited, and can be appropriately set depending on the target viscosity so as to facilitate the preparation of the photosensitive resin composition.

[0048] (Other Additive Components) The photosensitive resin composition of the present invention may further contain other components, such as antioxidants, antifoaming agents, leveling agents, cyanate compounds, elastomers, mercapto compounds, thixotropic agents, adhesion promoters, chain transfer agents, polymerization inhibitors, copper inhibitors, rust inhibitors, thickeners, and flame retardants, as required. These may be any of those known in the field of electronic materials.

[0049] The photosensitive resin composition of the present invention may be used in the form of a dry film.

[0050] [Preparation Method] The photosensitive resin composition of the present invention can be prepared by weighing and blending the components, pre-stirring them with a stirrer, and then dispersing and kneading the components in a kneader.

[0051] Examples of the kneading machine include a bead mill, a ball mill, a sand mill, a three-roll mill, and a two-roll mill. Among these, a bead mill is preferably used to improve dispersibility. Dispersion conditions such as the type and particle size of the beads of the bead mill can be appropriately set depending on the target viscosity.

[0052] [Applications] The photosensitive resin composition of the present invention has a high degree of blackness, i.e., a high OD value, and can be preferably used in applications for forming a patterned layer of a cured product, such as a material for forming a black matrix of a micro LED display device or a mini LED display device, a pixel dividing layer of an organic EL display device, a black matrix of a liquid crystal display device, or a black bezel of a display device.

[0053] The photosensitive resin composition of the present invention can also be used to form pattern layers as permanent coatings for printed wiring boards, such as solder resists, coverlays, and interlayer insulating layers.

[0054] [Dry Film] The photosensitive resin composition of the present invention can also be in the form of a dry film comprising a first film and a resin layer formed on the first film, the resin layer being a dried coating of the photosensitive resin composition. The term "first film" as used herein refers to a film that is at least adhered to the resin layer when the dry film is laminated onto a substrate or other base material by heating or other means so that the resin layer side of the dry film is in contact with the resin layer side of the photosensitive resin layer formed on the dry film and integrally formed. The first film may be peeled from the resin layer in a post-lamination step. In particular, in the present invention, peeling from the resin layer in a post-exposure step is preferred. To form a dry film, the photosensitive resin composition of the present invention is diluted with the organic solvent to an appropriate viscosity, and then coated to a uniform thickness on the first film using a comma coater, blade coater, lip coater, rod coater, squeeze coater, reverse coater, transfer roll coater, gravure coater, spray coater, or the like. The resulting film is typically dried at a temperature of 50 to 130°C for 1 to 30 minutes. There is no particular restriction on the thickness of the coating film, but it is generally selected appropriately within the range of 1 to 150 μm, preferably 2 to 60 μm, in terms of thickness after drying.

[0055] The first film can be any known film without particular limitation, and examples of suitable films include polyester films such as polyethylene terephthalate and polyethylene naphthalate, and films made of thermoplastic resins such as polyimide films, polyamideimide films, polypropylene films, and polystyrene films. Among these, polyester films are preferred from the viewpoints of heat resistance, mechanical strength, ease of handling, etc. A laminate of these films can also be used as the first film.

[0056] From the viewpoint of improving mechanical strength, the thermoplastic resin film as described above is preferably a film stretched in a uniaxial or biaxial direction.

[0057] The thickness of the first film is not particularly limited, but can be, for example, 10 μm to 150 μm.

[0058] After forming a resin layer consisting of a dried coating film of the photosensitive resin composition of the present invention on the first film, a peelable second film may be laminated on the surface of the resin layer for the purpose of preventing dust from adhering to the surface of the resin layer. The second film in the present invention refers to a film that is peeled from the photosensitive resin layer before lamination when the dry film is laminated by heating or the like so that the resin layer side of the dry film is in contact with a substrate or other base material to form an integral mold. Examples of the peelable second film that can be used include polyethylene film, polytetrafluoroethylene film, polypropylene film, and surface-treated paper, as long as the adhesive strength between the resin layer and the second film is smaller than the adhesive strength between the resin layer and the first film when the second film is peeled off.

[0059] The thickness of the second film is not particularly limited, but can be, for example, 10 μm to 150 μm.

[0060] [Cured Product] The cured product of the present invention is obtained by curing the photosensitive resin composition of the present invention or the resin layer of the dry film of the present invention. The manufacturing conditions such as curing conditions will be described later. The cured product of the present invention can be suitably used for electronic components such as circuit boards.

[0061] [Electronic Component] The electronic component of the present invention includes the cured product of the present invention. The electronic component of the present invention can be produced by a method of directly applying the photosensitive resin composition of the present invention onto a substrate, or by a method of using the dry film of the present invention.

[0062] A method for forming a resin layer of the photosensitive resin composition of the present invention includes, for example, adjusting the viscosity of the photosensitive resin composition of the present invention to a level suitable for the coating method using the organic solvent, applying the composition to a substrate by a method such as dip coating, flow coating, roll coating, bar coating, screen printing, or curtain coating, and then evaporating and drying (pre-drying) the organic solvent contained in the composition for 15 to 90 minutes at a temperature of 60 to 100° C. to form a tack-free resin layer. In the case of a dry film, the composition is laminated onto the substrate using a laminator or the like so that the resin layer is in contact with the substrate, and a resin layer is formed on the substrate.

[0063] Examples of the substrate include glass substrates, printed wiring boards and flexible printed wiring boards on which circuits have been formed in advance using copper or the like, copper-clad laminates for high-frequency circuits made of materials such as paper phenol, paper epoxy, glass cloth epoxy, glass polyimide, glass cloth / non-woven cloth epoxy, glass cloth / paper epoxy, synthetic fiber epoxy, fluororesin / polyethylene / polyphenylene ether, polyphenylene oxide / cyanate, and the like, and copper-clad laminates of all grades (FR-4, etc.), as well as metal substrates, polyimide films, polyethylene terephthalate films, polyethylene naphthalate (PEN) films, ceramic substrates, wafer plates, etc.

[0064] The dry film is preferably bonded to the substrate under pressure and heat using a vacuum laminator or the like. By using such a vacuum laminator, when a circuit-formed substrate is used, the dry film adheres tightly to the circuit board even if the circuit board surface is uneven, preventing the inclusion of air bubbles and improving the ability to fill recesses in the substrate surface. The pressure condition is preferably about 0.1 to 2.0 MPa, and the heating condition is preferably 40 to 120°C.

[0065] The volatilization drying carried out after coating the photosensitive resin composition of the present invention on a substrate can be carried out using a hot air circulation drying oven, an IR oven, a hot plate, a convection oven, etc. (a method in which hot air in a dryer equipped with a heat source of an air heating type using steam is brought into countercurrent contact with the substrate, or a method in which hot air is blown onto the substrate from a nozzle.) Examples of the apparatus include a hot air circulation drying oven such as DF610 manufactured by Yamato Scientific Co., Ltd.

[0066] After forming a resin layer on a substrate, the resin layer is selectively exposed to active energy rays through a photomask having a predetermined pattern formed thereon, and the unexposed areas are developed with a dilute alkaline aqueous solution (e.g., a 0.3 to 3.0 mass % sodium carbonate aqueous solution) to form a patterned cured product. In the case of a dry film, after exposure, the first film is peeled from the dry film and development is carried out to form a patterned cured product on the substrate. Note that, as long as the properties are not impaired, the first film may be peeled from the dry film before exposure, and the exposed resin layer may be exposed and developed.

[0067] The exposure device used for the active energy ray irradiation may be a device equipped with a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a mercury short arc lamp, or the like, which irradiates ultraviolet light in the range of 350 to 450 nm, or an exposure device equipped with an LED. Furthermore, a direct imaging device (for example, a laser direct imaging device that draws an image directly with a laser based on CAD data from a computer) may also be used. The lamp light source or laser light source of the direct imaging device may have a maximum wavelength in the range of 350 to 450 nm. The exposure dose for image formation varies depending on factors such as the film thickness, but is generally 10 to 1,000 mJ / cm. ２ , preferably 20 to 800 mJ / cm ２ As an example of the exposure device, an exposure device equipped with a metal halide lamp, such as HMW-680-GW20 manufactured by Oak Manufacturing Co., Ltd., can be used.

[0068] The developing method may be a dipping method, a shower method, a spray method, a brush method, or the like, and the developing solution may be an aqueous alkali solution such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, or an amine.

[0069] Furthermore, the cured product is irradiated with active energy rays and then heat-cured (for example, at a temperature of 100 to 220°C for 30 to 90 minutes), or is irradiated with active energy rays (for example, at a temperature of 1,000 to 2,000 mJ / cm ２), or by heat curing only for final finish curing (main curing), a cured product with excellent properties such as adhesion and hardness is formed. Examples of equipment include a UV conveyor using a high-pressure mercury lamp, such as the QRM-2082 manufactured by Oak Manufacturing Co., Ltd.

[0070] The present invention will be described in more detail below using examples, but the present invention is not limited to the following examples. In the following, "parts" and "%" are all based on mass unless otherwise specified.

[0071] Synthesis Example 1 Synthesis of Carboxyl Group-Containing Urethane Acrylate Resin Into a reaction vessel equipped with a stirrer, a thermometer, and a condenser, 2400 g (3 mol) of a polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol (TJ5650J, manufactured by Asahi Kasei Corporation, number average molecular weight 800), 603 g (4.5 mol) of dimethylolpropionic acid, and 238 g (2.6 mol) of 2-hydroxyethyl acrylate as a monohydroxyl compound were added. Next, 1887 g (8.5 mol) of isophorone diisocyanate as a polyisocyanate was added, and the mixture was heated to 60°C with stirring and stopped. When the temperature in the reaction vessel began to decrease, the mixture was heated again and continued stirring at 80°C. The absorption spectrum of the isocyanate group (2280 cm) was measured by infrared absorption spectroscopy. －１ The reaction was terminated after confirming that the carboxyl group-containing urethane acrylate resin had disappeared. Carbitol acetate was added so that the solid content was 50% by mass, and a carboxyl group-containing urethane acrylate resin having an acid value of 50 mgKOH / g was obtained.

[0072] Synthesis Example 2: Synthesis of Styrene-Methyl Methacrylate-Methacrylic Acid Copolymer Resin. 377 g of tripropylene glycol monomethyl ether was placed in a 2,000 ml flask equipped with a stirrer and a condenser and heated to 90°C under a nitrogen stream. A mixture of 104.2 g of styrene, 246.5 g of methacrylic acid, and 20.7 g of dimethyl 2,2'-azobis(2-methylpropionate) (V-601, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added dropwise to the flask over 4 hours. In this way, a styrene-methyl methacrylate-methacrylic acid copolymer resin solution was obtained. This styrene-methyl methacrylate-methacrylic acid copolymer resin solution had an acid value of 120 mgKOH / g of solids, a solids content of 50%, and a weight-average molecular weight (Mw) of 20,000. The weight average molecular weight (Mw) of the obtained styrene-methyl methacrylate-methacrylic acid copolymer resin was measured by high performance liquid chromatography using a pump LC-6AD manufactured by Shimadzu Corporation and three columns Shodex (registered trademark) KF-804, KF-803, and KF-802 manufactured by Resonac Corporation connected together.

[0073] [Examples 1 to 4, Comparative Examples 1 to 3] <Preparation of Photosensitive Resin Composition> Photosensitive resin compositions were obtained by blending the components according to the formulations shown in Table 1 below and dispersing using a triple roll. Next, PM (propylene glycol monomethyl ether) was added to the obtained photosensitive resin composition, and the composition was diluted so that the dry film thickness of the resin layer after coating would be each of the film thicknesses shown in Table 2.

[0074]

[0075] The blend amounts in Table 1 are in parts by mass (solid content equivalent). Details of each component in Table 1 are as follows. *1: Paliogen Blue L 6480, manufactured by DIC Corporation *2: Paliogen Red K3580, manufactured by BASF Japan Co., Ltd. *3: Cromophtal Yellow S1515, manufactured by BASF Japan Co., Ltd. *4: MA-100, manufactured by Mitsubishi Chemical Corporation *5: Spectrasense Black S 0084, manufactured by DIC Corporation *6: Carboxyl group-containing urethane acrylate resin of Synthesis Example 1 *7: Styrene-methyl methacrylate-methacrylic acid copolymer resin of Synthesis Example 2 *8: TOE-04-A3, manufactured by Nippon Chemical Industry Co., Ltd. *9: Laromer LR8863, manufactured by BASF Japan Co., Ltd. *10: NK Ester BPE-900, manufactured by Shin-Nakamura Chemical Co., Ltd. *11: jER834, manufactured by Mitsubishi Chemical Corporation *12: DICY, manufactured by Nippon Carbide Industries Co., Ltd. *13: BYK-361N, manufactured by BYK Japan Co., Ltd.

[0076] <Measurement of absorbance of dried coating film of photosensitive resin composition> The photosensitive resin compositions of Examples 1 to 4 and Comparative Examples 1 to 3 were each applied to a 1.2 mm thick glass plate with an applicator so that the film thickness after drying was 25 μm for Examples 1 to 2 and Comparative Examples 1 to 3, 10 μm for Example 3, and 5 μm for Example 4. The dried coating film was then dried in a hot air circulation drying oven at 90°C for 30 minutes for Examples 1 to 2 and Comparative Examples 1 to 3, and at 90°C for 10 minutes for Examples 3 and 4. Using a UV-visible spectrophotometer (Konica Minolta, Inc., Spectrophotometer CM-5) and an integrating sphere device, the absorbance baseline at 300 to 800 nm was measured on the same glass plate as the above-mentioned glass plate. The absorbance of the prepared glass plate with the dried coating film was measured, and the absorbance of the dried coating film was calculated from the baseline to obtain the absorbance at 405 nm and 555 nm.

[0077] <Preparation of Dry Film> Next, the photosensitive resin composition obtained above was applied onto a first film (T60, manufactured by Toray Industries, Inc., thickness 38 μm) using a bar coater so that the film thickness of the resin layer after drying was 25 μm in Examples 1 and 2 and Comparative Examples 1 to 3, 10 μm in Example 3, and 5 μm in Example 4. Next, the film was dried at 90° C. for 30 minutes in a hot air circulation drying oven to form a resin layer on the first film, thereby obtaining a dry film with a two-layer structure.

[0078] <Performance Evaluation> <Preparation of OD Value Evaluation Board> The two-layer dry film obtained above was attached to a 1.2 mm thick glass substrate using a vacuum laminator MVLP-500 (manufactured by The Japan Steel Works, Ltd.) at a lamination temperature of 70°C and a pressure of 0.3 MPa. Next, using a DI exposure machine (Ledia 7-F, manufactured by SCREEN PE Solutions Co., Ltd.), light was applied from above the first film at an exposure wavelength of 405 nm and an exposure dose of 350 mJ / cm. ２ The first film was then peeled off, and the substrate was developed with a 1% aqueous solution of sodium carbonate for 60 seconds. The resin layer was then cured in a hot air circulating drying oven at 150°C for 60 minutes to obtain a substrate for evaluating OD values.

[0079] <Measurement of OD Value (Optical Density)> The OD value evaluation substrate obtained above was measured using a transmission densitometer (X-Rite 361T) to detect all wavelengths from 400 to 900 nm. The OD value was measured using a weighting coefficient of ISO 5 standard visual density (approximately matching human visual sensitivity) based on ISO 5 / 3. The OD value is related to the amount of transmitted light T by the following formula, and the higher the OD value, the more black it is, which is preferable. OD value = -Log10(T / 100)

[0080] <Preparation of Undercut Evaluation Board> The two-layer dry film obtained above was attached to a 1.6 mm thick copper-clad laminate using a vacuum laminator MVLP-500 (manufactured by The Japan Steel Works, Ltd.) at a lamination temperature of 70°C and a pressure of 0.3 MPa. Next, using a DI exposure machine (Ledia 7-F, manufactured by SCREEN PE Solutions Co., Ltd.), a 350 μm × 450 μm opening pattern was formed by exposing the first film to light at an exposure wavelength of 405 nm and an exposure dose of 350 mJ / cm. ２ The glass substrate coated with the resin layer was exposed to light at 1000 K. The first film was then peeled off, and the substrate was developed with a 1% aqueous sodium carbonate solution for 60 seconds. The resin layer was then cured in a hot air circulating drying oven at 150°C for 60 minutes. The glass substrate coated with the resin layer was cut, and the side surfaces were polished to obtain an undercut evaluation substrate.

[0081] <Evaluation of Undercut> In the resin layer of the undercut evaluation substrate obtained above, the undercut amount of a 350 μm × 450 μm opening was measured using a microscope. The undercut was evaluated according to the following evaluation criteria. (Evaluation criteria) ○: The undercut amount on one side was 10 μm or less. △: The undercut amount on one side was more than 10 μm and less than 30 μm. ×: The undercut amount on one side was 30 μm or more. XX: Due to insufficient deep curing, curing shrinkage occurred during thermal drying, making it impossible to produce a coating film.

[0082] The results of the above measurements and evaluations are shown in Table 2.

[0083]

[0084] From the results in Table 2 above, it was confirmed that in each Example, the ratio of the absorbance at 405 nm to the absorbance at 555 nm of the dried coating film of the photosensitive resin composition was smaller than in each Comparative Example, and a higher OD value was obtained. It was also confirmed that in each Example, the amount of undercut was small and good resolution was obtained.

Claims

1. A photosensitive resin composition comprising: (A) a colorant; (B) an alkali-soluble resin; (C) a photopolymerization initiator; and (D) a photopolymerizable monomer, wherein the ratio of the absorbance at 405 nm to the absorbance at 555 nm of a dried coating film of the photosensitive resin composition is 0.60 or less.

2. The photosensitive resin composition according to claim 1, wherein the colorant (A) comprises an anthraquinone blue pigment, a perylene red pigment, and an anthraquinone yellow pigment.

3. The photosensitive resin composition according to claim 2, wherein, relative to a total of 100 parts by mass of the anthraquinone blue pigment, the perylene red pigment, and the anthraquinone yellow pigment, the amount of the anthraquinone blue pigment is 45 parts by mass or more and 65 parts by mass or less, the amount of the perylene red pigment is 25 parts by mass or more and 45 parts by mass or less, and the amount of the anthraquinone yellow pigment is 1 part by mass or more and 15 parts by mass or less.

4. The photosensitive resin composition according to claim 1, wherein the blending amount of the colorant (A) is 1 mass % or more and 80 mass % or less in terms of solid content based on the total amount of the photosensitive resin composition.

5. The photosensitive resin composition according to claim 1, wherein the amount of the alkali-soluble resin (B) is 20% by mass or more and 80% by mass or less, calculated as solid content based on the total amount of the photosensitive resin composition.

6. The photosensitive resin composition according to claim 1, wherein the blending amount of the photopolymerization initiator (C) is 0.01 mass % or more and 2.0 mass % or less in terms of solid content based on the total amount of the photosensitive resin composition.

7. The photosensitive resin composition according to claim 1, wherein the blending amount of the (D) photopolymerizable monomer is 3 mass % or more and 40 mass % or less in terms of solid content based on the total amount of the photosensitive resin composition.

8. A dry film comprising a first film and a resin layer formed on the first film, the resin layer being a dry coating of the photosensitive resin composition according to any one of claims 1 to 7.

9. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 7.

10. A cured product obtained by curing the resin layer of the dry film according to claim 8.

11. An electronic part comprising the cured product according to claim 9.

12. An electronic part comprising the cured product according to claim 10.