Conductive paste

Abstract

This conductive paste is characterized by comprising a conductive powder, a binder resin, and an organic solvent, the binder resin containing one or more polybutenes, and the weight average molecular weight (Mw) of all the polybutene components being 3,700 or greater. According to the present invention, it is possible to provide a conductive paste that can be used in various applications, can form an electrode layer having sufficient adhesion to a base layer in the manufacture of a laminated component with a high level of lamination, and can prevent the occurrence of lamination deviation when fabricating and pressure bonding a laminate structure by laminating a plurality of layers of a coating film obtained using the conductive paste.

Description

conductive paste

[0001] The present invention relates to a conductive paste used for forming electrodes of electronic components.

[0002] With the recent development of electronics technology, various electronic devices have become increasingly miniaturized, and as a result, there is an increasing demand for further miniaturization and increased capacitance for electronic components such as capacitors and inductors used in such electronic devices. To meet these demands, for example, in multilayer ceramic capacitors, the dielectric layers and internal electrode layers have been made thinner. However, thinner dielectric layers are more likely to cause problems such as sheet attack, delamination, and cracking. Therefore, there is a demand for highly multilayered electronic components with excellent electrical properties that are less susceptible to such problems.

[0003] Conventionally, it has been known that in conductive pastes for forming internal electrodes of multilayer ceramic capacitors, adhesion to the dielectric layers can be improved by including polyvinyl butyral, which is contained as a binder resin in the dielectric layers of the majority of multilayer ceramic capacitors, in the conductive paste (e.g., Patent Documents 1 and 2).

[0004] However, in this case, an organic solvent that dissolves the polyvinyl butyral is required in the conductive paste, and when the conductive paste coating comes into contact with the dielectric layer, there is a problem in that the organic solvent in the conductive paste dissolves the polyvinyl butyral used in the dielectric layer, resulting in sheet attack, which is particularly likely to occur as the dielectric layer is made thinner.

[0005] Therefore, Patent Document 3 describes an invention that aims to prevent the organic solvent in the conductive paste from penetrating into the dielectric layer by setting the amount of resin contained in the conductive paste to a certain percentage or more. However, increasing the amount of resin contained in the conductive paste increases the amount of organic matter in the conductive paste, which deteriorates degreasing properties and causes delamination and cracks, making it impossible to manufacture laminated components with stable quality. Furthermore, even with this method, sheet attack still occurs to a certain extent.

[0006] Furthermore, Patent Document 4 describes an invention that attempts to suppress the occurrence of sheet attack by using dihydroterpineol, which has lower solubility in polyvinyl butyral than terpineol, which has been conventionally used as an organic solvent for conductive pastes. However, dihydroterpineol does not have a sufficient effect of suppressing sheet attack, and when the dielectric layer is extremely thin, particularly when the dielectric layer is made of a butyral resin binder and has a sheet thickness of less than 5 μm, it becomes difficult to suppress sheet attack.

[0007] Therefore, in recent years, studies have been conducted to use a specific polyvinyl butyral different from the polyvinyl butyral used in the dielectric in the conductive paste, and to use an organic solvent that has selective solubility to dissolve the specific polyvinyl butyral but not the polyvinyl butyral used in the dielectric in the conductive paste. However, in this case, the combinations of resins and organic solvents that can be used are limited, which causes a problem of restricting the degree of freedom in design.

[0008] Incidentally, as a countermeasure against the problem of delamination, Patent Document 5 discloses a method of treating a metal powder that has been subjected to a surface treatment to adsorb a predetermined amount of elements, and then applying the metal powder to a mold with a predetermined kinetic viscosity (a kinetic viscosity at 40° C. of 500 to 30,000 mm ２ The problem of delamination is solved by improving sintering properties with a paste that uses polybutene (polybutene / s) as a binder resin.

[0009] JP 2002-216540 Patent - 4894260 Patent - 6613551 JP 9-17687 Patent - 6630208

[0010] As described above, in recent years, there has been a demand for electronic components in which thin dielectric layers and internal electrode layers are highly laminated. Therefore, in the manufacture of highly laminated electronic components, a conductive paste is needed that can form an electrode layer that has sufficient adhesion to a base layer, and that can form a coating film that is less likely to slip when a laminate structure is produced by laminating multiple coating films formed using the conductive paste and bonding them under pressure.

[0011] On the other hand, Patent Document 5 only states that organic solvents that can be contained in the conductive paste may include alcohol solvents, glycol ether solvents, acetate solvents, and ketone solvents, and the only specific example actually confirmed in Patent Document 5 is an electrode formed from a conductive paste containing no solvent at all on polybutene (HV300, HV15, both manufactured by JX Nippon Oil & Energy Corporation).

[0012] Therefore, the present inventors actually produced a prototype of the conductive paste described in Patent Document 5, applied the conductive paste to a dielectric layer, and dried it. However, the coating film did not solidify after drying, and therefore deformed when a load was applied. Therefore, when a highly laminated structure with a large number of layers, which has been in particular demand in recent years, is actually produced using the conductive paste specifically described in Patent Document 5 and then pressure-bonded, a decrease in coating thickness and lamination misalignment occur. To solve these problems, various improvements to the compression bonding conditions and processes, such as those described in JP 2000-269640 A, are necessary to prevent lamination misalignment during pressure bonding. In other words, although Patent Document 5 suggests the use of the conductive paste for internal electrodes in multilayer ceramic capacitors, the process becomes complicated when actually producing a laminated structure in which internal electrode layers are alternately stacked using the paste described as an example.

[0013] Furthermore, in Patent Documents 1 to 4, many studies have been conducted on methods for suppressing the occurrence of sheet attack and delamination while improving the adhesion between the conductive paste and the dielectric layer on which it is printed. However, none of these methods take into consideration the prevention of lamination misalignment when a laminate structure is created by stacking multiple layers of coating films formed using the conductive paste and bonding them together under pressure.

[0014] Therefore, an object of the present invention is to provide a conductive paste that can be used for various purposes, that can form an electrode layer that has sufficient adhesion to a base layer in the manufacture of highly stacked laminate components, and that can also prevent the occurrence of stacking misalignment when a laminate structure is produced by stacking multiple layers of coating films obtained using the conductive paste and bonding them together under pressure.

[0015] The above-mentioned problems are solved by the present invention as follows: Namely, the present invention (1) provides a conductive paste comprising a conductive powder, a binder resin, and an organic solvent, wherein the binder resin contains one or more polybutenes, and the weight-average molecular weight (Mw) of the entire polybutene component is 3,700 or more.

[0016] The present invention (2) also provides the conductive paste of (1), wherein the weight average molecular weight (Mw) of the entire polybutene component is 4,000 or more.

[0017] The present invention (3) also provides the conductive paste of (2), wherein the weight average molecular weight (Mw) of the entire polybutene component is 4,300 or more.

[0018] The present invention (4) also provides the conductive paste of (3), wherein the weight average molecular weight (Mw) of the entire polybutene component is 4,500 or more.

[0019] The present invention (5) also provides a conductive paste comprising a conductive powder, a binder resin, and an organic solvent, wherein the binder resin contains one or more polybutenes, and the viscosity of the entire polybutene component is 50 Pa s or more at a temperature of 40°C and a shear rate of 0.10 / s.

[0020] The present invention (6) also provides the conductive paste of (5), wherein the viscosity of the entire polybutene component at a temperature of 40° C. and a shear rate of 0.10 / s is 55 Pa·s or more.

[0021] The present invention (7) also provides the conductive paste of (6), wherein the viscosity of the entire polybutene component at a temperature of 40° C. and a shear rate of 0.10 / s is 60 Pa·s or more.

[0022] The present invention (8) also provides the conductive paste of (7), wherein the viscosity of the entire polybutene component is 80 Pa·s or more at a temperature of 40° C. and a shear rate of 0.10 / s.

[0023] The present invention (9) also provides the conductive pastes of (1) to (8), wherein the organic solvent contains a hydrocarbon solvent.

[0024] The present invention (10) also provides the conductive paste according to any one of (1) to (9), wherein the organic solvent contains one or more selected from the group consisting of terpineol, dihydroterpineol, dihydroterpineol acetate, petroleum hydrocarbon, cycloalkyl acetate, dialkylene glycol dialkyl ether, and trialkylene glycol dialkyl ether.

[0025] The present invention (11) also provides the conductive paste according to (10), wherein the organic solvent contains one or more selected from the group consisting of mineral spirits, turpene, isoparaffin, normal paraffin, cycloparaffin, and cycloalkyl acetate.

[0026] The present invention (12) also provides the conductive paste of any one of (1) to (11), wherein the conductive powder is a metal powder.

[0027] The present invention (13) also provides a conductive paste according to any one of (1) to (12), which is used for forming internal electrodes of multilayer ceramic electronic components.

[0028] The present invention (14) also provides an electronic component comprising a substrate layer containing polyvinyl butyral and an electrode layer laminated on the substrate layer using any one of the conductive pastes (1) to (13).

[0029] According to the present invention, it is possible to provide a conductive paste that can be used for various applications, that can form electrode layers that have sufficient adhesion to base layers in the manufacture of highly stacked laminate components, and that can prevent the occurrence of lamination misalignment when a laminate structure is produced by stacking multiple layers of coating films obtained using the conductive paste and bonding them together under pressure.Furthermore, according to the present invention, it is possible to provide a multilayer ceramic capacitor that exhibits excellent reliability even when the dielectric layers are further thinned and thickened.

[0030] Photograph of Example 6 observed by microscope Photograph of Comparative Example 5 observed by microscope Photograph of Example 7, in the atmosphere, for binder removal property test Photograph of Example 7, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Example 8, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Comparative Example 6, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Comparative Example 6, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Comparative Example 7, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Comparative Example 7, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Comparative Example 8, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere Photograph of Comparative Example 8, in the atmosphere, for binder removal property test in a nitrogen gas atmosphere

[0031] The conductive paste of the present invention comprises a conductive powder, a binder resin, and an organic solvent, wherein the binder resin contains one or more polybutenes, and the weight average molecular weight (Mw) of the entire polybutene component is 3,700 or more.

[0032] The conductive paste of the present invention comprises a conductive powder, a binder resin, and an organic solvent, wherein the binder resin contains one or more polybutenes, and the viscosity of the entire polybutene component is 50 Pa s or more at a temperature of 40°C and a shear rate of 0.10 / s.

[0033] The conductive paste of the present invention contains a conductive powder, a binder resin, and an organic solvent, and is characterized in that one or more types of polybutene are used as the binder resin, and the weight-average molecular weight (Mw) of the entire polybutene component not containing the organic solvent is within a predetermined range and / or the absolute viscosity of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is within a predetermined range.

[0034] The conductive paste of the present invention is suitably used for forming internal electrodes of multilayer ceramic capacitors, and is also applicable to other ceramic electronic components such as inductors and actuators.

[0035] The method for forming a coating film using the conductive paste of the present invention is not particularly limited, and various printing methods such as offset printing, screen printing, gravure printing, inkjet printing, dipping, dispensing, brush coating, and spin coating can be used.

[0036] The conductive powder for the conductive paste of the present invention is not particularly limited as long as it is conductive, but metal powder is preferred. Metal powders may be any metal, such as noble metals such as silver, gold, platinum, and palladium, or base metals such as nickel, copper, cobalt, iron, aluminum, molybdenum, and tungsten. These metal powders include single metals as well as alloy powders, composite powders, and mixed powders. Preferred examples include nickel, copper, silver, gold, platinum, and palladium. Conductive powders may also have a thin oxide film on their surface, or be coated with glass or various oxides to prevent oversintering or oxidation. Conductive powders may also be surface-treated with organometallic compounds, surfactants, fatty acids, or the like, as needed. The conductive powders may be used alone or in combination.

[0037] The average particle size of the conductive powder is not particularly limited, but is preferably 1.0 μm or less. Having the average particle size of the conductive powder within the above range facilitates the formation of dense, smooth, and thin internal electrode layers. The conductive powder may be a mixed powder of two or more types of conductive powders with different average particle sizes. The shape of the conductive powder is not particularly limited, and conventionally used powders such as spherical powder, flaky powder, and dendritic powder can be used, or a mixed powder of two or more types of conductive powders with different shapes can be used. In the present invention, the average particle size of the conductive powder is the volume-based cumulative fraction 50% value (D50) in the particle size distribution measured using a laser particle size distribution analyzer.

[0038] The content of the conductive powder in the conductive paste of the present invention is not particularly limited, and is usually selected appropriately in the range of 10.0 mass % or more and 95.0 mass % or less, taking into consideration the finished viscosity, printability, storage stability, etc. of the conductive paste.

[0039] The conductive paste of the present invention contains one or more polybutenes as a binder resin.

[0040] In the conductive paste of the present invention, polybutene refers to a homopolymer of 1-butene, a homopolymer of 2-butene, a homopolymer of isobutylene, a copolymer of two or more of 1-butene, 2-butene, and isobutylene, or a mixture of two or more of these polymers (homopolymers or copolymers). The polybutene used in the conductive paste of the present invention satisfies the following physical properties. As the polybutene, a homopolymer of isobutylene or a copolymer of isobutylene and linear butene is preferred, an isobutylene homopolymer or a copolymer of a monomer mainly consisting of isobutylene and partially containing linear butene is more preferred, and an isobutylene homopolymer is particularly preferred.

[0041] In the conductive paste of the present invention, the weight-average molecular weight (Mw) of the entire polybutene component is 3,700 or more, preferably 4,000 or more, more preferably 4,300 or more, more preferably 4,500 or more, even more preferably 5,000 or more, and particularly preferably 5,500 or more. When the weight-average molecular weight (Mw) of the entire polybutene component is within the above range, an electrode layer having sufficient adhesion to the substrate layer can be formed. Furthermore, when a laminate structure is produced by laminating multiple layers of coating films obtained using the conductive paste and then pressing the layers together, the coating layers are less likely to deform, thereby preventing lamination slippage. On the other hand, when the weight-average molecular weight (Mw) of the entire polybutene component is below the above range, the coating films are not solidified and are prone to deformation, resulting in lamination slippage, making it difficult to produce a highly accurate laminate, which can adversely affect the properties of electronic components and reduce yields. The weight average molecular weight (Mw) of the entire polybutene component is a polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography using an HLC-8321GPC / HT manufactured by Tosoh Corporation. In the present invention, the weight average molecular weight (Mw) of the entire polybutene component refers to the weight average molecular weight (Mw) of one type of polybutene when one type of polybutene is used as the binder resin, or refers to the weight average molecular weight (Mw) of a mixture of two or more types of polybutene when two or more types of polybutene are used as the binder resin, assuming that the two or more types of polybutene are mixed in the blending ratio in the conductive paste.

[0042] When the weight-average molecular weight of the entire polybutene component is high, it can be used by changing the ratio of the polybutene component to the organic solvent in the conductive paste depending on the method for forming the coating film (offset printing, screen printing, gravure printing, etc.). Therefore, in the conductive paste of the present invention, there is no particular upper limit to the weight-average molecular weight (Mw) of the entire polybutene component. However, from the viewpoint of ease of handling as a paste, the weight-average molecular weight (Mw) of the entire polybutene component is preferably 100,000 or less, more preferably 90,000 or less, and particularly preferably 80,000 or less.

[0043] At the time of filing this application, there were no readily available polybutene products in Japan with a weight-average molecular weight (Mw) of 3,000 or more but 6,000 or less. However, experiments conducted by the present inventors have shown that there is a correlation between the weight-average molecular weight (Mw) of the entire polybutene component and the magnitude (degree) of the effects of the present invention. Therefore, it has been confirmed that satisfactory results can be obtained as long as the weight-average molecular weight (Mw) of the entire polybutene component used in the conductive paste of the present invention is 3,700 or more, and that the obtained effects increase as the weight-average molecular weight (Mw) increases to 4,000 or more, 4,300 or more, 4,500 or more, 5,000 or more, and even 5,500 or more.

[0044] In the conductive paste of the present invention, the number average molecular weight (Mn) of the entire polybutene component is preferably 1,000 or more, more preferably 1,050 or more, even more preferably 1,100 or more, and particularly preferably 1,200 or more. In the conductive paste of the present invention, there is no particular upper limit to the number average molecular weight (Mn) of the entire polybutene component, but from the viewpoint of ease of handling as a paste, it is preferably 60,000 or less, more preferably 50,000 or less, and particularly preferably 40,000 or less. In the present invention, the number average molecular weight (Mn) of the entire polybutene component is the polystyrene-equivalent number average molecular weight measured by gel permeation chromatography using a Tosoh HLC-8321GPC / HT. In the present invention, the number average molecular weight (Mn) of the entire polybutene component refers to the number average molecular weight (Mn) of one type of polybutene when one type of polybutene is used as the binder resin, and refers to the number average molecular weight (Mn) of a mixture of two or more types of polybutene when the two or more types of polybutene are mixed in the blending ratio in the conductive paste when two or more types of polybutene are used as the binder resin.

[0045] In the conductive paste of the present invention, the viscosity (absolute viscosity) of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is 50 Pa·s or more, preferably 55 Pa·s or more, more preferably 60 Pa·s or more, more preferably 80 Pa·s or more, even more preferably 100 Pa·s or more, and particularly preferably 130 Pa·s or more. When the viscosity (absolute viscosity) of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is within the above range, an electrode layer having sufficient adhesion to the substrate layer can be formed, and when a laminate structure is produced by laminating multiple layers of coating films obtained using the conductive paste and then pressure-bonding the layers, the coating film layers are less likely to deform, thereby preventing the occurrence of lamination shear. On the other hand, if the viscosity of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is less than the above range, when a laminate structure is produced by laminating multiple layers of coating films obtained using the conductive paste and then bonding them under pressure, lamination slippage occurs, which adversely affects the properties of electronic components and causes a decrease in yield. In the present invention, the absolute viscosity of the entire polybutene component is measured using an ARES-G2 manufactured by TA Instruments. In the present invention, the viscosity (absolute viscosity) of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s refers to the viscosity (absolute viscosity) of the one polybutene at a temperature of 40°C and a shear rate of 0.10 / s when one type of polybutene is used as the binder resin, or refers to the viscosity (absolute viscosity) of the mixture of the two or more polybutenes mixed in the blending ratio in the conductive paste at a temperature of 40°C and a shear rate of 0.10 / s when two or more types of polybutene are used as the binder resin.

[0046] When the viscosity of the entire polybutene component is high, it can be used by changing the ratio of the polybutene component to the organic solvent in the conductive paste depending on the method for forming the coating film (offset printing, screen printing, gravure printing, etc.). Therefore, in the present invention, there is no particular upper limit to the viscosity of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s. However, in terms of ease of handling as a paste, the viscosity (absolute viscosity) of the entire polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is preferably 100,000 Pa s or less, more preferably 80,000 Pa s or less, and particularly preferably 50,000 Pa s or less.

[0047] At the time of filing this application, there were no polybutene products readily available in Japan with a viscosity (absolute viscosity) of 50 to 150 at a temperature of 40°C and a shear rate of 0.10 / s. However, experiments conducted by the present inventors have shown that there is a correlation between the absolute viscosity of the polybutene components as a whole and the magnitude (degree) of the effects of the present invention. Therefore, it has been confirmed that if the absolute viscosity of the polybutene components as a whole used in the conductive paste of the present invention is 50 Pa s or more, satisfactory results can be obtained as the effects of the present invention, and that the effects obtained increase as the absolute viscosity increases to 55 Pa s or more, 60 Pa s or more, 80 Pa s or more, 100 Pa s or more, and even 130 Pa s or more.

[0048] In the conductive paste of the present invention, the kinematic viscosity of the entire polybutene component at a temperature of 40° C. is preferably 45,000 mm ２ / s or more, more preferably 55,000 mm ２ / s or more, more preferably 100,000 mm ２ / s or more, particularly preferably 130,000 mm ２ In the conductive paste of the present invention, the upper limit of the kinematic viscosity of the entire polybutene component at a temperature of 40° C. is not particularly limited, but in terms of ease of handling as a paste, it is preferable that the upper limit be 100,000,000 mm ２ / s or less is preferable, and 80,000,000 mm ２ / s or less is more preferable, and 50,000,000 mm ２When the kinematic viscosity of the entire polybutene component at a temperature of 40°C is within the above range, the coating film layers are less likely to deform when a laminate structure is produced by laminating multiple layers of coating films obtained using the conductive paste and then bonding them under pressure, thereby enhancing the effect of preventing the occurrence of lamination slippage.

[0049] The conductive paste of the present invention uses a polybutene component having the above-mentioned predetermined weight-average molecular weight (Mw) and / or the above-mentioned predetermined viscosity at a shear rate of 0.10 / s at a temperature of 40°C as a binder resin, thereby enabling the formation of an electrode layer having sufficient adhesion to a substrate layer, and preventing the occurrence of lamination misalignment when a laminate structure is produced by laminating multiple layers of coating films obtained using the conductive paste and then pressure-bonding the layers together, thereby preventing the coating layers from deforming. Furthermore, by setting the number-average molecular weight (Mn) and / or 40°C kinematic viscosity of the entire polybutene component used as the binder resin within the above-mentioned predetermined ranges, the conductive paste of the present invention is more effective in preventing the coating layers from deforming when a laminate structure is produced by laminating multiple layers of coating films obtained using the conductive paste and then pressure-bonding the layers together.

[0050] As the polybutene used in the conductive paste of the present invention, a single polybutene (hereinafter also referred to as polybutene (1)) that satisfies the physical properties of the entire polybutene component is preferably used, for example, a copolymer of monomers mainly containing isobutylene and partially containing linear butene, or a homopolymer of isobutylene that satisfies the physical properties of the entire polybutene component. Examples of such polybutene (1) include HV-1900 manufactured by ENEOS Corporation, TETRAX 6T manufactured by ENEOS Corporation, TETRAX 5T manufactured by ENEOS Corporation, TETRAX 4T manufactured by ENEOS Corporation, and TETRAX 3T manufactured by ENEOS Corporation. In the conductive paste of the present invention, these polybutenes (1) can be used alone as the binder resin. Furthermore, in the conductive paste of the present invention, two or more types of polybutene (1) can be used in combination. In addition, in the conductive paste of the present invention, one or more types of polybutene (1) can be used in combination with the polybutene (2) described below so that the polybutene component as a whole satisfies the above physical property values ​​of the entire polybutene component.

[0051] In the conductive paste of the present invention, even if a polybutene (hereinafter also referred to as polybutene (2)) does not satisfy the physical property values ​​of the entire polybutene component by itself, one or more polybutenes (2) can be used as one component of the binder resin as long as the physical property values ​​of the entire polybutene component are satisfied when used in combination with polybutene (1). In other words, in the conductive paste of the present invention, one or more polybutenes (1) and one or more polybutenes (2) can be used in combination as long as the physical property values ​​of the mixture obtained when one or more polybutenes (1) and one or more polybutenes (2) are mixed in the blending ratio in the conductive paste satisfy the physical property values ​​of the entire polybutene component.

[0052] In the conductive paste of the present invention, it is preferable that the polybutene used as the binder resin is polybutene (1) alone, in view of ease of industrial use.

[0053] Furthermore, since the polybutene of the conductive paste of the present invention has superior thermal decomposition properties compared to ethyl cellulose and other resins, almost no carbon or carbonaceous organic residue remains after firing the conductive paste of the present invention, which not only suppresses the inhibition of sintering of the conductive powder caused by these residues but also prevents the occurrence of blisters, delamination, cracks, etc., resulting in the production of electronic components with excellent electrical properties.

[0054] In the conductive paste of the present invention, as long as the effects of the present invention are not impaired, binder resins other than polybutene may include cellulose-based resins such as acrylic resins, methacrylic resins, ethyl cellulose, and hydroxyethyl cellulose, butyral resins, epoxy resins, phenolic resins, and rosin. As is well known in the technical field of the present invention, the properties of the conductive paste can sometimes be improved by mixing appropriate amounts of multiple types of binder resins. However, to further enjoy the effects of the present invention, the higher the proportion of polybutene in the binder resin, the better, preferably 90.0% by mass or more, and particularly preferably 100.0% by mass.

[0055] The content of the binder resin in the conductive paste of the present invention is appropriately selected depending on the application of the conductive paste and the printing method.

[0056] The content ratio of the conductive powder to the binder resin in the conductive paste of the present invention is appropriately selected depending on the application of the conductive paste and the printing method.

[0057] The organic solvent for the conductive paste of the present invention is not particularly limited as long as it is capable of dissolving polybutene. It may be an organic solvent that is soluble in polybutene but has low solubility for polyvinyl butyral used in the dielectric layer (hereinafter referred to as a preferred solvent), or an organic solvent that is soluble in polybutene and has high solubility for polyvinyl butyral used in the dielectric layer (hereinafter referred to as a usable solvent).

[0058] Among the conductive pastes of the present invention, those containing a suitable organic solvent can suppress sheet attack due to the low solubility of polyvinyl butyral used in the dielectric layer, and are therefore suitable for conductive pastes that require the prevention of sheet attack. Suitable solvents include hydrocarbon solvents. Examples of hydrocarbon solvents include paraffinic hydrocarbons, olefinic hydrocarbons, naphthenic hydrocarbons, aromatic hydrocarbons, petroleum hydrocarbons, and mixed solvents of two or more of these. Examples of naphthenic hydrocarbons include cycloparaffins, and examples of petroleum hydrocarbon solvents include mineral spirits, turpen, isoparaffins, and normal paraffins. Other suitable solvents include oxygen-containing organic solvents such as cycloalkyl acetates such as cyclohexanol acetate and cyclodecyl acetate, dialkylene glycol dialkyl ethers (wherein the alkyls may be the same or different) such as dipropylene glycol methyl-n-propyl ether and dipropylene glycol methyl-n-butyl ether, and trialkylene glycol dialkyl ethers (wherein the alkyls may be the same or different) such as tripropylene glycol methyl-n-propyl ether.

[0059] Conventional conductive pastes for forming internal electrodes typically contain ethyl cellulose, which is suitable for screen printing, as a binder resin, and polyvinyl butyral, which ensures adhesion to the dielectric layer. Therefore, conventional conductive pastes must contain an organic solvent that dissolves the ethyl cellulose and polyvinyl butyral contained in the paste. The fact that this organic solvent dissolves the polyvinyl butyral used in the dielectric layer causes the problem of sheet attack on the dielectric layer. In response to this, the present inventors have conducted extensive research and have found that a polybutene component that uses one or more types of polybutene as a binder resin and has a weight average molecular weight (Mw) of the entire component and / or a viscosity at a temperature of 40°C and a shear rate of 0.10 / s within a specific range exhibits high adhesion to the dielectric layer as a binder resin, has superior combustion decomposition properties compared to ethyl cellulose, and also contributes to improving the dispersibility of the conductive powder. Therefore, it can be used to replace ethyl cellulose or polyvinyl butyral as a binder resin, and even when the proportion of polybutene in the binder resin is 100%, it is possible to ensure the printability of the conductive paste and adhesion to the dielectric layer. The present inventors have also discovered that because polybutene is a hydrocarbon-based compound with low polarity, a suitable solvent can be used as the organic solvent for the conductive paste, and therefore the conductive paste of the present invention, which is a conductive paste that "uses, as the binder resin, one or more polybutenes whose weight-average molecular weight (Mw) of the polybutene component as a whole and / or whose viscosity at a temperature of 40°C and a shear rate of 0.10 / s fall within a specific range, and uses a suitable solvent as the organic solvent," can suppress sheet attack and ensure adhesion to the dielectric layer even when used in a dielectric layer that uses polyvinyl butyral.

[0060] The conductive paste of the present invention uses polybutene as the binder resin instead of the combination of ethyl cellulose and polyvinyl butyral that has been widely used in conventional conductive pastes. Polybutene is soluble in organic solvents that poorly dissolve the polyvinyl butyral used in the dielectric layer, such as hydrocarbon solvents, cycloalkyl acetates, dialkylene glycol dialkyl ethers, and trialkylene glycol dialkyl ethers. Therefore, the conductive paste of the present invention can use, as the organic solvent for dissolving the binder resin, organic solvents that poorly dissolve the polyvinyl butyral used in the dielectric layer, such as hydrocarbon solvents, cycloalkyl acetates, dialkylene glycol dialkyl ethers, and trialkylene glycol dialkyl ethers. Therefore, when the conductive paste of the present invention contains a suitable solvent as the organic solvent, the conductive paste of the present invention can suppress sheet attack.

[0061] Furthermore, the conductive paste of the present invention using polybutene has higher dispersibility of the conductive powder than conventional conductive pastes using ethyl cellulose as a binder resin. Furthermore, when a hydrocarbon solvent is used as the organic solvent, the dispersibility of the conductive powder is further improved.

[0062] The conductive paste of the present invention does not exclude the inclusion of an organic solvent that has a high solubility for the polyvinyl butyral used in the dielectric layer, and if the conductive paste does not need to prevent the above-mentioned sheet attack (for example, for inductor applications), it may contain an organic solvent that has a high solubility for the polyvinyl butyral used in the dielectric layer, as long as it does not interfere with the effects of the present invention. Usable solvents include, for example, terpineol, dihydroterpineol, and dihydroterpineol acetate.

[0063] When the conductive paste of the present invention contains a mixture of suitable solvents and usable solvents as the organic solvent, the proportion of suitable solvents in the organic solvent, such as hydrocarbon solvents such as naphthenic hydrocarbon solvents and petroleum hydrocarbon solvents, cycloalkyl acetates such as cyclohexanol acetate and cyclodecyl acetate, dialkylene glycol dialkyl ethers such as dipropylene glycol methyl n-propyl ether and dipropylene glycol methyl n-butyl ether (wherein the alkyls may be the same or different), and trialkylene glycol dialkyl ethers such as tripropylene glycol methyl n-propyl ether (wherein the alkyls may be the same or different), is preferably 90.0 mass% or more, in order to suppress sheet attack. Furthermore, it is particularly preferred that the conductive paste of the present invention uses an organic solvent with a proportion of suitable solvents of 100.0 mass% as the organic solvent, in order to enhance the effect of suppressing sheet attack when used in a dielectric layer containing polyvinyl butyral.

[0064] Furthermore, the conductive paste of the present invention may contain an organic solvent that does not dissolve polybutene as long as it does not impair the effects of the present invention. However, in order to further enjoy the effects of the present invention, the higher the proportion of the organic solvent that is soluble in polybutene in the organic solvent, the better, preferably 90.0 mass% or more, and particularly preferably 100.0 mass%. In particular, it is preferable that the conductive paste of the present invention uses an organic solvent in which the proportion of the suitable solvent in the organic solvent is 100.0 mass% because this enhances the effect of suppressing sheet attack when used in a dielectric layer containing polyvinyl butyral.

[0065] In the conductive paste of the present invention, the boiling point of the organic solvent is appropriately selected depending on the application of the conductive paste and the printing method, but is preferably 80 to 240° C., more preferably 90 to 230° C. In addition, in the conductive paste of the present invention, the kinematic viscosity of the organic solvent at a temperature of 40° C. is appropriately selected depending on the application of the conductive paste and the printing method, but is preferably 0.3 to 90.0 mm２ / s, more preferably 1.0 to 85.0 mm ２ / s.

[0066] The content of the organic solvent in the conductive paste of the present invention is not particularly limited as long as it can dissolve the binder resin, and is appropriately selected depending on the application of the conductive paste and the printing method. The content of the organic solvent in the conductive paste of the present invention is preferably 10.0 parts by mass or more and 800.0 parts by mass or less per 100.0 parts by mass of the conductive powder, more preferably 30.0 parts by mass or more and 550.0 parts by mass or less per 100.0 parts by mass of the conductive powder, in order to facilitate easy handling of the paste. By having the content of the organic solvent in the conductive paste within the above range, good printability can be expected using known printing methods such as screen printing and gravure printing, even when using the specific polybutene of the present invention to suppress the aforementioned lamination slippage.

[0067] In addition to the above components, the conductive paste of the present invention may contain various additives that are typically incorporated into conductive pastes. For example, the conductive paste of the present invention may contain additives such as plasticizers, dispersants, and surfactants as needed to improve the dispersibility of inorganic powders such as conductive powders and to ensure long-term stability of the viscosity of the conductive paste and appropriate flow characteristics during printing.

[0068] In addition, the conductive paste of the present invention can contain components that can be normally blended into conductive pastes, such as glass, alumina, silica, metal oxides such as copper oxide, manganese oxide, and titanium oxide, inorganic powders such as ceramics and montmorillonite, metal organic compounds, plasticizers, etc., as appropriate depending on the purpose, and it is particularly preferable to contain ceramic powder.

[0069] When the conductive paste of the present invention is a conductive paste for forming internal electrode layers of a multilayer ceramic electronic component, the conductive paste of the present invention can contain a powder called a "co-material" having the same or similar composition as the ceramic layer, in order to make its shrinkage behavior during firing closer to the shrinkage behavior of the surrounding unsintered ceramic layer.

[0070] The type of the co-material powder is not particularly limited, but it is desirable to select it so as to minimize the change in the characteristics of the capacitor due to the reaction with the ceramic dielectric. As the co-material powder, a powder of the general formula: ABO, which is usually used in conductive paste for forming internal electrodes, is used. ３ (where A is at least one of Ba, Ca and Sr, and B is at least one of Ti, Zr and Hf), for example, perovskite oxide powders such as barium titanate, strontium zirconate and calcium zirconate, or powders of these to which various additives have been added, are preferred. Furthermore, the co-material powder is preferably one having the same composition as or a similar composition to the dielectric ceramic raw material powder used as the main component of the dielectric layer. Note that the co-material powder may be adhered to the surface of the conductive powder and then mixed with the other components in the conductive paste.

[0071] When the conductive paste of the present invention contains a co-material powder, the content of the co-material powder in the conductive paste of the present invention is, relative to 100.0 parts by mass of the conductive powder, more than 0.0 parts by mass and not more than 50.0 parts by mass, preferably more than 1.0 part by mass and not more than 40.0 parts by mass, particularly preferably more than 5.0 parts by mass and not more than 30.0 parts by mass.

[0072] The average particle size of the co-material powder is not particularly limited, but is preferably 30% or less of the average particle size of the conductive powder, as this provides a more excellent effect of suppressing sintering and improving density.

[0073] The viscosity of the conductive paste of the present invention is not particularly limited as long as it is in a paste form, and may be appropriately selected depending on the application of the conductive paste and the printing method.

[0074] The method for preparing and producing the conductive paste of the present invention is not particularly limited, and the conductive paste is produced by dispersing and kneading the conductive powder, organic solvent, and binder resin by a known method.

[0075] The electronic component of the present invention is an electronic component characterized by having a substrate layer containing polyvinyl butyral and an electrode layer laminated on the substrate layer using the conductive paste of the present invention.

[0076] The substrate layer of the electronic component of the present invention is not particularly limited, but examples thereof include a dielectric layer, a glass layer, a ceramic layer, and a magnetic layer.

[0077] The electronic component of the present invention is manufactured by a known method using the conductive paste of the present invention to form internal electrodes. For example, a multilayer ceramic capacitor, which is an example of the electronic component of the present invention, is manufactured by the following method using the conductive paste of the present invention.

[0078] First, a dielectric ceramic raw material powder such as barium titanate is dispersed in polyvinyl butyral and formed into a 3.0 μm-thick ceramic green sheet. The conductive paste of the present invention is applied to the green sheet by a known method such as screen printing, and the green sheet is dried to remove the organic solvent, forming an internal electrode paste coating in a predetermined pattern. Next, 1,000 ceramic green sheets with the internal electrode paste coating formed thereon are stacked, thermocompressed at 30°C and 15 MPa for 1 second, and then vacuum thermocompressed at 90°C and 130 MPa for 240 seconds to produce an unfired laminate. The resulting laminate is then cut to a predetermined shape and fired at a high temperature to simultaneously sinter the dielectric layer and electrode layer, obtaining a multilayer ceramic capacitor element. Terminal electrodes are then formed on both end faces of the element to obtain the multilayer ceramic capacitor of the present invention. The terminal electrodes may be attached before firing the laminate and fired simultaneously with the laminate.

[0079] By using the conductive paste of the present invention, even an unfired laminate produced under the above conditions will not undergo lamination slippage without the use of a jig or the like, and the occurrence of sheet attack can also be suppressed.

[0080] The present invention will be described below based on specific experimental examples, but the present invention is not limited to these.

[0081] Experimental Example 1 <Production of Conductive Paste> (Examples 1 and 2 and Comparative Examples 1 to 3) 100.0 g of spherical nickel powder (Ni-683L, manufactured by Shoei Chemical Industry Co., Ltd.) having an average particle size of 0.19 μm was mixed with polybutene and an organic solvent shown in Table 1 in the blending ratio (parts by mass) shown in Table 1 to produce a conductive paste. In Comparative Example 3, no organic solvent was blended. The performance of the obtained conductive paste was evaluated. The results are shown in Table 1.

[0082] The details of the polybutene and organic solvent shown in Table 1 are as follows: <Polybutene> Polybutene HV-15: A copolymer of monomers mainly consisting of isobutylene and partially containing linear butene, weight average molecular weight (Mw): 717, number average molecular weight (Mn): 388, absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s: 2.1 Pa s, kinematic viscosity at 40°C: 655 mm ２ / s, 100℃ kinematic viscosity: 31mm ２ / s Polybutene HV-300 A copolymer of monomers mainly containing isobutylene and some linear butene, weight average molecular weight (Mw): 2,470, number average molecular weight (Mn): 977, absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s: 26.3 Pa·s, kinematic viscosity at 40°C: 26,000 mm ２ / s, 100℃ kinematic viscosity: 590mm ２ / s Polybutene HV-1900 A copolymer of monomers mainly containing isobutylene and some linear butene, weight average molecular weight (Mw): 6,940, number average molecular weight (Mn): 1,230, absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s: 171.1 Pa·s, kinematic viscosity at 40°C: 160,000 mm ２ / s, 100℃ Kinematic viscosity: 3,710mm ２ / s TETRAX 6T isobutylene homopolymer, weight average molecular weight (Mw): 72,400, number average molecular weight (Mn): 36,700, absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s: 43,395.8 Pa·s, kinematic viscosity at 200°C: 50,500 mm ２ / s <Organic solvent> Hydrocarbon solvent Naphtesol 200 (manufactured by ENEOS), boiling point: 190 to 220°C

[0083] <Paste Performance Evaluation> The conductive pastes prepared as described above were subjected to various tests using the methods described below. (1) Deformability Test: Fifteen samples were taken from each sample, and a 10-μm-thick coating film measuring 15 mm square was formed on each sample. After drying at 140°C for 10 minutes, samples were pressed at 50°C and 20 MPa for 10 seconds to determine the average change in area, and their deformability was evaluated. Here, samples with an average change in area (((area after test - area before test) / area before test) x 100) of less than 10% were rated "A: Pass, Excellent," samples with an average change in area of ​​10% or more but less than 20% were rated "B: Pass, Good," and samples with an average change in area of ​​20% or more were rated "C: Fail," as shown in Table 1. (2) Adhesion Test: Fifteen samples were taken from each sample, and a 10-μm-thick coating film measuring 4.0 cm square was formed on a PET film. The samples were then dried at 140°C for 10 minutes to obtain a dried film of the conductive paste on the PET film. In addition, a dielectric slurry prepared by mixing barium titanate powder, polyvinyl butyral, and dihydroterpineol was used to form a 4.0 cm square, 10 μm thick coating on another PET film. This was then dried at 140°C for 10 minutes to obtain a dried film of the dielectric slurry on the PET film. The dried film of the conductive paste and the dried film of the dielectric slurry were brought into contact with each other and pressed at 40°C and 20 tons for 10 seconds. The PET film was then peeled off from the dried film of the dielectric slurry. Tape (adhesive strength: approximately 5 N per 10 mm width) was then applied to the dried film of the dielectric slurry, and the peeled condition was observed to evaluate adhesion. Here, for a 4.0 cm square adhesive coating area, the area of ​​the dried film of the dielectric slurry and the dried film of the conductive paste that were attached to the tape together was 80% or more and 100% or less, was rated as "A: Pass, excellent", 50% or more and less than 80% was rated as "B: Pass", and less than 50% was rated as "C: Fail", and these are all shown in Table 1.

[0084]

[0085] In Table 1, the absolute viscosity of the entire polybutene component is the absolute viscosity at a temperature of 40° C. and a shear rate of 0.10 / s, and the kinematic viscosity is the kinematic viscosity at 40° C. Furthermore, when one type of polybutene is used as the polybutene, the weight average molecular weight, number average molecular weight, absolute viscosity, and kinematic viscosity of the entire polybutene component are values ​​measured using only that one type of polybutene, and when two or more types of polybutene are used as the polybutene, they are values ​​measured using a mixture obtained by mixing those two or more types of polybutene in the blending ratio shown in Table 1.

[0086] Experimental Example 2 <Production of Conductive Paste> (Example 6 and Comparative Example 5) A conductive paste was produced by mixing 100.0 g of spherical nickel powder having an average particle size of 0.18 μm (Ni-688BT, manufactured by Shoei Chemical Industry Co., Ltd.) with the binder resin and organic solvent shown in Table 2 in the blending ratio (parts by mass) shown in Table 2. The performance of the obtained conductive paste was evaluated. The results are shown in Table 2.

[0087] The details of the binder resins and organic solvents shown in Table 2 are as follows: <Binder resin> Polybutene (HV-1900) Ethyl cellulose (STD100, manufactured by The Dow Chemical Company) <Organic solvent> Naphtesol 200 (NAPH200) Secondary butyl alcohol (SBA)

[0088] <Paste Performance Evaluation> The conductive pastes prepared as described above were subjected to various tests using the methods described below. (1) Dispersibility Test Ten samples were taken from each sample, and a 1.0 μm thick coating was formed using a bar coater. The coating was then dried at 140°C for 10 minutes to obtain a dried film. Using a stylus surface roughness tester, the surface roughness of the dried film was measured in accordance with JIS B 0601-2001, and dispersibility was evaluated. Here, a surface roughness of less than 50 nm was rated "A: Pass, Excellent," a surface roughness of 50 nm to less than 70 nm was rated "B: Pass, Good," and a surface roughness of 70 nm or greater was rated "C: Fail," as shown in Table 2. The dispersion state of each sample was also confirmed using a microscope. The results are shown in Figures 1 and 2. (2) Sheet Attack Test: Various samples were printed onto a 4 μm-thick dielectric coating using a dielectric slurry made by mixing barium titanate powder, polyvinyl butyral, and dihydroterpineol, with a predetermined internal electrode shape to a dry film thickness of 2 μm. The printed film was then dried at 90°C for 5 minutes to form a dried conductive paste film. The dielectric coating portion covered with the dried conductive paste film was visually observed from the back, and the degree of sheet attack was evaluated based on the degree of deformation due to distortion or tearing and color change. Here, the results are listed in Table 2, with almost no change being rated "A: Pass, Excellent," swelling being rated "B: Pass," and distortion or tearing being rated "C: Fail."

[0089]

[0090] Experimental Example 3 (Examples 7 to 8 and Comparative Examples 6 to 8) The binder resins shown in Table 3 were prepared, and the resin performance was evaluated by the method described below.

[0091] The details of the binder resins and organic solvents shown in Tables 3 and 4 are as follows. <Binder resins> ・Polybutene (HV-1900) ・Polyisobutylene (TETRAX6T) ・Ethyl cellulose (STD300) ・Cellulose acetate butyrate (ECB-5000) ・Cellulose acetate butyrate (CAB-553) ・Polyvinyl butyral (BL-S) <Organic solvents> ・Terpineol (TPO) ・Dihydroterpineol (DHT) ・Dihydroterpineol acetate (DHTA) ・Mineral spirits (MS) ・Turpene ・Normal paraffin ・Isoparaffin ・Cycloparaffin ・Cyclohexanol acetate (CHXA) ・Cyclodecyl acetate (CDA) ・Dipropylene glycol methyl-n-butyl ether (DPMNB) ・Dipropylene glycol methyl-n-propyl ether (DPMNP) Tripropylene glycol methyl-n-propyl ether (TPMNP)

[0092] <Resin Performance Evaluation> (1) Binder Removal Property Test 10 mg of each binder resin shown in Table 3 was placed in an aluminum pan and heated to 500°C at a rate of 10°C per minute in air or a nitrogen gas atmosphere. The residue was measured and evaluated as binder removal property. Here, residues of less than 1.5% were rated "A: Pass, Excellent," residues of 1.5% or more but less than 3% were rated "B: Pass, Good," and residues of 3% or more were rated "C: Fail," as shown in Table 3. The residues in the collected aluminum pans were also visually inspected. The results are shown in Figures 3 to 12.

[0093]

[0094] (2) Solubility test Solubility tests were conducted using the method described below. 2 g each of TETRAX 6T and polyvinyl butyral, which is used as a dielectric, was taken, and 8 g of the organic solvent shown in Table 4 was added, and the dissolution results were evaluated. Here, the results are listed in Table 4 as follows: "A" indicates that the material dissolved until it became uniform and transparent; "B" indicates that it became uniform but slightly cloudy; "C" indicates that it became uniform but became deeply cloudy or had a gel-like texture; "D" indicates that it was not uniform and had noticeable cloudiness; and "E" indicates that it hardly dissolved or that swelling was observed.

[0095]

[0096] When a test similar to that in Experimental Example 1 was performed using polybutenes (Polybutene HV-100 and Polybutene HV-50, both manufactured by ENEOS Corporation) having a weight-average molecular weight (Mw) of less than 2,470, which is outside the range of the present invention, and an absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s of less than 26.3 Pa·s, it was confirmed that similar results to those in Comparative Examples 1 and 2 were obtained. Furthermore, when a test similar to that in Experimental Examples 1 to 3 was performed using polybutenes (TETRAX 3T, TETRAX 4T, TETRAX 5T) having a weight-average molecular weight (Mw) in the range of 6,940 to 72,400 and an absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s in the range of 171.1 Pa·s to 433,395.8 Pa·s, it was confirmed that similar results to those in Examples 2 to 5 were obtained.

Claims

1. A conductive paste comprising a conductive powder, a binder resin, and an organic solvent, wherein the binder resin contains one or more types of polybutene, and the weight average molecular weight (Mw) of the entire polybutene component is 3,700 or more.

2. The conductive paste according to claim 1, wherein the weight average molecular weight (Mw) of the entire polybutene component is 4,000 or more.

3. The conductive paste according to claim 2, wherein the weight average molecular weight (Mw) of the entire polybutene component is 4,300 or more.

4. The conductive paste according to claim 3, wherein the weight average molecular weight (Mw) of the entire polybutene component is 4,500 or more.

5. A conductive paste comprising a conductive powder, a binder resin, and an organic solvent, wherein the binder resin contains one or more types of polybutene, and the viscosity of the entire polybutene component is 50 Pa·s or more at a temperature of 40°C and a shear rate of 0.10 / s.

6. The conductive paste according to claim 5, wherein the viscosity of the entire polybutene component is 55 Pa·s or more at a temperature of 40° C. and a shear rate of 0.10 / s.

7. The conductive paste according to claim 6, wherein the viscosity of the entire polybutene component is 60 Pa·s or more at a temperature of 40° C. and a shear rate of 0.10 / s.

8. The conductive paste according to claim 7, wherein the viscosity of the entire polybutene component is 80 Pa·s or more at a temperature of 40° C. and a shear rate of 0.10 / s.

9. The conductive paste according to claim 1 or 5, wherein the organic solvent includes a hydrocarbon solvent.

10. A conductive paste according to claim 1 or 5, wherein the organic solvent contains one or more selected from the group consisting of terpineol, dihydroterpineol, dihydroterpineol acetate, petroleum-based hydrocarbons, cycloalkyl acetates, dialkylene glycol dialkyl ethers, and trialkylene glycol dialkyl ethers.

11. The conductive paste according to claim 10, wherein the organic solvent comprises one or more selected from the group consisting of mineral spirits, turpentine, isoparaffin, normal paraffin, cycloparaffin, and cycloalkyl acetate.

12. The conductive paste according to claim 1 or 5, wherein the conductive powder is a metal powder.

13. The conductive paste according to claim 1 or 5, which is used for forming internal electrodes of multilayer ceramic electronic components.

14. An electronic component comprising: a substrate layer containing polyvinyl butyral; and an electrode layer laminated on said substrate layer using the conductive paste according to claim 1 or 5.