Polyamide composition and molded article

JPWO2025100541A1Pending Publication Date: 2025-05-15
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Patent Information

Application Number
JP2025556483
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2023-11-10
Filing Date
2024-11-08
Publication Date
2025-05-15
Patent Text Reader

Abstract

The present invention addresses the problem of providing: a polyamide composition that has good flame retardancy, tensile strength, and heat aging resistance, that causes less contamination of a mold during molding, and that has excellent laser marking properties; and a molded article and a laminate in which the polyamide composition is used. This polyamide composition comprises: (A) a polyamide; (B) a phosphorus-based flame retardant; and (C) a compound having a plurality of structures that react with a molecular terminal of the polyamide. The total mass of component (C) is 0.1-4.0 mass% with respect to the total mass of component (A) and component (C).
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