Polyamide composition and molded article
JPWO2025100541A1Pending Publication Date: 2025-05-15
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Patent Information
- Application Number
- JP2025556483
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Priority Date
- 2023-11-10
- Filing Date
- 2024-11-08
- Publication Date
- 2025-05-15
Abstract
The present invention addresses the problem of providing: a polyamide composition that has good flame retardancy, tensile strength, and heat aging resistance, that causes less contamination of a mold during molding, and that has excellent laser marking properties; and a molded article and a laminate in which the polyamide composition is used. This polyamide composition comprises: (A) a polyamide; (B) a phosphorus-based flame retardant; and (C) a compound having a plurality of structures that react with a molecular terminal of the polyamide. The total mass of component (C) is 0.1-4.0 mass% with respect to the total mass of component (A) and component (C).
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