Adhesive film, method for producing adhesive film, and method for producing electronic device

Abstract

Disclosed is an adhesive film (100) which includes: a base material layer (A); an adhesive resin layer (B) for provisionally fixing an electronic component, the adhesive resin layer (B) being positioned on the first surface (A1) side of the base material layer (A); an adhesive resin layer (C) that is positioned on the second surface (A2) side of the base material layer (A); and an electron conjugated polymer layer (1) that is positioned between the base material layer (A) and the adhesive resin layer (B).

Description

Adhesive film, method for manufacturing an adhesive film, and method for manufacturing an electronic device

[0001] The present invention relates to an adhesive film, a method for manufacturing an adhesive film, and a method for manufacturing an electronic device.

[0002] Fan-out WLP (wafer level packaging) has been developed as a technology that can reduce the size and weight of electronic devices (e.g., semiconductor devices). One method for fabricating fan-out WLP, called embedded wafer level ball grid array (eWLB), involves temporarily fixing multiple electronic components, such as semiconductor chips, spaced apart on an adhesive film attached to a support substrate, and then encapsulating the multiple electronic components together with an encapsulant. Here, the adhesive film must be adhered to the electronic components and the support substrate during the encapsulation process, and must be removed from the encapsulated electronic components together with the support substrate after encapsulation.

[0003] As a technique relating to a manufacturing method of such a fan-out type WLP, for example, the technique described in Patent Document 1 can be given.

[0004] Patent Document 1 describes a heat-resistant adhesive sheet for use in manufacturing semiconductor devices, which is used by adhering when resin-encapsulating a substrateless semiconductor chip, in order to address the issues of chip misalignment and package damage in a method of manufacturing a substrateless semiconductor package using an adhesive sheet as a temporary fixing support, the heat-resistant adhesive sheet having a base layer and an adhesive layer, the adhesive layer having an adhesive strength to SUS304 after lamination of 0.5 N / 20 mm or more, and hardening due to stimuli received up to the point at which the resin-encapsulating process is completed, so that the peel strength to the package is 2.0 N / 20 mm or less.

[0005] JP 2011-134811 A

[0006] The present invention provides an adhesive film that can suppress adhesive residue on electronic components.

[0007] The present inventors have conducted extensive research to achieve the above object, and as a result have found that the inclusion of an electronically conjugated polymer layer can suppress adhesive residue on electronic components, thereby completing the present invention.

[0008] According to the present invention, there are provided a pressure-sensitive adhesive film, a method for producing a pressure-sensitive adhesive film, and a method for producing an electronic device, as shown below.

[0009] [1] An adhesive film comprising: a base layer (A); an adhesive resin layer (B) on a first surface side of the base layer (A) for temporarily fixing an electronic component; an adhesive resin layer (C) on a second surface side of the base layer (A); and an electronically conjugated polymer layer between the base layer (A) and the adhesive resin layer (B). [2] The adhesive film according to [1] above, wherein the electronically conjugated polymer contained in the electronically conjugated polymer layer comprises one or more selected from the group consisting of polyacetylene, polyacene, polyparaphenylene, polyparaphenylenevinylene, polypyrrole, polyaniline, polythiophene, and derivatives thereof. [3] The adhesive film according to [1] or [2] above, wherein the electronically conjugated polymer contained in the electronically conjugated polymer layer comprises one or more selected from the group consisting of polypyrrole, polythiophene, and derivatives thereof. [4] The pressure-sensitive adhesive film according to any one of [1] to [3] above, wherein the thickness of the electronically conjugated polymer layer is 0.01 μm or more and 10 μm or less. [5] The pressure-sensitive adhesive film according to any one of [1] to [4] above, wherein the content of the electronically conjugated polymer in the electronically conjugated polymer layer is 95% by mass or more, when the entire electronically conjugated polymer layer is taken as 100% by mass. [6] The pressure-sensitive adhesive film according to any one of [1] to [5] above, wherein the content of the binder resin in the electronically conjugated polymer layer is 1.0% by mass or less, when the entire electronically conjugated polymer layer is taken as 100% by mass. [7] The pressure-sensitive adhesive film according to any one of [1] to [6] above, further comprising the electronically conjugated polymer layer between the base layer (A) and the pressure-sensitive adhesive resin layer (C). [8] The adhesive film according to any one of the above [1] to [7], wherein the adhesive resin layer (B) comprises one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins. [9] The adhesive film according to any one of the above [1] to [8], wherein the adhesive resin layer (C) is a layer whose adhesive strength decreases in response to an external stimulus.

[10] The pressure-sensitive adhesive film according to any one of [1] to [9] above, wherein the pressure-sensitive adhesive resin layer (C) comprises one or more selected from the group consisting of (meth)acrylic pressure-sensitive adhesive resins, silicone pressure-sensitive adhesive resins, urethane pressure-sensitive adhesive resins, olefin pressure-sensitive adhesive resins, and styrene pressure-sensitive adhesive resins.

[11] The pressure-sensitive adhesive film according to any one of [1] to

[10] above, wherein the base layer (A) comprises one or more selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, and polyimide.

[12] The pressure-sensitive adhesive film according to any one of [1] to

[11] above, which can be used to temporarily fix an electronic component when sealing the electronic component with a sealant.

[13] A method for producing the pressure-sensitive adhesive film according to any one of [1] to

[12] above, comprising the step of immersing the base layer (A) in a treatment liquid containing a monomer capable of forming the electronic conjugated polymer layer while polymerizing the monomer, thereby forming the electronic conjugated polymer layer on the surface of the base layer (A).

[14] A method for manufacturing an electronic device, comprising the steps of: preparing a structure including the pressure-sensitive adhesive film according to any one of [1] to

[12] above; an electronic component attached to the pressure-sensitive adhesive resin layer (B) of the pressure-sensitive adhesive film; and a support substrate attached to the pressure-sensitive adhesive resin layer (C) of the pressure-sensitive adhesive film; and encapsulating the electronic component with a sealant.

[15] A method for manufacturing an electronic device according to

[14] above, further comprising the step of applying an external stimulus to reduce the adhesive strength of the pressure-sensitive adhesive resin layer (C) to peel the support substrate from the structure.

[16] A method for manufacturing an electronic device according to

[14] or

[15] above, further comprising the step of peeling the pressure-sensitive adhesive film from the electronic component.

[17] A method for manufacturing an electronic device according to any one of

[14] to

[16] above, wherein the sealant comprises an epoxy resin-based sealant.

[18] A method for manufacturing an electronic device according to any one of

[14] to

[17] above, wherein the electronic device comprises a fan-out package.

[0010] According to the present invention, it is possible to provide an adhesive film that can suppress adhesive residue on electronic components.

[0011] Fig. 1 is a cross-sectional view schematically showing an example of the structure of an adhesive film of the present embodiment; Fig. 2 is a cross-sectional view schematically showing an example of the structure of an adhesive film of the present embodiment; Fig. 3 is a cross-sectional view schematically showing an example of the structure of an adhesive film of the present embodiment; Fig. 4 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device of the present embodiment.

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by common reference numerals, and their explanation will be omitted where appropriate. Furthermore, the drawings are schematic and do not necessarily correspond to the actual dimensional ratios. In the specification, the upper and lower limit values ​​of numerical ranges can be arbitrarily combined unless otherwise specified. In the specification, "(meth)acrylic" means acrylic, methacrylic, or both acrylic and methacrylic.

[0013] <Adhesive Film> The adhesive film 100 of this embodiment will be described below. Fig. 1 is a cross-sectional view that schematically shows an example of the structure of the adhesive film 100 of this embodiment.

[0014] The adhesive film 100 of this embodiment is an adhesive film 100 including a base layer (A), an adhesive resin layer (B) for temporarily fixing an electronic component on a first surface A1 side of the base layer (A), an adhesive resin layer (C) on a second surface A2 side of the base layer (A), and an electronic conjugated polymer layer 1 between the base layer (A) and the adhesive resin layer (B).

[0015] A manufacturing method for an electronic device includes a step of arranging electronic components spaced apart on an adhesive film attached to a support substrate and encapsulating the components together with an encapsulant. The adhesive film must then be peeled from the encapsulated electronic components. The inventors have found that, when peeling the adhesive film from the encapsulated electronic components, the adhesive resin layer on the electronic component side and the encapsulant may have a stronger adhesive bond between the encapsulant and the adhesive resin layer on the electronic component side than the adhesive bond between the substrate layer in the adhesive film and the adhesive resin layer on the electronic component side due to an interaction at the interface between the adhesive resin layer on the electronic component side and the encapsulant. This can result in the adhesive resin layer peeling off from the adhesive film and adhering to the electronic component (hereinafter also referred to as adhesive residue). After extensive research, the inventors have found that including an electronically conjugated polymer layer between the substrate layer (A) and the adhesive resin layer (B) can suppress adhesive residue on the electronic component, leading to the completion of the present invention.

[0016] The pressure-sensitive adhesive film 100 of this embodiment can be suitably used to temporarily fix electronic components when sealing the electronic components with a sealing material, from the viewpoint of being able to suppress adhesive residue on the electronic components.

[0017] In the pressure-sensitive adhesive film 100 of this embodiment, the electronically conjugated polymer layer 1 contains a polymer having a conjugated double bond (electronically conjugated polymer). From the viewpoint of further suppressing adhesive residue on electronic components, the electronically conjugated polymer of this embodiment preferably contains one or more types selected from the group consisting of polyacetylene, polyacene, polyparaphenylene, polyparaphenylenevinylene, polypyrrole, polyaniline, polythiophene, and derivatives thereof, more preferably contains one or more types selected from the group consisting of polypyrrole, polythiophene, and derivatives thereof, even more preferably contains one or more types selected from the group consisting of polypyrrole and derivatives thereof, and even more preferably contains polypyrrole.

[0018] In the pressure-sensitive adhesive film 100 of this embodiment, the content of the electronically conjugated polymer in the electronically conjugated polymer layer 1 is preferably 95% by mass or more, more preferably 96% by mass or more, even more preferably 97% by mass or more, even more preferably 98% by mass or more, and still more preferably 99% by mass or more, from the viewpoint of further suppressing adhesive residue on electronic components, when the entire electronically conjugated polymer layer 1 is taken as 100% by mass. Furthermore, the upper limit of the content of the electronically conjugated polymer in the electronically conjugated polymer layer 1 is not particularly limited, but is, for example, 100% by mass or less. Furthermore, in the pressure-sensitive adhesive film 100 of this embodiment, the content of the electronic conjugated polymer in the electronic conjugated polymer layer 1, when the entire electronic conjugated polymer layer 1 is taken as 100% by mass, is preferably 95% by mass or more and 100% by mass or less, more preferably 96% by mass or more and 100% by mass or less, even more preferably 97% by mass or more and 100% by mass or less, even more preferably 98% by mass or more and 100% by mass or less, and even more preferably 99% by mass or more and 100% by mass or less, from the viewpoint of further suppressing adhesive residue on electronic components.

[0019] In the pressure-sensitive adhesive film 100 of this embodiment, the content of the binder resin in the electronic conjugated polymer layer 1 is preferably 1.0% by mass or less, more preferably 0.8% by mass or less, even more preferably 0.6% by mass or less, even more preferably 0.4% by mass or less, even more preferably 0.2% by mass or less, and even more preferably 0.1% by mass or less, from the viewpoint of further suppressing adhesive residue on electronic components, when the entire electronic conjugated polymer layer 1 is taken as 100% by mass. Furthermore, the lower limit of the content of the binder resin is not particularly limited, but is, for example, 0% by mass or more. Furthermore, in the pressure-sensitive adhesive film 100 of this embodiment, the content of the binder resin in the electronic conjugated polymer layer 1, when the entire electronic conjugated polymer layer 1 is taken as 100% by mass, is preferably from 0% by mass to 1.0% by mass, more preferably from 0% by mass to 0.8% by mass, even more preferably from 0% by mass to 0.6% by mass, even more preferably from 0% by mass to 0.4% by mass, even more preferably from 0% by mass to 0.2% by mass, and even more preferably from 0% by mass to 0.1% by mass, from the viewpoint of further suppressing adhesive residue on electronic components.

[0020] The binder resin refers to a resin that disperses the electronically conjugated polymer and functions as a filler, adhesive, and binder for the electronically conjugated polymer layer 1. Examples of the binder resin include thermoplastic resins and thermosetting resins. Examples of the thermoplastic resin include polyolefin resins, polystyrene resins, (meth)acrylic resins, silicone resins, polyester resins, polyamide resins, and fluorine-based resins. Examples of the thermosetting resin include epoxy resins, phenol resins, melamine resins, urea resins, urethane resins, maleimide resins, and cyanate resins.

[0021] From the viewpoint of further suppressing adhesive residue on electronic components, the thickness of the electronic conjugated polymer layer 1 of the present embodiment is preferably 0.01 μm or more, more preferably 0.03 μm or more, even more preferably 0.05 μm or more, and is preferably 10 μm or less, more preferably 8 μm or less, even more preferably 5 μm or less, even more preferably 3 μm or less, even more preferably 1 μm or less, even more preferably 0.5 μm or less, even more preferably 0.3 μm or less, even more preferably 0.1 μm or less. Furthermore, from the viewpoint of further suppressing adhesive residue on electronic components, the thickness of the electronic conjugated polymer layer 1 of this embodiment is preferably 0.01 μm or more and 10 μm or less, more preferably 0.01 μm or more and 8 μm or less, even more preferably 0.01 μm or more and 5 μm or less, even more preferably 0.01 μm or more and 3 μm or less, even more preferably 0.01 μm or more and 1 μm or less, even more preferably 0.01 μm or more and 0.5 μm or less, even more preferably 0.03 μm or more and 0.3 μm or less, and even more preferably 0.05 μm or more and 0.1 μm or less.

[0022] As shown in FIG. 2 , the pressure-sensitive adhesive film 100 of the present embodiment preferably further includes an electronic conjugated polymer layer 1 between the base material layer (A) and the pressure-sensitive adhesive resin layer (C), from the viewpoint of further suppressing adhesive residue on electronic components.

[0023] The thickness of the entire pressure-sensitive adhesive film 100 of this embodiment is preferably 25 μm or more, more preferably 30 μm or more, even more preferably 50 μm or more, and is preferably 800 μm or less, more preferably 500 μm or less, even more preferably 300 μm or less, even more preferably 200 μm or less, and even more preferably 150 μm or less, from the viewpoint of further improving the performance balance between mechanical properties and handleability. Furthermore, the thickness of the entire pressure-sensitive adhesive film 100 of this embodiment is preferably 25 μm or more and 800 μm or less, more preferably 25 μm or more and 500 μm or less, even more preferably 25 μm or more and 300 μm or less, even more preferably 30 μm or more and 200 μm or less, and even more preferably 50 μm or more and 150 μm or less, from the viewpoint of further improving the performance balance between mechanical properties and handleability.

[0024] Each layer of the adhesive film 100 will be described below.

[0025] [Substrate Layer (A)] The substrate layer (A) is a layer provided for the purpose of further improving the handleability, mechanical properties, heat resistance, and other properties of the pressure-sensitive adhesive film 100. The substrate layer (A) is not particularly limited, but examples thereof include resin films. Examples of resins constituting the resin film include thermoplastic resins, and examples thereof include one or more selected from polyolefins such as polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene); polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyamides such as nylon-6, nylon-66, and polymethaxylene adipamide; polyacrylate; polymethacrylate; polyvinyl chloride; polyvinylidene chloride; polyimide; polyetherimide; ethylene-vinyl acetate copolymer; polyacrylonitrile; polycarbonate; polystyrene; ionomer; polysulfone; polyethersulfone; and polyphenylene ether. Among these, the resin constituting the resin film preferably contains one or more types selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, and polyimide, more preferably one or more types selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate, and even more preferably polyethylene terephthalate, from the viewpoint of an excellent balance of transparency, mechanical strength, price, and the like.

[0026] The base layer (A) may be a single layer or two or more layers. The resin film for forming the base layer (A) may be a stretched film or a uniaxially or biaxially stretched film, but is preferably a uniaxially or biaxially stretched film from the viewpoint of improving the mechanical strength of the base layer (A).

[0027] The thickness of the substrate layer (A) is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, and even more preferably 20 μm or more, from the viewpoint of obtaining better film properties, and is preferably 500 μm or less, more preferably 300 μm or less, even more preferably 250 μm or less, even more preferably 150 μm or less, and even more preferably 100 μm or less. Furthermore, from the viewpoint of obtaining better film properties, the thickness of the substrate layer (A) is preferably 1 μm or more and 500 μm or less, more preferably 1 μm or more and 300 μm or less, even more preferably 5 μm or more and 250 μm or less, even more preferably 10 μm or more and 150 μm or less, and even more preferably 20 μm or more and 100 μm or less. The substrate layer (A) may be subjected to a surface treatment to further improve adhesion with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment, etc. may be performed, but corona treatment is preferred from the viewpoint of further improving adhesion with other layers.

[0028] [Adhesive resin layer (B)] The adhesive resin layer (B) is a layer located on the first surface A1 side of the base layer (A). The adhesive resin layer (B) is a layer that comes into contact with the surface of an electronic component to temporarily fix the electronic component when sealing the electronic component with a sealing material in the manufacturing process of an electronic device, for example.

[0029] The adhesive resin constituting the adhesive resin layer (B) preferably contains one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins, and more preferably contains a (meth)acrylic adhesive resin, since this makes it easier to adjust the adhesive strength.

[0030] The adhesive resin layer (B) can be a radiation-crosslinked adhesive resin layer whose adhesive strength can be reduced by radiation. The radiation-crosslinked adhesive resin layer (B) undergoes crosslinking upon irradiation with radiation, significantly reducing its adhesive strength, making it easier to pick up electronic components from the adhesive resin layer (B) in the electronic component pick-up step. Examples of radiation include ultraviolet light, electron beams, and infrared light. The radiation-crosslinked adhesive resin layer is preferably an ultraviolet-crosslinked adhesive resin layer.

[0031] Examples of the (meth)acrylic adhesive resin include a copolymer containing a (meth)acrylic acid alkyl ester monomer unit (b1) and a monomer unit (b2) having a functional group capable of reacting with a crosslinking agent. In this embodiment, the (meth)acrylic acid alkyl ester refers to an acrylic acid alkyl ester, a methacrylic acid alkyl ester, or a mixture thereof.

[0032] The (meth)acrylic adhesive resin of the present embodiment can be obtained, for example, by copolymerizing a monomer mixture containing a monomer that forms a (meth)acrylic acid alkyl ester monomer unit (b1) and a monomer that forms a monomer unit (b2) having a functional group that can react with a crosslinking agent.

[0033] The monomer forming the (meth)acrylic acid alkyl ester monomer unit (b1) is preferably a (meth)acrylic acid alkyl ester having an alkyl group containing 1 to 12 carbon atoms, more preferably a (meth)acrylic acid alkyl ester having an alkyl group containing 1 to 8 carbon atoms. Specific examples of the monomer forming the (meth)acrylic acid alkyl ester monomer unit (b1) include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, and 2-ethylhexyl methacrylate. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin of this embodiment, the content of the monomer unit (b1) is preferably 10% by mass or more and 98.9% by mass or less, more preferably 50% by mass or more and 98% by mass or less, and even more preferably 85% by mass or more and 97% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin is taken as 100% by mass.

[0034] Examples of monomers that form the monomer unit (b2) having a functional group reactive with a crosslinking agent include acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, itaconic acid monoalkyl esters, mesaconic acid monoalkyl esters, citraconic acid monoalkyl esters, fumaric acid monoalkyl esters, maleic acid monoalkyl esters, glycidyl acrylate, glycidyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, tert-butylaminoethyl acrylate, and tert-butylaminoethyl methacrylate. Preferred are acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, and the like. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin of the present embodiment, the content of the monomer unit (b2) is preferably 1% by mass or more and 40% by mass or less, more preferably 2% by mass or more and 20% by mass or less, and even more preferably 3% by mass or more and 15% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin is 100% by mass.

[0035] The (meth)acrylic adhesive resin of this embodiment may further contain, in addition to the monomer unit (b1) and the monomer unit (b2), a bifunctional monomer unit (b3) or a specific comonomer unit having surfactant properties (hereinafter referred to as a polymerizable surfactant). The polymerizable surfactant has the property of copolymerizing with the monomer unit (b1), the monomer unit (b2), and the bifunctional monomer unit (b3), and also acts as an emulsifier when emulsion polymerization is performed.

[0036] Examples of monomers that form the bifunctional monomer unit (b3) include allyl methacrylate, allyl acrylate, divinylbenzene, vinyl methacrylate, vinyl acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tetraethylene glycol di(meth)acrylate, and, for example, those having diacrylate or dimethacrylate at both ends and a propylene glycol main chain structure (e.g., manufactured by NOF Corporation, trade names: PDP-200, PDP-400, ADP-200, ADP-400), tetramethylene glycol (e.g., manufactured by NOF Corporation, trade names: ADT-250, ADT-850), and mixtures thereof (e.g., manufactured by NOF Corporation, trade names: ADET-1800, ADPT-4000).

[0037] In the (meth)acrylic adhesive resin of the present embodiment, the content of the bifunctional monomer unit (b3) is preferably 0.1% by mass or more and 30% by mass or less, more preferably 0.1% by mass or more and 15% by mass or less, even more preferably 0.1% by mass or more and 20% by mass or less, and still more preferably 0.1% by mass or more and 5% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin is 100% by mass.

[0038] Examples of the polymerizable surfactant include those in which a polymerizable 1-propenyl group has been introduced into the benzene ring of polyoxyethylene nonylphenyl ether (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.; trade names: AQUALON RN-10, RN-20, RN-30, RN-50, etc.), those in which a polymerizable 1-propenyl group has been introduced into the benzene ring of an ammonium salt of a sulfate ester of polyoxyethylene nonylphenyl ether (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.; trade names: AQUALON HS-10, HS-20, HS-1025, etc.), and sulfosuccinic acid diesters having a polymerizable double bond in the molecule (manufactured by Kao Corporation; trade names: Latemul S-120A, S-180A, etc.). In the (meth)acrylic adhesive resin of the present embodiment, the content of the polymerizable surfactant is preferably 0.1% by mass or more and 30% by mass or less, more preferably 0.1% by mass or more and 15% by mass or less, even more preferably 0.1% by mass or more and 20% by mass or less, and still more preferably 0.1% by mass or more and 5% by mass or less, when the sum of all monomer units in the (meth)acrylic adhesive resin is 100% by mass.

[0039] The (meth)acrylic adhesive resin of the present embodiment may further contain, if necessary, a monomer unit formed from a monomer having a polymerizable double bond, such as vinyl acetate, acrylonitrile, or styrene.

[0040] The polymerization reaction mechanism of the (meth)acrylic adhesive resin of this embodiment can be radical polymerization, anionic polymerization, cationic polymerization, etc. Specific examples of the radical polymerization initiator used when polymerizing the (meth)acrylic adhesive resin of this embodiment by radical polymerization include benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 3,3,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxydicarbonate, methyl ethyl ketone peroxide, t-butyl peroxyphthalate, t-butyl peroxybenzoate, di-t-butyl peroxyacetate, t-butylperoxyisobutyrate, and t-butylperoxy-2-hexanoate. peroxides such as ammonium persulfate, potassium persulfate, and sodium persulfate; and azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, and 4,4'-azobis-4-cyanovaleric acid.

[0041] The radical polymerization initiator in the (meth)acrylic adhesive resin of the present embodiment is preferably an inorganic peroxide such as water-soluble ammonium persulfate, potassium persulfate, or sodium persulfate, or an azo compound having a carboxyl group in the molecule such as water-soluble 4,4'-azobis-4-cyanovaleric acid, from the viewpoint of being able to further suppress adhesive residue of the adhesive resin layer (B) on electronic components; and from the viewpoint of the influence of ions on the surface of electronic components, more preferably an azo compound having a carboxyl group in the molecule such as ammonium persulfate or 4,4'-azobis-4-cyanovaleric acid, and even more preferably an azo compound having a carboxyl group in the molecule such as 4,4'-azobis-4-cyanovaleric acid.

[0042] The adhesive resin layer (B) of this embodiment preferably further contains, in addition to the adhesive resin, a crosslinking agent having two or more crosslinkable functional groups per molecule. Examples of such crosslinking agents include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcinol diglycidyl ether; isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, a toluene diisocyanate triadduct of trimethylolpropane, polyisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate; and trimethylolpropane-tri-β-aziridinyl propionate. aziridine compounds such as N,N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide), N,N'-toluene-2,4-bis(1-aziridinecarboxamide), and trimethylolpropane-tri-β-(2-methylaziridine)propionate; tetrafunctional epoxy compounds such as N,N,N',N'-tetraglycidyl-m-xylylenediamine and 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane; and melamine compounds such as hexamethoxymethylolmelamine. Among these, it is preferable to use one or more compounds selected from the group consisting of epoxy compounds, isocyanate compounds, and aziridine compounds.

[0043] The content of the crosslinking agent in the adhesive resin layer (B) is preferably 0.1 parts by mass or more, more preferably 1 part by mass or more, even more preferably 2 parts by mass or more, and preferably 15 parts by mass or less, more preferably 10 parts by mass or less, even more preferably 8 parts by mass or less, and even more preferably 5 parts by mass or less, relative to 100 parts by mass of the adhesive resin, from the viewpoint of further suppressing adhesive residue on electronic components. Also, the content of the crosslinking agent in the adhesive resin layer (B) is preferably 0.1 parts by mass or more and 15 parts by mass or less, more preferably 0.1 parts by mass or more and 10 parts by mass or less, even more preferably 1 part by mass or more and 8 parts by mass or less, and even more preferably 2 parts by mass or more and 5 parts by mass or less, relative to 100 parts by mass of the adhesive resin, from the viewpoint of further suppressing adhesive residue on electronic components.

[0044] The adhesive resin layer (B) may contain additives such as a plasticizer and a tackifying resin as other components. When the adhesive resin layer (B) is a radiation-crosslinked adhesive resin layer, it may contain various additives for radiation crosslinking. From the viewpoint of further suppressing adhesive residue on electronic components, the total content of the adhesive resin and crosslinking agent in the adhesive resin layer (B) is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more, when the entire adhesive resin layer (B) is taken as 100% by mass.

[0045] In the pressure-sensitive adhesive film 100 of the present embodiment, from the viewpoint of stably holding the electronic component 70 on the adhesive resin layer (B) when the adhesive strength of the adhesive resin layer (C) is reduced by heat treatment to peel off the support substrate from the adhesive resin layer (C), the total content of the gas-generating component and heat-expandable microspheres in the adhesive resin layer (B) is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, and even more preferably 0.01% by mass or less, when the entire adhesive resin layer (B) is taken as 100% by mass, and even more preferably the adhesive resin layer (B) does not contain any gas-generating component or heat-expandable microspheres.

[0046] The thickness of the adhesive resin layer (B) is preferably 1 μm or more, more preferably 3 μm or more, even more preferably 5 μm or more, from the viewpoint of further suppressing adhesive residue on electronic components, and is preferably 40 μm or less, more preferably 35 μm or less, even more preferably 30 μm or less, even more preferably 25 μm or less, and even more preferably 20 μm or less. Also, the thickness of the adhesive resin layer (B) is preferably 1 μm or more and 40 μm or less, more preferably 1 μm or more and 35 μm or less, even more preferably 1 μm or more and 30 μm or less, even more preferably 3 μm or more and 25 μm or less, and even more preferably 5 μm or more and 20 μm or less, from the viewpoint of further suppressing adhesive residue on electronic components.

[0047] [Adhesive Resin Layer (C)] The adhesive resin layer (C) is a layer located on the second surface A2 side of the base layer (A). The adhesive resin layer (C) is preferably a layer whose adhesive strength decreases with an external stimulus. This allows the adhesive film 100 to be peeled off from the support substrate by applying an external stimulus. Examples of adhesive resin layers (C) whose adhesive strength decreases with an external stimulus include heat-peelable adhesive resin layers whose adhesive strength decreases with heating, and light-peelable adhesive resin layers whose adhesive strength decreases with light such as ultraviolet light or radiation. Methods for applying the external stimulus include light irradiation and heat treatment.

[0048] Examples of heat-peelable adhesive resin layers include adhesive resin layers made of a heat-expandable adhesive containing an adhesive resin (C1) and a gas-generating component; adhesive resin layers made of a heat-expandable adhesive containing an adhesive resin (C1) and heat-expandable microspheres that can expand to reduce adhesive strength; and adhesive resin layers made of a heat-expandable adhesive whose adhesive strength is reduced by a crosslinking reaction of the adhesive component due to heat. Among these, from the viewpoint of further suppressing misalignment of electronic components and further simplifying the manufacturing method, it is preferable that the adhesive resin layer (C) of this embodiment includes an adhesive resin layer made of a heat-expandable adhesive.

[0049] From the viewpoint of further improving the thermal peelability, the adhesive resin layer (C) of the present embodiment preferably contains one or more components selected from the group consisting of a gas-generating component and heat-expandable microspheres, and more preferably contains heat-expandable microspheres.

[0050] The thermally expandable adhesive in the adhesive resin layer (C) is an adhesive whose adhesive strength decreases or is lost when heated at a temperature above 100°C, more preferably at a temperature of 110°C or higher, even more preferably at a temperature of 120°C or higher, even more preferably at a temperature of 130°C or higher, even more preferably at a temperature of 150°C or higher, even more preferably at a temperature of 180°C or higher, even more preferably at a temperature of 200°C or higher, even more preferably at a temperature of 210°C or higher, and even more preferably at a temperature of 230°C or higher. For example, a material that does not peel at temperatures below 100°C but peels at temperatures above 100°C can be selected as the thermally expandable adhesive in the adhesive resin layer (C). It is preferable that the adhesive strength be such that the adhesive film 100 does not peel from the support substrate during the manufacturing process of the electronic device. Such an adhesive resin layer (C) can be obtained by selecting the type of gas-generating component or thermally expandable microspheres in the adhesive resin layer (C). Here, the decrease or loss of adhesive strength due to heating at a temperature exceeding 100°C can be evaluated, for example, by attaching the adhesive resin layer (C) side to a stainless steel plate, heating at 90°C for 1 hour, and then heating at a temperature exceeding 100°C for 2 minutes, and then measuring the peel strength from the stainless steel plate. The specific heating temperature when heating at a temperature exceeding 100°C is set to a temperature higher than the temperature at which gas is generated and the temperature at which the heat-expandable microspheres thermally expand, and is appropriately set depending on the gas generated and the type of heat-expandable microspheres. In this embodiment, loss of adhesive strength refers, for example, to a 180° peel strength of less than 0.5 N / 25 mm measured at 23°C and a tensile speed of 300 mm / min.

[0051] Examples of gas-generating components that can be used include azo compounds, azide compounds, Meldrum's acid derivatives, etc. Examples of gas-generating components include inorganic blowing agents such as ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium boron hydroxide, and various azides; water; fluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; paratoluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxo-2,4'-dimethylaminobenzoate, and the like; Other examples of organic blowing agents that can be used include hydrazine compounds such as bis(benzenesulfonylhydrazide) and allylbis(sulfonylhydrazide); semicarbazide compounds such as p-toluylenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; and N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine and N,N'-dimethyl-N,N'-dinitrosoterephthalamide. The gas-generating component may be mixed with the adhesive resin (C1) or may be directly bonded to the adhesive resin (C1).

[0052] Heat-expandable microspheres can be prepared using, for example, microencapsulated blowing agents. Examples of such heat-expandable microspheres include microspheres in which a substance that easily gasifies and expands upon heating, such as isobutane, propane, or pentane, is encapsulated in an elastic shell. Examples of materials constituting the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone. Heat-expandable microspheres can be produced by, for example, coacervation or interfacial polymerization.

[0053] The total content of the gas-generating component and heat-expandable microspheres in the adhesive resin layer (C) can be appropriately set depending on the expansion ratio and adhesive strength reduction of the adhesive resin layer (C), and is not particularly limited. It is preferably at least 1 part by mass, more preferably at least 10 parts by mass, even more preferably at least 12 parts by mass, and is preferably at most 150 parts by mass, more preferably at most 130 parts by mass, even more preferably at most 100 parts by mass, even more preferably at most 50 parts by mass, even more preferably at most 25 parts by mass, even more preferably at most 20 parts by mass, per 100 parts by mass of the adhesive resin (C1) in the adhesive resin layer (C). The total content of the gas-generating component and heat-expandable microspheres in the adhesive resin layer (C) is preferably 1 to 150 parts by mass, more preferably 1 to 130 parts by mass, even more preferably 1 to 100 parts by mass, even more preferably 1 to 50 parts by mass, even more preferably 10 to 25 parts by mass, and even more preferably 12 to 20 parts by mass, per 100 parts by mass of the adhesive resin (C1) in the adhesive resin layer (C). It is preferable to design the temperature at which gas is generated and the temperature at which the heat-expandable microspheres thermally expand are above 100°C.

[0054] The adhesive resin (C1) constituting the adhesive resin layer (C) preferably contains one or more selected from the group consisting of (meth)acrylic adhesive resins, urethane adhesive resins, silicone adhesive resins, olefin adhesive resins, polyester adhesive resins, polyamide adhesive resins, fluorine-based adhesive resins and styrene-based adhesive resins, and from the viewpoint of further improving thermal peelability, more preferably contains one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins and styrene-based adhesive resins, and even more preferably contains a (meth)acrylic adhesive resin from the viewpoint of facilitating adjustment of adhesive strength, etc.

[0055] The adhesive resin layer (C) of this embodiment preferably further contains, in addition to the adhesive resin (C1), a crosslinking agent (C2) having two or more crosslinkable functional groups per molecule. The crosslinking agent (C2) having two or more crosslinkable functional groups per molecule is reacted with the functional groups of the adhesive resin (C1) to adjust the adhesive strength and cohesive strength. Examples of such crosslinking agents (C2) include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcinol diglycidyl ether; isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, toluene diisocyanate triadduct of trimethylolpropane, polyisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate; and trimethylolpropane-tri-β-aziridinylpropionate. aziridine compounds such as tetramethylolmethane-tri-β-aziridinylpropionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide), N,N'-toluene-2,4-bis(1-aziridinecarboxamide), and trimethylolpropane-tri-β-(2-methylaziridine)propionate; tetrafunctional epoxy compounds such as N,N,N',N'-tetraglycidyl-m-xylylenediamine and 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane; and melamine compounds such as hexamethoxymethylolmelamine. These may be used alone or in combination of two or more. The adhesive resin layer (C) of this embodiment preferably contains one or more compounds selected from the group consisting of epoxy compounds, isocyanate compounds, and aziridine compounds.

[0056] The content of the crosslinking agent (C2) in the adhesive resin layer (C) is preferably within a range such that the number of functional groups in the crosslinking agent (C2) is not greater than the number of functional groups in the adhesive resin (C1). However, if necessary, an excess amount may be added when new functional groups are generated by the crosslinking reaction or when the crosslinking reaction is slow. The content of the crosslinking agent (C2) in the adhesive resin layer (C) is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, even more preferably 1.0 parts by mass or more, and even more preferably 2.0 parts by mass or more, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of further improving the balance between adhesive strength and thermal peelability. From the viewpoint of storage stability, the content is preferably 10.0 parts by mass or less, more preferably 5.0 parts by mass or less, and even more preferably 3.0 parts by mass or less. In addition, the content of the crosslinking agent (C2) in the adhesive resin layer (C) is preferably 0.1 parts by mass or more and 10.0 parts by mass or less, more preferably 0.5 parts by mass or more and 10.0 parts by mass or less, even more preferably 1.0 parts by mass or more and 5.0 parts by mass or less, and even more preferably 2.0 parts by mass or more and 3.0 parts by mass or less, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of further improving the performance balance of adhesive strength, thermal peelability, and storage stability.

[0057] The adhesive resin layer (C) of this embodiment preferably contains a tackifier resin in addition to the adhesive resin (C1) from the viewpoint of improving adhesion to the support substrate. Incorporating a tackifier resin into the adhesive resin layer (C) is preferred because it facilitates adjustment of adhesion to the support substrate at around room temperature. The tackifier resin preferably has a softening point of 100°C or higher. Specific examples of tackifier resins include rosin-based resins such as rosin derivatives treated by esterification or the like; terpene-based resins such as α-pinene, β-pinene, dipentene, and terpene phenol; natural rosins such as gum, wood, and tall oil; petroleum resins obtained by hydrogenating, disproportionating, polymerizing, or maleating these natural rosins; and coumarone-indene resins. Among these, the adhesive resin layer (C) of this embodiment preferably has a softening point in the range of 100 to 160°C, and even more preferably in the range of 120 to 150°C.

[0058] The content of the tackifier resin in the adhesive resin layer (C) is preferably 1 part by mass or more, more preferably 2 parts by mass or more, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of further improving adhesion to the support substrate during operation, and is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, from the viewpoint of further improving the performance balance between adhesion to the support substrate and application ability at room temperature. Furthermore, the content of the tackifier resin in the adhesive resin layer (C) is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 2 parts by mass or more and 50 parts by mass or less, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of further improving the performance balance between adhesion to the support substrate during operation and application ability at room temperature.

[0059] The adhesive resin layer (C) may contain additives such as plasticizers as other components. The lower limit of the total content of the adhesive resin (C1), crosslinking agent (C2), and tackifier resin in the adhesive resin layer (C), when the entire adhesive resin layer (C) is taken as 100% by mass, is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more. Furthermore, when the adhesive resin layer (C) is a heat-expandable adhesive resin layer, the lower limit of the total content of the adhesive resin (C1), crosslinking agent (C2), tackifier resin, gas-generating component, and heat-expandable microspheres in the adhesive resin layer (C), when the entire adhesive resin layer (C) is taken as 100% by mass, is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more. The upper limit is not particularly limited, but is, for example, 100% by mass or less.

[0060] Examples of the photo-peelable adhesive resin layer (C) include adhesive resin layers composed of an ultraviolet-expandable adhesive containing an ultraviolet-reactive adhesive resin (C3) and further containing a gas-generating component, an ultraviolet-expandable adhesive containing ultraviolet-expandable microspheres that can expand to reduce adhesive strength, and an ultraviolet-expandable adhesive whose adhesive strength is reduced by a crosslinking reaction of the adhesive component upon ultraviolet irradiation. The light source used here is not particularly limited, but it is preferable to use a light source that can irradiate ultraviolet or visible light with a wavelength of 200 nm to 500 nm. Examples of such light sources include high-pressure mercury lamps, low-pressure mercury lamps, metal halide lamps, and super UV lamps. In the case of ultraviolet crosslinking, for example, a high-pressure mercury lamp is used to irradiate ultraviolet light with a dominant wavelength of 365 nm at an irradiation intensity of 10 to 350 mW / cm in an environment of 0 to 60°C. ２ UV dose 100-20,000 mJ / cm ２ By irradiating the adhesive resin layer (C) under the conditions, the adhesive resin layer (C) in the adhesive film 100 expands, reducing the adhesive strength to the support substrate, and the adhesive film 100 can be peeled off from the support substrate.

[0061] The adhesive resin layer (C) may be a single layer or a multilayer. For example, by laminating two or more layers with different degrees of expansion due to heating to form the adhesive resin layer (C), the adhesiveness and thermal peelability can be changed between one side and the other side of the adhesive resin layer (C). The thickness of the adhesive resin layer (C) is preferably 3 μm or more, more preferably 20 μm or more, from the viewpoint of further improving the performance balance of adhesiveness and thermal peelability, and is preferably 300 μm or less, more preferably 150 μm or less, from the viewpoint of improving the handleability of the adhesive film 100. In addition, the thickness of the adhesive resin layer (C) is preferably 3 μm or more and 300 μm or less, more preferably 20 μm or more and 150 μm or less, from the viewpoint of further improving the performance balance of adhesiveness, thermal peelability, and handleability of the adhesive film 100.

[0062] [Intermediate Layer (D)] The pressure-sensitive adhesive film 100 of this embodiment may further include an intermediate layer (D). The pressure-sensitive adhesive film 100 of this embodiment preferably further includes an intermediate layer (D) in at least one selected from between the substrate layer (A) having an electronic conjugated polymer layer 1 on its surface and the adhesive resin layer (B), and between the substrate layer (A) having an electronic conjugated polymer layer 1 on its surface and the adhesive resin layer (C). More preferably, the pressure-sensitive adhesive film 100 further includes an intermediate layer (D) between the substrate layer (A) having an electronic conjugated polymer layer 1 on its surface and the adhesive resin layer (C). FIG. 3 is a cross-sectional view schematically showing the structure of the pressure-sensitive adhesive film 100 in which the intermediate layer (D) is located between the substrate layer (A) having an electronic conjugated polymer layer 1 on its surface and the adhesive resin layer (C). The intermediate layer (D) can be provided, for example, as an irregularity-absorbing resin layer, an impact-absorbing layer, or the like.

[0063] The intermediate layer (D) preferably contains a thermoplastic resin, more preferably contains one or more types selected from the group consisting of polyolefin-based resins, polystyrene-based resins, (meth)acrylic-based resins, urethane-based resins, silicone-based resins, polyester-based resins, polyamide-based resins, and fluorine-based resins, and even more preferably contains one or more types selected from the group consisting of polyolefin-based resins, polystyrene-based resins, and (meth)acrylic resins.

[0064] The thickness of the intermediate layer (D) is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, even more preferably 20 μm or more, even more preferably 30 μm or more, even more preferably 50 μm or more, and preferably 500 μm or less, more preferably 400 μm or less, even more preferably 300 μm or less, even more preferably 200 μm or less, and even more preferably 150 μm or less, from the viewpoint of being able to improve the unevenness absorbency of the pressure-sensitive adhesive film 100. Furthermore, the thickness of the intermediate layer (D) is preferably 1 μm or more and 500 μm or less, more preferably 5 μm or more and 500 μm or less, even more preferably 10 μm or more and 400 μm or less, even more preferably 20 μm or more and 300 μm or less, even more preferably 30 μm or more and 200 μm or less, and even more preferably 50 μm or more and 150 μm or less, from the viewpoint of being able to improve the unevenness absorbency of the pressure-sensitive adhesive film 100.

[0065] [Method for manufacturing adhesive film] Next, an example of a method for manufacturing the adhesive film 100 of this embodiment will be described. The method for manufacturing the adhesive film 100 of this embodiment includes a step of forming the electronic conjugated polymer layer 1 on the surface of the base layer (A) by polymerizing the monomer while immersing the base layer (A) in a treatment liquid containing the monomer capable of forming the electronic conjugated polymer layer 1.

[0066] The treatment liquid preferably contains a monomer capable of forming the electronic conjugated polymer layer 1 and an oxidative polymerization agent. The monomer capable of forming the electronic conjugated polymer layer 1 is polymerized by contacting with the oxidative polymerization agent in the treatment liquid, and can form the electronic conjugated polymer layer 1 on the surface of the substrate layer (A).

[0067] The monomer capable of forming the electronically conjugated polymer layer 1 refers to, for example, a substance that has a conjugated double bond in its molecular structure and undergoes polymerization by oxidation, and a representative example thereof is a five-membered heterocyclic compound. Specific examples of the five-membered heterocyclic compound include pyrroles such as N-methylpyrrole, thiophenes such as 3-methylthiophene, furans such as 3-methylfuran, indoles such as 3-methylindole, and derivatives thereof.

[0068] Examples of the oxidative polymerization agent include halogens such as chlorine, bromine, and iodine; peroxoacid salts such as peroxodisulfuric acid and potassium peroxodisulfate; and transition metal chlorides such as ferric chloride.

[0069] The treatment liquid may further contain a dopant from the viewpoint of improving the efficiency of forming the electronic conjugated polymer layer 1. Examples of the dopant that can be used include commonly used acceptor dopants. Examples of the acceptor dopants include Lewis acids such as phosphorus pentafluoride; protonic acids such as hydrogen chloride, sulfuric acid, and paratoluenesulfone; and transition metal compounds such as silver perchlorate and silver boron fluoride.

[0070] When the monomer and the oxidative polymerization agent are liquid, they can be used as the treatment solution as is. However, in order to control the formation of an electronically conjugated polymer in the treatment solution, the treatment solution may further contain a solvent. Examples of the solvent include water and commonly used organic solvents. Examples of organic solvents include aliphatic alcohols such as methanol and ethanol; aliphatic ketones such as acetone and methyl ethyl ketone; ethers such as diethyl ether and tetrahydrofuran; halogenated hydrocarbons such as methylene chloride and chloroform; esters such as ethyl acetate and butyl acetate; aliphatic hydrocarbons such as hexane; nitrogen-containing compounds such as acetonitrile and benzonitrile; and mixtures thereof. These solvents may be used alone or in combination, and may be appropriately selected depending on the monomer, oxidative polymerization agent, and materials of the substrate layer (A).

[0071] Specific methods for forming the electronically conjugated polymer layer 1 on the surface of the substrate layer (A) include, for example, the following. First, the oxidative polymerization agent and the dopant are supplied to a treatment tank, and the substrate layer (A) is immersed therein. Next, the monomer is supplied to the treatment tank, and after rapid mixing with a stirrer, the substrate layer (A) is immersed and maintained in the treatment liquid while gently stirring. In this way, the monomer is polymerized while the substrate layer (A) is immersed in the treatment liquid containing the monomer, thereby forming the electronically conjugated polymer layer 1 on the surface of the substrate layer (A).

[0072] The temperature of the treatment solution is preferably −10° C. or higher, more preferably −5° C. or higher, and preferably 30° C. or lower, more preferably 20° C. or lower, even more preferably 10° C. or lower, and even more preferably 5° C. or lower, from the viewpoint of improving the efficiency of forming the electronic conjugated polymer layer 1. The treatment time for which the substrate layer (A) is immersed and held is preferably 1 minute or longer, more preferably 3 minutes or longer, even more preferably 5 minutes or longer, from the viewpoint of improving the efficiency of forming the electronic conjugated polymer layer 1, and is preferably 1 hour or shorter, more preferably 45 minutes or shorter, and even more preferably 30 minutes or shorter.

[0073] The pressure-sensitive adhesive film 100 of this embodiment can be formed, for example, by a method of providing an adhesive resin layer (B) and an adhesive resin layer (C) on a base layer (A) provided with an electronic conjugated polymer layer 1, or by a method of transferring the adhesive resin layer (B) and the adhesive resin layer (C) formed on a separator onto a base layer (A) provided with an electronic conjugated polymer layer 1. The pressure-sensitive adhesive film 100 of this embodiment may also be formed by laminating the adhesive resin layer (B), the base layer (A) provided with the electronic conjugated polymer layer 1, and the adhesive resin layer (C) in this order. When the adhesive film 100 of the present embodiment includes the intermediate layer (D), it can be formed, for example, by a method in which the base material layer (A) to which the electronic conjugated polymer layer 1 has been provided and the intermediate layer (D) are laminated together, and then the adhesive resin layer (B) and the adhesive resin layer (C) are respectively provided thereon; or a method in which the base material layer (A) to which the electronic conjugated polymer layer 1 has been provided and the intermediate layer (D) are laminated together, and then the adhesive resin layer (B) and the adhesive resin layer (C) formed on a separator are transferred onto the base material layer (A) to which the electronic conjugated polymer layer 1 has been provided and the intermediate layer (D), respectively.

[0074] An example of a method for applying the adhesive resin layer (B) and the adhesive resin layer (C) to the base layer (A) to which the electronic conjugated polymer layer 1 has been applied is a method of applying an adhesive coating liquid capable of forming the adhesive resin layer (B) and the adhesive resin layer (C). Conventional coating methods, such as roll coating, reverse roll coating, gravure roll coating, bar coating, comma coating, and die coating, can be used to apply the adhesive coating liquid. While there are no particular limitations on the drying conditions for the adhesive coating liquid, drying at a temperature range of 80 to 200°C for 10 seconds to 10 minutes is generally preferred. Drying at 80 to 170°C for 15 seconds to 5 minutes is more preferred. In order to sufficiently promote the crosslinking reaction between the crosslinker and the adhesive resin, the adhesive coating liquid may be heated at 40 to 80°C for approximately 5 to 300 hours after drying.

[0075] [Method for manufacturing an electronic device] The method for manufacturing an electronic device of this embodiment will be described with reference to the drawings. Fig. 4 is a cross-sectional view schematically showing the method for manufacturing an electronic device of this embodiment according to the present invention. The method for manufacturing an electronic device of this embodiment includes the steps of preparing a structure 200 including an adhesive film 100, an electronic component 70 attached to the adhesive resin layer (B) of the adhesive film 100, and a support substrate 80 attached to the adhesive resin layer (C) of the adhesive film 100, and sealing the electronic component 70 with a sealant 90.

[0076] From the viewpoint of further suppressing misalignment of the electronic component 70, the support substrate 80 preferably includes at least one type selected from the group consisting of a stainless steel substrate and a glass substrate.

[0077] Examples of the electronic component 70 include semiconductor chips such as ICs, LSIs, discrete devices, light-emitting diodes, and light-receiving elements, as well as semiconductor panels and semiconductor packages. The surface of the electronic component 70 has an uneven structure due to the presence of electrodes. Furthermore, when mounting an electronic device on a mounting surface, the electrodes are bonded to the electrodes formed on the mounting surface to form an electrical connection between the electronic device and the mounting surface (such as a printed circuit board). Examples of the electrodes include bump electrodes such as ball bumps, printed bumps, stud bumps, plated bumps, and pillar bumps. That is, the electrodes are, for example, convex electrodes. These bump electrodes may be used alone or in combination of two or more. The metal species constituting the bump electrodes are not particularly limited, and examples include silver, gold, copper, tin, lead, bismuth, and alloys thereof. These metal species may be used alone or in combination of two or more.

[0078] In the process of sealing the electronic components 70 with the sealing material 90, the electronic components 70 may be sealed together with the sealing material 90, or may be sealed individually. As a method for individually covering the electronic components 70 with the sealing material 90, it is preferable to use one or more methods selected from the group consisting of a 3D printer method, a spray method, a screen printing method, and an inkjet method, and it is more preferable to use a 3D printer method. By using the above method to individually cover the electronic components 70 with the sealing material 90, it is possible to suppress misalignment of the electronic components 70 in the process of sealing the electronic components 70 with the sealing material 90.

[0079] As the sealing material 90, any known sealing material with high insulating properties can be used, but the sealing material 90 preferably includes an epoxy resin-based sealing material, which improves the affinity of the sealing material 90 to the adhesive film 100 and enables more uniform sealing of the electronic component 70. Examples of such epoxy resin-based sealing materials that can be used include the T693 / R4000 series, T693 / R1000 series, and T693 / R5000 series manufactured by Nagase ChemteX Corporation. The sealing material 90 may be solid or liquid, but is preferably liquid, from the viewpoints that the sealing process can be performed at low temperature and low pressure and that displacement of the electronic component 70 during the sealing process can be further suppressed.

[0080] From the viewpoint of further suppressing misalignment of the electronic component 70, the thickness of the sealing material 90 after covering the electronic component 70 is preferably 1.0 μm or more, more preferably 1.5 μm or more, even more preferably 5.0 μm or more, even more preferably 10.0 μm or more, even more preferably 30.0 μm or more, even more preferably 50.0 μm or more, even more preferably 100.0 μm or more, even more preferably 200.0 μm or more, even more preferably 300.0 μm or more, and is preferably 2000.0 μm or less, more preferably 1500.0 μm or less, even more preferably 1000.0 μm or less, even more preferably 500.0 μm or less. Furthermore, from the viewpoint of further suppressing misalignment of the electronic component 70, the thickness of the sealing material 90 after covering the electronic component 70 is preferably 1.0 μm or more and 2000.0 μm or less, more preferably 1.5 μm or more and 2000.0 μm or less, even more preferably 5.0 μm or more and 2000.0 μm or less, even more preferably 10.0 μm or more and 2000.0 μm or less, even more preferably 30.0 μm or more and 2000.0 μm or less, even more preferably 50.0 μm or more and 2000.0 μm or less, even more preferably 100.0 μm or more and 1500.0 μm or less, even more preferably 200.0 μm or more and 1000.0 μm or less, and even more preferably 300.0 μm or more and 500.0 μm or less.

[0081] The sealing temperature in the step of sealing the electronic component 70 with the sealing material 90 is preferably 10° C. or higher, more preferably 15° C. or higher, and even more preferably 20° C. or higher, from the viewpoint of further improving the work efficiency of the step of sealing the electronic component 70 with the sealing material 90. Furthermore, the sealing temperature in the step of sealing the electronic component 70 with the sealing material 90 is preferably 45° C. or lower, more preferably 40° C. or lower, even more preferably 35° C. or lower, and even more preferably 30° C. or lower, from the viewpoint of further suppressing misalignment of the electronic component 70. Furthermore, the sealing temperature in the step of sealing the electronic component 70 with the sealing material 90 is preferably 10° C. or higher and 45° C. or lower, more preferably 10° C. or higher and 40° C. or lower, even more preferably 15° C. or higher and 35° C. or lower, and even more preferably 20° C. or higher and 30° C. or lower, from the viewpoint of further improving the work efficiency of the step of sealing the electronic component 70 with the sealing material 90 and further suppressing misalignment of the electronic component 70. Note that the sealing temperature in this embodiment refers to the set temperature of the device used to seal the electronic component 70.

[0082] The sealing pressure in the step of sealing the electronic component 70 with the sealing material 90 is preferably 30 kPa or more, more preferably 50 kPa or more, even more preferably 70 kPa or more, and even more preferably 90 kPa or more, from the viewpoint of improving the reliability of the electronic device, and is preferably 150 kPa or less, more preferably 130 kPa or less, and even more preferably 110 kPa or less, from the viewpoint of further suppressing misalignment of the electronic component 70. Furthermore, the sealing pressure in the step of sealing the electronic component 70 with the sealing material 90 is preferably 30 kPa or more and 150 kPa or less, more preferably 50 kPa or more and 150 kPa or less, even more preferably 70 kPa or more and 130 kPa or less, and even more preferably 90 kPa or more and 110 kPa or less, from the viewpoint of improving the reliability of the electronic device and further suppressing misalignment of the electronic component 70. Furthermore, it is more preferable that the sealing pressure in the step of sealing the electronic component 70 with the sealing material 90 is normal pressure. The sealing pressure in this embodiment refers to the set pressure in the device used to seal the electronic component 70 .

[0083] The method for manufacturing an electronic device according to this embodiment preferably further includes a step of curing the encapsulant 90. This fixes the electronic component 70 and further suppresses misalignment of the electronic component 70. Examples of a method for curing the encapsulant 90 include treating the encapsulant 90 with one or two methods selected from the group consisting of light irradiation and heat treatment. From the viewpoint of further suppressing misalignment of the electronic component 70, the method of curing the encapsulant 90 by light irradiation is preferred.

[0084] The method of curing the encapsulant 90 by light irradiation is preferably a method of curing the encapsulant 90 by crosslinking it through irradiation with light such as ultraviolet light. The light source used in this method is preferably a light source capable of emitting ultraviolet light containing wavelength components capable of exciting a photoinitiator, and more preferably a light source capable of emitting ultraviolet light containing components with wavelengths of less than 300 nm. The method of curing the encapsulant 90 by heat treatment is preferably a method of curing the encapsulant 90 by thermal crosslinking using an oven, thermal crosslinking using a hot plate, or thermal crosslinking using infrared radiation. In the case of thermal crosslinking, the heating temperature is, for example, 100°C to 180°C, and the heating time is, for example, 10 to 180 minutes. The heating temperature is preferably a temperature that does not exceed the temperature at which gas contained in the pressure-sensitive adhesive film 100 generates or the temperature at which the heat-expandable microspheres thermally expand.

[0085] The method for manufacturing an electronic device according to the present embodiment preferably further includes a step of applying an external stimulus to reduce the adhesive strength of the adhesive resin layer (C) and peeling the support substrate 80 from the structure 200. After sealing the electronic component 70, the support substrate 80 can be easily removed from the adhesive film 100, for example, by heating the support substrate 80 to a temperature exceeding 100°C to reduce the adhesive strength of the adhesive resin layer (C). The step of applying an external stimulus to reduce the adhesive strength of the adhesive resin layer (C) and peeling the support substrate 80 from the structure 200 is preferably performed after the step of sealing the electronic component 70 with the sealant 90, and more preferably after the step of curing the sealant 90.

[0086] The method for manufacturing an electronic device according to the present embodiment preferably further includes a step of peeling the adhesive film 100 from the plurality of electronic components 70. This step results in an electronic device. Examples of methods for peeling the adhesive film 100 from the electronic components 70 include a mechanical peeling method and a method of peeling the adhesive film 100 after reducing the adhesive strength of the surface of the adhesive film 100. The step of peeling the adhesive film 100 from the plurality of electronic components 70 is preferably performed after a step of sealing the electronic components 70 with a sealing material 90, more preferably after a step of curing the sealing material 90, and even more preferably after a step of applying an external stimulus to reduce the adhesive strength of the adhesive resin layer (C) and peeling the support substrate 80 from the structure 200.

[0087] The adhesive film 100 of this embodiment can be preferably used to manufacture an electronic device including a fan-out package. That is, the electronic device obtained by the manufacturing method of the electronic device of this embodiment includes a fan-out package. In a fan-out package, terminals can be spread to the outside of the chip (fan out), so it can be used in applications where the number of terminals is large compared to the chip area. In addition, since a package substrate is not required, it can also be made thinner.

[0088] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted.

[0089] The present invention is not limited to the above-described embodiment, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0090] The present invention will be specifically described below with reference to examples, but the present invention is not limited thereto. Details of the method for producing an adhesive film are as follows.

[0091] <Synthesis of Pressure-Sensitive Adhesive Raw Materials> (Meth)acrylic Resin Emulsion 1: Using 0.5 parts by mass of ammonium persulfate as a polymerization initiator, 63 parts by mass of 2-ethylhexyl acrylate, 21 parts by mass of n-butyl acrylate, 9 parts by mass of methyl methacrylate, 3 parts by mass of 2-hydroxyethyl methacrylate, 2 parts by mass of methacrylic acid, 1 part by mass of acrylamide, 1 part by mass of polytetramethylene glycol diacrylate (manufactured by NOF Corporation, product name: Blemmer ADT-250), and 2 parts by mass of an aqueous solution of polyoxyethylene nonylpropenyl phenyl ether ammonium sulfate (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., product name: Aqualon HS-1025) were emulsion-polymerized in deionized water at 70°C for 8 hours. After polymerization was completed, the pH was adjusted to 7 with aqueous ammonia. In this way, (meth)acrylic resin emulsion 1 with a solids concentration of 56.5% was obtained.

[0092] (Meth)acrylic resin emulsion 2: Using 0.5 parts by mass of 4,4'-azobis-4-cyanovaleric acid (manufactured by Otsuka Chemical Co., Ltd., product name: ACVA) as a polymerization initiator, 74 parts by mass of butyl acrylate, 14 parts by mass of methyl methacrylate, 9 parts by mass of 2-hydroxyethyl methacrylate, 2 parts by mass of methacrylic acid, 1 part by mass of acrylamide, and 3 parts by mass of an aqueous solution of polyoxyethylene nonylpropenylphenyl ether ammonium sulfate (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., product name: Aqualon HS-1025) were emulsion-polymerized in deionized water at 70°C for 8 hours. After completion of polymerization, the pH was adjusted to 7 with aqueous ammonia. As a result, (meth)acrylic resin emulsion 2 with a solids concentration of 42.5% was obtained.

[0093] (Meth)acrylic resin solution: 49 parts by mass of ethyl acrylate, 20 parts by mass of 2-ethylhexyl acrylate, 21 parts by mass of methyl acrylate, 10 parts by mass of glycidyl methacrylate, and 0.5 parts by mass (solids content equivalent) of a benzoyl peroxide polymerization initiator were reacted in 65 parts by mass of toluene and 50 parts by mass of ethyl acetate at 80°C for 10 hours. After completion of the reaction, the resulting solution was cooled, and to the cooled solution were added 25 parts by mass of xylene, 5 parts by mass of acrylic acid, and 0.5 parts by mass of tetradecyldimethylbenzylammonium chloride, followed by reaction at 85°C for 32 hours while blowing in air. In this way, a (meth)acrylic resin solution was obtained.

[0094] <Formulation of adhesive coating liquid> Adhesive coating liquid B1 for forming adhesive resin layer (B): 42.6 parts by mass of (meth)acrylic resin emulsion 1, 57.4 parts by mass of (meth)acrylic resin emulsion 2, 0.4 parts by mass of dimethylethanolamine, 1.45 parts by mass of an epoxy compound (manufactured by Nagase ChemteX Corporation, product name: EX-1610) as a crosslinking agent, 13 parts by mass of diethylene glycol monobutyl ether, and H ２ 20 parts by mass of PEG-1000 was mixed with PEG-1000 to prepare a pressure-sensitive adhesive coating solution B1.

[0095] Adhesive coating solution B2 for forming adhesive resin layer (B): 42.6 parts by mass of (meth)acrylic resin emulsion 1, 57.4 parts by mass of (meth)acrylic resin emulsion 2, 0.4 parts by mass of dimethylethanolamine, 1.10 parts by mass of an epoxy compound (manufactured by Nagase ChemteX Corporation, product name: EX-1610) as a crosslinking agent, 13 parts by mass of diethylene glycol monobutyl ether, and H ２ 20 parts by mass of O were mixed to prepare a pressure-sensitive adhesive coating solution B2.

[0096] Adhesive coating liquid C1 for forming adhesive resin layer (C): 100 parts by mass of a (meth)acrylic resin solution (solid content concentration 45%), 2.4 parts by mass of a rosin resin (manufactured by Arakawa Chemical Industries, Ltd., product name: Pencel D-125) (5.3 parts by mass per 100 parts by mass of adhesive resin, converted into solid content), 1.3 parts by mass of an isocyanate crosslinking agent (manufactured by Mitsui Chemicals, Inc., product name: Olester P49-75S) (2.9 parts by mass per 100 parts by mass of adhesive resin, converted into solid content), and 7.1 parts by mass of heat-expandable microspheres (manufactured by Sekisui Chemical Co., Ltd., product name: Advancell EM-503) (15.8 parts by mass per 100 parts by mass of adhesive resin, converted into solid content), were mixed, and 37 parts by mass of toluene and 37 parts by mass of ethyl acetate were added to prepare adhesive coating liquid C1.

[0097] [Example 1] <Preparation of Adhesive Film> 500 mL of a 0.1 mol / L aqueous potassium peroxodisulfate solution was placed in a 1 L glass beaker, and a polyethylene terephthalate film (manufactured by Toray Industries, Inc., product name: 38S10, thickness: 38 μm, double-sided corona-treated) serving as the substrate layer (A) was immersed therein. Next, 100 mL of a 0.2 mol / L aqueous pyrrole solution was added to the beaker, and the mixture was stirred with a magnetic stirrer while maintaining the temperature at 2-3°C. The substrate layer was then removed from the beaker, washed with distilled water, and dried at 60°C for 1 hour to obtain a substrate layer having a 0.1 μm-thick electronic conjugated polymer layer on its surface. Next, the adhesive coating liquid B1 was applied to a silicone-treated separator and dried at 120°C for 3 minutes to form a resin film. This resin film was then attached to the first surface of the substrate layer (A) having an electronic conjugated polymer layer on its surface, forming a 7 μm-thick adhesive resin layer (B). Furthermore, the adhesive coating liquid C1 was applied to a separator and dried at 120°C for 3 minutes to form a resin film. This resin film was laminated on the second surface of a substrate layer (A) having an electronic conjugated polymer layer on the surface. As a result, an adhesive resin layer (C) with a thickness of 47 μm was obtained. As a result, an adhesive film was obtained, which included a substrate layer (A), an adhesive resin layer (B) for temporarily fixing electronic components on the first surface side of the substrate layer (A), an adhesive resin layer (C) on the second surface side of the substrate layer (A), an electronic conjugated polymer layer between the substrate layer (A) and the adhesive resin layer (B), and an electronic conjugated polymer layer between the substrate layer (A) and the adhesive resin layer (C).

[0098] Example 2 An adhesive film was obtained in the same manner as in Example 1, except that adhesive coating liquid B2 was used instead of adhesive coating liquid B1.

[0099] [Comparative Example 1] A pressure-sensitive adhesive film was obtained in the same manner as in Example 1, except that a polyethylene terephthalate film (manufactured by Toray Industries, Inc., product name: 38S10, thickness: 38 μm, both sides untreated with corona) was used as the base layer (A) and an electronic conjugated polymer layer was not formed on the surface of the base layer (A).

[0100] Comparative Example 2 An adhesive film was obtained in the same manner as in Example 1, except that the electronic conjugated polymer layer was not formed.

[0101] Comparative Example 3 An adhesive film was obtained in the same manner as in Example 2, except that the electronic conjugated polymer layer was not formed.

[0102] <Evaluation> [Adhesive Residue] The adhesive resin layer (C) side of the adhesive film obtained in each Example and Comparative Example was adhered to a stainless steel plate (φ320 mm, thickness 2.0 mm) for compression molding. Next, 500 1.5 mm x 1.5 mm patterned silicon chips were placed on the adhesive resin layer (B) of the adhesive film as electronic components and adhered to obtain a structure. The structure was then heated at 150 ° C for 1 hour. Next, using a compression molding machine, the silicon chips on the adhesive resin layer (B) were encapsulated by compression molding (125 ° C, 500 seconds) using a liquid epoxy resin-based encapsulant (manufactured by Nagase ChemteX Corporation, product name: R4212-2C). This resulted in a structure in which an encapsulating resin wafer (φ300 mm, thickness 550 μm) was formed on the stainless steel plate. The resulting structure was subjected to post-mold curing at 150 ° C for 1 hour. Thereafter, the adhesive film was peeled off from the stainless steel plate by heating at 195°C for 60 seconds. Furthermore, the adhesive film was peeled off from the encapsulating resin wafer by heating at 150°C for 60 seconds. The obtained encapsulating resin wafer was observed for adhesive residue on the peeled surface (the surface to which the adhesive film had been adhered) of the encapsulating resin wafer using a shape analysis laser microscope (manufactured by KEYENCE Corporation, product name: VK-X1000), and evaluated according to the following criteria. A: No adhesive residue was observed on the peeled surface of the encapsulating resin wafer. B: Adhesive residue was observed in the range of more than 0% to 50% of the peeled surface of the encapsulating resin wafer. C: Adhesive residue was observed in the range of more than 50% to 75% of the peeled surface of the encapsulating resin wafer. D: Adhesive residue was observed in the range of more than 75% to 100% of the peeled surface of the encapsulating resin wafer. E: When the adhesive film was peeled off from the encapsulating resin wafer, only the base layer peeled off.

[0103]

[0104] It was confirmed that the adhesive film 100 of this embodiment, which includes an electronic conjugated polymer layer, can suppress adhesive residue on electronic components.

[0105] This application claims priority based on Japanese Patent Application No. 2023-197553, filed November 21, 2023, the disclosure of which is incorporated herein by reference in its entirety.

[0106] A: Base layer (A) B: Adhesive resin layer (B) C: Adhesive resin layer (C) D: Intermediate layer (D) A1: First surface of base layer (A) A2: Second surface of base layer (A) 1: Electronic conjugated polymer layer 70: Electronic component 80: Support substrate 90: Sealant 100: Adhesive film 200: Structure

Claims

1. Substrate layer (A), On the first surface side of the base material layer (A), there is an adhesive resin layer (B) for temporarily fixing electronic components, A tacky resin layer (C) is provided on the second surface side of the base material layer (A), An electron-conjugated polymer layer is placed between the substrate layer (A) and the adhesive resin layer (B), An adhesive film containing [a specific substance].

2. The adhesive film according to claim 1, wherein the electron-conjugated polymer contained in the electron-conjugated polymer layer comprises one or more selected from the group consisting of polyacetylene, polyacene, poly(p-phenylene), poly(p-phenylene vinylene), polypyrrole, polyaniline, polythiophene, and derivatives thereof.

3. The adhesive film according to claim 1 or 2, wherein the electron-conjugated polymer contained in the electron-conjugated polymer layer comprises one or more selected from the group consisting of polypyrrole, polythiophene, and derivatives thereof.

4. The adhesive film according to claim 1 or 2, wherein the thickness of the electron-conjugated polymer layer is 0.01 μm or more and 10 μm or less.

5. The adhesive film according to claim 1 or 2, wherein the content of the electron-conjugated polymer in the electron-conjugated polymer layer is 95% by mass or more when the total mass of the electron-conjugated polymer layer is taken as 100% by mass.

6. The adhesive film according to claim 1 or 2, wherein the content of the binder resin in the electron-conjugated polymer layer is 1.0% by mass or less when the total mass of the electron-conjugated polymer layer is 100% by mass.

7. The adhesive film according to claim 1 or 2, further comprising the electron-conjugated polymer layer between the substrate layer (A) and the adhesive resin layer (C).

8. The adhesive film according to claim 1 or 2, wherein the adhesive resin layer (B) comprises one or more selected from the group consisting of (meth)acrylic adhesive resin, silicone adhesive resin, urethane adhesive resin, olefin adhesive resin, and styrene adhesive resin.

9. The adhesive film according to claim 1 or 2, wherein the adhesive resin layer (C) is a layer whose adhesive strength decreases due to external stimuli.

10. The adhesive film according to claim 1 or 2, wherein the adhesive resin layer (C) comprises one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins.

11. The adhesive film according to claim 1 or 2, wherein the base material layer (A) comprises one or more selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, and polyimide.

12. An adhesive film according to claim 1 or 2, which can be used to temporarily fix an electronic component when sealing the electronic component with an sealing material.

13. A method for producing an adhesive film according to claim 1 or 2, A method for producing an adhesive film, comprising the step of forming the electron-conjugated polymer layer on the surface of the substrate layer (A) by polymerizing the monomer while immersing the substrate layer (A) in a processing solution containing monomers capable of forming the electron-conjugated polymer layer.

14. A step of preparing a structure comprising: an adhesive film according to claim 1 or 2; an electronic component attached to the adhesive resin layer (B) of the adhesive film; and a support substrate attached to the adhesive resin layer (C) of the adhesive film; A step of sealing the electronic component with a sealing material, A method for manufacturing electronic devices, including

15. The method for manufacturing an electronic device according to claim 14, further comprising the step of reducing the adhesive strength of the adhesive resin layer (C) by applying an external stimulus and peeling the support substrate from the structure.

16. A method for manufacturing an electronic device according to claim 14, further comprising the step of peeling the adhesive film from the electronic component.

17. The method for manufacturing an electronic device according to claim 14, wherein the sealing material includes an epoxy resin-based sealing material.

18. The method for manufacturing an electronic device according to claim 14, wherein the electronic device includes a fan-out type package.