Bonding system and bonding method

Abstract

This bonding system comprises: a delivery module that delivers a component carrier which holds a plurality of components and a substrate to which the plurality of components are to be bonded; a relay module that is for placement of the component carrier and the substrate which are received from the delivery module; a conveyance module that conveys, along a first direction, the component carrier and the substrate which have been placed on the relay module; a surface treatment module that performs a surface treatment with respect to the plurality of components which are held by the component carrier and a surface treatment with respect to the substrate; and a bonding device that individually bonds the surface-treated plurality of components to the surface-treated substrate, wherein the conveyance module conveys the component carrier and the substrate between the surface treatment module and the bonding device.

Description

Bonding system and bonding method

[0001] The present disclosure relates to a bonding system and method for individually bonding multiple components held in a component carrier to a substrate.

[0002] 2. Description of the Related Art With the increasing integration density of semiconductor devices, techniques for stacking semiconductor devices three-dimensionally have been proposed. For example, a bonding system for bonding semiconductor wafers together has been proposed (see Patent Document 1).

[0003] Patent No. 7012798

[0004] It is not limited to bonding semiconductor wafers together as in Patent Document 1. For example, it is possible to build a bonding system that individually bonds multiple components held in component carriers (e.g., tape frames) to the substrate of a semiconductor wafer. In this case, in order to automatically transport two different types of objects, the component carrier and the substrate, it is necessary to design the transport devices to avoid interference between each other, which may result in a decrease in processing efficiency.

[0005] An object of the present disclosure is to provide a bonding system and bonding method with high processing efficiency.

[0006] The bonding system of the present disclosure comprises an input module that inputs a component carrier that holds multiple components and a substrate for bonding the multiple components to the component carrier; a relay module that places the component carrier and the substrate received from the input module; a transport module that transports the component carrier and the substrate placed on the relay module along a first direction; a surface treatment module that performs surface treatment on the multiple components held by the component carrier and surface treatment on the substrate; and a bonding device that individually bonds the multiple surface-treated components to the surface-treated substrate, and the transport module transports the component carrier and the substrate between the surface treatment module and the bonding device.

[0007] The bonding method disclosed herein includes the steps of using an input module to load a component carrier holding multiple components and a substrate for bonding the multiple components; using a relay module to place the component carrier and the substrate received from the input module; using a transport module to transport the component carrier and the substrate placed on the relay module along a first direction; using a surface treatment module to perform surface treatment on the multiple components held by the component carrier and surface treatment on the substrate; and using a bonding device to individually bond the multiple surface-treated components to the surface-treated substrate, wherein the transport module is one that transports the component carrier and the substrate between the surface treatment module and the bonding device.

[0008] According to the present disclosure, it is possible to provide a bonding system and a bonding method with high processing efficiency.

[0009]

[0010] (Regarding Aspects of the Present Disclosure) According to a first aspect of the present disclosure, there is provided a bonding system comprising: a plurality of surface treatment modules that perform surface treatment on a plurality of components held in a component carrier and a surface treatment on a substrate for bonding the plurality of components; a bonding device that individually bonds the plurality of surface-treated components to the surface-treated substrate; and a transfer module that transports the component carrier and the substrate between the surface treatment modules and the bonding device, wherein the transfer module comprises a transfer robot having a first hand that holds the substrate and a second hand that holds the component carrier, and a robot moving table that moves the transfer robot along a first direction.

[0011] According to a second aspect of the present disclosure, there is provided a bonding system as described in the first aspect, wherein at least one of the surface treatment modules and the bonding device are arranged on opposite sides of the movement path of the transport robot along the first direction.

[0012] According to a third aspect of the present disclosure, there is provided the bonding system according to the first or second aspect, wherein the surface treatment module performs surface treatment using any one of ultraviolet light, plasma, and liquid.

[0013] According to a fourth aspect of the present disclosure, there is provided a bonding system described in any one of the first to third aspects, wherein the component carrier is a tape frame having an ultraviolet-curing adhesive sheet, and at least one of the surface treatment modules has an ultraviolet irradiation device that irradiates ultraviolet rays.

[0014] According to a fifth aspect of the present disclosure, there is provided a bonding system described in any one of the first to fourth aspects, wherein the bonding apparatus has a first bonding module into which the substrate is loaded and a second bonding module into which the component carrier is transported, and the first bonding module and the second bonding module are arranged in the first direction.

[0015] According to a sixth aspect of the present disclosure, there is provided a bonding system described in any one of the first to fifth aspects, further comprising a partition wall separating the transport module and the bonding device from each other, the partition wall having an opening for transferring the component carrier and the substrate held by the transport module to the bonding device.

[0016] According to a seventh aspect of the present disclosure, there is provided the bonding system according to the sixth aspect, wherein the opening has a first opening through which the substrate passes and a second opening through which the component carrier passes.

[0017] According to an eighth aspect of the present disclosure, there is provided a bonding system described in any one of the first to seventh aspects, wherein the first hand and the second hand are arranged offset from each other vertically and each is movable back and forth.

[0018] According to a ninth aspect of the present disclosure, there is provided the bonding system according to the eighth aspect, wherein the first hand is disposed above the second hand.

[0019] According to a tenth aspect of the present disclosure, there is provided the bonding system according to any one of the first to ninth aspects, wherein the substrate is a wafer and the component carrier is a tape frame.

[0020] According to an eleventh aspect of the present disclosure, there is provided a bonding method including the steps of: performing surface treatment on a plurality of components held in a component carrier; performing surface treatment on a substrate to which the plurality of components are to be bonded; transporting the surface-treated substrate to a bonding device with a first hand; transporting the surface-treated component carrier to the bonding device with a second hand; using the bonding device to individually bond the plurality of surface-treated components to the surface-treated substrate; removing the substrate to which the plurality of components have been bonded from the bonding device with the first hand; and removing the component carrier from which the plurality of components have been removed from the bonding device with the second hand.

[0021] (Regarding another aspect of the present disclosure) According to a first aspect of the present disclosure, there is provided a bonding system comprising: an input module that inputs a component carrier that holds a plurality of components and a substrate for bonding the plurality of components; a relay module that places the component carrier and the substrate received from the input module; a transport module that transports the component carrier and the substrate placed on the relay module along a first direction; a surface treatment module that performs surface treatment on the plurality of components held by the component carrier and surface treatment on the substrate; and a bonding device that individually bonds the plurality of surface-treated components to the surface-treated substrate, wherein the transport module transports the component carrier and the substrate between the surface treatment module and the bonding device.

[0022] According to a second aspect of the present disclosure, there is provided a bonding system as described in the first aspect, wherein the relay module has a first temporary placement stage on which the substrate is placed and a second temporary placement stage on which the component carrier is placed.

[0023] According to a third aspect of the present disclosure, there is provided a bonding system as described in the second aspect, wherein the first temporary placement stage has a first shelf on which the substrate received from the loading module is placed before use, and a second shelf on which the used substrate with the multiple components bonded thereto is placed, and the second temporary placement stage has a third shelf on which the component carrier received from the loading module is placed before use, and a fourth shelf on which the used component carrier from which the multiple components have been removed is placed.

[0024] According to a fourth aspect of the present disclosure, there is provided the bonding system according to the third aspect, wherein the first shelf is located below the second shelf, and the third shelf is located below the fourth shelf.

[0025] According to a fifth aspect of the present disclosure, there is provided a bonding system described in any one of the second to fourth aspects, wherein the first temporary placement stage is configured to transfer the substrate to the transport module in a first transfer direction in a planar view, and the second temporary placement stage is configured to transfer the component carrier to the transport module in a second transfer direction in a planar view.

[0026] According to a sixth aspect of the present disclosure, there is provided a bonding system as described in the fifth aspect, in which the first temporary placement stage and the second temporary placement stage are arranged in a second direction that intersects the first direction in a planar view, and the first transfer direction and the second transfer direction each intersect with the first direction.

[0027] According to a seventh aspect of the present disclosure, there is provided a bonding system described in any one of the second to sixth aspects, wherein the relay module further has a positioning stage for receiving the component carrier and the substrate from the transport module and positioning them in a predetermined transfer direction.

[0028] According to an eighth aspect of the present disclosure, there is provided a bonding system as described in the seventh aspect, wherein the positioning stage has a first positioning stage for positioning the substrate and a second positioning stage for positioning the component carrier.

[0029] According to a ninth aspect of the present disclosure, there is provided the bonding system according to the seventh or eighth aspect, wherein the positioning stage is positioned below the first temporary placement stage and the second temporary placement stage.

[0030] According to a tenth aspect of the present disclosure, there is provided a bonding system described in any one of the first to ninth aspects, wherein the loading module includes a first transport robot having a first hand that holds the substrate and a second hand that holds the component carrier, and a first robot moving table that moves the first transport robot in a second direction that intersects the first direction in a planar view.

[0031] According to an eleventh aspect of the present disclosure, there is provided a bonding system described in any one of the first to tenth aspects, wherein the transport module comprises a second transport robot having a third hand that holds the substrate and a fourth hand that holds the component carrier, and a second robot moving table that moves the second transport robot in the first direction.

[0032] According to a twelfth aspect of the present disclosure, there is provided a bonding system as described in the eleventh aspect, wherein at least one of the surface treatment modules and the bonding device are arranged on opposite sides of the movement path of the transport module along the first direction.

[0033] According to a thirteenth aspect of the present disclosure, there is provided the bonding system according to any one of the first to twelfth aspects, wherein the substrate is a wafer and the component carrier is a tape frame.

[0034] According to a fourteenth aspect of the present disclosure, there is provided a bonding method including the steps of: using an input module to load a component carrier holding a plurality of components and a substrate for bonding the plurality of components; using a relay module to place the component carrier and the substrate received from the input module; using a transport module to transport the component carrier and the substrate placed on the relay module along a first direction; using a surface treatment module to perform surface treatment on the plurality of components held by the component carrier and on the substrate; and using a bonding device to individually bond the plurality of surface-treated components to the surface-treated substrate, wherein the transport module is one that transports the component carrier and the substrate between the surface treatment module and the bonding device.

[0035]

[0023] (Embodiments) Exemplary embodiments of a bonding system and a bonding method according to the present disclosure will be described below with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are also included in the present disclosure.

[0036] First, a bonding system 2 and a bonding method according to an embodiment of the present disclosure will be described with reference to Fig. 1A, which is a schematic plan view showing a simplified bonding system 2.

[0037] 1A is a system for individually bonding multiple components (not shown) held in a component carrier C to a substrate W. In this embodiment, the components are chip components, the component carrier C is a tape frame with an adhesive sheet that adhesively holds the multiple components, and the substrate W is a semiconductor wafer. The tape frame may also be called, for example, a dicing frame or a wafer ring.

[0038] The bonding system 2 includes a load port 3, a carry-in module 4, a relay module 6, a transfer module 8, a plurality of surface treatment modules 10, 12, 14, and 16, a bonding device 18, and a control unit 19. In Fig. 1A, mutually orthogonal horizontal directions are defined as the X-axis direction and the Y-axis direction, and a vertical direction orthogonal to both the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

[0039] The bonding system 2 shown in FIG. 1A is installed in a clean room, and a downflow flows inside the bonding system 2.

[0040] The load port 3 is a member for supplying substrates W and component carriers C to the load module 4. The load port 3 is equipped with a sealed container 20 that houses a plurality of substrates W, and a sealed container 22 that houses a plurality of component carriers C. Fig. 1A illustrates a state in which the sealed container 20 houses the substrates W, and the sealed container 22 houses the component carriers C. In the example shown in Fig. 1A, the sealed container 20 and the sealed container 22 are aligned in the Y-axis direction, and are connected to the load module 4 in the X-axis direction.

[0041] The carry-in module 4 is a module for carrying the substrate W and component carrier C supplied from the load port 3 into the bonding system 2. The carry-in module 4 removes the substrate W from the sealed container 20 mounted on the load port 3, and removes the component carrier C from the sealed container 22. The carry-in module 4 may also be referred to as an EFEM (Equipment Front End Module).

[0042] The loading module 4 includes a transport robot 24 and a robot moving table 26 .

[0043] The transport robot 24 is a robot for transporting the substrates W and component carriers C supplied from the load port 3. The transport robot 24 has arms for holding the substrates W and component carriers C, respectively, and is moved by a robot moving table 26.

[0044] The robot transfer table 26 is a drive table for moving the transfer robot 24. In this embodiment, the robot transfer table 26 has a function of linearly moving the transfer robot 24 in the Y direction (see arrow Y1), a function of horizontally rotating the transfer robot 24 (see arrow R1), and a function of raising and lowering the transfer robot 24 in the Z axis direction. Note that the functions of horizontally rotating and raising and lowering the transfer robot 24 may be performed by a turning mechanism or an elevating mechanism provided in the transfer robot 24.

[0045] The transport robot 24 moves in the Y-axis direction so as to be able to access each of the sealed containers 20 and 22 arranged in the Y-axis direction, and takes out the substrate W from the sealed container 20 and the component carrier C from the sealed container 22.

[0046] Next, the detailed configuration of the loading module 4 will be described with reference to FIGS.

[0047] 2 to 4 are schematic plan views showing different states of the transfer robot 24 in the load module 4. FIG.

[0048] Figure 2 shows a state in which the hand 28 of the transport robot 24 is not holding either a substrate W or a component carrier C, Figure 3 shows a state in which the hand 28 holding a substrate W has advanced, and Figure 4 shows a state in which the hand 32 holding a component carrier C has advanced.

[0049] As shown in FIGS. 2 to 4, the transport robot 24 has a hand 28 and an arm 30 for holding and transporting the substrate W, and a hand 32 and an arm 34 for holding and transporting the component carrier C.

[0050] As shown in Fig. 2, the hand 28 is a hand capable of supporting the substrate W from below and has a bifurcated shape. The upper surface of the hand 28 is provided with a plurality of anti-slip portions (not shown) for preventing the substrate W from shifting position. The hand 28 may also be a type that chucking the substrate W from above (including a non-contact type). The hand 28 is attached to the tip portions of a plurality of arms 30. The arms 30 are rotatably supported relative to one another, and their base ends are supported by a base 36. As shown in Fig. 3, the hand 28 moves linearly in the forward and backward directions by driving the arms 30 so that the connection angle between them changes (see arrow A1).

[0051] As shown in Fig. 2, the hand 32 is a bifurcated hand capable of supporting the component carrier C from below. The upper surface of the hand 32 is provided with a plurality of anti-slip portions (not shown) for preventing the component carrier C from shifting position. The hand 32 is attached to the distal ends of a plurality of arms 34. The arms 34 are rotatably supported relative to one another, and their base ends are supported by a base 36. As shown in Fig. 4, the arms 34 are driven to change the connection angle between them, causing the hand 32 to move linearly in the forward and backward directions (see arrow A2).

[0052] The hand 28 and arm 30 for transporting substrates W and the hand 32 and arm 34 for transporting component carriers C are positioned vertically offset to prevent interference with each other. In this embodiment, the hand 28 for substrates is positioned above the hand 32 for component carriers. Since component carriers C have a higher particle adhesion rate than substrates W, positioning the hand 32 for component carriers below can prevent particles from getting mixed in.

[0053] The hand 32, which is disposed below the hand 28, is positioned at a height that passes through the vertical gap in the arm 30 connected to the hand 28. This allows the hand 28 and arm 30 for substrates and the hand 32 and arm 34 for component carriers to move independently without interfering with each other.

[0054] 2 , the robot transfer table 26 moves the base 36 along the Y-axis, thereby moving the transfer robot 24 in the Y-axis direction (arrow Y1). The robot transfer table 26 rotates the base 36 about a rotation axis extending in the Z-axis direction, thereby rotating the transfer robot 24 horizontally (arrow R1). The robot transfer table 26 raises and lowers the base 36 along the Z-axis, thereby raising and lowering the transfer robot 24 in the Y-axis direction.

[0055] The transfer robot 24 of this embodiment does not have the function of moving in a horizontal direction (e.g., the X-axis direction) different from the Y-axis direction. That is, the horizontal linear movement of the transfer robot 24 is limited to the Y-axis direction. This allows the dimension of the load module 4 in the X-axis direction to be reduced.

[0056] Returning to FIG. 1A, a relay module 6 is connected to the downstream side of the carry-in module 4, and a transport module 8 is connected to the downstream side of the relay module 6.

[0057] Like the load module 4, the transfer module 8 has a transfer robot 60 and a robot transfer table 62. The transfer robot 60 has the same configuration as the transfer robot 24, and the robot transfer table 62 has the same configuration as the robot transfer table 26.

[0058] The detailed configuration of the transport robot 60 and the robot moving table 62 will be described with reference to FIG.

[0059] FIG. 5 is a schematic plan view of the transfer module 8. As shown in FIG.

[0060] As shown in FIG. 5, the transport robot 60 of the transport module 8 has a hand 64 and an arm 66 for holding and transporting the substrate W, and a hand 68 and an arm 70 for holding and transporting the component carrier C.

[0061] 5, the hand 64 is a hand capable of supporting the substrate W from below, and is attached to the tip portions of a plurality of arms 66. The hand 68 may also be a hand that chucks the substrate W from above (including a non-contact type). The base ends of the plurality of arms 66 are pivotally supported on a base 72. The hand 64 moves linearly in the forward and backward directions by driving the plurality of arms 66 so that the connection angle between them changes (see arrow A3).

[0062] The hand 68 is capable of supporting the component carrier C from below, and is attached to the tip portions of a plurality of arms 70. The base ends of the plurality of arms 70 are pivotally supported on a base portion 72. The hand 68 moves linearly in the forward and backward directions by driving the plurality of arms 70 so that the connection angle between them changes (see arrow A4).

[0063] The hand 64 and arm 66 for transporting the substrate W and the hand 68 and arm 70 for transporting the component carrier C are arranged offset vertically so as not to interfere with each other. In this embodiment, the hand 64 for the substrate is arranged above the hand 68 for the component carrier.

[0064] The robot transfer table 62 moves the base 72 along the X-axis direction, thereby moving the transfer robot 60 in the X-axis direction (arrow X1). The robot transfer table 62 rotates the base 72 about a rotation axis extending in the Z-axis direction, thereby rotating the transfer robot 60 horizontally (arrow R2). The robot transfer table 62 raises and lowers the base 72 along the Z-axis direction, thereby raising and lowering the transfer robot 60 in the same manner. Note that the functions of horizontally rotating and raising and lowering the transfer robot 60 may be performed by a turning mechanism or an elevating mechanism provided in the transfer robot 60.

[0065] The transfer robot 60 of this embodiment does not have the function of moving in a horizontal direction (e.g., the Y-axis direction) different from the X-axis direction, and the only horizontal linear movement is in the X-axis direction, which allows the size of the transfer module 8 in the Y-axis direction to be reduced.

[0066] Returning to FIG. 1A, the relay module 6 is a module for temporarily arranging the substrates W and component carriers C that have been carried into the carry-in module 4 and transferring them to the transport module 8 .

[0067] FIG. 6 is a perspective view schematically showing the relay module 6. As shown in FIG.

[0068] As shown in FIG. 6 , the relay module 6 has a first temporary placement stage 38 and a second temporary placement stage 40 .

[0069] The first temporary placement stage 38 is a stage for placing a substrate W before use that has been carried in from the load module 4. The transport robot 24 of the load module 4 described above places the substrate W held by the hand 28 on the first temporary placement stage 38, whereby the substrate W before use is temporarily placed on the first temporary placement stage 38. The transport robot 60 (not shown) of the transport module 8 receives and transports the temporarily placed substrate W.

[0070] The second temporary placement stage 40 is a stage for placing component carriers C before use that have been carried in from the carry-in module 4. The transport robot 24 of the carry-in module 4 described above places the component carrier C held by the hand 32 on the second temporary placement stage 40, whereby the component carrier C before use is temporarily placed on the second temporary placement stage 40. The transport robot 60 (not shown) of the transport module 8 receives and transports the temporarily placed component carrier C.

[0071] FIG. 7 is a schematic front view of the first temporary placement stage 38, and FIG. 8 is a schematic front view of the second temporary placement stage 40. As shown in FIG.

[0072] The first temporary placement stage 38 shown in FIG. 7 has two shelves 46 and 48 on which substrates W are placed.

[0073] The first shelf 46 on the lower level is a shelf for temporarily storing the unusable substrate W1 that has been carried in from the carry-in module 4. The second shelf 48 on the upper level is a shelf for temporarily storing the used substrate W2 to which components have been bonded by the bonding device 18 described below.

[0074] By providing a second shelf 48 in addition to the first shelf 46, the used substrate W2 after components have been bonded can be returned to the loading module 4 via the relay module 6 and discharged outside the bonding system 2.

[0075] Arranging the first shelf 46 and the second shelf 48 one above the other can reduce the horizontal dimension of the relay module 6. Placing the unused substrate W1, which has a relatively higher particle rate than the used substrate W2, on the lower first shelf 46 can suppress the intrusion of particles.

[0076] The second temporary placement stage 40 shown in FIG. 8 has two shelves 50 and 52 on which component carriers C are placed.

[0077] The third shelf 50 on the lower level is a shelf for temporarily storing component carriers C1 before use that have been carried into the carry-in module 4. The fourth shelf 52 on the upper level is a shelf for temporarily storing component carriers C2 after use, from which components have been removed in the bonding device 18 (described later).

[0078] By providing a fourth shelf 52 in addition to the third shelf 50, the used component carrier C2 after the components have been bonded can be returned to the input module 4 via the relay module 6 and discharged outside the bonding system 2.

[0079] Arranging the third shelf 50 and the fourth shelf 52 one above the other reduces the horizontal dimension of the relay module 6. Placing the unused component carrier C1, which has a relatively higher particle retention rate than the used component carrier C2, on the lower third shelf 50 can suppress the intrusion of particles.

[0080] 6, the temporary placement stages 38, 40 of this embodiment are disposed obliquely so as to intersect with both the X-axis direction and the Y-axis direction in a plan view. The arrangement of the temporary placement stages 38, 40 will now be described with reference to FIGS. 9 and 10.

[0081] 9 and 10 are schematic plan views showing the periphery of the relay module 6 including the first temporary placement stage 38 and the second temporary placement stage 40, respectively.

[0082] 9 shows the state in which the substrate W placed on the first temporary placement stage 38 is being transported, and FIG. 10 shows the states before and after the component carrier C placed on the second temporary placement stage 40 is being transported.

[0083] As shown in Figures 9 and 10, the first temporary placement stage 38 and the second temporary placement stage 40 are arranged in the Y-axis direction and are located on opposite sides of the central axis 63 of the movement path of the downstream transport robot 60 along the X-axis direction.

[0084] 9 , the first temporary placement stage 38 is configured to transfer a substrate W to the upstream transport robot 24 along a transfer direction A3 that is oblique in plan view, and to transfer a substrate W to the downstream transport robot 60 along a transfer direction A4 that is oblique in plan view. The transfer directions A3 and A4 in this embodiment are directions that intersect with both the X-axis direction and the Y-axis direction in plan view and are parallel to each other. In particular, the transfer direction A4 to the downstream transport robot 60 is inclined in a direction approaching a central axis 63 of the movement path of the transport robot 60.

[0085] 10 , the second temporary placement stage 40 is configured to transfer the component carrier C to the upstream transport robot 24 along a transfer direction A5 that is oblique in plan view, and to transfer the component carrier C to the downstream transport robot 60 along a transfer direction A6 that is oblique in plan view. In this embodiment, the transfer directions A5 and A6 are parallel to each other and intersect with both the X-axis direction and the Y-axis direction in plan view. In particular, the transfer direction A6 to the downstream transport robot 60 is inclined toward the central axis 63 of the movement path of the transport robot 60.

[0086] By setting the transfer directions A4 and A6 in this way, even if the downstream transport robot 60 can only move horizontally in the X-axis direction and does not have the function of moving in the Y-axis direction, the transport robot 60 can rotate horizontally to receive the substrate W from the first temporary placement stage 38 and the component carrier C from the second temporary placement stage 40. This simplifies the configuration of the transport module 8 and improves processing efficiency. Furthermore, this configuration allows the transport robot 60 to be a less expensive three-axis type rather than a four-axis type with a higher degree of freedom of movement of the hand 64, which is advantageous for reducing costs.

[0087] The inclination angles of the transfer directions A3, A4, A5, and A6 relative to the central axis 63 may be set appropriately according to the specifications of the bonding system 2.

[0088] The upstream transport robot 24 can move in the Y-axis direction to a position where it can transfer a substrate W to the first temporary placement stage 38, and to a position where it can transfer a component carrier C to the second temporary placement stage 40.

[0089] Returning to FIG. 6, the relay module 6 further includes a first positioning stage 42 and a second positioning stage 44 .

[0090] The first positioning stage 42 is a stage for aligning the substrate W transported by the transport robot 60 of the transport module 8 in a predetermined orientation. The transport robot 60 places the substrate W held by the hand 64 on the first positioning stage 42, whereby the substrate W before bonding processing is temporarily placed on the first positioning stage 42. The substrate W placed on the first positioning stage 42 is positioned in a predetermined orientation, and is then handed over to the transport robot 60, after which it is carried into the bonding device 18.

[0091] The second positioning stage 44 is a stage for aligning the component carrier C, which is transported by the transport robot 60 of the transport module 8, in a predetermined orientation. The transport robot 60 places the component carrier C held by the hand 68 on the second positioning stage 44, whereby the component carrier C before bonding processing is temporarily placed on the second positioning stage 44. The component carrier C placed on the second positioning stage 44 is positioned in a predetermined orientation and handed over to the transport robot 60, after which it is carried into the bonding device 18.

[0092] By providing the temporary placement stages 42, 44, the substrate W and the component carrier C can be aligned in a predetermined direction just before being carried into the bonding device 18, which leads to improved bonding processing accuracy in the bonding device 18.

[0093] 11 and 12 are perspective views for explaining how to use the first positioning stage 42. FIG.

[0094] As shown in FIGS. 11 and 12, the first positioning stage 42 has a rotary plate 73 (FIG. 11), a rotational position detection unit 74, and a drive box 76.

[0095] The rotating plate 73 is a member for rotating the substrate W. The rotating plate 73 is rotatable about a rotation axis Ax1 extending in the Z-axis direction (arrow R3), and rotates with the substrate W placed thereon (arrow R4), as shown in FIG.

[0096] The rotational position detection unit 74 is a member for detecting the rotational position of the substrate W. The rotational position detection unit 74 of this embodiment detects the rotational position of the substrate W by irradiating light toward the outer periphery of the substrate W and detecting light that passes through a position corresponding to a notch N provided in the substrate W. The detection method is not limited to this, and any detection method may be adopted as long as it is capable of detecting the rotational position of the substrate W.

[0097] The drive box 76 is a box-shaped member that houses the drive members of the rotation plate 73 and the rotation position detection unit 74. The drive box 76 is connected to the control unit 19 shown in Fig. 1A, and the control unit 19 identifies the rotation position of the substrate W based on the detection result of the rotation position detection unit 74, and adjusts the amount of rotation of the rotation plate 73 so that the substrate W reaches a predetermined rotation position. In this way, the substrate W is positioned in a predetermined orientation.

[0098] 13 and 14 are perspective views for explaining how to use the second positioning stage 44. FIG.

[0099] As shown in FIGS. 13 and 14, the second positioning stage 44 has a pair of aligners 78 and a drive box 80 .

[0100] The pair of aligners 78 are members for positioning the component carrier C. The pair of aligners 78 are movable in directions toward and away from each other (arrows A7), and when they move toward each other, they sandwich the component carrier C and position it in a predetermined orientation.

[0101] The drive box 80 is a box-shaped member that houses a drive member for the aligner 78. The drive box 80 is connected to the control unit 19 shown in FIG. 1A.

[0102] 14, with the pair of aligners 78 in an open state, the transport robot 60 places the component carrier C held by the hands 68 between the pair of aligners 78. The pair of aligners 78 then move in the closing direction (arrow A8), engaging with the linear portions S of the component carrier C and sandwiching the component carrier C, thereby positioning the component carrier C in a predetermined orientation.

[0103] 15 and 16 are schematic plan views showing the periphery of the relay module 6 including the first positioning stage 42 and the second positioning stage 44, respectively.

[0104] 15 shows a state in which a substrate W is transferred on the first positioning stage 42, and FIG. 16 shows a state in which a component carrier C is transferred on the second positioning stage 44. In FIG.

[0105] The first positioning stage 42 and the second positioning stage 44 are disposed at an angle in a plan view, similar to the temporary placement stages 38 and 40 shown in Figures 9 and 10. As shown in Figures 15 and 16, the positioning stages 42 and 44 are disposed on opposite sides of the central axis 63 of the movement path of the downstream transfer robot 60 along the X-axis direction.

[0106] 15, the first positioning stage 42 is configured to transfer the substrate W to the transport robot 60 along a transfer direction A9 that is oblique in plan view. The transfer direction A9 of the first positioning stage 42 is parallel to the transfer direction A4 (FIG. 9) of the first temporary placement stage 38.

[0107] 16, the second positioning stage 44 is configured to transfer the component carrier C to the transport robot 60 along a transfer direction A10 that is oblique in plan view. The transfer direction A10 of the second positioning stage 44 is parallel to the transfer direction A6 (FIG. 10) of the second temporary placement stage 40.

[0108] 6 , the temporary placement stages 38, 40 are arranged on the upper level, and the positioning stages 42, 44 are arranged on the lower level. The relay module 6 is provided with a support plate 41 that supports the temporary placement stages 38, 40, and the support plate 41 separates the temporary placement stages 38, 40 and the positioning stages 42, 44 into upper and lower sections. This upper and lower arrangement reduces the floor area of ​​the relay module 6 and suppresses particle contamination. Furthermore, because the positioning stages 42, 44 have movable parts inside, there is a concern about particles being generated due to friction between the movable parts. However, by arranging the positioning stages 42, 44 below the support plate 41 that separates the upper and lower spaces, the possibility of particles adhering to the substrates W and component carriers C on the temporary placement stages 38, 40 can be reduced.

[0109] 1A, the control unit 19 is a component that controls each component of the bonding system 2. The control unit 19 is configured, for example, by a microcomputer that includes a processor and a memory that stores a computer program executed by the processor.

[0110] The surface treatment modules 10, 12, 14, and 16 are modules for performing surface treatment on the substrates W and component carriers C. After the surface treatment on the substrates W and component carriers C is performed in the surface treatment modules 10, 12, 14, and 16, the bonding process is performed in a bonding device 18.

[0111] In this embodiment, three surface treatment modules 10, 12, and 14 are arranged on one side (+Y axis direction) of the movement path of the transfer robot 60, and one surface treatment module 16 is arranged on the other side (-Y axis direction).

[0112] In this embodiment, the surface treatment modules 10 and 12 have cleaning devices for cleaning, the surface treatment module 14 has a plasma treatment device for surface modification, and the surface treatment module 16 has a UV irradiation device for hardening the adhesive sheet of the component carrier C.

[0113] The cleaning device of the surface treatment module 10 cleans the surfaces of the substrates W and component carriers C using a predetermined liquid (for example, pure water, alkaline chemical solution, or neutral surfactant).

[0114] The cleaning device of the surface treatment module 12 cleans (rinses) the surfaces of the substrates W and component carriers C using a predetermined liquid (for example, pure water).

[0115] The plasma treatment device in the surface treatment module 14 activates the surfaces of the substrates W and component carriers C by irradiating them with plasma.

[0116] The UV irradiation device of the surface treatment module 16 irradiates the component carrier C with ultraviolet light to harden the surface of the adhesive sheet holding the components on the component carrier C, thereby weakening the adhesive force.

[0117] By providing the surface treatment modules 10, 12, 14, and 16 adjacent to the transport path of the transport robot 60, the transport robot 60 can move in the X-axis direction to access each module and load and unload substrates W and component carriers C.

[0118] Each of the surface treatment modules 10, 12, 14, and 16 is provided with a partition wall for separating each module, an opening provided in the partition wall at a position facing the transport path of the transport robot 60, and a shutter for opening and closing the opening. The opening of each module is closed except when a substrate W or component carrier C is being loaded or unloaded, and the shutter operates to open the opening only when a substrate W or component carrier C is being loaded or unloaded.

[0119] A bonding device 18 is also provided at a position adjacent to the transfer path of the transfer robot 60 .

[0120] The bonding apparatus 18 is an apparatus for individually bonding a plurality of components held by component carriers C to a substrate W. The bonding apparatus 18 of this embodiment includes a first bonding module 82 and a second bonding module 84.

[0121] The first bonding module 82 is a module that receives the substrate W from the transport robot 60. The second bonding module 84 is a module that receives the component carrier C from the transport robot 60.

[0122] 1B , a partition wall 81 is provided between the transfer module 8 and the bonding device 18. Each of the bonding modules 82 and 84 is provided with openings 82g and 84g in the partition wall 81 at positions facing the transfer path of the transfer robot 60, and with shutters (not shown) for opening and closing the openings 82g and 84g. The bonding module 82 is provided with a first opening 82g for loading and unloading the substrate W, and the bonding module 84 is provided with a second opening 84g for loading and unloading the component carrier C.

[0123] The bonding modules 82 and 84 are arranged adjacent to each other in the X-axis direction, which is the direction of movement of the transfer robot 60, and their internal spaces are in communication with each other.

[0124] The first bonding module 82 has a substrate temporary rest section 86 , a substrate transport device 87 , a substrate holding table 88 , a stage moving device 89 , and a bonding head 94 .

[0125] The temporary substrate rest part 86 is a member for placing and temporarily placing the substrate W received from the transport robot 60. The substrate transport device 87 is a device for transporting the substrate W placed on the temporary substrate rest part 86 and transferring the substrate W to the substrate holding table 88. The substrate transport device 87 shown in FIG. 1B includes a first substrate transport device 87a and a second substrate transport device 87b. The first substrate transport device 87a transports the substrate S placed on the temporary substrate rest part 26 and transfers the substrate S to the second substrate transport device 87b. The second substrate transport device 87b transfers the substrate S received from the first substrate transport device 87a to the substrate holding table 88.

[0126] The substrate holding table 88 is a table that holds the substrate W received from the substrate transport device 87 and holds the substrate W while the bonding head 94 bonds the components. The stage moving device 89 is a device that moves the substrate holding table 88. The bonding head 94 is a member that receives components from a pickup head 96, which will be described later, and bonds the received components to the substrate W. The bonding head 94 in this embodiment is movable along the X-axis direction, which is the arrangement direction of the bonding modules 82, 84.

[0127] The second bonding module 84 includes a carrier temporary rest section 90 , a carrier transport device 91 , a carrier holding table 92 , a stage moving device 93 , and a pickup head 96 .

[0128] The carrier temporary rest section 90 is a member for arranging and temporarily storing component carriers C received from the transport robot 60. The carrier transport device 91 is a device for transporting component carriers C placed on the carrier temporary rest section 90 and transferring the component carriers C to a carrier holding table 92. The carrier holding table 92 is a table that holds the component carriers C received from the carrier transport device 91 and holds the component carriers C while a pickup head 96 picks up the components. The stage moving device 93 is a device that moves the carrier holding table 92. The pickup head 96 is a member for receiving components from the component carriers C held on the carrier holding table 92 and transferring the received components to the bonding head 94 described above.

[0129] Here, the detailed configuration and operation of the carrier holding table 92 will be described with reference to FIGS.

[0130] FIG. 17 is a perspective view schematically showing the carrier holding table 92. As shown in FIG.

[0131] As shown in FIG. 17, the carrier holding table 92 includes a carrier frame guide 100 , a carrier frame retainer 102 , a plurality of support columns 104 , a drive box 106 , a seat expansion ring 108 , and an ejector 110 .

[0132] The carrier frame guide 100 is a member that supports the carrier frame 112 of the component carrier C. The component carrier C has an outer carrier frame 112 and an inner adhesive sheet 114, and a plurality of components P are held on the adhesive sheet 114. A transport device (not shown) (carrier transport device 91 shown in FIG. 1B) transports the component carrier C to the carrier frame guide 100 (arrow A11), and the carrier frame guide 100 supports the carrier frame 112 of the component carrier C.

[0133] The carrier frame holder 102 is a member for pressing down from above the carrier frame 112 of the component carrier C. The carrier frame holder 102 has a ring shape with an opening in the center, and the dimensions of the opening are larger than the dimensions of the adhesive sheet 114.

[0134] The support pillars 104 are members that support the carrier frame holder 102 from below, and multiple support pillars 104 are provided. The support pillars 104 are configured to be able to be raised and lowered by a drive box 106. When the drive box 106 raises and lowers the support pillars 104, the carrier frame guide 100, carrier frame holder 102, and support pillars 104 rise and lower together (arrow Z1). The carrier frame guide 100, carrier frame holder 102, and support pillars 104 constitute a lifting unit 101.

[0135] The drive box 106 is a box that houses a drive unit for raising and lowering the lifting unit 101 .

[0136] The sheet expansion ring 108 is a member that supports the adhesive sheet 114 inside the component carrier C from below and expands it outward. When the component carrier C supported by the carrier frame guide 100 descends, the adhesive sheet 114 of the component carrier C comes into contact with and is supported by the sheet expansion ring 108. The sheet expansion ring 108 has a cylindrical shape that extends in the Z-axis direction, and the ring portion at the upper end supports the adhesive sheet 114.

[0137] The ejector 110 is a member that abuts against the adhesive sheet 114 supported by the sheet expanding ring 108 from below, thereby pushing up a component at a predetermined position and assisting the pickup head 96 in picking up the component. The ejector 110 is raised and lowered by the drive box 106 independently of the lifting unit 101.

[0138] The method of holding the component carriers C by the carrier holding table 92 having the above configuration will be described with reference to Figures 18 to 21. Figures 18 to 21 are vertical cross-sectional views each showing a schematic view of the method of holding the component carriers C by the carrier holding table 92.

[0139] As shown in FIG. 18, a transport device (not shown) (carrier transport device 91 shown in FIG. 1B) transports the component carrier C, and the carrier frame 112 of the component carrier C is supported by the carrier frame guide 100.

[0140] 19 , the lifting unit 101 is lowered (arrow Z2). As a result, the component carrier C supported by the carrier frame guide 100 and the lifting unit 101 are lowered together, and the adhesive sheet 114 of the component carrier C comes into contact with the upper end of the sheet expansion ring 108. If the lifting unit 101 is further lowered from this state, the carrier frame 112 of the component carrier C separates from the carrier frame guide 100, and the descending carrier frame presser 102 comes into contact with the carrier frame 112.

[0141] 20, the carrier frame presser 102 presses the carrier frame 112 downward (arrow Z3), causing the adhesive sheet 114 to spread radially outward, increasing the spacing between the multiple components P held by the adhesive sheet 114.

[0142] 21, the ejector 110 then rises (arrow Z4), pushing up the underside of the adhesive sheet 114 and pushing up the component P1 at the predetermined position. By pushing up the component P1, the pickup head 96 can accurately pick up the component P1.

[0143] The bonding operation for individually bonding a plurality of components P held on a component carrier C to a substrate W using the carrier holding table 92 and substrate holding table 90 described above will be described with reference to FIGS.

[0144] Fig. 22 is a longitudinal sectional view schematically showing a state in which a substrate W is held on the substrate holding table 88. Figs. 23 and 24 are longitudinal sectional views schematically showing a method of bonding components P held on component carriers C to a substrate W.

[0145] 22, the substrate transport device 87 shown in FIG. 1A transports the substrate W and places it on a holding surface 89 of a substrate holding table 88. The XY coordinate position of the substrate holding table 88 is adjusted so that the substrate W is located at a predetermined bonding operation position XY1. The bonding head 94 is positioned at a component transfer position XY2 for transferring components P to and from the pickup head 96.

[0146] 23, in a component carrier C held by the carrier holding table 92, the ejector 110 pushes up a component P1 at a predetermined position, and the pickup head 96 descends (arrow A12) to pick up the component P1. At this time, the XY coordinate position of the carrier holding table 92 is adjusted so that the component P1 is located at a predetermined pickup operation position XY3.

[0147] After picking up the component P1, the pickup head 96 moves horizontally from the pickup operation position XY3 toward the component transfer position XY2 (arrow A13), and turns around in the process (arrow R5), so that the component P1 faces upward.

[0148] Thereafter, the bonding head 94, which is positioned above the pickup head 96 at the component transfer position XY2, descends (arrow A14) and picks up and holds the component P1 held by the pickup head 96. This transfers the component P1 from the pickup head 96 to the bonding head 94. After receiving the component P1, the bonding head 94 moves from the component transfer position XY2 to the bonding work position XY1 (arrow A15).

[0149] 24, the bonding head 94, which has moved to the bonding operation position XY1, descends toward the substrate W held on the substrate holding table 88 (arrow A16), and bonds the component P1 to the substrate W at a position corresponding to the bonding operation position XY1. This completes the bonding process for the component P1.

[0150] While the bonding head 94 is mounting the component P1 on the substrate W, the pick-up head 96 performs the operation of picking up the next component P2. To align the next component P2 at the pick-up operation position XY3, the lifting unit 101 supporting the component carrier C is moved in the X and Y directions. The ejector 110 does not have the function of moving in the X and Y directions, and is raised and lowered independently of the lifting unit 101 while being positioned in advance at the pick-up operation position XY3.

[0151] By repeatedly performing the operations shown in FIGS. 23 and 24, a plurality of components P held on the component carrier C can be bonded to one substrate W individually.

[0152] The bonding system 2 of this embodiment performs hybrid bonding, which directly bonds electrodes together, without using a bonding auxiliary member such as solder when bonding a component P to a substrate W. In order to perform hybrid bonding with high precision, the substrate W and the component P are each subjected to surface treatment before being carried into the bonding device 18.

[0153] 1A, multiple types of surface treatment modules 10, 12, 14, and 16 are provided, and a transport robot 60 is provided for a transport module 8 that accommodates both substrates W and component carriers C. The transport robot 60 transports the substrates W and component carriers C to each module, where surface treatment is performed, and then the substrates W and component carriers C are loaded into a bonding device 18.

[0154] (Substrate Processing Flow) An example of a processing flow for a substrate W by the bonding system 2 of this embodiment will be described with reference to Figures 25 to 27. Figures 25 to 27 are each a plan view of the bonding system 2 schematically showing an example of a processing flow for a substrate W.

[0155] 25 to 27, the movement sequence of the substrate W is indicated by dotted arrows.

[0156] FIG. 25 shows the movement sequence of the substrate W from when it is supplied by the load port 3 until it is carried into the first bonding module 82 of the bonding apparatus 18 .

[0157] 25 , the transport robot 24 of the carry-in module 4 accesses the sealed container 20 mounted on the load port 3 and uses the hand 28 (FIGS. 2 to 4) to remove one substrate W from the sealed container 20. After removing the substrate W, the transport robot 24 rotates horizontally and then delivers the substrate W obliquely in a plan view to the first shelf 46 (FIG. 7) on the lower level of the first temporary placement stage 38 of the relay module 6.

[0158] <First Cleaning Step (First Surface Treatment Step)> Thereafter, the transfer robot 60 of the transfer module 8 accesses the first temporary placement stage 38 and receives the substrate W at an angle in plan view. After receiving the substrate W, the transfer robot 60 rotates horizontally and then moves horizontally in the +X-axis direction to access the surface treatment module 10, and delivers the substrate W to the surface treatment module 10. In the surface treatment module 10, the substrate W is subjected to a cleaning treatment using a liquid such as pure water or a chemical solution.

[0159] <Surface Modification Step (Second Surface Treatment Step)> The substrate W that has been subjected to the cleaning treatment is carried out from the surface treatment module 10 and received by the transfer robot 60. Having received the substrate W, the transfer robot 60 moves horizontally in the +X-axis direction to access the surface treatment module 14, and delivers the substrate W to the surface treatment module 14. In the surface treatment module 14, a surface modification treatment of the substrate W is performed using plasma.

[0160] <Second Cleaning Step (Third Surface Treatment Step)> The substrate W that has been subjected to the surface modification treatment is carried out from the surface treatment module 14 and received by the transfer robot 60. Having received the substrate W, the transfer robot 60 moves horizontally in the −X axis direction to access the surface treatment module 12, and hands over the substrate W to the surface treatment module 12. In the surface treatment module 12, the substrate W is subjected to a cleaning treatment using pure water.

[0161] <Positioning Step> The substrate W that has been subjected to the cleaning process is carried out from the surface treatment module 12 and received by the transport robot 60. The transport robot 60 that has received the substrate W moves horizontally in the −X axis direction to access the third temporary placement stage 42 of the relay module 6, and delivers the substrate W to the third temporary placement stage 42 in an oblique orientation in a plan view. On the third temporary placement stage 42, the substrate W is positioned so that it is aligned in a predetermined orientation.

[0162] <Loading Step into Bonding Apparatus> The transfer robot 60 receives the substrate W, which has been positioned in a predetermined orientation on the third temporary placement stage 42, at an angle in a plan view. After receiving the substrate W, the transfer robot 60 moves horizontally in the +X-axis direction to access the first bonding module 82 of the bonding apparatus 18, and loads the substrate W into the first bonding module 82.

[0163] According to the above flow, after the cleaning process and the surface modification process are performed on the substrate W, the substrate W is aligned in a predetermined direction on the third temporary placement stage 42 and then carried into the first bonding module 82 .

[0164] <Bonding Step> The substrate W carried into the first bonding module 82 is subjected to a bonding process using a plurality of components P on a component carrier C carried into the second bonding module 84. In this embodiment, when a plurality of components P are bonded to the substrate W, the components P can also be stacked in a plurality of layers. In this case, after the bonding process for the nth layer of components P is completed, the substrate W is subjected to a cleaning process before the bonding process for the n+1th layer of components P is performed.

[0165] Figure 26 shows the movement sequence of the substrate W, from when the substrate W is loaded into the first bonding module 82 and a predetermined number of components P (e.g., components P in the nth tier) are bonded, to when the substrate W is unloaded from the first bonding module 82, subjected to various surface treatments, and returned to the first bonding module 82 before the next tier of components P (e.g., components P in the n+1th tier) are bonded.

[0166] 26 , the transport robot 60 receives the substrate W unloaded from the first bonding module 82, and then rotates horizontally to access the surface treatment module 10. As in the processing flow of FIG. 25 , the transport robot 60 transports the substrate W so that the cleaning process (first cleaning step) in the surface treatment module 10, the surface modification process (surface modification step) in the surface treatment module 14, the cleaning process (second cleaning step) in the surface treatment module 12, the positioning process (positioning step) on the third temporary placement stage 42, and the supply process to the first bonding module 82 (loading into the bonding apparatus step) are performed in this order.

[0167] By performing the process flow shown in FIG. 26 each time a component P is bonded to a stage, the process of bonding multiple stages of components P to a board W can be performed with high accuracy.

[0168] FIG. 27 shows the movement sequence of the substrate W from when the substrate W is unloaded from the first bonding module 82 after all the components P to be bonded to the substrate W have been bonded, until when the substrate W is returned to the load port 3.

[0169] 27 , the transport robot 60 receives the substrate W that has been transported from the first bonding module 82, and moves horizontally in the −X-axis direction to access the first temporary placement stage 38. The transport robot 60 delivers the substrate W to the second shelf 48 ( FIG. 7 ) on the upper level of the first temporary placement stage 38, with the substrate W oriented obliquely in a plan view.

[0170] <Step of Unloading from Bonding System> The transfer robot 24 of the load module 4 accesses the first temporary placement stage 38 and receives the substrate W at an angle in a plan view. Having received the substrate W, the transfer robot 24 rotates horizontally and delivers the substrate W to the load port 3.

[0171] According to the processing flow shown in FIG. 27, the used substrate W after the bonding processing of the components P is completed can be returned to the load port 3 and discharged to the outside of the bonding system 2.

[0172] (Processing flow of component carriers) An example of a processing flow of component carriers C by the bonding system 2 of this embodiment will be described with reference to Fig. 28 and Fig. 29. Fig. 28 and Fig. 29 are each a plan view of the bonding system 2 schematically showing an example of a processing flow of component carriers C.

[0173] 28 and 29, the movement order of the component carriers C is indicated by dotted arrows.

[0174] FIG. 28 shows the movement sequence of the component carrier C from when it is supplied by the load port 3 until it is carried into the second bonding module 84 of the bonding apparatus 18.

[0175] 28 , the transfer robot 24 of the carry-in module 4 accesses the sealed container 22 mounted on the load port 3 and uses the hand 32 (FIGS. 2 to 4) to remove one component carrier C from the sealed container 22. After removing the component carrier C, the transfer robot 24 rotates horizontally and then delivers the component carrier C at an angle in plan view to the third shelf 50 (FIG. 8) below the second temporary placement stage 40 of the relay module 6.

[0176] <First Cleaning Step (First Surface Treatment Step)> The transfer robot 60 of the transfer module 8 accesses the second temporary placement stage 40 and receives the component carrier C at an angle in a plan view. After receiving the component carrier C, the transfer robot 60 rotates horizontally and then moves horizontally in the +X-axis direction to access the surface treatment module 10, and hands over the component carrier C to the surface treatment module 10. In the surface treatment module 10, the component carrier C is subjected to a cleaning process using a liquid such as pure water or a chemical solution.

[0177] <Surface Modification Step (Second Surface Treatment Step)> The component carrier C that has undergone the cleaning treatment is carried out from the surface treatment module 10 and received by the transfer robot 60. After receiving the component carrier C, the transfer robot 60 moves horizontally in the +X-axis direction to access the surface treatment module 14, and hands over the component carrier C to the surface treatment module 14. In the surface treatment module 14, a surface modification treatment of the component carrier C is performed using plasma.

[0178] <Second Cleaning Step (Third Surface Treatment Step)> The component carrier C that has undergone the surface modification treatment is carried out from the surface treatment module 14 and received by the transfer robot 60. After receiving the component carrier C, the transfer robot 60 moves horizontally in the −X axis direction to access the surface treatment module 12, and hands over the component carrier C to the surface treatment module 12. In the surface treatment module 12, the component carrier C is cleaned using pure water.

[0179] <Ultraviolet Light Irradiation Step (Fourth Surface Treatment Step)> The component carrier C that has undergone the cleaning treatment is carried out from the surface treatment module 12 and received by the transfer robot 60. After receiving the component carrier C, the transfer robot 60 moves horizontally in the +X-axis direction to access the surface treatment module 16, and hands over the component carrier C to the surface treatment module 16. In the surface treatment module 16, the component carrier C is subjected to an ultraviolet light irradiation treatment. This hardens the adhesive sheet 114 on the component carrier C, weakening the adhesive force of the components P.

[0180] <Positioning Step> The component carrier C that has been subjected to the ultraviolet irradiation treatment is carried out from the surface treatment module 16 and received by the transfer robot 60. After receiving the component carrier C, the transfer robot 60 moves horizontally in the −X axis direction to access the fourth temporary placement stage 44 of the relay module 6, and delivers the component carrier C to the fourth temporary placement stage 44 at an angle in a plan view. At the fourth temporary placement stage 44, the component carrier C is positioned so that it is aligned in a predetermined orientation.

[0181] <Loading Step into Bonding Apparatus> The transport robot 60 receives the component carrier C, which has been positioned in a predetermined orientation on the fourth temporary placement stage 44, at an angle in a plan view. After receiving the component carrier C, the transport robot 60 moves horizontally in the +X-axis direction to access the second bonding module 84 of the bonding apparatus 18, and loads the component carrier C into the second bonding module 84.

[0182] According to the above flow, after the component carrier C is subjected to cleaning processing, surface modification processing, and ultraviolet irradiation processing, the component carrier C is aligned in a predetermined orientation on the fourth temporary placement stage 44, and then the component carrier C is supplied to the second bonding module 84.

[0183] <Component Removal Step, Bonding Step> In the second bonding module 84, a plurality of components P held in the component carrier C are sequentially picked up by the pickup head 96, and are transferred to the bonding head 94, and then bonded to the substrate W. The used component carrier C from which all of the components P have been removed is unloaded from the second bonding module 84, and then discharged to the outside of the bonding system 2.

[0184] 29 shows the movement sequence of the component carrier C from when the component carrier C is removed from the second bonding module 84 after all the components P to be removed have been removed in the second bonding module 84 until when the component carrier C returns to the load port 3.

[0185] 29, the transport robot 60 receives the component carrier C that has been transported from the second bonding module 84, and moves horizontally in the −X-axis direction to access the second temporary placement stage 40. The transport robot 60 delivers the component carrier C to the fourth shelf 52 (FIG. 8) on the upper level of the second temporary placement stage 40 at an angle in a plan view.

[0186] <Step of Unloading from Bonding System> The transfer robot 24 of the load module 4 accesses the second temporary placement stage 40 and receives the component carrier C at an angle in a plan view. After receiving the component carrier C, the transfer robot 24 rotates horizontally and delivers the component carrier C to the load port 3.

[0187] According to the process flow shown in FIG. 29, the used component carrier C from which the component P has been removed can be returned to the load port 3 and discharged to the outside of the bonding system 2.

[0188] According to the above configuration and method, it is possible to construct a hybrid bonding system capable of directly bonding the electrodes of a component P and a substrate W, and in particular a bonding system 2 with high processing efficiency that can automatically transport both a component carrier C and a substrate W.

[0189] By using transport robots 24, 60 that can handle both the two types of transport objects, components P and substrates W, the components P and substrates W can be transported efficiently, respectively, thereby realizing a bonding system 2 with high processing efficiency.

[0190] Furthermore, by providing the temporary storage module 6, the substrates W and component carriers C can be efficiently transferred between the carry-in module 4 and the transport module 8. Furthermore, by adding a positioning function for the component carriers C and the substrates W to the relay module 6, the accuracy of the component bonding process in the bonding device 18 can be improved.

[0191] The number of component carriers C required for one substrate W varies. For example, five component carriers C may be required for one substrate W. The processing flows for substrates W shown in Figures 25 to 27 and the processing flows for component carriers C shown in Figures 28 and 29 may be executed at appropriate times depending on one substrate W and the number of component carriers C required for it, or may be executed in parallel.

[0192] (Action / Effect 1) The bonding system 2 of this embodiment comprises a plurality of surface treatment modules 10, 12, 14, 16 that perform surface treatment on a plurality of components P held in a component carrier C and surface treatment on a substrate W for bonding the plurality of components P to the substrate W, a bonding device 18 that individually bonds the plurality of surface-treated components P to the surface-treated substrate W, and a transport module 8 that transports the component carrier C and the substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding device 18, and the transport module 8 comprises a transport robot 60 having a hand 64 (first hand) that holds the substrate W and a hand 68 (second hand) that holds the component carrier C, and a robot moving table 62 that moves the transport robot 60 along the X-axis direction (first direction).

[0193] With this configuration, both the substrates W and the component carriers C can be transported by the transport robot 60 and moved between the surface treatment modules 10, 12, 14, and 16 and the bonding device 18, thereby realizing a bonding system 2 with high processing efficiency. Note that the surface treatment modules are not limited to the surface treatment modules 10, 12, 14, and 16, and it is sufficient to provide multiple surface treatment modules, each of which is capable of treating a substrate W and at least one of which is capable of treating a component carrier C, to perform surface treatment on multiple components P held on the component carrier C and on a substrate W to which multiple components P are to be bonded.

[0194] Furthermore, in the bonding system 2 of this embodiment, the surface treatment modules 10, 12, and 14 and the bonding device 18 are arranged on opposite sides of the movement path of the transport robot 60 along the X-axis direction (first direction). With this configuration, the transport robot 60 is movable in the X-axis direction while rotating horizontally, so that the component carriers C and the components P can be easily transferred to the surface treatment modules 10, 12, and 14 and the bonding device 18 arranged on opposite sides of the movement path of the transport robot 60. Note that the number of surface treatment modules is not limited to three, and it is sufficient that at least one surface treatment module and one bonding device 18 are arranged on opposite sides of the movement path of the transport robot 60 along the X-axis direction.

[0195] In the bonding system 2 of this embodiment, the surface treatment modules 10, 12, and 1416 perform surface treatment using ultraviolet light, plasma, or liquid. This configuration makes it possible to perform multiple types of surface treatment on the substrates W and component carriers C.

[0196] Furthermore, in the bonding system 2 of this embodiment, the component carrier C is a tape frame having an ultraviolet-curing adhesive sheet 114, and the surface treatment module 16 has an ultraviolet irradiation device that irradiates ultraviolet rays. With this configuration, the surface treatment module 16 irradiates the adhesive sheet 114 of the tape frame with ultraviolet rays, thereby weakening the adhesive force of the adhesive sheet 114 on the component P, making it easier to pick up the component P from the tape frame. Note that it is not limited to only the surface treatment module 16, as long as at least one surface treatment module has an ultraviolet irradiation device that irradiates ultraviolet rays.

[0197] Furthermore, in the bonding system 2 of this embodiment, the bonding apparatus 18 has a first bonding module 82 into which the substrate W is carried and a second bonding module 84 into which the component carrier C is transported, and the first bonding module 82 and the second bonding module 84 are arranged in the X-axis direction (first direction). With this configuration, by arranging two types of bonding modules in the X-axis direction, the transfer robot 60 can easily access each of the bonding modules 82, 84 by moving in the X-axis direction (first direction).

[0198] The bonding system 2 of this embodiment further includes a partition wall 81 that separates the transfer module 8 and the bonding device 18 from each other, and the partition wall 81 is provided with openings 82g and 84g for transferring the component carriers C and substrates W held by the transfer module 8 to the bonding device 18. With this configuration, by separating areas other than the openings 82g and 84g with the partition wall 81, it is possible to suppress the intrusion of particles.

[0199] Furthermore, in the bonding system 2 of this embodiment, the openings 82g, 84g provided in the partition wall 81 include a first opening 82g for passing the substrate W and a second opening 84g for passing the component carrier C. With this configuration, by separating the first opening 82g for passing the substrate W and the second opening 84g for passing the component carrier C, it is possible to further suppress the intrusion of particles.

[0200] In the bonding system 2 of this embodiment, the hand 64 (first hand) and the hand 68 (second hand) are arranged offset from each other vertically and are each movable back and forth. This configuration allows the hand 64 and the hand 68 to hold the component carrier C and the substrate W, respectively, while preventing interference between them.

[0201] Furthermore, in the bonding system 2 of this embodiment, the hand 64 (first hand) is arranged above the hand 68 (second hand). With this configuration, by arranging the component carrier C, which has a higher particle adhesion rate than the substrate W, below, it is possible to suppress the intrusion of particles caused by the component carrier C.

[0202] In the bonding system 2 of this embodiment, the substrate W is a wafer, and the component carrier C is a tape frame. With this configuration, a bonding process can be performed in which a component P held on the tape frame is bonded to the wafer.

[0203] Furthermore, the bonding method of this embodiment includes the steps of performing surface treatment on a plurality of components P held on a component carrier C, performing surface treatment on a substrate W for bonding the plurality of components P, transporting the surface-treated substrate W to a bonding device 18 with a hand 64 (first hand), transporting the surface-treated component carrier C to the bonding device 18 with a hand 68 (second hand), individually bonding the plurality of surface-treated components P to the surface-treated substrate W using the bonding device 18, removing the substrate W to which the plurality of components P have been bonded from the bonding device 18 with the hand 64, and removing the component carrier C from which the plurality of components P have been removed with the hand 68 from the bonding device 18.

[0204] According to this method, both the substrate W and the component carrier C can be transported by the transport robot 60 and carried in and out of the bonding apparatus 18, thereby realizing a bonding system 2 with high processing efficiency.

[0205] (Action / Effect 2) The bonding system 2 of this embodiment includes a carry-in module 4 that carries in component carriers C that hold multiple components P and substrates W for bonding the multiple components P to each other, a relay module 6 that places the component carriers C and substrates W received from the carry-in module 4, a transport module 8 that transports the component carriers C and substrates W placed on the relay module 6 along the X-axis direction (first direction), surface treatment modules 10, 12, 14, and 16 that perform surface treatment on the multiple components P held by the component carriers C and surface treatment on the substrates W, and a bonding device 18 that individually bonds the multiple surface-treated components P to the surface-treated substrate W, and the transport module 8 transports the component carriers C and substrates W between the surface treatment modules 10, 12, 14, and 16 and the bonding device 18.

[0206] With this configuration, both the substrates W and the component carriers C can be transported by the transport module 8 and moved between the surface treatment modules 10, 12, 14, and 16 and the bonding device 18, thereby realizing a bonding system 2 with high processing efficiency. Note that the surface treatment modules are not limited to the surface treatment modules 10, 12, 14, and 16, and it is sufficient to provide a surface treatment module in which at least one surface treatment module is capable of treating the substrates W and at least one surface treatment module is capable of treating the component carriers C, thereby performing surface treatment on the multiple components P held on the component carriers C and on the substrates W to which the multiple components P are to be bonded.

[0207] Furthermore, in the bonding system 2 of this embodiment, the relay module 6 has a first temporary placement stage 38 on which the substrate W is placed, and a second temporary placement stage 40 on which the component carrier C is placed. With this configuration, the substrate W and the component carrier C can be placed in different locations.

[0208] Furthermore, in the bonding system 2 of this embodiment, the first temporary placement stage 38 has a first shelf 46 on which an unusable substrate W received from the carry-in module 4 is placed, and a second shelf 48 on which a used substrate W to which a plurality of components P are bonded is placed, and the second temporary placement stage 40 has a third shelf 50 on which an unusable component carrier C received from the carry-in module 4 is placed, and a fourth shelf 52 on which a used component carrier C from which a plurality of components P has been removed is placed. With this configuration, an unusable substrate W and a used substrate W can be placed on the first temporary placement stage 38, and an unusable component carrier C and a used component carrier C can be placed on the second temporary placement stage 40, respectively.

[0209] Furthermore, in the bonding system 2 of this embodiment, the first shelf 46 is located below the second shelf 48, and the third shelf 50 is located below the fourth shelf 52. With this configuration, since the substrates W and component carriers C are more likely to contain particles before use than after use, by placing the substrates W and component carriers C below before use, it is possible to prevent particles from getting into the substrates W and component carriers C after use.

[0210] Furthermore, in the bonding system 2 of this embodiment, the first temporary placement stage 38 is configured to transfer the substrate W to the transport module 8 in a first transfer direction A4 in a plan view, and the second temporary placement stage 40 is configured to transfer the component carrier C to the transport module 8 in a second transfer direction A6 in a plan view. With this configuration, the temporary placement stages 38, 40 can each transfer the substrate W and the component carrier C to the transport module 8 in a desired direction.

[0211] In the bonding system 2 of this embodiment, the first temporary placement stage 38 and the second temporary placement stage 40 are arranged in the Y-axis direction (second direction) that intersects the X-axis direction (first direction) in a plan view, and the first transfer direction A4 and the second transfer direction A6 each intersect with the X-axis direction. With this configuration, the temporary placement stages 38, 40 can be positioned facing the transport module 8, allowing for smooth transfer of component carriers C and substrates W.

[0212] In the bonding system 2 of this embodiment, the relay module 6 further includes positioning stages 42, 44 for receiving the component carriers C and substrates W from the transport module 8 and positioning them in the predetermined transfer directions A9, A10. With this configuration, by positioning the component carriers C and substrates W in the predetermined transfer directions A9, A10 before carrying them into the bonding device 18, it becomes easier to maintain a constant attitude of the component carriers C and substrates W in the bonding device 18, leading to improved bonding accuracy.

[0213] Furthermore, in the bonding system 2 of this embodiment, the positioning stages 42, 44 include a first positioning stage 42 for positioning the substrate W and a second positioning stage 44 for positioning the component carrier C. With this configuration, the substrate W and the component carrier C can be positioned by the separate stages 42, 44, respectively.

[0214] Furthermore, in the bonding system 2 of this embodiment, the positioning stages 42, 44 are located below the first temporary placement stage 38 and the second temporary placement stage 40. With this configuration, it is possible to suppress the intrusion of particles.

[0215] Furthermore, in the bonding system 2 of this embodiment, the load module 4 includes a transport robot 24 (first transport robot) having a hand 28 (first hand) for holding a substrate W and a hand 32 (second hand) for holding a component carrier C, and a robot movement table 26 (first robot movement table) for moving the transport robot 24 in a Y-axis direction (second direction) that intersects with the X-axis direction (first direction) in a plan view. With this configuration, both the substrate W and the component carrier C can be transported by the transport robot 24.

[0216] Furthermore, in the bonding system 2 of this embodiment, the transport module 8 includes a transport robot 60 (second transport robot) having a hand 64 (third hand) for holding a substrate W and a hand 68 (fourth hand) for holding a component carrier C, and a robot transfer table 62 (second robot transfer table) for moving the transport robot 60 in the X-axis direction (first direction). With this configuration, both the substrate W and the component carrier C can be transported by the transport robot 60.

[0217] Furthermore, in the bonding system 2 of this embodiment, the surface treatment modules 10, 12, and 14 and the bonding device 18 are arranged on opposite sides of the movement path of the transfer module 8 along the X-axis direction (first direction). With this configuration, the transfer robot 60 is movable in the X-axis direction while rotating horizontally, thereby making it possible to easily transfer component carriers C and components P to the surface treatment modules 10, 12, and 14 and the bonding device 18 arranged on opposite sides of the movement path of the transfer module 8. Note that the number of surface treatment modules is not limited to three, and it is sufficient that at least one surface treatment module and one bonding device 18 are arranged on opposite sides of the movement path of the transfer module 8 along the X-axis direction.

[0218] In the bonding system 2 of this embodiment, the substrate W is a wafer, and the component carrier C is a tape frame. With this configuration, a bonding process can be performed in which a component P held on the tape frame is bonded to the wafer.

[0219] Furthermore, the bonding method of this embodiment includes the steps of using the loading module 4 to load a component carrier C holding a plurality of components P and a substrate W for bonding the plurality of components P; using the relay module 6 to load the component carrier C and the substrate W received from the loading module 4; using the transport module 8 to transport the component carrier C and the substrate W loaded on the relay module 6 along the X-axis direction (first direction); using surface treatment modules 10, 12, 14, and 16 to perform surface treatment on the plurality of components P held on the component carrier C and on the substrate W; and using the bonding device 18 to individually bond the plurality of surface-treated components P to the surface-treated substrate W, and the transport module 8 is one that transports the component carrier C and the substrate W between the surface treatment modules 10, 12, 14, and 16 and the bonding device 18.

[0220] According to this method, both the substrate W and the component carrier C can be transported by the transport module 8 and moved between the surface treatment modules 10, 12, 14, 16 and the bonding device 18, thereby realizing a bonding system 2 with high processing efficiency.

[0221] (Variations, etc.) In the above-described embodiment, the case where the substrate W is a wafer and the component carrier C is a tape frame is described, but this is not limited to such a case; the substrate W may be a substrate of a type other than a wafer, and the component carrier C may be a component carrier of a type other than a tape frame.

[0222] In the above embodiment, the three surface treatment modules 10, 12, and 14 are provided as the first surface treatment modules, but the number of first surface treatment modules is not limited to three and may be any number. Similarly, the one surface treatment module 16 is provided as the second surface treatment module, but the number of second surface treatment modules is not limited to one and may be any number.

[0223] Furthermore, the specific surface treatment methods (cleaning treatment, surface modification treatment, ultraviolet irradiation treatment) in the surface treatment modules 10, 12, 14, and 16 may be changed as appropriate depending on the specifications of the substrates W and components P. The surface treatment modules 10, 12, 14, and 16 are not limited to those capable of treating both substrates W and component carriers C, but may also be surface treatment modules dedicated to substrates or surface treatment modules dedicated to component carriers.

[0224] In the above embodiment, the layout of each module as shown in FIG. 1A is described. However, the present invention is not limited to this case, and the layout may be changed as appropriate, such as by changing the arrangement of the surface treatment modules 10, 12, 14, and 16.

[0225] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such variations and modifications should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they depart therefrom. Furthermore, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0226] The various modifications described above can be combined as appropriate to achieve the effects of each modification.

[0227] The present disclosure is applicable to a bonding system and bonding method for individually bonding multiple components held in a component carrier to a substrate.

[0228] 2 Bonding system 4 Carry-in module 6 Relay module 8 Transfer module 10, 12, 14, 16 Surface treatment module 18 Bonding device 19 Control unit 24 Transfer robot 26 Robot moving table 28 Hand 32 Hand 60 Transfer robot 62 Robot moving table 64 Hand 68 Hand C Component carrier P Component W Substrate

Claims

1. A bonding system comprising: an input module which inputs a component carrier holding a plurality of components and a substrate for bonding the plurality of components; a relay module which places the component carrier and the substrate received from the input module; a transport module which transports the component carrier and the substrate placed on the relay module along a first direction; a surface treatment module which performs surface treatment on the plurality of components held by the component carrier and surface treatment on the substrate; and a bonding device which individually bonds the plurality of surface-treated components to the surface-treated substrate, wherein the transport module transports the component carrier and the substrate between the surface treatment module and the bonding device.

2. A bonding system as described in claim 1, wherein the relay module has: a first temporary placement stage for placing the substrate; and a second temporary placement stage for placing the component carrier.

3. A bonding system as described in claim 2, wherein the first temporary placement stage has a first shelf for placing the substrate before use received from the loading module and a second shelf for placing the substrate after use with the multiple components bonded to it, and the second temporary placement stage has a third shelf for placing the component carrier before use received from the loading module and a fourth shelf for placing the component carrier after use from which the multiple components have been removed.

4. The bonding system of claim 3, wherein said first shelf is located below said second shelf and said third shelf is located below said fourth shelf.

5. A bonding system as described in claim 2, wherein the first temporary placement stage is configured to transfer the substrate to the transport module in a first transfer direction in a planar view, and the second temporary placement stage is configured to transfer the component carrier to the transport module in a second transfer direction in a planar view.

6. The bonding system described in claim 5, wherein the first temporary placement stage and the second temporary placement stage are arranged in a second direction intersecting the first direction in a planar view, and the first transfer direction and the second transfer direction each intersect with the first direction.

7. The bonding system according to claim 2, wherein said relay module further comprises a positioning stage for receiving said component carrier and said substrate from said transfer module and positioning them in a predetermined transfer direction.

8. The bonding system of claim 7, wherein the positioning stage comprises: a first positioning stage for positioning the substrate; and a second positioning stage for positioning the component carrier.

9. The bonding system according to claim 7, wherein the positioning stage is located below the first temporary placement stage and the second temporary placement stage.

10. The bonding system of claim 1, wherein the loading module comprises: a first transport robot having a first hand for holding the substrate and a second hand for holding the component carrier; and a first robot moving table for moving the first transport robot in a second direction intersecting the first direction in a planar view.

11. The bonding system of claim 1, wherein the transport module comprises: a second transport robot having a third hand for holding the substrate and a fourth hand for holding the component carrier; and a second robot moving table for moving the second transport robot in the first direction.

12. The bonding system of claim 11, wherein at least one of the surface treatment modules and the bonding device are disposed on opposite sides of a moving path of the transfer module along the first direction.

13. The bonding system of claim 1, wherein the substrate is a wafer and the component carrier is a tape frame.

14. A bonding method comprising: using an input module to input a component carrier holding a plurality of components and a substrate for bonding the plurality of components; using a relay module to place the component carrier and the substrate received from the input module; using a transport module to transport the component carrier and the substrate placed on the relay module along a first direction; using a surface treatment module to perform surface treatment on the plurality of components held by the component carrier and surface treatment on the substrate; and using a bonding device to individually bond the plurality of surface-treated components to the surface-treated substrate, wherein the transport module is one that transports the component carrier and the substrate between the surface treatment module and the bonding device.