Metal-ceramic composite components, electronic devices, and methods for manufacturing metal-ceramic composite components.

JPWO2025115998A1Pending Publication Date: 2025-06-05
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Patent Information

Application Number
JP2025560176
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2023-12-01
Filing Date
2024-11-29
Publication Date
2025-06-05
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Claims

1. A heat dissipation member having an upper surface and a lower surface opposite to the upper surface, and made of a metal sintered material, A ceramic body made of a ceramic material has, in the thickness direction, an opposing surface facing the upper surface of the heat dissipation member and a surface opposite to the opposing surface, An adhesive layer having a first interface in contact with the opposing surface of the ceramic body, and a second interface opposite to the first interface in contact with the upper surface of the heat dissipation member, Equipped with, A metal-ceramic composite component, wherein the adhesive layer is made of a composite material containing both ceramic and metal, the composite material is sintered with the ceramic material of the ceramic body at the first interface, and is sintered with the metal sintered material of the heat dissipation member at the second interface.

2. A metal-ceramic composite component according to Claim 1, The aforementioned metal-ceramic composite component is a package in which electronic components will be housed. The heat dissipation member has an outer wall surface connecting the upper surface and the lower surface. Metal-ceramic composite components.

3. A metal-ceramic composite component according to Claim 2, The package has a cavity in which the electronic component will be housed, The upper surface of the heat dissipation member faces the cavity, The ceramic body is a frame having an inner surface surrounding the cavity and an outer surface opposite to the inner surface. Metal-ceramic composite components.

4. A metal-ceramic composite component according to any one of claims 1 to 3, The metal-ceramic composite component comprises a metal sintered material which includes at least one high-melting-point metal selected from the group consisting of tungsten and molybdenum, and copper.

5. A metal-ceramic composite component according to claim 4, A metal-ceramic composite component in which the metal of the composite material of the adhesive layer comprises at least one high-melting-point metal selected from the group consisting of tungsten and molybdenum, and copper.

6. A metal-ceramic composite component according to claim 4, A metal-ceramic composite component comprising a metallized layer provided on the surface of the ceramic body, the metallized layer being made of a sintered material containing copper in a higher volume ratio compared to the metal sintered material of the heat dissipation member.

7. A metal-ceramic composite component according to claim 3, The composite material of the adhesive layer does not contain silver. A metal-ceramic composite component wherein the adhesive layer has an inner end extending into the cavity, and a space is provided in the thickness direction between the inner end of the adhesive layer and the opposing surface of the ceramic body or the upper surface of the heat dissipation member.

8. A metal-ceramic composite component according to claim 2 or 3, A metal-ceramic composite component in which the lower surface and the outer wall surface of the heat dissipation member form an obtuse angle.

9. A metal-ceramic composite component according to any one of claims 1 to 3, A metal-ceramic composite component wherein the lower surface of the heat dissipation member has a convex shape at the center of the heat dissipation member.

10. A metal-ceramic composite component according to claim 9, A metal-ceramic composite component wherein the lower surface of the heat dissipation member has a concave shape on the outer side of the central part.

11. A metal-ceramic composite component according to any one of claims 1 to 3, The aforementioned adhesive layer is a metal-ceramic composite component that does not contain silver.

12. A metal-ceramic composite component according to claim 3, A metal-ceramic composite component in which, in a cross-sectional view parallel to the thickness direction, the outer surface of the ceramic body has a lower end, the outer wall surface of the heat dissipation member has an upper end, and the positional displacement between the lower end and the upper end in a direction perpendicular to the thickness direction is within 0.1 mm.

13. A metal-ceramic composite component according to claim 3, A metal-ceramic composite component in which the corner formed by the surface and outer surface of the ceramic body has a radius of curvature of 0.1 mm or more and 0.5 mm or less.

14. A metal-ceramic composite component according to any one of claims 1 to 3, A metal-ceramic composite component further comprising a metal terminal provided on the surface of the ceramic body.

15. The metal-ceramic composite component according to claim 7, The electronic component housed within the cavity of the metal-ceramic composite component, A mounting material containing silver for mounting the aforementioned electronic component onto the aforementioned metal-ceramic composite component, An electronic device equipped with the following features.

16. A method for manufacturing a metal-ceramic composite component according to any one of claims 1 to 3, A step of forming a green structure by combining a first green member which will become the heat dissipation member by firing, a second green member which will become the ceramic body by firing, and a third green member which will become the adhesive layer by firing, The process of firing the aforementioned green structure, A method for manufacturing metal-ceramic composite parts, comprising the features described above.