Plasma processing device

JPWO2025126845A1Pending Publication Date: 2025-06-19
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Patent Information

Application Number
JP2025563407
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2023-12-12
Filing Date
2024-11-28
Publication Date
2025-06-19

AI Technical Summary

Technical Problem

Existing plasma processing apparatuses face challenges in suppressing the intrusion of particles between the inner and outer rings, which can damage the substrate and the edge rings.

Method used

The plasma processing apparatus incorporates a substrate support unit with an inner ring and an outer ring, where the substrate support surface is higher than the inner ring's upper surface, and a labyrinth structure is provided between the outer peripheral surface of the inner ring and the inner peripheral surface of the outer ring.

Benefits of technology

This configuration effectively suppresses the intrusion of particles between the inner and outer rings, protecting the substrate and maintaining the integrity of the plasma processing environment.

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Abstract

This plasma processing device comprises: a substrate support part for supporting a substrate to be processed; an inner ring supported by the substrate support part and provided on the lower side of the substrate; and an outer ring provided outside of the substrate and the inner ring. A substrate support surface, which supports the substrate, of the substrate support part is located higher than the upper surface of the inner ring. The inner peripheral surface of the outer ring is provided on the outside of the outermost periphery of the substrate. A labyrinth structure is provided between the outer peripheral surface of the inner ring and the inner peripheral surface of the outer ring.
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Citation Information

Patent Citations

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    JP2008244274A

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    JP2012146742A

  • Mounting table and plasma processing device

    JP2019220497A

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    JP2020519016A

  • Plasma processing device, plasma processing system, and method for aligning edge ring

    JP2022078522A