Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

JPWO2025127002A1Pending Publication Date: 2025-06-19
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Patent Information

Application Number
JP2025563487
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2023-12-11
Filing Date
2024-12-09
Publication Date
2025-06-19

AI Technical Summary

Technical Problem

In the manufacturing of printed wiring boards, there is a challenge in achieving both good followability of the photosensitive layer to substrate unevenness and adequate peelability of the cured photosensitive layer, as improving one often compromises the other.

Method used

A photosensitive resin composition is developed, comprising a binder polymer with structural units derived from acrylic acid, methacrylic acid, and additional units from (meth)acrylate compounds with alicyclic and aryl structures, which enhances both followability and peelability.

Benefits of technology

The photosensitive resin composition effectively balances followability and peelability, allowing for precise resist pattern formation and efficient manufacturing of printed wiring boards with improved substrate conformity.

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Abstract

A photosensitive resin composition according to one aspect of the present disclosure comprises a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer has a structural unit which is derived from acrylic acid and a structural unit which is derived from methacrylic acid.
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