Discharge device and discharge method

Abstract

A discharge device (1) comprises: a storage case (10) in which a photocurable material (M) is stored; a light source (30) that emits light (L); and a lens (40) that condenses the light (L) emitted from the light source (30).

Description

Discharge device and discharge method

[0001] The present disclosure relates to a dispensing device and a dispensing method.

[0002] Various techniques have been disclosed for ejection devices for ejecting photocurable materials. For example, a ejection device disclosed in Patent Document 1 includes a nozzle for ejecting the photocurable material and a light source for irradiating the photocurable material ejected from the nozzle with light. A light-shielding member for blocking the irradiated light is disposed around the nozzle in a position facing the light source.

[0003] Japanese Patent Application Laid-Open No. 2009-166008

[0004] For example, in the ejection device disclosed in Patent Document 1, when photocurable material is ejected three-dimensionally from a nozzle onto an object (such as a substrate), if the nozzle is brought closer to the object, the photocurable material ejected from the nozzle onto the object will come into contact with the light-shielding member arranged around the nozzle, resulting in the photocurable material becoming distorted and hardening in an uneven shape.

[0005] As described above, conventional discharge devices have had the problem that the discharged photocurable material is cured unevenly.

[0006] The present disclosure has been made in view of the above points, and an object thereof is to stably cure a photocurable material.

[0007] The discharge device according to the present disclosure comprises a storage case in which a photocurable material is stored, a light source that emits light, and a lens that focuses the light emitted from the light source, wherein the storage case is provided with a discharge hole through which the photocurable material is discharged, and the photocurable material stored in the storage case is positioned between the light source and the discharge hole, and the light emitted from the light source is focused by the lens and emitted from the discharge hole after passing through the photocurable material stored in the storage case.

[0008] The discharge method according to the present disclosure uses the discharge device to discharge the photocurable material from the discharge hole, while focusing the light with the lens and emitting it from the discharge hole through the photocurable material contained in the storage case.

[0009] According to the present disclosure, the photocurable material can be stably cured.

[0010] Fig. 1 shows a discharge device according to a first embodiment. Fig. 2 shows a discharge device according to a second embodiment. Fig. 3 shows a discharge device according to a third embodiment. Fig. 4 shows a discharge method according to a fourth embodiment.

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following description of the preferred embodiments is merely exemplary in nature and is not intended to limit the present disclosure, its applications, or its uses.

[0012] <First embodiment> (Discharge device) A discharge device 1 according to a first embodiment will be described. Fig. 1 shows a front view (partially in cross section) of the discharge device 1. The discharge device 1 is movable by a movement mechanism (not shown). The discharge device 1 includes a housing case 10, a light emission head 20, a light source 30, and a lens 40.

[0013] The storage case 10 is formed, for example, in the shape of a box that is open upward. The storage case 10 includes a horizontally extending bottom wall 11 and side walls (not shown) that rise upward from the edges of the bottom wall 11. The storage case 10 forms an internal space surrounded by the bottom wall 11 and the side walls. The bottom wall 11 and the side walls separate the internal space of the storage case 10 from the external space of the storage case 10.

[0014] A discharge hole 12 is provided in the bottom wall 11 of the storage case 10. The discharge hole 12 penetrates the bottom wall 11 from top to bottom. The discharge hole 12 connects the internal space of the storage case 10 with the external space of the storage case 10. The discharge hole 12 is also called a discharge nozzle. The shape of the storage case 10 can be changed as desired. For example, the bottom wall 11 may be inclined toward the discharge hole 12.

[0015] The storage case 10 contains a photocurable resin M as a photocurable material. In other words, the storage case 10 is filled with the photocurable resin M. The photocurable resin M is contained in an internal space surrounded by the bottom wall 11 and side walls of the storage case 10. The photocurable resin M is placed on the inner surface (upper surface) of the bottom wall 11 of the storage case 10.

[0016] The photocurable resin M is a resin that hardens (changes from a liquid to a solid) when exposed to light of a specific wavelength. The photocurable resin M is liquid when contained in the container case 10. As will be described later, the photocurable resin M is appropriately set to correspond to the wavelength of the light L from the light source 30.

[0017] The liquid surface Ma of the photocurable resin M contained in the internal space of the container 10 faces upward. The liquid surface Ma of the photocurable resin M can also be said to be the upper surface of the photocurable resin M.

[0018] The photocurable resin M contained in the internal space of the storage case 10 is discharged downward into the external space of the storage case 10 through a discharge hole 12 provided in the bottom wall 11 of the storage case 10 .

[0019] The light-emitting head 20 is formed, for example, in a box shape and includes a horizontally extending lower wall 21, a horizontally extending upper wall 22 disposed above the lower wall 21, and a side wall 23 vertically connecting an edge of the lower wall 21 and an edge of the upper wall 22.

[0020] An emission port 24 is provided in the lower wall 21 of the light emission head 20. The emission port 24 optically penetrates the lower wall 21 in the vertical direction. The emission port 24 connects the inside and outside of the light emission head 20. The emission port 24 provided in the lower wall 21 of the light emission head 20 is positioned above the discharge hole 12 in the lower wall 11 of the accommodating case 10 (and further above the liquid level Ma of the photocurable resin M accommodated in the accommodating case 10). The emission port 24 faces the liquid level Ma of the photocurable resin M accommodated in the accommodating case 10.

[0021] A gap H is provided between the emission port 24 of the lower wall 21 of the light emission head 20 and the liquid surface Ma of the photocurable resin M contained in the container case 10. An air layer (air gap) is formed in the gap H.

[0022] A light source 30 and a lens 40 are housed inside the light emission head 20. More specifically, the light source 30 and the lens 40 are housed in an internal space surrounded by a bottom wall 21, a top wall 22, and a side wall 23 of the light emission head 20. The light source 30 and the lens 40 housed in the light emission head 20 are disposed above the discharge hole 12 in the bottom wall 11 of the housing case 10 (and further above the liquid surface Ma of the photocurable resin M housed in the housing case 10). The light source 30 is a device that converts electricity into light (e.g., a laser oscillator). Alternatively, the light source 30 may be provided outside the light emission head 20, and light generated by the light source 30 may be transmitted to the light emission head 20 via an optical fiber or the like.

[0023] In the vertical direction, the photocurable resin M contained in the container case 10 is disposed between the light source 30 and the discharge hole 12 of the container case 10 .

[0024] The light source 30 emits light L. The light L is, for example, laser light. The light source 30 is, for example, a laser oscillator. Note that the term "light" is broadly understood to encompass all electromagnetic waves, not limited to visible light, but also including other wavelength ranges such as ultraviolet light and infrared light. The light L is preferably ultraviolet light or infrared light.

[0025] Inside the light emitting head 20, the light source 30 is disposed above the lens 40. The light source 30 faces the light outlet 24 via the lens 40.

[0026] The lens 40 condenses the light L emitted from the light source 30. In other words, the lens 40 converges the light L emitted from the light source 30. The lens 40 is, for example, a convex lens. Inside the light emission head 20, the lens 40 is disposed below the light source 30. The lens 40 is disposed between the light source 30 and the emission port 24. The lens 40 faces the emission port 24.

[0027] In the light emitting head 20, light L emitted from the light source 30 is condensed by the lens 40 and emitted downward through the emission port 24. The light L emitted downward from the emission port 24 of the light emitting head 20 passes through the photocurable resin M contained in the accommodating case 10, and is emitted downward from the discharge hole 12 in the bottom wall 11 of the accommodating case 10.

[0028] In summary, the light L emitted from the light source 30 is condensed by the lens 40 and passes through the photocurable resin M contained in the container case 10 before being emitted from the discharge hole 12 .

[0029] The convergence point P of the light L by the lens 40 is located below the discharge hole 12 in the bottom wall 11 of the casing 10. In other words, the convergence point P is located in the external space of the casing 10. The convergence point P is also called a focal point. The convergence point P is a point where the rays of the light L incident on the lens 40 from the light source 30 converge.

[0030] On the other hand, as described above, the light source 30 is located above the discharge hole 12 in the bottom wall 11 of the casing 10. In other words, the focal point P of the light L formed by the lens 40 is located on the opposite side of the discharge hole 12 in the bottom wall 11 of the casing 10 from the light source 30 in the vertical direction. The focal point P is located at the same position as the center of the discharge hole 12 in the horizontal direction. The focal point P faces the discharge hole 12.

[0031] (Discharge Method) A discharge method using the discharge device 1 will be described. In this discharge method, the discharge device 1 is used to discharge the photocurable resin M from the discharge hole 12, while condensing light L from the light source 30 with the lens 40 and emitting it from the discharge hole 12 through the photocurable resin M contained in the container case 10.

[0032] In this discharge method, the photocurable resin M is cured (changed from liquid to solid) by multiphoton absorption of light L at the focal point P by the lens 40. The curing of the photocurable resin M occurs only at the focal point P, which is located below the discharge hole 12 in the bottom wall 11 of the containing case 10 (in the external space of the containing case 10). The curing of the photocurable resin M does not occur in the internal space above the bottom wall 11 of the containing case 10. Only the photocurable resin M immediately after being discharged from the discharge hole 12 is cured by multiphoton absorption of light L at the focal point P.

[0033] Multiphoton absorption is a phenomenon in which two or more (a large number) photons are absorbed simultaneously. By generating light L with a high photon density by, for example, focusing (converging) light L (preferably laser light) with a lens 40, two or more (a large number) photons are absorbed simultaneously. As an example of multiphoton absorption, the phenomenon in which two photons are absorbed simultaneously is called two-photon absorption.

[0034] For example, suppose a material (such as a known ultraviolet curing resin, acrylic resin, or epoxy resin) that is suitably cured by high-energy ultraviolet light L is selected as the photocurable resin M. Simply irradiating low-energy infrared light L onto such photocurable resin M that is compatible with high-energy ultraviolet light will not cure the photocurable resin M that is compatible with the ultraviolet light.

[0035] However, even in the case of low-energy infrared light L, by concentrating the light L with a lens 40 to increase the energy density, the photocurable resin M, which is compatible with high-energy ultraviolet light, can be cured by multi-photon absorption of the light L.

[0036] In this discharge method, the photocurable resin M is cured by multiphoton absorption of light L focused by the lens 40 by the photocurable resin M only at the focal point P located below the discharge hole 12 in the bottom wall 11 of the storage case 10. On the other hand, in this discharge method, the photocurable resin M is not cured in the internal space above the bottom wall 11 of the storage case 10 because the light L is not multiphoton absorbed by the photocurable resin M. In other words, the photocurable resin M stored in the storage case 10 before being discharged is not cured.

[0037] In order to cure the photocurable resin M only at the focal point P by multiphoton absorption, the wavelength of the light L and the material of the photocurable resin M must be appropriately selected.

[0038] The photocurable resin M is preferably made of a material that transmits light L in order to suppress reflection of the light L. For example, when the wavelength of the light L is 500 nm to 1500 nm, the material of the photocurable resin M preferably transmits light L with a wavelength of 500 nm to 1500 nm and also absorbs light L with a wavelength of 200 nm to 450 nm.

[0039] It is preferable to use a multi-photon absorbing material (such as BTP-1 or IB-3) as the photo-curable resin M. It is preferable that the photo-curable resin M is a type that is cured by both light L and heat.

[0040] The diameter of the discharge hole 12 is preferably, for example, 20 μm to 250 μm.

[0041] The viscosity of the photocurable resin M is preferably about 3000 mPa·s to 6000 mPa·s.

[0042] In this discharge method, the photocurable resin M discharged from the discharge hole 12 of the storage case 10 has a central portion (in the horizontal direction) that hardens at the light condensing point P to become a hardened resin portion M1, and an outer peripheral portion (located on the outer periphery side of the central portion in the horizontal direction) that remains unhardened to become an unhardened resin portion M2. Note that the photocurable resin M stored in the storage case 10 is unhardened and is therefore the unhardened resin portion M2.

[0043] The cured photocurable resin M is used for, for example, surface bonding of liquid crystal panels, local adhesion of electronic components, gaskets, and the like.

[0044] (Effects) According to the discharge device 1 of this embodiment, light L emitted from the light source 30 is condensed by the lens 40, passes through the photocurable resin M contained in the storage case 10, and is emitted from the discharge hole 12 of the storage case 10. According to the discharge method of this embodiment, while the photocurable resin M is discharged from the discharge hole 12 of the storage case 10, light L is condensed by the lens 40, passes through the photocurable resin M contained in the storage case 10, and is emitted from the discharge hole 12 of the storage case 10.

[0045] The light L condensed by the lens 40 strikes the photocurable resin M near the discharge hole 12, so that the photocurable resin M is cured in a concentrated manner at the timing when it is discharged from the discharge hole 12.

[0046] For example, in the discharge device 1 according to this embodiment, it is not necessary to arrange a light-shielding member around the discharge hole 12. Therefore, when the photocurable resin M is three-dimensionally (stereoscopically) discharged from the discharge hole 12 onto a target object (such as a substrate W, see FIG. 4 ), it is possible to prevent the photocurable resin M discharged from the discharge hole 12 onto the target object from coming into contact with the light-shielding member.

[0047] This makes it possible to prevent the photocurable resin M discharged from the discharge hole 12 from being distorted and curing in an uneven shape. Even when the photocurable resin M is discharged three-dimensionally from the discharge hole 12 onto the target object, the photocurable resin M can be cured in a uniform shape by concentrating and curing the photocurable resin M in the vicinity of the discharge hole 12 (preferably only at the focal point P).

[0048] Furthermore, by concentrating and curing the photocurable resin M in the vicinity of the discharge hole 12 (preferably only at the focal point P), diffuse reflection from the object (e.g., the substrate W, see Figure 4) is suppressed, allowing the photocurable resin M to be cured in a uniform shape.

[0049] Furthermore, it is possible to prevent a difference in the irradiation time of light L between the photocurable resin M immediately after being discharged from the discharge hole 12 and the photocurable resin M some time after being discharged from the discharge hole 12. This prevents a difference in the degree of curing between the photocurable resin M immediately after being discharged from the discharge hole 12 and the photocurable resin M some time after being discharged from the discharge hole 12. This allows the photocurable resin M to be cured in a uniform shape.

[0050] In this way, the discharge device 1 according to this embodiment prevents the shape of the cured photocurable resin M from becoming unstable (uneven). As described above, the discharge device 1 and the discharge method according to this embodiment enable the photocurable resin M to be stably (uniformly) cured.

[0051] A focal point P of the light L by the lens 40 is located on the opposite side of the light source 30 with respect to the discharge hole 12 of the accommodating case 10. The light L immediately after being discharged from the discharge hole 12 of the accommodating case 10 can be concentrated at the focal point P and cured.

[0052] Since the discharge hole 12 is provided in the lower wall 11 of the storage case 10 and the light source 30 is arranged above the discharge hole 12 of the lower wall 11 of the storage case 10, the photocurable resin M can be smoothly discharged from the discharge hole 12 by gravity, making it easy to handle the discharge device 1.

[0053] By the principle of multiphoton absorption, the photocurable resin M can be cured only at the focal point P, and the photocurable resin M can be prevented from curing at any point other than the focal point P.

[0054] By concentrating and hardening the photo-curable resin M only at the light-converging point P, the photo-curable resin M is prevented from being hardened at any point other than the light-converging point P, and therefore the photo-curable resin M can be prevented from clogging the tip of the discharge hole 12 (nozzle) without being hardened.

[0055] Second Embodiment A discharge device 1 according to a second embodiment will be described. In the following description, the same components as those in the above embodiment will be denoted by the same reference numerals, and detailed description thereof will be omitted. Figure 2 shows a front view (partially in cross section) of the discharge device 1.

[0056] The liquid surface Ma of the photocurable resin M contained in the storage case 10 faces the emission port 24 of the light emission head 20 located above. A transparent material 50 is disposed between the emission port 24 of the light L in the lower wall 21 of the light emission head 20 and the liquid surface Ma of the photocurable resin M contained in the storage case 10. The transparent material 50 is disposed below the emission port 24 of the lower wall 21 of the light emission head 20 and above the liquid surface Ma of the photocurable resin M contained in the storage case 10.

[0057] The transparent material 50 is plate-shaped with its thickness in the vertical direction and extends horizontally. The transparent material 50 transmits light L. The transparent material 50 is made of, for example, transparent glass or transparent plastic. The lower surface of the transparent material 50 covers the liquid surface Ma of the photocurable resin M contained in the housing case 10, which faces the emission port 24 of the light emission head 20.

[0058] A gap H is provided between the lower surface of the lower wall 21 of the light emitting head 20 and the upper surface of the transmitting material 50 .

[0059] The other configurations are the same as those of the first embodiment.

[0060] Without the transparent material 50, unevenness occurs on the liquid surface Ma of the photocurable resin M contained in the container case 10. When unevenness occurs on the liquid surface Ma of the photocurable resin M, the refractive index of the light L becomes disturbed and unstable, and the focal point P of the lens 40 shifts in position and becomes unstable.

[0061] According to this embodiment, by covering the liquid surface Ma of the photocurable resin M contained in the container case 10 with the transparent material 50, it is possible to prevent the occurrence of unevenness on the liquid surface Ma of the photocurable resin M (to make the liquid surface Ma flat). This stabilizes the refractive index of the light L, thereby stabilizing the focal point P of the lens 40 and preventing the focal point P from shifting.

[0062] By suppressing the positional deviation of the light-converging point P, the photocurable resin M can be stably cured.

[0063] <Third embodiment> A discharge device 1 according to a third embodiment will be described. In the following description, the same components as those in the above embodiments will be denoted by the same reference numerals, and detailed description will be omitted. Figure 3 shows a front view (partially in cross section) of the discharge device 1 according to the third embodiment.

[0064] The light L emission port 24 in the lower wall 21 of the light emission head 20 is disposed below the liquid surface Ma of the photocurable resin M contained in the storage case 10. The light L emission port 24 in the lower wall 21 of the light emission head 20 is immersed in the photocurable resin M contained in the storage case 10 from above.

[0065] There is no gap H (air gap, see FIG. 1) between the emission port 24 of the lower wall 21 of the light emission head 20 and the liquid surface Ma of the photocurable resin M contained in the container case 10 .

[0066] The other configurations are the same as those of the first and second embodiments.

[0067] According to this embodiment, by immersing the exit port 24 of the light emitting head 20 in the photocurable resin M, it is possible to prevent a gap H (air gap) from being formed between the exit port 24 of the light emitting head 20 and the liquid surface Ma of the photocurable resin M.

[0068] This makes it possible to prevent the refractive index of the light L emitted from the emission port 24 of the light emission head 20 from changing and becoming distorted between the gap H (air gap) and the photocurable resin M. By stabilizing the refractive index of the light L, the focal point P formed by the lens 40 can be stabilized, and positional deviation of the focal point P can be prevented.

[0069] By suppressing the positional deviation of the light-converging point P, the photocurable resin M can be stably cured.

[0070] <Fourth embodiment> A discharge method according to the fourth embodiment will be described. In the following description, the same components as those in the above embodiments will be given the same reference numerals, and detailed description will be omitted. Figure 4 shows a front view (partially in cross section) of a discharge method using a discharge device 1.

[0071] A substrate W is placed on a stage (not shown). The substrate W is, for example, a semiconductor substrate. The substrate W extends horizontally with its thickness direction being the up-down direction. The top surface of the substrate W faces the discharge hole 12 in the bottom wall 11 of the accommodating case 10. An optical waveguide E is formed on the top surface of the substrate W. The optical waveguide E is a transmission path made of a material with optical properties and uses light for communication. The optical waveguide E is composed of a core E1 and a clad E2. For example, various semiconductor materials can be used as the optical waveguide E.

[0072] The optical waveguide E covers the upper surface of the substrate W. In the optical waveguide E, a core E1 is embedded inside a clad E2. In other words, in the optical waveguide E, the outer periphery of the core E1 is covered with the clad E2. At the end of the substrate W (the left end in FIG. 4 ), part of the clad E2 (the upper part in FIG. 4 ) is removed, exposing the core E1.

[0073] In this discharge method, an optical transmission path F is formed on a substrate W by using a photocurable resin M discharged from the discharge hole 12 of the accommodating case 10. The optical transmission path F is a transmission path for light. An example of the optical transmission path F is an optical fiber. The optical transmission path F is essentially the same type as the optical waveguide E. The optical transmission path F is composed of a core F1 and a cladding F2.

[0074] As described above, the photocurable resin M discharged from the discharge hole 12 of the storage case 10 hardens at the center at the focal point P to become a hardened resin portion M1, while the outer periphery remains unhardened and becomes an unhardened resin portion M2.

[0075] The photocurable resin M discharged from the discharge hole 12 of the accommodating case 10 is applied to the substrate W so as to connect to the gap (the portion where the core E1 is exposed) of the optical waveguide E. The cured resin portion M1 at the center of the discharged photocurable resin M corresponds to the core F1 of the optical transmission path F. The uncured resin portion M2 at the periphery of the discharged photocurable resin M corresponds to the cladding F2 of the optical transmission path F.

[0076] A cured resin portion M1 at the center of the photocurable resin M is connected to a core E1 of the optical waveguide E in the substrate W, and becomes a core F1 of the optical transmission path F. An uncured resin portion M2 at the periphery of the photocurable resin M is connected to a clad E2 of the optical waveguide E in the substrate W, and becomes a clad F2 of the optical transmission path F after undergoing curing, which will be described later.

[0077] The uncured resin portion M2 of the photocurable resin M connected to the cladding E2 of the optical waveguide E in the substrate W is cured by being irradiated with external light G from diagonally above and to the side, thereby becoming the cladding F2 of the optical transmission line F. The wavelength of the external light G is preferably different from the wavelength of the light L from the light source 30. Heat may be used instead of the external light G.

[0078] One optical waveguide E and another optical waveguide E may be connected to each other via an optical transmission line F. The optical waveguide E may be connected to an external optical fiber or the like via the optical transmission line F.

[0079] The other configurations are the same as those of the first embodiment.

[0080] According to this embodiment, the optical transmission path F can be suitably formed on the substrate W using the discharge device 1 .

[0081] <Other Embodiments> Although the present disclosure has been described above with reference to preferred embodiments, these descriptions are not limiting and, of course, various modifications, substitutions, and combinations are possible.

[0082] The light source 30 and the lens 40 may be arranged separately from each other rather than being housed in the light emitting head 20. For example, the lens 40 may be arranged outside the light emitting head 20.

[0083] The focal point P of the light L formed by the lens 40 may be located in the internal space of the casing 10 rather than in the external space.

[0084] The light L is not limited to laser light. The wavelength of the light L is not limited to the exemplified values. The photocurable material M is not limited to the exemplified ones (it may not be a resin depending on the conditions). The transparent material 50 is not limited to the exemplified ones.

[0085] The principle of multiphoton absorption does not necessarily have to be used.

[0086] For example, the discharge hole 12 may be provided in the side wall of the accommodating case 10 and the light source 30 may be disposed laterally of the discharge hole 12 in the side wall of the accommodating case 10 .

[0087] The present disclosure does not preclude the discharging device 1 from being provided with a light-shielding member. The discharging device 1 may be provided with a light-shielding member.

[0088] The ejection method using the ejection device 1 is not limited to the example shown, and various applications are possible.

[0089] The present disclosure is applicable to a discharge device and a discharge method, and is therefore extremely useful and has high industrial applicability.

[0090] M Photocurable resin (photocurable material) Ma Liquid surface (surface) M1 Cured resin portion M2 Uncured resin portion L Light P Focusing point H Gap W Substrate E Optical waveguide E1 Core E2 Clad F Optical transmission path F1 Core F2 Clad G External light 1 Discharge device 10 Storage case 11 Bottom wall 12 Discharge hole 20 Light emission head 21 Bottom wall 22 Top wall 23 Side wall 24 Emission port 30 Light source 40 Lens 50 Transmitting material

Claims

1. An ejection device comprising: a storage case in which a photocurable material is stored; a light source that emits light; and a lens that collects the light emitted from the light source, wherein the storage case is provided with an ejection hole through which the photocurable material is ejected, the photocurable material contained in the storage case is disposed between the light source and the ejection hole, and the light emitted from the light source is collected by the lens and emitted from the ejection hole after passing through the photocurable material contained in the storage case.

2. The discharge device according to claim 1, wherein the point at which the light is focused by the lens is located on the opposite side of the discharge hole from the light source.

3. The ejection device according to claim 1 or 2, further comprising a light emission head in which the light source is housed, the light emission port of the light emission head being immersed in the photocurable material housed in the housing case.

4. An ejection device as described in claim 1 or 2, comprising a light emission head in which the light source is housed, a transparent material that transmits the light is disposed between the light emission port of the light emission head and the photocurable material housed in the storage case, and the transparent material covers a surface of the photocurable material housed in the storage case that faces the emission port.

5. The discharge device according to claim 1 or 2, wherein the discharge hole is provided in a bottom wall of the container case, and the light source is disposed above the discharge hole.

6. A discharge method using the discharge device according to claim 1 or 2, comprising: discharging the photocurable material from the discharge hole while condensing the light with the lens and emitting the light from the discharge hole through the photocurable material contained in the storage case.

7. The ejection method according to claim 6, wherein the photocurable material is cured by multiphoton absorption of the light at a focal point of the lens.

8. The discharge method according to claim 6, wherein an optical transmission path is formed on a substrate by the photocurable material discharged from the discharge hole.