Photosensitive resin composition, cured product, partition wall, organic electroluminescent element, color filter, image display device, and method for forming cured product

Abstract

The present invention provides a photosensitive resin composition which has high liquid repellency and good ink jet wet spreadability. A photosensitive resin composition according to the present invention comprises (A) a photopolymerizable compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a silicon-containing copolymer resin. The photopolymerization initiator (B) contains (B1) an oxime ester compound, and the silicon-containing copolymer resin (D) contains a repeating unit (D1) that contains a specific structure and an ethylenically unsaturated group (D2) in a side chain.

Description

Photosensitive resin composition, cured product, partition wall, organic electroluminescent device, color filter, image display device, and method for forming the cured product

[0001] The present invention relates to a photosensitive resin composition, a cured product, a partition wall, an organic electroluminescent device, a color filter, an image display device, and a method for forming the cured product. This application claims priority based on Japanese Patent Application No. 2024-037179, filed on March 11, 2024, the contents of which are incorporated herein by reference.

[0002] In recent years, color filters in which pixels are formed using luminescent nanocrystalline particles such as quantum dots have been investigated in order to reduce the power consumption and expand the color gamut of displays. Color filters can be manufactured using photolithography or inkjet printing, with the latter method known to reduce ink material waste (see, for example, Patent Document 1). When manufacturing a color filter containing luminescent nanocrystalline particles using inkjet printing, pixels are formed by ejecting ink containing luminescent nanocrystalline particles into areas (pixel portions) surrounded by pre-prepared partition walls. Organic electroluminescent elements used in organic electroluminescent displays and the like are manufactured by forming partition walls (banks) on a substrate and then stacking various functional layers within the areas surrounded by the partition walls. The inkjet printing is a known method for stacking functional layers within the partition walls. Both the partition walls for color filters containing luminescent nanocrystalline particles and the partition walls for organic electroluminescent elements must prevent inks from mixing with each other between adjacent pixel portions when inks are ejected by inkjet printing, and therefore require high liquid repellency (liquid repellency). Patent Document 2 describes a colored photosensitive resin composition that exhibits high liquid repellency and excellent linearity when two specific alkali-soluble resins are used in combination to form liquid-repellent partition walls by photolithography. Typically, when forming such partition walls by photolithography, the final pattern is formed through a post-development thermal baking step at 200°C or higher for 15 minutes or more. The examples in Patent Document 2 also describe heat curing in an oven at 230°C for 30 minutes. Meanwhile, efforts to lower the temperature and shorten the thermal baking step have been pursued to reduce production costs and accommodate substrates with limited heat resistance, such as plastic substrates. Photosensitive resin compositions that exhibit comparable performance even when baked at a lower temperature or for a shorter time than conventional methods are needed. To meet these performance requirements, methods using blocked isocyanates (e.g., Patent Document 3) and methods combining an epoxy-containing material with a thermally activated delayed-release fluorescent compound (e.g., Patent Document 4) are known. These documents describe in the examples that the required performance was obtained even when the thermal baking step was carried out at 150° C., but do not specifically mention liquid repellency.Furthermore, in order to prevent ink bleeding and color mixing, a method has been proposed in which a vinyl polymer having a crosslinkable functional group and a polyorganosiloxane chain is used as a liquid repellent (for example, Patent Document 5), and it is described that this method can achieve both ink repellency for the partition walls and prevention of coating defects.

[0003] Japanese Patent Publication No. 2019-86745 International Publication No. 2019 / 146685 Japanese Patent No. 5708313 Japanese Patent Publication No. 2020-30290 Japanese Patent No. 4221964

[0004] In recent years, fluorine-based liquid repellents, which tend to exhibit high liquid repellency, have traditionally been used to apply liquid repellents to partition walls. However, in recent years, there has been a growing trend toward regulating organic fluorine compounds (PFAS) due to concerns about their persistence and ecotoxicity, and there has been a demand for the establishment of partition wall materials that use silicone resin-based liquid repellents. The inventors' investigations have revealed that when the polymer having a polyorganosiloxane chain described in Patent Document 5 is used, sufficient wetting and spreading cannot be ensured, which makes it easy for coating defects to occur.

[0005] Therefore, an object of the present invention is to provide a photosensitive resin composition that uses a specific silicon-containing resin and that can achieve both sufficient liquid repellency and inkjet wetting and spreading properties for the partition walls regardless of the type of ink. Another object of the present invention is to provide a cured product that has high liquid repellency and excellent inkjet wetting and spreading properties, partition walls composed of the cured product, an organic electroluminescent device that includes the partition walls, a color filter that includes the partition walls, and an image display device that includes the partition walls.

[0006] As a result of extensive investigations, the present inventors have found that the above-mentioned problems can be solved by using an alkali-soluble resin containing a specific resin in a photosensitive resin composition containing a liquid repellent agent, and have thus completed the present invention.

[0007] [1] A photosensitive resin composition comprising (A) a photopolymerizable compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a silicon-containing copolymer resin, wherein the (B) photopolymerization initiator comprises (B1) an oxime ester compound, and the (D) silicon-containing copolymer resin comprises repeating units (D1) and (D2). Repeating unit (D1): a repeating unit comprising the following general formula (d1). Repeating unit (D2): a repeating unit comprising an ethylenically unsaturated group in a side chain.

[0008]

[0009] R １ , R ２ , R ３ are each independently an alkyl group having 1 to 3 carbon atoms. * represents a bond. [2] The photosensitive resin composition of [1], wherein the repeating unit (D1) in the silicon-containing copolymer resin (D) is represented by the following general formula (d1-1):

[0010]

[0011] R １ , R ２ , R ３ are each independently an alkyl group having 1 to 3 carbon atoms. ４ represents a hydrogen atom or a methyl group. １ represents a divalent organic group. [3] The photosensitive resin composition according to [1], wherein the repeating unit (D2) is represented by the following general formula (d2):

[0012]

[0013] R ｄｂ１ , R ｄｃ１ R each independently represents a hydrogen atom or a methyl group. ｄｂ２ , R ｄｃ２ each independently represents an alkylene group which may have a substituent, or an arylene group which may have a substituent. ２represents a divalent organic group. * represents a bond. [4] The photosensitive resin composition of [1] further containing a polyfunctional thiol compound. [5] The photosensitive resin composition of [1] further containing a colorant. [6] The photosensitive resin composition of [1], wherein the content of the silicon-containing copolymer resin (D) relative to the total solid content of the photosensitive resin composition is 0.01 mass % or more and 3 mass % or less. [7] The photosensitive resin composition of [1] for use in baking at 180°C or less. [8] A cured product obtained by curing the photosensitive resin composition of any of [1] to [7]. [9] A partition wall composed of the cured product of [8].

[10] An organic electroluminescent device comprising the partition wall of [9].

[11] A color filter comprising the partition wall of [9] and further containing luminescent nanocrystalline particles.

[12] An image display device comprising the partition wall of [9].

[13] A method for forming a cured product using the photosensitive resin composition of any one of [1] to [7], comprising at least the following steps (1) to (4): Step (1): A step of applying the photosensitive resin composition of any one of [1] to [7] onto a substrate to form a coating film. Step (2): A step of exposing at least a portion of the coating film formed in step (1). Step (3): A step of developing the coating film exposed in step (2). Step (4): A step of baking the coating film developed in step (3).

[14] The method for forming a cured product of

[13] , wherein the baking temperature in step (4) is 180°C or less.

[15] The method for forming a cured product of

[13] , comprising, after step (3), a post-exposure step of exposing the coating film developed in step (3).

[0014] According to the present invention, a photosensitive resin composition having high liquid repellency and good ink-jet wetting and spreading properties can be provided.

[0015] Fig. 1 is a schematic diagram showing the evaluation criteria for inkjet wetting and spreading properties, and Fig. 2 is a schematic cross-sectional view of an example of a color filter having partition walls of the present invention.

[0016] The present invention will be described in detail below. Note that the following description is merely an example of an embodiment of the present invention, and the present invention is not limited to these embodiments without departing from the gist of the present invention. In the present invention, the following terms have the following meanings. "(Meth)acrylic" means "either acrylic or methacrylic, or both." "Total solid content of a photosensitive resin composition" means the amount of all components in the photosensitive resin composition other than the solvent. Even if components other than the solvent are liquid at room temperature, these components are not included in the solvent but are included in the total solid content. A numerical range expressed using "to" means a range including the numerical values ​​before and after "to" as the lower and upper limits. "(Co)polymer" means both a single polymer (homopolymer) and a copolymer. "(Acid) anhydride" and "(anhydrous)...acid" mean both an acid and its anhydride. "Partition material" refers to a bank material, a wall material, or a wall material. "Partition wall" refers to a bank, a wall, or a wall. "Weight average molecular weight" refers to the weight average molecular weight (Mw) calculated in terms of polystyrene by gel permeation chromatography (GPC). "Acid value" refers to the acid value calculated in terms of effective solid content, unless otherwise specified, and is calculated by neutralization titration.

[0017] In the present invention, the partition wall can be used, for example, to partition a functional layer (organic layer, light-emitting portion) in an active-drive organic electroluminescent device, and can be used to form, for example, pixels including a functional layer and a partition wall by discharging and drying an ink that is a material for constituting the functional layer into the partitioned region (pixel region).Furthermore, the partition wall can be used to partition a pixel portion in a color filter that contains luminescent nanocrystalline particles, and can be used to form pixels by discharging and drying an ink into the partitioned region.

[0018] [1] Photosensitive Resin Composition The photosensitive resin composition of the present invention contains (A) a photopolymerizable compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a silicon-containing copolymer resin. If necessary, the photosensitive resin composition may further contain other components, such as a solvent, (E) a colorant, and (F) a dispersant.

[0019] [1-1] Components and Composition of Photosensitive Resin Composition The components constituting the photosensitive resin composition of the present invention and their composition will be described.

[0020] [1-1-1] (A) Photopolymerizable Compound The photosensitive resin composition of the present invention contains (A) a photopolymerizable compound. It is believed that the inclusion of (A) a photopolymerizable compound increases the curability of the coating film and improves its liquid repellency. The photopolymerizable compound refers to a compound having one or more ethylenically unsaturated bonds in the molecule. For example, a compound having two or more ethylenically unsaturated bonds in the molecule is preferred in terms of increasing the polymerizability, crosslinkability, and the associated difference in developer solubility between exposed and unexposed areas. The ethylenically unsaturated bond is preferably derived from a (meth)acryloyloxy group, and the photopolymerizable compound is more preferably a (meth)acrylate compound.

[0021] In the present invention, it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds per molecule. The number of ethylenically unsaturated groups in the polyfunctional ethylenic monomer is not particularly limited, but is preferably two or more, more preferably three or more, even more preferably five or more, and is preferably 15 or less, more preferably 10 or less, even more preferably eight or less, and particularly preferably seven or less. The above upper and lower limits can be arbitrarily combined. For example, 2 to 15 is preferred, 2 to 10 is more preferred, 3 to 8 is even more preferred, and 5 to 7 is particularly preferred. By setting the number at or above the lower limit, polymerizability tends to be improved and liquid repellency tends to be enhanced. By setting the number at or below the upper limit, developability tends to be better.

[0022] Examples of the photopolymerizable compound include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; and esters obtained by an esterification reaction between polyhydric hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds and unsaturated carboxylic acids and polybasic carboxylic acids.

[0023] Examples of esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters of aliphatic polyhydroxy compounds such as ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate; methacrylic acid esters in which the acrylate of these exemplary compounds is replaced with methacrylate; itaconic acid esters in which the acrylate of these exemplary compounds is replaced with itaconate; crotonate esters in which the acrylate of these exemplary compounds is replaced with crotonate; and maleic acid esters in which the acrylate of these exemplary compounds is replaced with maleate.

[0024] Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, and pyrogallol triacrylate.

[0025] Esters obtained by the esterification reaction of polyvalent hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polybasic carboxylic acids are not necessarily single compounds, but examples thereof include condensates of acrylic acid, phthalic acid, and ethylene glycol, condensates of acrylic acid, maleic acid, and diethylene glycol, condensates of methacrylic acid, terephthalic acid, and pentaerythritol, and condensates of acrylic acid, adipic acid, butanediol, and glycerin.

[0026] Other useful polyfunctional ethylenic monomers include, for example, urethane (meth)acrylates obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; epoxy acrylates such as addition reaction products of a polyfunctional epoxy compound with a hydroxyl (meth)acrylate or (meth)acrylic acid; acrylamides such as ethylene bisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate.

[0027] Examples of urethane (meth)acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, and UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, and UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), and UV-1700B, UV-7600B, UV-7605B, UV-7630B, and UV-7640B (manufactured by Mitsubishi Chemical Corporation).

[0028] From the viewpoints of adhesion of the partition walls to the substrate, liquid repellency, and inkjet wetting and spreading properties, it is preferable to use an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid or a urethane (meth)acrylate as the (A) photopolymerizable compound, and it is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol tetra(meth)acrylate, 2-tris(meth)acryloyloxymethylethyl phthalate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, a dibasic acid anhydride adduct of dipentaerythritol penta(meth)acrylate, or a dibasic acid anhydride adduct of pentaerythritol tri(meth)acrylate. One type of (A) photopolymerizable compound may be used alone, or two or more types may be used in combination.

[0029] The molecular weight of the photopolymerizable compound (A) is not particularly limited, but from the viewpoint of liquid repellency and the formation of high-definition partition walls with narrow line widths, it is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, still more preferably 300 or more, particularly preferably 400 or more, and most preferably 500 or more, and is preferably 1000 or less, more preferably 700 or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 100 to 1000, more preferably 150 to 1000, even more preferably 200 to 1000, even more preferably 300 to 700, still more preferably 400 to 700, and particularly preferably 500 to 700.

[0030] The number of carbon atoms in the (A) photopolymerizable compound is not particularly limited, but from the viewpoint of liquid repellency and residue suppression, it is preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, still more preferably 20 or more, particularly preferably 25 or more, and preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, particularly preferably 30 or less. The above upper and lower limits can be arbitrarily combined. For example, 7 to 50 is preferred, 10 to 50 is more preferred, 15 to 40 is even more preferred, 20 to 35 is even more preferred, and 25 to 30 is particularly preferred.

[0031] From the viewpoints of liquid repellency, inkjet wetting and spreading properties, and the ability to form highly precise partition walls with narrow line widths, ester (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates are preferred, and trifunctional or higher functional ester (meth)acrylates such as pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and dipentaerythritol penta(meth)acrylate, and adducts of acid anhydrides to trifunctional or higher functional ester (meth)acrylates such as 2,2,2-tris(meth)acryloyloxymethylethyl phthalate and dibasic acid anhydride adducts of dipentaerythritol penta(meth)acrylate are more preferred.

[0032] From the viewpoint of improving the penetration resistance of the partition walls, it is preferable to use ester (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates having one or more hydroxyl groups in the molecule, and examples thereof include pentaerythritol tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol mono(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, More preferred are pentaerythritol di(meth)acrylate, a glycidyl (meth)acrylate adduct to glycerol (number of additions: 1 to 3), a glycidyl (meth)acrylate adduct to pentaerythritol (number of additions: 1 to 4), a glycidyl (meth)acrylate adduct to dipentaerythritol (number of additions: 1 to 6), a glycidyl (meth)acrylate adduct to sorbitol (number of additions: 1 to 6), a glycidyl acrylate adduct to 3-butene-1,2-diol (number of additions: 2), a reaction product of a diglycidylated bisphenol compound with (meth)acrylic acid, and an alkylene oxide-modified product thereof.

[0033] The hydroxyl group equivalent of the photopolymerizable compound (A) is preferably 1200 g / mol or less, more preferably 800 g / mol or less, even more preferably 400 g / mol or less, even more preferably 350 g / mol or less, and particularly preferably 300 g / mol or less, and is preferably 100 g / mol or more, more preferably 150 g / mol or more, even more preferably 200 g / mol or more, and particularly preferably 225 g / mol or more. The above upper and lower limits can be arbitrarily combined. For example, 100 to 1200 g / mol is preferred, 150 to 600 g / mol is more preferred, 200 to 400 g / mol is even more preferred, 225 to 350 g / mol is even more preferred, and 225 to 300 g / mol is particularly preferred. By setting the hydroxyl group equivalent at or below the upper limit, developability and penetration resistance of the partition walls tend to be improved, while by setting the hydroxyl group equivalent at or above the lower limit, liquid repellency tends to be improved.

[0034] The content of the photopolymerizable compound (A) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, and even more preferably 15% by mass or more, relative to the total solid content of the photosensitive resin composition. It is also preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 60% by mass or less, and even more preferably 50% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 80% by mass is preferred, 5 to 80% by mass is more preferred, 10 to 70% by mass is even more preferred, 15 to 60% by mass is even more preferred, and 15 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, liquid repellency tends to be improved. By setting the content at or below the upper limit, inkjet wetting and spreading properties are improved, and high-definition partition walls with narrow line widths tend to be formed.

[0035] The content ratio of the photopolymerizable compound (A) relative to 100 parts by mass of the alkali-soluble resin (C) is not particularly limited, but is preferably at least 1 part by mass, more preferably at least 5 parts by mass, even more preferably at least 10 parts by mass, even more preferably at least 15 parts by mass, particularly preferably at least 20 parts by mass, even more particularly preferably at least 25 parts by mass, and most preferably at least 30 parts by mass, and is preferably at most 200 parts by mass, more preferably at most 180 parts by mass, even more preferably at most 160 parts by mass, even more preferably at most 140 parts by mass, and particularly preferably at most 120 parts by mass. The above upper and lower limits can be arbitrarily combined. For example, 1 to 200 parts by mass is preferred, 5 to 180 parts by mass is more preferred, 10 to 160 parts by mass is even more preferred, 15 to 140 parts by mass is even more preferred, 20 to 125 parts by mass is particularly preferred, 30 to 125 parts by mass is particularly preferred, and 50 to 105 parts by mass is most preferred. By adjusting the content to be at least the above lower limit, liquid repellency tends to be improved. By ensuring that the content is equal to or less than the upper limit, inkjet wetting and spreading properties become good, and it tends to be possible to form highly precise partition walls with narrow line widths.

[0036] [1-1-2] (B) Photopolymerization Initiator The photosensitive resin composition of the present invention contains (B) a photopolymerization initiator. In the photosensitive resin composition of the present invention, the (B) photopolymerization initiator contains at least (B1) an oxime ester compound.

[0037] [1-1-2-1] (B1) Oxime Ester Compound As a photopolymerization initiator, an oxime ester compound is particularly effective in terms of sensitivity, adhesion, and patterning properties. Oxime ester compounds have a high quantum yield of photoreaction and generate highly active radicals. Therefore, even a small amount of an oxime ester compound provides high sensitivity and is stable against thermal reactions, making it possible to obtain a highly sensitive photosensitive resin composition with a small amount.

[0038] Examples of the oxime ester compound include compounds represented by the following general formula (b1).

[0039]

[0040] In formula (b1), R e21a represents a hydrogen atom, an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. e21b represents an aromatic ring which may have a substituent, or a heterocyclic ring which may have a substituent. e22a represents an alkanoyl group which may have a substituent or an aroyl group which may have a substituent, and n represents an integer of 0 or 1.

[0041] R e21aThe number of carbon atoms in the alkyl group in the formula (I) is not particularly limited, but from the viewpoints of solubility in solvents and sensitivity, it is preferably 1 or more, more preferably 2 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a cyclopentylmethyl group, a cyclopentylethyl group, and a cyclohexylmethyl group. Examples of the substituent that the alkyl group may have include an aromatic ring group, a hydroxyl group, a carboxy group, a halogen atom, an amino group, an amide group, a 4-(2-methoxy-1-methyl)ethoxy-2-methylphenyl group, an N-acetyl-N-acetoxyamino group, a methoxycarbonyl group, and an ethoxycarbonyl group. From the viewpoint of ease of synthesis, it is preferably unsubstituted, and from the viewpoints of sensitivity and liquid repellency, a methoxycarbonyl group or an ethoxycarbonyl group is preferred.

[0042] R e21a Examples of the aromatic ring group in include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is not particularly limited, but is preferably 5 or more from the viewpoint of solubility in the photosensitive resin composition. Furthermore, from the viewpoint of developability, the number of carbon atoms is preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less. For example, 5 to 30 is preferred, more preferably 5 to 20, and even more preferably 5 to 12.

[0043] Examples of the aromatic ring group include a phenyl group, a naphthyl group, a pyridyl group, and a furyl group. From the viewpoint of developability, a phenyl group and a naphthyl group are preferred, and a phenyl group is more preferred. Examples of the substituent that the aromatic ring group may have include a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, an alkyl group, an alkoxy group, and a group in which these substituents are linked, and from the viewpoint of developability, an alkyl group, an alkoxy group, and a group in which these are linked are preferred, and linked alkoxy groups are more preferred. From the viewpoint of sensitivity, R e21a is preferably an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent.

[0044] R e21bAs the alkyl group, an optionally substituted carbazolyl group, an optionally substituted thioxanthonyl group, an optionally substituted diphenyl sulfide group, an optionally substituted fluorenyl group, or an optionally substituted indolyl group is preferred. From the viewpoint of sensitivity, an optionally substituted carbazolyl group is more preferred.

[0045] R e22a The number of carbon atoms in the alkanoyl group in the formula (I) is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 2 or more, and preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and still more preferably 5 or less. For example, 2 to 20 is preferred, 2 to 15 is more preferred, 2 to 10 is even more preferred, and 2 to 5 is even more preferred. Examples of the alkanoyl group include an acetyl group, a propanoyl group, and a butanoyl group. Examples of the substituent that the alkanoyl group may have include an aromatic ring group, a hydroxyl group, a carboxy group, a halogen atom, an amino group, and an amide group. From the viewpoint of ease of synthesis, it is preferably unsubstituted.

[0046] R e22a The number of carbon atoms in the aroyl group in the formula (I) is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 7 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 7 to 20 is preferred, 7 to 15 is more preferred, and 7 to 10 is even more preferred. Examples of the aroyl group include a benzoyl group and a naphthoyl group. Examples of the substituent that the aroyl group may have include a hydroxyl group, a carboxy group, a halogen atom, an amino group, an amide group, and an alkyl group. From the viewpoint of ease of synthesis, it is preferably unsubstituted.

[0047] From the viewpoint of sensitivity, R e22a is preferably an alkanoyl group which may have a substituent, more preferably an unsubstituted alkanoyl group, and even more preferably an acetyl group.

[0048] For example, Japanese Patent No. 4454067, International Publication No. 2002 / 100903, International Publication No. 2012 / 45736, International Publication No. 2015 / 36910, International Publication No. 2006 / 18973, International Publication No. 2008 / 78678, Japanese Patent No. 4818458, International Publication No. 2005 / 80338, International Publication No. Photopolymerization initiators described in WO 2008 / 75564, WO 2009 / 131189, WO 2010 / 133077, WO 2010 / 102502, WO 2012 / 68879, WO 2021 / 175855, and JP 2016-133574 can be used.

[0049] [1-1-2-2] Photopolymerization initiators other than oxime ester compounds

[0050] The photosensitive resin composition of the present invention may contain a photopolymerization initiator other than the oxime ester compound (B1). Examples of the photopolymerization initiator include metallocene compounds including titanocene compounds described in JP-A-59-152396 and JP-A-61-151197, hexaarylbiimidazole derivatives described in JP-A-2000-56118, halomethyl-s-triazine derivatives described in JP-A-10-39503, halomethylated oxadiazole derivatives, halomethyl-s-triazine derivatives, N-aryl-α-amino acids such as N-phenylglycine, N-aryl-α-amino acid salts, radical activators such as N-aryl-α-amino acid esters, and α-aminoalkylphenone derivatives.

[0051] Examples of the metallocene compound include dicyclopentadienyltitanium dichloride, dicyclopentadienyltitanium bisphenyl, dicyclopentadienyltitanium bis(2,3,4,5,6-pentafluorophenyl), dicyclopentadienyltitanium bis(2,3,5,6-tetrafluorophenyl), dicyclopentadienyltitanium bis(2,4,6-trifluorophenyl), dicyclopentadienyltitanium di(2,6-difluorophenyl), dicyclopentadienyltitanium di(2,4-difluorophenyl), di(methylcyclopentadienyl)titanium bis(2,3,4,5,6-pentafluorophenyl), di(methylcyclopentadienyl)titanium bis(2,6-difluorophenyl), and dicyclopentadienyltitanium[2,6-difluoro-3-(pyrrol-1-yl)-phenyl].

[0052] Examples of biimidazole derivatives include 2-(2'-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-chlorophenyl)-4,5-bis(3'-methoxyphenyl)imidazole dimer, 2-(2'-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-methoxyphenyl)-4,5-diphenylimidazole dimer, and (4'-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0053] Examples of halomethylated oxadiazole derivatives include 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-(6''-benzofuryl)vinyl)]-1,3,4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole.

[0054] Examples of halomethyl-s-triazine derivatives include 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine.

[0055] Examples of α-aminoalkylphenone derivatives include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one, and 3,6-bis(2-methyl-2-morpholinopropionyl)-9-octylcarbazole.

[0056] The photopolymerization initiator (B1) other than the oxime ester compound may be used alone or in combination of two or more.

[0057] The content of the (B) photopolymerization initiator in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, even more preferably 2% by mass or more, and particularly preferably 3% by mass or more, relative to the total solids content of the photosensitive resin composition. It is also preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, even more preferably 12% by mass or less, particularly preferably 10% by mass or less, and most preferably 8% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 25% by mass is preferred, 0.01 to 20% by mass is more preferred, 0.1 to 15% by mass is even more preferred, 1 to 10% by mass is even more preferred, 2 to 8% by mass is particularly preferred, and 3 to 8% by mass is particularly preferred. By setting the content at or above the lower limit, liquid repellency tends to be improved. By setting the content at or below the upper limit, residue tends to be reduced.

[0058] The content of the oxime ester compound (B1) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, even more preferably 2% by mass or more, and particularly preferably 3% by mass or more, relative to the total solids content of the photosensitive resin composition. It is also preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, even more preferably 12% by mass or less, particularly preferably 10% by mass or less, and most preferably 8% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 25% by mass is preferred, 0.01 to 20% by mass is more preferred, 0.1 to 15% by mass is even more preferred, 1 to 10% by mass is even more preferred, 2 to 8% by mass is particularly preferred, and 3 to 8% by mass is particularly preferred. By adjusting the content to be equal to or greater than the lower limit, liquid repellency tends to be improved. By adjusting the content to be equal to or less than the upper limit, residue tends to be reduced.

[0059] The blending ratio of the (B) photopolymerization initiator to the (A) photopolymerizable compound in the photosensitive resin composition is preferably 1 part by mass or more, more preferably 2 parts by mass or more, even more preferably 4 parts by mass or more, even more preferably 6 parts by mass or more, and particularly preferably 10 parts by mass or more, per 100 parts by mass of the (A) photopolymerizable compound. It is also preferably 200 parts by mass or less, more preferably 100 parts by mass or less, even more preferably 50 parts by mass or less, and particularly preferably 30 parts by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 200 parts by mass is preferred, 2 to 200 parts by mass is more preferred, 4 to 100 parts by mass is even more preferred, 6 to 50 parts by mass is even more preferred, and 10 to 30 parts by mass is particularly preferred. By adjusting the blending ratio to the lower limit or more, liquid repellency tends to be improved. By adjusting the blending ratio to the upper limit or less, residue tends to be reduced.

[0060] [1-1-2-3] Sensitizing dye, polymerization accelerator The (B) photopolymerization initiator may contain a sensitizing dye and a polymerization accelerator according to the wavelength of the image exposure light source, if necessary, for the purpose of increasing sensitivity. Examples of sensitizing dyes include xanthene dyes described in JP-A-4-221958 and JP-A-4-219756; coumarin dyes having a heterocycle described in JP-A-3-239703 and JP-A-5-289335; 3-ketocoumarin compounds described in JP-A-3-239703 and JP-A-5-289335; pyrromethene dyes described in JP-A-6-19240; Examples of dyes having a dialkylaminobenzene skeleton include those described in JP-B No. 45-37377, JP-A No. 48-84183, JP-A No. 52-112681, JP-A No. 58-15503, JP-A No. 60-88005, JP-A No. 59-56403, JP-A No. 2-69, JP-A No. 57-168088, JP-A No. 5-107761, JP-A No. 5-210240, and JP-A No. 4-288818.

[0061] The sensitizing dye is preferably an amino group-containing sensitizing dye, and more preferably a compound having an amino group and a phenyl group in the same molecule. Examples thereof include benzophenone compounds such as 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, and 3,4-diaminobenzophenone; 2-(p-dimethylaminophenyl)benzoxazole, 2-(p-diethylaminophenyl)benzoxazole, 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole, 2-(p-dimethylaminophenyl)benzo[6,7]benzoxazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-oxazole, and 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole. Examples of p-dialkylaminophenyl group-containing compounds include (p-dialkylaminophenyl)benzothiazole, 2-(p-diethylaminophenyl)benzothiazole, 2-(p-dimethylaminophenyl)benzimidazole, 2-(p-diethylaminophenyl)benzimidazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-thiadiazole, (p-dimethylaminophenyl)pyridine, (p-diethylaminophenyl)pyridine, (p-dimethylaminophenyl)quinoline, (p-diethylaminophenyl)quinoline, (p-dimethylaminophenyl)pyrimidine, and (p-diethylaminophenyl)pyrimidine, with 4,4'-dialkylaminobenzophenone being particularly preferred. One type of sensitizing dye may be used alone, or two or more types may be used in combination.

[0062] Examples of the polymerization accelerator that can be used include aromatic amines such as ethyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 4-dimethylaminoacetophenone, and 4-dimethylaminopropiophenone, and aliphatic amines such as n-butylamine, N-methyldiethanolamine, and 2-dimethylaminoethyl benzoate. One type of polymerization accelerator may be used alone, or two or more types may be used in combination.

[0063] [1-1-3] (C) Alkali-Soluble Resin The photosensitive resin composition of the present invention contains (C) an alkali-soluble resin. In the present invention, the alkali-soluble resin (C) is not particularly limited as long as it is developable with an alkaline developer. Examples of the alkali-soluble group contained in the alkali-soluble resin include a carboxy group and a hydroxyl group, but a carboxy group is preferred from the viewpoint of excellent developability of the alkali-soluble resin. Furthermore, from the viewpoint of improving liquid repellency and adhesion, an alkali-soluble resin having an ethylenically unsaturated bond is preferred. The presence of an ethylenically unsaturated bond causes photocuring upon exposure to form a stronger film.

[0064] In particular, it is preferable to contain an acrylic copolymer resin (C1) from the viewpoints of liquid repellency and inkjet wetting and spreading properties, an epoxy (meth)acrylate resin (C2) from the viewpoint of pattern linearity, and an alkali-soluble resin (C3) from the viewpoint of low-temperature curing properties. [Acrylic Copolymer Resin (C1)]

[0065] The acrylic copolymer resin (C1) preferably has at least one, or two or more, of the partial structures represented by the following general formulae (C1-1) to (C1-4).

[0066] (Partial structure represented by general formula (C1-1))

[0067]

[0068] In formula (C1-1), R c1 and R c2 Each independently represents a hydrogen atom or a methyl group. * represents a bond.

[0069] By having the partial structure represented by formula (C1-1), the flexibility of the film is maintained and radicals tend to be easily released.

[0070] Among the partial structures represented by formula (C1-1), the partial structure represented by the following general formula (C1-1′) is preferred from the viewpoints of sensitivity and alkali developability.

[0071]

[0072] In formula (C1-1'), R c1 and Rc2 R each independently represents a hydrogen atom or a methyl group. X represents a hydrogen atom or a polybasic acid residue.

[0073] The polybasic acid residue in formula (C1-1') refers to a mono- or divalent group obtained by removing one or two OH groups from a polybasic acid. Examples of polybasic acids include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, benzophenonetetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chlorendic acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid. Among these, from the viewpoint of patterning properties, preferred are maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, and biphenyltetracarboxylic acid, and more preferred are tetrahydrophthalic acid and biphenyltetracarboxylic acid.

[0074] The content of the partial structure represented by formula (C1-1) in the acrylic copolymer resin (C1) is not particularly limited, but is preferably 10 mol% or more, more preferably 30 mol% or more, even more preferably 50 mol% or more, even more preferably 60 mol% or more, even more preferably 70 mol% or more, and particularly preferably 80 mol% or more, relative to the total number of moles of the structural units of the acrylic copolymer resin (C1). It is also preferably 99 mol% or less, more preferably 95 mol% or less, and even more preferably 90 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, it is 10 to 99 mol%, preferably 30 to 95 mol%, more preferably 50 to 95 mol%, even more preferably 60 to 95 mol%, even more preferably 70 to 95 mol%, and particularly preferably 80 to 90 mol%. By setting it at or above the lower limit, liquid repellency, inkjet wetting and spreading properties, and penetration resistance tend to be improved, while by setting it at or below the upper limit, developability tends to be improved.

[0075] When the acrylic copolymer resin (C1) has a partial structure represented by formula (C1-1'), its content is not particularly limited, but is preferably 10 mol% or more, more preferably 30 mol% or more, even more preferably 50 mol% or more, even more preferably 60 mol% or more, even more preferably 70 mol% or more, and particularly preferably 80 mol% or more, relative to the total number of moles of the structural units of the acrylic copolymer resin (C1). It is also preferably 99 mol% or less, more preferably 95 mol% or less, and even more preferably 90 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, it is 10 to 99 mol%, preferably 30 to 95 mol%, more preferably 50 to 95 mol%, even more preferably 60 to 95 mol%, even more preferably 70 to 95 mol%, and particularly preferably 80 to 90 mol%. By setting it to the lower limit or more, liquid repellency, inkjet wetting and spreading properties, and penetration resistance tend to be improved, while by setting it to the upper limit or less, developability tends to be improved.

[0076] (Partial Structure Represented by General Formula (C1-2)) Of the partial structures that the acrylic copolymer resin (C1) has, it is preferred that it further has a partial structure represented by the following general formula (C1-2) from the viewpoint of development adhesion.

[0077]

[0078] In formula (C1-2), R c3 represents a hydrogen atom or a methyl group, R c4 represents an alkyl group which may have a substituent, an aromatic ring group which may have a substituent, or an alkenyl group which may have a substituent.

[0079] (R c4 In formula (C1-2), R c4 represents an alkyl group which may have a substituent, an aromatic ring group which may have a substituent, or an alkenyl group which may have a substituent. c4The alkyl group in the formula (I) includes linear, branched, and cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, and particularly preferably 8 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 20 is preferred, 1 to 18 is more preferred, 3 to 16 is more preferred, 5 to 14 is even more preferred, and 8 to 12 is particularly preferred. By setting the group at or above the lower limit, film strength tends to be increased and development adhesion tends to be improved, while by setting the group at or below the upper limit, developability tends to be improved.

[0080] Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. From the viewpoint of developability, a dicyclopentanyl group and a dodecanyl group are preferred, and a dicyclopentanyl group is more preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0081] R c4Examples of the aromatic ring group in the formula (I) include monovalent aromatic hydrocarbon ring groups and monovalent aromatic heterocyclic groups. The number of carbon atoms is preferably 6 or more, and 24 or less, more preferably 22 or less, even more preferably 20 or less, and particularly preferably 18 or less. For example, it is 6 to 24, preferably 6 to 22, more preferably 6 to 20, and even more preferably 6 to 18. Setting the carbon number at or above the lower limit tends to improve development adhesion, while setting the carbon number at or below the upper limit tends to reduce residue. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic or fused ring, and examples include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. The aromatic heterocycle in the aromatic heterocyclic group may be a single ring or a condensed ring, and examples thereof include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring.From the viewpoint of developability, a benzene ring or a naphthalene ring is preferred, and a benzene ring is more preferred. Examples of the substituent that the aromatic ring group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0082] R c4The alkenyl group in the formula (I) may be a linear, branched, or cyclic alkenyl group. The number of carbon atoms is 2 or more, and preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is 2 to 22, preferably 2 to 20, more preferably 2 to 18, even more preferably 2 to 16, and still more preferably 2 to 14. By setting it to be equal to or more than the lower limit, development adhesion tends to be improved, and by setting it to be equal to or less than the upper limit, residues tend to be reduced.

[0083] Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0084] R c4 represents an alkyl group which may have a substituent, an aromatic ring group which may have a substituent, or an alkenyl group which may have a substituent, and from the viewpoints of developability and film strength, an alkyl group or an alkenyl group is preferred, and an alkyl group is more preferred.

[0085] When the acrylic copolymer resin (C1) has a partial structure represented by formula (C1-2), its content is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, and is preferably 70 mol% or less, more preferably 50 mol% or less, even more preferably 30 mol% or less, and even more preferably 10 mol% or less, relative to the total number of moles of the structural units of the acrylic copolymer resin (C1). The above upper and lower limits can be arbitrarily combined. For example, it is 1 to 70 mol%, preferably 2 to 50 mol%, more preferably 2 to 30 mol%, and even more preferably 2 to 10 mol%. By making it equal to or greater than the lower limit, development adhesion and liquid repellency tend to be improved, while by making it equal to or less than the upper limit, developability tends to be improved.

[0086] (Partial Structure Represented by General Formula (C1-3)) From the viewpoint of heat resistance and film strength, the partial structure of the acrylic copolymer resin (C1) preferably contains a partial structure represented by the following general formula (C1-3).

[0087]

[0088] In formula (C1-3), R c5 represents a hydrogen atom or a methyl group, R c6 represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, an alkynyl group which may have a substituent, a hydroxy group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkylsulfide group which may have a substituent. t represents an integer of 0 to 5. When t represents an integer of 2 or more, multiple R 6 may be the same or different.

[0089] (R c6 In formula (C1-3), R c6 represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, an alkynyl group which may have a substituent, a hydroxy group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkyl sulfide group which may have a substituent. c6 The alkyl group in the formula (I) may be a linear, branched, or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be arbitrarily combined. For example, it is 1 to 20, preferably 1 to 18, more preferably 3 to 16, and even more preferably 5 to 14. By setting the carbon number at or above the lower limit, development adhesion tends to be improved, and by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0090] Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. From the viewpoint of developability and film strength, a dicyclopentanyl group and a dodecanyl group are preferred, and a dicyclopentanyl group is more preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0091] R c6 The alkenyl group in the formula (I) may be a linear, branched, or cyclic alkenyl group. The alkenyl group has 2 or more carbon atoms, and preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is 2 to 22, preferably 2 to 20, more preferably 2 to 18, even more preferably 2 to 16, and still more preferably 2 to 14. By setting the alkenyl group at or above the lower limit, development adhesion tends to be improved, and by setting the alkenyl group at or below the upper limit, developability tends to be improved.

[0092] Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of improving developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0093] R c6The alkynyl group in the formula (I) includes linear, branched, and cyclic alkynyl groups. The number of carbon atoms is 2 or more, and preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is 2 to 22, preferably 2 to 20, more preferably 2 to 18, even more preferably 2 to 16, and still more preferably 2 to 14. By setting it to be equal to or more than the lower limit, development adhesion tends to be improved, and by setting it to be equal to or less than the upper limit, developability tends to be improved.

[0094] Examples of the substituent that the alkynyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of improving developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0095] R c6 Examples of the halogen atom in the formula (I) include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. From the viewpoint of liquid repellency, a fluorine atom is preferred.

[0096] R c6 The alkoxy group in the formula (I) may be a linear, branched, or cyclic alkoxy group. The number of carbon atoms is 1 or more, and preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, still more preferably 14 or less, and particularly preferably 12 or less. For example, it is 1 to 20, preferably 1 to 18, more preferably 1 to 16, even more preferably 1 to 14, and still more preferably 1 to 12. By making the alkoxy group equal to or more than the lower limit, development adhesion tends to be improved, and by making the alkoxy group equal to or less than the upper limit, developability tends to be improved.

[0097] Examples of the substituent that the alkoxy group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of improving developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0098] R c6 Examples of the alkyl sulfide group in include linear, branched, and cyclic alkyl sulfide groups. The number of carbon atoms is preferably 1 or more, and is also preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, still more preferably 14 or less, and particularly preferably 12 or less. For example, it is 1 to 20, preferably 1 to 18, more preferably 1 to 16, even more preferably 1 to 14, and still more preferably 1 to 12. By setting it to be equal to or more than the above lower limit, development adhesion tends to be improved, and by setting it to be equal to or less than the above upper limit, developability tends to be improved.

[0099] Examples of the substituent that the alkyl group in the alkyl sulfide group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of improving developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0100] R c6 represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, an alkynyl group which may have a substituent, a hydroxy group, a carboxy group, a halogen atom, an alkoxy group, a hydroxyalkyl group, a thiol group, or an alkylsulfide group which may have a substituent, and from the viewpoint of improving developability, a hydroxy group or a carboxy group is preferred, and a carboxy group is more preferred.

[0101] In formula (C1-3), t represents an integer of 0 to 5. From the viewpoint of ease of production, t is preferably 0.

[0102] When the acrylic copolymer resin (C1) has a partial structure represented by formula (C1-3), its content is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, even more preferably 2 mol% or more, and particularly preferably 4 mol% or more, relative to the total number of moles of the structural units of the acrylic copolymer resin (C1). Furthermore, it is preferably 50 mol% or less, more preferably 30 mol% or less, even more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 6 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, it is 0.5 to 50 mol%, preferably 1 to 30 mol%, more preferably 1 to 20 mol%, even more preferably 2 to 10 mol%, and even more preferably 4 to 6 mol%. By setting it at or above the lower limit, film uniformity tends to be improved, while by setting it at or below the upper limit, developability tends to be improved.

[0103] (Partial Structure Represented by General Formula (C1-4)) From the viewpoint of developability, it is also preferable that the acrylic copolymer resin (C1) has a partial structure represented by the following general formula (C1-4) as the partial structure.

[0104]

[0105] In formula (C1-4), R c7 represents a hydrogen atom or a methyl group.

[0106] When the acrylic copolymer resin (C1) has a partial structure represented by formula (C1-4), its content is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, and even more preferably 20 mol% or more, relative to the total number of moles of the structural units of the acrylic copolymer resin (C1). It is also preferably 80 mol% or less, more preferably 70 mol% or less, and even more preferably 60 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, it is 5 to 80 mol%, preferably 10 to 70 mol%, and more preferably 20 to 60 mol%. By making it equal to or greater than the lower limit, developability tends to be improved, while by making it equal to or less than the upper limit, liquid repellency tends to be improved.

[0107] The double bond equivalent of the acrylic copolymer resin (C1) is 400 g / mol or less, preferably 350 g / mol or less, more preferably 300 g / mol or less, and even more preferably 270 g / mol or less. It is also preferably 80 g / mol or more, more preferably 100 g / mol or more, even more preferably 150 g / mol or more, and particularly preferably 200 g / mol or more. The above upper and lower limits can be arbitrarily combined. For example, it is 80 to 400 g / mol, preferably 100 to 350 g / mol, more preferably 150 to 300 g / mol, and even more preferably 200 to 270 g / mol. By setting the double bond equivalent at or below the upper limit, liquid repellency and inkjet wetting and spreading properties tend to be improved, while by setting the double bond equivalent at or above the lower limit, developability tends to be improved. The double bond equivalent of the acrylic copolymer resin (C1) can be calculated using the following formula:

[0108] (Double bond equivalent of acrylic copolymer resin (C1))=(weight average molecular weight of acrylic copolymer resin (C1)) / (number of ethylenically unsaturated bonds per molecule of acrylic copolymer resin (C1))

[0109] The acid value of the acrylic copolymer resin (C1) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 15 mgKOH / g or more, even more preferably 20 mgKOH / g or more, even more preferably 25 mgKOH / g or more, and is preferably 150 mgKOH / g or less, more preferably 120 mgKOH / g or less, even more preferably 90 mgKOH / g or less, even more preferably 60 mgKOH / g or less, and particularly preferably 40 mgKOH / g or less. The above upper and lower limits can be arbitrarily combined. For example, it is 10 to 150 mgKOH / g, preferably 15 to 120 mgKOH / g, more preferably 20 to 90 mgKOH / g, even more preferably 20 to 60 mgKOH / g, and even more preferably 20 to 40 mgKOH / g. By setting the acid value at or above the lower limit, developability tends to be improved, while by setting it at or below the upper limit, penetration resistance and development adhesion tend to be improved.

[0110] The weight-average molecular weight (Mw) of the acrylic copolymer resin (C1) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 4,000 or more, even more preferably 6,000 or more, and particularly preferably 7,000 or more, and is preferably 30,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and even more preferably 10,000 or less. The above upper and lower limits can be arbitrarily combined. For example, it is 1,000 to 30,000, preferably 2,000 to 20,000, more preferably 4,000 to 20,000, even more preferably 6,000 to 15,000, even more preferably 7,000 to 15,000, and particularly preferably 7,000 to 10,000. By setting it to be equal to or greater than the lower limit, development adhesion and penetration resistance tend to be improved, while by setting it to be equal to or less than the upper limit, developability tends to be improved.

[0111] Examples of the acrylic copolymer resin (C1) include resins described in Japanese Patent Application Laid-Open Nos. 8-297366 and 2001-89533.

[0112] [Epoxy (meth)acrylate resin (C2)] The epoxy (meth)acrylate resin (C2) is a resin obtained by adding an ethylenically unsaturated monocarboxylic acid or ester compound to an epoxy resin, optionally reacting with an isocyanate group-containing compound, and then further reacting with a polybasic acid or its anhydride. For example, a resin obtained by ring-opening addition of a carboxy group of an unsaturated monocarboxylic acid to the epoxy group of the epoxy resin, thereby adding an ethylenically unsaturated bond to the epoxy resin via an ester bond (—COO—), and adding one carboxy group of a polybasic acid anhydride to the hydroxyl group generated in this process, may be used. Also included is a resin obtained by simultaneously adding a polyhydric alcohol when adding the polybasic acid anhydride.

[0113] Resins obtained by reacting the carboxyl group of the resin obtained by the above reaction with a compound having a functional group that can further react are also included in the epoxy (meth)acrylate resin (C2).

[0114] Examples of epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, biphenyl novolac epoxy resins, trisphenol epoxy resins, polymerized epoxy resins of phenol and dicyclopentadiene, dihydroxyfluorene type epoxy resins, dihydroxyalkyleneoxylfluorene type epoxy resins, diglycidyl ethers of 9,9-bis(4'-hydroxyphenyl)fluorene, and diglycidyl ethers of 1,1-bis(4'-hydroxyphenyl)adamantane, and epoxy resins having an aromatic ring in the main chain can be preferably used.

[0115] As the epoxy resin, from the viewpoint of heat resistance, bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, and diglycidyl ether of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, and bisphenol A epoxy resin is more preferred.

[0116] Examples of epoxy resins include bisphenol A type epoxy resins (e.g., "jER (registered trademark, the same applies hereinafter) 828," "jER1001," "jER1002," and "jER1004" manufactured by Mitsubishi Chemical Corporation, and "NER-1302" (epoxy equivalent: 323, softening point: 76°C) manufactured by Nippon Kayaku Co., Ltd.), bisphenol F type resins (e.g., "jER807," "jER4004P," "jER4005P," and "jER4007P" manufactured by Mitsubishi Chemical Corporation, and "NER-1302" (epoxy equivalent: 323, softening point: 76°C) manufactured by Nippon Kayaku Co., Ltd.), and "NER-7406" (epoxy equivalent: 350, softening point: 66°C) manufactured by Mitsubishi Chemical Corporation), bisphenol S type epoxy resin, biphenyl glycidyl ether (for example, "jERYX-4000" manufactured by Mitsubishi Chemical Corporation), phenol novolac type epoxy resin (for example, "EPPN-201" manufactured by Nippon Kayaku Co., Ltd., "jER152" and "jER154" manufactured by Mitsubishi Chemical Corporation, "DEN-438" manufactured by Dow Chemical Company), (o, m, p-) cresol novolac type epoxy resin ( For example, "EOCN (registered trademark, the same applies hereinafter)-102S," "EOCN-1020," and "EOCN-104S" manufactured by Nippon Kayaku Co., Ltd., triglycidyl isocyanurate (for example, "TEPIC (registered trademark)" manufactured by Nissan Chemical Industries, Ltd.), trisphenolmethane type epoxy resin (for example, "EPPN (registered trademark, the same applies hereinafter)-501," "EPPN-502," and "EPPN-503" manufactured by Nippon Kayaku Co., Ltd.), alicyclic epoxy resin (for example, "Celloxide (registered trademark)" manufactured by Daicel Corporation), Registered trademark, the same applies hereinafter.) 2021P" and "Celloxide EHPE"), epoxy resins obtained by glycidylating phenolic resins obtained by reacting dicyclopentadiene with phenol (for example, "EXA-7200" manufactured by DIC Corporation, "NC-7300" and "XD-1000" manufactured by Nippon Kayaku Co., Ltd.), biphenyl-type epoxy resins (for example, "NC-7000" manufactured by Nippon Kayaku Co., Ltd.), and adamantyl group-containing phenolic epoxy resins (for example, "Adamantate E-201" manufactured by Osaka Organic Chemical Industry Co., Ltd.). From the viewpoint of high-resolution pattern resolution, "XD-1000" manufactured by Nippon Kayaku Co., Ltd., "NC-3000" manufactured by Nippon Kayaku Co., Ltd., "ESF-300" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and "E-201" manufactured by Osaka Organic Chemical Industry Co., Ltd. are more preferred. One type of epoxy resin may be used alone, or two or more types may be used in combination.

[0117] Examples of ethylenically unsaturated monocarboxylic acids include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, and reaction products of (meth)acrylic acid and ε-caprolactone. From the viewpoint of sensitivity, (meth)acrylic acid is preferred. One ethylenically unsaturated monocarboxylic acid may be used alone, or two or more may be used in combination.

[0118] Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof. From the viewpoint of suppressing outgassing from the cured product and ensuring long-term reliability, succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride are preferred, and succinic anhydride and tetrahydrophthalic anhydride are more preferred. As the polybasic acids (anhydrides), one type may be used alone, or two or more types may be used in combination.

[0119] The use of a polyhydric alcohol increases the molecular weight of the epoxy (meth)acrylate resin (C2), allows for the introduction of branches into the molecule, and tends to balance the molecular weight and viscosity. Furthermore, the introduction rate of acid groups into the molecule can be increased, which tends to make it easier to balance sensitivity and adhesion. Preferred polyhydric alcohols are trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. One type of polyhydric alcohol may be used alone, or two or more types may be used in combination.

[0120] In addition to the resins described above, the epoxy (meth)acrylate resin (C2) may also include resins described in Korean Patent Publication No. 10-2013-0022955.

[0121] The acid value of the epoxy (meth)acrylate resin (C2) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 30 mgKOH / g or more, even more preferably 50 mgKOH / g or more, even more preferably 70 mgKOH / g or more, and particularly preferably 80 mgKOH / g or more. It is also preferably 200 mgKOH / g or less, more preferably 180 mgKOH / g or less, even more preferably 150 mgKOH / g or less, even more preferably 120 mgKOH / g or less, and particularly preferably 110 mgKOH / g or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 10 to 200 mgKOH / g, more preferably 30 to 180 mgKOH / g, even more preferably 50 to 150 mgKOH / g, even more preferably 70 to 120 mgKOH / g, and particularly preferably 80 to 110 mgKOH / g. By adjusting the acid value to be equal to or greater than the lower limit, developability tends to be improved. By adjusting the content to the upper limit or less, the liquid repellency and film strength tend to be improved.

[0122] The weight-average molecular weight (Mw) of the epoxy (meth)acrylate resin (C2) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 3,000 or more, and particularly preferably 3,500 or more. It is also preferably 30,000 or less, more preferably 15,000 or less, even more preferably 10,000 or less, even more preferably 8,000 or less, and particularly preferably 5,000 or less. The above upper and lower limits can be arbitrarily combined. For example, 1,000 to 30,000 is preferred, 1,000 to 15,000 is more preferred, 2,000 to 10,000 is even more preferred, 3,000 to 8,000 is even more preferred, and 3,500 to 5,000 is particularly preferred. By setting the Mw at or above the lower limit, liquid repellency and film strength tend to be improved. By setting the Mw at or below the upper limit, residue tends to be reduced.

[0123] [Alkali-Soluble Resin (C3)] The alkali-soluble resin (C3) is a resin having a structural unit represented by the following general formula (C3-1) (hereinafter, sometimes referred to as "structural unit (C3-1)").

[0124]

[0125] In formula (V), R c11 ~R c14 Each independently represents a hydrogen atom or a hydrocarbon group. n represents an integer of 0 to 2. * represents a bond.

[0126] The alkali-soluble resin (C3) has a structural unit represented by formula (C3-1). The structural unit represented by formula (C3-1) is not as rigid as aromatic hydrocarbons, but has a three-dimensionally bulky structure, and its certain degree of flexibility allows reactive sites to approach each other during the photo- and / or thermosetting reaction, preventing excessive inhibition of the progress of the curing reaction. Furthermore, it is believed that the bulky structure contributes to the development of penetration resistance after curing.

[0127] <Structural Unit (C3-1)> In formula (C3-1), R c11 ~R c14 are each independently a hydrogen atom or a hydrocarbon group. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, an aromatic ring group, and an aralkyl group.

[0128] The alkyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkyl group is not particularly limited, but is preferably 1 or more, more preferably 3 or more, even more preferably 6 or more, and is preferably 15 or less, more preferably 8 or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 15 is preferred, 3 to 15 is more preferred, and 6 to 8 is even more preferred. By setting the number at or above the lower limit, penetration resistance tends to be improved, while by setting the number at or below the upper limit, developability tends to be improved. Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

[0129] The number of carbon atoms in the alkenyl group is not particularly limited, but is preferably 2 or more, more preferably 3 or more, and is preferably 10 or less, more preferably 8 or less. The upper and lower limits above can be arbitrarily combined. For example, 2 to 10 is preferred, and 3 to 8 is more preferred. By setting the number at or above the lower limit, there is a tendency for the penetration resistance to be improved, and by setting the number at or below the upper limit, there is a tendency for the developability to be improved. Examples of alkenyl groups include vinyl groups, allyl groups, butenyl groups, and pentenyl groups.

[0130] The number of carbon atoms in the alkynyl group is not particularly limited, but is preferably 2 or more, more preferably 3 or more, and is preferably 10 or less, more preferably 8 or less. The upper and lower limits above can be arbitrarily combined. For example, 2 to 10 is preferred, and 3 to 8 is more preferred. By making the number equal to or greater than the lower limit, there is a tendency for the penetration resistance to be improved, and by making the number equal to or less than the upper limit, there is a tendency for the developability to be improved. Examples of alkynyl groups include ethynyl groups.

[0131] Examples of aromatic ring groups include aromatic hydrocarbon ring groups and aromatic heterocyclic groups. The number of carbon atoms in the aromatic ring group is not particularly limited, but is preferably 4 or more, more preferably 5 or more, and even more preferably 6 or more. It is also preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The above upper and lower limits can be arbitrarily combined. For example, 4 to 20 is preferred, 5 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number at or above the lower limit, there is a tendency for the penetration resistance to be improved, and by setting the number at or below the upper limit, there is a tendency for the developability to be improved. Examples of aromatic ring groups include a phenyl group, a naphthyl group, an anthracenyl group, a tolyl group, and a xylyl group.

[0132] The number of carbon atoms in the aralkyl group is not particularly limited, but is preferably 5 or more, more preferably 6 or more, even more preferably 7 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The above upper and lower limits can be arbitrarily combined. For example, 5 to 20 is preferred, 6 to 15 is more preferred, and 7 to 10 is even more preferred. By setting the number at or above the lower limit, there is a tendency for the penetration resistance to be improved, and by setting the number at or below the upper limit, there is a tendency for the developability to be improved. Examples of aralkyl groups include groups in which one hydrogen atom of the above-mentioned alkyl group is substituted with the above-mentioned aromatic ring group. Examples of aralkyl groups include a benzyl group and a phenethyl group.

[0133] R c11 ~R c14 each independently represents a hydrogen atom or a hydrocarbon group; R １ and R ４ may be linked to form a cyclic structure, and R ２ and R ３ may be linked to form a cyclic structure.

[0134] From the viewpoint of ease of synthesis, R c11 ~R c14 is preferably a hydrogen atom, and R c11 ~R c14 It is more preferable that all of are hydrogen atoms.

[0135] n represents an integer of 0 to 2, and n is preferably 0 from the viewpoint of developability.

[0136] Examples of the structural unit (C3-1) include those represented by the following general formulas (C3-1-1) to (C3-1-3): The structural unit represented by the following general formula (C3-1-1) is more preferred from the viewpoint of penetration resistance.

[0137]

[0138] <Structural Unit (C3-2)> The alkali-soluble resin (C3) preferably has a structural unit (C3-2) that has a carboxy group (hereinafter, this may be referred to as the "structural unit (C3-2)"). There are no particular restrictions on the structure of the structural unit (C3-2) that has a carboxy group in the alkali-soluble resin (C3), but examples include structural units derived from unsaturated group-containing carboxylic acids and unsaturated group-containing carboxylic acid anhydrides. From the perspective of improving developability and staining resistance, the alkali-soluble resin (C3) preferably has a structural unit represented by the following general formula (C3-2-1) (hereinafter, this may be referred to as the "structural unit (C3-2-1)").

[0139]

[0140] In formula (C3-2-1), R c15 represents a hydrogen atom or an organic group. * represents a bond.

[0141] The organic group may be an alkyl group which may have a substituent, or an aryl group which may have a substituent. The organic group preferably has 1 to 18 carbon atoms.

[0142] R c15When the alkyl group is an alkyl group, the number of carbon atoms is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 4 or more, and is preferably 9 or less, and more preferably 7 or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 9 is preferred, 2 to 9 is more preferred, and 4 to 7 is even more preferred. Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

[0143] R c15 When the aryl group is an aryl group, the number of carbon atoms is not particularly limited, but is preferably 6 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, the number of carbon atoms is preferably 6 to 20, more preferably 6 to 15, and even more preferably 6 to 10. Examples of the aryl group include a phenyl group, a naphthyl group, an anthracenyl group, a tolyl group, and a xylyl group.

[0144] Examples of the substituent that the alkyl group and aryl group may have include a hydroxyl group and a (meth)acryloyl group.

[0145] From the viewpoint of penetration resistance, R c15 is preferably a structural unit represented by the following general formula (C3-2-2).

[0146]

[0147] In formula (C3-2-2), R c16 represents a hydrogen atom or a methyl group. e represents an integer of 1 to 5. * represents a bond.

[0148] In formula (C3-2-2), e represents an integer of 1 to 5, and from the viewpoint of penetration resistance, e is preferably an integer of 1 to 3, and more preferably an integer of 1 or 2.

[0149] As the structural unit (C3-2-1), any of the structural units represented by the following general formulas (C3-2-3) to (C3-6) is more preferred, and a structural unit represented by the following general formula (C3-2-3) or formula (C3-2-4) is particularly preferred.

[0150]

[0151] In formulas (C3-2-3) to (C3-2-6), * represents a bond.

[0152] <Other Structural Units> The alkali-soluble resin (C3) may contain "other structural units" in addition to the structural units (C3-1) and (C3-2). The other structural units are not limited, but include, for example, structural units represented by the following general formulas (C3-3-1) to (C3-3-5) (hereinafter, these may be referred to as "structural units (C3-3-1) to (C3-3-5)").

[0153]

[0154] In formula (C3-3-1), R c15 has the same meaning as formula (C3-2-1), and in formulas (C3-3-1) and (C3-3-2), R c17 Each independently represents a hydrogen atom or a methyl group. * represents a bond.

[0155]

[0156] In formula (C3-3-5), R c18 represents an alkyl group which may have a substituent. * represents a bond.

[0157] By including the structural unit represented by formula (C3-3-5), the heat resistance of the alkali-soluble resin (C3) tends to be improved.

[0158] R c18 Examples of the alkyl group which may have a substituent include a methyl group, an ethyl group, a propyl group, and a benzyl group.

[0159] From the viewpoint of surface smoothness and penetration resistance, the alkali-soluble resin (C3) preferably contains the structural unit (C3-1), the structural unit (C3-2), and the structural unit (C3-3-1), and more preferably contains the structural unit (C3-1), the structural unit (C3-2), the structural unit (C3-3-1), and the structural unit (C3-3-4).

[0160] [Method for producing alkali-soluble resin (C3)] The method for producing the alkali-soluble resin (C3) is not particularly limited, and a conventionally known method can be used. For example, it can be produced by the methods described in WO 2016 / 194619, JP 2017-057260 A, and WO 2022 / 264909.

[0161] The content of the structural unit (C3-1) in the alkali-soluble resin (C3) is not particularly limited, but is preferably 20 mol% or more, more preferably 30 mol% or more, even more preferably 40 mol% or more, and is preferably 80 mol% or less, more preferably 70 mol% or less, and even more preferably 60 mol% or less, based on all structural units of the alkali-soluble resin (C3). The above upper and lower limits can be arbitrarily combined. For example, 20 to 80 mol% is preferred, 30 to 70 mol% is more preferred, and 40 to 60 mol% is even more preferred. By ensuring that the content is equal to or greater than the lower limit, penetration resistance tends to be improved, while by ensuring that the content is equal to or less than the upper limit, developability tends to be improved.

[0162] When the alkali-soluble resin (C3) contains the structural unit (C3-2-1), its content is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, and even more preferably 15 mol% or more, of all structural units of the alkali-soluble resin (C3), and is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, 5 to 40 mol% is preferred, 10 to 30 mol% is more preferred, and 15 to 20 mol% is even more preferred. By ensuring that the content is equal to or greater than the lower limit, developability tends to be improved, while by ensuring that the content is equal to or less than the upper limit, penetration resistance tends to be improved.

[0163] When the alkali-soluble resin (C3) contains the structural unit (C3-3-1), its content is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, and is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, based on all structural units of the alkali-soluble resin (C3). The above upper and lower limits can be arbitrarily combined. For example, 5 to 40 mol% is preferred, 10 to 30 mol% is more preferred, and 15 to 20 mol% is even more preferred. By ensuring that the content is equal to or greater than the lower limit, penetration resistance tends to be improved, while by ensuring that the content is equal to or less than the upper limit, developability tends to be improved.

[0164] When the alkali-soluble resin (C3) contains the structural unit (C3-3-4), its content is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, and is preferably 40 mol% or less, more preferably 30 mol% or less, and even more preferably 20 mol% or less, based on all structural units of the alkali-soluble resin (C3). The above upper and lower limits can be arbitrarily combined. For example, 5 to 40 mol% is preferred, 10 to 30 mol% is more preferred, and 15 to 20 mol% is even more preferred. By ensuring that the content is equal to or greater than the lower limit, synthesis tends to be easier, while by ensuring that the content is equal to or less than the upper limit, penetration resistance and developability tend to be improved.

[0165] When the alkali-soluble resin (C3) contains the structural unit (C3-2-1), the structural unit (C3-3-1), and the structural unit (C3-3-4), the content of the structural unit (C3-2-1) relative to the total content of the structural unit (C3-2-1), the structural unit (C3-3-1), and the structural unit (C3-3-4) in the alkali-soluble resin (C3) is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, and is preferably 90 mol% or less, more preferably 70 mol% or less, and even more preferably 50 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, 10 to 90 mol% is preferred, 20 to 70 mol% is more preferred, and 30 to 50 mol% is even more preferred. By setting the content at or above the lower limit, developability tends to be improved, while by setting the content at or below the upper limit, penetration resistance tends to be improved.

[0166] The acid value of the alkali-soluble resin (C3) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 30 mgKOH / g or more, and even more preferably 50 mgKOH / g or more. It is also preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less, even more preferably 100 mgKOH / g or less, and particularly preferably 80 mgKOH / g or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 10 to 200 mgKOH / g, more preferably 10 to 150 mgKOH / g, even more preferably 30 to 100 mgKOH / g, and particularly preferably 50 to 80 mgKOH / g. By setting the acid value at or above the lower limit, developability tends to be improved, while by setting it at or below the upper limit, development adhesion tends to be improved.

[0167] The weight-average molecular weight (Mw) of the alkali-soluble resin (C3) is not particularly limited, but is preferably 2,000 or more, more preferably 3,000 or more, even more preferably 4,000 or more, still more preferably 5,000 or more, and particularly preferably 6,000 or more, and is preferably 35,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 2,000 to 35,000, more preferably 3,000 to 35,000, even more preferably 4,000 to 20,000, even more preferably 5,000 to 15,000, and particularly preferably 6,000 to 10,000. By setting it to be equal to or greater than the lower limit, development adhesion tends to be improved, and by setting it to be equal to or less than the upper limit, developability tends to be improved.

[0168] The double bond equivalent of the alkali-soluble resin (C3) is not particularly limited, but is preferably 200 g / mol or more, more preferably 300 g / mol or more, even more preferably 400 g / mol or more, even more preferably 500 g / mol or more, and particularly preferably 600 g / mol or more, and is preferably 1000 g / mol or less, more preferably 800 g / mol or less, and even more preferably 700 g / mol or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 200 to 1000 g / mol, more preferably 300 to 800 g / mol, even more preferably 400 to 700 g / mol, even more preferably 500 to 700 g / mol, and particularly preferably 600 to 700 g / mol. By setting it to be equal to or greater than the lower limit, developability tends to be improved, and by setting it to be equal to or less than the upper limit, penetration resistance tends to be improved. The double bond equivalent of the alkali-soluble resin (C3) can be calculated in the same manner as for the double bond equivalent of the acrylic copolymer resin (C1).

[0169] The content of the alkali-soluble resin (C) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 50% by mass or more, and particularly preferably 60% by mass or more, based on the total solid content of the photosensitive resin composition. It is also preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 80% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 30 to 90% by mass is even more preferred, 30 to 85% by mass is even more preferred, 30 to 80% by mass is particularly preferred, 50 to 80% by mass is even more preferred, and 60 to 80% by mass is particularly preferred. By setting the content at or above the lower limit, residue tends to be reduced. By setting the content at or below the upper limit, liquid repellency and inkjet wetting and spreading properties tend to be improved.

[0170] The content of the acrylic copolymer resin (C1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, and particularly preferably 40% by mass or more, based on the total solid content of the photosensitive resin composition. It is also preferably 70% by mass or less, and more preferably 60% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, even more preferably 20 to 60% by mass, and even more preferably 30 to 60% by mass. By setting it at or above the lower limit, liquid repellency and inkjet wetting and spreading properties tend to be improved. By setting it at or below the upper limit, the resolution of high-resolution patterns tends to be improved.

[0171] The content of the epoxy (meth)acrylate resin (C2) is not particularly limited, but is preferably 5% by mass or more, more preferably 20% by mass or more, even more preferably 33% by mass or more, particularly preferably 50% by mass or more, and preferably 60% by mass or less, based on the total solid content of the photosensitive resin composition. For example, 5 to 60% by mass is preferred, more preferably 20 to 60% by mass, even more preferably 33 to 60% by mass, and particularly preferably 50 to 60% by mass. By ensuring that the content is equal to or greater than the lower limit, the resolution of high-definition patterns tends to be improved. By ensuring that the content is equal to or less than the upper limit, the liquid repellency tends to be good.

[0172] The content of the alkali-soluble resin (C3) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more, based on the total solids content of the photosensitive resin composition. It is also preferably 60% by mass or less, more preferably 50% by mass or less, and even more preferably 40% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 5 to 60% by mass, more preferably 10 to 60% by mass, even more preferably 20 to 50% by mass, even more preferably 30 to 50% by mass, and particularly preferably 30 to 40% by mass. By setting it at or above the lower limit, bleeding during low-temperature baking tends to be suppressed. By setting it at or below the upper limit, developability tends to be improved.

[0173] [1-1-4] (D) Silicon-containing copolymer resin

[0174] The silicon-containing copolymer resin (D) of the present invention contains at least repeating units (D1) and (D2). Repeating unit (D1): A repeating unit containing the following general formula (d1). Repeating unit (D2): A repeating unit containing an ethylenically unsaturated group in the side chain.

[0175]

[0176] However, R １ , R ２ , R ３ are each independently an alkyl group having 1 to 3 carbon atoms. * represents a bond.

[0177] The photosensitive resin composition of the present invention exhibits enhanced liquid repellency due to the inclusion of silicon-containing copolymer resin (D). While the inclusion of silicon facilitates aggregation at or near the surface of the coating film, the inclusion of repeating unit (D2) is believed to facilitate bonding of silicon-containing copolymer resin (D1) to the surface or its vicinity upon exposure, thereby improving liquid repellency. Meanwhile, the branched siloxane chain structure of repeating unit (D1) increases the glass transition temperature (Tg). Therefore, unreacted silicon-containing copolymer resin (D) upon exposure is less likely to bleed into pixel areas upon baking, improving inkjet wetting and spreading. When using solventless inks with high surface tension and viscosity, sufficient wetting and spreading cannot be achieved, leading to problems with coating defects. Furthermore, the inclusion of repeating units (D1) and (D2) allows the above-described effects to be achieved regardless of the materials and physical properties used in the inkjet ink. In particular, it is useful because it provides sufficient ink-jet wetting and spreading properties even for solvent-free inks and inks with high surface tension.

[0178] The repeating unit (D1) and the repeating unit (D2) may each have a repeating unit, or may contain a (D1) structure and a (D2) structure in one repeating unit. However, from the viewpoint of liquid repellency and inkjet wetting and spreading properties, it is preferable that the repeating unit (D1) and the repeating unit (D2) each have a repeating unit.

[0179] <Repeating Unit (D1)> The repeating unit (D1) is not particularly limited as long as it has the structure of formula (d1). １ ~R ３ In the formula (D1), examples of the alkyl group having 1 to 3 carbon atoms include a methyl group, an ethyl group, a propyl group, and an isopropyl group. From the viewpoints of liquid repellency and inkjet wetting and spreading properties, a methyl group and an ethyl group are preferred, and a methyl group is more preferred. From the viewpoint of ease of synthesis, the repeating unit (D1) more preferably contains a repeating unit of the following formula (d1-1):

[0180] R １ , R２ , R ３ are each independently an alkyl group having 1 to 3 carbon atoms. ４ is a hydrogen atom or a methyl group. １ represents a divalent organic group. * represents a bond. R １ , R ２ , R ３ is R in formula (d1). １ , R ２ , R ３ is synonymous with.

[0181] L １ The divalent organic group is preferably a single bond, an alkylene group having 1 to 50 carbon atoms, or an alkyleneoxy group having 1 to 50 carbon atoms.

[0182] L １ Examples of the alkylene group having 1 to 50 carbon atoms include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-pentylene group, an n-hexylene group, an n-heptylene group, an n-octylene group, an n-nonylene group, an n-decylene group, an n-dodecylene group, an isopropylene group, a 2-methylpropylene group, a 2-methylhexylene group, and a tetramethylethylene group.

[0183] L １ The alkylene group having 1 to 50 carbon atoms is preferably an alkylene group having 1 to 15 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and even more preferably a methylene group, an ethylene group, an n-propylene group, or an isopropylene group.

[0184] L １ The alkyleneoxy group having 1 to 50 carbon atoms is, for example, one of the alkylene groups -CH ２ - is a group in which - is substituted with -O-. １ The alkyleneoxy group having 1 to 50 carbon atoms is preferably an alkyleneoxy group having 1 to 15 carbon atoms, more preferably an alkyleneoxy group having 1 to 8 carbon atoms, and even more preferably a methyleneoxy group, an ethyleneoxy group, a propyleneoxy group, an oxytrimethylene group, a butyleneoxy group, an oxytetramethylene group, a pentyleneoxy group, a heptyleneoxy group, or an octyleneoxy group.

[0185] L １ When the divalent organic group is an alkylene group having 1 to 50 carbon atoms or an alkyleneoxy group having 1 to 50 carbon atoms, these divalent organic groups are -CH ２ A part of the - may be replaced by a carbonyl group (-C(=O)-), a phenylene group, an amide bond or a urethane bond, and further, a hydroxyl group or the like may be substituted on the carbon atom. １ is more preferably an alkylene group having 1 to 5 carbon atoms.

[0186] Specific examples of the repeating unit (D1) are as follows:

[0187]

[0188] From the viewpoint of liquid repellency and ink jet wetting and spreading properties, (d1-1-2) is preferred. The repeating unit (D1) may contain one or more types.

[0189] <Repeating Unit (D2)> The structure of the repeating unit (D2) is not particularly limited as long as it contains an ethylenically unsaturated group in the side chain. As the ethylenically unsaturated group, for example, a vinyl group, an allyl group, a (meth)acryloyl group, or a (meth)acryloyloxy group is preferred, and a (meth)acryloyl group or a (meth)acryloyloxy group is preferred. The repeating unit (D2) preferably contains a repeating unit of the following formula (d2):

[0190]

[0191] R ｄｂ１ , R ｄｃ１ R each independently represents a hydrogen atom or a methyl group. ｄｂ２ , R ｄｃ２ each independently represents an alkylene group which may have a substituent, or an arylene group which may have a substituent. ２ represents a divalent organic group. * represents a bond.

[0192] R ｄｂ２ , R ｄｃ２The alkylene group preferably has 1 or more carbon atoms, more preferably 2 or more carbon atoms, and preferably 5 or less carbon atoms, more preferably 4 or less carbon atoms, and even more preferably 3 or less carbon atoms. The alkylene group may be linear or branched. Specific examples include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a pentylene group, and an isopentylene group, with an ethylene group and a propylene group being preferred. ｄｂ２ , R ｄｃ２ The arylene group of R is preferably a phenylene group or a naphthylene group, and more preferably a phenylene group. ｄｂ２ , R ｄｃ２ Examples of the substituents that the alkylene group and arylene group have include a hydroxyl group and a halogen atom. ｄｂ２ , R ｄｃ２ From the viewpoint of liquid repellency and ink jet wetting and spreading properties, L is more preferably an unsubstituted ethylene group or an unsubstituted propylene group. ２ The divalent organic group in is not particularly limited, but examples thereof include a urethane group, an ester group, and a bond between a hydroxyl group and an epoxy group. Specific examples thereof include the following structures.

[0193]

[0194] L ２ As the hydroxyl group, (d2-3) and (d2-4) are preferable, and (d2-4) is more preferable.

[0195] Specific examples of the repeating unit (D2) are as follows.

[0196]

[0197] From the viewpoint of inkjet wetting and spreading properties, (d2-23) and (d2-24) are preferred, and (d2-23) is more preferred. The repeating unit (D2) may contain one or more types.

[0198] The molar number of repeating units (D1) in the silicon-containing copolymer resin (D) is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, and even more preferably 20 mol% or more, relative to 100 mol% of all repeating units in the silicon-containing copolymer resin (D). Also, 70 mol% or less is preferred, more preferably 50 mol% or less, even more preferably 40 mol% or less, and even more preferably 30 mol% or less. Setting the molar number at or above the lower limit of the aforementioned value tends to enhance liquid repellency. Setting the molar number at or below the upper limit of the aforementioned value tends to improve inkjet wetting and spreading properties. The above upper and lower limits can be combined arbitrarily. For example, it may be 5 to 70 mol%, 10 to 50 mol%, 15 to 40 mol%, or 20 to 30 mol%.

[0199] The molar number of repeating units (D2) in the silicon-containing copolymer resin (D) is not particularly limited, but is preferably 30 mol% or more, more preferably 50 mol% or more, even more preferably 60 mol% or more, and even more preferably 70 mol% or more, relative to 100 mol% of all repeating units in the silicon-containing copolymer resin (D). Also, 95 mol% or less is preferred, more preferably 90 mol% or less, even more preferably 85 mol% or less, and even more preferably 80 mol% or less is preferred. By setting the molar number at or above the lower limit, inkjet wetting and spreading properties tend to be improved. Furthermore, by setting the molar number at or below the upper limit, liquid repellency tends to be improved. The above upper and lower limits can be arbitrarily combined. For example, it may be 30 to 95 mol%, 50 to 90 mol%, 60 to 85 mol%, or 70 to 80 mol%.

[0200] The ratio of the total molar amount of the repeating unit (D1) and the repeating unit (D2) to the total molar amount of all repeating units in the silicon-containing copolymer resin (D) is not particularly limited, but the total molar amount of the repeating unit (D1) and the repeating units is preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 90 mol% or more, and particularly preferably 98 mol% or more, relative to the total molar amount of all repeating units (100%). By keeping the ratio below the upper limit of the aforementioned value, inkjet wetting and spreading properties tend to be compatible with liquid repellency.

[0201] The molar ratio of repeating units (D1) and repeating units (D2) in the silicon-containing copolymer resin (D) is not particularly limited. For example, based on 100 mol% of the total number of moles of repeating units (D1) and repeating units (D2), the proportion of repeating units (D1) is preferably 5 mol% or more, more preferably 10 mol% or more, and even more preferably 15 mol% or more. The proportion is preferably 95 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 40 mol% or less, particularly preferably 30 mol% or less, and most preferably 24 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, the proportion may be 5 to 95 mol%, 5 to 70 mol%, 10 to 50 mol%, 10 to 40 mol%, 15 to 30 mol%, or 15 to 24 mol%. Setting the proportion at or above the lower limit tends to enhance liquid repellency. Setting the proportion at or below the upper limit tends to improve inkjet wetting and spreading properties.

[0202] The content of the structure of formula (d1) in the silicon-containing copolymer resin (D) is not particularly limited, but is preferably 5% by weight or more, more preferably 10% by weight or more, and even more preferably 15% by weight or more, relative to the mass of the silicon-containing copolymer resin (D). Also, it is preferably 80% by weight or less, more preferably 50% by weight or less, even more preferably 30% by weight or less, even more preferably 28% by weight or less, and particularly preferably 25% by weight. By making it equal to or greater than the lower limit of the aforementioned value, the liquid repellency tends to be enhanced. Also, by making it equal to or less than the upper limit of the aforementioned value, the inkjet wetting and spreading properties tend to be improved.

[0203] The content of silicon atoms in the silicon-containing copolymer resin (D) is not particularly limited, but is preferably 1% by weight or more, more preferably 4% by weight or more, even more preferably 5% by weight or more, even more preferably 6% by weight or more, and particularly preferably 7% by weight or more, relative to the mass of the silicon-containing copolymer resin (D). Also, it is preferably 50% by weight or less, more preferably 20% by weight or less, even more preferably 12% by weight or less, and even more preferably 10% by weight or less. By setting it to the lower limit or more, liquid repellency tends to be enhanced. Furthermore, by setting it to the upper limit or less, inkjet wetting and spreading properties tend to be improved.

[0204] The silicon-containing copolymer resin (D) may contain repeating units other than the repeating units (D1) and (D2). Examples of such repeating units include repeating units having a carboxy group and repeating units having an ester bond other than the repeating units (D1) and (D2). Furthermore, the silicon-containing copolymer resin (D) preferably does not contain fluorine atoms. The absence of fluorine atoms reduces environmental accumulation and reduces the environmental impact.

[0205] The number average molecular weight (Mn) of the silicon-containing copolymer resin (D) is preferably 1,000 or more, more preferably 2,000 or more, and even more preferably 2,500 or more. It is also preferably 20,000 or less, more preferably 10,000 or less, and even more preferably 5,000 or less. By setting it at or above the lower limit, inkjet wetting and spreading properties tend to be good. By setting it at or below the upper limit, gelation and the like are less likely to occur, synthesis is easier, and inkjet wetting and spreading properties tend to be good. The weight average molecular weight (Mw) of the silicon-containing copolymer resin (D) is preferably 3,000 or more, more preferably 5,000 or more, even more preferably 8,000 or more, even more preferably 10,000 or more, and particularly preferably 13,000 or more. It is also preferably 100,000 or less, more preferably 50,000 or less, and even more preferably 20,000 or less. By setting it at or above the lower limit, inkjet wetting and spreading properties tend to be good. By setting it at or below the upper limit, gelation and the like are less likely to occur, synthesis is easier, and inkjet wetting and spreading properties tend to be good.

[0206] The content of the silicon-containing copolymer resin (D) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.3% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 1.5% by mass or less, even more preferably 1% by mass or less, and particularly preferably 0.8% by mass or less, based on the total solids content of the photosensitive resin composition. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 5% by mass is preferred, 0.01 to 3% by mass is preferred, 0.1 to 3% by mass is more preferred, 0.3 to 1.5% by mass is even more preferred, 0.3 to 1% by mass is particularly preferred, and 0.3 to 0.8% by mass is particularly preferred. By setting the content at or above the lower limit, liquid repellency tends to be improved. By setting the content at or below the upper limit, inkjet wetting and spreading properties tend to be good.

[0207] The synthesis method for the silicon-containing copolymer resin (D) is not particularly limited, and known synthesis methods can be used. For example, a silicon-containing copolymer resin (D) can be synthesized by a polymerization method comprising a polymerizable monomer (DA) having a structure of formula (d1) and a functional group (Db) (R ｄｂ３ The compound (DC) can be synthesized by reacting a polymer (DP) obtained by copolymerizing at least a polymerizable monomer (DB) having the functional group (Db) with a compound (DC) having an ethylenically unsaturated group and a functional group (Dc) reactive with the functional group (Db). Here, the ethylenically unsaturated group possessed by the repeating unit (D2) in the silicon-containing copolymer (D) is derived from the ethylenically unsaturated group possessed by the compound (DC). "Polymerizable monomer" refers to a compound having a polymerizable unsaturated group, and examples of the polymerizable unsaturated group possessed by the polymerizable monomer (DA) and the polymerizable monomer (DB) include C=C-containing groups such as (meth)acryloyl, (meth)acryloyloxy, (meth)acryloylamino, vinyl ether, allyl, styryl, and maleimide groups. Among these, (meth)acryloyl and (meth)acryloyloxy groups are preferred due to their ease of raw material availability and favorable polymerization reactivity. The number of polymerizable unsaturated groups contained in the polymerizable monomer may be one or two or more.

[0208] As the polymerizable monomer (DA), for example, a polymerizable monomer represented by the following formula (d1-A) is preferably used.

[0209]

[0210] Here, R １ , R ２ , R ３ , R ４ , L １ has the same meaning as formula (d1-1).

[0211] The polymerizable monomer (DA) can be produced by a known method, or a commercially available product may be used. Examples of the polymerizable monomer (DA) include 3-(methacryloyloxy)propyltris(trimethylsiloxy)silane.

[0212] The polymerizable monomer (DB) having a functional group (Db) is preferably a polymerizable monomer represented by the following general formula (d2-B):

[0213]

[0214] In formula (d2-B), R ｄｂ１ , R ｄｂ２ is R in formula (d2) ｄｂ１ , R ｄｂ２ It is synonymous with R ｄｂ３ is a hydroxyl group, an isocyanate group, an epoxy group, a carboxyl group, or a carboxylic acid halide group. ｄｂ３ corresponds to the functional group (Db) of the polymerizable monomer (DB).

[0215] Examples of the polymerizable monomer (DB) include polymerizable monomers having a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, N-(2-hydroxyethyl) (meth)acrylamide, glycerin mono(meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(meth)acryloyloxyethyl-2-hydroxyethyl phthalate, and lactone-modified (meth)acrylates having a hydroxyl group at the terminal; Examples of the polymerizable monomer include polymerizable monomers having an isocyanate group, such as 2-(meth)acryloyloxyethyl isocyanate, 2-(2-(meth)acryloyloxyethoxy)ethyl isocyanate, and 1,1-bis((meth)acryloyloxymethyl)ethyl isocyanate; polymerizable monomers having an epoxy group, such as glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether; polymerizable monomers having a carboxyl group, such as (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl phthalic acid, maleic acid, and itaconic acid; polymerizable monomers having an acid anhydride group, such as maleic anhydride and itaconic anhydride; and polymerizable monomers having a carboxylic acid halide group, such as (meth)acrylic acid chloride and (meth)acrylic acid bromide.

[0216] The polymerization form of the polymer (DP), which is a copolymer having at least the polymerizable monomer (DA) and the polymerizable monomer (DB) as polymerization components, is not particularly limited, and may be a random copolymer of the polymerizable monomer (DA) and the polymerizable monomer (DB), or a block copolymer of the polymerizable monomer (DA) and the polymerizable monomer (DB).

[0217] The polymer (DP) can be produced by copolymerizing the polymerizable monomer (DA), the polymerizable monomer (DB), and, if necessary, other polymerizable monomers in an organic solvent in the presence of a radical polymerization initiator. The organic solvent used here is preferably a ketone, an ester, an amide, a sulfoxide, an ether, or a hydrocarbon, and specific examples thereof include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, diethyl ether, diisopropyl ether, tetrahydrofuran, dioxane, toluene, and xylene.

[0218] As the radical polymerization initiator used in the production of the polymer (DP), known compounds can be used. For example, acetyl peroxide, cumyl peroxide, t-butyl peroxide, propionyl peroxide, benzoyl peroxide, 2-chlorobenzoyl peroxide, 3-chlorobenzoyl peroxide, 4-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, 4-bromomethylbenzoyl peroxide, lauroyl peroxide, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2-methylpropyl-1-hydroperoxide, triphenyl peroxide, peroxides such as t-butyl peracetate, t-butyl hydroperoxide, t-butyl performate, t-butyl peracetate, t-butyl perbenzoate, t-butyl per-2-ethylhexanoate, t-butyl perphenylacetate, and t-butyl per-4-methoxyacetate; 2,2'-dichloro-2,2'-azobispropane, 1,1'-azo(methylethyl)diacetate, 2,2'-azobis(2-amidinopropane) nitrate, 2,2'-azobisisobutane, 2,2'-azo Bisisobutylamide, 2,2'-azobisisobutyronitrile, methyl 2,2'-azobis-2-methylpropionate, 2,2'-dichloro-2,2'-azobisbutane, 2,2'-azobis-2-methylbutyronitrile, dimethyl 2,2'-azobisisobutyrate, dimethyl 2,2'-azobisisobutyrate, 2-(4-methylphenylazo)-2-methylmalonodinitrile, 4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethyl Examples of the azo compounds include ethylphenylazo-2-methylmalonodinitrile, 1,1'-azobis-1-cyclohexanecarbonitrile, 1,1'-azobis-1-phenylethane, 1,1'-azobiscumene, ethyl 4-nitrophenylazocyanoacetate, phenylazodiphenylmethane, phenylazotriphenylmethane, 4-nitrotriphenylazotriphenylmethane, and 1,1'-azobis-1,2-diphenylethane. Furthermore, chain transfer agents such as lauryl mercaptan, 2-mercaptoethanol, thioglycerol, ethylthioglycolic acid, and octylthioglycolic acid can also be used as needed.

[0219] The compound (DC) is a compound having a functional group (Dc) reactive with the functional group (Db) and an ethylenically unsaturated group. When the functional group (Db) is a hydroxyl group, examples of the functional group (Dc) include an isocyanate group, an epoxy group, a carboxyl group, an acid anhydride group, and a carboxylic acid halide group. When the functional group (Db) is an isocyanate group, examples of the functional group (Dc) include a hydroxyl group. When the functional group (Db) is an epoxy group, examples of the functional group (Dc) include a hydroxyl group, a carboxyl group, and an acid anhydride group. When the functional group (Db) is a carboxyl group, examples of the functional group (Dc) include a hydroxyl group and an epoxy group. When the functional group (Db) is a carboxylic acid halide group, examples of the functional group (Dc) include a hydroxyl group.

[0220] The functional group (Db) of the polymerizable monomer (DB) and the functional group (Dc) of the compound (DC) are preferably selected so that the silicon-containing copolymer resin (D) contains a urethane bond, and it is more preferable that the functional group (b) is a hydroxyl group and the functional group (Dc) is an isocyanate group, or that the functional group (Db) is an isocyanate group and the functional group (Dc) is a hydroxyl group. The structure of the compound (DC) is not particularly limited, but a compound represented by the following general formula (c-1) is preferred.

[0221]

[0222] In formula (d2-c), R ｄｃ１ , R ｄｃ２ is R in formula (d2) ｄｃ１ , R ｄｃ２ It is synonymous with R ｄｃ３ R is an isocyanate group, an epoxy group, a carboxyl group, an acid anhydride group, a carboxylic acid halide group, or a hydroxyl group. ｄｃ３ corresponds to the functional group (Dc) of the compound (DC).

[0223] Examples of the compound (DC) include unsaturated monomers having a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, N-(2-hydroxyethyl) (meth)acrylamide, glycerin mono(meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(meth)acryloyloxyethyl-2-hydroxyethyl phthalate, and lactone-modified (meth)acrylates having a hydroxyl group at the terminal; unsaturated monomers having an isocyanate group, such as 2-(2-(meth)acryloyloxyethoxy)ethyl isocyanate and 1,1-bis((meth)acryloyloxymethyl)ethyl isocyanate; unsaturated monomers having an epoxy group, such as glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether; unsaturated monomers having a carboxyl group, such as (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl phthalic acid, maleic acid and itaconic acid; unsaturated monomers having an acid anhydride group, such as maleic anhydride and itaconic anhydride; and unsaturated monomers having a carboxylic acid halide group, such as (meth)acrylic acid chloride and (meth)acrylic acid bromide. Also usable are unsaturated monomers having a hydroxyl group and a plurality of polymerizable unsaturated groups, such as 2-hydroxy-3-acryloyloxypropyl methacrylate, pentaerythritol triacrylate, and dipentaerythritol pentaacrylate.

[0224] In particular, from the viewpoint of favorable polymerization curing properties upon irradiation with ultraviolet light, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 4-hydroxybutyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, N-(2-hydroxyethyl)acrylamide, 2-acryloyloxyethyl isocyanate, 4-hydroxybutyl acrylate glycidyl ether, and acrylic acid are preferred.

[0225] When the polymer (DP) has two or more functional groups (Db), the compound (DC) may have a functional group reactive with at least one of the two or more functional groups (Db). Furthermore, two or more compounds (DC) may be used as long as they are reactive with the functional groups (Db) of the polymer (DP).

[0226] The proportion of the structure derived from compound (DC) in silicon-containing copolymer resin (D) is, for example, 0.3 to 1.0 equivalent of the amount of substance of functional group (Db) in polymer (DP), preferably 0.5 to 1.0 equivalent of the amount of substance of functional group (Db) in polymer (DP), and more preferably 0.8 to 1.0 equivalent of the amount of substance of functional group (Db) in polymer (DP).

[0227] The method of reacting the polymer (DP) with the compound (DC) may be carried out under conditions that do not polymerize the polymerizable unsaturated group in the compound (DC), and for example, the reaction is preferably carried out by adjusting the temperature conditions to the range of 30 to 120° C. This reaction is preferably carried out in the presence of a catalyst and a polymerization inhibitor, and, if necessary, in the presence of an organic solvent.

[0228] For example, when the functional group (Db) is a hydroxyl group and the functional group (Dc) is an isocyanate group, or when the functional group (Db) is an isocyanate group and the functional group (Dc) is a hydroxyl group, a preferred method is to use, as a polymerization inhibitor, for example, p-methoxyphenol, hydroquinone, or 2,6-di-t-butyl-4-methylphenol, and as a urethanization reaction catalyst, for example, dibutyltin dilaurate, dibutyltin diacetate, tin octylate, or zinc octylate, and to carry out the reaction at a temperature in the range of 20 to 150°C (preferably in the range of 40 to 120°C). Furthermore, when the functional group (Db) is an epoxy group and the functional group (Dc) is a carboxyl group, or when the functional group (Db) is a carboxyl group and the functional group (Dc) is an epoxy group, it is preferable to use, as a polymerization inhibitor, for example, p-methoxyphenol, hydroquinone, or 2,6-di-t-butyl-4-methylphenol, and, as an esterification reaction catalyst, for example, a tertiary amine such as triethylamine, a quaternary ammonium such as tetramethylammonium chloride, a tertiary phosphine such as triphenylphosphine, or a quaternary phosphonium such as tetrabutylphosphonium chloride, and to carry out the reaction at a reaction temperature in the range of 80 to 130°C (preferably in the range of 100 to 120°C).

[0229] The organic solvent used in the above reaction is preferably a ketone, an ester, an amide, a sulfoxide, an ether, or a hydrocarbon, and examples thereof include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, diethyl ether, diisopropyl ether, tetrahydrofuran, dioxane, toluene, and xylene. These may be appropriately selected in consideration of boiling point and compatibility.

[0230] [1-1-5] Solvent The photosensitive resin composition of the present invention usually contains a solvent, and is used in a state in which each component contained in the photosensitive resin composition is dissolved or dispersed in the solvent. The solvent is not particularly limited, and examples thereof include the following organic solvents.

[0231] Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-tert-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, and diethylene glycol monomethyl ether. glycol dialkyl ethers such as ethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and dipropylene glycol dimethyl ether; glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, 3-methoxy-1-butyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, and 3-methyl-3-methoxybutyl acetate;Glycol diacetates such as ethylene glycol diacetate, propylene glycol diacetate, 1,3-butylene glycol diacetate, 1,4-butanediol diacetate, and 1,6-hexylene glycol diacetate; alkyl acetates such as cyclohexanol acetate; ethers such as amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether, ethyl isobutyl ether, and dihexyl ether; acetone, methyl ethyl ketone, and methyl isopropyl Ketones such as methyl amyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketone, methyl nonyl ketone, and methoxymethyl pentanone; methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, and methoxymethyl pentanone; monohydric or polyhydric alcohols such as alcohol, glycerin, and benzyl alcohol; aliphatic hydrocarbons such as n-pentane, n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane; alicyclic hydrocarbons such as cyclohexane, methylcyclohexane, methylcyclohexene, and bicyclohexyl; aromatic hydrocarbons such as benzene, toluene, xylene, and cumene; amyl formate, ethyl formate, ethyl acetate, propyl acetate, butyl acetate, amyl acetate, methyl isobutyrate, and ethyl propionate. Chain or cyclic esters such as propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; alkoxycarboxylic acids such as 3-methoxypropionic acid and 3-ethoxypropionic acid; halogenated hydrocarbons such as butyl chloride and amyl chloride;Ether ketones such as methoxymethylpentanone; nitriles such as acetonitrile and benzonitrile; tetrahydrofurans such as tetrahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran;

[0232] Commercially available solvents include, for example, mineral spirits, Balsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and No. 2, Solvesso #150, Shell TS28 Solvent, Carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, and diglyme (all trade names).

[0233] The solvent is capable of dissolving or dispersing each component contained in the photosensitive resin composition and is selected depending on the method of use of the photosensitive resin composition of the present invention. From the viewpoint of coatability, the boiling point of the solvent under atmospheric pressure is preferably 60 to 280°C, more preferably 70 to 260°C. Propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

[0234] The solvent may be used alone or in combination of two or more. The solvent is preferably used so that the total solids content in the photosensitive resin composition solution is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 20% by mass or more, particularly preferably 25% by mass or more, and preferably 90% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 35% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, the solvent is preferably used so that the content is preferably 10 to 90% by mass, more preferably 15 to 50% by mass, even more preferably 20 to 40% by mass, and particularly preferably 25 to 35% by mass. By using a solvent at or above the lower limit, the occurrence of coating unevenness tends to be suppressed. By using a solvent at or below the upper limit, the occurrence of, for example, foreign matter and cissing tends to be suppressed.

[0235] [1-1-6] (E) Colorant The photosensitive resin composition of the present invention may further contain (E) a colorant. By containing (E) a colorant, appropriate light absorption properties can be obtained, and in particular, appropriate light blocking properties can be obtained when used for applications in which light scattering is the purpose, by using a white colorant.

[0236] The type of colorant (E) used in the present invention is not particularly limited, and may be a pigment or a dye. From the viewpoint of durability, it is preferable to use a pigment.

[0237] The pigment contained in the (E) colorant may be one type or two or more types. In particular, from the viewpoint of uniformly blocking light in the visible region, two or more types are preferred. The type of pigment that can be used as the (E) colorant is not particularly limited, but examples thereof include organic pigments and inorganic pigments. When light-blocking properties are the objective, it is preferable to use an organic pigment from the viewpoint of controlling the transmission wavelength of the photosensitive resin composition and efficiently curing it. Examples of organic pigments include organic color pigments and organic black pigments. Here, the organic color pigment means an organic pigment that exhibits a color other than black, and examples thereof include red pigments, orange pigments, blue pigments, purple pigments, green pigments, and yellow pigments.

[0238] Among organic pigments, it is preferable to use organic color pigments from the viewpoint of ultraviolet absorption. The organic color pigments may be used alone or in combination of two or more. When used for light-shielding purposes, it is more preferable to use a combination of organic color pigments of different colors, and it is even more preferable to use a combination of organic color pigments that exhibit a color close to black.

[0239] The chemical structure of these organic pigments is not particularly limited, but examples include azo, phthalocyanine, quinacridone, benzimidazolone, isoindolinone, dioxazine, indanthrene, and perylene pigments. Specific examples of pigments that can be used are listed below by pigment number. Terms such as "C.I. Pigment Red 2" listed below refer to the Color Index (C.I.).

[0240] Examples of red pigments include C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166 , 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276. From the viewpoint of light-blocking properties and dispersibility, C.I. Pigment Red 48:1, 122, 149, 168, 177, 179, 194, 202, 206, 207, 209, 224, 242, 254 are preferred, and C.I. Pigment Red 177, 209, 224, 254 are more preferred. In terms of dispersibility and light-blocking properties, preferred are C.I. Pigment Red 177, 254, and 272. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use a red pigment with low ultraviolet absorption, and from this viewpoint, C.I. Pigment Red 254 and 272 are preferred.

[0241] Examples of orange pigments include C.I. Pigment Orange 1, 2, 5, 13, 16, 17, 19, 20, 21, 22, 23, 24, 34, 36, 38, 39, 43, 46, 48, 49, 61, 62, 64, 65, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78, and 79. From the viewpoint of dispersibility and light-blocking properties, C.I. Pigment Orange 13, 43, 64, and 72 are preferred, and C.I. Pigment Orange 43, 64, and 72 are more preferred. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use an orange pigment with low ultraviolet absorption, and from this viewpoint, C.I. Pigment Orange 64 and 72 are preferred.

[0242] Examples of blue pigments include C.I. Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. From the viewpoint of light-blocking properties, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, and 60 are preferred, and C.I. Pigment Blue 15:6 is more preferred. From the viewpoint of dispersibility and light-blocking properties, C.I. Pigment Blue 15:6, 16, and 60 are preferred, and C.I. More preferred are C.I. Pigment Blue 15:6 and 60. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use a blue pigment with low ultraviolet absorption, and from this viewpoint, C.I. Pigment Blue 60 is more preferred.

[0243] Examples of purple pigments include C.I. Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. From the viewpoint of light-blocking properties, C.I. Pigment Violet 19 and 23 are preferred, and C.I. Pigment Violet 23 is more preferred. From the viewpoint of dispersibility and light-blocking properties, C.I. Pigment Violet 23 and 29 are preferred. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use a purple pigment with low ultraviolet absorption, and from this viewpoint, C.I. Pigment Violet 29 is preferred.

[0244] Examples of organic color pigments that can be used in addition to red pigments, orange pigments, blue pigments, and purple pigments include green pigments and yellow pigments.

[0245] Examples of green pigments include C.I. Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54, and 55, and C.I. Pigment Green 7 and 36 are preferred.

[0246] Examples of yellow pigments include C.I. Pigment Yellow 1, 1:1, 2, 3, 4, 5, 6, 9, 10, 12, 13, 14, 16, 17, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 41, 42, 43, 48, 53, 55, 61, 62, 62:1, 63, 65, 73, 74, 75, 81, 83, 87, 93, 94, 95, 97, 100, 101, 104, 105, 108, 109, 110, 111, 116, 117, 119, 120, 126, 127, 127:1, 128, 129, 133, 134, 136, 138 , 139, 142, 147, 148, 150, 151, 153, 154, 155, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 172, 173, 174, 175, 176, 180, 181, 182, 183, 184, 185, 188, 189, 190, 191, 191:1, 192, 193, 194, 195, 196, 197, 198, 199, 200, 202, 203, 204, 205, 206, 207, 208 can be mentioned, and C.I. C.I. Pigment Yellow 83, 117, 129, 138, 139, 150, 154, 155, 180, and 185 are more preferred, and C.I. Pigment Yellow 83, 138, 139, 150, and 180 are even more preferred.

[0247] From the viewpoint of light-shielding properties and liquid repellency, it is preferable to use at least one pigment selected from the group consisting of red pigments, orange pigments, blue pigments and purple pigments.

[0248] From the viewpoint of light-blocking properties and liquid repellency, it is preferable to contain at least one of the following pigments: Red pigment: C.I. Pigment Red 177, 254, 272 Orange pigment: C.I. Pigment Orange 64, 72 Blue pigment: C.I. Pigment Blue 15:6, 16, 60 Purple pigment: C.I. Pigment Violet 23, 29

[0249] When two or more organic color pigments are used in combination, the combination of organic color pigments is not particularly limited, but from the viewpoint of light-blocking properties, it is preferable that the (E) colorant contains at least one selected from the group consisting of red pigments and orange pigments and at least one selected from the group consisting of blue pigments and violet pigments. The color combination is not particularly limited, but from the viewpoint of light-blocking properties, examples of the combination include a combination of a red pigment and a blue pigment, a combination of a blue pigment and an orange pigment, and a combination of a blue pigment, an orange pigment and a violet pigment.

[0250] From the viewpoint of blocking blue light, it is preferable to contain a violet pigment as the colorant (E).

[0251] From the viewpoint of light-blocking properties, it is preferable to use an organic black pigment as the colorant (E). Examples of organic black pigments include perylene-based black pigments, aniline-based black pigments, and benzodifuranone-based black pigments. Examples of perylene-based black pigments include Lumogen Black (registered trademark) FK4281, K0087, and Paliogen Black (registered trademark) EH0788 (all manufactured by BASF), and examples of aniline-based black pigments include Paliotol Black (registered trademark) L0080, D0080, and K0080 (all manufactured by BASF). From the viewpoint of achieving good dispersibility, developability, tapered shape control, and liquid repellency, benzodifuranone-based black pigments are preferred. Among benzodifuranone-based black pigments, it is preferable to use an organic black pigment containing at least one selected from the group consisting of a compound represented by the following general formula (A1) (hereinafter, may be referred to as "compound (A1)"), a geometric isomer of compound (A1), a salt of compound (A1), and a salt of a geometric isomer of compound (A1) (hereinafter, may be referred to as "organic black pigment represented by general formula (A1)").

[0252]

[0253] In formula (A1), R a11 and R a16 each independently represents a hydrogen atom, CH, CF, a fluorine atom, or a chlorine atom; R a12 , R a13 , R a14 , Ra15 , R a17 , R a18 , R a19 and R a20 are each independently a hydrogen atom, a halogen atom, R a21 , COOH, COOR a21 , COO - , CONH2, CONHR a21 , C.O.R. a21 R a22 , CN, OH, OR a21 , COCR a21 , OOCNH2, OOCNHR a21 , OOCNR a21 R a22 , NO2, NH2, NHR a21 , N.R. a21 R a22 , NHCOR a22 , N.R. a21 COR a22 , N=CH2, N=CHR a21 , N=CR a21 R a22 , S.H., S.R. a21 , SOR a21 , SO2R a21 , SO3R a21 , SO3H, SO3 - , SO2NH2, SO2NHR a21 or SO2NR a21 R a22 represents; R a12 and R a13 , R a13 and R a14 , R a14 and R a15 , R a17 and R a18 , R a18 and R a19 , and R a19 and R a20 may be directly bonded to each other or may be bonded to an oxygen atom, a sulfur atom, an NH or an NR a21 may be connected to each other by bridges; R a21 and R a22each independently represents an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 3 to 12 carbon atoms, an alkenyl group having 2 to 12 carbon atoms, a cycloalkenyl group having 3 to 12 carbon atoms, or an alkynyl group having 2 to 12 carbon atoms.

[0254] Compound (A1) and the geometric isomers of compound (A1) have the following core structure (where the substituents in the structural formula are omitted), and the trans-trans isomer is probably the most stable.

[0255]

[0256] When compound (A1) is anionic, it is preferably a salt whose charge is compensated with any known suitable cation, for example, a metal, organic, inorganic, or metal-organic cation, specifically, an alkali metal, alkaline earth metal, transition metal, primary ammonium, secondary ammonium, tertiary ammonium such as trialkylammonium, quaternary ammonium such as tetraalkylammonium, or an organometallic complex. When a geometric isomer of compound (A1) is anionic, it is preferably a similar salt.

[0257] The following substituents in formula (A1) and their definitions tend to have a high shielding rate, and are therefore preferred because they are thought to have no absorption and do not affect the hue of the pigment. a12 , R a14 , R a15 , R a17 , R a19 and R a20 are each independently preferably a hydrogen atom, a fluorine atom, or a chlorine atom, and more preferably a hydrogen atom. a13 and R a18 are each independently preferably a hydrogen atom, NO2, OCH3, OC2H5, a bromine atom, a chlorine atom, CH3, C2H5, N(CH3)2, N(CH3)(C2H5), N(C2H5)2, α-naphthyl, β-naphthyl, SO3H, or SO3 - is more preferably a hydrogen atom or SO3H, and particularly preferably a hydrogen atom.

[0258] R a11 and R a16are each independently preferably a hydrogen atom, CH or CF, more preferably a hydrogen atom. a11 and R a16 , R a12 and R a17 , R a13 and R a18 , R a14 and R a19 , and R a15 and R a20 At least one combination selected from the group consisting of R a11 is R a16 is the same as R a12 is R a17 is the same as R a13 is R a18 is the same as R a14 is R a19 and R a15 is R a20 is the same as

[0259] Examples of the alkyl group having 1 to 12 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, a tert-butyl group, a 2-methylbutyl group, an n-pentyl group, a 2-pentyl group, a 3-pentyl group, a 2,2-dimethylpropyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a 1,1,3,3-tetramethylbutyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, an undecyl group, and a dodecyl group.

[0260] Examples of the cycloalkyl group having 3 to 12 carbon atoms include a cyclopropyl group, a cyclopropylmethyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a methylcyclohexyl group, a trimethylcyclohexyl group, a thujyl group, a norbornyl group, a bornyl group, a norcaryl group, a caryl group, a methyl group, a norpinyl group, a pinyl group, an adamantan-1-yl group, and an adamantan-2-yl group.

[0261] Examples of the alkenyl group having 2 to 12 carbon atoms include a vinyl group, an allyl group, a 2-propen-2-yl group, a 2-buten-1-yl group, a 3-buten-1-yl group, a 1,3-butadien-2-yl group, a 2-penten-1-yl group, a 3-penten-2-yl group, a 2-methyl-1-buten-3-yl group, a 2-methyl-3-buten-2-yl group, a 3-methyl-2-buten-1-yl group, a 1,4-pentadien-3-yl group, a hexenyl group, an octenyl group, a nonenyl group, a decenyl group, and a dodecenyl group.

[0262] Examples of the cycloalkenyl group having 3 to 12 carbon atoms include a 2-cyclobuten-1-yl group, a 2-cyclopenten-1-yl group, a 2-cyclohexen-1-yl group, a 3-cyclohexen-1-yl group, a 2,4-cyclohexadien-1-yl group, a 1-p-menthen-8-yl group, a 4(10)-thujen-10-yl group, a 2-norbornen-1-yl group, a 2,5-norbornadien-1-yl group, a 7,7-dimethyl-2,4-norcaradien-3-yl group, and a camphenyl group.

[0263] Examples of the alkynyl group having 2 to 12 carbon atoms include a 1-propyn-3-yl group, a 1-butyn-4-yl group, a 1-pentyn-5-yl group, a 2-methyl-3-butyn-2-yl group, a 1,4-pentadiyn-3-yl group, a 1,3-pentadiyn-5-yl group, a 1-hexyn-6-yl group, a cis-3-methyl-2-penten-4-yn-1-yl group, a trans-3-methyl-2-penten-4-yn-1-yl group, a 1,3-hexadiyn-5-yl group, a 1-octyn-8-yl group, a 1-nonyne-9-yl group, a 1-decyn-10-yl group, and a 1-dodecyn-12-yl group.

[0264] The halogen atom is, for example, a fluorine atom, a chlorine atom, a bromine atom or an iodine atom.

[0265] The organic black pigment represented by formula (A1) is preferably an organic black pigment containing at least one compound selected from the group consisting of a compound represented by the following general formula (A2) (hereinafter also referred to as "compound (A2)") and a geometric isomer of compound (A2):

[0266]

[0267] An example of the organic black pigment represented by compound (A2) is the trade name Irgaphor (registered trademark) Black S 0100 CF (manufactured by BASF). This organic black pigment is preferably dispersed using a dispersant, solvent, and method described below. Furthermore, the presence of a sulfonic acid derivative of compound (A1), particularly a sulfonic acid derivative of compound (A2), during dispersion can improve dispersibility and storage stability, so it is preferable that the organic black pigment contain these sulfonic acid derivatives.

[0268] As a colorant other than these organic pigments, an inorganic black pigment may be used. In addition to the organic pigment, an inorganic black pigment may also be used.

[0269] Examples of inorganic black pigments include carbon black, acetylene black, lamp black, bone black, graphite, iron black, cyanine black, titanium black, etc. Among these, carbon black is preferably used from the viewpoint of light-shielding properties.

[0270] Examples of carbon black include the following carbon blacks manufactured by Mitsubishi Chemical Corporation: MA7, MA8, MA11, MA77, MA100, MA100R, MA100S, MA220, MA230, MA600, MCF88, #5, #10, #20, #25, #30, #32, #33, #40, #44, #45, #47, #50, #52, #55, #650, #750, #850, #900, #950, and #9 60, #970, #980, #990, #1000, #2200, #2300, #2350, #2400, #2600, #2650, #3030, #3050, #315 0, #3250, #3400, #3600, #3750, #3950, #4000, #4010, OIL7B, OIL9B, OIL11B, OIL30B, OIL31B. Degussa: Printex (registered trademark, hereinafter the same) 3, Printex3OP, Printex30, Printex30OP, Printex40, Printex45, Printex55, Printex60, Printex75, Printex80, Printex85, Printex90, Printex A, Printex L, Printex G, Printex P, Printex U, Printex V, SpecialBlack550, SpecialBlack350, SpecialBlack250, SpecialBlack100, SpecialBlack6, SpecialBlack5, SpecialBlack4, Color Black FW1, Color Black FW2, Color Black FW2V, Color Black FW18, Color Black FW200, Color Black S160, Color Black S170. Cabot Corporation: Monarch (registered trademark, the same applies hereinafter) 120, Monarch 280, Monarch 460, Monarch 800, Monarch 880, Monarch 900, Monarch 1000, Monarch 1100, Monarch 1300, Monarch 1400, Monarch 4630, REGAL (registered trademark, the same applies hereinafter).) 99, REGAL 99R, REGAL 415, REGAL 415R, REGAL 250, REGAL 250R, REGAL 330, REGAL 400R, REGAL 550R, REGAL 660R, BLACK PEARLS 480, PEARLS 130, VULCAN (registered trademark, the same applies below) XC72R, ELFTEX (registered trademark)-8. Biller: RAVEN (registered trademark, the same applies hereinafter) 11, RAVEN 14, RAVEN 15, RAVEN 16, RAVEN 22, RAVEN 30, RAVEN 35, RAVEN 40, RAVEN 410, RAVEN 420, RAVEN 450, RAVEN 500, RAVEN 780, RAVEN 850, RAVEN 890H, RAVEN 100 0, RAVEN1020, RAVEN1040, RAVEN1060U, RAVEN1080U, RAVEN1170, RAVEN1190U, RAVEN1250, RAV EN1500, RAVEN2000, RAVEN2500U, RAVEN3500, RAVEN5000, RAVEN5250, RAVEN5750, RAVEN7000.

[0271] Carbon black may be coated with a resin. The use of resin-coated carbon black has the effect of improving adhesion to the glass substrate and volume resistivity. For example, the carbon black described in Japanese Patent Application Laid-Open No. 09-71733 can be suitably used as the resin-coated carbon black. Resin-coated carbon black is suitable from the viewpoint of volume resistivity and dielectric constant.

[0272] These organic and inorganic pigments are preferably dispersed and used so that the average particle size is preferably 1 μm or less, more preferably 0.5 μm or less, and even more preferably 0.25 μm or less. Here, the average particle size is based on the number of pigment particles. The average particle size of the pigment is a value determined from the pigment particle size measured by dynamic light scattering (DLS). Particle size measurement is performed on a sufficiently diluted photosensitive resin composition (usually diluted to a pigment concentration of approximately 0.005 to 0.2 mass %; however, if a concentration recommended by the measuring instrument is available, that concentration should be followed), and the measurement is performed at 25°C.

[0273] In addition to organic pigments and inorganic black pigments, dyes may also be used. Examples of dyes that can be used as colorants include azo dyes, anthraquinone dyes, phthalocyanine dyes, quinoneimine dyes, quinoline dyes, nitro dyes, carbonyl dyes, and methine dyes.

[0274] When the photosensitive resin composition of the present invention contains a colorant (E), the content of the colorant (E) is not particularly limited. However, it is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, and particularly preferably 4% by mass or more, based on the total solids content of the photosensitive resin composition. It is also preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, particularly preferably 12% by mass or less, and most preferably 10% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 1 to 50% by mass, more preferably 1 to 30% by mass, even more preferably 2 to 20% by mass, even more preferably 2 to 15% by mass, particularly preferably 3 to 12% by mass, and particularly preferably 4 to 10% by mass. By setting the content at or above the lower limit, light-blocking properties tend to be ensured. By setting the content at or below the upper limit, the alkali-soluble resin and photopolymerizable compound can be relatively increased, which tends to improve the curability and liquid repellency of the coating film.

[0275] When light scattering is the objective, a white pigment (E2) may be used in part or in whole of the colorant (E). Examples of the white pigment (E2) include metal oxides such as titanium oxide, zirconium oxide, hafnium oxide, and barium titanate, and inorganic fillers such as calcium silicate, magnesium carbonate, calcium carbonate, calcium sulfate, and barium sulfate. One type of white pigment (E2) may be used alone, or two or more types may be used in combination.

[0276] From the viewpoint of refractive index and light scattering property, it is preferable to use a metal oxide, more preferably titanium oxide, zirconium oxide or hafnium oxide, and even more preferably titanium oxide.

[0277] When the photosensitive resin composition of the present invention contains a white pigment (E2), the content is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, particularly preferably 4% by mass or more, and is preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 10% by mass or less, based on the total solids content of the photosensitive resin composition. The above upper and lower limits can be arbitrarily combined. For example, 1 to 50% by mass is preferred, 1 to 30% by mass is more preferred, 2 to 20% by mass is even more preferred, 3 to 15% by mass is even more preferred, and 4 to 10% by mass is particularly preferred. By setting the content at or above the lower limit, a high refractive index and improved light scattering properties tend to be achieved. By setting the content at or below the upper limit, the transmittance in the ultraviolet range can be increased, and the curability and liquid repellency of the coating film tend to be improved.

[0278] [1-1-7] (F) Dispersant The photosensitive resin composition of the present invention preferably contains a (F) dispersant in order to finely disperse the (E) colorant and stabilize the dispersed state. As the (F) dispersant, a polymer dispersant having a functional group is preferred, and from the viewpoint of dispersion stability, a polymer dispersant having a functional group such as a carboxy group; a phosphate group; a sulfonic acid group; or a base thereof; a primary, secondary, or tertiary amino group; a quaternary ammonium base; or a group derived from a nitrogen-containing heterocycle such as pyridine, pyrimidine, or pyrazine is more preferred. In particular, a polymer dispersant having a tertiary amino group or a quaternary ammonium base is particularly preferred from the viewpoint that the (E) colorant can be dispersed with a small amount of dispersant.

[0279] Examples of polymeric dispersants include urethane-based dispersants, acrylic-based dispersants, polyethyleneimine-based dispersants, polyallylamine-based dispersants, dispersants consisting of a monomer and a macromonomer having an amino group, polyoxyethylene alkyl ether-based dispersants, polyoxyethylene diester-based dispersants, polyether phosphate-based dispersants, polyester phosphate-based dispersants, sorbitan aliphatic ester-based dispersants, and aliphatic-modified polyester-based dispersants.

[0280] Examples of polymer dispersants include trade names such as EFKA (registered trademark, manufactured by BASF), DISPERBYK (registered trademark, manufactured by BYK-Chemie), DISPARLON (registered trademark, manufactured by Kusumoto Chemicals), SOLSPERSE (registered trademark, manufactured by Lubrizol), KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), and AJISPER (registered trademark, manufactured by Ajinomoto Co., Inc.) One type of polymer dispersant may be used alone, or two or more types may be used in combination.

[0281] The weight-average molecular weight (Mw) of the polymer dispersant is preferably 700 or more, more preferably 1,000 or more. It is also preferably 100,000 or less, more preferably 50,000 or less. The above upper and lower limits can be combined arbitrarily. For example, the weight-average molecular weight (Mw) of the polymer dispersant is preferably 700 to 100,000, more preferably 1,000 to 50,000. From the viewpoint of dispersion stability of the (E) colorant, it is preferable that the (E) colorant contains an acrylic polymer dispersant having a functional group. From the viewpoints of dispersibility and storage stability, a polymer dispersant having a basic functional group and either or both of a polyester bond and a polyether bond is preferable.

[0282] As the acrylic polymer dispersant, it is preferable to use a random copolymer, graft copolymer, or block copolymer of an unsaturated group-containing monomer having a functional group (the functional group here refers to the functional group contained in the polymer dispersant described above) and an unsaturated group-containing monomer not having a functional group. These copolymers can be produced by known methods.

[0283] The acrylic polymer dispersant is particularly preferably an A-B or B-A-B block copolymer consisting of an A block having a functional group and a B block having no functional group. In this case, the A block may contain, in addition to the partial structure derived from the unsaturated group-containing monomer having the functional group, a partial structure derived from the unsaturated group-containing monomer not having the functional group, and these may be contained in the A block in the form of either random copolymerization or block copolymerization. The content of the partial structure not having a functional group in the A block is preferably 80% by mass or less, more preferably 50% by mass or less, and even more preferably 30% by mass or less.

[0284] The B block is composed of a partial structure derived from an unsaturated group-containing monomer that does not contain the above functional group, but one B block may contain partial structures derived from two or more types of monomers, and these may be contained in the B block in the form of either random copolymerization or block copolymerization. The A-B or B-A-B block copolymer is prepared, for example, by the living polymerization method shown below. Living polymerization methods include anionic living polymerization, cationic living polymerization, and radical living polymerization.

[0285] The amount of quaternary ammonium salt group per 1 g of the AB block copolymer or B-A-B block copolymer that can be used in the present invention is preferably 0.1 to 10 mmol. By keeping it within this range, good dispersibility tends to be ensured.

[0286] When the block copolymer contains amino groups generated during the production process, the amine value is preferably 1 to 100 mgKOH / g. From the viewpoint of dispersibility, the amine value is preferably 10 mgKOH / g or more, more preferably 30 mgKOH / g or more, even more preferably 50 mgKOH / g or more, and is preferably 90 mgKOH / g or less, more preferably 80 mgKOH / g or less, and even more preferably 75 mgKOH / g or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 100 mgKOH / g is preferred, 10 to 90 mgKOH / g is more preferred, 30 to 80 mgKOH / g is even more preferred, and 50 to 75 mgKOH / g is particularly preferred.

[0287] The amine value is expressed as the mass of KOH equivalent to the amount of base per 1 g of solids in the dispersant sample, excluding the solvent, and is measured using the following method. 0.5 to 1.5 g of the dispersant sample is accurately weighed into a 100 mL beaker and dissolved in 50 mL of acetic acid. Using an automatic titrator equipped with a pH electrode, this solution is neutralized with a 0.1 mol / L HClO4 acetic acid solution. The inflection point on the titration pH curve is used as the titration endpoint, and the amine value is calculated using the following formula:

[0288] Amine value [mgKOH / g] = (561 × V) / (W × S) (where W represents the weighed amount of the dispersant sample [g], V represents the titration amount at the titration end point [mL], and S represents the solids concentration of the dispersant sample [% by mass]).

[0289] The acid value of the block copolymer is preferably low, preferably 10 mgKOH / g or less, although this depends on the presence or absence and type of acidic group that is the source of the acid value. The weight average molecular weight (Mw) of the block copolymer is preferably in the range of 1,000 to 100,000. By keeping the weight average molecular weight within this range, good dispersibility tends to be ensured.

[0290] Suitable acrylic polymer dispersants include, for example, EFKA-4300 and EFKA-4320 (manufactured by BASF), DISPERBYK-2000, DISPERBYK-2001, DISPERBYK-LPN21116, and DISPERBYK-LPN6919 (manufactured by BYK-Chemie).

[0291] When the photosensitive resin composition of the present invention contains a dispersant (F), its content is not particularly limited, but is preferably 0.1% by mass or more, more preferably 1% by mass or more, even more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total solids content of the photosensitive resin composition. It is also preferably 60% by mass or less, more preferably 40% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 0.1 to 60% by mass, more preferably 0.1 to 40% by mass, even more preferably 0.5 to 30% by mass, and particularly preferably 0.5 to 20% by mass. By setting the content at or above the lower limit, aggregation tends to be suppressed, and a coating film in which the colorant (F) is uniformly dispersed tends to be formed. By setting the content at or below the upper limit, the amount of other components can be relatively increased, which tends to improve patterning properties.

[0292] When the photosensitive resin composition of the present invention contains a dispersant (F), the content of the dispersant (F) is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, particularly preferably 30 parts by mass or more, and especially preferably 50 parts by mass or more, relative to 100 parts by mass of the colorant (E). It is also preferably 150 parts by mass or less, more preferably 120 parts by mass or less, and even more preferably 100 parts by mass or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 1 to 150 parts by mass, more preferably 5 to 120 parts by mass, even more preferably 10 to 100 parts by mass, particularly preferably 20 to 100 parts by mass, and especially preferably 50 to 100 parts by mass. By setting the content at or above the lower limit, the generation of residue due to aggregates tends to be suppressed. By setting the content at or below the upper limit, the amount of other components can be relatively increased, which tends to improve patterning properties.

[0293] [1-1-7] Polyfunctional Thiol Compound The photosensitive resin composition of the present invention may contain a polyfunctional thiol compound. A polyfunctional thiol compound is a compound containing two or more mercapto groups in one molecule. The inclusion of a polyfunctional thiol compound tends to improve liquid repellency.

[0294] The number of mercapto groups in one molecule is usually 2 or more, preferably 3 or more, and more preferably 4 or more. Also, 6 or less is preferable. For example, 2 to 6 is preferable, 3 to 6 is more preferable, and 4 to 6 is even more preferable. By making the number equal to or greater than the lower limit, liquid repellency tends to be improved. By making the number equal to or less than the upper limit, storage stability tends to be improved, and highly precise partition walls with narrow line widths tend to be formed. The polyfunctional thiol compound is preferably an aliphatic polyfunctional thiol compound. Specific examples include hexanedithiol, decanedithiol, butanediol bis(3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis(3-mercaptopropionate), ... pentaerythritol tris(3-mercaptopropionate), butanediol bis(3-mercaptobutyrate), ethylene glycol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione. From the viewpoint of liquid repellency, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione are more preferred, and pentaerythritol tetrakis(3-mercaptobutyrate) is even more preferred.The polyfunctional thiol compounds may be used alone or in combination of two or more.

[0295] When the photosensitive resin composition of the present invention contains a polyfunctional thiol compound, its content is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, still more preferably 0.8% by mass or more, and is preferably 5% by mass or less, more preferably 4% by mass or less, even more preferably 3% by mass or less, and even more preferably 2% by mass or less, relative to the total solids content of the photosensitive resin composition. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 5% by mass is preferred, 0.1 to 4% by mass is more preferred, 0.5 to 3% by mass is even more preferred, and 0.8 to 2% by mass is particularly preferred. By setting the content at or above the lower limit, liquid repellency tends to be improved. By setting the content at or below the upper limit, highly precise partition walls with narrow line widths tend to be formed.

[0296] The content ratio of the polyfunctional thiol compound relative to the photopolymerization initiator (B) in the photosensitive resin composition is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, and particularly preferably 20 parts by mass or more, per 100 parts by mass of the photopolymerization initiator (B). It is also preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 100 parts by mass or less, and particularly preferably 50 parts by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 5 to 500 parts by mass is preferred, more preferably 10 to 300 parts by mass, even more preferably 15 to 100 parts by mass, and particularly preferably 20 to 50 parts by mass. By setting the content at or above the lower limit, liquid repellency tends to be improved. By setting the content at or below the upper limit, highly precise partition walls with narrow line widths tend to be formed.

[0297] [1-1-9] Surfactant The photosensitive resin composition of the present invention may contain a surfactant. However, the silicon-containing copolymer resin (D) of the present invention is not included in the surfactants of the present invention. Surfactants can be used, for example, to improve the coatability of the photosensitive resin composition as a coating liquid and the developability of the coating film, and examples of such surfactants include fluorine-based surfactants and silicone-based surfactants. In particular, silicone-based surfactants are preferred because they have the effect of removing residues of the photosensitive resin composition from unexposed areas during development and also have the function of exhibiting wettability, and polyether-modified silicone-based surfactants are more preferred.

[0298] As the fluorine-based surfactant, a compound having a fluoroalkyl or fluoroalkylene group at least at one of the terminal, main chain, and side chain is suitable. Commercially available fluorine-based surfactants include, for example, BM Examples of such a cleaning agent include "BM-1000" and "BM-1100" manufactured by Chemie Co., Ltd.; "Megafac F142D," "Megafac F172," "Megafac F173," "Megafac F183," "Megafac F470," "Megafac F475," "Megafac F554," and "Megafac F559" manufactured by DIC Corporation; "DFX-18" manufactured by Neos Corporation; "Fluorad FC430," "Fluorad FC431," "FC-4430," and "FC4432" manufactured by 3M Japan Ltd.; and "Asahiguard (registered trademark) AG710," "Surflon (registered trademark, the same applies hereinafter) S-382," "Surflon SC-101," "Surflon SC-102," "Surflon SC-103," "Surflon SC-104," "Surflon SC-105," and "Surflon SC-106" manufactured by AGC.

[0299] Examples of commercially available silicone surfactants include "DC3PA," "SH7PA," "DC11PA," "SH21PA," "SH28PA," "SH29PA," "8032 Additive," and "SH8400" manufactured by Dow Corning Toray Co., Ltd., and "BYK (registered trademark, the same applies hereinafter) 323" and "BYK330" manufactured by BYK-Chemie.

[0300] The surfactants may be used alone or in combination of two or more.

[0301] [1-1-10] UV absorber The photosensitive resin composition of the present invention may contain a UV absorber. The UV absorber is added for the purpose of controlling the photocuring distribution by absorbing specific wavelengths of the light source used for exposure. The addition of a UV absorber can, for example, provide effects such as forming high-definition partition walls with narrow line widths and eliminating residues remaining in unexposed areas after development. As the UV absorber, from the viewpoint of inhibiting light absorption by the (B) photopolymerization initiator, for example, a compound having an absorption maximum in the wavelength range of 250 nm to 400 nm can be used.

[0302] The ultraviolet absorber preferably contains either or both of a benzotriazole-based compound and a triazine-based compound. It is believed that the inclusion of either or both of a benzotriazole-based compound and a triazine-based compound reduces the light absorption rate of the initiator at the bottom of the film, thereby reducing the line width at the bottom of the coating film and enabling the formation of high-definition partition walls with narrow line widths.

[0303] Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, octyl 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, ethylhexyl 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(3,5-di-tert-amyl-2-hydroxyphenyl)- ) benzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl] heptyl propionate, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl] octyl propionate, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl] nonyl propionate, and the like.

[0304] Commercially available benzotriazole compounds include, for example, Sumisorb (registered trademark, the same applies hereinafter) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry Co., Ltd.), TINUVIN (registered trademark, the same applies hereinafter) PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN 326, TINUVIN900, TINUVIN928, TINUVIN1130 (manufactured by BASF), EVERSORB70, EVERSORB71, EVERSORB72, EVERSORB73, EVERSORB74, EVERSORB75, EVERSORB76, EVERSORB234, EVERSORB77, EVERSORB78, EVERSORB80, EVERSORB81 ( Examples of such surfactants include those manufactured by Taiwan Yongko Chemical Industry Co., Ltd.), Tomisorb (registered trademark, the same applies hereinafter) 100, Tomisorb 600 (manufactured by API Corporation), SEESORB (registered trademark, the same applies hereinafter) 701, SEESORB 702, SEESORB 703, SEESORB 704, SEESORB 706, SEESORB 707, and SEESORB 709 (manufactured by Shipro Chemical Industry Co., Ltd.), and RUVA-93 (Otsuka Chemical Co., Ltd.).

[0305] Examples of triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazin-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, a reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and 2-ethylhexyl glycidyl ether, and 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3-5-triazine. From the viewpoints of liquid repellency and the ability to form highly precise partition walls with narrow line widths, hydroxyphenyltriazine compounds are preferred.

[0306] Examples of commercially available triazine compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF).

[0307] Other ultraviolet absorbers include, for example, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes, such as Sumisorb 130 (manufactured by Sumitomo Chemical), EVERSORB 10, EVERSORB 11, EVERSORB 12 (manufactured by Taiwan Yongko Chemical Industry Co., Ltd.), Tomisorb 800 (manufactured by API Corporation), SEESORB 100, SEESORB 101, SEESORB 101S, SEESORB 102, SEESORB 103, SEESORB 105, and SEESORB 106. benzophenone compounds such as SEESORB 107 and SEESORB 151 (manufactured by Shipro Chemicals); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemicals) and phenyl salicylate; cinnamic acid derivatives such as 2-ethylhexyl cinnamate, 2-ethylhexyl p-methoxycinnamate, isopropyl methoxycinnamate and isoamyl methoxycinnamate; α-naphthol, β-naphthol, α- Examples of suitable dyes include naphthol methyl ether, α-naphthol ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene as naphthalene derivatives; anthracene and 9,10-dihydroxyanthracene as anthracene and its derivatives; and dyes such as azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes. From the viewpoint of liquid repellency, cinnamic acid derivatives and naphthalene derivatives are preferred, and cinnamic acid derivatives are particularly preferred.

[0308] From the viewpoint of the tapered shape, either one or both of a benzotriazole-based compound and a hydroxyphenyltriazine-based compound are preferred, and a benzotriazole-based compound is particularly preferred.

[0309] The ultraviolet absorber may be used alone or in combination of two or more kinds.

[0310] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, its content is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and particularly preferably 1% by mass or more, relative to the total solid content of the photosensitive resin composition. It is also preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 15% by mass is preferred, 0.05 to 15% by mass is more preferred, 0.1 to 10% by mass is even more preferred, 0.5 to 5% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. By setting the content at or above the lower limit, highly precise partition walls with narrow line widths tend to be formed. By setting the content at or below the upper limit, liquid repellency tends to be enhanced.

[0311] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the blending ratio of the ultraviolet absorber to the photopolymerization initiator (B) is preferably 1 part by mass or more, more preferably 10 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, and preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 100 parts by mass or less, based on 100 parts by mass of the photopolymerization initiator (B). The above upper and lower limits can be arbitrarily combined. For example, 1 to 500 parts by mass is preferred, 10 to 500 parts by mass is more preferred, 30 to 300 parts by mass is even more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 100 parts by mass is particularly preferred. By using an amount equal to or greater than the lower limit, highly precise partition walls with narrow line widths tend to be formed. By using an amount equal to or less than the upper limit, liquid repellency tends to be enhanced.

[0312] [1-1-11] Polymerization Inhibitor The photosensitive resin composition of the present invention may contain a polymerization inhibitor. The inclusion of a polymerization inhibitor inhibits radical polymerization, which tends to increase the taper angle of the resulting partition walls. Examples of polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). From the viewpoint of polymerization inhibition ability, hydroquinone, methoxyphenol, and methylhydroquinone are preferred, and methylhydroquinone is more preferred. One type of polymerization inhibitor may be used alone, or two or more types may be used in combination.

[0313] Depending on the method for producing the alkali-soluble resin (C), the produced alkali-soluble resin may contain a polymerization inhibitor. In this case, the alkali-soluble resin may be used as it is, or a polymerization inhibitor identical to or different from the polymerization inhibitor contained in the resin may be further added during production of the photosensitive resin composition.

[0314] When the photosensitive resin composition contains a polymerization inhibitor, its content is not particularly limited, but is preferably 0.0005% by mass or more, more preferably 0.001% by mass or more, even more preferably 0.01% by mass or more, and is preferably 0.1% by mass or less, more preferably 0.08% by mass or less, and even more preferably 0.05% by mass or less, relative to the total solid content of the photosensitive resin composition. The above upper and lower limits can be arbitrarily combined. For example, 0.0005 to 0.1% by mass is preferred, 0.001 to 0.08% by mass is more preferred, and 0.01 to 0.05% by mass is even more preferred. By setting the content at or above the lower limit, the taper angle tends to be higher. By setting the content at or below the upper limit, the liquid repellency tends to be higher.

[0315] [1-1-12] Silane Coupling Agent The photosensitive resin composition of the present invention may contain a silane coupling agent to improve adhesion to the substrate. Examples of silane coupling agents that can be used include epoxy-based, methacrylic-based, amino-based, and imidazole-based silane coupling agents. From the viewpoint of improving adhesion, epoxy-based and imidazole-based silane coupling agents are preferred. When the photosensitive resin composition of the present invention contains a silane coupling agent, the content is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more. Furthermore, the content is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less. By setting the content at or above the lower limit, the effect of improving adhesion to the substrate tends to be sufficient. By setting the content at or below the upper limit, the storage stability of the photosensitive resin composition tends to be good.

[0316] [1-1-13] Phosphate-Based Ethylenic Monomer The photosensitive resin composition of the present invention may contain a phosphate-based ethylenic monomer for the purpose of imparting adhesion to a substrate. As the phosphate-based ethylenic monomer, a (meth)acryloyloxy group-containing phosphate is preferred, and a (meth)acryloyloxy group-containing phosphate represented by the following general formula (g1), (g2), or (g3) is preferred.

[0317]

[0318] In formulas (g1), (g2), and (g3), R 51 represents a hydrogen atom or a methyl group; l and l' are integers of 1 to 10; and m is 1, 2, or 3.

[0319] The phosphate-based ethylenic monomers may be used alone or in combination of two or more.

[0320] When the photosensitive resin composition of the present invention contains a phosphoric acid-based ethylenic monomer, the content thereof is preferably 0.02 mass% or more, more preferably 0.05 mass% or more, even more preferably 0.1 mass% or more, and particularly preferably 0.2 mass% or more, based on the total solids content of the photosensitive resin composition. It is also preferably 4 mass% or less, more preferably 3 mass% or less, even more preferably 2 mass% or less, and particularly preferably 1 mass% or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 0.02 to 4 mass%, more preferably 0.05 to 3 mass%, even more preferably 0.1 to 2 mass%, and particularly preferably 0.2 to 1 mass%. By setting the content at or above the lower limit, the effect of improving adhesion to the substrate tends to be sufficient. By setting the content at or below the upper limit, the storage stability of the photosensitive resin composition tends to be good.

[0321] [1-2] Method for Preparing Photosensitive Resin Composition The photosensitive resin composition of the present invention is prepared by mixing the components contained in the photosensitive resin composition with a stirrer. For example, when a solvent-insoluble component such as a pigment is contained as the colorant (E), it is preferable to perform a dispersion treatment in advance using a paint conditioner, sand grinder, ball mill, roll mill, stone mill, jet mill, homogenizer, or the like. The dispersion treatment results in the fine particle formation of the colorant (E), thereby improving the coating properties of the photosensitive resin composition.

[0322] The dispersion treatment is usually preferably carried out in a system using a combination of an (E) colorant, a solvent, and an (F) dispersant, or in a system using these in combination, optionally with a part or all of an (C) alkali-soluble resin (hereinafter, the mixture subjected to the dispersion treatment and the composition obtained by the dispersion treatment may be referred to as an "ink" or a "pigment dispersion"). In particular, using a polymeric dispersant as the (F) dispersant is preferred because it provides excellent dispersion stability for the resulting ink and photosensitive resin composition and suppresses thickening over time. Thus, in the process of producing the photosensitive resin composition, it is preferred to produce a pigment dispersion containing at least an (E) colorant, a solvent, and an (F) dispersant. The (E) colorant, organic solvent, and (F) dispersant that can be used in the pigment dispersion can preferably be those described as being usable in the photosensitive resin composition. The content ratio of each (E) colorant in the pigment dispersion can preferably be the same as that described as the content ratio in the photosensitive resin composition.

[0323] When dispersing the colorant (E) using a sand grinder, glass beads or zirconia beads with a particle size of about 0.1 to 8 mm are preferably used. The temperature during the dispersion treatment is preferably 0°C to 100°C, more preferably room temperature to 80°C. The dispersion time varies depending on the composition of the liquid, the size of the dispersion treatment device, and other factors, so it is adjusted appropriately. A guideline for dispersion is to control the gloss of the ink so that the 20-degree specular gloss (JIS Z8741) of the photosensitive resin composition is in the range of 50 to 300.

[0324] The particle size of the pigment dispersed in the ink is preferably 0.03 to 0.3 μm, as measured, for example, by dynamic light scattering. Next, the ink obtained by the dispersion treatment is mixed with the other components contained in the photosensitive resin composition to form a uniform solution or dispersion. Since fine dust particles may be mixed into the liquid during the production process of the photosensitive resin composition, it is desirable to filter the obtained photosensitive resin composition using a filter or the like.

[0325] [2] Partition Wall and Method for Forming the Same The cured product of the present invention can be obtained by curing the photosensitive resin composition of the present invention. The photosensitive resin composition of the present invention can be used to form partition walls, and is suitable for forming, for example, partition walls for dividing organic layers of organic electroluminescent devices or partition walls for dividing pixel sections in color filters containing luminescent nanocrystalline particles. The partition walls of the present invention are composed of the cured product of the present invention. The method for forming partition walls using the photosensitive resin composition of the present invention is not particularly limited, and conventionally known methods can be used. Formation of a cured product using the photosensitive resin composition of the present invention preferably includes at least the following steps (1) to (4): Step (1): A step of applying the photosensitive resin composition of the present invention to a substrate to form a coating film; Step (2): A step of exposing at least a portion of the coating film formed in step (1); Step (3): A step of developing the coating film exposed in step (2); Step (4): A step of baking the coating film developed in step (3).

[0326] <Step (1): Step of applying the photosensitive resin composition onto a substrate to form a coating film> Examples of methods for supplying the photosensitive resin composition onto a substrate include an inkjet method and a photolithography method.

[0327] In the inkjet method, a photosensitive resin composition whose viscosity has been adjusted by dilution with a solvent or the like is used as ink, and ink droplets are ejected onto a substrate by the inkjet method along a predetermined partition wall pattern to coat the photosensitive resin composition on the substrate and form a pattern of uncured partition walls. The pattern of uncured partition walls is then exposed to light to form cured partition walls on the substrate. The exposure of the pattern of uncured partition walls is performed in the same manner as the exposure step in the photolithography method described below, except that a mask is not used.

[0328] In the photolithography method, a photosensitive resin composition is applied to the entire surface of a region of a substrate where partition walls are to be formed, to form a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed to light according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate.

[0329] In the photolithography method, in the coating step of coating a substrate with a photosensitive resin composition, the photosensitive resin composition is applied to the substrate on which the partition walls are to be formed using a contact transfer coating device such as a roll coater, reverse coater, or bar coater, or a non-contact coating device such as a spinner (rotary coating device) or curtain flow coater. After the photosensitive resin composition is supplied to the substrate, it is preferably dried to form a coating film. Drying is preferably performed using a hot plate, IR oven, or convection oven. A reduced-pressure drying method, in which drying is performed in a reduced-pressure chamber without increasing the temperature, may also be combined. Drying conditions can be appropriately selected depending on the type of solvent components, the performance of the dryer used, and the like. The drying time is typically selected from the range of 15 seconds to 5 minutes at a temperature of 40°C to 100°C, and preferably from the range of 30 seconds to 3 minutes at a temperature of 50°C to 80°C, depending on the type of solvent components and the performance of the dryer used. It is preferable to perform the drying within a range not exceeding the baking temperature described below.

[0330] <Step (2): Step of exposing at least a part of the coating film formed in step (1)> In the exposure step, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet light or excimer laser light using a negative mask, and the photosensitive resin composition layer is partially exposed according to the bank pattern. For exposure, a light source that emits ultraviolet light such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. The exposure dose varies depending on the composition of the photosensitive resin composition, but is, for example, 10 to 400 mJ / cm. 2 The degree is preferable.

[0331] <Step (3): Step of Developing the Coating Film Exposed in Step (2)> In the developing step, the photosensitive resin composition layer exposed according to the partition wall pattern is developed with a developer to form the partition walls. The developing method is not particularly limited, and an immersion method, a spray method, or the like can be used. Examples of the developer include organic developers such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. An antifoaming agent or a surfactant can also be added to the developer.

[0332] After the development step, an additional exposure step (post-exposure step) may be carried out, if necessary. The partition walls after development are exposed by irradiating them with active energy rays such as ultraviolet light or excimer laser light. At this time, partial exposure using a mask may be performed. For exposure, a light source that emits ultraviolet light, such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a carbon arc lamp, or a UV-FL (ultraviolet fluorescent lamp), may be used. The exposure dose varies depending on the composition of the photosensitive resin composition, but is generally 10 mJ / cm. 2 More than 100 mJ / cm is preferable. 2 More preferably, 500 mJ / cm or more 2 More preferably, 800 mJ / cm or more 2 More than 10,000 mJ / cm is particularly preferred. 2 Preferably, 5000 mJ / cm or less 2 More preferably, 2000 mJ / cm or less 2 The above upper and lower limits can be arbitrarily combined. For example, 10 to 10,000 mJ / cm 2 is preferred, and 100 to 10,000 mJ / cm 2 More preferably, 500 to 5000 mJ / cm 2 is more preferably 800 to 2000 mJ / cm 2 is particularly preferred. By setting the irradiation time to the above lower limit or more, there is a tendency for the penetration resistance to be improved. By setting the irradiation time to the above upper limit or less, it is possible to obtain penetration resistance and ensure productivity by not making the irradiation time too long, which is preferable.

[0333] <Step (4): Step of Baking the Coating Film Developed in Step (3)> After development, or after post-exposure following development, the partition walls are baked (post-baked), i.e., subjected to a heat curing treatment. The baking (post-baking) conditions are preferably 80°C or higher, more preferably 90°C or higher, and also preferably 250°C or lower, more preferably 200°C or lower, even more preferably 180°C or lower, even more preferably 140°C or lower, particularly preferably 120°C or lower, and most preferably 100°C or lower. The above upper and lower limits can be arbitrarily combined. For example, 80 to 250°C is preferred, 80 to 200°C is more preferred, 80 to 180°C is even more preferred, 80 to 140°C is even more preferred, 80 to 120°C is particularly preferred, 80 to 100°C is even more preferred, and 90 to 100°C is particularly preferred. Furthermore, the baking temperature may be 180°C or less, 80 to 180°C, 90 to 180°C, 80 to 140°C, 90 to 140°C, 80 to 120°C, 90 to 120°C, 80 to 100°C, or 90 to 100°C. At or above the lower limit, penetration resistance and heat resistance tend to be good. By setting the baking temperature at or below the upper limit, there tends to be less impact on manufacturing costs, substrates with limited heat resistance such as plastic substrates, and elements. The baking time is preferably 5 to 120 minutes.

[0334] The substrate used for forming the partition walls is not particularly limited and is appropriately selected depending on the type of organic electroluminescent device or color filter to be manufactured using the substrate on which the partition walls are formed. Suitable substrate materials include glass and various resin materials. Examples of resin materials include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonate; poly(meth)acrylic resins; polysulfone; and polyimide. Glass and polyimide are preferred due to their excellent heat resistance. Depending on the type of organic electroluminescent device or color filter to be manufactured, a transparent electrode layer such as ITO or ZnO may be previously provided on the surface of the substrate on which the partition walls are to be formed. Furthermore, partition walls for color filters may be formed on a substrate carrying elements. To improve surface properties such as adhesion, the substrate may be subjected to, for example, corona discharge treatment, ozone treatment, or thin film formation treatment using various resins such as silane coupling agents or urethane-based resins, as needed.

[0335] The thickness of the partition walls of the present invention is preferably 0.1 μm or more, more preferably 1 μm or more, even more preferably 5 μm or more, particularly preferably 10 μm or more, and preferably 1 mm or less, more preferably 100 μm or less, even more preferably 50 μm or less, still more preferably 30 μm or less, and particularly preferably 20 μm or less. The above upper and lower limits can be arbitrarily combined. For example, 0.1 μm to 1 mm is preferred, 0.1 to 100 μm is more preferred, 1 to 50 μm is even more preferred, 5 to 30 μm is even more preferred, and 10 to 20 μm is particularly preferred. By setting the thickness to be equal to or greater than the lower limit, light-blocking properties tend to be improved. By setting the thickness to be equal to or less than the upper limit, adhesion tends to be improved. The thickness of the partition walls is measured using a step / surface roughness / microshape measuring device, a scanning white light interference microscope, an ellipsometer, a reflection spectroscopic film thickness meter, or an electron microscope.

[0336] [3] Organic electroluminescent element The organic electroluminescent element of the present invention comprises the partition wall of the present invention. Various organic electroluminescent elements are manufactured using a substrate having a partition wall pattern manufactured by the method described above. The method for forming the organic electroluminescent element is not particularly limited, but preferably, the organic electroluminescent element is manufactured by forming a partition wall pattern on the substrate by the method described above, and then injecting ink into the areas on the substrate surrounded by the partition walls to form organic layers such as pixels.

[0337] Examples of types of organic electroluminescent devices include bottom-emission and top-emission devices. Bottom-emission devices are fabricated, for example, by forming a partition wall on a glass substrate on which a transparent electrode is laminated, and then laminating a hole transport layer, a light-emitting layer, an electron transport layer, and a metal electrode layer in an opening surrounded by the partition wall. Top-emission devices are fabricated, for example, by forming a partition wall on a glass substrate on which a metal electrode layer is laminated, and then laminating an electron transport layer, a light-emitting layer, a hole transport layer, and a transparent electrode layer in an opening surrounded by the partition wall.

[0338] When the partition walls have a trailing shape, the ink for forming the organic layer is repelled by the trailing edge of the partition walls, which may result in the area surrounded by the partition walls not being sufficiently covered with the ink for forming the organic layer. In contrast, by forming the partition walls in a good shape without trailing edge, the area surrounded by the partition walls can be sufficiently covered with the ink for forming the organic layer. This can, for example, solve the problem of halation in organic EL display elements.

[0339] The solvent used in forming the ink for forming the organic layer may be water, an organic solvent, or a mixture thereof. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, and 3-phenoxytoluene. The ink may also contain surfactants, antioxidants, viscosity modifiers, ultraviolet absorbers, and the like.

[0340] As a method for injecting ink into the region surrounded by the partition wall, an inkjet method is preferred because it allows for easy injection of a small amount of ink into a predetermined location. The ink used to form the organic layer is selected appropriately depending on the type of organic electroluminescent device to be manufactured. When injecting ink by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be ejected well from the inkjet head, but is preferably 4 to 20 mPa·s, and more preferably 5 to 10 mPa·s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, etc.

[0341] Examples of the light-emitting layer include organic electroluminescent layers such as those described in Japanese Patent Application Laid-Open No. 2009-146691 and Japanese Patent No. 5734681. Quantum dots such as those described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may also be used.

[0342] [4] Color filter containing luminescent nanocrystalline particles The color filter containing the luminescent nanocrystalline particles according to the present invention is not particularly limited as long as it includes the partition walls of the present invention, and examples thereof include a color filter having pixels formed in regions partitioned by the partition walls.

[0343] Fig. 2 is a schematic cross-sectional view of an example of a color filter including a partition wall of the present invention. As shown in Fig. 2, the color filter 100 includes a substrate 10, a partition wall 20 provided on the substrate, a red pixel 30, a green pixel 40, and a blue pixel 50. The red pixel 30, the green pixel 40, and the blue pixel 50 are arranged in a lattice pattern, repeating in this order. The partition wall 20 is provided between these adjacent pixels. In other words, these adjacent pixels are separated from each other by the partition wall 20.

[0344] The red pixel 30 contains red-emitting nanocrystalline particles 12, and the green pixel 40 contains green-emitting nanocrystalline particles 11. The blue pixel 50 is a pixel that transmits blue light from the light source.

[0345] These nanocrystalline particles are nano-sized crystals that absorb excitation light and emit fluorescence or phosphorescence, and are, for example, crystals whose maximum particle size as measured by a transmission electron microscope or a scanning electron microscope is 100 nm or less.

[0346] The luminescent nanocrystalline particles can absorb light of a specific wavelength and emit light (fluorescence or phosphorescence) of a wavelength different from the absorbed wavelength. For example, red-luminescent nanocrystalline particles 12 emit light having a peak emission wavelength in the range of 605 to 665 nm (red light), and green-luminescent nanocrystalline particles 11 emit light having a peak emission wavelength in the range of 500 to 560 nm (green light).

[0347] According to the solution of the Schrodinger wave equation of the well-well potential model, the wavelength (emission color) of light emitted by luminescent nanocrystalline particles depends on the size (e.g., particle diameter) of the luminescent nanocrystalline particles, but also on the energy gap of the luminescent nanocrystalline particles. Therefore, the emission color can be selected by changing the constituent material and size of the luminescent nanocrystalline particles used. Examples of luminescent nanocrystalline particles include quantum dots.

[0348] The method for producing a color filter containing luminescent nanocrystalline particles is not particularly limited, but examples thereof include a method of preparing a substrate having partition walls formed from the cured product of the present invention and forming a layer containing luminescent nanocrystalline particles in the areas partitioned by the partition walls. The method for forming the layer containing luminescent nanocrystalline particles is not particularly limited, but the color filter can be produced, for example, by a method of selectively depositing an ink composition containing luminescent nanocrystalline particles by an inkjet method and curing the ink composition by irradiation with active energy rays or heating.

[0349] [5] Image display device The image display device of the present invention includes the partition wall of the present invention. Examples of the image display device of the present invention include an image display device including the organic electroluminescent element of the present invention. The type and structure of the image display device are not particularly limited as long as it includes the organic electroluminescent element, and it can be assembled according to a conventional method using, for example, an active-drive organic electroluminescent element. For example, the image display device of the present invention can be formed by a method such as that described in "Organic EL Display" (Ohmsha, published August 20, 2004, by Tokito Shizuo, Adachi Chinaya, and Murata Hideyuki). For example, an image can be displayed by combining an organic electroluminescent element that emits white light with a color filter, or by combining organic electroluminescent elements that emit different colors of light, such as RGB.

[0350] An example of the image display device of the present invention is an image display device equipped with a color filter containing the luminescent nanocrystalline particles of the present invention. Examples of types of image display devices include liquid crystal display devices and image display devices including organic electroluminescent elements. In the case of liquid crystal display devices, examples include those including a light source equipped with a blue LED and a liquid crystal layer equipped with electrodes that control the blue light emitted from the light source for each pixel. On the other hand, examples of image display devices including organic electroluminescent elements include those in which blue-emitting organic electroluminescent elements are arranged at positions corresponding to each pixel of the color filter. Specifically, examples include the system described in Japanese Patent Application Laid-Open No. 2019-87746.

[0351] Next, the photosensitive resin composition of the present invention will be described with reference to specific examples, but the present invention is not limited to the following examples as long as it does not depart from the gist of the invention. The components of the photosensitive resin composition used in the following examples are as follows.

[0352] <Alkali-Soluble Resin-1> (Synthesis of Precursor Resin) 2-norbornene (75% by mass toluene solution, Maruzen Petrochemical Co., Ltd., 125.5 g, 1.00 mol) and dimethyl 2,2'-azobis(2-methylpropionate) (V-601, Wako Pure Chemical Industries, Ltd., 9.2 g, 40 mmol) were weighed into an appropriately sized reaction vessel equipped with a stirrer and a condenser and dissolved in methyl ethyl ketone (MEK, 196.1 g). Nitrogen was bubbled through this solution for 10 minutes to remove oxygen, and then the solution was heated to 80°C with stirring. While maintaining the solution at 80°C, a previously prepared solution of maleic anhydride (Nippon Shokubai Co., Ltd., 98.1 g, 1.00 mol) dissolved in MEK (119.9 g) was added dropwise over 1.5 hours, and the reaction was continued for an additional 8 hours while maintaining the temperature at 80°C. The resulting reaction mixture was added dropwise to a large amount of methanol to precipitate a polymer. After filtration using a Nutsche filter, the solid was washed with methanol and vacuum dried at 70° C. The weight-average molecular weight Mw of the resulting precursor resin was 6,900.

[0353] (Synthesis of Alkali-Soluble Resin-1) The precursor resin (50.0 g) described above was weighed into an appropriately sized reaction vessel equipped with a stirrer and a condenser and dissolved in MEK (90 g). 2-Hydroxyethyl methacrylate (Nippon Shokubai Co., Ltd., 21.2 g, 163 mmol) and triethylamine (5.0 g) were then added and heated at 70°C for 6 hours. Glycidyl methacrylate (11.1 g, 78 mmol) was added to this reaction solution and stirred at 70°C for an additional 4 hours. After acid treatment with formic acid, the reaction solution was added dropwise to a large amount of pure water to precipitate a polymer. The filtered solid was dried in a vacuum dryer at 40°C for 16 hours to obtain Alkali-Soluble Resin-1. The weight-average molecular weight (Mw) was 7,800. The double bond equivalent was 540 g / mol.

[0354] <Alkali-soluble resin-2> An alkali-soluble acrylic copolymer resin obtained by subjecting a copolymer resin having dicyclopentanyl methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.02 / 0.045 / 0.935) as constituent monomers to an addition reaction of an equal amount of acrylic acid and glycidyl methacrylate, and further adding tetrahydrophthalic anhydride at a molar ratio of 0.096 per mole of the copolymer resin. Measured by GPC, the weight average molecular weight (Mw) in terms of polystyrene was 8900, and the acid value of the solid content was 27 mgKOH / g.

[0355] <Alkali-soluble Resin-3> An alkali-soluble acrylic copolymer resin obtained by subjecting a copolymer resin having dicyclopentanyl methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.30 / 0.10 / 0.60) as constituent monomers to an addition reaction of an equal amount of acrylic acid to the glycidyl methacrylate, and then further subjecting tetrahydrophthalic anhydride to an addition reaction such that the amount was 0.39 moles per mole of the total number of moles of the constituent monomers of the copolymer resin. Measured by GPC, the weight average molecular weight (Mw) in terms of polystyrene was 9000, and the acid value of the solid content was 80 mgKOH / g.

[0356] <Photopolymerizable Compound> The following two types of photopolymerizable compounds were used in Examples 1 to 4 and Comparative Examples 1 to 5. The detailed blending ratios of the photopolymerizable compounds are shown in Table 1.

[0357] <Photopolymerizable compound-1> DPHA: manufactured by Nippon Kayaku Co., Ltd. A mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate <Photopolymerizable compound-2> TMP-A: manufactured by Kyoeisha Chemical Co., Ltd. Trimethylolpropane triacrylate.

[0358] <Photopolymerization initiator-1> An oxime-based photopolymerization initiator having the following chemical structure, which corresponds to (B1) an oxime ester compound: Photopolymerization initiator-1 can be prepared by the production method described in WO 2009 / 131189.

[0359]

[0360] <Photopolymerization initiator-2> Omnirad 907: manufactured by IGM Resins, an α-aminoalkylphenone-based photopolymerization initiator that does not fall under the category of (B1) oxime ester compounds.

[0361] <Silicon-Containing Copolymer Resin-1> A four-neck flask was charged with 65 g of propylene glycol monomethyl ether acetate (PGMEA), which was then purged with nitrogen. The mixture was heated to 95°C while stirring under a nitrogen stream. Two types of dropping liquids were placed in separate dropping devices: a monomer solution prepared by dissolving 31.2 g of 3-methacryloyloxypropyltris(trimethylsiloxy)silane and 32.7 g of hydroxyethyl methacrylate in 50 g of PGMEA, and a polymerization initiator solution prepared by dissolving 3.3 g of t-butylperoxy-2-ethylhexanoate as a polymerization initiator in 25 g of PGMEA. These two solutions were simultaneously added dropwise over a period of 2 hours while maintaining the temperature in the flask at 95°C. After the completion of the dropping, the mixture was stirred at 95°C for 5 hours, followed by stirring at 110°C for 1 hour. 96 g of the solvent was then distilled off under reduced pressure. Next, 0.03 parts by mass of p-methoxyphenol as a polymerization inhibitor and 0.03 g of tin octoate as a urethanization catalyst were added to the solution obtained above, and stirring was initiated under an air stream. While maintaining the temperature at 75°C, 34.4 g of 2-acryloyloxyethyl isocyanate was added dropwise over 1 hour. After completion of the dropwise addition, the mixture was stirred at 75°C for 1 hour, then heated to 80°C and stirred for 4 hours to obtain an acrylic copolymer resin composed of repeating units of the following formulae (d1-1X) and (d2-1X). (d1-1X) corresponds to (D1), and (d2-1X) corresponds to (D2). The molar ratio of the repeating units (d1-1X) to (d2-1X) measured by NMR was 22:78, and the weight average molecular weight (Mw) and number average molecular weight (Mn) measured in terms of polystyrene equivalents by GPC were 14,000 and 2,700, respectively.

[0362]

[0363] <Silicon-containing resin-2> BYK-UV3500: manufactured by BYK Chemie KK A polyether-modified polydimethylsiloxane having an acrylic group, which contains the repeating unit (D2) but does not contain the repeating unit (D1).

[0364] <Silicon-containing resin-3> BYK-UV3505: manufactured by BYK Chemie KK A modified polydimethylsiloxane having an acrylic group, which contains the repeating unit (D2) but does not contain the repeating unit (D1).

[0365] <Silicon-containing resin-4> BYK-UV3570: manufactured by BYK Chemie KK A polyester-modified polydimethylsiloxane having an acrylic group, which contains the repeating unit (D2) but does not contain the repeating unit (D1).

[0366] <Silicon-containing resin-5> BYK-UV3575: manufactured by BYK Chemie KK A modified polydimethylsiloxane having an acrylic group, which contains the repeating unit (D2) but does not contain the repeating unit (D1).

[0367] <Preparation of Pigment Dispersion Liquid-1> The pigment, dispersant, alkali-soluble resin, and solvent were mixed to obtain the mass ratio shown in Table 1. This solution was subjected to a dispersion treatment using a paint shaker at a temperature range of 25 to 45°C for 3 hours. Zirconia beads with a diameter of 0.5 mm were used, and 2.5 times the mass of the dispersion liquid was added. After dispersion was completed, the beads and dispersion liquid were separated using a filter to prepare Pigment Dispersion Liquid-1.

[0368]

[0369] Dispersant-1: A high molecular weight acrylic A-B block copolymer consisting of an A block having a quaternary ammonium base and a tertiary amino group in the side chain and a B block having no quaternary ammonium base or tertiary amino group. The amine value is 70 mg KOH / g. The acid value is 1 mg KOH / g or less.

[0370] <Solvent-1> PGMEA: propylene glycol monomethyl ether acetate <Solvent-2> MB: 3-methoxy-1-butanol.

[0371] <Additive-1> Karenz MT PE1 (pentaerythritol tetrakis(3-mercaptobutyrate) manufactured by Resonac Co., Ltd.

[0372] <Additive-2> KAYAMER PM-21 (manufactured by Nippon Kayaku Co., Ltd.).

[0373] <Additive-3> SH6040 (3-glycidoxypropyltrimethoxysilane) manufactured by Dow Corning Toray Co., Ltd.

[0374] <Preparation of Photosensitive Resin Compositions> [Examples 1 to 11 and Comparative Examples 1 to 5] The components other than pigment dispersion-1 were mixed in the blending ratios shown in Tables 2 and 3, stirred to fully dissolve, and then pigment dispersion-1 was added and mixed, followed by vibration stirring using an ultrasonic cleaner for 10 minutes to prepare photosensitive resin compositions. Each of the obtained photosensitive resin compositions was evaluated using the methods described below. The blending ratios of the pigment dispersion, alkali-soluble resin, and silicon-containing resin in Tables 2 and 3 are values ​​converted to solids content.

[0375]

[0376]

[0377] The performance evaluation method is explained below.

[0378] <Measurement of PGMEA Contact Angle> The photosensitive resin composition was applied onto a glass substrate using a spin coater so that the thickness after post-baking would be 10 μm. The coated substrate was vacuum dried for 1 minute and then heated and dried on a hot plate at 100° C. for 120 seconds. The resulting coating film was exposed to an exposure dose of 80 mJ / cm using a mirror projection exposure machine (MPA-600FA) manufactured by Canon Inc. ２ The light intensity at a wavelength of 365 nm was 500 mW / cm 2 The substrate was then spray-developed for 80 seconds at 22°C using an aqueous solution of 0.04% by mass of KOH and 0.07% by mass of Emulgen A-60 (a surfactant manufactured by Kao Corporation) as a developer, and then washed with pure water for 10 seconds. The substrate was then post-baked for 30 minutes in an oven at the temperature shown in Table 2. Thereafter, for Examples 2 to 4, as shown in Table 2, a UV irradiation device equipped with a UV-FL manufactured by Toshiba Lighting & Technology Corporation was used to apply an illuminance of 0.15 mW / cm. ２ The substrate was then post-exposed to UV light for 5 minutes to obtain a substrate for contact angle measurement.

[0379] Using a Drop Master 500 (contact angle measurement device) manufactured by Kyowa Interface Science Co., Ltd., 0.7 μL of PGMEA was dropped onto the substrate for contact angle measurement at 23° C. and 50% RH, and the contact angle was measured 1 second later, and the results are shown in Table 2. A larger contact angle indicates higher liquid repellency.

[0380] <Evaluation of Inkjet (IJ) Wetting and Spreading Properties> The photosensitive resin composition was applied onto a glass substrate using a spinner so that the thickness after post-baking would be 10 μm. The coated substrate was vacuum-dried for 1 minute and further dried by heating on a hot plate at 100° C. for 120 seconds. Next, the resulting coated substrate was exposed to an exposure dose of 80 mJ / cm using a photomask in an MPA exposure machine. 2 The light intensity at a wavelength of 365 nm was 500 mW / cm 2 The photomask used had 15 μm-wide openings arranged in a grid pattern at intervals of 135 μm in both the vertical and horizontal directions. Development, post-baking, and post-exposure were then carried out under the same conditions as in the preparation of the substrate for contact angle measurement, to prepare an inkjet substrate having an inkjet partition pattern.

[0381] A 10 pL nozzle cartridge filled with 1,6-hexanediol diacrylate as the ejection ink was attached to a Fujifilm DMP-2831 inkjet device, and one droplet (equivalent to 10 pL) was ejected onto the pixel portion (opening portion surrounded by partition walls on all four sides) of the inkjet substrate. The inkjet wetting and spreading properties were evaluated according to the size of the ejected droplet that spread, using the following evaluation criteria.

[0382] <Inkjet Wetting and Spreading Property Evaluation Criteria> The area of ​​the inkjet droplet 3 that had spread into the pixel portion 2 (inside the partition wall portion 1) was evaluated visually according to the image in Fig. 1. Fig. 1 shows the excellence of inkjet wetting and spreading property in order from left to right, with A being the best, B being less wetting and spreading than A but not problematic in practical use, and C and D levels being poor wetting and spreading and problematic in practical use.

[0383] A comparison of Example 1 and Comparative Examples 2 to 5 reveals that the silicon-containing copolymer resin (D) containing both repeating units (D1) and (D2) can provide both ink repellency and wetting and spreading properties within pixels. This is because the silicon-containing copolymer resin (D) contains both repeating units (D1) and (D2). ３ ) ２ When the compound has a polydimethylsiloxane skeleton in which O-units are connected in a straight chain, the Tg is low and the compound easily exudes from the partition wall into the pixel, thereby deteriorating the inkjet wetting and spreading properties. On the other hand, when the compound has a branched structure (D1), the Tg is high and the compound is less likely to exude and is less likely to deteriorate the inkjet wetting and spreading properties.

[0384] A comparison between Example 1 and Comparative Example 1 shows that it is difficult to form partition walls as in the present invention unless the initiator (B) contains the oxime ester compound (B1). This is thought to be because initiators such as acetophenone-based initiators have low curing properties in the lower part of the coating film, so the bottom of the thin line part of the coating film is not cured sufficiently, resulting in poor adhesion.

[0385] Furthermore, as shown in Examples 2 to 4, the photosensitive resin composition of the present invention exhibited a sufficient PGMEA contact angle even when post-baked at 170°C or lower, and the lower the post-baking temperature, the better the inkjet wetting and spreading properties. This is presumably because the lower the baking temperature, the lower the mobility of the silicon-containing copolymer resin (D) during baking and the higher the Tg of the silicon-containing copolymer resin (D), making it less likely to bleed from the partition walls into the pixels.

[0386] REFERENCE SIGNS LIST 1 Partition wall portion 2 Pixel portion (non-image portion) 3 Inkjet dropping portion 10 Substrate 11 Green luminescent nanocrystalline particle 12 Red luminescent nanocrystalline particle 20 Partition wall 30 Red pixel 40 Green pixel 50 Blue pixel 100 Color filter

Claims

1. A photosensitive resin composition comprising (A) a photopolymerizable compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a silicon-containing copolymer resin, wherein the (B) photopolymerization initiator comprises (B1) an oxime ester compound, and the (D) silicon-containing copolymer resin comprises repeating units (D1) and (D2). Repeating unit (D1): A repeating unit comprising the following general formula (d1). Repeating unit (D2): A repeating unit comprising an ethylenically unsaturated group in the side chain. R １ , R ２ , R ３ are each independently an alkyl group having 1 to 3 carbon atoms. * represents a bond.

2. The photosensitive resin composition according to claim 1, wherein the repeating unit (D1) in the silicon-containing copolymer resin (D) is represented by the following general formula (d1-1): R １ , R ２ , R ３ are each independently an alkyl group having 1 to 3 carbon atoms. ４ represents a hydrogen atom or a methyl group. １ represents a divalent organic group.

3. The photosensitive resin composition according to claim 1, wherein the repeating unit (D2) is represented by the following general formula (d2): R ｄｂ１ , R ｄｃ１ R each independently represents a hydrogen atom or a methyl group. ｄｂ２ , R ｄｃ２ each independently represents an alkylene group which may have a substituent, or an arylene group which may have a substituent. ２ represents a divalent organic group. * represents a bond.

4. The photosensitive resin composition according to claim 1, further comprising a polyfunctional thiol compound.

5. The photosensitive resin composition according to claim 1, further comprising a colorant.

6. The photosensitive resin composition according to claim 1, wherein the content of said silicon-containing copolymer resin (D) is 0.01 mass % or more and 3 mass % or less relative to the total solid content of the photosensitive resin composition.

7. The photosensitive resin composition according to claim 1, which is used for baking at 180°C or less.

8. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 7.

9. A partition wall made from the cured product according to claim 8.

10. An organic electroluminescent device comprising the partition wall according to claim 9.

11. A color filter comprising the partition wall according to claim 9 and further containing luminescent nanocrystalline particles.

12. An image display device comprising the partition wall according to claim 9.

13. A method for forming a cured product using the photosensitive resin composition according to any one of claims 1 to 7, comprising at least the following steps (1) to (4): Step (1): A step of applying the photosensitive resin composition according to any one of claims 1 to 7 onto a substrate to form a coating film. Step (2): A step of exposing at least a portion of the coating film formed in step (1). Step (3): A step of developing the coating film exposed in step (2). Step (4): A step of baking the coating film developed in step (3).

14. The method for forming a cured product according to claim 13, wherein the baking temperature in step (4) is 180°C or lower.

15. The method for forming a cured product according to claim 13, further comprising, after step (3), a post-exposure step of exposing the coating film developed in step (3).