Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing electronic component

Abstract

To provide a liquid compression molding material which has excellent injectability and contains little aggregates in the hardened product. A liquid compression molding material that contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst and is used at least for sealing a gap between an element and a substrate, the liquid compression molding material having an initial viscosity of 10 to 250 Pa s at 25°C, and a cured product obtained by curing the liquid compression molding material under the conditions shown in the following (1) satisfies the conditions shown in the following (2): (1) Mold temperature: 150°C, mold time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes (2) When a cross section of the cured product is observed using a scanning electron microscope (magnification: 500x) over an area of ​​250 μm × 180 μm, the area ratio of aggregates with a circle equivalent diameter of 1 μm or more within said area is 1.0% or less.

Description

[Technical field]

[0001] The present invention relates to a liquid compression molding material, an electronic component, a semiconductor device, and a method for manufacturing an electronic component. [Background technology]

[0002] Many semiconductor elements such as integrated circuits that constitute semiconductor devices are encapsulated with an encapsulant. Various resin compositions have been proposed for use in such encapsulants (see, for example, Patent Documents 1 and 2). Although there are a number of molding methods for encapsulating semiconductor elements, in recent years, compression molding, which is more suitable for producing relatively large molded products, has been increasingly adopted for encapsulating semiconductor elements. This is due to the widespread use of wafer-level chip size packaging technology (a technology for encapsulating wafers that have not been cut into chips after circuit formation has been completed). In addition, when manufacturing various devices using compression molding, organic substrates may be used as substrates in addition to inorganic substrates such as silicon wafers.

[0003] Conventional curable resin compositions used for sealing semiconductor elements by compression molding have mainly been solid resin compositions such as granular ones. However, recently, with the development of new compression molding techniques, liquid curable resin compositions (so-called liquid compression molding materials) are often used. Hereinafter, liquid compression molding materials may be abbreviated as "LCM (Liquid Compression Molding) materials."

[0004] LCM materials are required to have excellent injectability during compression molding as well as storage stability. A latent curing catalyst is used to achieve storage stability. A typical latent curing catalyst is, for example, a microencapsulated latent curing catalyst, which is used in many resin compositions including LCM materials due to its high storage stability. For example, in the liquid resin composition for electronic parts described in Patent Document 2, a microencapsulated imidazole derivative is used as a microencapsulated latent curing catalyst. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2021-161206 A [Patent Document 2] JP 2007-182562 A Summary of the Invention [Problem to be solved by the invention]

[0006] On the other hand, when compression molding is performed using an LCM material, foreign matter contained in the LCM material or its cured product may cause poor injection properties of the LCM material during compression molding, or poor appearance of the LCM material and / or its cured product. Therefore, the present inventors performed a composition analysis of the foreign matter in the cured product described above. As a result, it was found that the main component constituting the foreign matter is a resin component. From the analysis results, the present inventors presumed that the foreign matter contained in the LCM material containing a microencapsulated latent curing catalyst and its cured product originates from an aggregate of the microencapsulated latent curing catalyst.

[0007] The reason is as follows. First, in the case of a microencapsulated latent curing catalyst, the curing catalyst component is covered by a capsule of minute size. Therefore, in order to prepare an LCM material containing a microencapsulated latent curing catalyst without destroying the capsule, it is necessary to apply a relatively weaker shear force to the raw material solution used to prepare the LCM material and perform a dispersion process, compared to an LCM material containing a non-microencapsulated curing catalyst. As a result, in an LCM material containing a microencapsulated latent curing catalyst, the latent curing catalysts tend to form aggregates in which the latent curing catalysts aggregate together. In this state, when heat is applied to the LCM material during compression molding, the curing catalyst in the capsule is released from the capsule and the curing reaction proceeds, and at the same time, the inorganic filler cannot enter the capsule that constitutes the aggregate after the curing catalyst is released to the outside, and the resin component enters and hardens. As a result, the cured product of the LCM material also contains aggregates mainly composed of resin components, as found in the above-mentioned analysis results.

[0008] The present invention has been made in view of the above circumstances, and the first object of the present invention is to provide a liquid compression molding material that has excellent injectability during compression molding and contains little aggregates in the cured product, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material.The second object of the present invention is to provide a liquid compression molding material that has excellent injectability during compression molding and contains little aggregates in the cured product, and also has excellent storage stability and fast curing properties, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material. [Means for solving the problem]

[0009] The above object is achieved by the present invention. A first liquid compression molding material of the present invention comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used at least for sealing a gap between a substrate and an element disposed on the substrate in an electronic component including the substrate and the element, the liquid compression molding material having an initial viscosity of 10 Pa s to 460 Pa s at 25°C, and a cured product obtained by curing the liquid compression molding material under the conditions (1) below satisfies the conditions (2) below; (1) Mold temperature: 150°C, mold time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes (2) When a cross section of the cured product is observed using a scanning electron microscope (magnification: 500x) over an area of ​​250 μm × 180 μm, the area ratio of aggregates with a circle equivalent diameter of 1 μm or more within said area is 1.0% or less.

[0010] In one embodiment of the liquid compression molding material of the first present invention, the (D) curing catalyst is preferably a non-microencapsulated curing catalyst.

[0011] In another embodiment of the liquid compression molding material of the first invention, the non-microencapsulated curing catalyst preferably includes at least one selected from the group consisting of imidazole compounds and modified aliphatic polyamine compounds.

[0012] In another embodiment of the liquid compression molding material of the first invention, the non-microencapsulated curing catalyst preferably includes at least one selected from the group consisting of imidazole compounds having a melting point of 200°C or higher and modified aliphatic polyamine compounds having a melting point of 130°C or higher.

[0013] A liquid compression molding material according to a second aspect of the present invention includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an imidazole compound having a melting point of 200°C or higher as a curing catalyst, and has an initial viscosity of 10 Pa s to 460 Pa s at 25°C; In an electronic component having a substrate and an element disposed on the substrate, the sealing material is used at least to seal a gap between the element and the substrate.

[0014] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, it is preferable that the (B) curing agent includes at least one selected from the group consisting of acid anhydride curing agents and phenolic curing agents.

[0015] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the (B) curing agent preferably includes an acid anhydride curing agent and a phenolic curing agent.

[0016] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the mixing ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is preferably 60 mass % or more and less than 80 mass %.

[0017] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the mixing ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is preferably 60% by mass to 78.5% by mass.

[0018] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the initial viscosity at 25° C. is preferably 10 Pa·s to 250 Pa·s.

[0019] In another embodiment of the liquid compression molding material of the first and second aspects of the present invention, the inorganic filler (C) preferably has an average particle size of 0.03 μm to 3 μm.

[0020] The electronic component of the present invention includes an encapsulant made of a cured product of the liquid compression molding material of the first or second invention.

[0021] The semiconductor device of the present invention comprises a substrate, a semiconductor element disposed on the substrate, and a cured product of the first or second liquid compression molding material of the present invention that seals a gap between the semiconductor element and the substrate.

[0022] In one embodiment of the semiconductor device of the present invention, the cured product preferably contains aggregates, and the aggregates have a maximum equivalent circular diameter of 4 μm or less.

[0023] The method for producing an electronic component of the present invention involves at least a step of compression molding using the first or second liquid compression molding material of the present invention, to produce an electronic component comprising a substrate, an element disposed on the substrate, and a sealing material made of a cured product of the liquid compression molding material that seals the gap between the element and the substrate.

[0024] In one embodiment of the method for producing an electronic component of the present invention, the cured product preferably contains aggregates, and the aggregates have a maximum equivalent circular diameter of 4 μm or less. Effect of the Invention

[0025] According to the first invention, it is possible to provide a liquid compression molding material that has excellent injectability during compression molding and contains little aggregates in the cured product, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material. According to the second invention, it is possible to provide a liquid compression molding material that has excellent injectability during compression molding and contains little aggregates in the cured product, and also has excellent storage stability and fast curing properties, electronic components and semiconductor devices manufactured using the liquid compression molding material, and a method for manufacturing electronic components using the liquid compression molding material. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] The LCM material of the first embodiment includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst. The LCM material of the first embodiment has an initial viscosity of 10 Pa s to 460 Pa s at 25°C, and a cured product obtained by curing the LCM material under the conditions shown in (1) below satisfies the conditions shown in (2) below. (1) Mold temperature: 150°C, mold time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes (2) When a cross section of the cured product is observed under a scanning electron microscope (magnification: 500 times) over an area of ​​250 μm × 180 μm, the area ratio of aggregates having a circle equivalent diameter of 1 μm or more within the area is 1.0% or less.

[0027] This makes it possible to obtain an LCM material that has excellent injectability during compression molding and contains few aggregates in the cured product. The above area ratio is preferably 0.5% or less, more preferably 0.2% or less, even more preferably 0.1% or less, and most preferably 0%.

[0028] In addition, since it is considered that the aggregates contained in the cured product correspond to the aggregates present in the LCM material before curing, it is presumed that the maximum diameter of the aggregates observed in the cured product roughly corresponds to the maximum diameter of the aggregates present in the LCM material. The presence or absence and size of the aggregates present in the LCM material affect the injectability of the LCM material during compression molding to a greater or lesser extent, and are considered to have a greater effect particularly when the LCM material is injected through a gap of a size relatively similar to the maximum diameter of the aggregates (for example, a gap length of several μm to several tens of μm). In view of these points, from the viewpoint of improving the injectability especially in a narrower gap length, the maximum diameter (maximum diameter of the circle equivalent diameter) of the aggregates contained in the cured product is preferably 4 μm or less, more preferably 3 μm or less, and even more preferably 1 μm or less.

[0029] Moreover, the LCM material of the first embodiment and the LCM material of the second embodiment described later are resin compositions used at least for sealing the gap between an element and a substrate in an electronic component (such as a semiconductor device) including a substrate and an element (such as a semiconductor element) arranged on the substrate. Compression molding is generally performed by a process of (i) supplying the LCM material into a mold, pressing a laminate in which a substrate and an element are laminated with a gap between them against the LCM material spread horizontally in the mold, and then clamping the mold to harden the LCM material in this state, or (ii) applying the LCM material onto a laminate in which a substrate and an element are laminated with a gap between them, clamping the mold, and hardening the LCM material in this state. In these processes, the LCM material is injected into the gap formed between the substrate and the element, covers the element, and hardens in this state to complete the sealing process. Then, electronic components such as semiconductor devices are manufactured through such processes. For this reason, the cured LCM material is present in the electronic component in a form in which it covers the element and is interposed between the element and the substrate.

[0030] The length of the gap in electronic components such as semiconductor devices manufactured using an LCM material is generally 10 μm to 30 μm. Therefore, in order to quickly inject the LCM material into the entire narrow gap during compression molding and prevent poor injection performance, the LCM material needs to have an appropriate level of fluidity (low viscosity).

[0031] Next, each component contained in the LCM material of the first embodiment will be described in detail below.

[0032] (A) Epoxy resin The epoxy resin used in the LCM material of the first embodiment is not particularly limited as long as it is various epoxy resins generally used for semiconductor encapsulation, but it is preferable to use a liquid epoxy resin from the viewpoint of the viscosity and injectability required for LCM. In addition, as the epoxy resin to be mixed in the LCM material, only one type of epoxy resin may be used, or two or more types of epoxy resins may be used in combination. Note that the epoxy resin may further contain functional groups other than epoxy groups (e.g., acrylic groups, methacrylic groups, etc.) as necessary, but may not contain other functional groups such as acrylic groups and methacrylic groups.

[0033] Specific examples of epoxy resins include, but are not limited to, aromatic epoxy resins and aliphatic epoxy resins. Examples of aromatic epoxy resins include bisphenol A type epoxy resins such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether; bisphenol F type epoxy resins; novolac type epoxy resins; fluorene type epoxy resins; biphenyl aralkyl epoxy resins; diepoxy resins such as p-tert-butylphenyl glycidyl ether and 1,4-phenyldimethanol diglycidyl ether; biphenyl type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; aminophenol type epoxy resins such as diglycidylaniline, diglycidyl toluidine, triglycidyl-p-aminophenol, and tetraglycidyl-m-xylylenediamine; naphthalene type epoxy resins; and epoxy resins having a skeleton derived from plants.

[0034] Specific examples of aliphatic epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule, such as alkyl alcohol glycidyl ethers (butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.) and alkenyl alcohol glycidyl ethers (vinyl glycidyl ether, allyl glycidyl ether, etc.); difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as polyalkylene glycol diglycidyl ethers (e.g., alkylene glycol diglycidyl ether, polytetramethylene glycol diglycidyl ether), and alkenylene glycol diglycidyl ether; and polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, such as polyglycidyl ethers of trifunctional or higher alcohols (e.g., trimethylolpropane triglycidyl ether, pentaerythritol, dipentaerythritol (tri- or tetra-glycidyl ether, dipentaerythritol (tri-, tetra-, penta- or hexa-glycidyl ether, etc.).

[0035] Among these epoxy resins, liquid bisphenol type epoxy resin, liquid naphthalene type epoxy resin, and liquid aminophenol type epoxy resin are preferred from the viewpoints of workability and injectability. The content of the epoxy resin relative to the total amount of the LCM material is preferably 3% by mass to 40% by mass, more preferably 4% by mass to 30% by mass, and even more preferably 5% by mass to 25% by mass.

[0036] (B) Hardener As the curing agent used in the LCM material of the first embodiment, any known curing agent for epoxy resins can be used, but it is preferable to use a phenol-based curing agent and / or an acid anhydride-based curing agent.

[0037] (B1) Phenol-based hardener The phenol-based curing agent has the effect of lowering the glass transition temperature (Tg) of the cured product. As the phenol-based curing agent, any monomer, oligomer, or polymer having a phenolic hydroxyl group can be used, and examples thereof include phenol novolac resin, alkylated product of phenol novolac resin, allylated product of phenol novolac resin, cresol novolac resin, phenol aralkyl resin (resin containing a phenylene skeleton and / or a biphenylene skeleton), naphthol aralkyl resin, triphenol methane resin, dicyclopentadiene type phenol resin, imide modified phenol resin (including liquid type), etc., but it is preferable to use a phenol-based curing agent other than the imide modified phenol resin. In addition, when using an imide modified phenol resin, the amount of the imide modified phenol resin in the curing agent is preferably more than 0% by mass and less than 50% by mass, more preferably more than 0% by mass and 30% by mass or less, and even more preferably more than 0% by mass and 10% by mass or less. As the phenol-based curing agent to be blended in the LCM, only one type of phenol-based curing agent may be used, or two or more types of phenol-based curing agents may be used in combination. From the viewpoint of workability, it is preferable to use a phenol-based curing agent that is liquid at 25° C., and from the viewpoint of the effect of lowering the glass transition temperature Tg of the cured product, a phenol novolac resin with particularly little steric hindrance is preferable.

[0038] (B2) Acid anhydride curing agent The acid anhydride curing agent has the effect of lowering the viscosity of the LCM material and increasing the glass transition temperature Tg of the cured product. Examples of the acid anhydride curing agent include phthalic anhydride (for example, alkylated hydrophthalic anhydrides such as methyl tetrahydrophthalic anhydride and methyl hexahydrophthalic anhydride; hexahydrophthalic anhydride, etc.), methyl hymic anhydride, succinic anhydride substituted with an alkenyl group, methyl nadic anhydride, and glutaric anhydride. As the acid anhydride curing agent to be blended in the LCM material, only one type of acid anhydride curing agent may be used, or two or more types of acid anhydride curing agents may be used in combination. Among these acid anhydride curing agents, methyl tetrahydrophthalic anhydride and methyl hexahydrophthalic anhydride are preferable because they have excellent electrical insulation and heat resistance stability, and are liquid at room temperature (25°C).

[0039] In the LCM material of the first embodiment, it is particularly preferable to use a combination of a phenolic curing agent (B1) and an acid anhydride curing agent (B2) as the curing agent (B). In this case, the blending ratio of the phenolic curing agent (B1) and the acid anhydride curing agent (B2) is not particularly limited, but the ratio of the phenol equivalent b1 of the phenolic curing agent (B1) to the acid anhydride equivalent b2 of the acid anhydride curing agent (B2), that is, the equivalent ratio b1:b2, is preferably 10:90 to 90:10, more preferably 15:85 to 85:15, even more preferably 35:65 to 80:20, particularly preferably 45:55 to 80:20, and most preferably 45:55 to 55:45. The phenol equivalent b1 is calculated by dividing the mass of the component (B1) by the hydroxyl equivalent in the component (B1), and the acid anhydride equivalent b2 is calculated by dividing the mass of the component (B2) by the acid anhydride equivalent in the component (B2).

[0040] When the equivalent ratio b1:b2 is within the range of 10:90 to 90:10, (i) it is easier to ensure the excellent fast curing property of the LCM material, and (ii) it is easier to adjust the glass transition temperature Tg of the cured product within the range of 50 ° C. to 120 ° C., so that it is easier to suppress warping of an encapsulation article such as a semiconductor device manufactured using the LCM material. The reason why the effect of (ii) is obtained is as follows. First, the elastic modulus of the cured product of the resin composition generally changes significantly with the glass transition temperature Tg as a boundary, and the cured product has a relatively very high elastic modulus in a temperature range below the glass transition temperature Tg in the glass state, and has a relatively very low elastic modulus in a temperature range above the glass transition temperature Tg in the rubber state. On the other hand, in a compression molding process using an LCM material, the heating temperature during molding and the heating temperature of the post-cure performed after molding are usually performed at a temperature exceeding about 130 ° C. Therefore, if the glass transition temperature Tg of the cured product is set to 120°C or less, the elastic modulus of the cured product near the heating temperature during molding or post-curing can be made very low, so that the internal stress caused by the difference in the degree of shrinkage of each member constituting the sealed article during the cooling process after heating can be alleviated, and as a result, warping of the sealed article can be suppressed. The glass transition temperature Tg can be measured by the DMA (Dynamic Mechanical Analysis) method described later.

[0041] The mass ratio of the (B1) phenol-based curing agent to the (B2) acid anhydride-based curing agent is not particularly limited as long as the equivalent ratio b1:b2 can be adjusted within the range of 10:90 to 90:10. However, the mass ratio is usually preferably 10:90 to 90:10, more preferably 15:85 to 85:15, and even more preferably 35:65 to 80:20.

[0042] The content of the (B) curing agent in the entire resin composition constituting the LCM material is preferably 2% by mass or more, more preferably 5% by mass or more, and even more preferably 8% by mass or more, from the viewpoint of ensuring sufficient curability. On the other hand, the upper limit of the content is not particularly limited, but from the viewpoint of the blending balance with other components blended in the resin composition, it is practically preferably 50% by mass or less, more preferably 30% by mass or less, and even more preferably 20% by mass or less.

[0043] (C) Inorganic filler The inorganic filler is not particularly limited as long as it has the effect of reducing the linear expansion coefficient of the cured product obtained by curing the LCM material. Examples of the material of the inorganic filler include silica, alumina, aluminum, aluminum nitride, silicon carbide, and silicon nitride. As the inorganic filler, silica or alumina is particularly suitable from the viewpoint of increasing the blending amount (filling amount) of the inorganic filler in the resin composition. In addition, the inorganic filler may be surface-treated with a surface treatment agent such as a silane coupling agent. In addition, as the inorganic filler blended in the resin composition, only one type of inorganic filler may be used, or two or more types of inorganic fillers may be used in combination.

[0044] The shape of the inorganic filler is not particularly limited, and may be any of spherical, amorphous, flaky, etc. On the other hand, the length of the gap into which the LCM material is injected during compression molding is generally 10 to 30 μm as described above, but if the LCM material contains particles having a relatively large particle size (5 to 10 μm or more) in relation to this gap length, there is a high possibility that problems such as poor injection properties of the LCM material during compression molding will occur. From this perspective, the average particle size of the inorganic filler is preferably 0.001 μm to 4 μm, more preferably 0.005 μm to 4 μm, even more preferably 0.01 μm to 3 μm, and particularly preferably 0.03 μm to 3 μm. If the average particle size of the inorganic filler exceeds 4 μm, it becomes extremely difficult to seal the gap between an element such as a semiconductor element and a substrate using the LCM material of this embodiment. The average particle size refers to the volume average particle size D50 (particle size that is 50% cumulative from the small diameter side of the volume-based particle size distribution) measured using a laser diffraction particle size distribution measuring device.

[0045] From the viewpoint of further reducing the viscosity of the LCM material while maintaining a high content of inorganic filler in the LCM material, it is preferable to use a combination of two types of inorganic fillers with different volume average particle diameters D50. In this case, the ratio (DL / DS) of the volume average particle diameter D50 (DL) of the large-diameter inorganic filler to the volume average particle diameter D50 (DS) of the small-diameter inorganic filler is preferably 4 to 30, more preferably 8 to 15, and the ratio (AL / AS) of the content AL of the large-diameter inorganic filler to the content AS of the small-diameter inorganic filler in the LCM material is preferably 1 to 5, more preferably 2 to 4.

[0046] The content of the inorganic filler in the entire LCM material is preferably less than 80% by mass, more preferably 78.5% by mass or less, even more preferably 77% by mass or less, and particularly preferably 74.5% by mass or less, from the viewpoint of facilitating the preparation of the LCM material and ensuring viscosity suitable for compression molding. If the content of the inorganic filler exceeds 78.5% by mass, particularly 80% by mass or more, the viscosity of the LCM material becomes too high, and the injectability into the gap between the element such as a semiconductor element and the substrate is significantly deteriorated, so that it may be difficult to use it as an LCM material. In addition, from the viewpoint of reducing the thermal expansion coefficient of the cured product and further suppressing warping, the content of the inorganic filler is preferably 60% by mass or more, more preferably 65% ​​by mass or more, even more preferably 67% by mass or more, and particularly preferably 70% by mass or more. In addition, as a suitable combination of the upper limit value and the lower limit value of the content of the inorganic filler, any value selected from the above-mentioned multiple upper limit values ​​and any value selected from the above-mentioned multiple lower limit values ​​can be appropriately combined.

[0047] (D) Curing catalyst The curing catalyst used in the LCM material of the first embodiment is not particularly limited as long as it satisfies condition (2) when the cross section of the cured product obtained by curing the LCM material under the above-mentioned condition (1) is observed with a scanning electron microscope (SEM). However, as such a curing catalyst, a curing catalyst that is not microencapsulated can be suitably used. In this specification, the term "curing catalyst that is not microencapsulated" does not mean a curing catalyst that has a core part and a shell part covering the core part, in which the core part contains a curing catalyst component, and the shell part is composed of an epoxy compound or the like, so that the curing promotion function is suppressed at room temperature or a relatively low temperature range above room temperature, but means a curing catalyst in which the curing catalyst component is not covered by a protective material such as a shell part and is in an exposed state. Suitable specific examples of curing catalysts that are not microencapsulated include imidazole compounds that are not microencapsulated and modified aliphatic polyamine compounds that are not microencapsulated (hereinafter, each will be simply referred to as "imidazole compound" and "modified aliphatic polyamine compound", respectively), and by blending these with the LCM material, the occurrence of aggregates in the LCM material and its cured product can be suppressed.

[0048] Of the imidazole compounds and modified aliphatic polyamine compounds, from the viewpoint of realizing an excellent pot life (storage stability), it is preferable to use an imidazole compound having a melting point of 200°C or more and / or a modified aliphatic polyamine compound having a melting point of 130°C or more as the curing catalyst to be blended into the LCM material, and from the viewpoint of realizing even superior rapid curing properties, it is even more preferable to use an imidazole compound having a melting point of 200°C or more as the curing catalyst to be blended into the LCM material.

[0049] Examples of the imidazole compound include 2-methylimidazole, 2-undecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 2,4-diamino-6-[2'-methylimidazoline-(1')]-ethyl-s-triazine, and the like. Commercially available products include 2E4MZ, 2P4MHZ, 2MA-OK, 2MZ-A, 2PHZ, and the like manufactured by Shikoku Chemical Industry Co., Ltd. Among these, imidazole compounds having a melting point of 200°C or higher include 2,4-diamino-6-[2'-methylimidazoline-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2,4-diamino-6-vinyl-s-triazine. Commercially available products include 2MA-OK, 2PHZ, and 2MZ-A manufactured by Shikoku Chemical Industry Co., Ltd. Commercially available modified aliphatic polyamine compounds include EH-4357S manufactured by ADEKA Corporation and Fujicure FXR-1020 and FXR-1030 manufactured by T&K TOKA Corporation. Of these, a commercially available modified aliphatic polyamine compound having a melting point of 130°C or higher includes Fujicure FXR-1030 manufactured by T&K TOKA Corporation.

[0050] The reasons why the occurrence of agglomerates in the LCM material and its cured product is suppressed when an imidazole compound or a modified aliphatic polyamine compound is used as a curing catalyst are thought to be: (i) there are no capsule-like residues that constitute the microcapsule-type latent curing catalyst; and (ii) when preparing an LCM material containing an imidazole compound or a modified aliphatic polyamine compound, there is no need to consider the destruction of capsules during the dispersion process of the raw material solution, so that a shear force sufficient to prevent the occurrence of agglomerates can be applied.

[0051] The non-microencapsulated curing catalyst may be used in one type or in combination of two or more types. In addition, when at least one of an imidazole compound having a melting point of 200° C. or more and a modified aliphatic polyamine compound having a melting point of 130° C. or more is used, a curing catalyst other than these may be used in combination.

[0052] From the viewpoint of obtaining an LCM material that has few aggregates in the LCM material and its cured product, has excellent storage stability, and also has excellent fast curing properties, it is preferable to use an imidazole compound having a melting point of 200°C or higher as the curing catalyst (D), and from the viewpoint of obtaining even better effects, it is more preferable to use 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct (a commercially available product, for example, 2MA-OK).

[0053] From the viewpoint of obtaining an LCM material with few aggregates and its cured product, it is preferable that the curing catalyst used in the LCM material of the first embodiment does not substantially contain a microcapsule-type latent curing catalyst. When a microcapsule-type curing catalyst is contained as a main component as a curing catalyst blended in the LCM material of the first embodiment, the above-mentioned condition (2) cannot be satisfied. From this viewpoint, it is preferable that the LCM material of the first embodiment does not contain a microcapsule-type latent curing catalyst at all. Even if a microcapsule-type latent curing catalyst is blended in the LCM material, from the viewpoint of suppressing the occurrence of aggregates in the cured product, the content is preferably more than 0 mass% and 5 mass% or less with respect to the entire LCM material, more preferably more than 0 mass% and 2 mass% or less, and even more preferably more than 0 mass% and 1 mass% or less.

[0054] The amount of the non-microencapsulated curing catalyst blended in the LCM material is not particularly limited, but is usually about 0.5 to 10 parts by mass relative to 100 parts by mass of epoxy resin. When the non-microencapsulated curing catalyst is 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, the blending amount is preferably 2.0 to 3.8 parts by mass, more preferably 2.3 to 3.4 parts by mass, relative to 100 parts by mass of epoxy resin. This allows a good balance between suppressing warping of an intermediate product produced using the LCM material before it is divided into individual pieces by dicing or the like, and suppressing cracks that occur during dicing.

[0055] (E) Other ingredients The LCM material of the first embodiment may further contain other components other than the above components (A) to (D) as necessary. Examples of other optional components include resin components other than epoxy resins, alcohol compounds, coupling agents, pigments, ion trapping agents, leveling agents, antioxidants, defoamers, flame retardants, colorants, reactive diluents, elastomers, etc. The amount of other components to be added can be appropriately selected depending on the type of the other components.

[0056] Examples of resin components other than epoxy resin include acrylic copolymers, but other resin components may not be used at all. When using other resin components other than epoxy resin such as acrylic copolymers, the amount of the resin to be added is preferably more than 0% by mass and less than 50% by mass, more preferably more than 0% by mass and 30% by mass or less, and even more preferably more than 0% by mass and 10% by mass or less, based on the total LCM material.

[0057] Examples of the alcohol compound include polycarbonate diol compounds having a tetramethylene glycol structure as an alkylene glycol structure, polytetramethylene ether glycol, and the like. Commercially available products of such alcohol compounds include PEPCD NT2006 (polycarbonate diol compound having a tetramethylene glycol structure as an alkylene glycol structure, liquid (transparent) at 25°C, number average molecular weight 2000, glass transition temperature -84°C, manufactured by Mitsubishi Chemical Corporation), PEPCD NT2002 (polycarbonate diol compound having a tetramethylene glycol structure as an alkylene glycol structure, liquid (transparent) at 25°C, number average molecular weight 2000, glass transition temperature -71°C, manufactured by Mitsubishi Chemical Corporation), PTMG 2000 (polytetramethylene ether glycol, number average molecular weight: 2000, manufactured by Mitsubishi Chemical Corporation), and PTMG 3000 (polytetramethylene ether glycol, number average molecular weight: 3000, manufactured by Mitsubishi Chemical Corporation). By blending 0.1% by mass to 5% by mass of the alcohol compound with respect to the entire LCM material, warping after compression molding can be reduced.

[0058] The initial viscosity of the LCM material of the first embodiment at 25°C (viscosity measured within 1 hour after preparation of the LCM material) is 10 Pa·s to 460 Pa·s. By setting the initial viscosity at 10 Pa·s to 460 Pa·s, it is possible to achieve both ease of handling and injectability of the LCM material. The initial viscosity is preferably 10 Pa·s to 350 Pa·s, more preferably 20 Pa·s to 300 Pa·s, and even more preferably 30 Pa·s to 250 Pa·s. From the viewpoint of storage stability of the LCM material, the viscosity increase ratio after 24 hours is preferably 5 times or less, more preferably 3 times or less, and the closer to 1 times the better. Here, the viscosity increase ratio after 24 hours means the ratio of the viscosity after 24 hours at 25°C (viscosity measured 24 hours after preparation of the LCM material) to the initial viscosity at 25°C.

[0059] The LCM material of the first embodiment is prepared by mixing and stirring the components (A) to (D) and, if necessary, the other components (E). When mixing and stirring, a known mixing and stirring means such as a roll mill or a planetary mixer can be appropriately used. When the epoxy resin (A) is solid, it is preferable to mix it with the other components after liquefying or fluidizing it by heating or the like. When mixing the components, all the components may be mixed at the same time, or a mixture obtained by first mixing some of the components may be added to the remaining components and mixed, and the mixing procedure is not particularly limited. When it is difficult to uniformly disperse the inorganic filler (C) in the epoxy resin (A), the remaining components may be added to the mixture prepared by first mixing the epoxy resin (A) and the inorganic filler (C) and mixed therewith.

[0060] Next, the LCM material of the second embodiment will be described. The LCM material of the second embodiment includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an imidazole compound having a melting point of 200°C or higher as a curing catalyst, and has an initial viscosity of 10 Pa·s to 460 Pa·s at 25°C. The LCM material of the second embodiment, like the LCM material of the first embodiment, has excellent injectability during compression molding and can provide an LCM material with few aggregates contained in the cured product. In addition, the LCM material of the second embodiment is also excellent in storage stability and fast curing properties. In the LCM material of the second embodiment, the components (A) to (C) and the component (E) that can be further used as necessary can be the same as those of the LCM material of the first embodiment, and the component (D) is an imidazole compound having a melting point of 200°C or higher (a curing catalyst that is not microencapsulated) used in the LCM material of the first embodiment. In addition, the suitable ranges of the initial viscosity and 24-hour viscosity increase ratio of the LCM material of the second embodiment are also preferably similar to those of the LCM material of the first embodiment.

[0061] The LCM material of the first and second embodiments of the present invention can be used to manufacture any part or product, as long as the part or product is produced at least through a compression molding process using the LCM material. Representative examples of such parts or products include electronic parts having a sealant made of the cured product of the LCM material of the first or second embodiments of the present invention. Examples of such electronic parts include electronic parts having a substrate, an element disposed on the substrate, and the cured product of the LCM material of the first or second embodiments of the present invention that seals the gap between the element and the substrate. Specific examples of electronic parts having such a structure include semiconductor devices using semiconductor elements as elements. In addition, in parts or products having such a structure with a gap, the smaller the gap length of the gap, the more preferable it is that the maximum diameter of the aggregates contained in the cured product (maximum diameter of the circle equivalent diameter) is 4 μm or less, as described above. EXAMPLES

[0062] Specific examples of the present invention will be described below with reference to examples, but the present invention is not limited to the examples described below. In the following description, Experimental Example A is an example corresponding to the first and second LCM materials of the present invention, Experimental Example B is an example corresponding to the first LCM material of the present invention and a comparative example corresponding to the second LCM material of the present invention, and Experimental Example C is a comparative example corresponding to the first and second LCM materials of the present invention.

[0063] 1. Preparation of LCM Materials The LCM materials of each experimental example were prepared by mixing and stirring the raw material solution in which each component was mixed to obtain the composition shown in Tables 1 to 3. In this case, the mixing and stirring of the raw material solution for preparing the LCM material of the example using a non-microencapsulated curing catalyst as the curing catalyst (D) was performed under the mixing and stirring condition 1 described below, and the mixing and stirring of the raw material solution for preparing the LCM material of the comparative example using a microencapsulated latent curing catalyst as the curing catalyst (D) was performed under the mixing and stirring condition 2 described below. In addition, when a phenol-based curing agent and an acid anhydride-based curing agent were used in combination as the (B) curing agent, the composition of the curing agent was prepared so that the ratio of the phenol equivalent b1 of the phenol-based curing agent to the acid anhydride equivalent b2 of the acid anhydride-based curing agent was 49:51. <Mixing stirring conditions 1> The ingredients were manually mixed with a spatula to obtain a raw solution, which was then dispersed in a three-roll mill. <Mixing stirring conditions 2> The components were manually mixed with a spatula to obtain a raw solution, which was then mixed and stirred at 20 rpm for 10 minutes in a vessel equipped with a baffle.

[0064] 2. Raw materials used in the preparation of LCM materials Details of each component constituting the LCM materials shown in Tables 1 to 3 are as follows.

[0065] (A) Epoxy resin YDF-870GS (Bisphenol F epoxy resin: manufactured by Nippon Steel Chemical & Materials) HP-4032D (Naphthalene type epoxy resin: manufactured by DIC) jER630LSD (aminophenol type epoxy resin: manufactured by Mitsubishi Chemical)

[0066] (B) Hardener <Phenol-based hardener> MEH-8005 (liquid phenol novolac resin: manufactured by UBE, hydroxyl equivalent: 135g / eg) BRM-553 (Solid phenol novolac resin: Aica Kogyo, hydroxyl equivalent: 108g / eg) <Acid anhydride curing agent> MH-700 (mixture of 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride: manufactured by New Japan Chemical Co., Ltd., acid anhydride equivalent: 164g / eq) HN-2200 (Methyltetrahydrophthalic anhydride: manufactured by Resonac, acid anhydride equivalent: 166g / eq)

[0067] (C) Inorganic filler · SE2200-SME (methacrylic surface treated silica filler, average particle size 0.5μm, manufactured by Admatechs) YA050C-SM1 (methacrylic surface-treated silica filler, average particle size 0.05 μm, manufactured by Admatechs) ·AG2051 SXM (phenylamino surface treated alumina filler, average particle size: 1μm, manufactured by Admatechs)

[0068] (D) Curing catalyst <Non-microencapsulated curing catalyst> 2MA-OK (2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct: manufactured by Shikoku Chemical Industry Co., Ltd., melting point 260°C) FXR-1030 (amine adduct-based latent hardener: T&K TOKA, melting point 140°C) 2PHZ (2-phenyl-4,5-bis(hydroxymethyl)imidazole: manufactured by Shikoku Chemical Industry Co., Ltd., melting point 230°C) 2E4MZ (2-ethyl-4-methylimidazole: manufactured by Shikoku Chemical Industries, melting point 40°C) 2P4MHZ (2-phenyl-4-methyl-5-hydroxymethylimidazole: manufactured by Shikoku Chemical Industry Co., Ltd., melting point 195°C) EH-4357S (Polyamine type latent hardener: ADEKA, melting point 78°C) FXR-1020 (amine adduct-based latent hardener: T&K TOKA, melting point 124°C) <Microcapsule type latent hardener> HX-3088FR (microcapsule type latent hardener: Asahi Kasei) HX-3742 (microcapsule type latent hardener: Asahi Kasei)

[0069] (E) Other ingredients ·KBM-403 (Silane coupling agent: Shin-Etsu Chemical Co., Ltd.) Special Black 4 (pigment: Orien Engineered Carbons)

[0070] 3. Evaluation and measurement methods Details of the evaluation and measurement methods for the LCM materials and their cured products in each experimental example are as follows.

[0071] 3.1 Area ratio of aggregates The LCM material was compression molded (mold temperature: 150°C, mold time: 700 seconds) to obtain a pre-cured product. This pre-cured product was then heat treated (curing temperature: 180°C, curing time: 60 minutes) to obtain a cured product (sample for measuring area ratio). The cured product was then cut and the resulting cross section was polished. The polished cross section was then observed at a magnification of 500x with a Hitachi High-Technologies Corporation scanning electron microscope (SEM) within an area of ​​250 μm x 180 μm in length and width, and the area ratio of agglomerates with a circular equivalent diameter of 1 μm or more present within this area (100 x the total area of ​​agglomerates with a circular equivalent diameter of 1 μm or more (μm 2 ) / total area of ​​the observation region (250 μm × 180 μm) was calculated.

[0072] Here, the cross section of the cured product to be observed by SEM was polished successively under the polishing conditions (i) to (vi) shown below. (i) Polishing with abrasive paper (240 grit) for 3 minutes (ii) Polishing with abrasive paper (600 grit) for 3 minutes (iii) Polishing for 3 minutes using a polishing pad (LAMPLAN, polishing cloth LAMPLAN 410) and a polishing liquid (LAMPLAN, high-press diamond slurry 3 μm) (iv) Polishing for 3 minutes using a polishing pad (LAMPLAN, Polishing Cloth LAMPLAN 410) and a polishing liquid (LAMPLAN, High Press Diamond Slurry 1 μm) (v) Polishing for 3 minutes using a polishing pad (Buhler, Mastertex 0.05 μm) and a polishing solution (Buhler, MasterPrep 0.05 μm) (vi) Polishing for 30 seconds using a polishing pad (Buhler, Mastertex 0.05 μm) and water instead of the polishing liquid.

[0073] The area ratio was calculated using Mitani Shoji Co., Ltd.'s image analysis and measurement software WinROOF2018. In addition, before performing image analysis of the SEM images of the polished cross-section, a composition analysis of the granular matter present in the cross-section was performed to distinguish between granular matter derived from pigments and inorganic fillers and granular matter derived from aggregates whose main component is resin, and the difference in contrast of each granular matter on the SEM image was understood. Then, using this information, only the granular matter corresponding to the aggregates was selected as the analysis target, and image analysis was performed to calculate the area ratio.

[0074] 3.2 Initial viscosity The viscosity of the LCM material within 1 hour after completion of preparation was measured using a Brookfield HB type viscometer at 25° C. and 20 rpm.

[0075] 3.3 Viscosity increase rate after 24 hours The viscosity of the LCM material 24 hours after completion of preparation (viscosity after 24 hours) was measured using a Brookfield HB type viscometer at 25°C and 20 rpm. The ratio of the viscosity after 24 hours to the initial viscosity (viscosity after 24 hours / initial viscosity) was calculated as the viscosity increase rate after 24 hours.

[0076] 3.4 Gel time Using the automatic curing time measuring device "Madoka" manufactured by Matsuo Sangyo Co., Ltd., the time until the LCM material gelled (gel time) was measured under the measurement conditions of a rotation speed of 120 rpm, a test temperature of 150°C, and a sample amount of 0.3 ml. The shorter the gel time, the better the fast curing property. However, if the gel time is too short, there is a high possibility that the LCM material will harden before molding after the supply of the LCM material is started by coating it on the substrate or release film, so the lower limit of the gel time is practically around 100 to 120 seconds or more, depending on the operating speed of the compression molding device actually used.

[0077] 3.5 Injectability evaluation Two tapes (thickness: 30 μm) were placed along both ends of the vertical side of a first glass substrate placed on a flat table, and a second glass substrate having the same vertical and horizontal sizes as the first glass substrate was placed on top of the first glass substrate. However, the second glass substrate was placed slightly shifted in the vertical side direction with respect to the first glass substrate. In this state, a laminate consisting of two glass substrates and two tapes was sandwiched with a clip to fix the glass substrates so that they do not shift horizontally, thereby obtaining a test specimen in which two parallel tapes were placed between two glass substrates. In this test specimen, a gap surrounded by two glass substrates and two tapes was formed, and the distance between the two glass substrates (the distance in the thickness direction of the test specimen) was 30 μm, and the distance between the two tapes (the distance in the horizontal direction of the test specimen) was 1 cm.

[0078] Next, the test piece was placed on a hot plate with a heating temperature set to 150°C, and the LCM material (0.2 g) was applied to the opening of the gap formed on one end side of the vertical side direction of the test piece. At this time, the LCM material was applied so as to be approximately evenly distributed along the horizontal side direction of the test piece. After application, the test piece was left for 700 seconds, so that the LCM material was allowed to permeate from the opening into the gap from one end side to the other end side of the vertical side direction of the test piece. Then, after 700 seconds had elapsed, a CCD camera installed above the test piece was used to measure the maximum permeation distance of the LCM material that had permeated from the opening into the gap in the vertical side direction of the test piece, with the opening being set as 0 μm (reference position). The evaluation criteria were as follows. A: The maximum penetration distance of LCM material is 1500μm or more B: The maximum penetration distance of the LCM material is 1000 μm or more and less than 1500 μm. C: The maximum penetration distance of the LCM material is less than 1000 μm

[0079] 3.6 Glass transition temperature Tg The glass transition temperature Tg of the LCM material was measured by DMA (Dynamic Mechanical Analysis) using a DMS6100 from Seiko Instruments Inc. (SII) for a cured product obtained by heating and curing the LCM material at 150°C for 60 minutes. The glass transition temperature Tg is the temperature at which the loss tangent (tan δ) reaches its maximum value in the change curve of the loss tangent (tan δ) versus temperature measured by the DMA method. Tan δ is calculated by dividing the loss modulus at a given temperature by the storage modulus at that temperature.

[0080] 3.7 Warpage evaluation The warpage was evaluated by the following procedure. First, the upper and lower dies in the compression molding device were heated to 150°C, and then an FR4 substrate (GN74240, manufactured by Global Net Co., Ltd.) with a length of 74 mm, width of 240 mm, and thickness of 300 μm was placed on the upper die. Next, the LCM material was applied on the release film, and the release film was placed on the lower die in the compression molding device with the surface on which the LCM material was applied facing up. Then, the lower die was operated, and compression molding was performed at 150°C / 700 seconds. The size of the cured product formed on the FR4 substrate was 67 mm long, 233 mm wide, and 250 μm thick. After the compression molding was completed, the FR4 substrate on which the cured product was formed was removed from the die and placed in a dryer set at 180°C for 1 hour. As a result, an evaluation sample was prepared in which a layer made of a cured product of the LCM material was formed on one side of the FR4 substrate. Next, this evaluation sample was placed on a horizontal table so that the surface on which the cured product layer was formed was the upper surface. In this state, the distance from the bottom surface of the evaluation sample to the base was measured. The distance was measured at eight locations on the outer periphery of the evaluation sample (four corners of the FR4 substrate and the midpoints between adjacent corners (four locations)), and the average of these measurements was taken as the warpage value.

[0081] 3.8 Dicing crack evaluation A test piece was prepared in which a hardened layer of the LCM material was formed on the FR4 substrate (product name: L6504C1, manufactured by Nikkan Kogyo Co., Ltd.) having a length and width of 40 mm x width of 40 mm and a thickness of 800 μm, and then the LCM material was printed at a length and width of 30 mm x width of 300 μm, and then the test piece was hardened in a hardening oven at 180 ° C for 60 minutes. A dicing tape (YHP-1510M3-30A, manufactured by Denka Co., Ltd.) was attached to the surface of the test piece on which the hardened layer was formed. A dicing blade (Microblade 59D-0.265T-40H, manufactured by Futawa Diamond Co., Ltd.) was attached to a dicing device (DAD3360, manufactured by Disco Co., Ltd.), and the rotation speed was set to 35000 rpm and the dicing speed to 350 mm / sec. The test piece attached to the dicing tape was diced so that the length and width of the hardened layer of the LCM material was 20 mm x 20 mm. The obtained test piece after dicing was peeled off from the dicing tape, placed on the base of an optical microscope with the side on which the cured layer of the LCM material was formed facing up, and the four sides on which the cured layer of the LCM material was diced were observed at 200x magnification to check for the presence or absence of cracks in the cured layer of the LCM material.The evaluation criteria are as follows: A: No cracks were observed. B: Cracks were observed.

[0082] 4. Evaluation Results The composition of each experimental example, as well as the area ratio of the aggregates, initial viscosity, viscosity increase rate after 24 hours, gel time, maximum particle size of the aggregates, Tg, warpage evaluation, and dicing crack evaluation are shown in Tables 1 to 3. In both experimental examples A and B, in the SEM observation carried out to determine the area ratio of the aggregates, no aggregates with a maximum circle equivalent diameter of 4 μm or more were observed within the SEM observation area of ​​250 μm x 180 μm.

[0083] [Table 1]

[0084]

Table 2

[0085]

Table 3

Claims

1. (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; (D) a curing catalyst, 1. A liquid compression molding material used at least to seal a gap between a substrate and an element disposed on the substrate in an electronic component, the liquid compression molding material comprising: The initial viscosity at 25°C is 10 Pa s to 460 Pa s, A liquid compression molding material, wherein the liquid compression molding material is cured under the conditions shown in the following (1), and the cured product satisfies the conditions shown in the following (2); (1) Mold temperature: 150°C, mold time: 700 seconds, curing temperature: 180°C, curing time: 60 minutes (2) When a cross section of the cured product is observed under a scanning electron microscope (magnification: 500x) over an area of ​​250 μm x 180 μm, the area ratio of aggregates having a circle-equivalent diameter of 1 μm or more within the area is 1.0% or less.

2. 2. The liquid compression molding material according to claim 1, wherein the curing catalyst (D) is a non-microencapsulated curing catalyst.

3. 3. The liquid compression molding material according to claim 2, wherein the non-microencapsulated curing catalyst comprises at least one selected from the group consisting of an imidazole compound and a modified aliphatic polyamine compound.

4. 4. The liquid compression molding material according to claim 2, wherein the non-microencapsulated curing catalyst comprises at least one selected from the group consisting of an imidazole compound having a melting point of 200°C or higher and a modified aliphatic polyamine compound having a melting point of 130°C or higher.

5. (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; (D) an imidazole compound having a melting point of 200°C or higher as a curing catalyst, The initial viscosity at 25°C is 10 Pa s to 460 Pa s, A liquid compression molding material used at least for sealing a gap between a substrate and an element disposed on the substrate in an electronic component having the substrate and the element.

6. The liquid compression molding material according to any one of claims 1 to 3 or 5, wherein the (B) curing agent includes at least one selected from the group consisting of acid anhydride curing agents and phenolic curing agents.

7. The liquid compression molding material according to any one of claims 1 to 3 or 5, wherein the (B) curing agent includes an acid anhydride-based curing agent and a phenol-based curing agent.

8. The liquid compression molding material according to any one of claims 1 to 3 or 5, wherein the blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is 60% by mass or more and less than 80% by mass.

9. The liquid compression molding material according to any one of claims 1 to 3 or 5, wherein the blending ratio of the (C) inorganic filler to all components constituting the liquid compression molding material is 60% by mass to 78.5% by mass.

10. The liquid compression molding material according to any one of claims 1 to 3 or 5, having an initial viscosity at 25 ° C. of 10 Pa · s to 250 Pa · s.

11. The liquid compression molding material according to any one of claims 1 to 3 or 5, wherein the average particle size of the inorganic filler (C) is 0.03 μm to 3 μm.

12. An electronic component comprising an encapsulant made of a cured product of the liquid compression molding material according to any one of claims 1 to 3 or 5.

13. A substrate; a semiconductor element disposed on the substrate; A semiconductor device comprising: a cured product of the liquid compression molding material according to any one of claims 1 to 3 or 5, which seals a gap between the semiconductor element and the substrate.

14. The semiconductor device according to claim 13 , wherein the cured product contains aggregates having a maximum equivalent circle diameter of 4 μm or less.

15. 10. A method for manufacturing an electronic component comprising: a substrate; an element disposed on the substrate; and a sealant made of a cured product of the liquid compression molding material that seals a gap between the element and the substrate, the method comprising at least a step of compression molding using the liquid compression molding material according to claim 1 to 3 or 5.

16. The method for producing an electronic component according to claim 15, wherein the cured product contains aggregates having a maximum equivalent circle diameter of 4 μm or less.