Conveyor and plating equipment

Abstract

To simplify the overall configuration of a plating apparatus. The transport device 700 includes a transport mechanism 710 for transporting a substrate Wf within a plating apparatus having a plurality of plating modules, a first hand 720 attached to the transport mechanism 710 for transferring the substrate Wf between each plating module of the plurality of plating modules, and a second hand 730 attached to the transport mechanism 710, the second hand 730 having a cleaning mechanism 740 for cleaning the substrate Wf arranged in each plating module and contact members for supplying power to the substrate Wf.

Description

[Technical field]

[0001] The present application relates to a conveying apparatus and a plating apparatus. [Background technology]

[0002] A cup-type electrolytic plating module is known as an example of a plating module. In the cup-type electrolytic plating module, a substrate (e.g., a semiconductor wafer) held by a substrate holder is immersed in a plating solution with the surface to be plated facing downward, and a voltage is applied between the substrate and an anode to deposit a conductive film on the surface of the substrate.

[0003] For example, Patent Document 1 discloses a plating apparatus equipped with a plurality of such plating modules. Each plating module of the plating apparatus includes a substrate cleaning member for cleaning the substrate surface to be plated after plating, and a contact cleaning member for cleaning a contact member for supplying electricity to the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7089133 Summary of the Invention [Problem to be solved by the invention]

[0005] The plating apparatus of the prior art has room for improvement in terms of simplifying the overall configuration of the plating apparatus.

[0006] In other words, in the plating apparatus of the prior art, it is necessary to provide a substrate cleaning member and a contact cleaning member in each of the multiple plating modules, which increases the number of parts in each plating module, and as a result, there is a risk that the configuration of the plating apparatus as a whole will become complicated.

[0007] Therefore, one object of the present application is to simplify the overall configuration of a plating apparatus. [Means for solving the problem]

[0008] According to one embodiment, a transport device is disclosed that includes a transport mechanism for transporting a substrate within a plating apparatus having a plurality of plating modules, a first hand attached to the transport mechanism for transferring a substrate to and from each plating module of the plurality of plating modules, and a second hand attached to the transport mechanism having a cleaning mechanism for cleaning a substrate arranged within each plating module and a contact member for supplying power to the substrate. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of the present embodiment. [Diagram 2] FIG. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment. [Diagram 3] FIG. 3 is a vertical cross-sectional view that illustrates a schematic configuration of the plating module of the present embodiment. [Figure 4] FIG. 4 is a perspective view showing the overall configuration of the conveying device of the present embodiment. [Diagram 5] FIG. 5 is a perspective view showing the configuration of the second hand of the transport device. [Figure 6] FIG. 6 is a perspective view showing the configuration of a first hand and a second hand of the transport device. [Figure 7] FIG. 7 is a perspective view showing a state in which the substrate and the contact members are being cleaned using the transport device. [Figure 8] FIG. 8 is a vertical cross-sectional view showing a state in which the substrate and the contact members are being cleaned using the transfer device. [Figure 9] FIG. 9 is an enlarged longitudinal sectional view of a portion of FIG. [Figure 10A] FIG. 10A is a perspective view for explaining the operation of the transport device. [Figure 10B] FIG. 10B is a perspective view for explaining the operation of the transport device. [Figure 10C] FIG. 10C is a perspective view for explaining the operation of the transport device. [Figure 10D] FIG. 10D is a perspective view for explaining the operation of the transport device. [Figure 10E] FIG. 10E is a perspective view for explaining the operation of the transport device. [Figure 10F] FIG. 10F is a perspective view for explaining the operation of the transport device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and redundant description will be omitted.

[0011] <Overall configuration of plating equipment> Fig. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. Fig. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a presoak module 300, a plating module 400, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0012] The load port 100 is a module for loading a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading a substrate from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to transfer a substrate between the load port 100, the aligner 120, and the spin rinse dryer 600. When transferring a substrate between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrate via a temporary placement table (not shown).

[0013] The aligner 120 is a module for aligning the position of an orientation flat, a notch, etc. of a substrate in a predetermined direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary.

[0014] The presoak module 300 is configured to perform a presoak process in which an oxide film with high electrical resistance present on the surface of a seed layer formed on the plated surface of a substrate before plating is etched away with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are arbitrary. The plating module 400 performs plating on the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged in a vertical arrangement of three modules and a horizontal arrangement of four modules, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0015] The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers are arranged vertically, but the number and arrangement of the spin rinse dryers are arbitrary. The transport device 700 is a device for transporting the substrate between multiple modules in the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000, and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0016] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is carried into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette in the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, etc. of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the transfer apparatus 700.

[0017] The transfer device 700 transfers the substrate received from the transfer robot 110 to the plating module 400. The plating module 400 performs a pre-wet process on the substrate. The transfer device 700 transfers the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transfer device 700 transfers the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate. Furthermore, the plating module 400 performs a cleaning process on the substrate that has been subjected to the plating process.

[0018] The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600. The spin rinse dryer 600 performs a drying process on the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0019] <Plating module configuration> Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. FIG. 3 is a vertical cross-sectional view that shows a schematic configuration of the plating module 400 in this embodiment. As shown in FIG. 3, the plating module 400 includes a plating tank 410 for containing a plating solution. The plating tank 410 is a container having a cylindrical side wall and a circular bottom wall, and a circular opening is formed at the top. The plating module 400 also includes an overflow tank 405 disposed outside the top opening of the plating tank 410. The overflow tank 405 is a container for receiving the plating solution overflowing from the top opening of the plating tank 410.

[0020] The plating module 400 includes a membrane 420 that vertically divides the interior of a plating tank 410. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the membrane 420. The cathode region 422 and the anode region 424 are each filled with a plating solution. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424. A resistor 450 is disposed in the cathode region 422 facing the membrane 420. The resistor 450 is a member for achieving uniform plating on the plating surface Wf-a of the disk-shaped substrate Wf, and is composed of a plate-shaped member with a large number of holes formed therein.

[0021] The plating module 400 also includes a substrate holder 440 for holding the substrate Wf with the surface Wf-a to be plated facing downward. The substrate holder 440 has a contact member 494-4 for supplying power to the substrate Wf held by the substrate holder 440. The plating module 400 also includes a lifting mechanism 442 for lifting and lowering the substrate holder 440. The lifting mechanism 442 can be realized by a known mechanism such as a motor. The plating module 400 also includes a rotation mechanism 446 for rotating the substrate holder 440 so that the substrate Wf rotates around a virtual rotation axis extending vertically through the center of the surface Wf-a to be plated. The rotation mechanism 446 can be realized by a known mechanism such as a motor.

[0022] The plating module 400 is configured to perform a plating process on the plating surface Wf-a of the substrate Wf by immersing the substrate Wf in the plating solution in the cathode region 422 using the lifting mechanism 442 and rotating the substrate Wf using the rotation mechanism 446 while applying a voltage between the anode 430 and the substrate Wf.

[0023] The plating module 400 also includes a tilting mechanism 447 configured to tilt the substrate holder 440. The tilting mechanism 447 can be realized by a known mechanism, such as a tilt mechanism.

[0024] <Conveyor device configuration> 4 is a perspective view showing the overall configuration of the transport device 700 of this embodiment. The transport device 700 includes a transport mechanism 710 for transporting the substrate Wf in the plating apparatus 1000 having a plurality of plating modules 400 (24 in this embodiment). The transport device 700 also includes a first hand 720 attached to the transport mechanism 710. The first hand 720 is a member for transferring the substrate Wf between each plating module of the plurality of plating modules 400. The first hand 720 is attached to the transport mechanism 710 via a first arm 722. The first arm 722 is configured to move the first hand 720 into each plating module 400 or retract it from each plating module 400 by rotating a plurality of link members connected to each other.

[0025] The transport device 700 includes a second hand 730 attached to the transport mechanism 710. The second hand 730 has a cleaning mechanism 740 for cleaning the substrate Wf and the contact members 494-4 arranged in each plating module 400. The second hand 730 is attached to the transport mechanism 710 via a second arm 732. The second arm 732 is configured to move the second hand 730 into each plating module 400 or retract it from each plating module 400 by rotating a plurality of link members connected to each other.

[0026] The transport mechanism 710 includes a first transport mechanism 712 for moving the first hand 720 and the second hand 730 in a horizontal direction (the traveling direction of the transport device 700). The first transport mechanism 712 can be realized by a known mechanism such as a motor that moves the first hand 720 and the second hand 730 along a traveling rail (not shown) that extends in the horizontal direction. The transport mechanism 710 includes a second transport mechanism 714 for moving the first hand 720 and the second hand 730 in a vertical direction. The second transport mechanism 714 can be realized by a known mechanism such as a motor that moves the first hand 720 and the second hand 730 along a lift rail 713 that extends in the vertical direction.

[0027] Fig. 5 is a perspective view showing the configuration of the second hand 730 of the transport device. Fig. 6 is a perspective view showing the configurations of the first hand 720 and the second hand 730 of the transport device. Fig. 7 is a perspective view showing a state in which the substrate and the contact members 494-4 are being cleaned using the transport device.

[0028] As shown in Figures 5 to 7, the first hand 720 is configured to hold the substrate Wf with the surface to be plated Wf-a facing downward by adsorbing the back surface of the surface to be plated Wf-a of the substrate Wf.

[0029] The cleaning mechanism 740 of the second hand 730 includes a support plate 742 fixed to the tip of the second arm 732 via a bracket 733. The support plate 742 is made of a transparent disc-shaped member having approximately the same size as the substrate Wf, and is disposed so as to face the plating surface Wf-a of the substrate Wf. The support plate 742 is disposed between a first cleaning member and a second cleaning member, which will be described later, and is a member for supporting the first cleaning member and the second cleaning member.

[0030] The cleaning mechanism 740 includes a first cleaning member 744 that can be positioned below the first hand 720. The first cleaning member 744 has a first injection port 744a for injecting a cleaning liquid onto the plating surface Wf-a of the substrate Wf held by the first hand 720.

[0031] The first cleaning member 744 is configured to be rotatable so that the first jetting port 744a moves in the circumferential direction along the plating surface Wf-a of the substrate Wf. More specifically, the cleaning mechanism 740 includes a support shaft 748 extending in a vertical direction relative to the support plate 742. The first cleaning member 744 includes a plurality of (three in this embodiment) first nozzles 744-1 to 744-3 extending radially from the upper end of the support shaft 748 and supported rotatably relative to the support shaft 748. The first nozzles 744-1 to 744-3 are supplied with the cleaning liquid via a cleaning liquid source and a flow path (not shown). The first jetting port 744a is configured to jet the cleaning liquid obliquely upward from the extending portion of the first nozzles 744-1 to 744-3.

[0032] The first cleaning member 744 (first nozzle) is configured to rotate about the support shaft 748 by a reaction force of the cleaning liquid jetted from the extending portions of the first nozzles 744-1 to 744-3 obliquely upward to hit the plating surface Wf-a of the substrate Wf. Note that, in the present embodiment, an example has been shown in which the first cleaning member 744 is rotated by jetting the cleaning liquid obliquely upward from the extending portions of the first nozzles 744-1 to 744-3, but the present invention is not limited to this, and the first cleaning member 744 may be rotated by other means.

[0033] The cleaning mechanism 740 also includes a second cleaning member 746 disposed below the first cleaning member 744. The second cleaning member 746 has a second jet port 746a for jetting the cleaning liquid toward the contact member 494-4. Furthermore, the second cleaning member 746 has a third jet port 746b for jetting the cleaning liquid toward the support plate 742.

[0034] The second cleaning member 746 is configured to be rotatable such that the second jetting port 746a moves in the circumferential direction along the contact member 494-4 surrounding the second cleaning member 746. More specifically, the second cleaning member 746 includes a plurality of (three in this embodiment) second nozzles 746-1 to 746-3 that extend radially from the lower end of the support shaft 748 and are supported rotatably relative to the support shaft 748. The second nozzles 746-1 to 746-3 are supplied with the cleaning liquid via a cleaning liquid source and a flow path (not shown). The second jetting port 746a is configured to jet the cleaning liquid from the tip of the extension portion of the second nozzles 746-1 to 746-3. The third jetting port 746b is configured to jet the cleaning liquid obliquely upward from the extension portion of the second nozzles 746-1 to 746-3.

[0035] The second cleaning member 746 (second nozzle) is configured to rotate about the support shaft 748 by the reaction force of the cleaning liquid jetted from the extending portion of the second nozzles 746-1 to 746-3 by jetting the cleaning liquid obliquely upward and hitting the support plate 742. Note that, in the present embodiment, an example has been shown in which the second cleaning member 746 is rotated by jetting the cleaning liquid obliquely upward from the extending portion of the second nozzles 746-1 to 746-3, but the present embodiment is not limited to this, and the second cleaning member 746 may be rotated by other means. For example, in the present embodiment, the extending portions of the second nozzles 746-1 to 746-3 each extend radially from the lower end of the support shaft 748, and the tip portion is bent in a direction intersecting the radial direction. Therefore, the second cleaning member 746 (second nozzle) may be rotated by the reaction force of the jet of the cleaning liquid jetted from the third jet port 746b.

[0036] The second hand 730 includes a camera 750 disposed on the support plate 742 (bracket 733). The camera 750 is configured to capture an image of the contact members 494-4 through the transparent support plate 742.

[0037] Fig. 8 is a vertical cross-sectional view showing a state in which the substrate and the contact members are cleaned using the transport device. Fig. 9 is a vertical cross-sectional view showing an enlarged portion of Fig. 8. As shown in Figs. 8 and 9, the substrate holder 440 includes a support mechanism 494 for supporting the outer periphery of the surface to be plated of the substrate.

[0038] The support mechanism 494 includes an annular support member 494-1 for supporting the outer periphery of the surface to be plated of the substrate. The support member 494-1 has a flange 494-1a that protrudes toward the center of the annular support member 494-1. An annular seal member 494-2 is disposed on the flange 494-1a. The seal member 494-2 is an elastic member. The support member 494-1 supports the outer periphery of the surface to be plated of the substrate via the seal member 494-2.

[0039] The support mechanism 494 includes an annular pedestal 494-3 attached to the inner circumferential surface of the support member 494-1. The pedestal 494-3 is a conductive member such as stainless steel. The support mechanism 494 includes an annular contact member 494-4 for supplying power to the substrate. The contact member 494-4 is annularly attached to the inner circumferential surface of the pedestal 494-3 by a screw or the like. The support member 494-1 holds the contact member 494-4 via the pedestal 494-3.

[0040] 8 and 9, the second hand 730 is disposed in the plating module 400 so that the tips (second jet ports 746a) of the second nozzles 746-1 to 746-3 face the contact member 494-4. In this state, the annular contact member 494-4 can be cleaned by jetting a cleaning liquid from the second jet ports 746a while rotating the second nozzles 746-1 to 746-3.

[0041] Next, the operation of the transport device 700 will be described. Figures 10A to 10F are perspective views for explaining the operation of the transport device. When the plating process of the substrate Wf is completed, as shown in Figure 10A, the transport device 700 uses the first arm 722 to move the first hand 720 into the plating module 400. At this time, the second hand 730 is in a state of being retracted outside the plating module 400.

[0042] 10B, the transport device 700 uses the second transport mechanism 714 to lower the first hand 720. The first hand 720 suction-holds the rear surface of the surface to be plated Wf-a of the substrate Wf.

[0043] 10C, the transfer device 700 lifts the first hand 720 using the second transfer mechanism 714. As a result, the substrate Wf is held by the first hand 720 and lifted up.

[0044] Next, as shown in FIG. 10D, the transport device 700 uses the second arm 732 to move the second hand 730 into the plating module 400.

[0045] 10E, the transport device 700 uses the second transport mechanism 714 to lower the first hand 720 and the second hand 730. The transport device 700 lowers the first hand 720 and the second hand 730 until the tips (second ejection ports 746a) of the second nozzles 746-1 to 746-3 face the contact member 494-4.

[0046] 10F, the transport device 700 ejects the cleaning liquid from the first ejection port 744a, the second ejection port 746a, and the third ejection port 746b. As a result, the first nozzles 744-1 to 744-3 and the second nozzles 746-1 to 746-3 rotate due to the reaction force of the ejection of the cleaning liquid. The cleaning liquid is ejected from the first ejection port 744a while rotating the first nozzles 744-1 to 744-3, so that the cleaning liquid is sprayed on the entire surface Wf-a to be plated of the substrate Wf, and the entire surface Wf-a to be plated of the substrate Wf is cleaned. In addition, the cleaning liquid is ejected from the second ejection port 746a while rotating the second nozzles 746-1 to 746-3, so that the cleaning liquid is sprayed on the entire contact member 494-4, and the entire contact member 494-4 is cleaned.

[0047] According to this embodiment, it is possible to simplify the overall configuration of the plating apparatus 1000. That is, in the conventional technology, each of the multiple plating modules is provided with a cleaning mechanism for cleaning the substrate and the contact members, which increases the number of parts in each plating module, which may result in a complex configuration of the plating apparatus as a whole.

[0048] In contrast, according to this embodiment, the transfer device 700 is provided with a cleaning mechanism 740 for cleaning the substrates and contact members of each plating module 400, so there is no need to provide a cleaning mechanism for each plating module 400. Therefore, according to this embodiment, the number of parts in each plating module 400 can be reduced, and the overall configuration of the plating apparatus 1000 can be simplified.

[0049] Although several embodiments of the present invention have been described above, the above-mentioned embodiments of the present invention are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of each component described in the claims and specification is possible within the scope of solving at least a part of the above-mentioned problems or achieving at least a part of the effects.

[0050] The present application discloses, as one embodiment, a transport device including a transport mechanism for transporting a substrate within a plating apparatus having a plurality of plating modules, a first hand attached to the transport mechanism for transferring a substrate to and from each plating module of the plurality of plating modules, and a second hand attached to the transport mechanism for transferring a substrate to and from each plating module of the plurality of plating modules, the second hand having a cleaning mechanism for cleaning a substrate arranged within each plating module and a contact member for supplying power to the substrate.

[0051] The present application also discloses, as one embodiment, a conveying device, in which the first hand is configured to hold a substrate with a surface to be plated facing downward, and the cleaning mechanism includes: a first cleaning member that can be positioned below the first hand, the first cleaning member having a first nozzle for spraying a cleaning liquid toward the surface to be plated of the substrate held by the first hand, and a second cleaning member that is positioned below the first cleaning member, the second cleaning member having a second nozzle for spraying a cleaning liquid toward the contact member.

[0052] In addition, as one embodiment, the present application discloses a conveying device in which the first cleaning member is configured to be rotatable so that the first jet nozzle moves circumferentially along the plated surface of the substrate, and the second cleaning member is configured to be rotatable so that the second jet nozzle moves circumferentially along the contact member surrounding the second cleaning member.

[0053] The present application also discloses, as one embodiment, a conveying device, wherein the cleaning mechanism is disposed between the first cleaning member and the second cleaning member and further includes a support plate for supporting the first cleaning member and the second cleaning member, and the second cleaning member further has a third nozzle for spraying cleaning liquid against the support plate.

[0054] The present application also discloses, as one embodiment, a conveying device, wherein the cleaning mechanism further includes a support shaft extending perpendicular to the support plate, the first cleaning member includes a plurality of first nozzles extending radially from an upper end of the support shaft and rotatably supported on the support shaft, and the first nozzles are configured to spray cleaning liquid diagonally upward from the extended portion of the first nozzles.

[0055] The present application also discloses, as one embodiment, a conveying device in which the second cleaning member includes a plurality of second nozzles extending radially from a lower end of the support shaft and supported rotatably on the support shaft, the second nozzles are configured to spray cleaning liquid from the tips of the extension portions of the second nozzles, and the third nozzles are configured to spray cleaning liquid diagonally upward from the extension portion of the second nozzles.

[0056] In addition, as one embodiment, the present application discloses a conveying device, wherein the conveying mechanism includes a first conveying mechanism for moving the first hand and the second hand in a horizontal direction, and a second conveying mechanism for moving the first hand and the second hand in a vertical direction.

[0057] In addition, as one embodiment, the present application discloses a conveying device further including a first arm configured to move the first hand into each plating module and retract it out of each plating module, and a second arm configured to move the second hand into each plating module and retract it out of each plating module.

[0058] The present application also discloses, as one embodiment, a conveying device in which the support plate is made of a transparent material, and the second hand is positioned on the support plate and further includes a camera configured to acquire an image of the contact member through the support plate.

[0059] In addition, as one embodiment, the present application discloses a plating apparatus including a plurality of plating modules, each of which includes a plating tank configured to contain a plating solution and a substrate holder configured to hold a substrate with the surface to be plated facing downward and having a contact member for supplying power to the substrate, and a conveying device described above. [Explanation of symbols]

[0060] 400 Plating Module 410 Plating tank 440 PCB Holder 494-4 Contact material 700 Transport Equipment 710 Conveyor mechanism 712 First conveying mechanism 714 Second Transport Mechanism 720 First Hand 722 First Arm 730 Second Hand 732 Second Arm 740 Cleaning mechanism 742 Support Plate 744 First cleaning member 744-1~744-3 First nozzle 744a First Jet 746 Second cleaning material 746-1~746-3 Second Nozzle 746a Second Jet 746b Third Jet 748 Support shaft 750 Camera 1000 Plating Equipment Wf substrate Wf-a Plated surface

Claims

1. a transport mechanism for transporting substrates within a plating apparatus having a plurality of plating modules; a first hand attached to the transport mechanism for transferring a substrate to and from each plating module of the plurality of plating modules; a second hand attached to the transport mechanism, the second hand having a cleaning mechanism for cleaning the substrates and the contact members for supplying power to the substrates arranged in each of the plating modules; A conveying device comprising:

2. The first hand is configured to hold a substrate with a surface to be plated facing downward, The cleaning mechanism includes: a first cleaning member that can be disposed below the first hand, the first cleaning member having a first injection port for injecting a cleaning liquid onto a surface to be plated of a substrate held by the first hand; a second cleaning member disposed below the first cleaning member, the second cleaning member having a second injection port for injecting a cleaning liquid onto the contact member; Including, The conveying device according to claim 1 .

3. the first cleaning member is configured to be rotatable such that the first jet nozzle moves in a circumferential direction along the plating surface of the substrate, The second cleaning member is configured to be rotatable such that the second jet port moves in a circumferential direction along the contact member surrounding the second cleaning member. The conveying device according to claim 2 .

4. the cleaning mechanism further includes a support plate disposed between the first cleaning member and the second cleaning member for supporting the first cleaning member and the second cleaning member; The second cleaning member further has a third injection port for injecting a cleaning liquid onto the support plate. The conveying device according to claim 3.

5. The cleaning mechanism further includes a support shaft extending perpendicular to the support plate, the first cleaning member includes a plurality of first nozzles extending radially from an upper end of the support shaft and rotatably supported on the support shaft; The first nozzle is configured to spray cleaning liquid obliquely upward from an extension of the first nozzle.

5. The conveying device according to claim 4.

6. the second cleaning member includes a plurality of second nozzles extending radially from a lower end of the support shaft and rotatably supported on the support shaft; the second nozzle is configured to inject cleaning liquid from a tip of an extension portion of the second nozzle; The third nozzle is configured to spray cleaning liquid obliquely upward from an extension portion of the second nozzle.

6. The conveying device according to claim 5.

7. the transport mechanism includes a first transport mechanism for moving the first hand and the second hand in a horizontal direction, and a second transport mechanism for moving the first hand and the second hand in a vertical direction; Including, 7. The conveying device according to claim 6.

8. a first arm configured to move the first hand into each of the plating modules and to move the first hand out of each of the plating modules; a second arm configured to move the second hand into each of the plating modules and to move the second hand out of each of the plating modules; Further comprising:

8. The conveying device according to claim 7.

9. The support plate is made of a transparent material, the second hand further includes a camera disposed on the support plate and configured to capture an image of the contact member through the support plate.

9. The conveying device according to claim 8.

10. a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward and having a contact member for supplying power to the substrate; a plurality of plating modules each including: A conveying device according to any one of claims 1 to 9, 13. A plating apparatus comprising: