Method for manufacturing connection structure, and transfer method for singulated adhesive film
By arranging adhesive films on substrates through an elastic resin layer and using laser ablation to reorganize them, the method addresses the productivity issue caused by substrate irregularities, achieving improved transferability and higher productivity in Micro LED manufacturing.
KR1020260113136APending Publication Date: 2026-07-21DEXERIALS CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- KR · KR
- Patent Type
- Applications
- Current Assignee / Owner
- DEXERIALS CORP
- Filing Date
- 2023-02-07
- Publication Date
- 2026-07-21
AI Technical Summary
Technical Problem
The transfer rate of Micro LEDs in the laser lift-off method is reduced due to irregularities such as wiring or insulating films on the substrate, leading to decreased productivity.
Method used
A method involving the arrangement of an adhesive film on a substrate through an elastic resin layer, followed by a transfer process using a laser ablation technique to reorganize the adhesive film, ensuring the peeling force against the elastic resin layer is lower than against the substrate, allowing for precise and efficient transfer even on substrates with irregularities.
Benefits of technology
This approach enhances the transferability of adhesive films on substrates with irregularities, thereby improving productivity and enabling high-resolution displays.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure PAT00003_ABST
Abstract
The present invention provides a method for manufacturing a connection structure capable of improving productivity even when irregularities exist on a substrate, and a method for transferring an adhesive film. The method comprises an arrangement process in which an adhesive film is arranged on a substrate via an elastic resin layer, a transfer process in which the adhesive film arranged on the elastic resin layer is transferred to the substrate by pressing the substrate against the substrate, and a mounting process in which an electronic component is mounted on the adhesive film arranged on the substrate. The size of the adhesive film is 200 μm or less, and the peel force of the adhesive film against the elastic resin layer is smaller than the peel force of the adhesive film against the substrate. As a result, good transferability of the adhesive film is obtained even on a substrate having irregularities such as wiring and an insulating film on the wiring surface, thereby improving productivity.
Need to check novelty before this filing date? Find Prior Art