Grinding apparatus

Abstract

A grinding device according to one or more embodiments of the present disclosure comprises a grinding unit for grinding a molding resin layer of a workpiece, a measuring unit for measuring the thickness of the molding resin layer, and a control unit. The control unit controls the measuring unit to measure the thickness of the molding resin layer, obtains thickness information of the molding resin layer from the measuring unit, determines grinding conditions based on the thickness information of the molding resin layer, and controls the grinding unit to perform a grinding process corresponding to the grinding conditions on the workpiece. The workpiece comprises a substrate and a molding resin layer covering the substrate, and the molding resin layer may be colored or opaque.

Description

Technology Field

[0001] The present invention relates to a grinding device, and more specifically, to a grinding device for precisely grinding a molding resin layer of a workpiece. Background Technology

[0002] In a semiconductor manufacturing process, after placing a silicon chip or a copper pillar on a glass substrate, a molding resin layer covering the silicon chip or the copper pillar can be formed using a molding resin. Subsequently, a process of forming wiring on the processed surface by processing the surface through grinding can be performed.

[0003] In this process, grinding of the molding resin layer may be performed to expose the silicon chip or copper pillar. However, since the molding resin layer completely covers the silicon chip or copper pillar and the molding resin is colored or opaque, a conventional optical detector cannot detect the location or structure of the silicon chip or copper pillar covered by the molding resin layer from the outside.

[0004] Accordingly, for example, Patent Document 1 (Japanese Patent Publication No. 2017-191876) discloses a technique in which the thickness to a silicon chip or copper pillar is calculated indirectly based on the height of the stage prior to grinding and the thickness information of the workpiece, and the calculated information is used for grinding. The problem to be solved

[0005] The problem that the present invention aims to solve is to provide a grinding device capable of precisely grinding a molding resin layer covering a substrate.

[0006] However, the problems that the present invention aims to solve are not limited to those mentioned above, and other problems can be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0007] To solve the above-mentioned problem, a grinding device according to one embodiment of the present disclosure includes a grinding unit for grinding a molding resin layer of a workpiece, a measuring unit for measuring the thickness of the molding resin layer, and a control unit. The control unit controls the measuring unit to measure the thickness of the molding resin layer, obtains thickness information of the molding resin layer from the measuring unit, determines grinding conditions based on the thickness information of the molding resin layer, and controls the grinding unit to perform a grinding process corresponding to the grinding conditions on the workpiece. The workpiece includes a substrate and the molding resin layer covering the substrate, and the molding resin layer may be colored or opaque.

[0008] A grinding device according to one embodiment of the present disclosure comprises a measuring unit fixed to a first workpiece and measuring the thickness of a molding resin layer of a workpiece, a grinding unit fixed to a second workpiece different from the first workpiece and grinding the molding resin layer, a conveying unit conveying the workpiece between the first workpiece and the second workpiece, and a control unit. The control unit may control the measuring unit to measure the thickness of the molding resin layer, obtain thickness information of the molding resin layer from the measuring unit, determine grinding conditions based on the thickness information of the molding resin layer, control the conveying unit to convey the workpiece to the grinding unit, and control the grinding unit to perform a grinding process corresponding to the grinding conditions on the molding resin layer.

[0009] A grinding device according to one embodiment of the present disclosure comprises: a grinding unit for grinding a molding resin layer of a workpiece; a measuring unit for measuring the thickness of the molding resin layer and fixed to the same workpiece as the workpiece to which the grinding unit is fixed; wherein the control unit controls the measuring unit to measure the thickness of the molding resin layer, obtains thickness information of the molding resin layer from the measuring unit, determines grinding conditions based on the thickness information of the molding resin layer, and controls the grinding unit to perform a grinding process corresponding to the grinding conditions for the workpiece, wherein the workpiece comprises a substrate and the molding resin layer covering the substrate, and the molding resin layer may be colored or opaque. Effects of the invention

[0010] A grinding device according to one or more embodiments of the present disclosure can improve the precision of the grinding process for a molding resin layer by including a measuring unit for measuring the thickness of the molding resin layer.

[0011] The effects of the present invention are not limited to the effects described above, and unmentioned effects will be clearly understood by those skilled in the art from this specification and the attached drawings. Brief explanation of the drawing

[0012] FIG. 1 is a cross-sectional view of a workpiece according to one or more embodiments of the present disclosure. FIG. 2 is a plan view illustrating the schematic configuration of a grinding device according to one or more embodiments of the present disclosure. FIG. 3 is a plan view illustrating the schematic configuration of a grinding device according to one or more embodiments of the present disclosure. FIG. 4 is a plan view illustrating the schematic configuration of a grinding device according to one or more embodiments of the present disclosure. Specific details for implementing the invention

[0013] Embodiments of the present invention will be described in detail below with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. Additionally, identical elements in the description of the drawings are denoted by the same reference numerals, and redundant descriptions are omitted. The dimensional ratios in the drawings are exaggerated for convenience of explanation and may differ from the actual ratios.

[0014] In the following, embodiments of the present disclosure will be described clearly and in detail so that a person skilled in the art can easily practice the present disclosure.

[0015] In this specification, an element described as being "separated" from another element in a specific direction (e.g., vertically separated, horizontally separated, etc.) and / or an element described as being "separated" from another element may be understood as being separated from direct contact with another element in a specific direction (e.g., vertically isolated, horizontally separated, etc.). Likewise, elements described as being "separated" from each other in a specific direction (e.g., vertically separated, horizontally separated, etc.) and / or elements described as being "separated" from each other may be understood as being separated from direct contact with each other in a specific direction (e.g., vertically separated, horizontally separated, etc.). Similarly, in this specification, a structure positioned between two different structures to separate the two different structures may be understood as being configured to separate the two different structures so that they do not come into direct contact with each other.

[0016] First, with reference to FIG. 1, the configuration of a workpiece (90) that is ground by a grinding unit (10) of a grinding device (1) according to one embodiment of the present disclosure will be described. In addition, the grinding device (1) according to one embodiment of the present disclosure can be used in a process in which, in a semiconductor manufacturing process, a silicon chip (93) or a copper pillar (94) is mounted on a glass substrate (95), then encapsulated by a molding resin to form a molding resin layer (92), and then the surface is processed by the grinding unit (10) to form wiring again. However, the process in which the grinding device (1) according to one embodiment of the present disclosure is used is not limited to the example described above, and the grinding device (1) can be used in various process technologies.

[0017] FIG. 1 is a cross-sectional view of a workpiece (90) according to one or more embodiments of the present disclosure.

[0018] As illustrated in FIG. 1, the workpiece (90) may include a substrate (91) and a molding resin layer (92) configured to cover the substrate (91). As illustrated in FIG. 1, the substrate (91) may include a silicon chip (93), a copper pillar (94), and a glass substrate (95). The copper pillar (94) may be a terminal connecting the silicon chip (93) and the substrate for the semiconductor package. The substrate (91) may be, for example, a semiconductor substrate.

[0019] The silicon chip (93) and copper pillar (94) can be placed on the upper surface of the glass substrate (95) as shown in FIG. 1.

[0020] The molding resin layer (92) may be colored or opaque. The material forming the molding resin layer (92) is not particularly limited, but may be a thermoplastic resin such as epoxy resin or silicone resin, or a thermoplastic resin such as PPS resin. In addition, in the present disclosure, "colored or opaque" is defined to mean "the total light transmittance in the visible light wavelength range of 360 nm to 830 nm is 1% or less when measured by a method based on [Test method for total light transmittance of plastic-transparent materials] of JIS K 7361-1: 1997 (corresponding to ISO 13468-1: 1996)."

[0021] Next, the configuration of a grinding device (1) according to one embodiment of the present disclosure will be described with reference to FIGS. 2 and FIGS. 3. FIGS. 2 is a plan view illustrating the schematic configuration of a grinding device (1) according to one or more embodiments of the present disclosure. FIGS. 3 is a plan view illustrating the schematic configuration of a grinding device (1) according to one or more embodiments of the present disclosure.

[0022] According to one embodiment, the grinding device (1) may include a grinding unit (10) for grinding a molding resin layer (92) of a workpiece (90) as illustrated in FIGS. 2 and 3, a measuring unit (20) for measuring the thickness of the remaining molding resin layer (92), and a control unit (30) for controlling the grinding unit (10). The grinding device (1) according to one embodiment may be used in an RDL process or a face-up process.

[0023] According to one embodiment, the grinding unit (10) and the measuring unit (20) can be fixed to the same workpiece. Since the grinding unit (10) can grind the molding resin layer (92) while the measuring unit (20) measures the thickness of the molding resin layer (92) in real time, the grinding time can be shortened and a high-precision grinding process can be performed.

[0024] The grinding unit (10) can perform a grinding process for grinding the molding resin layer (92) of a workpiece (90) having a substrate (91) and a molding resin layer (92). The grinding unit (10) may include a known grinding disc (or grinding wheel). The grinding unit (10) is positioned on top of the workpiece (90). In some embodiments, when the grinding unit (10) grinds the molding resin layer (92), the supply unit (50) may supply liquid to the grinding area of ​​the molding resin layer (92). Here, the grinding area may refer to one area within the entire area of ​​the molding resin layer (92) where the grinding process is performed by the grinding unit (10). For example, the grinding area may be one area within the entire area of ​​the molding resin layer (92) that overlaps vertically with the grinding unit (10).

[0025] The measuring unit (20) measures the thickness of the molding resin layer (92). The measuring unit (20) is positioned on the upper part of the workpiece (90).

[0026] According to some embodiments, the measuring unit (20) measures the thickness of the molding resin layer (92) using the terahertz pulse echo method. By using the terahertz pulse echo method in this way, the thickness of the colored or opaque molding resin layer (92) can be appropriately measured. Since the terahertz pulse echo method is a known method, a detailed description is omitted here.

[0027] According to some embodiments, when the measuring unit (20) measures the thickness of the molding resin layer (92), the removal unit (60) can remove liquid from the measuring area of ​​the molding resin layer (92). Here, the measuring area may refer to a part of the entire area of ​​the molding resin layer (92) where the measuring process by the measuring unit (20) is performed. For example, the measuring area may be a part of the entire area of ​​the molding resin layer (92) that overlaps vertically with the measuring unit (20).

[0028] The removal unit (60) may include a previously disclosed air injection device. In this way, by installing the removal unit (60), liquid can be properly removed from the measurement area of ​​the molding resin layer (92), and the thickness of the measurement area of ​​the molding resin layer (92) can be properly measured using the terahertz pulse echo method.

[0029] The control unit (30) can determine grinding conditions and control the grinding unit (10) based on the thickness information of the molding resin layer (92) measured by the measuring unit (20).

[0030] The control unit (30) is operatively connected to the measuring unit (20) and the grinding unit (10) and can control the overall operations of the grinding device (1). The control unit (30) may be implemented in hardware, firmware, software, or any combination thereof. For example, the control unit (30) may include computing devices such as a workstation computer, a desktop computer, a laptop computer, or a tablet computer. The control unit (30) may include complex processors such as a microprocessor, CPU, GPU, etc., processors configured by software, dedicated hardware, or firmware. The control unit (30) may be implemented by, for example, a general-purpose computer or application-specific hardware such as a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), and an Application Specific Integrated Circuit (ASIC). The control unit (30) may be implemented as instructions stored on a machine-readable medium that can be read and executed by at least one processor. Here, a machine-readable medium may include any mechanism for storing and / or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include Read Only Memory (ROM), Random Access Memory (RAM), magnetic disk storage media, optical storage media, flash memory devices, electrical, optical, acoustic, or other forms of radio signals (e.g., carrier waves, infrared signals, digital signals, etc.) and any other signals.

[0031] In some embodiments, the control unit (30) may determine the thickness of the molding resin layer (92) as the “final target thickness” such that the upper surface of the molding resin layer (92) is positioned at the same vertical level as the upper surface of the silicon chip (93) and / or copper pillar (94). The final target thickness may be determined based on the vertical distance (L) of the molding resin layer (92) from the upper surface of the molding resin layer (92) to the upper surface of the silicon chip (93) and / or copper pillar (94). For example, if the total thickness of the molding resin layer (92) is 1 mm and the vertical distance (L) is 100 μm, the final target thickness of the molding resin layer (92) may be 900 μm. However, this is merely an example, and the control unit (30) may determine the final target thickness of the molding resin layer (92) based on various methods.

[0032] The control unit (30) can control the grinding unit (10) to grind the molding resin layer (92) until the thickness of the molding resin layer (92) reaches the final target thickness. When the grinding unit (10) grinds the molding resin layer (92), the grinding unit (10) may be moved toward the molding resin layer (92), and the stage on which the molding resin layer (92) is placed may be moved toward the grinding unit (10).

[0033] The control unit (30) may include a receiving unit that receives thickness information of the molding resin layer (92) measured by the measuring unit (20), a calculating unit that calculates grinding conditions based on the thickness information received by the receiving unit, and a transmitting unit that transmits information of the grinding conditions calculated by the calculating unit to the grinding unit (10) and / or the stage.

[0034] Hereinafter, the grinding method of the grinding device (1) will be described.

[0035] First, the user of the grinding device (1) can position the workpiece (90), the grinding unit (10), and the measuring unit (20) at a predetermined location. Then, the control unit (30) can control the measuring unit (20) to measure the vertical distance (L) of the molding resin layer (92) from the upper surface of the molding resin layer (92) to the upper surface of the silicon chip (93) and / or copper pillar (94).

[0036] And the control unit (30) can receive thickness information of the molding resin layer (92) measured by the measurement unit (20) from the measurement unit (20). The control unit (30) can determine grinding conditions based on the information regarding the thickness. According to one embodiment, the control unit (30) receives the vertical distance (L) of the molding resin layer (92) measured by the measurement unit (20) and can determine grinding conditions based on the information regarding the received vertical distance (L). For example, when the vertical distance (L) is 1 mm, the grinding condition may be either [moving the grinding unit (10) 1 mm toward the molding resin layer (92)] or [moving the stage on which the molding resin layer (92) is placed 1 mm toward the grinding unit (10)].

[0037] In some embodiments, the grinding conditions may include target thickness value information set according to the process execution time. The target thickness value may be determined according to the flow of the grinding process execution time. For example, the first target thickness of the molding resin layer (92) corresponding to the first time point may be 990 μm, and the second target thickness of the molding resin layer (92) corresponding to the second time point may be 920 μm.

[0038] The control unit (30) can transmit information of the determined grinding conditions to the grinding unit (10) or the stage and control the grinding unit (10) to grind the molding resin layer (92) until the vertical distance (L) becomes 0. While the grinding of the molding resin layer (92) by the grinding unit (10) is in progress, the measuring unit (20) can measure the thickness of the molding resin layer (92) and feed back the measurement result to the control unit (30). Based on the thickness measurement result, the control unit (30) can identify whether the thickness of the molding resin layer (92) matches the target thickness and identify the quality of the grinding conditions based on the identification result.

[0039] In the process of determining the quality of the grinding conditions, if the thickness of the molding resin layer (92) measured by the measuring unit (20) is the target thickness, the previously determined grinding condition is identified as a correct condition, and the grinding of the molding resin layer (92) can be continued. Specifically, while the grinding unit (10) is performing a grinding process on one area of ​​the molding resin layer (92), the measuring unit (20) can measure the thickness of another area of ​​the molding resin layer (92) where the grinding process by the grinding unit (10) has already been performed. If the thickness of the other area measured by the measuring unit (20) matches the target thickness, the previously determined grinding condition can be identified as a correct condition.

[0040] Meanwhile, in the process of determining the quality of the grinding conditions, if the thickness of the molding resin layer (92) measured by the measuring unit (20) is not the target thickness, it can be determined that the predetermined grinding conditions are not correct conditions and the grinding conditions can be determined again. Based on the above method, the grinding process can be performed more precisely until the vertical distance (L) of the molding resin layer (92) from the upper surface of the molding resin layer (92) to the upper surface of the silicon chip (93) and / or copper pillar (94) becomes 0.

[0041] As a specific example, the control unit (30) may receive from the measuring unit (20) a measurement result indicating that the thickness of the molding resin layer (92) has been measured as a first thickness (e.g., 990 μm) at a first time (e.g., a time when 3 seconds have passed since the grinding process started). The control unit (30) may identify whether the first thickness matches the first target thickness corresponding to the first time. If the control unit (30) identifies that the first thickness matches the first target thickness, it may identify that the grinding conditions are good. Conversely, if the control unit (30) identifies that the first thickness does not match the first target thickness, it may identify that the grinding conditions are poor and may redefine the grinding conditions. In this case, the control unit (30) may determine new grinding conditions based on the thickness measurement result of the molding resin layer (92) measured by the measuring unit (20).

[0042] As described above, a grinding device (1) according to one embodiment of the present disclosure may include a grinding unit (10) for grinding a molding resin layer (92) in a workpiece (90) comprising a substrate (91) and a colored or opaque molding resin layer (92) covering the substrate (91), a measuring unit (20) for measuring the thickness of the molding resin layer (92), and a control unit (30) for determining grinding conditions based on information of the thickness measured by the measuring unit (20) and controlling the grinding unit (10). According to the grinding device (1) as described above, the thickness of the molding resin layer (92) can be measured by the measuring unit (20), and the measured thickness can be fed back to the grinding conditions of the grinding unit (10) to grind the molding resin layer (92), thereby allowing the molding resin layer (92) covering the substrate (91) to be ground with high precision.

[0043] Next, with reference to FIG. 4, the configuration of a grinding device (2) according to one embodiment of the present disclosure will be described.

[0044] FIG. 4 is a plan view illustrating the schematic configuration of a grinding device (2) according to one or more embodiments of the present disclosure.

[0045] The grinding device (2) may differ from the grinding device (1) of FIGS. 2 and FIG. 3 in that the grinding part (10) and the measuring part (20) are fixed to different workpieces. Additionally, for components identical to the grinding device (1) described above, the same reference numerals are used and the description is omitted.

[0046] A grinding device (2) according to one embodiment may include a first grinding unit (110), a second grinding unit (210), a measuring unit (20), and a control unit (30) as shown in FIG. 4.

[0047] The first grinding unit (110), the second grinding unit (210), and the measuring unit (20) can each be fixed to different workpieces (locations) as shown in FIG. 4. The grinding device (2) may further include a conveying unit (70) that is positioned between different workpieces and conveys the workpiece (90).

[0048] The first grinding unit (110) may be a grinding device for rough grinding. The second grinding unit (210) may be a grinding device for fine grinding. The grinding device (2) may include two different grinding units (110, 210).

[0049] Next, we will explain the grinding method of the grinding device (2).

[0050] First, the user can place the workpiece (90) on the workpiece where the measuring unit (20) is placed. Then, the control unit (30) can control the measuring unit (20) to measure the thickness of the molding resin layer (92) of the workpiece (90).

[0051] And the control unit (30) receives thickness information of the molding resin layer (92) measured by the measuring unit (20) and can determine grinding conditions based on the received thickness information. For example, the control unit (30) can receive information about the vertical distance (L) measured by the measuring unit (20) and can determine grinding conditions based on the vertical distance (L).

[0052] According to one embodiment, the control unit (30) can determine a first grinding thickness by the first grinding unit (110) and a second grinding thickness by the second grinding unit (210) based on the thickness information. Specifically, when the vertical distance (L) of the molding resin layer (92) is 1 mm, the grinding conditions may be [the first grinding unit (110) grinds the molding resin layer (92) by 0.95 mm] and [the second grinding unit (210) grinds the molding resin layer (92) by 0.05 mm]. However, the grinding conditions determined by the control unit (30) are not limited to the examples described above. In addition, the grinding method moves the grinding unit (110, 210) or the stage in a vertical direction, in the same manner as the grinding device (1) according to the above-described embodiment.

[0053] And the control unit (30) can control the conveying unit (70) so that the workpiece (90) is conveyed to the workpiece where the first grinding unit (110) is placed. And the control unit (30) can control the first grinding unit (110) so that the molding resin layer (92) is ground by a first grinding thickness (e.g., 0.95 mm).

[0054] And the control unit (30) can control the conveying unit (70) so that the workpiece (90) is conveyed to the workpiece where the measuring unit (20) is placed. And the control unit (30) can control the measuring unit (20) to measure the thickness of the molding resin layer (92). At this time, it can identify whether the remaining vertical distance of the molding resin layer (92) (the distance obtained by subtracting the first grinding thickness ground by the first grinding unit (110) from the vertical distance (L)) matches the second grinding thickness (e.g., 0.05 mm). If it is identified that the remaining vertical distance of the molding resin layer (92) matches the second grinding thickness, the control unit (30) can control the conveying unit (70) so that the workpiece (90) is conveyed to the workpiece where the second grinding unit (210) is placed. And the control unit (30) can control the second grinding unit (210) so that the molding resin layer (92) is ground by a second grinding thickness (0.05 mm).

[0055] If it is identified that the remaining vertical distance of the molding resin layer (92) does not match the second grinding thickness (e.g., 0.05 mm), the control unit (30) can control the return unit (70) so that the workpiece (90) is returned to the first grinding unit (110).

[0056] Although the configuration of the grinding device (1) and (2) has been described above through embodiments and variations, the present invention is not limited to the embodiments described above and can be modified in various ways within the scope of the patent claims.

[0057] For example, in the above-described embodiment, the measuring unit (20) measured the thickness of the molding resin layer (92) using a terahertz pulse echo method. However, in some embodiments, the measuring unit (20) may measure the thickness of the molding resin layer (92) using ultrasound. In this case, when measuring using ultrasound, since it is desirable for liquid to be present in the measurement area of ​​the molding resin layer (92), the removal unit (60) for removing the liquid described above becomes unnecessary, and it is desirable to supply liquid from the supply unit (50) during measurement.

[0058] Up to this point, the present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0059] 1, 2: Grinding device 10: Grinding part 20: Measurement section 30: Control unit 50: Supply unit 60: Removal section 70: Return section 90: Object to be processed 91: Board 92: Molding resin layer 93: Silicon Chip 94: Copper Pillar 110: 1st grinding section 210: 2nd grinding section

Claims

Claim 1 A grinding device comprising: a grinding unit for grinding a molding resin layer of a workpiece; a measuring unit for measuring the thickness of the molding resin layer; and a control unit; wherein the control unit controls the measuring unit to measure the thickness of the molding resin layer, obtains thickness information of the molding resin layer from the measuring unit, determines grinding conditions based on the thickness information of the molding resin layer, and controls the grinding unit to perform a grinding process corresponding to the grinding conditions on the workpiece, wherein the workpiece comprises a substrate and the molding resin layer covering the substrate, and the molding resin layer is colored or opaque. Claim 2 A grinding device according to claim 1, wherein the grinding part and the measuring part are fixed to the same workpiece. Claim 3 A grinding device according to claim 1, wherein the control unit controls the grinding unit to grind the grinding area of ​​the molding resin layer and controls the measuring unit to measure the thickness of the measuring area of ​​the molding resin layer, and identifies the quality of the grinding condition based on the thickness of the measuring area, and wherein the grinding area and the measuring area are areas spaced apart from each other in a horizontal direction. Claim 4 In paragraph 3, the control unit identifies that the grinding condition is good when the thickness of the measurement area is the target thickness, and controls the grinding unit to perform the grinding process corresponding to the grinding condition, and the grinding device. Claim 5 A grinding device according to paragraph 3, wherein the control unit identifies that the grinding condition is poor when the thickness of the measurement area is not the target thickness, and determines the grinding condition again based on the thickness of the measurement area. Claim 6 A grinding device according to claim 1, wherein the workpiece comprises a copper pillar or a silicon chip disposed on the substrate, and the control unit controls the measuring unit and the grinding unit to perform n measurement-grinding processes (n is a natural number greater than or equal to 2), wherein the n measurement-grinding processes include a process of measuring the thickness of the molding resin layer by the measuring unit and a process of grinding the molding resin layer by the grinding unit, and wherein the n measurement-grinding processes expose the copper pillar or the silicon chip to the outside of the molding resin layer. Claim 7 A grinding device according to claim 1, wherein the workpiece comprises a copper pillar or silicon chip disposed on the substrate, and the measuring unit measures the thickness of the molding resin layer based on the terahertz pulse-echo method. Claim 8 A grinding device according to claim 7, further comprising: a supply unit for supplying liquid to a grinding area of ​​the molding resin layer; and a removal unit for removing liquid in a measuring area of ​​the molding resin layer, wherein the grinding area and the measuring area are spaced apart from each other in a horizontal direction. Claim 9 A grinding device according to claim 8, wherein the control unit controls the supply unit to supply liquid to the grinding area and controls the removal unit to remove liquid in the measuring area. Claim 10 A grinding device according to claim 1, wherein the workpiece comprises a copper pillar or silicon chip disposed on the substrate, and the measuring unit measures the thickness of the molding resin layer based on ultrasonic reflection. Claim 11 A grinding device comprising: a measuring unit fixed to a first workpiece and measuring the thickness of a molding resin layer of a workpiece; a grinding unit fixed to a second workpiece different from the first workpiece and grinding the molding resin layer; a conveying unit conveying the workpiece between the first workpiece and the second workpiece; and a control unit; wherein the control unit controls the measuring unit to measure the thickness of the molding resin layer, obtains thickness information of the molding resin layer from the measuring unit, determines grinding conditions based on the thickness information of the molding resin layer, controls the conveying unit to convey the workpiece to the grinding unit, and controls the grinding unit to perform a grinding process corresponding to the grinding conditions on the molding resin layer. Claim 12 A grinding device according to claim 11, wherein the second work comprises a first grinding work and a second grinding work different from the first grinding work, and the grinding part comprises: a first grinding part fixed to the first grinding work and performing rough grinding; and a second grinding part fixed to the second grinding work and performing fine grinding. Claim 13 A grinding device according to claim 12, wherein the control unit determines a first grinding thickness and a second grinding thickness based on the thickness information, wherein the first grinding thickness is the thickness of the molding resin layer to be ground by the rough grinding of the first grinding unit, and the second grinding thickness is the thickness of the molding resin layer to be ground by the precision grinding of the second grinding unit. Claim 14 A grinding device according to claim 13, wherein the control unit controls the first grinding unit to grind the molding resin layer, controls the conveying unit to convey the workpiece to the measuring unit, controls the measuring unit to identify whether the molding resin layer has been ground by the first grinding thickness, controls the conveying unit to convey the workpiece to the second grinding unit when the molding resin layer has been ground by the first grinding thickness, and controls the conveying unit to convey the workpiece to the first grinding unit when the molding resin layer has not been ground by the first grinding thickness. Claim 15 A grinding device according to claim 11, wherein the workpiece comprises a copper pillar or silicon chip disposed on a substrate, and the measuring unit measures the thickness of the molding resin layer based on the terahertz pulse-echo method. Claim 16 A grinding device according to claim 15, further comprising a removal unit for removing liquid on the upper surface of the molding resin layer; wherein the control unit controls the removal unit to remove liquid on the upper surface of the molding resin layer. Claim 17 A grinding device according to claim 11, wherein the workpiece comprises a copper pillar or silicon chip disposed on a substrate, and the measuring unit measures the thickness of the molding resin layer based on ultrasonic reflection. Claim 18 A grinding device comprising: a grinding unit for grinding a molding resin layer of a workpiece; a measuring unit for measuring the thickness of the molding resin layer and fixed to the same workpiece as the workpiece to which the grinding unit is fixed; and a control unit; wherein the control unit controls the measuring unit to measure the thickness of the molding resin layer, obtains thickness information of the molding resin layer from the measuring unit, determines grinding conditions based on the thickness information of the molding resin layer, and controls the grinding unit to perform a grinding process corresponding to the grinding conditions on the workpiece, wherein the workpiece comprises a substrate and the molding resin layer covering the substrate, and the molding resin layer is colored or opaque. Claim 19 A grinding device according to claim 18, wherein the grinding condition includes a target thickness value set according to the process execution time, and the control unit controls the grinding unit so that a grinding process is performed on the molding resin layer and controls the measuring unit so that a measurement process is performed on the molding resin layer, and based on the result of the measurement process and the process execution time, identifies whether the thickness of the molding resin layer corresponds to the target thickness value, and if the thickness of the molding resin layer does not correspond to the target thickness value, determines the grinding condition again. Claim 20 In claim 19, the grinding device wherein the control unit controls the grinding unit to perform a grinding process corresponding to the newly determined grinding condition on the molding resin layer when the grinding condition is determined again.

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