Display apparatus and method for manufacturing the same

Abstract

The present invention provides a display device having improved adhesion between a protective film and a cover panel at the bottom of a display panel, comprising a display panel including a display element, a protective film disposed at the bottom of the display panel and including a first silicon-based compound, and a cover panel disposed at the bottom of the protective film and including a second silicon-based compound.

Description

Technology Field

[0001] Embodiments of the present invention relate to a display device and a method for manufacturing the same, and more specifically, to a display device and a method for manufacturing the same in which the adhesion between a protective film on the lower part of a display panel and a cover panel is improved. Background Technology

[0002] A display device may be an electronic device, such as a mobile phone or tablet PC, or a part of an electronic device, and provides visual information, such as images or videos, to the user. Display devices are also being developed with a structure in which a part of the display section is curved so that images can be displayed even from the side or corner. The display device is equipped with a display panel having a protective film attached to the bottom, and the protective film may include a silicon-based compound so that it can be easily bent from the side or corner. The problem to be solved

[0003] However, these conventional display devices had a problem in that the adhesive strength of the protective film at the bottom of the display panel and the cover panel placed at the bottom of the protective film to protect the display panel was low.

[0004] The present invention aims to solve various problems, including those mentioned above, and more specifically, to provide a display device and a method for manufacturing the same in which the adhesion between the protective film on the lower part of the display panel and the cover panel is improved. However, these problems are merely examples, and the scope of the present invention is not limited by them. means of solving the problem

[0005] According to one aspect of the present invention, a display device is provided having a display panel including a display element, a protective film disposed below the display panel and including a first silicon-based compound, and a cover panel disposed below the protective film and including a second silicon-based compound.

[0006] The first silicon-based compound and the second silicon-based compound may contain the same material.

[0007] The first silicon-based compound and the second silicon-based compound may include polydimethylsiloxane.

[0008] The above second silicon-based compound may be different from the above first silicon-based compound.

[0009] The above first silicon-based compound may include polydimethylsiloxane.

[0010] The above second silicon-based compound may include at least one of silica and silsesquioxane.

[0011] The above cover panel may further include a cushion layer, which is a foamed layer containing a plurality of voids, disposed below the above silicone layer.

[0012] The cushion layer may include at least one of a urethane-based compound and an epoxy-based compound.

[0013] The above cushion layer may include a light-blocking material.

[0014] The above cover panel may further include an organic layer disposed below the cushion layer and comprising at least one of a polyimide resin, an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin.

[0015] The above cover panel may further include a metal layer disposed below the organic layer and comprising at least one of copper, nickel, ferrite, silver, and aluminum.

[0016] According to one aspect of the present invention, a method for manufacturing a display device is provided, comprising the steps of: manufacturing a preliminary cover panel; attaching the preliminary cover panel to the lower part of a protective film comprising a first silicon-based compound attached to the lower part of a display panel; and heat-curing the preliminary cover panel. The step of manufacturing the preliminary cover panel comprises the steps of: forming a preliminary cushion layer on an organic layer; forming a silicon layer forming layer by applying a silicon layer composition comprising a second silicon-based compound onto the preliminary cushion layer and heat-treating it; and forming a preliminary silicon layer by irradiating the silicon layer forming layer with ultraviolet light.

[0017] The temperature at which the above preliminary cover panel is heat-cured may be lower than the temperature at which the above silicon layer composition is heat-treated.

[0018] The first silicon-based compound and the second silicon-based compound may contain the same material.

[0019] The first silicon-based compound and the second silicon-based compound may include polydimethylsiloxane.

[0020] The above second silicon-based compound may be different from the above first silicon-based compound.

[0021] The first silicon-based compound above may include polydimethylsiloxane.

[0022] The above second silicon-based compound may include at least one of silica and silsesquioxane.

[0023] The step of forming the above preliminary cushion layer may include the step of forming a cushion layer forming layer by applying a cushion layer composition onto the organic layer and heat treating it, and the step of forming a preliminary cushion layer by irradiating the cushion layer forming layer with ultraviolet rays.

[0024] The step of heat-curing the above preliminary cover panel may be a step of heat-curing the above preliminary cushion layer and the above preliminary silicone layer.

[0025] Other aspects, features, and advantages other than those described above will become clear from the following specific details, claims, and drawings for implementing the invention. Effects of the invention

[0026] According to one embodiment of the present invention as described above, a display device and a method for manufacturing the same can be realized with improved adhesion between a display panel and a cover panel protecting the display panel. Of course, the scope of the present invention is not limited by this effect. Brief explanation of the drawing

[0027] FIG. 1a is a perspective view schematically illustrating a part of a display device according to one embodiment of the present invention. FIG. 1b is an exploded perspective view schematically illustrating a part of a display device according to one embodiment of the present invention. FIG. 2a is a cross-sectional view schematically illustrating a cross-section taken along the line A-A' of FIG. 1a. FIG. 2b is a cross-sectional view schematically illustrating a cross-section taken along the line B-B' of FIG. 1a. FIG. 2c is a cross-sectional view schematically illustrating a cross-section taken along the line C-C' of FIG. 1a. FIG. 3 is a plan view schematically illustrating a display panel that is part of the display device of FIG. 1a. FIG. 4 is an equivalent circuit diagram illustrating an example of a pixel circuit included in the display device of FIG. 1a. Figure 5 is a conceptual diagram showing an enlarged view of section D of Figure 3. FIG. 6 is a cross-sectional view schematically illustrating a cross-section taken along the line I-I' of FIG. 5. FIG. 7 is a cross-sectional view schematically illustrating a cross section taken along the line II-II' of FIG. 5. FIG. 8 is a cross-sectional view showing an enlarged view of section E of FIG. 2a. FIG. 9a is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 9b is a cross-sectional view schematically illustrating a section taken along the line III-III' of FIG. 9a. FIG. 9c is a cross-sectional view schematically illustrating a cross section taken along the line IV-IV' of FIG. 9a. FIGS. 10a to 10e are drawings for explaining the step of manufacturing a preliminary cover panel in a method for manufacturing a display device according to one embodiment of the present invention. FIG. 11 is a drawing illustrating the step of attaching a preliminary cover panel in a method for manufacturing a display device according to one embodiment of the present invention. FIG. 12 is a drawing illustrating the step of heat-curing a preliminary cover panel in a method for manufacturing a display device according to one embodiment of the present invention. Specific details for implementing the invention

[0028] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0030] In the following embodiments, when various components such as layers, films, regions, and plates are described as being "on" another component, this includes not only cases where they are "directly on" another component, but also cases where other components are interposed between them. Furthermore, for convenience of explanation, the size of components in the drawings may be exaggerated or reduced. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and therefore the present invention is not necessarily limited to what is illustrated.

[0031] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes in an orthogonal coordinate system and can be interpreted in a broader sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but they may also refer to different directions that are not orthogonal to each other.

[0032] In the following examples, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0033] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0034] In the following embodiments, terms such as "comprising" or "having" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0035] In this specification, "A and / or B" indicates the case where it is A, B, or both A and B. And, "at least one of A and B" indicates the case where it is A, B, or both A and B.

[0036] FIG. 1a is a perspective view schematically illustrating a part of a display device (1) according to one embodiment of the present invention, and FIG. 1b is an exploded perspective view schematically illustrating a part of a display device (1) according to one embodiment of the present invention. FIG. 2a is a cross-sectional view schematically illustrating a cross-section taken along the line A-A' of FIG. 1a, FIG. 2b is a cross-sectional view schematically illustrating a cross-section taken along the line B-B' of FIG. 1a, and FIG. 2c is a cross-sectional view schematically illustrating a cross-section taken along the line C-C' of FIG. 1a.

[0037] The display device (1) is a device for displaying video or still images and may be a portable electronic device such as a mobile phone, smartphone, tablet PC, mobile communication terminal, electronic notebook, e-book, PMP (portable multimedia player), navigation, or UMPC (Ultra Mobile PC). Of course, the display device (1) may be an electronic device such as a television, laptop, monitor, billboard, or Internet of Things (IOT). Alternatively, the display device (1) may be a wearable device such as a smart watch, watch phone, glasses-type display, or head-mounted display (HMD). Alternatively, the display device (1) may be a part of another device. For example, the display device (1) may be the display part of any electronic device. Alternatively, the display device (1) may be a Center Information Display (CID) placed on the instrument panel, center fascia, or dashboard of a vehicle, a room mirror display that replaces the side mirror of a vehicle, or a display that is placed on the back of the front seat as entertainment for the rear seat of a vehicle.

[0038] Referring to FIGS. 1a, 1b and FIGS. 2a through 2c, a display device (1) capable of displaying an image may have an edge extended in a first direction and an edge extended in a second direction. Here, the first direction and the second direction may be directions that intersect each other. For example, the angle formed by the first direction and the second direction may be an acute angle. Alternatively, the angle formed by the first direction and the second direction may be an obtuse angle or a right angle. For convenience, the following description will focus on the case where the first direction and the second direction are perpendicular. For example, the first direction may be the x direction or the -x direction, and the second direction may be the y direction or the -y direction.

[0039] A corner (CN) where an edge extended in a first direction (e.g., x direction or -x direction) meets an edge extended in a second direction (y direction or -y direction) may have a predetermined curvature.

[0040] As illustrated in FIG. 1b and FIG. 2a through 2c, the display device (1) may include a display panel (10), a cover window (20), a protective film (30), and a cover panel (40). The display device (1) may include a central area (CA), a first area (A1), a second area (A2), a corner area (CNA), an intermediate area (MA), and a peripheral area (PA). The central area (CA) may be a flat area. The display device (1) may provide most of the image in this central area (CA).

[0041] The first region (A1) may be adjacent to the center region (CA) in the first direction (e.g., x direction or -x direction). The first region (A1) may be extended in the second direction (e.g., y direction or -y direction). The display device (1) may be bent in this first region (A1). That is, the first region (A1) may be defined as a region that is bent differently from the center region (CA) in the cross-section in the first direction (e.g., zx cross-section). On the other hand, the first region (A1) may appear not bent in the cross-section in the second direction (e.g., yz cross-section). That is, the first region (A1) may be a region bent around an axis extended in the second direction.

[0042] In FIG. 2a, the first region (A1) located in the x direction from the center region (CA) and the first region (A1) located in the -x direction from the center region (CA) are shown to have the same curvature, but the present invention is not limited thereto. For example, the first region (A1) located in the x direction from the center region (CA) and the first region (A1) located in the -x direction from the center region (CA) may have different curvatures.

[0043] The second region (A2) may be adjacent to the center region (CA) in the second direction. The second region (A2) may be extended in the first direction. The display device (1) may be bent in this second region (A2). That is, the second region (A2) may be defined as a region that is bent differently from the center region (CA) in the cross-section in the second direction (e.g., yz cross-section). On the other hand, the second region (A2) may appear not bent in the cross-section in the first direction (e.g., zx cross-section). That is, the second region (A2) may be a region that is bent around an axis extended in the first direction.

[0044] In FIG. 2b, the second region (A2) located in the y direction from the center region (CA) and the second region (A2) located in the -y direction from the center region (CA) are shown to have the same curvature, but the present invention is not limited thereto. For example, the second region (A2) located in the y direction from the center region (CA) and the second region (A2) located in the -y direction from the center region (CA) may have different curvatures.

[0045] The display device (1) may be bent at a corner area (CNA). The corner area (CNA) may be an area placed at a corner (CN). That is, the corner area (CNA) may be an area where the first direction edge and the second direction edge of the display device (1) meet. The corner area (CNA) may at least partially surround the center area (CA), the first area (A1), and the second area (A2). Alternatively, the corner area (CNA) may at least partially surround the center area (CA), the first area (A1), the second area (A2), and the intermediate area (MA).

[0046] As described above, if the first region (A1) is extended in the second direction and is bent at the cross-section in the first direction (e.g., zx cross-section), and the second region (A2) is extended in the first direction and is bent at the cross-section in the second direction (e.g., yz cross-section), at least a portion of the corner region (CNA) may appear to be bent at both the cross-section in the first direction (e.g., zx cross-section) and the cross-section in the second direction (e.g., yz cross-section). That is, at least a portion of the corner region (CNA) may be a complex curved region in which multiple curvatures in multiple directions overlap. The display device (1) may have multiple corner regions (CNA).

[0047] An intermediate region (MA) may be located between a central region (CA) and a corner region (CNA). The intermediate region (MA) may extend in the direction in which the first region (A1) extends between the first region (A1) and the corner region (CNA). Of course, the intermediate region (MA) may extend in the direction in which the second region (A2) extends between the second region (A2) and the corner region (CNA). This intermediate region (MA) may be curved. Furthermore, a driving circuit for providing an electrical signal to a pixel (PX) may be placed in the intermediate region (MA), and power wiring for providing power to the pixel (PX) may also be placed therein. If necessary, a pixel (PX) placed in the intermediate region (MA) may overlap with the driving circuit and / or power wiring.

[0048] A peripheral area (PA) may be located outside the central area (CA). Specifically, the peripheral area (PA) may be located outside the first area (A1) and the second area (A2). This peripheral area (PA) may be curved. Additionally, pixels (PX) may not be placed in the peripheral area (PA). That is, the peripheral area (PA) may be a non-display area that does not display an image. A driving circuit for providing an electrical signal to the pixels (PX) or power wiring for providing power to the pixels (PX) may be placed in the peripheral area (PA).

[0049] As shown in FIG. 2a, a portion of the peripheral region (PA), the intermediate region (MA), and the first region (A1) can be bent with a first radius of curvature (R1). As shown in FIG. 2b, another portion of the peripheral region (PA), the intermediate region (MA), and the second region (A2) can be bent with a second radius of curvature (R2). Of course, as shown in FIG. 2c, the corner region (CNA) and the intermediate region (MA) can be bent with a third radius of curvature (R3).

[0050] A pixel (PX) can be implemented as a display element. Each of the pixels (PX) may include a red subpixel, a green subpixel, and a blue subpixel. Alternatively, each of the pixels (PX) may include a red subpixel, a green subpixel, a blue subpixel, and a white subpixel.

[0051] A pixel (PX) may be placed in at least one of a center area (CA), a first area (A1), a second area (A2), a corner area (CNA), and an intermediate area (MA). For example, a plurality of pixels (PX) may be placed in the center area (CA), the first area (A1), the second area (A2), the corner area (CNA), and the intermediate area (MA). Accordingly, the display device (1) can display an image in the center area (CA), the first area (A1), the second area (A2), the corner area (CNA), and the intermediate area (MA). If necessary, the display device (1) may provide independent images in the center area (CA), the first area (A1), the second area (A2), the corner area (CNA), and the intermediate area (MA), respectively. Alternatively, the display device (1) may provide parts of any one image in each of the center area (CA), the first area (A1), the second area (A2), the corner area (CNA), and the intermediate area (MA).

[0052] As such, the display device (1) can display images not only in the central area (CA) but also in the first area (A1), second area (A2), intermediate area (MA), and corner area (CNA). Therefore, the area occupied by the display area, which is the area for displaying images in the display device (1), can be significantly increased. In addition, since the display device (1) can display images even at the curved corner (CN), the aesthetic appeal can be improved.

[0053] A cover window (20) may be placed on the upper surface (in the +z direction) of the display panel (10). Here, the 'upper surface' of the display panel (10) may be defined as the surface facing the direction in which the display panel (10) provides an image.

[0054] According to one embodiment, a cover window (20) may be positioned to cover the upper surface of a display panel (10). This cover window (20) may function to protect the upper surface of the display panel (10). Additionally, since the cover window forms the exterior of the display device (1), it may include flat and curved surfaces corresponding to the shape of the display device (1).

[0055] The cover window (20) can be attached to the display panel (10) by an adhesive layer (not shown). The adhesive layer may include an adhesive material such as, for example, an optical clear adhesive (OCA) or a pressure sensitive adhesive (PSA).

[0056] The cover window (20) may have a high transmittance to transmit light emitted from the display panel (10) and may have a thin thickness to minimize the weight of the display device (1). Additionally, the cover window (20) may have high strength and hardness to protect the display panel (10) from external impact. The cover window (20) may be a flexible window. The cover window (20) can protect the display panel (10) by easily bending according to external force without the occurrence of cracks, etc.

[0057] The cover window (20) may include glass, sapphire, or plastic. For example, the cover window (20) may be ultra-thin reinforced glass (UTG) whose strength has been enhanced by methods such as chemical strengthening or thermal strengthening. ®It may be a transparent polyimide (Colorless Polyimide, CPI). The cover window (20) may have a structure in which a flexible polymer layer is disposed on one side of a glass substrate, or it may be composed solely of a polymer layer. An image displayed by the display panel (10) may be provided to the user through the transparent cover window (20). That is, the image provided by the display device (1) can be understood as being implemented by the display panel (10). Accordingly, the central area (CA), first area (A1), second area (A2), corner area (CNA), intermediate area (MA), and peripheral area (PA) of the aforementioned display device (1) can be understood as being provided in the display panel (10). .

[0058] A protective film (30) may be placed on the lower surface of the display panel (10) so as to face the lower surface (in the -z direction) of the display panel (10). Specifically, the protective film (30) may be placed on the lower surface of the substrate (100) so as to face the lower surface (in the -z direction) of the substrate (100). The protective film (30) may serve to protect the display panel (10) during the manufacturing process of the display device. The protective film (30) may include a first silicon-based compound. The first silicon-based compound may be an organosilicon compound containing silicon. Specifically, the first silicon-based compound may include a siloxane-based polymer material. For example, the first silicon-based compound may include polydimethylsiloxane.

[0059] When the protective film (30) contains polyethylene terephthalate (PET), the modulus of the protective film (30) is high, so the molding of the protective film (30) may not be easy. However, in the case of the display device (1) according to the present embodiment, the protective film (30) contains a silicon-based material, so the modulus of the protective film (30) is low, and the shape of the protective film (30) can be easily deformed using a small force. Accordingly, the protective film (30) can be easily molded.

[0060] Although not shown, an adhesive layer may be interposed between the protective film (30) and the substrate (100). By means of this adhesive layer, the protective film (30) can be attached to the lower part of the substrate (100). The adhesive layer interposed between the protective film (30) and the substrate (100) may include at least one of an optical clear resin (OCR), an optical clear adhesive (OCA), and a pressure sensitive adhesive (PSA).

[0061] Meanwhile, the adhesive layer interposed between the protective film (30) and the substrate (100) may further include a silicone-based material. For example, the adhesive layer interposed between the protective film (30) and the substrate (100) may be a pressure-sensitive adhesive (PSA) containing a silicone-based material. As the adhesive layer interposed between the protective film (30) and the substrate (100) contains a silicone-based material, the adhesive strength between the protective film (30) and the adhesive layer may increase. That is, since the adhesive layer contains a material having properties similar to the silicone-based material contained in the protective film (30), the adhesive strength between the protective film (30) and the adhesive layer may increase.

[0062] Meanwhile, the cover panel (40) may be placed below the display panel (10). Specifically, the cover panel (40) may be placed below the protective film (30) attached to the display panel (10), and the protective film (30) may be interposed between the display panel (10) and the cover panel (40). At this time, the cover panel (40) not only protects the display panel (10) from the outside but can also absorb shocks applied from the cover window (20), etc. The cover panel (40) may include a metal layer, an organic layer, a cushion layer, and a light-blocking layer. Detailed information regarding the metal layer, organic layer, cushion layer, and light-blocking layer will be described later.

[0063] FIG. 3 is a plan view schematically illustrating a display panel (10) which is part of the display device (1) of FIG. 1a. FIG. 3 schematically illustrates the display panel (10) in an unfolded state without being bent.

[0064] As described above, the peripheral area (PA) may be positioned outside the central area (CA). The peripheral area (PA) may include a first adjacent area (AA1), a second adjacent area (AA2), a third adjacent area (AA3), a bending area (BA), and a pad area (PADA).

[0065] The first adjacent area (AA1) may be located outside the first area (A1). That is, the first area (A1) may be located between the first adjacent area (AA1) and the central area (CA). Accordingly, the first adjacent area (AA1) may be located in the first direction from the first area (A1) and may extend along the second direction, just like the first area (A1). A driving circuit (DC) and / or power wiring may be placed in the first adjacent area (AA1).

[0066] The second adjacent area (AA2) and the third adjacent area (AA3) may be located outside the second area (A2). That is, the second areas (A2) may be located between the second adjacent area (AA2) and the central area (CA), and between the third adjacent area (AA3) and the central area (CA). The second adjacent area (AA2) and the third adjacent area (AA3) may extend in the first direction, just like the second area (A2). The second areas (A2) and the central area (CA) may be located between the second adjacent area (AA2) and the third adjacent area (AA3).

[0067] The bending area (BA) may be located outside the third adjacent area (AA3). That is, the third adjacent area (AA3) may be located between the bending area (BA) and the second area (A2). And the pad area (PADA) may be placed outside the bending area (BA). That is, the bending area (BA) may be located between the third adjacent area (AA3) and the pad area (PADA). In the bending area (BA), the display panel (10) may be bent. In this case, the pad area (PADA) may be located overlapping with other parts of the display panel (10). Accordingly, the area of ​​the surrounding area (PA) visible to the user can be minimized. A pad (not shown) may be placed in the pad area (PADA). The display panel (10) may receive electrical signals and / or power voltage through the pad.

[0068] Although FIG. 3 shows the display panel (10) in an unfolded state without being bent, the display panel (10) can be bent in a part as described above. That is, at least one of the first area (A1), the second area (A2), the corner area (CNA), and the intermediate area (MA) can be bent.

[0069] Specifically, the first region (A1) may be bent around an axis extending in the second direction, appearing bent in the cross-section in the first direction (e.g., zx cross-section) and not bent in the cross-section in the second direction (e.g., yz cross-section). The second region (A2) may be bent around an axis extending in the first direction, appearing bent in the cross-section in the second direction (e.g., yz cross-section) and not bent in the cross-section in the first direction (e.g., zx cross-section). As at least a portion of the corner region (CNA) is bent in both the cross-section in the first direction (e.g., zx cross-section) and the cross-section in the second direction (e.g., yz cross-section), at least a portion of the corner region (CNA) may be a complex curved region in which multiple curvatures in multiple directions overlap.

[0070] When the corner region (CNA) is bent in this way, compressive strain may occur more significantly than tensile strain in the corner region (CNA). Therefore, it is necessary to apply a structure such as a shrinkable substrate (100) to at least a portion of the corner region (CNA). As a result, the structure of the display panel (10) in the corner region (CNA) may differ from the structure of the display panel (10) in the center region (CA).

[0071] As described above, a pixel (PX) that can be placed in at least one of a central region (CA), a first region (A1), a second region (A2), a corner region (CNA), and an intermediate region (MA) may include a display element. The display element may be an organic light-emitting diode (OLED) comprising an organic light-emitting layer. Alternatively, the display element may be a light-emitting diode (LED) comprising an inorganic light-emitting layer. The size of the light-emitting diode (LED) may be micro-scale or nano-scale. For example, the light-emitting diode may be a micro-light-emitting diode. Alternatively, the light-emitting diode may be a nanorod light-emitting diode. A nanorod light-emitting diode may include gallium nitride (GaN). If necessary, a color conversion layer may be placed on such a display element. In this case, the color conversion layer may include quantum dots. Alternatively, the display element may be a quantum dot light-emitting diode (Quantum dot Light Emitting Diode) comprising a quantum dot light-emitting layer. For convenience, the following describes the case where the display element includes an organic light-emitting diode.

[0072] A pixel (PX) may include multiple subpixels, and each of the multiple subpixels may emit light of a predetermined color using a display element. A subpixel is the smallest unit for implementing an image and refers to a light-emitting region. Meanwhile, when an organic light-emitting diode is used as a display element, the light-emitting region may be defined by an opening in a pixel defining layer. This will be described later.

[0073] The driving circuit (DC) can provide signals to the pixels (PX). For example, the driving circuit (DC) may be a scan driving circuit that provides a scan signal to pixel circuits electrically connected to subpixels containing the pixel (PX) via a scan line (SCL). Alternatively, the driving circuit (DC) may be a light emission control driving circuit that provides a light emission control signal to pixel circuits electrically connected to subpixels via a light emission control line (not shown). Alternatively, the driving circuit (DC) may be a data driving circuit that provides a data signal to pixel circuits electrically connected to subpixels via a data line (DL). Although not shown, the data driving circuit may be placed in a third adjacent area (AA3) or a pad area (PADA). Alternatively, the data driving circuit may be placed on a display circuit board connected via a pad.

[0074] FIG. 4 is an equivalent circuit diagram illustrating an example of a pixel circuit (PC) included in the display device (1) of FIG. 1a. That is, FIG. 4 is an equivalent circuit diagram of a pixel circuit (PC) electrically connected to an organic light-emitting diode, which is a display element (DPE) forming a subpixel included in the display device (1) of FIG. 1a. A pixel circuit (PC) electrically connected to a subpixel may include a driving thin-film transistor (T1), a switching thin-film transistor (T2), and a storage capacitor (Cst). In one embodiment, the display element (DPE) may emit red, green, or blue light, or emit red, green, blue, or white light.

[0075] The switching thin-film transistor (T2) is connected to the scan line (SCL) and the data line (DL), and can transmit the data signal or data voltage input from the data line (DL) to the driving thin-film transistor (T1) based on the scan signal or switching voltage input from the scan line (SCL).

[0076] The storage capacitor (Cst) is connected to the switching thin-film transistor (T2) and the driving voltage line (PL), and can store a voltage corresponding to the difference between the voltage received from the switching thin-film transistor (T2) and the first power supply voltage (ELVDD) supplied to the driving voltage line (PL).

[0077] The driving thin-film transistor (T1) is connected to the driving voltage line (PL) and the storage capacitor (Cst), and can control the driving current flowing from the driving voltage line (PL) to the organic light-emitting diode (OLED) in correspondence with the voltage value stored in the storage capacitor (Cst). The display element (DPE) can emit light having a predetermined brightness by the driving current. The counter electrode of the display element (DPE) can receive a second power supply voltage (ELVSS).

[0078] FIG. 4 illustrates that the pixel circuit (PC) includes two thin-film transistors and one storage capacitor, but the pixel circuit (PC) may include more than that number of thin-film transistors.

[0079] FIG. 5 is a conceptual diagram showing an enlarged view of section D of FIG. 3, and FIG. 6 is a cross-sectional view schematically showing a cross-section taken along the line I-I' of FIG. 5.

[0080] As illustrated in FIGS. 5 and 6, the display panel (10) included in the display device (1) may include a substrate (100), a pixel circuit layer (PCL), a display element layer (DEL), an encapsulation layer (300), a protective layer (400), a touch sensor layer (500), and an anti-reflection layer (600), etc.

[0081] The substrate (100) may include a central region (CA), a first region (A1), a second region (A2), a corner region (CNA), and an intermediate region (MA). In other words, since the display panel (10) includes the substrate (100), the central region (CA), the first region (A1), the second region (A2), the corner region (CNA), the intermediate region (MA), and the peripheral region (PA) may be defined on the substrate (100).

[0082] The first region (A1) may be adjacent to the center region (CA) in the first direction (e.g., the x direction or the -x direction). The first region (A1) may be extended in the second direction (the y direction or the -y direction). The second region (A2) may be adjacent to the center region (CA) in the second direction. The second region (A2) may be extended in the first direction.

[0083] The corner area (CNA) may be an area positioned at a corner (CN). That is, the corner area (CNA) may be an area where the first direction edge and the second direction edge of the display panel (10) meet. The corner area (CNA) may at least partially enclose the center area (CA), the first area (A1), and the second area (A2). Alternatively, the corner area (CNA) may at least partially enclose the center area (CA), the first area (A1), the second area (A2), and the intermediate area (MA). Such a corner area (CNA) may include a center corner area (CCA), a first adjacent corner area (ACA1), and a second adjacent corner area (ACA2).

[0084] The center corner area (CCA) may include an extension area (EA). The extension area (EA) may extend in a direction away from the center area (CA). The display panel (10) may include a plurality of extension areas (EA). Each of the plurality of extension areas (EA) may extend in a direction away from the center area (CA). For example, the plurality of extension areas (EA) may extend in a direction that intersects a first direction (e.g., x direction or -x direction) and a second direction (y direction or -y direction).

[0085] A separation area (SA) may be defined between adjacent extension areas (EA). The separation area (SA) may be an area where components of the display panel (10) are not placed. When the center corner area (CCA) is bent at a corner (CN), compressive strain may occur more significantly than tensile strain in the center corner area (CCA). However, since a separation area (SA) is defined between adjacent extension areas (EA), the display panel (10) can be bent without damage at the center corner area (CCA).

[0086] The first adjacent corner region (ACA1) may be adjacent to the center corner region (CCA). At least a portion of the first region (A1) and the first adjacent corner region (ACA1) may be located along the first direction (e.g., the x direction or the -x direction). The end of the first adjacent corner region (ACA1) in the direction of the center corner region (CCA) and the end of the center corner region (CCA) in the direction of the first adjacent corner region (ACA1) may be spaced apart from each other. The first adjacent corner region (ACA1) may appear to be bent in the cross-section in the first direction (zx cross-section) and not bent in the cross-section in the second direction (yz cross-section). A spaced-out region (SA) may not be defined within this first adjacent corner region (ACA1).

[0087] The second adjacent corner region (ACA2) may also be adjacent to the center corner region (CCA). At least a portion of the second region (A2) and the second adjacent corner region (ACA2) may be located along the second direction (y direction or -y direction). The end of the second adjacent corner region (ACA2) in the direction of the center corner region (CCA) and the end of the center corner region (CCA) in the direction of the second adjacent corner region (ACA2) may be spaced apart from each other. The second adjacent corner region (ACA2) may appear to be unbent in the cross-section in the first direction (zx cross-section) and appear to be bent in the cross-section in the second direction (yz cross-section). A spaced-out region (SA) may not be defined within this second adjacent corner region (ACA2).

[0088] An intermediate region (MA) may be located between the central region (CA) and the corner region (CNA). The intermediate region (MA) may extend between the central region (CA) and the first adjacent corner region (ACA1). Additionally, the intermediate region (MA) may extend between the central region (CA) and the second adjacent corner region (ACA2). This intermediate region (MA) may enclose at least a portion of the central region (CA), the first region (A1), and the second region (A2).

[0089] As illustrated in FIG. 5, a plurality of pixels (PX) may be placed in a central region (CA), a first region (A1), a second region (A2), a corner region (CNA), and an intermediate region (MA). Accordingly, the display panel (10) can display an image in the central region (CA), the first region (A1), the second region (A2), the corner region (CNA), and the intermediate region (MA). Meanwhile, each of the plurality of extended regions (EA) may include a pixel region (PXA), and a plurality of pixels (PX) may be placed in the pixel region (PXA). In each of the plurality of extended regions (EA), a plurality of pixels (PX) may be arranged along the extension direction of the extended region (EA). A pixel (PX) may include a display element (DPE).

[0090] An intermediate region (MA) may have a driving circuit (DC) for providing an electrical signal to a pixel (PX) and / or power wiring for providing power. Multiple driving circuits (DC) may be provided. The driving circuits (DC) may extend in the direction in which the intermediate region (MA) extends. The driving circuits (DC) may surround at least a portion of the central region (CA), the first region (A1), and the second region (A2).

[0091] A pixel (PX) placed in an intermediate area (MA) may overlap with a driving circuit (DC) and / or power wiring. In such a case, the intermediate area (MA) may function as a display area even if the driving circuit (DC) and / or power wiring is placed therein. However, the present invention is not limited thereto. For example, the driving circuit (DC) and / or power wiring may not be placed in the intermediate area (MA). In such a case, a pixel (PX) placed in the intermediate area (MA) may not overlap with the driving circuit (DC) and / or power wiring.

[0092] The substrate (100) may include a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. Alternatively, the substrate (100) may include two layers containing such polymer resins and a barrier layer interposed between the layers. In this case, the barrier layer may include an inorganic material such as silicon nitride (SiNx), silicon oxide (SiO2), and / or silicon oxynitride (SiON). Of course, the substrate (100) may, alternatively, include glass or metal.

[0093] A pixel circuit layer (PCL) may be disposed on a substrate (100). The pixel circuit layer (PCL) may include a pixel circuit (PC), a buffer layer (111), a first gate insulating layer (112), a second gate insulating layer (113), an interlayer insulating layer (115), a first planarization layer (116), a second planarization layer (117), and a connecting electrode (CML). The pixel circuit (PC) may include at least one thin-film transistor. Specifically, the pixel circuit (PC) may include a driving thin-film transistor (T1), a switching thin-film transistor (T2), and a storage capacitor (Cst).

[0094] The driving thin-film transistor (T1) may include a first semiconductor layer (Act1), a first gate electrode (GE1), a first source electrode (SE1), and a first drain electrode (DE1). The pixel circuit layer (PCL) may further include a buffer layer (111), a first gate insulating layer (112), a second gate insulating layer (113), an interlayer insulating layer (115), a first planarization layer (116), and a second planarization layer (117) disposed above or / and below the components of the driving thin-film transistor (T1).

[0095] The buffer layer (111) can reduce or block the penetration of foreign matter, moisture, or outside air from the bottom of the substrate (100) and can provide a flat surface on the substrate (100). The buffer layer (111) may include inorganic materials, organic materials, or organic-inorganic composites such as oxides or nitrides, and may have a single-layer or multi-layer structure of inorganic and organic materials.

[0096] The first semiconductor layer (Act1) may be disposed on the buffer layer (111). The first semiconductor layer (Act1) may include polysilicon. Alternatively, the first semiconductor layer (Act1) may include amorphous silicon, an oxide semiconductor, an organic semiconductor, etc. The first semiconductor layer (Act1) may include a channel region and a drain region and a source region disposed on both sides of the channel region, respectively.

[0097] The first gate electrode (GE1) may overlap with the channel region. The first gate electrode (GE1) may include a low-resistance metal material. The first gate electrode (GE1) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including such material.

[0098] A first gate insulating layer (112) may be interposed between the first semiconductor layer (Act1) and the first gate electrode (GE1). The first gate insulating layer (112) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2), etc.

[0099] The second gate insulating layer (113) can cover the first gate electrode (GE1). The second gate insulating layer (113) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2), etc.

[0100] A second capacitor electrode (CE2) of a storage capacitor (Cst) may be disposed on the upper portion of the second gate insulating layer (113). The second capacitor electrode (CE2) may overlap with the first gate electrode (GE1) located below it. At this time, the first gate electrode (GE1) and the second capacitor electrode (CE2) of the driving thin-film transistor (T1) that overlap with the second gate insulating layer (113) in between may form a storage capacitor (Cst). That is, the first gate electrode (GE1) of the driving thin-film transistor (T1) may function as the first capacitor electrode (CE1) of the storage capacitor (Cst), and the storage capacitor (Cst) and the driving thin-film transistor (T1) may overlap. The present invention is not limited thereto. For example, the storage capacitor (Cst) may not overlap with the driving thin-film transistor (T1). The second capacitor electrode (CE2) may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or a multilayer of the aforementioned materials.

[0101] The interlayer insulating layer (115) can cover the second capacitor electrode (CE2). The interlayer insulating layer (115) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2), etc.

[0102] The first drain electrode (DE1) and the first source electrode (SE1) may each be disposed on an interlayer insulating layer (115). The first drain electrode (DE1) and the first source electrode (SE1) may include a material with good conductivity. The first drain electrode (DE1) and the first source electrode (SE1) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including such material. For example, the first drain electrode (DE1) and the first source electrode (SE1) may have a multilayer structure of Ti / Al / Ti.

[0103] The switching thin-film transistor (T2) may include a second semiconductor layer (Act2), a second gate electrode (GE2), a second drain electrode (DE2), and a second source electrode (SE2). Since the second semiconductor layer (Act2), the second gate electrode (GE2), the second drain electrode (DE2), and the second source electrode (SE2) are similar to the first semiconductor layer (Act1), the first gate electrode (GE1), the first drain electrode (DE1), and the first source electrode (SE1), a detailed description is omitted.

[0104] Meanwhile, the pixel circuit layer (PCL) may further include a driving circuit (DC), and the driving circuit (DC) may be disposed in an intermediate region (MA). The driving circuit (DC) may include at least one thin-film transistor, and the driving circuit (DC) may be connected to a scan line. The thin-film transistor included in the driving circuit (DC) may include a driving circuit semiconductor layer, a driving circuit gate electrode, a driving circuit source electrode, and a driving circuit drain electrode, similar to a switching thin-film transistor (T2).

[0105] The first flattening layer (116) may cover the first drain electrode (DE1) and the first source electrode (SE1). The first flattening layer (116) may have a roughly flat upper surface. The first flattening layer (116) may include organic materials. For example, the first flattening layer (116) may include general-purpose polymers such as BCB (Benzocyclobutene), polyimide, HMDSO (Hexamethyldisiloxane), polymethylmethacrylate (PMMA), or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof. Of course, the first flattening layer (116) may include inorganic materials as needed. In this case, the first flattening layer (116) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2), etc. If the first flattening layer (116) includes inorganic materials, chemical flattening polishing may be performed depending on the case. Of course, the first flattening layer (116) may include both organic and inorganic materials.

[0106] The pixel circuit layer (PCL) may further include a connecting electrode (CML), and the connecting electrode (CML) may be disposed on the first planarization layer (116). At this time, the connecting electrode (CML) may be connected to the first drain electrode (DE1) or the first source electrode (SE1) through a contact hole of the first planarization layer (116). The connecting electrode (CML) may include a material with good conductivity. The connecting electrode (CML) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including such material. For example, the connecting electrode (CML) may have a multilayer structure of Ti / Al / Ti.

[0107] The second planarization layer (117) may cover the connecting electrode (CML). The second planarization layer (117) may have a roughly flat upper surface. The second planarization layer (117) may include organic materials. For example, the second planarization layer (117) may include general-purpose polymers such as BCB (Benzocyclobutene), polyimide, HMDSO (Hexamethyldisiloxane), polymethylmethacrylate (PMMA), or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof. Of course, the second planarization layer (117) may include inorganic materials as needed. In this case, the second flattening layer (117) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2), etc. If the second flattening layer (117) includes inorganic materials, chemical flattening polishing may be performed depending on the case. Of course, the second flattening layer (117) may include both organic and inorganic materials.

[0108] A display element layer (DEL) may be disposed on a pixel circuit layer (PCL). The display element layer (DEL) may include a display element (DPE), a pixel defining film (119), and a spacer (121). An organic light-emitting diode, which is the display element (DPE), may have a pixel electrode (210), a counter electrode (230), and an intermediate layer (220) located between them and including a light-emitting layer.

[0109] The pixel electrode (210) can be placed on a second flattening layer (117) having a flat upper surface. The pixel electrode (210) can be electrically connected to a connecting electrode (CML) through a contact hole formed in the second flattening layer (117). And as shown in FIG. 6, an organic light-emitting diode, which is a display element (DPE), can be positioned to overlap with a pixel circuit (PC) that is electrically connected in the central region (CA).

[0110] The pixel electrode (210) may be a (semi)transparent electrode or a reflective electrode. In some embodiments, the pixel electrode (210) may have a reflective film comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr and compounds thereof, and a transparent or translucent electrode layer formed on the reflective film. The transparent or translucent electrode layer may have at least one selected from the group comprising indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO or ZnO2), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In some embodiments, the pixel electrode (210) may have a stacked structure of ITO / Ag / ITO.

[0111] A pixel defining film (119) may be disposed on the second planarization layer (117), and the pixel defining film (119) may serve to define the light-emitting region of the pixel by having an opening (119OP) that exposes the central part of the pixel electrode (210). In addition, the pixel defining film (119) may serve to prevent arcs from occurring at the edge of the pixel electrode (210) by increasing the distance between the edge of the pixel electrode (210) and the opposing electrode (230) above the pixel electrode (210). The pixel defining film (119) may be formed using an organic insulating material such as polyimide, polyamide, acrylic resin, benzocyclobutene, HMDSO (hexamethyldisiloxane), and phenolic resin, and may be formed by a method such as spin coating.

[0112] An intermediate layer (220) may be disposed on the pixel defining film (119). The intermediate layer (220) may include a light-emitting layer (220b) disposed at an opening of the pixel defining film (119) and overlapping with the pixel electrode (210). The intermediate layer (220) may further include at least one of a first functional layer (220a) located between the pixel electrode (210) and the light-emitting layer (220b), and a second functional layer (220c) located on the light-emitting layer (220b). The first functional layer (220a) may include, for example, a hole transport layer (HTL) or a hole transport layer and a hole injection layer (HIL). The second functional layer (220c) may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer (220a) and / or the second functional layer (220c) may be formed integrally to correspond to a plurality of pixel electrodes (210).

[0113] The counter electrode (230) may be a transparent electrode or a reflective electrode. In some embodiments, the counter electrode (230) may be a transparent or translucent electrode and may include a metal thin film with a low work function comprising Li, Ca, LiF, Al, Ag, Mg, or a compound thereof. In addition, in addition to the metal thin film, it may further include a transparent conductive oxide (TCO) film such as ITO, IZO, ZnO, ZnO2, or In2O3. Such a counter electrode (230) may be integrally formed to correspond to a plurality of pixel electrodes (210).

[0114] A spacer (121) may be placed on a pixel defining film (119). The spacer (121) may be intended to prevent damage to the substrate (100) and / or the multilayer film on the substrate (100) in a method for manufacturing a display device. In a method for manufacturing a display panel, a mask sheet may be used, in which case such a mask sheet may enter into the opening (119OP) of the pixel defining film (119) or adhere to the pixel defining film (119). The spacer (121) may prevent or reduce defects in which a portion of the substrate (100) and the multilayer film is damaged or broken by the mask sheet when a deposition material is deposited on the substrate (100).

[0115] The spacer (121) may include an organic material such as polyimide. Alternatively, the spacer (121) may include an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiO2), or may include both an organic insulating material and an inorganic insulating material. The spacer (121) may include a material different from the pixel defining film (119). Alternatively, the spacer (121) may include the same material as the pixel defining film (119), in which case the pixel defining film (119) and the spacer (121) may be formed together in a mask process using a halftone mask, etc.

[0116] A sealing layer (300) comprising a first inorganic sealing layer (310), a second inorganic sealing layer (320), and an organic sealing layer (330) interposed between them may be disposed on the opposing electrode (230).

[0117] The first inorganic encapsulation layer (310) and the second inorganic encapsulation layer (320) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2). The organic encapsulation layer (330) may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.) or any combination thereof.

[0118] A protective layer (400) may be disposed on a sealing layer (300). The protective layer (400) may protect the sealing layer (300). For example, the protective layer (400) may prevent or reduce the occurrence of cracks in at least one of the first inorganic sealing layer (310) and / or the second inorganic sealing layer (320). A second inorganic protective layer (430) may be disposed on the first inorganic protective layer (410).

[0119] The first weapon protection layer (410) and the second weapon protection layer (430) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2).

[0120] The touch sensor layer (500) may be disposed on the protective layer (400). The touch sensor layer (500) may acquire coordinate information based on an external input, such as a touch event. The touch sensor layer (500) may include a first touch conductive layer (510), a first touch insulating layer (520), a second touch conductive layer (530), and a second touch insulating layer (540).

[0121] The first touch conductive layer (510) may be disposed on the second inorganic protective layer (430). The first touch conductive layer (510) may include a conductive material. Specifically, the first touch conductive layer (510) may include at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). For example, the first touch conductive layer (510) may have a multilayer structure of Ti / Al / Ti in which a titanium layer, an aluminum layer, and a titanium layer are sequentially stacked.

[0122] The first touch insulating layer (520) may be disposed on the first touch conductive layer (510). The first touch insulating layer (520) may include an inorganic material. For example, the first touch insulating layer (520) may include aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO), silicon oxide (SiO2), and silicon nitride (SiN2). X It may include one or more inorganic materials among silicon oxynitride (SiON).

[0123] The second touch conductive layer (530) may be disposed on the first touch insulating layer (520). The first touch insulating layer (520) may have a contact hole, and the second touch conductive layer (530) may be connected to the first touch conductive layer (510) through this contact hole. The second touch conductive layer (530) may include a conductive material. Specifically, the second touch conductive layer (530) may include at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). For example, the second touch conductive layer (530) may have a multilayer structure of Ti / Al / Ti in which a titanium layer, an aluminum layer, and a titanium layer are sequentially stacked.

[0124] The second touch insulating layer (540) may be disposed on the second touch conductive layer (530). The upper surface of the second touch insulating layer (540) may be flat. The second touch insulating layer (540) may include an organic material. Specifically, the second touch insulating layer (540) may include a polymer-based material. The aforementioned polymer-based material may be transparent. For example, the second touch insulating layer (540) may include a silicone-based resin, an acrylic-based resin, an epoxy-based resin, polyimide, and polyethylene, etc. Meanwhile, the second touch insulating layer (540) may include an inorganic material.

[0125] An anti-reflection layer (600) may be placed on the touch sensor layer (500). The anti-reflection layer (600) may reduce the reflectivity of light incident from the outside toward the display panel (10). The anti-reflection layer (600) may increase the color purity of light emitted from the display panel (10). The anti-reflection layer (600) may include a color filter (610), a black matrix (630), and a flattening layer (650). The color filter (610) may overlap with an organic light-emitting diode, which is a display element (DPE). The color filter (610) may be arranged considering the color of light emitted from the organic light-emitting diode. The color filter (610) may include red, green, or blue pigments or dyes. Alternatively, the color filter (610) may further include quantum dots in addition to the aforementioned pigments or dyes. Alternatively, the color filter (610) may not contain the aforementioned pigment or dye and may contain scattering particles such as titanium oxide.

[0126] The black matrix (630) may be positioned adjacent to the color filter (610) and may overlap with at least one of the first touch conductive layer (510) and / or the second touch conductive layer (530). The black matrix (630) may absorb external light or internal reflected light at least partially. The black matrix (630) may include a black pigment.

[0127] The flattening layer (650) may be placed on the color filter (610) and the black matrix (630). The upper surface of the flattening layer (650) may be flat. The flattening layer (650) may contain an organic material. Specifically, the flattening layer (650) may contain a transparent polymer-based material. For example, the flattening layer (650) may include a silicone-based resin, an acrylic-based resin, an epoxy-based resin, polyimide, and polyethylene, etc.

[0128] Meanwhile, the pixel (PX) located in the central region (CA) of FIG. 5 has been described with reference to FIG. 6. Below, the structure of the part near the separation region (SA) in the extension region (EA) and the pixel (PX) located in the extension region (EA) will be described with reference to FIG. 7, which is a cross-sectional view schematically illustrating a cross-section taken along the line II-II' of FIG. 5. Among the reference numbers shown in FIG. 6, those that are identical to the reference numbers shown in FIG. 7 represent identical or corresponding components, so a description thereof is omitted for convenience.

[0129] As illustrated in FIG. 7, the pixel circuit layer (PCL) may include a pixel circuit (PC), a buffer layer (111), a first gate insulating layer (112), a second gate insulating layer (113), an interlayer insulating layer (115), a first flattening layer (116), a second flattening layer (117), and a connecting electrode (CML). The pixel circuit layer (PCL) may further include a lower wiring (LWL) and an electrode power supply line (ELVSS).

[0130] The lower wiring (LWL) can transmit power voltage and / or electrical signals to pixels placed in the corner area (CNA). The lower wiring (LWL) may include a first lower wiring (LWL1) and a second lower wiring (LWL2). The first lower wiring (LWL1) may be interposed between the first gate insulating layer (112) and the second gate insulating layer (113), and the second lower wiring (LWL2) may be interposed between the second gate insulating layer (113) and the interlayer insulating layer (115).

[0131] The electrode power supply line (ELVSS) can be placed on the first flattening layer (116) just like the connecting electrode (CML) and can be formed simultaneously with the same material as the connecting electrode (CML). This electrode power supply line (ELVSS) is electrically connected to a counter electrode (230) containing an organic light-emitting diode which is a display element (DPE), so that an electrical signal can be applied to the counter electrode (230).

[0132] The second flattening layer (117) can cover the electrode power supply line (ELVSS) and the connecting electrode (CML). As shown in FIG. 7, the second flattening layer (117) may have a first corner hole (CH1) and a second corner hole (CH2). Of course, the second flattening layer (117) may have a contact hole so that a pixel electrode (210) located on the second flattening layer (117) can be connected to the connecting electrode (CML) through the contact hole. The first corner hole (CH1), the second corner hole (CH2), and the contact hole may be formed simultaneously.

[0133] The first corner hole (CH1) and the second corner hole (CH2) may overlap with the electrode power supply line (ELVSS), and the lower corner pattern (LCIP) located on the electrode power supply line (ELVSS) can prevent or minimize damage to the electrode power supply line (ELVSS) during the process of forming the first corner hole (CH1) and the second corner hole (CH2). Specifically, the lower corner pattern (LCIP) includes a first lower corner pattern (LCIP1) and a second lower corner pattern (LCIP2), wherein the first lower corner pattern (LCIP1) overlaps with the first corner hole (CH1) and the second lower corner pattern (LCIP2) overlaps with the second corner hole (CH2). Through this, the electrode power supply line (ELVSS) is not exposed or the degree of exposure is minimized during the process of forming the first corner hole (CH1) and the second corner hole (CH2), thereby preventing or minimizing damage to the electrode power supply line (ELVSS). This lower corner pattern (LCIP) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2).

[0134] Overlapping weapon patterns (COP), corner weapon patterns (CIP), and weapon pattern lines (IPL) may be located on the second flattening layer (117). Overlapping weapon patterns (COP), corner weapon patterns (CIP), and weapon pattern lines (IPL) may be formed simultaneously from the same material. Overlapping weapon patterns (COP), corner weapon patterns (CIP), and weapon pattern lines (IPL) may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO or ZnO2), etc.

[0135] The overlapping weapon pattern (COP) may be located on the second flattening layer (117) and may be located near the contact hole. Of course, as shown in FIG. 7, the overlapping weapon pattern (COP) may also be located on the inner surface of the contact hole. In this case, the pixel electrode (210) located on the second flattening layer (117) may be located on the overlapping weapon pattern (COP) and connected to the connecting electrode (CML) through the contact hole.

[0136] The corner weapon pattern (CIP) is separated from the overlapping weapon pattern (COP) by the first corner hole (CH1) and may have a shape that surrounds at least part of the overlapping weapon pattern (COP) in a plan view. The weapon pattern line (IPL) is separated from the corner weapon pattern (CIP) by the second corner hole (CH2) and may have a shape that surrounds at least part of the corner weapon pattern (CIP) in a plan view.

[0137] The corner weapon pattern (CIP) may have a corner protrusion tip (CPT) protruding in the direction of the center of at least one of the first corner hole (CH1) and the second corner hole (CH2). In FIG. 7, the corner weapon pattern (CIP) is shown protruding in the direction of the center of each of the first corner hole (CH1) and the second corner hole (CH2). The weapon pattern line (IPL) may have an intermediate protrusion tip (MPT) protruding in the direction of the center of the second corner hole (CH2). Additionally, the weapon pattern line (IPL) may have an outer corner protrusion tip (OCPT) protruding in the direction of the spacing area (SA). Of course, as shown in FIG. 7, the overlapping weapon pattern (COP) may also have a protrusion tip protruding in the direction of the center of the first corner hole (CH1).

[0138] The pixel defining film (119) can cover the edge of the pixel electrode (210). At this time, when forming the pixel defining film (119), a first pattern (119P) can be formed simultaneously with the same material. The first pattern (119P) can be located on the inorganic pattern line (IPL). The first pattern (119P) can form a first corner dam (CDAM1) together with the inorganic pattern line (IPL). Of course, when forming a spacer (121) on the pixel defining film (119), a second pattern (121P) located on the first pattern (119P) can be formed simultaneously with the same material. In this case, the first pattern (119P) and the second pattern (121P) can form a first corner dam (CDAM1) together with the inorganic pattern line (IPL). In addition, when forming the pixel definition film (119), a second corner dam (CDAM2) can be formed simultaneously with the same material, spaced apart from the first corner dam (CDAM1) and located on the corner weapon pattern (CIP).

[0139] Referring to FIG. 6, an intermediate layer (220) may be disposed on the pixel defining film (119) in the extended region (EA) as in the central region (CA) described above. The intermediate layer (220) may include a light-emitting layer (220b) disposed in the opening of the pixel defining film (119) and overlapping with the pixel electrode (210). The intermediate layer (220) may further include at least one of a first functional layer (220a) located between the pixel electrode (210) and the light-emitting layer (220b), and a second functional layer (220c) located on the light-emitting layer (220b).

[0140] As described above, the overlapping weapon pattern (COP) may have a protruding tip that protrudes toward the center of the first corner hole (CH1). Additionally, the corner weapon pattern (CIP) may have a corner protruding tip (CPT) that protrudes toward the center of the first corner hole (CH1). Accordingly, when forming the first functional layer (220a) and the second functional layer (220c), a functional layer pattern (220P) located within the first corner hole (CH1) can be formed, which is separated from the first functional layer (220a) and the second functional layer (220c) by the protruding tip of the overlapping weapon pattern (COP) and the corner protruding tip (CPT) of the corner weapon pattern (CIP). Furthermore, as described above, the weapon pattern line (IPL) has an intermediate protruding tip (MPT) that protrudes toward the center of the second corner hole (CH2). Accordingly, when forming the first functional layer (220a) and the second functional layer (220c), a functional layer pattern (220P) located within the second corner hole (CH2) can be formed by the corner protrusion tip (CPT) and the intermediate protrusion tip (MPT).

[0141] The opposing electrode (230) is formed on the pixel defining film (119) and the intermediate layer (220) to correspond to a plurality of pixel electrodes (210). Accordingly, for the same reason that the functional layer pattern (220P) located within the first corner hole (CH1) and the second corner hole (CH2) is formed, a common electrode pattern (230P) located within the first corner hole (CH1) and the second corner hole (CH2) can be formed.

[0142] The first inorganic encapsulation layer (310) included in the encapsulation layer (300) is located on the opposing electrode (230) and can come into direct contact with the protruding tip of the overlapping inorganic pattern (COP), the corner protruding tip (CPT) of the corner inorganic pattern (CIP), and the intermediate protruding tip (MPT) of the inorganic pattern line (IPL). Furthermore, depending on the case, as shown in FIG. 7, the first inorganic encapsulation layer (310) can come into contact with the common electrode pattern (230P) within the first corner hole (CH1) and the second corner hole (CH2), and can also cover the inner surface of the first corner hole (CH1) and the second corner hole (CH2). The organic encapsulation layer (330) included in the encapsulation layer (300) is located on the first inorganic encapsulation layer (310) and can fill the first corner hole (CH1) as shown in FIG. 7. The second corner dam (CDAM2) can prevent the material for forming the organic sealing layer (330) from flowing outward during the manufacturing process. The second inorganic sealing layer (320) included in the sealing layer (300) may be located on the organic sealing layer (330). The second inorganic sealing layer (320) may be in direct contact with the first inorganic sealing layer (310) on the second corner dam (CDAM2). If necessary, the second inorganic sealing layer (320) may also be in direct contact with the first inorganic sealing layer (310) in the second corner hole (CH2).

[0143] The protective layer (400) may include a first inorganic protective layer (410), an organic protective layer (420), and a second inorganic protective layer (430). The first inorganic protective layer (410) may be located on the encapsulation layer (300), and the organic protective layer (420) may be located on the first inorganic protective layer (410). The second inorganic protective layer (430) may be located on the organic protective layer (420). The organic protective layer (420) may fill the second corner hole (CH2). The second inorganic protective layer (430) may be in direct contact with the first inorganic protective layer (410) on the first corner dam (CDAM1). The first inorganic protective layer (410) and the second inorganic protective layer (430) may surround the corner protruding tip (CPT) of the corner inorganic pattern (CIP). In addition, the first weapon protection layer (410) and the second weapon protection layer (430) can surround the outer corner protruding tip (OCPT) of the weapon pattern line (IPL). This effectively prevents the display device from being damaged by oxygen or moisture from the outside, and by increasing the mechanical strength of the display device, it can prevent damage from external impact.

[0144] The touch sensor layer (500) may be located on the protective layer (400). The touch sensor layer (500) may include a first touch conductive layer (510), a first touch insulating layer (520), a second touch conductive layer (530), and a second touch insulating layer (540). If necessary, the second touch insulating layer (540) may overlap with the outer corner protrusion tip (OCPT) of the inorganic pattern line (IPL).

[0145] With reference to FIG. 6, just as in the central region (CA) described above, an anti-reflection layer (600) may also be disposed on the touch sensor layer (500) in the extended region (EA). The anti-reflection layer (600) may include, for example, a color filter (610), a black matrix (630), and a flattening layer (650). The color filter (610) may overlap with the pixel electrode (210).

[0146] FIG. 8 is a cross-sectional view schematically illustrating a part of a display device (1) according to one embodiment of the present invention. Specifically, FIG. 8 is an enlarged cross-sectional view of part E of FIG. 2a. As shown in FIG. 8, the cover panel (40) may include a metal layer (ML), an organic layer (OL), a cushion layer (CL), and a silicone layer (SL).

[0147] Among the metal layer (ML), organic layer (OL), cushion layer (CL), and silicon layer (SL), the metal layer (ML) may be positioned furthest from the display panel (10). The metal layer (ML) may have a function of shielding electromagnetic interference (EMI) and / or a function of heat dissipation. The metal layer (ML) may include a heat dissipation member for efficiently dissipating heat. For example, the metal layer (ML) may include a metal material with high thermal conductivity such as copper, nickel, ferrite, silver, or aluminum.

[0148] The organic layer (OL) may be disposed on the metal layer (ML). The organic layer (OL) may include a synthetic resin film. Specifically, the organic layer (OL) may include a thermosetting resin. For example, the organic layer (OL) may include at least one of a polyimide resin, an acrylic resin, a methacrylate resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin.

[0149] Although not illustrated in the drawing, an adhesive layer may be interposed between the metal layer (ML) and the organic layer (OL). For example, the adhesive layer interposed between the metal layer (ML) and the organic layer (OL) may include at least one of an optical clear resin (OCR), an optical clear adhesive (OCA), and a pressure-sensitive adhesive (PSA).

[0150] A cushion layer (CL) may be disposed on the organic layer (OL). The cushion layer (CL) may be a synthetic resin foam comprising a matrix member and a plurality of pores. The matrix member may include a flexible material. For example, the matrix member may include a synthetic resin. The plurality of pores can easily absorb impact applied to the display panel (10). The plurality of pores may be defined as the cushion layer (CL) has a porous structure. Thus, the plurality of pores may be dispersed in the matrix member. The plurality of pores may allow the shape of the cushion layer (CL) to be easily deformed. Accordingly, the elasticity of the cushion layer (CL) can be improved, thereby improving the impact resistance of the cover panel (40).

[0151] The cushion layer (CL) may include a light-blocking material. Accordingly, the cushion layer (CL) can block external light from being incident toward the display panel (10). The light-blocking material may include at least one of a black dye and black particles. For example, the light-blocking material may include Cr, CrOx, Cr / CrOx, Cr / CrOx / CrNy, a resin (carbon pigment, RGB mixed pigment), graphite, a non-Cr-based pigment, a lactam-based pigment, or a perylene-based pigment. The light-blocking material may include a black organic pigment, and the black organic pigment may include one or more selected from the group consisting of aniline black, lactam black, and perylene black.

[0152] Meanwhile, a silicon layer (SL) may be disposed on the cushion layer (CL). Specifically, the silicon layer (SL) may be interposed between the cushion layer (CL) and the protective film (30). The silicon layer (SL) may include a second silicon-based compound. The second silicon-based compound may be an organosilicon compound containing silicon. Specifically, the second silicon-based compound may include a siloxane-based material.

[0153] In one embodiment, the second silicon-based compound may include the same material as the first silicon-based compound included in the protective film (30). For example, the first silicon-based compound and the second silicon-based compound may include polydimethylsiloxane. Since the protective film (30) and the silicon layer (SL) include the same material, the protective film (30) and the silicon layer (SL) may have the same or similar properties. Accordingly, the adhesion between the protective film (30) and the silicon layer (SL) may be improved. However, the present invention is not limited thereto.

[0154] In another embodiment, the second silicon-based compound may be different from the first silicon-based compound included in the protective film (30). For example, the first silicon-based compound may include polydimethylsiloxane, and the second silicon-based compound may include at least one of silica and silsesquioxane. Even in this case, silica and silsesquioxane may include siloxane groups. That is, polydimethylsiloxane, silica, and silsesquioxane may include the same elements and the same functional groups. Accordingly, the protective film (30) and the silicon layer (SL) may have the same or similar properties, and the adhesion between the protective film (30) and the silicon layer (SL) may be improved. The second silicon-based compound may be in the form of fine particles. The diameter of the particles of the second silicon-based compound can be tens of nanometers to hundreds of nanometers.

[0155] FIG. 9a is a plan view schematically illustrating a part of a display device (2) according to another embodiment of the present invention, FIG. 9b is a cross-sectional view schematically illustrating a cross section taken along the line III-III' of FIG. 9a, and FIG. 9c is a cross-sectional view schematically illustrating a cross section taken along the line IV-IV' of FIG. 9a. Since the display device (2) according to the present embodiment is similar to the display device (1) described above with reference to FIG. 1a to 8, the following description will focus on the differences from the display device (1) described above with reference to FIG. 1a to 8. In FIG. 9a to 9c, reference numerals identical to those in FIG. 1a to 8 denote identical components, so redundant descriptions will be omitted.

[0156] With reference to FIG. 8 and the like, in the display device (1) according to the above-described embodiment, a protective film (30) and a cover panel (40) may be disposed on the lower part of the display panel (10) in the central area (CA), first area (A1), second area (A2), intermediate area (MA), peripheral area (PA), and corner area (CNA) of the display device (1). As shown in FIG. 9b, in the case of the display device (2) according to the present embodiment, a protective film (30) and a cover panel (40) may also be disposed on the lower part of the display panel (10) in the corner area (CNA) of the display device (2).

[0157] However, as illustrated in FIG. 9c, the structure and / or constituent materials of the protective film and cover panel disposed on the lower part of the display panel (10) in the display device (2) according to the present embodiment may differ depending on the location in the display device (2). Specifically, in areas of the display device (2) excluding the corner area (CNA) of the display device (2) (e.g., center area (CA), first area (A1), second area (A2), intermediate area (MA) and peripheral area (PA)), a protective film (30') and a cover panel (40') may be disposed on the lower part of the display panel (10).

[0158] A protective film (30') may be placed on the lower surface of the display panel (10) so as to face the lower surface (in the -z direction) of the display panel (10). Specifically, the protective film (30') may be placed on the lower surface of areas other than the corner area (CNA) of the display panel (10). Compared to the protective film (30) of the display device (1) described above, the protective film (30') of the present embodiment may not contain a first silicon-based compound. Specifically, the protective film (30') may not contain a first silicon-based compound and may contain polyethylene terephthalate (PET).

[0159] The cover panel (40') may include a metal layer (ML) and an organic layer (OL). Compared to the cover panel (40) of the display device (1) described above, the cover panel (40') of the present embodiment may include a cushion layer (CL') and a light-blocking layer (BL). A cushion layer (CL') may be disposed on the organic layer (OL), and a light-blocking layer (BL) may be disposed on the cushion layer (CL'). That is, compared to the cushion layer (CL) of the cover panel (40) of the display device (1), the cushion layer (CL') does not contain a light-blocking material, and the cover panel (40') may include a light-blocking layer (BL) which is a separate layer independent of the cushion layer (CL').

[0160] The light-blocking layer (BL) may include a light-blocking material. Accordingly, the light-blocking layer (BL) can block external light from being incident toward the display panel (10). The light-blocking material may include at least one of a black dye and black particles. For example, the light-blocking material may include Cr, CrOx, Cr / CrOx, Cr / CrOx / CrNy, a resin (carbon pigment, RGB mixed pigment), graphite, a non-Cr-based pigment, a lactam-based pigment, or a perylene-based pigment. The light-blocking material may include a black organic pigment, and the black organic pigment may include one or more selected from the group consisting of aniline black, lactam black, and perylene black.

[0161] Meanwhile, although not shown in FIG. 9c, an adhesive layer may be interposed between the light-blocking layer (BL) and the protective film (30'). By means of this adhesive layer, the cover panel (40') including the light-blocking layer (BL) can be attached to the underside of the protective film (30'). The adhesive layer interposed between the light-blocking layer (BL) and the protective film (30') may include at least one of an optical clear resin (OCR), an optical clear adhesive (OCA), and a pressure-sensitive adhesive (PSA).

[0162] Up to this point, the display device (1) has been described, but the present invention is not limited thereto. A method for manufacturing such a display device is also considered to be within the scope of the present invention. Below, a method for manufacturing such a display device is described. FIGS. 10a to 10e are schematic cross-sectional views for explaining the step of manufacturing a preliminary cover panel (P40) among the steps included in the method for manufacturing a display device according to one embodiment of the present invention.

[0163] First, as illustrated in FIG. 10a, a cushion layer forming layer (CLFL) can be formed on an organic layer (OL). In this specification, "cushion layer forming layer" may refer to a layer that has been heat-treated after applying a cushion layer composition. Meanwhile, a metal layer (ML) may be disposed on the underside of the organic layer (OL). That is, after attaching the metal layer (ML) to the lower surface (in the -z direction) of the organic layer (OL), a cushion layer forming layer (CLFL) can be formed on the opposite side of the organic layer (OL) to which the metal layer (ML) is attached. An adhesive layer may be used to attach the metal layer (ML) to the underside of the organic layer (OL). For example, the adhesive layer may include at least one of an optical clear resin (OCR), an optical clear adhesive (OCA), and a pressure-sensitive adhesive (PSA).

[0164] The cushion layer composition may include at least one of a urethane-based compound and an epoxy-based compound. For example, the cushion layer composition may include at least one of a polyurethane-based resin and a polyepoxy-based resin.

[0165] Meanwhile, the cushion layer composition may further include a thermosetting agent and a photocuring agent. The thermosetting agent may be included if it is typically usable to thermosetting urethane-based compounds and / or epoxy-based compounds, and is not particularly limited. For example, the thermosetting agent may include at least one of diethylenetriamine, phthalic anhydride, trioxanetritylenemercaptan, and 2-methylimidazole. The photocuring agent may be included if it is typically usable to photocuring urethane-based compounds and / or epoxy-based compounds, and is not particularly limited. Also, The cushion layer composition may further include a solvent. The solvent included in the cushion layer composition may be a water-soluble solvent. That is, the cushion layer composition may be a solution in which at least one of a urethane-based compound and an epoxy-based compound, a photocuring agent, and a thermosetting agent are dissolved in a solvent.

[0166] The cushion layer composition can be applied onto the organic layer (OL). The cushion layer composition can be applied onto the organic layer (OL) using various methods. For example, the cushion layer composition can be applied to the entire surface of the organic layer (OL) using an inkjet device. Alternatively, the cushion layer composition can be coated onto the organic layer (OL) by a dip coating method.

[0167] Subsequently, a cushion layer forming layer (CLFL) can be formed on an organic layer (OL) by heat-treating the applied cushion layer composition to remove at least a portion of the solvent. That is, the cushion layer forming layer (CLFL) may include at least one of a urethane-based compound and an epoxy-based compound, a photocuring agent, and a thermosetting agent. The heat treatment may be performed at a temperature of 80°C to 120°C for several seconds to tens of seconds. Since the cushion layer composition is heat-treated for only several seconds to tens of seconds, sufficient energy may not be supplied to the cushion layer composition for it to be heat-cured. Accordingly, in the step of forming the cushion layer forming layer (CLFL), the cushion layer composition may not be heat-cured.

[0168] Next, as illustrated in FIG. 10b, ultraviolet light can be irradiated onto the cushion layer forming layer (CLFL). By doing so, a preliminary cushion layer (PCSL, see FIG. 10c) can be formed. In this specification, "preliminary cushion layer" may refer to a layer that is photocured by irradiating the cushion layer forming layer with ultraviolet light. Specifically, ultraviolet light having a light intensity of 100 mJ / cm² to 1000 mJ / cm² can be irradiated onto the cushion layer forming layer (CLFL). For photocuring, ultraviolet light having a wavelength of about 300 nm to about 400 nm may be used. An LED or a metal halide may be used as the ultraviolet source.

[0169] As ultraviolet rays are irradiated onto the cushion layer forming layer (CLFL), the cushion layer forming layer (CLFL) can be photocured. Accordingly, the pre-cushion layer (PCSL) may have a viscosity and / or hardness greater than that of the cushion layer forming layer (CLFL), and the pre-cushion layer (PCSL) may maintain a constant shape. As described below, a silicone layer composition may be applied onto the pre-cushion layer (PCSL), and the application of the silicone layer composition may be easy as the pre-cushion layer (PCSL) maintains a constant shape. The degree to which the cushion layer forming layer (CLFL) is photocured may be such that the pre-cushion layer (PCSL) maintains a constant shape so that subsequent processes can proceed. Meanwhile, as ultraviolet rays are irradiated onto the cushion layer forming layer (CLFL), a plurality of pores may be formed within the cushion layer forming layer (CLFL). That is, the pre-cushion layer (PCSL) may be a foamed layer comprising a matrix member and a plurality of pores.

[0170] Subsequently, as illustrated in FIG. 10c, a silicon layer forming layer (SLFL) may be formed on a pre-cushion layer (PCSL). In this specification, "silicon layer forming layer" may refer to a layer heat-treated after applying a silicon layer composition. Specifically, the silicon layer composition may include a second silicon-based compound. The second silicon-based compound may be an organosilicon compound containing silicon. Specifically, the second silicon-based compound may include a siloxane-based material. For example, the second silicon-based compound may include at least one of polydimethylsiloxane, silica, and silsesquioxane. The second silicon-based compound may be included in the silicon layer composition in the form of fine particles. The diameter of the particles of the second silicon-based compound may be tens of nanometers to hundreds of nanometers.

[0171] The silicone layer composition may further include an acrylic compound. For example, the acrylic compound may be an acrylic resin. The acrylic compound may include at least one of methyl methacrylate, acrylic acid, ethylhexyl acrylate, pentafluoropropyl acrylate, and ethylene glycol dimethacrylate.

[0172] Meanwhile, the silicone layer composition may further include a thermosetting agent and a photocuring agent. The thermosetting agent may be included if it is typically usable to thermosetting acrylic compounds and is not particularly limited. The photocuring agent may be included if it is typically usable to photocuring acrylic compounds and is not particularly limited. In addition, The silicon layer composition may further include a solvent. The solvent included in the silicon layer composition may be a water-soluble solvent. That is, the silicon layer composition may be a solution in which a second silicon-based compound, an acrylic-based compound, a photocuring agent, and a thermosetting agent are dissolved in a solvent.

[0173] A silicon layer composition can be applied onto a pre-cushion layer (PCSL). The silicon layer composition can be applied onto the pre-cushion layer (PCSL) using various methods. For example, the silicon layer composition can be applied to the entire surface of the pre-cushion layer (PCSL) using an inkjet device. Alternatively, the silicon layer composition can be coated onto the pre-cushion layer (PCSL) by a dip coating method. Subsequently, a silicon layer forming layer (SLFL) can be formed on the pre-cushion layer (PCSL) by heat-treating the applied silicon layer composition to remove at least a portion of the solvent. That is, the silicon layer forming layer (SLFL) may include a second silicon-based compound, an acrylic-based compound, a photocuring agent, and a thermosetting agent. The heat treatment may be performed at a temperature of 80°C to 120°C for several seconds to tens of seconds. Since the silicon layer composition is heat-treated for only several seconds to tens of seconds, sufficient energy may not be supplied to the silicon layer composition for the silicon layer composition to be heat-cured. Accordingly, in the step of forming the silicon layer forming layer (SLFL), the silicon layer composition may not be heat-cured.

[0174] Next, as illustrated in FIG. 10d, ultraviolet light can be irradiated onto the silicon layer forming layer (SLFL). By doing so, a preliminary silicon layer (PSL, see FIG. 10e) can be formed. That is, a preliminary cover panel (P40, see FIG. 10e) including the preliminary silicon layer (PSL) can be formed. The term "preliminary silicon layer" in this specification may refer to a layer that is photocured by irradiating the silicon layer forming layer with ultraviolet light. Specifically, ultraviolet light having a light intensity of 100 mJ / cm² to 1000 mJ / cm² can be irradiated onto the silicon layer forming layer (SLFL). For photocuring, ultraviolet light having a wavelength of about 300 nm to about 400 nm may be used. An LED or a metal halide may be used as the ultraviolet source.

[0175] As ultraviolet light is irradiated onto the silicon layer forming layer (SLFL), the silicon layer forming layer (SLFL) can be photocured. Accordingly, the pre-silicon layer (PSL) may have a viscosity and / or hardness greater than that of the silicon layer forming layer (SLFL), and the pre-silicon layer (PSL) may maintain a constant shape. The degree to which the silicon layer forming layer (SLFL) is photocured may be such that the pre-silicon layer (PSL) can maintain a constant shape so that a subsequent process can proceed.

[0176] Meanwhile, in the step of manufacturing the preliminary cover panel (P40), the regions corresponding to the first region (A1), second region (A2), intermediate region (MA), peripheral region (PA), and corner region (CNA) of the display panel (10) may be flat and not bent.

[0177] FIG. 11 is a schematic cross-sectional view illustrating the step of attaching a preliminary cover panel (P40) to the lower part of a display panel (10) among the steps included in a method for manufacturing a display device according to an embodiment of the present invention. The display panel (10) can be positioned so that the lower surface (in the -z direction) of the display panel (10) faces the preliminary cover panel (P40). That is, the display panel (10) can be positioned so that the lower surface (in the -z direction) of the protective film (30) attached to the lower part of the display panel (10) faces the preliminary silicon layer (PSL) of the preliminary cover panel (P30).

[0178] The first region (A1), second region (A2), intermediate region (MA), peripheral region (PA), and corner region (CNA) of the display panel (10) may be in a curved state. That is, the display panel (10) can be pre-formed before attaching a preliminary cover panel (P40) to the bottom of the display panel (10). For example, the display panel (10) in an uncurved, i.e., flat state can be pre-formed using a guide film (not shown). Specifically, after attaching the flat display panel (10) to the guide film, the shape of the display panel (10) can be deformed by applying an external force, such as tensile force, to the guide film. Since the method of using a guide film is a common practice in the pre-formation of display panels, a detailed explanation is omitted.

[0179] Meanwhile, the cover window (20) and protective film (30) attached to the display panel (10) may also have areas corresponding to the first area (A1), second area (A2), intermediate area (MA), peripheral area (PA), and corner area (CNA) of the display panel (10) in a curved state. For example, after pre-forming a flat cover window (20) to correspond to the shape of the pre-formed display panel (10), the pre-formed cover window (20) can be attached to the upper surface (in the +z direction) of the pre-formed display panel (10). Subsequently, after pre-forming a flat protective film (30) to correspond to the shape of the pre-formed display panel (10), the pre-formed protective film (30) can be attached to the lower surface (in the -z direction) of the pre-formed display panel (10). However, the present invention is not limited thereto. For example, a flat cover window (20) can be attached to the upper surface (in the +z direction) of an unbent, i.e., flat display panel (10), and a flat protective film (30) can be attached to the lower surface (in the -z direction) of the display panel (10). The combination of the display panel (10), the cover window (20), and the protective film (30) can be pre-formed simultaneously using a guide film.

[0180] Meanwhile, the preliminary cover panel (P40) may be in a flat state where the regions corresponding to the first region (A1), second region (A2), intermediate region (MA), peripheral region (PA), and corner region (CNA) of the display panel (10) are not bent. The preliminary cover panel (P40) in a flat state may be attached directly to the lower surface (in the -z direction) of the protective film (30) without being pre-molded. As described above, the silicon layer forming layer (SLFL) may be photocured only to the extent that the preliminary silicon layer (PSL) can maintain a certain shape. Accordingly, the preliminary silicon layer (PSL) is flabby and can be easily deformed. Therefore, the preliminary silicon layer (PSL) can be uniformly attached to the protective film (30) in a bent state without any part of the preliminary silicon layer (PSL) overlapping with another part or lifting. In this case, the preliminary silicon layer (PSL) is not heat-cured and may have viscosity and be sticky. Therefore, even if a separate adhesive layer is not interposed between the pre-silicone layer (PSL) and the protective film (30), the pre-silicone layer (PSL) can be attached to the protective film (30).

[0181] Next, as illustrated in FIG. 12, a cover panel (40) can be formed by heat-curing a preliminary cover panel (P40). Specifically, a cushion layer (CL) and a silicone layer (SL) can be formed by heat-curing the preliminary cushion layer (PCSL) and the preliminary silicone layer (PSL) included in the preliminary cover panel (P40). The temperature at which the preliminary cover panel (P40) is heat-cured is lower than the temperature at which the cushion layer composition or the silicone layer composition is heat-treated, and the time at which the preliminary cover panel (P40) is heat-cured may be longer than the time at which the cushion layer composition or the silicone layer composition is heat-treated. For example, heat curing may be performed at a temperature of 50°C to 80°C for about 5 minutes to about 30 minutes. As a result, the cushion layer (CL) may have greater hardness than the preliminary cushion layer (PCSL), and the silicone layer (SL) may have greater hardness than the preliminary silicone layer (PSL).

[0182] Meanwhile, the adhesion between the silicon layer (SL) and the protective film (30) can be improved by thermal curing. That is, the adhesion between the silicon layer (SL) and the protective film (30) can be greater than the adhesion between the pre-silicon layer (PSL) and the protective film (30). Thermal energy can be supplied to the cover window (20), the display panel (10), the protective film (30), and the pre-cover panel (P40) for thermal curing. Accordingly, a chemical bond can be formed between the first silicon-based compound contained in the protective film (30) and the second silicon-based compound contained in the pre-silicon layer (PSL). For example, a bond may be formed between the sulfur (S) atoms contained in the first silicon-based compound and the oxygen (O) atoms contained in the second silicon-based compound, or a bond may be formed between the sulfur (S) atoms contained in the second silicon-based compound and the oxygen (O) atoms contained in the first silicon-based compound. Therefore, the adhesion between the silicone layer (SL) and the protective film (30) may be greater than the adhesion between the pre-silicone layer (PSL) and the protective film (30). That is, the adhesion between the cover panel (40) and the protective film (30) may be improved.

[0183] Meanwhile, compared to the case where the silicon layer (SL) does not contain a second silicon-based compound, the present embodiment can improve the adhesion between the cover panel (40) and the protective film (30). That is, since the protective film (30) and the silicon layer (SL) contain materials having the same or similar properties, the protective film (30) and the silicon layer (SL) can have the same or similar properties. Accordingly, the adhesion between the protective film (30) and the silicon layer (SL) can be improved.

[0184] As such, the present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0185] 1: Display device 10: Display panel 30: Protective film 40: Cover panel SL: Silicon layer DPE: Display element P40: Spare cover panel OL: Organic layer PCSL: Pre-cushion layer SLFL: Silicon cambium layer PSL: Preliminary silicon layer

Claims

Claim 1 A display device comprising: a display panel including a display element; a protective film disposed below the display panel and including a first silicon-based compound; and a cover panel disposed below the protective film and including a silicon layer including a second silicon-based compound, wherein the silicon layer is in direct contact with the protective film. Claim 2 A display device according to claim 1, wherein the first silicon-based compound and the second silicon-based compound comprise the same material. Claim 3 A display device according to paragraph 2, wherein the first silicon-based compound and the second silicon-based compound comprise polydimethylsiloxane. Claim 4 In claim 1, the second silicon-based compound is different from the first silicon-based compound, display device Claim 5 In paragraph 4, the display device wherein the first silicon-based compound comprises polydimethylsiloxane. Claim 6 A display device according to claim 5, wherein the second silicon-based compound comprises at least one of silica and silsesquioxane. Claim 7 A display device according to claim 1, wherein the cover panel further comprises a cushion layer which is a foamed layer containing a plurality of voids disposed below the silicone layer. Claim 8 In claim 7, the cushion layer comprises at least one of a urethane-based compound and an epoxy-based compound, forming a display device. Claim 9 In claim 7, the display device, wherein the cushion layer comprises a light-blocking material. Claim 10 A display device according to claim 7, wherein the cover panel is disposed below the cushion layer and further comprises an organic layer comprising at least one of a polyimide resin, an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. Claim 11 A display device according to claim 10, wherein the cover panel is disposed below the organic layer and further comprises a metal layer comprising at least one of copper, nickel, ferrite, silver, and aluminum.

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