Substrate processing apparatus

Abstract

A substrate processing device comprising: a batch processing block for performing batch processing; a first posture conversion mechanism capable of converting a plurality of substrates that have finished batch processing from a vertical posture to a horizontal posture; a standby group for holding the plurality of substrates converted to a horizontal posture; a lifting mechanism for performing an exposure operation of positioning the substrates waiting in the standby group one by one above the standby group; a center robot capable of removing the substrates located above the standby group; and a single-wafer processing block having a single-wafer processing chamber for performing single-wafer processing on the substrates in the horizontal posture, wherein the center robot brings the substrates removed from above the standby group into the single-wafer processing chamber.

Description

Technology Field

[0001] This application claims priority to Japanese Patent Application No. 2025-017109 filed on February 4, 2025, the contents of said application are incorporated by reference in their entirety into this application.

[0002] The present invention relates to a substrate processing apparatus for performing a predetermined treatment on various substrates, such as semiconductor substrates, substrates for FPD (Flat Panel Display) such as liquid crystal displays or organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs. Background Technology

[0003] The apparatus of Patent Document 1 and Patent Document 2 comprises a batch module and a single-wafer module. The batch module is configured to perform a predetermined process on a plurality of substrates in a batch. The single-wafer module is configured to perform a predetermined process on one substrate at a time. The apparatus of Patent Document 1 is configured to first perform batch processing of substrates in the batch module, and then perform single-wafer processing of substrates in the single-wafer module.

[0004] The device of Patent Document 1 is equipped with a posture conversion device that converts the posture of a substrate from a vertical posture to a horizontal posture at the end of a batch module, and a horizontal substrate transport device that transports the substrate in a horizontal posture from the batch module to a single-wafer module.

[0005] The device of Patent Document 2 is equipped with the same attitude changing device and horizontal conveying device as above on the base of a batch-type module. Prior art literature

[0006] Japanese Published Patent Application No. 2024-47292 Japanese Published Patent Application No. 2024-106669 The problem to be solved

[0007] Conventional substrate processing equipment requires a horizontal transport device between the batch module and the single-wafer module. Installing this horizontal transport device results in the equipment becoming larger.

[0008] The present invention has been made in consideration of such circumstances, and its purpose is to provide a substrate processing device with a small footprint. means of solving the problem

[0009] The present invention takes the following configuration to solve the above problem.

[0010] That is, the substrate processing apparatus of the present invention is a substrate processing apparatus that continuously performs batch processing, which processes a plurality of substrates collectively, and single-wafer processing, which processes substrates one by one.

[0011] A batch processing block that performs batch processing, and

[0012] A first orientation conversion mechanism capable of converting multiple substrates, after batch processing is complete, from a vertical orientation to a horizontal orientation, and

[0013] A standby team holding multiple substrates converted to a horizontal position, and

[0014] A lifting mechanism that performs an exposure operation of positioning substrates waiting in the above standby unit one by one above the above standby unit, and

[0015] A center robot capable of transporting a substrate located above the above standby unit, and

[0016] A single-wafer processing block is provided with a single-wafer processing chamber for performing single-wafer processing on a substrate in a horizontal position, and

[0017] The above center robot brings the substrate removed from above the standby unit into the above single-wafer processing chamber.

[0018] It is characterized by that.

[0019] [Operation and Effect] According to the configuration described above, a center robot performs substrate transport from above the waiting room to the single-wafer processing chamber. Therefore, the present invention does not require a device for transporting a horizontally positioned substrate other than the center robot, as in conventional configurations. According to the present invention, a substrate transport device for transporting a horizontally positioned substrate is omitted, thereby providing a substrate processing device with a small footprint.

[0020] In addition, in the substrate processing device described above,

[0021] In the above batch processing block, a processing tank capable of immersing multiple substrates in a vertical position into a processing solution is aligned in a predetermined direction, and

[0022] A batch conveying robot capable of conveying a substrate that has finished processing in the processing tank toward the waiting tank in the predetermined direction, and

[0023] It is preferable that the center robot be located at a reference position separated from the standby team in a horizontal direction orthogonal to the predetermined direction.

[0024] [Operation and Effect] According to the configuration described above, the batch processing block is equipped with a processing tank capable of immersing multiple substrates in a vertical position in a processing solution, which is aligned in a predetermined direction, and a batch transport robot capable of transporting substrates that have finished processing in the processing tank toward a standby tank in a predetermined direction. The center robot is located at a reference position separated from the standby tank in a horizontal direction orthogonal to the predetermined direction. With this configuration, there is no need to separate the single-wafer processing block and the batch processing block in a predetermined direction, thereby allowing the length in the predetermined direction of the substrate processing device to be reduced.

[0025] In addition, in the substrate processing device described above,

[0026] In the above single-wafer processing block, the single-wafer processing chamber is aligned in the above predetermined direction, and

[0027] The above single-wafer processing chamber has a length in the above-mentioned predetermined direction that is a predetermined length, and

[0028] It is preferable that the center robot is capable of moving in the predetermined direction by a distance greater than or equal to the predetermined length from the reference position.

[0029] [Operation / Effect] According to the configuration described above, in the single-wafer processing block, the single-wafer processing chambers are aligned in a predetermined direction, the length of the single-wafer processing chambers in the predetermined direction is a predetermined length, and the center robot is capable of moving in the predetermined direction by a distance greater than the predetermined length from a reference position. By configuring it in this way, the number of single-wafer processing chambers in the substrate processing block can be easily increased.

[0030] In addition, in the substrate processing device described above,

[0031] It is preferable to provide a wet robot between the first single-wafer processing chamber and the second single-wafer processing chamber separated in the above-mentioned predetermined direction, which removes a substrate containing liquid from the first single-wafer processing chamber and conveys it to the second single-wafer processing chamber.

[0032] [Operation / Effect] According to the configuration described above, a wet robot is provided between a first single-wafer processing chamber and a second single-wafer processing chamber separated in a predetermined direction, which takes out a substrate (W) containing liquid from the first single-wafer processing chamber and transports it to the second single-wafer processing chamber. With this configuration, it is possible for the wet robot and the center robot to operate independently without interference.

[0033] In addition, in the substrate processing device described above,

[0034] It is preferable that the first single-wafer processing chamber be located closer to the reference position than the second single-wafer processing chamber.

[0035] [Operation and Effect] According to the configuration described above, the first single-wafer processing chamber is located closer to the reference position than the second single-wafer processing chamber. With this configuration, when the center robot moves the wet substrate from above the standby tank to the first single-wafer processing chamber, the travel distance of the substrate can be minimized. This makes it possible to provide a substrate processing device in which the center robot can transport the substrate while reliably maintaining the wet state.

[0036] In addition, in the substrate processing device described above,

[0037] It is preferable that the above-mentioned second sheet-wafer processing chamber performs a drying process using a supercritical fluid.

[0038] [Operation and Effect] According to the configuration described above, the second single-wafer processing chamber performs a drying process using a supercritical fluid. Thus, the present invention is suitable for a substrate processing apparatus using a supercritical fluid.

[0039] In addition, in the substrate processing device described above,

[0040] A preparatory team that receives the substrate returned by the above-mentioned batch return robot toward the above-mentioned atmosphere, and

[0041] It is desirable to have an auxiliary robot that conveys the substrate in the horizontal direction between the above-mentioned preparatory team and the above-mentioned standby team.

[0042] [Operation / Effect] According to the configuration described above, a preparatory unit is provided to receive substrates transported toward the waiting layer by a batch transport robot, and an auxiliary robot is provided to transport substrates horizontally between the preparatory unit and the waiting unit. With this configuration, substrates after batch processing can be reliably transported to the waiting unit.

[0043] In addition, in the substrate processing device described above,

[0044] A carrier robot that acquires substrates in bulk from a carrier that stores substrates stacked in a horizontal position, and

[0045] A second posture conversion mechanism that converts a substrate in a horizontal posture acquired by the above-mentioned carrier robot into a vertical posture, and

[0046] The above center robot is equipped with a substrate placement unit that stacks and places substrates that have finished single-wafer processing.

[0047] The above-described batch conveying robot is capable of conveying a substrate in a vertical position to which the second position changing mechanism has changed its position, and

[0048] It is desirable that the above carrier robot can collectively acquire substrates in a horizontal position stacked on the substrate placement section and store them in the carrier.

[0049] [Operation and Effect] According to the configuration described above, a carrier robot is provided to collectively acquire substrates from a carrier that stores substrates stacked in a horizontal position. This carrier robot can collectively acquire processed substrates stacked in a substrate storage area and store them in a carrier. By configuring it in this way, unprocessed substrates and processed substrates can be transported by the same robot, thereby providing a substrate processing device with a simple device configuration and a small footprint.

[0050] In addition, in the substrate processing device described above,

[0051] A storage shelf for storing the above carrier is provided,

[0052] The above standby unit is located in a position facing the above predetermined direction from the above storage shelf, and

[0053] It is preferable that the above standby group be located in a position facing the opposite direction of the above predetermined direction from the above batch processing block.

[0054] [Operation and Effect] According to the configuration described above, a storage shelf for storing carriers is provided, and a standby unit is located in a position facing a predetermined direction from the storage shelf, and the standby unit is located in a position facing the opposite direction from the batch processing block. By configuring it in this way, the standby unit can be placed at the base of the batch processing block, thereby providing a substrate processing device with a small footprint.

[0055] In addition, in the substrate processing device described above,

[0056] The above single-wafer processing chamber performs a drying process on the substrate, and

[0057] It is preferable that the above center robot be equipped with a wet hand for bringing a substrate in the air in the above standby unit into the single-wafer processing chamber, and a dry hand for removing a substrate that has finished drying from the single-wafer processing chamber.

[0058] [Operation and Effect] According to the configuration described above, the single-wafer processing chamber performs drying treatment on the substrate, and the center robot is equipped with a wet hand for bringing the substrate in the air from the standby tank into the single-wafer processing chamber, and a dry hand for removing the substrate after drying treatment from the single-wafer processing chamber. With this configuration, the substrate after drying treatment can be reliably removed from the single-wafer processing chamber.

[0059] In addition, in the substrate processing device described above,

[0060] A first passage adjacent to the above-mentioned batch processing block in the above-mentioned horizontal direction and accessible to the center robot, and

[0061] It is preferable to have a first chamber extending from the first passage away from the single-wafer processing block.

[0062] [Operation and Effect] According to the configuration described above, a first passage is provided that is horizontally adjacent to the batch processing block and is accessible to the center robot, and a first chamber is provided that extends from the first passage in a direction away from the single-wafer processing block. By configuring it in this way, a substrate processing device can be provided that allows for easy maintenance of the center robot, etc.

[0063] In addition, in the substrate processing device described above,

[0064] A second passage extending in the horizontal direction adjacent to the carrier robot, and

[0065] It is desirable to have a second chamber extended from the second passage toward the standby tank.

[0066] [Operation / Effect] According to the configuration described above, a second passage extending in a horizontal direction adjacent to the carrier robot and a second chamber extending from the second passage in a direction approaching the standby unit are provided. By configuring it in this way, a substrate processing device that can easily perform maintenance on the center robot, etc. can be provided. Effects of the invention

[0067] According to the present invention, a substrate processing device with a small footprint can be provided. Brief explanation of the drawing

[0068] FIG. 1 is a plan view illustrating the overall configuration of a substrate processing device related to an embodiment. FIG. 2 is a perspective view illustrating a transfer block related to an embodiment. FIG. 3 is a plan view illustrating a preliminary assembly of a substrate processing device related to an embodiment. FIG. 4 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 5 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 6 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 7 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 8 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 9 is a cross-sectional view illustrating the orientation change of a substrate in a substrate processing apparatus related to an embodiment. FIG. 10 is a cross-sectional view illustrating the orientation change of a substrate in a substrate processing apparatus related to an embodiment. FIG. 11 is a cross-sectional view illustrating the lifting operation of a substrate in a substrate processing apparatus related to an embodiment. FIG. 12 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 13 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 14 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 15 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 16 is a cross-sectional view illustrating substrate transport in a substrate processing apparatus related to an embodiment. FIG. 17 is a cross-sectional view illustrating the orientation change of a substrate in a substrate processing apparatus related to an embodiment. FIG. 18 is a cross-sectional view illustrating the orientation change of a substrate in a substrate processing apparatus related to an embodiment. FIG. 19 is a cross-sectional view illustrating the lifting operation of a substrate in a substrate processing apparatus related to an embodiment. FIG. 20 is a cross-sectional view illustrating the acquisition of a substrate by a center robot in a substrate processing apparatus related to an embodiment. FIG. 21 is a cross-sectional view illustrating the acquisition of a substrate by a center robot in a substrate processing apparatus related to an embodiment. FIG. 22 is a cross-sectional view illustrating the acquisition of a substrate by a center robot in a substrate processing apparatus related to an embodiment. FIG. 23 is a cross-sectional view illustrating the acquisition of a substrate by a center robot in a substrate processing apparatus related to an embodiment. FIG. 24 is a cross-sectional view illustrating the acquisition of a substrate by a center robot in a substrate processing apparatus related to an embodiment. FIG. 25 is a cross-sectional view illustrating the acquisition of a substrate by a center robot in a substrate processing apparatus related to an embodiment. FIG. 26 is a side view illustrating the configuration of a center robot related to an embodiment. FIG. 27 is a plan view illustrating the configuration of a center robot related to an embodiment. FIG. 28 is a plan view illustrating the configuration of a center robot related to an embodiment. FIG. 29 is a rear view illustrating a pass related to an embodiment. FIG. 30 is a side view illustrating a pass related to an embodiment. FIG. 31 is a plan view illustrating a maintenance area related to an embodiment. FIG. 32 is a flowchart illustrating the flow of a substrate related to an example. FIG. 33 is a plan view illustrating the flow of a substrate related to an embodiment. FIG. 34 is a plan view illustrating the flow of a substrate related to an embodiment. FIG. 35 is a plan view illustrating a configuration related to a first variant of the present invention. FIG. 36 is a plan view illustrating the flow of a substrate related to a first variant of the present invention. FIG. 37 is a plan view illustrating a configuration related to a first variant of the present invention. Specific details for implementing the invention

[0069] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The substrate processing apparatus of the present invention continuously performs batch processing, which processes a plurality of substrates in batches, and single-wafer processing, which processes substrates one by one, and has a batch processing block related to batch processing and a single-wafer processing block related to single-wafer processing.

[0070] Embodiment

[0071] <1. Overall Composition>

[0072] The substrate processing device of the present example is configured by being divided into a plurality of blocks. That is, the substrate processing device of the present example is equipped with a stoker block (3), a material transfer block (5), an orientation change block (6), a batch processing block (7), a single-wafer transfer block (4), and a single-wafer processing block (8).

[0073] A brief explanation of the stoker block (3) follows. The stoker block (3) manages a carrier (C) that stores multiple substrates (W), and transfers unprocessed substrates (W) stored in the carrier (C) to the transfer block (5), or stores processed substrates (W) in the carrier (C).

[0074] The carrier (C) is a container that accommodates substrates (W) arranged in a vertical direction in a horizontal position. For example, the carrier (C) is a closed-type FOUP (Front Opening Unify Pod). In the present invention, an open-type container may be adopted as the carrier (C). For example, the carrier (C) can accommodate 25 substrates arranged at a full pitch (1 cm interval).

[0075] A brief explanation of the transfer block (5) is provided. The transfer block (5) is configured to receive multiple substrates (W) from the stocker block (3) in bulk and change the orientation of the substrates (W) from a horizontal orientation to a vertical orientation. Additionally, the transfer block (5) combines two groups of 25 substrates arranged at full pitch to form a lot of 50 substrates (W) arranged at half pitch (5 mm intervals).

[0076] The batch processing block (7) is configured to perform chemical treatment on the substrate (W) for the lot.

[0077] The posture conversion block (6) is configured to convert the substrate (W) constituting the lot from a vertical posture to a horizontal posture after the liquid treatment of the lot.

[0078] The single-wafer return block (4) receives a substrate (W) in a horizontal position from the position change block (6) by the center robot (CR) and returns it to the single-wafer processing block (8).

[0079] The single-wafer processing block (8) is equipped with a plurality of single-wafer processing chambers (48) that perform a predetermined treatment, such as drying, on the substrate (W).

[0080] As can be seen by referring to FIG. 1, the stoker block (3), material transfer block (5), posture change block (6), and batch processing block (7) are arranged in a single column in this order. The direction in which the stoker block (3), material transfer block (5), posture change block (6), and batch processing block (7) are aligned corresponds to a predetermined direction of the present invention. In FIG. 1, the predetermined direction is shown as the X direction.

[0081] The orientation change block (6), single-wafer conveying block (4), and single-wafer processing block (8) are arranged in a single row in this order. The direction in which the orientation change block (6), single-wafer conveying block (4), and single-wafer processing block (8) are aligned corresponds to the horizontal direction of the present invention. In FIG. 1, the horizontal direction is shown as the Y direction. The predetermined direction and the horizontal direction are orthogonal to each other.

[0082] The X direction is defined as the front-back direction in FIG. 1. That is, the direction from the material block (5) toward the stocker block (3) is the front direction, and the opposite direction is the rear direction. Likewise, the Y direction is defined as the left-right direction in FIG. 1. That is, the direction from the orientation change block (6) toward the single-wafer transport block (4) is the right direction, and the opposite direction is the left direction. The Z direction is defined as the vertical direction in FIG. 1.

[0083] Next, the details of each block will be explained.

[0084] <2. Stalker Block>

[0085] The stoker block (3) is provided with a first load port (9) which is an inlet when a carrier (C) that stores multiple substrates (W) in a horizontal position at predetermined intervals in a vertical direction is inserted into the block. The first load port (9) is configured to protrude from the outer wall of the stoker block (3) that extends in the width direction (Y direction).

[0086] The internal structure of the stocker block (3) is described. The stocker block (3) is equipped with a return storage unit (ACB) for stocking and managing carriers (C). The return storage unit (ACB) is equipped with a carrier return mechanism (11) for returning carriers (C) and a shelf (13) for placing carriers (C). The number of carriers (C) that the stocker block (3) can stock is 1 or more.

[0087] The stocker block (3) has a plurality of shelves (13) for storing carriers (C). The shelves (13) are formed in a bulkhead that separates the stocker block (3) and the transfer block (5). The shelves (13) include a stock shelf (13b) for simply temporarily storing carriers (C), and a carrier storage shelf (13a) for removing substrates that is accessed by a handling robot (HTR) of the transfer block (5).

[0088] The carrier storage shelf (13a) is configured to accommodate a carrier (C) that stores multiple substrates in a horizontal position at a predetermined interval in the vertical direction. The carrier storage shelf (13a) is configured to accommodate a carrier (C) that is the target for extracting a substrate (W). In this embodiment, one carrier storage shelf (13a) is formed, but multiple carrier storage shelves (13a) may be formed. The carrier transport mechanism (11) takes a carrier (C) that stores unprocessed substrates (W) from the first load port (9) and places it on the carrier storage shelf (13a) for extracting substrates. At this time, the carrier transport mechanism (11) may temporarily place the carrier (C) on a stock shelf (13b) before placing it on the carrier storage shelf (13a). The number of carrier racks (13a) that the stoker block (3) has is 1 or more.

[0089] <3. Batch Processing Unit: Material Block>

[0090] The transfer block (5) is adjacent to the carrier storage shelf (13a). The transfer block (5) is positioned adjacent to the rear of the stocker block (3). The transfer block (5) is equipped with a handling robot (HTR) capable of accessing a carrier (C) placed on the carrier storage shelf (13a) for substrate extraction, an HVC posture conversion unit (23) that converts multiple substrates (W) from a horizontal posture to a vertical posture in batches, and a pusher mechanism (25). The HVC posture conversion unit (23) converts multiple substrates (W) from a horizontal posture to a vertical posture in batches. Additionally, the transfer block (5) has a substrate transfer position (PP) set for transferring multiple substrates (W) to and from a substrate transfer mechanism (WTR) formed in a batch transfer area (R4).

[0091] As shown in FIG. 2, the handling robot (HTR), the HVC posture conversion unit (23), and the pusher mechanism (25) are arranged in this order in the Y direction. The handling robot (HTR) has a hand (211) capable of gripping a substrate (W) in a horizontal position. The hand (211) can grip one substrate (W). The handling robot (HTR) has the hand (211) arranged in a vertical direction. The handling robot (HTR) can transport multiple substrates (W) at once by gripping the substrate with each of the hands (211). The moving support mechanism (213) is a mechanism that constitutes the handling robot (HTR) and is configured to rotate the hand (211) around a vertical axis, raise and lower the hand (211), move the hand (211) forward and backward in the forward direction (X), or move it laterally in the left and right direction (Y).

[0092] The handling robot (HTR) has 25 hands (211). The handling robot (HTR) conveys 25 substrates stored in the carrier (C) in batches by these hands.

[0093] The HVC posture conversion unit (23) is configured to convert a substrate (W) taken out of a carrier (C) by a handling robot (HTR) from a horizontal posture to a vertical posture. The HVC posture conversion unit (23) is equipped with a pair of support rods (231) and a pair of gripping rods (232) that extend in the vertical direction (Z direction). The support (237) has a support surface that extends in an XY plane to support the support rods (231) and gripping rods (232). The rotation drive mechanism (238) is configured to rotate the support rods (231) and gripping rods (232) together with the support (237) by 90°. Due to this rotation, the support rods (231) and gripping rods (232) are configured to extend in the left-right direction (Y direction).

[0094] The pusher mechanism (25) is equipped with a pusher (251) capable of arranging a substrate (W) in a vertical position in a horizontal direction. The pusher (251) is a half-pipe type that follows the curve of the bottom of the substrate (W). In the initial state, the pusher (251) has a U-groove (251a) forming the half-pipe extended in the left-right direction (Y). The pusher (251) in this state is capable of receiving the substrate (W) from the HVC position conversion unit (23).

[0095] The pusher shift mechanism (254) can move the pusher (251) in an initial state back and forth in the left and right direction (Y). The pusher shift mechanism (254) can bring the pusher (251) closer to the HVC attitude conversion unit (23) and can bring the pusher (251) closer to the substrate transport mechanism (WTR).

[0096] The pusher lifting mechanism (255) can raise the pusher (251) from the initial position to an upper position. Additionally, the pusher lifting mechanism (255) can return the pusher (251) from the upper position to the initial position.

[0097] The handling robot (HTR) describes how a horizontally positioned substrate (W) acquired from a carrier (C) is conveyed to a pusher (251). First, the handling robot (HTR) acquires a row of horizontally positioned substrates from the carrier (C) in a batch by directing the hand (211) in the forward direction. Then, the handling robot (HTR) rotates the hand (211) around a vertically extending rotation axis to direct the hand (211) toward the HVC position conversion unit (23), as shown in FIG. 2. Also, in FIG. 2, the substrate (W) held by the hand (211) is omitted.

[0098] After that, the hand (211) transfers the substrate heat to the HVC position conversion unit (23). At this time, the substrate (W) is held by a pair of support rods (231).

[0099] The HVC orientation conversion unit (23) that has acquired the substrate row operates the rotary driving mechanism (238) as shown by the arrow in FIG. 2 to change the orientation of the substrate (W) constituting the substrate row from a horizontal orientation to a vertical orientation. As a result, the substrate (W) in a horizontal orientation that was arranged in a vertical direction becomes a vertical orientation and is arranged in the left-right direction (Y) (horizontal direction). At this time, the substrate (W) is separated from the pair of support rods (231) and supported by a pair of clamping rods (232).

[0100] The pusher mechanism (25) moves the pusher (251) downward as shown in FIG. 2 before the rotational operation of the HVC position conversion unit (23) and waits until the substrate row arrives. Then, the pusher mechanism (25) raises the pusher (251) toward the substrate (W) supported by the clamping rod (232) as shown by the arrow in FIG. 2. Then, the substrate (W) is pushed up by the pusher (251), falls off the clamping rod (232), and is finally held only by the pusher (251). In this way, the pusher mechanism (25) obtains the substrate (W) from the HVC position conversion unit (23).

[0101] The pusher mechanism (25) can form a lot in which 50 substrates are arranged horizontally by repeating the acquisition of such a substrate row twice. The lot is composed of two substrates (W) of a carrier (C), and the arrangement pitch of the substrates (W) in the lot is half (5 mm) of the arrangement pitch of the substrates (W) in the carrier (C). In addition, in the substrate processing apparatus of the present invention, an operation of rotating the pusher (251) 180° around the vertical axis may be added between the first operation of acquiring the substrate row and the second operation of acquiring the substrate row.

[0102] The substrate heat support (33) is configured to temporarily stock the substrate heat consisting of a dried substrate. The substrate return mechanism (WTR) can hold the substrate heat prior to the chemical treatment in the substrate heat support (33) when the substrate heat stagnation occurs during the subsequent chemical treatment.

[0103] <4. Batch Processing Block>

[0104] As shown in FIG. 1, the batch processing block (7) is adjacent to the material block (5). The batch processing block (7) performs batch processing for the lot described above. The batch processing block (7) is divided into a batch processing area (R3) and a batch return area (R4) arranged in the width direction (Y direction). Each area extends in the front-back direction (X direction). Specifically, the batch processing area (R3) is located inside the batch processing block (7). The batch return area (R4) is adjacent to the batch processing area (R3) and is located at the far left of the batch processing block (7).

[0105] <5. Batch Processing Block : Batch Processing Area>

[0106] The batch processing area (R3) in the batch processing block (7) is a rectangular area extended in the front-back direction (X direction). One end (front side) of the batch processing area (R3) is adjacent to the orientation conversion block (6). The other end of the batch processing area (R3) extends in a direction away from the material block (5) and the orientation conversion block (6) (rear side). When transporting a substrate row from the batch processing block (7) to the orientation conversion block (6), a substrate transport mechanism (WTR) is used.

[0107] The substrate transport mechanism (WTR) transports multiple substrates (W) in a vertical position in batches between the material block (5), the batch processing unit (BPU1 to BPU5), and the preparatory group (65) of the position conversion block (6). The batch transport area (R4), which is the area where the substrate transport mechanism (WTR) can move, extends in the Y direction along the left end of the position conversion block (6).

[0108] The substrate transport mechanism (WTR) can transport the substrate (W) that has finished processing in the batch processing unit (BPU) in the X direction toward the waiting group (55) described later. The substrate transport mechanism (WTR) corresponds to the batch transport robot of the present invention.

[0109] In the batch processing block (7), a batch processing unit (BPU) capable of immersing a plurality of substrates (W) in a vertical position into a processing solution is aligned in the X direction. The batch processing unit (BPU) corresponds to the processing tank of the present invention.

[0110] The batch processing area (R3) is equipped with a batch processing unit that primarily performs batch processing. Specifically, the batch processing area (R3) has a plurality of batch processing units (BPU1 to BPU5) arranged in the direction in which the batch processing area (R3) extends to immerse and process a plurality of substrates (W) in a batch. The batch processing units (BPU1 to BPU5) immerse and process a plurality of substrates in a vertical position in a batch. The arrangement of the batch processing units (BPU1 to BPU5) will be described in detail. The first batch processing unit (BPU1) is adjacent to the rear of the position change block (6). The second batch processing unit (BPU2) is adjacent to the rear of the first batch processing unit (BPU1). The third batch processing unit (BPU3) is adjacent to the rear of the second batch processing unit (BPU2). The fourth batch processing unit (BPU4) is adjacent to the rear of the third batch processing unit (BPU3). The fifth batch processing unit (BPU5) is adjacent to the rear of the fourth batch processing unit (BPU4). Thus, the first batch processing unit (BPU1), the second batch processing unit (BPU2), the third batch processing unit (BPU3), the fourth batch processing unit (BPU4), and the fifth batch processing unit (BPU5) are arranged in this order so as to be far from the attitude conversion block (6).

[0111] A batch treatment tank is a liquid tank that holds a chemical solution or pure water. The chemical solution may be an acidic aqueous solution, for example, an aqueous phosphoric acid solution. In this specification, the chemical solution and pure water are collectively referred to as the treatment solution. A batch treatment tank that holds a chemical solution is called a batch chemical solution treatment tank (CHB2 to CHB5), and a batch treatment tank that holds pure water is called a batch rinse treatment tank (ONB).

[0112] The second batch processing unit (BPU2) specifically comprises a batch chemical treatment tank (CHB2) that processes a series of substrates in a batch, and a lifter (LF2) that raises and lowers the series of substrates between a substrate transfer position and a chemical treatment position. The substrate transfer position is a position set above the batch chemical treatment tank (CHB2) where a substrate transport mechanism (WTR) can access, and the chemical treatment position is a position set within the tank of the batch chemical treatment tank (CHB2) where the series of substrates can be immersed in a chemical solution. The batch chemical treatment tank (CHB2) performs acid treatment on the series of substrates. The acid treatment may be phosphoric acid treatment, but may also be a treatment using other acids. Phosphoric acid treatment performs etching treatment on a plurality of substrates (W) constituting the series of substrates. The etching treatment chemically etches, for example, a nitride film on the surface of the substrate (W).

[0113] A batch chemical treatment tank (CHB2) contains an acid solution, such as a phosphoric acid solution. A lifter (LF2) is installed in the batch chemical treatment tank (CHB2) to move the substrate column up and down. The lifter (LF2) moves up and down in the vertical direction (Z direction). Specifically, the lifter (LF2) moves up and down between a processing position corresponding to the inside of the batch chemical treatment tank (CHB2) and a transfer position corresponding to the upper part of the batch chemical treatment tank (CHB2). The lifter (LF2) maintains a substrate column consisting of a substrate (W) in a vertical position. At the transfer position, the lifter (LF2) transfers the substrate column with a substrate transport mechanism (WTR). When the lifter (LF2) descends from the transfer position to the processing position while maintaining the substrate column, the entire surface of the substrate (W) is located below the liquid level of the chemical solution. When the lifter (LF2) rises from the processing position to the transfer position while maintaining the substrate heat, the entire surface of the substrate (W) is positioned on the liquid surface of the chemical solution. The lifter (LF2) can immerse multiple substrates in a vertical position, which have been converted by the HVC position conversion unit (23), into the batch processing tank in batches. At this time, the lifter (LF2) descends from the transfer position to the processing position.

[0114] The third batch processing unit (BPU3) specifically comprises a batch chemical treatment tank (CHB3) and a lifter (LF3) that raises and lowers the substrate column between the substrate transfer position and the chemical treatment position. The batch chemical treatment tank (CHB3) has the same configuration as the batch chemical treatment tank (CHB2) described above. In short, the batch chemical treatment tank (CHB3) contains the chemical described above and is equipped with a lifter (LF3). The batch chemical treatment tank (CHB3) performs the same treatment on the substrate column as the batch chemical treatment tank (CHB2). The batch processing block (7) of the present example is provided with a plurality of treatment tanks capable of performing the same chemical treatment. This is because phosphoric acid treatment requires more time than other treatments. Phosphoric acid treatment requires a long time (e.g., 60 minutes). Therefore, the apparatus of the present example is configured to allow acid treatment to be performed in parallel by a plurality of batch chemical treatment tanks.

[0115] The fourth batch processing unit (BPU4) and the fifth batch processing unit (BPU5) have the same configuration as the second batch processing unit (BPU2) and the third batch processing unit (BPU3). That is, the fourth batch processing unit (BPU4) is equipped with a batch chemical treatment tank (CHB4) and a lifter (LF4) that raises and lowers the substrate heat between the substrate transfer position and the chemical treatment position. Likewise, the fifth batch processing unit (BPU5) is equipped with a batch chemical treatment tank (CHB5) and a lifter (LF5) that raises and lowers the substrate heat between the substrate transfer position and the chemical treatment position. Accordingly, the substrate heat is acid-treated in any of the batch chemical treatment tanks (CHB2) to the batch chemical treatment tank (CHB5). By performing chemical treatment in parallel by four processing units in this way, the throughput of the device is increased.

[0116] The first batch processing unit (BPU1) specifically comprises a batch rinse processing tank (ONB) that receives rinse liquid and a lifter (LF1) that raises and lowers the substrate heat between the substrate transfer position and the rinse position. The substrate transfer position is a position set above the batch rinse processing tank (ONB) where the substrate transport mechanism (WTR) can access, and the rinse position is a position set within the tank of the batch rinse processing tank (ONB) where the substrate heat can be immersed in the rinse liquid. The batch rinse processing tank (ONB) has the same configuration as the batch chemical treatment tank (CHB2) described above. That is, the batch rinse processing tank (ONB) receives rinse liquid and is equipped with a lifter (LF1). Unlike other processing tanks, the batch rinse processing tank (ONB) receives pure water and is formed for the purpose of cleaning the chemical liquid attached to a plurality of substrates (W). In the batch rinse treatment tank (ONB), when the resistivity of the pure water in the tank rises to a predetermined value, the cleaning treatment is terminated.

[0117] In this way, the batch rinse treatment tank (ONB) in this embodiment is located closer to the position change block (6) than the batch chemical treatment tank (CHB2) to the batch chemical treatment tank (CHB5). By configuring it in this manner, the various mechanisms constituting the position change block (6) and the batch chemical treatment tank (CHB2) to the batch chemical treatment tank (CHB5) are kept as far apart as possible, so that the position change block (6) is not adversely affected by acids such as phosphoric acid. In addition, by positioning the position change block (6) and the batch rinse treatment tank (ONB) in close proximity, the substrate row after the rinse treatment is completed is transported only a short distance and immediately brought into the position change block (6). Therefore, according to the configuration of this embodiment, the transport of the substrate (W) can be completed quickly while maintaining the wet state of the substrate (W).

[0118] <6. Batch Processing Block: Batch Return Area>

[0119] The batch return area (R4) in the batch processing block (7) is a rectangular area extended in the front-back direction (X direction). The batch return area (R4) is formed along the outer edge of the batch processing area (R3), with one end extending to the material transfer block (5) and the other end extending away from the material transfer block (5). Accordingly, the batch return area (R4) is configured to correspond to the position change block (6) located between the material transfer block (5) and the batch processing block (7).

[0120] In the batch transport area (R4), a substrate transport mechanism (WTR) is formed to transport multiple substrates (W) in batches. The substrate transport mechanism (WTR) transports a series of substrates in batches between a substrate transfer position (PP) determined within the material block (5), a substrate column support (33), each batch processing unit (BPU1 to BPU5), and a preparatory group (65) in the position conversion block (6) described later. The substrate transport mechanism (WTR) is configured to be reciprocating in the forward and backward direction (X direction) across the material block (5), the position conversion block (6), and the batch processing block (7). In addition to the batch transport area (R4) in the batch processing block (7), the substrate transport mechanism (WTR) can also move to the substrate transfer position (PP) within the material block (5), the substrate column support (33), and the preparatory group (65) within the position conversion block (6).

[0121] The substrate transport mechanism (WTR) is equipped with a pair of chucks (29) for transporting a substrate column. The pair of chucks (29) can change between a closed state where they are close to each other and an open state where they are separated from each other. The chucks (29) are members extending in the Y direction, with grooves for gripping the substrate (W) arranged at a full pitch (the same pitch as the substrate column). The pair of chucks (29) are in a closed state and receive a plurality of substrates (W) constituting the substrate column. Then, the pair of chucks (29) are in an open state and transfer the plurality of substrates (W) constituting the substrate column to another member (lifter (LF1), etc.). The substrate transport mechanism (WTR) transfers the substrate column between the substrate transfer position (PP) and the substrate column support part (33) in the material transfer block (5), and the lifter (LF65) of the preparatory group (65) in the position change block (6). In addition to these, the substrate transport mechanism (WTR) exchanges substrate heat with each lifter (LF1 to LF5) belonging to the batch processing unit (BPU1 to BPU5) in the batch processing block (7).

[0122] In the batch transfer area (R4), a guide rail (31X) extending in the X direction is provided to guide the substrate transfer mechanism (WTR). The substrate transfer mechanism (WTR) can move back and forth in the X direction along the guide rail (31X). Accordingly, the guide rail (31X) extends from the batch processing block (7) through the position change block (6) to the material transfer block (5). More specifically, the guide rail (31X) faces the substrate transfer position (PP) in the material transfer block (5) from the Y direction and faces the fifth batch processing unit (BPU5) in the batch processing block (7) from the Y direction. In addition to these, the guide rail (31X) faces the substrate heat support (33) in the material block (5), the preparatory unit (65) in the position change block (6), and the first batch processing unit (BPU1) to the fifth batch processing unit (BPU5) in the batch processing block (7) from the Y direction.

[0123] <7. Posture Transformation Block>

[0124] The orientation change block (6) has the function of changing the orientation of the substrate (W) that has received batch processing from the batch processing block (7) and relaying it to the single-wafer transport block (4).

[0125] The posture conversion block (6) is equipped with a preparatory tank (65) that immerses a lot in pure water, and a standby tank (55) that receives a plurality of substrates (W) arranged in the Y direction and converts the posture of the plurality of substrates (W) from a vertical posture to a horizontal posture by collectively rotating the received substrates (W) 90° underwater. The preparatory tank (65) and the standby tank (55) are arranged in the Y direction. The substrate transport mechanism (WTR) described above is accessible to the preparatory tank (65), and the center robot (CR) described above is accessible to the standby tank (55).

[0126] <8. Posture Change Block: Preliminary Group>

[0127] The preparatory tank (65) immerses the lot that has finished batch processing into pure water. The preparatory tank (65) has the same configuration as the first batch processing unit (BPU1) of the batch processing block (7). That is, the preparatory tank (65) has a lifter (LF65) that maintains pure water and raises the lot. The lifter (LF65) can reciprocate between an overhead position for acquiring the lot from the substrate transport mechanism (WTR) and an immersion position for immersing the received lot into pure water. The overhead position is above the preparatory tank (65), and the immersion position is inside the preparatory tank (65). The overhead position is set so that the entire surface of the substrate (W) constituting the lot is in the air, and the immersion position is set so that the entire surface of the substrate (W) constituting the lot is immersed in pure water.

[0128] The reserve group (65) accepts the lot that the substrate return mechanism (WTR) returns to the standby group (55).

[0129] <9. Posture Change Block: Assistive Robot>

[0130] The auxiliary robot (STR) classifies the lot immersed in the preparatory unit (65) into a first substrate (W1) and a second substrate (W2). The auxiliary robot (STR) can transport 25 substrates (W) arranged in full pitch between the preparatory unit (65) and the standby unit (55). 50 substrates (W) arranged in half pitch are kept in the preparatory unit (65), and the auxiliary robot (STR) picks up half of them, 25 substrates, and transports them to the standby unit (55). The auxiliary robot (STR) has a pair of chucks (30) identical to the pair of chucks (29) in the substrate transport mechanism (WTR). The chucks (30) have grooves formed at half-pitch intervals, just like the chucks (29), but differ from the chucks (29) in that two types of grooves are arranged alternately. That is, in the chuck (30), deep grooves that cannot grip the substrate and shallow grooves that grip the substrate are alternately arranged at half-pitch intervals. Therefore, when the auxiliary robot (STR) attempts to grip the lot in the lifter (LF65), 25 substrates (W) are picked up by the shallow grooves that can grip the substrate (W), and the remaining 25 substrates (W) are left in the lifter (LF65) without touching the deep grooves. Since the shallow grooves in the chuck (30) are arranged at a pitch twice the half-pitch (full pitch), the auxiliary robot (STR) picks up the 25 substrates (W) arranged at the full pitch from the lot in the lifter (LF65). In the lot, from the perspective that the substrates (W) are arranged in a face-to-face manner, the picked-up substrate (W) is arranged so that the surface (device surface) is on the right and the back surface is on the left so that the device surface of the adjacent substrate (W) does not face each other.Meanwhile, the 25 substrates (W) that remain in the lifter (LF65) without being picked up are arranged so that the surface (device surface) is on the left and the back surface is on the right, so that the device surfaces of adjacent substrates (W) do not face each other.

[0131] A pair of chucks (30) having an auxiliary robot (STR) can take two states, such as a closed state where the chucks (30) are close to each other in the X direction, and an open state where the chucks (30) are separated from each other in the X direction, just like the chuck (29) of the substrate transport mechanism (WTR). When the pair of chucks (30) are in a closed state, the chucks (30) are sufficiently close to each other in relation to the diameter of the substrate (W), so two points on the lower part of the substrate (W) come into contact with each of the chucks (30). In this way, the substrate (W) is gripped by the pair of chucks (30). When the pair of chucks (30) in the closed state are opened, the chucks (30) are sufficiently separated from each other in relation to the diameter of the substrate (W), so the substrate (W) is released from the chucks (30). The case in which a pair of chucks (30) are in an open state is, specifically, before receiving a plurality of substrates (W) from a lifter (LF65) in an upper position, and when transferring a plurality of substrates (W) described in FIG. 7 and FIG. 15 to an inversion chuck (71).

[0132] The posture change block (6) is provided with a guide rail (31Y) extended in the Y direction to guide the auxiliary robot (STR). The auxiliary robot (STR) can move back and forth in the Y direction along the guide rail (31Y). Accordingly, the guide rail (31Y) extends from the reserve team (65) to the standby team (55).

[0133] The auxiliary robot (STR) is guided by the guide rail (31Y) and can move back and forth from an overhead position, which is a location for transferring lots of the lifter (LF65), to a pair of inversion chucks (71) waiting above a standby unit (55) described later, which is located to the right of the overhead position. By doing so, the auxiliary robot (STR) can transport multiple substrates (W) in the Y direction from the overhead position to the overhead position of the standby unit. Additionally, the auxiliary robot (STR) can move to the overhead position of the standby unit so as not to interfere with the substrate transport mechanism (WTR) when the substrate transport mechanism (WTR) moves from the material transfer block (5) to the batch processing block (7) (see FIG. 3).

[0134] The auxiliary robot (STR) carries the substrate (W) in the X direction between the reserve team (65) and the standby team (55).

[0135] <10. Posture Transformation Block: Standby Team>

[0136] The standby tank (55) converts a plurality of substrates (W) received from the batch processing block (7) from a vertical position to a horizontal position. The standby tank (55) converts the classified first substrate (W1) and second substrate (W2) from a vertical position to a horizontal position in batches. The standby tank (55) maintains a liquid (pure water or a liquid to which IPA (Isopropyl Alcohol) is added) and above it, there is a pair of inversion chucks (71) and a pair of inversion chuck support mechanisms (72) that maintain each of the inversion chucks (71) and raise and lower and rotate the pair of inversion chucks (71). The inversion chucks (71) can be raised and lowered into the liquid of the standby tank (55) from a substrate transfer position with an auxiliary robot (STR) set on the liquid surface of the standby tank (55). The inversion chuck (71) can immerse a plurality of substrates (W) received from the auxiliary robot (STR) in the standby tank (55) and rotate them 90° in one direction or the opposite direction. The position of the plurality of substrates (W), which are in a vertical position, is converted to a horizontal position by rotating a pair of inversion chucks (71). The standby tank (55) is configured to hold the plurality of substrates (W), which have been converted to a horizontal position, in the liquid. The standby tank (55) is located behind the carrier storage shelf (13a) and in front of the batch processing block (7).

[0137] The inversion chuck (71) can change state between a closed state, which is capable of holding multiple substrates (W) by the operation of a pair of inversion chuck support mechanisms (72), and an open state, which is capable of opening the held multiple substrates (W). Additionally, the inversion chuck (71) can rotate 90° in one direction and the opposite direction while maintaining the positional relationship between them by the operation of a pair of inversion chuck support mechanisms (72). Furthermore, the inversion chuck (71) is capable of ascending from above the standby tank (55) to the liquid of the standby tank (55) while maintaining the positional relationship between them by the operation of a pair of inversion chuck support mechanisms (72). The inversion chuck (71) is capable of converting multiple substrates (W) that have finished batch processing from a vertical position to a horizontal position and corresponds to the first position conversion mechanism of the present invention.

[0138] The inversion chuck support mechanism (72) is described in detail. A pair of inversion chuck support mechanisms (72) operate synchronously to perform an inversion operation that rotates the inversion chuck (71) by at least 180° without changing the relative position of the pair of inversion chucks (71), a lifting operation that raises and lowers the inversion chuck (71) without changing the relative position of the pair of inversion chucks (71), and an opening and closing operation that brings the pair of inversion chucks (71) closer and further apart. Accordingly, the inversion chuck support mechanism (72) is composed of each mechanism regarding the inversion operation, the lifting operation, and the opening and closing operation. The inversion chuck support mechanism (72) is equipped with an inversion mechanism (72a) that performs the inversion operation of the inversion chuck (71), a lifting mechanism (72b) that performs the lifting operation of the inversion chuck (71), and an opening and closing mechanism (72c) that performs the opening and closing operation of the inversion chuck (71). The lifting mechanism (72b) performs an exposure operation to position the substrates (W) waiting in the standby group (55) one by one above the standby group (55).

[0139] The inversion chuck (71) has a comb-like shape in which a plurality of V-grooves (71a) are formed at full pitch intervals, and a pair of inversion chucks (71) hold a plurality of substrates (W) from both sides by inserting a plurality of substrates (W) into the V-grooves. When the inversion chuck (71) is closed by the opening / closing mechanism (72c) of the inversion chuck support mechanism (72), each end of the substrate comes into contact with the deepest part of the V-grooves, and in this state, even if the inversion chuck (71) is rotated, the substrate (W) does not slide off from the inversion chuck (71). When the inversion chuck (71) is opened by the opening / closing mechanism (72c) of the inversion chuck support mechanism (72), the substrate (W) can be received from an auxiliary robot (STR) that is waiting above the standby unit (55) while holding the plurality of substrates (W). In addition, the inversion chuck (71) may take a state between a closed state and an open state (half-open state), but this state will be described later.

[0140] Details of the inversion mechanism (72a) and the lifting mechanism (72b) of the inversion chuck support mechanism (72) will be described later.

[0141] <11. Actions of the Posture Transformation Block>

[0142] FIG. 4 shows a lifter (LF65) holding multiple substrates (W) at an overhead position set above the preparatory unit (65). The transport of the substrates to the overhead position is performed by a substrate transport mechanism (WTR). The multiple substrates (W) placed on the lifter (LF65) are arranged in a face-to-face manner, with substrates (W) facing to the right and substrates (W) facing to the left being alternately arranged.

[0143] At this time, when the lifter (LF65) descends from the upper position to the immersion position, it is possible to prevent the substrate (W) waiting to be transported from drying out while transporting the substrate (W) one by one in the attitude change block (6).

[0144] FIG. 4 shows a scene in which multiple substrates (W) are transferred collectively from a lifter (LF65) to an auxiliary robot (STR) in order to transfer multiple substrates (W) to a standby team (55). At this time, the lifter (LF65) supports the multiple substrates (W) in an overhead position, and the auxiliary robot (STR) moves a pair of chucks (30) to a position where the lot can be held, thereby closing the chucks (30). At this time, as described above, the chucks (30) can only hold half of the multiple substrates (W) arranged in a half-pitch constituting the lot. Consequently, the lot is in a state where substrates (W) held by the chucks (30) and substrates (W) not held by the chucks (30) are arranged alternately.

[0145] FIG. 5 shows the state when the lifter (LF65) is lowered from the upper position to the immersion position. When the lifter (LF65) is lowered from the state of FIG. 4, a number of substrates (W) arranged in full pitch corresponding to half of the number of substrates (W) constituting the lot remain on the auxiliary robot (STR), and the remaining half of the substrates (W) are returned to the reserve group (65) in a state arranged in full pitch on the lifter (LF65). The number of substrates (W) remaining on the auxiliary robot (STR) have their device surfaces facing to the right, and the number of substrates (W) maintained at the immersion position by the lifter (LF65) have their device surfaces facing to the left.

[0146] FIG. 6 shows the state after the auxiliary robot (STR) has transported multiple substrates (W) to the upper part of the standby unit (55). At this time, a pair of inversion chucks (71) are positioned above the auxiliary robot (STR), and the rotation angle is 0°, which is the initial state. The inversion chucks (71) in the initial state are extended in the horizontal direction, making it possible to receive multiple substrates (W) in a vertical position.

[0147] FIG. 7 shows the inversion chuck (71) descending to the auxiliary robot (STR) thereafter. The operation of this inversion chuck (71) is realized by the lifting mechanism (72b) of the inversion chuck support mechanism (72). FIG. 7 shows 25 substrates (W) being transferred from the chuck (30) of the auxiliary robot (STR) to the inversion chuck (71). That is, a pair of inversion chucks (71) descend to the auxiliary robot (STR) while maintaining an open state, and then become closed. Since the pair of inversion chucks (71) in the open state are spaced apart enough to allow the substrates (W) to pass through, they can approach the chuck (30) without contacting the substrates (W). After that, the inversion chuck (71) is closed by the operation of the opening / closing mechanism (72c) in the inversion chuck support mechanism (72) and holds 25 substrates (W). At this time, the 25 substrates (W) are held by both the chuck (30) and the inversion chuck (71). After that, the chuck (30) is opened and ejected in the Y direction (left direction). In this way, the transfer of substrates (W) from the chuck (30) to the inversion chuck (71) is executed. FIG. 8 shows the state in which 25 substrates (W) are transferred to the inversion chuck (71). As indicated by the arrow in FIG. 8, the inversion chuck (71) is lowered to below the liquid level of the standby tank (55) and the 25 substrates (W) are immersed in the pure water maintained by the standby tank (55).

[0148] FIG. 9 shows the inversion chuck (71) rotating 90° while immersing 25 substrates (W) in pure water. This operation of the inversion chuck (71) is realized by the inversion mechanism (72a) of the inversion chuck support mechanism (72). FIG. 10 shows the inversion chuck (71) after completing a 90° rotation. In this way, the device surface of the 25 substrates (W) immersed in the standby tank (55) and facing the Y direction (left direction) is rotated 90° and faces upward. By tilting the substrate (W) in this manner, the orientation of the substrate (W) can be changed to a horizontal position with the device surface facing upward. Subsequently, the substrate (W) in the horizontal position is transported with the device surface facing upward.

[0149] FIG. 11 shows the state after the inversion chuck (71) moves one of the 25 substrates (W) onto the liquid surface of the standby tank (55). The operation of this inversion chuck (71) is realized by the lifting mechanism (72b) of the inversion chuck support mechanism (72). According to FIG. 11, there is only one substrate (W) on the liquid surface, and the remaining 24 substrates (W) are below the liquid surface in the standby tank (55). By configuring it in this way, the 24 substrates (W) do not dry out during the transport standby. The one substrate (W) on the liquid surface is transported to the single-wafer processing chamber (48) by the center robot (CR) while maintaining a horizontal position with a pure water puddle formed on its upper surface. When this operation is repeated, all 25 substrates (W) are transported to the single-wafer processing chamber (48) by the center robot (CR).

[0150] In this way, the lifting mechanism (72b) of the present example is configured to perform an exposure operation of positioning one substrate (W) waiting in the standby group (55) at a time above the standby group (55).

[0151] The opening and closing operation of the inversion chuck (71) in each state of FIGS. 4 to FIGS. 11 will be explained. As described above, in the state of FIGS. 4 to FIGS. 6, the pair of inversion chucks (71) is in an open state and is not in a state where it can grip the substrate (W). Since the inversion chuck (71) in the open state can pass through the substrate (W), the inversion chuck (71) can move to the position shown in FIG. 6B without colliding with the substrate (W). In FIG. 7, the pair of inversion chucks (71) are switched from an open state to a closed state. At this time, each of the V-grooves of the pair of inversion chucks (71) allows each end of the 25 substrates (W) arranged in full pitch to enter and come into contact with each other. Since the V-grooves are arranged in full pitch, the 25 substrates (W) arranged in full pitch easily enter each V-groove. The appearance of the substrate (W) entering each V groove is explained in detail in FIG. 22. In FIG. 8 to FIG. 10, the pair of inversion chucks (71) are in a closed state and are gripping the substrate (W). In this state, even if the inversion chucks (71) are rotated, the gripping substrate (W) will not be dropped.

[0152] In order to realize the state of FIG. 11, it is necessary to allow the substrate (W) to be transported to the center robot (CR) while preventing the substrate (W) waiting in the standby group (55) from falling. Thus, according to the present embodiment, in the state of FIG. 11, a pair of inversion chucks (71) are in a half-open state. This realizes a state in which the substrate (W) is supported so that it can be ejected. The half-open state is explained in detail in FIGs. 24 and 25.

[0153] FIG. 12 shows the lifter (LF65) holding a plurality of substrates (W) at an overhead position set above the preparatory unit (65). The transport of the substrates to the overhead position is performed by a substrate transport mechanism (WTR). The 25 substrates (W) placed on the lifter (LF65) are arranged in full pitch with the device surface facing to the right. These substrates (W) are the substrates (W) left on the preparatory unit (65) in FIG. 5. After FIG. 12, the appearance when transporting these 25 substrates (W) is described. Also, FIG. 12 shows the appearance when the horizontal substrate transport described in FIG. 11 is completed and a pair of inversion chucks (71) return to the initial state shown in FIG. 4. A pair of inversion chucks (71) in the initial state can be extended in the Y direction to introduce a substrate (W) in a vertical position and are positioned above the standby group (55).

[0154] FIG. 13 is a drawing corresponding to FIG. 5 described above, showing 25 substrates (W) being transferred to the chuck (30) of the auxiliary robot (STR). FIG. 14 is a drawing corresponding to FIG. 6 described above, showing the state when the auxiliary robot (STR) moves the 25 substrates (W) to a position where they are sandwiched between the standby unit (55) and a pair of inversion chucks (71). FIG. 15 is a drawing corresponding to FIG. 7 described above, showing the state when 25 substrates (W) are transferred from the auxiliary robot (STR) to a pair of inversion chucks (71). FIG. 16 is a drawing corresponding to FIG. 8 described above, showing the state when the 25 substrates (W) supported by a pair of inversion chucks (71) are above the standby unit (55).

[0155] FIG. 17 shows the inversion chuck (71) rotating -90° while immersing 25 substrates (W) in pure water. This operation of the inversion chuck (71) is realized by the inversion mechanism (72a) of the inversion chuck support mechanism (72). FIG. 18 shows the inversion chuck (71) after completing the -90° rotation. In this way, the device surface of the 25 substrates (W) immersed in the standby tank (55) and facing the Y direction (left direction) is rotated 90° and faces upward. By tilting the substrate (W) in this manner, the orientation of the substrate (W) can be changed to a horizontal position with the device surface facing upward. Subsequently, the substrate (W) in the horizontal position is transported with the device surface facing upward.

[0156] FIG. 19 is a drawing corresponding to FIG. 11 described above, showing a state in which a pair of inversion chucks (71) are half-opened while only the substrate (W) at the top position is exposed on the liquid surface of the standby tank (55). This movement of the substrate (W) is realized by the lifting mechanism (72b) of the inversion chuck support mechanism (72). Subsequently, the lifting mechanism (72b) raises the pair of inversion chucks (71) to a height corresponding to the full pitch. By repeating this operation, all 25 substrates (W) are transported to the single-wafer processing chamber (48) by the center robot (CR).

[0157] FIG. 20 shows a center robot (CR) acquiring a substrate (W) in a horizontal position above a standby unit (55). The hand (103) of the center robot (CR) can access the area above the standby unit (55) and acquire the substrate (W) held in the inversion chuck (71). FIG. 20 also shows the center robot (CR) acquiring the first substrate (W1) shown in FIG. 11. Likewise, FIG. 21 shows the center robot (CR) acquiring the second substrate (W2) shown in FIG. 19. The center robot (CR) can retrieve the substrate (W) located above the standby unit (55).

[0158] The half-open state of the pair of inversion chucks (71) is described. FIG. 22 is a cross-sectional view illustrating the appearance immediately after 25 substrates (W) have been rotated 90° or -90° as shown in FIG. 10 and FIG. 18. At this time, the pair of inversion chucks (71) is in a closed state, and both ends of the substrates (W) have reached the deepest part of the V-groove (71a). When the pair of inversion chucks (71) press both ends of the substrates (W) to fix the substrates (W) in this way, the 25 substrates (W) do not slide off from the pair of inversion chucks (71). Also, in FIG. 22 and the subsequent FIG. 23 to FIG. 25, the liquid level in the standby tank (55) is omitted.

[0159] FIG. 23 is a cross-sectional view corresponding to FIG. 20 and FIG. 21 described above. A pair of inversion chucks (71) are closed, and a hand (103) of a center robot (CR) is inserted between the substrates (W).

[0160] FIG. 24 shows the appearance of a pair of inversion chucks (71) that were in a closed state, when they are slightly displaced and become half-open. When the pair of inversion chucks (71) are in a half-open state, both ends of the substrate (W) move from the deepest part of the V-groove and come into contact with the wall forming the V-groove. In this state, the substrate (W) does not slide off the inversion chuck (71) unless the inversion chuck (71) is rotated, and the substrate (W) itself is not fixed to the inversion chuck (71). Therefore, when the pair of inversion chucks (71) are in a half-open state, it becomes possible to transfer one substrate (W) to the hand (103) on the liquid surface while holding the substrate (W) waiting in the liquid. This operation of the inversion chucks (71) is performed by an opening / closing mechanism (72c).

[0161] However, in the state of FIG. 24, since the hand (103) is not yet in contact with the substrate (W), in order to transfer the substrate (W) to the hand (103), it is necessary to lower the substrate (W) relative to the hand (103).

[0162] FIG. 25 is a cross-sectional view corresponding to FIG. 20 and FIG. 21 described above. FIG. 25 shows that a pair of inversion chucks (71) are lowered slightly from the state of FIG. 24 so that the substrate (W) comes into contact with the hand (103). In the state of FIG. 25, the substrate (W) is placed on the hand (103) and is positioned away from the wall of the V-groove (71a) of the inversion chuck (71). That is, in the state of FIG. 25, the substrate (W) is not in contact with the inversion chuck (71). Therefore, when the hand (103) is withdrawn in this state, the substrate (W) is withdrawn from above the standby unit (55) without coming into contact with the inversion chuck (71).

[0163] Additionally, FIG. 25 describes a configuration in which a substrate (W) is transferred by lowering a pair of inversion chucks (71) relative to a hand (103). However, even if this specific example is not used, the same transfer of the substrate (W) can be performed if the relative positional relationship between the inversion chucks (71) and the hand (103) in the Z direction changes. For example, even if the hand (103) is slightly raised relative to the pair of inversion chucks (71) from the state of FIG. 24, the same transfer of the substrate (W) as described in FIG. 25 is possible.

[0164] <12. Single-Wafer Return Block>

[0165] Referring to FIG. 1, a single-wafer transport block (4) will be described. The single-wafer transport block (4) has a long, slender shape extending in the X direction. The single-wafer transport block (4) has a pass (24), a center robot (CR), and a guide rail (41X) extending in the X direction that moves the center robot (CR) in the X direction. The pass (24) can stack substrates (W) in a horizontal position. The center robot (CR) can move back and forth guided by the guide rail (41X).

[0166] The center robot (CR) has a hand (103) and a hand (104) for conveying a substrate (W). FIG. 26 illustrates the configuration of the center robot (CR) of the present invention. The center robot (CR) is equipped with a hand (103) for conveying a wet substrate, a hand (104) for conveying a dry substrate, and a robot base (105) that supports the hand (103) and the hand (104). The hand (104) and the hand (103) are stacked in the Z direction, and the hand (104) is located above the hand (103).

[0167] Hand (103) is a wet hand for bringing the substrate (W) in the air in the standby room (55) into the single-wafer processing chamber (48). Hand (104) is a dry hand for taking out the substrate (W) that has finished drying from the single-wafer processing chamber (48).

[0168] FIG. 27 describes the configuration of a hand (104) related to the conveying of a dry substrate in the present example. The hand (104) in the present example has two blades (40) and a base member (41) connected to the base of each blade (40). A guide (42) that contacts a substrate (W) is formed at the tip and base of the blade (40), and the hand (104) supports the substrate (W) through the guide (42). The guide (42) has a wall portion that contacts the bevel portion of the substrate (W).

[0169] The pusher part (43) is located on the base material (41) and can move in the direction in which the blade (40) extends. When the pusher part (43) moves to the tip of the blade (40), the pusher part (43) comes into contact with the end of the substrate (W). Then, the bevel part of the substrate (W) comes into contact with the wall of the guide (42) at the tip of the blade (40). In this way, the substrate (W) is sandwiched between the wall of the guide (42) and the pusher part (43), thereby becoming clamped by the hand (104). Also, in FIG. 27, the pusher part (43) is located away from the tip of the blade (40), showing the state before the substrate (W) is clamped by the hand (104).

[0170] FIG. 28 describes the configuration of a hand (103) for transporting a wet substrate in the present example. The hand (103) in the present example also has two blades (44) and a base member (45) connected to the base of each blade (44). A pin (46) that contacts the lower side of the substrate (W) is formed at the tip and base of the blade (44), and the hand (103) supports the substrate (W) from below through the pin (46). Since the pin (46) does not contact the bevel portion of the substrate (W), even if the substrate (W) containing liquid is transported, the liquid does not flow down from the bevel portion of the substrate (W).

[0171] The center robot (CR) is equipped with a robot base (105) that supports a hand (104) and a hand (103). The center robot (CR) can individually move the hand (104) and the hand (103) in a horizontal direction (the Y direction in FIG. 26) relative to the robot base (105). Additionally, the center robot (CR) can simultaneously direct the hand (104) and the hand (103) at least to the right, left, and forward. Additionally, the center robot (CR) can move the hand (104) and the hand (103) up and down as a group.

[0172] By configuring it in this way, the center robot (CR) can access the air above the standby unit (55) in the attitude change block (6). At this time, the center robot (CR) raises the hand (103) toward the left and raises the hand (103) to the air above the standby unit (55).

[0173] Additionally, the hand (103) of the center robot (CR) can access the single-wafer processing chamber (48) in the single-wafer processing block (8) described later. At this time, the center robot (CR) raises the hand (103) toward the right and raises the hand (103) to the target single-wafer processing chamber (48). Also, referring to FIG. 1, the single-wafer processing block (8) includes a front single-wafer processing chamber (48) and a rear single-wafer processing chamber (48). When the center robot (CR) accesses the front single-wafer processing chamber (48), the center robot (CR) is positioned in the front according to the guidance of the guide rail (41X). When the center robot (CR) accesses the rear single-wafer processing chamber (48), the center robot (CR) is positioned in the rear according to the guidance of the guide rail (41X).

[0174] Additionally, the hand (104) of the center robot (CR) can also access the single-wafer processing chamber (48) in the single-wafer processing block (8). At this time, the center robot (CR) raises the hand (104) toward the right and raises the hand (104) to the target single-wafer processing chamber (48). The situation in which the center robot (CR) moves back and forth according to the guidance of the guide rail (41X) so that the front single-wafer processing chamber (48) and the rear single-wafer processing chamber (48) can be accessed is the same as in the case of the hand (103) described above.

[0175] And, the hand (104) of the center robot (CR) can also access the pass (24). At this time, the center robot (CR) raises the hand (104) forward to the pass (24).

[0176] In the single-wafer return block (4), the reference position (BP) of the center robot (CR) is determined. When the center robot (CR) is in the leading position in the X direction, the center robot (CR) is in the reference position (BP). The center robot (CR) in the reference position (BP) can access any of the standby line (55) in the posture change block (6), the single-wafer processing chamber (48) in the single-wafer processing block (8), and the pass (24) in the single-wafer return block (4). Additionally, there are two single-wafer processing chambers (48): one in the reference position (BP) and one in a position moved backward from the reference position (BP). The center robot (CR) in the reference position (BP) can access the single-wafer processing chamber (48) in the reference position (BP). When the center robot (CR) accesses the single-wafer processing chamber (48) located at the rear, the center robot (CR) moves backward from the reference position (BP). A guide rail (41X) is used for this movement.

[0177] The reference position (BP) is located adjacent to the standby group (55) in the Y direction. The Y direction corresponds to the horizontal direction of the present invention. The reference position (BP) is located adjacent to the pass (24) in the X direction. Thus, the reference position (BP) is located to the right of the standby group (55) and behind the pass (24). The reference position (BP) is the limit to which the center robot (CR), which is movable in the X direction, can move forward. When the center robot (CR) is moved to its furthest forward position, the center robot (CR) is at the reference position (BP).

[0178] The center robot (CR) transfers the substrate (W) transferred from the air above the standby unit (55) to the single-wafer processing chamber (48). When transferring the substrate (W) from the standby unit (55), the center robot (CR) is at the reference position (BP). When transferring the substrate (W) to the single-wafer processing chamber (48), the center robot (CR) is at the reference position (BP) or behind the reference position (BP).

[0179] FIG. 29 describes the pass (24) of the present example. The pass (24) is equipped with a pair of comb-shaped members (241) that stack and support a substrate (W) in a horizontal position. The pair of comb-shaped members (241) are formed on each of the inner walls of both sides of the box-shaped pass (24) and are configured to support the substrate (W) by bringing one end and the other end into contact. The pair of comb-shaped members (241) form a plurality of slots (S), and one substrate is stored in each of these slots (S). The pass (24) can hold 25 substrates (W) through the slots (S). At this time, the substrates (W) are arranged at a full pitch (1 cm interval).

[0180] Pass (24) is a temporary mounting place for substrates where the center robot (CR) stacks and places substrates that have finished single-wafer processing, and corresponds to the substrate placement section of the present invention. The center robot (CR) can move the hands (103, 104) in the Z direction so that substrates (W) can be placed in any of the slots (S) formed by the comb member (241).

[0181] FIG. 30 is a side view of the device illustrating the location of the pass (24). As shown in the figure, the pass (24) is located in the middle layer of the substrate processing device (1). Specifically, the pass (24) is at a height accessible to the handling robot (HTR).

[0182] <13. Single-wafer processing block>

[0183] The single-wafer processing block (8) is provided with a plurality of single-wafer processing chambers (48) that individually process a substrate (W) in a horizontal position. That is, the single-wafer processing block (8) has a laminate in which the single-wafer processing chambers (48) are stacked. In the substrate processing device (1) of the present example, two laminates are arranged in the front-rear direction. In the single-wafer processing block (8), the single-wafer processing chambers (48) are aligned in the X direction.

[0184] The center robot (CR) can move its hands (103, 104) in the Z direction to access any of the single-wafer processing chambers (48) that make up the laminate.

[0185] The single-wafer processing chamber (48) is equipped with a spin chuck inside. The spin chuck can rotate while holding a substrate (W). The center robot (CR) completes the loading of the substrate into the single-wafer processing chamber (48) by placing the held substrate (W) onto the spin chuck. The center robot (CR) completes the removal of the substrate from the single-wafer processing chamber (48) by receiving the substrate (W) placed on the spin chuck from the spin chuck.

[0186] The single-wafer processing chamber (48) can dry the substrate (W) by spin drying. The hand (103) of the center robot (CR) brings the substrate (W), which has been puddled by pure water, into the single-wafer processing chamber (48). The hand (104) of the center robot (CR) removes the substrate (W), which has been dried by spin drying, from the single-wafer processing chamber (48).

[0187] The single-wafer processing chamber (48) has a predetermined length in the X direction. The center robot (CR) can move in the X direction by at least a predetermined length from the reference position (BP). By configuring it in this way, the center robot (CR) can access the single-wafer processing chamber (48) located behind the reference position (BP).

[0188] <14. Maintenance Area>

[0189] As shown in FIG. 31, the substrate processing device (1) of the present example is equipped with two maintenance areas (R1, R2). The maintenance areas (R1, R2) are areas that an operator enters when performing maintenance on the substrate processing device (1). A standby unit (55) and other units, and a device such as an HVC attitude changer (23) are formed to avoid the maintenance areas (R1, R2).

[0190] The first maintenance area (R1) is located inside the attitude change block (6) and is positioned between the row consisting of the reserve group (65) and the standby group (55) and the batch processing block (7). The first maintenance area (R1) is an area where an operator enters, for example, when performing maintenance on the center robot (CR). The first maintenance area (R1) extends in a direction away from the single-wafer processing block (8) based on the first passage described later, and corresponds to the first chamber of the present invention.

[0191] When the operator enters the first maintenance area (R1), the operator first enters the single-wafer return block (4) and moves forward. From there, the operator changes the direction of travel to the left and reaches the first maintenance area (R1). The single-wafer processing block (8) is adjacent to the batch processing block (7) in the Y direction and is the first passage accessible to the center robot (CR).

[0192] The second maintenance area (R2) is located inside the posture change block (6) and is positioned between the reserve unit (65) and the material block (5). The second maintenance area (R2) is an area where an operator enters, for example, when performing maintenance on the reserve unit (65), the inversion chuck (71), and the inversion chuck support mechanism (72). The second maintenance area (R2) extends in a direction approaching the standby unit (55) from the second passage described later and corresponds to the second chamber of the present invention.

[0193] When the operator enters the second maintenance area (R2), the operator first moves along a passage extending in the Y direction that continues from the front of the single-wafer processing block (8). The operator reaches the second maintenance area (R2) after passing behind the handling robot (HTR) and the HVC attitude changer (23). The material block (5) has a second passage extending in the Y direction adjacent to the handling robot (HTR).

[0194] <15. Other Composition>

[0195] As shown in FIG. 1, a control area (49) is formed in front of the single-wafer processing block (8) and is equipped with a control unit for controlling the device. The control area (49) is equipped with a control unit (131) for controlling the substrate processing device (1). Also, although not shown in FIG. 1, a memory unit corresponding to the control unit (131) is provided in the substrate processing device (1). The control unit (131) is composed of, for example, a CPU (Central Processing Unit). The specific configuration of the control unit is not limited, and, for example, the control unit may be composed of a single processor, or each control unit may be composed of an individual processor.

[0196] Controls for the control unit (131) include, for example, control for the carrier conveying mechanism (11), handling robot (HTR), HVC attitude conversion unit (23), pusher mechanism (25), substrate conveying mechanism (WTR), batch processing unit (BPU1 to BPU5), center robot (CR), single-wafer processing chamber (48), inversion chuck (71), and auxiliary robot (STR).

[0197] That is, the control unit (131) controls the center robot (CR) to receive the substrate (W) containing the liquid in pure water via the hand (103) and transport it to the single-wafer processing chamber (48). The control unit (131) controls the center robot (CR) to receive the substrate that has been dried in the single-wafer processing chamber (48) via the hand (104) and transport it to the pass (24). Then, the control unit (131) controls the handling robot (HTR) to return the dried substrate (W) to the carrier (C).

[0198] The memory unit stores programs or parameters related to control. The memory unit may be composed of a single device or individual devices corresponding to each control unit. In addition, the substrate processing device (1) of the present embodiment does not have any particular limitations regarding the configuration of the device realizing the memory unit.

[0199] <16. Flow of Substrate Processing>

[0200] Next, the flow of substrate processing using the substrate processing device (1) of the present example will be explained with reference to FIG. 32. FIG. 32 is a flowchart explaining the operation of the substrate processing device of the present example. Below, each step of the flowchart will be explained.

[0201] Step S11: A carrier (C) containing an unprocessed substrate (W) is placed in a load port (9). The carrier (C) is conveyed to a carrier storage shelf (13a) by a carrier conveying mechanism (11).

[0202] Step S12: The handling mechanism (HTR) extracts the substrate (W) stored in the carrier (C) in batches and returns it to the HVC attitude conversion unit (23).

[0203] Step S13: The HVC attitude conversion unit (23) acquires the substrate (W) in a horizontal position in a batch and converts the attitude of the substrate (W) from a horizontal position to a vertical position. The attitude-converted substrate (W) is held by a pusher mechanism (25).

[0204] Step S14: The HVC position change unit (23) performs the arrangement of the substrate (W) by once again performing the position change of the substrate (W) and the introduction into the pusher mechanism (25). After the arrangement, the pusher mechanism (25) holds two carriers (C) of substrates (W). Before the arrangement, the substrates (W) were arranged at a full pitch (1 cm interval), but after the arrangement, the substrates (W) are arranged at a half pitch (5 mm interval). Due to the arrangement, the substrates (W) become a lot arranged, for example, face-to-face.

[0205] Step S15: The substrate transport mechanism (WTR) receives the lot from the pusher mechanism (25) and transports it, for example, to a batch processing unit (BPU5). In the batch processing unit (BPU5), chemical treatment (acid treatment) of the lot is performed. This step can be realized by using batch processing units (BPU2 to BPU4) instead of the batch processing unit (BPU5).

[0206] Step S16: The lot that has completed the chemical treatment is returned to the batch processing unit (BPU1) by the substrate return mechanism (WTR). In the batch processing unit (BPU1), cleaning treatment of the lot is performed. The lot that has completed the cleaning treatment is returned to the preparatory unit (65) by the substrate return mechanism (WTR).

[0207] Step S17: The auxiliary robot (STR) selects and holds a group of substrates arranged in full pitch from a lot immersed in the reserve group (65) and performs the dismantling of the lot. The auxiliary robot (STR) conveys the held group of substrates to the standby group (55). FIG. 33 illustrates the substrate conveying from Step S11 to Step S17. That is, from Step S11 to Step S17, the substrate (W) passes through the load port (9), carrier placement shelf (13a), handling robot (HTR), HVC posture conversion unit (23), pusher mechanism (25), substrate conveying mechanism (WTR), batch processing unit (BPU5), batch processing unit (BPU1), reserve group (65), and auxiliary robot (STR) respectively, and reaches the standby group (55).

[0208] Step S18: The vertically positioned substrate (W) returned to the standby table (55) is converted to a horizontal position by the inversion chuck (71).

[0209] Step S19: The center robot (CR) acquires a substrate (W) in a horizontal position located above the standby unit (55) and transports it to the single-wafer processing chamber (48) of the single-wafer processing block (8). At this time, the center robot (CR) transports the substrate (W) by means of a hand (103).

[0210] Step S20: In the single-wafer processing chamber (48), drying of the substrate (W) by spin drying is performed.

[0211] Step S21: The center robot (CR) receives the substrate (W) that has finished drying from the single-wafer processing chamber (48) and transports it to the pass (24). At this time, the center robot (CR) transports the substrate (W) by means of a hand (104). Steps S19 to S21 are repeated until all substrates (W) are removed from the standby unit (55). At this time, the center robot (CR) inserts the substrate (W) into each of the slots (S) of the pass (24) and arranges the substrates (W) in the Z direction within the pass (24).

[0212] Step S22: In this step, by repeating Step S21, 25 substrates (W) are arranged and maintained in the Z direction on Pass (24). The handling robot (HTR) acquires the horizontally positioned substrates (W) stacked on Pass (24) in batches.

[0213] Step S23: The handling mechanism (HTR) stores the retained multiple substrates in an empty carrier (C) placed on the carrier storage shelf (13a). The carrier (C) on the carrier storage shelf (13a) is transported to the load port (9) by the carrier transport mechanism (11). In this way, the substrate processing of the present invention is completed.

[0214] FIG. 34 illustrates the substrate transport from step S18 to step S23. That is, the substrate (W) passes through the standby unit (55), center robot (CR), single-wafer processing chamber (48), center robot (CR), pass (24), and handling mechanism (HTR), and then through each of the carrier placement shelves (13a) to reach the load port (9).

[0215] <17. Effects of the present invention>

[0216] According to the configuration described above, the center robot (CR) carries the substrate from the upper part of the standby unit (55) to the single-wafer processing chamber (48). Therefore, the present invention does not require a device for carrying a horizontally positioned substrate other than the center robot (CR), as in the conventional configuration. According to the present invention, a substrate carrying device for carrying a horizontally positioned substrate is omitted, and a substrate processing device (1) with a small footprint can be provided.

[0217] In the batch processing block (7) of the configuration described above, a batch processing unit (BPU) capable of immersing multiple substrates in a vertical position into a processing solution is aligned in the X direction, and a substrate transport mechanism (WTR) capable of transporting the substrates processed by the batch processing unit (BPU) in the X direction toward the standby tank (55) is provided, and a center robot (CR) is located at a reference position (BP) separated from the standby tank (55) in the Y direction orthogonal to the X direction. By configuring it in this way, there is no need to separate the single-wafer processing block (8) and the batch processing block (7) in the X direction, so the length in the X direction of the substrate processing device can be reduced.

[0218] According to the configuration described above, in the single-wafer processing block (8), the single-wafer processing chamber (48) is aligned in the X direction, the length of the single-wafer processing chamber (48) in the X direction is a predetermined length, and the center robot (CR) is capable of moving in the X direction by a distance greater than the predetermined length from the reference position (BP). By configuring it in this way, the number of single-wafer processing chambers (48) in the substrate processing block can be easily increased.

[0219] According to the configuration described above, a substrate transport mechanism (WTR) is provided with a preparatory unit (65) that receives a substrate transported toward the waiting layer, and an auxiliary robot (STR) that transports the substrate in the Y direction between the preparatory unit (65) and the waiting unit (55). With this configuration, the substrate after batch processing can be reliably transported to the waiting unit (55).

[0220] According to the configuration described above, a handling robot (HTR) is provided to collectively acquire substrates from a carrier (C) that stores substrates stacked in a horizontal position. This handling robot (HTR) can collectively acquire processed substrates stacked on a pass (24) and store them in the carrier (C). By configuring it in this way, unprocessed substrates and processed substrates can be transported by the same robot, thereby providing a substrate processing device with a simple configuration and a small footprint.

[0221] According to the configuration described above, a carrier storage shelf (13a) for storing a carrier (C) is provided, and a standby unit (55) is located in a position facing the X direction from the carrier storage shelf (13a), and the standby unit (55) is located in a position facing the opposite direction from the X direction from the batch processing block (7). By configuring it in this way, the standby unit (55) can be placed at the base of the batch processing block (7), thereby providing a substrate processing device with a small footprint.

[0222] According to the configuration described above, the single-wafer processing chamber (48) performs drying treatment on the substrate, and the center robot (CR) is equipped with a hand (103) for bringing the substrate in the air in the standby tank (55) into the single-wafer processing chamber (48), and a hand (104) for taking out the substrate that has finished drying treatment from the single-wafer processing chamber (48). By configuring it in this way, the substrate that has finished drying treatment can be reliably taken out from the single-wafer processing chamber (48).

[0223] According to the configuration described above, a first passage is provided that is adjacent to the batch processing block (7) in the Y direction and is accessible to the center robot (CR), and a first maintenance area (R1) is provided that extends from the first passage in a direction away from the single-wafer processing block (8). By configuring it in this way, a substrate processing device can be provided that allows for easy maintenance of the center robot (CR), etc.

[0224] According to the configuration described above, a second passage extending in the Y direction adjacent to the handling robot (HTR) and a second maintenance area (R2) extending in a direction closer to the standby team (55) from the second passage are provided. By configuring it in this way, a substrate processing device that can easily perform maintenance on the center robot (CR), etc. can be provided.

[0225] <18. Variant Example>

[0226] The present invention is not limited to the configuration described above, and modifications as follows are possible.

[0227] <Variation Example 1>

[0228] The single-wafer processing block (8) of the above-described embodiment was equipped with a single-wafer processing chamber (48) capable of performing spin drying, but it may be configured to have a drying chamber (50) with a different configuration from the single-wafer processing chamber (48) and a single-wafer processing chamber (48) for holding substrate liquid.

[0229] FIG. 35 illustrates a substrate processing apparatus of the present variation. As shown in FIG. 35, the substrate processing apparatus of the present variation is almost identical to the substrate processing apparatus of the embodiment, but there is a significant difference in the configuration of the single-wafer processing block (8). The apparatus of the present variation is equipped with a stack of drying chambers (50) in addition to a stack of single-wafer processing chambers (48). The apparatus of the present variation is configured such that the stack of single-wafer processing chambers (48) is positioned at the front, and the stack of drying chambers (50) is positioned at the rear.

[0230] Between the single-wafer processing chamber (48) and the drying chamber (50), a wet robot (WR) is formed to transport a substrate (W) containing liquid. The wet robot (WR) transports the substrate (W) containing liquid from the single-wafer processing chamber (48) to the drying chamber (50) while in a puddle state.

[0231] The single-wafer processing chamber (48) performs liquid filling of an organic solvent on the introduced substrate (W). The organic solvent may be, for example, IPA. In the single-wafer processing chamber (48), the substrate (W) filled with liquid pure water is introduced by the center robot (CR), so the single-wafer processing chamber (48) has the function of replacing the liquid filled in the substrate (W) from pure water to IPA.

[0232] The drying chamber (50) is configured to perform substrate drying treatment using a supercritical fluid. For example, carbon dioxide can be used as the supercritical fluid.

[0233] Next, the transport of the substrate in the substrate processing related to the present variation is described. In the present variation, as in the embodiment, a substrate is acquired from a carrier (C), a predetermined process is performed, and the processed substrate is returned to the carrier (C). The substrate (W) contained in the carrier (C) is transported from the material block (5) through the batch processing block (7) to the standby block (55) of the position change block (6). The appearance is the same as in the embodiment, and for the substrate transport during this process, refer to FIG. 33.

[0234] FIG. 36 shows a horizontally positioned substrate (W) waiting in a standby tank (55) undergoing drying treatment and being returned to a carrier (C). The substrate (W) in a puddle state due to pure water is transported from the standby tank (55) to a single-wafer processing chamber (48). This transport is accomplished by the hand (103) of the center robot (CR).

[0235] A substrate (W) introduced into a single-wafer processing chamber (48) is rotated by a spin chuck attached to the single-wafer processing chamber (48) to remove pure water from the substrate (W). After the rotation of the substrate (W) stops, the single-wafer processing chamber (48) supplies IPA to the substrate (W) through an attached nozzle to make the substrate (W) puddle.

[0236] The wet robot (WR) accepts the substrate (W) that has been puddled by IPA and returns it to the drying chamber.

[0237] The drying chamber performs a drying treatment of the substrate (W) using a supercritical fluid.

[0238] After drying, the substrate (W) is transported to the pass (24) by the hand (104) of the center robot (CR). Subsequent substrate transport is the same as in the example. For this point, refer to FIG. 34.

[0239] As described above, according to the configuration of the present modified example, a wet robot (WR) is provided between the single-wafer processing chamber (48) (first single-wafer processing chamber) and the drying chamber (50) (second single-wafer processing chamber) separated in the X direction, for transporting a substrate (W) containing liquid from the single-wafer processing chamber (48) to the drying chamber (50). With this configuration, it is possible for the wet robot (WR) and the center robot (CR) to operate independently without interference.

[0240] In addition, according to the configuration of the present variant, the single-wafer processing chamber (48) is located closer to the reference position (BP) of the center robot (CR) than to the drying chamber (50). By configuring it in this way, when the center robot (CR) moves the wet substrate (W) from above the standby tank (55) to the first single-wafer processing chamber (48), the travel distance of the substrate (W) can be minimized. This allows for the provision of a substrate processing device (1) in which the center robot (CR) can transport the substrate (W) while reliably maintaining the wet state.

[0241] According to the configuration of the present variation, the drying chamber (50) performs a drying process using a supercritical fluid. Thus, the present invention is suitable for a substrate processing apparatus using a supercritical fluid.

[0242] <Variation Example 2>

[0243] In the single-wafer processing block (8) of the substrate processing apparatus (1) of the embodiment, two stacks of single-wafer processing chambers (48) were formed at the reference position (BP) of the center robot (CR) and at a position behind the reference position (BP), but the present invention is not limited to this configuration. As shown in FIG. 37, the stack of single-wafer processing chambers (48) may be one. In addition, the substrate processing apparatus (1) of the present invention may be configured to have three or more stacks of single-wafer processing chambers (48). In this case, three or more stacks are arranged in the X direction in the single-wafer processing block (8). In this way, the substrate processing apparatus (1) of the present invention can increase or decrease the number of stacks depending on the purpose of substrate processing.

[0244] In addition, in a configuration having one stack of the single-wafer processing chamber (48) shown in FIG. 37, the guide rail (41X) shown in FIG. 1 is not necessarily required. That is, the substrate processing apparatus (1) of this modified example is established even without a configuration that moves the center robot (CR) in the X direction from the reference position (BP).

Claims

Claim 1 A substrate processing device that continuously performs batch processing for processing multiple substrates in batches and single-wafer processing for processing substrates one by one, comprising: a batch processing block for performing batch processing; a first posture conversion mechanism capable of converting multiple substrates that have finished batch processing from a vertical posture to a horizontal posture; a standby group for holding multiple substrates converted to a horizontal posture; a lifting mechanism for performing an exposure operation to position the substrates waiting in the standby group one by one above the standby group; a center robot capable of removing the substrates located above the standby group; and a single-wafer processing block equipped with a single-wafer processing chamber for performing single-wafer processing on the substrates in the horizontal posture, wherein the center robot brings the substrates removed from above the standby group into the single-wafer processing chamber. Claim 2 A substrate processing device according to claim 1, wherein the batch processing block comprises a processing tank capable of immersing a plurality of substrates in a vertical position in a processing liquid, which is aligned in a predetermined direction, and a batch conveying robot capable of conveying a substrate that has been processed in the processing tank toward the waiting tank in the predetermined direction, and wherein the center robot is located at a reference position separated from the waiting tank in a horizontal direction orthogonal to the predetermined direction. Claim 3 A substrate processing apparatus according to claim 2, wherein the single-wafer processing block has the single-wafer processing chamber aligned in the predetermined direction, the single-wafer processing chamber has a predetermined length in the predetermined direction, and the center robot is capable of moving in the predetermined direction by a distance greater than or equal to the predetermined length from the reference position. Claim 4 A substrate processing apparatus according to claim 3, characterized by having a wet robot between a first substrate processing chamber and a second substrate processing chamber separated in the aforementioned predetermined direction, which removes a substrate containing liquid from the first substrate processing chamber and conveys it to the second substrate processing chamber. Claim 5 A substrate processing apparatus according to claim 4, wherein the first substrate processing chamber is located closer to the reference position than the second substrate processing chamber. Claim 6 In claim 4, the substrate processing apparatus is characterized in that the second substrate processing chamber performs a drying process using a supercritical fluid. Claim 7 A substrate processing apparatus according to claim 2, characterized by having a preparatory unit that receives a substrate conveyed toward the waiting layer by the batch conveying robot, and an auxiliary robot that conveys the substrate in the horizontal direction between the preparatory unit and the waiting unit. Claim 8 A substrate processing apparatus according to claim 2, comprising: a carrier robot that collectively acquires substrates from a carrier that stacks and stores substrates in a horizontal position; a second position conversion mechanism that converts the substrates in a horizontal position acquired by the carrier robot into a vertical position; and a substrate placement unit in which the center robot stacks and stores substrates that have finished single-wafer processing; wherein the placement conveying robot is capable of conveying the substrates in a vertical position converted by the second position conversion mechanism; and wherein the carrier robot is capable of collectively acquiring the substrates in a horizontal position stacked in the substrate placement unit and storing them in the carrier. Claim 9 A substrate processing apparatus according to claim 8, characterized in that it is equipped with a storage shelf for storing the carrier, and the standby unit is located at a position facing the predetermined direction from the storage shelf, and the standby unit is located at a position facing the opposite direction from the predetermined direction from the batch processing block. Claim 10 A substrate processing apparatus according to claim 1, wherein the single-wafer processing chamber performs a drying process of a substrate, and the center robot is equipped with a wet hand for bringing a substrate in the air above in the standby tank into the single-wafer processing chamber and a dry hand for removing a substrate that has finished the drying process from the single-wafer processing chamber. Claim 11 A substrate processing apparatus according to claim 1, characterized by having a first passage adjacent to the batch processing block in the horizontal direction and accessible to the center robot, and a first chamber extending from the first passage in a direction away from the single-wafer processing block. Claim 12 A substrate processing device according to claim 8, characterized by having a second passage extending in the horizontal direction adjacent to the carrier robot, and a second chamber extending from the second passage in a direction approaching the standby tank.

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