Substrate processing device

Abstract

A substrate processing apparatus is provided, comprising: a lower electrode; a reaction chamber on the lower electrode; an electrolyte solution within the reaction chamber; and a flattening unit in contact with the electrolyte solution, wherein the flattening unit comprises a light source unit disposed within the reaction chamber and an electrode in contact with the light source unit, and the electrolyte solution comprises a photosensitive agent and a photoinitiator.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus comprising an electrode and a light source unit capable of flattening the upper surface of a substrate in a reaction chamber. Background Technology

[0002] The manufacturing of semiconductor devices can be carried out through various processes. For example, the manufacturing of semiconductor devices may proceed through photolithography, etching, and deposition processes on a substrate. Prior to each process, it may be necessary to planarize the surface of the substrate. To this end, a planarization process may be performed on the substrate. The planarization process can be carried out in various ways. For instance, an electrochemical planarization process may be used to planarize the substrate. In particular, an electrochemical copper planarization (ECP) process utilizing electrochemistry may be used. The problem to be solved

[0003] The problem that the present invention aims to solve is to provide a substrate processing apparatus that enhances the flattening speed by triggering a photocatalytic reaction using a light source unit in substrate flattening using electrochemistry.

[0004] The problem that the present invention aims to solve is to provide a substrate processing apparatus that suppresses light diffusion to promote photoreaction only in desired areas, thereby increasing the efficiency of substrate planarization.

[0005] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0006] To achieve the above-mentioned problem, a substrate processing apparatus according to one embodiment of the present invention comprises a lower electrode; a reaction chamber on the lower electrode; an electrolyte solution within the reaction chamber; and a planarization unit in contact with the electrolyte solution, wherein the planarization unit comprises a light source unit disposed within the reaction chamber and an electrode in contact with the light source unit, and the electrolyte solution may comprise a photosensitive agent and a photoinitiator.

[0007] To achieve the above-mentioned problem, a substrate processing device according to one embodiment of the present invention comprises a lower electrode; a reaction chamber on the lower electrode; an electrolyte solution within the reaction chamber; and a flattening unit in contact with the electrolyte solution, wherein the flattening unit may include a light source unit disposed in the center of the flattening unit and an electrode surrounding the light source unit.

[0008] To achieve the above-mentioned problem, a substrate processing device according to one embodiment of the present invention comprises: a lower electrode; a reaction chamber on the lower electrode; a substrate connected to the lower electrode; an electrolyte solution within the reaction chamber; an attachment member connected to the upper part of the reaction chamber; an electrode connected to the attachment member; and a light source unit connected to the electrode, wherein the electrolyte solution may include a photosensitive agent and a photoinitiator.

[0009] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0010] According to the substrate processing apparatus of the present invention, an uneven upper surface of a substrate can be efficiently flattened using an electrode and a light source unit.

[0011] According to the substrate processing apparatus of the present invention, the electrolyte solution in the reaction chamber includes a photosensitive agent and a photoinitiator, so that localized portions of the substrate can be efficiently flattened.

[0012] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0013] FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. Figure 2 is a plan view illustrating the flattening unit of the substrate processing device of Figure 1. FIG. 3 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 4 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 5 is a plan view illustrating the flattening unit of the substrate processing device of FIG. 3 and FIG. 4. FIG. 6 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. Figure 7 is a plan view illustrating the flattening unit of the substrate processing device of Figure 6. FIG. 8 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 9 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 10 is a plan view illustrating the flattening unit of the substrate processing device of FIG. 8 and FIG. 9. FIG. 11 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 12 is a plan view illustrating the flattening unit of the substrate processing device of FIG. 11. FIG. 13 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 14 is a plan view illustrating the flattening unit of the substrate processing device of FIG. 13. FIG. 15 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 16 is a plan view illustrating the flattening unit of the substrate processing device of FIG. 15. Specific details for implementing the invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. Throughout the entire specification, the same reference numerals may refer to the same components.

[0015] In the following, D1 may be referred to as the first direction, D2 intersecting the first direction (D1) as the second direction, and D3 intersecting each of the first direction (D1) and the second direction (D2) as the third direction (D3). The third direction (D1) may be referred to as the upward direction, and the direction opposite to the third direction (D1) may be referred to as the downward direction. Additionally, the first direction (D1) and the second direction (D2) may each be referred to as the horizontal direction.

[0017] FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 2 is a plan view for explaining a planarization unit of the substrate processing apparatus of FIG. 1.

[0018] Referring to FIGS. 1 and 2, a substrate processing device (1) according to an embodiment of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), and a flattening unit (20) connected to the attachment member (31).

[0019] The lower electrode (11) may include a conductive material. The lower electrode (11) may support a substrate (12). More specifically, the substrate (12) may be positioned on the upper surface of the lower electrode (11). On the upper surface of the lower electrode (11), the substrate (12) may be rotated from a planar perspective. In this specification, the term "planar perspective" may mean a view from above, as illustrated in FIG. 2. The lower electrode (11) may be connected to a power source (not shown) and may apply voltage to the substrate (12).

[0020] A substrate (12) may be provided on the lower electrode (11). The substrate (12) may include a silicon wafer, but is not limited thereto. In the substrate processing apparatus (1) according to an embodiment of the present invention, an object to be flattened may be placed at the location where the substrate (12) is placed.

[0021] A substrate (12) may include a pattern (13) on its upper surface. The pattern (13) may include an uneven upper surface. The uneven upper surface of the pattern (13) may be flattened by a substrate processing device (1) according to an embodiment of the present invention. The pattern (13) may include, for example, a conductive material. The pattern (13) may include, for example, an uneven copper pattern. The pattern (13) may come into contact with an electrolyte solution (14). The upper surface of the pattern (13) may be exposed to the electrolyte solution (14). From a planar perspective, the size of the substrate (12) may be equal to or larger than the size of the pattern (13), but is not limited thereto.

[0022] A reaction chamber (15) may be disposed on the lower electrode (11). The reaction chamber (15) has a processing space for processing a substrate inside. The lower part of the reaction chamber (15) may be filled with an electrolyte solution (14), and the upper part of the reaction chamber (15) may not be filled with the electrolyte solution (14). The upper part of the reaction chamber (15) may be an empty space.

[0023] The electrolyte solution (14) in the reaction chamber (15) may contain a viscous electrolyte. In one embodiment, the electrolyte solution (14) in the reaction chamber may contain at least one of a photosensitive agent and a photoinitiator.

[0024] Oxygen can be dissolved in the electrolyte solution (14) in the reaction chamber (15). The electrolyte solution (14) may contain other by-products. The dissolved oxygen can produce hydrogen peroxide (H2O2) through a reduction reaction. The hydrogen peroxide (H2O2) can dissolve the uneven surface of the pattern (13).

[0025] The photosensitive agent may include at least one of melanin, chlorophyll, hemoglobin, beta-carotene, and carbon black.

[0026] The photoinitiator may include at least one of benzoyl peroxide, 2,2-dimethoxy-2-phenylacetophenone, and 2,2'-azobis[2-methyl-n-(2-hydroxylethyl)propionamide].

[0027] In one embodiment, the electrolyte solution (14) may include a photocatalyst. If the light provided by the light source unit (23) is visible light, the photocatalyst may be one of Au / TiO2, TiO2 / SeO2, and TiO2 / SiO2. If the light is ultraviolet light, the photocatalyst may be one of TiO2, ZnO, ZrO2, CdSe, WO3 / TiO2, and Al2O3 / ZrO2. Hydrolysis by the photocatalytic reaction may generate hydroxyl radicals (OH radicals) with strong oxidizing power. The flattening speed of the pattern (13) may be controlled through the oxidation reaction of the hydroxyl radicals.

[0028] An attachment member (31) may be disposed on the upper surface of the reaction chamber (15). The attachment member (31) may be connected to the upper surface of the reaction chamber (15). A leveling unit (20) may be connected to the upper surface of the reaction chamber (15) by the attachment member (31). The attachment member (31) and the electrolyte solution (14) may be spaced apart.

[0029] It may include a flattening unit (20) connected to an attachment member (31). A portion of the flattening unit (20) may be placed within the electrolyte solution (14), and a portion of the flattening unit (20) may be exposed. The flattening unit (20) may be connected to and fixed to the upper part of the reaction chamber (15) by the attachment member (31).

[0030] The flattening unit (20) may include a light source unit (23) penetrating the interior, an electrode (22) surrounding the light source unit (23), and a protective housing (21) surrounding the electrode (22).

[0031] The light source unit (23) may have a cylindrical shape. From a planar perspective, the light source unit (23) may have a circular cross-section. The light source unit (23) may provide light to the upper surface of the pattern (13). The light source unit (23) may promote a photocatalytic reaction, and a portion of the uneven upper surface of the pattern (13) may be dissolved into the electrolyte solution (14) by the photocatalytic reaction. Through the photocatalytic reaction, the uneven upper surface of the pattern (13) may become uniform.

[0032] An electrode (22) surrounding the light source unit (23) may be provided. The electrode (22) may have a ring shape surrounding the light source unit (23). The electrode (22) may include a conductive material. The electrode (22) may form an electric field region within the electrolyte solution (14). The electrode (22) may provide free electrons within the electrolyte solution (14).

[0033] It may include a protective housing (21) surrounding the electrode (22). The protective housing (21) may have a ring shape surrounding the electrode (22). The electrode (22) can be protected by the protective housing (21), and oxidation and corrosion of the electrode (22) can be prevented, thereby increasing the lifespan of the electrode (22).

[0034] The height (H23) of the light source unit (23) may be substantially the same as the height (H22) of the electrode (22). The height (H23) of the light source unit (23) may be substantially the same as the height (H21) of the protective housing (21). The height (H21) of the electrode (22) may be substantially the same as the height (H21) of the protective housing (21).

[0035] In this specification, height may mean the vertical distance to the third direction (D3) of the object. In this specification, substantially identical may mean identical within an error range of -5% to +5%.

[0036] The substrate processing device (1) of the present invention may have a light source unit (23) embedded inside the electrode (22). Through this, the oxidation reaction of the pattern (13) accompanying the process of flattening the upper surface of the pattern (13) can be promoted as a photocatalytic reaction.

[0037] Additionally, the substrate processing device (1) of the present invention may include a photosensitive agent and a photoinitiator. Light diffusion is suppressed through the photosensitive agent, allowing the photoreaction to occur only in the desired area. In this case, the flattening efficiency can be increased by allowing light to reach the protruding parts of the non-uniform pattern (13). The oxidation reaction of the protruding parts of the pattern (13) can be promoted through the photoinitiator. This can increase the efficiency of the flattening reaction.

[0039] FIG. 3 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 5 is a plan view for explaining the planarization unit of the substrate processing apparatus of FIG. 3 and FIG. 4. For the sake of simplification of the explanation, content that overlaps with the above description is omitted.

[0040] Referring to FIGS. 3 and 5, the substrate processing apparatus (2) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), and a flattening unit (20a) connected to the attachment member (31).

[0041] The flattening unit (20a) may include a light source unit (23) penetrating its interior, a cover member (24) surrounding the light source unit (23), an electrode (22) surrounding the cover member (24), and a protective housing (21) surrounding the electrode (22). The cover member (24) may be interposed between the light source unit (23) and the electrode (22).

[0042] Referring to FIG. 5 from a planar perspective, the light source unit (23) may have a circular cross-section. The cover member (24) may have a ring shape surrounding the light source unit (23). The electrode (22) may have a ring shape surrounding the cover member (24). The protective housing (21) may have a ring shape surrounding the electrode (22).

[0043] A cover member (24) may be disposed between the light source unit (23) and the electrode (22). The electrode (22) may be disposed between the cover member (24) and the protective housing (21). The light source unit (23) and the cover member (24) may have a relatively protruding shape. In other words, the level of the lower surface of the light source unit (23) and the lower surface of the cover member (24) may be lower than the level of the lower surface of the electrode (22) and the protective housing (21). Here, the level may be defined by the distance from the upper surface of the substrate (12) to the third direction (D3). A lower level may be defined as meaning that the distance from the upper surface of the substrate (12) to the third direction (D3) is smaller.

[0044] The height (H23) of the light source unit (23) and the height (H24) of the cover member (24) may be substantially the same. The height (H22) of the electrode (22) and the height (H21) of the protective housing (21) may be substantially the same. The height (H23) of the light source unit (23) may be greater than the height (H22) of the electrode (22). The height (H23) of the light source unit (23) may be greater than the height (H21) of the protective housing (21). The height (H24) of the cover member (24) may be greater than the height (H22) of the electrode (22). The height (H24) of the cover member (24) may be greater than the height (H21) of the protective housing (21).

[0045] Since the light source unit (23) protrudes beyond the electrode (22), the light provided from the light source unit (23) can be emitted at a wider variety of angles. Since the cover member (24) also protrudes around the light source unit (23), the light source unit (23) can be protected.

[0047] FIG. 4 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 5 is a plan view for explaining the planarization unit of the substrate processing apparatus of FIG. 3 and FIG. 4. For the sake of simplification of the explanation, content that overlaps with the above description is omitted.

[0048] Referring to FIGS. 4 and 5, the substrate processing apparatus (3) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), and a flattening unit (20a) connected to the attachment member (31).

[0049] The flattening unit (20a) may include a light source unit (23) positioned in the center, a cover member (24) surrounding the side and bottom surfaces of the light source unit (23), an electrode (22) surrounding the cover member (24), and a protective housing (21) surrounding the electrode (22).

[0050] The light source unit (23) may have a recessed shape. The lower surface of the light source unit (23) may be covered by a cover member (24). The level of the lower surface of the light source unit (23) may be higher than the level of the lower surface of the cover member (24), the electrode (22), and the protective housing (21). A higher level may be defined as having a greater distance from the upper surface of the substrate (12) to the third direction (D3).

[0051] The height (H24) of the cover member (24) and the height (H22) of the electrode (22) may be substantially the same. The height (H22) of the electrode (22) and the height (H21) of the protective housing (21) may be substantially the same. The height (H24) of the cover member (24) and the height (H21) of the protective housing (21) may be substantially the same. The height (H23) of the light source unit (23) may be smaller than the height (H24) of the cover member (24). The height (H23) of the light source unit (23) may be smaller than the height (H21) of the protective housing (21). The height (H23) of the light source unit (23) may be smaller than the height (H22) of the electrode (22).

[0052] Since the light source unit (23) is recessed compared to the electrode (22), the light provided from the light source unit (23) can be provided at a higher density. Since the light source unit (23) is surrounded by a cover member (24), the light source unit (23) can be protected.

[0054] FIG. 6 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 7 is a plan view for explaining a planarization unit of the substrate processing apparatus of FIG. 6. For the sake of simplicity of explanation, content that overlaps with the above description is omitted.

[0055] Referring to FIGS. 6 and 7, the substrate processing apparatus (4) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), and a flattening unit (20b) connected to the attachment member (31).

[0056] The flattening unit (20b) may include an electrode (22) positioned in the center, a light source unit (23) surrounding the electrode (22), and a protective housing (21) surrounding the light source unit (23).

[0057] The electrode (22) may have a cylindrical core shape. The electrode (22) may have a circular cross-section in a planar view. The light source unit (23) may have a ring shape surrounding the electrode (22). The protective housing (21) may have a ring shape surrounding the light source unit (23).

[0058] The height (H22) of the electrode (22) and the height (H23) of the light source unit (23) may be substantially the same. The height (H22) of the electrode (22) and the height (H21) of the protective housing (21) may be substantially the same. The height (H23) of the light source unit (23) and the height (H21) of the protective housing (21) may be substantially the same.

[0059] Since the light source unit (23) is provided in a ring shape surrounding the electrode (22), light from the light source unit (23) can be provided to a wider space.

[0061] FIG. 8 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 10 is a plan view for explaining a planarization unit of the substrate processing apparatus of FIG. 8 and FIG. 9. For the sake of simplicity, content that overlaps with what has been described above is omitted.

[0062] Referring to FIGS. 8 and FIGS. 10, the substrate processing apparatus (5) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), and a flattening unit (20c) connected to the attachment member (31).

[0063] The flattening unit (20c) may include an electrode (22) penetrating the interior thereof, a cover member (24) surrounding the electrode (22), a light source unit (23) surrounding the cover member (24), and a protective housing (21) surrounding the light source unit (23).

[0064] The electrode (22) and the cover member (24) may have a relatively protruding shape. In other words, the level of the lower surface of the electrode (22) and the lower surface of the cover member (24) may be lower than the level of the lower surface of the light source unit (23) and the protective housing (21).

[0065] The height (H22) of the electrode (22) and the height (H24) of the cover member (24) may be substantially the same. The height (H23) of the light source unit (23) and the height (H21) of the protective housing (21) may be substantially the same. The height (H23) of the light source unit (23) may be smaller than the height (H22) of the electrode (22). The height (H23) of the light source unit (23) may be smaller than the height (H21) of the cover member (24). The height (H21) of the protective housing (21) may be smaller than the height (H22) of the electrode (22). The height (H21) of the protective housing (21) may be smaller than the height (H24) of the cover member (24).

[0066] Since the electrode (22) protrudes beyond the light source unit (23), free electrons from the electrode (22) can be provided at a wider variety of angles. Since the cover member (24) also protrudes around the electrode (22), the electrode (22) can be protected.

[0068] FIG. 9 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 10 is a plan view for explaining the planarization unit of the substrate processing apparatus of FIG. 8 and FIG. 9. For the sake of simplicity of explanation, content that overlaps with the above description is omitted.

[0069] Referring to FIGS. 9 and 10, the substrate processing apparatus (6) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), and a flattening unit (20c) connected to the attachment member (31).

[0070] The flattening unit (20c) may include an electrode (22) penetrating the interior thereof, a cover member (24) surrounding the side and bottom surfaces of the electrode (22), a light source unit (23) surrounding the cover member (24), and a protective housing (21) surrounding the light source unit (23).

[0071] The electrode (22) may have a recessed shape. The lower surface of the electrode (22) may be covered by a cover member (24). The level of the lower surface of the electrode (22) may be higher than the level of the lower surface of the cover member (24), the light source unit (23), and the protective housing (21).

[0072] The height (H24) of the cover member (24) and the height (H23) of the light source unit (23) may be substantially the same. The height (H23) of the light source unit (23) and the height (H21) of the protective housing (21) may be substantially the same. The height (H24) of the cover member (24) and the height (H21) of the protective housing (21) may be substantially the same. The height (H22) of the electrode (22) may be smaller than the height (H24) of the cover member (24). The height (H22) of the electrode (22) may be smaller than the height (H21) of the protective housing (21). The height (H23) of the light source unit (23) may be greater than the height (H22) of the electrode (22).

[0073] Since the electrode (22) is recessed compared to the light source unit (23), free electrons can be provided at a higher density. Since the electrode (22) is surrounded by a cover member (24), the electrode (22) can be protected. The electrode (22) can be less corroded and damaged.

[0075] FIG. 11 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 12 is a plan view for explaining a planarization unit of the substrate processing apparatus of FIG. 11. For the sake of simplicity of explanation, content that overlaps with the above description is omitted.

[0076] Referring to FIGS. 11 and 12, the substrate processing apparatus (7) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) within the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) within the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), an electrode structure (28) connected to the attachment member (31), and a light-emitting structure (27) connected to the electrode structure (28). It may also include a rotating member (32) for fixing and rotating the light-emitting structure (27).

[0077] The electrode structure (28) and the light-emitting structure (27) may be spaced apart. The spaced electrode structure (28) and the light-emitting structure (27) may be connected by a connecting member (41). The connecting member (41) may connect the side of the electrode structure (28) and the side wall of the light-emitting structure (27). Multiple connecting members (41) may be provided. The connecting member (41) may include an insulating material. The protective housing (21) and the cover member (24) may be connected by the connecting member (41).

[0078] The electrode structure (28) may include an electrode (22) and a protective housing (21) surrounding the electrode (22). The electrode (22) may be provided perpendicular to the upper surface of the substrate (12). The electrode (22) may have a shape extending in a third direction (D3). The electrode (22) may be positioned in the center of the electrode structure (28). The electrode (22) may have a cylindrical core shape. The protective housing (21) may have a ring shape surrounding the electrode (22).

[0079] The light-emitting structure (27) may include a light source unit (23) and a cover member (24) surrounding the light source unit (23). The light source unit (23) may be positioned in the center of the light-emitting structure (27). The light source unit (23) may have a cylindrical core shape. The cover member (24) may have a ring shape surrounding the light source unit (23).

[0080] An axis located along the longitudinal direction of the light source unit (23) can be defined as the length axis (LX). A rotating member (32) can be connected to the axis located along the longitudinal direction of the light source unit (23). The rotating member (32) can be rotated clockwise or counterclockwise. As the rotating member (32) is rotated, the light source unit (23) and the light-emitting structure (27) can also be rotated. From a planar perspective, the rotating member (32) can overlap with the center of the light-emitting structure (27). The height (H22) of the electrode (22) and the height (H21) of the protective housing (21) can be the same.

[0081] The upper surface of the light source unit (23) and the substrate (12) can form a first angle (θ1). More specifically, the length axis (LX) of the light source unit (23) and the upper surface of the substrate (12) can form a first angle (θ1). The first angle (θ1) can be an acute angle. Since the first angle (θ1) can be an acute angle, the opposite side of the first angle (θ1) can be an obtuse angle. In other words, depending on the direction in which the angle is measured, the length axis (LX) of the light source unit (23) and the upper surface of the substrate (12) can form an obtuse angle. The first angle (θ1), which is the angle formed by the length axis (LX) of the light source unit (23) and the upper surface of the substrate (12), can be an acute angle, and the angle in the opposite direction of the first angle (θ1), which is formed by the length axis (LX) of the light source unit (23) and the upper surface of the substrate (12), can be an obtuse angle. The first angle (θ1) may not be a right angle.

[0083] FIG. 13 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 14 is a plan view for explaining a planarization unit of the substrate processing apparatus of FIG. 13. For the sake of simplicity of explanation, content that overlaps with the above description is omitted.

[0084] Referring to FIGS. 13 and 14, the substrate processing apparatus (8) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), an electrode structure (28) connected to the attachment member (31), and a light-emitting structure (27) connected to the electrode structure (28).

[0085] The electrode structure (28) and the light-emitting structure (27) may be spaced apart. The spaced electrode structure (28) and the light-emitting structure (27) may be connected by a connecting member (41). The connecting member (41) may connect the side of the electrode structure (28) and the side wall of the light-emitting structure (27). Multiple connecting members (41) may be provided. The protective housing (21) and the cover member (24) may be connected by the connecting member (41).

[0086] From a planar perspective, the electrode structure (28) may have a cylindrical shape. More specifically, the electrode structure (28) may have a cylindrical shape in which an electrode (22) is disposed in the center and a protective housing (21) surrounds the electrode (22).

[0087] From a planar perspective, the light-emitting structure (27) may have a ring shape surrounding the electrode structure (28). The light-emitting structure (27) may include a ring-shaped light source unit (23) and may include a cover member (24) surrounding the outer wall and inner wall of the light source unit (23). The cover member (24) may be composed of a ring surrounding the outer wall of the light source unit (23) and a ring surrounding the inner wall of the light source unit (23). The cover member (24) surrounding the inner wall of the light source unit (23) and the electrode structure (28) may be connected by a connecting member (41). The cover member (24) surrounding the inner wall of the light source unit (23) and the protective housing (21) may be connected.

[0088] An electrode structure (28) may be disposed in the hollow in the center of a ring-shaped light-emitting structure (27). The light-emitting structure (27) and the electrode structure (28) may be concentrically arranged to share a center.

[0089] The inclined axis (AX) of the light source unit (23) and the upper surface of the substrate (12) may form a second angle (θ2). In the substrate processing device (8), the inclined axis (AX) of the light source unit (23) may be defined as an axis passing through the center of the upper surface and the center of the lower surface of the light source unit (23) in a cross-sectional view. The second angle (θ2) may be an acute angle. Depending on the measurement direction, the second angle (θ2) may be an obtuse angle. The second angle (θ2) may not be a right angle.

[0090] The height (H23) of the light source unit (23) and the height (H22) of the electrode (22) may be substantially the same. As the inclined axis (AX) of the light source unit (23) and the upper surface of the substrate (12) form a second angle (θ2), the height (H23) of the light source unit (23) in the third direction and the length of the light source unit (23) may be different. The length of the light source unit (23) may be defined as the length connecting the center of the upper surface and the center of the lower surface of the light source unit (23) in a cross-sectional view. The length of the light source unit (23) may be longer than the length of the electrode (22).

[0092] FIG. 15 is a cross-sectional view showing a substrate processing apparatus according to embodiments of the present invention. FIG. 16 is a plan view for explaining a planarization unit of the substrate processing apparatus of FIG. 15. For the sake of simplicity of explanation, content that overlaps with the above description is omitted.

[0093] Referring to FIGS. 15 and 16, the substrate processing apparatus (9) of the present invention may include a lower electrode (11), a substrate (12) on the lower electrode (11), a pattern (13) in the substrate (12), a reaction chamber (15) on the lower electrode (11), an electrolyte (14) in the reaction chamber (15), an attachment member (31) connected to the upper part of the reaction chamber (15), an electrode structure (28) connected to the attachment member (31), and a light-emitting structure (27) connected to the electrode structure (28).

[0094] The electrode structure (28) and the light-emitting structure (27) may be spaced apart. The spaced electrode structure (28) and the light-emitting structure (27) may be connected by a connecting member (41). The connecting member (41) may connect the side of the electrode structure (28) and the side wall of the light-emitting structure (27). Multiple connecting members (41) may be provided. A protective housing (21) and a cover member (24) may be connected by a connecting member (41). Multiple light-emitting structures (27) may be provided.

[0095] Referring again to FIG. 16, from a planar perspective, the electrode structure (28) may be surrounded by four light-emitting structures (27). The four light-emitting structures (27) may be spaced apart from each other. More specifically, the four light-emitting structures (27) may form an annular structure surrounding the electrode structure (28). The four light-emitting structures (27) may be arranged in a four-part ring. In an embodiment of the present invention, the electrode structure (28) is described as being surrounded by four light-emitting structures (27), but n light-emitting structures (27) instead of four may surround the electrode structure (28). In other words, the number of light-emitting structures (27) surrounding the electrode structure (28) is not limited.

[0096] Referring again to FIGS. 15 and 16, the angle of a plurality of light-emitting structures (27) can be adjusted by a rotating member (32). Similar to the inclination axis (AX) in FIGS. 13 and 14, the light-emitting structure (27) may have an inclination axis (AX). Similar to the second angle (θ2) in FIGS. 13 and 14, the light-emitting structure (27) may have a second angle (θ2). The second angle (θ2) can be adjusted by a rotating member (32).

[0097] The electrode structure (28) may include an electrode (22) positioned at the center and a protective housing (21) surrounding the electrode (22). The light-emitting structure (27) may include a light source unit (23) positioned in the center and a cover member (24) positioned in contact with the outer and inner walls of the light source unit (23).

[0098] The height (H22) of the electrode (22) may be the same as the height (H23) of the light source unit (23). Since the light source unit (23) has a second angle (θ2) with respect to the upper surface of the substrate (12), the length of the light source unit (23) may differ from the height (H23) of the light source unit (23). The length defined by connecting the midpoint of the upper surface of the light source unit (23) and the midpoint of the lower surface of the light source unit (23) in a cross-sectional view may be smaller than the height (H23) of the light source unit (23).

[0099] Since the light source unit (23) is provided in an annular shape and the angle of the light source unit (23) can be adjusted by the rotating member (32), light can be irradiated onto a desired part of the pattern (13). The flattening of the pattern (13) can be carried out more efficiently.

[0100] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0102] 11: Lower electrode 12: Substrate 13 : Pattern 14: Electrolyte solution 15: Reaction chamber 21: Protective housing 22 : Electrode 23 : Light source unit 24: Cover missing 31: Connecting member 41: Connecting member

Claims

Claim 1 A lower electrode; a reaction chamber on the lower electrode; an electrolyte solution within the reaction chamber; and a flattening unit in contact with the electrolyte solution, wherein the flattening unit comprises: A light source unit disposed within the above reaction chamber, and It includes an electrode in contact with the light source unit, and The above electrolyte solution comprises a photosensitive agent and a photoinitiator, in a substrate processing device. Claim 2 A substrate processing device according to claim 1, wherein the light source unit is positioned in the center of the flattening unit and the electrode is positioned to surround the light source unit. Claim 3 A substrate processing apparatus according to claim 1, wherein the photosensitive agent comprises at least one of melanin, chlorophyll, hemoglobin, beta-carotene, and carbon black. Claim 4 A substrate processing apparatus according to claim 1, wherein the photoinitiator comprises at least one of benzoyl peroxide, 2,2-dimethoxy-2-phenylacetophenone, and 2,2'-azobis[2-methyl-n-(2-hydroxylethyl)propionamide]. Claim 5 A substrate processing device according to claim 1, wherein the planarization unit further comprises a cover member between the light source unit and the electrode, and the height of the light source unit is longer than the height of the electrode. Claim 6 A substrate processing device according to claim 1, wherein the planarization unit further comprises a protective housing surrounding the electrode, and the height of the protective housing and the height of the electrode are the same. Claim 7 A substrate processing apparatus according to claim 1, wherein the flattening unit further includes a cover member surrounding the side and bottom surface of the light source unit, the height of the light source unit is smaller than the height of the electrode, and the light source unit and the electrolyte solution are spaced apart. Claim 8 A substrate processing device according to claim 1, wherein the planarization unit further comprises a protective housing in contact with the light source unit and in contact with the electrolyte solution, the electrode is positioned in the center of the planarization unit, and the light source unit is positioned to surround the electrode. Claim 9 In claim 8, the planarization unit further comprises a cover member interposed between the electrode and the light source unit, and the height of each of the electrode and the cover member is longer than the height of the light source unit, a substrate processing device. Claim 10 A lower electrode; a reaction chamber on the lower electrode; an electrolyte solution within the reaction chamber; and a flattening unit in contact with the electrolyte solution, wherein the flattening unit comprises: A light source unit positioned in the center of the above-mentioned flattening unit, A substrate processing device comprising electrodes surrounding the light source unit.

Images