Heat dissipation apparatus for display device
Patent Information
- Authority / Receiving Office
- KR · KR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-05
- Publication Date
- 2026-08-12
Smart Images

Figure PAT00001_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to a heat dissipation device for a display device, and more specifically, to a heat dissipation device for a display device into which an operating fluid is injected for cooling an electronic device. Background Technology
[0002] Today's trend toward the miniaturization and integration of electronic devices is rapidly increasing the amount of heat generated per unit area within these devices. This increase in heat per unit area directly impacts the performance and operating lifespan of electronic devices. Consequently, the development of cooling devices capable of effectively dissipating the heat generated within these devices has emerged as a critical issue.
[0003] In addition, display devices such as video display devices for electronic products, OLED TVs and monitors, and smartphones are becoming larger in screen size while their thickness is gradually decreasing. In response to this trend of larger and thinner display devices, heat sinks for display devices are also required to be thin while possessing high heat dissipation performance. In particular, for display devices applied to TVs and monitors, as the demand for larger sizes increases, there is also an increasing demand for lighter and slimmer TV structures, along with higher quality and clarity of image quality.
[0004] One of the various next-generation cooling devices proposed in this context is the vibrating heat pipe. The vibrating heat pipe, which does not contain a complex wick structure inside, is a device that transfers heat through the self-vibration of liquid slugs and bubble slugs formed by filling a certain amount of working fluid inside a curved capillary tube.
[0005] On the other hand, the heat dissipation sheet is attached to the back cover via an adhesive material such as double-sided tape, and heat is dissipated by absorbing heat generated from the display panel and either releasing it directly to the outside or transferring it to the back cover. However, due to the principle of heat diffusion, heat transfer occurs in the horizontal direction, resulting in poor heat dissipation performance; furthermore, because the thermal conductivity in the vertical direction is low, sufficient heat dissipation effect is not achieved. Additionally, there are handling issues, such as the sheet easily breaking or being damaged.
[0006] A heat sink structure that satisfactorily meets the above requirements has not been known to date. In other words, there was a problem in that increasing the heat dissipation performance of the heat sink in response to the enlargement of display panels required increasing the thickness of the heat sink, which failed to meet the requirements for thinning the display panel; conversely, if the thickness of the heat sink was reduced to accommodate thinning the display panel, it failed to provide sufficient heat dissipation performance.
[0007] Furthermore, there are various causes for the temperature increase of displays, including the temperature of the surrounding environment and heat generated as the display becomes brighter due to high ambient light. In particular, as displays become larger in size, efficient cooling is becoming an increasingly urgent requirement. The problem to be solved
[0008] One embodiment of the present invention provides a heat dissipation device for a display device in which, when a grid-shaped internal channel is implemented, adjacent paths through which the working fluid can move are secured even if blockage occurs at one or more points, thereby significantly reducing the impact on the overall internal working fluid flow phenomenon, enabling performance to be secured and increasing the reliability of performance quality assurance.
[0009] In addition, according to one embodiment of the present invention, a heat dissipation device for a display device is provided that is differentiated by the fact that, in the case of a grid-type channel structure, it can be effectively utilized in various environments through the advantages of simple design and high production efficiency.
[0010] The problems that the present invention aims to solve are not limited to those mentioned above, and other problems not mentioned herein will be clearly understood by those skilled in the art from the description below. means of solving the problem
[0011] A heat dissipation device for a display device according to one embodiment of the present invention is a heat dissipation device for a display device in which evaporation and condensation occur as a working fluid circulates through a fluid channel formed inside, wherein the heat dissipation device includes a heat dissipation plate in which a fluid channel is formed inside, and columns are arranged in a grid shape on the heat dissipation plate so that the working fluid can circulate through the fluid channel formed by the columns.
[0012] The heat dissipation plate may include a first plate; and a second plate in which a column is formed internally and one surface of the first plate and the column are joined to be combined with the first plate.
[0013] A geometric boundary area is set in the center of the second plate, and the column may include a first column disposed inside the boundary area; and a second column disposed outside the boundary area.
[0014] The spacing between the first columns and the spacing between the second columns can be formed differently from each other.
[0015] The spacing between the first columns can be formed wider than the spacing between the second columns.
[0016] The spacing between the first pillars may be 3mm, and the spacing between the second pillars may be 2mm.
[0017] The spacing between the first columns may be formed narrower than the spacing between the second columns.
[0018] The spacing between the first pillars is 2mm, and the spacing between the second pillars may be 3mm.
[0019] The above boundary region may be rhombus-shaped.
[0020] The second plate is divided into a first area, a second area, and a third area along the vertical direction, and the first area and the third area are formed symmetrically with respect to each other with respect to the second area, and the column may include a first column disposed in the first area and the third area; and a second column disposed in the second area.
[0021] The spacing between the first columns and the spacing between the second columns can be formed differently from each other.
[0022] The above fluid channel includes a first fluid channel arranged in a horizontal direction; and a second fluid channel arranged in a vertical direction, and the spacing between the first fluid channel and the second fluid channel may be formed differently.
[0023] The above column may have a cross-section of a geometric shape.
[0024] The above column may have a square cross-section, a circular cross-section, or a rhombus cross-section.
[0025] The above columns may be arranged staggered with respect to the columns placed in other adjacent columns or rows. Effects of the invention
[0026] According to one embodiment of the present invention, when an internal channel shape in the form of a grid is implemented, an adjacent path through which the working fluid can move is secured even if blockage occurs at one or more points, so the impact on the overall internal working fluid flow phenomenon is significantly reduced, thereby enabling performance to be secured and increasing the reliability of ensuring the quality of performance.
[0027] In addition, according to one embodiment of the present invention, the grid-type channel structure has the advantage of being effectively utilized in various environments through its simple design and high production efficiency. Brief explanation of the drawing
[0028] FIG. 1 is a diagram illustrating the coupling relationship of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 2 is a drawing illustrating a comparison of a grid-shaped channel structure of a heat dissipation device for a display device according to one embodiment of the present invention with a conventional one. FIG. 3 is a drawing illustrating an example of a second plate of a heat dissipation device for a display device according to an embodiment of the present invention. FIG. 4 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 5 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 6 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 7 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 8 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 9 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 10 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. FIG. 11 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention. Specific details for implementing the invention
[0029] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention. In describing the present invention, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the present invention.
[0030] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.
[0031] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.
[0032] Furthermore, throughout the specification, when the term "connected" is used, it does not mean only that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are connected not only physically but also electrically, or that they are a single unit although referred to by different names depending on their location or function.
[0033] Furthermore, when described as being formed or placed on the “top or bottom” of each component, “top or bottom” includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as “top or bottom,” it may include the meaning of a downward direction as well as an upward direction relative to a single component.
[0034] Hereinafter, an embodiment of a heat dissipation device for a display device according to the present invention will be described in detail with reference to the accompanying drawings. In describing with reference to the accompanying drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.
[0035] FIG. 1 is a diagram illustrating the coupling relationship of a heat dissipation device for a display device according to one embodiment of the present invention.
[0036] Referring to FIG. 1, a heat dissipation device for a display device according to one embodiment of the present invention relates to a heat dissipation device for a display device in which evaporation and condensation occur as a working fluid circulates through a fluid channel formed inside, wherein the heat dissipation device includes a heat dissipation plate (10) in which a fluid channel (220) is formed inside, and columns (210) are arranged in a grid shape on the heat dissipation plate (10) so that the working fluid can circulate through the fluid channel (220) formed by the columns (210).
[0037] The heat dissipation plate (10) can be manufactured by forming a thin sheet of a metal material with excellent thermal conductivity, for example, aluminum, stainless steel, and steel. The heat dissipation plate (10) can preferably be manufactured from a thin sheet of aluminum, taking into consideration thermal conductivity, formability, and manufacturing cost.
[0038] In this embodiment, a channel structure is formed inside the heat dissipation plate (10), which can be formed by columns (210) arranged vertically inside the heat dissipation plate (10). The columns (210) are arranged in a grid shape, and fluid channels (220) through which a working fluid circulates are formed between the columns (210). The heat dissipation plate (10) having such a structure is a heat pipe structure through which a working fluid circulates, and can include an evaporation section, a gas phase section, a condensation section, and a liquid phase section.
[0039] A heat dissipation plate (10) may include a first plate (100) and a second plate (200) in which the column (210) is formed internally and the column (210) is joined to one side of the first plate (100) and the first plate (100). A border wall (202) is formed at the edge of the second plate (200), and the column (210) may be arranged in a grid shape inside the border wall (202). A grid shape arrangement means that the column (210) is arranged in multiple columns and rows.
[0040] This is merely an example of an embodiment, and the column (210) may be provided on the inner side of the first plate (100). Importantly, the column (210) must be joined to the plate to form a fluid channel (220). The column (210) may have a rectangular cross-section, but is not limited thereto and may have a cross-section of various shapes.
[0041] In this way, by forming fluid channels (220) inside the first plate (100) and the second plate (200) constituting the heat dissipation plate (10) to form an evaporation structure that facilitates the flow of working fluid in the longitudinal direction, a vibrating heat pipe having a structure (pillar) having self-vibration of the working fluid can be realized, which effectively dissipates heat generated from a large-area display panel and significantly improves heat dissipation performance.
[0042] The heat dissipation plate (10) is made of aluminum, and when heat is conducted through the heat-generating part, heat is transferred through the working fluid. Heat transfer varies depending on the flow rate and surface area; while increasing the flow rate improves cooling performance, it causes a pressure drop, so the flow rate must be determined according to the cooling capacity. In addition, the channel structure of the present invention features a cooling solution that is simple in design, easy to integrate into a system, low cost, and widely adoptable.
[0043] Since the grid-shaped channel structure of the present invention provides a larger surface area, the heat transfer rate is improved, and the heat transfer rate (Q) can be increased.
[0044] Furthermore, the grid-shaped channel structure generates turbulence through irregular fluid flow, enhancing mixing within the working fluid and improving heat transfer performance by increasing the heat transfer coefficients and heat exchange rates at the evaporation and condensation surfaces. By thinning the thermal and kinetic boundary layer of the working fluid, heat transfer resistance is reduced and heat transfer efficiency is increased. The turbulence induces vibrations, thereby reinforcing abnormal flow patterns, maintaining a uniform temperature distribution, and simultaneously preventing localized performance degradation.
[0045] As described above, the generation of turbulence increases the Reynolds number, which raises the heat transfer coefficient and can further promote heat transfer. Accordingly, when turbulent flow occurs through a grid-shaped channel, the Reynolds number increases.
[0046] FIG. 2 is a drawing illustrating a comparison of a grid-shaped channel structure of a heat dissipation device for a display device according to one embodiment of the present invention with a conventional one.
[0047] Referring to FIG. 2, when comparing a conventional channel structure (closed-loop type) (a) and a grid-shaped channel structure (grid type) (b) of the present invention, it can be seen that the degree of heat distribution in the grid-shaped channel structure is spread relatively evenly. By spreading the degree of heat distribution evenly and widely in this way, the heat dissipation effect of the heat dissipation device can be enhanced.
[0048] In terms of blockage of internal channels during a series of manufacturing processes such as joining processes (brazing processes), in the case of the closed-loop type used in traditional vibrating heat pipes (PHP), channels may become blocked due to melting and leakage of flux during the brazing process. If a continuous channel becomes blocked at any point in the middle, the entire channel cannot be operated, making the manufacturing process difficult and management challenging.
[0049] On the other hand, when implementing a grid-shaped internal channel configuration, adjacent paths through which the working fluid can move are secured even if blockage occurs at one or multiple points, so the impact on the overall internal working fluid flow phenomenon is significantly reduced, thereby enabling performance assurance and increasing the reliability of performance quality assurance.
[0050] Therefore, compared to the closed-loop type in the bonding process, the grid-type channel structure offers higher productivity due to lower production defect rates and greater quality reliability. Furthermore, it has high utility value as it ensures high-performance operability even when the display's heat points are located at random positions. While the closed-loop type makes it difficult to optimize complex designs, precise manufacturing processes, and heat transfer performance, the grid-type channel structure offers a distinct advantage in that it can be effectively utilized in various environments thanks to its simple design and high production efficiency.
[0051] Below, we will examine various embodiments of forming a fluid channel (220) through a column (210).
[0052] FIG. 3 is a drawing illustrating one example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention, and FIG. 4 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention.
[0053] Referring to FIG. 3, a rhombus-shaped boundary area (300) is set in the center of the heat dissipation plate (10), and the pillars (210) may include a first pillar (212) positioned inside the boundary area (300) and a second pillar (214) positioned outside the boundary area (300).
[0054] A boundary area (300) with a geometric shape such as a rhombus is set in the center of the second plate (200), and the size of the boundary area (300), for example, the lengths of the long and short sides, can be set differently depending on the display panel. The working fluid undergoes a phase change while circulating through the fluid channel (220), and the inner side of the boundary area (300) can be applied as a condensation section and the outer side as an evaporation section. This is because the spacing between the first pillars (212) shown in FIG. 3 is formed wider than the spacing between the second pillars (214). For example, the spacing between the first pillars (212) placed inside the boundary area (300) can be 3 mm, and the spacing between the second pillars (214) can be 2 mm.
[0055] When the gap between the second column (214) is formed narrowly, vaporization (phase change) occurs along with the capillary action of the working fluid due to the heat of the heating element located on the outer side of the boundary region (300), and the latent heat and vapor pressure generated at this time can induce the working fluid to move rapidly into the inner side of the boundary region (300) to release heat.
[0056] In this way, the working fluid moves into the inner fluid channel (220) of the boundary region (300) and a condensation portion is formed, and as the vapor pressure increases accordingly, the working fluid moves outward, and the efficiency of heat dissipation is improved due to the even movement of the working fluid through the working fluid phase change phenomenon.
[0057] Referring to FIG. 4, contrary to the embodiment illustrated in FIG. 3, the spacing between the first columns (212) may be formed narrower than the spacing between the second columns (214). For example, the spacing between the first columns (212) placed inside the boundary area (300) may be 2 mm, and the spacing between the second columns (214) may be 3 mm. When the columns (210) are arranged in this way, the inner side of the boundary area (300) may be applied as an evaporation section and the outer side as a condensation section. Similarly, a phase change of the working fluid occurs due to the heat source located in the center, and due to the latent heat and vapor pressure generated at this time, the working fluid moves to the outer fluid channel (220) to generate a heat dissipation effect.
[0058] FIG. 5 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention, and FIG. 6 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention.
[0059] Referring to FIG. 5, the second plate (200) is divided into a first area (400), a second area (410), and a third area (420) along the vertical direction, and the first area (400) and the third area (420) are formed symmetrically with respect to each other with respect to the second area (410), and the column (210) may include a first column (212) placed in the first area (400) and the third area (420), and a second column (212) placed in the second area (410).
[0060] This embodiment utilizes the same operating principle as the embodiment illustrated in FIGS. 3 and FIGS. 4. In this embodiment, the spacing between the first columns (212) may be formed wider than the spacing between the second columns (214). For example, the spacing between the first columns (212) placed inside the boundary area (300) may be 3 mm, and the spacing between the second columns (214) may be 2 mm. When the columns (210) are arranged in this manner, the inner side of the boundary area (300) can be applied as a condensation section and the outer side as an evaporation section. Due to the heat generation section located in the center (second area (410)), a phase change of the working fluid occurs, and due to the latent heat and vapor pressure generated at this time, the working fluid moves to the outer fluid channel (220), thereby generating a heat dissipation effect.
[0061] Referring to FIG. 6, the spacing between the first columns (212) may be formed to be narrower than the spacing between the second columns (214). For example, the spacing between the first columns (212) placed inside the boundary area (300) may be 2 mm, and the spacing between the second columns (214) may be 3 mm. When the columns (210) are arranged in this way, the inside of the first boundary area (300) may be applied as an evaporation section and the outside as a condensation section. Due to the heat generation section located in the first area (400) and the third area (430), a phase change of the working fluid occurs, and due to the latent heat and vapor pressure generated at this time, the working fluid moves to the fluid channel (220) on the outside to generate a heat dissipation effect.
[0062] FIG. 7 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention, and FIG. 8 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention.
[0063] Referring to FIG. 7, in this embodiment, the columns (210) are arranged in a grid shape, and the fluid channel (220) may include a first fluid channel (222) arranged in a horizontal direction and a second fluid channel (224) arranged in a vertical direction. Also, the spacing between the first fluid channel (222) and the second fluid channel (224) may be formed differently.
[0064] In the embodiment illustrated in FIG. 7, the spacing of the first fluid channel (222) can be formed wider than the spacing of the second fluid channel (224). Then, the capillary action of the second fluid channel (224), i.e., the vertical channel, can be maximized, and the operability of the working fluid can be increased when a heater point is located on the upper or lower side.
[0065] In the embodiment illustrated in FIG. 8, the spacing of the first fluid channel (222) may be formed narrower than the spacing of the second fluid channel (224). Then, the capillary action of the first fluid channel (222), i.e., the transverse channel, can be maximized, and the operability of the working fluid can be enhanced when a heater point is located on the left or right side.
[0066] FIG. 9 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention, and FIG. 10 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention.
[0067] Referring to FIGS. 9 and 10, the column (210) may have a circular cross-section or a rhombus-shaped cross-section. That is, any cross-section capable of generating turbulence during the circulation of the working fluid may be adopted for the column (210). The column (210) can circulate the working fluid between the condenser and the evaporator as long as it is arranged in a grid shape.
[0068] FIG. 11 is a drawing illustrating another example of a second plate of a heat dissipation device for a display device according to one embodiment of the present invention.
[0069] Referring to FIG. 11, in this embodiment, the columns (210) may be arranged alternately with other columns (210) placed in adjacent columns or rows. That is, the columns (210) may be arranged alternately with adjacent columns or rows along the horizontal or vertical direction.
[0070] Although the present invention has been described above with reference to specific embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols
[0071] 10: Heat dissipation plate 100: First plate 200: Second plate 210: Pillar 212: First Pillar 214: Second Pillar 220: Fluid channel 222: First fluid channel 224: Second fluid channel 300: Boundary area 400: Zone 1 410: Second Zone 420: Third Zone
Claims
Claim 1 A heat dissipation device for a display device in which evaporation and condensation occur as a working fluid circulates through a fluid channel formed inside, wherein the heat dissipation device comprises a heat dissipation plate in which a fluid channel is formed inside, and columns are arranged in a grid shape on the heat dissipation plate so that the working fluid circulates through the fluid channel formed by the columns. Claim 2 A heat dissipation device for a display device according to claim 1, wherein the heat dissipation plate comprises: a first plate; and a second plate having a column formed therein and one surface of the first plate joined to the column and combined with the first plate. Claim 3 A heat dissipation device for a display device according to paragraph 2, wherein a geometric boundary area is set in the center of the second plate, and the columns include a first column disposed inside the boundary area; and a second column disposed outside the boundary area. Claim 4 A heat dissipation device for a display device according to paragraph 3, wherein the spacing between the first pillars and the spacing between the second pillars are formed differently from each other. Claim 5 A heat dissipation device for a display device according to claim 4, wherein the spacing between the first pillars is formed wider than the spacing between the second pillars. Claim 6 A heat dissipation device for a display device according to claim 5, wherein the spacing between the first pillars is 3 mm and the spacing between the second pillars is 2 mm. Claim 7 A heat dissipation device for a display device according to claim 4, wherein the spacing between the first pillars is formed to be narrower than the spacing between the second pillars. Claim 8 A heat dissipation device for a display device according to claim 7, wherein the spacing between the first pillars is 2 mm and the spacing between the second pillars is 3 mm. Claim 9 In paragraph 3, the above boundary region is a rhombus-shaped heat dissipation device for a display device. Claim 10 In paragraph 2, the second plate is divided into a first region, a second region, and a third region along the vertical direction, and the first region and the third region are formed symmetrically with respect to each other with respect to the second region, and the column comprises a first column disposed in the first region and the third region; and a second column disposed in the second region, for a heat dissipation device for a display device. Claim 11 A heat dissipation device for a display device according to claim 10, wherein the spacing between the first pillars and the spacing between the second pillars are formed differently from each other. Claim 12 A heat dissipation device for a display device according to claim 1, wherein the fluid channel comprises a first fluid channel arranged in a horizontal direction; and a second fluid channel arranged in a vertical direction, and the spacing between the first fluid channel and the second fluid channel is formed differently. Claim 13 In claim 1, the column is a heat dissipation device for a display device having a cross-section of a geometric shape. Claim 14 In paragraph 13, the above column is a heat dissipation device for a display device having a square cross-section, a circular cross-section, or a rhombus cross-section. Claim 15 A heat dissipation device for a display device according to claim 1, wherein the columns are arranged staggered with respect to the columns arranged in adjacent columns or rows.