Polygonal panel bending suppression work platform and method for suppressing bending thereof, dispensing device, panel chip level underfill equipment and polygonal panel work method

Abstract

A polygonal panel bending suppression work platform, a polygonal panel bending suppression method, a dispensing device, a panel chip level underfill equipment, and a polygonal panel work method are disclosed. The polygonal panel bending suppression work platform comprises: a support member that supports a polygonal panel; a support mechanism located below the support member and movable along a vertical direction, capable of supporting a polygonal panel when its support end protrudes from the support member; a lifting mechanism capable of moving the support mechanism up and down along a vertical direction, wherein the polygonal panel is supported on the support mechanism when the support mechanism moves upward and the polygonal panel is supported on the support member when the support mechanism moves downward; and a plurality of flattening mechanisms, wherein one of the flattening mechanisms corresponds to one side of the support member, and when a polygonal panel is placed on the support member, the plurality of flattening mechanisms simultaneously press a plurality of edge portions of the polygonal panel downward, respectively, thereby bonding the polygonal panel to the support member.

Description

Technology Field

[0001] The present disclosure claims priority to a Chinese patent application filed with the National Intellectual Property Administration of China on October 31, 2024, with application number 202411541572.0 and titled "Panel chip level underfill equipment and wafer working method thereof," and priority to a Chinese patent application filed with the National Intellectual Property Administration of China on October 31, 2024, with application number 202411541584.3 and titled "Polygonal panel warping suppression working platform and warping suppression method thereof," the entire contents of which are incorporated into the present application by reference.

[0002] The present disclosure relates to the field of warping suppression technology, and more specifically, to a polygonal panel warping suppression work platform and a warping suppression method thereof, a dispensing device, a panel chip level underfill equipment and a polygonal panel work method. Background Technology

[0003] Panel chip-level underfill is currently a prominent research direction in the chip field, and panel-level packaging is an advanced packaging process that implements fan-out wiring within a large area. With the advancement of the semiconductor industry, factors such as increased wiring density and growing demand for I / O ports are jointly driving the development of fan-out packaging. Fan-out packaging is divided into Fan-Out Wafer Level Packaging (FOWLP) and Fan-Out Panel Level Packaging (FOPLP); the difference between the two lies in the substrate, and the substrate for panel-level packaging transitions from 8-inch / 12-inch wafer carriers to large-sized polygonal panels. Panel-level packaging offers advantages such as high area utilization, low waste, a large number of chips per package, and higher packaging efficiency. As panel area increases, chip manufacturing costs can be significantly reduced; switching from 200mm to 300mm can save approximately 25% of costs, while switching from 300mm to panel-level packaging can save 66%.

[0004] Large polygonal panels (e.g., 600mm x 600mm) used in panel-level packaging are relatively fragile and warp more easily than 8-inch or 12-inch wafers (the amount of warping can reach 10mm). Furthermore, if dispensing is performed directly while the panel is warped, it is very easy to scratch the chips on the panel. Currently, the warping of large polygonal panels is handled using a manual pressing method, where an operator manually flattens the warped edges of the panel onto a work platform and then attaches the panel to the platform using vacuum suction. This method not only has low work efficiency but also makes the panel prone to damage. The problem to be solved

[0005] The present disclosure aims to solve at least one of the technical problems existing in the prior art.

[0006] To this end, the present disclosure provides a polygonal panel bending suppression work platform and method. means of solving the problem

[0007] A polygonal panel bending suppression work platform according to a first aspect embodiment of the present disclosure is,

[0008] A support member that supports the polygonal panel, the shape of which matches the shape of the polygonal panel;

[0009] A support mechanism located below the above-mentioned support and movable along a vertical direction, capable of supporting the polygonal panel when its support end protrudes from the above-mentioned support;

[0010] A lifting mechanism capable of moving the support mechanism up and down along a vertical direction, wherein when the support mechanism moves upward, the polygonal panel is supported on the support mechanism; and when the support mechanism moves downward, the polygonal panel is supported on the support member; and

[0011] It includes a plurality of flattening mechanisms—one of the flattening mechanisms corresponds to one side of the support, and when the polygonal panel is placed on the support, the plurality of flattening mechanisms simultaneously press downward on each of the plurality of edge portions of the polygonal panel to bond the polygonal panel to the support.

[0012] The beneficial effect of the present disclosure is that the present disclosure can improve synchronization when lifting large-sized polygonal panels through a lifting mechanism and can simultaneously flatten multiple edges of polygonal panels through a plurality of flattening mechanisms. The present disclosure can not only implement automated warping suppression processing but also reduce damage to the panels.

[0013] According to one embodiment of the present disclosure, the support mechanism comprises a support plate and a support assembly, wherein the support plate is connected to the lifting mechanism, the lower end of the support assembly is connected to the support plate, and a plurality of through holes are opened in the support member to allow the support assembly to move, and when the polygonal panel is supported on the support assembly, the support assembly protrudes from the support member by penetrating the through holes, and when the polygonal panel is supported on the support member, the support assembly retracts into the through holes.

[0014] According to one embodiment of the present disclosure, the support assembly includes a plurality of first support members, the positions of the plurality of first support members correspond to the edge portions of the support plate, and the plurality of first support members jointly support the edge of the polygonal panel.

[0015] According to one embodiment of the present disclosure, the support assembly further includes a second support member, the position of which corresponds to the center of the support plate, and the second support member assists a plurality of the first support members to jointly support the polygonal panel.

[0016] According to one embodiment of the present disclosure, a stepped surface is installed at the support end of the first support member to contact the edge of the polygonal panel.

[0017] According to one embodiment of the present disclosure, the lifting mechanism is,

[0018] A plurality of screw lifting assemblies connected to the support mechanism and operating simultaneously to control the support mechanism to rise and fall synchronously as a whole; and

[0019] A lifting drive assembly comprising a lifting drive member and a power belt—the power belt is simultaneously power-connected to a plurality of screw lifting assemblies, and the lifting drive member drives the plurality of screw lifting assemblies to operate simultaneously through the power belt—including

[0020] When the output shaft of the lifting drive member rotates in the forward direction, the support mechanism can be driven to rise synchronously as a whole, and when the output shaft of the lifting drive member rotates in the reverse direction, the support mechanism can be driven to descend synchronously as a whole.

[0021] According to one embodiment of the present disclosure, the lifting drive assembly further comprises a plurality of electric gears and idler gears, the electric gears are connected to the screw lifting assembly, and the electric belt is wound on the electric gears and idler gears to implement electric power.

[0022] According to one embodiment of the present disclosure, the flattening mechanism can change its height by extending in the longitudinal direction and change its distance from the support by extending in the transverse direction.

[0023] According to one embodiment of the present disclosure, the flattening mechanism comprises a longitudinal drive assembly, a transverse drive assembly, a pressure plate, and a universal pressure head, wherein the universal pressure head is installed on the pressure plate, the pressure plate is connected to the transverse drive assembly, and the transverse drive assembly is connected to the longitudinal drive assembly.

[0024] According to one embodiment of the present disclosure, the universal pressure head comprises a connector and a ball, most of the volume of the ball is located within a receiving groove of the connector, the connector is installed within a mounting hole of the pressure plate, and when the ball comes into contact with the edge of a polygonal panel, the ball can self-adaptively adjust the contact position with the edge as the amount of bending of the polygonal panel decreases during the process in which the flattening mechanism presses the edge of the polygonal panel downward.

[0025] According to one embodiment of the present disclosure, a heating module is installed on the support, and when the polygonal panel is supported on the support, the heating module heats the polygonal panel.

[0026] According to one embodiment of the present disclosure, a vacuum adsorption module is installed on the support, and a plurality of adsorption channels are opened on the upper surface of the vacuum adsorption module.

[0027] According to one embodiment of the present disclosure, the polygonal panel is a wafer.

[0028] A method for suppressing polygonal panel bending according to a second aspect embodiment of the present disclosure is,

[0029] S1, a step of placing a polygonal panel on the top of a support, moving a support mechanism driven by a lifting mechanism upward and protruding it from the support to support the polygonal panel;

[0030] S2, a step of driving the lifting mechanism to gradually lower the support mechanism to bring the polygonal panel into contact with the surface of the support; and

[0031] S3, the method includes the step of a plurality of flattening mechanisms located around the support simultaneously pressing a plurality of edge portions of the polygonal panel downwards to bond the polygonal panel onto the support.

[0032] According to one embodiment of the present disclosure, prior to step S2, the lifting mechanism lowers the support mechanism by a certain distance and then hovers above the support, and the heating module of the support bakes the polygonal panel.

[0033] According to one embodiment of the present disclosure, prior to step S3, the heating module of the support heats the polygonal panel.

[0034] According to one embodiment of the present disclosure, in the process of the flattening mechanism applying downward pressure to the edge of the polygonal panel, the universal pressure head of the flattening mechanism can self-adaptively adjust the contact position with the edge of the polygonal panel as the amount of bending of the polygonal panel decreases.

[0035] A dispensing device according to a third aspect embodiment of the present disclosure comprises a dispensing work platform and a polygonal panel bending suppression work platform according to any first aspect embodiment of the present application, wherein the dispensing work platform is located above the polygonal panel bending suppression work platform and performs a dispensing operation on a polygonal panel disposed on the polygonal panel bending suppression work platform.

[0036] According to one embodiment of the present disclosure, a dispensing work platform includes a y-axis drive mechanism, an x-axis drive mechanism, and four z-axis work mechanisms, wherein the y-axis drive mechanism is installed on each side of a support, the ends of the x-axis drive mechanism are installed on the y-axis drive mechanism, and all four z-axis work mechanisms are connected to each other with the x-axis drive mechanism, and the four z-axis work mechanisms can perform dispensing work independently or synchronously.

[0037] A panel chip level underfill equipment according to a fourth aspect embodiment of the present disclosure is,

[0038] A loading / unloading mechanism comprising, wherein the loading / unloading mechanism has an activity space suitable for conveying a polygonal panel opened therein; wherein a pickup member for loading and unloading the polygonal panel is installed within the activity space, and the pickup member is suitable for conveying the polygonal panel to each work station, and each of the work stations comprises a preparation station, a dispensing station, and a detection station, and the dispensing station is a dispensing device according to any embodiment of the third aspect of the present disclosure.

[0039] The above preparation station is located on one side of the loading / unloading mechanism and can receive a polygonal panel to be processed input from the pickup member, preheat the polygonal panel to be processed, scan it, and align it.

[0040] The dispensing station is located on the side of the loading / unloading mechanism and is positioned adjacent to the material storage section of the loading / unloading mechanism, so that the preheated polygonal panel can be received via the preparation station via the shortest path, and heating and dispensing are performed on the preheated polygonal panel.

[0041] The detection station is located on the other side of the loading / unloading mechanism and is installed opposite the preparation station, and the detection station is suitable for receiving the polygonal panel after the dispensing operation is completed at the dispensing station and detecting the dispensing status of the polygonal panel.

[0042] Beneficial effects of this embodiment of the present disclosure: By adopting mutual cooperation between a loading / unloading mechanism, a preparation station, a dispensing station, and a detection station, scanning, alignment, preheating, heating, flattening, and dispensing can be performed on a polygonal panel, and multiple dispensing stations can be installed, which not only improves dispensing quality but also improves the utilization rate of the loading / unloading mechanism and reduces waiting time, and through alignment and flattening of the polygonal panel, the efficiency of final product output and the yield rate can be effectively improved.

[0043] According to one embodiment of the present disclosure, the loading / unloading mechanism comprises: a base; a movable member installed on the base via a guide rail and suitable for moving between each of the work stations along the guide rail; and a pickup member installed on the movable member for picking up and placing polygonal panels within the material storage unit and each of the work stations.

[0044] According to one embodiment of the present disclosure, the preparation station and the detection station comprise a polygonal panel rotation platform; a heating module—the heating module is installed on the polygonal panel support, and the polygonal panel rotation platform divides the heating module into an inner ring heating plate and an outer ring heating plate, and the inner ring heating plate and the outer ring heating plate are suitable for simultaneously heating the polygonal panel—; and a polygonal panel lifting mechanism suitable for moving along a vertical direction and protruding from the heating module to support the polygonal panel.

[0045] According to one embodiment of the present disclosure, the polygonal panel rotation platform comprises: a polygonal panel support used to support the polygonal panel; a polygonal panel support assembly that moves along a vertical direction and protrudes from the polygonal panel support to be used to support the polygonal panel; a polygonal panel lifting mechanism connected to the polygonal panel support assembly to drive the polygonal panel support assembly to move along the vertical direction; and a polygonal panel rotation mechanism that, when the polygonal panel support assembly protrudes from the polygonal panel support, drives the polygonal panel support assembly to rotate around the vertical direction and synchronously drives the polygonal panel to rotate.

[0046] According to one embodiment of the present disclosure, the polygonal panel lifting mechanism comprises: a first screw drive assembly that drives the polygonal panel support assembly to move up and down along a vertical direction; and a first drive motor that is belt-driven connected to the first screw drive assembly via a drive belt and drives the first screw drive assembly to move.

[0047] According to one embodiment of the present disclosure, the polygonal panel support assembly comprises: a bottom disc—the polygonal panel lifting mechanism is suitable for driving the bottom disc to move along a vertical direction—; a fixed outer ring fixed to the bottom disc via a plurality of support columns; and a movable top ring connected to the fixed outer ring via a bearing and capable of protruding from the polygonal panel support.

[0048] According to one embodiment of the present disclosure, the movable top ring comprises: a top support member suitable for protruding from the polygonal panel support and contacting the polygonal panel; a bottom mounting member connected to the fixed outer ring via a bearing; and a central connecting member simultaneously connecting the bottom mounting member and the top support member.

[0049] According to one embodiment of the present disclosure, the polygonal panel rotation mechanism comprises: a pulley rotation disk fixed and covered on the bottom mounting member; and a drive assembly installed on the bottom disk and electrically connected to the pulley rotation disk via a drive belt to drive the pulley rotation disk to rotate and to drive the movable top ring to rotate synchronously via the pulley rotation disk.

[0050] According to one embodiment of the present disclosure, the drive assembly comprises: a second drive motor having a first gear mounted at its output end; and a reduction mechanism having its input end electrically connected to the first gear and its output end connected to the pulley rotating disk to drive the pulley rotating disk to rotate.

[0051] According to one embodiment of the present disclosure, the reduction mechanism comprises a drive shaft and a second gear and a third gear installed at both ends of the drive shaft, wherein the second gear is connected to the first gear via a drive belt and the third gear is connected to the pulley rotation disk via a drive belt, and the diameter of the second gear is larger than the diameter of the first gear.

[0052] According to one embodiment of the present disclosure, the polygonal panel lifting mechanism comprises: a polygonal panel support member suitable for moving along a vertical direction and positioned at the peripheral edge and center of the polygonal panel, respectively, and capable of simultaneously supporting the peripheral edge of the polygonal panel and the center of the polygonal panel after extending upward from the heating module; a second screw drive assembly positioned at the periphery of the polygonal panel and connected to each of the polygonal panel support members via a bottom plate—each of the second screw drive assemblies being connected to each other via a drive belt to perform synchronous movement—; and a third drive motor that is electrically connected to an adjacent second screw drive assembly via a drive belt and drives each of the second screw drive assemblies to move synchronously along a vertical direction.

[0053] According to one embodiment of the present disclosure, the dispensing station comprises: a dispensing work platform; a dispensing support on which a heating module is installed—when the polygonal panel is supported on the dispensing support, the heating module heats the polygonal panel—; and a plurality of flattening mechanisms—one of the flattening mechanisms corresponds to one side of the dispensing support, and when the polygonal panel is placed on the dispensing support, the plurality of flattening mechanisms simultaneously press a plurality of edge portions of the polygonal panel downward, respectively, to bond the polygonal panel to the dispensing support.

[0054] According to one embodiment of the present disclosure, the dispensing work platform comprises: a y-axis driving mechanism installed on each side of the dispensing support; an x-axis driving mechanism with both ends installed on the y-axis driving mechanism; and four z-axis working mechanisms, all of which are connected to the x-axis driving mechanism and can perform dispensing work independently or synchronously.

[0055] According to one embodiment of the present disclosure, the detection station further comprises: a three-axis motion platform having motion strokes in three directions of X, Y, and Z; and a visual detection mechanism—the visual detection mechanism being installed on the three-axis motion platform and driven to move upward of the polygonal panel working platform through the three-axis motion platform, and the visual detection mechanism being suitable for performing visual detection of the dispensing state of a polygonal panel supported on the polygonal panel working platform.

[0056] A polygonal panel working method according to a fifth aspect embodiment of the present disclosure is applied to a panel chip level underfill equipment, wherein the panel chip level underfill equipment comprises a loading / unloading mechanism for transferring a polygonal panel to each working station, a preparation station for preheating, scanning, and aligning the polygonal panel, a dispensing station for heating and dispensing the preheated polygonal panel, and a detection station for detecting the polygonal panel after dispensing is completed. The polygonal panel working method comprises the steps of: acquiring a polygonal panel and scanning and aligning the polygonal panel; initially preheating the polygonal panel; performing a warping prevention operation on the polygonal panel after the temperature of the polygonal panel reaches a first set temperature; and after the warping prevention operation on the polygonal panel is completed, rotating the polygonal panel to a specified angle and transferring it to a dispensing station to continue heating. The method includes the step of performing dispensing after the temperature of the polygonal panel reaches a second set temperature and then performing a second anti-bending operation on the polygonal panel; and the step of transferring the polygonal panel to a detection station after the dispensing of the polygonal panel is completed, detecting the dispensing state of the polygonal panel, and then outputting the polygonal panel.

[0057] According to one embodiment of the present disclosure, the step of initially preheating a polygonal panel comprises: lifting the polygonal panel so that the polygonal panel does not come into direct contact with a heating module of a preparation station; gradually reducing the distance between the polygonal panel and the heating module to gradually increase the temperature of the polygonal panel; and, after the temperature of the polygonal panel has risen to a temperature at which it can come into direct contact with the heating module, placing the polygonal panel back into the heating module to heat it to a first set temperature.

[0058] According to one embodiment of the present disclosure, the step of performing a bending prevention operation on a polygonal panel includes: placing the polygonal panel in the upper position of a heating module and supporting the polygonal panel; gradually bringing the support of the polygonal panel closer to the heating module until the polygonal panel comes into direct contact with the heating module; and simultaneously pressing downward a plurality of edge portions of the polygonal panel through a plurality of flattening mechanisms to bond the polygonal panel onto the heating module.

[0059] According to one embodiment of the present disclosure, as the amount of bending decreases during the process in which the flattening mechanism presses downward on the edge of the polygonal panel, the flattening mechanism can self-adaptively adjust the contact position with the edge of the polygonal panel.

[0060] Other features and advantages of the present disclosure are described in the following specification, some of which will become apparent from the specification or be understood by practicing this disclosure. The purpose and other advantages of the present disclosure are realized and obtained through structures specifically indicated in the specification, claims, and drawings. Brief explanation of the drawing

[0061] The present disclosure is further explained below by combining drawings and embodiments. FIG. 1 is a structural diagram of a polygonal panel bending suppression work platform of the present disclosure. FIG. 2 is a structural diagram of the lifting mechanism (support assembly extended state) of the present disclosure. FIG. 3 is a structural diagram of the lifting mechanism (support assembly retracted state) of the present disclosure. FIG. 4 is a structural diagram of the flattening mechanism of the present disclosure. FIG. 5 is a cross-sectional view of a universal pressure head of the present disclosure. FIG. 6 is a cross-sectional view of the flattening mechanism of the present disclosure. FIG. 7 is a structural diagram of a lateral drive assembly of the present disclosure. FIG. 8 is a structural diagram of a connection module of the present disclosure. FIG. 9 is a structural diagram of a longitudinal drive assembly of the present disclosure. FIG. 10 is a schematic diagram of a universal pressure head of the present disclosure pressing downward on a polygonal panel edge. FIG. 11 is a structural diagram of a lifting drive assembly of the present disclosure. FIG. 12 is a cross-sectional view of the lifting mechanism of the present disclosure. FIG. 13 is a structural diagram of a stepped surface of the present disclosure. FIG. 14 is a partial schematic diagram of a vacuum adsorption module of the present disclosure. FIG. 15 is a transverse cross-sectional view of a vacuum adsorption module of the present disclosure. FIG. 16 is a structural diagram of a heating plate of the present disclosure. FIG. 17 is a schematic diagram of a support assembly of the present disclosure supporting a polygonal panel. FIG. 18 is a perspective view of a panel chip level underfill equipment of the present disclosure. FIG. 19 is a plan view of a panel chip level underfill equipment of the present disclosure. FIG. 20 is a three-dimensional view of the polygonal panel lifting mechanism of the polygonal panel rotation platform of the present disclosure when it is raised. FIG. 21 is a three-dimensional view of the polygonal panel lifting mechanism of the polygonal panel rotating platform of the present disclosure when it is raised. FIG. 22 is a three-dimensional view of the polygonal panel lifting mechanism and the polygonal panel lifting mechanism of the polygonal panel rotation platform of the present disclosure. FIG. 23 is a three-dimensional view of the polygonal panel lifting mechanism of the polygonal panel rotating platform of the present disclosure after installing a polygonal panel support member. FIG. 24 is a three-dimensional view of the polygonal panel support assembly and polygonal panel rotation mechanism of the polygonal panel rotation platform of the present disclosure after assembly. FIG. 25 is an electric structure diagram of a polygonal panel rotating platform of the present disclosure. FIG. 26 is a cross-sectional view of a polygonal panel support assembly of a polygonal panel rotation platform of the present disclosure. FIG. 27 is a three-dimensional view of the preparation station of the present disclosure. FIG. 28 is a three-dimensional view of a dispensing station of the present disclosure. FIG. 29 is an assembly diagram of a heating module and a flattening mechanism in a dispensing station of the present disclosure. FIG. 30 is a structural diagram of the loading / unloading mechanism of the present disclosure. FIG. 31 is a flowchart of the polygonal panel working method of the present disclosure. FIG. 32 is a workflow diagram of the initial preheating of the present disclosure. FIG. 33 is a workflow diagram of preventing polygonal panel bending according to the present disclosure. FIGS. 34a to 34g are schematic diagrams of the angular positions when a polygonal panel moves between each station in the panel chip level underfill equipment of the present disclosure, wherein the dispensing station adjacent to the preparation station is used to perform dispensing operations on the polygonal panel. FIGS. 35a to 35d are schematic diagrams of the angular positions when a polygonal panel moves between each station in the panel chip level underfill equipment of the present disclosure, wherein the dispensing station adjacent to the detection station is used to perform dispensing operations on the polygonal panel. Specific details for implementing the invention

[0062] The present disclosure is described in more detail below with reference to the accompanying drawings. Since these accompanying drawings are all simplified schematic drawings and merely describe the basic structure of the present disclosure in a schematic manner, only the configurations related to the present disclosure are illustrated.

[0063] In the description of the present disclosure, terms such as “center,” “longitudinal,” “transverse,” “length,” “width,” “thickness,” “top,” “bottom,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” “outside,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate orientations or positional relationships based on the orientations or positional relationships depicted in the drawings. These are intended merely to facilitate and simplify the description of the present disclosure and do not imply or suggest that the indicated device or element must have a specific orientation or be configured and operated in a specific orientation; therefore, they should not be understood as limitations to the present disclosure. Additionally, features limited to “first” and “second” may explicitly or implicitly include one or more such features. In the description of the present disclosure, unless otherwise specified, the meaning of “plural” is two or more.

[0064] In the description of this disclosure, unless otherwise explicitly defined and limited, the terms “installation,” “interconnection,” and “connection” are to be understood in a broad sense and may, for example, be fixed connections, detachable connections, or integral connections; mechanical connections, or electrical connections; direct connections, indirect connections through an intermediary, or communication within two elements. A person skilled in the art will understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0065] The polygonal panel disclosed in this application is preferably a wafer, for example, a square wafer (i.e., the large-sized wafer mentioned above), and primarily addresses the problems that exist in the manufacturing process of polygonal panels, for example, square wafers. However, while the solution disclosed in this application may be applied to the shapes and specifications of currently mainstream polygonal panels, for example, wafers, it should be understood that due to differences in wafer shapes and specifications, some functions related to the solution of this application are not essential in currently mainstream wafer manufacturing processes. The following is a detailed description of the structure related to the manufacturing process of polygonal panels, for example, square wafers, as provided in this application. Since those skilled in the art can operate on the currently mainstream wafer types based on experience, the manufacturing process of such wafers is not described further below.

[0066] As illustrated in FIGS. 1 to 17 and FIG. 28, a polygonal panel bending suppression work platform according to an embodiment of the first aspect of the present disclosure comprises a support member (1), a support mechanism (66), a lifting mechanism (2), and a plurality of flattening mechanisms (3), wherein the shape of the support member (1) matches the shape of the polygonal panel (100) to support the polygonal panel (100); the support mechanism (66) is located below the support member (1) and is movable along a vertical direction, and can support the polygonal panel (100) when the support end of the support mechanism (66) protrudes from the support member (1); the lifting mechanism (2) can move the support mechanism (66) up and down along a vertical direction, and when the support mechanism (66) moves upward, the polygonal panel (100) is supported on the support mechanism (66); When the support mechanism (66) moves downward, the polygonal panel (100) can be supported on the support (1); one flattening mechanism (3) corresponds to one side of the support (1), and when the polygonal panel (100) is placed on the support (1), a plurality of flattening mechanisms (3) simultaneously press a plurality of edge portions of the polygonal panel (100) downward, respectively, thereby joining the polygonal panel (100) to the support (1). The present disclosure is advantageous for improving work efficiency and reducing damage to the polygonal panel (100) by enabling automatic flattening of the bending edge.

[0067] It is necessary to explain that the number of flattening mechanisms (3) matches the number of sides of the polygonal panel (100). For example, if it is a quadrilateral panel, four flattening mechanisms (3) are provided, and each of the four flattening mechanisms (3) is located on the four sides of the quadrilateral panel. When performing a flattening operation, the four flattening mechanisms (3) act simultaneously on the four edges of the quadrilateral panel. This embodiment is mainly intended for the treatment of suppressing warping of large-sized polygonal panels (100). For example, if the size of the quadrilateral panel is 600mm*600mm, the amount of warping caused by the material of the polygonal panel (100) is much greater than that of an 8-inch / 12-inch wafer, and while the warping amount of the wafer is generally about 3mm, the warping amount of the polygonal panel (100) can reach 10mm. During the process of gradually flattening the bending edge, the contact position between the flattening mechanism (3) and the bending edge changes due to the elongation of the product, that is, relative displacement occurs between the flattening mechanism (3) and the panel, and a constant frictional force is generated during this relative displacement process, and this frictional force may scratch the product. Therefore, the present embodiment improves the structure of the flattening mechanism (3) so that flexible contact occurs between the flattening mechanism (3) and the bending edge during the downward pressing process.

[0068] Specifically, the flattening mechanism (3) includes a longitudinal drive assembly (32), a transverse drive assembly (33), a pressure plate (34), and a universal pressure head (319). The universal pressure head (319) is installed on the pressure plate (34), the pressure plate (34) is connected to the transverse drive assembly (33), and the transverse drive assembly (33) is connected to the longitudinal drive assembly (32). The number of universal pressure heads (319) installed on one pressure plate (34) is multiple, and the multiple universal pressure heads (319) are arranged in a straight line. Since the size of the polygonal panel (100) is relatively large, in this embodiment, the number of transverse drive assemblies (33) is two, and two pressure plates (34) are installed on each transverse drive assembly (33). Of course, for polygonal panels (100) of different sizes, the number of longitudinal drive assemblies (32), transverse drive assemblies (33), pressure plates (34), and universal pressure heads (319) can be changed, and in principle, the edges of the polygonal panels (100) can be pressed flat. The longitudinal drive assembly (32) can move the transverse drive assembly (33) up and down, and the transverse drive assembly (33) can extend or retract the pressure plate (34) along the horizontal direction. When bending inhibition is not performed, the pressure plate (34) is in a retracted state, and the pressure plate (34) is located on the side of the support (1), so that the lifting mechanism (2) does not affect the lifting and lowering of the polygonal panels (100).

[0069] For example, the universal pressure head (319) includes a connector (311) and a ball (312), most of the volume of the ball (312) is located within the receiving groove of the connector (311), and the connector (311) is installed within the mounting hole of the pressure plate (34). When the ball (312) comes into contact with the bending edge, the ball (312) can self-adaptively adjust the contact position with the bending edge as the amount of bending of the polygonal panel (100) decreases during the process in which the flattening mechanism (3) presses the edge of the polygonal panel (100) downward. It can be understood that when the edge is bent, the panel cross-section is approximately crescent-shaped, the bending edge is approximately arc-shaped, and the ball (312) is not fixed within the receiving groove but is rotatable. During the process of the universal pressure head (319) applying downward pressure, the ball (312) comes into contact with the bending edge. Assuming that the initial contact point between the ball (312) and the bending edge is point A, as the bending edge is gradually flattened, the contact point changes from point A to point B. As the contact point of the ball (312) changes during the downward pressure process, a constant frictional force is generated, and this frictional force may scratch the panel. However, since the ball (312) of the present embodiment is freely rotatable, when the contact point changes, this frictional force can be offset by the rotation of the ball (312), thereby preventing the panel from being scratched. Additionally, the ball (312) and the bending edge of the present embodiment are in point contact, and the contact area is smaller, which further reduces the risk of panel damage during the downward pressure process.

[0070] For example, the universal pressure head (319) adopts the material peek (polyetheretherketone) and has advantages such as high temperature resistance, excellent mechanical performance, excellent self-lubricating properties, chemical corrosion resistance, flame retardancy, peel resistance, radiation resistance, and insulation stability. In addition, the peek material has a relatively low coefficient of friction, which helps to reduce friction and wear of the product; and the self-lubricating properties allow it to secrete lubricant on its own during operation, which is advantageous for further reducing wear.

[0071] Specifically, the flattening mechanism (3) further includes a connection module (35), and the pressure plate (34) is connected to the lateral drive assembly (33) through the connection module (35), and a pressure sensor (4) is installed on the connection module (35), and the pressure sensor (4) is used to detect the pressure value applied by the universal pressure head (319) to the edge. The connection module (35) includes a first connection plate (351), a second connection plate (352), a third connection plate (353), and a guide rail (354). The first connection plate (351) and the third connection plate (353) are slidably connected through the guide rail (354). The second connection plate (352) is connected to the first connection plate (351), and the pressure plate (34) is connected to the second connection plate (352). One end of the pressure sensor (4) is connected to the third connection plate (353), and the other end of the pressure sensor (4) is connected to the second connection plate (352). That is, the pressure plate (34) and the third connecting plate (353) move together, the second connecting plate (352) and the first connecting plate (351) move together, and the third connecting plate (353) and the first connecting plate (351) can slide relative to each other through the guide rail (354). The pressure sensor (4) connects the second connecting plate (352) and the third connecting plate (353). When the universal pressure head (319) presses the bending edge downward, the bending edge generates a reaction force against the universal pressure head (319). This reaction force moves the pressure plate (34) and the universal pressure head (319) upward by a small distance. When the pressure plate (34) moves upward, the third connecting plate (353) also moves upward, and when the third connecting plate (353) moves upward, it presses the pressure sensor (4). Thus, the pressure sensor (4) can detect the magnitude of this reaction force and reflects the downward pressure applied by the universal pressure head (319) to the bending edge. Since the polygonal panel (100) is made of glass, it is relatively fragile, and if the downward pressure of the universal pressure head (319) is too large, it is easy to break or crack the panel edge.Accordingly, the pressure value applied by the universal pressure head (319) to the edge can be monitored in real time through the pressure sensor (4), and if the real-time pressure value is found to exceed a preset maximum pressure value, the downward pressure is adjusted by controlling the lowering speed of the universal pressure head (319). A pressure calibration table (5) is further installed on the second connecting plate (352), and the pressure calibration table (5) is connected to the pressure sensor (4) to enable calibration of the pressure sensor (4).

[0072] For example, a first limit block (355) is installed on the first connecting plate (351). The first limit block (355) is located at the bottom of the first connecting plate (351) and is located below the third connecting plate (353). The first limit block (355) is used to restrict the downward movement of the third connecting plate (353). The third connecting plate (353) can move upward by a small distance due to the action of a reaction force, and when this reaction force disappears, the third connecting plate (353) descends and returns due to gravity; at this time, the first limit block (355) can prevent the third connecting plate (353) from falling.

[0073] It is necessary to explain that the support (1) includes a vacuum suction module (102), and that a plurality of suction channels are opened on the upper surface of the vacuum suction module (102). After the polygonal panel (100) is completely flattened, the vacuum suction module (102) can be operated to suction the polygonal panel, and then the universal pressure head (319) can be removed. For example, the suction channels are square, and the upper surface of the vacuum suction module (102) can be divided into four areas, and a plurality of square suction channels are opened within each area. For example, there are six suction channels opened within each area, and each suction channel is connected to one suction hole (1021), and the suction hole (1021) is connected to a vacuum connector (1022). Through this, a large-sized polygonal panel (100) can be suctioned more effectively.

[0074] For example, a heating module (6) is installed on the support (1), and when the polygonal panel (100) is supported on the support (1), the heating module (6) heats the polygonal panel (100). It is necessary to explain that if the polygonal panel (100) is made of metal, it can be flattened directly by the flattening mechanism (3) without the need to perform heating. If the polygonal panel (100) is made of glass, heating the polygonal panel (100) before flattening so that the polygonal panel (100) is softened to a certain degree makes it difficult to break when subjected to downward pressure. The heating module (6) is, for example, a heating plate (101), the heating plate (101) is located below the vacuum adsorption module (102), the bottom surface and exterior of the heating plate (101) are wrapped with an insulating layer (103), the flattening mechanism (3) is located on the side of the support (1), and the support plate (616) is located below the heating plate (101), so the insulating layer (103) is advantageous for reducing the effect of high temperature on the flattening mechanism (3) and the support plate (616). For example, the polygonal panel bending suppression work platform further installs a temperature sensor (71) used to monitor the temperature change of the heating plate (101), and the temperature sensor (71) is connected to the heating plate (101).

[0075] In this embodiment, the longitudinal drive assembly (32) is installed on the base (36). The longitudinal drive assembly (32) includes a longitudinal drive motor (321), two synchronous wheels (322), a synchronous belt (323), a longitudinal screw (324), and a first connecting block (3259). The longitudinal drive motor (321) and the longitudinal screw (324) are each located on both sides of the base (36). One synchronous wheel (322) is installed on the output shaft of the longitudinal drive motor (321), and the other synchronous wheel (322) is installed on the longitudinal screw (324). The synchronous belt (323) is placed over the two synchronous wheels (322), and the first connecting block (3259) is connected to a nut on the longitudinal screw (324). When the longitudinal drive motor (321) is started, the longitudinal screw (324) can be rotated through the synchronous wheel (322) and the synchronous belt (323), and when the longitudinal screw (324) rotates, the nut and the first connecting block (3259) can be moved up and down. Here, the first connecting block (3259) is also connected to the longitudinal drive plate (3269), and the number of longitudinal drive plates (3269) matches the number of transverse drive assemblies (33). In this embodiment, the transverse drive assembly (33) is in two sets, and the number of longitudinal drive plates (3269) is two. Both sides of the first connecting block (3259) are fixedly connected to each of the two longitudinal drive plates (3269), and the longitudinal drive plates (3269) and the base (36) are slidably connected, so that simultaneous up-and-down movement of the two longitudinal drive plates (3269) can be achieved.For example, a blocking plate (3261) is connected to the side of the longitudinal drive plate (3269), and two photoelectric sensors (361) are installed on the edge of the base (36). The two photoelectric sensors (361) are on the same vertical line, the lower photoelectric sensor (361) corresponds to the initial position of the longitudinal drive plate (3269), and the upper photoelectric sensor (361) corresponds to the highest position of the longitudinal drive plate (3269). When the blocking plate (3261) is inserted into the photoelectric sensor (361), a detection signal can be triggered, allowing the controller to determine the movement status of the longitudinal drive plate (3269).

[0076] Specifically, the transverse drive assembly (33) includes a transverse drive cylinder (331), a transverse mounting plate (332), a transverse drive plate (333), and a second connecting block (334). The transverse mounting plate (332) is connected to the longitudinal drive plate (3269), the transverse drive cylinder (331) is installed on the lower surface of the transverse mounting plate (332), the transverse drive plate (333) is slidably connected to the upper surface of the transverse mounting plate (332), the transverse drive plate (333) is connected to the transverse drive cylinder (331) through the second connecting block (334), and the first connecting plate (351) is connected to the transverse drive plate (333). When the longitudinal drive plate (3269) moves up and down, the entire transverse drive assembly (33) can be moved up and down. When the lateral drive cylinder (331) is actuated, the lateral drive plate (333) can be horizontally extended or retracted through the second connecting block (334). Longitudinal movement and lateral movement of the pressure plate (34) and the universal pressure head (319) can be achieved through the longitudinal drive assembly (32) and the lateral drive assembly (33).

[0077] Since this method is intended for a large-sized polygonal panel (100), when performing lifting and lowering operations on the polygonal panel (100), overall synchronization must be ensured when the polygonal panel (100) moves up and down, and a situation where lifting is fast at one position and slow at another position must not occur. Based on this, the present embodiment has improved the lifting mechanism (2) for the corresponding special application scenario. Specifically, the lifting mechanism (2) includes a plurality of screw lifting assemblies (229) and a lifting drive assembly (239), and the plurality of screw lifting assemblies (229) are connected to a support mechanism (66), and the plurality of screw lifting assemblies (229) operate simultaneously to control the support mechanism (66) to rise and fall synchronously as a whole. The lifting drive assembly (239) includes a lifting drive member (2319) and a drive belt (233), and the drive belt (233) is simultaneously belt-driven connected to a plurality of screw lifting assemblies (229), and the lifting drive member (2319) drives the plurality of screw lifting assemblies (229) to operate simultaneously through the drive belt (233). When the output shaft of the lifting drive member (2319) rotates in the forward direction, the support mechanism (66) can be driven to rise synchronously as a whole; and when the output shaft of the lifting drive member (2319) rotates in the reverse direction, the support mechanism (66) can be driven to descend synchronously as a whole. The plurality of screw lifting assemblies (229) are distributed at intervals and are surrounded by a shape that matches the shape of the polygonal panel (100). The polygonal panel (100) may have a shape such as a quadrilateral, a quadrilateral, and a hexagon. The lifting drive assembly (239) includes a plurality of electric gears (2329) and idler gears (234), the electric gears (2329) are connected to the screw lifting assembly (229), and the electric belt (233) is wound on the electric gears (2329) and idler gears (234) to implement electric power.That is, the lifting mechanism (2) of the present embodiment can satisfy the synchronization requirement when performing a lifting operation on a polygonal panel (100).

[0078] It is necessary to explain that the support mechanism (66) includes a support plate (616) and a support assembly (626), the support plate (616) is connected to the lifting mechanism (2), and the lower end of the support assembly (626) is connected to the support plate (616); a plurality of through holes (104) are opened in the support (1) to allow the support assembly (626) to move; when the polygonal panel (100) is supported on the support assembly (626), the support assembly (626) protrudes from the support (1) by passing through the through holes (104); and when the polygonal panel (100) is supported on the support (1), the support assembly (626) retracts into the through holes (104). The support assembly (626) includes a plurality of first support members (621), the positions of the plurality of first support members (621) correspond to the edge portions of the support plate (616), and the plurality of first support members (621) jointly support the edge of the polygonal panel (100). For example, the support assembly (626) further includes a second support member (622), the positions of the second support member (622) correspond to the center portion of the support plate (616), and the second support member (622) assists the plurality of first support members (621) in jointly supporting the polygonal panel (100).

[0079] It is necessary to explain that the upper ends of the first support member (621) and the second support member (622) can penetrate the through hole (104) of the support (1), and when the support mechanism (66) receives the polygonal panel (100), the first support member (621) and the second support member (622) move upward simultaneously to support the polygonal panel (100), and then the first support member (621) and the second support member (622) move downward synchronously, and when the first support member (621) and the second support member (622) retract into the through hole (104), the polygonal panel (100) comes into contact with the upper surface of the support (1) to implement heating and vacuum adsorption. Here, a stepped surface (6211) is installed on the upper end of the first support member (621) to contact the edge of the polygonal panel (100). When the polygonal panel (100) is placed on the first support member (621), the side wall of the stepped surface (6211) can act as a limiter for the edge of the panel (100), and the side wall of the stepped surface (6211) of the plurality of first support members (621) surrounds the edge of the polygonal panel (100), thereby enabling positioning of the polygonal panel (100) and prevention of falling of the polygonal panel (100).

[0080] A screw lifting assembly (229) is installed on a base plate (25), and a support (1) is connected to the base plate (25) through four support columns (8), and a plurality of screw lifting assemblies (229) each correspond to a plurality of corner areas of a polygonal panel (100). A lifting drive member (2319) is installed on the base plate (25) through a mounting plate, and an electric gear (2329) is installed on each screw lifting assembly (229), and an electric belt (233) is wound around all electric gears (2329), and when the lifting drive member (2319) is activated, all screw lifting assemblies (229) can be driven to operate synchronously through the electric belt (233) and the electric gear (2329). When the screw lifting assembly (229) is operated, the support mechanism (66) is driven to rise or fall as a whole, thereby enabling synchronization when different positions of the polygonal panel (100) rise or fall.

[0081] The screw lifting assembly (229) includes a lifting screw (2219), a connecting rod (2229), a third connecting block (2239), and a bearing (224). The third connecting block (2239) is installed within a mounting hole of the bottom plate (25). The connecting rod (2229) is fixedly connected to the lifting screw (2219). The lower end of the connecting rod (2229) is connected to the third connecting block (2239) through the bearing (224). The nut on the lifting screw (2219) is fixedly connected to the support plate (616). The lifting screw (2219) can rotate under the drive of the lifting drive assembly (239). When the lifting screw (2219) rotates, the nut on the lifting screw (2219) can rise or fall, thereby raising or lowering the support plate (616).

[0082] For example, the lifting mechanism (2) further includes a guide assembly (249), which is used to guide the support mechanism (66) when it moves up and down. The guide assembly (249) includes a guide column (241) and a guide block (242), the guide block (242) is placed over the guide column (241) and is slidably relative to the guide column (241), and the guide block (242) is fixedly connected to the support plate (616), and when the support plate (616) moves up or down under the drive of the screw lifting assembly (229), the guide block (242) slides up and down along the guide column (241). Since the size of the polygonal panel (100) is relatively large, the size of the support plate (616) is also relatively large in proportion to this, and the stability and straightness of the support mechanism (66) when it moves up and down can be improved through the guide assembly (249).

[0083] It is necessary to explain that the polygonal panel (100) can be, for example, a wafer.

[0084] A method for suppressing bending of a polygonal panel according to an embodiment of the second aspect of the present disclosure comprises: S1, a step of placing a polygonal panel (100) on the top surface of a support (1) and supporting the polygonal panel by moving a support mechanism (66) upward and protruding it from the support (1) using a lifting mechanism (2); S2, a step of driving the support mechanism (66) to gradually lower the polygonal panel (100) to come into contact with the top surface of the support (1); and S3, a step of simultaneously pressing a plurality of edge portions of the polygonal panel (100) downward using a plurality of flattening mechanisms (3) located around the support (1) to bond the polygonal panel (100) onto the support (1).

[0085] It is necessary to explain that the polygonal panel (100) may be quadrilateral, quadrilateral, hexagonal, etc. The amount of bending of the polygonal panel (100) may reach 10 mm. Many chip structures or precision structures are arranged on the polygonal panel (100), and in the packaging process, there is a step of performing a dispensing operation on the polygonal panel (100) to make the bond between the chip structures and the panel more rigid. Therefore, before the dispensing operation, a restraining treatment must be performed on the bending edges to ensure the flatness of the entire polygonal panel (100).

[0086] The specific process is as follows. A support assembly (626) extends outward from the support (1) to receive a polygonal panel (100) to be processed, and then the support mechanism (66) moves downward under the drive of the lifting drive assembly (239) so that the polygonal panel (100) is placed on the vacuum suction module (102), at which time the support assembly (626) has already retracted into the support (1). After that, a plurality of flattening mechanisms (3) simultaneously flatten a plurality of edges of the polygonal panel (100). The specific process is as follows: the longitudinal drive assembly (32) moves the transverse drive assembly (33) and the pressure plate (34) together upward to reach a designated height, and then the transverse drive assembly (33) extends the pressure plate (34) horizontally to bring it close to the support (1), and then the longitudinal drive assembly (32) moves the transverse drive assembly (33) and the pressure plate (34) together downward again, and during the downward movement, the universal pressure head (319) contacts the bending edge and applies pressure to the edge so that the bending edge is gradually flattened on the support (1). After the multiple edges of the polygonal panel (100) are flattened by the flattening mechanism (3), the vacuum suction module (102) immediately activates vacuum suction to suction the polygonal panel (100). After that, the lateral drive assembly (33) can retract the pressure plate (34) to move it away from the support (1).

[0087] Before step S3, it is necessary to explain that the heating module of the support (1) heats the polygonal panel (100). That is, when the polygonal panel (100) is supported on the upper surface of the support (1), the heating plate (101) (e.g., operating at a heating temperature of 150°C) heats the polygonal panel (100) so that the polygonal panel (100) softens to a certain degree, which is convenient for the warping suppression treatment. In the entire panel chip level underfill operation system, before entering the dispensing operation stage, there is also a preheating stage of the polygonal panel (100), that is, the polygonal panel (100) is heated. By doing this, the time for the heating plate (101) to heat the polygonal panel (100) is shortened, and the work efficiency of the warping suppression operation can be improved.

[0088] Before performing step S2, it is necessary to explain that one more step may be added, namely that the lifting mechanism (2) lowers the support mechanism (66) a certain distance and then hovers above the support (1), and the support (1) activates the heating function to bake the polygonal panel (100). When the polygonal panel (100) comes into contact with the upper surface of the support (1) and the heating plate (101) heats the polygonal panel (100), the temperature difference between the surface of the support (1) and the polygonal panel (100) is relatively large, so the bending of the polygonal panel (100) increases at the moment of contact. Therefore, a baking step is added to hover the polygonal panel (100) above the support (1), for example, at a position of 1 mm (i.e., the polygonal panel (100) does not come into contact with the upper surface of the support (1)), and the heating plate (101) (for example, at a heating temperature of 100°C) is operated to bake the polygonal panel (100). By reducing the temperature difference between the polygonal panel (100) and the support (1) through baking, the effect of the temperature difference on the bending can be reduced.

[0089] When the universal pressure head (319) applies pressure to the bending edge, the contact point between the universal pressure head (319) and the bending edge changes from point A to point B. During this position change process, a constant frictional force is generated, and the ball (312) can rotate freely under the action of this frictional force, thereby reducing damage to the panel. Additionally, since there is point contact between the ball (312) and the panel, damage to the panel can be further reduced.

[0090] It is necessary to explain that during the process in which the universal pressure head (319) applies pressure to the bending edge, the pressure sensor (4) can detect this pressure value in real time. Since the bending edge is approximately arc-shaped and the pressure applied by the universal pressure head (319) to the bending edge changes as it is flattened, this pressure change is detected through the pressure sensor (4). When the pressure sensor (4) feeds back to the controller, the controller can adjust the pressure applied by the universal pressure head (319) to the bending edge in real time to prevent the pressure value from being excessive (making it easy to break the panel) or insufficient (making the flattening effect not ideal).

[0091] In summary, the polygonal panel bending suppression work platform and the bending suppression method of the present disclosure can implement automatic flattening processing on the bending edge of the polygonal panel (100) through improvements, and can not only improve work efficiency but also reduce the risk of panel damage. By installing a universal pressure head (319), flexible contact with the bending edge is achieved during the downward pressure process, which is advantageous for reducing damage to the panel. The pressure value applied by the universal pressure head (319) to the bending edge can be detected in real time through a pressure sensor (4), allowing for monitoring of pressure changes and timely adjustment. Synchronization can be improved during the lifting of a large-sized polygonal panel (100) through a lifting mechanism (2). The present disclosure has a clever structure, is convenient to operate, and has high value for actual application.

[0092] A dispensing device according to a third aspect embodiment of the present disclosure, with reference to FIG. 28, comprises a dispensing work platform (31) and a polygonal panel bending suppression work platform according to any first aspect embodiment of the present application, wherein the dispensing work platform (31) is located above the polygonal panel bending suppression work platform and performs a dispensing operation on a polygonal panel placed on the polygonal panel bending suppression work platform.

[0093] According to one embodiment of the present disclosure, a dispensing work platform (31) includes a y-axis driving mechanism (70), an x-axis driving mechanism (72), and four z-axis work mechanisms (73), wherein the y-axis driving mechanism (70) is installed on each side of a support, the ends of the x-axis driving mechanism (72) are installed on the y-axis driving mechanism (70), and all four z-axis work mechanisms (73) are connected to each other with the x-axis driving mechanism (72), and the four z-axis work mechanisms (73) can perform dispensing work independently or synchronously.

[0094] In addition, since polygonal panels, for example, large-sized wafers, cause orientation deviation during the wafer transfer process, the orientation of polygonal panels, for example, large-sized wafers does not match at different stations, affecting the normal operation of polygonal panels, for example, wafers. Taking this into account, it is necessary to design panel chip-level underfill equipment to solve the above problem.

[0095] Referring to FIGS. 18 to 19 and FIG. 30, a panel chip level underfill device of a fourth aspect embodiment of the present disclosure comprises a loading / unloading mechanism (1a), a preparation station (2a), a dispensing station (3a), and a detection station (4a), wherein the dispensing station (3a) is a dispensing device according to any embodiment of the third aspect of the present application, a movable member (12) is opened within the loading / unloading mechanism (1a), and a pickup member (11) for loading and unloading is installed within the activity space, and a polygonal panel (100) can be transferred into each work station through the pickup member (11) to perform work. A dispensing station (3a) is located on opposite sides of a loading / unloading mechanism (1a), and a preparation station (2a) is located on one side of the loading / unloading mechanism (1a) and is installed in close proximity to one of the dispensing stations (3a), so that the dispensing station (3a) can receive a preheated polygonal panel (100) through the preparation station (2a) via the shortest path, and a detection station (4a) is located on the other side of the loading / unloading mechanism (1a), and the detection station (4a) is installed opposite the preparation station (2a), and at the same time, the detection station (4a) is installed in close proximity to the dispensing station (3a) on the same side. Accordingly, by symmetrically installing the dispensing station (3a) in a position adjacent to the material storage section (not shown in the drawing) of the loading / unloading mechanism (1a), it is convenient for the operator to operate the dispensing equipment within the dispensing station (3a) from the same side, and at the same time, both symmetrically installed dispensing stations (3a) can receive the preheated polygonal panel (100) through the preparation station (2a), thereby ensuring the smooth flow of the dispensing operation, reducing the time the polygonal panel (100) waits for dispensing, and improving work efficiency.

[0096] It should be understood that, as illustrated in FIG. 18, the loading / unloading mechanism (1a) includes a material storage unit (5a) and a material storage unit, and the material storage unit (5a) is installed on the outside of the loading / unloading mechanism (1a) and is used to support the material storage unit. An activity space suitable for transporting the polygonal panel (100a) within the material storage unit and the loading / unloading mechanism (1a) is connected through an input zone (not shown in the drawing), so that the polygonal panel (100) enters the activity space from the material storage unit through the input zone to implement the loading of the polygonal panel (100a).

[0097] The above preparation station (2a) can receive a polygonal panel (100) to be processed that is input by a pickup member (11), scan the polygonal panel (100) before inputting the polygonal panel (100), then preheat the polygonal panel (100) to be processed, and after preheating is completed, perform a first anti-bending operation on the polygonal panel (100) to flatten the surface of the polygonal panel (100), and after the polygonal panel (100) is flattened, correct its orientation again so that the position of the polygonal panel (100) after it is input to each station is maintained so that the overall work efficiency of the equipment can be improved.

[0098] A dispensing station (3a) is installed adjacent to the material storage section of a loading / unloading mechanism (1a), and a material storage mechanism used for dispensing polygonal panels (100) is installed within the material storage section. The dispensing station (3a) can receive the polygonal panels (100) that have been pre-processed through the preparation station (2a), perform heat treatment on the pre-processed polygonal panels (100), and after the heat treatment is completed, perform anti-bending treatment on the softened polygonal panels (100). The polygonal panels (100) that have undergone anti-bending treatment are in a generally flat state, and at this time, dispensing is performed on the flat polygonal panels (100). It is necessary to explain that the material storage section can be suitably connected to an AGV vehicle, a PGV vehicle, and an OHT overhead crane to perform the initial transfer of the polygonal panels (100).

[0099] The polygonal panel (100) that has been processed on the dispensing station (3a) is received through the detection station (4a), and the adhesive condition is inspected after the dispensing of the polygonal panel (100) is completed, thereby preventing the occurrence of defects such as missing adhesive.

[0100] Referring to FIGS. 19 and 30, the loading / unloading mechanism (1a) comprises a base (13), a movable member (12), and a pickup member (11), wherein the movable member (12) is installed on the base (13) via a guide rail (3254) and the movable member (12) is suitable for moving between each work station along the guide rail (3254). The pickup member (11) is installed on the movable member (12) so that the pickup member (11) can retrieve polygonal panels (100) within the material storage unit and each work station.

[0101] Referring to FIGS. 20, 21, 27 and 29, the preparation station (2a) and the detection station (4a) both include a polygonal panel work platform, the polygonal panel work platform includes a polygonal panel rotation platform (20), a heating module (6), and a polygonal panel lifting mechanism (26), the polygonal panel rotation platform (20) divides the heating module (6) into an inner ring heating plate (61) and an outer ring heating plate (62), the inner ring heating plate (61) and the outer ring heating plate (62) are suitable for heating the polygonal panel (100) simultaneously, the polygonal panel lifting mechanism (26) is suitable for moving along a vertical direction, and the polygonal panel lifting mechanism (26) is suitable for protruding from the heating module (6) to support the polygonal panel (100). Here, a temporary stop frame (28) is installed only within the preparation station (2a), and the temporary stop frame (28) is installed above the polygonal panel rotation platform (20) and is used to stop the polygonal panel (100) in an emergency. It is necessary to explain that a heating module (6) is installed within the detection station (4a), the preparation station (2a), and the dispensing station (3a), and here, in the detection station (4a) and the preparation station (2a), the heating module (6) is divided into an inner ring heating plate (61) and an outer ring heating plate (62). In the dispensing station (3a), the heating module (6) is a single plate.

[0102] Referring to FIGS. 21 through 26, specifically, the polygonal panel rotation platform (20) comprises a polygonal panel support (21), a polygonal panel support assembly (22), a polygonal panel lifting mechanism (23), and a polygonal panel rotation mechanism (24). The polygonal panel support (21) is used to support a polygonal panel (100), and the polygonal panel support assembly (22) moves along a vertical direction and protrudes from the polygonal panel support (21) to support a polygonal panel (100). The polygonal panel lifting mechanism (23) is connected to the polygonal panel support assembly (22) to drive the polygonal panel support assembly (22) to move along a vertical direction. The polygonal panel rotation mechanism (24) drives the polygonal panel support assembly (22) to rotate around a vertical direction when the polygonal panel support assembly (22) protrudes from the polygonal panel support (21). The panel (100) is driven synchronously to rotate.

[0103] More specifically, the polygonal panel lifting mechanism (23) includes a first screw drive assembly (231) and a first drive motor (232), the first screw drive assembly (231) can move the polygonal panel support assembly (22) up and down along the vertical direction, and the first drive motor (232) is electrically connected to the first screw drive assembly (231) via a drive belt (27) to drive the movement of the first screw drive assembly (231).

[0104] When the polygonal panel support assembly (22) comes into contact with the polygonal panel (100), the contact surface between the two is mainly located in the central region of the polygonal panel (100). Therefore, in order to maximize stable support action on the polygonal panel (100), the contact surface between the polygonal panel support assembly (22) and the polygonal panel (100) is installed in a ring shape to achieve stable support for the polygonal panel (100). The polygonal panel support assembly (22) includes a bottom disk (221), a fixed outer ring (222), and a movable top ring (223). Here, the fixed outer ring (222) is connected to the bottom disk (221) through a plurality of support columns, that is, the polygonal panel support assembly (22) can be driven to move synchronously along the vertical direction through the bottom disk (221). A plurality of mounting portions (2211) are further extended on the periphery of the floor disc (221), and a guide column (2212) is installed on each mounting portion (2211), and it can be ensured that no radial deflection occurs when the floor disc (221) drives the polygonal panel support assembly (22) through the guide column (2212) to move along the vertical direction.

[0105] Additionally, the movable top ring (223) is movably connected to the fixed outer ring (222) via a bearing, and the installation of the bearing (where two bearings are installed, and both bearings adopt thin-wall bearings) enables the movable top ring (223) to rotate relative to the fixed outer ring (222), and the rotation direction of the movable top ring (223) rotates around the vertical direction so that when the movable top ring (223) supports the polygonal panel (100), the polygonal panel (100) can be driven to rotate synchronously.

[0106] Specifically, the movable top ring (223) includes a top support member (2231) and a bottom mounting member (2232), and the bottom mounting member (2232) is fixedly connected to the top support member (2231) through a central connecting member (2233) to form an integral. Here, the top support member (2231) extends a mounting portion (2211) along the radial direction, and the mounting portion (2211) forms an embedded mounting groove in cooperation with a fixed outer ring (222), and one end of the central connecting member (2233) is embedded into the mounting groove and fixedly connected to the mounting portion (2211) via a bolt, and at the same time, the other end of the central connecting member (2233) is connected to the bottom mounting member (2232). The above-mentioned bottom mounting member (2232) is installed in a stepped structure, its upper end is connected to the central connecting member (2233), and its lower end is connected to the pulley rotation disk (241), so that each structural member connected thereto can be driven to rotate synchronously through the rotation of the pulley rotation disk (241).

[0107] The polygonal panel rotation mechanism (24) includes a pulley rotation disk (241) and a drive assembly (242), the pulley rotation disk (241) is fixedly coupled to a bottom mounting member (2232), the drive assembly (242) is installed on a bottom disk (221), and the drive assembly (242) is electrically connected to the pulley rotation disk (241) via a drive belt (27) to drive the pulley rotation disk (241) to rotate and to drive the movable top ring (223) to rotate synchronously through the rotation of the pulley rotation disk (241).

[0108] Specifically, the drive assembly (242) includes a second drive motor (2421) and a reduction mechanism, the input end of the reduction mechanism is electrically connected to the first gear (2422), and the output end of the reduction mechanism is connected to the pulley rotation disk (241) to drive the pulley rotation disk (241) to rotate. At the same time, the reduction mechanism further includes a drive shaft and a second gear (2423) and a third gear (2424) installed at both ends of the drive shaft, the second gear (2423) is connected to the first gear (2422) via a drive belt (27), and the third gear (2424) is connected to the pulley rotation disk (241) via a drive belt (27), and the diameter of the second gear (2423) is larger than the diameter of the first gear (2422).

[0109] That is, after the second drive motor (2421) outputs driving force to the second gear (2423) through the first gear (2422), the second gear (2423) can be driven to rotate, and since the diameter of the third gear (2424) is smaller than the diameter of the second gear (2423), when the second gear (2423) rotates one full turn, the third gear (2424) is driven to rotate multiple full turns, and then power is output to the pulley rotation disk (241) through the third gear (2424) to drive the pulley rotation disk (241) to rotate.

[0110] However, since the entry angle of the drive belt (27) introduced and exited between the third gear (2424) and the pulley rotating disk (241) is excessive, the drive area between the drive belt (27), the third gear (2424), and the pulley rotating disk (241) is reduced, which affects the stability of the drive process between the pulley rotating disk (241) and the third gear (2424). Therefore, to improve the drive area between the drive belt (27), the pulley rotating disk (241), and the third gear (2424), an idler gear is installed between the third gear (2424) and the pulley rotating disk (241).

[0111] By installing an idler gear, the drive belt (27) derived from the third gear (2424) is guided to drive with the pulley rotating disk (241) at a smaller entry angle, thereby increasing the drive area between the drive belt (27) and the pulley rotating disk (241). At the same time, when the drive belt (27) is introduced from the pulley rotating disk (241) to the third gear (2424), the drive belt (27) being introduced also has its entry angle adjusted first through the idler gear, thereby increasing the drive area between the drive belt (27) and the third gear (2424), thus ensuring stability during drive between the pulley rotating disk (241) and the third gear (2424).

[0112] Referring to FIG. 29, the detection station (4a) further comprises a three-axis motion platform (41) and a visual detection mechanism (42), the three-axis motion platform (41) has motion strokes in three directions X, Y, and Z, and the visual detection mechanism (42) is installed on the three-axis motion platform (41) and can be driven to move upward on the polygonal panel work platform via the three-axis motion platform (41), and the visual detection mechanism (42) is suitable for performing visual detection of the dispensing state of the polygonal panel (100) supported on the polygonal panel work platform.

[0113] Specifically, the visual detection mechanism (42) includes at least a 2D detection module and may additionally install a 3D detection module. After additionally installing the 3D detection module, it is integrated integrally with the 2D detection module to implement synchronous movement. Here, the detection module can perform adhesive shape detection, and adhesive shape detection includes determining the product target position, delimiting the detection area, identifying a 2D code, detecting errors, detecting adhesive points, and measuring the adhesive shape. 3D detection mainly includes functions such as detecting the adhesive height of the four sides of the product and detecting the adhesive height of the R corner.

[0114] More specifically, the polygonal panel lifting mechanism (26) includes a polygonal panel support member (261), a second screw drive assembly (262), and a third drive motor (263). The polygonal panel support member (261) is suitable for moving along a vertical direction and is positioned at the peripheral edge and the center of the polygonal panel, respectively, so as to be able to simultaneously support the peripheral edge and the center of the polygonal panel after extending upward from the heating module (6). The second screw drive assembly (262) is positioned at the periphery of the polygonal panel and is connected to each polygonal panel support member (261) via a bottom plate. Each second screw drive assembly (262) is connected to each other via a drive belt (27) to perform synchronous movement. The third drive motor (263) is electrically connected to an adjacent second screw drive assembly (262) via a drive belt (27), so that each second screw drive The assembly (262) is driven to move synchronously along the vertical direction.

[0115] Referring to FIGS. 31 through 33, a polygonal panel working method according to a fifth aspect embodiment of the present disclosure is applied to a panel chip level underfill equipment, wherein the panel chip level underfill equipment comprises a loading / unloading mechanism (1a) for transferring a polygonal panel (100) to each working station, a preparation station (2a) for preheating, scanning, and aligning the polygonal panel (100), a dispensing station (3a) for heating and dispensing the preheated polygonal panel (100), and a detection station (4a) for detecting the polygonal panel (100) after dispensing is completed. Optionally, the panel chip level underfill equipment is a panel chip level underfill equipment according to any fourth aspect embodiment of the present disclosure. The polygonal panel working method

[0116] A step of acquiring a polygonal panel (100) and scanning the polygonal panel (100);

[0117] A step of initially preheating the polygonal panel (100);

[0118] A step of performing a first bending prevention operation on the polygonal panel (100) after the temperature of the polygonal panel (100) reaches a first set temperature;

[0119] After the bending prevention work on the polygonal panel (100) is completed, the polygonal panel (100) is rotated to a designated angle and then transferred back to the dispensing station (3a) to continue heating;

[0120] A step of performing dispensing after the temperature of the polygonal panel (100) reaches a second set temperature, and then performing a second anti-bending operation on the polygonal panel (100); and

[0121] After the dispensing of the polygonal panel (100) is completed, the polygonal panel (100) is transferred to a detection station (4a) to detect the dispensing state of the polygonal panel (100), and then the polygonal panel (100) is output.

[0122] Specifically, the polygonal panel (100) is first input to the preparation station (2a) via the loading / unloading mechanism (1a), and then, after performing scanning alignment, preheating, warping prevention, and alignment operations at the preparation station (2a), the polygonal panel (100) is transferred to the dispensing station (3a) to perform preheating, heating, warping prevention, and dispensing operations, and then, the polygonal panel (100) after dispensing is transferred to the detection station (4a), and the detection station (4a) performs adhesive shape detection on the polygonal panel (100) after dispensing is completed, and additionally installs adhesive height detection if necessary.

[0123] Specifically, the step of initially preheating the polygonal panel (100) is,

[0124] A step of lifting the polygonal panel (100) so that the polygonal panel (100) does not come into direct contact with the heating module (6) of the preparation station (2a);

[0125] A step of gradually decreasing the distance between the polygonal panel (100) and the heating module (6) to gradually increase the temperature of the polygonal panel (100); and

[0126] The method includes the step of, after the temperature of the polygonal panel (100) has risen to a temperature at which it can come into direct contact with the heating module (6), placing the polygonal panel (100) back into the heating module (6) to heat it to a first set temperature.

[0127] More specifically, the polygonal panel (100) is heated to a first set temperature at the preparation station (2a) and then transferred to the dispensing station (3a), but since the temperature of the polygonal panel (100) has not yet reached the temperature required for the operation of the dispensing station (3a), the polygonal panel (100) must be heated to a second set temperature. When heating, the polygonal panel (100) is first lifted through a lifting mechanism (2) installed in the dispensing station (3a), and a heating module (6) installed in the dispensing station (3a) performs a second preheating on the polygonal panel (100). Then, the lifting mechanism (2) slowly supports the polygonal panel (100) to bring it close to the heating module (6), and finally, the polygonal panel (100) is placed on the heating module (6), and the temperature of the polygonal panel (100) is... After raising to the second set temperature, subsequent operations such as preventing bending and dispensing can be performed on the polygonal panel (100).

[0128] Specifically, the step of performing a bending prevention operation on the polygonal panel (100) is,

[0129] A step of placing a polygonal panel (100) in the upper chamber of a heating module (6) and supporting the polygonal panel (100);

[0130] A step of gradually lowering the support of the polygonal panel (100) until the polygonal panel (100) comes into contact with the surface of the heating module (6); and

[0131] The method includes the step of simultaneously pressing downward on multiple edge portions of the polygonal panel (100) through multiple flattening mechanisms (3) to bond the polygonal panel (100) onto the heating module (6).

[0132] More specifically, as the flattening mechanism (3) presses downward on the edge of the polygonal panel (100), the amount of bending decreases, and the flattening mechanism (3) can self-adaptively adjust the contact position with the edge of the polygonal panel (100).

[0133] In summary, the present disclosure can perform automatic flattening processing on the bending edge of a polygonal panel (100), improve work efficiency, and reduce the risk of damage to the polygonal panel (100). By installing a universal pressure head (319), flexible contact with the bending edge is achieved during the downward pressure process, which is advantageous for reducing damage to the polygonal panel (100). The pressure value applied by the universal pressure head (319) to the bending edge of the polygonal panel (100) can be detected in real time through a pressure sensor (326), allowing for monitoring of pressure changes and timely adjustment. At the same time, it ensures synchronization of each region of the polygonal panel (100) when performing lifting support on the polygonal panel (100).

[0134] To facilitate understanding of the present application, the movement and angular position of the polygonal panel (100) between each station of the panel chip level underfill equipment are briefly described below. It should be understood that only the angular position is described exemplarily below, and the corresponding operation performed at each station is omitted, and the omitted details can be specifically referred to in the above description. For example, the polygonal panel (100) described below has a roughly rectangular shape with a chamfer, and the chamfer is intended to check the orientation of the polygonal panel (100) and to prevent misalignment.

[0135] When combined with FIG. 18, FIG. 34a to FIG. 34g relate to a dispensing station (3a) located on the same side as the preparation station (2a) and the loading / unloading mechanism (1a).

[0136] In the first step, as illustrated in FIG. 34a, the polygonal panel (100) is at a first angle in the material storage of the loading / unloading mechanism (1a), and a mechanical hand (i.e., a pickup member (11)) transfers the polygonal panel (100) in the material storage to a preparation station (2a), and during this transfer process, the mechanical hand rotates 90° counterclockwise so that the polygonal panel (100) enters the preparation station (2a) at a second angle, which is 90° counterclockwise relative to the first angle;

[0137] In the second step, as illustrated in FIG. 34b, at the preparation station (2a), the polygonal panel (100) is rotated 90° counterclockwise with respect to the second angle in the polygonal panel support assembly (22) of the preparation station (2a) to obtain a third angle, at which time the polygonal panel (100) is at the third angle;

[0138] In the third step, as illustrated in FIG. 34c, a mechanical hand extracts the polygonal panel (100) from the preparation station (2a) and transfers it to a dispensing station (3a) located on the same side as the preparation station (2a) and the loading / unloading mechanism (1a), and during this process, no change in the orientation of the polygonal panel (100) occurs;

[0139] In the fourth step, as illustrated in FIG. 34d, a mechanical hand extracts a polygonal panel (10) from the corresponding dispensing station (3a) and transfers it to a detection station (4a). During this transfer process, the mechanical hand rotates 180° clockwise or counterclockwise relative to the third angle to obtain a fourth angle, at which point the polygonal panel (100) is at the fourth angle;

[0140] In the fifth step, as illustrated in FIG. 34e, the polygonal panel (100) in the polygonal panel support assembly (22) of the detection station (4a) is rotated 90° counterclockwise with respect to the fourth angle to obtain the fifth angle, at which time the polygonal panel (100) is at the fifth angle;

[0141] Step 6, as illustrated in FIG. 34f, the polygonal panel (100) in the polygonal panel support assembly (22) of the detection station (4a) rotates 180° counterclockwise or clockwise with respect to the second angle to obtain the sixth angle;

[0142] In the seventh step, as illustrated in FIG. 34g, a mechanical hand extracts a polygonal panel (100) located on a detection station (4a) and transports it to a material storage unit. During this transport process, the mechanical hand rotates 90° counterclockwise to obtain a seventh angle, at which point the polygonal panel (100) is at the seventh angle, and the seventh angle is in the same orientation as the first angle, that is, the angle at which the polygonal panel (100) returns to the material storage unit (as illustrated in FIG. 34g) is the same as the angle at which the polygonal panel (100) is output from the material storage unit (as illustrated in FIG. 34a).

[0143] FIGS. 35a to 35c relate to a dispensing station (3a) located on different sides of a preparation station (2a) and a loading / unloading mechanism (1a).

[0144] The first step is the same as the first step of FIG. 34a. For brevity, specific drawings are not shown, nor are specific descriptions provided.

[0145] In the second step, as illustrated in FIG. 35a, at the preparation station (2a), the polygonal panel (100) is rotated 90° clockwise with respect to the second angle in the polygonal panel support assembly (22) of the preparation station (2a) to obtain an eighth angle, at which time the polygonal panel (100) is at the eighth angle;

[0146] In the third step, as illustrated in FIG. 35b, a mechanical hand extracts a polygonal panel (100) from a preparation station (2a) and transfers it to a dispensing station (3a) located on opposite sides of the preparation station (2a) and the loading / unloading mechanism (1a), and in this process, the mechanical hand rotates 180° clockwise or counterclockwise so that the polygonal panel (100) rotates 180° clockwise or counterclockwise to obtain a ninth angle, at which time the polygonal panel (100) is at the ninth angle;

[0147] In the fourth step, as illustrated in FIG. 35c, a mechanical hand extracts the polygonal panel (10) from the corresponding dispensing station (3a) and transfers it to the detection station (4a), and during this transfer process, the angular position of the polygonal panel (100) does not change;

[0148] In the fifth step, as illustrated in FIG. 35d, the polygonal panel (100) in the polygonal panel support assembly (22) of the detection station (4a) is rotated 90° clockwise with respect to the ninth angle to obtain the tenth angle, at which time the polygonal panel (100) is at the tenth angle;

[0149] Steps 6 and 7 are identical to Steps 6 and 7 of FIG. 34f and FIG. 34g. For brevity, specific drawings are not shown, nor are specific descriptions provided.

[0150] It is necessary to explain that, in this embodiment, as can be seen from FIGS. 34a to 34g and FIGS. 35a to 35d, when an operator is standing at the operating position of the dispensing station (3a) or the detection station (4a), the chamfer of the polygonal panel (100) is located at the lower left corner of the polygonal panel (100) when observed from the operator's perspective. Of course, in other embodiments, the chamfer may be located at other corners of the polygonal panel (100), for example, the lower right corner.

[0151] The dotted line in the drawing does not represent the movement trajectory of the mechanical hand (i.e., the pickup member (11)), and the starting point and ending point positions when the polygonal panel (100) is returned can be identified through both ends of the dotted line.

[0152] In the description of this specification, the reference terms “one embodiment,” “some embodiment,” “exemplary embodiment,” “example,” “specific example,” or “some example” mean that the specific features, structures, materials, or properties described in combination with said embodiment or example are included in at least one embodiment or example of this disclosure. In this specification, the exemplary expressions of the terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials, or properties may be combined in an appropriate manner in any one or more embodiments or examples.

[0153] The foregoing is based on ideal embodiments of the present disclosure, and through the above description, a person skilled in the art can fully perform various changes and modifications without departing from the scope of the technical concept of the present disclosure. The technical scope of the present disclosure is not limited to the contents of the specification, and must be defined by the scope of the claims. Explanation of the symbols

[0154] 1: Support 1021: Suction hole 1022: Vacuum Connector 100: Polygon panel 101: Heating plate 102: Vacuum adsorption module 103: Insulation layer 104: Communion 2: Lifting Mechanism 2219: Lifting Screw 2229: Connection Load 2239: Third connecting block 224: Bearing 2319: Lifting drive member 2329: Electric Gear 233: Power belt 234: Idler Gear 241: Guide Pillar 242: Guide Block 229: Screw lifting assembly 239: Lifting drive assembly 249: Guide Assembly 25: Floor plate 3: Flattening mechanism 319: Universal Pressure Head 32: Longitudinal drive assembly 33: Lateral drive assembly 34: Pressure plate 35: Connection Module 36: Bass 311: Connection 312: Ball 321: Longitudinal drive motor 322: Synchronous Wheel 323: Synchronizing belt 324: Longitudinal screw 3259: 1st connection block 3269: Longitudinal drive plate 331: Transverse drive cylinder 332: Transverse mounting plate 333: Transverse drive plate 334: Second connection block 351: 1st connecting plate 352: Second connecting plate 353: Third connecting plate 354: Guide rail 355: 1st Limit Block 3261: Block 361: Photoelectric sensor 4: Pressure sensor 5: Pressure calibration table 66: Support mechanism 616: Support plate 626: Support assembly 621: First supporting member 622: Second support member 6211: Step surface 71: Temperature sensor 8: Support pillars 1a: Loading / Unloading Mechanism 11: No pickup 12: Movable part 13: Bass 2a: Preparation Station 20: Polygonal Panel Rotation Platform 21: Polygonal panel support 22: Polygonal panel support assembly 221: Floor disc 2211: Mounting part 2212: Guide Pillar 222: Fixed outer ring 223: Movable top ring 2231: Top support member 2232: Bottom mounting member 2233: Central connecting member 23: Polygonal Panel Lifting Mechanism 231: First screw drive assembly 232: 1st drive motor 24: Polygonal Panel Rotation Mechanism 241: Pulley rotating disk 242: Drive Assembly 2421: Second drive motor 2422: 1st Gear 2423: 2nd Gear 2424: Third Gear 26: Polygonal Panel Lifting Mechanism 261: Polygonal panel support member 262: Second screw drive assembly 263: Third drive motor 27: Power belt 28: Temporary pause frame 3a: Dispensing Station 31: Dispensing Operation Platform 325: Connection Module 3251: 1st connecting plate 3252: Second connecting plate 3253: Third connecting plate 3254: Guide rail 326: Pressure sensor 4a: Detection station 41: 3-axis motion platform 42: Visual Detection Mechanism 5a: Material storage rack 6: Heating module 61: Inner ring heating plate 62: Paddle ring heating plate 70: Y-axis drive mechanism 72: X-axis drive mechanism 73: Z-axis working mechanism

Claims

Claim 1 In a polygonal panel bending suppression work platform, a support member (1) that supports the polygonal panel (100) and whose shape matches the shape of the polygonal panel (100); a support mechanism (66) located below the support member (1) and movable along a vertical direction, capable of supporting the polygonal panel (100) when the support end of the support mechanism (66) protrudes from the support member (1); and a lifting mechanism (2) capable of moving the support mechanism (66) up and down along a vertical direction, wherein when the support mechanism (66) moves upward, the polygonal panel (100) is supported on the support mechanism (66); and when the support mechanism (66) moves downward, the polygonal panel (100) is supported on the support member (1). A polygonal panel bending suppression work platform characterized by including a plurality of flattening mechanisms (3) - one of the flattening mechanisms (3) corresponds to one side of the support (1), and when the polygonal panel (100) is placed on the support (1), the plurality of flattening mechanisms (3) simultaneously press downward on each of the edge portions of the polygonal panel (100) to join the polygonal panel (100) to the support (1). Claim 2 A polygonal panel bending suppression work platform according to claim 1, wherein the support mechanism (66) includes a support plate (616) and a support assembly (626), the support plate (616) is connected to the lifting mechanism (2), the lower end of the support assembly (626) is connected to the support plate (616), and a plurality of through holes (104) are opened in the support member (1) to allow the support assembly (626) to move, and when the polygonal panel (100) is supported by the support assembly (626), the support assembly (626) protrudes from the support member (1) by penetrating the through holes (104), and when the polygonal panel (100) is supported on the support member (1), the support assembly (626) retracts into the through holes (104). Claim 3 A polygonal panel bending suppression work platform according to claim 2, wherein the support assembly (626) includes a plurality of first support members (621), the positions of the plurality of first support members (621) correspond to the edge portions of the support plate (616), and the plurality of first support members (621) jointly support the edge of the polygonal panel (100). Claim 4 A polygonal panel bending suppression work platform according to claim 3, wherein the support assembly (626) further includes a second support member (622), the position of the second support member (622) corresponds to the central part of the support plate (616), and the second support member (622) assists a plurality of the first support members (621) to jointly support the polygonal panel (100). Claim 5 A polygonal panel bending suppression work platform according to claim 3 or 4, characterized in that a stepped surface (6211) for contacting the edge of the polygonal panel (100) is installed at the support end of the first support member (621). Claim 6 In any one of claims 1 to 5, the lifting mechanism (2) is connected to the support mechanism (66) and operates simultaneously to control the support mechanism (66) to rise and fall synchronously as a whole, comprising a plurality of screw lifting assemblies (229); A polygonal panel bending suppression work platform comprising a lifting drive assembly (239) including a lifting drive member (2319) and a power belt (233) - wherein the power belt (233) is simultaneously power-connected to a plurality of screw lifting assemblies (229), and the lifting drive member (2319) drives the plurality of screw lifting assemblies (229) to operate simultaneously through the power belt (233); wherein when the output axis of the lifting drive member (2319) rotates in the forward direction, the support mechanism (66) can be driven to rise synchronously as a whole, and when the output axis of the lifting drive member (2319) rotates in the reverse direction, the support mechanism (66) can be driven to descend synchronously as a whole. Claim 7 A polygonal panel bending suppression work platform according to claim 6, wherein the lifting drive assembly (239) further comprises a plurality of electric gears (2329) and idler gears (234), the electric gears (2329) are connected to the screw lifting assembly (229), and the electric belt (233) is wound on the electric gears (2329) and idler gears (234) to implement electric power. Claim 8 A polygonal panel bending suppression work platform according to any one of claims 1 to 7, wherein the flattening mechanism (3) can change the height by extending in the longitudinal direction and change the distance from the support (1) by extending in the transverse direction. Claim 9 A polygonal panel bending suppression work platform according to any one of claims 1 to 8, wherein the flatning mechanism (3) comprises a longitudinal drive assembly (32), a transverse drive assembly (33), a pressure plate (34), and a universal pressure head (319), wherein the universal pressure head (319) is installed on the pressure plate (34), the pressure plate (34) is connected to the transverse drive assembly (33), and the transverse drive assembly (33) is connected to the longitudinal drive assembly (32). Claim 10 A polygonal panel bending suppression work platform according to claim 9, wherein the universal pressure head (319) comprises a connector (311) and a ball (312), most of the volume of the ball (312) is located within a receiving groove of the connector (311), the connector (311) is installed within a mounting hole of the pressure plate (34), and when the ball (312) contacts the edge of the polygonal panel (100), the ball (312) self-adaptively adjusts the contact position with the edge as the amount of bending of the polygonal panel (100) decreases during the process in which the flattening mechanism (3) presses the edge of the polygonal panel (100) downward. Claim 11 A polygonal panel bending suppression work platform according to any one of claims 1 to 10, wherein a heating module (6) is installed on the support (1), and when the polygonal panel (100) is supported on the support (1), the heating module (6) heats the polygonal panel (100). Claim 12 A polygonal panel bending suppression work platform according to any one of claims 1 to 11, wherein a vacuum suction module (102) is installed on the support (1), and a plurality of suction channels are opened on the upper surface of the vacuum suction module (102). Claim 13 A polygonal panel bending suppression work platform characterized in that, in any one of claims 1 to 12, the polygonal panel (100) is a wafer. Claim 14 A method for suppressing bending of a polygonal panel, comprising: S1, a step of placing a polygonal panel (100) on the top surface of a support (1), and moving a support mechanism (66) driven by a lifting mechanism (2) upward and protruding from the support (1) to support the polygonal panel (100); S2, a step of driving the lifting mechanism (2) to gradually lower the support mechanism (66) so that the polygonal panel (100) comes into contact with the top surface of the support (1); and S3, a step of having a plurality of flattening mechanisms (3) located around the support (1) simultaneously press a plurality of edge portions of the polygonal panel (100) downward to bond the polygonal panel (100) onto the support (1). Claim 15 A method for suppressing polygonal panel bending according to claim 14, characterized in that, prior to step S2, the lifting mechanism (2) lowers the support mechanism (66) by a certain distance and then hovers above the support (1), and the heating module (6) of the support (1) bakes the polygonal panel (100). Claim 16 A method for suppressing polygonal panel bending, characterized in that, in claim 14 or 15, prior to step S3, the heating module (6) of the support (1) heats the polygonal panel (100). Claim 17 A method for suppressing bending of a polygonal panel, wherein, in any one of claims 14 to 16, during the process in which the flattening mechanism (3) presses downward on the edge of the polygonal panel (100), the universal pressure head (319) of the flattening mechanism (3) self-adaptively adjusts the contact position with the edge of the polygonal panel (100) as the amount of bending of the polygonal panel (100) decreases. Claim 18 A dispensing device comprising a dispensing work platform (31) and a polygonal panel bending suppression work platform according to any one of claims 1 to 13, wherein the dispensing work platform (31) is located above the polygonal panel bending suppression work platform and performs a dispensing operation on a polygonal panel disposed on the polygonal panel bending suppression work platform. Claim 19 A dispensing device according to claim 18, wherein the dispensing work platform (31) comprises: a y-axis driving mechanism (70) installed on each side of the support; an x-axis driving mechanism (72) with both ends installed on the y-axis driving mechanism (70); and four z-axis working mechanisms (73) all connected to the x-axis driving mechanism (72) and capable of performing dispensing work independently or synchronously. Claim 20 In a panel chip level underfill equipment, the loading / unloading mechanism (1a) is included, wherein the loading / unloading mechanism (1a) has an activity space suitable for transporting a polygonal panel (100) inside, wherein a pickup member (11) for loading and unloading the polygonal panel (100) is installed within the activity space, and wherein the pickup member (11) is suitable for transporting the polygonal panel (100) to each work station, and wherein each work station includes a preparation station (2a), a dispensing station (3a), and a detection station (4a), wherein the dispensing station (3a) is a dispensing device according to claim 18 or 19, and wherein the preparation station (2a) is located on one side of the loading / unloading mechanism (1a) and can receive the polygonal panel (100) to be processed input from the pickup member (11), and wherein the polygonal panel to be processed A panel chip level underfill device characterized by preheating and scanning a panel (100) to align it, wherein the dispensing station (3a) is located on the side of the loading / unloading mechanism (1a) and the dispensing station (3a) is positioned adjacent to the material storage section of the loading / unloading mechanism (1a) so as to receive the preheated polygonal panel (100) via the preparation station (2a) via the shortest path and perform heating and dispensing on the preheated polygonal panel (100), wherein the inspection station (4a) is located on the other side of the loading / unloading mechanism (1a) and is installed to face the preparation station (2a), and the detection station (4a) is suitable for receiving the polygonal panel (100) after the dispensing operation is completed at the dispensing station (3a) and detecting the dispensing state of the polygonal panel (100). Claim 21 In claim 20, the loading / unloading mechanism (1a) comprises: a base (13); a movable member (12) installed on the base (13) via a guide rail (3254) and suitable for moving between each of the work stations along the guide rail (3254); and a pickup member (11) installed on the movable member (12) for picking up and placing the polygonal panel (100) within the material storage unit and each of the work stations, characterized in that it comprises a panel chip level underfill equipment. Claim 22 A panel chip level underfill equipment according to claim 20 or 21, wherein the preparation station (2a) and the detection station (4a) both include a polygonal panel work platform, and the polygonal panel work platform includes: a polygonal panel rotation platform (20); a heating module (6) - the polygonal panel rotation platform (20) divides the heating module (6) into an inner ring heating plate (61) and an outer ring heating plate (62), and the inner ring heating plate (61) and the outer ring heating plate (62) are suitable for heating the polygonal panel (100) simultaneously -; and a polygonal panel lifting mechanism (26) suitable for moving along a vertical direction and protruding from the heating module (6) to support the polygonal panel (100). Claim 23 In claim 22, the polygonal panel rotation platform (20) comprises: a polygonal panel support (21) used to support the polygonal panel (100); a polygonal panel support assembly (22) that moves along a vertical direction and protrudes from the polygonal panel support (21) and can be used to support the polygonal panel (100); a polygonal panel lifting mechanism (23) connected to the polygonal panel support assembly (22) to drive the polygonal panel support assembly (22) to move along a vertical direction; and a polygonal panel rotation mechanism (24) that drives the polygonal panel support assembly (22) to rotate around a vertical direction and drives the polygonal panel (100) to rotate synchronously when the polygonal panel support assembly (22) protrudes from the polygonal panel support (21). Claim 24 In claim 23, the polygonal panel lifting mechanism (23) comprises: a first screw drive assembly (231) that drives the polygonal panel support assembly (22) to move up and down along a vertical direction; and a first drive motor (232) that is belt-driven connected to the first screw drive assembly (231) via a drive belt (27) and drives the first screw drive assembly (231) to move. Panel chip level underfill equipment. Claim 25 A panel chip level underfill device according to claim 23 or 24, wherein the polygonal panel support assembly (22) comprises: a bottom disk (221) - the polygonal panel lifting mechanism (23) is suitable for driving the bottom disk (221) to move along a vertical direction -; a fixed outer ring (222) fixed to the bottom disk (221) via a plurality of support columns; and a movable top ring (223) connected to the fixed outer ring (222) via a bearing and capable of protruding from the polygonal panel support (21). Claim 26 In claim 25, the above-described movable upper ring (223) comprises: a top support member (2231) suitable for protruding from the polygonal panel support (21) and contacting the polygonal panel (100); a bottom mounting member (2232) connected to the fixed outer ring (222) via a bearing; and a central connecting member (2233) simultaneously connecting the bottom mounting member (2232) and the top support member (2231), characterized in that it is a panel chip level underfill device. Claim 27 In claim 26, the polygonal panel rotation mechanism (24) comprises: a pulley rotation disk (241) fixed and covered on the bottom mounting member (2232); and a drive assembly (242) installed on the bottom disk (221) and electrically connected to the pulley rotation disk (241) via an electric belt (27) to drive the pulley rotation disk (241) to rotate and to drive the movable top ring (223) to rotate synchronously via the pulley rotation disk (241), characterized in that it comprises a panel chip level underfill device. Claim 28 In claim 27, the above drive assembly (242) comprises: a second drive motor (2421) having a first gear (2422) mounted at its output end; and a reduction mechanism having its input end electrically connected to the first gear (2422) and its output end connected to the pulley rotation disk (241) to drive the pulley rotation disk (241) to rotate, the panel chip level underfill equipment. Claim 29 In claim 28, the reduction mechanism comprises a drive shaft and a second gear (2423) and a third gear (2424) installed at both ends of the drive shaft, wherein the second gear (2423) is connected to the first gear (2422) via a drive belt (233), the third gear (2424) is connected to the pulley rotation disk (241) via a drive belt (233), and the diameter of the second gear (2423) is larger than the diameter of the first gear (2422), characterized in that the panel chip level underfill equipment. Claim 30 In any one of claims 22 to 29, the polygonal panel lifting mechanism (26) is suitable for moving along a vertical direction and is positioned at the peripheral edge and the center of the polygonal panel (100), respectively, and is capable of simultaneously supporting the peripheral edge of the polygonal panel (100) and the center of the polygonal panel (100) after extending upward from the heating module (6); a second screw drive assembly (262) positioned at the periphery of the polygonal panel (100) and connected to each of the polygonal panel support members (261) via a bottom plate - each of the second screw drive assemblies (262) is connected to each other via a drive belt (27) to perform synchronous movement -; A panel chip level underfill device characterized by including a third drive motor (263) that is electrically connected to an adjacent second screw drive assembly (262) via a drive belt (27) and drives each second screw drive assembly (262) to move synchronously along a vertical direction. Claim 31 A panel chip level underfill equipment, characterized in that, in any one of claims 20 to 30, the detection station (4a) further comprises: a three-axis motion platform (41) having motion strokes in three directions X, Y, and Z; and a visual detection mechanism (42) — the visual detection mechanism (42) is installed on the three-axis motion platform (41) and can be driven to move the visual detection mechanism (42) upward on the polygonal panel working platform via the three-axis motion platform (41), and the visual detection mechanism (42) is suitable for performing visual detection of the dispensing state of the polygonal panel (100) supported on the polygonal panel working platform. Claim 32 In a polygonal panel working method, the panel chip level underfill equipment is applied, wherein the panel chip level underfill equipment comprises a loading / unloading mechanism (1a) for transporting a polygonal panel (100) to each working station, a preparation station (2a) for scanning, aligning, and preheating the polygonal panel (100), a dispensing station (3a) for heating and dispensing the preheated polygonal panel (100), and a detection station (4a) for detecting the polygonal panel (100) after dispensing is completed, and the polygonal panel working method comprises the steps of: acquiring a polygonal panel (100) and scanning and aligning the polygonal panel (100); the step of initially preheating the polygonal panel (100); the step of performing a first warping prevention operation on the polygonal panel (100) after the temperature of the polygonal panel (100) reaches a first set temperature; and the warping prevention of the polygonal panel (100). A polygonal panel operation method characterized by comprising: a step of, after the operation is completed, rotating the polygonal panel (100) to a specified angle and then transferring it back to a dispensing station (3a) to continue heating; a step of, after the temperature of the polygonal panel (100) reaches a second set temperature, performing a second anti-bending operation on the polygonal panel (100) and then performing dispensing; and a step of, after the dispensing of the polygonal panel (100) is completed, transferring the polygonal panel (100) to a detection station (4a) to detect the dispensing state of the polygonal panel (100) and then outputting the polygonal panel (100). Claim 33 A polygonal panel operation method according to claim 32, wherein the step of initially preheating the polygonal panel (100) comprises: lifting the polygonal panel (100) so that the polygonal panel (100) does not come into direct contact with the heating module (6) of the preparation station (2a); gradually decreasing the distance between the polygonal panel (100) and the heating module (6) to gradually increase the temperature of the polygonal panel (100); and, after the temperature of the polygonal panel (100) has risen to a temperature at which it can come into direct contact with the heating module (6), placing the polygonal panel (100) back into the heating module (6) to heat it to a first set temperature. Claim 34 A method for working with a polygonal panel according to claim 32 or 33, wherein the step of performing a bending prevention operation on a polygonal panel (100) comprises: placing the polygonal panel (100) in the upper position of a heating module (6) and supporting the polygonal panel (100); gradually lowering the support of the polygonal panel (100) until the polygonal panel (100) comes into contact with the surface of the heating module (6); and simultaneously pressing downward a plurality of edge portions of the polygonal panel (100) through a plurality of flattening mechanisms (32) to bond the polygonal panel (100) onto the heating module (6). Claim 35 A polygonal panel working method according to claim 34, characterized in that, as the amount of bending decreases during the process in which the flattening mechanism (32) presses downward on the edge of the polygonal panel (100), the flattening mechanism (32) self-adaptively adjusts the contact position with the edge of the polygonal panel (100).

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