Display apparatus, method for manufacturing display apparatus and electronic apparatus

Abstract

According to one aspect of the present invention, a display device is disclosed comprising: a substrate; a first light-emitting element and a second light-emitting element on the substrate; a bank layer having openings corresponding to each of the first light-emitting element and the second light-emitting element to define a first light-emitting region and a second light-emitting region; an organic encapsulation layer disposed on the bank layer; a first color filter disposed on the organic encapsulation layer and disposed to overlap the first light-emitting region and a second color filter disposed to overlap the second light-emitting region; and an overcoat layer covering the first color filter and the second color filter and filling the space between the first color filter and the second color filter.

Description

Technology Field

[0001] The present invention relates to a display device, a method for manufacturing a display device, and an electronic device, and more specifically, to a display device with improved light emission efficiency, a method for manufacturing a display device, and an electronic device. Background Technology

[0002] Recently, electronic devices have been widely used. Electronic devices are utilized in various forms, such as mobile and stationary devices, and these devices include display devices capable of providing visual information, such as images or videos, to users to support various functions.

[0003] A display device includes multiple pixels that receive electrical signals and emit light to display an image externally. Each pixel includes a light-emitting element; for example, in the case of an organic light-emitting display device, it has an organic light-emitting diode (OLED) as the light-emitting element. Generally, an organic light-emitting display device forms thin-film transistors and organic light-emitting diodes on a substrate, and operates by the organic light-emitting diode emitting light on its own.

[0004] Recently, as the applications of display devices have become more diverse, various design attempts are being made to improve their quality.

[0005] The aforementioned background technology is technical information that the inventor possessed for the derivation of the present invention or acquired during the process of deriving the present invention, and it cannot be considered as publicly known technology disclosed to the general public prior to the filing of the present invention. The problem to be solved

[0006] In order to solve various problems including the problems mentioned above, embodiments of the present invention aim to provide a display device with improved process efficiency, a method for manufacturing a display device, and an electronic device.

[0007] However, these problems are exemplary, and the problems to be solved by the present invention are not limited thereto. means of solving the problem

[0008] According to one aspect of the present invention, a display device is disclosed comprising: a substrate; a first light-emitting element and a second light-emitting element on the substrate; a bank layer having openings corresponding to each of the first light-emitting element and the second light-emitting element to define a first light-emitting region and a second light-emitting region; an organic encapsulation layer disposed on the bank layer; a first color filter disposed on the organic encapsulation layer and disposed to overlap the first light-emitting region and a second color filter disposed to overlap the second light-emitting region; and an overcoat layer covering the first color filter and the second color filter and filling the space between the first color filter and the second color filter.

[0009] In one embodiment, the surface of the organic encapsulation layer may be a hydrophobic coating.

[0010] In one embodiment, the first color filter and the second color filter may have a convex hemispherical dome shape.

[0011] In one embodiment, the apparatus further comprises a first encapsulating member disposed between the organic encapsulating layer and the first color filter, and a second encapsulating member disposed between the organic encapsulating layer and the second color filter, wherein the first encapsulating member and the second encapsulating member may be disposed spaced apart from each other.

[0012] In one embodiment, it may further include a first scattering part disposed on the first bagging member and a second scattering part disposed on the second bagging member.

[0013] In one embodiment, the first color filter may cover the first encapsulating member and the first scattering member so that the first encapsulating member and the first scattering member are located within the perimeter of the first color filter in a planar view.

[0014] In one embodiment, the light-blocking member disposed between the first color filter and the second color filter is further included, and the light-blocking member may be spaced apart from the first color filter and the second color filter.

[0015] In one embodiment, the light-blocking portion may include a first portion having the same material as the first color filter and a second portion having the same material as the second color filter.

[0016] In one embodiment, the second part may be arranged to surround the first part.

[0017] In one embodiment, the light-blocking portion may include a black material.

[0018] According to one aspect of the present invention, a method for manufacturing a display device is disclosed, comprising: a step of arranging a light-emitting element on a substrate; a step of arranging a bank layer having an opening corresponding to the light-emitting element to define a light-emitting region on the light-emitting element; a step of arranging an organic encapsulation layer on the bank layer; a step of patterning an inorganic encapsulation layer and a scattering layer on the organic encapsulation layer in a portion overlapping with the light-emitting region; and a step of forming a color filter by jetting ink to cover the inorganic encapsulation layer and the scattering layer.

[0019] In one embodiment, the step of hydrophobically coating the surface of the organic encapsulation layer may be further included.

[0020] In one embodiment, the step of forming the color filter may include the step of jetting ink so that the color filter has a convex hemispherical shape.

[0021] In one embodiment, the step of forming the color filter may include the step of covering the inorganic encapsulating layer and the scattering layer such that the inorganic encapsulating layer and the scattering layer are located within the perimeter of the color filter in a planar view.

[0022] In one embodiment, the step of arranging a light-blocking portion along the perimeter of the color filter on a plan view may be further included.

[0023] In one embodiment, the light-blocking portion may be spaced apart from the perimeter of the color filter.

[0024] In one embodiment, the light-blocking part may include the same material as the color filter.

[0025] In one embodiment, the step of arranging the light-blocking part may include the step of jetting ink.

[0026] In one embodiment, the light-blocking portion may include a black material.

[0027] According to one aspect of the present invention, an electronic device is disclosed comprising: a processor; and a display device controlled by said processor; wherein the display device comprises: a substrate; a first light-emitting element and a second light-emitting element on the substrate; a bank layer having openings corresponding to each of said first light-emitting element and said second light-emitting element to define a first light-emitting region and a second light-emitting region; an organic encapsulation layer disposed on said bank layer; a first color filter disposed on said organic encapsulation layer and disposed to overlap with said first light-emitting region and a second color filter disposed to overlap with said second light-emitting region; and an overcoat layer covering said first color filter and said second color filter and filling the space between said first color filter and said second color filter.

[0028] Other aspects, features, and advantages other than those described above will become clear from the following specific details, claims, and drawings for implementing the invention. Effects of the invention

[0029] According to embodiments of the present invention, since a separate layer for accommodating a color filter is not required, process efficiency can be improved.

[0030] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims. Brief explanation of the drawing

[0031] FIG. 1a is a block diagram schematically illustrating an electronic device according to one embodiment of the present invention. FIG. 1b is a schematic diagram illustrating electronic devices according to embodiments of the present invention. FIG. 2 is a schematic perspective view illustrating a display device according to one embodiment of the present invention. FIG. 3 shows a light-emitting diode provided in one pixel of a display device according to one embodiment of the present invention and a pixel circuit connected thereto. FIG. 4 is a cross-sectional view schematically showing a display device according to one embodiment of the present invention, and is a cross-sectional view along the line IV-IV' of FIG. 2. FIG. 5 is a cross-sectional view schematically showing a display device according to one embodiment of the present invention. FIGS. 6 and FIGS. 7 are cross-sectional views schematically illustrating a display device according to an embodiment of the present invention. FIGS. 8 to 11 are schematic drawings illustrating a method for manufacturing a display device according to an embodiment of the present invention. Specific details for implementing the invention

[0032] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0034] In the following examples, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0035] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0036] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0037] In the following embodiments, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another film, region, or component is interposed in between.

[0038] In the following embodiments, when membranes, regions, components, etc. are described as being connected, this includes cases where the membranes, regions, components are directly connected and / or cases where other membranes, regions, components are interposed between them to be indirectly connected. Additionally, when membranes, regions, components, etc. are described as being electrically connected, this includes cases where the membranes, regions, components, etc. are directly electrically connected and / or cases where other membranes, regions, components, etc. are interposed between them to be indirectly electrically connected.

[0039] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0040] In the following embodiments, "A and / or B" indicates the case where it is A, B, or both A and B. Additionally, "at least one of A and B" indicates the case where it is A, B, or both A and B.

[0041] In the following embodiments, the meaning of "the wiring extends in a first direction or a second direction" includes not only extending in a straight line shape, but also extending in a zigzag or curved shape along the first direction or the second direction.

[0042] In the following embodiments, "planar" means when the target part is viewed from above. In the following embodiments, "cross-sectional" means when the cross-section obtained by vertically cutting the target part is viewed from the side. In the following embodiments, "overlapping" of the first component with the second component means that the first component is located above or below the second component.

[0043] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes in an orthogonal coordinate system and can be interpreted in a broader sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but they may also refer to different directions that are not orthogonal to each other.

[0044] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0045] FIG. 1a is a block diagram schematically illustrating an electronic device (1) according to an embodiment of the present invention. The electronic device (1) according to the present embodiment may further include modules having additional functions in addition to the display module (11). For example, as shown in FIG. 1a, the electronic device (1) according to the present embodiment may include a display module (11), a processor (12), a memory (13), and a power module (14).

[0046] The processor (12) can control the components of the electronic device (1). The processor (12) may include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0047] The memory (13) can store data information necessary for the operation of the processor (12) or the display module (11). When the processor (12) executes an application stored in the memory (13), a data signal for an image and / or an input control signal is transmitted to the display module (11), and the display module (11) can process the received signal to output image information.

[0048] The power module (14) may include a power supply module, such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate power necessary for the operation of the electronic device (1).

[0049] FIG. 1b is a schematic diagram illustrating electronic devices (1) according to embodiments of the present invention. Referring to FIG. 1b, electronic devices (1) including a display module (11) may include image display electronic devices such as a smartphone (1a), tablet PC (1b), laptop (1c), TV (1d), and desk monitor (1e), as well as wearable electronic devices including a display module such as smart glasses (1f), head-mounted display (1g), and smart watch (1h), and automotive electronic devices (1i) including a display module such as a CID (Center Information Display) and room mirror display placed on the instrument panel, center fascia, and dashboard of a car.

[0050] Meanwhile, the display module (11) may include a display device (10, see FIG. 2). The display device (10) can be applied to various electronic devices (1). That is, the electronic device (1) includes the display device (10) and may further include modules or devices having additional functions other than the display device (10). For example, the electronic device (1) may include a display device (10), a processor (12), a memory (13), and a power module (14), and the display device (10) may be controlled by the processor (12). Below, the description will focus on the display device (10).

[0051] FIG. 2 is a schematic perspective view illustrating a display device according to one embodiment of the present invention.

[0052] Referring to FIG. 2, the display device (10) may include a display area (DA) and an outer peripheral area (NDA) of the display area (DA). The display device (10) may provide an image through an array of multiple pixels (P) arranged two-dimensionally in the display area (DA).

[0053] Each pixel (P) of the display device (10) is an area capable of emitting light of a predetermined color, and the display device (10) can provide an image using the light emitted from the pixels (P). For example, each pixel (P) can emit red, green, blue, or white light.

[0054] Each of the pixels (P) can emit light of a specific color using a light-emitting diode, such as an organic light-emitting diode. Each organic light-emitting diode can emit light of, for example, red, green, blue, or white. Each organic light-emitting diode can be connected to a pixel circuit including a thin-film transistor and a capacitor.

[0055] The peripheral area (NDA) is an area that does not provide an image and may completely surround the display area (DA). Drivers or main power lines for providing electrical signals or power to pixel circuits may be placed in the peripheral area (NDA). The peripheral area (NDA) may include pads, which are areas where electronic components or printed circuit boards can be electrically connected.

[0056] The display area (DA) may have a polygonal shape including a rectangle, as shown in FIG. 2. For example, the display area (DA) may have a rectangular shape where the width is greater than the height, a rectangular shape where the width is smaller than the height, or a square shape. Alternatively, the display area (DA) may have various shapes such as an ellipse or a circle.

[0057] The display device (10) can be used in electronic devices such as mobile phones, televisions, billboards, tablet PCs, laptops, smartwatches or smart bands worn on the wrist.

[0058] FIG. 3 shows a light-emitting diode provided in one pixel of a display device according to one embodiment of the present invention and a pixel circuit connected thereto.

[0059] Referring to FIG. 3, as a light-emitting diode, an organic light-emitting diode (OLED) is connected to a pixel circuit (PC). The pixel circuit (PC) may include a first thin-film transistor (T1), a second thin-film transistor (T2), and a storage capacitor (Cst).

[0060] The second thin-film transistor (T2) is a switching thin-film transistor connected to a scan line (SL) and a data line (DL), and can transmit a data voltage input from the data line (DL) to the first thin-film transistor (T1) according to the switching voltage input from the scan line (SL). The storage capacitor (Cst) is connected to the second thin-film transistor (T2) and the driving voltage line (PL), and can store a voltage corresponding to the difference between the voltage received from the second thin-film transistor (T2) and the driving voltage (ELVDD) supplied to the driving voltage line (PL).

[0061] The first thin-film transistor (T1) is a driving thin-film transistor connected to a driving voltage line (PL) and a storage capacitor (Cst), and can control the driving current flowing from the driving voltage line (PL) to the organic light-emitting diode (OLED) in correspondence with the voltage value stored in the storage capacitor (Cst). The organic light-emitting diode (OLED) can emit light having a predetermined brightness by the driving current. The pixel electrode (e.g., anode) of the organic light-emitting diode (OLED) can be connected to a pixel circuit (PC). The counter electrode (e.g., cathode) of the organic light-emitting diode (OLED) can be supplied with a common voltage (ELVSS).

[0062] FIG. 3 illustrates a pixel circuit (PC) comprising two thin-film transistors and one storage capacitor, but in other embodiments, the number of thin-film transistors or the number of storage capacitors can be varied depending on the design of the pixel circuit (PC).

[0063] FIG. 4 is a cross-sectional view schematically showing a display device according to one embodiment of the present invention, and is a cross-sectional view along the line IV-IV' of FIG. 2.

[0064] Referring to FIG. 4, the display device (10) may include a substrate (100), a display layer (200), an encapsulation layer (300), an anti-reflection layer (400), an adhesive layer (OCA), and a cover window (500).

[0065] The substrate (100) may include glass or a polymer resin. For example, the polymer resin may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate (100) containing the polymer resin may have flexible, rollable, or bendable properties. The substrate (100) may form a multilayer structure including a layer containing the polymer resin and an inorganic layer (not shown).

[0066] The display layer (200) may include a thin-film transistor electrically connected to a light-emitting diode, such as an organic light-emitting diode, and insulating layers interposed between them.

[0067] A bag layer (300) may be disposed on the label layer (200). For example, the label layer (200) may be sealed with the bag layer (300). The bag layer (300) may include at least one inorganic bag layer and at least one organic bag layer.

[0068] An anti-reflection layer (400) may be disposed on the encapsulation layer (300). The anti-reflection layer (400) can reduce the reflectivity of external light incident from the outside toward the display device (10) through the cover window (500).

[0069] The anti-reflection layer (400) may include color filters and an overcoat layer. The color filters may be arranged considering the color of the light emitted from each of the light-emitting diodes of the display layer (200). The overcoat layer may be positioned to cover the color filters.

[0070] A cover window (500) may be placed on an anti-reflective layer (400), for example, an overcoat layer. The cover window (500) may protect layers placed beneath the cover window (500), such as a display layer (200). The cover window (500) may be attached to the anti-reflective layer (400) by an adhesive layer (OCA) interposed between the cover window (500) and the anti-reflective layer (400) after being formed separately. The adhesive layer (OCA) may be, for example, an optically transparent adhesive. Alternatively, the cover window (500) may be formed directly on the anti-reflective layer (400).

[0071] FIG. 5 is a cross-sectional view schematically showing a display device according to one embodiment of the present invention.

[0072] Referring to FIG. 5, the display device (10) may include a substrate (100), a display layer (200), an encapsulation layer (300), an anti-reflection layer (400), an adhesive layer (OCA), and a cover window (500).

[0073] A display device (10) may include a plurality of pixels arranged in a display area (DA, FIG. 3). Each of the plurality of pixels may emit red, green, or blue light. The plurality of pixels may include pixels that emit different colors, such as a first color pixel, a second color pixel, and a third color pixel. Each of the first color pixel, the second color pixel, and the third color pixel may be provided in a plurality. In one embodiment, the first color pixel may be a red pixel (Pr) capable of emitting red light, the second color pixel may be a green pixel (Pg) capable of emitting green light, and the third color pixel may be a blue pixel (Pb) capable of emitting blue light.

[0074] A display layer (200) may be disposed on a substrate (100). The display layer (200) may include a pixel circuit layer and a light-emitting diode layer. The pixel circuit layer may include a thin-film transistor (TFT) and may include insulating layers such as a buffer layer (201), a gate insulating layer (203), an interlayer insulating layer (205), and a planarization layer (207).

[0075] A buffer layer (201) is positioned on a substrate (100) to reduce or block the penetration of foreign matter, moisture, or outside air from the bottom of the substrate (100) and to provide a flat surface on the substrate (100). The buffer layer (201) may include an inorganic material such as an oxide or a nitride, an organic material, or an organic-inorganic composite, and may be composed of a single layer or a multilayer structure of inorganic and organic materials. A barrier layer (not shown) that blocks the penetration of outside air may be further included between the substrate (100) and the buffer layer (201). For example, the buffer layer (201) may include silicon oxide or silicon nitride.

[0076] A thin-film transistor (TFT) may be disposed on the buffer layer (201). The thin-film transistor (TFT) may include a semiconductor layer (ACT), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). The thin-film transistor (TFT) may be connected to an organic light-emitting diode to drive it.

[0077] A semiconductor layer (ACT) may be disposed on a buffer layer (201). The semiconductor layer (ACT) may comprise polysilicon or amorphous silicon. Alternatively, the semiconductor layer (ACT) may comprise an oxide of at least one material selected from the group comprising indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layer (ACT) may comprise a channel region, an impurity-doped source region, and a drain region.

[0078] The gate electrode (GE), source electrode (SE), and drain electrode (DE) may be formed from various conductive materials. In one embodiment, the gate electrode (GE) may include at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). For example, the gate electrode (GE) may be a single layer of molybdenum (Mo) or a three-layer structure including a molybdenum (Mo) layer, an aluminum (Al) layer, and a molybdenum (Mo) layer. In one embodiment, the source electrode (SE) and drain electrode (DE) may include at least one material selected from the group including copper (Cu), titanium (Ti), and aluminum (Al). For example, the source electrode (SE) and drain electrode (DE) may be a three-layer structure including a titanium (Ti) layer, an aluminum (Al) layer, and a titanium (Ti) layer.

[0079] Meanwhile, to ensure insulation between the semiconductor layer (ACT) and the gate electrode (GE), a gate insulating layer (203) may be disposed between the semiconductor layer (ACT) and the gate electrode (GE). An interlayer insulating layer (205) may be disposed on the upper side of the gate electrode (GE), and a source electrode (SE) and a drain electrode (DE) may be disposed on the interlayer insulating layer (205).

[0080] The gate insulating layer (203) and the interlayer insulating layer (205) may each include an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride. The gate insulating layer (203) and the interlayer insulating layer (205) may be formed, for example, through chemical vapor deposition (CVD) or atomic layer deposition (ALD).

[0081] A planarization layer (207) may be disposed on a thin film transistor (TFT). To provide a flat upper surface, chemical mechanical polishing may be performed on the upper surface of the planarization layer (207) after forming the planarization layer (207). The planarization layer (207) may include photosensitive polyimide, polyimide, polystyrene (PS), polycarbonate (PC), BCB (Benzocyclobutene), HMDSO (Hexamethyldisiloxane), polymethylmethacrylate (PMMA), general-purpose polymers such as polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, or vinyl alcohol polymers. In FIG. 5, the planarization layer (207) is shown as a single layer, but in some embodiments, the planarization layer (207) may be multilayer. Each pixel electrode (210R, 210G, 210B) of the first to third organic light-emitting diodes (OLED1, OLED2, OLED3) may be electrically connected to a thin-film transistor (TFT) through a contact hole of the planarization layer (207).

[0082] The light-emitting diode layer may be disposed on the pixel circuit layer. In one embodiment, the light-emitting diode layer may include first to third organic light-emitting diodes (OLED1, OLED2, OLED3), a bank layer (225), and a spacer (227).

[0083] The first to third organic light-emitting diodes (OLED1, OLED2, OLED3) can be disposed on the pixel circuit layer. A first organic light-emitting diode (OLED1) may include a stacked structure of a first pixel electrode (210R), a first common layer (221), a light-emitting layer (222R), an intermediate layer (220R) including a second common layer (223), and a counter electrode (230); a second organic light-emitting diode (OLED2) may include a second pixel electrode (210G), a first common layer (221), a light-emitting layer (222G), an intermediate layer (220G) including a second common layer (223), and a counter electrode (230); and a third organic light-emitting diode (OLED3) may include a third pixel electrode (210B), a first common layer (221), a light-emitting layer (222B), an intermediate layer (220B) including a second common layer (223), and a counter electrode (230).

[0084] Pixel electrodes (210R, 210G, 210B) can be placed on the planarization layer (207). Pixel electrodes (210R, 210G, 210B) can be placed spaced apart from each other.

[0085] The pixel electrodes (210R, 210G, 210B) may be reflective electrodes. The pixel electrodes (210R, 210G, 210B) may have a reflective film comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) and compounds thereof, and a transparent or translucent conductive layer formed on the reflective film. The transparent or translucent electrode layer may comprise at least one material selected from the group comprising indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO).

[0086] A bank layer (225) may be disposed on the pixel electrodes (210R, 210G, 210B). The bank layer (225) may have first to third lower openings (225OP1, 225OP2, 2225OP3) that overlap the pixel electrodes (210R, 210G, 210B) and expose the central portion of each of the pixel electrodes (210R, 210G, 210B). The bank layer (225) covers the edges of the pixel electrodes (210R, 210G, 210B) and increases the distance between the edges of the pixel electrodes (210R, 210G, 210B) and the opposing electrode (230), thereby preventing arcs from occurring at the edges of the pixel electrodes (210R, 210G, 210B).

[0087] The first to third lower openings (225OP1, 225OP2, 225OP3) of the bank layer (225) can define the first to third light-emitting regions (EA1, EA2, EA3) of the first to third organic light-emitting diodes (OLED1, OLED2, OLED3) included in each pixel. As shown in FIG. 5, the bank layer (225) may include a first lower opening (225OP1) that defines the first light-emitting region (EA1) of the first organic light-emitting diode (OLED1) of the first color pixel. Additionally, it may include a second lower opening (225OP2) defining a second light-emitting region (EA2) of a second organic light-emitting diode (OLED2) of a second color pixel, and a third lower opening (225OP3) defining a third light-emitting region (EA3) of a third organic light-emitting diode (OLED3) of a third color pixel.

[0088] The bank layer (225) may include an organic insulating material. Alternatively, the bank layer (225) may include an inorganic insulating material such as silicon nitride or silicon oxide. In some embodiments, the bank layer (225) may include an organic insulating material and an inorganic insulating material.

[0089] In one embodiment, the bank layer (225) may include a light-blocking material. For example, the light-blocking material of the bank layer (225) may be black. The light-blocking material may include carbon black, carbon nanotubes, a resin or paste containing a black dye, metal particles, such as nickel, aluminum, molybdenum, and their alloys, metal oxide particles or metal nitride particles, etc. When the bank layer (225) includes a light-blocking material, external light reflection by metal structures placed on the lower part of the bank layer (225) can be reduced.

[0090] A spacer (227) may be disposed on the bank layer (225). The spacer (227) may include an organic insulating material such as polyimide. Alternatively, the spacer (227) may include an inorganic insulating material such as silicon nitride or silicon oxide, or may include both an organic insulating material and an inorganic insulating material. In one embodiment, the spacer (227) may include a material different from the bank layer (225) containing the aforementioned light-blocking material and may be formed in separate processes.

[0091] In another embodiment, the spacer (227) may include the same material as the bank layer (225). In this case, the bank layer (225) and the spacer (227) may be formed together in a mask process using a halftone mask, etc.

[0092] An intermediate layer may be disposed on the pixel electrodes (210R, 210G, 210B) and the bank layer (225). As described above, the intermediate layer may include a first common layer (221), a light-emitting layer (222), and a second common layer (223).

[0093] The light-emitting layers (222R, 222G, 222B) may be disposed within the first to third lower openings (225OP1, 225OP2, 225OP3) of the bank layer (225). The light-emitting layers (222R, 222G, 222B) may be organic materials comprising fluorescent or phosphorescent materials capable of emitting red, green, or blue light. The aforementioned organic materials may be low-molecular-weight organic materials or high-molecular-weight organic materials.

[0094] A first common layer (221) and a second common layer (223) may be disposed below and above the light-emitting layer, respectively. The first common layer (221) may, for example, include a hole transport layer (HTL) or include a hole transport layer and a hole injection layer (HIL). The second common layer (223) may, for example, include an electron transport layer (ETL) or include an electron transport layer and an electron injection layer (EIL). In one embodiment, the second common layer (223) may not be provided.

[0095] While the light-emitting layer is arranged for each pixel to correspond to the first to third lower openings (225OP1, 225OP2, 225OP3) of the bank layer (225), the first common layer (221) and the second common layer (223) can each be formed integrally to cover the entire substrate (100). In other words, the first common layer (221) and the second common layer (223) can each be formed integrally to cover the entire display area (DA) of the substrate (100).

[0096] The counter electrode (230) may be a cathode, which is an electron injection electrode. This counter electrode (230) may include a conductive material with a low work function. For example, the counter electrode (230) may include a (semi)transparent layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the counter electrode (230) may further include a layer such as ITO, IZO, ZnO, or In2O3 on the (semi)transparent layer including the aforementioned materials.

[0097] In one embodiment, a capping layer may be further disposed on the display layer (200). The capping layer may be disposed on the first to third organic light-emitting diodes (OLED1, OLED2, OLED3). In one embodiment, the capping layer may serve to improve the luminous efficiency of the first to third organic light-emitting diodes (OLED1, OLED2, OLED3) by the principle of constructive interference.

[0098] The capping layer may be an organic capping layer containing organic materials, an inorganic capping layer containing inorganic materials, or a composite capping layer containing organic and inorganic materials. For example, the capping layer may include a carbocyclic compound, a heterocyclic compound, an amine group-containing compound, porphine derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, an alkali metal complex, an alkaline earth metal complex, or any combination thereof. Carbocyclic compounds, heterocyclic compounds, and amine group-containing compounds may optionally be substituted with substituents including O, N, S, Se, Si, F, Cl, Br, I, or any combination thereof. The following description will focus on the case where the capping layer is omitted.

[0099] A sealing layer (300) may be disposed on the opposing electrode (230). The sealing layer (300) may include at least one inorganic sealing layer and at least one organic sealing layer. For example, as shown in FIG. 5, the sealing layer (300) may include a first inorganic sealing layer (310), an organic sealing layer (320), and a second inorganic sealing layer (330) stacked sequentially.

[0100] The first inorganic sealing layer (310) and the second inorganic sealing layer (330) may include inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, or zinc oxide. The first inorganic sealing layer (310) and the second inorganic sealing layer (330) may be a single layer or a multilayer structure including the aforementioned inorganic insulating materials.

[0101] The organic encapsulation layer (320) can relieve internal stress of the first inorganic encapsulation layer (310) and / or the second inorganic encapsulation layer (330). The organic encapsulation layer (320) may include a monomer or a polymer. For example, the organic encapsulation layer (320) may include ethylene, propylene, styrene, or polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.) or any combination thereof.

[0102] In one embodiment, the first inorganic encapsulation layer (310) may be disposed on the counter electrode (230). The first inorganic encapsulation layer (310) may be disposed to cover the entire surface of the substrate (100). An organic encapsulation layer (320) may be disposed on the first inorganic encapsulation layer (310).

[0103] The second inorganic encapsulation layer (330) may be disposed on the organic encapsulation layer (320). At this time, the second inorganic encapsulation layer (330) may be patterned. In one embodiment, the second inorganic encapsulation layer (330) may be disposed to overlap with light-emitting regions (EA) in a plan view. For example, the second inorganic encapsulation layer (330) may include a first encapsulation member (331) disposed on the organic encapsulation layer (320) to overlap with the first light-emitting region (EA1), a second encapsulation member (332) disposed on the organic encapsulation layer (320) to overlap with the second light-emitting region (EA2), and a third encapsulation member (333) disposed on the organic encapsulation layer (320) to overlap with the third light-emitting region (EA3). The second inorganic encapsulation layer (330) may be arranged in a disconnected manner, and accordingly, the first encapsulation member (331), the second encapsulation member (332), and the third encapsulation member (333) may be arranged spaced apart from each other. Additionally, the first encapsulation member (331), the second encapsulation member (332), and the third encapsulation member (333) may overlap with the first pixel electrode (210R), the second pixel electrode (210G), and the third pixel electrode (210B), respectively, in a planar view.

[0104] In one embodiment, the second inorganic encapsulation layer (330) may expose a portion of the organic encapsulation layer (320). The second inorganic encapsulation layer (330) is disposed on the upper surface of the organic encapsulation layer (320) corresponding to the light-emitting regions (EA), and the remaining portion of the organic encapsulation layer (320) may be exposed. The exposed portion of the organic encapsulation layer (320) may be coated to have hydrophobicity, as described below. For example, the exposed portion of the organic encapsulation layer (320) may be surface-treated with tetrafluorinated carbon (CF4). Accordingly, the exposed portion of the organic encapsulation layer (320) may have hydrophobicity.

[0105] An anti-reflection layer (400) may be disposed on the encapsulation layer (300). In one embodiment, the anti-reflection layer (400) may include a scattering layer (SC), a plurality of color filters (CF), and an overcoat layer (OC).

[0106] A scattering layer (SC) may be placed on the second inorganic encapsulation layer (330). The scattering layer (SC) can increase the color reproduction rate and reduce color distortion by scattering light of a specific wavelength band from the light emitted in the light-emitting region (EA). At this time, the scattering layer (SC) may be patterned. In one embodiment, the scattering layer (SC) may be placed to overlap the first light-emitting region (EA1) and the second light-emitting region (EA2) in a plan view. The scattering layer (SC) may not be placed on the third light-emitting region (EA3) in a plan view. That is, the scattering layer (SC) may not be placed in the third light-emitting region (EA3), for example, the region emitting blue light. For example, the scattering layer (SC) may include a first scattering part (SC1) disposed on a first encapsulating member (331) so as to overlap with a first light-emitting region (EA1), and a second scattering part (SC2) disposed on a second encapsulating member (332) so as to overlap with a second light-emitting region (EA2). In this case, the first scattering part (SC1) may overlap with the first encapsulating member (331), and the second scattering part (SC2) may overlap with the second encapsulating member (332). The scattering layer (SC) may be disposed in a discontinuous manner, and accordingly, the first scattering part (SC1) and the second scattering part (SC2) may be disposed spaced apart from each other. Additionally, the first scattering part (SC1) and the second scattering part (SC2) may overlap with the first pixel electrode (210R) and the second pixel electrode (210G), respectively, in a planar view.

[0107] In one embodiment, the scattering layer (SC) may expose a portion of the organic encapsulation layer (320) together with the second inorganic encapsulation layer (330). The second inorganic encapsulation layer (330) is disposed on the upper surface of the organic encapsulation layer (320) in the light-emitting regions (EA), and the remaining portion of the organic encapsulation layer (320) may be exposed.

[0108] A plurality of color filters (CF) may be disposed on the scattering layer (SC). The plurality of color filters (CF) may include first to third color filters (CF1, CF2, CF3) of different colors corresponding to each of the first to third organic light-emitting diodes (OLED1, OLED2, OLED3). The plurality of color filters (CF) may be disposed to overlap with light-emitting regions (EA) in a planar view. The first to third color filters (CF1, CF2, CF3) may have colors corresponding to the light emitted from the first to third light-emitting regions (EA1, EA2, EA3). For example, when red light is emitted from the first light-emitting region (EA1), the first color filter (CF1) may be a red color filter, when green light is emitted from the second light-emitting region (EA2), the second color filter (CF2) may be a green color filter, and when blue light is emitted from the third light-emitting region (EA3), the third color filter (CF3) may be a blue color filter.

[0109] In one embodiment, each color filter (CF) may cover a scattering layer (SC) and / or a second inorganic encapsulation layer (330). The first color filter (CF1) may cover the first scattering portion (SC1) and the first encapsulation member (331) below the first scattering portion (SC1). The first color filter (CF1) may cover the first scattering portion (SC1) and the first encapsulation member (331) such that, in a plan view, the first scattering portion (SC1) and the first encapsulation member (331) are located within the perimeter of the first color filter (CF1). In one embodiment, the first color filter (CF1) may have a convex hemispherical shape.

[0110] The second color filter (CF2) can cover the second scattering section (SC2) and the second sealing member (332) located below the second scattering section (SC2). The second color filter (CF2) can cover the second scattering section (SC2) and the second sealing member (332) such that, in a plan view, the second scattering section (SC2) and the second sealing member (332) are located within the perimeter of the second color filter (CF2). In one embodiment, the second color filter (CF2) may have a convex hemispherical shape.

[0111] The third color filter (CF3) can cover the third encapsulating member (333). The third color filter (CF3) can cover the third encapsulating member (333) such that the third encapsulating member (333) is positioned within the perimeter of the third color filter (CF3) in a planar view. In one embodiment, the third color filter (CF3) may have a convex hemispherical shape.

[0112] In one embodiment, the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may be spaced apart from each other. The first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may be formed by jetting ink. As described above, since the surface of the organic encapsulation layer (320) to which the color filter (CF) contacts is coated hydrophobically, the color filter (CF) may have a convex hemispherical shape and aggregate. Accordingly, the color filter (CF) can be formed by ink jetting alone without requiring a separate layer to accommodate the color filter ink. That is, a process for forming a separate layer to accommodate the color filter (CF), such as a process of depositing a separate layer, photolithography, and then etching, can be omitted, and process efficiency and cost can be improved. In addition, the LvA of the color filter (CF) can be improved by having a convex hemispherical shape, that is, a dome shape. Here, LvA may refer to the ratio of the side light emission efficiency to the front light emission efficiency.

[0113] An overcoat layer (OC) may be disposed on the color filters (CF). The overcoat layer (OC) may be disposed to cover the color filters (CF). The overcoat layer (OC) covers a plurality of color filters (CF) and fills the spaces between the plurality of color filters (CF) to come into contact with the organic encapsulation layer (320). Additionally, the upper surface of the overcoat layer (OC) may be flat, thereby flattening the upper surface of the anti-reflection layer (400). In one embodiment, the overcoat layer (OC) may be a colorless transparent layer that does not have a color in the visible light band. The overcoat layer (OC) may include a colorless transparent organic material such as an acrylic resin.

[0114] Meanwhile, in one embodiment, the refractive index of the color filter (CF) may be smaller than the refractive index of the overcoat layer (OC). For example, the refractive index of the color filter (CF) may be about 1.5, and the refractive index of the overcoat layer (OC) may be about 1.65. The color filter (CF) and the overcoat layer (OC) having such refractive indices can achieve the effect of a micro lens array.

[0115] A cover window (500) can be placed on the overcoat layer (OC) with an adhesive layer (OCA) in between.

[0116] FIGS. 6 and 7 are schematic cross-sectional views of a display device according to an embodiment of the present invention. Since the display device according to the present embodiment is similar to the display device described above, the following description will focus only on the differences.

[0117] Referring to FIG. 6, the anti-reflection layer (400) may further include a light-blocking portion (BM). The light-blocking portion (BM) can reduce external light reflection and prevent light leakage. In one embodiment, the light-blocking portion (BM) may be placed between a plurality of color filters (CF). In this case, the light-blocking portion (BM) may be spaced apart from each of the plurality of color filters (CF) by a predetermined distance. For example, the light-blocking portion (BM) may be placed between the first color filter (CF1) and the second color filter (CF2) and spaced apart from the first color filter (CF1) and the second color filter (CF2) by a predetermined distance, and may be placed between the second color filter (CF2) and the third color filter (CF3) and spaced apart from the second color filter (CF2) and the third color filter (CF3) by a predetermined distance. Also, in one embodiment, the light-blocking portion (BM) may be placed along the perimeter of each of the plurality of color filters (CF) in a plan view. In this case, it will be understood that the light-blocking portion (BM) may be spaced apart from the perimeter of the color filter (CF).

[0118] In one embodiment, the light-blocking portion (BM) may include a first portion (B1), a second portion (B2), and a third portion (B3). In one embodiment, the first portion (B1) may include the same material as the first color filter (CF1). The second portion (B2) may include the same material as the second color filter (CF2). The third portion (B3) may include the same material as the third color filter (CF3).

[0119] In one embodiment, the light-blocking portion (BM) may have a structure in which a first portion (B1), a second portion (B2), and a third portion (B3) are stacked. For example, a first portion (B1) may be placed on an organic encapsulation layer (320), a third portion (B3) may be placed to surround the first portion (B1), and a second portion (B2) may be placed to surround the third portion (B3). As another example, a third portion (B3) may be placed on an organic encapsulation layer (320), a first portion (B1) may be placed to surround the third portion (B3), and a second portion (B2) may be placed to surround the first portion (B1). In other words, the top layer may be a second portion (B2) containing the same material as the green color filter, and the stacking order of the first portion (B1) and the third portion (B3) may be reversed.

[0120] These first part (B1), second part (B2), and third part (B3) can be formed together during the ink jetting process of the color filter (CF). Accordingly, no separate additional process is required to form the light-blocking part (BM), thereby improving process efficiency and cost.

[0121] Meanwhile, referring to FIG. 7, in one embodiment, the light-blocking portion (BM) may include a black material. For example, the light-blocking portion (BM) may include at least one of carbon black, carbon nanotubes, and a resin including a black dye. Such a light-blocking portion (BM) may be formed by jetting the black material by an ink jetting process.

[0122] FIGS. 8 to 11 are schematic drawings illustrating a method for manufacturing a display device according to an embodiment of the present invention. The method for manufacturing a display device according to the present embodiment may be used to manufacture the aforementioned display device, but is not necessarily limited thereto.

[0123] Referring to FIG. 8, a display board (DS) may be placed. The display board (DS) may refer to a part of a display device (10) that is in the process of manufacturing. For example, the display board (DS) may refer to a state in which a display layer (200), an encapsulation layer (300), etc. are laminated on a substrate (100).

[0124] A second inorganic encapsulation layer (330) can be disposed on an organic encapsulation layer (320) in a display substrate (DS). Additionally, a scattering layer (SC) can be disposed on the second inorganic encapsulation layer (330). In one embodiment, the second inorganic encapsulation layer (330) and the scattering layer (SC) can be formed by deposition on the organic encapsulation layer (320) over the entire surface of the display substrate (DS).

[0125] Referring to FIG. 9, the second inorganic encapsulation layer (330) and the scattering layer (SC) can be patterned. In one embodiment, the second inorganic encapsulation layer (330) and the scattering layer (SC) can be patterned through photolithography and etching processes. In this case, a halftone mask may be used in the photolithography process. Accordingly, the second inorganic encapsulation layer (330) and the scattering layer (SC) can be patterned on the organic encapsulation layer (320) in a portion that overlaps with the light-emitting region (EA). For example, the first encapsulation member (331) and the first scattering portion (SC1) can be formed to overlap with the first light-emitting region (EA1), and the second encapsulation member (332) and the second scattering portion (SC2) can be formed to overlap with the second light-emitting region (EA2). Additionally, a third encapsulating member (333) may be formed to overlap with the third light-emitting region (EA3). It will be understood that because a halftone mask is used, the scattering layer (SC) can be prevented from being formed only in the third light-emitting region (EA3).

[0126] In one embodiment, the upper surface of the display substrate (DS) may be coated to be hydrophobic. In one embodiment, after the second inorganic encapsulation layer (330) and the scattering layer (SC) are patterned, the upper surface of the display substrate (DS), for example, the upper surface of the scattering layer (SC) and the upper surface of the exposed portion of the organic encapsulation layer (320), may be surface-treated with tetrafluorinated carbon (CF4). Tetrafluorinated carbon (CF4) may react with the organic encapsulation layer (320) to make the exposed upper surface of the organic encapsulation layer (320) hydrophobic.

[0127] Referring to FIG. 10, a color filter (CF) can be formed by jetting ink to cover the second inorganic encapsulation layer (330) and the scattering layer (SC). At this time, since the exposed upper surface of the organic encapsulation layer (320) is hydrophobic, the jetted ink can aggregate to form a convex hemispherical dome shape.

[0128] In addition, in one embodiment, ink can be jetted to form a light-blocking portion (BM) as shown in FIG. 6. In one embodiment, inks containing the same material as the color filters (CF) can be sequentially jetted to form the light-blocking portion (BM). At this time, as described above, the light-blocking portion (BM) can be arranged along the perimeter of each of the color filters (CF) and can be spaced apart from the perimeter of the color filters (CF). In other words, the light-blocking portion (BM) can be arranged between the plurality of color filters (CF) at a predetermined distance from the plurality of color filters (CF).

[0129] Referring to FIG. 11, an overcoat layer (OC) may be placed to cover a color filter (CF) and / or a light-blocking portion (BM). Additionally, a cover window (500) may be placed on the overcoat layer (OC) with an adhesive layer (OCA) in between.

[0130] According to a method for manufacturing a display device according to one embodiment of the present invention, a separate layer for accommodating a color filter (CF) is not required, and the color filter (CF) can be formed to correspond to a light-emitting region (EA) by ink jetting alone. That is, a process for forming a separate layer for accommodating a color filter (CF), for example, a process of depositing a separate layer, photolithography, and then etching, can be omitted, and process efficiency and cost can be improved.

[0131] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative. Those skilled in the art will fully understand that various modifications and equivalent alternative embodiments are possible from the embodiments. Accordingly, the true technical scope of protection of the present invention should be determined based on the appended claims. Explanation of the symbols

[0132] 1: Electronic device 10: Display device 100: Substrate 200: Indicator layer 300: Bag layer 310: First inorganic sealing layer 320: Organic bag layer 330: Second Inorganic Sealing Layer 400: Anti-reflective layer SC: Spawning layer CF: Color filter OC: Overcoat layer 500: Cover Window

Claims

Claim 1 A display device comprising: a substrate; a first light-emitting element and a second light-emitting element on the substrate; a bank layer having openings corresponding to each of the first light-emitting element and the second light-emitting element to define a first light-emitting region and a second light-emitting region; an organic encapsulation layer disposed on the bank layer; a first color filter disposed on the organic encapsulation layer and disposed to overlap the first light-emitting region and a second color filter disposed to overlap the second light-emitting region; and an overcoat layer covering the first color filter and the second color filter and filling the space between the first color filter and the second color filter. Claim 2 A display device according to claim 1, wherein the surface of the organic encapsulation layer is coated with a hydrophobic coating. Claim 3 A display device according to claim 1, wherein the first color filter and the second color filter have a convex hemispherical dome shape. Claim 4 A display device according to claim 1, further comprising a first sealing member disposed between the organic sealing layer and the first color filter and a second sealing member disposed between the organic sealing layer and the second color filter, wherein the first sealing member and the second sealing member are spaced apart from each other. Claim 5 A display device according to claim 4, further comprising a first scattering part disposed on the first bag member and a second scattering part disposed on the second bag member. Claim 6 In claim 5, the first color filter is a display device that covers the first sealing member and the first scattering member such that the first sealing member and the first scattering member are located within the perimeter of the first color filter in a planar view. Claim 7 A display device according to claim 1, further comprising a light-blocking member disposed between the first color filter and the second color filter, wherein the light-blocking member is spaced apart from the first color filter and the second color filter. Claim 8 In claim 7, the light-blocking part comprises a first part having the same material as the first color filter and a second part having the same material as the second color filter, in a display device. Claim 9 In paragraph 8, the display device wherein the second part is arranged to surround the first part. Claim 10 In claim 7, the light-blocking part comprises a black material, a display device. Claim 11 A method for manufacturing a display device, comprising: a step of placing a light-emitting element on a substrate; a step of placing a bank layer having an opening corresponding to the light-emitting element to define a light-emitting region on the light-emitting element; a step of placing an organic encapsulation layer on the bank layer; a step of patterning an inorganic encapsulation layer and a scattering layer on the organic encapsulation layer in a portion overlapping with the light-emitting region; and a step of forming a color filter by jetting ink to cover the inorganic encapsulation layer and the scattering layer. Claim 12 A method for manufacturing a display device, further comprising the step of hydrophobically coating the surface of the organic encapsulation layer in claim 11. Claim 13 A method for manufacturing a display device according to claim 11, wherein the step of forming the color filter comprises the step of jetting ink so that the color filter has a convex hemispherical shape. Claim 14 A method for manufacturing a display device according to claim 11, wherein the step of forming the color filter comprises covering the inorganic encapsulation layer and the scattering layer such that the inorganic encapsulation layer and the scattering layer are positioned within the perimeter of the color filter in a planar view. Claim 15 A method for manufacturing a display device, further comprising the step of arranging a light-blocking portion along the perimeter of the color filter on a plan view in claim 11. Claim 16 A method for manufacturing a display device, wherein, in paragraph 15, the light-blocking part is spaced apart from the circumference of the color filter. Claim 17 A method for manufacturing a display device, wherein, in paragraph 15, the light-blocking part comprises the same material as the color filter. Claim 18 A method for manufacturing a display device according to claim 17, wherein the step of arranging the light-blocking part includes the step of jetting ink. Claim 19 In claim 15, the method of manufacturing a display device wherein the light-blocking part comprises a black material. Claim 20 An electronic device comprising: a processor; and a display device controlled by said processor; wherein the display device comprises: a substrate; a first light-emitting element and a second light-emitting element on the substrate; a bank layer having openings corresponding to each of said first light-emitting element and said second light-emitting element to define a first light-emitting region and a second light-emitting region; an organic encapsulation layer disposed on said bank layer; a first color filter disposed on said organic encapsulation layer and disposed to overlap with said first light-emitting region and a second color filter disposed to overlap with said second light-emitting region; and an overcoat layer covering said first color filter and said second color filter and filling the space between said first color filter and said second color filter.

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