Three-dimensional packaging device for semiconductor chips

Abstract

The present invention relates to a three-dimensional packaging device comprising a plurality of three-dimensional packages having a cylindrical or spiral structure, wherein a plurality of semiconductor chips are mounted on each of the plurality of three-dimensional packages, and the plurality of three-dimensional packages can be stacked with respect to a central axis.

Description

Technology Field

[0001] The present invention relates to a three-dimensional packaging device for a semiconductor chip, and specifically to a three-dimensional packaging device capable of packaging a semiconductor chip in a cylindrical or spiral shape. Background Technology

[0002] With the advancement of semiconductor technology, package design has established itself as a factor just as important as chip design in system design. Conventional semiconductor design has primarily focused on improving the performance and functionality of the chip itself. However, recently, the design of the package housing the chip is receiving increasing attention for ensuring the efficient operation of the chip, going beyond mere protection and connectivity to include signal transmission, power distribution, and thermal management. In particular, package design is evaluated as a more economical and efficient approach compared to chip design in terms of performance development costs.

[0003] Conventional package design methods have been configured in a rectangular shape to match the physical geometry of the chip. While rectangular packages offer the advantage of ease of manufacturing due to their structural simplicity, they have limitations in meeting the requirements of modern electronic devices, which are becoming increasingly complex, miniaturized, and capable of integrating various functions. For example, robot joints require flexible and irregular structures to support multi-axis rotation and complex movements. In such environments, rectangular packages may exhibit limitations in mechanical adaptability and space utilization due to physical constraints. Similarly, wearable health monitoring devices, medical implants, and automotive electronic systems must provide stable power management and data transmission capabilities while possessing flexibility and lightweight properties. However, existing rectangular packages struggle to meet these requirements.

[0004] In conclusion, while rectangular packages are useful in relatively standardized environments, their performance limitations become evident in advanced technology applications. Therefore, a new design approach is needed to overcome these physical constraints and meet the complex requirements of modern technology. The problem to be solved

[0005] The present invention aims to provide a three-dimensional packaging device applicable not only to systems with a planar structure but also to systems with various three-dimensional structures.

[0006] In addition, the present invention aims to provide a stable and highly reliable system by completely separating the power / ground supply and signal connection.

[0007] However, the technical problem that this embodiment aims to solve is not limited to the technical problem described above, and other technical problems may exist. means of solving the problem

[0008] A three-dimensional packaging device according to one embodiment of the present invention is composed of a plurality of three-dimensional packages having a cylindrical or spiral structure, a plurality of semiconductor chips are mounted on each of the plurality of three-dimensional packages, and the plurality of three-dimensional packages can be stacked with respect to a central axis.

[0009] According to one embodiment, a hollow formed with respect to the central axis of a plurality of three-dimensional packages may be further included.

[0010] According to one embodiment, each of the plurality of three-dimensional packages can be electrically connected through the hollow.

[0011] According to one embodiment, each of the plurality of three-dimensional packages can be designed to be modular and configured to be detachable from one another.

[0012] According to one embodiment, the cross-sections of a plurality of packages may have a shape among a cylindrical, a spiral, and a polygon, and each of the packages may be configured with the same shape.

[0013] According to one embodiment, each of the plurality of semiconductor chips can be arranged vertically in a plurality of three-dimensional packages.

[0014] According to one embodiment, each of the plurality of semiconductor chips can be arranged horizontally on the surface of the plurality of packages.

[0015] According to one embodiment, the outer surface of the hollow may include a signal routing path for one or more of a data line, a power supply line, and a ground line.

[0016] According to one embodiment, each of the plurality of three-dimensional packages may further include a first layer, a second layer, and a third layer.

[0017] According to one embodiment, a first layer may be formed on the outer surface of a plurality of three-dimensional packages, and a second layer and a third layer may be formed at the center of each of the plurality of three-dimensional packages.

[0018] According to one embodiment, the first layer, the second layer, and the third layer are used as any one of a power / ground line, a high-frequency signal line, or a control signal line, and a buffer, a control, or a non-contact connection chip may be placed thereon. Effects of the invention

[0019] The present invention can provide a three-dimensional packaging device applicable not only to systems with a planar structure but also to systems with various three-dimensional structures.

[0020] In addition, the present invention can provide a stable and highly reliable three-dimensional packaging device by completely separating the power / ground supply and signal connection. Brief explanation of the drawing

[0021] FIG. 1 is a drawing showing a cylindrical three-dimensional packaging device according to one embodiment of the present invention. Figure 2 is a cross-sectional view AA' of the cylindrical three-dimensional packaging device of Figure 1. Figure 3 is a drawing showing an example in which a chip is mounted vertically in a cylindrical three-dimensional packaging device of Figure 1. Figure 4 is a drawing showing an example in which a chip is mounted horizontally in a cylindrical three-dimensional packaging device of Figure 1. FIG. 5 is a drawing showing a spiral three-dimensional packaging device according to another embodiment of the present invention. Figure 6 is a cross-sectional view AA' of the spiral three-dimensional packaging device of Figure 5. Figure 7 is a drawing showing an example in which a chip is mounted vertically in the spiral three-dimensional packaging device of Figure 5. Figure 8 is a drawing showing an example in which a chip is mounted horizontally in the spiral three-dimensional packaging device of Figure 5. FIG. 9 is a diagram showing the arrangement and connection method of chips inside a cylindrical three-dimensional packaging device according to another embodiment of the present invention. Specific details for implementing the invention

[0022] Embodiments of the present invention are described in detail below with reference to the attached drawings so that those skilled in the art can easily implement the invention. Since the present invention is susceptible to various modifications and may have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0023] To clearly explain the present invention, parts unrelated to the description have been omitted from the drawings, and similar parts throughout the specification have been given similar reference numerals. Furthermore, while describing with reference to the drawings, even components indicated by the same name may have different drawing numbers depending on the drawing, and drawing numbers are provided merely for the convenience of explanation; the concept, feature, function, or effect of each component is not to be interpreted restrictively by the corresponding drawing number.

[0024] Similar reference numerals are used for similar components when describing each drawing. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any of a plurality of related described items.

[0025] In this specification, the meaning that another component is placed, stacked, or formed "on" a component should be understood to encompass not only a state in which the component and the other component are in direct contact, but also a state in which the component is placed, stacked, or formed with another component interposed therein.

[0026] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which this invention pertains.

[0027] Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0028] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected" but also cases where they are "electrically connected" with other elements interposed between them. Furthermore, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components; it should be understood that this does not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0029] In this specification, the term "part" or "unit" includes a unit realized by hardware or software, or a unit realized using both; a single unit may be realized using two or more pieces of hardware, or two or more units may be realized by a single piece of hardware.

[0030] Hereinafter, a three-dimensional packaging device according to embodiments of the present invention will be described with reference to the attached drawings.

[0031] FIG. 1 is a drawing showing a cylindrical three-dimensional packaging device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view AA' of the cylindrical three-dimensional packaging device of FIG. 1, FIG. 3 is a drawing showing an example in which a chip is mounted in a vertical direction on the cylindrical three-dimensional packaging device of FIG. 1, and FIG. 4 is a drawing showing an example in which a chip is mounted in a horizontal direction on the cylindrical three-dimensional packaging device of FIG. 1.

[0032] Referring to FIGS. 1 to 4, a cylindrical three-dimensional packaging device (1) according to one embodiment of the present invention may include a first cylindrical three-dimensional package (10), a second cylindrical three-dimensional package (20), and a third cylindrical three-dimensional package (30). Here, the cylindrical three-dimensional packages (10, 20, 30) may form a stacked structure in which the first cylindrical three-dimensional package (10), the second cylindrical three-dimensional package (20), and the third cylindrical three-dimensional package (30) are aligned with respect to a central axis (z). This design can implement high-density integration technology to provide efficient and reliable operation in various electronic systems.

[0033] In the example of FIG. 1, three cylindrical three-dimensional packages (10, 20, 30) are shown stacked, but this is merely one embodiment, and individual cylindrical three-dimensional packages can be composed of two or more and can have a structure that is combined through a modular stack structure.

[0034] In some embodiments, the first cylindrical three-dimensional package (10), the second cylindrical three-dimensional package (20), and the third cylindrical three-dimensional package (30) may have the same circular cross-section. This structure can provide a system that is integrated as a whole while each layer independently performs a specific function. The cylindrical three-dimensional packages (10, 20, 30) can realize a multi-functional electronic system by mounting semiconductor chips of various purposes on each layer.

[0035] In the present invention, the semiconductor chip may be used as a concept including an integrated circuit (IC), a semiconductor device, a microchip, a processor, a memory chip, a small semiconductor device, a power management IC (PMIC), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), a digital signal processor (DSP), a chipset, a System on Chip (SoC), a sensor chip, an AI accelerator chip, and a Neural Processing Unit (NPU).

[0036] In some embodiments, the cylindrical three-dimensional packaging device (1) may operate as an integrated system while each layer is designed independently to perform a unique function. Each package transmits signals and power through separate routing paths and can provide stable inter-layer connections.

[0037] For example, the first cylindrical package (10) may be equipped with a module optimized for power management, the second cylindrical package (20) may be composed of a signal processing module, and the third cylindrical package (30) may include a large-capacity memory for data storage. However, this is merely one example, and the functions and roles of each package may be changed according to design requirements. That is, a signal processing module may be placed in the first cylindrical package (10), a data storage module may be placed in the second cylindrical package (20), and the third cylindrical package (30) may be utilized for power management.

[0038] In addition, multiple functions may be integrated within a specific package, and in some designs, the same module may be distributed across multiple layers to enhance specific functions. For example, in applications where high-speed data processing and signal conversion are important, the same signal processing chip may be placed on each layer to maximize parallel processing performance, and in applications requiring large-capacity data storage, memory modules may be evenly distributed across multiple layers to expand storage capacity. As such, the cylindrical three-dimensional packaging device (1) can be designed so that various combinations are possible according to design purposes and system requirements, rather than having specific components fixed in specific positions.

[0039] Additionally, the functionality of specific layers can be upgraded or new modules can be added as needed. For example, the upper layer, the first cylindrical package (10), can be replaced to improve data processing performance, or a new data storage device can be added to the lower layer, the third cylindrical package (30), to increase storage capacity. This modular design facilitates the upgrade of the electronic system and can increase cost efficiency.

[0040] In some embodiments, the cylindrical three-dimensional packaging device (1) may further include a hollow (40) forming an interlayer routing path. The hollow (40) may be used as a transmission path for power and data signals and may be designed to simultaneously perform a thermal management function.

[0041] The interior of the hollow (40) can be implemented in various ways depending on the design purpose and application environment. In one embodiment, the hollow (40) can be kept empty, thereby allowing airflow or cooling fluid to circulate, which can be utilized as an effective heat dissipation path. In this case, overheating can be prevented even in a package containing a high-power semiconductor chip, and the stability of the system can be maintained.

[0042] In other embodiments, the hollow (40) may be filled with a dielectric material. For example, it may include a low dielectric constant for electromagnetic interference (EMI) shielding, which can serve to maintain signal integrity and reduce signal interference. Additionally, if a high dielectric constant is included, it may optimize specific signal transmission characteristics or improve performance in specific frequency bands.

[0043] Additionally, the hollow (40) may be filled with the same material as each layer. For example, if the layers of the cylindrical three-dimensional packaging device (1) are composed of polyimide, FR-4, or a ceramic-based dielectric, the hollow (40) may also be filled with the same material. This can contribute to maintaining the mechanical strength of the package and stabilizing the interlayer structure. Furthermore, if the hollow (40) is filled with the same material, the coefficient of thermal expansion (CTE) is maintained uniformly with the layers, thereby preventing deformation due to thermal stress.

[0044] As such, the hollow space (40) is not a simple open space, but can be configured in various ways according to the design purpose and can be optimized to perform functions such as power and signal routing, thermal management, structural stability, and electromagnetic interference shielding. Electrical connections support power supply and data transmission, thereby enabling each layer to operate independently while performing the functions of an integrated system.

[0045] One of the technical advantages of the cylindrical three-dimensional packaging device (1) is that it can minimize electromagnetic interference (EMI) and crosstalk. The circular cross-sectional design of each layer (10, 20, 30) can reduce electrical interference and provide an optimal environment for high-frequency signal transmission. Compared to conventional rectangular packages, the cylindrical three-dimensional packaging device (1) can integrate more electronic components in the same volume, thus having an advantage in terms of space efficiency. These features can be utilized in high-performance applications such as aircraft, space equipment, robot joints, and miniaturized electronic systems.

[0046] Cylindrical packages can be fabricated using various materials to ensure the performance and stability of electronic systems. The materials used for cylindrical packages have characteristics similar to those used in the fabrication of Printed Circuit Boards (PCBs), and suitable materials can be selected depending on design requirements and application environments. Major materials used for cylindrical packages include FR-4, polyimide, ceramic-based dielectrics, PTFE, hybrid materials, and glass fiber-based materials.

[0047] Specifically, FR-4 (Fiber Reinforced Laminate) is a representative dielectric material widely used in cylindrical packages, featuring an epoxy-based structure reinforced with glass fibers. FR-4 offers high mechanical strength and excellent electrical insulation performance, along with low manufacturing costs and suitability for mass production. These characteristics make cylindrical packages suitable for mass production applications, such as low-speed signal processing systems in data centers or consumer electronics. Additionally, FR-4 exhibits excellent thermal resistance, enabling it to effectively dissipate heat generated within the laminated structure.

[0048] Polyimide is a high-temperature, heat-resistant dielectric material suitable for high-performance designs of cylindrical packages, providing high electrical insulation properties and flexibility. Polyimide is an essential material used in environments requiring complex curved structures and thermal stability, such as wearable devices, robot joints, and aerospace equipment. This material is suitable for high-frequency signal processing and ensures stable operation even in extreme environments. Polyimide is also suitable for curved designs, enabling cylindrical packages to be utilized in the design of various types of electronic systems.

[0049] Ceramic-filled dielectrics are high-performance materials that provide excellent thermal stability and low dielectric constant in cylindrical packages, and are utilized in environments requiring RF and high-frequency signal processing. Alumina (Al₂O₃) and aluminum nitride (AlN) are representative examples of ceramic dielectrics, offering excellent thermal conductivity and electrical insulation. Alumina operates stably even at high temperatures and maintains signal quality by preventing electromagnetic interference (EMI). Aluminum nitride exhibits particularly excellent thermal conductivity, meeting the thermal management requirements of high-power electronic systems. These ceramic-based materials can be usefully employed in high-performance applications such as high-speed communication devices, sensor modules for autonomous vehicles, and radar systems.

[0050] PTFE (Polytetrafluoroethylene, Teflon) offers very low dielectric constant and excellent thermal stability, and is widely used in applications requiring high-frequency and ultra-high-frequency signal processing in cylindrical packages. PTFE minimizes signal transmission loss and can maximize the performance of cylindrical packages in high-speed data communication devices. For example, PTFE-based cylindrical packages can guarantee signal quality and support stable operation in high-speed data communication environments, such as 5G network equipment.

[0051] Hybrid materials are composite dielectrics designed by combining FR-4 with high-performance materials such as ceramics or PTFE, and can flexibly meet the complex design requirements of cylindrical packages. Hybrid materials provide excellent performance in systems where low-frequency and high-frequency signals are processed simultaneously, balancing cost-effectiveness with high performance. These materials can be used in sensor systems for autonomous vehicles, data centers, aerospace equipment, and the like.

[0052] Glass fiber-based materials are used to enhance the mechanical stability of cylindrical packages and strengthen thermal management performance. Glass fibers provide high electrical insulation and thermal resistance, making them effective in environments where high-speed signal processing and heat dissipation are required simultaneously. Applying glass fiber-based materials to cylindrical packages can ensure reliability and minimize electromagnetic interference in high-speed data processing systems.

[0053] As described above, cylindrical packages can be designed using various dielectric materials used in PCB fabrication. FR-4, polyimide, ceramic-based dielectrics, PTFE, hybrid materials, glass fiber-based materials, etc., are selected depending on design requirements and application environments, and each material can provide signal processing, thermal management, electrical insulation, and mechanical stability.

[0054] FIG. 2 is a cross-sectional view showing A-A' of FIG. 1, showing the components of a central hollow (40) and a first cylindrical three-dimensional package (10), a second cylindrical three-dimensional package (20), and a third cylindrical three-dimensional package (30) surrounding it.

[0055] As shown in FIG. 2, the cylindrical three-dimensional packaging device (1) is designed so that a first cylindrical three-dimensional package (10), a second cylindrical three-dimensional package (20), and a third cylindrical three-dimensional package (30) are symmetrically stacked around a hollow (40), thereby providing a structure that satisfies electrical connection, thermal management, and mechanical stability.

[0056] The hollow (40) constitutes the central axis of the present invention and can serve as an interlayer electrical connection and a heat dissipation path. In terms of electrical connection, the hollow (40) can be used as a routing path that can integrate power supply lines and data transmission lines. This design minimizes signal interference between electronic components installed in cylindrical three-dimensional packages (10, 20, 30) and provides an environment that can reliably support high-speed data transmission. For example, in communication systems requiring high-frequency signals, central routing through the hollow (40) can maintain signal quality and optimize transmission speed. In terms of thermal management, the hollow (40) can be used as a circulation path for air flow or cooling fluid to efficiently dissipate heat generated within the laminated structure. This can solve the problem of overheating that occurs in high-performance electronic systems. As described through FIG. 1, the interior of the hollow (40) is not limited by the above description but can be implemented in various ways depending on the design purpose and application environment.

[0057] Each cylindrical three-dimensional package (10, 20, 30) can operate as an integrated system while each layer is designed independently to perform a unique function. Each package can transmit signals and power through separate routing paths and provide stable inter-layer connections.

[0058] FIG. 3 is a drawing showing an example in which a chip is mounted vertically in a cylindrical three-dimensional packaging device of FIG. 1. Here, the cross-sectional view AA' and the cross-sectional view BB' represent a plane that vertically crosses the interior of the cylinder where the chips are respectively placed in the first to third cylindrical three-dimensional packages (10, 20, 30).

[0059] Referring to FIG. 3, the AA' cross-section and the BB' cross-section can basically be orthogonal (90 degrees) to each other, but can be adjusted to various angles such as 30 degrees or 60 degrees depending on the specific application environment, and can be expanded into a multi-structure including two or more cross-sections as needed. In the AA' cross-section, the chips are arranged symmetrically with respect to the cylindrical central axis, but are not limited to this arrangement.

[0060] In the AA' and BB' cross-sections, the connection between chips can be made using a contactless connection method utilizing the hollow (40) portion. By utilizing the hollow (40) to form a data signal and power transmission path, high-speed signal processing and power distribution can be optimized. Compared to the wiring method of connecting chips on a conventional PCB (Printed Circuit Board), direct connection between chips in a multilayer structure is enabled, thereby reducing the connection distance and ensuring sufficient spacing between connection lines, so that crosstalk and electromagnetic interference (EMI) can be minimized.

[0061] In addition, the present invention allows for maintaining signal integrity through a power and signal separation structure using the above method. By connecting power, data, and ground signals through independent routing paths in the hollow (40) region, power loss can be reduced and signal interference minimized. In particular, in high-frequency environments with high signal transmission speeds, signal routing needs to be precisely designed, and a non-contact connection using the hollow (40) region can provide structural advantages that effectively resolve this. In particular, in chiplet designs requiring high-speed interconnect technology, it can provide the effect of minimizing power consumption while increasing the data exchange speed between chips.

[0062] The BB' cross-section shows a configuration adjusted to a specific angle with the AA' cross-section. This design can be designed to physically separate signal and power routing paths by layer to prevent inter-layer signal interference (crosstalk).

[0063] The AA' and BB' cross-sections include a complex hierarchical structure of signal and power routing, with each path separated into a distinct routing layer. The signal routing layer utilizes materials with low dielectric constant for high-frequency signal processing, while the power routing layer can be designed to operate stably even in high-current-density environments. Such a design can suppress electromagnetic interference (EMI) and signal interference, thereby improving signal quality and power distribution efficiency.

[0064] The hollow (40) is a multi-purpose space formed in the center of a cylindrical package and can perform various functions beyond simple structural elements, such as power and data routing, thermal management, and structural stability. The hollow (40) can organically integrate electrical, thermal, and structural functions depending on the design purpose and application environment.

[0065] One of the main functions of the hollow (40) is to provide stable inter-layer electrical connections through the integration of power lines and data lines. Inside the hollow (40), signal routing paths and power transmission paths are physically separated and arranged, which can minimize electromagnetic interference (EMI) and suppress crosstalk. Power signals are transmitted to each layer through the hollow (40) without loss, and data signals can be transmitted quickly while maintaining signal quality even in high-frequency environments. For example, if the hollow (40) is utilized in a high-speed data communication device, data lines are efficiently arranged, enabling reliable signal transmission even in high-speed data environments such as 5G networks.

[0066] Additionally, the hollow (40) can be designed as a circulation path for air flow or cooling fluid to effectively dissipate heat generated inside the cylindrical package. This cooling path can control the temperature of high-power semiconductor chips that generate a large amount of heat, extend the lifespan of electronic components, and increase the stability of the system.

[0067] Additionally, the hollow (40) may be utilized as a high-speed optical data transmission path including optical fibers according to design requirements. In a high-speed communication device, the data processing speed can be increased and signal loss minimized by transmitting optical signals through the hollow (40). Furthermore, the hollow (40) may be utilized as a power supply device by inserting battery cells or energy storage modules, or the functionality of the system may be expanded by integrating various sensor modules. As described in FIG. 1, the interior of the hollow (40) is not limited by the above description but can be implemented in various ways depending on the design purpose and application environment.

[0068] Figure 4 is a drawing showing an example in which a chip is mounted horizontally in a cylindrical three-dimensional packaging device of Figure 1.

[0069] The CC' and DD' cross-sectional views in Fig. 4 are cross-sectional views showing the internal structure of a cylindrical three-dimensional package cut in the horizontal direction, and the CC' and DD' cross-sectional views show that the surface of each layer is designed as a space for chip mounting.

[0070] Each layer is designed independently to suit a specific application environment, and inter-layer connections are implemented through highly reliable stacking technology. For example, in data centers, identical chips can be mounted on each layer to maximize parallel processing performance, while in sensor modules for autonomous vehicles, chips performing various functions can be placed on each layer to support the multifunctionality of the system. This multilayer structure enables cylindrical packages to operate efficiently even in application environments requiring miniaturization and high density.

[0071] A hollow (40) located in the center of a cylindrical three-dimensional packaging device (1) penetrates each layer and is designed as an electrical connection and heat dissipation path. Power lines and data routing paths are arranged inside the hollow (40) to reliably supply signals and power to the first to third cylindrical three-dimensional packages (10, 20, 30). In terms of electrical connection, the hollow (40) reliably transmits high-speed data signals and power signals, and serves to prevent signal interference or quality degradation. For example, high-frequency data signals can be transmitted through the hollow (40) without loss, and power lines can supply uniform power to the chips in each layer. In terms of thermal management, the hollow (40) can be utilized as an air circulation path or for the flow of cooling fluid to effectively dissipate heat generated internally. This design can prevent overheating problems occurring in high-performance electronic systems and provide a stable operating environment. Since the hollow (40) has been described in detail in FIGS. 1 to 3, further detailed description is to be omitted.

[0072] FIG. 5 is a drawing showing a spiral three-dimensional packaging device according to another embodiment of the present invention.

[0073] Referring to FIG. 5, the spiral three-dimensional packaging device shows a form in which a first spiral three-dimensional package (11), a second spiral three-dimensional package (21), and a third spiral three-dimensional package (31) are stacked and combined in a spiral.

[0074] Specifically, the spiral coupling structure is formed such that the first spiral three-dimensional package (11), the second spiral three-dimensional package (21), and the third spiral three-dimensional package (31) have the same circular cross-section and are connected to each other along an inclined surface that leads spirally. This structure increases the interlayer contact area, thereby increasing mechanical coupling strength and significantly improving the stability of the laminated structure. For example, even in high-vibration environments such as aircraft or robots, the spiral coupling structure maintains the stability of the laminated structure and enables highly reliable operation. A hollow space (40) may additionally be formed between the spirally coupled layers.

[0075] Even in a spiral structure, the first spiral package (11), the second spiral package (21), and the third spiral package (31) can each independently perform specific electronic functions. The first spiral package (11) can perform data processing and signal conversion functions. For example, it can be equipped with a high-performance processor to analyze and process sensor data in real time. The second spiral package (21) can house a chip responsible for power management and distribution functions, and can supply stable power to the entire system by including a power conversion module. The third spiral package (31) can include a data storage device and can safely store and manage large amounts of data over the long term. However, it should be kept in mind that various types of chips can be housed in each of the first spiral package (11), the second spiral package (21), and the third spiral package (31) depending on the design purpose, and are not limited to the examples described above.

[0076] Figure 6 is a cross-sectional view AA' of the spiral three-dimensional packaging device of Figure 5.

[0077] In FIG. 6, the first spiral package (11), the second spiral package (21), and the third spiral package (31) are each aligned along a spiral trajectory and are connected by inclined surfaces while maintaining the same circular cross-section.

[0078] If the material used in the helical structure has properties that allow for flexibility, the elliptical cross-section of region A shown in Fig. 6 itself can be configured as a helical package. For example, high-performance dielectric materials such as polyimide have excellent heat resistance and electrical insulation properties and can be molded into a flexible shape, making them suitable for implementing helical structures. In addition, materials such as liquid crystal polymers (LCPs) or thermoplastics can be considered in helical package design because they provide high flexibility and excellent signal transmission characteristics.

[0079] In the design method of the spiral elliptical package, a structure that continues in a spiral shape can be created centered on the ellipse indicated in area A. This allows the entire package, rather than a specific layer, to be designed as a single spiral unit.

[0080] Dedicated paths for routing power, data signals, and ground signals may be included within the spiral unit, and these paths can be arranged along the curvature of the spiral to efficiently manage interlayer connections. In addition, unlike conventional standardized stacked packages, the flexible spiral package can be easily applied in non-standardized environments such as curved displays, wearable devices, and aerospace systems.

[0081] The helical three-dimensional packaging device (2) of the present invention may further include a hollow (40). The interior of the hollow (40) can be implemented in various ways depending on the design purpose and application environment. For example, the hollow (40) may be kept empty or filled with a dielectric material. Additionally, the hollow (40) may be filled with the same material as each layer. As such, the hollow (40) is not merely an open space but can be configured in various ways according to the design purpose and can be optimized to perform functions such as power and signal routing, thermal management, structural stability, and electromagnetic interference shielding. Electrical connections support power supply and data transmission, thereby enabling each layer to operate independently while performing the functions of an integrated system.

[0082] Figure 7 is a drawing showing an example in which a chip is mounted vertically in the spiral three-dimensional packaging device of Figure 5.

[0083] Referring to FIG. 7, the AA' cross-sectional view shows a vertical cross-section including the central axis of the helical package, showing the chips uniformly arranged along the outer edge of the cylinder along the helical arrangement. The BB' cross-sectional view, like the AA' cross-sectional view, is a cross-sectional view of the helical package cut in the vertical direction, showing the arrangement of chips along the helical structure and the interlayer connection method.

[0084] Each layer of the first spiral package (11), the second spiral package (21), and the third spiral package (31) is designed to perform a specific function and can mount various chips. For example, the first spiral package (11) can be responsible for stable and efficient power supply by including a power management chip, and the second spiral package (21) can perform high-speed data processing by mounting a signal processing chip. In addition, the third spiral package (31) can be reliably managed with large amounts of data by including a data storage chip. This design can provide flexibility to be adjusted to the requirements of the application environment by mounting the same chip repeatedly or by placing chips with unique functions on each layer.

[0085] As described in FIGS. 6 and 7, the spiral three-dimensional packaging device (2) of the present invention may further include a hollow (40) and a support member (50), and the interior of the hollow (40) may be implemented in various ways depending on the design purpose and application environment. A detailed description of the hollow (40) is omitted.

[0086] Figure 8 is a drawing showing an example in which a chip is mounted horizontally in the spiral three-dimensional packaging device of Figure 5.

[0087] Referring to FIG. 8, the CC' and DD' cross-sectional views show a spiral three-dimensional package horizontally cut to show the shape in which the chips of each layer are uniformly arranged along the circular surface. Each chip is placed at regular intervals on the outer edge of the spirally arranged spiral structure. A hollow (40) penetrates the center of the spiral structure and is designed as a main path for power and data signals for interlayer connection.

[0088] The CC' and DD' cross-sectional views show that each layer of the first helical package (11), the second helical package (21), and the third helical package (31) is designed independently. A chip performing a different function may be mounted on each layer. For example, the first helical package (11) may be responsible for stable power supply by including a power management chip, and the second helical package (21) may be equipped with a signal processing chip for high-speed signal processing. The third helical package (31) may include a data storage chip capable of stably storing and managing large amounts of data. Additionally, the structure can be flexibly adjusted according to design requirements by repeatedly mounting chips with the same function or by arranging chips that perform various functions.

[0089] The hollow (40) can be utilized as a support point for interlayer alignment. Additionally, if an electromagnetic shielding material is included inside the hollow (40), data and power signals can be protected from external interference, thereby maintaining signal quality. If an optical fiber is included inside the hollow (40), high-speed data transmission and bandwidth expansion can be enabled, providing high efficiency in data centers and high-speed communication equipment. However, it should be kept in mind that the configuration of the hollow (40) is not limited to these embodiments and can be applied in various ways, as described in FIGS. 6 and 7.

[0090] FIG. 9 is a diagram showing the arrangement and connection method of chips inside a cylindrical three-dimensional packaging device (1) according to another embodiment of the present invention. Here, Figure A and Figure B respectively show the longitudinal and transverse arrangement of chips.

[0091] Referring to FIG. 9, Figure A shows a structure in which chips are arranged longitudinally on the outer edge of a cylindrical three-dimensional packaging device (1). Each chip can be connected to the edge of the central cylinder through a chip-to-chip routing layer, and such connection can minimize electrical interference and optimize the data transmission path. In FIG. 9, the first layer (60), the second layer (70), and the third layer (80) represent routing layers, and each layer (60, 70, 80) can transmit power, low-frequency signals, and high-frequency signals separately as needed.

[0092] The first layer (60) is a Power / Ground Routing Layer that transmits power and ground signals and can support a stable power supply without power loss. Through an optimized design to meet the power requirements of each chip, voltage drop can be prevented and the electrical stability of the entire system can be maintained.

[0093] The second layer (70) is a low-frequency routing layer that transmits low-frequency data signals, ensuring the stability and reliability of data transmission and preventing signal interference. This area operates effectively, particularly in modules requiring low-speed data processing.

[0094] The third layer (80) is a high-frequency routing layer for high-frequency signal transmission, which maintains signal quality and maximizes data transmission speed in environments requiring high-speed data transmission and communication. For example, high-frequency data signals can be transmitted quickly without distortion through the third layer (80).

[0095] Additionally, a chip-to-chip control chip or a buffer may be placed in the third layer (80). The control chip and the buffer operate integrally with the routing layer and can increase the efficiency of signal flow between chips. The control chip manages the flow of data signals in real time, and the buffer can minimize distortion and delay that may occur during data transmission.

[0096] The central cylindrical structure shown in Diagram A can maintain not only electrical connections between chips but also the structural stability of the system. The outer surface of the cylinder can be composed of multiple layers, allowing for the addition of new modules or the replacement of existing ones. For example, the top chip can be replaced with a high-speed processor to enhance data processing performance, or additional memory modules can be installed to increase data storage capacity. This design facilitates system scalability and maintenance, and can extend the lifespan of high-performance electronic systems.

[0097] Drawing B shows a structure in which chips are arranged transversely with respect to a central cylinder. In this design, the chips are arranged with respect to a central cylinder, and the edge of each chip can be connected to the edge of the central cylinder.

[0098] Although the cylindrical three-dimensional packaging device (1) and the spiral three-dimensional packaging device (2) described above are illustrated to have a cylindrical cross-section, the present invention is not limited thereto, and various structures including polygonal cross-sections such as squares, triangles, pentagons, and hexagons may be applied. These various cross-sectional shapes can be flexibly selected according to the design purpose and application environment, and the performance of the packaging system can be improved according to characteristics such as mechanical stability, signal routing optimization, and thermal management efficiency provided by each shape.

[0099] Three-dimensional packaging devices with a square cross-section offer high compatibility with standard PCB design methods during the manufacturing process and facilitate the alignment of layer-by-layer structures. The advantages of a square cross-section include the ability to standardize signal and power routing within the package and the suitability for maintaining wiring patterns with specific directional orientations. For example, in data center environments requiring high-speed data processing, a square structure can be used to straighten signal paths and minimize inter-layer transmission paths, thereby reducing signal latency. Furthermore, square packages facilitate the placement of power layers to maintain balanced power distribution and offer the advantage of allowing the application of standardized designs even in mass production processes.

[0100] Three-dimensional packaging devices with a triangular cross-section can provide high mechanical stability structurally and may be advantageous for maximizing signal density within a limited space. The triangular cross-section structure can be designed so that each layer maintains an equal area within a multilayer package, and signal transmission can be optimized in a specific direction. For example, the triangular cross-section structure can be utilized in wearable devices or miniaturized high-density packaging environments, enabling designs that optimize space efficiency and power consumption.

[0101] Polygonal cross-sectional structures, such as pentagons or hexagons, are shapes capable of providing a balance between signal routing and mechanical strength, enabling efficient power and data signal distribution while maintaining the stability of multilayer structures. Hexagonal structures allow for balanced interlayer signal path placement while maximizing area utilization, and maintain compatibility with existing linear PCB-based designs. In particular, polygonal cross-sectional structures are suitable for applying modular package designs in applications such as autonomous vehicles and aerospace systems, contributing to the optimization of internal package space and improved data transmission speeds.

[0102] In some embodiments, a hybrid structure combining cylindrical and polygonal cross-sections may be applied. For example, if the internal structure is maintained as cylindrical while the external shape is designed as polygonal, it is possible to optimize interlayer signal transmission internally while increasing compatibility with external packaging. Additionally, it may be possible to enhance mechanical strength in a specific direction or enable optimal space utilization in a specific arrangement method (e.g., 3D stacked structure).

[0103] As described above, the cylindrical three-dimensional packaging device is not limited to a cylindrical cross-section, and various polygonal cross-sectional structures such as squares, triangles, pentagons, and hexagons may be applied. These various cross-sectional structures can be optimized according to the design requirements of the system and can be determined by considering various performance enhancement factors such as signal routing, power management, and heat dissipation. Accordingly, the present invention includes a flexible packaging technology that is not limited to a specific cross-sectional shape and can implement various shapes depending on the design purpose and application environment.

[0104] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will understand that other specific forms can be easily modified without altering the technical spirit or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and components described as distributed may likewise be implemented in a combined form.

[0105] The scope of the present invention is defined by the claims set forth below rather than by the detailed description, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the present invention.

[0106] [Personal Statement]

[0107] This project (result) is the result of the Local Government-University Cooperation-based Regional Innovation Project, conducted in 2024 with funding from the Ministry of Education and support from the National Research Foundation of Korea (2023RIS-009).

[0108] This research was supported by "Regional Innovation Strategy (RIS)" through the National Research Foundation of Korea(NRF) funded by the Ministry of Education(MOE).(2023RIS-009) Explanation of the symbols

[0109] 10: First cylindrical three-dimensional package 11: 1st Spiral 3D Package 20: Second cylindrical three-dimensional package 21: Second spiral three-dimensional package 30: Third cylindrical three-dimensional package 31: Third spiral three-dimensional package 40: Communist China 50: Support member 60: 1st layer 70: 2nd layer 80: 3rd layer A-A': First cutting section B-B': Second cutting section C-C': Third cutting section D-D': 4th cutting section Chip: Mounted semiconductor chip

Claims

Claim 1 It is composed of a plurality of three-dimensional packages having a cylindrical or spiral structure, and A three-dimensional packaging device characterized in that a plurality of semiconductor chips are mounted on each of the plurality of three-dimensional packages, and the plurality of three-dimensional packages are stacked with respect to a central axis. Claim 2 A three-dimensional packaging device according to claim 1, further comprising a hollow formed with respect to the central axis of the plurality of three-dimensional packages. Claim 3 A three-dimensional packaging device according to claim 2, characterized in that each of the plurality of three-dimensional packages is electrically connected through the hollow. Claim 4 A three-dimensional packaging device according to claim 1, characterized in that each of the plurality of three-dimensional packages is designed to be modular and configured to be detachably attached to one another. Claim 5 A three-dimensional packaging device according to claim 1, wherein the cross-sections of the plurality of packages have a shape among a cylindrical, a spiral, and a polygon, and each package is configured with the same shape as one another. Claim 6 A three-dimensional packaging device according to claim 1, characterized in that each of the plurality of semiconductor chips is arranged perpendicularly to the plurality of three-dimensional packages. Claim 7 A three-dimensional packaging device according to claim 1, characterized in that each of the plurality of semiconductor chips is arranged horizontally on the surface of the plurality of packages. Claim 8 A three-dimensional packaging device according to claim 2, characterized in that the outer surface of the hollow includes a signal routing path for one or more of a data line, a power supply line, and a ground line. Claim 9 A three-dimensional packaging device according to claim 1, wherein each of the plurality of three-dimensional packages further comprises a first layer, a second layer, and a third layer. Claim 10 A three-dimensional packaging device according to claim 9, wherein the first layer is formed on the outer surface of the plurality of three-dimensional packages, and the second layer and the third layer are each formed at the center of the plurality of three-dimensional packages. Claim 11 A three-dimensional packaging device according to claim 9, wherein the first layer, the second layer, and the third layer are used as any one of a power / ground line, a high-frequency signal line, or a control signal line, and a buffer, control, or non-contact connection chip is disposed thereon.

Images