Display apparatus

Abstract

A display device according to the present specification comprises a substrate including a display area and a non-display area disposed outside the display area, a link area, a bending area, and a pad area located in the non-display area, a first signal link wiring disposed in the link area, an organic insulating layer disposed on the first signal link wiring, a touch insulating structure disposed on the organic insulating layer, a second signal link wiring extending to the pad area along the surface of the touch insulating structure, and a plurality of pads disposed on the pad area, wherein the end portion of the second signal link wiring may overlap with the pad.

Description

Technology Field

[0001] This specification relates to a display device. Background Technology

[0002] Display devices are applied to various electronic devices such as TVs, smartphones, laptops, and tablets. To this end, research is continuously being conducted to develop thinner, lighter, and lower power consumption display devices.

[0003] Examples of display devices include Liquid Crystal Display apparatus (LCD), Field Emission Display apparatus (FED), and Organic Light Emitting Display apparatus (OLED).

[0004] The bezel area of ​​a display device may include an area surrounding the outer edge of the display area on the display panel. The bezel area can protect the edges of the display panel and internal electronic components from external shock, pressure, or damage. Meanwhile, the bezel area is visible to the user and may be a factor that reduces the sense of immersion regarding the image emitted from the display area.

[0005] Accordingly, there has recently been an increasing demand for display devices that implement a narrow bezel, which reduces the bezel area where the screen is not displayed, or a zero bezel, which has the effect of having virtually no bezel area. The problem to be solved

[0006] The display panel may include a bending area that allows a portion of the area to be bent to hide the pad area beneath the display area. Accordingly, the bezel area of ​​the display device visible to the user can be reduced.

[0007] A bending area includes multiple wires to transmit various signals to pixels on a display area, and the wires can extend to a display area or a pad area through link areas adjacent to the bending area.

[0008] As multiple wires are placed on bending areas and link areas adjacent to the bending areas, they may be exposed to defects such as cracks.

[0009] Accordingly, the inventors of this specification have invented a display device through various experiments in which wiring extending to a display area or pad area via a bending area and adjacent link areas may include a structure robust against cracks.

[0010] The problem to be solved according to the embodiments of the present specification is to provide a display device capable of preventing damage to wiring placed in the bending area and adjacent link areas.

[0011] In addition, the problem to be solved according to the embodiments of the present specification is to provide a display device that can simplify the signal movement path of wirings extended to a display area or pad area through link areas adjacent to a bending area.

[0012] The problems solved according to one embodiment of this specification are not limited to the purposes mentioned above, and other unmentioned purposes and advantages of the present invention may be understood from the following description and will be more clearly understood by the embodiments of this specification. Furthermore, it will be readily apparent that the purposes and advantages of this specification can be realized by the means and combinations thereof set forth in the claims. means of solving the problem

[0013] A display device according to one embodiment of the present specification comprises a substrate including a display area and a non-display area disposed outside the display area, a link area, a bending area, and a pad area located in the non-display area, a first signal link wiring disposed in the link area, an organic insulating layer disposed on the first signal link wiring, a touch insulating structure disposed on the organic insulating layer, a second signal link wiring extending to the pad area along the surface of the touch insulating structure, and a plurality of pads disposed on the pad area, wherein the end portion of the second signal link wiring may overlap with the pad. Effects of the invention

[0014] According to an embodiment of the present specification, by configuring organic insulating films that include a flat surface without a step on a non-display area extended in one direction of a display area, it is possible to prevent crack defects from occurring in the wirings placed in the bending area of ​​the non-display area and adjacent link areas.

[0015] According to an embodiment of the present specification, by reinforcing the rigidity of the area adjacent to the bending area among the non-display areas of the substrate, it is possible to prevent the occurrence of crack-vulnerable points in the area extending from the display area through the bending area to the pad area.

[0016] Accordingly, it is possible to prevent signal lines from being damaged by stress in the area adjacent to the bending area during the bending motion. Consequently, this has the effect of reinforcing the rigidity of the bending area and the area adjacent to it while further reducing the externally visible bezel area.

[0017] According to the embodiments of this specification, the failure rate of a display device due to damage to a signal line is lowered, which can reduce the production energy required for additional production of the display device, thereby having the effect of reducing greenhouse gas emissions.

[0018] The effects of this specification are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0019] FIG. 1 is a plan view of a display panel according to embodiments of the present specification. Figure 2 is a cross-sectional view along line II-II' of Figure 1. Figure 3 is a cross-sectional view according to region II of Figure 1. FIGS. 4 to 6 are drawings according to an embodiment of the present specification. FIGS. 7 and FIGS. 8 are drawings according to other embodiments of the present specification. FIG. 9 is a drawing according to another embodiment of the present specification. Specific details for implementing the invention

[0020] The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below but may be implemented in various different forms, and these embodiments are provided merely to ensure that the disclosure of this specification is complete and to fully inform those skilled in the art of the scope of the invention.

[0021] Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary and are not limited to the depicted items. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing this specification, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of this specification, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0022] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0023] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0024] In the case of an explanation of a temporal relationship, for example, when a temporal sequence is explained using 'after', 'following', 'next', 'before', etc., it may include cases where the sequence is not continuous unless 'immediately' or 'directly' is used.

[0025] Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of this specification.

[0026] The features of each of the various embodiments of this specification may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0027] Hereinafter, a display device according to each embodiment of the present invention will be described with reference to the attached drawings.

[0029] FIG. 1 is a plan view of a display panel according to embodiments of the present specification. FIG. 2 is a cross-sectional view along line II-II' of FIG. 1. FIG. 2 schematically shows one subpixel of a display device.

[0030] Referring to FIGS. 1 and FIGS. 2, a display device (1) according to an embodiment of the present specification may include a display panel (200), a printed circuit board (104), and a control circuit chip (105), etc.

[0031] The display panel (200) may include a display area (AA) and a non-display area (NAA). The display area (AA) is an area where an image is displayed, and a plurality of pixels (P), data lines (DL), and gate lines (GL) may be arranged therein. In one example, the display area (AA) may include a touch sensing unit arranged on a different layer from the data lines (DL) and gate lines (GL). The non-display area (NAA) may be an area where an image is not displayed. The non-display area (NAA) may be located in the peripheral area (or border area) of the display panel (200), but is not limited thereto. For example, the remaining area excluding the light-emitting area on the display area (AA) from which light is emitted outwardly may be referred to as the non-display area (NAA). The bezel area of ​​the display device may be defined by the non-display area (NAA). The bezel area may surround the outer side of the display area (AA).

[0032] Wiring may be arranged in the non-display area (NAA) to provide an electrical signal to the display area (AA) or to receive an electrical signal from the display area (AA). For example, driving circuits including a gate driving circuit, a data driving circuit, and a touch driving circuit may be arranged in the non-display area (NAA). The non-display area (NAA) may include several driving units (101, 103) for driving the display area (AA). For example, the driving units (101, 103) may include a first driving unit (101) and a second driving unit (103), but are not limited thereto.

[0033] The first driving unit (101) may be positioned on the right and left edges of the non-display area (NAA) in a GIP (Gate In Panel) manner. The first driving unit (101) may transmit a gate signal onto the display area (AA) through gate wires (GL). For example, the first driving unit (101) may be referred to as a gate driving unit. The second driving unit (103) may transmit a data signal onto the display area (AA) through a plurality of data wires (DL) of the display area (AA). Alternatively, it may detect a touch signal through a plurality of touch sensing units of the display area (AA), transmit it to a control circuit chip (105), and transmit a signal provided from the control circuit chip (105) to the display area (AA). For example, the second driving unit (103) may include a data driving unit or a touch driving unit, but is not limited thereto.

[0034] Gate wires (GL) can be extended in a first direction (X) of the display panel (200), and data wires (DL) can intersect with the gate wires (GL) and be extended in a second direction (Y) of the display panel (200).

[0035] A non-display area (NAA) extending in one direction of a display area (AA) may include a link area (LKA1, LKA2), a bending area (BDA), and a pad area (PDA).

[0036] The link areas (LKA1, LKA2) may have signal lines arranged therein to provide an electrical signal to the display area (AA) or to receive an electrical signal from the display area (AA). For example, the signal lines may electrically connect the gate lines (GL), data lines (DL), or touch lines of the display area (AA) to the second driving unit (103) or the control circuit chip (105). The signal lines will be described later with reference to the drawings.

[0037] The link area (LKA1, LKA2) may include a first link area (LKA1) and a second link area (LKA2). Among the link areas (LKA1, LKA2), the first link area (LKA1) may be positioned between the display area (AA) and the pad area (PDA), and the bending area (BDA) may be positioned between the first link area (LKA1) and the pad area (PDA). The second link area (LKA2) may be positioned between the bending area (BDA) and the pad area (PDA).

[0038] The bending area (BDA) can be bent to position the printed circuit board (104) so ​​as to face the back of the display area (AA) of the display panel (200). The printed circuit board (104) may include a control circuit chip (105). The control circuit chip (105) can control the first driving unit (101) and the second driving unit (103).

[0039] As the bending area (BDA) of the display panel (200) bends, the pad area (PDA) of the non-display area (NAA) can be located below the display area (AA). Accordingly, the lower non-display area perceived from the front of the display device (1) can be reduced.

[0040] The display area (AA) may include a plurality of pixels (P) and holes (H). The holes (H) may be areas where electronic components are placed to add various functions to the display device (1). For example, the electronic components may include a camera module for taking photos or videos, such as in a smartphone, laptop, and tablet, or various sensor devices for detecting external objects. The sensor devices may include at least one of a proximity sensor, a gesture sensor, a color sensor, a bio-sensor, and an infrared sensor, but are not limited thereto.

[0041] A single pixel (P) may be composed of multiple subpixels (SP1, SP2, SP3). An image can be displayed in a display area (AA) through the multiple subpixels (SP1, SP2, SP3). The multiple subpixels (SP1, SP2, SP3) may be arranged in an array on the display area (AA). In one example, the multiple subpixels (SP1, SP2, SP3) may be arranged in a matrix-type array spaced apart from each other in a first direction of the display area (AA) and in a second direction intersecting the first direction. The first direction may be a horizontal direction, an X-axis direction, or a row direction, and the second direction may be a vertical direction, a Y-axis direction, or a column direction. However, this is not limited thereto, and the arrangement shape, arrangement order, and arrangement direction of the subpixels (SP1, SP2, SP3) may be varied.

[0042] In this specification, one embodiment is described in which a pixel (P) is composed of a first subpixel (SP1), a second subpixel (SP2), and a third subpixel (SP3), but is not limited thereto. For example, additional subpixels may be included in the pixel (P).

[0043] Each subpixel (SP1, SP2, SP3) may be implemented to emit light of the same color for each subpixel, such as white light, or may be implemented to emit light of a different color for each subpixel, such as red, green, or blue light. For example, the first subpixel (SP1) may be implemented as red, the second subpixel (SP2) as green, and the third subpixel (SP3) as blue.

[0044] Referring to FIG. 2, the display area (AA) of the display panel (200) may include a pixel driving circuit comprising a plurality of transistors (220, 240) disposed on a substrate (201), a light-emitting element (260), and a touch sensor unit (287). For convenience of explanation, the present specification describes the configuration of a single subpixel, but is not limited thereto.

[0045] A single subpixel may include a light-emitting element (260) and a pixel driving circuit that applies a driving current to the light-emitting element (260). The pixel driving circuit is disposed on a substrate (201), and the light-emitting element (260) is disposed on the pixel driving circuit. The pixel driving circuit may include a plurality of transistors (220, 240) and a storage capacitor (230). In one example, the plurality of transistors (220, 240) may include a first transistor (220) and a second transistor (240).

[0046] The substrate (201) may be a flexible plastic substrate. If the substrate (201) is a plastic film, it may include multiple layers of insulating material. For example, the substrate (201) may include a first base layer (202), a second base layer (203), and a support layer (204). The first base layer (202) and the second base layer (203) may be spaced apart from each other at the top and bottom, and the support layer (204) may be placed between them.

[0047] The first base layer (202) and the second base layer (203) may include a flexible insulating material. For example, the first base layer (202) and the second base layer (203) may include polyimide. The support layer (204) may support the first and second base layers (202, 203) which are relatively flexible. The support layer (204) may include an insulating material that is relatively rigid compared to the first and second base layers (202, 203). For example, the support layer (204) may include silicon oxide (SiOx) or silicon nitride (SiNx).

[0048] A first buffer layer (205) may be disposed on a substrate (201). The first buffer layer (205) may cover the surface of the substrate (201). The first buffer layer (205) may reduce or prevent the penetration of moisture, oxygen, or impurities through the substrate (201). The first buffer layer (205) may be a single layer or a multilayer made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). The first buffer layer (205) may cover the entire surface of the substrate (201) on the display area (AA). For example, the first buffer layer (205) may extend to a non-display area (NAA) surrounding the outside of the display area (AA).

[0049] A light-shielding layer (209) may be disposed on the first buffer layer (205). The light-shielding layer (209) may block external light incident on the transistor. To this end, the light-shielding layer (209) may include an opaque metallic material. A second buffer layer (212) may be disposed on the light-shielding layer (209). The second buffer layer (212) may protect the transistor from moisture, oxygen, or impurities. The second buffer layer (212) may be a single layer or a multilayer made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. The second buffer layer (212) may cover the entire surface of the substrate (201) on the display area (AA). For example, the second buffer layer (212) may extend to a non-display area (NAA) surrounding the outside of the display area (AA).

[0050] A first transistor (220) may be disposed on the second buffer layer (212). The first transistor (220) may include a first semiconductor layer (221), a first gate insulating layer (222), a first gate electrode (223), a first source electrode (224), and a first drain electrode (225). In one example, the first transistor (220) may be a switching transistor.

[0051] The first semiconductor layer (221) may include a channel region and a source / drain region. The region of the first semiconductor layer (221) that overlaps with the first gate electrode (223) in the upper and lower directions may be the channel region. The source / drain region may be disposed on each side of the channel region. The first semiconductor layer (221) may be composed of one or a combination of a polysilicon semiconductor layer and a low-temperature polysilicon semiconductor layer. In another example, the first semiconductor layer (221) may include an oxide semiconductor layer. For example, it may include at least one of oxide semiconductor materials such as indium gallium zinc oxide (IGZO) or indium zinc oxide (IZO).

[0052] If the first semiconductor layer (221) includes an oxide semiconductor layer, the first transistor (220) may be an oxide thin film transistor. The first semiconductor layer (221) may be arranged to overlap the light shielding layer (209) in the upper and lower directions. The light shielding layer (209) may block external light incident on the first semiconductor layer (221).

[0053] A first gate insulating layer (222) may be disposed between the first semiconductor layer (221) and the first gate electrode (223). The first gate insulating layer (222) may extend outwardly while covering the first semiconductor layer (221). The first gate insulating layer (222) may be composed of a single layer or multiple layers of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). The first gate insulating layer (222) may completely cover the surface of the substrate (201) on the display area (AA). For example, the first gate insulating layer (222) may extend to a non-display area (NAA) surrounding the outside of the display area (AA). In the non-display area (NAA), the second buffer layer (212) and the first gate insulating layer (222) may come into contact with each other from the top and bottom to form a first insulating structure (213).

[0054] A first gate electrode (223) may be disposed on a first gate insulating layer (222). A first interlayer insulating layer (214) may be disposed on the first gate electrode (223). The first interlayer insulating layer (214) may be a single layer or a multilayer made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). In one example, the first interlayer insulating layer (214) may extend to a non-display area (NAA) surrounding the outside of a display area (AA).

[0055] The first source electrode (224) and the first drain electrode (225) can be electrically connected to the first semiconductor layer (221).

[0056] The storage capacitor (230) may include a first storage electrode (231) and a second storage electrode (232). For example, the first storage electrode (231) may be located on the same layer as the first gate electrode (223). For example, the first storage electrode (231) may be placed on the first gate insulating layer (222) at a different location spaced apart from the first gate electrode (223). The first storage electrode (231) may be made of the same material as the first gate electrode (223). The second storage electrode (232) may be placed on the first interlayer insulating layer (214) so ​​as to overlap the first storage electrode (231) in the upper and lower directions.

[0057] The first storage electrode (231) and the second storage electrode (232) may be a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. However, they are not limited to these materials.

[0058] A second interlayer insulating layer (216) may be disposed on the second storage electrode (232). The second interlayer insulating layer (216) may be a single layer or a multilayer made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). In one example, the second interlayer insulating layer (216) may extend to a non-display area (NAA) surrounding the outside of the display area (AA).

[0059] A second transistor (240) may be disposed on the second interlayer insulating layer (216) spaced apart from the first transistor (220). The second transistor (240) may be electrically connected to the first transistor (220). For example, the second transistor (240) may include a second semiconductor layer (241), a second gate insulating layer (242), a second gate electrode (243), a second source electrode (245), and a second drain electrode (246). In one example, the second transistor (240) may be a driving transistor electrically connected to a light-emitting element (260).

[0060] The second semiconductor layer (241) may include a channel region and a source / drain region. The region of the second semiconductor layer (241) that overlaps with the second gate electrode (243) in the up and down directions may be the channel region. The source / drain region may be disposed on each side of the channel region. The second semiconductor layer (241) may be composed of an oxide semiconductor layer. For example, it may include at least one oxide semiconductor material such as indium gallium zinc oxide (IGZO) or indium zinc oxide (IZO). In one example, the second semiconductor layer (241) may be disposed to overlap with the storage capacitor (230) in the up and down directions. Accordingly, external light incident from outside the substrate (201) to the second semiconductor layer (241) can be blocked by the storage capacitor (230). Thus, it is possible to prevent the characteristics of the second transistor (240) from changing due to external light.

[0061] A second gate insulating layer (242) may be disposed between the second semiconductor layer (241) and the second gate electrode (243). The second gate insulating layer (242) may extend outward while covering the second semiconductor layer (241). For example, the second gate insulating layer (242) may extend to a non-display area (NAA) surrounding the outside of the display area (AA). The second gate insulating layer (242) may be composed of a single layer or multiple layers of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0062] The first gate electrode (223) or the second gate electrode (243) may be a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. However, it is not limited to these materials.

[0063] A third interlayer insulating layer (218) may be disposed on the second gate electrode (243). The third interlayer insulating layer (218) may include an insulating material. For example, the third interlayer insulating layer (218) may be a single layer or a multilayer, including inorganic insulating materials such as silicon oxide (Six), silicon nitride (SiNx), and silicon oxide nitride (SiON). In one example, the third interlayer insulating layer (218) may extend to a non-display area (NAA) surrounding the outside of the display area (AA). In the non-display area (NAA), the third interlayer insulating layer (218), the second gate insulating layer (242), and the second interlayer insulating layer (216) may come into contact with each other from the top and bottom to form a second insulating structure (219).

[0064] A first source electrode (224), a first drain electrode (225), a second source electrode (245), and a second drain electrode (246) may be disposed on the third interlayer insulating layer (218).

[0065] The first source electrode (224) and the first drain electrode (225) can be connected by directly contacting the source / drain regions of the first semiconductor layer (221) through the third interlayer insulating layer (218), the second gate insulating layer (242), the second interlayer insulating layer (216), the first interlayer insulating layer (214), and the first gate insulating layer (222).

[0066] The second source electrode (245) and the second drain electrode (246) can be connected by directly contacting the source / drain regions of the second semiconductor layer (241), respectively, by penetrating the third interlayer insulating layer (218) and the second gate insulating layer (242). The second drain electrode (246) of the second transistor (240) can be electrically connected to the storage capacitor (230). For example, a portion of the second drain electrode (246) can be connected by directly contacting the first storage electrode (231) of the storage capacitor (230) by penetrating the third interlayer insulating layer (218), the second gate insulating layer (242), the second interlayer insulating layer (216), and the first interlayer insulating layer (214).

[0067] The first source electrode (224), the first drain electrode (225), the second source electrode (245), or the second drain electrode (246) may be a single layer or a multilayer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, but is not limited thereto. In one example, the first source electrode (224) or the second drain electrode (225) may be a laminated structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0068] A passivation layer (247) may be disposed on the first source electrode (224), the first drain electrode (225), the second source electrode (245), or the second drain electrode (246). The passivation layer (247) may be a single layer or a multilayer, comprising an inorganic insulating material such as silicon oxide, silicon nitride, and silicon oxynitride. The passivation layer (247) may protect the pixel driving circuit disposed underneath.

[0069] A flattening layer (250) may be disposed on the passivation layer (247). The flattening layer (250) may flatten the step difference caused by the lower pixel driving circuit. The flattening layer (250) may include a multilayer structure of a first flattening layer (251) and a second flattening layer (252). For example, each of the first flattening layer (251) and the second flattening layer (252) may include an organic insulating material such as polyimide or acrylic resin. Accordingly, the flattening layer (250) may be referred to as an organic insulating layer. In one example, the first flattening layer (251) and the second flattening layer (252) may extend to a non-display area (NAA) surrounding the outside of the display area (AA).

[0070] A pixel contact electrode (255) may be disposed on the first flattening layer (251). The pixel contact electrode (255) may penetrate the first flattening layer (251) and the passivation layer (247) and directly contact the second drain electrode (246) of the second transistor (240).

[0071] A light-emitting element (260) may be formed on a flattening layer (250). For example, a light-emitting element (260) may be disposed on a second flattening layer (252). The light-emitting element (260) may include a first electrode (261), a light-emitting layer (263), a second electrode (265), and a capping layer (267).

[0072] The light-emitting element (260) can be electrically connected to a pixel driving circuit through a first electrode (261). For example, the first electrode (261) can penetrate the second planarization layer (252) and come into direct contact with the pixel contact electrode (255). Accordingly, the first electrode (261) can be electrically connected to the second transistor (240) through the pixel contact electrode (255). However, FIG. 2 is intended to explain an example of a method of supplying current to the first electrode (261) and is not limited to physical contact between the first electrode (261) and the second transistor (240), which is the driving transistor. In one example, the switching transistor electrically connected to the first electrode (261) may be a light-emitting transistor. For example, the light-emitting transistor may control the turn-on and turn-off states of the light-emitting element (260). The pixel contact electrode (255) may include a conductive material. For example, the pixel contact electrode (255) may include metallic materials such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), and tungsten (W). In one example, the pixel contact electrode (255) may have a multilayer structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0073] The first electrode (261) may include a transparent conductive film. For example, the first electrode (261) may include indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, the first electrode (261) may include a single-layer or multi-layer structure comprising a reflective metal film formed of one of silver (Ag), aluminum (Al), gold (Au), nickel (Ni), and chromium (Cr), or an alloy thereof. The first electrode (261) may also be referred to as an anode electrode or a pixel electrode.

[0074] A bank (262) may be disposed on the first electrode (261). The bank (262) may be disposed to cover the edge of the first electrode (261). A portion of the bank (262) may extend to the second flattening layer (252). The upper surface of the first electrode (261) exposed and not covered by the bank (262) may become a light-emitting region. The bank (262) may be composed of an organic insulating material. The bank (262) may include, for example, photosensitive polyimide, photoacrylic, or benzocyclobutene (BCB).

[0075] A spacer (264) may be further disposed on the bank (262). The spacer (264) may be disposed to prevent damage to the bank (262) and the first electrode (261) during the process. The spacer (264) may be made of the same material as the bank (262). The bank (262) and the spacer (264) may be stacked on top of each other to form an organic insulating structure (266).

[0076] A light-emitting layer (263) may be disposed on the first electrode (261). The light-emitting layer (263) may include a hole transport layer (HTL), an organic light-emitting layer (EML), an electron transport layer (ETL), a hole blocking layer (HBL), a hole injecting layer (HIL), an electron blocking layer (EBL), and an electron injecting layer (EIL). The light-emitting layer (263) may have a multi-stack structure in which two or more organic light-emitting layers (EML) are stacked.

[0077] A second electrode (265) may be disposed on the light-emitting layer (263). The second electrode (265) may be commonly connected to the light-emitting layer (263) formed on all pixels. Thus, the second electrode (265) may also be referred to as a cathode electrode or a common electrode. The second electrode (265) may include a semi-transparent conductive material. For example, it may be formed from a metallic material such as magnesium (Mg), silver (Ag), or an alloy of silver (Ag) and magnesium (Mg) (Ag-Mg). In one example, the second electrode (265) may include a transparent conductive film such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO).

[0078] A capping layer (267) may be disposed on the second electrode (265). The capping layer (267) can improve light extraction efficiency by preventing light generated from the light-emitting layer (263) from being lost.

[0079] A sealing portion (270) may be disposed on the light-emitting element (260). The sealing portion (270) may protect the light-emitting element (260) from external oxygen or moisture. The sealing portion (270) may cover the display area (AA) and extend to the non-display area (NAA) outside the display area (AA).

[0080] The bag portion (270) may include a multilayer structure in which a first bag layer (271), a second bag layer (273), and a third bag layer (275) are arranged. The second bag layer (273) may be configured to be arranged between the first bag layer (271) and the third bag layer (275).

[0081] A first encapsulation layer (271) may be placed on a capping layer (267). A second encapsulation layer (273) may be placed on the first encapsulation layer (271). The second encapsulation layer (273) may have sufficient thickness to cover the first encapsulation layer (271) and have a flat surface. The second encapsulation layer (273) may prevent foreign substances from penetrating into the light-emitting element (260). A third encapsulation layer (275) may be placed on the second encapsulation layer (273). The first encapsulation layer (271) and the third encapsulation layer (275) may extend to a non-display area (NAA) surrounding the outside of the display area (AA). The first encapsulation layer (271) and the third encapsulation layer (275) extended to the non-display area (NAA) may form an inorganic insulating structure (276) that is stacked on top of and bottom of each other.

[0082] The first encapsulation layer (271) and the third encapsulation layer (275) may comprise an inorganic insulating material, and the second encapsulation layer (273) may comprise an organic insulating material. For example, each of the first encapsulation layer (271) and the third encapsulation layer (275) may comprise at least one material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). The second encapsulation layer (273) may comprise at least one material selected from epoxy, polyimide, polyethylene, and acrylate.

[0083] A touch portion may be disposed on the packaging portion (270). The touch portion may include a touch buffer layer (277), a touch sensor portion (287), an inter-touch layer insulating layer (282), a first touch protection layer (290), and a second touch protection layer (295).

[0084] A touch buffer layer (277) may be disposed on the third encapsulation layer (275). The touch buffer layer (277) can relieve stress between the encapsulation portion (270) and the touch sensor portion (287) layer, thereby preventing damage to the encapsulation portion (270) and the light-emitting element (260). The touch buffer layer (277) may include an inorganic insulating material. For example, the touch buffer layer (277) may include silicon nitride (SiNx).

[0085] The touch sensor unit (287) may include a plurality of touch electrodes (285) and a bridge electrode (281). The plurality of touch electrodes (285) and the bridge electrode (281) may be disposed on different layers. For example, the bridge electrode (281) may be disposed on a touch buffer layer (277). The plurality of touch electrodes (287) may be disposed on a touch interlayer insulating layer (282). The plurality of touch electrodes (287) may include a first touch electrode (283) and a second touch electrode (284). The bridge electrode (281) may electrically connect adjacent first touch electrodes (283). To this end, the first touch electrode (283) may penetrate the touch interlayer insulating layer (282) and be connected to the bridge electrode (281). The touch interlayer insulating layer (282) may include an inorganic insulating material. For example, the interlayer insulation layer (282) may include silicon nitride (SiNx).

[0086] The first touch electrode (283), the second touch electrode (284), or the bridge electrode (281) may include a conductive material. The first touch electrode (283), the second touch electrode (284), or the bridge electrode (281) may include a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0087] The touch buffer layer (277) and the touch interlayer insulating layer (282) may extend in the direction of the non-display area (NAA). The touch buffer layer (277) and the touch interlayer insulating layer (282) may contact the non-display area (NAA) in the upper and lower directions to form a touch insulating structure (280).

[0088] A touch protection layer (297) may be disposed on the touch sensor portion (287). The touch protection layer (297) may include a first touch protection layer (290) and a second touch protection layer (295). The first touch protection layer (290) can prevent damage to the touch sensor portion (287) caused by external impact and moisture. The first touch protection layer (290) may include an organic insulating material. For example, the first touch protection layer (290) may be made of a photosensitive acrylic or polyimide-based organic material. The first touch protection layer (290) may extend into a non-display area (NAA).

[0089] A second touch protection layer (295) may be disposed on the first touch protection layer (290). The second touch protection layer (295) may further protect the touch sensor portion (287) from external shocks and moisture. Additionally, the second touch protection layer (295) may flatten the step difference caused by the patterns constituting the lower touch sensor portion (287). The second touch protection layer (295) may include an organic insulating material. For example, the second touch protection layer (295) may include the same organic insulating material as the first touch protection layer (290), but is not limited thereto. For example, the second touch protection layer (295) may include a different organic insulating material than the first touch protection layer (295). For example, the touch protection layer (297) may extend to a non-display area (NAA) surrounding the outside of the display area (AA).

[0090] FIG. 3 is a drawing according to region II of FIG. 1. FIGS. 4 through 6 are drawings according to an embodiment of the present specification. For example, FIG. 4 is a cross-sectional view according to line IV-IV' of FIG. 3. FIG. 5 is an enlarged plan view according to region III of FIG. 3. FIG. 6 is a cross-sectional view according to line V-V' of FIG. 3. FIG. 4 shows a portion of an area where a first signal link wiring (223L) is arranged to transmit a signal (or gate signal) for driving a pixel on a display area (AA). FIG. 5 and FIG. 6 show a portion of an area where a second signal link wiring (287L) is arranged to transmit a signal to a touch sensing unit.

[0091] Referring to FIGS. 3 to 5, a non-display area (NAA) may be included in a portion of one edge of a display area (AA) of a display panel (200). For example, the non-display area (NAA) may include a first link area (LKA1), a bending area (BDA), and a second link area (LKA2), and a portion of a pad area (PDA). In one example, the second link area (LKA2) may include a first area (TRA1), a second area (TRA2), and a third area (TRA3).

[0092] The first region (TRA1) may be an area where data lines (DL) of a display area (AA) extend toward a pad area (PDA). The second region (TRA2) may be an area where a connecting line (255-1) electrically connected to a plurality of first signal link lines (223L, see FIG. 4) connected to gate lines (GL) extend toward a pad area (PDA). In one example, the second region (TRA2) may be referred to as a GIP trace area. The third region (TRA3) may be an area where a connecting line (255-1) electrically connected to a first portion (287-1) of a plurality of second signal link lines (287L, see FIG. 6) connected to a touch electrode (285, see FIG. 2) extend toward a pad area (PDA). In one example, the third region (TRA3) may be referred to as a touch trace area. The third region (TRA3) may be placed between the first region (TRA1) and the second region (TRA2), but is not limited thereto.

[0093] In the first link area (LKA1), a first link contact electrode (225-1) connected to the second area (TRA2) of the second link area (LKA2) and a first part (287-1) of the second signal link wiring (287L) connected to the third area (TRA3) of the second link area (LKA2) may be positioned at different locations. In the second link area (LKA2), a second link contact electrode (225-2) connected via the bending area (BDA) of the second area (TRA2) and a second part (287-2) of the second signal link wiring (287L) connected via the bending area (BDA) of the third area (TRA3) may be positioned at different locations. The bending area (BDA) may include a plurality of connecting wires (255-1). Each connecting wire (255-1) can electrically connect the signal lines of the first link area (LKA1) and the signal lines of the second link area (LKA2).

[0094] A plurality of first link contact electrodes (225-1) and a first portion (287-1) of a plurality of second signal link wirings (287L) may each extend in a second direction (Y) from a first link area (LKA1). A connecting wiring (255-1) may extend in a second direction (Y) from a bending area (BDA). A plurality of second link contact electrodes (225-2) and a second portion (287-2) of a plurality of second signal link wirings (287L) may each extend in a second direction (Y) from a second link area (LKA2). The second direction (Y) may be the vertical or longitudinal direction of the display panel (200).

[0095] Referring to FIGS. 3 and 4, a first insulating structure (213) may be disposed on a first link region (LKA1), a bending region (BDA), a second link region (LKA2), and a pad region (PDA) of a substrate (201). The first insulating structure (213) may include a second buffer layer (212) and a first gate insulating layer (222) extending from a display region (AA). For example, the first insulating structure (213) may include a multilayer comprising an inorganic insulating material.

[0096] A plurality of first signal link wires (223L) may be disposed on the first insulating structure (213). The first signal link wires (223L) may be electrically connected to each gate wire (GL) of the display area (AA). The first signal link wires (223L) may also be referred to as gate link wires. In one example, the first signal link wires (223L) may be formed from the same material and in the same process as the first gate electrode (223).

[0097] A first pad pattern (223p) may be disposed on the first insulating structure (213) of the pad region (PDA). The first pad pattern (223p) may be formed in the same process with the same material as the first gate electrode (223).

[0098] A second insulating structure (219) may be disposed on the first signal link wiring (223L). The second insulating structure (219) may be a structure in which a third interlayer insulating layer (218), a second gate insulating layer (242), and a second interlayer insulating layer (216) extending from the display area (AA) are in contact with each other from the top and bottom. For example, the second insulating structure (219) may include a multilayer comprising an inorganic insulating material.

[0099] The second insulating structure (219) may extend continuously to the first link region (LKA1), the bending region (BDA), and the second link region (LKA2). The end portion of the second insulating structure (219) may be located in the pad region (PDA). Accordingly, the first pad pattern (223p) may not be covered by the second insulating structure (219).

[0100] In the embodiments of this specification, for convenience of explanation, an embodiment in which the first signal link wiring (223L) is formed in the same process as the first gate electrode (223) has been described, but is not limited thereto. For example, the first signal link wiring (223L) may be formed in the same process with the same material as the second storage electrode (232), or may be formed in the same process with the same material as the second gate electrode (243). In addition, in another example, the first signal link wiring (223L) may include a plurality of wirings disposed on different layers.

[0101] A link contact electrode (225L) may be disposed on the second insulating structure (219). The link contact electrode (225L) may include a first link contact electrode (225-1) and a second link contact electrode (225-2). The first link contact electrode (225-1) may be disposed on a first link region (LKA1) adjacent to a display region (AA). The second link contact electrode (225-2) may be disposed on a second link region (LKA2) adjacent to a pad region (PDA). The first link contact electrode (225-1) and the second link contact electrode (225-2) may be disposed on the same layer spaced apart from each other. The first link contact electrode (225-1) and the second link contact electrode (225-2) may be formed in the same process with the same material as the second source electrode (245) and the second drain electrode (246).

[0102] A first link contact electrode (225-1) disposed on a first link region (LKA1) may be electrically connected to a first signal link wiring (223L). For example, the first link contact electrode (225-1) may be connected to the first signal link wiring (223L) through a first via electrode (225c) penetrating a second insulating structure (219). In one example, the first via electrode (225c) may be integral with the first link contact electrode (225-1). The region where the first link contact electrode (225-1) and the first signal link wiring (223L) are electrically connected may be a link contact region (LCA).

[0103] A second link contact electrode (225-2), spaced apart from the first link contact electrode (225-1) and positioned on the second link region (LKA2), may extend into a pad region (PDA). For example, the second link contact electrode (225-2) may extend along the inclined surface of the end portion of the second insulating structure (219) to cover the first pad pattern (223p) on the pad region (PDA). The portion of the second link contact electrode (225-2) that covers the first pad pattern (223p) may become the second pad pattern (225p).

[0104] A first flattening layer (251) covering a first link contact electrode (225-1) and a second link contact electrode (225-2) may be disposed on a second insulating structure (219). The first flattening layer (251) may be disposed on a first link region (LKA1), a bending region (BDA), and a second link region (LKA2) of a substrate (201). The first flattening layer (251) may extend to a portion of the pad region (PDA). Accordingly, it may cover the second link contact electrode (225-2) that extends to the inclined surface of the end portion of the second insulating structure (219).

[0105] A connecting wire (255-1) may be disposed on the first flattening layer (251). The connecting wire (255-1) may extend from the first link area (LKA1) through the bending area (BDA) to the second link area (LKA2). For example, the connecting wire (255-1) may include a first portion disposed on the first link area (LKA1), a second portion disposed on the second link area (LKA2), and a third portion located between the first portion and the second portion and disposed on the bending area (BDA).

[0106] The connecting wire (255-1) can be formed from the same material and in the same process as the pixel contact electrode (255) of the display area (AA). In one example, the connecting wire (255-1) may have a multilayer structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0107] A first portion of the connecting wire (255-1) can be connected to a first link contact electrode (225-1) through a second via electrode (255c1) penetrating the first flattening layer (251) in a first contact area (CTA1). Accordingly, the first portion of the connecting wire (255-1) can be electrically connected to a first signal link wire (223L) through the second via electrode (255c1), the first link contact electrode (225-1), and the first via electrode (225c). In one example, the first link contact electrode (225-1) is placed in each first contact area (CTA1), and adjacent first link contact electrodes (225-1) can be insulated from each other.

[0108] A second portion of the connecting wire (255-1) can be connected to a second link contact electrode (225-2) through a third via electrode (255c2) that penetrates the first flattening layer (251) in the second contact area (CTA2). Accordingly, the second portion of the connecting wire (255-1) can be electrically connected to a second pad pattern (225p) of a pad area (PDA) through the second link contact electrode (225-2). Thus, a signal transmitted through the pad area (PDA) can be provided to a pixel on a display area (AA) using the second link contact electrode (225-2), the second contact area (CTA2), the connecting wire (255-1), the first contact area (CTA1), and the first link contact electrode (225-1) as signal transmission paths. In one example, a second link contact electrode (225-2) is placed in each second contact area (CTA2), and adjacent second link contact electrodes (225-2) can be insulated from each other.

[0109] A third pad pattern (255p) may be disposed on a second pad pattern (225p) of a pad area (PDA). The third pad pattern (255p) may be formed in the same process with the same material as the pixel contact electrode (255). In one example, the third pad pattern (255p) may have a multilayer structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0110] A second flattening layer (252) may be disposed on the connecting wire (255-1). The second flattening layer (252) may be disposed on the first link region (LKA1), the bending region (BDA), and the second link region (LKA2) of the substrate (201) while covering the connecting wire (255-1). The second flattening layer (252) may flatten the step difference caused by the lower circuit elements. The first flattening layer (251) and the second flattening layer (252) may include an organic insulating material.

[0111] An organic insulating structure (266) may be disposed on the second flattening layer (252). The organic insulating structure (266) may be configured such that a bank (262) and a spacer (264) disposed on the display area (AA) are stacked in the upper and lower directions.

[0112] A touch insulating structure (280) may be disposed on an organic insulating structure (266). The touch insulating structure (280) may be a structure in which a touch buffer layer (277) extending from a display area (AA) and an inter-touch insulating layer (282) are in contact with each other from the top and bottom. For example, the touch insulating structure (280) may include a multilayer comprising an inorganic insulating material. For example, the touch insulating structure (280) may include silicon nitride (SiNx).

[0113] The touch insulating structure (280) may cover the exposed surface of the organic insulating material. For example, the touch insulating structure (280) may cover the inclined surface of the end portion of the organic insulating structure (266), the second flattening layer (252), and the first flattening layer (251). In one example, the touch insulating structure (280) may be placed within the pad area (PDA), but is not limited thereto.

[0114] A first touch protection layer (290) may be disposed on a touch insulation structure (280). The first touch protection layer (290) may include an organic insulating material.

[0115] A fourth pad pattern (287p) may be placed on a third pad pattern (255p) of a pad area (PDA). The fourth pad pattern (287p) may be formed in the same process as the touch electrode (285) or bridge electrode (281) of the touch sensor part (287) using the same material. Accordingly, a pad (PD) may be placed in the pad area (PDA) in which the first pad pattern (223p), the second pad pattern (225p), the third pad pattern (255p), and the fourth pad pattern (287p) are stacked from bottom to top. The fourth pad pattern (287p) may be placed on the top of the pad (PD) to cover the lower structure so that it is not exposed.

[0116] FIG. 5 is an enlarged plan view according to area III of FIG. 3. FIG. 6 is a cross-sectional view along line V-V' of FIG. 3. In FIG. 5 and FIG. 6, components identical to those in FIG. 5 and FIG. 6 may have the same reference numerals. Accordingly, redundant descriptions will be omitted or briefly explained, and parts that differ will be explained.

[0117] Referring to FIGS. 5 and 6, the second signal link wiring (287L) can be electrically connected to the first signal link wiring (223L) through the connecting wiring (255-1). For example, the second signal link wiring (287L) can be formed in the same process with the same material as the touch electrode (285) extending from the display area (AA).

[0118] The first signal link wiring (223L) can be electrically connected to the first link contact electrode (225-1) through the first via electrode (255c) in the link contact area (LCA). The second link contact electrode (225-2), spaced apart from the first link contact electrode (225-1), can extend into the pad area (PDA) to cover the first pad pattern (223p). The first link contact electrode (225-1) and the second link contact electrode (225-2) can be electrically connected to each other through the connecting wiring (255-1). The connecting wiring (255-1) can be covered with the second flattening layer (252).

[0119] The second flattening layer (252) may include contact holes (252h1, 252h2). The contact holes (252h1, 252h2) may penetrate the organic insulating structure (266) and the second flattening layer (252) to expose a portion of the surface of the connecting wiring (255-1). The contact holes (252h1, 252h2) may include a first contact hole (252h1) placed on a first link area (LKA1) and a second contact hole (252h2) placed on a second link area (LKA2).

[0120] The touch insulation structure (280) is placed on the organic insulation structure (266), the second flattening layer (252), and the contact holes (252h1, 252h2), and may expose a portion of the surface of the connecting wiring (255-1). The touch insulation structure (280) may cover the inclined surface of the end portions of the organic insulation structure (266), the second flattening layer (252), and the first flattening layer (251). In one example, the touch insulation structure (280) may be placed within the pad area (PDA), but is not limited thereto.

[0121] The second signal link wiring (287L) may be placed on the touch insulation structure (280). For example, a first part (287-1) of the second signal link wiring (287L) may be placed in the first contact area (CTA1) of the first link area (LKA1). A second part (287-2) of the second signal link wiring (287L) may be placed in the second contact area (CTA2) of the second link area (LKA2) spaced apart from the first link area (LKA1). The first part (287-1) and the second part (287-2) of the second signal link wiring (287L) may be placed on the same layer.

[0122] The first part (287-1) of the second signal link wiring (287L) can extend along the touch insulation structure (280) placed on the first contact hole (252h1) to make direct contact with the first part of the connection wiring (255-1). Additionally, the second part (287-2) of the second signal link wiring (287L) can extend along the touch insulation structure (280) placed on the second contact hole (252h2) to make direct contact with the second part of the connection wiring (255-1).

[0123] The second portion (287-2) of the second signal link wiring (287L) may extend into a pad area (PDA) to cover a third pad pattern (255p). A portion of the area extending from the second portion (287-2) of the second signal link wiring (287L) into the pad area (PDA) may become a fourth pad pattern (287p). Accordingly, a pad (PD) may be disposed in the pad area (PDA) in which the first pad pattern (223p), the second pad pattern (225p), the third pad pattern (255p), and the fourth pad pattern (287p) are stacked from bottom to top.

[0124] The second signal link wiring (287L) can be covered by the first touch protection layer (290). The first touch protection layer (290) can cover the second signal link wiring (287L) placed on the display area (AA), the first link area (LKA1), the bending area (BDA), and the second link area (LKA2).

[0125] The second signal link wiring (287L) can directly contact the connecting wiring (255-1) in the contact areas (CTA1, CTA2) of the link areas (LKA1, LKA2) adjacent to the bending area (BDA). Referring to FIG. 5, the first part (287-1) of the second signal link wiring (287L) can overlap the first part of the connecting wiring (255-1) in the first contact area (CTA1) from above and below. Additionally, the second part (287-1) of the second signal link wiring (287L) can overlap the second part of the connecting wiring (255-1) in the second contact area (CTA2) from above and below.

[0126] Accordingly, the signal transmitted through the pad (PD) can be provided to the display area (AA) using the second part (287-1) of the second signal link wiring (287L), the connection wiring (255-1), and the first part (287-1) of the second signal link wiring (287L) as signal transmission paths.

[0127] A first touch protection layer (290) can be placed on the second signal link wiring (287L).

[0128] Referring to FIG. 6, contact holes (252h1, 252h2) placed in each contact area (CTA1, CTA2) can be formed by removing the second flattening layer (252). During the process of forming the contact holes (252h1, 252h2), a step may occur on the second flattening layer (252) of the area (A) corresponding to the upper corner of the contact holes (252h1, 252h2). Additionally, during the process of exposing a portion of the surface of the connecting wiring (255-1) on the contact holes (252h1, 252h2), a step may occur due to the touch insulation structure (280) of the area (B) corresponding to the bottom surface of the contact holes (252h1, 252h2).

[0129] The second signal link wiring (287L) can be formed along the shape of the step created on the second flattening layer (252) and the step created on the touch insulation structure (280). The part where the step is created may become a vulnerable point where the second signal link wiring (287L) is damaged and a crack defect may occur. If physical impact or the like is applied to the display device, the second signal link wiring (287L) at the part where the crack occurred may be severed. Consequently, the signal cannot be transmitted to the display area (AA), resulting in pixel defects or operational failures, which may increase the defect rate of the display device.

[0130] Accordingly, another embodiment of the present specification may include a structure capable of preventing the occurrence of a weak point that causes a crack in the second signal link wiring (287L).

[0131] FIGS. 7 and 8 are drawings according to other embodiments of the present specification. For example, FIG. 7 is an enlarged plan view according to area III of FIG. 3. FIG. 8 is a cross-sectional view along line V-V' of FIG. 3. FIGS. 7 and 8 show a portion of an area in which a second signal link wiring for transmitting a signal to a touch sensing unit is arranged. In FIGS. 7 and 8, components identical to those in FIGS. 4 through 6 may have the same reference numerals. Accordingly, redundant descriptions are omitted or briefly described, and parts that differ are described.

[0132] Referring to FIGS. 7 and 8, a first insulating structure (213) may be placed on a non-display area (NAA) of a substrate (201). A first signal link wiring (223L) may be placed on the first insulating structure (213). A first pad pattern (223p) may be placed on the first insulating structure (213) of a pad area (PDA). The first pad pattern (223p) may be formed in the same process with the same material as the first signal link wiring (223L) and the first gate electrode (223).

[0133] A second insulating structure (219) may be disposed on the first signal link wiring (223L). The second insulating structure (219) may include a multilayer comprising an inorganic insulating material. For example, the second insulating structure (219) may be a structure in which a third interlayer insulating layer (218), a second gate insulating layer (242), and a second interlayer insulating layer (216) extending from the display area (AA) are in contact with each other from the top and bottom.

[0134] A link contact electrode (225L) may be disposed on the second insulating structure (219). The link contact electrode (225L) may include a first link contact electrode (225-1) and a second link contact electrode (225-2). The first link contact electrode (225-1) and the second link contact electrode (225-2) may be disposed on the same layer. The first link contact electrode (225-1) and the second link contact electrode (225-2) may be disposed spaced apart from each other. For example, the first link contact electrode (225-1) may be disposed on a first link area (LKA1) adjacent to a display area (AA). The second link contact electrode (225-2) may be disposed on a second link area (LKA2) adjacent to a pad area (PDA). The first and second link contact electrodes (225-1, 225-2) can be formed in the same process with the same material as the second source electrode (245) and the second drain electrode (246).

[0135] A first link contact electrode (225-1) placed on a first link region (LKA1) can be electrically connected to a first signal link wiring (223L) through a first via electrode (225c). The first signal link wiring (223L) can be electrically connected to the first link contact electrode (225-1) through a first via electrode (255c) in a link contact region (LCA).

[0136] The second link contact electrode (225-2) placed on the second link area (LKA2) can extend to the pad area (PDA) and come into contact with the first pad pattern (223p).

[0137] A first flattening layer (251) may be disposed on the first link contact electrode (225-1) and the second link contact electrode (225-2). The first flattening layer (251) may extend to a portion of the pad area (PDA). Accordingly, it may cover the second link contact electrode (225-2) that extends to the inclined surface of the end portion of the second insulating structure (219).

[0138] The first flattening layer (251) can flatten the step difference caused by the first link contact electrode (225-1) and the second link contact electrode (225-2).

[0139] A second flattening layer (252) may be disposed on the first flattening layer (251). The second flattening layer (252) may be disposed on the first link region (LKA1), the bending region (BDA), and the second link region (LKA2) of the substrate (201). The first flattening layer (251) and the second flattening layer (252) may include an organic insulating material.

[0140] The second flattening layer (252) may be a flat surface as it is placed on the first flattening layer (251) on which the surface is flattened.

[0141] An organic insulating structure (266) may be disposed on the second flattening layer (252). The organic insulating structure (266) may include the same organic insulating material as the bank (262) and spacer (264) disposed on the display area (AA).

[0142] A touch insulating structure (280) may be disposed on an organic insulating structure (266). The touch insulating structure (280) may be a structure in which a touch buffer layer (277) extending from a display area (AA) and an inter-touch insulating layer (282) are in contact with each other from the top and bottom. For example, the touch insulating structure (280) may include a multilayer comprising an inorganic insulating material. For example, the touch insulating structure (280) may include silicon nitride (SiNx).

[0143] The touch insulation structure (280) may be placed along the flat surfaces of the first link area (LKA1), the bending area (BDA), and the second link area (LKA2). The touch insulation structure (280) may cover the inclined surface of the end portion of the organic insulation structure (266), the second flattening layer (252), and the first flattening layer (251) in the pad area (PDA).

[0144] A second signal link wiring (287L) may be disposed on a touch insulation structure (280). The second signal link wiring (287L) may be disposed continuously on a flat touch insulation structure (280). Accordingly, the second signal link wiring (287L) may be configured at the same height in the first link area (LKA1), the bending area (BDA), and the second link area (LKA2), respectively. For example, the second signal link wiring (287L) may be located at the same height from the upper surface of the second flattening layer (252) in the first link area (LKA1), the bending area (BDA), and the second link area (LKA2), respectively. For example, the second signal link wiring (287L) may be disposed on the same layer in the first link area (LKA1), the bending area (BDA), and the second link area (LKA2).

[0145] The second signal link wiring (287L) may extend into the pad area (PDA) to cover the third pad pattern (255p). A portion of the area extending from the second signal link wiring (287L) into the pad area (PDA) may become the fourth pad pattern (287p). For example, the end portion of the second signal link wiring (287L) may overlap with the pad (PD) of the pad area (PDA).

[0146] Accordingly, the pad area (PDA) can be configured with a pad (PD) in which a first pad pattern (223p), a second pad pattern (225p), a third pad pattern (255p), and a fourth pad pattern (287p) are stacked from the bottom to the top.

[0147] A first touch protection layer (290) may be disposed on the second signal link wiring (287L). The first touch protection layer (290) may include an organic insulating material. The first touch protection layer (290) may include an opening area (OA) that exposes the second signal link wiring (287L) in an area corresponding to the bending area (BDA).

[0148] In the display device, the neutral plane may be located inside the substrate (201). The neutral plane is a plane where no stress is generated because compressive and tensile stresses are offset during bending motion. The closer to the neutral plane, the less the influence of stress may be. The first touch protection layer (290) can optimize the neutral plane by including an opening area (OA) positioned at a location corresponding to the bending area (BDA).

[0149] According to another embodiment of the present specification, a first flattening layer (251) disposed in a first link area (LKA1) adjacent to a bending area (BDA) and a second link area (LKA2) adjacent to a pad area (PDA) may be disposed to have the same height without a step. Additionally, a second flattening layer (252) disposed on the first flattening layer (251) may also be disposed on the first link area (LKA1), the bending area (BDA), and the second link area (LKA2) at the same height without a step, as no step occurs in the lower first flattening layer (251). Furthermore, an organic insulating structure (266) disposed on the second flattening layer (251) may also be disposed at the same height without a step.

[0150] Accordingly, by arranging the second signal link wiring (287L) along a flat surface without any curved structure at the bottom, crack defects caused by uneven surfaces, such as steps, can be prevented. Therefore, since the failure of the second signal link wiring (287L) to be disconnected due to crack defects can be prevented, the defect rate of the display device can be reduced. Consequently, as the defect rate of the display device is lowered, the production energy required for additional production of the display device can be reduced, which has the effect of reducing greenhouse gas emissions.

[0151] In addition, by arranging the second signal link wiring (287L) along a flat surface without a curved structure at the bottom, it is possible to prevent the second signal link wiring (287L) from being damaged by stress in the first link area (LKA1) or the second link area (LKA2), which are adjacent to the bending area (BDA), when the bending area (BDA) is bent. Accordingly, there is an effect of strengthening the rigidity of the bending area (BDA) and the area adjacent to the bending area while further reducing the bezel area visible from the outside.

[0152] Additionally, the second signal link wiring (287L) can be extended as a single wire through the first link area (LKA1), the bending area (BDA), and the second link area (LKA2) to the pad area (PDA). Accordingly, the signal provided from the pad area (PDA) to the display area (AA) in the third area (TRA3, see FIG. 3) of the second link area (LKA2) may not use contact areas (CTA1, CTA2, see FIG. 6) composed of a multi-stage structure. Accordingly, since the occurrence of step differences while configuring the multi-stage structure can be prevented, the second signal link wiring (287L) can have a structure that is robust against cracks. Additionally, since the second signal link wiring (287L) extends through the first link area (LKA1), the bending area (BDA), and the second link area (LKA2) to the pad area (PDA) as a single wire, it is possible to reduce signal loss or noise in the signal path including contact areas (CTA1, CTA2, see FIG. 6) composed of a multi-stage structure.

[0153] FIG. 9 is a drawing according to another embodiment of the present specification. For example, FIG. 9 is a cross-sectional view along line V-V' of FIG. 3. In FIG. 9, components identical to those in FIG. 8 may have the same reference numerals. Accordingly, redundant descriptions will be omitted or briefly described, and parts that differ will be described.

[0154] Referring to FIG. 9, a first insulating structure (213) comprising an inorganic insulating material may be disposed on a non-display area (NAA) of a substrate (201). A second insulating structure (219) may be disposed on the first insulating structure (213). A first link area (LKA1) may include a first signal link wiring (223L) disposed between the first insulating structure (213) and the second insulating structure (219).

[0155] A first link contact electrode (225-1) and a second link contact electrode (225-2) may be placed on the second insulating structure (219).

[0156] The first link contact electrode (225-1) can be electrically connected to the first signal link wiring (223L) through the first via electrode (225c). The first signal link wiring (223L) can be electrically connected to the first link contact electrode (225-1) through the first via electrode (255c) in the link contact area (LCA).

[0157] A second link contact electrode (225-2) positioned at a different location spaced apart from the first link contact electrode (225-1) extends into a pad area (PDA), and a portion of the second link contact electrode (225-2) may form a second pad pattern (225p) that covers the first pad pattern (223p).

[0158] The first flattening layer (251) can cover the first link contact electrode (225-1) and the second link contact electrode (225-2). For example, the first flattening layer (251) can cover the second link contact electrode (225-2) which extends from the pad area (PDA) to the inclined surface of the end portion of the second insulating structure (219).

[0159] A second flattening layer (252) may be disposed on the first flattening layer (251). As the second flattening layer (252) is disposed on the first flattening layer (251) with a flattened surface, it may have a flat surface.

[0160] A touch insulating structure (280) may be disposed on the second flattening layer (252). The touch insulating structure (280) may be a structure in which a touch buffer layer (277) extending from the display area (AA) and a touch interlayer insulating layer (282) are in contact with each other from the top and bottom. For example, the touch insulating structure (280) may include a multilayer containing an inorganic insulating material. For example, the touch insulating structure (280) may include silicon nitride (SiNx). The touch insulating structure (280) may cover the inclined surface of the end portions of the second flattening layer (252) and the first flattening layer (251) in the pad area (PDA). The touch insulating structure (280) may be composed of a flat surface without a step.

[0161] A second signal link wiring (287L) may be placed on a touch insulation structure (280). Since the second signal link wiring (287L) is placed on a touch insulation structure (280) composed of a flat surface, it can be configured at the same height without step difference in the first link area (LKA1), the bending area (BDA), and the second link area (LKA2).

[0162] The second signal link wiring (287L) may extend into the pad area (PDA) to cover the third pad pattern (255p). A portion of the area extending from the second signal link wiring (287L) into the pad area (PDA) may become the fourth pad pattern (287p). For example, the end portion of the second signal link wiring (287L) may overlap with the pad (PD) of the pad area (PDA).

[0163] Accordingly, the pad area (PDA) can be configured with a pad (PD) in which a first pad pattern (223p), a second pad pattern (225p), a third pad pattern (255p), and a fourth pad pattern (287p) are stacked from the bottom to the top.

[0164] A first touch protection layer (290) including an opening area (OA) may be disposed on the second signal link wiring (287L). The opening area (OA) may be exposed by removing the first touch protection layer (290) in the area corresponding to the bending area (BDA), thereby exposing the second signal link wiring (287L).

[0165] According to another embodiment of the present specification, the second signal link wiring (287-2) is disposed on a first flattening layer (251), a second flattening layer (252), and a touch insulation structure (280) having a flat surface on the bottom, thereby preventing cracks caused by an uneven surface from occurring in the second signal link wiring (287-2).

[0166] Additionally, the organic insulating structure between the second flattening layer (252) and the touch insulating structure (280) may be omitted. Accordingly, the thickness of the display device can be reduced, thereby preventing the bending region (BDA) from being damaged by stress during the bending operation of the bending region (BDA).

[0167] A display device according to various embodiments of the present specification may be described as follows.

[0168] A display device according to an embodiment of the present specification comprises a substrate including a display area and a non-display area disposed outside the display area, a link area, a bending area, and a pad area located in the non-display area, a first signal link wiring disposed in the link area, an organic insulating layer disposed on the first signal link wiring, a touch insulating structure disposed on the organic insulating layer, a second signal link wiring extending to the pad area along the surface of the touch insulating structure, and a plurality of pads disposed on the pad area, wherein the end portion of the second signal link wiring may overlap with the pad.

[0169] According to various embodiments of the present specification, the second signal link wiring may have a flat shape between the link region and the pad region.

[0170] According to various embodiments of the present specification, the second signal link wiring may be located at the same height from the organic insulating layer in the link region and the bending region.

[0171] According to various embodiments of the present specification, the display area may further include a plurality of transistors disposed on a substrate and comprising a gate electrode, a source electrode, and a drain electrode; a light-emitting element electrically connected to the plurality of transistors through a pixel contact electrode disposed on the plurality of transistors and comprising a first electrode, a light-emitting layer, and a second electrode, and a touch sensor portion located on the light-emitting element and comprising a plurality of touch electrodes.

[0172] According to various embodiments of the present specification, the first signal link wiring may include the same material as the gate electrode and be formed in the same process.

[0173] According to various embodiments of the present specification, the second signal link wiring may include the same material as the touch electrode and be formed in the same process.

[0174] According to various embodiments of the present specification, a link area includes a first link area located in an area adjacent to a display area in a non-display area, a second link area spaced apart from the first link area and located in an area adjacent to a pad area in a non-display area, and a first signal link wiring may be disposed in the first link area.

[0175] According to various embodiments of the present specification, a first link region may include a first link contact electrode that overlaps the first signal link wiring and the upper and lower portions, and a second link region may include a second link contact electrode disposed in the same layer as the first link contact electrode and whose end portion overlaps the pad.

[0176] According to various embodiments of the present specification, a first touch protection layer disposed on a second signal link wiring is further included, and the first touch protection layer may include an opening area that exposes the second signal link wiring at a position corresponding to a bending area.

[0177] According to various embodiments of the present specification, the organic insulating layer may include a first flattening layer covering a first signal link wiring and a second flattening layer on the first flattening layer.

[0178] According to various embodiments of the present specification, the organic insulating layer may further include a structure disposed between the second flattening layer and the touch insulating structure and comprising an organic insulating material.

[0179] According to various embodiments of the present specification, a pad may include a first pad pattern having the same material as a first signal link wiring, a second pad pattern disposed on the first pad pattern having the same material as a second link contact electrode, a third pad pattern on the second pad pattern having the same material as a second signal link wiring, and a fourth pad pattern having the same material as a second signal link wiring.

[0180] According to various embodiments of the present specification, the second signal link wiring may be placed on the same layer in the first link region, the bending region, and the second link region.

[0181] Although the embodiments of this specification have been described in more detail with reference to the attached drawings, this specification is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical spirit of this specification. Accordingly, the embodiments disclosed in this specification are intended to explain, not limit, the technical spirit of this specification, and the scope of the technical spirit of this specification is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0182] 1: Display device 200: Display panel AA: Display area NAA: Non-display area LKA1: 1st Link Area LKA2: Second Link Area BDA: Bending area PDA: Pad area 223L: 1st Signal Link Wiring 287L: Second signal link wiring CTA1: 1st contact area CTA2: Second contact area 255-1: Connection Wiring 225-1: First link contact electrode 225-2: Second link contact electrode

Claims

Claim 1 A display device comprising: a substrate including a display area and a non-display area disposed outside the display area; a link area, a bending area, and a pad area located in the non-display area; a first signal link wiring disposed in the link area; an organic insulating layer disposed on the first signal link wiring; a touch insulating structure disposed on the organic insulating layer; a second signal link wiring extending to the pad area along the surface of the touch insulating structure; and a plurality of pads disposed on the pad area, wherein the end portion of the second signal link wiring overlaps with the pad. Claim 2 A display device according to claim 1, wherein the second signal link wiring has a flat shape between the link area and the pad area. Claim 3 A display device according to claim 1, wherein the second signal link wiring is located at the same height from the organic insulating layer in the link region and the bending region. Claim 4 A display device according to claim 1, wherein the display area further comprises: a plurality of transistors disposed on the substrate and including a gate electrode, a source electrode, and a drain electrode; a pixel contact electrode disposed on the plurality of transistors; a light-emitting element electrically connected to the plurality of transistors through the pixel contact electrode and including a first electrode, a light-emitting layer, and a second electrode; and a touch sensor portion located on the light-emitting element and including a plurality of touch electrodes. Claim 5 In paragraph 4, the display device wherein the first signal link wiring comprises the same material as the gate electrode and is formed in the same process. Claim 6 In paragraph 4, the display device wherein the second signal link wiring comprises the same material as the touch electrode and is formed in the same process. Claim 7 A display device according to claim 1, wherein the link area comprises: a first link area located in an area adjacent to the display area in the non-display area; and a second link area spaced apart from the first link area and located in an area adjacent to the pad area in the non-display area, and the first signal link wiring is disposed in the first link area. Claim 8 A display device according to claim 7, wherein the first link region includes a first link contact electrode that overlaps the first signal link wiring above and below, and the second link region includes a second link contact electrode disposed in the same layer as the first link contact electrode and whose end portion overlaps the pad. Claim 9 A display device according to claim 1, further comprising a first touch protection layer disposed on the second signal link wiring, wherein the first touch protection layer comprises an opening area that exposes the second signal link wiring at a position corresponding to the bending area. Claim 10 A display device according to claim 1, wherein the organic insulating layer comprises: a first flattening layer covering the first signal link wiring; and a second flattening layer on the first flattening layer. Claim 11 A display device according to claim 10, wherein the organic insulating layer is disposed between the second planarization layer and the touch insulating structure and further comprises a structure including an organic insulating material. Claim 12 A display device according to claim 8, wherein the pad comprises: a first pad pattern having the same material as the first signal link wiring; a second pad pattern disposed on the first pad pattern and having the same material as the second link contact electrode; a third pad pattern on the second pad pattern; and a fourth pad pattern having the same material as the second signal link wiring. Claim 13 In claim 7, the second signal link wiring is a display device disposed on the same layer in the first link area, the bending area, and the second link area.

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