Novel Design and Process of Scalable High-Impedance Components

Abstract

A scalable high-impedance component (SHIC) may include a flexible polyimide core that may include one or more vias. The SHIC may include a magnetic film formed on one or more sides of the flexible polyimide core. The SHIC may include a polymer layer formed on the magnetic film, the polymer layer isolating the magnetic film from the flexible polyimide core. The SHIC may include a metal layer formed on and within the polymer layer such that the metal layer forms a winding extending through one or more vias. The SHIC may include a magnetic paste placed on the metal layer so that the SHIC shields electromagnetic interference at a desired frequency.

Description

Technology Field

[0001] Cross-reference of related applications

[0002] This application claims the benefit and priority of U.S. Regular Application No. 18 / 512,409, filed on November 17, 2023, titled “NOVEL DESIGN AND PROCESS OF SCALABLE HIGH IMPEDANCE COMPONENTS”, the contents of which are incorporated herein by reference in their entirety for all purposes.

[0003] Technology field

[0004] The present technology relates to semiconductor systems, processes, and equipment. More specifically, the present technology relates to the creation of a noise-blocking inductor device in a power distribution path. Background Technology

[0005] Noise coupling between Power Management Integrated Circuits (PMICs) and Radio Frequency (RF) components poses significant challenges in the design and manufacturing of electronic devices. Existing solutions for radiation coupling components, such as power lines for RF components and antennas, may be difficult to implement in advance during the initial product design phase due to unknown design constraints. To mitigate electromagnetic interference (EMI) issues caused by PMIC noise, noise suppression filters—such as EMI filters, choke inductors, or ferrite beads—can be used in high-speed digital systems. However, the unpredictable nature of EMI caused by PMIC noise may necessitate the introduction of noise suppression filters at the source. As current surges increase in high-performance computing, stronger noise sources propagate across the package, generating noise that interferes with other components. Noise is also radiated as electric, magnetic, or electromagnetic fields. To prevent this, noise blocking components need to be added along the power lines. The present invention provides a novel method for creating such components. means of solving the problem

[0006] A scalable high-impedance component (SHIC) may include a flexible polyimide core that may include one or more vias. The SHIC may include a magnetic film formed on one or more sides of the flexible polyimide core. The SHIC may include a polymer layer formed on the magnetic film, the polymer layer isolating the magnetic film from the flexible polyimide core. The SHIC includes a metal layer, which is formed on the polymer layer and within the vias to form a winding extending through one or more vias. The SHIC may include a magnetic paste placed on the metal layer to shield the SHIC from electromagnetic interference at a desired frequency.

[0007] In some embodiments, the magnetic paste may include metallic flakes, and the size of the metallic flakes corresponds to the desired frequency of the electromagnetic interference. The AC impedance of the SHIC may exceed 1000 ohms. In some embodiments, the magnetic paste may include flakes of different sizes. The flakes may include at least one of nickel, iron, and cobalt. The magnetic film may include at least one of nickel, iron, cobalt, zirconia, and tantalum. The magnetic film may also be formed on the sidewalls of one or more vias.

[0008] The SHIC may include a flexible core. The SHIC may include a magnetic film formed on one or more sides of the flexible core. The SHIC may include a polymer layer formed on the magnetic film. The SHIC may include a metal layer formed on the polymer layer. The SHIC may include a magnetic paste that may include a metal foil disposed on one or more sides of the SHIC.

[0009] In some embodiments, the magnetic paste may be applied with a thickness of about 100 micrometers. The magnetic paste may be selected to provide an AC impedance associated with a frequency range of about 200 MHz to about 1000 MHz. The flexible core may comprise polyimide. The metal foil may be about 10 nanometers to about 10 micrometers. The AC impedance may exceed 100 ohms in the 100 to 1000 MHz band. The AC impedance may exceed 100 ohms, and the total thickness of the SHIC may be less than 0.2 mm.

[0010] A method for forming a SHIC may include the step of forming a magnetic film on a carrier core. The method may include the step of forming a polymer layer on the magnetic film. The method may include the step of forming a metal layer on at least a portion of the polymer layer. The method may include the step of applying a magnetic paste to at least one side of the SHIC.

[0011] In some embodiments, the metal layer may comprise at least one of copper, silver, and nickel. The magnetic film may be deposited via sputtering. The magnetic film may comprise a cobalt alloy deposited using physical vapor deposition. The vias may have a diameter of about 25 micrometers. A metal paste is applied to one or more sides of the SHIC with a thickness of about 100 micrometers. Brief explanation of the drawing

[0012] FIG. 1 illustrates a flowchart of a method for forming ferrite beads according to specific embodiments. FIGS. 2a to 2g show the process flow of a method for forming ferrite beads according to specific embodiments. FIG. 3 illustrates a cross-sectional view of a ferrite bead having an air gap according to specific embodiments. FIG. 4a illustrates a toroidal inductor having four windings according to specific embodiments. FIG. 4b illustrates a toroidal inductor having six windings according to specific embodiments. FIG. 4c illustrates a toroidal inductor having four angled windings according to specific embodiments. FIG. 4d illustrates a toroidal inductor having four windings according to specific embodiments. FIG. 4e illustrates a toroidal inductor having four angled windings according to specific embodiments. FIG. 5 illustrates a ferrite bead comprising a magnetic paste according to a specific embodiment. FIG. 6 illustrates an exemplary computer system in which various embodiments can be implemented. Specific details for implementing the invention

[0013] Voltage regulators integrated with magnetic devices can be critical components of current and future electronic devices, such as high-performance computing systems, mobile processors in smartphones, or any mixed-signal system. These systems may rely on advanced system packaging technologies, such as more traditional multi-chip packaging featuring heterogeneous chiplet integration on interposers and substrates or surface-assembled on embedded components. High-speed switching circuits can induce noise within the system, some of which is radiated as near-field or far-field electromagnetic fields. Some of this noise can propagate through the system in a conduction mode along power transmission lines. This noise can be filtered or blocked through various approaches, such as utilizing EMI filter inductors (e.g., ferrite beads or ferrite wraps around current-carrying coils), electromagnetic bandgap (EBG) structures, or metamaterial structures like frequency-selective surfaces.

[0014] EMI filter inductors can possess various properties, including high inductance to form high impedance, low DC resistance to prevent DC power loss, high AC loss to generate additional impedance from loss tangents, and an overall design that can be flat and compact. EMI filter inductors can also handle high currents without inducing a radiation field and can dissipate heat generated during operation. These inductors can be manufactured from a single magnetic material. However, manufacturing from a single magnetic material limits the scalability of the inductors' impedance and may not be able to utilize the additional advantages of other materials. When multiple materials are utilized, impedances from their intrinsic characteristics can be effectively combined. For example, thin-film magnetic cores can maintain high permeability and generate high inductance or impedance. When combined with thick magnetic particles of various shapes, additional impedance can be influenced by other loss contributions from eddy currents that generate higher impedance or by utilizing their ferromagnetic resonance. The systems and methods described herein may utilize combinations of magnetic films to create scalable impedance devices in a small form factor.

[0015] A specific combination of thin magnetic films as inner layers and thick magnetic films as outer layers is particularly advantageous because the inner layers obtain impedance from high permeability at high frequencies. The inner layers can be wrapped in windings to provide high inductance. On the other hand, the outer layers can further increase impedance through FMR and other loss contributions. The intrinsic field anisotropy derived from the particle size, composition, and structure determines the ferromagnetic resonance. Peak impedance can be reached at FMR. By selecting the particle size and chemical properties, peak AC impedance can be achieved in a narrow or broadband. The outer layers also provide shielding. This shielding can prevent radiated noise that leaks to adjacent components, causing malfunctions or other electromagnetic compatibility issues.

[0016] One way to increase the inductance of an integrated inductor is to increase the number of windings (typically copper) contained within the inductor. However, as the number of windings increases, resistance also increases. Furthermore, the amount of current ripple or drift can also increase. Minimizing the number of copper windings in an integrated inductor can resolve some of these issues. The maximum current an inductor can handle is directly proportional to the reluctance of the magnetic core, whereas inductance is inversely proportional to reluctance. Reluctance is directly proportional to the length of the core and inversely proportional to the cross-sectional area. Toroidal inductors with an air gap can provide the lowest reluctance and high inductance. A relatively thick magnetic core can further increase inductance without increasing the footprint or coil length of the inductors. To form these inductors, nanomagnetic films (sometimes "magnetic films") can be deposited on multiple sides of a flexible core to form an integrated scalable high-impedance component (SHIC). The flexible core may include cavities or vias passing through the flexible core. An isolation layer of the SHIC can then be formed, and the SHIC can be planarized. Subsequently, a metal layer can be formed on the SHIC (e.g., via plating). This process can offer several advantages. For example, the process (or "SHIC approach") can eliminate several integration problems associated with patterning toroidal inductors with air gaps because the vias are perforated before the metal layer is formed. The process can also improve throughput due to multi-sided sputtering. Inductors formed from the above process can offer performance advantages, such as higher current handling and efficiency, partly due to multi-sided deposition.

[0017] Inductors formed via the SHIC approach can be used as ferrite beads. It should be understood that any reference to ferrite beads in this specification may include any type of integrated scalable high-impedance component. Ferrite beads can passively filter EMI over a wide frequency range. That is, ferrite beads can shield other components within an electronic device from EMI (e.g., noise generated by a PMIC). While inductors formed via the SHIC approach can shield some EMI, the effectiveness of the inductor as a ferrite bead can be substantially increased by applying magnetic paste to one or more sides of the ferrite bead. The magnetic paste may contain particles that increase the alternating current (AC) impedance of the ferrite bead within a specific frequency range. Thus, the ferrite bead can be tuned, at least partially, by selecting a magnetic paste having specific components to provide stronger shielding against EMI at a desired frequency.

[0018] Ferrite beads may require high AC impedance while maintaining low DC resistance. AC impedance can result from inductance and core losses. DC resistance can be reduced by minimizing copper length. By utilizing combinations of materials to improve both inductance and losses, high AC impedance can be achieved with low DC resistance. Scalable High Impedance Components (SHICs) can achieve this using thin cores, high-permeability films on the cores, and high-magnetic-loss overlaps on the thin cores. Impedances of hundreds of ohms can be achieved with very small thicknesses and low DC resistance of tens of milliohms.

[0019] FIG. 1 illustrates a flowchart of a method (100) for forming SHIC according to specific embodiments. The steps of the method (100) may be performed in a different order than shown in FIG. 1 and / or may be combined with other steps of the method (100). In some embodiments, some of the steps of the method (100) may be skipped entirely. While some embodiments refer to ferrite beads, it should be understood that the methods and systems described herein may be applied to any SHIC.

[0020] In step 102, the method (100) may include forming a magnetic film (206) on a flexible core (202). In FIG. 2a, a flexible core (202) may be provided. The flexible core (202) may be a carrier core. The flexible core (202) may comprise polyimide, molypermalloy powder cores, High Flux, kool Mu® / Sendust, or other suitable core materials. The flexible core (202) may have a thickness of about 15 μm, about 20 μm, about 30 μm, about 35 μm, or about 40 μm. The flexible core (202) may be a "pre-fabricated" product or may be manufactured as part of the method (100). During the manufacturing process, the flexible core (202) may be supported by a framework, a grid frame, or other suitable device. The framework may provide a template for features to be formed on the flexible core (202), such as patterning for deposition or etching processes, guide holes for perforation or ablation, and / or any other such processes.

[0021] As illustrated in FIG. 2b, first vias (204) may be formed within the flexible core (202). The first vias (204) may be formed using a laser, mechanical perforation, or through an etching and / or ablation process. The first vias (204) may have diameters of about 10 μm, about 15 μm, about 20 μm, about 25 μm, about 30 μm, about 40 μm, about 50 μm, about 60 μm, and / or about 70 μm. In some embodiments, all first vias (204) have the same diameter. In other embodiments, the first vias (204) may have different diameters. In any case, the first vias (204) may extend through the top and bottom sides of the flexible core (202).

[0022] As illustrated in FIG. 2c, a magnetic film (206) may be formed on a plurality of sides of a flexible film (202). The magnetic film (206) may be formed on the sidewalls of the first vias (204). The magnetic film may be deposited with a thickness of about 10 μm, about 15 μm, about 20 μm, about 25 μm, or about 30 μm. The magnetic film (206) may comprise nickel, iron, cobalt, zirconia, tantalum, and / or any other suitable material. The magnetic film (206) may comprise a single material, or may comprise combinations and alloys of any or all of the aforementioned materials. In some embodiments, the magnetic film (206) may be formed by sputtering one or more materials onto a flexible core (202). In other embodiments, the magnetic film (206) may be formed by physical vapor deposition (PVD), atomic layer deposition (ALD), or any other type of deposition. In some embodiments, an oxide layer may be formed on the magnetic film (206). The oxide layer may function as a dielectric and help isolate the magnetic film (206) from other layers of the inductor.

[0023] In step 104, the method (100) may include forming a polymer layer (208) on a magnetic film (206) as illustrated in FIG. 2d. The polymer layer (208) may be formed with a thickness of about 5 μm, about 10 μm, about 15 μm, or about 20 μm. The polymer layer (208) may be formed on the top and bottom sides of the flexible core (202). The polymer layer (208) may also be formed within the first vias (204). The polymer layer (208) may completely or partially fill some or all of the first vias (204). Thus, the polymer layer (208) can isolate the flexible core (202) and the magnetic film (206). The flexible core (202) and the magnetic film (206) can therefore be considered as the magnetic core of an inductor.

[0024] The polymer layer (208) may comprise one or more polymers or other suitable materials. The polymer layer (208) may comprise dielectric materials such as polypropylene, cyclic transparent optical fluoropolymer (CYTOP), polypropylene-co-1-butene, or other suitable polymers and / or materials. The polymer layer (208) may flatten the magnetic film (206). For example, forming the magnetic film (206) may create imperfections or non-uniform surfaces. The polymer layer (208) may be formed so that imperfections are filled and / or the surface of the polymer layer (208) is flat.

[0025] In some embodiments, the method may include forming second vias (209) through a polymer layer (208), as illustrated in FIG. 2e. The second vias (209) may pass through the same path as the first vias (204) corresponding to the first vias (204). Thus, each of the second vias (209) may be a cavity surrounded by a dielectric layer (e.g., polymer layer (208)) and a magnetic film (206). The second vias (209) may be formed using a laser, mechanical perforation, or through an etching and / or ablation process. The second vias (209) may have a diameter of about 10 μm, about 15 μm, about 20 μm, about 25 μm, about 30 μm, about 40 μm, and / or about 50 μm.

[0026] In step 106, the method (100) may include forming a metal layer (210) on at least a portion of the polymer layer (208), as illustrated in FIG. 2f. The metal layer (210) may comprise copper, silver, nickel, and / or any other suitable metal. The metal layer (210) may be formed through PVD, ALD, sputtering, or other suitable deposition processes. The metal layer (210) may additionally or alternatively be formed through an electroplating process. The metal layer (210) may be formed with a thickness of about 5 μm, about 10 μm, about 15 μm, about 20 μm, or about 30 μm.

[0027] A metal layer (210) may be formed on the top and bottom sides of the inductor and within the second vias (209) so that the second vias (209) are only completely filled. The metal layer (210) may thus form windings (e.g., copper windings) surrounding a magnetic core (e.g., flexible core (202) and magnetic film (206)). The windings and the magnetic core may form components of the inductor (e.g., the ferrite bead (300) of FIG. 3). A polymer layer (208) may isolate the magnetic core from the windings, thereby improving the performance of the inductor. In some embodiments, the windings may form a toroidal shape. As previously mentioned, a toroidal shape may provide greater inductance and / or other performance metrics of the inductor.

[0028] In step 108, the method (100) may include applying a magnetic paste (212) to an inductor as illustrated in FIG. 2g. The magnetic paste (212) may include flakes of material suspended in a paste or slurry. The magnetic paste (212) may include graphene, silver, and / or other suitable materials. The flakes may include nickel, iron, cobalt, iron, and / or any alloys thereof. The flakes may be in a size range of about 10 nm to about 20 μm, including boundary values. The magnetic paste (212) may include homogeneous flakes of the same size or may include a mixture of any flake size and material.

[0029] The magnetic paste (212) can be selected based on the desired frequency of the EMI to be shielded, at least partially. For example, EMI of a specific frequency may be incident on an electronic device. The inductor may then be selected for its inductance at that specific frequency. The magnetic paste (212) may then be selected to increase the AC impedance of the inductor (i.e., effective shielding at a specific frequency such as about 200 MHz to 1000 MHz). The magnetic paste (212) may then be applied to the inductor to create ferrite beads.

[0030] The magnetic paste (212) may be applied to the inductor with a thickness of about 80 μm, about 90 μm, about 100 μm, about 120 μm, or about 150 μm. The magnetic paste (212) may be applied to both sides of the inductor as shown in FIG. 2g, or to only one side. In some embodiments, the magnetic paste (212) may be applied in different areas with different thicknesses. For example, the magnetic paste (212) may be applied to the top side of the inductor with 100 μm and to the bottom side of the inductor with 50 μm. Furthermore, different magnetic pastes (e.g., thin sheets of different sizes and / or magnetic pastes having different materials) may be applied to different sides of the inductor.

[0031] Additionally or alternatively, one or more multilayer shielding structures may be applied to the magnetic paste (212) and / or the inductor. The multilayer shielding structures may comprise one or more layers of metals such as nickel, iron, copper, cobalt, tantalum, aluminum, and other such metals. The multilayer shielding structures may comprise alternating layers of metals or a single layer of a single metal. The layers of the multilayer shielding structure may be selected based on the desired frequency of EMI to be shielded, at least partially. The multilayer shielding structure may be applied to the inductor on the magnetic paste (212) or placed on the inductor instead of the magnetic paste (212).

[0032] FIG. 3 illustrates a cross-sectional view of a ferrite bead (300) having an air gap (305) according to specific embodiments. The ferrite bead (300) may be formed by a process such as that described in connection with the method (100) of FIG. 1 and FIG. 2a through 2f. Thus, the ferrite bead (300) may include similar characteristics and components described therein. The ferrite bead (300) may include a flexible core (302), a magnetic film (304), an insulating layer (306), metal paths (308a-c), a metal layer (310), and a magnetic paste (212). The flexible core (302) and the magnetic film (304) may form the magnetic core of the ferrite bead (300). The flexible core (302) may include polyimide and / or any other suitable material for forming the flexible core. The flexible core (302) may include a core thickness (302a). The core thickness (302a) may be about 30 μm. In other embodiments, the core thickness (302a) may be about 15 μm, about 20 μm, about 35 μm, or about 40 μm.

[0033] The magnetic film (304) may comprise nickel, iron, cobalt, zirconia, tantalum, and / or any other suitable material. The magnetic film (304) may comprise a single material, or any or all of the aforementioned materials and combinations and alloys (e.g., cobalt alloy). The magnetic film (304) may comprise a film thickness (304a). The film thickness (304a) may be about 15 μm. In other embodiments, the film thickness (304a) may be about 10 μm, about 20 μm, about 25 μm, or about 30 μm.

[0034] The magnetic core of the ferrite bead (300) (i.e., the flexible core (302) and the magnetic film (304)) may be substantially round. The magnetic core may also include an air gap (305). The air gap (305) may be formed in the flexible core (302) before forming the magnetic film (304). The air gap (305) may be formed through etching, laser cutting ablation, or any other suitable method. In relation to FIG. 3, the magnetic core may extend inward to form a partial disk. The two sides of the magnetic core shown in FIG. 3 may therefore be a single segment, and the air gap (305) is on one side of the partial disk. A top-down view of a similar magnetic core can be seen in FIG. 4d. The air gap (305) may have a width of about 120 μm. In other embodiments, the air gap (305) may have a width of about 80 μm, about 90 μm, about 100 μm, about 150 μm, or about 200 μm.

[0035] The isolation layer (306) may be similar to the polymer layer (208) of FIGS. 2c through 2f. The isolation layer (306) may therefore include a dielectric material as described above. The isolation layer (306) may also include an oxide formed on the magnetic film (304). The isolation layer (306) may fill the air gap (305). In some embodiments, the air gap (305) may not include the isolation layer (306). The isolation layer (306) may include a dielectric thickness (306a). The dielectric thickness (306a) may be about 10 μm. In other embodiments, the dielectric thickness (306a) may be about 5 μm, about 15 μm, or about 20 μm. The isolation layer (306) may have the same dielectric thickness (306a) in all regions and may be uniform. In other embodiments, the isolation layer (306) may include different dielectric thicknesses (306a) in different regions (for example, the dielectric thickness within the air gap (305) may be different from the dielectric thickness on the bottom side of the ferrite bead (300)).

[0036] The metal paths (308a-c) may contain copper and may extend through the top and bottom sides of the magnetic core and the isolation layer (306). The metal paths (308a-c) may contain a via width (318). The via width (318) may be about 36 μm. In other embodiments, the via width (318) may be about 20 μm, about 30 μm, about 40 μm, or about 50 μm. The metal paths (308a-c) may be formed as part of the metal layer (310) and / or may be connected to the metal layer. The metal layer (310) may also contain copper. The metal layer (310) may have a metal thickness (310a) of about 15 μm. In other embodiments, the metal thickness (310a) may be about 5 μm, about 10 μm, about 20 μm, or about 30 μm.

[0037] The metal paths (308a-c) and the metal layer (310) can form copper windings around the magnetic core. The copper windings can pass through vias or cavities passing through the magnetic core and the isolation layer (306). As previously mentioned, the magnetic core may be a disk (or partial disk). Thus, the copper windings may form a toroid with respect to the magnetic core. That is, the ferrite bead (300) may include a toroidal inductor and an air gap (305). Thus, the ferrite bead (300) may have better inductance and lower current ripple and DC resistance compared to other inductors.

[0038] The magnetic paste (312) may be similar to the magnetic paste (212) of FIG. 2g. Thus, the magnetic paste (312) may contain metal flakes suspended within the material. The magnetic paste (312) may be selected based on the desired frequency of EMI to be shielded at least partially. The magnetic paste (312) may be applied to a toroidal inductor with a paste thickness (312a). The paste thickness (312a) may be about 100 μm. In other embodiments, the paste thickness (312a) may be about 80 μm, about 90 μm, about 120 μm, or about 150 μm. In some embodiments, the ferrite bead (300) may include a multilayer shielding structure as described in FIG. 2g. The multilayer shielding structure may be included in the ferrite bead (300) instead of or in addition to the magnetic paste (312).

[0039] The ferrite bead (300) may have an AC impedance of more than 100 ohms at a frequency of about 100 MHz to about 1000 MHz or higher. The ferrite bead (300) may have an AC impedance of more than 100 ohms while having a total thickness of less than 0.2 mm.

[0040] FIG. 4a illustrates a toroidal inductor (400) having four windings (404a-d) according to specific embodiments. The toroidal inductor (400) may be similar to the ferrite bead (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (400) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (400) may include a magnetic core (402) and windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0041] The windings (404a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the windings (404a-d) may be spaced every 90° with respect to the magnetic core (402). One or more of the windings (404a-d) (e.g., winding (404b)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the windings (404a-d) so that the toroidal inductor (400) operates according to the design (e.g., as a high-switching regulator).

[0042] FIG. 4b illustrates a toroidal inductor (401) having six windings (404a-f) according to specific embodiments. The toroidal inductor (401) may be similar to the ferrite bead (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (401) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (401) may include a magnetic core (402) and windings (404a-f). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0043] The windings (404a-f) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the windings (404a-f) may be spaced every 60° with respect to the magnetic core (402). One or more of the windings (404a-f) (e.g., winding (404b)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the windings (404a-f) so that the toroidal inductor (400) operates according to the design (e.g., as a high-switching regulator).

[0044] FIG. 4c illustrates a toroidal inductor (403) having four angled windings (404a-d) according to specific embodiments. The toroidal inductor (403) may be similar to the ferrite bead (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (403) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (403) may include a magnetic core (402) and angled windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0045] The angled windings (404a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the angled windings (404a-d) may be placed every 60° with respect to the magnetic core (402). One or more of the angled windings (404a-d) (e.g., angled winding (404a)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the angled windings (404a-d) so that the toroidal inductor (400) operates according to the design (e.g., as a high-speed switching regulator).

[0046] The angled windings (404a-d) may include a first arm (406a) and a second arm (406b). Although the first arm (406a) and the second arm (406b) are shown only on the angled winding (404c), it should be understood that all of the angled windings (404a-d) may include the first arm and the second arm. The first arm (406a) and the second arm (406b) may meet to form an angle (416). The angle (416) may be within the range of about 60° to about 120°, including boundary values. The first arm (406a) and the second arm (406b) may increase the surface area of ​​the angled winding (404c) and / or the total length of the angled winding (404c). Therefore, the toroidal inductor (403) can exhibit different operating characteristics (e.g., operating frequency, inductance, reluctance, etc.) from other inductors.

[0047] FIG. 4d illustrates a toroidal inductor (405) having four windings (404a-d) according to specific embodiments. The toroidal inductor (405) may be similar to the ferrite bead (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (405) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (405) may include a magnetic core (402) and windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0048] The magnetic core (402) may also include an air gap (412). The air gap (412) may be similar to the air gap (305) of FIG. 3. Thus, the air gap (412) may be formed as part of the production process of the flexible core and / or may be formed through an etching process, a cutting process (e.g., laser cutting), ablation, or any other suitable method.

[0049] The windings (404a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the windings (404a-d) may be spaced every 90° with respect to the magnetic core (402). One or more of the windings (404a-d) (e.g., winding (404b)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the windings (404a-d) so that the toroidal inductor (405) operates according to the design (e.g., as a high-speed switching regulator).

[0050] FIG. 4e illustrates a toroidal inductor (407) having four angled windings (404a-d) according to specific embodiments. The toroidal inductor (407) may be similar to the ferrite bead (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (407) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (407) may include a magnetic core (402) and angled windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0051] The magnetic core (402) may also include an air gap (412). The air gap (412) may be similar to the air gap (305) of FIG. 3. Thus, the air gap (412) may be formed as part of the production process of the flexible core and / or may be formed through an etching process, a cutting process (e.g., laser cutting), ablation, or any other suitable method. As shown in FIG. 4e, the air gap (412) may include a magnetic paste (408). The magnetic paste (408) may allow the toroidal inductor (407) to be tuned for various applications (e.g., ferrite beads, noise chokes, voltage regulators, etc.). The magnetic paste (408) may include iron, silver, graphene, cobalt, nickel, and / or any other suitable material.

[0052] The angled windings (404a-d) may include a first arm (406a) and a second arm (406b). Although the first arm (406a) and the second arm (406b) are shown only on the angled winding (404c), it should be understood that all of the angled windings (404a-d) may include the first arm and the second arm. The first arm (406a) and the second arm (406b) may meet to form an angle (416). The angle (416) may be within the range of about 60° to about 120°, including boundary values. The first arm (406a) and the second arm (406b) may increase the surface area of ​​the angled winding (404c) and / or the total length of the angled winding (404c). Therefore, the toroidal inductor (403) can exhibit different operating characteristics (e.g., operating frequency, inductance, reluctance, etc.) from other inductors.

[0053] It should be understood that FIGS. 4a through 4e are provided merely as examples. Any toroidal inductor features depicted in any of FIGS. 4a through 4e may be combined with any other toroidal inductor features. A person skilled in the art will recognize a number of different configurations and possibilities.

[0054] FIG. 5 shows a ferrite bead (500) comprising a magnetic paste (512) according to specific embodiments. The ferrite bead (500) may include a toroidal inductor such as the toroidal inductor (400) of FIG. 4a. Accordingly, the ferrite bead (500) may include a magnetic core (502), windings (504a-d), and a magnetic paste (512). The windings (504a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (502). For example, the windings (504a-d) may be spaced every 90° with respect to the magnetic core (502). One or more of the windings (504a-d) (e.g., winding (504b)) may be connected to a power source (not shown).

[0055] The magnetic paste (512) can be applied to the top and bottom sides of the ferrite bead (500), as illustrated in FIG. 5. The magnetic paste (512) can be applied with a thickness of about 100 μm. The magnetic paste (512) can be selected based on the desired frequency of the EMI to be shielded, at least partially. The flake size (or particle size) can affect the AC impedance provided by the magnetic paste. For example, the frequency of the EMI to be shielded may be within the range of about 1 MHz to about 10 MHz. In this case, the magnetic paste (512) may contain large microparticles (e.g., 10 μm). In another example, the frequency of the EMI to be shielded may be within the range of about 100 MHz to about 500 MHz. In this case, the magnetic paste (512) may contain submicron particles (e.g., 400 nm). In another example, the frequency of the EMI to be shielded may be within the range of about 500 MHz to about 1500 MHz. In this case, the magnetic paste (512) may contain nanoparticles (e.g., 10 nm). A person skilled in the art will recognize many different possibilities and configurations. Although FIG. 5 is illustrated as including a toroidal inductor similar to the toroidal inductor (400), it should be understood that the ferrite bead (500) may include any inductor described herein having any number of windings and / or including an air gap.

[0056] FIG. 6 illustrates an exemplary computer system (600) in which various embodiments may be implemented. The system (600) may be used to implement any of the aforementioned computer systems. As illustrated in the drawing, the computer system (600) includes a processing unit (604) that communicates with a plurality of peripheral subsystems via a bus subsystem (602). These peripheral subsystems may include a processing acceleration unit (606), an I / O subsystem (608), a storage subsystem (618), and a communication subsystem (624). The storage subsystem (618) includes a type of computer-readable storage medium (622) and a system memory (610).

[0057] The bus subsystem (602) provides a mechanism that enables various components and subsystems of the computer system (600) to communicate with each other as intended. Although the bus subsystem (602) is schematically illustrated as a single bus, alternative embodiments of the bus subsystem may utilize multiple buses. The bus subsystem (602) may be any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, and a local bus using any of various bus architectures. For example, these architectures may include an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MCA) bus, an Enhanced ISA (EISA) bus, a Video Electronics Standards Association (VESA) local bus, and a Peripheral Component Interconnect (PCI) bus, which may be implemented as a mezzanine bus manufactured to the IEEE P1386.1 standard.

[0058] A processing unit (604) (e.g., a conventional microprocessor or microcontroller) that can be implemented as one or more integrated circuits controls the operation of the computer system (600). One or more processors may be included in the processing unit (604). These processors may include single-core or multi-core processors. In certain embodiments, the processing unit (604) may be implemented as one or more independent processing units (632 and / or 634) having a single-core or multi-core processor included in each processing unit. In other embodiments, the processing unit (604) may also be implemented as a quad-core processing unit formed by integrating two dual-core processors into a single chip.

[0059] In various embodiments, the processing unit (604) may execute various programs in response to program code and may maintain a number of concurrently executed programs or processes. At any given time, part or all of the program code to be executed may reside within the processor(s) (604) and / or the storage subsystem (618). Through suitable programming, the processor(s) (604) may provide the various functions described above. The computer system (600) may further include a processing acceleration unit (606) which may include a digital signal processor (DSP), a special purpose processor, etc.

[0060] The I / O subsystem (608) may include user interface input devices and user interface output devices. User interface input devices may include pointing devices such as keyboards, mice, or trackballs, touchpads or touchscreens integrated into a display, audio input devices having scroll wheels, click wheels, dials, buttons, switches, keypads, voice command recognition systems, microphones, and other types of input devices. User interface input devices may include, for example, motion detection and / or gesture recognition devices that allow a user to control and interact with input devices through a natural user interface using gestures and voice commands. Additionally, user interface input devices may include voice recognition detection devices that allow a user to interact with a voice recognition system through voice commands.

[0061] User interface input devices may also, without limitation, include three-dimensional (3D) mice, joysticks or pointing sticks, gamepads and graphic tablets, and audio / visual devices such as speakers, digital cameras, digital camcorders, portable media players, webcams, image scanners, fingerprint scanners, barcode readers, 3D scanners, 3D printers, laser rangefinders, and eye-tracking devices. Additionally, user interface input devices may include medical imaging input devices, such as computed tomography, magnetic resonance imaging, positional emission tomography, and medical ultrasound devices. User interface input devices may also include audio input devices, such as MIDI keyboards, digital instruments, etc.

[0062] User interface output devices may include non-visual displays such as display subsystems, indicator lights, or audio output devices. Display subsystems may be flat-panel devices, projection devices, touch screens, etc., such as using a cathode ray tube (CRT), liquid crystal display (LCD), or plasma display. Generally, the term “output device” is intended to include all types of devices and mechanisms that can be used to output information from a computer system (600) to a user or another computer. For example, user interface output devices may include, without limitation, various display devices that visually convey text, graphics, and audio / video information, such as monitors, printers, speakers, headphones, car navigation systems, plotters, voice output devices, and modems.

[0063] The computer system (600) may include a storage subsystem (618) containing software elements described as being located in the current system memory (610). The system memory (610) may store program instructions that are loadable and executable on the processing unit (604), as well as data generated during the execution of these programs.

[0064] Depending on the configuration and type of the computer system (600), the system memory (610) may be volatile (e.g., Random Access Memory (RAM)) and / or non-volatile (e.g., Read-Only Memory (ROM), flash memory, etc.). RAM typically contains data and / or program modules that are immediately accessible by the processing unit (604) and / or are currently operating and executing. In some implementations, the system memory (610) may contain a number of different types of memory, such as static random access memory (SRAM) or dynamic random access memory (DRAM). In some implementations, for example, during startup, a basic input / output system (BIOS) containing basic routines that help transfer information between elements within the computer system (600) may typically be stored in ROM. As an example not limited to, system memory (610) also exemplifies application programs (612) that may include program data (614) and an operating system (616), such as client applications, web browsers, intermediate layer applications, relational database management systems (RDBMS), etc.

[0065] The storage subsystem (618) may also provide a computer-readable storage medium of a type that stores basic programming and data configurations that provide the functionality of some embodiments. Software (programs, code modules, instructions) that provides the aforementioned functionality when executed by a processor may be stored in the storage subsystem (618). These software modules or instructions may be executed by the processing unit (604). The storage subsystem (618) may also provide a storage for storing data used according to some embodiments.

[0066] The storage subsystem (600) may also include a computer-readable storage medium reader (620) that may be additionally connected to the computer-readable storage medium (622). Together and optionally, in combination with the system memory (610), the computer-readable storage medium (622) may comprehensively represent a combination of remote, local, fixed, and / or removable storage devices and storage media for temporarily and / or more permanently containing, storing, transmitting, and retrieving computer-readable information.

[0067] A computer-readable storage medium (622) comprising code, or parts of code, may also include any suitable medium, including, but not limited to, storage and communication media, such as volatile and non-volatile, removable and non-removable media, implemented by any method or technique for storing and / or transmitting information. This may include a computer-readable storage medium of the type such as RAM, ROM, EEPROM (electronically erasable programmable ROM), flash memory or other memory technology, CD-ROM, DVD (digital versatile disk), or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or other types of tangible computer-readable media. This may also include a nontangible computer-readable medium, such as any other medium that can be used to transmit data signals, data transmission or desired information and is accessible by a computing system (600).

[0068] For example, a computer-readable storage medium (622) may include a hard disk drive that reads or writes from a non-removable non-volatile magnetic medium, a magnetic disk drive that reads or writes from a removable non-volatile magnetic disk, and an optical disk drive that reads and writes from a removable non-volatile optical disk, such as a CD-ROM, DVD, or other optical medium. A computer-readable storage medium (622) may include, but is not limited to, a flash memory card, a Universal Serial Bus (USB) flash drive, a secure digital (SD) card, a DVD disc, a digital video tape, etc. A computer-readable storage medium (622) may also include solid-state drives (SSDs) based on non-volatile memory, such as flash memory-based SSDs, enterprise flash drives, solid-state ROM, etc., solid-state RAM, dynamic RAM, static RAM, DRAM-based SSDs, magnetoresistive RAM (MRAM) SSDs, and hybrid SSDs using a combination of DRAM and flash memory-based SSDs. A disk drive and an associated computer-readable medium can provide non-volatile storage of computer-readable instructions, data structures, program modules, and other data for a computer system (600).

[0069] The communication subsystem (624) provides an interface to other computer systems and networks. The communication subsystem (624) serves as an interface for transmitting data from the computer system (600) to other systems and receiving data from them. For example, the communication subsystem (624) may enable the computer system (600) to connect to one or more devices via the Internet. In some embodiments, the communication subsystem (624) may include a radio frequency (RF) transceiver component for accessing a wireless voice and / or data network (e.g., cellular phone technology, advanced data network technology such as 3G, 4G, 6G or EDGE (enhanced data rates for global evolution)), WiFi (using the IEEE 802.6 family standard or other mobile communication technology or any combination thereof), a Global Positioning System (GPS) receiver component and / or other components. In some embodiments, the communication subsystem (624) may provide a wired network connection (e.g., Ethernet) in addition to or instead of the wireless interface.

[0070] In some embodiments, the communication subsystem (624) may also receive input communications in the form of structured and / or unstructured data feeds (626), event streams (628), event updates (630), etc., on behalf of one or more users who can use the computer system (600).

[0071] For example, the communication subsystem 624 may be configured to receive real-time data feeds 626 from social network and / or other communication service users, and to receive web feeds and / or real-time updates, such as Rich Site Summary (RSS) feeds, from one or more third-party information sources.

[0072] Additionally, the communication subsystem (624) may also be configured to receive data in the form of continuous data streams that may include event streams (628) and / or event updates (630) of real-time events, which may be essentially continuous or infinite without explicit endpoints. Examples of applications that generate continuous data may include, for example, sensor data applications, financial tickers, network performance measurement tools (e.g., network monitoring and traffic management applications), clickstream analysis tools, automotive traffic monitoring, etc.

[0073] The communication subsystem (624) may also be configured to output structured and / or unstructured data feeds (626), event streams (628), event updates (630), etc. to one or more databases capable of communicating with one or more streaming data source computers coupled to the computer system (600).

[0074] Because the characteristics of computers and networks are constantly changing, the description of the computer system (600) illustrated in the drawings is intended only as a specific example. Many other configurations are possible with more or fewer components than the system illustrated in the drawings. For example, customized hardware may also be used and / or specific elements may be implemented in hardware, firmware, software (including applets), or a combination thereof. Additionally, connections to other computing devices, such as network input / output devices, may be utilized. Based on the disclosures and teachings provided herein, other ways and / or methods for implementing various embodiments should be apparent.

[0075] In the foregoing description, numerous specific details have been presented for the purposes of explanation and to provide a thorough understanding of various embodiments. However, it will be apparent that some embodiments may be implemented without some of these specific details. In other cases, well-known structures and devices are illustrated in the form of block diagrams.

[0076] The foregoing description is merely intended to provide exemplary embodiments and is not intended to limit the scope, applicability, or configuration of the present disclosure. Rather, the foregoing description of various embodiments will provide possible disclosures for implementing at least one embodiment. It should be understood that various modifications may be made to the function and arrangement of elements without departing from the spirit and scope of some embodiments as set forth in the appended claims.

[0077] Specific details are provided in the foregoing description to provide a thorough understanding of the embodiments. However, it will be understood that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be illustrated as components in the form of block diagrams to avoid obscuring the embodiments with unnecessary details. In other cases, well-known circuits, processes, algorithms, structures, and technologies may be illustrated without unnecessary details to avoid obscuring the embodiments.

[0078] Additionally, it should be noted that individual embodiments may be described as processes illustrated as flowcharts, flow diagrams, data flow diagrams, structure diagrams, or block diagrams. While a flowchart may describe operations as a sequential process, many of the operations may be performed in parallel or simultaneously. Additionally, the order of the operations may be rearranged. A process terminates when its operations are completed, but it may have additional steps not included in the drawings. A process may correspond to a method, function, procedure, subroutine, subprogram, etc. When a process corresponds to a function, its termination may correspond to the function returning to the calling function or the main function.

[0079] The term “computer-readable medium” includes, but is not limited to, portable or fixed storage devices, optical storage devices, wireless channels, and various other media capable of storing, containing, or carrying instruction(s) and / or data. Code segments or machine-executable instructions may represent any combination of procedures, functions, subprograms, programs, routines, subroutines, modules, software packages, classes, or instructions, data structures, or program statements. Code segments may be coupled to other code segments or hardware circuits by transmitting and / or receiving information, data, arguments, parameters, or memory contents. Information, arguments, parameters, data, etc. may be transmitted, forwarded, or transmitted through any suitable means, including memory sharing, message passing, token passing, network transmission, etc.

[0080] Additionally, embodiments may be implemented by hardware, software, firmware, middleware, microcode, hardware description languages, or any combination thereof. When implemented by software, firmware, middleware, or microcode, program code or code segments for performing necessary tasks may be stored on a machine-readable medium. Processor(s) may perform the necessary tasks.

[0081] In the foregoing specification, features are described with reference to specific embodiments thereof, but it should be recognized that not all embodiments are limited thereto. Various features and aspects of some embodiments may be used individually or together. Furthermore, embodiments may be utilized in any number of environments and applications other than those described herein without departing from the broader spirit and scope of this specification. Accordingly, the specification and drawings should be considered illustrative rather than restrictive.

[0082] Additionally, for the purpose of illustration, the methods have been described in a specific order. It should be understood that in alternative embodiments, the methods may be performed in a different order than described. It should also be understood that the foregoing methods may be performed by hardware components or implemented as sequences of machine-executable instructions, which may be used to enable a machine, such as a general-purpose or special-purpose processor or logic circuit programmed with instructions, to perform the methods. Such machine-executable instructions may be stored on one or more machine-readable media, such as CD-ROMs or other types of optical discs, floppy diskettes, ROMs, RAMs, EPROMs, EEPROMs, magnetic or optical cards, flash memory, or other types of machine-readable media suitable for storing electronic instructions. Alternatively, the methods may be performed by a combination of hardware and software.

[0083] In the foregoing description, numerous specific details have been presented for the purposes of explanation and to provide a thorough understanding of various embodiments. However, it will be apparent that some embodiments may be implemented without some of these specific details. In other cases, well-known structures and devices are illustrated in the form of block diagrams.

[0084] The foregoing description is merely intended to provide exemplary embodiments and is not intended to limit the scope, applicability, or configuration of the present disclosure. Rather, the foregoing description of various embodiments will provide possible disclosures for implementing at least one embodiment. It should be understood that various modifications may be made to the function and arrangement of elements without departing from the spirit and scope of some embodiments as set forth in the appended claims.

[0085] Specific details are provided in the foregoing description to provide a thorough understanding of the embodiments. However, it will be understood that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be illustrated as components in the form of block diagrams to avoid obscuring the embodiments with unnecessary details. In other cases, well-known circuits, processes, algorithms, structures, and technologies may be illustrated without unnecessary details to avoid obscuring the embodiments.

[0086] Additionally, it should be noted that individual embodiments may be described as processes illustrated as flowcharts, flow diagrams, data flow diagrams, structure diagrams, or block diagrams. While a flowchart may describe operations as a sequential process, many of the operations may be performed in parallel or simultaneously. Additionally, the order of the operations may be rearranged. A process terminates when its operations are completed, but it may have additional steps not included in the drawings. A process may correspond to a method, function, procedure, subroutine, subprogram, etc. When a process corresponds to a function, its termination may correspond to the function returning to the calling function or the main function.

Claims

Claim 1 A scalable high-impedance component (SHIC) comprising: a flexible polyimide core including one or more vias; a magnetic film formed on one or more sides of the flexible polyimide core; a polymer layer formed on the magnetic film, wherein the polymer layer isolates the magnetic film from the flexible polyimide core; a metal layer formed on the polymer layer and within the vias, wherein the metal layer forms a winding extending through the one or more vias; and a magnetic paste disposed on the metal layer to shield the SHIC from electromagnetic interference of a desired frequency. Claim 2 In claim 1, the magnetic paste comprises a material flake, and the size of the flake corresponds to the desired electromagnetic interference frequency, SHIC. Claim 3 In paragraph 2, the AC impedance of the SHIC exceeds 1000 ohms, SHIC. Claim 4 In paragraph 2, the magnetic paste comprises flakes of different sizes, SHIC. Claim 5 In paragraph 2, the above-mentioned flakes comprise at least one of nickel, iron, and cobalt, SHIC. Claim 6 In claim 1, the magnetic film comprises at least one of nickel, iron, cobalt, zirconia, and tantalum, SHIC. Claim 7 In claim 1, the magnetic film is also formed on the sidewalls of the one or more vias, SHIC. Claim 8 A scalable high-impedance component (SHIC) comprising: a flexible core; a magnetic film formed on one or more sides of the flexible core; a polymer layer formed on the magnetic film; a metal layer formed on the polymer layer; and a magnetic paste comprising metal flakes disposed on one or more sides of the SHIC. Claim 9 In claim 8, the magnetic paste is applied to a thickness of about 100 micrometers, SHIC. Claim 10 In claim 8, the magnetic paste is selected to provide an AC impedance associated with a frequency range of about 200 MHz to about 1000 MHz, SHIC. Claim 11 In claim 8, the flexible core comprises polyimide, SHIC. Claim 12 In claim 8, the metal flakes are SHIC, which is between about 10 nanometers and about 10 micrometers. Claim 13 In paragraph 8, the AC impedance is SHIC, which exceeds 100 ohms at 100-1000 MHz. Claim 14 In claim 8, the AC impedance exceeds 100 ohms, and the total thickness of the SHIC is less than 0.2 mm. Claim 15 A method for forming a SHIC, comprising the steps of: forming a magnetic film on a carrier core; forming a polymer layer on the magnetic film; forming a metal layer on at least a portion of the polymer layer; and applying a magnetic paste to at least one side of the SHIC. Claim 16 In claim 15, the method wherein the metal layer comprises at least one of copper, silver, and nickel. Claim 17 In paragraph 15, the method wherein the magnetic film is deposited through sputtering. Claim 18 In paragraph 15, the method wherein the magnetic film comprises a cobalt alloy and is deposited using physical vapor deposition. Claim 19 In paragraph 15, the vias comprise a diameter of about 25 micrometers, method. Claim 20 In paragraph 15, the method wherein the magnetic paste is applied to one or more sides of the SHIC with a thickness of about 100 micrometers.

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