Multifaceted magnetic film on thin-core inductors

Abstract

The inductor may include a flexible polyimide flexible core that may include one or more cavities. The inductor may include a magnetic film formed on two sides of the flexible polyimide flexible core and on each sidewall of each of the one or more cavities. The inductor may include a dielectric layer formed on the magnetic film. The inductor may also include a metal layer formed on the dielectric layer and within the cavities such that vias are formed on one or more sides of the inductor and extend through the one or more cavities.

Description

Technology Field

[0001] Cross-reference of related applications

[0002] This application claims the interest and priority of U.S. Regular Application No. 18 / 512,941, filed on November 17, 2023, titled “MULTISIDED MAGNETIC FILMS ON THIN CORE INDUCTORS”, the contents of which are incorporated herein by reference in their entirety for all purposes.

[0003] Technology field

[0004] The present technology relates to semiconductor systems, processes, and equipment. More specifically, the present technology relates to inductors and methods for manufacturing the same. Background Technology

[0005] Modern electronic devices require individual inductors to perform multiple functions. As the performance requirements of electronic devices increase, so does the need for inductors capable of providing high inductance relative to the space they occupy within the device. Furthermore, inductors also need to provide better performance in handling currents at the power levels and / or frequencies used in electronic devices. means of solving the problem

[0006] The inductor may include a flexible polyimide flexible core that may include one or more cavities. The inductor may include a magnetic film formed on two sides of the flexible polyimide flexible core and on each sidewall of each of the one or more cavities. The inductor may include a dielectric layer formed on the magnetic film. The inductor may also include a metal layer formed on the dielectric layer and within the cavities such that vias are formed on one or more sides of the inductor and extend through the one or more cavities.

[0007] In some embodiments, the magnetic film may comprise nickel, iron, cobalt, zirconia, and tantalum, hafnium, and silicon. The magnetic film may comprise an oxide of at least one of zirconium, tantalum, hafnium, and silicon. The magnetic film may comprise a plurality of layers of magnetic films and oxide films. Metal layers and vias form between two and five turns of the inductor, including boundary values. The inductor may include an air gap within a flexible polyimide core, and the air gap may have a width of about 48 micrometers to about 250 micrometers.

[0008] The inductor may include a polyimide flexible core. The inductor may include a magnetic film deposited on one or more sides of the flexible core. The inductor may include a dielectric layer. The inductor may further include a plurality of copper windings.

[0009] In some embodiments, the magnetic film may comprise at least one of cobalt, zirconia, and tantalum. The magnetic film may comprise an oxide layer. In some embodiments, a plurality of copper windings may form a toroidal shape. The toroid may comprise an air gap.

[0010] A method for forming an inductor may include forming a magnetic film on a flexible core. The method may also include forming a dielectric layer on the magnetic film. The method may then include forming a metal layer on at least a portion of the dielectric layer.

[0011] In some embodiments, first vias may be formed through the flexible core before depositing a magnetic film on the flexible core. The method may include depositing a metal layer on at least a portion of the dielectric layer to form second vias through the dielectric layer such that the metal path extends through at least one of the flexible core, the magnetic film, and the dielectric layer. The first vias may have a diameter of about 25 micrometers. The magnetic film has a thickness of about 10 micrometers. The magnetic film, the dielectric layer, and the metal seeding layer may be deposited sequentially in the same PVD sequence. The flexible core may comprise polyimide, glass, liquid crystal polymer, and fluoropolymer. The method may also include forming an air gap in the metal layer, and the air gap is filled with a high-content magnetic paste. Brief explanation of the drawing

[0012] FIG. 1 illustrates a flowchart of a method for forming an inductor according to specific embodiments. FIGS. 2a through 2f illustrate the process flow of a method for forming an inductor according to specific embodiments. FIG. 3 illustrates a cross-sectional view of an inductor having an air gap according to specific embodiments. FIG. 4a illustrates a toroidal inductor having four windings according to specific embodiments. FIG. 4b illustrates a toroidal inductor having six windings according to specific embodiments. FIG. 4c illustrates a toroidal inductor having four angled windings according to specific embodiments. FIG. 4d illustrates a toroidal inductor having four windings according to specific embodiments. FIG. 4e illustrates a toroidal inductor having four angled windings according to specific embodiments. FIG. 5 illustrates an exemplary computer system in which various embodiments can be implemented. Specific details for implementing the invention

[0013] Voltage regulators equipped with integrated magnetic elements can be critical components of current and future electronic devices for high-performance computing and communication systems. They are integrated with various system hardware integration architectures, such as System on a Chip (SOC) technology, advanced multichips, multichilets, or heterogeneous integrated packages, and other devices. Some or all of these devices may require high-frequency switching regulators for high-efficiency and granular power delivery, where power supply is optimized for each domain within the integrated circuit (IC). Generally available inductors may experience current ripple and / or DC losses at or near the operating frequency of these devices. The integrated inductors included in these devices can reduce current ripple and / or DC losses by utilizing multiphase switching close to the active circuits. One way to increase the inductance of an integrated inductor is to increase the number of windings (typically copper) included in the inductor. However, as the number of windings increases, resistance also increases. Furthermore, the amount of current ripple or drift may also increase. Minimizing the number of copper windings in integrated inductors can solve some of these problems.

[0014] High-performance inductors require excellent characteristics. These films are formed only with smaller thicknesses, and this smaller thickness makes them very inefficient. This is a major challenge facing the industry. To address this major challenge, we disclose unique multifaceted films on thin cores.

[0015] The maximum current that an inductor can handle is directly proportional to the reluctance of the magnetic core, whereas inductance is inversely proportional to reluctance. Reluctance is directly proportional to the length of the core and inversely proportional to the cross-sectional area. Toroidal inductors with an air gap can provide the lowest reluctance and high inductance. A relatively thick magnetic core can further increase inductance without increasing the footprint or coil length of the inductors. To form these inductors, nanomagnetic films (sometimes referred to as "magnetic films") can be deposited on multiple sides of a flexible core to form an integrated passive component. To control the thickness, these are deposited on thin substrate cores. (These are referred to as multi-faceted magnetic films on thin cores). The flexible core may include cavities or vias passing through the flexible core. Via can also be referred to as a type of cavity. Subsequently, an MTC having an isolation layer can be formed, and the MTC can be planarized. Then, a metal layer can be formed on the MTC (e.g., via plating). This process can provide several advantages. For example, the process (or "MTC approach") can eliminate several integration problems associated with patterning toroids with air gaps because vias are perforated before the metal layer is formed. The process can also improve throughput due to multi-sided sputtering. Inductors formed from the above process can provide performance advantages such as higher current handling and efficiency due in part to multi-sided deposition. Process advantages also include thicker copper plating on each side to produce lower DC resistance for higher current handling capability. The processes and devices disclosed herein can be used to produce inductors using this MTC approach, thereby producing inductors with improved performance (e.g., lower current ripple and DC resistance).

[0016] FIG. 1 illustrates a flowchart of a method (100) for forming an inductor according to specific embodiments. The steps of the method (100) may be performed in a different order than shown in FIG. 1 and / or may be combined with other steps of the method (100). In some embodiments, some of the steps of the method (100) may be skipped entirely.

[0017] In step 102, the method (100) may include forming a magnetic film (206) on a flexible core (202). In FIG. 2a, a flexible core (202) may be provided. The flexible core (202) may comprise polyimide, glass, liquid crystal polymer, fluoropolymer, molypermalloy powder cores, High Flux, kool Mu® / Sendust, or other suitable core materials. The flexible core (202) may have a thickness of about 15 μm, about 20 μm, about 30 μm, about 35 μm, or about 40 μm. The flexible core (202) may be a "pre-fabricated" product or may be manufactured as part of the method (100). During the manufacturing process, the flexible core (202) may be supported by a framework, a grid frame, or other suitable device. The framework may provide a template for features to be formed on the flexible core (202), such as patterning for deposition or etching processes, guide holes for perforation or ablation, and / or any other such processes.

[0018] As illustrated in FIG. 2b, first vias (204) may be formed within the flexible core (202). The first vias (204) may be formed using a laser, mechanical perforation, or through an etching and / or ablation process. The first vias (204) may have diameters of about 10 μm, about 15 μm, about 20 μm, about 25 μm, about 30 μm, about 40 μm, about 50 μm, about 60 μm, and / or about 70 μm. In some embodiments, all first vias (204) have the same diameter. In other embodiments, the first vias (204) may have different diameters. In any case, the first vias (204) may extend through the top and bottom sides of the flexible core (202).

[0019] As illustrated in FIG. 2c, a magnetic film (206) may be formed on a plurality of sides of a flexible film (202). A magnetic film (206) may be formed on the sidewalls of the first vias (204). The magnetic film may be deposited with a thickness of about 10 μm, about 15 μm, about 20 μm, about 25 μm, or about 30 μm. The magnetic film (206) may comprise nickel, iron, cobalt, zirconia, tantalum, and / or any other suitable material. The magnetic film (206) may comprise a single material, or may comprise combinations and alloys of any or all of the aforementioned materials. In some embodiments, the magnetic film (206) may be formed by sputtering one or more materials onto a flexible core (202). In other embodiments, the magnetic film (206) may be formed by other physical vapor deposition (PVD) techniques, such as e-beam evaporation, atomic layer deposition (ALD), or any other type of deposition. In some embodiments, multiple layers of the magnetic film (206) may be deposited via sputtering. Multiple layers of the magnetic film (206) may be interspersed with thin oxides of materials such as zirconia, silica, or others. In some embodiments, a single oxide layer may be formed on the magnetic film (206). The single oxide layer (206) may function as a dielectric and help isolate the magnetic film (206) from other layers of the inductor.

[0020] In step 104, the method (100) may include forming a dielectric layer (208) on a magnetic film (206) as illustrated in FIG. 2d. The dielectric layer (208) may comprise materials such as epoxy, polyimide, silicon, and / or siloxane. The dielectric layer (208) may be formed with a thickness of about 5 μm, about 10 μm, about 15 μm, or about 20 μm. The dielectric layer (208) may be formed on the top side and bottom side of the flexible core (202). The dielectric layer (208) may also be formed within the first vias (204). The dielectric layer (208) may completely or partially fill some or all of the first vias (204). Thus, the dielectric layer (208) can isolate the flexible core (202) and the magnetic film (206). The flexible core (202) and magnetic film (206) can therefore be considered as the magnetic core of the inductor.

[0021] The dielectric layer (208) may comprise one or more polymers or other suitable materials. The dielectric layer (208) may comprise a dielectric material such as polypropylene, cyclic transparent optical fluoropolymer (CYTOP), polypropylene-co-1-butene, or other suitable polymers and / or materials. The dielectric layer (208) may flatten the magnetic film (206). For example, forming the magnetic film (206) may create imperfections or non-uniform surfaces. The dielectric layer (208) may be formed so that imperfections are filled and / or the surface of the dielectric layer (208) is flat.

[0022] In some embodiments, the method may include forming second vias (209) through a dielectric layer (208), as illustrated in FIG. 2e. The second vias (209) may pass through the same path as the first vias (204) corresponding to the first vias (204). Thus, each of the second vias (209) may be a cavity surrounded by a dielectric layer (e.g., dielectric layer (208)) and a magnetic film (206). The second vias (209) may be formed using a laser, mechanical perforation, or through an etching and / or ablation process. The second vias (209) may have a diameter of about 10 μm, about 15 μm, about 20 μm, about 25 μm, about 30 μm, about 40 μm, and / or about 50 μm.

[0023] In step 106, the method (100) may include forming a metal layer (210) on at least a portion of the dielectric layer (208), as illustrated in FIG. 2f. The metal layer (210) may comprise copper, silver, nickel, and / or any other suitable metal. The metal layer (210) may be formed through PVD, ALD, sputtering, and / or other suitable deposition processes. The metal layer (210) may additionally or alternatively be formed through an electroplating process. For example, the metal layer (210) may be formed by depositing a metal seeding layer via PVD and then electroplating the metal layer (210) on the metal seeding layer. The metal layer (210) may be formed with a thickness of about 5 μm, about 10 μm, about 15 μm, about 20 μm, or about 30 μm.

[0024] A metal layer (210) may be formed on the top and bottom sides of the inductor and within the second vias (209) so that the second vias (209) are only completely filled. The metal layer (210) may thus form windings (e.g., copper windings) surrounding a magnetic core (e.g., flexible core (202) and magnetic film (206)). The windings and the magnetic core may form components of an inductor (e.g., the inductor (200) of FIG. 3). A dielectric layer (208) may isolate the magnetic core from the windings, thereby improving the performance of the inductor. In some embodiments, the windings may form a toroidal shape. As previously mentioned, a toroidal shape may provide greater inductance and / or other performance metrics of the inductor.

[0025] The metal layer (210) can be formed via electroplating. Thick, low-resistance copper structures can be created using standard plating formulations. Electroplating can utilize a current bus plane deposited by PVD (e.g., sputtering) or by chemical solution treatment (electroless plating). Since the current bus plane facilitates the plating of copper by acting as a seed, this plane may be referred to as a seed layer. When the seed layer is deposited by a sputtering process, the seed layer provides specific advantages in relation to tool supply chain management because the magnetic film (206), the isolation layer (e.g., oxide layer, dielectric layer, etc.), and the seeding can be formed on the same tool or toolset at the semiconductor foundry level.

[0026] FIG. 3 illustrates a cross-sectional view of an inductor (300) having an air gap (305) according to specific embodiments. The inductor (300) may be formed by a process such as that described in relation to the method (100) of FIG. 1 and FIG. 2a through 2f. Thus, the inductor (300) may include similar characteristics and components described therein. The inductor (300) may include a flexible core (302), a magnetic film (304), an isolation layer (306), metal paths (308a-c), and a metal layer (310). The flexible core (302) and the magnetic film (304) may form the magnetic core of the inductor (300). The flexible core (302) may include polyimide and / or any other suitable material for forming the flexible core. The flexible core (302) may include a core thickness (302a). The core thickness (302a) may be about 30 μm. In other embodiments, the core thickness (302a) may be about 15 μm, about 20 μm, about 35 μm, or about 40 μm.

[0027] The magnetic film (304) may comprise nickel, iron, cobalt, zirconia, tantalum, hafnium, silicon, and / or any other suitable material. The magnetic film (304) may additionally or alternatively comprise oxygen and at least one of nickel, iron, cobalt, zirconia, tantalum, hafnium, silicon, and / or any other suitable material. The magnetic film (304) may comprise a single material, or may comprise any or all of the aforementioned materials and combinations and alloys (e.g., cobalt alloys). The magnetic film (304) may comprise a film thickness (304a). The film thickness (304a) may be about 15 μm. In other embodiments, the film thickness (304a) may be about 10 μm, about 20 μm, about 25 μm, or about 30 μm.

[0028] The magnetic core of the inductor (300) (i.e., the flexible core (302) and the magnetic film (304)) may be substantially round, rectangular, or any other suitable shape. The magnetic core may also include an air gap (305). The air gap (305) may be formed in the flexible core (302) before forming the magnetic film (304). The air gap (305) may be formed through etching, laser cutting ablation, or any other suitable method. In relation to FIG. 3, the magnetic core may extend inward to form a partial disk. The two sides of the magnetic core shown in FIG. 3 may therefore be a single segment, and the air gap (305) is on one side of the partial disk. A top-down view of a similar magnetic core can be seen in FIG. 4d. The air gap (305) may have a width of about 120 μm. In other embodiments, the air gap (305) may have a width of about 80 μm, about 90 μm, about 100 μm, about 150 μm, or about 200 μm.

[0029] The isolation layer (306) may be similar to the dielectric layer (208) of FIGS. 2c through 2f. The isolation layer (306) may therefore include a dielectric material as described above. The isolation layer (306) may also include an oxide formed on the magnetic film (304). The isolation layer (306) may fill the air gap (305). In some embodiments, the air gap (305) may not include the isolation layer (306). The isolation layer (306) may include a dielectric thickness (306a). The dielectric thickness (306a) may be about 10 μm. In other embodiments, the dielectric thickness (306a) may be about 5 μm, about 15 μm, or about 20 μm. The isolation layer (306) may have the same dielectric thickness (306a) in all regions and may be uniform. In other embodiments, the isolation layer (306) may include different dielectric thicknesses (306a) in different regions (for example, the dielectric thickness within the air gap (305) may be different from the dielectric thickness on the bottom side of the inductor (300)).

[0030] The metal paths (308a-c) may contain copper and may extend through the top and bottom sides of the magnetic core and the isolation layer (306). The metal paths (308a-c) may contain a via width (318). The via width (318) may be about 36 μm. In other embodiments, the via width (318) may be about 20 μm, about 30 μm, about 40 μm, or about 50 μm. The metal paths (308a-c) may be formed as part of the metal layer (310) and / or may be connected to the metal layer. The metal layer (310) may also contain copper. The metal layer (310) may have a metal thickness (310a) of about 15 μm. In other embodiments, the metal thickness (310a) may be about 5 μm, about 10 μm, about 20 μm, or about 30 μm.

[0031] The isolation layer (306) can affect subsequent processing steps and also affect the current handling of the inductor (300) by increasing its reluctance. Thicker polymer isolation can produce good reluctance and includes conformal polymer coating or complete polymer fill, and then perforation of internal vias. Thus, the PVD process for depositing the magnetic film can be interrupted by adding another PVD process to form the polymer coating or lamination. In some embodiments, the isolation layer (306) may include an oxide film also deposited through the PVD process. This approach has advantages because the metal winding is created by the PVD seeding process. All PVD steps are deposited sequentially by PVD without interruption to add the polymer lining. That is, the magnetic film (304), the isolation layer (306), and the metal seeding layer can be formed sequentially by a single PVD sequence.

[0032] The metal paths (308a-c) and the metal layer (310) can form copper windings around the magnetic core. The copper windings can pass through vias or cavities passing through the magnetic core and the isolation layer (306). As previously mentioned, the magnetic core can be a disk (or partial disk). Thus, the copper windings can form a toroid with respect to the magnetic core. That is, the inductor (300) can be a toroidal inductor and can include an air gap (305). Thus, the inductor (300) can have better inductance and lower current ripple and DC resistance compared to other inductors.

[0033] FIG. 4a illustrates a toroidal inductor (400) having four windings (404a-d) according to specific embodiments. The toroidal inductor (400) may be similar to the inductor (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (400) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (400) may include a magnetic core (402) and windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0034] The windings (404a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the windings (404a-d) may be spaced every 90° with respect to the magnetic core (402). One or more of the windings (404a-d) (e.g., winding (404b)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the windings (404a-d) so that the toroidal inductor (400) operates according to design (e.g., as a high switching regulator).

[0035] FIG. 4b illustrates a toroidal inductor (401) having six windings (404a-f) according to specific embodiments. The toroidal inductor (401) may be similar to the inductor (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (401) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through FIG. 2f. The toroidal inductor (401) may include a magnetic core (402) and windings (404a-f). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0036] The windings (404a-f) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the windings (404a-f) may be spaced every 60° with respect to the magnetic core (402). One or more of the windings (404a-f) (e.g., winding (404b)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the windings (404a-f) so that the toroidal inductor (400) operates according to design (e.g., as a high-switching regulator).

[0037] FIG. 4c illustrates a toroidal inductor (403) having four angled windings (404a-d) according to specific embodiments. The toroidal inductor (403) may be similar to the inductor (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (403) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (403) may include a magnetic core (402) and angled windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0038] The angled windings (404a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the angled windings (404a-d) may be placed every 60° with respect to the magnetic core (402). One or more of the angled windings (404a-d) (e.g., angled winding (404a)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the angled windings (404a-d) so that the toroidal inductor (400) operates according to design (e.g., as a high-speed switching regulator).

[0039] The angled windings (404a-d) may include a first arm (406a) and a second arm (406b). Although the first arm (406a) and the second arm (406b) are shown only on the angled winding (404c), it should be understood that all of the angled windings (404a-d) may include the first arm and the second arm. The first arm (406a) and the second arm (406b) may meet to form an angle (416). The angle (416) may be within the range of about 60° to about 120°, including boundary values. The first arm (406a) and the second arm (406b) may increase the surface area of ​​the angled winding (404c) and / or the total length of the angled winding (404c). Therefore, the toroidal inductor (403) can exhibit different operating characteristics (e.g., operating frequency, inductance, reluctance, etc.) from other inductors.

[0040] FIG. 4d illustrates a toroidal inductor (405) having four windings (404a-d) according to specific embodiments. The toroidal inductor (405) may be similar to the inductor (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (405) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (405) may include a magnetic core (402) and windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0041] The magnetic core (402) may also include an air gap (412). The air gap (412) may be similar to the air gap (305) of FIG. 3. Thus, the air gap (412) may be formed as part of the production process of the flexible core and / or may be formed through an etching process, a cutting process (e.g., laser cutting), ablation, or any other suitable method.

[0042] The windings (404a-d) may be spaced at regular radial intervals with respect to the center of the magnetic core (402). For example, the windings (404a-d) may be spaced every 90° with respect to the magnetic core (402). One or more of the windings (404a-d) (e.g., winding (404b)) may be connected to a power source (not shown). The power source may provide alternating current or DC to the windings (404a-d) so that the toroidal inductor (405) operates according to design (e.g., as a high switching regulator).

[0043] FIG. 4e illustrates a toroidal inductor (407) having four angled windings (404a-d) according to specific embodiments. The toroidal inductor (407) may be similar to the inductor (300) of FIG. 3 and may include similar features, measurements, and performance. The toroidal inductor (407) may be formed by a process such as the method (100) of FIG. 1 and FIG. 2a through 2f. The toroidal inductor (407) may include a magnetic core (402) and angled windings (404a-d). The magnetic core (402) may be disk-shaped and may include a path in the center. The magnetic core (402) may include a flexible core and a magnetic film, such as the flexible core (302) and magnetic film (304) of FIG. 3.

[0044] The magnetic core (402) may also include an air gap (412). The air gap (412) may be similar to the air gap (305) of FIG. 3. Thus, the air gap (412) may be formed as part of the production process of the flexible core and / or may be formed through an etching process, a cutting process (e.g., laser cutting), ablation, or any other suitable method. As shown in FIG. 4e, the air gap (412) may include a magnetic paste (408). The magnetic paste (408) may allow the toroidal inductor (407) to be tuned for various applications (e.g., ferrite beads, noise chokes, voltage regulators, etc.). The magnetic paste (408) may include iron, silver, graphene, cobalt, nickel, and / or any other suitable material. The magnetic paste may provide additional degrees of freedom in managing the trade-off between inductance and current handling capability. For example, a weakly-loaded magnetic paste (e.g., a relatively small number of magnetic particles within a polymer paste) can improve inductance without compromising current handling. Alternatively, a highly-loaded magnetic paste (e.g., a relatively large number of magnetic particles within a polymer paste) can increase inductance but may have lower current handling.

[0045] The angled windings (404a-d) may include a first arm (406a) and a second arm (406b). Although the first arm (406a) and the second arm (406b) are shown only on the angled winding (404c), it should be understood that all of the angled windings (404a-d) may include the first arm and the second arm. The first arm (406a) and the second arm (406b) may meet to form an angle (416). The angle (416) may be within a range of about 60° to about 120°, including boundary values. The first arm (406a) and the second arm (406b) may increase the surface area of ​​the angled winding (404c) and / or the total length of the angled winding (404c). Therefore, the toroidal inductor (403) can exhibit different operating characteristics (e.g., operating frequency, inductance, reluctance, etc.) from other inductors.

[0046] It should be understood that FIGS. 4a through 4e are provided merely as examples. Any toroidal inductor features depicted in any of FIGS. 4a through 4e may be combined with any other toroidal inductor features. A person skilled in the art will recognize a number of different configurations and possibilities.

[0047] FIG. 5 illustrates an exemplary computer system (500) in which various embodiments may be implemented. The system (500) may be used to implement any of the aforementioned computer systems. As illustrated in the drawing, the computer system (500) includes a processing unit (504) that communicates with a plurality of peripheral subsystems via a bus subsystem (502). These peripheral subsystems may include a processing acceleration unit (506), an I / O subsystem (508), a storage subsystem (518), and a communication subsystem (524). The storage subsystem (518) includes a type of computer-readable storage medium (522) and a system memory (510).

[0048] The bus subsystem (502) provides a mechanism that enables various components and subsystems of the computer system (500) to communicate with each other as intended. Although the bus subsystem (502) is schematically illustrated as a single bus, alternative embodiments of the bus subsystem may utilize multiple buses. The bus subsystem (502) may be any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, and a local bus using any of various bus architectures. For example, these architectures may include an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MCA) bus, an Enhanced ISA (EISA) bus, a Video Electronics Standards Association (VESA) local bus, and a Peripheral Component Interconnect (PCI) bus, which may be implemented as a mezzanine bus manufactured to the IEEE P1386.1 standard.

[0049] A processing unit (504) (e.g., a conventional microprocessor or microcontroller) that can be implemented as one or more integrated circuits controls the operation of a computer system (500). One or more processors may be included in the processing unit (504). These processors may include single-core or multi-core processors. In certain embodiments, the processing unit (504) may be implemented as one or more independent processing units (532 and / or 534) having a single-core or multi-core processor included in each processing unit. In other embodiments, the processing unit (504) may also be implemented as a quad-core processing unit formed by integrating two dual-core processors into a single chip.

[0050] In various embodiments, the processing unit (504) may execute various programs in response to program code and may maintain a number of concurrently executed programs or processes. At any given time, part or all of the program code to be executed may reside within the processor(s) (504) and / or the storage subsystem (518). Through suitable programming, the processor(s) (504) may provide the various functions described above. The computer system (500) may further include a processing acceleration unit (506) which may include a digital signal processor (DSP), a special purpose processor, etc.

[0051] The I / O subsystem (508) may include user interface input devices and user interface output devices. User interface input devices may include pointing devices such as keyboards, mice, or trackballs, touchpads or touchscreens integrated into a display, audio input devices having scroll wheels, click wheels, dials, buttons, switches, keypads, voice command recognition systems, microphones, and other types of input devices. User interface input devices may include, for example, motion detection and / or gesture recognition devices that allow a user to control and interact with input devices through a natural user interface using gestures and voice commands. Additionally, user interface input devices may include voice recognition detection devices that allow a user to interact with a voice recognition system through voice commands.

[0052] User interface input devices may also, without limitation, include three-dimensional (3D) mice, joysticks or pointing sticks, gamepads and graphic tablets, and audio / visual devices such as speakers, digital cameras, digital camcorders, portable media players, webcams, image scanners, fingerprint scanners, barcode readers, 3D scanners, 3D printers, laser rangefinders, and eye-tracking devices. Additionally, user interface input devices may include medical imaging input devices, such as computed tomography, magnetic resonance imaging, positional emission tomography, and medical ultrasound devices. User interface input devices may also include audio input devices, such as MIDI keyboards, digital instruments, etc.

[0053] User interface output devices may include non-visual displays such as display subsystems, indicator lights, or audio output devices. A display subsystem may be a flat-panel device, a projection device, a touch screen, etc., such as using a cathode ray tube (CRT), a liquid crystal display (LCD), or a plasma display. Generally, the use of the term "output device" is intended to include all possible types of devices and mechanisms for outputting information from a computer system (500) to a user or another computer. For example, user interface output devices may include, without limitation, various display devices that visually convey text, graphic, and audio / video information, such as monitors, printers, speakers, headphones, car navigation systems, plotters, voice output devices, and modems.

[0054] The computer system (500) may include a storage subsystem (518) containing software elements described as being located in the current system memory (510). The system memory (510) may store program instructions that are loadable and executable on the processing unit (504), as well as data generated during the execution of these programs.

[0055] Depending on the configuration and type of the computer system (500), the system memory (510) may be volatile (such as Random Access Memory (RAM)) and / or non-volatile (such as Read-Only Memory (ROM), flash memory, etc.). RAM typically contains data and / or program modules that are immediately accessible by the processing unit (504) and / or are currently operating and executing. In some implementations, the system memory (510) may contain a number of different types of memory, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). In some implementations, for example, during startup, a Basic Input / Output System (BIOS) containing basic routines that help transfer information between elements within the computer system (500) may typically be stored in ROM. As an example not limited to, system memory (510) also exemplifies application programs (512) that may include program data (514) and an operating system (516), such as client applications, web browsers, intermediate layer applications, relational database management systems (RDBMS), etc.

[0056] The storage subsystem (518) may also provide a computer-readable storage medium of a type that stores basic programming and data configurations that provide functionality of some embodiments. Software (programs, code modules, instructions) that provides the aforementioned functionality when executed by a processor may be stored in the storage subsystem (518). These software modules or instructions may be executed by the processing unit (504). The storage subsystem (518) may also provide a storage for storing data used according to some embodiments.

[0057] The storage subsystem (500) may also include a computer-readable storage medium reader (520) that may be additionally connected to the computer-readable storage medium (522). Together and optionally, in combination with the system memory (510), the computer-readable storage medium (522) may comprehensively represent a combination of remote, local, fixed, and / or removable storage devices and storage media for temporarily and / or more permanently containing, storing, transmitting, and retrieving computer-readable information.

[0058] A computer-readable storage medium (522) comprising code, or parts of code, may also include any suitable medium, including, but not limited to, storage and communication media, such as volatile and non-volatile, removable and non-removable media, implemented by any method or technique for storing and / or transmitting information. This may include computer-readable storage media of the type such as RAM, ROM, EEPROM (electronically erasable programmable ROM), flash memory or other memory technology, CD-ROM, DVD (digital versatile disk), or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or other types of tangible computer-readable media. This may also include non-tangible computer-readable media, such as any other medium that can be used to transmit data signals, data transmissions, or desired information and can be accessed by a computing system (500).

[0059] For example, a computer-readable storage medium (522) may include a hard disk drive that reads or writes from a non-removable non-volatile magnetic medium, a magnetic disk drive that reads or writes from a removable non-volatile magnetic disk, and an optical disk drive that reads and writes from a removable non-volatile optical disk, such as a CD-ROM, DVD, or other optical medium. The computer-readable storage medium (522) may include, but is not limited to, a flash memory card, a Universal Serial Bus (USB) flash drive, a secure digital (SD) card, a DVD disc, a digital video tape, etc. The computer-readable storage medium (522) may also include solid-state drives (SSDs) based on non-volatile memory, such as flash memory-based SSDs, enterprise flash drives, and solid-state ROM, solid-state RAM, dynamic RAM, static RAM, DRAM-based SSDs, magnetoresistive RAM (MRAM) SSDs, and hybrid SSDs using a combination of DRAM and flash memory-based SSDs. A disk drive and an associated computer-readable medium can provide non-volatile storage of computer-readable instructions, data structures, program modules, and other data for a computer system (500).

[0060] The communication subsystem (524) provides an interface to other computer systems and networks. The communication subsystem (524) serves as an interface for transmitting data from the computer system (500) to other systems and receiving data from them. For example, the communication subsystem (524) may enable the computer system (500) to connect to one or more devices via the Internet. In some embodiments, the communication subsystem (524) may include radio frequency (RF) transceiver components for accessing wireless voice and / or data networks (e.g., using cellular phone technology, advanced data network technology such as 3G, 4G, 5G or EDGE (enhanced data rates for global evolution), WiFi (IEEE 802.5 family standard), or other mobile communication technologies, or any combination thereof), Global Positioning System (GPS) receiver components, and / or other components. In some embodiments, the communication subsystem (524) may provide a wired network connection (e.g., Ethernet) in addition to or instead of the wireless interface.

[0061] In some embodiments, the communication subsystem (524) may also receive input communications in the form of structured and / or unstructured data feeds (526), ​​event streams (528), event updates (530), etc., on behalf of one or more users who can use the computer system (500).

[0062] For example, the communication subsystem 524 may be configured to receive real-time data feeds 526 from social network and / or other communication service users, and to receive web feeds and / or real-time updates, such as Rich Site Summary (RSS) feeds, from one or more third-party information sources.

[0063] Additionally, the communication subsystem (524) may also be configured to receive data in the form of continuous data streams that may include event streams (528) and / or event updates (530) of real-time events, which may be essentially continuous or infinite without explicit endpoints. Examples of applications that generate continuous data may include, for example, sensor data applications, financial tickers, network performance measurement tools (e.g., network monitoring and traffic management applications), clickstream analysis tools, automotive traffic monitoring, etc.

[0064] The communication subsystem (524) may also be configured to output structured and / or unstructured data feeds (526), ​​event streams (528), event updates (530), etc. to one or more databases capable of communicating with one or more streaming data source computers coupled to the computer system (500).

[0065] Because the characteristics of computers and networks are constantly changing, the description of the computer system (500) illustrated in the drawings is intended only as a specific example. Many other configurations are possible with more or fewer components than the system illustrated in the drawings. For example, customized hardware may also be used and / or specific elements may be implemented in hardware, firmware, software (including applets), or a combination thereof. Additionally, connections to other computing devices, such as network input / output devices, may be utilized. Based on the disclosures and teachings provided herein, other ways and / or methods for implementing various embodiments will be apparent.

[0066] In the foregoing description, numerous specific details have been presented for the purposes of explanation and to provide a thorough understanding of various embodiments. However, it will be apparent that some embodiments may be implemented without some of these specific details. In other cases, well-known structures and devices are illustrated in the form of block diagrams.

[0067] The foregoing description is merely intended to provide exemplary embodiments and is not intended to limit the scope, applicability, or configuration of the present disclosure. Rather, the foregoing description of various embodiments will provide possible disclosures for implementing at least one embodiment. It should be understood that various modifications may be made to the function and arrangement of elements without departing from the spirit and scope of some embodiments as set forth in the appended claims.

[0068] Specific details are provided in the foregoing description to provide a thorough understanding of the embodiments. However, it will be understood that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be illustrated as components in the form of block diagrams to avoid obscuring the embodiments with unnecessary details. In other cases, well-known circuits, processes, algorithms, structures, and technologies may be illustrated without unnecessary details to avoid obscuring the embodiments.

[0069] Additionally, it should be noted that individual embodiments may be described as processes illustrated as flowcharts, flow diagrams, data flow diagrams, structure diagrams, or block diagrams. While a flowchart may describe operations as a sequential process, many of the operations may be performed in parallel or simultaneously. Additionally, the order of the operations may be rearranged. A process terminates when its operations are completed, but it may have additional steps not included in the drawings. A process may correspond to a method, function, procedure, subroutine, subprogram, etc. When a process corresponds to a function, its termination may correspond to the function returning to the calling function or the main function.

[0070] The term “computer-readable medium” includes, but is not limited to, portable or fixed storage devices, optical storage devices, wireless channels, and various other media capable of storing, containing, or carrying instruction(s) and / or data. Code segments or machine-executable instructions may represent any combination of procedures, functions, subprograms, programs, routines, subroutines, modules, software packages, classes, or instructions, data structures, or program statements. Code segments may be coupled to other code segments or hardware circuits by transmitting and / or receiving information, data, arguments, parameters, or memory contents. Information, arguments, parameters, data, etc. may be transmitted, forwarded, or transmitted through any suitable means, including memory sharing, message passing, token passing, network transmission, etc.

[0071] Additionally, embodiments may be implemented by hardware, software, firmware, middleware, microcode, hardware description languages, or any combination thereof. When implemented by software, firmware, middleware, or microcode, program code or code segments for performing necessary tasks may be stored on a machine-readable medium. Processor(s) may perform the necessary tasks.

[0072] In the foregoing specification, features are described with reference to specific embodiments thereof, but it should be recognized that not all embodiments are limited thereto. Various features and aspects of some embodiments may be used individually or together. Furthermore, embodiments may be utilized in any number of environments and applications other than those described herein without departing from the broader spirit and scope of this specification. Accordingly, the specification and drawings should be considered illustrative rather than restrictive.

[0073] Additionally, for the purpose of illustration, the methods have been described in a specific order. It should be understood that in alternative embodiments, the methods may be performed in a different order than described. It should also be understood that the foregoing methods may be performed by hardware components or implemented as sequences of machine-executable instructions, which may be used to enable a machine, such as a general-purpose or special-purpose processor or logic circuit programmed with instructions, to perform the methods. Such machine-executable instructions may be stored on one or more machine-readable media, such as CD-ROMs or other types of optical discs, floppy diskettes, ROMs, RAMs, EPROMs, EEPROMs, magnetic or optical cards, flash memory, or other types of machine-readable media suitable for storing electronic instructions. Alternatively, the methods may be performed by a combination of hardware and software.

[0074] In the foregoing description, numerous specific details have been presented for the purposes of explanation and to provide a thorough understanding of various embodiments. However, it will be apparent that some embodiments may be implemented without some of these specific details. In other cases, well-known structures and devices are illustrated in the form of block diagrams.

[0075] The foregoing description is merely intended to provide exemplary embodiments and is not intended to limit the scope, applicability, or configuration of the present disclosure. Rather, the foregoing description of various embodiments will provide possible disclosures for implementing at least one embodiment. It should be understood that various modifications may be made to the function and arrangement of elements without departing from the spirit and scope of some embodiments as set forth in the appended claims.

[0076] Specific details are provided in the foregoing description to provide a thorough understanding of the embodiments. However, it will be understood that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be illustrated as components in the form of block diagrams to avoid obscuring the embodiments with unnecessary details. In other cases, well-known circuits, processes, algorithms, structures, and technologies may be illustrated without unnecessary details to avoid obscuring the embodiments.

[0077] Additionally, it should be noted that individual embodiments may be described as processes illustrated as flowcharts, flow diagrams, data flow diagrams, structure diagrams, or block diagrams. While a flowchart may describe operations as a sequential process, many of the operations may be performed in parallel or simultaneously. Additionally, the order of the operations may be rearranged. A process terminates when its operations are completed, but it may have additional steps not included in the drawings. A process may correspond to a method, function, procedure, subroutine, subprogram, etc. When a process corresponds to a function, its termination may correspond to the function returning to the calling function or the main function.

Claims

Claim 1 An inductor comprising: a flexible polyimide core including one or more cavities; a magnetic film formed on each sidewall of each of the two sides of the flexible polyimide core and each of the one or more cavities; a dielectric layer formed on the magnetic film; and a metal layer formed on the dielectric layer and within the cavities such that vias are formed on one or more sides of the inductor and extend through the one or more cavities. Claim 2 In claim 1, the magnetic film comprises nickel, iron, cobalt, zirconia, and tantalum, hafnium, and silicon, inductor. Claim 3 In claim 1, the magnetic film comprises an oxide of at least one of zirconium, tantalum, hafnium, and silicon, inductor. Claim 4 In claim 1, the magnetic film comprises a plurality of layers of magnetic films and oxide films, an inductor. Claim 5 In claim 1, the metal layer and the vias form between two and five turns of the inductor, including boundary values. Claim 6 An inductor according to claim 1, further comprising an air gap within the flexible polyimide core, wherein the air gap comprises a width of approximately 48 micrometers to approximately 250 micrometers. Claim 7 An inductor comprising: a polyimide flexible core; a magnetic film deposited on one or more sides of the flexible core; a dielectric layer; and a plurality of copper windings. Claim 8 In claim 7, the magnetic film comprises at least one of cobalt, zirconia, and tantalum, inductor. Claim 9 In claim 7, the magnetic film comprises an oxide layer, inductor. Claim 10 In claim 7, the plurality of copper windings are an inductor formed using an electroplating process. Claim 11 In claim 7, the plurality of copper windings form a toroidal shape, an inductor. Claim 12 In paragraph 11, the toroid is an inductor including an air gap. Claim 13 A method for forming an inductor, comprising the steps of: forming a magnetic film on a flexible core; forming a dielectric layer on the magnetic film; and forming a metal layer on at least a portion of the dielectric layer. Claim 14 A method according to claim 13, wherein first vias are formed through the flexible core before the magnetic film is deposited on the flexible core. Claim 15 A method according to claim 14, further comprising the step of forming second vias through the dielectric layer such that depositing the metal layer on at least a portion of the dielectric layer forms a metal path extending through at least one of the flexible core, the magnetic film, and the dielectric layer. Claim 16 In claim 14, the method wherein the first vias comprise a diameter of about 25 micrometers. Claim 17 In paragraph 13, the method wherein the magnetic film has a thickness of about 10 micrometers. Claim 18 A method according to claim 13, wherein the magnetic film, the dielectric layer, and the metal seeding layer are sequentially deposited in the same PVD sequence. Claim 19 In claim 13, the method wherein the flexible core comprises polyimide, glass, liquid crystal polymer, and fluoropolymer. Claim 20 A method according to claim 13, further comprising the step of forming an air gap within the metal layer, wherein the air gap is filled with a high-content magnetic paste.

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