Plasma processing apparatus having a focus ring adjustment assembly

Abstract

A plasma processing device is provided. The plasma processing device includes a processing chamber that forms a vertical direction and a lateral direction. The plasma processing device has a pedestal disposed within the processing chamber. The pedestal is configured to support a substrate. The plasma processing device has a radio frequency (RF) disposed within the processing chamber. An RF bias electrode forms an RF zone extending between a first end of the RF bias electrode and a second end of the RF bias electrode along the lateral direction. The plasma processing device has a focus ring disposed within the processing chamber. The plasma processing device further has a focus ring adjustment assembly. The focus ring adjustment assembly has a lift pin located outside the RF zone. The lift pin is movable along the vertical direction to adjust the distance between the pedestal and the focus ring along the vertical direction.

Description

Technology Field

[0001] This application claims priority to U.S. Provisional Application No. 62 / 847,595, filed May 14, 2019, titled “System and method for transporting replaceable parts in a vacuum processing apparatus,” which is incorporated herein by reference.

[0002] The present invention generally relates to the processing of a workpiece, and more specifically to a focus ring adjustment assembly of a system for processing a workpiece, such as a semiconductor workpiece, under vacuum. Background Technology

[0004] A processing system that exposes a workpiece, such as a semiconductor wafer or other suitable substrate, to an overall processing plan for forming a semiconductor device or other device may perform multiple processing steps, such as plasma processing (e.g., stripping, etching, etc.), heat treatment (e.g., annealing), and deposition (e.g., chemical vapor deposition). To perform these processing steps, the system may be equipped with one or more robots to move the workpiece at multiple different times, for example, into the system, between various processing chambers, and out of the system. In semiconductor workpiece processing, it may occasionally be necessary to perform routine maintenance and / or preventive maintenance on the processing system. In certain cases, this may require the physical replacement of specific parts within the processing system. The problem to be solved

[0006] The aspects and advantages of the embodiments of the present disclosure may be practiced as described in the following description, or may be known from such description, or may be learned through the practice of the present disclosure.

[0007] One exemplary embodiment of the present disclosure relates to a plasma processing apparatus. The apparatus may have a processing chamber forming a vertical direction and a lateral direction. The plasma processing apparatus may have a pedestal disposed within the processing chamber. The pedestal may be configured to support a substrate. The plasma processing apparatus may have a radio frequency (RF) bias electrode disposed within the pedestal. The RF bias electrode may extend along the lateral direction between a first end of the RF bias electrode and a second end of the RF bias electrode. The RF bias electrode may form an RF zone extending along the lateral direction between a first end of the RF bias electrode and a second end of the RF bias electrode. In some embodiments, the RF zone may extend along the lateral direction from a first end of the RF bias electrode to a second end of the RF bias electrode. The apparatus may have a focus ring adjustment assembly comprising a lift pin located outside the RF zone. To adjust the distance between the pedestal and the focus ring along the vertical direction, the focus ring may be movable along the vertical direction to move between at least a first position and a second position.

[0008] Another exemplary aspect relates to a system and method for processing a workpiece. Variations and modifications may be made to the exemplary aspects of this disclosure.

[0009] These and other features, aspects, and advantages of the various embodiments will be better understood by referring to the following description and the appended claims. The appended drawings, which constitute part of this specification, illustrate embodiments of the present disclosure and serve to explain the related principles together with the description. Brief explanation of the drawing

[0011] Detailed discussion of the relevant embodiments for those skilled in the art is described in this specification with reference to the attached drawings. FIG. 1 illustrates a plan view of an exemplary processing system according to exemplary embodiments of the present disclosure. FIG. 2 illustrates a plan view of an exemplary processing system according to exemplary embodiments of the present disclosure. FIG. 3 illustrates a plan view of an exemplary processing system according to exemplary embodiments of the present disclosure. FIG. 4 illustrates an exemplary return location according to exemplary embodiments of the present disclosure. FIG. 5 illustrates an exemplary workpiece column according to exemplary embodiments of the present disclosure. FIG. 6 illustrates an exemplary robot arm motion pattern according to exemplary embodiments of the present disclosure. FIG. 7 illustrates an exemplary flowchart of an exemplary method according to exemplary embodiments of the present disclosure. FIG. 8 illustrates an exemplary flowchart of an exemplary method according to exemplary embodiments of the present disclosure. FIG. 9 illustrates a perspective view of an exemplary end effector according to exemplary embodiments of the present disclosure. FIG. 10a illustrates a perspective view of a first configuration of support members on the end effector of FIG. 9 for supporting an exemplary workpiece and a focus ring according to exemplary embodiments of the present disclosure. FIG. 10b shows a side view of support members on an end effector shown in FIG. 10a according to exemplary embodiments of the present disclosure. FIG. 11a illustrates a perspective view of a second configuration of support members on the end effector of FIG. 9 for supporting an exemplary workpiece and a focus ring according to exemplary embodiments of the present disclosure. FIG. 11b shows a side view of support members on the end effector shown in FIG. 11a according to exemplary embodiments of the present disclosure. FIG. 12a shows a partial perspective view of a third configuration of support members on the end effector of FIG. 9 for supporting an exemplary workpiece and focus ring according to exemplary embodiments of the present disclosure. FIG. 12b shows a side view of support members on the end effector shown in FIG. 12a according to exemplary embodiments of the present disclosure. FIG. 13 shows a perspective view of a focus ring adjustment assembly of an exemplary processing system according to exemplary embodiments of the present disclosure. FIG. 14a shows a side cross-sectional view of the adjustment assembly shown in FIG. 13 having a focus ring in a lowered position according to exemplary embodiments of the present disclosure. FIG. 14b shows a side cross-sectional view of the adjustment assembly shown in FIG. 13 having a focus ring in an elevated position according to exemplary embodiments of the present disclosure. FIG. 15a shows a cross-sectional view of a first embodiment of a focus ring for use with the adjustment assembly shown in FIG. 13 according to exemplary embodiments of the present disclosure. FIG. 15b shows a cross-sectional view of a second embodiment of a focus ring for use with the adjustment assembly shown in FIG. 13 according to exemplary embodiments of the present disclosure. FIG. 16 shows a top view of a pin support plate of an adjustment assembly shown in FIG. 14a-14b according to exemplary embodiments of the present disclosure. FIG. 17 illustrates a schematic diagram of an operating system for the adjustment assembly shown in FIG. 14a-14b according to exemplary embodiments of the present disclosure. FIG. 18 illustrates a plasma processing apparatus according to exemplary embodiments of the present disclosure. FIG. 19 illustrates a focus ring adjustment assembly that maintains the focus ring of a plasma processing device at a first position according to exemplary embodiments of the present disclosure. FIG. 20 illustrates a focus ring adjustment assembly that maintains the focus ring of a plasma processing device at a second position according to exemplary embodiments of the present disclosure. Specific details for implementing the invention

[0012] Hereinafter, embodiments are made by reference in detail, and one or more examples are illustrated in the drawings. Each example is provided through the description of the embodiments, not as a limitation of the present disclosure. In practice, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments without departing from the scope or spirit of the present disclosure. For example, features illustrated or described as part of one embodiment may be used to derive another embodiment using another embodiment. Accordingly, the aspects of the present disclosure are intended to cover such modifications and variations.

[0013] Exemplary aspects of the present disclosure relate to systems and methods for the automated replacement of replaceable parts within semiconductor workpiece processing equipment. The systems and methods may provide for operating replaceable parts through a vacuum device. Exemplary replaceable parts may include focus rings used in plasma processing chambers for semiconductor workpieces (e.g., plasma dry etching chambers).

[0014] In workpiece processing systems, preventive maintenance may be performed by skilled technicians who perform the physical labor required to replace replaceable parts, such as focus rings within a plasma dry etching chamber. In vacuum processing systems, this may require venting the processing chamber to the dash and opening the chamber for access. This can result in costly downtime in semiconductor device manufacturing processes. Furthermore, when the processing chamber is exposed to the environment, there is an increased risk of potential contamination of other processing parts, and other chamber sections may need to be removed and / or replaced.

[0015] For example, the process for performing maintenance on semiconductor processing equipment includes monitoring trigger conditions such as workpiece counts and plasma exposure times (e.g., for plasma processing tools). When a trigger condition occurs, the vacuum processing chamber may be taken offline, which can reduce workpiece throughput. A service technician may leave the vacuum processing chamber in a safe open state by performing processing chamber conditioning (e.g., plasma cleaning). After conditioning, the technician may evacuate the vacuum processing chamber. The technician may open the vacuum processing chamber to access the interior and start removal of specific chamber components (e.g., focus rings). After cleaning any unremoved parts, replacement parts may be added to the processing chamber, and the vacuum processing chamber may be closed and emptied. Once back online, certain qualified workpieces can be run through the vacuum processing chamber. Once the vacuum processing chamber produces successful results, it can be returned to semiconductor device production.

[0016] According to exemplary aspects of the present disclosure, a workpiece processing unit may be configured to automatically replace specific process chamber parts through robots typically found in workpiece processing units. More specifically, unused replaceable parts may be loaded into a storage area and accessed by vacuum transport robotics. The robotics may interface with the workpiece processing module to remove the worn (used) chamber part and replace it with a new (non-worn) chamber part. The used part may then be returned to a storage area from which it can be removed without the need to collapse the workpiece processing chamber.

[0017] In some embodiments, after placing a new (non-consumed) chamber part, the robotics can access a test workpiece (e.g., a dummy wafer) stored in a storage area (e.g., on a shelf within the storage area). The robotics can return the workpiece to a processing module to perform a test process. The system can perform measurements to verify that the new chamber part has been placed correctly. Additionally and / or alternatively, various sensors (e.g., optical sensors) perform measurements regarding the position of the new chamber part to verify that it has been placed correctly. In some embodiments, an automated wafer centering system may be used to coordinate the motion of the robotics when placing the new (non-consumed) part within the processing module to ensure proper placement.

[0018] In some embodiments, systems and methods according to exemplary aspects of the present disclosure may be used to replace focus rings used in plasma processing chambers. A focus ring may be positioned around the periphery of a workpiece supported on a workpiece support (e.g., having a cathode or bias electrode) within a plasma processing apparatus. A focus ring may be used, for example, to form a plasma in the vicinity of the workpiece. During plasma processing in a plasma processing chamber, the focus ring may be exposed to the plasma and thereby exposed to deposition and erosion. Consequently, focus rings may need to be periodically replaced in plasma processing chambers as part of preventive maintenance for the workpiece processing system.

[0019] Aspects of the present disclosure are discussed with reference to the focus ring as a replaceable part. Those skilled in the art using the disclosure provided herein will understand that the aspects of the present disclosure may be applied to replace other replaceable parts within a vacuum processing chamber without departing from the scope of the present disclosure.

[0020] In some embodiments, the system may monitor trigger conditions such as workpiece count, plasma exposure time, etc. When a trigger condition occurs, an in-situ plasma dry cleaning process may be performed to prepare a vacuum processing chamber. Once the in-situ plasma dry cleaning process is completed, a lift mechanism located outside the vacuum processing chamber but coupled inside the chamber may use a set of pins to lift a focus ring placed around a workpiece support inside the vacuum processing chamber. After lifting the focus ring, a workpiece handling robot may enter the chamber and lift the ring from the pins in vertical motion. The robot may retract and rotate to place the used focus ring on a shelf in a storage position. In some embodiments, the workpiece handling robot may hand off the focus ring to a second robot to place it in a storage position.

[0021] Next, the robot can move to another shelf in the storage location to retrieve a new focus ring. After rotating relative to the vacuum processing module, the robot can position the focus ring on the lift pin by extending to the required position and drop down. After the robot retracts from the vacuum processing module, the system can lower the lifting pin to drop the ring to a final position around the workpiece support (e.g., equipped with a cathode). Conditioning plasma can be used to stabilize process performance within the workpiece processing chamber, and the vacuum processing chamber can be brought back online for normal operation. A test workpiece (e.g., acquired from the storage location) can be used to test the processing module using a test process before bringing the processing module back online for normal operation.

[0022] Exemplary aspects of the present disclosure also include workpiece handling robots capable of accessing one or more parallel processing stations according to a specific robot arm motion pattern. Specifically, the robot arm motion pattern enables the end effector of the workpiece handling robot to enter a process chamber having parallel processing stations and then access one of the processing stations to transport workpieces or replaceable parts. The robot arm motion pattern may comprise moving the end effector along a first direction during a first time period, moving the end effector along a second direction that is generally horizontal to the first direction during a second time period, and moving the end effector along a third direction different from the first or second direction during a third time period. The end effector may be moved according to the robot arm motion pattern to access the processing station and may also be withdrawn from the processing station according to the same motion. In some embodiments, robot motion may be automatically controlled and / or adjusted in real time using a sensor as part of an automated wafer centering system (e.g., an optical sensor) to ensure proper placement of replaceable parts within a processing station.

[0023] According to exemplary aspects of the present disclosure, robotics used to convey workpieces as part of a workpiece processing system may be configured to convey replaceable parts (e.g., focus rings) according to exemplary embodiments of the present disclosure. For example, a robot end effector may have a spatula design to accommodate workpiece support pads and replaceable part support pads to support semiconductor workpieces and replaceable parts. The end effector may have at least one common support pad configured to support both the workpiece and the replaceable part. Additionally, the end effector may have at least one support pad for supporting the workpiece located further from the axis of the effector and from the distal end of the effector than at least one other support pad for supporting the replaceable part.

[0024] Exemplary aspects of the present disclosure also include a focus ring adjustment assembly for adjusting the position of a focus ring within a process chamber for removal and / or installation. Specifically, the adjustment assembly may include pins configured to raise the focus ring to, for example, one or more different vertical positions, so that the focus ring can be more easily removed from the focus chamber by an end effector, and the new focus ring can be lowered to install the focus ring around a workpiece support. The pins may be configured to contact the highest vertical portion of the lower part of the focus ring. Additionally, in some embodiments, the pins may be rotatable to lock the azimuth position of the focus ring to assist in the proper centering of the focus ring relative to the workpiece support.

[0025] The focus ring adjustment assembly described above is provided with a lift pin movable along the vertical direction to facilitate the movement of the focus ring of a plasma processing device, thereby adjusting the distance between the focus ring and the pedestal configured to support the substrate to be processed. In particular, the lift pin may be located outside the RF zone defined by a bias electrode located within the pedestal. The lift pin may also penetrate a ground plane located within the pedestal.

[0026] The aspects of the present disclosure may provide a number of technical effects and advantages. For example, the robot arm motion pattern provided herein may facilitate access to replaceable parts in process chambers having multiple processing stations, such as two processing stations. Additionally, the storage chamber provided herein enables the storage of available replaceable parts and allows for the retrieval of new replaceable parts from the process chamber without destroying the entire vacuum of the system. In some embodiments, a test workpiece may be contained in a storage chamber used for testing the replaceable part after placement. The contact between the pins and the focus ring may prevent lateral movement of the focus ring as the focus ring is raised and lowered to ensure that the focus ring is accurately concentric with the electrostatic chuck or other workpiece support. The end effector support member provided herein may reduce the total number of parts, which reduces costs and simplifies the control pattern for moving the end effector. Additionally, the spatial configuration of the support pad on the end effector may utilize the existing opening of the process chamber for moving the replaceable part into and out of the process chamber. Positioning the lift pin outside the RF zone and having the lift pin can reduce the risk of arcing associated with applying RF power (e.g., bias power) from the RF source to the bias electrode during the plasma process. Additionally, interference (e.g., electrical and mechanical) between the lift pin and the focus ring can be reduced.

[0027] One exemplary embodiment of the present disclosure relates to a system for processing workpieces. The system comprises a front end configured to be maintained at atmospheric pressure. The system comprises a load lock chamber disposed between the front end and a vacuum portion. The system comprises one or more process chambers disposed within the vacuum portion. Each process chamber may comprise two or more processing stations. At least one return chamber may be disposed within the vacuum portion. The system may comprise a storage chamber configured to store one or more replaceable parts coupled to at least one return chamber. The system may comprise one or more workpiece handling robots disposed within at least one return chamber. The workpiece handling robots may be configured to move one or more replaceable parts between the storage chamber and one or more process chambers. The workpiece handling robots may comprise an end effector configured to support the replaceable parts. The system may include a controller configured to control the motion of the end effector according to a robot arm motion pattern to access the processing station. The robot arm motion pattern described above is extended in a first direction during a first time period, extended in a second direction which is lateral to the first direction during a second time period, and extended in a third direction different from the first and second directions during a third time period. In some embodiments, the robot arm motion pattern is provided to retract the end effector again according to the same pattern.

[0028] As used herein, the controller may comprise one or more control devices, such as one or more processors. The one or more processors may be configured to execute computer-readable instructions stored in one or more memory devices to transmit control signals to control the operation of various components according to any of the functions, operations, or methods described herein.

[0029] In some embodiments, the one or more process chambers comprise a first process chamber and a second process chamber disposed on the opposite side of the return chamber. In some embodiments, the one or more process chambers comprise a first process chamber and a second process chamber disposed on the opposite side of the return chamber. The one or more process chambers further comprise a third process chamber disposed in a linear arrangement with the first process chamber and a fourth process chamber disposed in a linear arrangement with the second process chamber, such that the third process chamber and the fourth process chamber are disposed on the opposite side of the return chamber. Each of the first process chamber, the second process chamber, the third process chamber, and the fourth process chamber may have at least two processing stations. The return chamber may have a return position configured to support workpieces and replaceable parts in a stacked arrangement. In some embodiments, the stacked arrangement comprises a plurality of shelves configured to accommodate both workpieces and replaceable parts. The replaceable part may have a larger diameter than the workpiece.

[0030] In some embodiments, the one or more workpiece handling robots may comprise a first workpiece handling robot and a second handling robot. The first workpiece handling robot may be configured to convey a workpiece and a replaceable part from the workpiece column, the first process chamber, the second process chamber, and the conveying position, and the second workpiece handling robot may be configured to convey a workpiece and a replaceable part from the storage chamber, the third process chamber, the fourth process chamber, and the conveying position for automated processing of the workpiece and automated replacement of the replaceable part without breaking the vacuum.

[0031] In some embodiments, the process chambers are configured to perform plasma etching processes using direct plasma. The two or more processing stations are arranged side by side. The two or more processing stations may be associated with a workpiece support for supporting a workpiece during processing within the process chamber. The workpiece support comprises a pedestal assembly having a base plate, an electrostatic chuck configured to support the workpiece, and a replaceable part having a focus ring positioned against the electrostatic chuck, such that when the workpiece is placed on the electrostatic chuck, at least a portion of the focus ring at least partially surrounds the periphery of the workpiece.

[0032] In some embodiments, the replaceable part has a focus ring having a diameter larger than that of the workpiece.

[0033] In some embodiments, the storage chamber has a plurality of shelves configured to accommodate both used replaceable parts and new replaceable parts.

[0034] In some embodiments, the plurality of shelves are coupled to an elevator so that the elevator moves a replaceable part up and down within the storage chamber.

[0035] In some embodiments, the storage chamber is a vacuumable storage chamber having one or more access doors configured to allow the workpiece robot to access a replaceable part within the storage chamber and one or more access doors configured to allow replacement of a new or used replaceable part from the ambient environment.

[0036] In some embodiments, the workpiece handling robot is configured to transport one or more replaceable parts from the storage chamber to at least two processing stations within the process chamber using a scissors motion.

[0037] Another exemplary embodiment of the present disclosure relates to a system for processing workpieces. The system comprises: a front end configured to be maintained at atmospheric pressure; a load lock chamber disposed between the front end and a vacuum portion and having a workpiece column for storing workpieces; a transfer chamber disposed within the vacuum portion and having a transfer position configured to support a first workpiece handling robot, a second workpiece handling robot, and workpieces and focus rings in a stacked arrangement; and a first process chamber, a second process chamber, a third process chamber, and a fourth process chamber, wherein the first process chamber and the second process chamber are disposed on opposite sides of the transfer chamber within the vacuum portion, and the third process chamber and another process chamber are disposed on opposite sides of the transfer chamber, wherein the third process chamber is in a linear arrangement with the first process chamber and the fourth process chamber is in a linear arrangement with the second process chamber, and each of the first process chamber, the second process chamber, the third process chamber, and the fourth process chamber comprises two or more processing stations in a parallel arrangement. The system may have a storage chamber configured to store one or more focus rings coupled to the return chamber. The first workpiece handling robot and the second workpiece handling robot each have an end effector configured to support the focus ring. The system has a controller configured to control the motion of the end effector according to a robot arm motion pattern to access a processing station. The robot arm motion pattern is configured to extend in a first direction during a first time period, extend in a second direction which is lateral to the first direction during a second time period, extend in a third direction different from the first and second directions during a third time period, and retract again according to the same robot arm motion pattern.The first workpiece handling robot may be configured to convey workpieces and one or more focus rings between a workpiece column, a first process chamber, a second process chamber, and a conveying position, and the second workpiece handling robot may be configured to convey workpieces and one or more focus rings between a storage chamber, a third process chamber, a fourth process chamber, and a conveying position for automated processing of workpieces and automated replacement of focus rings without destroying the vacuum.

[0038] Another exemplary embodiment of the present disclosure relates to a method for replacing replaceable parts in a system for processing workpieces, wherein the system comprises a return chamber having one or more process chambers, each of the one or more process chambers comprising two or more processing stations arranged side-by-side, a storage chamber disposed on the return chamber, and one or more workpiece handling robots disposed within the return chamber having arms configured with end effectors. The method comprises the step of removing a used replaceable part from a processing station within the process chamber by the workpiece handling robot, said removal step comprising extending the end effector in a first direction during a first time period, extending in a second direction lateral to the first direction during a second time period, extending in a third direction different from the first and second directions during a third time period, picking up the used replaceable part and retracting it according to the same pattern; the step of returning the replaceable part to a storage chamber; and the step of removing a new replaceable part from the storage chamber by the workpiece handling robot. and may include a step of returning a new replaceable part to the processing station.

[0039] In some embodiments, the step of returning a new replaceable part to a processing station comprises the step of using a robot arm motion pattern to place the replaceable part within the processing station.

[0040] In some embodiments, the step of returning a replaceable part to a storage chamber comprises the step of using a first workpiece handling robot to return the used replaceable part from a return position within the return chamber to a stacking array, and the step of using a second workpiece handling robot to return the used replaceable part from the stacking array within the return position to the storage chamber.

[0041] In some embodiments, the step of removing a new replaceable part from a storage chamber with a workpiece handling robot comprises the step of using a second workpiece handling robot to return the new replaceable part from the storage chamber to a stacking array in a return chamber, and the step of using a first workpiece handling robot to return the new replaceable part from the stacking array in the return position to a processing station.

[0042] In some embodiments, the stacking array comprises a plurality of shelves configured to support one or more replaceable parts having a diameter larger than that of the workpiece.

[0043] Another exemplary embodiment relates to an end effector for moving workpieces and replaceable parts within a system for processing workpieces, wherein the end effector extends along the axial direction between a proximal end and a distal end. The end effector has an arm portion extending along the axial direction between a first arm end and a second arm end, wherein the first arm end is located at the proximal end of the end effector. The end effector also has a spatula portion extending along the axial direction between a first spatula end and a second spatula end, wherein the first spatula end is adjacent to the second arm end and the second spatula end is located at the distal end of the end effector. Additionally, the end effector has a first support member extending outwardly from the upper surface of the spatula portion, a second support member extending outwardly from the upper surface of the spatula portion, and a shared support member extending outwardly from the upper surface of the arm portion. The shared support member and the first support member are configured together to support a workpiece of a first diameter, and the shared support member and the second support member are configured together to support a replaceable part of a second diameter.

[0044] In some embodiments, the first diameter may be smaller than the second diameter. Additionally, in one or more embodiments, the second support member may be closer to the proximal end than the first support member.

[0045] Additionally, in some embodiments, the first and second support members may be spaced apart along the longitudinal direction so that a first contact area on the shared support member for a workpiece supported on the first support member is separated from a second contact area on the shared support member for a replaceable part supported on the second support member. In some embodiments, the second contact area may be closer to the proximal end than the first contact area.

[0046] In some embodiments, the first and second support members may be spaced apart along the longitudinal direction such that a first contact area on the shared support member for a workpiece supported on the first support member and a second contact area on the shared support member for a replaceable part supported on the second support member overlap at least partially.

[0047] Another exemplary embodiment of the present disclosure relates to an end effector for moving workpieces and replaceable parts within a system for processing workpieces, said end effector extending along an axial direction between a proximal end and a distal end. said end effector has an arm portion extending along an axial direction between a first arm end and a second arm end, said first arm end being at the proximal end of the end effector. said end effector further has a spatula portion extending along an axial direction between a first spatula end and a second spatula end, said first spatula end being adjacent to the second arm end and said second spatula end being at the distal end of the end effector. Additionally, the end effector comprises a first support member extending outwardly from the upper surface of the spatula portion, wherein the first support member is positioned at a first distance from the longitudinal axis of the end effector along a first direction. Additionally, the end effector comprises a second support member extending outwardly from the upper surface of the spatula portion, wherein the second support member is positioned at a second distance from the longitudinal axis of the end effector along a first direction. The first distance is greater than the second distance. In some embodiments, the second support member may be closer to the proximal end than the first support member.

[0048] Some embodiments may have an additional first support member and an additional second support member extending outwardly from the upper surface of the arm portion, wherein the first support member and the additional first support member are configured to support workpieces of a first diameter, and the second support member and the additional second support member are configured to support replaceable parts of a second diameter.

[0049] In some embodiments, the additional second support member may be closer to the distal end than the first support member.

[0050] In some embodiments, a shared support member extends outwardly from the upper surface of the arm portion, and the shared support member and the first support member may be configured together to support workpieces of a first diameter, and the shared support member and the second support member may be configured together to support replaceable parts of a second diameter.

[0051] Additionally, in some embodiments, the first and second support members may be spaced apart along the longitudinal direction such that a first contact area on the shared support member for a workpiece supported on the first support member and a second contact area on the shared support member for a replaceable part supported on the second support member overlap at least partially.

[0052] Additionally, in some embodiments, the second contact area may be closer to the proximal end than the first contact area.

[0053] Additionally, in some embodiments, the first and second support members may be spaced apart along the longitudinal direction such that a first contact area on the shared support member for a workpiece supported on the first support member and a second contact area on the shared support member for a replaceable part supported on the second support member overlap at least partially.

[0054] Another exemplary embodiment of the present disclosure relates to a focus ring adjustment assembly of a system for processing workpieces under vacuum, wherein the focus ring extends along a vertical direction between an upper portion and a lower portion, the lower portion having a first surface portion and a second surface portion, the first surface portion being perpendicular to the second surface portion. The focus ring adjustment assembly comprises a pin extending between a proximal end and a distal end, the distal end configured to selectively contact the first surface portion of the focus ring. The focus ring adjustment assembly further comprises an actuator operable to move the pin along the vertical direction between an extended position and a retracted position. The extended position of the pin is associated with the distal end of the pin in contact with the first surface of the focus ring, and the focus ring is accessible for removal by a workpiece handling robot from a vacuum process chamber.

[0055] In some embodiments, the pin may be positioned vertically higher along the vertical direction when the pin is in the extended position compared to when the pin is in the retracted position.

[0056] Some embodiments may have a rotary actuator configured to selectively rotate the pin, and rotation of the pin through a predefined locking angle secures the focus ring to the pin.

[0057] In some embodiments, the pin has a body portion and a flange portion, the body portion extends between the proximal end and the distal end, and the flange portion is spaced apart from the distal end of the pin and extends outwardly from the body portion. The flange portion may be configured to contact a transition surface portion positioned vertically between the first surface portion and the second surface portion of the focus ring when the distal end of the pin contacts the first surface portion of the focus ring.

[0058] Some embodiments further comprise a support plate located within the vacuum process chamber and a floating coupling fixed to the proximal end of the pin. The floating coupling may be slidably supported by the support plate so that the floating coupling can move horizontally relative to the support plate. The actuator may be configured to move the support plate along the vertical direction between an elevated position and a lowered position to move the pin between an extended position and a retracted position, wherein the elevated position of the support plate may be associated with the extended position of the pin and the lowered position of the support plate may be associated with the retracted position of the pin.

[0059] In some embodiments, the actuator may be vacuum sealed, the actuator is located outside the vacuum process chamber, and the actuator is coupled to the support plate through a connecting shaft extending through the outer wall of the vacuum process chamber.

[0060] Another exemplary embodiment of the present disclosure relates to a focus ring adjustment assembly of a system for processing workpieces under vacuum, wherein the focus ring extends along a vertical direction between an upper portion and a lower portion, and the focus ring has an inwardly concave groove from the lower portion toward the upper portion. The focus ring adjustment assembly may have a pin extending between a proximal end and a distal end, wherein the distal end may be configured to selectively contact the groove. Additionally, the focus ring adjustment assembly may have an actuator operable to move the pin along the vertical direction between an extended position and a retracted position. The extended position of the pin may be associated with the distal end of the pin in contact with the groove, and the focus ring is accessible for removal by a workpiece handling robot from a vacuum process chamber.

[0061] In some embodiments, the focus ring may extend along the radial direction between the inner surface and the outer surface, and the groove is annular with respect to the focus ring and is spaced apart from the inner surface and the outer surface.

[0062] In at least one embodiment, the groove has a first groove portion and a second groove portion, the first groove portion extends from the lower portion of the focus ring by a first distance from the lower portion, and the second groove portion extends from the lower portion by a second distance from the first distance, and the second distance may be smaller than the thickness of the focus ring between the upper portion and the lower portion along the vertical direction.

[0063] In the embodiments, the pin may have a main body portion and a flange portion, the main body portion extends between a proximal end and a distal end, and the flange portion is spaced apart from the distal end of the pin and extends outwardly to the main body portion. The flange portion may be configured to be at least partially received within a first groove portion, and a portion of the pin extending between the flange portion and the distal end may be at least partially received within a second groove portion.

[0064] In some embodiments, the focus ring may be positioned vertically higher along the vertical direction when the pin is in the extended position compared to when the pin is in the retracted position.

[0065] Additionally, some embodiments may include a support plate located within a vacuum process chamber and adjacent to the outer wall of the vacuum process chamber, and a floating coupling fixed to the proximal end of the pin. The floating coupling may be slidably supported by the support plate so that the floating coupling can move horizontally relative to the support plate. The actuator may be configured to move the support plate along the vertical direction between an elevated position and a lowered position to move the pin between an extended position and a retracted position, wherein the elevated position of the support plate is associated with the extended position of the pin and the lowered position of the support plate is associated with the retracted position of the pin.

[0066] Additionally, in some embodiments, the actuator may be vacuum sealed, the actuator is located outside the vacuum processing chamber, and the actuator is coupled to a support plate through a connecting shaft extending through the outer wall of the vacuum processing chamber.

[0067] Another exemplary embodiment of the present disclosure relates to a plasma processing apparatus. The apparatus may have a processing chamber forming a vertical direction and a lateral direction. The plasma processing apparatus may have a pedestal disposed within the processing chamber. The pedestal may be configured to support a substrate. The plasma processing apparatus may have a radio frequency (RF) bias electrode disposed within the pedestal. The RF bias electrode may extend between a first end of the RF bias electrode and a second end of the RF bias electrode along the lateral direction. The RF bias electrode may form an RF zone extending laterally between the first end of the RF bias electrode and the second end of the RF bias electrode. In some embodiments, the RF zone may extend along the lateral direction from the first end of the RF bias electrode to the second end of the RF bias electrode. Alternatively or additionally, the RF zone may extend along the vertical direction between the RF bias electrode of the plasma processing apparatus and a dielectric window.

[0068] The plasma processing device may have a focus ring disposed within a processing chamber. The plasma processing device may have a focus ring adjustment assembly having a lift pin located outside the RF zone. The lift pin may be movable along the vertical direction to move the focus ring between at least a first position and a second position to adjust the distance between the pedestal and the focus ring along the vertical direction. In some embodiments, the focus ring is positioned on the pedestal when the focus ring is in the first position. Additionally, the focus ring is spaced apart from the pedestal by the distance when the focus ring is in the second position.

[0069] In some embodiments, the plasma processing device may have a ground plane spaced apart from the RF bias electrode along the vertical direction. The ground plane may extend along the lateral direction between a first end of the ground plane and a second end of the ground plane. In some embodiments, the length of the ground plane along the lateral direction may be greater than the length of the RF bias electrode along the lateral direction. In some embodiments, the lift pin penetrates the ground plane. In some embodiments, the RF bias electrode and the ground plane are disposed within a pedestal.

[0070] In some embodiments, the focus ring adjustment assembly may have an actuator configured to move a lift pin along a vertical direction to move the focus ring between at least a first position and a second position. In some embodiments, the actuator is located outside the processing chamber. In some embodiments, the focus ring adjustment assembly may have a second actuator configured to rotate the lift pin in a vertical direction. In some embodiments, the second actuator is located outside the processing chamber.

[0071] Another exemplary embodiment of the present disclosure relates to a plasma processing apparatus. The apparatus may have a processing chamber forming a vertical direction and a lateral direction. The plasma processing apparatus may have a pedestal disposed within the processing chamber. The pedestal may be configured to support a substrate. The plasma processing apparatus may have a radio frequency (RF) bias electrode disposed within the pedestal. The RF bias electrode may extend laterally between a first end of the RF bias electrode and a second end of the RF bias electrode. The RF bias electrode may form an RF zone extending laterally between a first end of the RF bias electrode and a second end of the RF bias electrode. The plasma processing apparatus may have a ground plane spaced apart from the RF bias electrode along the vertical direction. The plasma processing apparatus may have a focus ring disposed within the processing chamber. The plasma processing apparatus may have a focus ring adjustment assembly having a lift pin penetrating the ground plane. The lift pin may be movable along the vertical direction to move the focus ring between at least a first position and a second position to adjust the distance between the pedestal and the focus ring along the vertical direction. In some embodiments, the lift pin may be located outside the RF zone.

[0072] Now, with reference to FIG. 1, an exemplary embodiment of the present disclosure will be described.

[0073] FIG. 1 illustrates an exemplary workpiece processing system (100) according to an exemplary embodiment of the present disclosure. The processing system (100) may have a forward end (112), one or more load lock chambers (114), a return chamber (115), and a plurality of process chambers including a first process chamber (120) and a second process chamber (130). The system may have a first workpiece handling robot (150) for returning workpieces to / from the workpiece column (110) in the load lock chamber (114) and to / or between the first process chamber (120) and the second process chamber (130).

[0074] The front end (112) may be configured to be maintained at atmospheric pressure and may be configured to be coupled with a workpiece input device (1180). The workpiece input device (118) may be equipped with, for example, a cassette, a front-opening integrated pod, or other device for supporting multiple workpieces. The workpiece input device (118) may be used to provide a pre-processed workpiece to the processing system (100) or to receive a post-processed workpiece from the processing system (100).

[0075] The front end (112) may be equipped with one or more robots (not shown) for conveying a workpiece from a workpiece input device (118), for example, to a load lock chamber (114), for example, to / from a workpiece column (110) located within the load lock chamber (114). In one example, the robot in the front end (112) may convey a workpiece to the load lock chamber (114) and may convey a post-processed workpiece from the load lock chamber (114) to one or more workpiece input devices (1180). Any suitable robot for conveying a workpiece may be used in the front end (112) without departing from the scope of the present disclosure. Workpieces may be conveyed to and / or from the load lock chamber (114) through a suitable slit, opening, or aperture.

[0076] The load lock chamber (114) may have a workpiece column (110) configured to support a plurality of workpieces in a stacked arrangement. The workpiece column (110) may have, for example, a plurality of shelves. Each shelf may be configured to support one or more workpieces. In one exemplary embodiment, the workpiece column (110) may have one or more shelves for supporting pre-processed workpieces and one or more shelves for supporting post-processed workpieces.

[0077] In some embodiments, suitable valves are provided with the load lock chamber (114) and other chambers to appropriately adjust the process pressure for processing workpieces. In some embodiments, the load lock chamber (114) and the return chamber (115) may be maintained at the same pressure. In these embodiments, it is not necessary to seal the load lock chamber (114) from the return chamber (115). In fact, in some embodiments, the load lock chamber (114) and the return chamber (115) may be part of the same chamber.

[0078] A single load lock chamber (114) is illustrated in FIG. 1. Those skilled in the art using the disclosure provided herein will understand that multiple load lock chambers (114) may be used in any processing system described herein without departing from the scope of the disclosure. For example, the system (100) may have a first load lock chamber for returning workpieces to a vacuum portion of the system (100) and a second load lock chamber for returning workpieces outside the vacuum portion of the system (100).

[0079] The first process chamber (120) and the second process chamber (130) may be used to perform any of the various workpiece processes on a workpiece, such as a vacuum annealing process, a surface treatment process, a dry strip process, a dry etching process, a deposition process, and other processes. In some embodiments, one or more of the first process chamber (120) and the second process chamber (130) may be equipped with a plasma-based process source, such as, for example, an inductively coupled plasma (ICP) source, a microwave source, a surface wave plasma source, an ECR plasma source, and a capacitively coupled (parallel plate) plasma source.

[0080] As described, the first process chamber (120) and the second process chamber (130) each have a pair of processing stations arranged in parallel so that a pair of workpieces can be simultaneously exposed to the same process. More specifically, the first process chamber (120) may have a first processing station (122) and a second processing station (124) arranged in parallel. The second process chamber (130) may have a first processing station (132) and a second processing station (134) arranged in parallel. Each processing station may have a workpiece support (e.g., a pedestal) for supporting the workpiece during processing. In some embodiments, each processing station may share a common pedestal having two parts for supporting the workpiece. In some embodiments, the workpiece support may have a pedestal assembly having a base plate, an electrostatic chuck configured to support the workpiece, and a replaceable part. The replaceable part may have a focus ring positioned relative to the electrostatic chuck such that when the workpiece is placed on the electrostatic chuck, at least a portion of the focus ring surrounds at least partially the periphery of the workpiece. The first process chamber (120) and / or the second process chamber (130) may be optionally sealed from the return chamber (115) for processing.

[0081] The return chamber (115) may be equipped with a workpiece handling robot (150). The workpiece handling robot (150) may be configured to return a workpiece from a workpiece column (110) in a load lock chamber (114) to a processing station in a first process chamber (120) and / or a second process chamber (130). The workpiece handling robot (150) may also return workpieces between the first process chamber (120) and the second process chamber (130).

[0082] As illustrated in FIG. 1, the workpiece processing system (100) may have a storage chamber (250) for storing new and / or used replaceable parts (e.g., focus rings) coupled to a return chamber (115). In some embodiments, the storage chamber is mounted on the rear side of the return chamber (115). The storage chamber (250) may have a plurality of shelves configured to support replaceable parts. The shelves may be configured to support a plurality of replaceable parts in a vertical / stacked arrangement. In certain embodiments, the shelves may be coupled to an elevator so that the elevator moves the replaceable parts up and down within the storage chamber (250). In some embodiments, the storage chamber (250) may have one or more test workpieces. For example, one or more shelves may be configured to support test workpieces.

[0083] In some embodiments, the storage chamber (250) is a vacuumable storage chamber that can be maintained at the same vacuum as the return chamber (115). In certain other embodiments, the storage chamber (250) is configured to be sealed from the return chamber (115). The vacuumable storage chamber may have one or more access doors configured to allow a workpiece handling robot to access replaceable parts within the storage chamber. For example, the access doors are large enough so that a workpiece handling robot can place used replaceable parts on shelves within the storage chamber (250) and remove new replaceable parts from one of the shelves. Thus, replaceable parts can be placed within or removed from the storage chamber (250) without destroying the vacuum of the entire system.

[0084] In some embodiments, the storage chamber (250) may have one or more access doors configured to allow replacement of new or used replaceable parts from the ambient environment. For example, in a specific embodiment, the storage chamber (250) communicating with the return chamber (115) may be sealed so that the return chamber (115) is maintained at a desired process pressure. Then, the storage chamber (250) may be accessed from the ambient environment and serviced so that used replaceable parts can be removed from the storage chamber (250) and new replaceable parts can be placed inside the storage chamber (250). After the service of the storage chamber (250) is completed, the storage chamber (250) may be returned to a desired process pressure using any known system for setting the process pressure within the storage chamber (250). When a desired process pressure, such as the same process pressure as the return chamber (115) or a vacuum, is achieved, the storage chamber (250) may not be sealed from the return chamber (115), so that one or more workpiece handling robots can access the storage chamber (250) again.

[0085] The workpiece handling robot (150) may be configured to transport replaceable parts between the storage chamber (250) and various processing stations for automated replacement of replaceable parts without breaking the vacuum. For example, the workpiece handling robot (150) may be used to transport replaceable parts from the first process chamber (120) or the second process chamber (130) to the storage chamber (250). The workpiece handling robot (150) may also be used to transport replaceable parts from the storage chamber (250) to the first process chamber (120) or the second process chamber (130). In a specific embodiment, the workpiece handling robot (150) may retrieve used replaceable parts from one of the processing stations within the first process chamber (120) and / or the second process chamber and transport the used parts to the storage chamber (250). The workpiece handling robot (150) can also retrieve a new replaceable part from the storage chamber (250) and return the new replaceable part to one of the processing stations, either the first process chamber (120) or the second process chamber (130).

[0086] The workpiece handling robot can be coupled to a controller, so that the controller can be used to control the workpiece handling robot to return new or used replaceable parts to the storage chamber and processing chamber (120, 130). The controller can be configured to control the motion of the workpiece handling robot (150) according to a robot arm motion pattern (280) (shown in FIG. 6) to access one or more processing stations of the first process chamber (120) or the second process chamber (130).

[0087] Referring to FIG. 2, the processing system (200) may have additional process chambers having a third process chamber (170) and a fourth process chamber (180). The third process chamber (170) is arranged in a linear arrangement with the first process chamber (120) and the fourth process chamber (180) is arranged in a linear arrangement with the second process chamber (130), so that the third process chamber (170) and the fourth process chamber (180) are arranged on opposite sides of the return chamber (195).

[0088] The third process chamber (170) and the fourth process chamber (180) may be used to perform any of the various workpiece processes on workpieces, such as vacuum annealing processes, heat treatment processes, surface treatment processes, dry stripping processes, dry etching processes, deposition processes, and other processes. In some embodiments, one or more of the third process chamber (170) and the fourth process chamber (180) may be equipped with a plasma-based process source, such as, for example, an inductively coupled plasma (ICP) source, a microwave source, a surface wave plasma source, an ECR plasma source, and a capacitively coupled (parallel plate) plasma source. In certain embodiments, a focus ring may be used in a plasma processing source used to provide a direct ion plasma etching process.

[0089] As described, the third process chamber (170) and the fourth process chamber (180) each have a pair of processing stations arranged side by side so that a pair of workpieces can be simultaneously exposed to the same process. More specifically, the third process chamber (170) may have a first processing station (172) and a second processing station (174) arranged side by side. The fourth process chamber (180) may have a first processing station (182) and a second processing station (184) arranged side by side. Each processing station may have a workpiece support (e.g., a pedestal) for supporting the workpiece during processing. In some embodiments, each processing station may share a common pedestal having two parts for supporting the workpiece. In some embodiments, the workpiece support may have a pedestal assembly having a base plate, an electrostatic chuck configured to support the workpiece, and a replaceable part. The replaceable part may have a focus ring positioned relative to the electrostatic chuck such that when the workpiece is placed on the electrostatic chuck, at least a portion of the focus ring surrounds at least partially the periphery of the workpiece. In some embodiments, the third process chamber (170) and / or the fourth process chamber (180) may be optionally sealed from the return chamber (115) for processing.

[0090] To return workpieces to the third process chamber (170) and the second process chamber (180), the system (200) may further include a return location (162) and a second workpiece handling robot (190). The return location (162) may be part of the return chamber (162) or a separate chamber. The return location (162) may include a support column (160) for supporting a plurality of workpieces in a stacked arrangement and / or a parallel arrangement. For example, the support column (160) may include a plurality of shelves configured to support workpieces in a stacked vertical arrangement. The first workpiece handling robot (150) may be configured to return workpieces from the workpiece column (110), the first process chamber (120), or the second process chamber (130) to the workpiece column (160) within the return location (162). The second workpiece handling robot (190) may be configured to return workpieces from a support column (160) in a return position (162) to processing stations in the third process chamber (170) and / or the fourth process chamber (180). The workpiece handling robot (190) may also return workpieces from the third process chamber (170) to the fourth process chamber (180).

[0091] As illustrated in FIG. 2, the workpiece processing system (200) may have a storage chamber (250) for storing new and / or used replaceable parts (e.g., focus rings) coupled to a return chamber. The storage chamber is mounted on the rear side of the return chamber. A workpiece handling robot (150, 190) may be configured to return replaceable parts between various return locations and processing stations for automated replacement of replaceable parts without breaking the vacuum. In some embodiments, the storage chamber (250) may store test workpieces.

[0092] To transport replaceable parts between the first process chamber (120), the second process chamber (130), and the storage chamber (250), the system (200) may use the second workpiece handling robot (190) to transport new or used replaceable parts from the storage chamber (250) to the storage chamber (250) within the transport location (162). The transport location (162) may be part of the transport chamber (162) or a separate chamber. The transport location (162) may be provided with a support column (160) for supporting a plurality of replaceable parts in a stacked arrangement. For example, the support column (160) may be provided with a plurality of shelves configured to support replaceable parts in a stacked vertical arrangement. Thus, in some embodiments, the support column (160) is configured to support workpieces and replaceable parts in a stacked arrangement. The first workpiece handling robot (150) may be configured to return replaceable parts from a support column (160) to a parallel processing station (122, 124) of the first process chamber or to a parallel processing station (132, 134) of the second process chamber (130). The second workpiece handling robot (190) may be configured to return replaceable parts from a support column (160) within a return position (162) to parallel processing stations (172, 174) in the third process chamber, parallel processing stations (182, 184) in the fourth process chamber (180), and / or to a storage chamber (250).

[0093] In removing used replaceable parts or providing new replaceable parts to one or more processing stations, the workpiece handling robot (150, 190) may use a robot arm motion pattern. For example, a controller may be used to control the motion of an end effector on the arm of the workpiece handling robot (150, 190) to control the motion of the end effector when accessing a processing station to return a replaceable part. The workpiece handling robot (150) may use a robot arm motion pattern to access processing stations (122, 124, 132, 134). The workpiece handling robot (190) may use a robot arm motion pattern to access processing stations (172, 174, 182, 184).

[0094] The processing system (200) may be configured to have four process chambers (120, 130, 170, 180) and to process eight workpieces simultaneously. Additional processing stations may be added in a linear fashion to provide additional processing capacity. For example, a fifth process chamber may be added in a linear arrangement with the third process chamber (170). A sixth process chamber may be added in a linear arrangement with the fourth process chamber (180). Additional return locations and workpiece handling robots may be used to return workpieces to and from the fifth and sixth process chambers. Additional processing chambers may be provided by extending the processing system in a linear fashion in this manner.

[0095] In certain embodiments, the workpiece storage chamber may be located at other locations within the processing system without departing from the scope of the present disclosure. For example, in some embodiments, the workpiece storage chamber may be located above or below a return location (e.g., return location (162) of the processing system (200)). Additionally, one or more of the processing chambers of the workpiece processing system (e.g., processing stations (120, 130, 170, or 180) of the processing system (200)) may be replaced with storage chambers for new and / or used replaceable parts according to exemplary embodiments of the present disclosure.

[0096] In another embodiment, the storage chamber (250) may be located at another location within the processing system without departing from the scope of the present disclosure. For example, the storage chamber may be placed on one or more process chambers (120, 130, 170 and / or 180). The storage chamber may also be located above or below a return location (e.g., return location (162) of the processing system (200)). Additionally, one or more of the processing chambers of the workpiece processing system (e.g., processing station (120, 130, 170 or 180) of the processing system (200)) may be replaced with a storage chamber for new and / or used replaceable parts according to exemplary embodiments of the present disclosure.

[0097] FIG. 3 illustrates an exemplary conveying mechanism (260) mounted in a processing chamber of a workpiece processing system (200) according to exemplary embodiments of the present disclosure. The conveying mechanism (260) may be directly coupled to the processing chamber (130). In other embodiments, the conveying mechanism (260) may be coupled to any processing chamber including 120, 130, 170 and / or 180. As illustrated, the conveying mechanism (260) may have a replaceable part storage location (262) (e.g., a shelf) capable of storing used and new replaceable parts (e.g., a focus ring). The conveying mechanism (260) may have robotics (270) configured to convey the replaceable parts to their appropriate location within the processing station.

[0098] FIG. 4 illustrates a side view of an exemplary support column (160) within a return position (162) according to exemplary embodiments of the present disclosure. As illustrated, the support column (160) may have a plurality of shelves (16). Each shelf (161) may be configured to support a workpiece (163) so that a plurality of workpieces (163) can be arranged on the support column in a vertical / stacking arrangement. Each shelf (161) may also be configured to support a replaceable part (165) so that a plurality of replaceable parts (165) can be arranged on the support column (160) in a vertical / stacking arrangement. Thus, the shelves (161) of the support column (160) are configured to support both the workpiece (163) and the replaceable part (165). In a particular embodiment, the replaceable part (165) may have a larger diameter compared to the workpiece (163). Accordingly, the shelf (161) is configured to support a replaceable part (165) having a larger diameter than the workpiece (163). In a specific embodiment, the replaceable part may have a focus ring. Focus rings used in the system provided herein may have a larger diameter compared to the workpieces. Accordingly, the support column (160) is configured to support both the workpiece and the focus ring having the larger diameter.

[0099] In some embodiments, the return location may have an opening or aperture that passes completely through the return location so that workpiece handling robots can return workpieces and / or replaceable parts using direct return between robots.

[0100] FIG. 5 illustrates a side view of an exemplary workpiece column (110) according to exemplary embodiments of the present disclosure. As illustrated, the workpiece column (110) may have a plurality of shelves (11). Each shelf (111) may be configured to support a workpiece (113) so that a plurality of workpieces (113) can be arranged on the workpiece column (110) in a vertical stacked arrangement.

[0101] In some embodiments, alternative approaches to the transport of replaceable parts in a workpiece processing system may be used without departing from the scope of the present disclosure. For example, an additional transport mechanism (e.g., a robot, a shuttle mechanism, multi-axis robotics) may be mounted in the process chamber to transport replaceable parts into and out of the process chamber.

[0102] FIG. 6 illustrates an exemplary robot arm motion pattern according to exemplary embodiments of the present disclosure. As illustrated, the system (100) comprises a workpiece handling robot (150) having an arm having an end effector (500). As illustrated in FIG. 6, the end effector (500) may be moved within the system (100) according to multi-directional movement. For example, the end effector (500) may be located inside a return chamber (115). As illustrated, when a used replaceable part (165) can be retrieved from one of the parallel processing stations (122 or 124, as illustrated), the end effector (500) may be moved to one of the processing stations according to a robot arm motion pattern (280).

[0103] The robot arm motion pattern (280) may be configured to extend in a first direction during a first time period, extend in a second direction that is generally later to the first direction during a second time period, and extend in a third direction that is different from the first and second directions during a third time period. As illustrated, the robot arm motion pattern (280) may be used to place the end effector (500) at one of the processing stations (122 or 124).

[0104] In some embodiments, the robot arm motion pattern may comprise extending the end effector (500) in a first direction during a first time period so that the end effector enters the processing chamber (120). Thus, in some embodiments, extending the end effector (500) in the first direction moves the end effector from the return chamber (115) to the process chamber (120), but does not place the end effector (500) within one of the parallel stations (122, 124). Then, the end effector (500) may be moved along a second direction that is generally later to the first direction to place the end effector (500) within one of the parallel processing chambers (122, 124). As used herein, “generally lateral” or “lateral” refers to within about 45° perpendicular to the first direction. In some embodiments, the second direction may be in the range of about 10° to about 70° perpendicular to the first direction, e.g., 20° to about 60°, e.g., 30° to about 50°. Then, the end effector (500) may be moved in a third direction to ensure proper placement of the end effector (500) within the processing station (122) so that the retrieval of the used replaceable part can be achieved. In some embodiments, the third direction may be 30° or less perpendicular to the first direction. In some embodiments, the end effector (500) may also be removed from the processing station (122) according to the same robot arm motion pattern. For example, the end effector (500) may be retracted into the return chamber (115) according to the same robot arm motion pattern (280).

[0105] In a specific embodiment, the end effector (500) may have a new replaceable part (165) on it. For example, the end effector (500) may retrieve a new replaceable part (165) from a support column (160) or a storage chamber (250). Then, the end effector (500) having the new replaceable part (165) on it may place the new replaceable part (165) within a processing station (122) according to an exemplary robot arm motion pattern provided herein. For example, the end effector may be moved in a first direction during a first time period to access the process chamber (120), moved in a second direction laterally to the first direction during a second time period to access one of the parallel processing stations (122), and moved in a third direction different from the first and second directions during a third time period to ensure proper placement of a new replaceable part (165) within one of the parallel processing stations (122, 124).

[0106] The robot arm motion pattern (280) disclosed in this specification may be used by one or more workpiece handling robots of the system. For example, the workpiece handling robots (150, 190) may all be coupled to a controller capable of executing the robot arm motion pattern (280) described in this specification. The robot arm motion pattern (280) may be used by the workpiece handling robots (150, 190) to access any of the parallel processing stations (122, 124, 132, 134, 172, 174, 182, 184) of each of the process chambers (120, 130, 170, 180) disclosed in this specification.

[0107] In some embodiments, the workpiece handling robot may be configured to convey workpieces and replaceable parts using a scissor motion. For example, the workpiece handling robot (150) may simultaneously convey workpieces from a workpiece column in a load lock chamber (114) to two parallel processing stations (122, 124) in a first process chamber (120), for example, using a scissor motion. Similarly, the workpiece handling robot (150) may simultaneously convey workpieces from a workpiece column (110) in a load lock chamber (114) to two parallel processing stations (132, 134) in a second process chamber (130), for example, using a scissor motion. The workpiece handling robot (190) can simultaneously transport a workpiece from a support column (160) in a transport position (162) to two parallel processing stations (172, 174) in a third process chamber (170) using, for example, a scissor motion. The workpiece handling robot (190) can simultaneously transport a workpiece from a support column (160) in a transport position (162) to two parallel processing stations (182, 184) in a fourth processing chamber (180) using, for example, a scissor motion.

[0108] In some embodiments, the controller may be configured to adjust the motion of the end effector to convey replaceable parts (e.g., focus rings) based at least partially on data received from one or more sensors (e.g., sensors associated with an automated wafer centering system). For example, optical sensor(s) may be used to monitor the motion of the replaceable parts during the motion pattern. To ensure proper placement of the replaceable parts, the controller may adjust the motion pattern in real time as the workpiece handling robot conveys the replaceable parts, thereby providing proper placement of the replaceable parts with reduced error.

[0109] In some embodiments, one or more sensors may be used to determine the position of a replaceable part after it has been delivered to the process chamber by a workpiece handling robot. The sensors may include, for example, one or more optical sensors. A controller may be configured to control the workpiece handling robot to adjust the position of the replaceable part when sensor measurements indicate that the replaceable part is positioned incorrectly (e.g., concentrically with the workpiece support).

[0110] FIG. 7 illustrates a flowchart of an exemplary method (300) according to exemplary aspects of the present disclosure. The method (300) comprises a method for replacing a replaceable part in a system for processing a workpiece. The method (300) will be discussed, for example, with reference to the system of FIG. 2. The method (300) may be implemented in any suitable processing device. FIG. 7 illustrates steps performed in a specific order for the sake of example and discussion. Those skilled in the art will understand that, by using the disclosure provided herein, various omissions, extensions, concurrent executions, rearrangements, and / or modifications may be made without departing from the scope of the present disclosure. Additionally, various steps (not illustrated) may be performed without departing from the scope of the present disclosure.

[0111] In step (302), the method may comprise the step of removing a used replaceable part (165) from a processing station (122, 124, 132, 134, 172, 174, 182 or 184). The workpiece handling robot (150) may move an end effector (500) from a return chamber (115) to a process chamber (120) and into a processing station (122) according to a robot arm motion pattern. The robot arm motion pattern may comprise extending the end effector (500) in a first direction during a first time period, extending the end effector (500) in a second direction which is lateral to the first direction during a second time period, and extending the end effector (500) in a third direction different from the first and second directions during a third time period. Once the end effector (500) is in the correct position within the processing chamber (122), the replaceable part can be placed on the end effector (500). In some embodiments, the end effector (500) can lift the replaceable part (165) from an elevated position within the processing station (122). For example, a plurality of pins connected to a lifting mechanism can be used to raise the replaceable part (165) from its processing position to an elevated position. Once in the elevated position, the end effector (500) can be easily placed under the replaceable part (165) to lift the replaceable part (165) from one or more pins.

[0112] Once the replaceable part (165) is placed on the end effector (500), the end effector (500) can be retracted into the return chamber (115) via a robot arm motion pattern. For example, the end effector (500) having the used replaceable part (165) can be retracted along a third direction different from the first and second directions during a third time period, retracted along a second direction lateral to the first direction during a second time period, and retracted along a first direction during a first time period until the end effector (500) having the replaceable part (165) on it is repositioned within the return chamber (115).

[0113] In step (304), the method comprises the step of returning a replaceable part to a storage chamber. Returning the replaceable part (165) to the storage chamber (250) may comprise using a workpiece handling robot (150) to place the used replaceable part (165) on a support column (160) within a return position (162). For example, the used replaceable part (165) may be placed on one of the shelves (161) located in the support column (160) in a stacked arrangement. Then, the workpiece handling robot (190) may remove the used replaceable part (165) from the shelf (161) from the support column (160) and return the replaceable part (165) to the storage chamber (250). The workpiece handling robot (190) may place the used replaceable part (165) on one of the shelves located within the storage chamber (250).

[0114] In step (306), the method comprises the step of removing a new replaceable part from a storage chamber. The workpiece handling robot (190) can remove a new replaceable part (165) from one of the shelves in the storage chamber (250) and place the new replaceable part on one of the shelves (161) in the support column (160) at a conveying position (162) in a stacking arrangement.

[0115] In step (308), the method comprises the step of returning a new replaceable part to a processing station. Once the new replaceable part (165) is positioned on one of the shelves (161) within the support column (160), the workpiece handling robot (150) can access the support column (160) to remove the new replaceable part (165). Afterward, the workpiece handling robot (150) can be used to place the new replaceable part into one of the parallel processing stations according to a robot arm motion pattern. For example, the workpiece handling robot (150) can move an end effector (500) having the new replaceable part (165) from the return chamber (115) to the process chamber (120) and into the processing station (122) according to a robot arm motion pattern. The robot arm motion pattern may comprise extending the end effector (500) in a first direction during a first time period, extending the end effector (500) in a second direction which is lateral to the first direction during a second time period, and extending the end effector (500) in a third direction different from the first and second directions during a third time period. Once the end effector (500) is in the correct position within the processing chamber (122), a new replaceable part (165) can be deposited within the processing station in any suitable manner. For example, in one embodiment, the replaceable part (165) (e.g., a focus ring) can be placed on a plurality of pins in an elevated position. Once securely placed on the pins, the pins can be lowered to place the replaceable part at a desired position within the processing station (122), so that additional workpiece processing can be achieved.

[0116] Once the replaceable part (165) is placed within the processing station (122), the end effector can be retracted back into the return chamber (115) via a robot arm motion pattern (280). For example, the end effector (500) can be retracted along a third direction different from the first and second directions during a third time period, retracted along a second direction lateral to the first direction during a second time period, and retracted along a first direction during a first time period until the end effector (500) is positioned within the return chamber (115).

[0117] In some embodiments, a workpiece handling robot may remove a test workpiece from a storage location. The test workpiece may be returned to a processing station. A test process may be performed using the test workpiece. Data collected during the test process and / or characteristics of the test workpiece may be monitored to determine the appropriate placement of a replaceable part.

[0118] Advantageously, the method (300) can be performed to allow the automated replacement of a replaceable part without destroying the vacuum of the processing system. Additionally, the method (300) enables the replacement of a replaceable part using a workpiece handling robot capable of transporting a replaceable part larger than the workpiece and the workpiece. Additionally, a robot arm motion pattern allows the end effector of the workpiece handling robot to enter one of the parallel processing stations so that the replaceable part can be replaced.

[0119] FIG. 8 illustrates a flowchart of an exemplary method (400) according to exemplary aspects of the present disclosure. The method (400) comprises a method for processing a workpiece. The method (400) will be discussed, for example, with reference to the system of FIG. 2. The method (400) may be implemented in any suitable processing device. FIG. 8 illustrates steps performed in a specific order for the sake of example and discussion. Those skilled in the art will understand that, by using the disclosure provided herein, various omissions, extensions, concurrent executions, rearrangements, and / or modifications may be made without departing from the scope of the present disclosure. Additionally, various steps (not illustrated) may be performed without departing from the scope of the present disclosure.

[0120] In step (402), the method comprises the step of conveying a plurality of workpieces to a workpiece column within a load lock chamber. For example, a plurality of workpieces may be conveyed from a front end of a processing system to a workpiece column (110) within a load lock chamber (114). The workpieces may be conveyed to the workpiece column (110) using, for example, one or more robots associated with the front end of the processing system.

[0121] In step (404), the method comprises the step of using a workpiece handling robot to return workpieces from a workpiece column to processing stations within a first process chamber and / or a second process chamber. For example, the workpiece handling robot (150) can return two workpieces to each of the processing station (122) and processing station (124) within the process chamber (120).

[0122] In step (406), the method comprises the step of performing a first processing process on a plurality of workpieces in a first process chamber and / or a second process chamber. The first processing process may comprise, for example, an annealing process, a heat treatment process, a surface treatment process, a dry strip process, a dry etching process, a deposition process, or other processes.

[0123] In step (408), the method may comprise the step of returning a plurality of workpieces to a return position using a workpiece handling robot. The workpiece handling robot (150) may return two workpieces to each of the processing station (122) and the processing station (124) within the process chamber (120). In some embodiments, the workpiece handling robot (150) may return the workpieces to a workpiece column (160) located at a return position (162).

[0124] In step (410), the method may comprise the step of transferring a plurality of workpieces from a transfer position to at least two processing stations in a third process chamber and / or a fourth process chamber using a second workpiece handling robot (190) placed in a transfer chamber. The third process chamber may be arranged in a linear arrangement with the first process chamber, and the fourth process chamber may be arranged in a linear arrangement with the second process chamber. For example, the workpiece handling robot (190) may transfer two workpieces from a workpiece column (160) in a transfer position (162) to a processing station (172) and a processing station (174) respectively in a processing chamber (170).

[0125] In step (412), the method may comprise the step of performing a second processing process on a plurality of workpieces in a third process chamber and / or a fourth process chamber. The third processing process may comprise, for example, an annealing process, a heat treatment process, a surface treatment process, a dry strip process, a dry etching process, a deposition process, or other processes.

[0126] In step (414), the method may include the step of returning a plurality of workpieces to a return position by a workpiece handling robot (190). For example, the workpiece handling robot (190) may return workpieces from a process chamber (170) and / or a process chamber (180) to a workpiece column (160) located at a return position (162).

[0127] In step (416), the method may comprise the step of returning the processed workpieces to a workpiece column in a load lock chamber. For example, the workpiece handling robot (150) may return two workpieces from the first process chamber (120) and / or the second process chamber (130). In some embodiments, the workpiece handling robot (150) may return two workpieces from a return position (162) to a workpiece column in a load lock chamber. Then, one or more robots located at the front end of the processing system may be returned, for example, to a cassette of processed workpieces.

[0128] As described, steps (404)–(416) may be repeated according to the number of workpieces required for processing. After a desired number of workpieces have been processed or another trigger condition has occurred, the method may include a step of replacing replaceable parts (418) at processing stations. For example, replaceable parts such as a focus ring may need to be replaced after being exposed to a certain number of processing operations. Replacing the replaceable parts (418) can be achieved by the method (300) provided herein. Thus, the system and method enable automated processing of workpieces and automated replacement of replaceable parts without changing the vacuum or process pressure of the system.

[0129] Now, referring to FIGS. 9-12b, exemplary embodiments of an end effector are illustrated according to exemplary embodiments of the present disclosure. More specifically, FIG. 9 illustrates a perspective view of an exemplary end effector for use in the system described above. FIGS. 10a-10b illustrates a first configuration of support members on the end effector of FIG. 9 for supporting an exemplary workpiece and a focus ring. FIGS. 11a-11b also illustrates a second configuration of support members on the end effector of FIG. 9 for supporting an exemplary workpiece and a focus ring. FIGS. 12a-12b also illustrates a partial perspective view of a third configuration of support members on the end effector of FIG. 9 for supporting an exemplary workpiece and a focus ring.

[0130] As illustrated in FIG. 9, the end effector (500) described above with reference to the system (100, 200) may extend along the longitudinal axis (502) between the proximal end (504) and the distal end (506), and between the upper surface (500US) and the lower surface (500LS) along the vertical direction (V1). The end effector (500) is generally symmetric with respect to the longitudinal axis (502). The end effector (500) comprises an arm portion (508) and a spatula portion (510). The arm portion (508) extends generally along the longitudinal axis (502) between the first arm end (512) and the second arm end (514), and the first arm end (512) is located at or adjacent to the proximal end (504). Similarly, the spatula portion (510) extends between the first spatula end (516) and the second spatula end (518). The first spatula end (516) is at or adjacent to the second spatula end (518), and the second spatula end (518) is at or adjacent to the distal end (506). The end effector (500) is attached to a robot (e.g., a workpiece handling robot (150, 190)) by its arm portion (508) or otherwise configured to operate so that the spatula portion (510) can be guided under a raised workpiece or a replaceable part (e.g., a focus ring).

[0131] Generally, the end effector (500) may be configured to support workpieces and replaceable parts individually, wherein the workpieces have different diameters than the replaceable parts. For example, as illustrated in FIGS. 10a, 11a and 12a, the end effector (500) may be configured to support a workpiece (163) having a diameter (163D) and a focus ring (165) having an inner diameter (165ID) and an outer diameter (1650D). In some embodiments, the diameter (163D) of the workpiece (163) is smaller than the outer diameter (1650D) of the focus ring (165). The diameter (163D) of the workpiece may be larger than the inner diameter (165ID) of the focus ring (165). In order to securely hold the workpiece (163) and replaceable parts when individually moved by the end effector (500), one or more support pads or elements may be provided on the upper surface of the end effector (500).

[0132] In one embodiment, such as the embodiment illustrated in FIG. 10a and 10b, it is desirable to have separate support members for the workpiece and the focus ring to prevent cross-contamination from the focus ring used. For example, a first support member (SE1) is provided to support the workpiece (163), and a second support member (SE2) is provided to support the focus ring (165). At least one of the first support members (SE1) is positioned on the arm portion (508), and at least another of the first support members (SE1) is positioned on the spatula portion (510). Similarly, at least one of the second support members (SE2) is positioned on the arm portion (508), and at least another of the second support members (SE2) is positioned on the spatula portion (510). In one embodiment, two separate first support members (SE1) are provided on the arm portion (508) and on the spatula portion (510), wherein the support members (SE1) have similar or identical shapes. Additionally, two separate second support members (SE2) are provided on the spatula portion (510), and one long second support member (SE2) is provided on the arm portion (508). However, any suitable number and shape of the support members (SE1, SE2) may instead be provided on the arm portion (508). For example, one, three or more first support members (SE1) or two or more second support members (SE2) may be provided on the arm portion (508). Additionally, the first support members (SE1) on the arm portion (508) may instead have a long shape such as the second support member (SE2) shown in FIG. 10a. Furthermore, the second support members (SE2) on the arm portion (508) may instead have the same shape as the second support members (SE2) on the spatula portion (510).

[0133] Support members (SE1, SE2) are spaced apart so that the first support member (SE1) can only support the workpiece and the second support member (SE2) can only support the focus ring. For example, in FIG. 10b, the first support member (SE1) is spaced apart by a distance (D1) along the longitudinal axis (502), the second support member (SE2) is spaced apart by a distance (D2) along the longitudinal axis (502), and the support members (SE1, SE2) on the arm portion (508) and the support members (SE1, SE2) on the spatula portion (510) are each spaced apart by a third distance (D3). However, in some embodiments, the support members (SE1, SE2) on the arm portion (508) may instead be spaced apart by a different distance than the support members (SE1, SE2) on the spatula portion (510). The distance (Dl, D2, D3) is selected so that when the workpiece is supported on the first support member (SE1), the workpiece does not come into contact with the second support member (SE2). Similarly, when the focus ring is supported on the second support member (SE2), the focus ring does not come into contact with the first support member (SE1).

[0134] In some embodiments, the second support member (SE2) on the spatula portion (510) is positioned closer to the distal end (506) of the end effector (500) than the first support member (SE1) on the spatula portion (510). Similarly, in one embodiment, the second support member (SE2) on the arm portion (508) is positioned closer to the proximal end (504) of the end effector (500) than the first support member (SE1) on the arm portion (508).

[0135] Additionally, in some embodiments, the first support member (SE1) on the spatula portion (510) is located further from the longitudinal axis (502) than the second support member (SE2) on the spatula portion (510). For example, the first support member (SE1) on the spatula portion (510) is spaced from the axis (502) by a first distance (LI) in a direction generally perpendicular to the axis (502), and the second support member (SE2) on the spatula portion (510) is spaced from the axis (502) by a second distance (L2) in a direction generally perpendicular to the axis (502), wherein the first distance (LI) is greater than the second distance (L2).

[0136] In other embodiments such as the embodiment illustrated in FIG. 11a and 11b, the risk of cross-contamination between the focus rings used and the workpieces is relatively low, so one or more support members may be configured to support both the workpieces and the focus rings. For example, in addition to the first support member (SE1) and the second support member (SE2) on the spatula portion (510), a common or shared support member (CSE1) is provided on the arm portion (508). The shared support member (CSE1) is configured to support the workpiece (163) together with the first support member (SE1) and to support the focus ring (165) together with the second support member (SE2).

[0137] Similar to FIG. 10b, in FIG. 11b, the first and second support members (SE1, SE2) are spaced apart so that the first contact area (CA1) of the first support member (SE1) and the shared support member (CSE1) can support only the workpiece, and the second contact area (CA2) of the second support member (SE2) and the shared support member (CSE1) can support only the focus ring. For example, the first support member (SE1) and the first contact area (CA1) are spaced apart by a distance (D1) along the longitudinal axis (502), the second support member (SE2) and the second contact area (CA2) are spaced apart by a distance (D2) along the longitudinal axis (502), and the support members (SE1, SE2) on the arm portion (508) and the contact areas (CA1, CA2) on the spatula portion (510) are each spaced apart by a third distance (D3). However, in some embodiments, the contact areas (CA1, CA2) on the arm portion (508) may instead be spaced apart by a different distance from the support members (SE1, SE2) on the spatula portion (510). The distance (D1, D2, D3) is selected so that when the workpiece is supported on the first support member (SE1) and the first contact area (CA1), the workpiece does not come into contact with the second support member (SE2) or the second contact area (CA2). Similarly, when the focus ring is supported on the second support member (SE2) and the second contact area (CA2), the focus ring does not come into contact with the first support member (SE1) or the first contact area (CA1). Thus, the first contact area (CA1) supporting the workpiece (163) is not separated from or overlaps with the second contact area (CA2) supporting the focus ring (165).

[0138] As described above, in some embodiments, the second support member (SE2) on the spatula portion (510) is positioned closer to the distal end (506) of the end effector (500) than the first support member (SE1) on the spatula portion (510). Similarly, in one embodiment, the second contact area (CA2) is positioned closer to the proximal end (504) of the end effector (500) than the first contact area (CA1) of the shared support member (CSE1) on the arm portion (508).

[0139] Additionally, in some embodiments, the first support member (SE1) on the spatula portion (510) is located further from the longitudinal axis (502) than the second support member (SE2) on the spatula portion (510). For example, the first support member (SE1) on the spatula portion (510) is spaced from the axis (502) by a first distance (LI) in a direction generally perpendicular to the axis (502), and the second support member (SE2) on the spatula portion (510) is spaced from the axis (502) by a second distance (L2) in a direction generally perpendicular to the axis (502), wherein the first distance (LI) is greater than the second distance (L2).

[0140] Alternatively, in some embodiments such as other embodiments like the one illustrated in FIG. 12a and 12b, the first and second contact areas (CA1, CA2) overlap at least partially. For example, as illustrated in FIG. 12a, the workpiece and focus ring individually supported on the end effector (500) are configured to be supported across the common contact area (CCA) on the shared support member (CSE1). For example, as illustrated in FIG. 12b, the first support member (SE1) and the common contact area (CCA) are spaced apart by a distance (D1) along the longitudinal axis (502), the second support member (SE2) and the common contact area (CCA) are spaced apart by a distance (D2) along the longitudinal axis (502), and the support members (SE1, SE2) on the arm portion (508) are spaced apart by a third distance (D3'). The distance (Dl, D2, D3') is selected so that the workpiece and the focus ring come into contact with a common contact area (CCA) when the workpiece is supported on the first support member (SE1) or when the focus ring is supported on the second support member (SE2). In this way, the common support member (CSE1) may be smaller when the common contact area (CCA) is acceptable compared to when separate contact areas (e.g., contact areas (CA1, CA2)) are used.

[0141] An embodiment of the end effector (500) illustrated in FIGS. 12a and 12b may be configured identically to an embodiment of the end effector (500) illustrated in FIGS. 11a and 11b unless otherwise configured. For example, as described above, in some embodiments, a second support member (SE2) on the spatula portion (510) is positioned closer to the distal end (506) of the end effector (500) than a first support member (SE1) on the spatula portion (510). Also, in some embodiments, a first support member (SE1) on the spatula portion (510) is positioned further from the longitudinal axis (502) than a second support member (SE2) on the spatula portion (510). For example, a first support member (SE1) on the spatula portion (510) may be spaced apart from the axis (502) by a first distance in a direction generally perpendicular to the axis (502), and a second support member (SE2) on the spatula portion (510) may be spaced apart from the axis (502) by a second distance in a direction generally perpendicular to the axis (502), wherein the first distance is greater than the second distance.

[0142] Now, referring to FIGS. 13-17, exemplary embodiments of an adjustment assembly for the workpiece processing station described above are illustrated. In particular, FIG. 13 illustrates a focus ring adjustment assembly of an exemplary processing system. FIG. 14a illustrates a side cross-sectional view of the adjustment assembly illustrated in FIG. 13 having a focus ring in a lowered position. Similarly, FIG. 14b illustrates a side cross-sectional view of the adjustment assembly illustrated in FIG. 13 having a focus ring in an elevated position. Additionally, FIG. 15a illustrates a cross-sectional view of a first embodiment of a focus ring for use with the adjustment assembly illustrated in FIG. 13, and FIG. 15b illustrates a cross-sectional view of a second embodiment of a focus ring for use with the adjustment assembly illustrated in FIG. 13. Also, FIG. 16 illustrates a top view of a pin support plate of the adjustment assembly illustrated in FIG. 14a-14b. Also, FIG. 17 illustrates a schematic diagram of an operating system for the adjustment assembly illustrated in FIG. 14a-14b according to exemplary embodiments of the present disclosure.

[0143] As described above, a workpiece processing system (e.g., system (100, 200)) comprises workpiece support(s) (e.g., stations (122, 124, 132, 134)) within a process chamber (e.g., 120, 130, 170, 180) configured to support a workpiece (e.g., workpiece (113, 163)) during process processing steps. As illustrated in FIG. 13, a focus ring (165) is positioned around the outer circumference or outer diameter of the workpiece supported on the workpiece support (163). For example, the focus ring (165) may be used to form a plasma in the vicinity of the workpiece. During plasma processing in a plasma processing chamber, the focus ring (165) may be exposed to the plasma, thereby being exposed to deposition and erosion. As a result, the focus ring (165) may need to be periodically replaced in the plasma processing chamber as part of preventive maintenance. A focus ring adjustment assembly (600) is provided that allows the focus ring (165) to be moved between one or more elevated positions and a working or processing position that is not easily accessible for removal from the process chamber. In at least one of the elevated positions, the focus ring is more easily accessible for removal from the process chamber.

[0144] The focus ring adjustment assembly (600) has a plurality of pins for supporting the focus ring. For example, as shown in FIGS. 14a and 14b, the focus ring (165) is supported by pins (602) (only one of which is shown). Each pin (602) extends between a proximal end (602P) and a distal end (602D), and the distal end (602D) is configured to contact the focus ring (165). As described in more detail below, the pin (602) may be configured to selectively contact a portion (e.g., a groove) of the focus ring (165) so that lateral movement of the ring (165) on the pin (602) can be at least partially prevented or reduced. The assembly (600) further comprises a lifting mechanism that can be used to raise or lower the pin (602) to raise the focus ring (165) from the processing position to the rising position or to lower the focus ring (165) to the processing position. In the processing position, the pin (602) may no longer be in contact with the focus ring, and the focus ring (165) may be supported by a pedestal (e.g., a step structure within the pedestal). As described in more detail below, the assembly (600) further comprises a floating coupling (604) slidably received within a pin support plate (606), wherein the proximal end (602P) of each pin (602) is coupled to each of the floating couplings (604), and the pin support plate (606) is movable to raise or lower the pin (602).

[0145] In one embodiment, as illustrated in FIG. 15a, the focus ring (165A) has a stepped cross-sectional profile. More specifically, the focus ring (165A) extends between an upper portion (165US) and a lower portion (165LS) along the vertical direction (V1), and the lower portion (165LS) has a first surface portion (P1), a second surface portion (P2), and a transition portion (T1) between the first surface portion (PI) and the second surface portion (P2). The first surface portion (P1) is vertically positioned above the second surface portion (P2). In some embodiments, the first surface portion (P1) is radially outward from the second surface portion (P2). The distal end (602D) of the pin (602) is configured to selectively contact a first surface portion (P1) (e.g., one or more grooves within the first surface portion (P1)) so as to prevent the focus ring (165A) from sliding laterally and failing to be seated at least partially on the pin (602). Additionally, the first surface portion (P1) is generally flat so that the distal end (602D) of the pin (602) makes full contact with the first surface portion (P1) (e.g., one or more grooves or slots within the first surface portion (P1)). In some embodiments, the focus ring has three rear radial slots to accommodate the pin(s) (60). This configuration can fix the position of the focus ring (165A), allowing for accurate centering of the focus ring relative to the pedestal and also preventing lateral movement. The rear radial slots can also allow for thermal expansion of the focus ring while it is supported by the pin (602). In some embodiments, the focus ring may have a rear annular groove. The rear annular groove extends annularly around the rear surface of the focus ring. The rear annular groove may include an outer diameter and an inner diameter. The pin(s) (602) may be configured to contact the outer diameter.During the thermal expansion of the focus ring, the pin(s) (602) may no longer be in contact with the outer diameter, but may slide radially within the groove toward the inner diameter to accommodate the thermal expansion of the focus ring.

[0146] In some embodiments, as illustrated in FIG. 15b, the focus ring (165B) has a grooved cross-sectional profile. More specifically, the focus ring (165B) extends along the vertical direction (V1) between the upper portion (165US') and the lower portion (165LS') and along the radial direction between the inner surface (165IS') and the outer surface (1650S'), and the groove (G1) is recessed into the lower portion (165LS') so as to be spaced apart from the inner surface (165IS') and the outer surface (1650S'). The groove (G1) may be an annular groove extending annularly around the focus ring (165B). The distal end (602D) of the pin (602) is configured to optionally contact at least a portion of the groove (G1). The groove (G1) forms a first groove portion extending a first distance (VD1) from the lower portion (165LS') and a second groove portion extending a second distance (VD2) from the lower portion (165LS'). The second distance (VD2) is smaller than the thickness of the focus ring (165B) formed between the upper portion (165US') and the lower portion (165LS') along the vertical direction (V1). A first surface portion (P1') is located at a first distance (VD1) from the lower portion (165LS'), a second surface portion (P2') is located at a second distance (VD2) from the lower portion (165LS'), a first transition portion (T1') extends between the first surface portion (P1') and the lower portion (165LS'), and a second transition portion (T2') extends between the first and second surface portions (P1', P2'). The second surface portion (P2') is perpendicular to the first surface portion (P1'). The distal end (602D) of the pin (602) is configured to selectively contact at least one of the second surface portion (P2') or the second transition portion (T2'). The second surface portion (P2') is generally flat so that the distal end (602D) of the pin (602) can come into full contact with the second surface portion (P2).In some embodiments, the pin (602) has a main body portion (MB) extending between a proximal end (602P) and a distal end (602D), and a flange portion (FP) extending outwardly from the main body portion (MB) at a distance (OH1) offset from the distal end (602D). The flange portion (FP) has a diameter (602D2) larger than the diameter (602D1) of the main body portion (MB) of the pin (60). The flange portion (FP) is configured to contact at least one of a first surface portion (P1') or a first transition portion (T1'). This prevents the focus ring (165B) from sliding laterally and from being at least partially seated on the pin (602).

[0147] Additionally or alternatively, in some embodiments, the shape of the groove (G1) of the focus ring (165B), the shape of the pin(s) (602), or both are configured such that, for example, rotation of the pin(s) (602) holds or secures the focus ring (165B) to the pin(s) (602). For example, rotation of the pin(s) (602) through a predetermined locking angle can secure the focus ring (165B) to the pin(s) (602).

[0148] A top view of the pin support plate (606) is shown in FIG. 16. The pin support plate (606) has a plurality of floating coupling slots (608) spaced circumferentially around the outer circumference of the pin support plate (606). The slots (608) extend radially outward from the outer circumference of the plate (606). However, in some embodiments, the slots (608) may extend radially inward from the inner circumference of the plate (606). Each floating coupling slot (608) is configured to accommodate each floating coupling (604). For example, each floating coupling slot (608) has a slot width (W1) that is larger than the outer diameter (604D1) of the floating coupling (604) but smaller than the outer diameter (604D2) of the flange portion of the floating coupling (604), so that it extends outward from the outer diameter (604D1) of the floating coupling (604). Thus, when the flange portion of the floating coupling (604) is installed within the floating coupling slot (608), it can be placed on the upper surface of the floating coupling slot (608). Thus, this floating coupling slot (608) allows the pin (602) to move slightly in the horizontal plane laterally along the x-axis and / or y-axis relative to the focus ring (165) or workpiece support.

[0149] The pin support plate (606) is configured to operate between a lowered position and one or more raised positions so that the focus ring (165) moves between the processing position and one or more raised positions, respectively. For example, as shown in FIG. 14a, the pin support plate (606) is in its lowered position relative to the main support post (620) fixed within the process chamber and the support ring (622) fixed to the main support post (620). In this lowered position of the pin support plate (606), the pin (602), supported on the pin support plate (606) by the floating coupling (604), is in its retracted position so that the focus ring (165) is in its processing position and is supported by the workpiece support. In some embodiments, the pin (602) is movable by the pin support plate (606) so that the pin (602) does not come into contact with the focus ring (165) when it is in its retracted position. However, in another embodiment, the pin (602) may be held in contact with the focus ring (165) when in its retracted position.

[0150] The pin support plate (606) can be moved to the raised position shown in FIG. 14b with respect to the main support post (620) and support ring (622), as described in more detail below. In that raised position, the pin support plate (606) is vertically higher along the vertical direction than in that lowered position. When the pin support plate (606) is moved to this raised position, the pin (602) supported on the pin support plate (606) by the floating coupling (604) is moved to its extended position along the vertical direction, so that the focus ring (165) is moved to the raised position above the workpiece support. The focus ring (165) is positioned vertically higher along the vertical direction (V1) when the pin (602) is in its extended position than when it is in its retracted position. Once in a raised position, the end effector (e.g., end effector (500)) can be easily positioned below the focus ring (165) to lift the focus ring (165) out of the chamber from one or more pins (602).

[0151] As illustrated in FIG. 17, the assembly (600) further comprises a plate actuator (624) for moving a pin support plate (606). The plate actuator (624) is located outside the process chamber and is vacuum sealed. More specifically, the plate actuator (624) has a vacuum-sealed housing (626) coupled to the outer wall (EXT1) of the process chamber and a connecting shaft (628) extending within the vacuum-sealed housing (626) through the outer wall (EXT1) of the process chamber. The connecting shaft (628) supports the pin support plate (606) and is movable relative to the outer wall (EXT1) by means of an actuator mechanism (632). The actuator mechanism (632) is configured to move the connecting shaft (628) between a first position along the vertical direction associated with the pin support plate (606) in the lower position, a second position along the vertical direction associated with the pin support plate (606) in the raised position, and / or one or more different vertical positions. The actuator mechanism (632) may be configured as any suitable actuator for moving the connecting shaft (628) between the first position and the second position. For example, in some embodiments, the actuator mechanism (632) is configured as a linear actuator, a rotary actuator, etc. By positioning the actuator mechanism (632) outside the process chamber, the mechanism (632) can be serviced or replaced without needing to affect the vacuum of the process chamber.

[0152] The focus ring (165) may be configured to be installed within a chamber having a specific azimuth orientation with respect to the workpiece support. Typically, the focus ring (165) is positioned within a storage chamber (e.g., storage chamber (250)) to have a suitable azimuth orientation when removed from the storage chamber for installation within the process chamber. However, in some embodiments, it is desirable to further adjust the azimuth position of the focus ring (165). In such embodiments, the storage chamber and / or end effector for moving the focus ring (165) may have one or more features for adjusting the azimuth position of the focus ring (165).

[0153] Now, referring to FIG. 18, a plasma processing apparatus (700) is provided according to exemplary embodiments of the present disclosure. The plasma processing apparatus (700) may have a processing chamber (701) forming a vertical direction (V) and a transverse direction (L). The plasma processing apparatus (700) may have a pedestal (704) disposed within an internal space (702) of the processing chamber (701). The pedestal (704) may be configured to support a substrate (706), such as a semiconductor wafer, within the internal space (702). A dielectric window (710) is positioned above the pedestal (704) and acts as a ceiling of the internal space (702). The dielectric window (710) has a central portion (712) and an angled periphery (714). The dielectric window (710) has a space within the central portion (712) for a shower head (720) to supply process gas into the internal space (702).

[0154] In some embodiments, the plasma processing device (700) may have a plurality of inductive elements, such as a primary inductive element (730) and a secondary inductive element (740), to generate an inductive plasma in the internal space (702). The primary inductive element (730) and the secondary inductive element (740) may each have a coil or antenna element that induces plasma in the process gas within the internal space (702) of the processing chamber (701) when RF power is supplied. For example, a first RF generator (760) may be configured to provide electromagnetic energy to the primary inductive element (730) through a matching network (762). A second RF generator (770) may be configured to provide electromagnetic energy to the secondary inductive element (740) through a matching network (772).

[0155] Although the present disclosure has been described with reference to a primary inductive element and a secondary inductive element, those skilled in the art will understand that the primary and secondary inductive elements are used for convenience. The secondary coil may operate independently of the primary coil. The primary coil may operate independently of the secondary coil. Additionally, in some embodiments, the plasma processing apparatus may have only a single inductive coupling element.

[0156] In some embodiments, the plasma processing device (700) may have a metal shield (752) placed around a secondary inductive element (740). In this way, the metal shield (752) separates the primary inductive element (730) and the secondary inductive element (740) to reduce cross-talk between the primary inductive element (730) and the secondary inductive element (740).

[0157] In some embodiments, the plasma processing device (700) may have a first Faraday shield (754) positioned between a primary inductive element (730) and a secondary inductive element (740). The first Faraday shield (754) may be a slotted metal shield that reduces capacitive coupling between the primary inductive element (730) and the process chamber (701). As illustrated, the first Faraday shield (754) may be fitted over an angled portion of the dielectric window (7106).

[0158] In some embodiments, the metal shield (752) and the first Faraday shield (754) may form a single body (750) for manufacturing and other purposes. The multi-turn coil of the primary inductive element (730) may be located adjacent to the first Faraday shield (754) of the single body (7500). The secondary inductive element (740) may be located near the metal shield (752) of the single body (750), such as between the metal shield (752) and the dielectric window (710).

[0159] The arrangement of the primary inductive element (130) and the secondary inductive element (140) on the opposite side of the metal shield (752) allows the primary inductive element (730) and the secondary inductive element (740) to have distinct structural configurations and perform different functions. For example, the primary inductive element (730) may be equipped with a multi-turn coil located adjacent to the periphery of the process chamber (701). The primary inductive element (730) may be used for basic plasma generation and reliable starting during the transient ignition phase. The primary inductive element (730) may be connected to a powerful RF generator and an expensive automatic tuning matching network and may be operated at an increased RF frequency, such as at approximately 13.56 MHz. As used herein, the term “approximately” refers to a range of values ​​within 20% of the mentioned numerical value.

[0160] In some implementations, a secondary inductive element (740) may be used for calibration and support functions and to improve plasma stability during steady-state operation. Additionally, since the secondary inductive element (740) may be used primarily for calibration and support functions and to improve plasma stability during steady-state operation, the secondary inductive element (740) does not need to be coupled to the RF generator as a primary inductive element (730), thus allowing for a different and cost-effective design to overcome the difficulties associated with the previous design. As discussed in detail below, the secondary inductive element (740) may also be operated at a lower frequency, such as about 2 MHz, so that the secondary inductive element (740) becomes very compact and fits into a limited space on the upper part of the dielectric window.

[0161] In some embodiments, the primary inductive element (730) and the secondary inductive element (740) may be operated at different frequencies. The frequencies may be sufficiently different to reduce cross-torque in the plasma between the primary inductive element (730) and the secondary inductive element (740). For example, the frequency applied to the primary inductive element (730) may be at least about 1.5 times greater than the frequency applied to the secondary inductive element (740). In some embodiments, the frequency applied to the primary inductive element (730) may be about 13.56 MHz, and the frequency applied to the secondary inductive element (740) may be in the range of about 1.75 MHz to about 2.15 MHz. Additionally, other suitable frequencies such as about 400 kHz, about 4 MHz, and about 27 MHz may be used. Although the present disclosure is discussed with reference to the first inductive element (730) operating at a higher frequency with respect to the second inductive element (740), those skilled in the art using the disclosure provided herein should understand that the second inductive element (740) may be operated at a higher frequency without going beyond the scope of the present disclosure.

[0162] In some embodiments, the secondary inductive element (740) may be equipped with a planar coil (742) and a magnetic flux concentrator (744). The magnetic flux concentrator (744) may be made of a ferrite material. The use of a magnetic flux concentrator with a suitable coil can provide high plasma coupling and good energy transfer efficiency of the secondary inductive element (740) and can significantly reduce coupling to the metal shield (752). The use of a lower frequency, such as about 2 MHz, on the secondary inductive element (740) can increase the skin layer, which also improves plasma heating efficiency.

[0163] In some implementations, the primary inductive element (730) and the secondary inductive element (740) may perform different functions. For example, the primary inductive element (730) may be used to perform the basic function of plasma generation during ignition and to provide sufficient priming to the secondary inductive element (7400). The primary inductive element (730) may have coupling to the plasma and the grounded shield to stabilize the plasma potential. The first Faraday shield (754) associated with the primary inductive element (730) may be used to prevent window sputtering and to supply coupling to the grounded shield.

[0164] An additional coil can be operated in the presence of good plasma priming provided by the primary inductive element (730), preferably having good energy transfer efficiency to the plasma coupling and plasma. A secondary inductive element (740) equipped with a flux concentrator (744) provides good transmission of flux to the plasma volume and, at the same time, provides good isolation of the secondary inductive element (740) from the surrounding metal shield (752). The symmetrical drive of the secondary inductive element (740) and the flux concentrator (744) further reduce the amplitude of the voltage between the coil ends and the surrounding ground elements. This can reduce sputtering of the dome but simultaneously provides some small capacitive coupling to the plasma that can be used to assist ignition. In some embodiments, a second Faraday shield may be used in combination with this secondary inductive element (740) to reduce the capacitive coupling of the secondary inductive element (740).

[0165] In some embodiments, the plasma processing device (700) may have a radio frequency (RF) bias electrode (760) disposed within a processing chamber (701). The plasma processing device (700) may further have a ground plane (770) disposed within the processing chamber (701) such that the ground plane (770) is spaced apart from the RF bias electrode (760) along the vertical direction (V). As illustrated, the RF bias electrode (760) and the ground plane (770) may be disposed within a pedestal (704) in some embodiments.

[0166] In some embodiments, the RF bias electrode (760) may be coupled to an RF power generator (780) via a suitable matching network (782). When the RF power generator (780) provides RF energy to the RF bias electrode (760), plasma may be generated from a mixture within a processing chamber (701) for direct exposure to the substrate (706). In some embodiments, the RF bias electrode (760) may form an RF zone (762) extending along the lateral direction (L) between the first end (764) of the RF bias electrode (760) and the second end (766) of the RF bias electrode (760). For example, in some embodiments, the RF zone (762) may extend along the lateral direction (L) from the first end (764) of the RF bias electrode (760) to the second end (766) of the RF bias electrode (760). The RF zone (762) can be further extended along the vertical direction (V) between the RF bias electrode (760) and the dielectric window (710).

[0167] It should be understood that the length of the ground plane (770) along the lateral direction (L) is longer than the length of the RF bias electrode (760) along the lateral direction (L). In this way, the ground plane (770) can direct RF energy toward the substrate (706) by the RF bias electrode (760).

[0168] Now, referring to FIGS. 19 and 20, according to exemplary embodiments of the present disclosure, a focus ring adjustment assembly (800) for a focus ring (790) of a plasma processing apparatus (700) (Fig. 18) is provided. As illustrated, the focus ring adjustment assembly (800) may adjust the distance between the focus ring (790) and the pedestal (704) along the vertical direction (V) by providing a lift pin (810) movable along the vertical direction (V) to move the focus ring (790) between at least a first position (Fig. 19) and a second position (Fig. 20). For example, the focus ring (790) may be spaced apart from the pedestal (704) by a first distance (D1) (e.g., 0 or very close to 0 so that the focus ring is supported on the pedestal (704)) when the focus ring (790) is at the first position (Fig. 19). Additionally, when the focus ring (790) is in the second position (Fig. 20), the focus ring (790) may be spaced apart from the pedestal (704) by a second distance (D2). As illustrated, the second distance (D2) may differ from the first distance (D1). In particular, the second distance (D2) may be greater than the first distance (D1). In this way, the focus ring adjustment assembly (800), particularly its pin (810), can move the focus ring (790) from the first position (Fig. 19) to the second position (Fig. 20), thereby facilitating the removal of the focus ring (790) from the processing chamber (701) using the end effector described above with reference to, for example, Figs. 9 through 12b.

[0169] As described, the lift pin (810) may be positioned outside the RF zone (762) formed by the RF bias electrode (760c). Additionally, the lift pin (810) may penetrate the ground plane (770). For example, in some implementations, the lift pin (810) may extend through an opening formed by the ground plane (770). It should be understood that positioning the lift pin (810) outside the RF zone (762) and additionally allowing the lift pin (810) to penetrate the ground plane (770) can reduce the risk of arcing associated with applying RF power (e.g., bias power) from the RF power generator (780) to the RF bias electrode (760) during the plasma process. Additionally, interference (e.g., electrical and mechanical) between the lift pin (810) and the focus ring (790) can be reduced.

[0170] In some implementations, the focus ring adjustment assembly (800) may have an actuator (820) configured to move a lift pin (810) along the vertical direction (V) to facilitate movement of the focus ring (790) between at least a first position (Fig. 19) and a second position (Fig. 20). As illustrated, the actuator (820) may be located outside the processing chamber (701). Additionally, the focus ring adjustment assembly (800) may have a second actuator (822) configured to rotate the lift pin (810) around the vertical direction (V). As illustrated, the second actuator (822) may be located outside the processing chamber (701).

[0171] Although the gist of this disclosure has been described in detail with respect to specific exemplary embodiments, those skilled in the art will understand that changes, variations, and equivalent variations to these embodiments can be easily made. Accordingly, the scope of this disclosure is merely illustrative and not limiting, and this disclosure does not exclude the exclusion of such modifications, variations, and / or additions to the gist of this disclosure as would be apparent to those skilled in the art.

Claims

Claim 1 A focus ring for a plasma processing apparatus, wherein the focus ring comprises: an annular body extending along a vertical direction between an upper portion and a lower portion; and at least one rear radial slot or rear annular groove formed on a first surface portion of the lower portion. Claim 2 A focus ring according to claim 1, wherein the lower portion includes the first surface portion and the second surface portion, and the first surface portion is vertically above the second surface portion with respect to the upper portion. Claim 3 A focus ring according to paragraph 2, wherein the lower portion further includes a transition portion extending vertically between the first surface portion and the second surface portion. Claim 4 In paragraph 2, the focus ring, wherein the first surface portion is located radially outward of the second surface portion with respect to the inner surface of the annular body. Claim 5 A focus ring according to claim 1, wherein the at least one rear radial slot or rear annular groove is configured to selectively receive the distal end of a lift pin to prevent lateral movement of the focus ring when raised along the vertical direction. Claim 6 In claim 1, the focus ring wherein at least one rear radial slot comprises three rear radial slots circumferentially spaced apart along the first surface portion. Claim 7 In claim 1, at least one rear annular groove is a focus ring that extends continuously around a first surface portion of the lower portion. Claim 8 A focus ring according to claim 1, wherein the first surface portion is substantially planar and oriented substantially perpendicular to the vertical direction. Claim 9 A focus ring for a plasma processing apparatus, wherein the focus ring comprises: an annular body extending along a vertical direction between an upper part and a lower part and extending along a radial direction between an inner surface and an outer surface; and a groove that is inwardly concave from the lower part toward the upper part, wherein the groove is spaced apart from both the inner surface and the outer surface along a radial direction, and the groove comprises a first groove portion extending by a first distance from the lower part and a second groove portion extending by a second distance from the lower part, wherein the second distance is greater than the first distance and less than the total vertical thickness of the annular body between the upper part and the lower part. Claim 10 In claim 9, the groove is a focus ring that is an annular groove extending continuously around the lower part of the annular body. Claim 11 In claim 9, the first groove portion is terminated at the first surface portion and the second groove portion is terminated at the second surface portion, and the second surface portion is vertically above the first surface portion with respect to the upper portion, a focus ring. Claim 12 In claim 11, the groove further forms a first transition portion extending between the lower portion and the first surface portion, and a second transition portion extending between the first surface portion and the second surface portion, a focus ring. Claim 13 In paragraph 11, the first surface portion and the second surface portion are each substantially planar and oriented substantially perpendicularly to the vertical direction, a focus ring. Claim 14 A focus ring according to claim 10, wherein the first groove portion has a first radial width and the second groove portion has a second radial width, and the first radial width is larger than the second radial width to form a stepped internal profile configured to accommodate a lift pin having a flange within the groove. Claim 15 A focus ring for a plasma processing apparatus, wherein the focus ring comprises: an annular body extending along a vertical direction between an upper part and a lower part and extending along a radial direction between an inner surface and an outer surface, wherein the lower part includes a first surface portion, a second surface portion, and a transition portion extending between the first surface portion and the second surface portion, wherein the first surface portion is vertically above the second surface portion with respect to the upper part; and an annular groove formed concavely from the first surface portion of the lower part toward the upper part, wherein the annular groove is spaced apart from both the inner surface and the outer surface along a radial direction, and the annular groove comprises a first groove portion extending from the lower part to a first distance along the vertical direction; A focus ring comprising a second groove portion extending from the lower portion to the second distance along the vertical direction from the first distance, wherein the second distance is greater than the first distance and smaller than the total thickness of the annular body between the upper portion and the lower portion along the vertical direction. Claim 16 In item 15, the focus ring, wherein the first surface portion is located radially outside of the second surface portion with respect to the inner surface. Claim 17 In paragraph 15, the first groove portion is terminated at a third surface portion located at the first distance and the second groove portion is terminated at a fourth surface portion located at the second distance, and the fourth surface portion is vertically above the third surface portion with respect to the upper portion, a focus ring. Claim 18 In claim 17, the annular groove further forms a first transition portion extending between the lower portion and the third surface portion, and a second transition portion extending between the third surface portion and the fourth surface portion, a focus ring. Claim 19 A focus ring according to claim 18, wherein the first groove portion has a first radial width and the second groove portion has a second radial width, and the first radial width is larger than the second radial width to form a stepped internal profile configured to accommodate a lift pin having a flange portion within the annular groove. Claim 20 In claim 15, the focus ring is configured such that the inner surface surrounds at least a portion of the periphery of a substrate supported on a pedestal within the plasma processing apparatus.

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