Element transfer device and method for controlling the same

Abstract

According to one aspect of an embodiment of the present disclosure, a device transfer apparatus is provided. The device transfer apparatus may include a polygonal container that accommodates a substrate having a plurality of device holes, a plurality of vibration sources that generate vibrations and output vibrations into a fluid within the container, a floating mask disposed on the substrate and having a plurality of mask holes, and a processor that controls the output of each of the plurality of vibration sources. The container may accommodate the floating mask, the fluid, and micro-devices distributed within the fluid. The processor may perform a dispersion operation in which, while the floating mask is disposed on the substrate, it outputs vibrations from at least one of the plurality of vibration sources to control the micro-devices to pass through the plurality of mask holes of the floating mask and be dispersed into the fluid on the substrate, and a transfer operation in which, while the floating mask is removed from the container on which the substrate is disposed, it outputs vibrations from at least one of the plurality of vibration sources to transfer the micro-devices to the plurality of device holes of the substrate.

Description

Technology Field

[0001] The embodiments of the present disclosure relate to a device transfer apparatus and a method for controlling a device transfer apparatus for transferring a micro device onto a substrate using a floating mask. The embodiments of the present disclosure can be applied to mass transfer technology based on a self-arrangement method of fine functional semiconductor chips. Furthermore, these microchips can be widely applied from the field of human biology to the field of displays. Additionally, the embodiments of the present disclosure can be used to classify, aggregate, and arrange these microchips in a desired location and a desired pattern.

[0002] This research was conducted with support from the Samsung Future Technology Development Program. (Project No.: SRFC-IT2201-02) Background Technology

[0003] There is a growing demand for the development of technologies capable of artificially controlling the behavior of micro-devices in the display field and in microstructure semiconductor fields such as MEMS (Micro-Electro Mechanical Systems). Furthermore, in the field of biochemistry, there is also a steadily increasing demand for technologies that can artificially control the behavior of multiple cellular-scale particles. Moreover, the particles or devices used in these diverse fields are inevitably trending toward becoming increasingly ultra-small in size due to the process of technological advancement.

[0004] Research and development have been conducted in various academic fields to artificially control and manipulate these microparticles for specific purposes. Regarding microparticle control and manipulation technology, effects such as reduced power consumption, non-destructive device characteristics, and prevention of impurity contamination are required. For this reason, acoustic technology, which requires 1 / 100,000th of the power required by optical technology, is being researched.

[0005] Although acoustic technology can move micro-devices and chips, it is difficult to apply to environments where multiple devices are moved on a large substrate. means of solving the problem

[0006] According to one aspect of an embodiment of the present disclosure, a device transfer apparatus is provided. The device transfer apparatus may include a polygonal container that accommodates a substrate having a plurality of device holes, a plurality of vibration sources that generate vibrations and output vibrations into a fluid within the container, a floating mask disposed on the substrate and having a plurality of mask holes, and a processor that controls the output of each of the plurality of vibration sources. The container may accommodate the floating mask, the fluid, and micro-devices distributed within the fluid. The processor may perform a dispersion operation in which, while the floating mask is disposed on the substrate, it outputs vibrations from at least one of the plurality of vibration sources to control the micro-devices to pass through the plurality of mask holes of the floating mask and be dispersed into the fluid on the substrate, and a transfer operation in which, while the floating mask is removed from the container on which the substrate is disposed, it outputs vibrations from at least one of the plurality of vibration sources to transfer the micro-devices to the plurality of device holes of the substrate.

[0007] Additionally, according to one embodiment of the present disclosure, the device transfer device may further include a spacer attached to the lower portion of the floating mask and preventing contact between the floating mask and the substrate. The floating mask may be disposed on the substrate such that the spacer contacts the substrate.

[0008] Additionally, according to one embodiment of the present disclosure, the plurality of vibration sources may include at least one first group of vibration sources disposed on the circumference of a first circle having a radius of a first distance from the center point of the container, and at least one second group of vibration sources disposed on the circumference of a second circle concentric with the first circle having a radius of a second distance longer than the first distance.

[0009] Additionally, according to one embodiment of the present disclosure, the first group vibration source may be positioned on at least one short axis passing through the center point and may include at least one pair of first group vibration sources facing each other with respect to the center point. The second group vibration source may be positioned on at least one long axis passing through the center point and may include at least one pair of second group vibration sources facing each other with respect to the center point.

[0010] Additionally, according to one embodiment of the present disclosure, the container may be in the shape of an octagon. Each of the at least one minor axis and the at least one major axis may be positioned to correspond to each corner of the octagon of the container.

[0011] Additionally, according to one embodiment of the present disclosure, the processor can control the floating mask to rotate by outputting a vibration wave from one of the plurality of vibration sources in the distributed operation.

[0012] Additionally, according to one embodiment of the present disclosure, the processor can reciprocate the floating mask by, in the distributed operation, outputting a vibration of a first frequency from a pair of vibration sources disposed on a first axis among the first group of vibration sources and outputting a vibration of a second frequency, which is a frequency different from the first frequency, from a pair of vibration sources disposed on a second axis among the first group of vibration sources.

[0013] Additionally, according to one embodiment of the present disclosure, the processor can control the direction of the reciprocating rotational motion by adjusting the frequency and amplitude of the vibration output from the first group of vibration source pairs on the first axis and the frequency and amplitude of the vibration output from the first group of vibration source pairs on the second axis.

[0014] Additionally, according to one embodiment of the present disclosure, the floating mask may be made of at least one of aluminum, stainless steel, Invar, or a high-rigidity organic material.

[0015] In addition, according to one embodiment of the present disclosure, the floating mask may have a thickness of 0.1 mm or more and 1 mm or less.

[0016] In addition, according to one embodiment of the present disclosure, the plurality of mask holes of the floating mask may be arranged in a two-dimensional array form having a diameter in the range of 0.1 mm or more and 0.3 mm or less and a pitch of 0.1 mm or more and 0.3 mm or less.

[0017] In addition, according to one embodiment of the present disclosure, the substrate corresponds to a display panel included in a display module, the micro-element is a light-emitting element transferred to the display panel, the pattern of the mask hole of the floating mask corresponds to the resolution of the display module, and the size of the mask hole may be larger than 0% and less than or equal to 15% than the size of the micro-element.

[0018] Additionally, according to one embodiment of the present disclosure, the processor acquires a first image of the substrate in the container with the floating mask removed, and in the transfer operation, can control the plurality of vibration sources to at least one of a plurality of transfer modes that output a predefined output frequency through at least one of the plurality of vibration sources based on the first image.

[0019] Additionally, according to one embodiment of the present disclosure, the processor can control the plurality of vibration sources to sequentially operate two or more of the plurality of transfer modes.

[0020] Additionally, according to one embodiment of the present disclosure, the processor determines, based on the first image, a transfer state in which the micro-element is transferred to a plurality of element holes of the substrate and the location of a residual micro-element that is not transferred to the substrate, and controls the plurality of vibration sources to operate in at least one of the plurality of transfer modes based on the transfer state and the location of the residual micro-element.

[0021] In addition, according to one embodiment of the present disclosure, the vibrations generated by the plurality of vibration sources may have a frequency in the range of 20 Hz or more and 100 MHz or less.

[0022] Additionally, according to one embodiment of the present disclosure, the element transfer device may further include a plurality of connecting plates that each connect the container and the plurality of vibration sources.

[0023] Additionally, according to one embodiment of the present disclosure, the apparatus further includes a camera for photographing the substrate within the container, and the processor determines a transfer state in which the micro-element is transferred to the plurality of element holes of the substrate based on the image captured by the camera, and determines a transfer mode of the plurality of vibration sources based on the determined transfer state.

[0024] Additionally, according to one embodiment of the present disclosure, the fluid may include at least one of water, ethanol, acetone, isopropyl alcohol (IPA), ethylene glycol, dimethyl sulfoxide, glycerol, tetrahydrofuran, silicone oil, or hexane.

[0025] According to one aspect of an embodiment of the present disclosure, a method for controlling a device transfer device is provided. The method for controlling a device transfer device may include: a dispersion step in which, while a substrate having a plurality of device holes is disposed in a polygonal container storing fluid and a floating mask is disposed on the substrate, vibration is output from at least one of a plurality of vibration sources to control the dispersion of a micro device through a plurality of mask holes of the floating mask and into the fluid on the substrate; and a transfer step in which, while the floating mask is removed from the container in which the substrate is disposed, vibration is output from at least one of the plurality of vibration sources to transfer the micro device to the plurality of device holes of the substrate. Brief explanation of the drawing

[0026] FIG. 1 is a diagram showing the structure of a device transfer apparatus according to one embodiment of the present disclosure. FIG. 2 is a diagram showing the structure of a floating mask and a substrate according to one embodiment of the present disclosure. FIG. 3 is a diagram showing the structure of a device transfer apparatus according to one embodiment of the present disclosure. FIG. 4 is a flowchart illustrating a method for controlling a device transfer device according to one embodiment of the present disclosure. FIG. 5 is a diagram showing the structure of a floating mask according to one embodiment of the present disclosure. FIG. 6 is a drawing showing a substrate and a micro-element placed in a container according to one embodiment of the present disclosure. FIG. 7 is a drawing showing a container and a plurality of vibration sources according to one embodiment of the present disclosure. FIG. 8 is a drawing showing the arrangement of a plurality of vibration sources according to one embodiment of the present disclosure. FIG. 9 is a diagram showing the operation of a first distribution mode according to one embodiment of the present disclosure. FIG. 10 is a diagram showing the operation of a second distributed mode according to one embodiment of the present disclosure. FIG. 11 is a diagram showing the operation of a third distributed mode according to one embodiment of the present disclosure. FIG. 12 is a diagram showing the structure of a device transfer apparatus according to one embodiment of the present disclosure. FIG. 13 is a flowchart illustrating a transfer operation according to one embodiment of the present disclosure. FIG. 14 is a diagram showing the definition of a plurality of transfer modes according to one embodiment of the present disclosure. FIG. 15 is a drawing showing a plurality of transfer modes according to one embodiment of the present disclosure. FIG. 16 is a diagram showing the structure of a micro device according to one embodiment of the present disclosure. FIG. 17 is a diagram showing the result of a distributed operation according to one embodiment of the present disclosure and the result of a distributed operation according to a comparative example. FIG. 18 is a diagram showing the result of a distributed operation according to one embodiment of the present disclosure and the result of a distributed operation according to a comparative example. Specific details for implementing the invention

[0027] The present disclosure clarifies the scope of the claims of the present disclosure and explains the principles of the embodiments of the present disclosure and discloses embodiments so that a person skilled in the art to which the embodiments of the present disclosure pertain can practice the embodiments of the present disclosure. The disclosed embodiments may be implemented in various forms.

[0028] Throughout this disclosure, the same reference numerals denote the same components. This disclosure does not describe all elements of the embodiments, and general content in the technical field to which the embodiments of this disclosure belong, or content that overlaps between embodiments, is omitted. The term "part" or "portion" as used in the specification may be implemented in software or hardware, and depending on the embodiments, a plurality of "parts" may be implemented as a single unit or element, or a single "part" may include a plurality of elements. The embodiments of this disclosure and the operating principles of the embodiments will be described below with reference to the attached drawings.

[0029] FIG. 1 is a diagram showing the structure of a device transfer apparatus according to one embodiment of the present disclosure.

[0030] A device transfer device (100) according to one embodiment of the present disclosure includes a container (120) and a plurality of vibration sources (130a, 130b, 130c, 130d, 132a, 132b, 132c, and 132d). In the present disclosure, the plurality of vibration sources (130a, 130b, 130c, 130d, 132a, 132b, 132c, and 132d) are collectively referred to as identification number 130.

[0031] A plurality of vibration sources (130) can be connected to a container (120) through a predetermined connecting plate. The plurality of vibration sources (130) output vibrations of a predetermined frequency, and the vibrations output from the vibration sources (130) are transmitted to the container (120) through the connecting plate.

[0032] A plurality of vibration sources (130) are controlled by a computing device (110) including a processor. The computing device (110) can control at least one of the on / off, output frequency, phase, timing, or vibration intensity of the plurality of vibration sources (130) by outputting a control signal to the plurality of vibration sources (130). The computing device (110) can determine the output frequency of the plurality of vibration sources (130) using a predetermined computer program and data, and control the plurality of vibration sources (130) to output the output frequency determined through the plurality of vibration sources (130).

[0033] A plurality of vibration sources (130) can generate and output vibrations based on a signal output from a signal amplifier (140). The signal amplifier (140) can generate and output a waveform signal corresponding to an output frequency using a control signal output from a computing device (110). A plurality of vibration sources (130) can receive a waveform signal corresponding to an output frequency from the signal amplifier (140) and generate and output vibrations corresponding to an output frequency.

[0034] The container (120) has a polygonal shape. The container (120) can have, for example, an octagonal shape. Additionally, the container (120) can have, for example, a regular polygonal shape and a regular octagonal shape.

[0035] The container (120) has a fluid receiving structure capable of receiving a fluid. The fluid receiving structure may be implemented, for example, in the form of a partition forming a space for receiving the fluid on the upper surface of the container (120). The fluid receiving structure may correspond to a chunk. The fluid may correspond, for example, to ethanol. A substrate and a floating mask may be placed within the container (120). The substrate and the floating mask may be placed so as to be submerged in the fluid. The floating mask may be placed on the substrate. The arrangement of the floating mask and the substrate will be described later with reference to FIG. 2.

[0036] According to one embodiment of the present disclosure, a plurality of vibration sources (130) are arranged on a plurality of concentric circles (134 and 136). The number of the plurality of concentric circles (130) can be determined differently depending on the embodiment. According to one embodiment of the present disclosure, the plurality of concentric circles (130) include a first circle (134) and a second circle (136). The first circle (134) has a smaller radius than the second circle (136). Additionally, the plurality of vibration sources (130) may be arranged to correspond to each face of a polygonal container (120). For example, the container (120) may be in the shape of a regular octagon, and eight vibration sources (130) may be arranged to correspond to each face of the regular octagon. The container (120) may be arranged on the center of the plurality of concentric circles (130).

[0037] A plurality of vibration sources (130) includes a first group of vibration sources (130a, 130b, 130c, and 130d) disposed on a first circle (134), and a second group of vibration sources (132a, 132b, 132c, and 132d) disposed on a second circle (136). The first group of vibration sources (130a, 130b, 130c, and 130d) includes a plurality of vibration sources disposed on the first circle (134). The second group of vibration sources (132a, 132b, 132c, and 132d) includes a plurality of vibration sources disposed on the second circle (136).

[0038] The computing device (110) controls to output vibrations of a predetermined output frequency through one or a combination of the first group vibration sources (130a, 130b, 130c, and 130d) or the second group vibration sources (132a, 132b, 132c, and 132d). A computing device (110) can determine the output frequency of a first group vibration source (130a, 130b, 130c, and 130d) or a second group vibration source (132a, 132b, 132c, and 132d) to move a micro element in a desired direction or pattern, and can output a vibration of the determined output frequency through at least one of the first group vibration sources (130a, 130b, 130c, and 130d) or at least one of the second group vibration sources (132a, 132b, 132c, and 132d).

[0039] By outputting vibrations of an output frequency through a first group of vibration sources (130a, 130b, 130c, and 130d) and a second group of vibration sources (132a, 132b, 132c, and 132d), vibrations output from a plurality of vibration sources (130) are transmitted to a container (120) through a connecting plate and to a fluid within the container (120). As vibrations are transmitted to the fluid, micro-elements within the fluid move in a predetermined direction or pattern due to the vibrations. Micro-elements are distributed along the nodal lines of waves generated in the fluid by the vibrations. In the present disclosure, vibrations are applied along each face of a polygonal container (120). By the combination of vibrations resulting therefrom, micro-elements can be dispersed in a desired pattern within the fluid. Accordingly, the device transfer device (100) according to one embodiment of the present disclosure has the effect of finely controlling the movement of the micro-small intestine by means of a combination of vibrations output through a plurality of vibration sources (130).

[0040] FIG. 2 is a diagram showing the structure of a floating mask and a substrate according to one embodiment of the present disclosure.

[0041] According to one embodiment of the present disclosure, a floating mask (150) and a substrate (160) are disposed within a container (120). The floating mask (150) is disposed on the substrate (160). The floating mask (150) and the substrate (160) are disposed to be submerged in a fluid within the container (120). Additionally, a micro-element (170) is disposed within the fluid. The micro-element (170) may be randomly distributed within the fluid. The micro-element (170) may be transferred to a mask hole (152) of the substrate (160).

[0042] According to one embodiment of the present disclosure, a floating mask (150) may be positioned to be in contact with the upper surface of a substrate (160). In this case, when the floating mask (150) is positioned in contact with the substrate, the movement of micro-elements (170) positioned on the top of the floating mask (150) is controlled by an acoustic streaming force generated by an applied wave, and can be arranged on the substrate (160) along the mask hole (152) on the floating mask (150). The micro-elements (170) are arranged on the substrate (160) along the pattern of the mask hole (152). According to one embodiment of the present disclosure, in order to increase the accuracy in the bonding process of bonding the micro-elements (152) to the substrate (160), the pattern of the mask hole (152) on the floating mask (150) and the pattern of the element hole on the substrate (160) may be formed such that the pattern of the mask hole (152) on the floating mask (150) and the pattern of the element hole on the substrate (160) match. Additionally, the floating mask (150) may be placed in contact with the substrate (160) so that the pattern of the mask hole (152) on the floating mask (150) matches the pattern of the element hole on the substrate (160). If the substrate (160) corresponds to a display panel included in a display module and the micro element (170) corresponds to a light-emitting element such as an LED, the pattern and pitch of the mask hole (152) of the floating mask (150) may be configured to match the resolution of the display module to be manufactured. Additionally, the mask hole (152) may be formed such that the size of the mask hole (152) is up to 15% larger than the size of the micro element (170), so that the micro element (170) passes through the mask hole (152) well and is stably seated in the element hole of the substrate (160).

[0043] Additionally, according to one embodiment of the present disclosure, a floating mask (150) may be positioned so as to be spaced apart from a substrate (160) by means of a spacer. In this case, the upper surface of the substrate (160) may not come into contact with the floating mask (150) because a gap is created between the floating mask (150) and the substrate (160). The spacer may correspond, for example, to an O-ring. The floating mask (150) may rotate or vibrate clockwise or counterclockwise on the fixed substrate (160) by means of an acoustic force generated by applied vibration. The floating mask (150) and the substrate (160) may vibrate or rotate together in the same motion pattern while in contact with the spacer.

[0044] The floating mask (150) may include a plurality of mask holes (152) through which the device can pass. The plurality of mask holes (152) may be arranged to cover the pattern of the device holes of the substrate (160). For example, the plurality of mask holes (152) may be arranged in the same size and shape as the area where the device holes of the substrate (160) are arranged, or may be arranged larger than the area where the device holes are arranged. The floating mask (150) may disperse the micro device (170) so that the micro device (170) in the fluid is distributed on the substrate (160) in a uniform distribution.

[0045] The substrate (160) includes device holes for fixing the micro device (170). The device holes may be arranged in a predetermined pattern. For example, the device holes may be arranged in a two-dimensional array form. The pattern of the device holes may be determined to correspond to the pattern in which the micro device (170) is arranged on the substrate (160) to be manufactured.

[0046] The element hole may have a shape corresponding to the shape of the micro element (170). Additionally, the element hole may be formed to have a step difference with the upper surface of the container (120) to accommodate the micro element (170), and may be formed as an intaglio. According to one embodiment of the present disclosure, the micro element (170) may have an asymmetric shape. If the micro element (170) has an asymmetric shape, the element hole may also have an asymmetric shape corresponding to the micro element (170).

[0047] According to one embodiment of the present disclosure, the device transfer device (100) can perform a dispersion operation (102) while the floating mask (150) is placed on the substrate (160). While performing the dispersion operation (102), the device transfer device (100) can output vibrations (180) from at least some of the plurality of vibration sources (130) to disperse the micro device (170) in the fluid. Additionally, while performing the dispersion operation (102), the device transfer device (100) can output vibrations (180) from at least some of the plurality of vibration sources (130) to move the micro device (170) onto the substrate (160) through the plurality of mask holes (152) of the floating mask (150). According to one embodiment of the present disclosure, the device transfer device (100) can output vibrations (180) from at least some of the plurality of vibration sources (130) to rotate or reciprocate the floating mask (150). Micro-elements (170) can be uniformly distributed on the substrate (160) by means of the distribution operation (102).

[0048] Additionally, according to one embodiment of the present disclosure, the device transfer device (100) may remove the floating mask (150) from the container (120) after the dispersion operation (102) is completed. When the floating mask (150) is removed, the substrate (160) becomes visible on the upper surface of the container (120). After the floating mask (150) is removed from the container (120), the device transfer device (100) performs a transfer operation (104). The transfer operation (104) is an operation of transferring a micro device (170) to a device hole on the substrate (160). While performing the transfer operation (104), the device transfer device (100) may output vibrations (180) from a plurality of vibration sources (130). By means of the vibrations (180), the micro device (170) may be transferred to the device hole of the substrate (160). According to one embodiment of the present disclosure, by uniformly distributing micro-elements (170) on a substrate (160) by means of a dispersion operation (102) using a floating mask (150), the device transfer device (100) can obtain a high transfer rate in the transfer operation (104).

[0049] According to one embodiment of the present disclosure, the device transfer device (100) can output vibrations from a plurality of vibration sources (130) based on the captured image while capturing the upper surface of the substrate (160) using a camera. The device transfer device (100) can control the behavior of the micro device (170) by outputting vibrations (180) from a plurality of vibration sources (130) according to a predetermined transfer mode based on the captured image. The device transfer device (100) can output vibrations (180) from a plurality of vibration sources (130) by setting a transfer mode to transfer the micro device (170) into an empty device hole on the substrate (160) based on the captured image. The operation of the plurality of vibration sources (130) according to the transfer mode will be described later.

[0050] FIG. 3 is a diagram showing the structure of a device transfer apparatus according to one embodiment of the present disclosure.

[0051] According to one embodiment of the present disclosure, a device transfer device (100) comprises a container (120), a vibration source (130), a floating mask (150), and a processor (210). The container (120) is positioned to receive vibrations output from the vibration source (130).

[0052] The container (120) is connected to the vibration source (130) by a connecting plate and can receive vibrations output from the vibration source (130) through the connecting plate. As previously described, the container (120) may have a polygonal shape, for example, a regular octagonal shape. The container (120) accommodates a floating mask (150) and a substrate (160), and accommodates a fluid. Additionally, the container (120) may accommodate a plurality of micro-elements (170) distributed within the fluid.

[0053] A fluid (or solvent) may be received so that a floating mask (150) and a substrate (160) within a container (120) are immersed in the fluid. According to one embodiment of the present disclosure, the fluid may comprise at least one of water, ethanol, or acetone. Additionally, according to one embodiment of the present disclosure, the fluid may comprise at least one or a mixture of at least some of isopropyl alcohol (IPA), ethylene glycol, dimethyl sulfoxide, glycerol, tetrahydrofuran, silicone oil, or hexanic acid. The fluid may be selected considering the interaction between the micro-device (170) and the fluid, evaporation characteristics, etc. Additionally, the interaction between the micro-device (170) and the fluid or evaporation characteristics may be predicted or determined considering surface tension, viscosity, or contact angle, etc.

[0054] A vibration source (130) is positioned around a container (120). The vibration source (130) includes a plurality of vibration sources. The plurality of vibration sources (130) are positioned on a plurality of concentric circles. The container (120) is positioned at the center of the concentric circles. The plurality of vibration sources (130) may include a first group of vibration sources (130a, 130b, 130c, and 130d) positioned on a first circle (134) and a second group of vibration sources (132a, 132b, 132c, and 132d) positioned on a second circle (136). The second circle (136) is a circle with a longer radius than the first circle (134).

[0055] According to one embodiment of the present disclosure, the difference in radius between the first circle (134) and the second circle (136) can be set to be 3 cm or more and 30 cm or less. When the difference in radius between the two concentric circles is within 3 cm, it is difficult to induce a vortex by the mutual frequency difference, i.e., the beat frequency, during the process in which wave energy is transmitted from the vibration source (130) to the container (120) containing the fluid. In addition, when the difference in radius between the two concentric circles is 30 cm or more, it becomes difficult to operate the device transfer device (100) structurally in terms of overall weight and the durability of the vibration source (130). Therefore, according to one embodiment of the present disclosure, by setting the difference in radius between the two concentric circles to a range of 3 cm or more and 30 cm or less, the effect of increasing the vibration transmission performance and durability of the device transfer device (100) is achieved.

[0056] A plurality of vibration sources (130) form waves in the fluid of the container (120). According to one embodiment of the present disclosure, a plurality of vibration sources (130) can generate a standing wave by outputting vibrations from a pair of opposing vibration sources. Whether a standing wave is formed depends on the boundary conditions of the applied pulse signal and the substrate on which the waveform is formed. Depending on the boundary conditions, the waveform generated in the fluid of the container (120) can vary. This is related to the eigenvalue, and a standing wave is formed when the composite wave in the container (120) has the eigenvalue of the vibration signal. Vibration energy applied as an external force to the micro-element (170) is transmitted by changing the position of the vibration nodal line. That is, the micro-element (170) gathers at the point where the pressure is low, and the plurality of vibration sources (130) induce movement of the micro-element gathered at the point where the pressure is low by changing the position of the nodal line. Changes in the nodal line can be induced through the generation of a composite wave by multiple vibration sources (130).

[0057] According to one embodiment of the present disclosure, a plurality of vibration sources (130) may include at least one of an actuator, a PZT (lead zirconate titanate) transducer, or a speaker. The plurality of vibration sources (130) may generate and output a standing wave having an output frequency.

[0058] According to one embodiment of the present disclosure, a plurality of vibration sources (130) can output vibrations with an output frequency in the range of 10 Hz or more and 100 MHz or less.

[0059] According to one embodiment of the present disclosure, a plurality of vibration sources (130) can output vibrations with an output frequency in the range of 10 Hz or more and 100 Hz or less. Vibrations with an output frequency in this range can correspond to acoustic waves. Acoustic waves can generate an acoustic force within a fluid through vibration. According to one embodiment of the present disclosure, the travel distance of the micro-element (170) can be increased by outputting long-wavelength vibrations. When the scale of the element transfer device (100) increases, if the micro-element (170) is moved by high-frequency vibrations, the travel distance of the micro-element (170) is short and energy loss may occur.

[0060] According to one embodiment of the present disclosure, the output frequency range may vary depending on the application. For example, the output frequency range may be adjusted within the range of 20Hz to 500Hz depending on the size of the substrate (160).

[0061] Additionally, according to one embodiment of the present disclosure, when ultrasonic levitation is used, the output frequency may be in the range of 20 kHz to 10 MHz. Additionally, according to one embodiment of the present disclosure, when precise ultrasonic levitation is used, the output frequency may be in the range of 10 MHz to 100 MHz. Additionally, when the micro-element (170) corresponds to a cell or a microparticle, the output frequency may be 1 MHz or higher. Additionally, when the micro-element (170) corresponds to a large object, the output frequency may be in the range of tens of kHz.

[0062] The floating mask (150) may include a plurality of mask holes (152). The floating mask (150) may have a disc shape. For example, the floating mask (150) may have a circular disc shape. The floating mask (150) may include a plurality of mask holes (152) arranged in a size and shape corresponding to the element holes of the substrate (160). The floating mask (150) may be composed of at least one of, for example, aluminum, stainless steel, Invar, or a high-rigidity organic material. Invar is an alloy of nickel and iron.

[0063] The processor (210) controls the overall operation of the device transfer device (100). The processor (210) may be implemented as one or more processors. The processor (210) may perform a predetermined operation by executing an instruction or command stored in memory (not shown). Additionally, the processor (210) controls the operation of components provided in the device transfer device (100).

[0064] The processor (210) is configured to control a series of processes to enable the device transfer device (100) to operate according to the embodiments described below, and may be composed of one or more processors. The one or more processors included in the processor (210) may be circuitry such as a System on Chip (SoC) or an Integrated Circuit (IC). The one or more processors included in the processor (210) may be general-purpose processors such as a CPU (Central Processing Unit), MPU (Micro Processor Unit), AP (Application Processor), DSP (Digital Signal Processor), graphics-dedicated processors such as a GPU (Graphic Processing Unit) or VPU (Vision Processing Unit), artificial intelligence-dedicated processors such as an NPU (Neural Processing Unit), or communication-dedicated processors such as a CP (Communication Processor). If the one or more processors included in the processor (210) are artificial intelligence-dedicated processors, the artificial intelligence-dedicated processors may be designed with a hardware structure specialized for processing a specific artificial intelligence model.

[0065] The processor (210) can write data to memory or read data stored in memory, and in particular, can process data according to a predefined operation rule or artificial intelligence model by executing a program or at least one instruction stored in memory. Accordingly, the processor (210) can perform operations described in subsequent embodiments, and operations described as being performed by the device transfer device (100) or detailed components included in the device transfer device (100) in subsequent embodiments can be seen as being controlled by the processor (210) unless otherwise specified.

[0066] The processor (210) can generate and output a driving signal to a plurality of vibration sources (130). The driving signal can be output to a plurality of vibration sources (130). According to one embodiment of the present disclosure, the driving signal is output to a signal amplifier (140), and the signal amplifier (140) can output the amplified driving signal to a plurality of vibration sources (130). The processor (210) can generate a pulse signal for controlling the waveform of the vibration energy of the plurality of vibration sources (130). The processor (210) can generate the pulse signal by a predetermined function generator.

[0067] The processor (210) can control the behavior of the floating mask (150) or the micro device (170) by adjusting the frequency of the standing wave output from the plurality of vibration sources (130). The processor (210) can output vibration from at least one of the plurality of vibration sources (130) to rotate or reciprocate the floating mask (150) during a distributed operation. Additionally, the processor (210) can set a target movement path for the micro device (170) during a transfer operation and control the plurality of vibration sources (130) to move the micro device (170) along the target movement path.

[0068] The container (120) may be implemented to be replaceable from the device transfer device (100). According to one embodiment of the present disclosure, the container (120) may be replaced with various containers (120) of different specifications or sizes. The container (120) may also be implemented as a disposable container. The container (120) may have a fixing structure for fixing the substrate.

[0069] A plurality of vibration sources (130) may be arranged in a predetermined arrangement on a predetermined support structure. A plurality of vibration sources (130) may be arranged on a plurality of concentric circles on the support structure. The support structure may have a structure that fixes a container (120) at the center of the concentric circles.

[0070] The processor (210) may be arranged to be electrically connected to a plurality of vibration sources (130). According to one embodiment of the present disclosure, the processor (210) may be implemented integrally with the plurality of vibration sources (130). Additionally, according to one embodiment of the present disclosure, the processor (210) may be placed in a predetermined external device electrically connected to the plurality of vibration sources (130). The external device may correspond to, for example, an electronic device such as a computer, a tablet PC, a laptop computer, or a communication terminal.

[0071] FIG. 4 is a flowchart illustrating a method for controlling a device transfer device according to one embodiment of the present disclosure.

[0072] According to one embodiment of the present disclosure, a device transfer device control method may be performed by a device electronic device (100) according to one embodiment of the present disclosure. Additionally, a device transfer device control method according to one embodiment of the present disclosure may be performed by a predetermined electronic device (e.g., a desktop PC, a laptop PC, a tablet PC, or a communication terminal, etc.) including a processor and memory. In the present disclosure, the device transfer device control method is described primarily in the form of an embodiment performed by a device transfer device (100) according to one embodiment of the present disclosure, but the embodiments of the present disclosure are not limited thereto.

[0073] In step S402, the device transfer device (100) outputs vibrations from at least some of the plurality of vibration sources (130) while the floating mask (150) is placed on the substrate (160). Before performing the dispersion operation, the substrate (160) may be placed in a container (120), and the floating mask (150) may be placed on the substrate (160). Additionally, the substrate (160) and the floating mask (150) may be submerged in a fluid. Additionally, a micro device (170) may be introduced onto the floating mask (150). The micro device (170) may be introduced onto the floating mask (150) using a predetermined physical tool before performing the dispersion operation. The micro device (170) may be randomly dispersed in the fluid.

[0074] The device transfer device (100) can vibrate, rotate, or reciprocate the floating mask (150) by performing a predefined dispersion operation that outputs vibration from at least one of a plurality of vibration sources (130). The operation of a plurality of dispersion modes of the device transfer device (100) in the dispersion operation will be described later.

[0075] During the dispersion operation, the micro-element (170) moves onto the substrate (160) by passing through the floating mask (150) via the mask hole (152) of the floating mask (150). The micro-element (170) can move onto the substrate (160) in a fluid. As the micro-element (170) moves onto the substrate (160) via the mask hole (152) of the floating mask (150), the micro-element (170) can be distributed more uniformly on the substrate (160).

[0076] When the dispersion operation of step S402 is completed, the floating mask (150) can be removed from the container (120). When the floating mask (150) is removed, the device transfer device (100) performs a transfer operation in step S404. In the transfer operation, the device transfer device (100) controls the transfer of the micro device (170) to the device hole of the substrate (160). The device transfer device (100) outputs vibrations from a plurality of vibration sources (130) according to a predetermined transfer mode to control the transfer of the micro device (170) to the device hole of the substrate (160). The device transfer device (100) can obtain a captured image by photographing the substrate (160) on the substrate (160). Based on the captured image, the device transfer device (100) obtains information about the transfer state of the substrate (160) and can select and perform a transfer mode to move the micro device (170) to the empty device hole. The operation of selecting and performing the transfer mode will be described later.

[0077] FIG. 5 is a diagram showing the structure of a floating mask according to one embodiment of the present disclosure.

[0078] According to one embodiment of the present disclosure, the floating mask (150) may have a circular disc shape. The floating mask (150) may be made of aluminum, for example. The floating mask (150) may be made of a diameter of 5 to 20 cm, for example. For example, the floating mask (150) may have a diameter of 8.4 cm. Additionally, the floating mask (150) may have a thickness of 150 μm, for example. Additionally, the floating mask (150) may be non-magnetic and its surface may be polished.

[0079] The floating mask (150) may include a plurality of mask holes (152) in a central mask hole region (510). According to one embodiment of the present disclosure, the mask hole region (510) may have a size and shape corresponding to a device hole region in which device holes are formed in the substrate (160). Additionally, according to one embodiment of the present disclosure, the mask hole region (510) may be formed larger than the device hole region by a predetermined amount. For example, the mask hole region (510) may be formed 5 to 10 percent larger than the device hole region.

[0080] The shape and size of the mask hole area (510) can be determined in various ways. The mask hole area (510) may have a shape such as, for example, a square, a rectangle, a rhombus, a circle, an ellipse, a hexagon, or an octagon. In addition, the size of the mask hole area (510) may be, for example, 2 to 10 cm. The mask hole area (510) may have a square shape with a side length of 3 cm, for example.

[0081] According to one embodiment of the present disclosure, the size of the mask hole (152) may be determined according to the size of the micro-element (170). The mask hole (152) has a size through which the micro-element (170) can pass. For example, when the process is performed in a contact manner, the mask hole (152) may have a size that is 0 to 15% larger than the size of the micro-element (170). When the process is performed in a non-contact manner to evenly disperse the micro-element (170) on the substrate (160), the mask hole (152) may have a size of, for example, 0.1 mm to 0.3 mm. Additionally, the mask hole (152) may have a shape such as, for example, a circle, an ellipse, a square, or a hexagon. According to one embodiment of the present disclosure, the mask hole (152) may have a circular shape. Additionally, the mask hole (152) may have a diameter of 200 μm.

[0082] The spacing between the mask holes (152), i.e., the pitch, can be determined according to the size of the mask holes (152). For example, the spacing between the mask holes (152) can be determined to be equal to the size of the mask holes (152). For example, the mask holes (152) can have a size of 0.1mm to 0.3mm.

[0083] According to one embodiment of the present disclosure, which processes in a non-contact manner, the floating mask (150) may have a spacer (530) on a surface facing the substrate (160). The spacer (530) supports the floating mask (150) to maintain a gap between the floating mask (150) and the substrate (160) when the floating mask (150) is placed on the substrate (160).

[0084] According to one embodiment of the present disclosure, the spacer (530) may correspond to an O-ring. The spacer (530) may have a thickness of 0.1 cm to 1 cm. Additionally, the spacer (530) may be placed along the outer edge of the floating mask (150) so as not to interfere with the mask hole area (510).

[0085] Additionally, according to one embodiment of the present disclosure, the floating mask (150) may include a plurality of lifting members (540). The lifting members (540) are provided on the floating mask (150) so as to be able to grasp the floating mask (150) when removing the floating mask (150) from the container (120) after a dispersion operation. The lifting members (540) may be implemented in the form of a protrusion, a handle, or a ring. According to one embodiment of the present disclosure, the lifting members (540) may be disposed on a surface opposite to the surface of the floating mask (150) provided with a spacer (530). The lifting members (540) may be disposed on a surface opposite to one surface of the floating mask (150) facing the substrate (160).

[0086] The lifting member (540) can be positioned so as not to interfere with the mask hole area (510). The lifting member (540) can be positioned at a predetermined point adjacent to the outer edge of the floating mask (150). According to one embodiment of the present disclosure, two lifting members (540) can be positioned adjacent to the outer edge of the floating mask (150) and positioned on opposite sides of each other. Additionally, according to one embodiment of the present disclosure, four lifting members (540) can be positioned adjacent to the outer edge of the floating mask (150) and positioned at 90-degree intervals. According to one embodiment of the present disclosure, the lifting member (540) can be positioned 5mm to 10mm inward from the outer edge of the floating mask (150). For example, the lifting member (540) can be positioned 5mm inward from the outer edge of the floating mask (150).

[0087] FIG. 6 is a drawing showing a substrate and a micro-element placed in a container according to one embodiment of the present disclosure.

[0088] Figure 6 shows an enlarged view of the first region (612) of the substrate (160) fixed to the container (120).

[0089] According to one embodiment of the present disclosure, a container (120) may accommodate a substrate (160). The container (120) may have a fixed structure and may fix the substrate (160) to the container (120) by means of the fixed structure. The substrate (160) may be referred to as an interposer. The substrate (160) may correspond to a Si interposer. According to one embodiment of the present disclosure, the container (120) may have a cartridge form in which the substrate (160) is integrally formed. When the transfer of a micro-element (170) from the cartridge to the substrate (160) is completed, the micro-element (170) transferred to the substrate (160) within the cartridge may be transferred to another predetermined substrate.

[0090] A substrate (160) includes a plurality of element holes (620) in which a micro-element (170) can be received and fixed. The plurality of element holes (620) are formed as intaglio on the surface of the substrate (160). The plurality of element holes (620) are formed in a shape corresponding to the micro-element (170) so that the micro-element (170) can be seated or fixed. The plurality of element holes (620) may be formed on the substrate (160) in a predetermined two-dimensional array shape. According to one embodiment of the present disclosure, when the micro-element (170) is a Mini-LED having a size of 70 μm or more, the substrate (160) may have a structure in which an elastic film is placed on a glass substrate and a Fine Metal Mesh (FMM) is placed thereon. In addition, according to one embodiment of the present disclosure, when the micro-element (170) corresponds to a Micro LED, the substrate (160) may have a structure in which an intaglio pattern is formed directly on a silicon substrate.

[0091] In FIG. 6, the first region (612) of the substrate (160) is shown enlarged on the right. The behavior of the micro device (170) is explained with reference to the enlarged drawing of the first region (612).

[0092] When vibration energy is output from a plurality of vibration sources (130), the output vibration energy is transmitted to a container (120), and a force (640) is applied to a micro-element (170) in the fluid. Due to the force and direction applied to the micro-element (170) by the vibration energy, the micro-element (170) moves to an element hole (620) of the substrate (160) and settles into an element hole (620) that matches the shape of the micro-element (170). The micro-element (170) can move or rotate due to the force (640) applied by the vibration energy.

[0093] In order for the micro-element (170) to be transferred to the element hole (170) of the substrate (160) as described above, it is important that the micro-element (170) is uniformly distributed on the substrate (160). If the micro-element (170) is not uniformly distributed on the substrate (160) but is locally dense, a large number of untransferred residual micro-elements (170) may be distributed in the densely concentrated area, which may hinder the movement of the micro-element (170). Additionally, in areas where the micro-element (170) is not distributed, a shortage of micro-elements (170) may result in a large number of empty element holes (170). According to one embodiment of the present disclosure, by uniformly distributing the micro-element (170) on the substrate (160) through a floating mask (150), the success rate of transferring the element hole (170) of the substrate (160) can be increased.

[0094] FIG. 7 is a drawing showing a container and a plurality of vibration sources according to one embodiment of the present disclosure.

[0095] The present disclosure describes an embodiment in which four vibration sources (130) are arranged in each of two concentric circles. Additionally, the present disclosure describes an embodiment in which eight vibration sources (130) are arranged to correspond to the corners of a regular octagonal container (120). However, the number of concentric circles and the number of vibration sources (130) can be changed and are not limited to those disclosed in the embodiments of the present disclosure.

[0096] According to one embodiment of the present disclosure, a plurality of vibration sources (130) may be arranged on a plurality of concentric circles (134, 136). The plurality of concentric circles (134, 136) are circles centered on the same center point (730) and have different radii. A first circle (134) may have a radius of a first distance, and a second circle (136) may have a radius of a second distance.

[0097] A plurality of vibration sources (130) includes a first group of vibration sources (130a, 130b, 130c, and 130d) and a second group of vibration sources (132a, 132b, 132c, and 132d) disposed on a first source (134). The first group of vibration sources (130a, 130b, 130c, and 130d) may include at least one pair of vibration sources (130a, 130b, 130c, and 130d) disposed facing each other on at least one major axis. According to one embodiment of the present disclosure, a pair of second group of vibration sources (132a and 132c) may be disposed on a first major axis (720a), and another pair of second group of vibration sources (132b and 132d) may be disposed on a second major axis (720b). Additionally, a pair of first group vibration sources (130a and 130c) may be placed on the first short axis (710a), and another pair of first group vibration sources (130b and 130d) may be placed on the second short axis (710b). The first short axis (710a), the first major axis (720a), the second short axis (710b), and the second major axis (720a) may be placed in the order mentioned above, forming a 45° angle with the adjacent axis.

[0098] According to one embodiment of the present disclosure, by arranging a pair of vibration sources (130) at positions facing each other and arranging the vibration sources (130) in a plurality of concentric circles (134 and 136), the first group of vibration sources (130a, 130b, 130c, and 130d) of the short axis (710a and 710b) between the second group of vibration sources (132a, 132b, 132c, and 132d) of the long axis (720a and 720b) ​​can act as springs. As a result, the device transfer device (100) is able to form a reflected wave in an area rotated 20 to 90° by vibration energy output from the vibration sources (130). In addition, the reflected wave thus formed forms a composite vector in the acoustic potential field over time, thereby resulting in a change in the dispersion pattern of the micro devices (170) periodically. In addition, to induce such torque generation, the dispersion of the micro-element (170) can be induced more quickly by additionally applying a beat frequency of 1 to 10 Hz. The beat frequency represents the frequency difference or the frequency difference over time with another vibration source (130) in the vibration output sequence of the vibration source (130). By applying this beat frequency, the vibration energy output from the multiple vibration sources (130) appears as a composite waveform, and by generating a swing effect equal to the width of the wavelength difference according to the frequency difference of the two vibrations, an inducing force can be provided that can further accelerate the dispersion of the micro-element (170) probabilistically and statistically. When vibration energy from the multiple vibration sources (130) is applied to the fluid of the container (120), the total acoustical pressure is given by Equation 1.

[0099]

[0100] In Equation 1, P0 is the wave amplitude and angular velocity = 2πf1(rad / s) and, = 2π * f² (rad / s), t(s) is time, x(m) i θ is the distance from the vibration source (130), and c0 represents the speed of sound propagation in the medium. Here, f1 = f2 + β, and β represents the beat frequency.

[0101] The acoustic propagation speed of a medium in Equation 1 = +ε and, =( + If ) / 2, the induced force applied to the entire micro-element (170) is equal to Equation 2.

[0102]

[0103] Here, r is the radius (m) of the micro-element (170), and ρ0 is the density of the fluid (kg / m³). 3 ), ρ is the density (kg / m²) of the micro-element (170). 3 ), c is the speed of sound in the micro-element (170), φ(ρ,c) is the acoustic contrast factor, k= / c0 is wave number(m- 1 It means ). P D is an acoustic pressure field, and 2P O Can correspond to. P O corresponds to the average peak amplitude of the two waves having the beat frequency. The induced force field travels from the high-frequency vibration source to the low-frequency vibration source at a constant speed v = ε / 2k in units of m / s. If the frequencies of excitation are given by f1 = f2 + Δf and f = (f1 + f2) / 2 (Hz), then the speed of the vibration pattern is am.

[0104] FIG. 8 is a drawing showing the arrangement of a plurality of vibration sources according to one embodiment of the present disclosure.

[0105] According to one embodiment of the present disclosure, a plurality of vibration sources (130) may be arranged as shown in FIG. 8. The plurality of vibration sources (130) includes a first group of vibration sources (130a, 130b, 130c, and 130d) and a second group of vibration sources (132a, 132b, 132c, and 132d).

[0106] The first group of vibration sources (130a, 130b, 130c, and 130d) includes a first vibration source (130a), a second vibration source (130b), a third vibration source (130c), and a fourth vibration source (130d). The first vibration source (130a) and the third vibration source (130c) are a pair of vibration sources positioned facing each other on the first axis (710a). The first vibration source (130a) and the third vibration source (130c) are positioned at equal distances from the center of the concentric circle in which the plurality of vibration sources (130) are positioned. The second vibration source (130b) and the fourth vibration source (130d) are a pair of vibration sources positioned facing each other on the second axis (710b). The second vibration source (130b) and the fourth vibration source (130d) are positioned at the same distance from the center of the concentric circle in which the plurality of vibration sources (130) are arranged.

[0107] The second group of vibration sources (132a, 132b, 132c, and 132d) includes the fifth vibration source (132a), the sixth vibration source (132b), the seventh vibration source (132c), and the eighth vibration source (132d). The fifth vibration source (132a) and the seventh vibration source (132c) are a pair of vibration sources positioned facing each other on the first major axis (720a). The fifth vibration source (132a) and the seventh vibration source (132c) are positioned at equal distances from the center of the concentric circle in which the plurality of vibration sources (130) are positioned. The sixth vibration source (132b) and the eighth vibration source (132d) are a pair of vibration sources positioned facing each other on the second major axis (720b). The 6th vibration source (132b) and the 8th vibration source (132d) are positioned at the same distance from the center of the concentric circle in which the plurality of vibration sources (130) are arranged.

[0108] In one embodiment of the present disclosure, a plurality of transfer modes are defined based on the arrangement of a plurality of vibration sources (130) shown in FIG. 8.

[0109] According to one embodiment of the present disclosure, a dispersion mode may define at least one of the operation status, output frequency, output cycle, or output time of each of a plurality of vibration sources (130). The vibration source (130) that outputs vibration in each dispersion mode, the output frequency, and the timing may be stored in advance in the memory of the device transfer device (100). The device transfer device (100) may control the vibration source (130) according to the sequence stored in the memory to perform the operation of each dispersion mode.

[0110] FIGS. 9 to 11 are drawings for explaining the operation of each dispersion mode. With reference to FIGS. 9 to 11, a plurality of dispersion modes will be described. Each circle in FIGS. 9 to 11 represents a vibration source (130), and the octagon represents a container (120). Additionally, the arrangement of the vibration source (130) in FIGS. 9 to 11 corresponds to the arrangement of the vibration source (130) described in FIG. 8. The number written on the circle corresponding to the vibration source (130) represents an output frequency in Hz, and an empty circle represents a state in which no vibration is output.

[0111] FIG. 9 is a diagram showing the operation of a first distribution mode according to one embodiment of the present disclosure.

[0112] The first dispersion mode (910) is a mode in which a pair of vibration sources on one axis, either a short axis or a long axis, is vibrated at a predetermined frequency. According to one embodiment of the present disclosure, the element transfer device (100) may output vibrations of a first frequency from a pair of vibration sources of a first short axis (130a), a first vibration source (130a) and a third vibration source (130c), in the first dispersion mode (910). For example, the first frequency may be 66 Hz. The first dispersion mode (910) is a mode in which vibrations are applied to a floating mask (150). In the first dispersion mode (910), vibration energy (920) may be transferred to the floating mask (150) and the fluid without the floating mask (150) undergoing rotational movement in the horizontal direction. In the first dispersion mode (910), as the floating mask (150) vibrates, the micro-element (170) on the floating mask (150) can move onto the substrate (160) through the mask hole.

[0113] FIG. 10 is a diagram showing the operation of a second distributed mode according to one embodiment of the present disclosure.

[0114] The second dispersion mode (1010) is a mode that outputs vibration from one of the plurality of vibration sources (130). For example, the device transfer device (100) may output vibration of a first frequency from the first vibration source (130a) in the second dispersion mode (1010). For example, the first frequency may be 66 Hz. The second dispersion mode (1010) rotates the floating mask (150) clockwise or counterclockwise. In the second dispersion mode (1010), as the floating mask (150) rotates, the micro device (170) on the floating mask (150) can move onto the substrate (160) through the mask hole. The second dispersion mode (1010) is a phenomenon that utilizes an asymmetric vibration pattern or a non-linear effect to cause the force applied to the wave-shaped floating mask (150) to move in a specific direction. According to one embodiment of the present disclosure, the device transfer device (100) can generate an asymmetric interference pattern by simultaneously applying two or more frequencies from a single vibration source (130). In this case, due to the difference in frequency, an asymmetric motion pattern such as a Lissajous curve (a shape formed by the synthesis of two waves with a phase difference) can be generated, and this can be used to generate rotation of the floating mask (150).

[0115] FIG. 11 is a diagram showing the operation of a third distributed mode according to one embodiment of the present disclosure.

[0116] The third dispersion mode (1110) is a mode that outputs vibrations of a first frequency from a pair of vibration sources (130a and 130c) on the first axis (710a) and outputs vibrations of a second frequency from a pair of vibration sources (130b and 130d) on the second axis (710b). For example, in the third dispersion mode (1110), the device transfer device (100) may output vibrations of 66 Hz from a pair of vibration sources (130a and 130c) on the first axis (710a) and output vibrations in the range of 67 Hz to 69 Hz from a pair of vibration sources (130b and 130d) on the second axis (710b). The third dispersion mode (1110) causes the floating mask (150) to reciprocate. In the third dispersion mode (1110), as the floating mask (150) reciprocates, the micro-element (170) on the floating mask (150) can move onto the substrate (160) through the mask hole. The third dispersion mode (1110) utilizes the physical phase difference between the vibration output from a pair of vibration sources (130a and 130c) on the first axis (710a) and the vibration output from a pair of vibration sources (130b and 130d) on the second axis (710b).

[0117] According to one embodiment of the present disclosure, the amplitudes of a first vibration (1112) output from a pair of vibration sources (130a and 130c) on a first axis (710a) and a second vibration (1114) output from one vibration source (130b and 130d) on a second axis (710b) may be set differently. The device transfer device (100) can control the directionality of the reciprocating rotational motion by adjusting the amplitudes of the first vibration (1112) and the second vibration (1114). The device transfer device (100) can control the floating mask (150) to perform a reciprocating rotational motion having a clockwise or counterclockwise directionality due to the difference in amplitude size.

[0118] According to one embodiment of the present disclosure, the amplitude of the reciprocating rotational motion may vary by a beat frequency corresponding to the frequency difference between the first vibration (1112) and the second vibration (1115). For example, the floating mask (150) performs a reciprocating rotational motion with a first amplitude (1122) when the beat frequency is 1 Hz, and performs a reciprocating rotational motion with a second amplitude (1122) when the beat frequency is 3 Hz. As the beat frequency increases, the amplitude of the reciprocating rotational motion may increase. For example, the amplitude of the reciprocating rotational motion may correspond to 15 to 20 degrees when the beat frequency is 3 Hz.

[0119] FIG. 12 is a diagram showing the structure of a device transfer apparatus according to one embodiment of the present disclosure.

[0120] According to one embodiment of the present disclosure, the device transfer device (100) may include a computing device (110), a container (120), a plurality of vibration sources (130), and a camera (1210). The computing device (110) includes a processor (210) that controls the device transfer device (100).

[0121] The camera (1210) converts incident light into an electrical image signal. The camera (1210) may include at least one lens, a lens driver, and an image sensor. The camera (1210) may include one or more cameras (1210). The camera (1210) generates captured image data and outputs it to the processor (210).

[0122] A camera (1210) may be positioned to photograph the upper surface of a substrate (160) placed inside a container (120). The camera (1210) may photograph the upper surface of the substrate (160) while performing a transfer operation after the floating mask (150) is removed from the container (120). The camera (1210) may be fixed in a predetermined position so as to face the upper surface of the container (120). The camera (1210) may be positioned so that the field of view (FOV) can be adjusted, that is, so that the shooting direction can be adjusted. The camera (1210) may take still images or video based on a control signal from a processor (210). The camera (1210) may transmit the captured images to a computing device (100).

[0123] The processor (210) can receive a captured image taken by a camera (1210). The processor (210) determines the transfer status of the micro-element (170) transferred to the substrate (160) using the captured image. The transfer status refers to the ratio of the device holes (620) where the transfer of the micro-element (170) is completed among the total device holes (620) of the substrate (160). The processor (210) recognizes the device holes (620) from the captured image and determines whether the micro-element (170) has been transferred to each device hole (620). The processor (210) can use a predetermined image recognition algorithm to recognize the device holes (620) and determine whether the transfer of the micro-element (170) to each device hole (620) has been completed. According to one embodiment of the present disclosure, a computing device (110) stores information regarding the number and arrangement of device holes (620) in advance in a predetermined memory, and a processor (210) can identify the location of the device holes (620) using the information stored in advance. The processor (210) can calculate the ratio of device holes (620) that have completed transfer using the number of device holes (620) that have completed transfer relative to the total number of device holes (620), and calculate the transfer status.

[0124] According to one embodiment of the present disclosure, a processor (210) can recognize a residual micro-element (170) from a captured image that has not been transferred. The processor (210) can obtain location information and distribution information of the residual micro-element (170). The processor (210) can output vibrations from a plurality of vibration sources (130) to transfer the residual micro-element (170) to an empty element hole (620).

[0125] According to one embodiment of the present disclosure, a device transfer device (100) can control a plurality of vibration sources (130) using a plurality of dispersion modes or transfer modes that define the operation of a plurality of vibration sources (130). The plurality of dispersion modes or transfer modes may define at least one of whether each of the plurality of vibration sources (130) operates, an output frequency, an output cycle, or an output time. The device transfer device (100) can move a micro device (170) in a desired direction or pattern using a plurality of dispersion modes or transfer modes. A plurality of dispersion modes or transfer modes will be described in detail below.

[0126] According to one embodiment of the present disclosure, the device transfer device (100) includes at least one connecting plate disposed between a plurality of vibration sources (130) and a container (120). According to one embodiment of the present disclosure, the at least one connecting plate includes eight connecting plates to individually connect each vibration source (130) and the container (120). Additionally, according to one embodiment of the present disclosure, the at least one connecting plate is implemented as a single plate in contact with all vibration sources (130).

[0127] According to one embodiment of the present disclosure, the processor (210) determines a transfer mode based on the transfer state obtained from the captured image and the distribution of residual micro-elements (170). According to one embodiment of the present disclosure, the processor (210) can control the behavior of residual micro-elements (170) by a transfer mode sequence that sequentially performs a plurality of transfer modes.

[0128] The device transfer device (100) can repeat the operation of capturing images, determining the transfer status of the substrate (160), and determining and performing a transfer mode until a target transfer rate is reached. The target transfer rate can be defined as a predefined value, for example, 99.5%.

[0129] FIG. 13 is a flowchart illustrating a transfer operation according to one embodiment of the present disclosure.

[0130] According to one embodiment of the present disclosure, the device transfer device (100) can perform the transfer operation of step S404 when the distribution operation of step S402 described above in FIG. 4 is completed. According to one embodiment of the present disclosure, the transfer operation may include steps S1302, S1304, S1306, S1308, and S1310.

[0131] In step S1302, the device transfer device (100) uses a camera (1210) to photograph a substrate (160) inside a container (120) and obtains a captured image. The captured image may be an image of the upper surface of the substrate (160).

[0132] Next, in step S1304, the device transfer device (100) determines the transfer status of the substrate (160) using a captured image. The device transfer device (100) can determine the transfer status of the substrate (160) by calculating the ratio of the completion of transfer to the device holes (620) formed in the substrate (160). Additionally, according to one embodiment of the present disclosure, the device transfer device (100) can detect residual micro-devices (170) in the fluid of the container (120) using a captured image. The device transfer device (100) can identify the location or distribution of the residual micro-devices (170).

[0133] Additionally, according to one embodiment of the present disclosure, the device transfer device (100) can detect residual device holes among the device holes (620) of the substrate (160) in which the micro device (170) has not been transferred, using a captured image. The device transfer device (100) can detect at least one of the device holes (620) in which the transfer is completed or the device holes in which the micro device (170) has not been transferred in the captured image. The device transfer device (100) can classify each device hole (620) into device holes in which the transfer is completed and residual device holes according to the detection result. The device transfer device (100) can identify the location or distribution of the residual device holes.

[0134] Next, in step S1306, the device transfer device (100) can select a transfer mode of a plurality of vibration sources (130) based on the transfer state of the substrate (160) and the position of the residual micro-device (170). Based on the transfer state and the position of the residual micro-device, the device transfer device (100) can determine a target position to move the residual micro-device and select a transfer mode to move it to the target position.

[0135] According to one embodiment of the present disclosure, the device transfer device (100) can select a transfer mode based on a transfer state, a location of a residual micro-device, and a location of a residual device hole. The device transfer device (100) can set a target location to move the residual micro-device based on the location of the residual micro-device and the location of the residual device hole. The device transfer device (100) can select a transfer mode based on the current location of the residual micro-device and the target location to move the residual micro-device.

[0136] According to one embodiment of the present disclosure, a device transfer device (100) can select a transfer mode using an Artificial Intelligence (AI) model. The device transfer device (100) inputs a captured image to the AI ​​model, and the AI ​​model can output a selected transfer mode based on the captured image. The AI ​​model may be a machine-learned model based on training data that includes a plurality of captured images and transfer modes. According to one embodiment of the present disclosure, the AI ​​model may use a Proximal Policy Optimization (PPO) algorithm. Additionally, according to one embodiment of the present disclosure, at least one of Trust Region Policy Optimization (TRPO), Advantage Actor Critic (A2C), or Deep Q Network (DQN) may be used.

[0137] Next, in step S1308, the device transfer device (100) controls a plurality of vibration sources (130) in a selected transfer mode to output vibrations from the plurality of vibration sources (130). The processor (210) controls the plurality of vibration sources (130) in a manner defined in the selected transfer mode. The processor (210) generates a driving signal of an output frequency defined in the selected transfer mode and outputs the generated driving signal to the vibration source (130) that outputs the vibrations. The processor (210) controls the plurality of vibration sources (130) to output vibrations in a set pattern for a preset time or cycle.

[0138] When vibrations are output from a plurality of vibration sources (130), the vibrations from the plurality of vibration sources (130) are transmitted to the container (120) through a connecting plate and to the fluid within the container (120), thereby inducing waves within the fluid. Due to the waves induced within the fluid, the micro-elements (170) within the fluid move. The operation of outputting vibrations from the plurality of vibration sources (130) is performed for a preset time.

[0139] Next, in step S1310, the device transfer device (100) determines whether the transfer state of the substrate (160) has reached a target transfer rate. After the vibration output is completed in step S1308, the device transfer device (100) can acquire a captured image of the substrate (160) again and, based on the captured image, determine whether the transfer state of the substrate (160) has reached a target transfer rate.

[0140] If the transfer state of the substrate (160) does not reach the target transfer rate, the device transfer device (100) repeats steps S1302, S1304, S1306, and S1308. The device transfer device (100) may repeat steps S1302, S1304, S1306, S1308, and S1310 until the transfer state reaches the target transfer rate.

[0141] The device transfer device (100) terminates operation when it is determined that the transfer status of the substrate (160) has reached a target transfer rate in step S1310. According to one embodiment of the present disclosure, when the device transfer device (100) determines that the transfer status of the substrate (160) has reached a target transfer rate, it may output a notification that the target transfer rate has been reached through a predetermined output interface or an external device.

[0142] Next, we will explain the multiple warrior modes.

[0143] In one embodiment of the present disclosure, a plurality of transfer modes are defined based on the arrangement of a plurality of vibration sources (130) shown in FIG. 8.

[0144] FIG. 14 is a diagram showing the definition of a plurality of transfer modes according to one embodiment of the present disclosure.

[0145] According to one embodiment of the present disclosure, a plurality of transfer modes may be defined by a vibration source and an output frequency that output vibration in each transfer mode. A plurality of transfer modes may be defined as shown in FIG. 14 and may be stored in advance in the memory of a device transfer device (100).

[0146] A plurality of transfer modes may include at least one of a first transfer mode, a second transfer mode, a third transfer mode, a fourth transfer mode, a seventh transfer mode, an eleventh transfer mode, a fourteenth transfer mode, a fifteenth transfer mode, a first switch transfer mode, a second switch transfer mode, a third switch transfer mode, or a fourth switch transfer mode, or a combination thereof.

[0147] The first transfer mode is a transfer mode that vibrates the first vibration source (130a) and the third vibration source (130c), which are a pair of vibration sources of the first single axis (710a), at a first frequency, and vibrates the second vibration source (130b) and the fourth vibration source (130d), which are a pair of vibration sources of the second single axis (710b), at a second frequency that is greater than the first frequency by a first beat frequency. For example, the first frequency may be 66 Hz, the second frequency may be 67 Hz, and the first beat frequency may be 1 Hz. The first transfer mode is a transfer mode that applies a beat frequency to the fluid in the container (120).

[0148] The second transfer mode is a transfer mode that vibrates the fifth vibration source (132a) and the seventh vibration source (132c), which are a pair of vibration sources on the first long axis (720a), at a third frequency, and vibrates the sixth vibration source (132b) and the eighth vibration source (132d), which are a pair of vibration sources on the second long axis (720b), at a fourth frequency that is greater than the third frequency by a first beat frequency. For example, the third frequency may be 68 Hz, the fourth frequency may be 69 Hz, and the first beat frequency may be 1 Hz.

[0149] The third transfer mode is a transfer mode in which the first vibration source (130a) and the third vibration source (130c), which are the vibration source pair of the first short axis (710a), are vibrated at a first frequency; the second vibration source (130b) and the fourth vibration source (130d), which are the vibration source pair of the second short axis (710b), are vibrated at a second frequency; the fifth vibration source (132a) and the seventh vibration source (132c), which are the vibration source pair of the first long axis (720a), are vibrated at a third frequency; and the sixth vibration source (132b) and the eighth vibration source (132d), which are the vibration source pair of the second long axis (720b), are vibrated at a fourth frequency. The third transfer mode is a transfer mode in which torque is applied to the fluid within the container (120). In the third transfer mode, by operating all of the multiple vibration sources (130), the dispersion pattern has a rotating aspect over time.

[0150] The fourth transfer mode is a transfer mode that vibrates the vibration source pair of the first short axis (710a) at the second frequency and vibrates the vibration source pair of the second short axis (710b) at the first frequency. The fourth transfer mode is a transfer mode that applies a beat frequency to the fluid of the container (120) by switching the output frequency of the first transfer mode between the vibration source pair of the first short axis (710a) and the vibration source pair of the second short axis (710b).

[0151] The seventh transfer mode is a transfer mode that vibrates the vibration source pair of the first single-axis (710a) at a first frequency and vibrates the vibration source pair of the second single-axis (710b) at a fifth frequency that is greater than the first frequency by a second beat frequency. For example, the second beat frequency may be 3 Hz and the fifth frequency may be 69 Hz. The seventh transfer mode is a transfer mode that applies a beat frequency to the fluid in the container (120).

[0152] The 11th transfer mode is a transfer mode that vibrates the vibration source pair of the 1st short axis (710a) at the 5th frequency and vibrates the vibration source pair of the 2nd short axis (710b) at the 1st frequency. The 11th transfer mode is a transfer mode that applies a beat frequency to the fluid of the container (120) by switching the output frequency of the 7th transfer mode between the vibration source pair of the 1st short axis (710a) and the vibration source pair of the 2nd short axis (710b).

[0153] The 14th transfer mode is a transfer mode that vibrates the vibration source pair of the first single axis (710a) at a first frequency and vibrates the vibration source pair of the second single axis (710b) at a sixth frequency that is greater than the first frequency by a third beat frequency. For example, the third beat frequency may be 5 Hz and the sixth frequency may be 71 Hz. The 14th transfer mode is a transfer mode that applies a beat frequency to the fluid in the container (120).

[0154] The 15th transfer mode is a transfer mode that vibrates the vibration source pair of the first short axis (710a) at the 6th frequency and vibrates the vibration source pair of the second short axis (710b) at the 1st frequency. The 15th transfer mode is a transfer mode that applies a beat frequency to the fluid of the container (120) by switching the output frequency of the 14th transfer mode between the vibration source pair of the first short axis (710a) and the vibration source pair of the second short axis (710b).

[0155] The first switch transfer mode is a transfer mode that vibrates the pair of vibration sources of the first short axis (710a) at a first frequency. The first switch transfer mode generates a standing wave of the first frequency between the pair of vibration sources of the first short axis (710a).

[0156] The second switch transfer mode is a transfer mode that vibrates the pair of vibration sources of the second short axis (710b) at the first frequency. The second switch transfer mode generates a standing wave of the first frequency between the pair of vibration sources of the second short axis (710b).

[0157] The third switch transfer mode is a transfer mode that vibrates the pair of vibration sources of the first long axis (720a) at a first frequency and sets different signal amplification rates between the two vibration sources of the pair of vibration sources of the first long axis (720a). For example, the fifth vibration source (132a) can output vibrations of the first frequency at an amplification rate of 80%, and the seventh vibration source (132c) can output vibrations of the first frequency at an amplification rate of 60%.

[0158] The fourth switch transfer mode is a transfer mode that vibrates the vibration source pair of the first single-axis (710a) and the vibration source in one of the groups of the third group vibration source and the fourth group vibration source divided by the first single-axis (710a) at a first frequency. For example, the third group vibration source may include the fourth vibration source (130d), the seventh vibration source (132c), and the eighth vibration source (132d), and the fourth group vibration source may include the second vibration source (130b), the fifth vibration source (132a), and the sixth vibration source (132b). According to one embodiment of the present disclosure, the fourth switch transfer mode may be a transfer mode that vibrates the vibration source pair of the first single-axis (710a) and the fourth group vibration source at a first frequency. That is, the fourth switch transfer mode may be a transfer mode that vibrates the first vibration source (130a), the second vibration source (130b), the third vibration source (130c), the fifth vibration source (132a), and the sixth vibration source (132b) at the first frequency.

[0159] FIG. 15 is a drawing showing a plurality of transfer modes according to one embodiment of the present disclosure.

[0160] According to one embodiment of the present disclosure, a transcription mode may be defined as a sequence of transcription modes described above in FIG. 14. In the present disclosure, a transcription mode defined as a sequence of transcription modes is referred to as a Sequential Mode Shift (SMS) transcription mode.

[0161] According to one embodiment of the present disclosure, an SMS transfer mode may include at least one of a first SMS transfer mode, a second SMS transfer mode, a third SMS transfer mode, a fourth SMS transfer mode, a fifth SMS transfer mode, a sixth SMS transfer mode, a seventh SMS transfer mode, an eighth SMS transfer mode, a ninth SMS transfer mode, a tenth SMS transfer mode, and an eleventh SMS transfer mode. Each SMS transfer mode may be defined by the type and order of operation modes performed, the time for one cycle to be executed, and the number of cycle repetitions.

[0162] The first SMS transfer mode is a transfer mode that operates in the first transfer mode (M1) and then in the second transfer mode (M2). In the first SMS transfer mode, the device transfer device (100) can operate in the first transfer mode (M1) for 4 minutes and then in the second transfer mode (M2) for 4 minutes. Additionally, in the first SMS transfer mode, the device transfer device (100) can repeat the cycle of operating in the first transfer mode (M1) and the second transfer mode (M2) three times.

[0163] The second SMS transfer mode is a transfer mode that operates as the third transfer mode (M3). In the second SMS transfer mode, the device transfer device (100) can repeat a cycle of operating as the third transfer mode (M3) for 4 minutes 6 times.

[0164] The third SMS transfer mode is a transfer mode that operates in the fourth transfer mode (M4) after operating in the first transfer mode (M1). In the third SMS transfer mode, the device transfer device (100) can operate in the first transfer mode (M1) for 4 minutes and then operate in the fourth transfer mode (M4) for 4 minutes. Additionally, in the third SMS transfer mode, the device transfer device (100) can repeat the cycle of operating in the first transfer mode (M1) and the fourth transfer mode (M4) three times.

[0165] The 4th SMS transfer mode is a transfer mode that operates in the 11th transfer mode (M11) after operating in the 7th transfer mode (M7). In the 4th SMS transfer mode, the device transfer device (100) can operate in the 7th transfer mode (M7) for 4 minutes, and then operate in the 11th transfer mode (M11) for 4 minutes. Additionally, in the 4th SMS transfer mode, the device transfer device (100) can repeat the cycle of operating in the 7th transfer mode (M7) and the 11th transfer mode (M11) three times.

[0166] The fifth SMS transfer mode is a transfer mode that operates sequentially in the first transfer mode (M1), the first switch transfer mode (SW1), the second transfer mode (M2), and the second switch transfer mode (SW2). In the fifth SMS transfer mode, the device transfer device (100) can operate in the first transfer mode (M1) for 3 minutes, then operate in the first switch transfer mode (SW1) for 3 minutes, then operate in the second transfer mode (M2) for 3 minutes, and then operate in the second switch transfer mode (SW2) for 3 minutes. Additionally, in the fifth SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the first transfer mode (M1), the first switch transfer mode (SW1), the second transfer mode (M2), and the second switch transfer mode (SW2).

[0167] The 6th SMS transfer mode is a transfer mode that operates sequentially in the 3rd transfer mode (M3), the 1st switch transfer mode (SW1), the 3rd transfer mode (M3), and the 2nd switch transfer mode (SW2). In the 6th SMS transfer mode, the device transfer device (100) can operate in the 3rd transfer mode (M3) for 3 minutes, then operate in the 1st switch transfer mode (SW1) for 3 minutes, then operate in the 3rd transfer mode (M3) for 3 minutes, and then operate in the 2nd switch transfer mode (SW2) for 3 minutes. Additionally, in the 6th SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the 3rd transfer mode (M3), the 1st switch transfer mode (SW1), the 3rd transfer mode (M3), and the 2nd switch transfer mode (SW2).

[0168] The 7th SMS transfer mode is a transfer mode that operates sequentially in the 1st transfer mode (M1), the 1st switch transfer mode (SW1), the 4th transfer mode (M4), and the 2nd switch transfer mode (SW2). In the 7th SMS transfer mode, the device transfer device (100) can operate in the 1st transfer mode (M1) for 3 minutes, then operate in the 1st switch transfer mode (SW1) for 3 minutes, then operate in the 4th transfer mode (M4) for 3 minutes, and then operate in the 2nd switch transfer mode (SW2) for 3 minutes. Additionally, in the 7th SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the 1st transfer mode (M1), the 1st switch transfer mode (SW1), the 4th transfer mode (M4), and the 2nd switch transfer mode (SW2).

[0169] The 8th SMS transfer mode is a transfer mode that operates sequentially through the 7th transfer mode (M7), the 1st switch transfer mode (SW1), the 11th transfer mode (M11), and the 2nd switch transfer mode (SW2). In the 8th SMS transfer mode, the device transfer device (100) can operate in the 7th transfer mode (M7) for 3 minutes, then operate in the 1st switch transfer mode (SW1) for 3 minutes, then operate in the 11th transfer mode (M11) for 3 minutes, and then operate in the 2nd switch transfer mode (SW2) for 3 minutes. Additionally, in the 8th SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the 7th transfer mode (M7), the 1st switch transfer mode (SW1), the 11th transfer mode (1129), and the 2nd switch transfer mode (SW2).

[0170] The ninth SMS transfer mode is a transfer mode that operates sequentially through the 14th transfer mode (1122), the first switch transfer mode (SW1), the 15th transfer mode (1124), and the second switch transfer mode (SW2). In the ninth SMS transfer mode, the device transfer device (100) can operate for 3 minutes in the 14th transfer mode (1122), then for 3 minutes in the first switch transfer mode (SW1), then for 3 minutes in the 15th transfer mode (1124), and then for 3 minutes in the second switch transfer mode (SW2). Additionally, in the ninth SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the 14th transfer mode (1122), the first switch transfer mode (SW1), the 15th transfer mode (1124), and the second switch transfer mode (SW2).

[0171] The 10th SMS transfer mode is a transfer mode that operates sequentially through the 7th transfer mode (M7), the 1st switch transfer mode (SW1), the 11th transfer mode (M11), the 2nd switch transfer mode (SW2), and the 3rd switch transfer mode (SW3). In the 10th SMS transfer mode, the device transfer device (100) can operate in the 7th transfer mode (M7) for 3 minutes, then operate in the 1st switch transfer mode (SW1) for 3 minutes, then operate in the 11th transfer mode (M11) for 3 minutes, then operate in the 2nd switch transfer mode (SW2) for 3 minutes, and then operate in the 3rd switch transfer mode (SW3) for 3 minutes. Additionally, in the 10th SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the 7th transfer mode (M7), the 1st switch transfer mode (SW1), the 11th transfer mode (1129), the 2nd switch transfer mode (SW2), and the 3rd switch transfer mode (SW3).

[0172] The 11th SMS transfer mode is a transfer mode that operates sequentially through the 7th transfer mode (M7), the 1st switch transfer mode (SW1), the 11th transfer mode (M11), the 2nd switch transfer mode (SW2), and the 4th switch transfer mode (SW4). In the 11th SMS transfer mode, the device transfer device (100) can operate in the 7th transfer mode (M7) for 3 minutes, then operate in the 1st switch transfer mode (SW1) for 3 minutes, then operate in the 11th transfer mode (M11) for 3 minutes, then operate in the 2nd switch transfer mode (SW2) for 3 minutes, and then operate in the 4th switch transfer mode (SW4) for 3 minutes. Additionally, in the 11th SMS transfer mode, the device transfer device (100) can perform one cycle of operating in the 7th transfer mode (M7), the 1st switch transfer mode (SW1), the 11th transfer mode (1129), the 2nd switch transfer mode (SW2), and the 4th switch transfer mode (SW4).

[0173] FIG. 16 is a diagram showing the structure of a micro device according to one embodiment of the present disclosure.

[0174] According to one embodiment of the present disclosure, the micro device (170) may have a pentagonal shape in which one vertex is removed from a rectangular structure. The micro device (170) may have an asymmetric structure in which the top, bottom, left, and right sides are distinguished. The micro device (170) may include a first electrode (1610) and a second electrode (1620). One of the first electrode (1610) and the second electrode (1620) may correspond to a cathode electrode, and the other may correspond to an anode electrode. The positions of the electrodes may be configured like a typical lateral chip or flip chip. A lateral chip and a flip chip are chips having a structure in which the electrodes are on one plane, and the micro device (170) may have an electrode structure such as a lateral chip or a flip chip.

[0175] The size of the micro device (170) shown in FIG. 16 is a size according to an example of the present disclosure. According to an embodiment of the present disclosure, the micro device (170) may have a height of 36 μm and a width of 26 μm. The first electrode (1610) may have a height of 10 μm and a width of 23 μm. Additionally, the second electrode (1620) may have a height of 10 μm and a width of 23 μm. The first electrode (1610) and the second electrode (1620) may be formed 1.5 μm to 2 μm away from the edge of the micro device (170). The micro device (170) may have a thickness of 6 μm or less. The micro device (170) may correspond to an LED chip. The micro device (170) can be fabricated by creating a GaN epitaxial layer on a sapphire substrate and removing one vertex using the LLO (laser-lift-off) method.

[0176] FIG. 17 is a diagram showing the result of a distributed operation according to one embodiment of the present disclosure and the result of a distributed operation according to a comparative example.

[0177] FIG. 17 shows the results of an experiment conducted using a circular chip-shaped micro-element (170). Image 1710 shows the experimental results according to a comparative example, and image 1720 shows the results of a dispersion operation according to one embodiment of the present disclosure. Image 1710 shows the dispersion state after the micro-element (170) is introduced into the fluid in the container (120) using a pipette. Image 1720 shows the state after the floating mask (150) is removed following the dispersion operation performed using a floating mask (150).

[0178] As shown in FIG. 17, when micro-elements (170) were introduced using a pipette, it was observed that the micro-elements (170) were unevenly distributed and clustered. On the other hand, when micro-elements (170) were dispersed using a floating mask (150) according to one embodiment of the present disclosure, it was observed that the micro-elements (170) were distributed relatively uniformly.

[0179] FIG. 18 is a diagram showing the result of a distributed operation according to one embodiment of the present disclosure and the result of a distributed operation according to a comparative example.

[0180] FIG. 18 shows the result of transferring a micro-element (170) to a substrate (160) by performing a predetermined transfer mode after the dispersion result shown in FIG. 17. 1810 shows the result of a transfer operation according to a comparative example, and 1820 shows the result of a transfer operation according to an embodiment of the present disclosure. The experimental result of FIG. 18 shows the result of applying a vibration of 66 Hz from a pair of vibration sources on a first axis for 5 minutes and a vibration of 67 to 69 Hz from a pair of vibration sources on a second axis for 5 minutes to a container (120) according to a comparative example and a container (120) according to an embodiment of the present disclosure.

[0181] According to the comparative example, as shown in the 1810 image, the micro-elements (170) were not uniformly arranged on the substrate but were clustered in a concentric shape. The micro-elements (170) were clustered in the nodal lines of vibrations output from a plurality of vibration sources (130) and were not uniformly arranged on the substrate (160). On the other hand, according to one embodiment of the present disclosure, as shown in the 1820 image, it was possible to confirm that the micro-elements (170) were uniformly distributed even after performing a transfer operation.

[0182] As described above, the disclosed embodiments have been explained with reference to the attached drawings. Those skilled in the art will understand that the present invention may be practiced in forms different from the disclosed embodiments without changing the technical concept or essential features of the present invention. The disclosed embodiments are illustrative and should not be interpreted restrictively.

Claims

Claim 1 A device transfer device comprising: a polygonal container for receiving a substrate having a plurality of device holes; a plurality of vibration sources for generating vibrations and outputting vibrations into a fluid within the container; a floating mask disposed on the substrate and having a plurality of mask holes; and a processor for controlling the output of each of the plurality of vibration sources, wherein the container receives the floating mask, the fluid, and micro-devices distributed within the fluid, and the processor performs a dispersion operation in which, with the floating mask disposed on the substrate, it outputs vibrations from at least one of the plurality of vibration sources to control the micro-devices to pass through the plurality of mask holes of the floating mask and be dispersed into the fluid on the substrate; and, with the floating mask removed from the container on which the substrate is disposed, it performs a transfer operation in which it outputs vibrations from at least one of the plurality of vibration sources to transfer the micro-devices to the plurality of device holes of the substrate. Claim 2 In claim 1, the device transfer device further comprises a spacer attached to the lower part of the floating mask and preventing contact between the floating mask and the substrate, and the floating mask is disposed on the substrate such that the spacer contacts the substrate. Claim 3 A device transfer apparatus according to claim 1, wherein the plurality of vibration sources comprises at least one first group vibration source disposed on the circumference of a first circle having a radius of a first distance from the center point of the container, and at least one second group vibration source disposed on the circumference of a second circle concentric with the first circle having a radius of a second distance longer than the first distance. Claim 4 A device transfer apparatus according to claim 3, wherein the first group vibration source is positioned on at least one short axis passing through the center point and includes at least one pair of first group vibration sources facing each other with respect to the center point, and the second group vibration source is positioned on at least one long axis passing through the center point and includes at least one pair of second group vibration sources facing each other with respect to the center point. Claim 5 A device transfer apparatus according to claim 4, wherein the container is in the shape of an octagon, and each of the at least one minor axis and the at least one major axis is arranged to correspond to each corner of the octagon of the container. Claim 6 In claim 1, the device transfer device, wherein the processor controls the floating mask to rotate by outputting a vibration wave from one of the plurality of vibration sources in the distributed operation. Claim 7 A device transfer apparatus according to claim 4, wherein the processor, in the distributed operation, outputs a vibration of a first frequency from a pair of vibration sources placed on a first axis among the first group of vibration sources and outputs a vibration of a second frequency that is different from the first frequency from a pair of vibration sources placed on a second axis among the first group of vibration sources, thereby causing the floating mask to reciprocate and rotate. Claim 8 In claim 7, the device transfer apparatus controls the direction of the reciprocating rotational motion by adjusting the frequency and amplitude of the vibration output from the first group vibration source pair on the first axis and the frequency and amplitude of the vibration output from the first group vibration source pair on the second axis. Claim 9 In claim 1, the floating mask is a device transfer device made of at least one of aluminum, stainless steel, Invar, or a high-rigidity organic material. Claim 10 In claim 1, the device transfer apparatus, wherein the floating mask has a thickness of 0.1 mm or more and 1 mm or less. Claim 11 A device transfer apparatus according to claim 1, wherein the plurality of mask holes of the floating mask have a diameter in the range of 0.1 mm or more and 0.3 mm or less, and are arranged in a two-dimensional array form with a pitch of 0.1 mm or more and 0.3 mm or less. Claim 12 A device transfer apparatus according to claim 1, wherein the substrate corresponds to a display panel included in a display module, the micro-element is a light-emitting element transferred to the display panel, the pattern of the mask hole of the floating mask corresponds to the resolution of the display module, and the size of the mask hole is greater than 0% and less than or equal to 15% larger than the size of the micro-element. Claim 13 A device transfer apparatus according to claim 1, wherein the processor acquires a first image of the substrate in the container with the floating mask removed, and in the transfer operation, controls the plurality of vibration sources to at least one of a plurality of transfer modes that output a predefined output frequency through at least one of the plurality of vibration sources based on the first image. Claim 14 In paragraph 13, the device transfer device wherein the processor controls the plurality of vibration sources to sequentially operate in two or more of the plurality of transfer modes. Claim 15 A device transfer device according to claim 13, wherein the processor determines, based on the first image, a transfer state in which the micro-device is transferred to a plurality of device holes of the substrate and the location of a residual micro-device not transferred to the substrate, and controls the plurality of vibration sources to operate in at least one of the plurality of transfer modes based on the transfer state and the location of the residual micro-device. Claim 16 In claim 1, the vibration generated by the plurality of vibration sources has a frequency in the range of 20 Hz or more and 100 MHz or less, in a device transfer device. Claim 17 In claim 1, the element transfer device further comprises a plurality of connecting plates connecting the container and the plurality of vibration sources, respectively. Claim 18 A device transfer apparatus according to claim 1, further comprising a camera for photographing the substrate within the container, wherein the processor determines a transfer state in which the micro-device is transferred to the plurality of device holes of the substrate based on the image captured by the camera, and determines a transfer mode of the plurality of vibration sources based on the determined transfer state. Claim 19 A device transfer apparatus according to claim 1, wherein the fluid comprises at least one of water, ethanol, acetone, isopropyl alcohol (IPA), ethylene glycol, dimethyl sulfoxide, glycerol, tetrahydrofuran, silicone oil, or nucleic acid. Claim 20 A method for controlling a device transfer device, comprising: a dispersion step in which, while a substrate including a plurality of device holes is disposed within a polygonal container storing a fluid and a floating mask is disposed on the substrate, vibration is output from at least one of a plurality of vibration sources to control the dispersion of a micro device through the plurality of mask holes of the floating mask and into the fluid on the substrate; and a transfer step in which, while the floating mask is removed from the container in which the substrate is disposed, vibration is output from at least one of the plurality of vibration sources to transfer the micro device to the plurality of device holes of the substrate.

Images