Transfer arm and substrate processing device

Abstract

[Project] Provide a thin conveyor arm for conveying a curved substrate. [Solution] A return arm (1, 1a to 1i) comprises an upper surface (2), a lower surface (4) facing the upper surface (2) and having a groove (3) formed therein, a cover member (5) disposed on the lower surface (4) and covering the groove (3), a mounting portion (6, 6a) formed by cutting out the upper surface (2) or the lower surface (4), and an adsorption pad (P, P1, P2) mounted on the mounting portion (6, 6a). An opening (H2) communicating with the groove (3) is formed in the mounting portion (6, 6a), and the adsorption pad (P, P1, P2) has a suction hole (H1), a small diameter portion (8) mounted on the mounting portion (6, 6a), and a large diameter portion (7) connected to the small diameter portion (8).

Description

Technology Field

[0001] This relates to a return arm used for substrate return and a substrate processing device. Background Technology

[0002] Substrates, such as semiconductor wafers or glass substrates, contain some irregularities within their surfaces. These irregularities are formed, for example, by bending caused by heating the substrate.

[0003] As various substrate treatments are repeated, the bending of the substrate tends to increase. In addition, even with a single treatment, if the load applied to the substrate is large, the bending within the substrate surface tends to increase.

[0004] For example, the semiconductor device manufacturing process can be cited as an example of various substrate treatments. Furthermore, in the film deposition or ion implantation processes within semiconductor device manufacturing, if the substrate is heated to a high temperature for treatment, the load on the substrate is high, and the bending of the substrate becomes particularly significant. Moreover, if the substrate becomes thinner, the bending becomes even greater.

[0005] In a conveying robot, an elastically deformable suction pad made of silicone rubber or synthetic resin is mounted on the tip of a conveying arm to convey a bent substrate. Patent Document 1 discloses an example of such a conveying arm.

[0006] The conveying arm disclosed in Patent Document 1 is equipped with an adsorption pad having a two-layer structure that supports the back surface of a substrate at three points. A first layer with a large diameter that contacts the back surface of the substrate is composed of a conductive material. A second layer with a small diameter that supports the first layer is composed of a soft material that is deformable and has lower rigidity than the first layer. Additionally, the adsorption pad has a suction hole that penetrates the first layer and the second layer. Such an adsorption pad is fixed to the upper surface of the conveying arm. Prior art literature

[0007] Patent Document 1: Japanese Published Patent Application No. 2022-113985 The problem to be solved

[0008] In a mass production device, substrates are stored in a cassette. The cassette has multiple shelves arranged in an up-and-down direction. One substrate is stored on each shelf. When removing a substrate from the cassette, a return arm is inserted between the substrates. Then, the return arm is raised to transfer the substrate onto the return arm. After the transfer of the substrate is completed, the return arm is retracted to remove the substrate from the cassette. When bringing a substrate into the cassette, the operation of the return arm is the reverse of the operation when removing the substrate.

[0009] The spacing of the shelves that accommodate the circuit boards is set according to the dimensions of the circuit boards being accommodated. Generally, the larger the dimensions of the circuit board, the wider the shelf spacing becomes. This shelf spacing is set assuming that the circuit boards are flat. Ideally, the distance between circuit boards accommodated in a cassette is equal to the shelf spacing. However, if the circuit boards are warped, the distance between them changes. Simply put, the greater the warping of the circuit boards, the shorter the distance between them becomes.

[0010] The return arm described in Patent Document 1 has a suction pad fixed to the upper surface of the return arm, so the thickness dimension of the return arm becomes relatively large. In such a return arm, the bending of the substrate increases, which may cause a hindrance to the transfer of the substrate between the cassette and the return arm.

[0011] Regarding the above problem, a thin conveying arm for conveying a bent substrate is provided. means of solving the problem

[0012] Bansong Aam is,

[0013] The upper surface and,

[0014] A lower surface facing the upper surface and having a groove formed therein, and

[0015] A cover member mounted on the lower surface and covering the groove, and

[0016] A mounting portion formed by cutting the upper surface or the lower surface, and

[0017] A suction pad that is placed on the above-mentioned placement portion is provided,

[0018] In the above-mentioned mounting portion, an opening communicating with the above-mentioned groove is formed, and

[0019] The above-mentioned adsorption pad,

[0020] suction port and,

[0021] A small neck portion attached to the above-mentioned attachment portion, and

[0022] It has a large diameter part connected to the above small diameter part. Effects of the invention

[0023] The upper or lower surface is cut to form a mounting section, and an adsorption pad is mounted thereon. As a result, since a portion of the adsorption pad is placed within the return arm, the return arm can be made thinner.

[0024] In addition, since the suction pad has a suction hole, a small diameter portion that is placed on the placement portion, and a large diameter portion connected to the small diameter portion, it is possible to transport a bent substrate. Brief explanation of the drawing

[0025] Figure 1 is a configuration diagram showing an example of a return arm. FIG. 2 is a perspective view showing an example of an adsorption pad. Figure 3 is a cross-sectional view showing an example of an adsorption pad. Figure 4 is an explanatory diagram of the distance between circuit boards stored in a cassette. Figure 5 is a perspective view showing another example of an adsorption pad. Figure 6 is a cross-sectional view showing another example of a return arm. Figure 7 is a cross-sectional view showing another example of a return arm. FIG. 8 is a cross-sectional view showing another example of a return arm. FIG. 9 is a cross-sectional view showing another example of a return arm. FIG. 10 is a cross-sectional view showing another example of a return arm. Figure 11 is an explanatory diagram of another method of fixing the adsorption pad. FIG. 12 is a cross-sectional view showing another example of a return arm. FIG. 13 is a cross-sectional view showing another example of a return arm. Figure 14 is an explanatory diagram of another configuration of the repositioning part. FIG. 15 is a plan view of the return arm shown in FIG. 14 when viewed from a different plane. FIG. 16 is a configuration diagram showing an example of a substrate transport device. FIG. 17 is a configuration diagram showing an example of a standby return room. Specific details for implementing the invention

[0026] Embodiments of the present disclosure will be described below with reference to the drawings. In all drawings describing the embodiments, common components are denoted by the same reference numerals, and repetitive descriptions are omitted. Furthermore, the following embodiments do not unduly limit the content of the present disclosure as described in the claims. Also, not all components appearing in the embodiments are essential components of the present disclosure. Additionally, each drawing is a schematic diagram and is not necessarily a strictly detailed illustration.

[0027] FIG. 1 illustrates a conveying arm (1) used for supporting a substrate (S) in a conveying robot. The conveying arm (1) is used for conveying a substrate (S) in the atmosphere and is equipped with three suction pads (P) that support the back surface of the substrate (S), which is shown by a dashed line.

[0028] The return arm (1) is provided with an upper surface (2) and a lower surface (4) facing the upper surface (2). The lower surface (4) is located in the -W axis direction of the upper surface (2) and is not shown in FIG. 1. Also, the -W axis direction refers to a direction opposite to the direction of the W axis. Each axis of the U axis, V axis, and W axis is orthogonal to each other.

[0029] For example, the return arm (1) is made of aluminum material for the purpose of low cost and light weight. Meanwhile, it may be made of ceramic material for the purpose of increasing rigidity.

[0030] On the lower surface (4), a groove (3) is formed, as shown by a dotted line. This groove (3) is connected to each adsorption pad (P). By vacuuming the inside of the groove (3) with a vacuum pump not shown, the back surface of the substrate (S) is adsorbed onto the adsorption pad (P).

[0031] Additionally, each adsorption pad (P) does not need to be connected to a common groove (3). An independent groove may be provided for each adsorption pad (P). In this case, the adsorption of the substrate (S) at each adsorption pad (P) is controlled independently.

[0032] FIG. 2 is a perspective view of a suction pad (P). The suction pad (P) is a member having a first opening (H1) (suction hole) formed in the center. The suction pad (P) has a small diameter portion (8) and a large diameter portion (7). The small diameter portion (8) and the large diameter portion (7) are typically composed of hollow columns with different diameters.

[0033] The small diameter section (8) and the large diameter section (7) are connected to each other and formed as a single component. However, the small diameter section (8) and the large diameter section (7) may be manufactured as separate components and then assembled into a single component using adhesive or tape.

[0034] In the W-axis direction, the thickness of the large diameter portion (7) is thinner than that of the small diameter portion (8). Also, in the V-axis and U-axis directions, the dimensions of the large diameter portion (7) are larger than those of the small diameter portion (8). By making the large diameter portion (7) and the small diameter portion (8) of the same material and making the relationship between the large diameter portion (7) and the small diameter portion (8) the dimensional relationship described in this specification, the small diameter portion (8) maintains the rigidity of the adsorption pad (P), and the large diameter portion (7) deforms in accordance with the bending of the substrate (S). This enables the support of the substrate (S) by the adsorption pad (P).

[0035] Materials such as silicone rubber, fluororubber, polyimide resin, or epoxy resin, which have excellent heat resistance, are used for the adsorption pad (P). When the large diameter portion (7) and the small diameter portion (8) are made as separate parts and the two members are assembled later, the large diameter portion (7) and the small diameter portion (8) may be made of different materials. For example, the large diameter portion (7) may be made of a material that is more flexible than the small diameter portion (8). Alternatively, since the large diameter portion (7) comes into direct contact with the substrate (S), the large diameter portion (7) may be made of a material that is more heat-resistant than the small diameter portion (8).

[0036] FIG. 3 is a cross-sectional view along the line A1-A1 shown in FIG. 1. In the -W axis direction of the lower surface (4), a cover member (5) is mounted to cover the groove (3) formed on the lower surface (4). In the thickness direction (a direction parallel to the W axis direction) of the return arm (1), the return arm (1) has a mounting portion (6) between the upper surface (2) and the lower surface (4). This mounting portion (6) is formed by cutting out the upper surface (2). A second opening (H2) is formed in the mounting portion (6) that communicates with the groove (3) of the lower surface (4).

[0037] In the configuration example shown in FIG. 3, the extension direction of the second opening (H2) is along the W axis, but the extension direction of the second opening (H2) may be a direction that intersects the W axis obliquely.

[0038] A small diameter portion (8) of the suction pad (P) is placed in the mounting portion (6). The small diameter portion (8) of the suction pad (P) is fixed to the mounting portion (6) using adhesive or double-sided tape. When fixing the small diameter portion (8), the center position of the first opening (H1) formed in the suction pad (P) and the center position of the second opening (H2) formed in the mounting portion (6) are aligned. In the configuration example of FIG. 3, the diameters of the first opening (H1) and the second opening (H2) are made the same, but their diameters may be different.

[0039] With the dashed line (B) shown on the adsorption pad (P) in between, the portion above the dashed line (B) is the large diameter portion (7) described in FIG. 2. The portion below the dashed line (B) is the small diameter portion (8) described in FIG. 2. After mounting the adsorption pad (P) on the mounting portion (6), vacuum exhaust is performed inside the groove (3) formed on the lower surface (4), thereby enabling the adsorption of the substrate (S) through the second opening (H2) formed in the mounting portion (6) and the first opening (H1) formed in the adsorption pad (P).

[0040] FIG. 4 illustrates a substrate (S) stored in a cassette (17). The cassette (17) has a plurality of shelves arranged in an up-and-down direction (a direction parallel to the W-axis direction). The distance between shelves (L3) is determined according to the dimensions of the substrate (S). If the substrate (S) is flat, the distance between substrates (Lx) is equal to the distance between shelves (L3). However, if the substrate (S) becomes significantly warped due to factors such as thinning of the substrate (S) or the load on the substrate processing, the distance between substrates (Lx) changes.

[0041] When bringing in and taking out a substrate (S) from a cassette (17), a return arm (1) is moved in and out between the substrates shown in FIG. 4. At this time, if the distance (Lx) between the substrates becomes small, there is a risk that the bringing in and taking out of the substrate (S) will be hindered in a return arm having a conventional thickness.

[0042] In the return arm (1) shown in FIG. 3, the upper surface (2) is cut to form a mounting portion (6), and an adsorption pad (P) is mounted on the mounting portion (6). As a result, since a portion of the adsorption pad (P) is placed within the return arm (1), the return arm (1) can be made thinner and can accommodate a small distance (Lx) between substrates.

[0043] In addition, in a conventional configuration where an adsorption pad (P) is mounted on the upper surface (2), the mounting position of the adsorption pad (P) becomes uncertain. On the other hand, as shown in FIG. 3, by cutting out the upper surface (2) and arranging the mounting portion (6), the approximate mounting position of the adsorption pad (P) becomes clear.

[0044] The distance between the large diameter portion (7) and the lower surface (4) shown in FIG. 3 becomes the thickness dimension (L1) of the return arm (1). The thickness dimension (L1) of the return arm (1) will be explained with a specific example.

[0045] When the substrate (S) being handled is an 8-inch wafer, the distance between shelves (L3) shown in FIG. 4 is 6.35 mm. Considering that the warping of the wafer being handled in a high-temperature ion implantation device used in the manufacturing process of a semiconductor device is about 0.5 mm, the shortest distance between substrates is 5.35 mm.

[0046] Here, considering vibration or bending of the return arm (1) during substrate return in the return arm (1), the thickness dimension (L1) of the return arm (1) is set to 3.85 mm or less. More preferably, considering other factors related to substrate return or the return stability of the substrate (S), the thickness dimension (L1) of the return arm (1) is set to 3 mm or less within a range where rigidity can be secured, and the dimension (L2) protruding from the upper surface (2) of the adsorption pad (P) is set to 0.3 mm or more.

[0047] The adsorption pad (P) described in FIGS. 1 to 3 was configured such that both the large diameter portion (7) and the small diameter portion (8) formed a columnar body. This configuration is an example, and the adsorption pad (P1) shown in FIG. 5 may also be used. FIG. 5 shows a perspective view of the adsorption pad (P1).

[0048] The adsorption pad (P1) has a large diameter portion (7a) and a small diameter portion (8), similar to FIG. 3. Unlike the columnar body of FIG. 3, the large diameter portion (7a) is a member having a conical portion (CS) inclined upward from the small diameter portion (8).

[0049] The large diameter portion (7a) has a flat portion (E) parallel to the UV plane around the first opening (H1). Outside of the flat portion (E), the large diameter portion (7a) is inclined obliquely upward. Also, the outside of the flat portion (E) is the side opposite to the first opening (H1) when viewed from the flat portion (E). Also, the obliquely upward direction is a direction having a component in the W-axis direction and is a direction away from the small diameter portion (8).

[0050] Since the configuration of the large diameter portion (7a) and the small diameter portion (8) forms a roughly funnel shape, the contact area between the large diameter portion (7a) and the substrate (S) during adsorption is increased compared to the adsorption pad (P) shown in FIG. 3, so the substrate support by the large diameter portion (7a) becomes more reliable.

[0051] FIG. 6 shows a cross-sectional view of a return arm (1a) equipped with an adsorption pad (P1) shown in FIG. 5. The configuration of this return arm (1a), excluding the adsorption pad (P1), is the same as that of the return arm (1) shown in FIG. 3.

[0052] The suction pad (P1) has a large diameter portion (7a) having a conical portion (CS) inclined upward from the small diameter portion (8). The tip of the conical portion (CS) in the large diameter portion (7a) defines the thickness dimension (L1) and the protrusion dimension (L2) from the upper surface (2) of the return arm (1a).

[0053] In the return arm (1a) shown in FIG. 6, just like the return arm (1) shown in FIG. 3, it is possible to return a substrate that has been thinned and bent by the return arm.

[0054] In addition, for the return arms (1b to 1i) shown in FIGS. 7 to 15, it is possible to return a substrate with thinning and bending of the return arm.

[0055] In the return arm (1b) shown in FIG. 7, the mounting portion (6) is provided with a movement restriction portion (9). In FIG. 7, the movement restriction portion (9) is a cylindrical portion formed at the end of the mounting portion (6) on the side of the second opening (H2).

[0056] The suction pad (P1) is placed on the mounting portion (6) and fixed. At this time, there is a concern that the suction pad (P1) may become misaligned and partially block the second opening (H2). However, by placing a movement regulating portion (9) on the mounting portion (6) to restrict the movement of the small diameter portion (8) toward the second opening (H2), the concern that the suction pad (P1) may partially block the second opening (H2) can be eliminated. Additionally, when the suction pad (P1) is placed on the mounting portion (6) using an adhesive, the movement regulating portion (9) can be installed to prevent the adhesive from leaking into the second opening (H2).

[0057] In the return arm (1, 1a, 1b) shown in FIGS. 3, 6, and 7, the large diameter portion (7, 7a) is located higher than the upper surface (2). Meanwhile, in the return arm (1c) shown in FIG. 8, a part of the large diameter portion (7, 7a) is located lower than the upper surface (2) of the return arm (1). Also, being higher than the upper surface (2) means being located on the W-axis side relative to the upper surface (2).

[0058] In the conveying arm (1c) shown in FIG. 8, when supporting the substrate (S) with the adsorption pad (P1), there is a risk that the movement of the large diameter portion (7a) may be restricted because it interferes with the upper surface (2) when the large diameter portion (7a) moves downward. For this reason, in terms of the conveying stability of the substrate (S), it is preferable for the entire large diameter portion (7, 7a) to be located higher than the upper surface (2).

[0059] In the return arm (1d) shown in FIG. 9, the configuration of the mounting portion (6) and the small diameter portion (8) mounted thereon is different from the configuration examples described so far. In the return arm (1d) shown in FIG. 9, the mounting portion (6) is inclined with respect to the upper surface (2), and the shape of the mounting portion (6) is roughly bowl-shaped. The lower surface of the small diameter portion (8) is also inclined to match the shape of the mounting portion (6).

[0060] By making the mounting portion (6) and the small diameter portion (8) into the shape shown in FIG. 9, when the suction pad (P1) is mounted on the mounting portion (6), the small diameter portion (8) slides over the mounting portion (6), and the suction pad (P1) is mounted at a predetermined position. This makes it easy to position the suction pad (P1) on the mounting portion (6). In addition, in the configuration example of FIG. 9, the mounting portion (6) is inclined so that the entire mounting portion (6) becomes a movement-restricting portion (9) that restricts the movement of the small diameter portion (8) in the direction of the second opening (H2).

[0061] In the configuration example shown in FIG. 9, the mounting portion (6) is configured to be inclined obliquely downward toward the second opening (H2). Conversely, as in the return arm (1e) shown in FIG. 10, the mounting portion (6) may be configured to be inclined obliquely upward toward the second opening (H2). Also, similar to the configuration example shown in FIG. 9, the shape of the lower surface of the small diameter portion (8) is matched with the shape of the mounting portion (6).

[0062] In the configuration example shown in FIG. 10, just like in the configuration example shown in FIG. 9, the mounting portion (6) is inclined so that the entire mounting portion (6) becomes a movement-restricting portion (9). When the adsorption pad (P) is fixed with an adhesive, if it is the configuration example shown in FIG. 10, the inflow of the adhesive into the second opening (H2) can be prevented.

[0063] Additionally, regarding the mounting portion (6), if the entire lower surface of the small diameter portion (8) is not fixed, the shape of the lower surface of the small diameter portion (8) may be different from the shape of the mounting portion (6).

[0064] In FIGS. 1 to 10, a configuration for fixing the suction pad (P, P1) to the mounting portion (6) using an adhesive or double-sided tape was introduced. However, the suction pad (P, P1) may be fixed to the mounting portion (6) using a method other than an adhesive or double-sided tape.

[0065] For example, screw processing is performed on the small diameter portion (8) and the mounting portion (6), and by fixing both sides with screws, the suction pad (P, P1) is fixed to the mounting portion (6).

[0066] Additionally, the suction pad (P, P1) placed on the placement part (6) may be fixed at a location different from the placement part (6).

[0067] FIG. 11 shows a plan view of the return arm (1f) when the suction pad (P, P1) is removed. As shown, for example, the shape of the mounting portion (6) is made elliptical in plan view. To follow the elliptical shape of the mounting portion (6), the upper surface (2) of the return arm (1f) is cut out from the upper surface (2) to the mounting portion (6).

[0068] The small diameter portion (8) of the suction pad (P, P1) is made perfectly round in a planar view, just as in the previous examples. In fixing the suction pad (P, P1), the small diameter portion (8) of the suction pad (P, P1) is placed on the placement portion (6) while being pressed along the shape of the placement portion (6). After the suction pad (P, P1) is placed on the placement portion (6), the pressure applied to the small diameter portion (8) is released. As a result, when the small diameter portion (8) returns to its original shape, the suction pad (P, P1) is fixed to the wall surface of the return arm (1f) in a direction parallel to the U-axis.

[0069] In the cross-sectional view of the return arm (1, 1a to 1f), the mounting portion (6) is formed in a straight line shape, but it may be formed in a curved shape. Also, as shown in FIG. 12, the return arm (1g) may be formed in a stepped shape.

[0070] In the embodiments described so far, the mounting portion (6) is formed by cutting the upper surface (2). Conversely, the mounting portion (6) may be formed by cutting the lower surface (4). In the return arm (1h) shown in FIG. 13, the lower surface (4) is cut to form the mounting portion (6), and a second opening (H2) is formed in the mounting portion (6). In this case, a part of the adsorption pad (P2) is placed within the second opening (H2).

[0071] In fixing the suction pad (P2), a flange to be mounted on the mounting portion (6) is installed on the small diameter portion (8). The flange portion is fixed to the mounting portion (6) using adhesive or double-sided tape. Alternatively, the flange portion may be fixed to the mounting portion (6) using fasteners such as screws.

[0072] The mounting portion (6) can be formed by cutting out the upper surface (2) or the lower surface (4) and can be configured in various ways. Typically, a counterbore is placed from the upper surface (2) toward the lower surface (4). Alternatively, a counterbore is placed from the lower surface (4) toward the upper surface (2). By these counterbores, the mounting portion (6) and the second opening (H2) are formed. Additionally, a mounting portion (6a) having a large area, as shown in FIGS. 14 and 15, may be formed.

[0073] FIG. 14 is a plan view of the return arm (1i) in the UV plane. FIG. 15 is a plan view of the return arm (1i) in the VW plane. In FIG. 14 and FIG. 15, the entire tip portion of the return arm (1i) is cut out to form a mounting portion (6a) that is one step lower than the upper surface (2).

[0074] The conveying arms (1, 1a to 1i) described so far can be used in various devices for conveying a substrate (S) under atmospheric conditions. More preferably, they are used in conveying robots (14a, 14b) that are used for conveying a substrate after removing a substrate heated to a high temperature under atmospheric conditions in a substrate processing device (D) that performs a film deposition process or an ion implantation process during the manufacturing process of a semiconductor device. FIG. 16 shows the configuration around the processing chamber of an ion implantation device as an example of a substrate processing device (D).

[0075] A plurality of substrates (S) are stored in the cassette (17a to 17d). The substrates (S) are circular substrates in a planar state, such as silicon carbide, silicon, or gallium oxide. A circular substrate in a planar state is a substrate that is approximately circular when viewed from the surface of the substrate on which ion implantation is performed, and includes substrates in which a notch or orientation flat is formed at the end of the surface of the substrate.

[0076] The return robot (14a, 14b) takes the substrate (S) out of the cassette (17a to 17d) and returns it to the aligner (15). After the circumferential position of the substrate (S) is adjusted in the aligner (15), the return robot (14a, 14b) returns the substrate (S) to the load lock seal (13a, 13b).

[0077] These return robots (14a, 14b) have any one of the return arms (1, 1a to 1i) described in FIGS. 1 to 15.

[0078] The load lock chambers (13a, 13b) enable the transport of a substrate (S) between a processing chamber (11) with a different vacuum level and an aligner (15) in an atmospheric transport chamber (19) by switching the vacuum level of the chamber.

[0079] The bottom of the load lock chamber (13a, 13b) moves along the Y-axis direction by a driving mechanism not shown. For example, in the transfer of a substrate (S) to the processing chamber (11), the bottom of the load lock chamber (13a, 13b) moves after the room of the load lock chamber (13a, 13b) is switched from the atmosphere to a vacuum.

[0080] For example, in a high-temperature ion implantation device, the substrate (S) is transported in the order of the atmospheric transport chamber (19), load lock chamber (13a), platen (12), load lock chamber (13b), and atmospheric transport chamber (19) as a transport path for the substrate (S).

[0081] The load lock seal (13a) is equipped with a heater for preheating the substrate (S). The platen (12) is equipped with either an electrostatic chuck and a mechanical clamp mechanism for supporting the substrate (S), or both. The platen (12) is equipped with a heater for raising the temperature of the substrate (S), which has been preheated in the load lock seal (13a), to a predetermined temperature.

[0082] The substrate (S), supported on a platen (12) in the processing room (11), is reciprocally scanned across an ion beam transported to the processing room (11) by an implantation mechanism unit not shown. By reciprocating the substrate (S), the ion beam is irradiated onto the front surface of the substrate (S), and an ion implantation treatment is performed on the substrate (S).

[0083] When the processing of the substrate in the processing room (11) is finished, the substrate (S) is recovered into one of the cassettes (17a to 17d) via the load lock room (13b) and the waiting return room (19).

[0084] Before the substrate (S) is returned to the atmospheric return chamber (19), the substrate (S) is cooled in the load lock chamber (13b). Cooling of the substrate (S) is performed when the pressure inside the load lock chamber (13b) is returned to atmospheric pressure. Specifically, cooling of the substrate (S) is performed by blowing nitrogen gas from one end of the load lock chamber (13b) toward the other end. Alternatively, cooling may be performed by blowing nitrogen gas from vertically above the substrate (S) toward the substrate surface.

[0085] In addition, returning to atmospheric pressure means making the pressure inside the load lock chamber (13b) equal to the pressure of the atmospheric transport chamber (19) where the transport robots (14a, 14b) are placed.

[0086] The processing chamber (11) is equipped with a vacuum hand (V1, V2) that can rotate independently in the direction of the arrow shown. The vacuum hand (V1, V2) is equipped with a gripping part (C1, C2) that grips around the substrate (S). For example, the vacuum hand (V1, V2) receives the substrate (S) from the load lock chamber (13a, 13b) and returns it to the platen (12).

[0087] The cooled substrate (S) is returned from the load lock room (13b) to the waiting return room (19). In the waiting return room (19), a base (16) is provided to naturally cool the substrate (S) before receiving the substrate (S) into the cassettes (17a to 17d).

[0088] In FIG. 17, the internal configuration of the waiting room (19) as viewed along the line A2-A2 of FIG. 16 is shown.

[0089] In FIG. 17, a temperature measuring device (18) is placed on the ceiling of a waiting transport room (19) where an aligner (15) or a transport robot (14a, 14b) is placed. The temperature measuring device (18) is one or more radiation thermometers or thermography cameras. The temperature of a substrate (S) on a base (16) is measured using the temperature measuring device (18).

[0090] In the configuration example shown in FIG. 17, the temperature measuring device (18) is placed on the inner wall of the waiting room (19). However, for the purpose of preventing contamination of the temperature measuring device (18), replacement in case of failure, or responding to problems, an infrared-transmitting window may be installed on the ceiling of the waiting room (19), and the temperature measuring device (18) may be placed outside the waiting room (19).

[0091] Based on the measurement result from the temperature measuring device (18), the substrate (S) is returned from the base (16) to the cassette (17a to 17d) by the return robot (14a, 14b).

[0092] By adopting a configuration in which the substrate (S) is cooled in the load lock room (13b) after processing the substrate in the processing room (11), it is possible to use inexpensive adsorption pads (P, P1, P2) with low heat resistance.

[0093] A new return arm may be formed by appropriately replacing the configuration of the return arms (1, 1a to 1i) shown in each drawing. For example, in the configuration examples shown in FIGS. 7, 9, 10, and 12, the adsorption pad (P1) shown is replaced with the adsorption pad (P) shown in FIG. 3 to form a new return arm.

[0094] Furthermore, it goes without saying that the present invention is not limited to the above embodiments and that various modifications are possible within the scope of the intent without departing from the spirit. Explanation of the symbols

[0095] 1, 1a to 1i Bansong Aam 2 Top surface 3 home 4 underneath 5 Cover missing 6, 6a Witty 7, 7a Daegyeongbu 8 Blind man 9 Movement restriction area P, P1, P2 suction pad H1 First opening (suction hole) H2 Second opening CS cone region

Claims

Claim 1 A conveying arm comprising an upper surface, a lower surface facing the upper surface and having a groove formed therein, a cover member mounted on the lower surface and covering the groove, a mounting portion formed by cutting out the upper surface or the lower surface, and a suction pad mounted on the mounting portion, wherein an opening communicating with the groove is formed in the mounting portion, and the suction pad has a suction hole, a small diameter portion mounted on the mounting portion, and a large diameter portion connected to the small diameter portion. Claim 2 In claim 1, the above-mentioned large-diameter portion is a return arm having a conical portion inclined upward from the above-mentioned small-diameter portion. Claim 3 A return arm according to claim 1, wherein the above-mentioned large diameter portion is located above the above-mentioned upper surface. Claim 4 A return arm according to claim 1, wherein a portion of the adsorption pad is located 0.3 mm or more above the upper surface. Claim 5 A return arm according to claim 1, wherein the distance between the large diameter portion and the lower surface is 3 mm or less in the opposing direction between the upper surface and the lower surface. Claim 6 In claim 1, the above-mentioned mounting portion is a return arm having a movement-regulating portion that regulates the movement of the above-mentioned small portion toward the opening side. Claim 7 A substrate processing device for processing a substrate heated to a high temperature in a vacuum processing chamber and discharging the processed substrate into the atmosphere, comprising: a load lock chamber that switches the atmosphere of the room between the atmosphere and the vacuum; an atmosphere return chamber adjacent to the load lock chamber and in which the room is in the atmosphere; and a return robot that returns the substrate in the atmosphere return chamber, wherein the return robot has a return arm as described in any one of claims 1 to 6. Claim 8 In claim 7, a substrate processing device in which the substrate is cooled in the load lock chamber.

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