A project device and smart glasses

Abstract

The present embodiment relates to a projection device comprising: a substrate; a light source disposed on the substrate; a cover glass disposed on the light source; a bonding wire electrically connecting the substrate and the light source; and a molding member disposed on the bonding wire, wherein the molding member contacts the cover glass.

Description

Technology Field

[0001] This embodiment relates to a project device and smart glasses. Background Technology

[0002] Virtual Reality (VR) refers to a specific environment or situation, or the technology itself, created using artificial technology such as computers that is similar to reality but is not actually real.

[0003] Augmented Reality (AR) refers to a technology that superimposes virtual objects or information onto a real environment to make them appear as if they exist in the original environment.

[0004] Mixed Reality (MR) or Hybrid Reality refers to the creation of new environments or new information by combining the virtual world and the real world. In particular, it is called Mixed Reality when referring to the ability to interact in real time between things existing in the real world and the virtual world.

[0005] In this case, the created virtual environment or situation stimulates the user's five senses and enables spatial and temporal experiences similar to reality, thereby allowing the user to freely cross the boundary between reality and imagination. Furthermore, the user can not only simply immerse themselves in this environment but also interact with the elements implemented within it, such as by using actual devices to perform operations or issue commands.

[0006] Recently, active research has been conducted on equipment (gear, devices) used in these technology fields. In particular, among these devices, there is a growing need for miniaturization and lightweighting in the case of wearable devices worn on the body.

[0007] (Patent Document 1) KR 10-2025-0031521 A The problem to be solved

[0008] The present embodiment aims to provide a projector device including a light source assembly structure with minimized size. means of solving the problem

[0009] A project device according to the present embodiment includes a substrate; a light source disposed on the substrate; a cover glass disposed on the light source; a bonding wire electrically connecting the substrate and the light source; and a molding member disposed on the bonding wire, wherein the molding member may come into contact with the cover glass.

[0010] At least a portion of the above cover glass may protrude beyond the molding member.

[0011] The above cover glass may include a protrusion formed to protrude beyond the molding member in the edge region of the upper surface of the cover glass.

[0012] The protrusion of the above cover glass can be formed so that the molding member does not encroach upon the upper surface of the above cover glass.

[0013] The protrusion of the above cover glass can be formed in the shape of a square ring when viewed from above.

[0014] A groove shape that is relatively concave due to the protrusion may be formed in the central region of the upper surface of the above cover glass.

[0015] The central region of the above cover glass may include a light-emitting effective region through which light emitted from the light source passes.

[0016] In a direction parallel to the light emission surface of the light source, the cover glass may overlap with the bonding wire.

[0017] The cover glass may overlap with the molding member in a direction parallel to the light emission surface of the light source.

[0018] In a direction parallel to the light emission surface of the light source, the protrusion of the cover glass may not overlap with the molding member.

[0019] In a direction parallel to the light emission surface of the light source, the width of the central region of the upper surface of the cover glass may be 0.85 to 0.9 of the width of the lower surface opposite the upper surface of the cover glass.

[0020] In a direction perpendicular to the light emission surface of the light source, the thickness of the central region of the cover glass may be 0.5 to 0.75 of the total thickness of the cover glass in the protruding region.

[0021] The above-described project device may include a heat dissipation member disposed on the substrate opposite to the light source; and an FPCB disposed between the heat dissipation member and the substrate.

[0022] The above-described project device comprises a housing; a lens and a light source assembly disposed in the housing; and a light guide member disposed between the lens and the light source assembly within the housing, wherein the light source assembly comprises the substrate, the light source, the cover glass, the bonding wire, and the molding member, and the light source is disposed on the upper surface of the substrate, and the edge region of the upper surface of the substrate can be coupled with the housing.

[0023] The smart glasses according to the present embodiment may include a frame; a display unit disposed on the frame; and a projector device disposed on the frame and outputting an image or video to the display unit. Effects of the invention

[0024] Through this embodiment, the size of the project device can be minimized and made lighter.

[0025] Therefore, the miniaturization and weight reduction of the smart glasses to which the project device of the present embodiment is applied can be realized. Brief explanation of the drawing

[0026] FIG. 1 is a perspective view of a project device according to the present embodiment. Figure 2 is a cross-sectional view taken from AA of Figure 1. Figure 3 is a cross-sectional view taken from BB of Figure 1. FIG. 4 is a cross-sectional view taken from above, in which a projection device according to the present embodiment is cut perpendicular to the optical axis of the light source. FIG. 5 is an exploded view of a project device according to the present embodiment. FIG. 6 is an exploded perspective view of a light source assembly of a project device according to the present embodiment. FIG. 7 is an exploded view illustrating the combined structure of the light source of a project device according to the present embodiment. FIG. 8 is a perspective view of a light source assembly of a project device according to the present embodiment. FIG. 9 is a partial perspective plan view of the light source assembly of the project device according to the present embodiment. FIG. 10 is a partial perspective side view of a light source assembly of a project device according to the present embodiment. FIG. 11 is a cross-sectional perspective view of a light source assembly of a project device according to the present embodiment. FIG. 12 is a drawing showing a comparison of the sizes of a light source assembly in a comparative example (a) and the present embodiment (b). FIG. 13 is a drawing showing a comparison of the sizes of the project device in comparative example (a) and the present embodiment (b). FIG. 14 is a perspective view and conceptual diagram of smart glasses according to the present embodiment. Specific details for implementing the invention

[0027] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0028] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0029] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0030] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0031] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0032] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0033] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0034] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0035] In the following, one of the "red light source assembly (301)", "green light source assembly (302)" and "blue light source assembly (303)" may be referred to as the "first light source assembly", another as the "second light source assembly", and the other as the "third light source assembly".

[0036] In the following, one of the “red light source (321),” “green light source (322)” and “blue light source (323)” may be referred to as the “first light source,” another as the “second light source,” and the other as the “third light source.”

[0038] The structure of the project device according to the present embodiment will be described below with reference to the drawings.

[0039] FIG. 1 is a perspective view of a project device according to the present embodiment. FIG. 2 is a cross-sectional view taken from AA in FIG. 1. FIG. 3 is a cross-sectional view taken from BB in FIG. 1. FIG. 4 is a cross-sectional view taken from above, cut perpendicularly to the optical axis of the light source drawn on the project device according to the present embodiment. FIG. 5 is an exploded perspective view of the project device according to the present embodiment. FIG. 6 is an exploded perspective view of the light source assembly of the project device according to the present embodiment. FIG. 7 is an exploded view illustrating the coupling structure of the light source of the project device according to the present embodiment. FIG. 8 is a perspective view of the light source assembly of the project device according to the present embodiment. FIG. 9 is a partial perspective plan view of the light source assembly of the project device according to the present embodiment. FIG. 10 is a partial perspective side view of the light source assembly of the project device according to the present embodiment. FIG. 11 is a cross-sectional perspective view of the light source assembly of the project device according to the present embodiment.

[0040] The project device (10) may include a housing (100). The housing (100) may function to accommodate internal components of the project device (10) and protect them from the outside. The housing (100) may form the exterior of the project device (10). The housing (100) may be formed as an injection molded product.

[0041] The project device (10) may include a case (150). The case (150) may protect the lower part of the housing (100). The case (150) may be coupled to the lower part of the housing (100). The case (150) may be coupled to the lower surface of the housing (100). The case (150) may be bonded to the housing (100) through an adhesive (see AD in FIG. 5). The case (150) may be formed as a separate member from the housing (100). After placing the light guide member (400) within the housing (100), the case (150) may be coupled to the housing (100). As a variation, the case (150) may be formed integrally with the housing (100). The housing (100) may include the case (150). Alternatively, the housing (100) and the case (150) may be understood as separate components.

[0042] The case (150) can be placed on the housing (100). The case (150) can be placed on the housing (100). The case (150) can be placed directly on the housing (100). The case (150) can be in contact with the housing (100). The case (150) can be fixed to the housing (100). The case (150) can be combined with the housing (100). The case (150) can be bonded to the housing (100) with an adhesive (AD).

[0043] The projection device (10) may include an imaging lens assembly (200). The imaging lens assembly (200) may perform an optical function for forming an image. Light emitted from a light source (320) and passing through a light guide member (400) may pass through the imaging lens assembly (200) during the process of exiting the projection device (10).

[0044] The imaging lens assembly (200) may be placed in the housing (100). The imaging lens assembly (200) may be placed on the housing (100). The imaging lens assembly (200) may be placed on the outside of the housing (100). The imaging lens assembly (200) may be placed directly in the housing (100). The imaging lens assembly (200) may be in contact with the housing (100). The imaging lens assembly (200) may be fixed to the housing (100). The imaging lens assembly (200) may be coupled to the housing (100). The imaging lens assembly (200) may be bonded to the housing (100) with an adhesive.

[0045] The projection device (10) may include a barrel (210). The imaging lens assembly (200) may include a barrel (210). The barrel (210) may serve to support the position of the lens so that it can be fixed or adjusted. The barrel (210) may be placed in the housing (100). The barrel (210) may be placed on the housing (100). The barrel (210) may be coupled with the housing (100). The barrel (210) may be fixed to the housing (100). The barrel (210) may be formed as a separate member from the housing (100) and integrated. As a variation, the barrel (210) may be formed integrally with the housing (100).

[0046] The project device (10) may include a lens (not shown). The lens may be an imaging lens. The lens may function as an optical element that forms an image by converging or diverging light. The lens may be placed in the barrel (210). The lens may be placed on the barrel (210). The lens may be placed inside the barrel (210). The lens may be placed directly in the barrel (210). The lens may be in contact with the barrel (210). The lens may be fixed to the barrel (210). The lens may be coupled to the barrel (210). The lens may be bonded to the barrel (210) with an adhesive. The lens may be placed in the housing (100). The lens may be formed of glass. The lens may be formed of plastic.

[0047] The project device (10) may include a light source assembly (300). The light source assembly (300) may perform the function of generating light for creating an image. The light source assembly (300) may be placed in the housing (100). The light source assembly (300) may be placed on the housing (100). The light source assembly (300) may be placed on the outside of the housing (100). The light source assembly (300) may be placed directly in the housing (100). The light source assembly (300) may be in contact with the housing (100). The light source assembly (300) may be fixed to the housing (100). The light source assembly (300) may be coupled to the housing (100). The light source assembly (300) may be bonded to the housing (100) with adhesive.

[0048] The light source assembly (300) may include a red light source assembly (301). The red light source assembly (301) may include a red light source (321). The red light source assembly (301) may be disposed on one side of the housing (100). The red light source assembly (301) may include at least one of a substrate (310), a red light source (321), a cover glass (330), a bonding wire (340), a molding member (350), an FPCB (360), and a heat dissipation member (370).

[0049] The light source assembly (300) may include a green light source assembly (302). The green light source assembly (302) may include a green light source (321). The green light source assembly (302) may be positioned below the housing (100). The green light source assembly (302) may be positioned opposite the imaging lens assembly (200) with respect to the light guide member (400). The green light source assembly (302) may include at least one of a substrate (310), a green light source (322), a cover glass (330), a bonding wire (340), a molding member (350), an FPCB (360), and a heat dissipation member (370).

[0050] The light source assembly (300) may include a blue light source assembly (303). The blue light source assembly (303) may include a blue light source (321). The blue light source assembly (303) may be positioned on the other side of the housing (100). The blue light source assembly (303) may be positioned on the opposite side of the red light source assembly (301) with respect to the light guide member (400). The blue light source assembly (303) may include at least one of a substrate (310), a blue light source (323), a cover glass (330), a bonding wire (340), a molding member (350), an FPCB (360), and a heat dissipation member (370).

[0051] The project device (10) may include a substrate (310). The light source assembly (300) may include a substrate (310). The substrate (310) may be a component on which a circuit pattern is formed. The substrate (310) may perform the function of transmitting power and electrical signals. The substrate (310) may include a printed circuit board (PCB). The substrate (310) may include a ceramic substrate.

[0052] A substrate (310) may be placed in a housing (100). A substrate (310) may be placed on the housing (100). A substrate (310) may be placed on the outer surface of the housing (100). A substrate (310) may be placed directly in the housing (100). A substrate (310) may be in contact with the housing (100). A substrate (310) may be fixed to the housing (100). A substrate (310) may be bonded to the housing (100). A substrate (310) may be bonded to the housing (100) with an adhesive (AD). An edge region of the upper surface of the substrate (310) may be bonded to the housing (100). An edge region of the upper surface of the substrate (310) may be bonded to the housing (100) with an adhesive (AD).

[0053] The project device (10) may include a light source (320). The light source assembly (300) may include a light source (320). The light source (320) may perform the function of emitting light. The light source (320) may include an LED chip. The light source (320) may include an LED module. The light source (320) may be an LED. The light source (320) may be a uLED. The light source (320) may be a microLED.

[0054] A light source (320) may be placed on a substrate (310). A light source (320) may be placed on the substrate (310). A light source (320) may be placed on the upper surface of the substrate (310). A light source (320) may be placed directly on the substrate (310). A light source (320) may be in contact with the substrate (310). A light source (320) may be fixed to the substrate (310). A light source (320) may be coupled to the substrate (310). A light source (320) may be bonded to the substrate (310) with an adhesive. A light source (320) may be mounted on the substrate (310). A light source (320) may be connected to the substrate (310). A light source (320) may be electrically connected to the substrate (310). The light source (320) can receive power from the substrate (310).

[0055] The light source (320) may include an emission surface from which light is emitted. The emission surface of the light source (320) may include an emission surface effective area (320a). The emission surface of the light source (320) may include an emission surface current conduction area (320b).

[0056] The light source (320) may include an effective emission area (320a). Light may be emitted from the effective emission area (320a). The effective emission area (320a) may be positioned in the central area of ​​the emission surface. The effective emission area (320a) may be positioned inside the energized emission area (320b).

[0057] The light source (320) may include an output surface current-carrying area (320b). The output surface current-carrying area (320b) may be formed in the edge area of ​​the output surface. The output surface current-carrying area (320b) may be coupled with a bonding wire (340). A terminal for coupling with the bonding wire (340) may be formed in the output surface current-carrying area (320b).

[0058] The light source (320) may include a red light source (321). The red light source (321) may emit red light. The red light source (321) may emit red light to the light guide member (400). The light source (320) may include a green light source (322). The green light source (322) may emit green light. The green light source (322) may emit green light to the light guide member (400). The light source (320) may include a blue light source (323). The blue light source (323) may emit blue light. The blue light source (323) may emit blue light to the light guide member (400).

[0059] The projector device (10) may include a cover glass (330). The light source assembly (300) may include a cover glass (330). The cover glass (330) may be placed in the light path to protect the light source (320) from foreign matter. The cover glass (330) may allow light to pass through transparently. The cover glass (330) may be formed of a transparent material.

[0060] The cover glass (330) can be placed on the light source (320). The cover glass (330) can be placed on the light source (320). The cover glass (330) can be placed on the upper surface of the light source (320). The cover glass (330) can be placed directly on the light source (320). The cover glass (330) can be in contact with the light source (320). The cover glass (330) can be fixed to the light source (320). The cover glass (330) can be combined with the light source (320). The cover glass (330) can be bonded to the light source (320). The cover glass (330) can be bonded to the light source (320) with an adhesive.

[0061] In a direction parallel to the light emission surface of the light source (320), the cover glass (330) may overlap with the bonding wire (340). In a direction parallel to the light emission surface of the light source (320), the cover glass (330) may overlap with the molding member (350). In a direction parallel to the light emission surface of the light source (320), the protrusion (331) of the cover glass (330) may not overlap with the molding member (350).

[0062] In a direction parallel to the light emission surface of the light source (320), the width of the center area of ​​the upper surface of the cover glass (330) (see W2 in FIG. 11) may be 0.85 to 0.9 of the width of the lower surface opposite the upper surface of the cover glass (330) (see W1 in FIG. 11). In a direction parallel to the light emission surface of the light source (320), the width of the center area of ​​the upper surface of the cover glass (330) (see W2 in FIG. 11) may be 0.80 to 0.95 of the width of the lower surface opposite the upper surface of the cover glass (330) (see W1 in FIG. 11).

[0063] In a direction perpendicular to the light emission surface of the light source (320), the thickness of the central region of the cover glass (330) (see T2 in FIG. 11) may be 0.5 to 0.75 of the total thickness of the cover glass (330) in the protrusion (331) region (see T1 in FIG. 11). In a direction perpendicular to the light emission surface of the light source (320), the thickness of the central region of the cover glass (330) (see T2 in FIG. 11) may be 0.4 to 0.85 of the total thickness of the cover glass (330) in the protrusion (331) region (see T1 in FIG. 11).

[0064] The cover glass (330) may include a protrusion (331). At least a portion of the cover glass (330) may protrude beyond the molding member (350). At this time, at least a portion of the cover glass (330) protruding beyond the molding member (350) may include a protrusion (331). The protrusion (331) may be formed to protrude beyond the molding member (350) in the edge region of the upper surface of the cover glass (330). The protrusion (331) may be a projection. The protrusion (331) may be a rib. The protrusion (331) may form a step. The protrusion (331) may be formed in a dam shape. The protrusion (331) may extend from the outer surface of the cover glass (330).

[0065] The cover glass (330) may include an upper surface. In this case, the upper surface may be a surface from which light is emitted. That is, the upper surface of the cover glass (330) may be a light-emitting surface. The protrusion (331) of the cover glass (330) may be formed so that the molding member (350) does not encroach upon the upper surface of the cover glass (330). The protrusion (331) of the cover glass (330) may be formed in a square ring shape when viewed from above. A groove shape that is relatively concave due to the protrusion (331) may be formed in the central region of the upper surface of the cover glass (330).

[0066] The central region of the cover glass (330) may include a light-emitting effective region through which light emitted from the light source (320) passes. The central region of the cover glass (330) may be positioned at a corresponding location with a size corresponding to the emission surface effective region (320a) of the light source (320). As a variation, the central region of the cover glass (330) may be formed larger than the emission surface effective region (320a) of the light source (320). As another variation, the central region of the cover glass (330) may be formed smaller than the emission surface effective region (320a) of the light source (320).

[0067] The project device (10) may include a bonding wire (340). The light source assembly (300) may include a bonding wire (340). The bonding wire (340) may perform the function of electrical connection between the light source (320) and the substrate (310). The bonding wire (340) may include a plurality of bonding wires. The bonding wire (340) may be formed of metal.

[0068] The bonding wire (340) can connect the light source (320) and the substrate (310). The bonding wire (340) can electrically connect the light source (320) and the substrate (310). The bonding wire (340) can be combined with the light source (320) and the substrate (310).

[0069] One end of the bonding wire (340) can be placed on the light source (320). The bonding wire (340) can be placed on the light source (320). The bonding wire (340) can be in contact with the light source (320). The bonding wire (340) can be fixed to the light source (320). The bonding wire (340) can be coupled with the light source (320). The bonding wire (340) can be soldered to the light source (320). The bonding wire (340) can be coupled with the energized area (320b) on the output surface of the light source (320).

[0070] The other end of the bonding wire (340) can be placed on the substrate (310). The bonding wire (340) can be placed on the substrate (310). The bonding wire (340) can be in contact with the substrate (310). The bonding wire (340) can be fixed to the substrate (310). The bonding wire (340) can be coupled to the substrate (310). The bonding wire (340) can be soldered to the substrate (310). The bonding wire (340) can be coupled to a terminal of the substrate (310).

[0071] The bonding wire (340) may be placed in the molding member (350). The bonding wire (340) may be placed within the molding member (350). The bonding wire (340) may be received in the molding member (350). The bonding wire (340) may be molded by the molding member (350). The bonding wire (340) may be encapsulated in the molding member (350).

[0072] The project device (10) may include a molding member (350). The light source assembly (300) may include a molding member (350). The molding member (350) may perform the function of protecting one or more of the light source (320) and the bonding wire (340) and cushioning against external impact. The molding member (350) may be epoxy. The molding member (350) may be a sealing member. The molding member (350) may have viscosity.

[0073] The molding member (350) may be placed on the substrate (310). The molding member (350) may be placed on the substrate (310). The molding member (350) may be placed directly on the substrate (310). The molding member (350) may be in contact with the substrate (310). At least a portion of the substrate (310) may be protected within the molding member (350).

[0074] The molding member (350) can be placed on the light source (320). The molding member (350) can be placed on the light source (320). The molding member (350) can be placed directly on the light source (320). The molding member (350) can be in contact with the light source (320). The light source (320) can be protected within the molding member (350).

[0075] The molding member (350) may be placed on the cover glass (330). The molding member (350) may be placed on the cover glass (330). The molding member (350) may be placed directly on the cover glass (330). The molding member (350) may be in contact with the cover glass (330). At least a portion of the cover glass (330) may be protected within the molding member (350).

[0076] A molding member (350) may be placed on a bonding wire (340). A molding member (350) may be placed on the bonding wire (340). A molding member (350) may be placed outside the bonding wire (340). A molding member (350) may be placed directly on the bonding wire (340). A molding member (350) may be in contact with the bonding wire (340). The bonding wire (340) may be protected within the molding member (350).

[0077] The project device (10) may include a Flexible Printed Circuit Board (FPCB) (360). The light source assembly (300) may include the FPCB (360). The FPCB (360) may be a flexible printed circuit board. The FPCB (360) may be a flexible substrate. The FPCB (360) may provide electrical connections. The FPCB (360) may perform the function of increasing space efficiency as it is folded and arranged. The FPCB (360) may include a fold portion. The FPCB (360) may be folded multiple times.

[0078] The FPCB (360) can be placed on the substrate (310). The FPCB (360) can be placed on the substrate (310). The FPCB (360) can be placed on the lower surface of the substrate (310). The FPCB (360) can be placed directly on the substrate (310). The FPCB (360) can be in contact with the substrate (310). The FPCB (360) can be fixed to the substrate (310). The FPCB (360) can be combined with the substrate (310). The FPCB (360) can be bonded to the substrate (310) with an adhesive. The FPCB (360) can be connected to the substrate (310). The FPCB (360) can be electrically connected to the substrate (310). The FPCB (360) can be placed between the substrate (310) and the heat dissipation member (370).

[0079] The project device (10) may include a connector (365). The FPCB (360) may include a connector (365). The connector (365) may be placed on the FPCB (360). The connector (365) may be formed to connect between the FPCB (360) and between the FPCB (360) and between the FPCB (360) and an external component. The connector (365) of the red light source assembly (301) may be coupled with the connector (365) of the green light source assembly (302). The connector (365) of the blue light source assembly (303) may be coupled with the connector (365) of the green light source assembly (302).

[0080] The project device (10) may include a heat dissipation member (370). The light source assembly (300) may include a heat dissipation member (370). The heat dissipation member (370) can dissipate heat generated from the light source (320) to the outside. The heat dissipation member (370) can control the heat generated by the light source (320). The heat dissipation member (370) may be formed of a material having a higher thermal conductivity than the substrate (310) and the FPCB (360).

[0081] A heat dissipation member (370) may be placed on the FPCB (360). A heat dissipation member (370) may be placed on the FPCB (360). A heat dissipation member (370) may be placed on the lower surface of the FPCB (360). A heat dissipation member (370) may be placed directly on the FPCB (360). A heat dissipation member (370) may be in contact with the FPCB (360). A heat dissipation member (370) may be fixed to the FPCB (360). A heat dissipation member (370) may be combined with the FPCB (360). A heat dissipation member (370) may be bonded to the FPCB (360). A heat dissipation member (370) may be bonded to the FPCB (360) with an adhesive.

[0082] A heat dissipation member (370) may be disposed on the substrate (310). A heat dissipation member (370) may be disposed on the substrate (310). A heat dissipation member (370) may be disposed on the lower side of the substrate (310). A heat dissipation member (370) may be disposed on the substrate (310) on the opposite side of the light source (320).

[0083] The project device (10) may include a light guide member (400). The light guide member (400) may perform the function of guiding or diffusing light generated through a light source (320) along a certain path.

[0084] The light guide member (400) may be disposed in the housing (100). The light guide member (400) may be disposed on the housing (100). The light guide member (400) may be disposed within the housing (100). The light guide member (400) may be disposed directly in the housing (100). The light guide member (400) may be in contact with the housing (100). The light guide member (400) may be fixed to the housing (100). The light guide member (400) may be coupled to the housing (100). The light guide member (400) may be bonded to the housing (100). The light guide member (400) may be bonded to the housing (100) with an adhesive.

[0085] The light guide member (400) may be positioned between the imaging lens assembly (200) and the light source assembly (300). The light guide member (400) may be positioned between the imaging lens assembly (200) and the green light source assembly (302). The light guide member (400) may be positioned between the red light source assembly (301) and the blue light source assembly (303).

[0086] The design intent of this embodiment may be to modify the installation structure of a micro LED that cannot be directly attached to a projector body due to its vulnerability to pressure, thereby enabling the micro LED to be directly attached to the projector body.

[0087] The present embodiment may include a structure in which a ceramic substrate is directly mounted onto a flex (FPCB) as a component using SMT, and then a uLED (ultra-light emitting diode) panel is precisely attached onto the mounted ceramic substrate. Subsequently, the panel structure may include an electrical connection between the uLED and the substrate (310) by wire bonding.

[0088] In this embodiment, a substantial reduction in module volume can be expected even if the width of the substrate corresponding to the stiffener and the width of the flex are designed to be very similar to the existing panel structure. The volume of the module can be reduced without directly attaching the microLED, and an efficient structural design for a projector that can be applied to actual processes and produced is possible.

[0089] A protrusion (331) with a height higher than the epoxy can be formed in the edge area of ​​the upper surface of the cover glass (330). This prevents the epoxy from overflowing and encroaching upon the light-emitting effective area of ​​the light source (320). Since the central part of the upper surface of the cover glass (330) where the protrusion (331) is not formed is relatively concave, it may be understood that a groove is formed in the central part of the upper surface of the cover glass (330).

[0090] FIG. 12 is a drawing showing a comparison of the sizes of a light source assembly in a comparative example (a) and the present embodiment (b).

[0091] As shown in FIG. 12, when the stiffener width of the comparative example (see FIG. 12 a) and the substrate bottom flex width of the present embodiment (see FIG. 12 c) are the same, and the flex width of the comparative example (see FIG. 12 b) and the flex width of the present embodiment (see FIG. 12 d) are the same, the length of the LED module of the present embodiment (see FIG. 12 e) can be reduced compared to the comparative example. In this case, the flex may be an FPCB.

[0092] FIG. 13 is a drawing showing a comparison of the sizes of the project device in comparative example (a) and the present embodiment (b).

[0093] As illustrated in FIG. 13, in this embodiment, the height of the housing (110) can be reduced as the length of the light source assembly (300) (see A in FIG. 13) is reduced compared to the comparative example. Thus, the size of the project device (10) can be minimized. Referring to FIG. 13, a volume reduction area of ​​the light source assembly (300) in this embodiment compared to the comparative example (see E in FIG. 13) can be found.

[0095] The structure of the smart glasses according to the present embodiment will be described below with reference to the drawings.

[0096] FIG. 14 is a perspective view and conceptual diagram of smart glasses according to the present embodiment.

[0097] The present embodiment may include an electronic device. The electronic device may be smart glasses. The electronic device may be AR glasses. The electronic device may be provided in a glass type. The glass-type electronic device is configured to be wearable on the head of the human body and may be provided with a frame (20) for this purpose. The frame (20) may be formed of a flexible material to facilitate wearing.

[0098] Smart glasses can be AR (Augmented Reality) glasses, video output devices, wearable devices, etc.

[0099] Smart glasses may include a frame (20). The frame (20) is supported on the head and provides a space for mounting various components. As illustrated, electronic components such as a projector (10), a user input unit (23), or an audio output unit (24) may be mounted on the frame (20). Additionally, a lens covering at least one of the left and right eyes may be detachably mounted on the frame (20).

[0100] As shown in the drawing, the frame (20) may have the form of glasses worn on the face of the user, but is not necessarily limited thereto and may have the form of goggles worn in close contact with the user's face.

[0101] Such a frame (20) may include a front frame (21) having at least one opening and a pair of side frames (22) that extend in the y direction (see FIG. 14) intersecting the front frame (21) and are parallel to each other.

[0102] Smart glasses may include a projection device (10). The projection device (10) is configured to control various electronic components provided in an electronic device. The projection device (10) may be used in combination with a light output device, a light projection device, a light irradiation device, an optical device, etc. The projection device (10) may be a projector. The projection device (10) may be a projector device.

[0103] The projection device (10) can generate an image or a continuous video of images that is displayed to the user. The projection device (10) may include an image source panel that generates an image and a plurality of lenses that diffuse and converge the light generated from the image source panel.

[0104] The project device (10) may be fixed to one of the two side frames (22). For example, the project device (10) may be fixed to the inside or outside of one of the side frames (22), or may be formed integrally by being embedded inside one of the side frames (22). Alternatively, the project device (10) may be fixed to the front frame (21) or provided separately from the electronic device. The project device (10) may be placed in the frame (20). The project device (10) may output an image or video to the display unit (30).

[0105] Smart glasses may include a display unit (30). The display unit (30) may be implemented in the form of a Head Mounted Display (HMD). An HMD form refers to a display method that is mounted on the head and displays images directly in front of the user's eyes. In order to provide images directly in front of the user's eyes when the user wears the electronic device, the display unit (30) may be positioned to correspond to at least one of the left eye and the right eye. In this drawing, the display unit (30) is exemplified as being located in the part corresponding to the right eye so as to output images toward the user's right eye. However, as described above, it is not limited to this and may be positioned on both the left eye and the right eye.

[0106] The display unit (30) can allow the user to visually perceive the external environment while simultaneously displaying an image generated by the projection device (10) to the user. For example, the display unit (30) can project an image onto a display area using a prism. The display unit (30) can be placed in a frame (20).

[0107] And the display unit (30) may be formed to be transparent so that the projected image and the general field of view in front, that is, the range the user looks at through their eyes, can be seen simultaneously. For example, the display unit (30) may be translucent and may be formed of an optical member including glass.

[0108] The display unit (30) may be inserted into and fixed to an opening included in the front frame (21), or positioned on the back of the opening, that is, between the opening and the user, and fixed to the front frame (21). Although the drawing illustrates an example in which the display unit (30) is positioned on the back of the opening and fixed to the front frame (21), the display unit (30) may be placed and fixed at various locations on the frame (20).

[0109] As illustrated in FIG. 14, when an image light for an image is incident on one side of a display unit (30) from a projection device (10), the image light is emitted through the display unit (30) to the other side, thereby allowing the image generated by the projection device (10) to be shown to the user.

[0110] Accordingly, the user can view the external environment through the opening of the frame (20) while simultaneously viewing the image generated by the projection device (10). That is, the image output through the display unit (30) can be seen overlapping with the normal field of view. The electronic device can utilize these display characteristics to provide Augmented Reality (AR) that overlays a virtual image onto a real image or background to display it as a single image.

[0111] Furthermore, in addition to this operation, the external environment and the image generated by the projection device (10) may be provided to the user with a time difference for a short period that is not perceived by the user. For example, within a single frame, the external environment may be provided to the user in one section, and the image from the projection device (10) may be provided to the user in another section. Alternatively, both overlap and time difference may be provided.

[0112] In addition, the projection device according to the embodiment may have a structure described below, or may be formed with a structure further including a waveguide or / and glass in the structure. In addition, the projection device may include a Digital Light Processing (DLP) projector or a projection device.

[0114] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

Claim 1 A projector device comprising: a substrate; a light source disposed on the substrate; a cover glass disposed on the light source; a bonding wire electrically connecting the substrate and the light source; and a molding member disposed on the bonding wire, wherein the molding member contacts the cover glass. Claim 2 A project device according to claim 1, wherein at least a portion of the cover glass protrudes beyond the molding member. Claim 3 A project device according to claim 1, wherein the cover glass includes a protrusion formed to protrude beyond the molding member in the edge region of the upper surface of the cover glass. Claim 4 A project device according to paragraph 3, wherein the protrusion of the cover glass is formed so that the molding member does not encroach upon the upper surface of the cover glass. Claim 5 In paragraph 3, the projection device in which the protrusion of the cover glass is formed in a square ring shape when viewed from above. Claim 6 A project device according to paragraph 3, wherein a groove shape formed relatively concavely by the protrusion is formed in the central region of the upper surface of the cover glass. Claim 7 In claim 6, the central region of the cover glass comprises a light-emitting effective region through which light emitted from the light source passes. Claim 8 A project device according to claim 1, wherein the cover glass overlaps the bonding wire in a direction parallel to the light emission surface of the light source. Claim 9 In claim 1, the project device in which the cover glass overlaps with the molding member in a direction parallel to the light emission surface of the light source. Claim 10 A project device according to paragraph 3, wherein the protrusion of the cover glass does not overlap with the molding member in a direction parallel to the light emission surface of the light source. Claim 11 A projector device according to claim 6, wherein, in a direction parallel to the light emission surface of the light source, the width of the central region of the upper surface of the cover glass is 0.85 to 0.9 of the width of the lower surface opposite the upper surface of the cover glass. Claim 12 A projector device according to claim 6, wherein, in a direction perpendicular to the light emission surface of the light source, the thickness of the central region of the cover glass is 0.5 to 0.75 of the total thickness of the cover glass in the protruding region. Claim 13 A project device according to claim 1, comprising: a heat dissipation member disposed on the substrate opposite to the light source; and an FPCB disposed between the heat dissipation member and the substrate. Claim 14 A projector device according to claim 1, comprising: a housing; a lens and a light source assembly disposed in the housing; and a light guide member disposed between the lens and the light source assembly within the housing, wherein the light source assembly comprises the substrate, the light source, the cover glass, the bonding wire, and the molding member, wherein the light source is disposed on the upper surface of the substrate, and the edge region of the upper surface of the substrate is coupled to the housing. Claim 15 Smart glasses comprising: a frame; a display unit disposed on the frame; and a projector device according to any one of claims 1 to 14 disposed on the frame and outputting an image or video to the display unit.

Images