Chiller for Semiconductor Processing Equipment

Abstract

The present invention relates to a chiller for semiconductor process equipment comprising: a refrigerant tank for receiving a refrigerant; a refrigerant supply unit forming a path for supplying the refrigerant stored in the refrigerant tank to process equipment; a refrigerant recovery unit forming a path for recovering the refrigerant used in the process equipment to the refrigerant tank; an integrated pump installed in the refrigerant supply unit; and a refrigerant circulation unit, one end of which is connected to a supply line of the refrigerant supply unit located between the integrated pump and the process equipment to form a supply branch point, and the other end of which is connected to the refrigerant tank.

Description

Technology Field

[0001] The present invention relates to a chiller for semiconductor process equipment that can reduce the volume of the chiller by simplifying the number of pumps and the piping structure, and can also reduce the manufacturing and maintenance costs of the chiller. Background Technology

[0002] Since the cooling load (flow rate) required by the process equipment changes in real time, chillers supplying refrigerant to semiconductor process equipment utilize a constant-speed pump that circulates a constant flow rate of refrigerant for cooling, and a variable-speed pump that supplies an amount of refrigerant corresponding to the flow rate required by the process equipment.

[0003] However, as described above, if refrigerant circulation for maintaining the refrigerant temperature and refrigerant supply to process equipment are carried out through a separate pump, there is a problem in that the volume of the chiller equipment increases.

[0004] In addition, since a refrigerant transfer line corresponding to each pump must be formed individually, there is also a problem that the refrigerant transfer line becomes longer and more piping is required.

[0005] In other words, not only were many pumps required, but the transfer lines also became complex to accommodate the pumps, which increased the costs required for manufacturing, maintenance, and repair.

[0006] Therefore, there is a growing need to develop a new type of chiller that can simplify its configuration to reduce its volume and lower the costs required for its manufacturing, maintenance, and repair. Prior art literature

[0007] Patent Document 1) Korean Registered Patent Publication No. 10-2433253 (Title: Standalone Chiller System Used in Semiconductor Process Equipment, Registration Date: August 11, 2022) Patent Document 2) Korean Registered Patent Publication No. 10-2372462 (Title: Chiller for Semiconductor Wafer Equipment Capable of Rapid Heating and Rapid Cooling, Registration Date: March 4, 2022) The problem to be solved

[0008] The present invention has been devised to solve the problems described above, and the objective of the present invention is to provide a chiller for semiconductor process equipment capable of simplifying the number of pumps and refrigerant transfer lines. means of solving the problem

[0009] The present invention, a chiller for semiconductor process equipment for achieving the above-mentioned purpose, is characterized by comprising: a refrigerant tank (100) in which a refrigerant is received; a refrigerant supply unit (200) that forms a path for supplying the refrigerant stored in the refrigerant tank (100) to the process equipment; a refrigerant recovery unit (300) that forms a path for recovering the refrigerant used in the process equipment to the refrigerant tank (100); an integrated pump (400) installed in the refrigerant supply unit (200); and a refrigerant circulation unit (500) in which one side is connected to a supply line (210) of the refrigerant supply unit (200) located between the integrated pump (400) and the process equipment to form a supply branching point (A), and the other side is connected to the refrigerant tank (100).

[0010] Additionally, the refrigerant tank (100) includes a heat exchanger (110) provided inside, and the refrigerant circulation unit (500) is characterized in that the other side is connected to the heat exchanger (110).

[0011] In addition, the above refrigerant recovery unit (300) is characterized in that one side is connected to process equipment and the other side is connected to a refrigerant circulation unit (500) to form a recovery branch point (B).

[0012] In addition, it is characterized by including a flow control valve (600) coupled to the supply line (210).

[0013] In addition, it is characterized by including a check valve (700) coupled to the refrigerant recovery unit (300).

[0014] Additionally, the refrigerant tank (100) comprises a low-temperature refrigerant tank (100A) for receiving a low-temperature refrigerant and a high-temperature refrigerant tank (100B) for receiving a high-temperature refrigerant; the refrigerant supply unit (200) comprises a low-temperature refrigerant supply unit (200A) for supplying a low-temperature refrigerant stored in the low-temperature refrigerant tank (100A) to process equipment (10), and a high-temperature refrigerant supply unit (200B) for supplying a high-temperature refrigerant stored in the high-temperature refrigerant tank (100B) to process equipment (10); and the integrated pump (400) comprises a low-temperature refrigerant integrated pump (400A) installed in the low-temperature refrigerant supply unit (200A) and a high-temperature refrigerant integrated pump (400B) installed in the high-temperature refrigerant supply unit (200B).

[0015] Additionally, the refrigerant circulation unit (500) is characterized by comprising: a low-temperature refrigerant circulation unit (500A) having one side connected to a low-temperature refrigerant supply line (210A) of a low-temperature refrigerant supply unit (200A) located between the low-temperature refrigerant integrated pump (400A) and process equipment to form a first supply branch point (A-1), and the other side connected to a low-temperature refrigerant tank (100A); and a high-temperature refrigerant circulation unit (500B) having one side connected to a high-temperature refrigerant supply line (210B) of a high-temperature refrigerant supply unit (200B) located between the high-temperature refrigerant integrated pump (400B) and process equipment to form a second supply branch point (A-2), and the other side connected to a high-temperature refrigerant tank (100B).

[0016] Additionally, the refrigerant recovery unit (300) comprises a low-temperature refrigerant recovery unit (300A) that forms a path for the low-temperature refrigerant used in process equipment to be recovered to the refrigerant tank (100), and a high-temperature refrigerant recovery unit (300B) that forms a path for the high-temperature refrigerant used in process equipment to be recovered to the refrigerant tank (100); wherein the low-temperature refrigerant recovery unit (300A) includes a first recovery branch point (B-1) in which one side is connected to the process equipment and the other side is connected to the low-temperature refrigerant circulation unit (500A), and the high-temperature refrigerant recovery unit (300B) includes a second recovery branch point (B-2) in which one side is connected to the process equipment and the other side is connected to the high-temperature refrigerant circulation unit (500B).

[0017] Additionally, it further includes a plurality of refrigerant supply channels through which refrigerant is supplied to process equipment; and the low-temperature refrigerant supply line (210A) and the high-temperature refrigerant supply line (210B) are formed in multiple numbers corresponding to the number of refrigerant supply channels.

[0018] Additionally, the apparatus includes a plurality of refrigerant recovery channels through which refrigerant used in process equipment is recovered; wherein the low-temperature refrigerant recovery unit (300A) comprises a plurality of first low-temperature refrigerant recovery pipes (310A) each connected to a plurality of refrigerant recovery channels, and a second low-temperature refrigerant recovery pipe (320A) connecting a plurality of first low-temperature refrigerant recovery pipes (310A) and a first recovery branch point (B-1); and the high-temperature refrigerant recovery unit (300B) comprises a plurality of first high-temperature refrigerant recovery pipes (310B) each connected to a plurality of refrigerant recovery channels, and a second high-temperature refrigerant recovery pipe (320B) connecting a plurality of first high-temperature refrigerant recovery pipes (310B) and a second recovery branch point (B-2). Effects of the invention

[0019] The semiconductor process equipment chiller of the present invention has the advantage of reducing the volume of the device by simplifying the number of pumps and the refrigerant transfer line.

[0020] In addition, there is the advantage of reducing raw material and maintenance costs by decreasing the number of pumps.

[0021] In addition, since the number of pumps is reduced, there is the advantage of minimizing the energy consumption required for pump operation.

[0022] In addition, since the recovered refrigerant is heat-exchanged directly inside the refrigerant tank, there is an advantage in that the heat exchange efficiency can be improved.

[0023] In addition, since the transfer lines are integrated and their length is reduced, there is an advantage in that the manufacturing and maintenance costs of the transfer lines can be reduced.

[0024] In addition, since the refrigerant supply flow rate can be controlled using a flow control valve, there is an advantage in that refrigerant supply delays caused by the pump's dead zone can be prevented. Brief explanation of the drawing

[0025] FIG. 1 is a conceptual diagram showing a chiller for semiconductor process equipment according to the present invention. FIG. 2 is a conceptual diagram showing that the refrigerant recovery section of the semiconductor process equipment chiller of the present invention is connected to the refrigerant circulation section. FIG. 3 is a conceptual diagram showing that the chiller for semiconductor process equipment according to the present invention supplies and recovers low-temperature refrigerant and high-temperature refrigerant through a plurality of channels. FIG. 4 is a conceptual diagram showing that the chiller for semiconductor process equipment according to the present invention supplies and recovers low-temperature refrigerant and high-temperature refrigerant through a plurality of channels, and that a plurality of supply branching points and recovery branching points are formed. Specific details for implementing the invention

[0026] The advantages and features of the embodiments of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0027] In describing the embodiments of the present invention, specific descriptions of known functions or configurations will be omitted if it is determined that such detailed descriptions could unnecessarily obscure the essence of the invention. Furthermore, the terms described below are defined in consideration of their functions in the embodiments of the present invention, and these definitions may vary depending on the intentions or practices of the user or operator. Therefore, such definitions should be based on the content throughout this specification.

[0028] Hereinafter, a chiller (1000) for semiconductor process equipment according to the present invention will be described with reference to the attached drawings.

[0029] FIG. 1 is a conceptual diagram showing a chiller for semiconductor process equipment according to the present invention, FIG. 2 is a conceptual diagram showing a refrigerant recovery unit of a chiller for semiconductor process equipment according to the present invention connected to a refrigerant circulation unit, FIG. 3 is a conceptual diagram showing a chiller for semiconductor process equipment according to the present invention supplying and recovering low-temperature refrigerant and high-temperature refrigerant through a plurality of channels, and FIG. 4 is a conceptual diagram showing a chiller for semiconductor process equipment according to the present invention supplying and recovering low-temperature refrigerant and high-temperature refrigerant through a plurality of channels, with a plurality of supply branching points and recovery branching points formed.

[0030] Referring to FIGS. 1 to 4, the chiller (1000) for semiconductor process equipment according to the present invention may include a refrigerant tank (100) in which a refrigerant is received, a refrigerant supply unit (200) that forms a path for supplying the refrigerant stored in the refrigerant tank (100) to process equipment, a refrigerant recovery unit (300) that forms a path for recovering the refrigerant used in the process equipment to the refrigerant tank (100), an integrated pump (400) installed in the refrigerant supply unit (200), and a refrigerant circulation unit (500) in which one side is connected to a supply line (210) of the refrigerant supply unit (200) located between the integrated pump (400) and process equipment to form a supply branch point (A), and the other side is connected to the refrigerant tank (100).

[0031] And, the refrigerant tank (100) includes a heat exchanger (110) provided inside, and the other side of the refrigerant circulation unit (500) can be connected to the heat exchanger (110).

[0032] To explain in detail, when refrigerant request information is received from the process equipment (10), the control device controls the operation of the integrated pump (400) so that refrigerant can be supplied to the process equipment (10) through the refrigerant supply unit (200).

[0033] In addition, since the refrigerant must be circulated to maintain the refrigerant in the refrigerant tank (100) at a constant temperature, the supply line (210) and the heat exchanger (110) are connected to the refrigerant circulation unit (500) so that the refrigerant can be supplied to the heat exchanger (110) using an integrated pump (400).

[0034] To explain once again, the supply of refrigerant to the process equipment (10) where semiconductor manufacturing takes place and the circulation of refrigerant through the refrigerant circulation unit (500) are both accomplished by a single integrated pump (400).

[0035] In addition, the chiller (1000) for semiconductor process equipment according to the present invention may include a heat recovery unit (20) that circulates cooling water or a heat exchange refrigerant through a heat exchanger (110), and the heat recovery unit (20) recovers heat from the refrigerant flowing into the heat exchanger (110) through a refrigerant circulation unit (500) so that the refrigerant on the refrigerant tank (100) can always maintain a constant temperature.

[0036] Referring to FIG. 2, the refrigerant recovery unit (300) can have one side connected to process equipment and the other side connected to a refrigerant circulation unit (500) to form a recovery branch point (B).

[0037] To explain in detail, the process equipment (10) and the refrigerant circulation unit (500) are connected to the refrigerant recovery unit (300) to create a recovery branch point (B), thereby enabling smooth refrigerant recovery using the integrated pump (400).

[0038] Therefore, the supply, circulation, and recovery of the refrigerant can all be achieved using only one integrated pump (400).

[0039] In addition, a flow control valve (600) may be connected to the supply line (210) to facilitate the supply, circulation, and recovery of the refrigerant, and a check valve (700) may be connected to the refrigerant recovery unit (300).

[0040] That is, the flow rate of the refrigerant supplied from the flow control valve (600) to the process equipment (10) is controlled, and the backflow of the refrigerant is prevented at the check valve (700).

[0041] In addition, although not shown in the drawing, a 3-way valve may be combined at one or more of the supply branch point (A) and the recovery branch point (B) to allow for smoother control of the refrigerant's direction of movement, and the operation of the 3-way valve may be automatically controlled by a central control unit.

[0042] Referring to FIG. 3, the refrigerant tank (100) may include a low-temperature refrigerant tank (100A) in which a low-temperature refrigerant is received, and a high-temperature refrigerant tank (100B) in which a high-temperature refrigerant is received.

[0043] To explain in detail, since process equipment such as semiconductor inspection equipment performs processes such as inspection at various temperatures, refrigerants with different temperatures are required to smoothly control these temperatures. Therefore, the refrigerant is maintained at a relatively low temperature in the low-temperature refrigerant tank (100A), and the refrigerant is maintained at a relatively higher temperature in the high-temperature refrigerant tank (100B) than the refrigerant stored in the low-temperature refrigerant tank (100A), so that a refrigerant with a suitable temperature can be supplied to the process equipment (10) as needed.

[0044] In addition, the low-temperature refrigerant stored in the low-temperature refrigerant tank (100A) and the high-temperature refrigerant stored in the high-temperature refrigerant tank (100B) can be mixed as needed and supplied to the process equipment (10), and it goes without saying that the temperature of the refrigerant can be controlled more precisely through this mixing process.

[0045] In addition, corresponding to the low-temperature refrigerant tank (100A) and the high-temperature refrigerant tank (100B), the heat recovery unit (20) may also include a first heat recovery unit (20A) for recovering heat of the refrigerant contained in the low-temperature refrigerant tank (100A) and a second heat recovery unit (20B) for recovering heat of the refrigerant contained in the high-temperature refrigerant tank (100B).

[0046] Additionally, the heat exchanger (110) may include a low-temperature refrigerant heat exchanger (110A) housed inside a low-temperature refrigerant tank (100A) and connected to a first heat recovery unit (20A), and a high-temperature refrigerant heat exchanger (110B) housed inside a high-temperature refrigerant tank (100B) and connected to a second heat recovery unit (20B).

[0047] In addition, the low-temperature refrigerant and the high-temperature refrigerant must be supplied, recovered, and circulated separately from each other. To this end, the refrigerant supply unit (200), the refrigerant recovery unit (300), the integrated pump (400), and the refrigerant circulation unit (500) can be separated into a configuration for the low-temperature refrigerant and a configuration for the high-temperature refrigerant.

[0048] More specifically, the refrigerant supply unit (200) may include a low-temperature refrigerant supply unit (200A) that supplies low-temperature refrigerant stored in a low-temperature refrigerant tank (100A) to process equipment (10), and a high-temperature refrigerant supply unit (200B) that supplies high-temperature refrigerant stored in a high-temperature refrigerant tank (100B) to process equipment (10).

[0049] Additionally, the refrigerant recovery unit (300) may include a low-temperature refrigerant recovery unit (300A) that forms a path for the low-temperature refrigerant used in the process equipment to be recovered to the refrigerant tank (100), and a high-temperature refrigerant recovery unit (300B) that forms a path for the high-temperature refrigerant used in the process equipment to be recovered to the refrigerant tank (100).

[0050] Additionally, the integrated pump (400) may include a low-temperature refrigerant integrated pump (400A) installed in the low-temperature refrigerant supply unit (200A) and a high-temperature refrigerant integrated pump (400B) installed in the high-temperature refrigerant supply unit (200B).

[0051] In addition, the above refrigerant circulation unit (500) may include a low-temperature refrigerant circulation unit (500A) in which one side is connected to the low-temperature refrigerant supply line (210A) of the low-temperature refrigerant supply unit (200A) located between the low-temperature refrigerant integrated pump (400A) and the process equipment to form a first supply branch point (A-1) and the other side is connected to the low-temperature refrigerant tank (100A), and a high-temperature refrigerant circulation unit (500B) in which one side is connected to the high-temperature refrigerant supply line (210B) of the high-temperature refrigerant supply unit (200B) located between the high-temperature refrigerant integrated pump (400B) and the process equipment to form a second supply branch point (A-2) and the other side is connected to the high-temperature refrigerant tank (100B).

[0052] Referring to FIG. 4, the low-temperature refrigerant recovery unit (300A) may include a first recovery branch point (B-1) in which one side is connected to process equipment and the other side is connected to the low-temperature refrigerant circulation unit (500A), and the high-temperature refrigerant recovery unit (300B) may include a second recovery branch point (B-2) in which one side is connected to process equipment and the other side is connected to the high-temperature refrigerant circulation unit (500B).

[0053] To explain in detail, by connecting each refrigerant circulation section and refrigerant recovery section to form individual recovery branch points, low-temperature refrigerant recovery is performed by the low-temperature refrigerant integrated pump (400A), and high-temperature refrigerant recovery is performed by the high-temperature refrigerant integrated pump (400B).

[0054] In addition, the chiller (1000) for semiconductor process equipment according to the present invention includes a plurality of refrigerant supply channels through which refrigerant is supplied to the process equipment, and the low-temperature refrigerant supply line (210A) and the high-temperature refrigerant supply line (210B) may be formed in a plurality corresponding to the number of refrigerant supply channels.

[0055] Additionally, the low-temperature refrigerant recovery unit (300A) may include a plurality of first low-temperature refrigerant recovery pipes (310A) each connected to a plurality of refrigerant recovery channels, and a second low-temperature refrigerant recovery pipe (320A) connecting a plurality of first low-temperature refrigerant recovery pipes (310A) and a first recovery branch point (B-1), and the high-temperature refrigerant recovery unit (300B) may include a plurality of first high-temperature refrigerant recovery pipes (310B) each connected to a plurality of refrigerant recovery channels, and a second high-temperature refrigerant recovery pipe (320B) connecting a plurality of first high-temperature refrigerant recovery pipes (310B) and a second recovery branch point (B-2).

[0056] To explain in detail, in order to smoothly supply refrigerant to complex process equipment (10), a plurality of refrigerant supply channels and a plurality of refrigerant recovery channels are formed to supply cooling water to the factory equipment (10), and a refrigerant supply unit and a refrigerant recovery unit are connected to each of these channels.

[0057] In addition, the refrigerant supply channel and the refrigerant recovery channel include a connecting valve connected to a supply line or a recovery pipe, and more specifically, the first connecting valve (30) of the first refrigerant supply channel (CH1) and the second connecting valve (40) of the second refrigerant supply channel (CH2), which are located on one side of the process equipment, can be connected to a low-temperature refrigerant supply line (210A) and a high-temperature refrigerant supply line (210B).

[0058] In addition, the third connecting valve (50) of the first refrigerant recovery channel (CH3) and the fourth connecting valve (60) of the second refrigerant recovery channel (CH4), which are located on the other side of the process equipment, can be connected to the first low-temperature refrigerant recovery pipe (310A) and the first high-temperature refrigerant recovery pipe (310B).

[0059] In addition, the first to fourth connecting valves described above may include a 3-way valve for controlling the direction of movement of refrigerant flowing in through different pipes.

[0060] Additionally, although not shown in the drawing, the flow control valve may be installed in each of the low-temperature refrigerant supply line (210A) and the high-temperature refrigerant supply line (210B), and the check valve (700) may be installed in each of the first low-temperature refrigerant recovery pipe (310A) and the first high-temperature refrigerant recovery pipe (310B).

[0061] Additionally, although not shown in the drawings, the chiller (1000) for a semiconductor process apparatus according to the present invention may further include a refrigerant mixing means that is coupled to a connecting pipe connecting the first connecting valve (30) and the second connecting valve (40) and the process equipment (10), and mixes a low-temperature refrigerant and a high-temperature refrigerant to a set temperature and then supplies it to the process equipment (10).

[0062] To explain in detail, when the temperature of the refrigerant required by the process equipment (10) is between that of a low-temperature refrigerant and a high-temperature refrigerant, the low-temperature refrigerant and the high-temperature refrigerant are mixed in a refrigerant mixing means and then supplied to the process equipment (10).

[0063] At this time, the refrigerant mixing means may include a chamber in which a low-temperature refrigerant and a high-temperature refrigerant are received, a mixing device provided inside the chamber, and a temperature measuring means for measuring the refrigerant temperature.

[0064] To explain in detail, in the case of fluids with different temperatures, there is a problem where they do not mix well and form layers due to the buoyancy effect caused by the difference in density, the formation of laminar flow due to viscous force, and thermal convection phenomena. Therefore, the mixing device is designed to mix the low-temperature refrigerant and the high-temperature refrigerant so that the temperature control of the refrigerant can be stably achieved.

[0065] At this time, the mixing device may include a screw located inside the chamber and a motor that rotates the screw, but may also include a plurality of ultrasonic vibrators spaced apart in the circumferential direction on the inner surface of the chamber.

[0066] The present invention is not limited to the embodiments described above and has a diverse scope of application. Furthermore, it is understood that anyone with ordinary knowledge in the field to which the present invention pertains can make various modifications without departing from the essence of the invention as claimed in the claims. Explanation of the symbols

[0067] 10 : Process Equipment 20 : Heat recovery unit 100 : Refrigerant tank 100A: Low-temperature refrigerant tank 100B: High-temperature refrigerant tank 110 : Heat exchanger 200 : Refrigerant supply unit 200A: Low-temperature refrigerant supply unit 200B: High-temperature refrigerant supply unit 210 : Supply line 210A: Low-temperature refrigerant supply line 210B: High-temperature refrigerant supply line 300 : Refrigerant recovery unit 300A: Low-temperature refrigerant recovery unit 310A: 1st low-temperature refrigerant recovery pipe 320A: 2nd low-temperature refrigerant recovery pipe 300B: High-temperature refrigerant recovery unit 310B: 1st high-temperature refrigerant recovery pipe 320B: Second high-temperature refrigerant recovery pipe 400: Integrated Pump 400A: Low-temperature refrigerant integrated pump 400B: High-temperature refrigerant integrated pump 500 : Refrigerant circulation unit 500A: Low-temperature refrigerant circulation unit 500B: High-temperature refrigerant circulation section 600 : Flow control valve 700 : Check valve A: Supply branch point A-1: 1st supply branch point A-2: Second supply branch point B: Recovery branch point B-1: 1st Recovery Branch B-2: Second recovery branch point

Claims

Claim 1 A chiller for semiconductor process equipment comprising: a refrigerant tank (100) in which a refrigerant is received; a refrigerant supply unit (200) forming a path for supplying the refrigerant stored in the refrigerant tank (100) to process equipment; a refrigerant recovery unit (300) forming a path for recovering the refrigerant used in the process equipment to the refrigerant tank (100); an integrated pump (400) installed in the refrigerant supply unit (200); and a refrigerant circulation unit (500) having one side connected to a supply line (210) of the refrigerant supply unit (200) located between the integrated pump (400) and the process equipment to form a supply branch point (A), and the other side connected to the refrigerant tank (100). Claim 2 A chiller for semiconductor process equipment according to claim 1, wherein the refrigerant tank (100) includes a heat exchanger (110) provided inside, and the other side of the refrigerant circulation unit (500) is connected to the heat exchanger (110). Claim 3 A chiller for semiconductor process equipment, characterized in that, in claim 1, one side of the refrigerant recovery unit (300) is connected to process equipment and the other side is connected to a refrigerant circulation unit (500) to form a recovery branch point (B). Claim 4 A chiller for semiconductor process equipment comprising, in claim 1, a flow control valve (600) coupled to the supply line (210). Claim 5 A chiller for semiconductor process equipment comprising, in claim 3, a check valve (700) coupled to the refrigerant recovery unit (300). Claim 6 In claim 2, the refrigerant tank (100) comprises a low-temperature refrigerant tank (100A) in which a low-temperature refrigerant is received and a high-temperature refrigerant tank (100B) in which a high-temperature refrigerant is received; the refrigerant supply unit (200) comprises a low-temperature refrigerant supply unit (200A) that supplies the low-temperature refrigerant stored in the low-temperature refrigerant tank (100A) to process equipment (10) and a high-temperature refrigerant supply unit (200B) that supplies the high-temperature refrigerant stored in the high-temperature refrigerant tank (100B) to process equipment (10); and the integrated pump (400) comprises a low-temperature refrigerant integrated pump (400A) installed in the low-temperature refrigerant supply unit (200A) and a high-temperature refrigerant integrated pump (400B) installed in the high-temperature refrigerant supply unit (200B); a chiller for semiconductor process equipment.

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