Black photosensitive resin composition, color filter and image display device

Abstract

A black photosensitive resin composition according to embodiments of the present invention comprises an alkali-soluble resin, an additive, a black pigment, a photopolymerizable compound, a photopolymerization initiator, and a solvent. The alkali-soluble resin comprises a phenylbenzotriazole-based monomer. The additive comprises a partial epoxy (meth)acrylate-based compound in which (meth)acrylic acid is reacted with an epoxy resin containing divalent or higher epoxy groups. The molar ratio of (meth)acrylic groups to epoxy groups contained in the partial epoxy (meth)acrylate-based compound is 0.5 to 4.

Description

Technology Field

[0001] The present invention relates to a black photosensitive resin composition, a color filter, and an image display device. More specifically, the invention relates to a black photosensitive resin composition comprising a binder resin and an additive, a color filter comprising a photocured pattern formed therefrom, and an image display device comprising the same. Background Technology

[0003] For example, a color filter is positioned on top of a liquid crystal display (LCD) device or a white organic light-emitting diode (White-OLED) display device to realize a desired color per pixel. The color filter may include a black matrix and photocuring patterns corresponding to RGB pixels.

[0004] The above photocuring pattern can be formed through a fine patterning process with a size corresponding to the pixel size of the display device. For example, a photosensitive composition comprising a binder resin and a black pigment can be formed on a substrate, and then a photocuring pattern of a color filter can be formed through an exposure and development process.

[0005] Color filters containing a black matrix can also be included in high-resolution imaging elements. For example, a color filter used in a CMOS image sensor (CIS) may employ a high-resolution black matrix pattern with a finer pitch to improve light blocking performance. The problem to be solved

[0007] One objective of the present invention is to provide a black photosensitive resin composition having improved pattern characteristics and optical reliability.

[0008] One objective of the present invention is to provide a color filter having improved pattern characteristics and optical reliability.

[0009] One objective of the present invention is to provide an image display device including the color filter. means of solving the problem

[0011] 1. An alkali-soluble resin comprising a phenyl benzotriazole monomer; an additive comprising a partial epoxy (meth)acrylate compound formed by reacting (meth)acrylic acid with an epoxy resin comprising divalent or higher epoxy groups; a black pigment; a photopolymerizable compound; a photopolymerization initiator; and a solvent, wherein the molar ratio of (meth)acrylic groups to epoxy groups contained in the partial epoxy (meth)acrylate compound is 0.5 to 4.

[0012] 2. A black photosensitive resin composition in which, in 1, the phenyl benzotriazole-based monomer comprises an aryl group having 1 to 30 carbon atoms, and the aryl group is bonded to the nitrogen (N) of the benzotriazole backbone.

[0013] 3. A black photosensitive resin composition in which the phenyl benzotriazole-based monomer is represented by the following chemical formula 1:

[0014] [Chemical Formula 1]

[0015]

[0016] (In Chemical Formula 1, R1 and R2 are each independently hydrogen, halogen, hydroxyl group, substituted or unsubstituted C1 to C30 alkyl group, substituted or unsubstituted C1 to C30 alkenyl group, substituted or unsubstituted C1 to C30 alkynyl group, substituted or unsubstituted C1 to C30 aryl group, substituted or unsubstituted C1 to C30 alkoxy group, substituted or unsubstituted C1 to C30 hydroxyalkyl group, substituted or unsubstituted C2 to C40 hydroxyalkoxyalkyl group, or substituted or unsubstituted C3 to C30 cycloalkyl group,

[0017] L1 is a directly bonded, substituted, or unsubstituted straight-chain or branched-chain alkylene group having 1 to 20 carbon atoms, having 3 to 20 carbon atoms, and

[0018] Z is a (meth)acrylate group or a vinyl group, and

[0019] a and b are each independently integers from 0 to 4).

[0020] 4. A black photosensitive resin composition according to 3 above, wherein in Chemical Formula 1, L1 is a silver-substituted or unsubstituted straight-chain alkylene group having 1 to 10 carbon atoms, and Z is a (meth)acrylate group.

[0021] 5. A black photosensitive resin composition according to 1, wherein the content of the phenyl benzotriazole-based monomer is 1% to 30% by weight of the total weight of the alkali-soluble resin.

[0022] 6. In the above 1, the black photosensitive resin composition wherein the partial epoxy (meth)acrylate compound is represented by the following chemical formula 2:

[0023] [Chemical Formula 2]

[0024]

[0025] (In Chemical Formula 2, A is an epoxy group and B is a (meth)acrylic group,

[0026] X is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms).

[0027] 7. In the above 6, X in Chemical Formula 2 is *-CH2-* or *-C(CH3)2-*, and

[0028] A is and B is And,

[0029] A black photosensitive resin composition in which Y is hydrogen or a methyl group.

[0030] 8. A black photosensitive resin composition according to 1, wherein the molar ratio of (meth)acrylic groups to epoxy groups contained in the partial epoxy (meth)acrylate-based compound is 1 to 3.

[0031] 9. A black photosensitive resin composition according to 1, wherein the content of the partial epoxy (meth)acrylate compound in the total weight of the composition is 0.01% to 5% by weight.

[0032] 10. A black photosensitive resin composition according to 1, wherein the content of the alkali-soluble resin in the total weight of the composition is 1% to 20% by weight.

[0033] 11. A black photosensitive resin composition according to 1, wherein the black pigment comprises at least one selected from the group consisting of aniline black, perylene black, titanium black, and carbon black, and the content of the black pigment is 5% to 30% by weight of the total weight of the composition.

[0034] 12. A color filter comprising: a substrate; and a photocuring pattern formed from the black photosensitive resin composition of 1 on the substrate.

[0035] 13. In the above 12, the photocuring pattern is provided as a black matrix, a color filter.

[0036] 14. A display panel; and an image display device comprising the color filter of 12 disposed on the display panel. Effects of the invention

[0038] The black photosensitive resin composition according to the embodiments of the present invention may include an alkali-soluble resin comprising a phenyl benzotriazole-based monomer. Accordingly, a photocured pattern produced from the black photosensitive resin composition may be realized in a purely tapered shape.

[0039] The black photosensitive resin composition according to embodiments of the present invention may include a partial epoxy (meth)acrylate-based compound. In exemplary embodiments, the molar ratio of acrylate groups to epoxy groups included in the partial epoxy (meth)acrylate-based compound may be controlled. Accordingly, the resolution and surface characteristics of the pattern are improved, so that fine patterns can be realized at high resolution.

[0040] A photocurable pattern prepared from a black photosensitive resin composition according to embodiments of the present invention can be provided as a black matrix. According to exemplary embodiments, the reflectance of the fine pattern is reduced, thereby providing a high-quality image display device. Brief explanation of the drawing

[0042] FIG. 1 is a diagram showing the surface condition evaluation criteria of photocurable patterns prepared from examples and comparative examples. FIG. 2 is a diagram showing the criteria for evaluating the pattern straightness of photocurable patterns manufactured from the examples and comparative examples. Specific details for implementing the invention

[0043] A black photosensitive resin composition according to embodiments of the present invention comprises an alkali-soluble resin, an additive, a black pigment, a photopolymerizable compound, a photopolymerization initiator, and a solvent. Additionally, embodiments of the present invention provide a black matrix comprising a photocured pattern formed using the black photosensitive resin composition, and an image display device comprising the black matrix.

[0044] The present disclosure will be described in detail below. However, this is merely illustrative and the present disclosure is not limited to the specific embodiments described illustratively.

[0045] The term "(meth)acryl-" as used in this application refers to "methacryl-", "acryl-", or both.

[0046] A black photosensitive resin composition according to exemplary embodiments (hereinafter referred to as the composition) comprises an alkali-soluble resin. The alkali-soluble resin may have reactivity and alkali solubility upon the action of light or heat.

[0047] The alkali-soluble resin according to exemplary embodiments comprises a phenyl benzotriazole-based monomer. The phenyl benzotriazole-based monomer can cause the photocuring pattern to have a net tapered shape during patterning and can reduce the rate of change in reflectance (SCI).

[0048] According to some embodiments, the phenyl benzotriazole monomer comprises an aryl group having 1 to 30 carbon atoms, and the aryl group may be bonded to the nitrogen (N) of the benzotriazole backbone.

[0049] In some embodiments, the phenyl benzotriazole-based monomer may be a benzotriazole (meth)acrylate-based monomer. For example, the alkali-soluble resin may be polymerized from a benzotriazole (meth)acrylate-based monomer or a mixture of monomers.

[0050] According to one embodiment, the phenyl benzotriazole-based monomer can be represented by the following chemical formula 1.

[0051] [Chemical Formula 1]

[0052]

[0053] In the above formula 1, R1 and R2 may each independently be hydrogen, a halogen, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkenyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkynyl group having 1 to 30 carbon atoms, a substituted or unsubstituted aryl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms, a substituted or unsubstituted hydroxyalkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted hydroxyalkoxyalkyl group having 2 to 40 carbon atoms, or a substituted or unsubstituted cycloalkyl group having 3 to 30 carbon atoms. In some embodiments, R2 may each independently be hydrogen, a halogen, a hydroxyl group, or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms. In one embodiment, R2 may be a hydroxyl group.

[0054] In some embodiments, L1 may be a directly bonded, or substituted or unsubstituted straight-chain or branched-chain alkylene group having 1 to 20 carbon atoms or 3 to 20 carbon atoms. In one embodiment, L1 may be a substituted or unsubstituted straight-chain alkylene group having 1 to 10 carbon atoms. In one embodiment, L1 may be a substituted or unsubstituted straight-chain alkylene group having 1 to 20 carbon atoms, 1 to 10 carbon atoms, 1 to 5 carbon atoms, or 1 to 3 carbon atoms. Accordingly, the alkali-soluble resin may provide improved mechanical durability and pattern-forming properties.

[0055] In some embodiments, Z may be a (meth)acrylate group or a vinyl group. In one embodiment, Z may be a (meth)acrylate group.

[0056] In some embodiments, a and b may each be independently integers from 0 to 4.

[0057] In one embodiment,

[0058] Non-limiting examples of the above phenyl benzotriazole (meth)acrylate monomers include 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethyl methacrylate, 2-[3-(2H-benzotriazole-2-yl)-4-methoxyphenyl]ethyl methacrylate, 2-[3-(2H-benzotriazole-2-yl)-4-chlorophenyl]ethyl methacrylate, 2-[3-(2H-benzotriazole-2-yl)-4-benzyloxyphenyl]ethyl methacrylate, and 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]butyl methacrylate. Examples include 2-[2-hydroxy-4-alkoxy-(2-oxypropyl-α-methylacrylate)-phenyl]2H-4-methoxybenzotriazole.

[0060] In some embodiments, the content of the phenyl benzotriazole monomer may be 1% to 30% by weight, or 1% to 25% by weight, 1% to 20% by weight, 3% to 20% by weight, or 5% to 15% by weight of the total weight of the alkali-soluble resin. Within the above range, the taper shape may be improved, and the surface characteristics and pattern resolution of the photocured pattern may be further enhanced.

[0061] The above alkali-soluble resin may include monomers that can typically be included in addition to the above phenyl benzotriazole-based monomer.

[0062] For example, the alkali-soluble resin may be (co)polymerized from a monomer or a monomer mixture comprising at least one selected from the group consisting of a phenyl benzotriazole-based monomer, an ethylenically unsaturated monomer having a carboxyl group, an ethylenically unsaturated monomer having a hydroxyl group, a compound having a glycidyl group, and an unsaturated monomer.

[0063] Specific examples of the above-mentioned ethylene unsaturated monomer having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid; and anhydrides of these dicarboxylic acids; and mono(meth)acrylates of polymers having carboxyl and hydroxyl groups at both ends, such as ω-carboxypolycaprolactone mono(meth)acrylate. These may be used alone or in combination of two or more types, and for example, the above-mentioned ethylene unsaturated monomer having a carboxyl group may include acrylic acid and / or methacrylic acid.

[0064] Specific examples of the ethylenically unsaturated monomer having the above-mentioned hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, N-hydroxyethyl acrylamide, etc. These may be used alone or in combination of two or more types, and for example, the ethylenically unsaturated monomer having the above-mentioned hydroxyl group may include 2-hydroxyethyl (meth)acrylate.

[0065] Specific compounds having the above-mentioned glycidyl group include butylglycidyl ether, glycidylpropyl ether, glycidylphenyl ether, 2-ethylhexylglycidyl ether, glycidyl butyrate, glycidylmethyl ether, ethylglycidyl ether, glycidyl isopropyl ether, t-butylglycidyl ether, benzylglycidyl ether, glycidyl 4-t-butylbenzoate, glycidyl stearate, arylglycidyl ether, methacrylic acid glycidyl ester, etc. These may be used alone or in combination of two or more types, and for example, the compounds having the above-mentioned glycidyl group may include butylglycidyl ether, arylglycidyl ether and / or methacrylic acid glycidyl ester.

[0066] For example, the above unsaturated monomer is an aromatic vinyl compound such as styrene, vinyltoluene, α-methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzylmethyl ether, m-vinylbenzylmethyl ether, p-vinylbenzylmethyl ether, o-vinylbenzylglycidyl ether, m-vinylbenzylglycidyl ether, p-vinylbenzylglycidyl ether; N-substituted maleimide compounds such as N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, No-hydroxyphenylmaleimide, Nm-hydroxyphenylmaleimide, Np-hydroxyphenylmaleimide, No-methylphenylmaleimide, Nm-methylphenylmaleimide, Np-methylphenylmaleimide, No-methoxyphenylmaleimide, Nm-methoxyphenylmaleimide, Np-methoxyphenylmaleimide, etc.; Alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate; cyclopentyl (meth)acrylates such as cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 2,6]decane-8-yl (meth)acrylate, 2-dicyclofentanyloxyethyl (meth)acrylate, isobornyl (meth)acrylate; It may include aryl (meth)acrylates such as phenyl (meth)acrylate and benzyl (meth)acrylate; and unsaturated oxetane compounds such as 3-(methacryloyloxymethyl)oxetane, 3-(methacryloyloxymethyl)-3-ethyloxetane, 3-(methacryloyloxymethyl)-2-trifluoromethyloxetane, 3-(methacryloyloxymethyl)-2-phenyloxetane, 2-(methacryloyloxymethyl)oxetane, and 2-(methacryloyloxymethyl)-4-trifluoromethyloxetane. These may be used alone or in combination of two or more types.

[0067] The acid value of the alkali-soluble resin may be 20 mgKOH / g to 200 mgKOH / g. In some embodiments, the acid value of the alkali-soluble resin may be 30 to 150 mgKOH / g. When the acid value of the alkali-soluble resin satisfies the above range, the black photosensitive resin composition can secure a sufficient development speed and improve adhesion to the substrate, thereby preventing short circuits in the pattern.

[0068] The weight-average molecular weight (Mw) of the alkali-soluble resin may be 3,000 to 30,000. In some embodiments, the weight-average molecular weight (Mw) of the alkali-soluble resin may be 5,000 to 25,000. Within this range, a photocurable pattern having excellent developability can be realized.

[0069] The content of the alkali-soluble resin may be 1% to 20% by weight of the total weight of the composition. In some embodiments, the content of the alkali-soluble resin may be 3% to 15% by weight or 5% to 12% by weight of the total weight of the composition. Within the above range, the moisture resistance, heat resistance, alkali resistance, etc. of the photocured pattern can be easily secured.

[0070] According to exemplary embodiments, the composition comprises a partial epoxy (meth)acrylate compound (hereinafter abbreviated as epoxy additive) in which (meth)acrylic acid is reacted with an epoxy resin containing divalent or higher epoxy groups as an additive.

[0071] For example, the epoxy additive can improve the upper flowability during the development process of the photocuring pattern, thereby improving the straightness of the pattern. Accordingly, the net taper shape can be improved, and the reflectance (SCI) can be further enhanced.

[0072] In some embodiments, the partial epoxy (meth)acrylate compound may be represented by the following chemical formula 2.

[0073] [Chemical Formula 2]

[0074]

[0075] In the above Chemical Formula 2, A may be an epoxy group and B may be a (meth)acrylic group. In one embodiment, A is and B is It could be.

[0076] In some embodiments, X may be a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms. In one embodiment, X may be *-CH2-* or *-C(CH3)2-*.

[0077] According to the embodiments of the present disclosure, the molar ratio of (meth)acrylic groups to epoxy groups contained in a partially epoxy (meth)acrylate-based compound (e.g., the molar ratio of B to A in Formula 2) may be 0.5 to 4, 0.8 to 3.5, 1 to 3.5, 1 to 3, or 1 to 2.5.

[0078] For example, if the molar ratio of (meth)acrylic groups to epoxy groups exceeds 4, the flowability of the upper part of the pattern may decrease during the photocuring pattern formation process, and the straightness of the pattern may be reduced.

[0079] For example, if the molar ratio of (meth)acrylic groups to epoxy groups is less than 0.5, the surface may be scraped during the photocuring pattern formation process, resulting in reduced surface properties and reduced resolution of the pattern.

[0080] Within the above range, the flowability of the pattern top and surface properties can be improved by a partial epoxy (meth)acrylate-based compound. Accordingly, a high-resolution fine photocurable pattern can be formed.

[0081] In some embodiments, the content of the epoxy additive in the total weight of the composition may be 0.01 wt% to 5 wt%, or 0.1 wt% to 2 wt%. In this range, the reliability of the photocuring pattern may be further improved.

[0082] A black photosensitive resin composition according to exemplary embodiments comprises a black pigment. The black pigment may comprise at least one selected from the group consisting of aniline black, perylene black, titanium black, and carbon black. These may be used alone or in combination of two or more.

[0083] In one embodiment, the black pigment may include carbon black. Accordingly, the photocurable pattern produced from the composition may be provided as a black matrix. For example, carbon black may have a low reflectance (SCI) and provide excellent light-blocking properties.

[0084] In some embodiments, the content of the black pigment may be 5% to 30% by weight, 6% to 20% by weight, or 8% to 16% by weight of the total weight of the composition. Within this range, the resolution of the photocured pattern produced from the composition may be improved.

[0085] In some embodiments, the pigment may be used together with a pigment dispersant. The pigment dispersant may be added together with the pigment to suppress the aggregation of the pigment and enhance dispersion properties.

[0086] Examples of the above pigment dispersants include cationic, anionic, nonionic, amphoteric, polyester, and polyamine surfactants.

[0087] For example, the content of the pigment dispersant may be included in an amount of 5% to 50% by weight relative to the total weight of the solid content of the pigment. Within this range, excessive viscosity increase can be suppressed, and the aggregation of the pigment and gelation of the composition can be prevented.

[0088] According to exemplary embodiments, the composition may include a photopolymerizable compound to further improve the curability of the photocuring pattern. For example, the photopolymerizable compound may be crosslinked by a photopolymerization initiator described below to form a cured network.

[0089] The photopolymerizable compound may include a monofunctional or polyfunctional (two or more functional) ethylenically unsaturated bond-containing compound (e.g., a (meth)acrylate-based compound). In exemplary embodiments, the photopolymerizable compound may include a (meth)acrylate-based compound with two or more functionalities. In some embodiments, considering the stability of the microphotocuring pattern, the photopolymerizable compound may include a (meth)acrylate-based compound with two to six functionalities.

[0090] Examples of the above monofunctional ethylenically unsaturated bond-containing compounds may include nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpyrrolidone, etc.

[0091] Examples of the above-mentioned difunctional ethylenically unsaturated bond-containing compounds include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, 3-methylpentanediol di(meth)acrylate, etc.

[0092] Examples of the above compounds containing three or more ethylene unsaturated bonds include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.

[0093] These can be used individually or in combination of two or more.

[0094] The content of the photopolymerizable compound may be about 1% to 15% by weight of the total weight of the black photosensitive resin composition. According to some embodiments, the content of the photopolymerizable compound may be about 0.5% to 10% by weight or 1% to 5% by weight of the total weight of the black photosensitive resin composition. Within this range, the strength and smoothness of the photocured pattern can be enhanced while suppressing the occurrence of reverse taper and residue.

[0095] The above photopolymerization initiator can, for example, induce a cross-linking reaction of the above-described photopolymerizable compound to provide curing pattern characteristics. The photopolymerization initiator may include compounds widely used in the field that can induce a cross-linking reaction of the above-described ethylenically unsaturated bond-containing compound.

[0096] In some embodiments, the photopolymerization initiator may comprise a compound comprising a carbazole unit or a fluorene unit. For example, the photopolymerization initiator may be an oxime ester-based initiator comprising a carbazole unit or a fluorene unit. In this case, deep curing of the photocuring pattern can be promoted more effectively even in a low-temperature process.

[0097] By using the aforementioned photopolymerization initiator, degradation of exposure / development characteristics and resolution for fine pattern formation caused by the use of the alkali-soluble resin can be suppressed, and the reliability of the photocured pattern can be improved.

[0098] The above photopolymerization initiator may further include additional initiators widely used in the field that can induce a cross-linking reaction of the aforementioned ethylenically unsaturated bond-containing compound.

[0099] The above additional photopolymerization initiator may include acetophenone-based initiators, benzophenone-based initiators, benzoin-based initiators, thioxantone-based initiators, triazine-based initiators, oxime-based initiators, etc.

[0100] Examples of the above-mentioned acetophenone-based initiators include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propan-1-one, 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl)butan-1-one, etc.

[0101] Examples of the above-mentioned benzoin-based initiators include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, etc.

[0102] Examples of the above-mentioned benzophenone-based initiators include benzophenone, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, etc.

[0103] Examples of the above-mentioned thioxantone-based initiators include 2-isopropylthioxantone, 2,4-diethylthioxantone, 2,4-dichlorothioxantone, and 1-chloro-4-propoxythioxantone.

[0104] Examples of the above triazine-based initiators include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, and 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine. Examples include 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5-triazine.

[0105] Examples of the above-mentioned oxime-based initiators include o-ethoxycarbonyl-α-oxyimino-1-phenylpropan-1-one, and commercially available products include BASF's OXE-01 and OXE-02.

[0106] In one embodiment, the black photosensitive resin composition may further include a photopolymerization initiation aid. The photopolymerization initiation aid promotes the polymerization of a photopolymerizable compound and can be used together with a photopolymerization initiator.

[0107] For example, the above photopolymerization initiation aid may include amine-based initiation aids, alkoxyanthracene-based photopolymerization initiation aids, etc.

[0108] The content of the photopolymerization initiator may be 0.01% to 3% by weight of the total weight of the composition. According to some embodiments, the content of the photopolymerization initiator may be 0.1% to 2% by weight or 0.3% to 1% by weight of the total weight of the composition. Within this range, the curability of the photocuring pattern is improved, while preventing the detachment of the pattern during the development process and preventing the occurrence of wrinkles caused by excessive cross-linking reactions.

[0109] The above solvent may include an organic solvent that has solubility for the alkali-soluble resin described above and can provide coating properties for the black photosensitive resin composition.

[0110] For example, ether-based solvents, acetate-based solvents, aromatic hydrocarbon-based solvents, ketone-based solvents, alcohol-based solvents and / or ester-based solvents may be used.

[0111] Examples of the above ether-based solvents include ethylene glycol monoalkyl ether compounds, diethylene glycol dialkyl ether compounds, propylene glycol monomethyl ether, etc.

[0112] Examples of the above acetate-based solvents include methyl cellosolve acetate, ethyl cellosolve acetate, alkyl acetate, alkoxyalkyl acetate, ethylene glycol monoacetate, ethylene glycol diacetate, propylene glycol methyl ether acetate, ethylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, dipropylene glycol methyl ether acetate, diethylene glycol monoacetate, diethylene glycol diacetate, diethylene glycol monoalkyl ether acetate, propylene glycol monoacetate, propylene glycol diacetate, propylene glycol monoalkyl ether acetate, etc.

[0113] Examples of the above aromatic hydrocarbon solvents include benzene, toluene, xylene, mesitylene, etc.

[0114] Examples of the above-mentioned ketone-based solvents include methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, cyclohexanone, etc.

[0115] Examples of the above alcohol-based solvents include ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, glycerin, 4-hydroxy-4-methyl-2-pentanone, etc.

[0116] The amount of the above solvent can be appropriately adjusted considering the sufficient solubility of components such as the above alkali-soluble resin and the coating properties of the composition, and may be included as the remainder of the above black photosensitive resin composition.

[0117] The term "residual amount" as used in this application is used in an open sense, adjusted according to components or additives added in variable amounts.

[0118] In exemplary embodiments, the content of the solvent may be 50% to 95% by weight of the total weight of the black photosensitive resin composition. In some embodiments, the content of the solvent may be 60% to 90% by weight, or 70% to 90% by weight, of the total weight of the black photosensitive resin composition. Within these ranges, the applicability may be improved when applied using an application device such as a roll coater, spin coater, slit-and-spin coater, slit coater, inkjet, etc.

[0119] According to exemplary embodiments, a black photosensitive resin composition can be prepared as follows.

[0120] In some embodiments, the black pigment may be dissolved in the solvent to prepare a coloring solution. The alkali-soluble resin, the photopolymerizable compound, and the photopolymerization initiator may be added to the coloring solution to prepare a photosensitive resin composition according to the embodiments of the present invention.

[0121] The black pigment may be dissolved or dispersed in the solvent. In one embodiment, the coloring solution can be prepared more easily by adding the pigment dispersant described above.

[0122] In some embodiments, a first solution in which the black pigment is dissolved in the solvent, and a second solution in which the alkali-soluble resin, the photopolymerizable compound, and the photopolymerization initiator are mixed in the solvent can each be prepared. The black photosensitive resin composition can be prepared by mixing the first solution and the second solution together.

[0123] In some embodiments, the black photosensitive resin composition may further include auxiliary additives within a range that does not impair the low-temperature curing characteristics of the alkali-soluble resin described above and the pattern stability / high-resolution characteristics of the black photosensitive resin composition.

[0124] For example, the above auxiliary additive may include an antioxidant or UV absorber, a surfactant, an adhesion promoter, a UV absorber, etc.

[0125] Examples of the above antioxidants or ultraviolet absorbers include benzotriazole compounds, alkyl phenol compounds, alkoxybenzophenone compounds, phenolic antioxidants, phosphorus-based antioxidants, etc.

[0126] Examples of the above surfactants include silicone-based surfactants or fluorine-based surfactants.

[0127] Examples of the above-mentioned adhesion promoters include linear silane coupling agents such as single silane compounds or alkoxysilane series compounds. For example, the above adhesion promoter may include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, etc. These can be used individually or in combination of two or more.

[0128] Embodiments of the present invention provide a photocurable pattern prepared from the black photosensitive resin composition described above and a color filter comprising said photocurable pattern. A color filter according to exemplary embodiments may comprise a substrate and a photocurable pattern formed on said substrate and prepared from said black photosensitive resin composition.

[0129] For example, a photosensitive resin layer can be formed by coating a black photosensitive resin composition according to the exemplary embodiments described above onto a semiconductor substrate, such as a glass substrate or a silicon wafer. For example, the photosensitive resin layer can be formed by coating the black photosensitive resin composition onto a substrate through spin coating, slit coating, inkjet printing, etc., followed by a pre-baking or soft-baking process.

[0130] As described above, deep curing of the photosensitive resin layer can be promoted through the alkali-soluble resin in the pre-baking or soft-baking process. Subsequently, a photocured pattern can be formed by patterning the photosensitive resin layer through an exposure and development process.

[0131] For example, the photosensitive resin layer can be selectively exposed using a photomask and a light source (e.g., g-line, i-line, etc.). Subsequently, a photocured pattern can be formed by removing the unexposed portions of the photosensitive resin layer through a development process. To improve the mechanical stability of the photocured pattern, a post-exposure baking (PEB) process may be further performed.

[0132] As a developer for the developing process, an aqueous solution of an alkaline compound such as sodium carbonate, sodium hydroxide, potassium hydroxide, potassium carbonate, tetramethylammonium hydroxide (TMAH), etc., can be used.

[0133] The above photocurable pattern may be provided as a black matrix including the black pigment described above. The black matrix may be prepared from the black photosensitive resin composition and provided as a high-resolution photocurable pattern with an enhanced fine pitch.

[0134] An image display device according to embodiments of the present invention includes a display panel and the above-described color filter disposed on the display panel.

[0135] Accordingly, for example, a coloring pattern corresponding to each pixel of an image display device may be formed, and a black matrix may be formed between adjacent coloring patterns. Accordingly, enhanced light-blocking properties can be provided to the image display device.

[0136] In one embodiment, the display panel may be a liquid crystal display (LCD) device panel. In this case, a backlight may be disposed below the display panel. In one embodiment, the display panel may be a white organic light-emitting diode (W-OLED) panel.

[0137] In the following, embodiments of the present invention are further described with reference to specific experimental examples. The embodiments and comparative examples included in the experimental examples are merely illustrative of the present invention and are not intended to limit the appended claims. It is obvious to those skilled in the art that various changes and modifications to the embodiments are possible within the scope and spirit of the present invention, and that such variations and modifications fall within the scope of the appended claims.

[0138] Synthetic example

[0139] Synthesis Example 1: Synthesis of Binder Resin B-1

[0140] Using a dropping lot, a precursor mixture was prepared by adding 56.1 g (0.3 mol) of benzyl maleimide, 21.6 g (0.3 mol) of acrylic acid, 64.7 g (0.2 mol) of 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethyl methacrylate, 4 g of t-butylperoxy-2-ethylhexanoate, and 40 g of propylene glycol monomethyl ether acetate (PGMEA) and stirring. Additionally, a chain transfer agent was prepared by stirring and mixing 6 g of n-dodecanethiol and 24 g of PGMEA.

[0141] Subsequently, 395 g of PGMEA was added to the flask, a nitrogen atmosphere was established inside the flask, and the temperature of the flask was raised to 90°C while stirring. Then, the precursor mixture and the chain transfer agent were added dropwise from the dropping lot at 90°C for 2 hours. After 1 hour had elapsed from the end of the dropping, the temperature was raised to 110°C and maintained for 3 hours. Subsequently, bubbling was initiated with an oxygen / nitrogen = 5 / 95 (v / v) mixed gas. Next, 28.4 g (0.2 mol) of glycidyl methacrylate, 0.4 g of 2,2'-methylenebis(4-methyl-6-t-butylphenol), and 0.8 g of triethylamine were added to the flask, and the reaction was carried out at 110°C for 8 hours to obtain binder resin B-1. The weight-average molecular weight in polystyrene equivalent, as measured by GPC, was 9,700. The content of the phenyl benzotriazole-based monomer represented by the above chemical formula 1 was 20% by weight of the total weight of binder resin B-1.

[0143] Synthesis Example 2: Synthesis of Binder Resin B-2

[0144] Binder resin B-2 was obtained by preparing it in the same manner as Synthesis Example 1, except that 28.8 g (0.4 mol) of acrylic acid and 32.3 g (0.1 mol) of 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethyl methacrylate were added. The weight-average molecular weight in terms of polystyrene measured by GPC was 9,100. The content of the phenyl benzotriazole-based monomer represented by Chemical Formula 1 was 10 wt% of the total weight of binder resin B-2.

[0146] Synthesis Example 3: Synthesis of Binder Resin B-3

[0147] Binder resin B-3 was obtained by preparing it in the same manner as Synthesis Example 1, except that 14.4 g (0.2 mol) of acrylic acid and 97.0 g (0.3 mol) of 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethyl methacrylate were added. The weight-average molecular weight in polystyrene equivalent measured by GPC was 10,100. The content of the phenyl benzotriazole-based monomer represented by Chemical Formula 1 was 30 wt% of the total weight of binder resin B-3.

[0149] Synthesis Example 4: Synthesis of Binder Resin B-4

[0150] Binder resin B-4 was obtained by preparing it in the same manner as Synthesis Example 1, except that 32.4 g (0.45 mol) of acrylic acid and 16.2 g (0.05 mol) of 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethyl methacrylate were added. The weight-average molecular weight in polystyrene equivalent measured by GPC was 9,000. The content of the phenyl benzotriazole-based monomer represented by Chemical Formula 1 was 5% by weight of the total weight of binder resin B-4.

[0152] Synthesis Example 5: Synthesis of Binder Resin B-5

[0153] Binder resin B-5 was obtained by preparing it in the same manner as Synthesis Example 1, except that 7.2 g (0.1 mol) of acrylic acid and 129.3 g (0.4 mol) of 2-[3-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethyl methacrylate were added. The weight-average molecular weight in polystyrene equivalent measured by GPC was 10,700. The content of the phenyl benzotriazole-based monomer represented by Chemical Formula 1 was 40 wt% of the total weight of binder resin B-5.

[0155] Synthesis Example 6: Synthesis of Epoxy Additive E-1

[0156] 100 g (0.44 mol) of bis(4-hydroxyphenyl)propane, 1 g of tetrabutylammonium bromide (TBAB), 240 mg of hydroquinone, and 83.2 g (0.59 mol) of glycidin methacrylate (GMA) were mixed in 300 mL of dimethylformamide (DMF), heated to 90°C, and stirred for 3 hours. Subsequently, 121 g (1.32 mol) of epichlorohydrin (ECH) was added and stirred at 90°C for 1 hour. After cooling to room temperature, 2 equivalents of a 20 wt% NaOH solution were added dropwise over 2 hours. After adding the above, the mixture was stirred for 1 hour, then 600 mL of ethyl acetate and 600 mL of water were added and stirred for 20 minutes. After standing for 20 minutes and removing the water layer, 50 g of Na2SO4 was added to the organic layer. After stirring for 30 minutes, the mixture was filtered, and the remaining solvent layer was concentrated under reduced pressure at 40°C (water bath). The remaining epichlorohydrin was removed from the concentrated remaining solvent layer using a high vacuum pump of 5 torr or less at 70°C for 12 hours, and epoxy additive E-1 (epoxy group (A):acrylic group (B)=1:2) was prepared.

[0158] Synthesis Example 7: Synthesis of Epoxy Additive E-2

[0159] Epoxy additive E-2 (epoxy group (A):acrylic group (B) = 1:3) was prepared in the same manner as Synthesis Example 6, except that 93.8 g (0.66 mol) of glycidin methacrylate was added.

[0161] Synthesis Example 8: Synthesis of Epoxy Additive E-3

[0162] Epoxy additive E-3 (epoxy group (A):acrylic group (B) = 2:1) was prepared in the same manner as Synthesis Example 6, except that 41.9 g (0.3 mol) of glycidin methacrylate was added.

[0164] Synthesis Example 9: Synthesis of Epoxy Additive E-4

[0165] Epoxy additive E-4 (epoxy group (A):acrylic group (B) = 1:1) was prepared in the same manner as Synthesis Example 6, except that 62.56 g (0.44 mol) of glycidin methacrylate was added.

[0167] Synthesis Example 10: Synthesis of Epoxy Additive E-5

[0168] Epoxy additive E-5 (epoxy group (A):acrylic group (B) = 1:4) was prepared in the same manner as Synthesis Example 6, except that 100.1 g (0.7 mol) of glycidin methacrylate was added.

[0170] Synthesis Example 11: Synthesis of Epoxy Additive E-6

[0171] Epoxy additive E-6 (epoxy group (A):acrylic group (B) = 3:1) was prepared in the same manner as Synthesis Example 6, except that 31.28 g (0.22 mol) of glycidin methacrylate was added.

[0173] Synthesis Example 12: Synthesis of Epoxy Additive E-7

[0174] Epoxy additive E-7 (epoxy group (A):acrylic group (B) = 1:5) was prepared in the same manner as Synthesis Example 6, except that 104.47 g (0.74 mol) of glycidin methacrylate was added.

[0176] Examples and Comparative Examples

[0177] A black photosensitive resin composition was prepared by changing the types and contents of the components as shown in Table 1 below. The contents were expressed as weight% of the total weight of the composition.

[0178] division (A) (B) (C) (D) (E) (F-1) (F-2) (G) Content type Content Content Content type Content Content Content Content Example 1 13.2 B-1 5.6 3.4 0.9 E-1 1 0.3 0.6 75 Example 2 13.2 B-2 5.6 3.4 0.9 E-1 1 0.3 0.6 75 Example 3 13.2 B-3 5.6 3.4 0.9 E-1 1 0.3 0.6 75 Example 4 13.2 B-4 5.6 3.4 0.9 E-1 1 0.3 0.6 75 Example 5 13.2 B-5 5.6 3.4 0.9 E-1 1 0.3 0.6 75 Example 6 13.2 B-1 5.6 3.4 0.9 E-2 1 0.3 0.6 75 Example 7 13.2 B-1 5.6 3.4 0.9 E-3 1 0.3 0.6 75 Example 8 13.2 B-1 5.6 3.4 0.9 E-4 1 0.3 0.6 75 Example 9 13.2 B-1 5.6 3.4 0.9 E-5 1 0.3 0.6 75 Example 10 13.2 B-1 4.2 3.8 0.9 E-1 2 0.3 0.6 75 Example 11 11.6 B-1 7.8 3.1 1.1 E-1 0.5 0.3 0.6 75 Comparative Example 1 13.2 B-6 5.6 3.4 0.9 E-1 1 0.3 0.6 75 Comparative Example 2 13.2 B-1 5.6 3.4 0.9 E-8 1 0.3 0.6 75 Comparative Example 3 13.2 B-1 5.6 3.4 0.9 E-6 1 0.3 0.6 75 Comparative Example 4 13.2 B-1 5.6 3.4 0.9 E-7 1 0.3 0.6 75 Comparative Example 5 13.2 B-4 5.6 3.4 0.9 E-6 1 0.3 0.6 75 Comparative Example 6 13.2 B-5 5.6 3.4 0.9 E-7 1 0.3 0.6 75

[0179] (A) Black pigment: MA-8 (Carbon-black: Mitsubishi)

[0180] (B) Alkali-soluble resin

[0181] B-1: Binder resin of Synthetic Example 1

[0182] B-2: Binder resin of Synthesis Example 2

[0183] B-3: Binder resin of Synthesis Example 3

[0184] B-4: Binder resin of Synthesis Example 4

[0185] B-5: Binder resin of Synthesis Example 5

[0186] B-6: SPCY-1L (Phenylbenzotriazole monomer-free acrylic resin, Showa Denko)

[0187] (C) Photopolymerizable compound: 6-functional monomer dipentaerythritol hexaacrylate (Kayarad DPHA, Nippon Kayaku Co.)

[0188] (D) Photopolymerization initiator: Irgacure OXE01 (Basf)

[0189] (E) Additives

[0190] E-1: Epoxy additive of Synthesis Example 6

[0191] E-2: Epoxy additive of Synthesis Example 7

[0192] E-3: Epoxy additive of Synthesis Example 8

[0193] E-4: Epoxy additive of Synthesis Example 9

[0194] E-5: Epoxy additive of Synthesis Example 10

[0195] E-6: Epoxy additive of Synthesis Example 11

[0196] E-7: Epoxy additive of Synthesis Example 12

[0197] E-8: EHPE-3150 (Epoxy compound, Daicel)

[0198] (F) Auxiliary additives

[0199] F-1: BYK-163 (Pigment Dispersant, BYK)

[0200] F-2: Solsperse 5000 (Pigment dispersant, Lubrisol)

[0201] (G) Solvent: Propylene glycol monomethyl ether acetate (PGMEA)

[0203] Experimental Example

[0204] A 5cm × 5cm glass substrate (Corning) was cleaned with a neutral detergent and water, and then dried. The black photosensitive resin compositions of the above examples and comparative examples, respectively, were spin-coated onto the glass substrate to achieve a final film thickness of 1.5㎛, pre-baked at 100°C, and dried for 3 minutes to remove the solvent. Subsequently, a test photomask having a line pattern ranging from 1㎛ to 20㎛ was placed, and an exposure dose of 80 mJ / cm² was applied. 2 A photocured pattern was formed by exposure to light. Subsequently, the unexposed portion was removed using an alkaline aqueous solution, and a pattern forming substrate with a photocured pattern was prepared by post-baking at 230°C for 30 minutes.

[0205] The physical properties of the above photocuring pattern were evaluated as follows, and the results are shown in Table 2.

[0207] (1) Pattern resolution and surface condition evaluation

[0208] The pattern resolution was evaluated by measuring the limit width (μm) of the fine pattern remaining on the pattern-forming substrate using an optical microscope (ECLIPSE LV100POL, NIKON).

[0209] In addition, the surface condition of the above-mentioned photocured pattern was evaluated using an optical microscope. Figure 1 is a diagram showing the criteria for evaluating the surface condition. Referring to Figure 1, the surface condition was evaluated as being superior as the damage to the surface of the pattern decreased.

[0211] (2) Evaluation of Taper Angle and Pattern Straightness

[0212] The tapered portion of the pattern-forming substrate was imaged using a scanning electron microscope (S-4300, HITACHI), and the taper angle was measured. Taper angle 90 o The above represents an inverse taper.

[0213] In addition, the pattern straightness of the tapered section was evaluated using a scanning electron microscope. Figure 2 is a diagram showing the evaluation criteria for pattern straightness. Referring to Figure 2, the pattern straightness was evaluated as being superior as the irregularities in the tapered section decreased.

[0215] (3) Evaluation of changes in reflectance (SCI)

[0216] In the above experimental example, a full-surface coated substrate was manufactured in the same manner as the above process, except that a test photomask was not introduced during exposure.

[0217] The reflectance (SCI) of the glass surface of the above-mentioned front-coated substrate was measured using a spectrophotometer (SPECTROPHOTOMETER CM-3700A, KONICA MINOLTA).

[0218] division Pattern resolution (㎛) Surface condition evaluation Taper angle( o ) Pattern straightness evaluation Reflectance (SCI) Example 1 3 ○ 71 ○ 4.9 Example 2 4 ○ 67 ○ 4.9 Example 3 3 ○ 75 ○ 4.9 Example 4 3 ○ 80 ○ 4.9 Example 5 5 ○ 66 ○ 5.0 Example 6 3 ○ 74 ○ 4.9 Example 7 4 ○ 60 ○ 4.9 Example 8 4 ○ 81 ○ 4.9 Example 9 3 ○ 69 ○ 4.9 Example 10 3 ○ 78 △ 4.9 Example 11 4 ○ 85 ○ 5.0 Comparative Example 1 3 ○ 104 △ 5.3 Comparative Example 2 7 × 118 × 5.2 Comparative Example 3 8 × 58 △ 5.0 Comparative Example 4 3 ○ 98 × 4.9 Comparative Example 5 7 × 64 ○ 5.0 Comparative Example 6 3 ○ 94 × 4.9

[0220] Referring to Table 2 above, the photocured patterns prepared from the black photosensitive resin compositions of the examples had improved pattern resolution and exhibited low reflectance.

[0221] The photocured patterns produced from the black photosensitive resin compositions of the comparative examples showed reduced pattern straightness in the tapered portion and deteriorated surface condition. In addition, they exhibited high reflectivity.

[0222] In the case of the photocurable pattern prepared from Comparative Example 1 using an acrylic resin not containing phenyl benzotriazole monomers, it was aligned in reverse taper and the straightness of the pattern was reduced. In addition, the reflectance of the pattern increased excessively.

[0223] In the case of the photocurable pattern prepared from Comparative Example 2 containing an epoxy group additive that was not partially acrylated, the pattern resolution was reduced and the damage to the pattern surface increased. In addition, the pattern was aligned in reverse taper and the straightness of the pattern was further reduced.

[0224] In the case of photocurable patterns prepared from Comparative Examples 3 and 5, in which the molar ratio of acrylic groups (B) to epoxy groups (A) was adjusted to less than 0.5, the resolution and surface condition of the patterns were excessively degraded. However, in the case of Comparative Example 5, the benzotriazole monomer content was adjusted to 5% by weight, which improved the degree of curing and slightly improved the straightness of the pattern.

[0225] In the case of photocuring patterns prepared from Comparative Examples 4 and 6, where the molar ratio of acrylic group (B) to epoxy group (A) was adjusted to be greater than 4, the patterns were aligned in reverse taper and the straightness of the patterns was excessively reduced.

[0227] The description above is merely an example of applying the principles of the present invention, and other configurations may be included without departing from the scope of the present invention.

Claims

Claim 1 A black photosensitive resin composition comprising: an alkali-soluble resin containing a phenyl benzotriazole-based monomer; an additive containing a partial epoxy (meth)acrylate-based compound in which (meth)acrylic acid is reacted with an epoxy resin containing two or more epoxy groups; a black pigment; a photopolymerizable compound; a photopolymerization initiator; and a solvent, wherein the molar ratio of (meth)acrylic groups to epoxy groups contained in the partial epoxy (meth)acrylate-based compound is 0.5 to 4. Claim 2 A black photosensitive resin composition according to claim 1, wherein the phenyl benzotriazole-based monomer comprises an aryl group having 1 to 30 carbon atoms, and the aryl group is bonded to the nitrogen (N) of the benzotriazole backbone. Claim 3 A black photosensitive resin composition according to claim 1, wherein the phenyl benzotriazole-based monomer is represented by the following chemical formula 1: [Chemical Formula 1] (In Chemical Formula 1, R1 and R2 are each independently hydrogen, halogen, hydroxyl group, substituted or unsubstituted C1 to C30 alkyl group, substituted or unsubstituted C1 to C30 alkenyl group, substituted or unsubstituted C1 to C30 alkynyl group, substituted or unsubstituted C1 to C30 aryl group, substituted or unsubstituted C1 to C30 alkoxy group, substituted or unsubstituted C1 to C30 hydroxyalkyl group, substituted or unsubstituted C2 to C40 hydroxyalkoxyalkyl group, or substituted or unsubstituted C3 to C30 cycloalkyl group, L1 is a directly bonded, or a substituted or unsubstituted C1 to C20 straight-chain or C3 to C20 branched-chain alkylene group, Z is a (meth)acrylate group or vinyl group, and a and b are Each is an integer from 0 to 4 independently). Claim 4 A black photosensitive resin composition according to claim 3, wherein in the formula 1, L1 is a substituted or unsubstituted straight-chain alkylene group having 1 to 10 carbon atoms, and Z is a (meth)acrylate group. Claim 5 A black photosensitive resin composition according to claim 1, wherein the content of the phenyl benzotriazole-based monomer is 1% to 30% by weight of the total weight of the alkali-soluble resin. Claim 6 The black photosensitive resin composition of claim 1, wherein the partial epoxy (meth)acrylate compound is represented by the following chemical formula 2: [Chemical Formula 2] (In Chemical Formula 2, A is an epoxy group, B is a (meth)acrylic group, and X is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms). Claim 7 In claim 6, wherein X in formula 2 is *-CH2-* or *-C(CH3)2-*, and A is and B is A black photosensitive resin composition in which Y is hydrogen or a methyl group. Claim 8 A black photosensitive resin composition according to claim 1, wherein the molar ratio of (meth)acrylic groups to epoxy groups included in the partial epoxy (meth)acrylate-based compound is 1 to 3. Claim 9 A black photosensitive resin composition according to claim 1, wherein the content of the partial epoxy (meth)acrylate compound in the total weight of the composition is 0.01% to 5% by weight. Claim 10 A black photosensitive resin composition according to claim 1, wherein the content of the alkali-soluble resin in the total weight of the composition is 1% to 20% by weight. Claim 11 A black photosensitive resin composition according to claim 1, wherein the black pigment comprises at least one selected from the group consisting of aniline black, perylene black, titanium black, and carbon black, and the content of the black pigment is 5% to 30% by weight of the total weight of the composition. Claim 12 A color filter comprising: a substrate; and a photocuring pattern formed from the black photosensitive resin composition of claim 1 on the substrate. Claim 13 In claim 12, the photocuring pattern is provided as a black matrix, a color filter. Claim 14 An image display device comprising: a display panel; and a color filter of claim 12 disposed on the display panel.

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