Linear deposition source and electronic device

Abstract

A linear deposition source according to one embodiment of the present invention may include a crucible extending along a first direction and containing a deposition material in an internal space, a plurality of nozzles disposed on the crucible and arranged along the first direction, a heater frame that contains the crucible and has a plurality of first openings and a plurality of second openings defined along the first direction, a plurality of heaters disposed between the heater frame and the crucible, a radiant heat blocking member that contains the heater frame, and a housing that contains the radiant heat blocking member, wherein each of the heaters may include a heating element comprising a first insulator, a heater pattern disposed on the first insulator and an electrode portion connected to one end of the heater pattern and passing through the first openings, a second insulator covering the electrode portion, and a third insulator covering the heater pattern.

Description

Technology Field

[0001] The present invention relates to a linear deposition source, and more specifically, to a linear deposition source used in a deposition apparatus.

[0002] The present invention relates to an electronic device comprising a substrate manufactured using a linear deposition source. Background Technology

[0003] The display device may include a light-emitting layer between opposing electrodes. One of the various methods for forming the electrodes is a deposition method using a deposition apparatus. The electrodes may include a metallic material, and a deposition apparatus in a high-temperature environment may be required to deposit the metallic material onto a substrate.

[0004] A point deposition source is a deposition source used to deposit metallic materials. A point deposition source consists of an arrangement of multiple crucibles, each containing an evaporative material. Due to the small capacity of the evaporative material, continuous operation for extended periods is difficult. Since the deposition sources are controlled individually, the control method is complex, which reduces the efficiency of the deposition process. Additionally, there is a problem in that a separate film thickness correction plate is required to form a uniform film on the substrate.

[0005] To solve the problems of point-type deposition sources, a linear deposition source extended in one direction can be used. However, the extended linear deposition source may have low thermal stability or experience temperature variations in high-temperature environments. The problem to be solved

[0006] The object of the present invention is to provide a linear deposition source comprising a heater and a heater frame for reducing condensation of a deposition material.

[0007] The object of the present invention is to provide an electronic device comprising a substrate manufactured from a linear deposition source comprising a heater and a heater frame for reducing the condensation of a deposited material. means of solving the problem

[0008] A linear deposition source according to one embodiment of the present invention may include a crucible extending along a first direction and containing a deposition material in an internal space, a plurality of nozzles disposed on the crucible and arranged along the first direction, a heater frame that contains the crucible and has a plurality of first openings and a plurality of second openings defined along the first direction, a plurality of heaters disposed between the heater frame and the crucible, a radiant heat blocking member that contains the heater frame, and a housing that contains the radiant heat blocking member, wherein each of the heaters may include a heating element comprising a first insulator, a heater pattern disposed on the first insulator and an electrode portion connected to one end of the heater pattern and passing through the first openings, a second insulator covering the electrode portion, and a third insulator covering the heater pattern.

[0009] The electrode portion may include a connecting portion connecting an external electrode disposed outside the housing and the heater pattern, and a fastening portion connected to one end of the heater pattern.

[0010] The above fastening portion may include a connecting member connecting the heater pattern and the connecting portion.

[0011] One end of the heater pattern may be closer to the nozzles than the first openings in a third direction that intersects both the first direction and the second direction that intersects the first direction.

[0012] The first insulator may be in the shape of a plate, the second insulator may be in the shape of a pipe, and the third insulator may be in the shape of a plate.

[0013] The heaters are arranged along the inner surface of the heater frame, and each heater can be controlled independently.

[0014] The heaters may include a first heater, a second heater arranged in the first direction with the first heater, a third heater arranged in the third direction intersecting both the first direction and the second direction intersecting the first direction with the first heater, and a fourth heater arranged in the first direction with the third heater.

[0015] The above linear deposition source may further include a fifth insulator disposed on the first heater, the second heater, the third heater, and the fourth heater.

[0016] The above linear deposition source may further include a 4-1 insulator disposed on the first heater and the second heater, and a 4-2 insulator disposed on the third heater and the fourth heater.

[0017] The above 4-1 insulator and the above 4-2 insulator may be disposed on the heater pattern, the electrode portion, and the above 2 insulator.

[0018] The above linear deposition source may further include a sixth insulator that covers the second insulator and is disposed below the fourth-1 insulator or the fourth-2 insulator.

[0019] The linear deposition source may further include a plurality of covers movable in a third direction that intersects both the first direction and the second direction that intersects the first direction on the second openings.

[0020] The linear deposition source may further include a camera positioned outside the heater frame to photograph the inside of the heater frame through the second openings.

[0021] The above linear deposition source further includes a cooling unit disposed on the housing, the cooling unit includes a cooling pipe through which cooling water flows, and the radiant heat blocking member can come into contact with the cooling unit.

[0022] A linear deposition source according to an embodiment of the present invention comprises: a crucible extending along a first direction and containing a deposition material in an internal space; a plurality of nozzles disposed on the crucible and arranged along the first direction; a heater frame that accommodates the crucible and has a plurality of first openings arranged along the first direction and a plurality of second openings arranged along the first direction defined therein; a first heater disposed between the heater frame and the crucible; a second heater arranged between the first heater and the first direction; a third heater arranged between the first heater and the first direction and a second direction intersecting both the first direction and the first direction; a fourth heater arranged between the third heater and the first direction; a radiant heat blocking member that accommodates the heater frame; and a housing that accommodates the radiant heat blocking member. Each of the first to fourth heaters comprises a heating element including a first insulator, a heater pattern disposed on the first insulator, and an electrode portion connected to one end of the heater pattern and passing through the first openings, and the electrode portion It may include a second insulator covering the heater pattern, a third insulator covering the heater pattern, a fourth insulator disposed on the heater pattern, the electrode portion, and the second insulator, and a fifth insulator disposed on the fourth insulator.

[0023] One end of the heater pattern may be closer to the nozzles than the first openings in the third direction.

[0024] The above-mentioned fourth insulator includes a fourth-1 insulator and a fourth-2 insulator, wherein the fourth-1 insulator is disposed on the first heater and the second heater, and the fourth-2 insulator may be disposed on the third heater and the fourth heater.

[0025] The linear deposition source may further include a plurality of covers movable in the third direction on the second openings.

[0026] An electronic device according to one embodiment of the present invention may include a crucible extending along a first direction and containing a deposition material in an internal space, a plurality of nozzles disposed on the crucible and arranged along the first direction, a heater frame that accommodates the crucible and has a plurality of first openings and a plurality of second openings defined along the first direction, a plurality of heaters disposed between the heater frame and the crucible, a radiant heat blocking member that accommodates the heater frame, and a housing that accommodates the radiant heat blocking member, wherein each of the heaters may include a heating element comprising a first insulator, a heater pattern disposed on the first insulator and an electrode portion connected to one end of the heater pattern and passing through the first openings, a second insulator covering the electrode portion, and a third insulator covering the heater pattern, and may include a substrate manufactured by a linear deposition source. Effects of the invention

[0027] As described above, the insulator can form a localized laminated structure on the heater. The thermal insulation performance of the electrode portion can be improved due to the localized laminated structure of the insulator. By increasing the temperature around the electrode portion through the localized laminated structure of the insulator, the condensation of the deposited material can be reduced or eliminated. Additionally, the deposited material can be allowed to move through the second openings. Thus, the condensation of the deposited material around the first openings can be reduced or eliminated. Brief explanation of the drawing

[0028] FIG. 1 is a cross-sectional view of a deposition apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view of a linear deposition source according to one embodiment of the present invention. FIG. 3 is a cross-sectional view of a linear deposition source (EP) cut along the cutting line I-I' shown in FIG. 2. FIG. 4 is a schematic perspective view of a heater frame and heaters according to one embodiment of the present invention. FIG. 5 is an exploded perspective view of a first heater according to one embodiment of the present invention. Figure 6 is an enlarged view of part AA of Figure 4. Figure 7 is an enlarged view of part AA of Figure 4. FIG. 8 is a cross-sectional view of part AA of FIG. 4 viewed from a third direction. FIG. 9 is a perspective view showing a part of a heater frame according to one embodiment of the present invention. FIG. 10 is a perspective view showing a heater frame and a part of the heaters according to one embodiment of the present invention. FIG. 11 is a block diagram of an electronic device according to one embodiment of the present invention. FIG. 12 is a schematic diagram of an electronic device according to one embodiment of the present invention. FIG. 13 is a plan view of a display panel including a substrate manufactured using the linear deposition source shown in FIG. 1. FIG. 14 is a diagram exemplarily illustrating a cross-section of a pixel shown in FIG. 13. Figure 15 is a diagram illustrating a process using a linear deposition source. Specific details for implementing the invention

[0029] In this specification, where a component (or region, layer, part, etc.) is described as being “on,” “connected,” or “joined” another component, it means that it may be directly placed / connected / joined on the other component, or that a third component may be placed between them.

[0030] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the effective illustration of the technical content. “And / or” includes all one or more combinations that the associated components may define.

[0031] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component, part, region, layer, or part from another component, part, region, layer, or part. For example, without departing from the scope of the present invention, a first component, a first part, a first region, a first layer, or a first part may be named a second component, a second part, a second region, a second layer, or a second part, and similarly, a second component, a second part, a second region, a second layer, or a second part may be named a first component, a first part, a first region, a first layer, or a first part. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0032] Additionally, terms such as “below,” “lower,” “above,” and “upper” are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0033] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0034] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an overly ideal or overly formal sense unless explicitly defined herein.

[0035] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0036] FIG. 1 is a cross-sectional view of a deposition apparatus according to one embodiment of the present invention.

[0037] Referring to FIG. 1, a deposition apparatus (ED) may include a chamber (CHB), a plurality of nozzles (NZ), and a linear deposition source (EP). The chamber (CHB) may provide an internal space, and the chamber (CHB) may form a sealed space and set the deposition conditions to a vacuum. The chamber (CHB) may have at least one gate, and the chamber (CHB) may be opened and closed through the gate. A substrate (SUB) may enter and exit through the gate provided in the chamber (CHB).

[0038] The chamber (CHB) may include a bottom surface (BP), a ceiling surface, and side walls. The bottom surface (BP) of the chamber (CHB) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2). The normal direction of the bottom surface of the chamber (CHB) may be parallel to a third direction (DR3).

[0039] A fixing member (PP) is positioned inside the chamber (CHB) and can face a linear deposition source (EP) in a third direction (DR3). The fixing member (PP) can bring a substrate (SUB) into close contact with a mask (MK). The fixing member (PP) may include magnetic materials for bringing the mask (MK) and the substrate (SUB) into close contact. For example, the magnetic materials can generate a magnetic force to fix the mask (MK), and the substrate (SUB) placed between the mask (MK) and the fixing member (PP) can be brought into close contact with the mask (MK). However, it is not limited thereto, and the fixing member (PP) may include a jig or a robot arm for holding the mask (MK).

[0040] The driving unit (DU) can be coupled to the upper surface of the fixed member (PP). The driving unit (DU) may have a cylindrical shape extending in the third direction (DR3), but is not limited thereto and may have various shapes. The driving unit (DU) can reciprocate in the third direction (DR3) to reciprocate the fixed member (PP) in the third direction (DR3).

[0041] A substrate (SUB) may be placed between a mask (MK) and a fixing member (PP). The substrate (SUB) may be a workpiece on which a deposition material is deposited. The substrate (SUB) may include a support substrate and a synthetic resin placed on the support substrate.

[0042] An electrostatic chuck (ESC) can be placed between a substrate (SUB) and a fixing member (PP). The electrostatic chuck (ESC) can generate an electrostatic force by utilizing the phenomenon of electrostatic induction. The electrostatic chuck (ESC) can chuck or dechuck the substrate (SUB) through the electrostatic force. The electrostatic chuck (ESC) can have a shape corresponding to a part of a rectangle.

[0043] Although not illustrated, the electrostatic chuck (ESC) can reciprocate in a third direction (DR3) by an external motor. Accordingly, it can be moved away from or closer to the substrate (SUB).

[0044] A mask frame (MF) can be placed under a substrate (SUB). The mask frame (MF) may have a rectangular frame shape. A frame opening (OP-MF) may be defined in the mask frame (MF) having a rectangular frame shape. The shape of the frame opening (OP-MF) may be rectangular.

[0045] The mask frame (MF) may have a certain rigidity. For example, the mask frame (MF) may include metallic materials such as stainless steel (SUS), Invar, nickel (Ni), cobalt (Co), etc.

[0046] Masks (MK) can be placed between a mask frame (MF) and a substrate (SUB). Both sides of the masks (MK) can be connected to the mask frame (MF). The masks (MK) can be stretched to cover a frame opening (OP-MF). For example, the masks (MK) can be stretched in the first direction (DR1) according to a force acting in the first direction (DR1) and in a direction opposite to the first direction (DR1). The stretched masks (MK) can be connected to the mask frame (MF) by laser welding.

[0047] The masks (MK) may include metal. For example, the masks (MK) may be defined as fine metal masks.

[0048] A linear deposition source (EP) is positioned inside the chamber (CHB) and may face a fixed member (PP) in a third direction (DR3). The linear deposition source (EP) may include a storage space for receiving a deposition material (EV) and at least one nozzle (NZ).

[0049] The deposition material (EV) may include an inorganic, metal, or organic material capable of sublimation or vaporization. For example, the deposition material (EV) may include an organic light-emitting material for forming an emitting layer (EML, see FIG. 14). The sublimated or vaporized deposition material (EV) may be sprayed toward the substrate (SUB) through a nozzle (NZ). The deposition material (EV) may be deposited by passing through the mask openings (OP-MK) of the mask (MK) and patterning onto the substrate (SUB).

[0050] FIG. 2 is a perspective view of a linear deposition source according to one embodiment of the present invention.

[0051] Referring to FIG. 2, the linear deposition source (EP) may be a device included in a deposition apparatus (ED, see FIG. 1) that sprays a deposition material (EV, see FIG. 1). In this embodiment, the linear deposition source (EP) is shown in a shape extended along a first direction (DR1). The linear deposition source (EP) may include a housing (HS) and a deposition module (DM).

[0052] The deposition module (DM) may be a module that stores and provides a deposition material (EV). The deposition module (DM) may provide the deposition material (EV) by heating the stored deposition material (EV) and spraying the deposition material (EV) onto a substrate (SUB, see FIG. 1) on which a deposition film is required to be formed. The deposition module (DM) may be housed inside a housing (HS).

[0053] The deposition module (DM) may include a plurality of nozzles (NZ). The deposition material (EV) may be sprayed out of the deposition module (DM). The deposition module (DM) may be sprayed toward a third direction (DR3) through the nozzles (NZ).

[0054] The nozzles (NZ) may be arranged in one direction. FIG. 2 illustrates nozzles (NZ) arranged in a first direction (DR1). The nozzles (NZ) may be arranged such that the spacing between the nozzles is equal. However, this is not limited thereto, and the spacing between the nozzles (NZ) may be arranged differently depending on the deposition material (EV), the thickness of the deposition film to be formed, the shape and size of the substrate (SUB), etc.

[0055] In FIG. 2, eight nozzles (NZ) are shown placed inside the housing (HS), but this is merely an exemplary illustration, and the number of nozzles (NZ) included in the linear deposition source (EP) may vary.

[0056] The housing (HS) may form the outer shape of a linear deposition source (EP). The housing (HS) may be extended in one direction. FIG. 2 illustrates a housing (HS) extended in a first direction (DR1).

[0057] The housing (HS) may include a main body (HS-B) having an internal empty space. The main body (HS-B) may accommodate a deposition module (DM) in the internal empty space and protect the deposition module (DM). The main body (HS-B) may expose a plurality of nozzles (NZ) in an upward direction.

[0058] The housing (HS) may further include a top plate (HS-T) disposed on the main body (HS-B) and covering a portion of the upper part of the exposed main body (HS-B). FIG. 2 illustrates, as an example, a top plate (HS-T) spaced apart at a predetermined interval along the second direction (DR2) to expose nozzles (NZ) through the spaced interval. However, the top plate (HS-T) is not limited to any single embodiment as long as it can cover a portion of the upper part of the main body (HS-B) while exposing the nozzles (NZ). For example, the top plate (HS-T) may be formed integrally to cover the entire upper part of the main body (HS-B) and may have a shape in which openings are defined overlapping the nozzles. Meanwhile, the top plate (HS-T) may be omitted.

[0059] FIG. 3 is a cross-sectional view of a linear deposition source (EP) cut along the cutting line I-I' shown in FIG. 2.

[0060] Referring to FIG. 3, a linear deposition source (EP) may include a crucible (CR), nozzles (NZ), a heater frame (HF), a plurality of heaters (HT), a radiation heat blocking member (RM), and a housing (HS) that accommodates the radiation heat blocking member (RM).

[0061] The crucible (CR) may have an open top and a hollow space inside. The crucible (CR) may accommodate a deposition material (EV) in the internal space. The deposition material (EV) may be a material that can be vaporized by heat. For example, the deposition material (EV) may be an inorganic material or a metallic material.

[0062] The crucible (CR) may be a linear crucible extended along the first direction (DR1). Compared to a conventional point crucible, the capacity of the deposition material accommodated may be larger. Accordingly, the continuous operating time of the deposition apparatus including the deposition source of the present invention may be increased, and the equipment utilization rate may be improved.

[0063] The crucible (CR) may include a material that can be used without deformation even at high temperatures. For example, the crucible (CR) may include metallic materials such as Mo-La (Molybdendum Lanthanum), W, TZM (Titanium-Zirconium-Molybdendum alloy), Ta, graphite, carbon composition, etc. However, the material of the crucible (CR) is not limited to the above examples.

[0064] A plurality of nozzles (NZ) may be placed on a crucible (CR). The nozzles (NZ) may be formed as a single unit. The nozzles (NZ) may be arranged along a first direction (DR1). The description of the nozzles (NZ) may be applied in the same way as the description above.

[0065] The nozzles (NZ) may include materials that can be used without deformation even at high temperatures. For example, the nozzles (NZ) may include metallic materials such as Mo-La (Molybdendum Lanthanum), W, TZM (Titanium-Zirconium-Molybdendum alloy), Ta, graphite, carbon composition, etc. However, the materials of the nozzles (NZ) are not limited to the above examples.

[0066] The nozzles (NZ) may contain the same material as the crucible (CR). Not limited thereto, the nozzles (NZ) may contain a different material from the crucible (CR).

[0067] The heater frame (HF) can accommodate a crucible (CR). The crucible (CR) may be placed on the inside of the heater frame (HF). The heater frame (HF) may have an open top and an empty space inside. The heater frame (HF) may be spaced apart from the crucible (CR) and surround the side and bottom surfaces of the crucible (CR).

[0068] The heaters (HT) can provide heat to heat the crucible (CR). The heaters (HT) can be placed between the heater frame (HF) and the crucible (CR). The heaters (HT) can be supported by the inner surface of the heater frame (HF). The heaters (HT) can be placed on the side and / or bottom surface of the crucible (CR) to surround the crucible (CR).

[0069] The heaters (HT) can heat the crucible (CR). The deposition material (EV) contained within the heated crucible (CR) can be evaporated and deposited on the substrate (SUB, see FIG. 1). For example, the heaters (HT) can heat the crucible (CR) to 1000 degrees or more, specifically 1200 degrees or more.

[0070] The radiant heat blocking member (RM) can block heat loss or prevent heat from radiating out of the linear deposition source (EP). The radiant heat blocking member (RM) can be placed between the heater frame (HF) and the housing (HS). The radiant heat blocking member (RM) can accommodate the heater frame (HF).

[0071] A radiant heat blocking member (RM) is positioned on the upper, side, and lower surfaces of a heater frame (HF) to block radiant heat emitted from the heater frame (HF) in the upward, side, and downward directions of the heater frame (HF).

[0072] The radiant heat prevention member (RM) may include a first radiant heat prevention part (RH1) disposed on the upper surface (HF-V) of the heater frame (HF), a second radiant heat prevention part (RH2) disposed on the outer surface (HF-O) of the heater frame (HF), and a third radiant heat prevention part (RH3) disposed on the lower surface (HF-B) of the heater frame (HF). The radiant heat prevention member (RM) may include a plurality of reflectors.

[0073] Some of the first to third radiant heat blocking members (RH1, RH2, RH3) may include a single carbon composite. For example, the second and third radiant heat blocking members (RH2, RH3) may include a plurality of reflectors, and the first radiant heat blocking member (RH1) may be a single body including a carbon composite. However, it is not limited thereto, and all of the first to third radiant heat blocking members (RH1, RH2, RH3) may include a plurality of reflectors. The carbon composite has excellent heat resistance so it does not easily deform even at high temperatures, and has low thermal conductivity so it can block heat loss.

[0074] Meanwhile, although not shown, the heater frame (HF) may further include a temperature sensing unit. The temperature sensing unit may measure the temperature of the crucible (CR) in different regions. By referring to the temperature measured by the temperature sensing unit, the temperature of the heaters (HT) can be controlled to make the overall temperature of the crucible (CR) uniform.

[0075] Although not illustrated, the linear deposition source (EP) may further include a cooling section. The cooling section may be placed on a housing (HS). The cooling section may include a cooling pipe through which cooling water flows. The cooling section may include a cooling bracket covering the outer surface of the cooling pipe. A refrigerant or cooling water may circulate inside the cooling pipe (CO-F). The cooling section may cool the heat radiated upward from the linear deposition source (EP) and reduce the amount of heat transferred to a substrate (SUB, see FIG. 1) placed on the linear deposition source (EP). A radiant heat blocking member (RM) may be in contact with the cooling section.

[0076] Conventional point-type deposition sources have a limited deposition area, so a configuration in which multiple point-type deposition sources are arranged must be used to form a deposition film on a substrate (SUB). In this case, individual control of the point-type deposition sources is required, which makes process management difficult, and it may be difficult to form a deposition film of uniform thickness due to deposition variations between the sources.

[0077] The linear deposition source (EP) of the present invention can reduce deposition variation and facilitate the formation of a deposition film of uniform thickness on a substrate (SUB) by arranging a plurality of nozzles (NZ) on a crucible (CR) that extends in one direction. In addition, the efficiency of using the deposition material (EV) is increased compared to a point deposition source, thereby reducing material costs.

[0078] FIG. 4 is a schematic perspective view of a heater frame and heaters according to one embodiment of the present invention.

[0079] Referring to FIG. 4, heaters (HT) can be arranged along the inner side (HF-I) of the heater frame (HF). Each heater (HT) can be controlled independently. The heaters (HT) can surround the periphery of the crucible (CR, see FIG. 3).

[0080] The heaters (HT) may include a first heater (HT1), a second heater (HT2), a third heater (HT3), a fourth heater (HT4), a fifth heater (HT5), a sixth heater (HT6), a seventh heater (HT7), and an eighth heater (HT8). In one embodiment of the present invention, the first to eighth heaters (HT1-HT8) are shown as representative, but the number of heaters (HT) is not limited thereto as long as the heaters (HT) can heat the crucible (CR).

[0081] The second heater (HT2) may be arranged in the first direction (DR1) with the first heater (HT1). Alternatively, the second heater (HT2) may be arranged in the first direction (DR1) with the seventh heater (HT7). The third heater (HT3) may be arranged in the third direction (DR3) with the first heater (HT1).

[0082] The fourth heater (HT4) may be arranged in the first direction (DR1) with the third heater (HT3). Alternatively, the fourth heater (HT4) may be arranged in the first direction (DR1) with the eighth heater (HT8).

[0083] The fifth heater (HT5) may be arranged in the first direction (DR1) with the first heater (HT1). Alternatively, the fifth heater (HT5) may be arranged in the first direction (DR1) with the seventh heater (HT7). The sixth heater (HT6) may be arranged in the first direction (DR1) with the third heater (HT3). Alternatively, the sixth heater (HT6) may be arranged in the first direction (DR1) with the eighth heater (HT8).

[0084] The seventh heater (HT7) can be arranged in the second direction (DR2) with the first heater (HT1). The eighth heater (HT8) can be arranged in the second direction (DR2) with the third heater (HT3).

[0085] The first to eighth heaters (HT1-HT8) may be independent heaters (HT) arranged along the inner surface (HF-I) of the heater frame (HF). For example, one side of the first heater (HT1) may be adjacent to the second heater (HT2), and the other side of the first heater (HT1) may be adjacent to the fifth heater (HT5). The first heater (HT1) and the second heater (HT2) and the seventh heater (HT7) and the eighth heater (HT8) may be spaced apart from each other by a crucible (CR, see FIG. 3) in a direction parallel to the second direction (DR2).

[0086] The heaters (HT) may have a shape corresponding to the shape of the inner surface (HF-I) of the heater frame (HF) in which they are placed. For example, they may be curved plate-shaped heaters, such as the second heater (HT2), the fourth heater (HT4), the fifth heater (HT5), and the sixth heater (HT6), or flat plate-shaped heaters, such as the first heater (HT1), the third heater (HT3), the seventh heater (HT7), and the eighth heater (HT8).

[0087] Each heater (HT) can be controlled independently. Therefore, the temperature can be controlled differently for each heater (HT), reducing temperature variations within the heater frame (HF) and allowing for uniform heating. The number and location of the heaters (HT) may vary depending on the structure of the heater frame (HF) and the size of the crucible (CR).

[0088] FIG. 5 is an exploded perspective view of a first heater according to an embodiment of the present invention. For convenience of explanation, the first heater (HT1) is described as an example, but the description of the first heater (HT1) can be applied equally to the second to eighth heaters (HT2-HT8). The description of the 4-1 insulator (isb41) is described later in FIG. 6.

[0089] Referring to FIG. 5, the first heater (HT1) may include a first insulator (ISB1), a heating element (HB), a second insulator (ISB2), and a third insulator (ISB3).

[0090] The first insulator (ISB1) may be placed on the inner surface (HF-I) of the heater frame (HF). The first insulator (ISB1) may be formed in a plate shape.

[0091] The heating element (HB) may include a heater pattern (HE) and an electrode part (EL).

[0092] A heater pattern (HE) may be disposed on a first insulator (ISB1). The heater pattern (HE) may be a heating coil. Although the heater pattern (HE) has been depicted in a serrated shape in this specification, it is not limited to any single shape as long as the heater pattern (HE) is a heating means capable of generating heat.

[0093] The heater pattern (HE) may include a metal material with high heat resistance. For example, the heater pattern (HE) may include Ta, Mo, W, etc., and the material is not limited to the above examples.

[0094] The electrode portion (EL) may be connected to one end of the heater pattern (HE). For example, the electrode portion (EL) may include a connecting portion (CNP) and a fastening portion (CBP). The connecting portion (CNP) may connect the heater pattern (HE) to an external electrode (not shown) disposed outside the housing (HS, see FIG. 3). The connecting portion (CNP) may be connected to the other end of the heater pattern (HE) to transmit externally applied power to the heater pattern (HE). The connecting portion (CNP) may pass through the lower surface of the heater frame (HF, see FIG. 4) and the lower surface of the housing (HS) and be exposed to the outside of the lower surface of the housing (HS). The connecting portion (CNP) may include a metallic material.

[0095] A connecting portion (CBP) may be connected to one end of a heater pattern (HE). One end of the heater pattern (HE) may be closer to the nozzles (NZ, see FIG. 3) than to the first openings (OP1, see FIG. 9) in a third direction (DR3) that intersects both the first direction (DR1) and the second direction (DR2). The connecting portion (CBP) may be connected to the heater pattern (HE) at one end of the heater pattern (HE) (e.g., the position furthest from the heater pattern (HE) in the third direction (DR3)) when the heater pattern (HE) extends in a serpentine shape in a direction parallel to the third direction (DR3). The connecting portion (CBP) may be connected to the position furthest from the third direction (DR3) among the positions where the heater pattern (HE) extends in the third direction (DR3).

[0096] The fastening portion (CBP) may include a connecting member (not shown) that connects the heater pattern (HE) and the connecting portion (CNP). Since the fastening portion (CBP) includes a connecting member, it may be easy to detach the electrode portion (EL) from the heater pattern (HE). When the electrode portion (EL) is detached from the heater pattern (HE) through the connecting member, the electrode portion (EL) can be replaced if a deposited material (EV, see FIG. 3) condenses around the electrode portion (EL). For example, the connecting member may be a bolt.

[0097] To connect the connection portion (CNP) to an external electrode, the connection portion (CNP) may be exposed outside the housing (HS) through the first openings (OP1, see FIG. 9) of the heater frame (HF). Thus, the electrode portion (EL) may have a lower temperature compared to other components of the first heater (HT1). Due to this lower temperature, the deposited material (EV) may condense around the electrode portion (EL).

[0098] At this time, the connecting portion (CBP) can be positioned at one end of the heater pattern (HE) to separate the connecting portion (CBP) from the first openings (OP1) and the third direction (DR3). Since the connecting portion (CBP) is separated from the first openings (OP1), the temperature of the connecting portion (CBP) can be prevented or reduced due to the low temperature outside the housing (HS). That is, the temperature of the electrode portion (EL) can be increased.

[0099] The second insulator (ISB2) can cover the electrode portion (EL). The second insulator (ISB2) may be in the shape of a pipe. The electrode portion (EL) may be placed inside the second insulator (ISB2). The second insulator (ISB2) can protect the electrode portion (EL). The deposited material (EV) may deviate from the evaporation path and enter the heaters (HT), contaminating the electrode portion (EL) and causing a short circuit problem, but the second insulator (ISB2) can prevent this problem.

[0100] The second insulator (ISB2) may include a material that is not reactive with the electrode portion (EL) at high temperatures. For example, the second insulator (ISB2) may include BN (Boron Nitride), pBN (Pyrolytic Boron Nitride), ALN (Aluminum Nitride), etc. The description of the second insulator (ISB2) may be applied equally to the first to sixth insulators (ISB1-ISB6).

[0101] The third insulator (ISB3) can cover the heater pattern (HE). The heater pattern (HE) can be placed between the first insulator (ISB1) and the third insulator (ISB3).

[0102] Figure 6 is an enlarged view of part AA of Figure 4.

[0103] Referring to FIG. 6, the linear deposition source (EP, see FIG. 3) may further include a fourth insulator (ISB4) and a sixth insulator (ISB6). The fourth insulator (ISB4) may include a fourth-1 insulator (ISB41) and a fourth-2 insulator (ISB42).

[0104] The 4-1 insulator (ISB41) may be placed on the first heater (HT1) and the second heater (HT2). The 4-1 insulator (ISB41) may be placed on the heater pattern (HE), the electrode portion (EL), and the second insulator (ISB2). When viewed from the second direction (DR2), the 4-1 insulator (ISB41) may overlap the electrode portion (EL) of the first heater (HT1) and the electrode portion of the second heater (HT2). The 4-1 insulator (ISB41) may be placed on the electrode portion (EL) to prevent the electrode portion (EL) from being exposed to air on the inner surface (HF-I) of the heater frame (HF). Additionally, the 4-1 insulator (ISB41) may cover the second insulator (ISB2).

[0105] A 4-1 insulator (ISB41) can be placed on the first heater (HT1) and the second heater (HT2), and on the electrode portion (EL) and the second insulator (ISB2) to form a localized stacked structure of insulators. By placing the 4-1 insulator (ISB41) on the second insulator (ISB2), the thermal insulation effect of the second insulator (ISB2) can be improved. Due to the localized stacked structure of insulators, the thermal insulation performance of the electrode portion (EL) can be improved. The temperature around the electrode portion (EL) may be lower than that of the first heater (HT1) or the second heater (HT2), as described in FIG. 5. Because the temperature around the electrode portion (EL) is low, the deposited material (EV, see FIG. 3) may condense around the electrode portion (EL). By increasing the temperature around the electrode portion (EL) through the localized stacked structure of insulators, the condensation of the deposited material (EV) can be reduced or eliminated.

[0106] The 4-2 insulator (ISB42) may be placed on the 3rd heater (HT3) and the 4th heater (HT4). The 4-2 insulator (ISB42) may be placed on the heater pattern (HE), the electrode portion (EL), and the 2nd insulator (ISB2). When viewed from the 2nd direction (DR2), the 4-2 insulator (ISB42) may overlap the electrode portion (EL) of the 3rd heater (HT3) and the electrode portion of the 4th heater (HT4). The 4-2 insulator (ISB42) may be placed on the electrode portion (EL) to prevent the electrode portion (EL) from being exposed to air on the inner surface (HF-I) of the heater frame (HF). Additionally, the 4-2 insulator (ISB42) may cover the 2nd insulator (ISB2).

[0107] Insulator 4-2 (ISB42), like insulator 4-1 (ISB41), can also increase the temperature around the electrode (EL) through a localized stacking structure of the insulator, thereby reducing or eliminating the condensation of the deposited material (EV).

[0108] The sixth insulator (ISB6) can cover the second insulator (ISB2). The sixth insulator (ISB6) can be placed under the fourth-1 insulator (ISB41) or the fourth-2 insulator (ISB42). The sixth insulator (ISB6) can cover the second insulator (ISB2) that passes through the fourth-1 insulator (ISB41) in the lower direction of the third direction (DR3). The sixth insulator (ISB6) can additionally cover the second insulator (ISB2) to reduce or eliminate the condensation of the deposited material (EV, see FIG. 3) into the local stacked structure of the insulator.

[0109] Figure 7 is an enlarged view of part AA of Figure 4.

[0110] Referring to FIG. 7, the linear deposition source (EP, see FIG. 3) may further include a fifth insulator (ISB5).

[0111] The fifth insulator (ISB5) may be placed on the first heater (HT1), the second heater (HT2), the third heater (HT3), and the fourth heater (HT4). The fifth insulator (ISB5) may be placed on the fourth insulator (ISB4). In this specification, the fifth insulator (ISB5) is illustrated in an I-shape, but the shape is not limited thereto as long as the local stacking structure of the insulator can produce an insulating effect. The fifth insulator (ISB5) may be placed on the fourth insulator (ISB4) to reduce or eliminate the condensation of the deposited material (EV, see FIG. 3) into the local stacking structure of the insulator.

[0112] FIG. 8 is a cross-sectional view of part AA of FIG. 4 viewed from a third direction.

[0113] Referring to FIG. 8, a heating element (HB) may be placed on the first insulator (ISB1). The second insulator may cover the electrode portion (EL). The third insulator (ISB3) may be placed on the first insulator (ISB1) while covering the heating element (HB). The fourth insulator (ISB4) may be placed between the third insulator (ISB3) in a direction parallel to the first direction (DR1) to cover a part of the heater pattern (HE) and the electrode portion (EL). The fifth insulator (ISB5) may be placed on the fourth insulator (ISB4) and may cover a part of the third insulator (ISB3) and the fourth insulator (ISB4). The sixth insulator (ISB6) may cover the second insulator (ISB2) and may be placed at the bottom of the insulators in the opposite direction of the third direction (DR3).

[0114] FIG. 9 is a perspective view showing a part of a heater frame according to one embodiment of the present invention.

[0115] Referring to FIG. 9, the heater frame (HF) may define first openings (OP1) and second openings (OP2). The first openings (OP1) may be arranged along a first direction (DR1). The first openings (OP1) may be spaced apart from the second direction (DR2). The second openings (OP2) may be arranged in the first direction (DR1). The second openings (OP2) may be larger than the first openings (OP1).

[0116] The heater frame (HF) may include a plurality of covers (CVR). The covers (CVR) may be movable in a third direction (DR3) over the second openings (OP2). The flow rate of the deposition material (EV) moving through the second openings (OP2) can be controlled through the covers (CVR) placed over the second openings (OP2). The covers (CVR) are movable in a third direction (DR3) so that the flow rate of the deposition material (EV) can be controlled by adjusting the opening area of ​​the second openings (OP2).

[0117] In the present invention, the deposition material (EV) can be moved through the second openings (OP2). Thus, the condensation of the deposition material (EV) around the first openings (OP1) can be reduced or eliminated.

[0118] Although not illustrated, the linear deposition source (EP, see FIG. 2) may further include a camera. The camera can photograph the interior of the heater frame (HF) through the second openings (OP2). By photographing the interior of the heater frame (HF) with the camera, the condition of the equipment can be monitored and inspected. Thus, when the deposition material (EV, see FIG. 3) condenses, pre-monitoring can prevent the condensation of the deposition material (EV) before the amount of condensation of the deposition material (EV) inside the heater frame (HF) becomes excessive.

[0119] FIG. 10 is a perspective view showing a heater frame and a part of the heaters according to an embodiment of the present invention. In FIG. 10, for convenience of explanation, the heaters (HT) are schematically shown and only the electrode part (EL) is shown, and the covers (CVR) are omitted.

[0120] Referring to FIG. 10, the electrode portion (EL) can pass through the first openings (OP1). For convenience of explanation, only a portion of the electrode portion (EL) passing through the first openings (OP1) is shown, but the electrode portion (EL) can pass through the first openings (OP1) completely. The electrode portion (EL) can be exposed outside the housing (HS, see FIG. 3) for connection with an external electrode. Due to this exposure, the area around the first openings (OP1) maintains a low temperature, so that the deposition material (EV, see FIG. 3) can condense around the first openings (OP1).

[0121] FIG. 11 is a block diagram of an electronic device according to one embodiment of the present invention.

[0122] Referring to FIG. 11, an electronic device (10) according to one embodiment may include a display module (11), a processor (12), a memory (13), and a power module (14).

[0123] The processor (12) may include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. The processor (12) can process an image signal and provide it to a display device.

[0124] The memory (13) may store data information necessary for the operation of the processor (12) or the display module (11). When the processor (12) executes an application stored in the memory (13), an image data signal and / or an input control signal are transmitted to the display module (11), and the display module (11) can process the received signal and output image information through a display screen.

[0125] The power module (14) may include a power supply module, such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate power required for the operation of the electronic device (10).

[0126] At least one of each component of the electronic device (10) described above may be included in a display device according to the embodiments described above. Additionally, some of the individual modules functionally included in one module may be included in the display device, while others may be provided separately from the display device. For example, the display device may include a display module (11), and the processor (12), memory (13), and power module (14) may be provided in the form of other devices within the electronic device (10) other than the display device.

[0127] FIG. 12 is a schematic diagram of an electronic device according to one embodiment of the present invention.

[0128] Referring to FIG. 12, various electronic devices to which a display device according to the embodiments is applied may include not only image display electronic devices such as a smartphone (10_1a), a tablet PC (10_1b), a laptop (10_1c), a TV (10_1d), and a desktop monitor (10_1e), but also wearable electronic devices including display modules such as smart glasses (10_2a), a head-mounted display (10_2b), and a smart watch (10_2c), and automotive electronic devices (10_3) including display modules such as a CID (Center Information Display) and a room mirror display placed on the instrument panel, center fascia, and dashboard of a car. The electronic device may include a substrate (SUB, see FIG. 1) manufactured by a linear deposition source (EP, see FIG. 2) according to one embodiment of the present invention.

[0129] FIG. 13 is a plan view of a display panel including a substrate manufactured using the linear deposition source shown in FIG. 1.

[0130] The display panel (DP) may have a rectangular shape having short sides and long sides, but the shape of the display panel (DP) is not limited thereto. The display panel (DP) may include a display portion (DA) and a non-display portion (NDA) surrounding the display portion (DA).

[0131] The display panel (DP) may be a light-emitting display panel. The display panel (DP) may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods, etc. Hereinafter, the display panel (DP) is described as an organic light-emitting display panel.

[0132] The display panel (DP) may include a plurality of pixels (PX), a plurality of scan lines (SL1~SLm), a plurality of data lines (DL1~DLn), a plurality of light-emitting lines (EL1~ELm), first and second control lines (CSL1, CSL2), first and second power lines (PLL1, PLL2), connection lines (CNL), and a plurality of pads (PD). m and n are natural numbers.

[0133] Pixels (PX) may be placed in the display section (DA). The scanning driver (SDV) and the light-emitting driver (EDV) may be placed in the non-display section (NDA) adjacent to the long sides of the display panel (DP), respectively. The data driver (DDV) may be placed in the non-display section (NDA) adjacent to any one of the short sides of the display panel (DP). When viewed in a planar view, the data driver (DDV) may be adjacent to the bottom of the display panel (DP).

[0134] Scan lines (SL1~SLm) can be extended in a first direction (DR1) and connected to pixels (PX) and a scan driver (SDV). Data lines (DL1~DLn) can be extended in a second direction (DR2) and connected to pixels (PX) and a data driver (DDV). Light emission lines (EL1~ELm) can be extended in a first direction (DR1) and connected to pixels (PX) and a light emission driver (EDV).

[0135] The first power line (PLL1) may be extended in the second direction (DR2) and placed in the non-display section (NDA). The first power line (PLL1) may be placed between the display section (DA) and the light-emitting driver (EDV), but is not limited thereto, and may be placed between the display section (DA) and the scanning driver (SDV).

[0136] The connection lines (CNL) can be extended in a first direction (DR1) and arranged in a second direction (DR2). The connection lines (CNL) can be connected to a first power line (PLL1) and pixels (PX). A first voltage can be applied to the pixels (PX) through the first power line (PLL1) and the connection lines (CNL) which are connected to each other.

[0137] The second power line (PLL2) may be placed in the non-display section (NDA). The second power line (PLL2) may extend along the long sides of the display panel (DP) and along another short side of the display panel (DP) where the data driver (DDV) is not placed. The second power line (PLL2) may be placed outside the scanning driver (SDV) and the light-emitting driver (EDV).

[0138] Although not illustrated, the second power line (PLL2) may be extended toward the display unit (DA) and connected to the pixels (PX). A second voltage having a level lower than the first voltage may be applied to the pixels (PX) through the second power line (PLL2).

[0139] The first control line (CSL1) is connected to the scanning driver (SDV) and can extend toward the bottom of the display panel (DP) when viewed in a planar view. The second control line (CSL2) is connected to the light-emitting driver (EDV) and can extend toward the bottom of the display panel (DP) when viewed in a planar view. The data driver (DDV) can be positioned between the first control line (CSL1) and the second control line (CSL2).

[0140] Pads (PDs) may be placed on a display panel (DP). Pads (PDs) may be located closer to the bottom of the display panel (DP) than to a data driver (DDV). A data driver (DDV), a first power line (PLL1), a second power line (PLL2), a first control line (CSL1), and a second control line (CSL2) may be connected to pads (PDs). Data lines (DL1 to DLn) are connected to a data driver (DDV), and the data driver (DDV) may be connected to pads (PDs) corresponding to the data lines (DL1 to DLn).

[0141] Unit regions corresponding to such a display panel (DP) can be defined on the aforementioned substrate (SUB). After light-emitting elements are formed in the unit regions, the unit regions can be cut. Thus, the display panel (DP) shown in FIG. 11 can be manufactured.

[0142] Although not illustrated, a timing controller for controlling the operation of the scanning driver (SDV), data driver (DDV), and light-emitting driver (EDV), and a voltage generator for generating first and second voltages may be disposed on a printed circuit board. The timing controller and the voltage generator may be connected to corresponding pads (PDs) through the printed circuit board.

[0143] The scanning driver (SDV) generates multiple scanning signals, and the scanning signals can be applied to pixels (PX) through scanning lines (SL1 to SLm). The data driver (DDV) generates multiple data voltages, and the data voltages can be applied to pixels (PX) through data lines (DL1 to DLn). The light emission driver (EDV) generates multiple light emission signals, and the light emission signals can be applied to pixels (PX) through light emission lines (EL1 to ELm).

[0144] Pixels (PX) can receive data voltages in response to scanning signals. Pixels (PX) can display an image by emitting light of a brightness corresponding to the data voltages in response to light emission signals. The light emission time of the pixels (PX) can be controlled by the light emission signals.

[0145] The aforementioned wiring may include data lines (DL1 to DLn). Pads connected to the aforementioned wiring may include pads (PD) illustrated in FIG. 11. A display panel (DP) in which light-emitting layers of pixels (PX) are not formed may be defined as the aforementioned substrate (SUB).

[0146] The cross-sectional structure of a substrate (SUB) in which light-emitting layers are not formed will be described below in FIG. 13. Pads (PDs) are formed on the substrate (SUB), and the substrate (SUB) can be defined as a state in which a printed circuit board is not connected. The pads (PDs) can be connected to the aforementioned ground terminal (GND) so that the pads (PDs) and data lines (DL1~DLn) can be grounded.

[0147] FIG. 14 is a diagram exemplarily illustrating a cross-section of a pixel shown in FIG. 13.

[0148] Referring to FIG. 14, a pixel (PX) is disposed on a base substrate (BS) and may include a transistor (TR) and a light-emitting element (OLED). The transistors (TR) and light-emitting elements (OLED) of the pixels (PX) may be connected to the aforementioned data lines (DL1~DLn) and first and second power lines (PLL1, PLL2).

[0149] The transistors (TR) and light-emitting elements (OLED) of the pixels (PX) can be connected to the pads (PD) of FIG. 11 through data lines (DL1 to DLn, see FIG. 11) and first and second power lines (PLL1, PLL2, see FIG. 11).

[0150] A light-emitting device (OLED) may include a first electrode (AE), a second electrode (CE), a hole control layer (HCL), an electron control layer (ECL), and a light-emitting layer (EML). The first electrode (AE) may be an anode electrode, and the second electrode (CE) may be a cathode electrode.

[0151] A transistor (TR) and a light-emitting element (OLED) may be disposed on a base substrate (BS). Although one transistor (TR) is illustrated as an example, substantially, the pixel (PX) may include a plurality of transistors and at least one capacitor for driving the light-emitting element (OLED).

[0152] The display unit (DA) may include a light-emitting unit (PA) corresponding to a pixel (PX) and a non-light-emitting unit (NPA) around the light-emitting unit (PA). A light-emitting element (OLED) may be placed in the light-emitting unit (PA).

[0153] The base substrate (BS) may include a flexible plastic substrate. For example, the base substrate (BS) may include transparent polyimide (PI). A buffer layer (BFL) is disposed on the base substrate (BS), and the buffer layer (BFL) may be an inorganic layer.

[0154] A semiconductor pattern may be disposed on the buffer layer (BFL). The semiconductor pattern may include polysilicon. However, it is not limited thereto, and the semiconductor pattern may include amorphous silicon or metal oxide.

[0155] The semiconductor pattern can be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a high-doping region and a low-doping region. The conductivity of the high-doping region is greater than that of the low-doping region and can substantially serve as the source and drain electrodes of the transistor (TR). The low-doping region can substantially correspond to the active (or channel) of the transistor.

[0156] The source (S), active (A), and drain (D) of the transistor (TR) can be formed from a semiconductor pattern. A first insulating layer (INS1) can be disposed on the semiconductor pattern. The gate (G) of the transistor (TR) can be disposed on the first insulating layer (INS1). A second insulating layer (INS2) can be disposed on the gate (G). A third insulating layer (INS3) can be disposed on the second insulating layer (INS2).

[0157] A connecting electrode (CNE) is positioned between a transistor (TR) and a light-emitting element (OLED) to connect the transistor (TR) and the light-emitting element (OLED). The connecting electrode (CNE) may include a first connecting electrode (CNE1) and a second connecting electrode (CNE2).

[0158] A first connecting electrode (CNE1) is disposed on a third insulating layer (INS3) and can be connected to a drain (D) through a first contact hole (CH1) defined in the first to third insulating layers (INS1~INS3). A fourth insulating layer (INS4) can be disposed on the first connecting electrode (CNE1). A fifth insulating layer (INS5) can be disposed on the fourth insulating layer (INS4).

[0159] A second connecting electrode (CNE2) may be disposed on a fifth insulating layer (INS5). The second connecting electrode (CNE2) may be connected to a first connecting electrode (CNE1) through a second contact hole (CH2) defined in the fifth insulating layer (INS5). A sixth insulating layer (INS6) may be disposed on the second connecting electrode (CNE2). The first insulating layer (INS1) to the sixth insulating layer (INS6) may be inorganic layers or organic layers.

[0160] A first electrode (AE) may be disposed on the sixth insulating layer (INS6). The first electrode (AE) may be connected to a second connecting electrode (CNE2) through a third contact hole (CH3) defined in the sixth insulating layer (INS6). A pixel defining film (PDL) that exposes a predetermined portion of the first electrode (AE) may be disposed on the first electrode (AE) and the sixth insulating layer (INS6). An opening (PX_OP) for exposing a predetermined portion of the first electrode (AE) may be defined in the pixel defining film (PDL).

[0161] A hole control layer (HCL) may be disposed on a first electrode (AE) and a pixel definition film (PDL). A hole control layer (HCL) may be disposed in common on a light-emitting part (PA) and a non-light-emitting part (NPA). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0162] The emitting layer (EML) may be disposed on the hole control layer (HCL). The emitting layer (EML) may be disposed in the region corresponding to the aperture (PX_OP). The emitting layer (EML) may comprise organic and / or inorganic materials. The emitting layer (EML) may generate any one of red, green, and blue light.

[0163] The electronic control layer (ECL) may be disposed on the emitting layer (EML) and the hole control layer (HCL). The electronic control layer (ECL) may be disposed in common on the emitting part (PA) and the non-emitting part (NPA). The electronic control layer (ECL) may include an electron transport layer and an electron injection layer.

[0164] The second electrode (CE) may be placed on the electronic control layer (ECL). The second electrode (CE) may be placed in common on the pixels (PX). The layer from the buffer layer (BFL) to the light-emitting element (OLED) may be defined as the pixel layer (PXL).

[0165] A thin film encapsulation layer (TFE) can be disposed on a light-emitting device (OLED). The thin film encapsulation layer (TFE) can be disposed on a second electrode (CE) to cover a pixel (PX). The thin film encapsulation layer (TFE) may include at least two inorganic layers and an organic layer between the inorganic layers. The inorganic layers can protect the pixel (PX) from moisture / oxygen. The organic layer can protect the pixel (PX) from foreign substances such as dust particles.

[0166] A first voltage is applied to a first electrode (AE) through a transistor (TR), and a second voltage having a level lower than the first voltage can be applied to a second electrode (CE). Holes and electrons injected into the light-emitting layer (EML) combine to form excitons, and as the excitons transition to a ground state, the light-emitting element (OLED) can emit light.

[0167] Figure 15 is a diagram illustrating a process using a linear deposition source.

[0168] Referring to FIGS. 13 to 15, the substrate (SUB) can be defined from the base substrate (BS) to the layer on which the hole control layer (HCL) is disposed. As previously described, the transistor (TR) can be connected to pads (PD) through data lines (DL1 to DLn). That is, the substrate (SUB) may include data lines (DL1 to DLn) defined by the aforementioned wiring and pads (PD) connected to the data lines (DL1 to DLn).

[0169] A mask (MK) may be positioned to face a substrate (SUB). The mask (MK) may be positioned in close proximity to the substrate (SUB). A deposition material (EV) may be provided onto the substrate (SUB) through a mask opening (OP-MK) defined on the upper surface of the mask (MK). An emissive layer (EML) may be formed on the substrate (SUB) by the deposition material (EV).

[0170] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as described in the claims set forth below.

[0171] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0172] EV: Deposited material CR: Crucible NZ: Nozzles OP1: First openings OP2: Second openings HF: Heater frame HT: Heaters RM: Radiant heat blocking member HS: Housing HB: Heating element ISB1: First insulator ISB2: Second insulator ISB3: Third insulator ISB4: Fourth Insulator ISB5: Fifth Insulator ISB6: 6th Insulator HE: Heater pattern EL: Electrode part

Claims

Claim 1 A linear deposition source comprising: a crucible extending along a first direction and containing a deposition material in an internal space; a plurality of nozzles disposed on the crucible and arranged along the first direction; a heater frame containing the crucible and having a plurality of first openings and a plurality of second openings defined along the first direction; a plurality of heaters disposed between the heater frame and the crucible; a radiant heat blocking member containing the heater frame; and a housing containing the radiant heat blocking member, wherein each of the heaters comprises: a first insulator; a heating element including a heater pattern disposed on the first insulator and an electrode portion connected to one end of the heater pattern and passing through the first openings; a second insulator covering the electrode portion; and a third insulator covering the heater pattern. Claim 2 A linear deposition source according to claim 1, wherein the electrode portion comprises: a connecting portion connecting an external electrode disposed outside the housing and the heater pattern; and a fastening portion connected to one end of the heater pattern. Claim 3 In claim 2, the connecting portion comprises a linear deposition source including a connecting member connecting the heater pattern and the connecting portion. Claim 4 In claim 1, the one end of the heater pattern is a linear deposition source closer to the nozzles than the first openings in a third direction intersecting both the first direction and the second direction intersecting the first direction. Claim 5 A linear deposition source according to claim 1, wherein the first insulator is plate-shaped, the second insulator is pipe-shaped, and the third insulator is plate-shaped. Claim 6 In claim 1, the heaters are arranged along the inner surface of the heater frame, and each heater is a linear deposition source that can be controlled independently. Claim 7 A linear deposition source according to claim 1, wherein the heaters comprise: a first heater; a second heater arranged in the first direction with the first heater; a third heater arranged in the third direction intersecting both the first direction and the second direction intersecting the first direction; and a fourth heater arranged in the first direction with the third heater. Claim 8 A linear deposition source according to claim 7, further comprising a fifth insulator disposed on the first heater, the second heater, the third heater, and the fourth heater. Claim 9 A linear deposition source according to claim 7, further comprising: a 4-1 insulator disposed on the first heater and the second heater; and a 4-2 insulator disposed on the third heater and the fourth heater. Claim 10 In claim 9, the 4-1 insulator and the 4-2 insulator are linear deposition sources disposed on the heater pattern, the electrode portion, and the 2 insulator. Claim 11 A linear deposition source according to claim 9, further comprising a sixth insulator covering the second insulator and disposed below the fourth-1 insulator or the fourth-2 insulator. Claim 12 A linear deposition source according to claim 1, further comprising a plurality of covers movable in a third direction intersecting both the first direction and the second direction intersecting the first direction on the second openings. Claim 13 A linear deposition source according to claim 1, further comprising a camera disposed outside the heater frame and capturing the inside of the heater frame through the second openings. Claim 14 In claim 1, the cooling member further comprises a cooling member disposed on the housing, wherein the cooling member comprises a cooling pipe through which cooling water flows, and the radiant heat blocking member is a linear deposition source in contact with the cooling member. Claim 15 A crucible extending along a first direction and accommodating a deposition material in an internal space; a plurality of nozzles disposed on the crucible and arranged along the first direction; a heater frame accommodating the crucible and having a plurality of first openings arranged along the first direction and a plurality of second openings defined along the first direction; a first heater disposed between the heater frame and the crucible; a second heater arranged in the first direction with the first heater; a third heater arranged in a third direction intersecting both the first direction and a second direction intersecting the first direction with the first heater; a fourth heater arranged in the first direction with the third heater; a radiant heat blocking member accommodating the heater frame; and a housing accommodating the radiant heat blocking member, wherein each of the first to fourth heaters comprises: a first insulator; a heating element comprising a heater pattern disposed on the first insulator and an electrode portion connected to one end of the heater pattern and passing through the first openings; and a second insulator covering the electrode portion. A linear deposition source comprising a third insulator covering the heater pattern, a fourth insulator disposed on the heater pattern, the electrode portion, and the second insulator, and a fifth insulator disposed on the fourth insulator. Claim 16 In claim 15, the one end of the heater pattern is a linear deposition source that is closer to the nozzles than the first openings in the third direction. Claim 17 In claim 15, the fourth insulator comprises a fourth-1 insulator and a fourth-2 insulator, wherein the fourth-1 insulator is disposed on the first heater and the second heater, and the fourth-2 insulator is disposed on the third heater and the fourth heater, forming a linear deposition source. Claim 18 A linear deposition source according to claim 15, further comprising a plurality of covers movable in the third direction on the second openings. Claim 19 An electronic device comprising a substrate manufactured by a linear deposition source, the crucible extending along a first direction and containing a deposition material in an internal space; a plurality of nozzles disposed on the crucible and arranged along the first direction; a heater frame that accommodates the crucible and has a plurality of first openings and a plurality of second openings defined along the first direction; a plurality of heaters disposed between the heater frame and the crucible; a radiant heat blocking member that accommodates the heater frame; and a housing that accommodates the radiant heat blocking member, wherein each of the heaters comprises: a first insulator; a heating element comprising a heater pattern disposed on the first insulator and an electrode portion connected to one end of the heater pattern and passing through the first openings; a second insulator covering the electrode portion; and a third insulator covering the heater pattern.

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