Temperature-controllable thermal chuck and reliability test method of semiconductor devices using the same

Abstract

The present invention relates to a temperature-controllable thermal chuck and a method for testing the reliability of a semiconductor device using the same.

Description

Technology Field

[0001] The present invention relates to a temperature-controlled thermal chuck for reliability evaluation and electrical characteristic analysis of semiconductor devices, and in particular, to a system capable of precisely controlling the temperature of a wafer or individual semiconductor device and a test method using the same. Background Technology

[0002] To evaluate the performance and reliability of semiconductor devices, it is essential to analyze their operating characteristics under various temperature environments. For this purpose, a thermal chuck system is generally used, which enables the measurement of electrical characteristics by controlling the wafer temperature.

[0003] However, existing thermal chuck systems have the following limitations:

[0004] 1. Lack of temperature control precision - There is a problem where a deviation of ±2~5% occurs at a specific temperature.

[0005] 2. Lack of temperature uniformity - It is difficult to maintain a uniform temperature across the entire wafer area

[0006] 3. Limitations in low-noise environments - Insufficient noise blocking for low-current (picoampere or lower) measurements

[0007] To solve these problems, the present invention proposes a thermal chuck system that provides high-precision temperature control and low-noise performance. The problem to be solved

[0008] The problem that the present invention aims to solve is to provide a temperature-controllable thermal chuck and a method for testing the reliability of a semiconductor device using the same.

[0009] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0010] The thermal chuck system of the present invention for solving the above-mentioned problem may be characterized in that it is a temperature-controllable thermal chuck system capable of controlling the temperature from -50℃ to 399℃, providing a uniform temperature distribution over the entire wafer surface, having a temperature switching speed of within 10 minutes, maintaining a temperature fluctuation range within ±0.1℃, including a DC-based low-noise power supply system, and including a shielding structure that minimizes signal interference. Effects of the invention

[0011] This invention is designed to overcome the limitations of existing thermal chuck systems and enable more precise and stable temperature control. In particular, it can accurately measure the electrical characteristics of semiconductor devices even in low-noise environments, thereby providing high efficiency in reliability testing and product development processes.

[0012] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below. Brief explanation of the drawing

[0013] FIG. 1 is a conceptual diagram showing a temperature-controlled thermal chuck of the present invention. Specific details for implementing the invention

[0014] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the present invention, and the present invention is defined only by the scope of the claims.

[0015] The terms used in this specification are for describing embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. The terms "comprises" and / or "comprising" used in this specification do not exclude the presence or addition of one or more other components in addition to the components mentioned. Throughout the specification, the same reference numerals refer to the same components, and "and / or" includes each of the mentioned components and all combinations of one or more. Although terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical scope of the invention.

[0016] Unless otherwise defined, all terms used herein (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0018] The objective of the present invention is as follows:

[0019] Provides high-precision temperature control function - Guarantees ±0.1℃ stability through precise PID-based temperature control

[0020] Improved temperature uniformity - Provides a uniform temperature distribution across the entire surface

[0021] Support for low-noise environments - Minimizes signal interference to enable low current measurement at the picoampere (pA) level

[0022] Implementation of fast temperature switching speed- Maximize test efficiency by rapidly changing the temperature

[0024] The present invention includes the following components:

[0025] Thermal Chuck main body

[0026] Temperature range: -50℃ ~ 399℃

[0027] Precision control: Provides ±0.1℃ stability

[0028] Supports coaxial and triaxial versions

[0029] Temperature control system

[0030] PID control method applied

[0031] Provides a DC-based low-noise environment

[0032] AC-based economical option support

[0033] electrical insulation system

[0034] Surface-to-ground insulation: 100GΩ or higher

[0035] Surface-guard insulation: 5TΩ or higher

[0036] Provides an ultra-low noise environment (10pA or less)

[0037] cooling system

[0038] Supports air and water cooling methods

[0039] Temperature switching speed within 10 minutes (-50℃ *?* 250℃)

[0041] The present invention is a thermal chuck system that provides precise temperature control and a low-noise environment, enabling more precise reliability evaluation and characteristic analysis of semiconductor devices. Furthermore, it allows for rapid switching between various temperature environments, making it applicable in diverse industrial fields such as semiconductors, displays, and sensors.

[0043] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

Claim 1 A thermal chuck system capable of temperature control, characterized by being capable of temperature control from -50℃ to 399℃, providing a uniform temperature distribution over the entire wafer surface, having a temperature switching speed of within 10 minutes, maintaining a temperature fluctuation range within ±0.1℃, including a DC-based low-noise power supply system, and including a shielding structure that minimizes signal interference.

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