A tabernacle device, a tabernacle method, and a method for manufacturing an electronic device

Abstract

A film forming device (1) for forming a thin film on a substrate held in an electrostatic chuck through a mask (16) held in a mask frame (15) mounted on a mask stand (33) by means of a film forming material emitted from an evaporation source (5) within a chamber, wherein the mask stand (33) and the mask frame (15) are positioned by the coupling of a kinematic coupling, and the mask (16) is provided with a protrusion that is pressed when the mask frame (15) is positioned on the mask stand (33).

Description

Technology Field

[0001] The present invention relates to a film formation apparatus, a film formation method, and a method for manufacturing an electronic device. Background Technology

[0002] Organic EL displays are expanding their applications beyond smartphones, televisions, and automotive displays to include VR HMDs (Virtual Reality Head-Mount Displays). In particular, displays used in VR HMDs require high-precision pixel patterns to reduce user dizziness, and further increases in resolution are required.

[0003] In the manufacture of an organic EL display device, when forming an organic light-emitting element (organic EL element; OLED) constituting the organic EL display device, an organic layer or a metal layer is formed by depositing a film material emitted from a film source onto a substrate through a mask having a pixel pattern formed thereon.

[0004] Since film-forming material emitted from an evaporation source installed on the bottom surface of the vacuum chamber is deposited onto the substrate through a mask, film-forming material accumulates on the mask as the deposition process is repeated. Therefore, it is necessary to replace the mask after a predetermined number of film depositions on the substrate. At this time, it is necessary to remove the mask with the deposited film-forming material from the vacuum chamber and install a new mask at a predetermined location with high precision.

[0005] As a method for determining the position of a mask with high precision, kinematic coupling technology is known (see Patent Document 1). Several methods are known for kinematic coupling technology; for example, by installing a kinematic coupling in which three V-shaped grooves and a sphere are fitted together and constraining six degrees of freedom, high-precision positioning can be achieved. Prior art literature

[0006] Patent Document 1: Japanese Patent Publication No. 5-267116 The problem to be solved

[0007] Kinematic couplings enable high-precision positioning by properly engaging multiple locations. However, if a location is not properly engaged due to any influence, high-precision positioning cannot be achieved.

[0008] The objective of the present invention is to provide a film deposition apparatus, a film deposition method, and a method for manufacturing an electronic device that can increase the positioning precision of a mask. means of solving the problem

[0009] The film deposition apparatus of the present invention is a film deposition apparatus that forms a thin film on a substrate held in a substrate holding support member through a mask held in a mask holding support member placed on a mask plate, by means of a film deposition material released from a film deposition source within a chamber.

[0010] The above mask band and the mask holding support member are positioned by fitting together a plurality of kinematic mounts, and any one of the mask, the mask holding support member, the substrate, and the substrate holding support member is characterized by having a convex portion installed that is pressed when the mask holding support member is positioned on the mask band. Effects of the invention

[0011] As explained above, according to the present invention, the positioning precision of the mask can be increased. Brief explanation of the drawing

[0012] Figure 1 is a schematic diagram of a membrane formation apparatus according to Example 1. FIG. 2 is an enlarged view of a magnetic levitation stage according to Example 1. FIG. 3 is a top view of a magnetic levitation stage according to Example 1. FIG. 4 is a drawing showing a mask and a mask frame according to Example 1. Figure 5 is a drawing showing a mask band according to Example 1. FIG. 6 is an explanatory diagram regarding the fitting of a kinematic coupling according to Example 1. FIG. 7 is an explanatory diagram of the arrangement relationship between the kinematic coupling and the convex portion according to Example 1. FIG. 8 is an explanatory diagram of the arrangement relationship between the kinematic coupling and the convex portion according to Example 1. Figure 9 is an operation flow for Example 1. FIG. 10 is a diagram showing the force received by the magnetic levitation stage of Example 1 during mask suction. FIG. 11 is a control block diagram of a magnetic levitation stage according to Example 1. FIG. 12 is a diagram showing the controller configuration of each axis according to Example 1. FIG. 13 is a diagram illustrating the concept of force action during tracking control according to Example 1. FIG. 14 is a mask explanatory diagram for Example 2. FIG. 15 is a mask explanatory diagram for Example 2. Figure 16 is an explanatory diagram of an organic EL display device. Specific details for implementing the invention

[0013] With reference to the drawings below, embodiments for carrying out the present invention will be described in detail by way of example based on examples. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described in these embodiments are not intended to limit the scope of the present invention to these alone, unless specifically stated otherwise.

[0014] (Example 1)

[0015] With reference to FIGS. 1 to 4, a film deposition apparatus, a film deposition method, and a method for manufacturing an electronic device according to Example 1 of the present invention will be described. Meanwhile, the XYZ axes are shown in FIGS. 1 to 3. The Z-axis is an axis parallel to the vertical direction, and the XY axes are axes parallel to the horizontal direction and also orthogonal to each other.

[0016] Tabernacle apparatus

[0017] With reference to FIG. 1, a film deposition apparatus (1) according to the present embodiment will be described. FIG. 1 is a schematic diagram of the film deposition apparatus (1) according to Example 1, and schematically shows the configuration of the film deposition apparatus (1) viewed from the front. In FIG. 1, a magnetic levitation stage (2) as a stage is provided in the part enclosed by the dotted line. The magnetic levitation stage (2) is fixed to the corner or side upper part of the upper surface of the interior of the vacuum chamber as a chamber by a stage support (6). The vacuum chamber is composed of a vacuum chamber side (3), a vacuum chamber bottom (32), and a vacuum chamber top plate (11), and generally takes the configuration of a hexagon as a whole. A thin film is formed on a substrate through a mask (16) by the film deposition material emitted from an evaporation source (5) as a film deposition source installed on the vacuum chamber bottom (32). The mask (16) is configured to be attracted by a suction magnet (18) which is a magnet capable of moving up and down relative to the magnetic levitation stage (2) and has magnetic properties. Meanwhile, the suction magnet (18) is configured to be able to be raised and lowered by a lifting mechanism (18X). Various known technologies, such as a ball screw mechanism or a rack and pinion mechanism, can be employed for the lifting mechanism (18X). The magnetic levitation stage (2) is configured so that its position can be controlled based on the measurement result of a laser displacement meter (17) installed on the mask base (33). In addition, the film deposition device (1) has a control unit (35). The control unit (35) has the function of controlling various mechanisms and the evaporation source (5), and controlling the film deposition. The control unit (35) can be configured, for example, by a computer having a processor, memory, storage, I / O, etc. In this case, the function of the control unit (35) is realized by the processor executing a program stored in memory or storage. As the computer, a general-purpose PC may be used, or an embedded computer or a PLC (programmable logic controller) may be used.Alternatively, some or all of the functions of the control unit (35) may be configured with a circuit such as an ASIC or FPGA. Meanwhile, a control unit (35) may be installed for each film deposition device (1), or one control unit (35) may control multiple film deposition devices (1).

[0018] Next, the configuration of the vibration isolation support member on the air side is described. The vibration isolation platform (9a, 9b) is placed on the vacuum chamber top plate (11) via the vibration isolation platform base (10a, 10b). The support frame (8) is supported by the vibration isolation platform (9a, 9b), thereby suppressing vibrations transmitted from the vacuum chamber. Additionally, the mask stand (33) is supported within the vacuum chamber by the mask support posts (13a, 13b) that move up and down by the mask guide mechanism (12a, 12b) installed on the support frame (8). The mask frame (15), serving as a mask holding support member, is brought into the device by an unillustrated robot hand and placed on the mask stand (33).

[0019] When a robot hand moves in and out of the device to bring a mask frame (15) or a substrate into the device, the mask band (33) is lowered by the mask guide mechanism (12a, 12b) to a position that does not interfere with the movement of the robot hand. When the mask guide mechanism (12a, 12b) is raised, the bellows (14a, 14b) extend and retract. The vacuum state inside the room is maintained by these bellows (14a, 14b).

[0020] On the other hand, if the positioning precision of the robot hand or the positional misalignment during the placement of items such as masks is significant, a rotary translation mechanism may be required in addition to vertical movement to place the masks within the camera's field of view. Since this is a known technology, a detailed explanation is omitted.

[0021] Additionally, the alignment cameras (7a, 7b) are also supported by the support frame (8). As a result, high-precision measurement is possible because vibrations transmitted from the vacuum chamber are suppressed in the alignment cameras (7a, 7b). A viewport for alignment measurement is installed on the top plate of the chamber (11), allowing alignment measurement to be performed from the atmospheric side. Meanwhile, by using the transmitted light of the illumination (24a, 24b) installed on the lower surface of the mask stand (33), alignment marks (102a, 102b, 102c, 102d) (see FIG. 4) are captured by the alignment cameras (7a, 7b). Four alignment cameras and illuminations are installed, including those not shown, and are configured to detect the position of the alignment marks formed on the substrate.

[0022] Maglev Stage

[0023] Using FIGS. 2 and FIGS. 3, the magnetic levitation stage (2) will be described. FIGS. 2 is an enlarged view of the magnetic levitation stage (2) in FIGS. 1, and FIGS. 3 is a view of the magnetic levitation stage (2) from the top surface. Meanwhile, FIGS. 3 also shows a stator installed on a stage support (6) and an attraction magnet (18) in order to clarify the positional relationship between the movable and the stator.

[0024] The magnetic levitation stage (2) is equipped with a stage frame (31) and, fixed to the stage frame (31), a magnetic weight compensation magnetic actuator (22a, 22b, 22c, 22d) and a linear motor actuator (20a, 20b, 20c, 20d). The magnetic weight compensation magnetic actuator (22a, 22b, 22c, 22d) serves to support the magnetic levitation stage (2) in a non-contact state with respect to the stage support (6) in order to offset the magnetic weight of the magnetic levitation stage (2). The linear motor actuator (20a, 20b, 20c, 20d) has the role of exerting thrust to move the magnetic levitation stage (2) in a non-contact state with respect to the stage support (6). Additionally, an electrostatic chuck (25) serving as a substrate holding support member is fixed to the lower surface of the magnetic levitation stage (2). With this electrostatic chuck (25), the substrate (27) to be formed can be adsorbed in a face-down state (the surface to be formed is facing downward).

[0025] On the lower surface of the stage support (6), a self-weight compensating magnet stator (23a, 23b, 23c, 23d) is fixed opposite to the above-mentioned self-weight compensating magnet movables (22a, 22b, 22c, 22d). Between the self-weight compensating magnet movables and the stator, a magnetic force corresponding to the self-weight of the magnetic levitation stage (2) is configured to be generated, and the magnetic levitation stage (2) is supported on the stage support (6) in a non-contact state.

[0026] Additionally, on the lower surface of the stage support (6), linear motor stators (21a, 21b, 21c, 21d) are fixed opposite to the above linear motor actuators (20a, 20b, 20c, 20d). A thrust force is generated to move the magnetic levitation stage (2) by a change in the current value flowing through the coils embedded in these linear motor stators (21a, 21b, 21c, 21d). Meanwhile, in the vertical direction, since the magnetic weight of the magnetic levitation stage (2) is offset by the above magnetic weight compensation magnet, the thrust force generated by the linear motor may be small. Therefore, since the amount of current flowing may be small, the amount of heat generated by the current flowing is small, and there is no problem of deformation or damage to each component due to heat. However, if necessary, each coil may be covered with a water-cooling jacket and actively cooled by flowing a refrigerant.

[0027] Linear motor actuators (20a, 20b, 20c, 20d) are positioned at four corners on the upper surface of the stage frame (31). By doing so, translational driving in the XY direction and rotational driving around the Z-axis of the magnetic levitation stage (2) are possible. Additionally, by positioning at least three linear motors (not shown) that generate thrust in the Z-axis direction, it is possible to move the magnetic levitation stage (2) in six degrees of freedom. In this embodiment, the magnetic levitation stage (2) is configured to move in six degrees of freedom by linear motors positioned at a total of seven locations. Furthermore, magnetic weight compensation magnet actuators (22a, 22b, 22c, 22d) are positioned at four locations symmetrically around the center of the magnetic levitation stage (2). By doing so, moment force can be applied, thereby enabling stable levitation of the magnetic levitation stage (2).

[0028] Alignment device

[0029] The alignment mechanism (positioning mechanism) between the substrate (27) and the mask (16) will be described. The relative position of the magnetic levitation stage (2) to the mask plate (33) is measured by a laser displacement meter (17). This laser displacement meter (17) is positioned at a total of six locations, including two locations in the X direction, one location in the Y direction, and three locations in the Z direction. Based on the information from the laser displacement meters (17) positioned at the six locations, geometric coordinate transformation is performed and converted into six positions of freedom around the center of the magnetic levitation stage (2). Based on the position information of the six degrees of freedom, control calculations are performed, and thrust commands for the six degrees of freedom are determined. By flowing current through the coils of each linear motor positioned at seven locations based on the thrust commands for the six degrees of freedom and moving the magnetic levitation stage (2), it is possible to position the magnetic levitation stage (2) with high precision relative to the mask plate (33).

[0030] Additionally, the laser displacement meter (17) is fixed near the mask (16) on the mask stand (33). By doing so, the position of the mask (16) and the substrate (27) can be determined directly without being affected by Abbe errors or the like in a vacuum environment. Furthermore, the laser displacement meter (17) is able to perform stable measurements because vibrations from the vacuum chamber are suppressed by the vibration isolation stand (9a, 9b) on which the support frame (8) is mounted through the mask stand (33). In addition, the magnetic levitation stage (2) is supported by a non-contact, low-magnetic spring-like self-weight compensation magnet, and is in a state where vibrations from the vacuum chamber are suppressed. With the above configuration, the relative position between the magnetic levitation stage (2) and the mask stand (33) can be determined with high precision, and as a result, high-precision alignment of the substrate (27) and the mask (16) becomes possible.

[0031] <Mask and Substrate>

[0032] The mask (16) and substrate (27) are described in more detail. The mask (16) is configured such that through holes corresponding to pixel patterns are installed at equal intervals in multiple locations, and a film-forming material passing through the through holes forms a film on the surface of the substrate (27). The material of the mask (16) is composed of, for example, a metal foil resistant to thermal expansion such as Invar, or a thin membrane film formed from a Si wafer. The mask (16) is fixed to a mask frame (15) serving as a mask holding support member, and is transported by a robot hand for each frame and placed on a mask stand (33). Various known techniques can be employed for fixing the mask (16) and the mask frame (15), such as fixing by spot welding in a tensioned state, mechanical clamping, or fixing by adhesive. It is desirable to ensure that the mask (16) does not twist during fixing.

[0033] The substrate (27) is supported by an electrostatic chuck (25) serving as a substrate support member. Additionally, a suction magnet (18) is configured to be accessible in a non-contact range on a surface opposite to the adsorption surface of the electrostatic chuck (25), and is configured to generate a magnetic flux necessary for the suction of the mask (16). The electrostatic chuck (25) and the substrate (27) are non-magnetic materials, and it is possible to generate a suction force that pulls the mask (16) vertically upward by the magnetic flux of the suction magnet (18). By this suction force, the mask (16) can be adhered to the substrate (27). By ensuring adhesion, it is possible to prevent the film material from being pushed back (shadow) during film formation.

[0034] <Determining the position of the mask relative to the mask stand>

[0035] With reference to FIGS. 4 to 8, the positioning of the mask (16) relative to the mask band (33) will be explained. FIG. 4 is a drawing showing the mask (16) and mask frame (15) according to the present embodiment, (a) of the same drawing is a side view of the mask (16) and mask frame (15), (b) of the same drawing is a top view of the mask (16) and mask frame (15), and (c) of the same drawing is a bottom view of the mask (16) and mask frame (15).

[0036] On the lower surface of the mask frame (15), a plurality of seats (100) (100a, 100b, 100c) as hemispherical parts constituting a kinematic coupling are installed at multiple locations (specifically, three locations). It is preferable that these seats (100a, 100b, 100c) be arranged at 120° equal intervals based on the center of the mask (16) (in this embodiment, the center of the mask (16) coincides with the center of the mask frame (central point in the plan view)), or installed at positions corresponding thereto. On the upper surface of the mask (16), convex parts (101) (101a, 101b, 101c) are installed. In addition, alignment marks (102a, 102b, 102c, 102d) are installed on the mask (16), and as described above, are captured by an alignment camera during alignment.

[0037] FIG. 5 is a drawing showing a mask base (33) according to the present embodiment, where (a) of the same drawing is a side view of the mask base (33) and (b) of the same drawing is a top view of the mask base (33). On the top surface of the mask base (33), a plurality of grooves constituting a kinematic coupling are installed (specifically, three locations). These grooves are composed of V-grooves (110) (110a, 110b, 110c) having a pair of sides that become narrower as they face the bottom of the groove.

[0038] As described above, in this embodiment, a seat (100) constituting a kinematic coupling is installed on the lower surface of a mask frame (15), and a groove (V-groove (110)) is installed on the upper surface of a mask base (33). When a mask (16) is placed on the mask base (33), the seat (100) is fitted into the V-groove (110), thereby forming a kinematic coupling in which the six degrees of freedom of the mask frame (15) and the mask base (33) are positioned relatively, and positioned with high precision. Meanwhile, in this embodiment, although a configuration is shown in which a seat (100) is installed on the mask frame (15) and a groove is installed on the mask base (33), a configuration in which a seat constituting a kinematic coupling is installed on the mask base (33) and a groove constituting a kinematic coupling is installed on the mask frame (15) may also be adopted. In addition, in this embodiment, the configuration of the seat and the V-groove portion is shown as the kinematic coupling, but the kinematic coupling is not limited to this configuration and other known technologies may be adopted.

[0039] Meanwhile, in this embodiment, the mask band (33) has lights (24a, 24b, 24c, 24d) embedded therein. In this embodiment, the lights (24a, 24b, 24c, 24d) illuminate the alignment marks (102a, 102b, 102c, 102d), and alignment is performed by photographing the transmitted light. As the alignment method using alignment marks is a known technology, the description thereof is omitted.

[0040] As described above, when film formation on the substrate (27) is repeated, film formation material accumulates on the mask (16), so it is necessary to replace the mask (16) every time a predetermined number of film formations are performed on the substrate (27). As explained with reference to FIG. 1, by lowering the mask stand (33) together with the mask support posts (13a, 13b) by the mask guide mechanism (12a, 12b), the gap between the electrostatic chuck (25) holding and supporting the substrate (27) and the mask stand (33) can be widened. In that state, a robot hand not shown enters the device, the mask frame (15) is removed from the mask stand (33), and a new mask frame (15) is placed on the mask stand (33).

[0041] FIG. 6 presents an example of a kinematic coupling in a fitted state (a fitted state of the seat (100) and the V-groove portion (110). By making the V-groove portion (110) of the kinematic coupling and the seat (100) touch at two contact points (120a, 120b) (see FIG. 6 (a)), six degrees of freedom are positioned, allowing the mask frame (15) and mask (16) to be positioned with high precision relative to the mask plate (33). However, when the mask frame (15) is placed in the robot hand, depending on the positioning precision of the transport robot, there may be a case where the V-groove portion (110) and the seat (100) touch at one contact point (120c), as shown in FIG. 6 (b). It is preferable to apply a coating to reduce the friction coefficient on the surface of the V-groove (110) and the seat (100) so that from the one-point contact state shown in FIG. 6 (b), the mask frame (15) slides due to its own weight and becomes the two-point contact state shown in FIG. 6 (a).

[0042] However, even if coating is applied, there may be cases where the one-point contact state shown in FIG. 6(b) is achieved due to wear of the coating, etc. Accordingly, in this embodiment, a method is adopted in which the kinematic coupling is properly engaged (the seat (100) and the V-groove portion (110) are properly engaged) even if the mask frame (15) does not slide due to its own weight and does not reach the state shown in FIG. 6(a). That is, in this embodiment, a configuration is adopted in which the convex portion (101) installed on the upper surface of the mask (16) is pressed when the mask frame (15) is positioned on the mask base (33), thereby allowing the state shown in FIG. 6(a) to be achieved even if the mask frame (15) does not slide due to its own weight. This point will be explained in more detail below.

[0043] FIG. 7 is a diagram illustrating the arrangement relationship between the kinematic coupling and the convex portion. (a) is a plan view of the mask, etc., and (b) is a side view of the mask, etc. Meanwhile, FIG. 4 shows a case where the outer shape of the mask frame (15) and the mask (16) have almost the same dimensions, but FIG. 7 shows a case where the outer size of the mask frame (15) is configured to be larger than the outer size of the mask (16). The convex portion (101) (101a, 101b, 101c) installed on the upper surface of the mask (16) is positioned so as to be offset toward the center (G) of the mask (16) than the kinematic coupling (seat (100) and V-groove portion (110)). More specifically, a convex portion (101) is disposed within a triangular area (see the grid-shaped hatching portion in FIG. 7 (a)) connecting the ends of the center (G) of the mask and the center (G) at the ends of the groove width direction of a pair of sides of the V-groove portion (110) when viewed in a direction perpendicular to the surface of the mask (16).

[0044] If the convex portion (101S) is positioned on the side opposite to the center (G) of the mask with respect to the kinematic coupling (see FIG. 8 (a)), when a pressure force (FS) is applied to the convex portion (101S) toward the mask band (33), a moment (MS) is applied in the direction that the seat (100) moves away from the V-groove portion (110). As a result, there is a risk that the fitting between the seat (100) and the V-groove portion (110) will become unstable. Therefore, it is preferable to position the convex portion (101) on the side of the center (G) of the mask rather than the kinematic coupling.

[0045] In addition, even if the convex portion is positioned on the center (G) side of the mask rather than the kinematic coupling, if the convex portion (101T) is positioned on the outer side in the width direction (R) of the grid-shaped hatching area shown in FIG. 7 (a) (see FIG. 8 (b)), when a pressure force (FT) is applied toward the convex portion (101T) toward the mask base (33), a moment (MT) is applied in the direction in which the seat (100) separates from the V-groove portion (110). As a result, there is a risk that the fitting between the seat (100) and the V-groove portion (110) will become unstable. Therefore, it is preferable that the convex portion (101) be positioned within the range of the width direction (R) mentioned above. Accordingly, as shown in FIG. 8 (b), when a pressure (F) is applied toward the mask band (33) with respect to the convex portion (101), the seat (100) can be moved toward the bottom of the V-groove portion (110).

[0046] As described above, it is preferable to place the convex portion (101) within the grid-shaped hatching portion of FIG. 7 (a). Furthermore, in this embodiment, as shown in FIG. 7 (a), a configuration is adopted in which the center (G) of the mask (16) and the convex portion (101) are aligned on a straight line where a pair of sides in the V-groove portion (110) intersect. By doing so, when a pressure is applied to the convex portion (101) toward the mask base (33), the seat (100) can be moved more reliably toward the bottom of the V-groove portion (110). That is, it is possible to transition more reliably from the state shown in FIG. 6 (b) to the state shown in FIG. 6 (a).

[0047] Meanwhile, in this embodiment, a configuration is shown in which the convex portion (101) is installed on the mask (16). However, a configuration in which the convex portion that performs the same function is installed on a member other than the mask (16) may also be adopted. For example, a configuration in which the convex portion (101) is installed on the mask frame (15) may be adopted, such as the convex portions (101ax, 101bx, 101cx) shown in FIG. 7 (a). In addition, a configuration in which the convex portion (101) is installed on the substrate (27) may be adopted, such as the convex portion (101by) shown in FIG. 7 (b). In addition, a configuration in which the convex portion (101) is installed on the electrostatic chuck (25) may be adopted, such as the convex portions (101az, 101cz) shown in FIG. 7 (c). Of course, even when a convex portion (101) is installed on any one of the mask frame (15), substrate (27), and electrostatic chuck (25), it is preferable that the convex portion (101) be placed within the grid-shaped hatching portion of FIG. 7 (a).

[0048] As described above, in the film forming device (1) according to the present embodiment, the convex portion (101) is pressed when the mask frame (15) is positioned on the mask base (33). That is, the control unit (35) performs control to press the convex portion (101) when the mask frame (15) is positioned on the mask base (33). More specifically, the control unit (35) performs tracking control to fit the kinematic coupling by pressing the convex portion (101) when the mask frame (15) is positioned on the mask base (33) according to the movement of the magnetic levitation stage (2). In addition, during this tracking control, the control unit (35) determines the fitting state of the kinematic coupling based on the position of the magnetic levitation stage (2), thereby ensuring that the seat (100) and the V-groove portion (110) are fitted more reliably.

[0049] Operation Flow

[0050] Referring to FIG. 9, the operation flow from introducing a substrate (27) into a vacuum chamber and holding it in an electrostatic chuck (25) until film deposition (deposition) is performed will be explained. Meanwhile, in the following description, the rotation axis around the X-axis will be the ωX-axis, the rotation axis around the Y-axis will be the ωy-axis, and the rotation axis around the Z-axis will be the ωz-axis. Furthermore, in the flow shown in FIG. 9, the case where impedance control is adopted as an example of tracking control will be explained.

[0051] <<Step S1>>

[0052] To replace the mask (16), the mask stand (33) that was lowered is raised to a predetermined position.

[0053] <<Step S2>>

[0054] The control mode of the magnetic levitation stage (2) is switched, for example, to torque control for the Z-axis and impedance control for the ωx and ωy axes, and the substrate (27) is followed by the convex portions (101a, 101b, 101c) installed on the upper surface of the mask (16) and pressed with a predetermined force (pressing process). By doing so, the substrate (27) can be followed by all three points on the convex portions on the upper surface of the mask (16).

[0055] <<Step S3>>

[0056] When the substrate (27) is tracked by the convex portions (101a, 101b, 101c), it is determined whether the coordinates of the Z-axis, ωX-axis, and ωY-axis of the magnetic levitation stage (2) are all within a predetermined range or outside the range. If all are within the range, it is determined that all three kinematic couplings are in a two-point contact state (a state shown in FIG. 6), and the process proceeds to step S5. If one or more are outside the range, it is determined that at least one of the kinematic couplings is in a one-point contact state (e.g., a state shown in FIG. 6, b), and the process proceeds to step S4. Thus, in step S3, the mating state of the kinematic couplings is determined based on the position of the magnetic levitation stage (2) during tracking control.

[0057] <<Step S4>>

[0058] The ωX and ωy axes are changed to position control mode, and with the magnetic levitation stage (2) returned to a horizontal position, the pressing force of the Z-axis torque control is increased by a predetermined amount and the mask is pressed. After that, the pressing force of the Z-axis torque control is returned to the initial setting value, and the process returns to step S2, and the same operation is performed again. In step S3, the same operation is repeated until it is determined that the coordinates of the Z-axis, ωX-axis, and ωy-axis of the magnetic levitation stage (2) are all within a predetermined range. By doing so, a two-point contact state can be achieved at all three kinematic couplings.

[0059] <<Step S5>>

[0060] When the substrate (27) is tracked to the convex portions (101a, 101b, 101c), the coordinates of the Z-axis, ωX-axis, and ωY-axis of the magnetic levitation stage (2) are stored. The Z-axis, ωX-axis, and ωY-axis are changed to a position control mode, the stored coordinates of the ωX-axis and ωY-axis are maintained, and the Z-axis is moved to a position that is raised by a predetermined amount from the stored coordinates. By doing so, regardless of individual differences between the substrate (27) and the mask (16), a high-precision parallelism and gap can be created between the substrate (27) and the mask (16), and alignment is performed in a non-contact state. Through this alignment, position adjustment of the mask (16) and the substrate (27) is performed in a direction parallel to the horizontal direction (X direction and Y direction) without accompanying rotation of the substrate (27) around the ωX-axis and ωY-axis.

[0061] <<Step S6>>

[0062] The control mode of the magnetic levitation stage (2) is switched, for example, to torque control for the Z-axis and impedance control for the ωx and ωy axes, and the substrate (27) is followed by the convex portions (101a, 101b, 101c) installed on the upper surface of the mask (16), and alignment is performed while pressing with a predetermined force. As a result, alignment is performed with the gap between the substrate (27) and the mask (16) narrower than in step S5, so higher precision alignment is possible. When the substrate (27) is followed by the convex portions (101a, 101b, 101c), the substrate (27) and the mask (16) are parallel. Therefore, alignment can be performed by switching the ωx and ωy axes to position control mode while pressing with a predetermined force in torque control for the Z-axis.

[0063] <<Step S7>>

[0064] As described above, in this embodiment, the substrate (27) and the mask (16) are aligned in a non-contact state (Step S5), and then a more fine alignment is performed with the substrate (27) and the mask (16) in a slightly contact state (Step S6). Then, in Step S7, the suction magnet (18) is lowered so that the substrate (27) and the mask (16) are in complete contact state, and a film deposition is performed (film deposition process).

[0065] In this embodiment, depending on the position of the suction magnet (18), the Z-axis torque of the magnetic levitation stage (2) is changed, and the suction magnet (18) is lowered to suction the mask (16) and press it against the substrate (27), after which deposition is performed. The reason for changing the Z-axis torque in this way is explained. When the suction magnet (18) is lowered and sucks in the mask (16), the magnetic levitation stage (2) receives a force from the mask (16) and is pushed back. An example of the relationship between the position of the suction magnet (18) and the force received by the magnetic levitation stage (2) from the mask (16) is shown in FIG. 10 (a). Also, FIG. 10 (b) is an explanatory diagram of the force received by the magnetic levitation stage (2) from the mask (16) and is a schematic diagram showing the magnetic levitation stage (2), etc. As can be seen from this drawing, since the suction magnet (18) sucks the mask (16) upward, the force (F) that the magnetic levitation stage (2) receives from the mask (16) depending on the position of the suction magnet (18) M ) changes. And, the force (F) of the magnetic levitation stage (2) pressing the mask frame (15) becomes weaker than the Z-axis torque (Fz) of the stage as in the following equation (1).

[0066] F=Fz-F M (1)

[0067] The force (F) that the magnetic levitation stage (2) receives from the mask (16) MWhen the Z-axis torque (Fz) of the stage becomes larger than the magnetic levitation stage (2), the magnetic levitation stage (2) may detach from the mask frame (15), so it is desirable to change the Z-axis torque of the magnetic levitation stage (2). Accordingly, it is desirable to store in advance in memory, etc., a relationship equation or table between the position of the suction magnet (18) and the force received by the magnetic levitation stage (2) from the mask (16) (equivalent to the contact force between the substrate (27) and the mask (16)), and for the control unit (35) to change the Z-axis torque of the magnetic levitation stage (2) according to the position of the suction magnet (18). That is, it is preferable to store in advance the relationship between the position of the suction magnet (18) and the contact force between the substrate (27) and the mask (16), and for the control unit (35) to change the Z-axis torque (Fz) based on this relationship so that the force (F) of contacting the substrate (27) and the mask frame (15) by the magnetic levitation stage (2) becomes constant. Additionally, if the alignment between the substrate (27) and the mask (16) is misaligned during the process of the suction magnet (18) descending, alignment may be performed at a position while the suction magnet (18) is descending, provided that the mask (16) is not yet in close contact with the substrate (27).

[0068] As mentioned above, the flow shown in FIG. 9 illustrates the case where impedance control is adopted as the tracking control; however, for the tracking control, a control other than impedance control may be adopted. Below, with reference to FIGS. 11 to 13, other examples of tracking control will be explained. Here, an example is described in which a thrust command based on the speed of the magnetic levitation stage (2) is executed, and feedback control is performed by adding a predetermined force to the thrust command. FIG. 11 shows the control block of the magnetic levitation stage (2). The output of the 6-degree-of-freedom controller is coordinate-transformed into the thrust of each linear motor, thrust is applied to the magnetic levitation stage (2), and the position detected by the laser displacement meter is coordinate-transformed into the 6-degree-of-freedom position and fed back, thereby performing position control of the magnetic levitation stage (2). FIG. 12 shows the controller configuration for each axis. The controller for each axis is configured as a PID control consisting of the sum of the value obtained by multiplying the position proportional gain (Kp), the value obtained by multiplying the position integral value by the integral gain (Ki), and the value obtained by multiplying the position derivative value by the derivative gain (Kd), so that only the Z-axis can have the torque command shown in FIG. 12 added. When the substrate (27) is tracked to the convex portions (101a, 101b, 101c) of the mask (16), the proportional gain (Kp) and integral gain (Ki) of the Z-axis, ωx, and ωy axes are set to zero. By doing so, a feedback control mode for the derivative of the position, that is, the speed, is achieved. FIG. 13 illustrates the concept of force action during tracking control. When the torque command (F) is added to cause the Z-axis to descend, initially, as shown in (a) of the same figure, the speed is zero and only a downward force (F) is applied. After that, the magnetic levitation stage (2) begins to move downward, and when the speed command is set to zero, a force (Fr) acts in the reverse direction (upward direction) of the speed as shown in (b) of the same drawing, and after the balance between this reverse force and the torque command is achieved, it descends at an inertial speed (V).When the substrate (27) and the mask (16) come into contact, the speed becomes zero again, so only the torque command (F) can be applied to the mask (16), as shown in (c) of the same drawing. Since no torque command is given to the ωx and ωy axes, the ωx and ωy axes are tilted and a tracking operation is performed so that the force is evenly distributed to the convex parts (101a, 101b, 101c) of the mask (16).

[0069] As described above, according to the film deposition apparatus (1) and film deposition method of the present embodiment, the positioning precision of the mask frame (15) and mask (16) relative to the mask band (33) can be improved. Accordingly, the film deposition precision on the substrate (27) can be increased.

[0070] (Example 2)

[0071] FIGS. 14 and 15 illustrate Example 2 of the present invention. Example 1 shows a configuration in which a convex portion is installed on a mask. In contrast, the present embodiment shows a configuration in which a convex portion is installed on a mask frame, and an opening is installed in the mask to allow the convex portion to be inserted. Since other configurations and operations are the same as in Example 1, descriptions of identical components are appropriately omitted.

[0072] FIG. 14 is a drawing showing a mask and a mask frame according to Example 2, where (a) of the same drawing is a top view and (b) of the same drawing is a side view. FIG. 15 is a side view of a substrate, a mask, and a mask frame according to Example 2, and is a drawing showing the state in which the mask is attracted to a magnet.

[0073] In this embodiment, a mask (403) is fixed to a mask frame (401) serving as a mask holding support member. In this embodiment, the outer periphery of the mask frame (401) and the mask (403) is fixed by a joint (404). Additionally, in this embodiment as well, a plurality of seats (402) (402a, 402b, 402c) serving as hemispherical parts constituting a kinematic coupling are installed on the lower surface of the mask frame (401) (specifically, three locations).

[0074] In this embodiment, a convex portion (405) (405a, 405b, 405c) is installed on the upper surface of the mask frame (401). Additionally, an opening (406) (406a, 406b, 406c) is installed in the mask (403) so as to allow the convex portion (405) to be inserted without contacting the convex portion (405). The opening (406) is sized to ensure sufficient clearance so that the mask (403) and the convex portion (405) remain non-contacting. The convex portion (405) is positioned closer to the center of the mask than the joint portion (404) installed on the outer periphery of the mask, and the opening (406) is installed in accordance with the position of the convex portion (405).

[0075] FIG. 15 shows a state in which a convex portion (405) installed on a mask frame (401) contacts a substrate (407) that is held and supported by an electrostatic chuck (408) serving as a substrate holding and supporting member. In the state shown in FIG. 14 (b), when the convex portion (405) is in contact with the substrate (407), the gap between the substrate (407) and the upper surface of the mask frame (401) is managed by the convex portion (405). In that state, as the suction magnet (not shown) descends, the mask (403) is sucked in and adheres to the substrate (407), resulting in the state shown in FIG. 15. In the case of this embodiment, by installing a convex portion (405) on a mask frame (401) that is easier to secure rigidity and flatness compared to the mask (403), the relative height precision of the convex portion (405) can be easily managed, and the gap amount between the substrate (407) and the mask (403) can be managed with higher precision. In addition, by installing an opening (406) in the mask (403), the convex portion (405) does not come into contact with the mask (403), so it does not hinder the deformation of the mask (403). As a result, the adsorption of the mask (403) onto the substrate (407) can be performed without damaging the alignment precision of the mask (403) and the substrate (407) that is performed before the mask (403) is adsorbed.

[0076] Meanwhile, although the present embodiment shows a configuration in which the convex portion is installed on the mask frame (401), a configuration in which the convex portion is installed on the substrate (407) or the electrostatic chuck (408) may also be adopted. In this case as well, the mask (403) may be provided with an opening configured to allow the convex portion to be inserted without contacting the convex portion. If such a configuration is adopted, the convex portion does not contact the mask (403) but contacts the mask frame (401). Even if such a configuration is adopted, the same effect as in the present embodiment can be obtained.

[0077] Meanwhile, in Examples 1 and 2, the number of convex parts is set to three so that the contact point between the substrate and the mask frame is reproduced on a single plane. This allows the gap amount between the substrate and the mask to be managed with high precision. However, when a configuration in which deformation due to the self-weight of the substrate and the mask frame is large is adopted, it is not necessary to set the number of convex parts to three; instead, four or more convex parts may be installed to suppress the collapse of the flatness of the substrate and the mask frame due to deformation due to self-weight.

[0078] Method for manufacturing an electronic device

[0079] An example of a method for manufacturing an electronic device using a film-forming device (1) according to each of the above embodiments is described. Hereinafter, the configuration and manufacturing method of an organic EL display device are exemplified as an example of an electronic device. First, the organic EL display device to be manufactured is described. FIG. 16 (a) is an overall view of the organic EL display device (560), and FIG. 16 (b) shows a cross-sectional structure of a pixel.

[0080] As shown in FIG. 16(a), in the display area (561) of the organic EL display device (560), a plurality of pixels (562) each having a plurality of light-emitting elements are arranged in a matrix shape. Although details will be explained later, each light-emitting element has a structure having an organic layer fitted between a pair of electrodes. Meanwhile, the pixel referred to here refers to a minimum unit that enables the display of a desired color in the display area (561). In the case of the organic EL display device according to the present embodiment, the pixel (562) is composed of a combination of a first light-emitting element (562R), a second light-emitting element (562G), and a third light-emitting element (562B) that exhibit different light emission. The pixel (562) is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0081] FIG. 16(b) is a partial cross-sectional schematic diagram along line AB of FIG. 16(a). The pixel (562) has an organic EL element having a first electrode (anode) (564), a hole transport layer (565), one of a light-emitting layer (566R, 566G, 566B), an electron transport layer (567), and a second electrode (cathode) (568) on a substrate (563). Among these, the hole transport layer (565), the light-emitting layer (566R, 566G, 566B), and the electron transport layer (567) correspond to organic layers. In addition, in this embodiment, the light-emitting layer (566R) is an organic EL layer that emits red light, the light-emitting layer (566G) is an organic EL layer that emits green light, and the light-emitting layer (566B) is an organic EL layer that emits blue light. The light-emitting layers (566R, 566G, 566B) are formed in a pattern corresponding to a light-emitting element (which may also be described as an organic EL element) that emits red, green, and blue light, respectively. Additionally, the first electrode (564) is formed separately for each light-emitting element. The hole transport layer (565), the electron transport layer (567), and the second electrode (568) may be formed in common with a plurality of light-emitting elements (562R, 562G, 562B) or may be formed for each light-emitting element. Meanwhile, an insulating layer (569) is installed between the first electrode (564) and the second electrode (568) to prevent short circuits caused by foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture or oxygen, a protective layer (570) is installed to protect the organic EL element from moisture or oxygen.

[0082] In FIG. 16(b), the hole transport layer (565) or the electron transport layer (567) is shown as a single layer, but depending on the structure of the organic EL display element, it may be formed as a plurality of layers including a hole block layer or an electron block layer. Additionally, a hole injection layer having an energy band structure that allows for smooth injection of holes from the first electrode (564) to the hole transport layer (565) may be formed between the first electrode (564) and the hole transport layer (565). Likewise, an electron injection layer may also be formed between the second electrode (568) and the electron transport layer (567).

[0083] Next, an example of a method for manufacturing an organic EL display device will be described in detail. First, a circuit (not shown) for driving the organic EL display device and a substrate (563) having a first electrode (564) formed thereon are prepared.

[0084] An acrylic resin is formed by spin coating on a substrate (563) on which a first electrode (564) is formed, and an insulating layer (569) is formed by patterning the acrylic resin by lithography so that an opening is formed in the portion where the first electrode (564) is formed. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0085] A substrate (563) with an insulating layer (569) patterned on it is introduced into a first film deposition device, the substrate is supported by a substrate support unit, and a hole transport layer (565) is deposited as a common layer on the first electrode (564) of the display area. The hole transport layer (565) is deposited by vacuum deposition. In practice, since the hole transport layer (565) is formed in a size larger than the display area (561), a high-precision mask is unnecessary.

[0086] Next, the substrate (563) formed up to the hole transport layer (565) is introduced into the second film-forming device and held and supported by the substrate support unit. Alignment of the substrate and the mask (first alignment and second alignment) is performed, the substrate is placed on the mask, and a red-emitting light-emitting layer (566R) is formed on the portion of the substrate (563) where the red-emitting element is placed.

[0087] Similar to the formation of the light-emitting layer (566R), a light-emitting layer (566G) emitting green is formed by a third forming device, and a light-emitting layer (566B) emitting blue is further formed by a fourth forming device. After the formation of the light-emitting layers (566R, 566G, 566B) is completed, an electron transport layer (567) is formed over the entire display area (561) by a fifth forming device. The electron transport layer (567) is formed as a layer common to the three-color light-emitting layers (566R, 566G, 566B).

[0088] The substrate formed up to the electron transport layer (567) is moved to a sputtering device to form a second electrode (568), and then moved to a plasma CVD device to form a protective layer (570), thereby completing the organic EL display device (560).

[0089] When a substrate (563) with an insulating layer (569) patterned on it is introduced into a film-forming device and the film-forming of a protective layer (570) is completed, if it is exposed to an atmosphere containing moisture or oxygen, there is a risk that the light-emitting layer made of organic EL material will deteriorate due to moisture or oxygen. Therefore, in this example, the introduction and removal of the substrate between film-forming devices is carried out under a vacuum atmosphere or an inert gas atmosphere. Explanation of the symbols

[0090] 1: Tabernacle device; 2: Magnetic levitation stage; 5: Evaporator; 6: Stage support; 15: Mask frame; 16: Mask; 18: Suction magnet; 18X: Lifting mechanism; 25: Electrostatic chuck; 27: Substrate; 31: Stage frame; 33: Mask stand; 35: Control unit; 100: Seat; 101: Convex part; 110: V-groove part; 401: Mask frame; 402: Seat; 403: Mask; 405: Convex part; 406: Opening; 407: Substrate; 408: Electrostatic chuck; G: Center

Claims

Claim 1 A film deposition apparatus for forming a thin film on a substrate held in a substrate holding support member through a mask held in a mask holding support member placed on a mask plate, by means of a film deposition material emitted from a film deposition source within a chamber, wherein the mask plate and the mask holding support member are positioned by the fitting of a kinematic coupling, and any one of the mask, the mask holding support member, the substrate, and the substrate holding support member has a convex portion installed that is pressed when the mask holding support member is positioned on the mask plate. Claim 2 A film forming apparatus according to claim 1, characterized in that it comprises a stage for moving the substrate holding support member and adjusting the relative positions of the substrate and the mask, and, as the stage moves, the convex portion is compressed so as to perform tracking control for fitting the kinematic coupling. Claim 3 A membrane forming device according to paragraph 2, characterized in that, during the tracking control, the fitting state of the kinematic coupling is determined based on the position of the stage. Claim 4 A film forming device according to paragraph 2, characterized in that, in the tracking control, a thrust command based on the speed of the stage is performed, and a feedback control is performed to add a predetermined force to the thrust command. Claim 5 A film forming apparatus according to claim 2, comprising a magnet that sucks the mask through the substrate and a lifting mechanism that raises the magnet, wherein when the mask is sucked by the magnet, the force of contact between the substrate and the mask by the stage is changed according to the position of the magnet that is raised by the lifting mechanism. Claim 6 A film deposition apparatus according to claim 5, characterized in that the relationship between the position of the magnet and the contact force between the substrate and the mask is stored in advance, and the force of contact between the substrate and the mask by the stage is changed based on the relationship. Claim 7 A film forming device according to claim 1, characterized in that the convex portion is positioned at a location offset toward the center of the mask compared to the fitting portion of the kinematic coupling. Claim 8 A film forming device according to claim 1, wherein the fitting portion of the kinematic coupling is composed of a groove portion having a pair of sides that are installed on one of the mask band and the mask holding support member and have a distance that narrows as they face the bottom of the groove, and a hemispherical portion installed on the other side, and wherein, when viewed in a direction perpendicular to the surface of the mask, the convex portion is disposed within a triangular area connecting the ends of the center side of the mask at both ends of the groove width direction of the pair of sides and the center. Claim 9 A membrane device according to claim 8, characterized in that the center of the mask and the convex portion are aligned on a straight line where the pair of sides intersect. Claim 10 A film forming device according to claim 1, wherein the convex portion is installed in any one of the mask holding support member, the substrate, and the substrate holding support member, and the mask is provided with an opening configured to allow the convex portion to be inserted without contacting the convex portion. Claim 11 A film deposition method for forming a thin film on a substrate held in a substrate holding support member through a mask held in a mask holding support member placed on a mask plate within a chamber by means of a film deposition material emitted from a film deposition source, wherein the mask plate and the mask holding support member are configured to be positionable by fitting of a kinematic coupling, and when the mask holding support member is positioned on the mask plate, a pressing process for pressing a convex portion installed on any one of the mask, the mask holding support member, the substrate, and the substrate holding support member, and a film deposition process for forming a thin film on the substrate through the mask. Claim 12 A film formation method according to claim 11, characterized by performing tracking control to fit the kinematic coupling by pressing the convex portion when positioning the mask holding support member on the mask plate by moving a stage that performs relative position adjustment of the substrate and the mask. Claim 13 A method for forming a membrane according to claim 12, characterized by determining the fitting state of the kinematic coupling based on the position of the stage during the tracking control. Claim 14 A film forming method according to claim 12, characterized in that, in the tracking control, a thrust command based on the speed of the stage is performed, and a feedback control is performed to add a predetermined force to the thrust command. Claim 15 A film formation method according to claim 12, wherein a magnet that sucks the mask through the substrate and a lifting mechanism that raises the magnet are used, and when the mask is sucked by the magnet, the force of contact between the substrate and the mask by the stage is changed according to the position of the magnet that is raised by the lifting mechanism. Claim 16 A method for manufacturing an electronic device characterized by using a film formation method described in any one of claims 11 to 15 to manufacture an electronic device.

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