Electronic devices and method for monitoring cracks in structures

Abstract

A method for monitoring cracks in electronic devices and structures is disclosed. A method according to one embodiment may include the operation of acquiring a panoramic image containing a structure, the operation of setting a plurality of points of interest (POIs) within the panoramic image, the operation of analyzing cracks within the plurality of POIs to generate a bounding box corresponding to each of the regions where the cracks occurred, and the operation of monitoring the cracks within the bounding box.

Description

Technology Field

[0001] The following disclosure relates to a method for monitoring cracks in electronic devices and structures. Background Technology

[0003] The management of major physical infrastructure is emerging as a critical task as part of social infrastructure. In particular, with the frequent occurrence of natural disasters such as earthquakes, floods, and typhoons, the need for monitoring the safety and durability of structures is becoming increasingly apparent. Conventional detection methods have primarily relied on human vision or simple sensors that issue warnings when a certain threshold is exceeded. However, these methods may make it difficult to detect minute changes or cracks in structures in real time. Furthermore, major structures such as cultural heritage sites are highly sensitive protection targets that require a high degree of accuracy and continuous monitoring, making detection even more challenging with conventional methods.

[0004] The background technology described above is possessed or acquired by the inventor in the process of deriving the content of the disclosure of the present application, and cannot necessarily be considered as prior art disclosed to the general public prior to the filing of this application. The problem to be solved

[0006] One embodiment can provide a technology that automates displacement detection for multiple points of interest (POIs) through artificial intelligence technology and efficiently analyzes large-scale data to monitor the condition of major structures in real time.

[0007] However, technical challenges are not limited to the technical challenges described above, and other technical challenges may exist. means of solving the problem

[0009] A method for monitoring cracks in a structure according to one embodiment may include the operation of acquiring a panoramic image containing said structure. The method may include the operation of setting a plurality of points of interest (POIs) within said panoramic image. The method may include the operation of analyzing cracks within said plurality of POIs and generating bounding boxes corresponding to each of the regions where said cracks occurred. The method may include the operation of monitoring said cracks within said bounding boxes.

[0010] The operation of acquiring the panoramic image may include acquiring a plurality of images of the structure captured from one or more cameras. The operation of acquiring the panoramic image may include generating the panoramic image based on the plurality of images.

[0011] The operation of setting the plurality of POIs may include the operation of setting the plurality of POIs in the panoramic image so that they do not overlap with each other.

[0012] The operation of generating the bounding box may include an operation of setting the bounding box to cover all areas where the cracks have occurred, but not to overlap each other.

[0013] The operation of monitoring the cracks may include modeling the cracks within the bounding box in the form of polygons and deleting areas within the bounding box that are unrelated to the cracks. The operation of monitoring the cracks may include detecting changes in the cracks corresponding to the modeled areas.

[0014] The above method may further include an operation of analyzing monitoring results and providing the analysis results to the user.

[0015] The above analysis results may include the change history of the cracks, the real-time status of the cracks, and, if emergency damage occurs to one or more of the cracks, a notification regarding the emergency damage.

[0016] An electronic device for monitoring cracks in a structure according to one embodiment may include a processor and a memory for storing instructions. The instructions may be executed individually or collectively by the processor to enable the electronic device to acquire a panoramic image containing the structure. The instructions may be executed individually or collectively by the processor to enable the electronic device to set a plurality of points of interest (POIs) within the panoramic image. The instructions may be executed individually or collectively by the processor to enable the electronic device to analyze cracks within the plurality of POIs and generate bounding boxes corresponding to each of the areas where the cracks occurred. The instructions may be executed individually or collectively by the processor to enable the electronic device to monitor the cracks within the bounding boxes.

[0017] The above instructions may be executed individually or collectively by the processor to enable the electronic device to acquire a plurality of images of the structure taken from one or more cameras. The above instructions may be executed individually or collectively by the processor to enable the electronic device to generate the panoramic image based on the plurality of images.

[0018] The above instructions may be executed individually or collectively by the processor to enable the electronic device to set the plurality of POIs within the panoramic image so that they do not overlap each other.

[0019] The above instructions may be executed individually or collectively by the processor to enable the electronic device to set the bounding box to cover all areas where the cracks have occurred, but without overlapping each other.

[0020] The above instructions may be executed individually or collectively by the processor to enable the electronic device to model the cracks within the bounding box in the form of polygons and delete regions unrelated to the cracks within the bounding box. The above instructions may be executed individually or collectively by the processor to enable the electronic device to detect changes in the cracks corresponding to the modeled regions.

[0021] The above instructions may be executed individually or collectively by the processor to enable the electronic device to analyze monitoring results and provide analysis results to the user.

[0022] The above analysis results may include the change history of the cracks, the real-time status of the cracks, and, if emergency damage occurs to one or more of the cracks, a notification regarding the emergency damage. Brief explanation of the drawing

[0024] FIG. 1 is an example of a crack monitoring system according to one embodiment. FIG. 2 is a drawing for explaining a crack monitoring method according to one embodiment. FIG. 3 is a diagram illustrating a multiple POI setting operation according to one embodiment. FIG. 4 is a drawing for explaining polygonal modeling according to one embodiment. FIG. 5 is an example of a flowchart of a crack monitoring method according to one embodiment. FIG. 6 is an example of an electronic device according to one embodiment. Specific details for implementing the invention

[0025] Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, actual implementations are not limited to the specific embodiments disclosed, and the scope of this specification includes modifications, equivalents, or substitutions included in the technical concept described by the embodiments.

[0026] Terms such as "first" or "second" may be used to describe various components, but these terms should be interpreted solely for the purpose of distinguishing one component from another. For example, the first component may be named the second component, and similarly, the second component may be named the first component.

[0027] When it is stated that a component is "connected" to another component, it should be understood that it may be directly connected to or coupled with that other component, or that there may be other components in between.

[0028] The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to specify the existence of the described features, numbers, steps, actions, components, parts, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0029] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0030] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are given the same reference numeral regardless of the drawing number, and redundant descriptions thereof will be omitted.

[0032] FIG. 1 is an example of a crack monitoring system according to one embodiment.

[0033] Referring to FIG. 1, a crack monitoring system (100) may include a camera, an electronic device (130), and a server (150). However, FIG. 1 is an example for explaining the present invention and should not be interpreted as limiting the scope of the present invention thereto. For example, the electronic device (130) can monitor cracks independently without the server (150).

[0034] Through the camera (110), the entire structure and / or specific areas can be photographed from various angles. The camera (110) can be implemented as a single camera, as shown in FIG. 1. If there is only one camera (110), the camera (110) can rotate to photograph the structure. However, the implementation examples of the camera (110) are not limited to this. For example, the camera (110) can be implemented as multiple cameras, in which case multiple cameras can be fixed to photograph the entire structure and / or parts thereof. As another example, the camera (110) may be implemented as a fisheye camera equipped with a wide-angle lens and / or a multi-imaging camera equipped with multiple sensors and lenses.

[0035] An image or video captured through the camera (110) can be transmitted to an electronic device (130) and / or a server (150).

[0036] The electronic device (130) can control the camera (110). The electronic device (130) can set the shooting method of the camera (110). The electronic device (130) can control the camera (110) according to the shooting method corresponding to the user input based on user input. For example, the electronic device (130) can set the screen size, aspect ratio, and / or resolution of the image (and / or video) captured through the camera (110) according to user input. In addition, the electronic device (130) can set the shooting angle and position of the camera (110) according to user input.

[0037] The camera (110), electronic device (130), and server (150) can communicate using a network (not shown). For example, the network may include a Local Area Network (LAN), a Wide Area Network (WAN), a Value Added Network (VAN), a mobile radio communication network, a satellite communication network, and combinations thereof. The network is a comprehensive data communication network that enables the camera (110), electronic device (130), and server (150) to communicate seamlessly with each other, and may include wired internet, wireless internet, and mobile wireless communication networks. Additionally, the wireless communication network may include, for example, Wi-Fi, Bluetooth, Bluetooth Low Energy, Zigbee, Wi-Fi Direct (WFD), Ultra-Wideband (UWB), Infrared Data Association (IrDA), Near Field Communication (NFC), but is not limited thereto.

[0038] Some and / or all of the operations performed on the server (150) may be performed on the electronic device (130) and / or the server (150). The following description will continue on the premise that the electronic device (130) is performing the operations.

[0039] The electronic device (130) can collect panoramic image data in real time and detect (or monitor) crack displacements of multiple POIs (points of interest) using deep learning technology, and analyze them in real time. A specific crack monitoring method will be described in detail with reference to FIG. 2.

[0041] FIG. 2 is a drawing for explaining a crack monitoring method according to one embodiment.

[0042] Referring to FIG. 2, the electronic device (130) may include a panoramic image generation model (210), a multi-POI setting model (230), a deep learning-based displacement detector (250), an analysis result visualization model (270), and a real-time warning model (290).

[0043] The electronic device (130) can acquire a panoramic image containing a structure. For example, the electronic device (130) can acquire multiple images of the structure taken from one or more cameras (e.g., camera (110) of FIG. 1) and create a panoramic image by stitching the multiple images through a panoramic image generation model (210). As another example, the electronic device (130) may acquire (e.g., receive) a panoramic image of the structure taken from a camera (110) (e.g., a panoramic image generation device).

[0044] The electronic device (130) can control the camera (110) to acquire a panoramic image (or image). Specifically, the panoramic image generation model (210) can control the camera (110) through operations (211 to 215) and acquire a panoramic image. Below, each operation (211 to 215) will be described in detail.

[0045] In operation 211, the panoramic image generation model (210) can set the image shooting angle and area of ​​the camera (110). The panoramic image generation model (210) can set the image shooting angle and specific area of ​​the camera (110), and can store collected real-time image data (e.g., images and / or panoramic images) and use them for displacement detection. In the panoramic image capturing device (100), setting the image shooting angle and area (110) combines multiple image data into one wide field of view and sets a specific area in the composite image to enable more detailed analysis.

[0046] In operation 213, the panoramic image generation model (210) can collect real-time images and / or panoramic images from the camera (110). The panoramic image generation model (210) can continuously receive images and / or panoramic images from the camera (110).

[0047] In operation 215, the panoramic image generation model (210) can divide and store image data. The panoramic image generation model (210) can divide and store data according to user requirements for smooth displacement detection and analysis of the collected images and / or panoramic images.

[0048] The electronic device (130) can set multiple points of interest (POIs) within the panoramic image. The electronic device (130) can analyze cracks within the multiple POIs and monitor only the direct areas where cracks have occurred. The electronic device (130) can generate bounding boxes corresponding to each of the areas where cracks have occurred within the multiple POIs. The electronic device (130) can monitor only a part of the panoramic image (e.g., an area corresponding to a POI) rather than detecting the entire area of ​​the panoramic image. By monitoring only a part of the panoramic image, the electronic device (130) can monitor only the area associated with the cracks in the actual structure. In this way, the electronic device (130) can detect minute changes or cracks in the structure within the panoramic image. Specifically, the electronic device (130) can set multiple POIs through operations (231 to 235). Each of the operations (231 to 235) will be described in detail below.

[0049] In operation 231, the multiple POI setting model (230) can set multiple POIs within a panoramic image. The multiple POI setting model (230) can generate anchor boxes corresponding to the POIs. The multiple POI setting model (230) can set multiple POIs within the panoramic image so that they do not overlap each other. That is, the multiple POI setting model (230) can generate anchor boxes so that they do not overlap each other. The multiple POI setting model (230) can support multiple POI settings for accurately monitoring multiple points of a detection target. Multiple POI settings can be performed simultaneously for multiple locations, and can enable more effective multi-directional displacement detection.

[0050] In operation 233, the multiple POI setting model (230) can label multiple bounding boxes. The multiple POI setting model (230) can analyze cracks within multiple POIs and generate bounding boxes corresponding to each of the areas where cracks have occurred (e.g., displacement detection areas). The multiple POI setting model (230) can set bounding boxes so that they cover all the areas where cracks have occurred but do not overlap each other.

[0051] In operation 235, the multiple POI setting model (230) can specify a displacement detection target. The multiple POI setting model (230) can specify a target crack to detect displacement within a bounding box by modeling it. The bounding box is implemented in the form of a rectangle and may include areas that are not directly related to the cracks. Accordingly, the multiple POI setting model (230) can model the cracks within the bounding box in the form of polygons to remove areas that are not related to the cracks within the bounding box.

[0052] The electronic device (130) can monitor (or detect) cracks within the bounding box. The electronic device (130) can detect changes in the cracks through a deep learning-based displacement detector (250). The electronic device (130) can detect changes in the cracks corresponding to an area modeled in a polygonal form through a deep learning-based displacement detector (250). The deep learning-based displacement detector (250) can detect changes in real time within a set POI area by applying an optimized displacement detection model based on a pre-trained deep learning architecture. Specifically, the electronic device (130) can monitor (or detect, sense, or monitor) changes in the cracks through operations (251 to 255). Each of the operations (251 to 255) will be described in detail below.

[0053] In operation 251, the deep learning-based displacement detector (250) may select a deep learning architecture (or deep learning model, artificial intelligence model). The deep learning architecture may be implemented with various artificial intelligence models used for displacement detection. The deep learning architecture may contribute to increasing the accuracy of displacement detection through image analysis.

[0054] In operation 253, the deep learning-based displacement detector (250) can perform pre-training and testing of the selected deep learning architecture. The deep learning-based displacement detector (250) can pre-train the deep learning architecture and test the deep learning architecture using actual image data. Based on the test results, the deep learning-based displacement detector (250) can evaluate the accuracy of the deep learning architecture and improve the model.

[0055] In operation 255, the deep learning-based displacement detector (250) detects changes in cracks in real time using a pre-trained model, and the detected changes in cracks can be transmitted to an analysis result visualization model (270) and a real-time warning model (290).

[0056] The electronic device (130) can analyze the monitoring results and provide the analysis results to the user. The analysis results may include the history of changes in the cracks, the real-time status of the cracks, and one or more notifications regarding emergency damage if emergency damage occurs to one or more of the cracks. The analysis results may be provided to the user through an analysis result visualization model (270). Additionally, if the analysis results show that a change in the crack is rapidly caused and the crack is emergency damaged, a notification regarding the emergency damage may be provided to the user through a real-time warning model (290).

[0057] Below, the specific operations of the analysis result visualization model (270) and the real-time warning model (290) will be described in detail.

[0058] The analysis result visualization model (270) can perform displacement analysis on multiple bounding boxes to derive comprehensive results. The analysis result visualization model (270) can convert the detected displacement changes and damage status into visualized data and deliver it to the user, thereby supporting the user in understanding the status in real time.

[0059] In operation 271, the analysis result visualization model (270) can sum the crack changes of the multiple bounding boxes of each POI (e.g., monitoring results). The analysis result visualization model (270) can combine data regarding the crack changes of the multiple bounding boxes analyzed in the images of each POI to determine the extent of overall damage or displacement.

[0060] In operation 273, the analysis result visualization model (270) can evaluate and analyze the monitoring results (e.g., results of detecting changes (or displacement) in cracks within a bounding box) as quantitative values. The analysis result visualization model (270) can analyze and organize the aggregated values ​​regarding changes in cracks and damage.

[0061] In operation 273, the analysis result visualization model (270) can provide visualization data for the monitoring results. The analysis result visualization model (270) visualizes the monitoring results so that relevant parties can easily understand them. It provides a function that visually displays displacement and damage data in real time.

[0062] The real-time warning model (290) can provide a notification to the user if urgent damage occurs to a monitored crack (e.g., target crack) (e.g., a crack modeled in the form of a polygon and monitored).

[0063] In operation 291, the real-time warning model (290) can collect the amount of displacement change and damage of the crack. The real-time warning model (290) can continuously collect data related to displacement or damage and generate a warning message based on this.

[0064] In operation 293, the real-time warning model (290) can determine a dangerous state by analyzing data collected in real time and an algorithm that evaluates the risk of damage. The determined dangerous state can be immediately converted into a warning message and delivered to relevant parties.

[0065] In operation 295, the real-time warning model (290) can detect damage in real time. The real-time warning model (290) can provide a damage notification based on the results analyzed in real time. The notification is propagated through various users' electronic devices (e.g., smartphones, laptops, desktops, etc.) and can be delivered to the user quickly.

[0067] FIG. 3 is a diagram illustrating a multiple POI setting operation according to one embodiment.

[0068] Referring to FIG. 3, an electronic device (e.g., the electronic device (130) of FIG. 1) can set a number of POIs and automatically designate a bounding box for each POI to precisely set a displacement detection target.

[0069] The electronic device (130) can set multiple POIs (e.g., 330, 331) within an image (310) received from a camera (e.g., camera (110) of FIG. 1). The electronic device (130) can set multiple POIs that are to be detected by a user or AI based on data that is divided and stored (130) using a suffix separated after being captured through the camera (110).

[0070] The electronic device (130) can generate anchor boxes corresponding to each POI (330, 331) (e.g., boxes labeled as POI_01 to POI_06) to identify each POI (330, 331). Each POI (330, 331) can be set so as not to overlap each other.

[0071] The electronic device (130) can generate bounding boxes (350, 351) by analyzing cracks within multiple POIs (330, 331). In FIG. 3, bounding boxes generated for POI (330) are shown for convenience of explanation, but bounding boxes can be generated substantially the same way for other POIs (e.g., 331). The electronic device (130) can perform precise monitoring of multiple areas through multiple bounding boxes (350, 351).

[0072] The electronic device (130) can perform precise monitoring by removing parts unrelated to cracks within the bounding box (350, 351) and targeting only the cracks. Since this is substantially the same as operations 233 to 235 of FIG. 2, a redundant description will be omitted.

[0074] FIG. 4 is a drawing for explaining polygonal modeling according to one embodiment.

[0075] Referring to FIG. 4, an electronic device (e.g., the electronic device (130) of FIG. 1) can model cracks within a bounding box in the form of polygons. The bounding box is implemented as a rectangle, so that the bounding box corresponding to the crack may include an area unrelated to the actual crack. Accordingly, in order to detect only the area directly related to the crack, the electronic device (130) can model the crack in the form of polygons. FIG. 4 illustrates cracks modeled in the form of polygons within a plurality of bounding boxes, but for convenience of explanation, the following description will be based on the bounding box (410). However, the following description may be substantially applicable to other bounding boxes as well.

[0076] The electronic device (130) can model the cracks within the bounding box (410) in a polygonal form. The electronic device (130) can delete areas unrelated to the cracks, excluding the areas (430) modeled in a polygonal form within the bounding box (410).

[0077] The electronic device (130) can improve the accuracy of crack monitoring by monitoring (or detecting) only the area (430) modeled in a polygonal shape through a deep learning model (or architecture) (e.g., the deep learning-based displacement detector (250) of FIG. 2).

[0079] FIG. 5 is an example of a flowchart of a crack monitoring method according to one embodiment.

[0080] Referring to FIG. 5, operations 510 through 570 may be performed sequentially, but are not limited thereto. For example, two or more operations may be performed in parallel. Operations 510 through 570 may be substantially identical to the operation of the electronic device (e.g., the electronic device (130) of FIG. 1) described with reference to FIG. 1 through 4. Accordingly, a detailed description is omitted.

[0081] In operation 510, the electronic device (130) can acquire a panoramic image containing the structure.

[0082] In operation 530, the electronic device (130) can set multiple points of interest (POI) within the panoramic image.

[0083] In operation 550, the electronic device (130) can analyze cracks within a plurality of POIs and generate a bounding box corresponding to each of the areas where cracks occurred.

[0084] In operation 570, the electronic device (130) can monitor cracks within the bounding box.

[0086] FIG. 6 is an example of an electronic device according to one embodiment.

[0087] Referring to FIG. 6, the electronic device (600) may include memory (610) and a processor (630). The description with reference to FIG. 1 through 5 may be applied in the same way to FIG. 6. For example, the electronic device (130) of FIG. 1 may be the electronic device (600).

[0088] The memory (610) can store instructions (e.g., programs) executable by the processor (630). For example, the instructions may include instructions for executing the operation of the processor (630) and / or the operation of each component of the processor (630).

[0089] The memory (610) can be implemented as a volatile memory device or a non-volatile memory device.

[0090] Volatile memory devices can be implemented as DRAM (dynamic random access memory), SRAM (static random access memory), T-RAM (thyristor RAM), Z-RAM (zero capacitor RAM), or TTRAM (Twin Transistor RAM).

[0091] Non-volatile memory devices can be implemented as EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory, MRAM (Magnetic RAM), Spin-Transfer Torque (STT)-MRAM, Conductive Bridging RAM (CBRAM), FeRAM (Ferroelectric RAM), PRAM (Phase change RAM), Resistive RAM (RRAM), Nanotube RRAM, Polymer RAM (PoRAM), Nano Floating Gate Memory (NFGM), holographic memory, Molecular Electronic Memory Device, or Insulator Resistance Change Memory.

[0092] The processor (630) can process data stored in memory (610). The processor (630) can execute computer-readable code (e.g., software) stored in memory (610) and instructions triggered by the processor (630).

[0093] The processor (630) may be a data processing device implemented in hardware having a circuit having a physical structure for executing desired operations. For example, the desired operations may include code or instructions included in a program.

[0094] For example, a data processing device implemented in hardware may include a microprocessor, a central processing unit, a processor core, a multi-core processor, a multiprocessor, an Application-Specific Integrated Circuit (ASIC), and a Field Programmable Gate Array (FPGA).

[0095] The processor (630) can cause the electronic device (600) to perform one or more operations by executing code and / or instructions stored in memory (610). The operations performed by the electronic device (600) may be substantially the same as the operations performed by the electronic device (130) described with reference to FIGS. 1 through 5. Such redundant descriptions are omitted.

[0097] The embodiments described above may be implemented as hardware components, software components, and / or combinations of hardware and software components. For example, the devices, methods, and components described in the embodiments may be implemented using a general-purpose computer or a special-purpose computer, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit may execute an operating system (OS) and software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. In addition, other processing configurations, such as parallel processors, are also possible.

[0098] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or command the processing unit independently or collectively. Software and / or data may be permanently or temporarily embodied in any type of machine, component, physical device, virtual equipment, computer storage medium or device, or transmitted signal wave in order to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on computer-readable recording media.

[0099] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may store program instructions, data files, data structures, etc., either individually or in combination, and the program instructions recorded on the medium may be those specifically designed and configured for the embodiment or those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, and flash memory. Examples of program instructions include machine code, such as that generated by a compiler, as well as high-level language code that can be executed by a computer using an interpreter, etc.

[0100] The hardware device described above may be configured to operate as one or more software modules to perform the operation of the embodiment, and vice versa.

[0101] Although the embodiments have been described above with reference to the limited drawings, those skilled in the art can apply various technical modifications and variations based thereon. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

[0102] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below.

Claims

Claim 1 A method for monitoring cracks in a structure, comprising: acquiring a panoramic image including the structure; setting a plurality of points of interest (POIs) within the panoramic image; analyzing cracks within the plurality of POIs to generate a bounding box corresponding to each of the areas where the cracks occurred; and monitoring the cracks within the bounding box. Claim 2 A method according to claim 1, wherein the operation of acquiring the panoramic image comprises: acquiring a plurality of images of the structure captured from one or more cameras; and generating the panoramic image based on the plurality of images. Claim 3 A method according to claim 1, wherein the operation of setting the plurality of POIs includes the operation of setting the plurality of POIs in the panoramic image so that they do not overlap each other. Claim 4 A method according to claim 1, wherein the operation of generating the bounding box includes the operation of setting the bounding box to cover all areas where the cracks have occurred but not to overlap each other. Claim 5 A method according to claim 1, wherein the operation of monitoring the cracks comprises: the operation of modeling the cracks within the bounding box in a polygonal form and deleting areas unrelated to the cracks within the bounding box; and the operation of detecting a change in the cracks corresponding to the modeled areas. Claim 6 A method according to claim 1, comprising the operation of analyzing monitoring results and providing the analysis results to a user. Claim 7 In claim 6, the analysis result comprises a change history of the cracks, a real-time state of the cracks, and, if emergency damage occurs to one or more of the cracks, a notification regarding the emergency damage. Claim 8 An electronic device for monitoring cracks in a structure, comprising: a processor; and a memory for storing instructions, wherein the instructions are executed individually or collectively by the processor to enable the electronic device to acquire a panoramic image containing the structure, set a plurality of points of interest (POIs) within the panoramic image, analyze cracks within the plurality of POIs, generate a bounding box corresponding to each of the areas where the cracks occurred, and monitor the cracks within the bounding box. Claim 9 An electronic device according to claim 8, wherein the instructions are executed individually or collectively by the processor to enable the electronic device to acquire a plurality of images of the structure taken from one or more cameras and to generate the panoramic image based on the plurality of images. Claim 10 An electronic device according to claim 8, wherein the instructions are executed individually or collectively by the processor to enable the electronic device to set the plurality of POIs within the panoramic image so as not to overlap each other. Claim 11 An electronic device according to claim 8, wherein the instructions are executed individually or collectively by the processor to cause the electronic device to set the bounding box to cover all areas where the cracks have occurred, but not to overlap each other. Claim 12 An electronic device according to claim 8, wherein the instructions are executed individually or collectively by the processor to enable the electronic device to model the cracks within the bounding box in a polygonal form, delete regions unrelated to the cracks within the bounding box, and detect changes in the cracks corresponding to the modeled regions. Claim 13 An electronic device according to claim 8, wherein the instructions are executed individually or collectively by the processor to enable the electronic device to analyze monitoring results and provide analysis results to a user. Claim 14 An electronic device according to claim 13, wherein the analysis result comprises a change history of the cracks, a real-time state of the cracks, and, if emergency damage occurs to one or more of the cracks, a notification regarding the emergency damage.

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