Lighting module and method for manufacturing the same

Abstract

The present invention relates to a method for manufacturing a light-emitting module, wherein the method for manufacturing the light-emitting module comprises the steps of: positioning a light-emitting part on a circuit board; positioning a mask for a fluorescent layer having a first opening that exposes the upper surface and side of the light-emitting part on the circuit board; injecting a material for the fluorescent layer into the first opening and flattening the exposed surface of the injected material for the fluorescent layer using a squeegee to form a preliminary fluorescent layer located on the upper surface and side of the light-emitting part; curing the preliminary fluorescent layer to form a fluorescent layer located on the upper surface and side of the light-emitting part; positioning a mask for a reflective part having a second opening that exposes the upper surface and side of the fluorescent layer on the circuit board; injecting a material for the reflective part into the second opening and flattening the exposed surface of the injected material for the reflective part using a squeegee to form a preliminary reflective part located on the upper surface and side of the fluorescent layer; and curing the preliminary reflective part to form a reflective part located on the upper surface and side of the fluorescent layer.

Description

Technology Field

[0001] The present invention relates to a light-emitting module and a method for manufacturing the same. Background Technology

[0002] As the functions of electronic devices become more diverse, the types and number of components mounted on them also increase.

[0003] In addition, as the trend toward miniaturization of electronic devices continues and the trend toward larger screens persists, there is a growing demand for even smaller components embedded in these devices.

[0004] Therefore, light-emitting modules, such as light-emitting diode modules, were initially manufactured using a structure that utilized lead frames constituting the electrodes, but they evolved into a Chip Scale Package (CSP) structure to reduce size.

[0005] Therefore, a chip-scale package in which a light-emitting part, such as a light-emitting diode chip and a fluorescent film part, is located on a circuit board is fabricated first, and then the fabricated chip-scale package is assembled back onto the circuit board to complete the light-emitting diode module.

[0006] However, when manufacturing light-emitting diode modules using such chip-scale packages, a problem arises in that a large amount of manufacturing time and cost is required because the chip-scale packages must be manufactured separately. Prior art literature

[0007] Korean Patent Publication No. 10-1457069 (Date of publication: October 31, 2014, Title of invention: Optical proximity sensor) The problem to be solved

[0008] The problem that the present invention aims to solve is to reduce the manufacturing cost and manufacturing time of light-emitting modules.

[0009] Another problem that the present invention aims to solve is to increase the productivity of the light-emitting module. means of solving the problem

[0010] A method for manufacturing a light-emitting module according to one feature of the present invention comprises the steps of: positioning a light-emitting part on a circuit board; positioning a mask for a fluorescent layer having a first opening that exposes the upper surface and side of the light-emitting part on the circuit board; injecting a material for the fluorescent layer into the first opening and flattening the exposed surface of the injected material for the fluorescent layer using a squeegee to form a preliminary fluorescent layer located on the upper surface and side of the light-emitting part; curing the preliminary fluorescent layer to form a fluorescent layer located on the upper surface and side of the light-emitting part; positioning a mask for a reflective part having a second opening that exposes the upper surface and side of the fluorescent layer on the circuit board; injecting a material for the reflective part into the second opening and flattening the exposed surface of the injected material for the reflective part using a squeegee to form a preliminary reflective part located on the upper surface and side of the fluorescent layer; and curing the preliminary reflective part to form a reflective part located on the upper surface and side of the fluorescent layer.

[0011] A method for manufacturing a light-emitting module according to another feature of the present invention comprises the steps of: positioning a light-emitting part on a circuit board; positioning a mask for a fluorescent layer having a first opening that exposes the upper surface and side of the light-emitting part on the circuit board; injecting a material for the fluorescent layer into the first opening and flattening the exposed surface of the injected material for the reflective part using a squeegee to form a preliminary fluorescent layer located on the upper surface and side of the light-emitting part; applying heat to the preliminary fluorescent layer to form a fluorescent layer located on the upper surface and side of the light-emitting part; forming a preliminary first part located on the side of the fluorescent layer and forming a preliminary second part on the upper surface of the fluorescent layer and on the preliminary first part; and curing the first preliminary part and the second preliminary part to form a reflective part including a first part located on the side of the fluorescent layer and a second part located on the upper surface of the fluorescent layer and on the first part.

[0012] The step of forming the preliminary first part and the preliminary second part may include the step of positioning a mask for a reflective part having a second opening that exposes the side of the fluorescent layer on the circuit board, the step of injecting the material for the first reflective part into the second opening to form the preliminary first part located on the side of the fluorescent layer, and the step of injecting the material for the second reflective part into the second opening and flattening the exposed surface of the injected material for the second reflective part using a squeegee to form the preliminary second part located above the preliminary first part and on the upper surface of the light-emitting part.

[0013] The steps of forming the first preliminary portion and forming the second preliminary portion may include: positioning a first reflective mask having a second opening that exposes the side of the fluorescent layer on the circuit board; positioning a first reflective material on the first reflective mask and then using a squeegee to push the first reflective material into the second opening to form the first preliminary portion; positioning a second reflective mask having a third opening that exposes the first preliminary portion and the upper surface of the fluorescent layer on the circuit board; and positioning a second reflective material on the second reflective mask and then using a squeegee to push the second reflective material into the third opening to form the second preliminary portion on the first preliminary portion and the exposed upper surface of the fluorescent layer.

[0014] The above fluorescent layer may completely surround the exposed portion of the light-emitting part.

[0015] The above reflective portion may completely surround the exposed portion of the fluorescent layer.

[0016] The upper thickness of the reflector located on the upper surface of the fluorescent layer may be smaller than the side thickness of the reflector located on the side of the fluorescent layer.

[0017] The first reflective material and the second reflective material may have characteristics of each other.

[0018] The first reflective material and the second reflective material contain titanium dioxide, and the titanium dioxide content of the first reflective material and the titanium dioxide content of the second reflective material may be different from each other.

[0019] The titanium dioxide content in the first part above may be higher than the titanium dioxide content in the second part above.

[0020] In the first part above, the content of the titanium dioxide may be 20% or more of the total content, and in the second part above, the content of the titanium dioxide may be 10% or less of the total content.

[0021] The thickness of the second part of the above-mentioned reflective portion may be 5 to 10 times the thickness of the first part of the above-mentioned reflective portion.

[0022] The first portion of the above-mentioned reflective part may be located from the upper surface of the circuit board to a height of 50% to 100% of the total height of the side of the fluorescent layer.

[0023] A light-emitting module according to another feature of the present invention comprises a circuit board, a light-emitting part located on the circuit board, a fluorescent layer located on the circuit board and completely surrounding the side and top surfaces of the exposed light-emitting part, and a reflective part located on the circuit board and completely surrounding the side and top surfaces of the exposed fluorescent layer.

[0024] The upper thickness of the reflector located on the upper surface of the fluorescent layer may be smaller than the side thickness of the reflector located on the side of the fluorescent layer.

[0025] The above-mentioned reflective portion may include a first portion located on the circuit board and in contact with the side of the fluorescent layer, and a second portion located above the first portion and on the upper surface of the fluorescent layer.

[0026] The first part and the second part may have different characteristics.

[0027] The first part and the second part contain titanium dioxide, and the titanium dioxide content of the first part and the titanium dioxide content of the second part may be higher.

[0028] In the first part, the content of the titanium dioxide may be 20% or more of the total content, and in the second part, the content of the titanium dioxide may be 10% or less of the total content.

[0029] The thickness of the second part may be 5 to 10 times the thickness of the first part.

[0030] The first portion may be located from the upper surface of the circuit board to a height of 50% to 100% of the total height of the side of the fluorescent layer. Effects of the invention

[0031] According to these features, an optical module can be manufactured by directly forming a fluorescent layer and a reflective part on a circuit board on which a light-emitting part is mounted using a squeegee method.

[0032] As a result, the process of fabricating a chip-scale package equipped with a light-emitting part, a fluorescent layer, and a reflective part, and then mounting the chip-scale package onto a circuit board, is eliminated, thereby significantly reducing the manufacturing time and cost of the optical module.

[0033] Since a reflective portion is formed using a squeegee method with two masks, the reflective portion can have different characteristics depending on its position. Therefore, light output from the emitting portion can be output to the outside without interference from the reflective portion.

[0034] Therefore, a reduction in the characteristics of the light-emitting module due to the reflective part can be prevented. Brief explanation of the drawing

[0035] FIG. 1 is a cross-sectional view of a light-emitting module according to one embodiment of the present invention. FIGS. 2 and FIGS. 3 are cross-sectional views of a light-emitting module according to another embodiment of the present invention. FIGS. 4a to 4e are drawings sequentially illustrating an example of a method for manufacturing a light-emitting module illustrated in FIG. 1. FIGS. 5a to 5e are drawings sequentially illustrating an example of a method for manufacturing a light-emitting module illustrated in FIG. 2. FIGS. 6a to 6e are drawings sequentially showing an example of a method for manufacturing a light-emitting module illustrated in FIG. 3. Specific details for implementing the invention

[0036] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are assigned the same reference number, and redundant descriptions thereof will be omitted. Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted.

[0037] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0038] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0039] In this application, each step described may be performed regardless of the order listed, except where it must be performed in the order listed by a particular causal relationship.

[0040] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0041] Hereinafter, a light-emitting module according to one embodiment of the present invention will be described with reference to the attached drawings.

[0042] First, referring to FIG. 1, a light-emitting module (1) according to one embodiment of the present invention may include a circuit board (10), a light-emitting part (20) located on the circuit board (10), a fluorescent layer (30) located on the side and top surface of the exposed light-emitting part, and a reflective part (40) located on the side and top surface of the exposed fluorescent layer (30).

[0043] The circuit board (10) can be electrically and physically connected to the mounted light-emitting part (20).

[0044] Accordingly, the circuit board (10) may have a signal transmission pattern (P10), such as a pad and a signal line for connection with the light-emitting unit (20), an electrical component (not shown) which is at least one of a passive component and an active component that controls the operation of the light-emitting module (1), and a control unit (not shown) that controls the overall operation of the light-emitting module (1). At this time, the control unit may be a control chip having the form of a chip and may be equipped with a processor.

[0045] Such a circuit board (10) can form the bottom surface of the light-emitting module (1) and can be a hard printed circuit board (HPCB), a flexible printed circuit board (FPCB), or a rigid flexible printed circuit board (RFPCB), etc.

[0046] The light-emitting part (20) outputs light of a predetermined color (e.g., one of red, green, and blue) and may include, for example, a light-emitting diode.

[0047] In this example, the light-emitting part (20) may be a light-emitting diode having a chip shape.

[0048] For example, the light-emitting part (20) of the present example may be a flip-chip type flip-chip light-emitting diode having a terminal (P20) for connection with a circuit board (10) located on the lower surface.

[0049] In this example, among the six faces of the radiating part (20) made of a cuboid, the radiating surface may be one face (e.g., the top face), and the actual radiating surface area on which light is emitted may be approximately 80% or less of the top face, which is the radiating surface, for example, 60% to 80%.

[0050] The fluorescent layer (30) may be located on the upper surface of the light-emitting part (20) and may contain a fluorescent material.

[0051] This fluorescent layer (30) may be equipped with a fluorescent material of the corresponding color (e.g., yellow).

[0052] Accordingly, the fluorescent layer (30) may be equipped with a yellow phosphor, and when the light-emitting unit (20) outputs blue light, a portion of the blue light output from the light-emitting unit (20) excites the yellow phosphor so that yellow light can be output from the fluorescent layer (30).

[0053] In this way, when blue light is output from the light-emitting part (20) and yellow light is output from the fluorescent layer (30), the blue light and yellow light are mixed with each other so that the light output from the light-emitting module (1) can become white light.

[0054] The type of phosphor provided in this fluorescent layer (30) can be determined according to the color of the light to be output from the light-emitting module (1) at the end.

[0055] The fluorescent layer (30) of the present example can be positioned on the side and top surfaces of the exposed light-emitting part (20) with a predetermined thickness, as previously described.

[0056] Accordingly, as illustrated in FIG. 1, the fluorescent layer (30) can be positioned on the circuit board (10) while surrounding the side and top surfaces of the light-emitting part (20), which is a part of the exposed light-emitting part (20).

[0057] In this way, the fluorescent layer (30) of the present example, located on the upper surface of the circuit board (10), surrounds not only the upper surface but also the side of the light-emitting part (20) from which light is emitted, and can be positioned to completely surround the exposed portion of the light-emitting part (20) located on the circuit board (1).

[0058] As a result, the fluorescent layer (30) can have the effect of diffusing the light emitted from the light-emitting part (20), thereby improving the light emission efficiency of the light emitted to the outside.

[0059] As such, since the fluorescent layer (30) of the present example can be located not only on the upper surface of the light-emitting part (20) but also on the upper surface of the circuit board (10), the fluorescent layer (30) can have different thicknesses depending on the location.

[0060] In addition, the side thickness (W30) of the fluorescent layer (30) of the present example, that is, the thickness from the side to the end of the fluorescent layer (30) in contact, may be thicker than the upper thickness (T30) of the fluorescent layer (30) located on the upper surface of the light-emitting part (20).

[0061] Accordingly, the fluorescent layer (30) located on the upper surface of the light-emitting part (20) acts as a fluorescent material, so that the color of the light output from the light-emitting part (20) and the color output from the fluorescent layer (30) are mixed so that light of the desired color can be output to the outside.

[0062] On the other hand, the fluorescent layer (30) located on the side of the light-emitting part (20) can perform the role of a diffuser that diffuses light.

[0063] The reflector (40) can reflect the light output from the light-emitting part (20) back toward the light-emitting part (20) and diffuse the light output from the light-emitting part (20).

[0064] Due to this reflective part (40), light output from the light-emitting part (20) can pass through the output surface [e.g., the upper surface of the reflective part (40)] of the light-emitting module (10) without loss and be output to the outside.

[0065] Accordingly, the reflective part (40) may contain at least one material among materials that reflect and block light.

[0066] For example, the reflective part (40) may contain silicon and titanium dioxide (TiO2).

[0067] In this example, the reflective portion (40) is positioned on the circuit board (10) as shown in FIG. 1 and can be positioned to completely surround the exposed portion (e.g., side and top surface) of the fluorescent layer (30), so that it can be positioned on a part of the exposed circuit board (10), the side and top surface of the fluorescent layer (30).

[0068] In this example, the side thickness (W40) of the reflective portion (40), that is, the thickness from the side of the adjacent fluorescent layer (30) to the end, may be thicker than the upper thickness (T40) of the reflective portion (40) located on the upper surface of the fluorescent layer (30).

[0069] Therefore, the light output from the light-emitting part (20) can pass through the fluorescent layer (30) and the reflection part (40) located above it and be output to the outside without loss.

[0070] On the other hand, light emitted from the side of the light-emitting part (20) can be reflected by the thick reflective part (40) and reflected back toward the light-emitting part (20) or toward the upper surface of the light-emitting part (20).

[0071] In addition, due to the diffusion effect of the reflective part (40), the light output to the outside can also be diffused and output.

[0072] FIG. 2 illustrates a light-emitting module (1a) according to another embodiment of the present invention.

[0073] When compared with FIG. 1, components in FIG. 2 that have the same structure and perform the same function as those in FIG. 1 are given the same reference numerals as those in FIG. 1, and a detailed description thereof is omitted.

[0074] As illustrated in FIG. 2, the light-emitting module (1a) of the present example may also be provided with a circuit board (10), a light-emitting part (20) mounted on the circuit board (10), a fluorescent layer (30) located on the side and top surface of the light-emitting part (20), and a reflective part (40a) located on the side and top surface of the fluorescent layer (30).

[0075] However, unlike FIG. 1, the reflector (40a) of the present example may have a first part (41) and a second part (42) having different operating characteristics, as shown in FIG. 2.

[0076] The first part (41) can be positioned in contact with the side of the fluorescent layer (30), and the second part (42) can be positioned on the upper surface of the fluorescent layer (30) and on the first part (41).

[0077] As shown in FIG. 2, the second part (42) can be positioned in contact with the upper surface of the fluorescent layer (30) as well as the side surface of the fluorescent layer (30).

[0078] Accordingly, the reflective portion (40a) of the present example may have an edge portion (401) in which both the first portion (41) and the second portion (42) are located and are in contact with the side of the fluorescent layer (30), and a central portion (402) in which only the second portion (42) is located and is in contact with the upper surface of the fluorescent layer (30).

[0079] Accordingly, only the second part (42) is located on the upper part of the fluorescent layer (30), and the first part (41) and the second part (42) can be located in sequence on the exposed circuit board (10).

[0080] As a result, the thickness of the reflective portion (40a) may vary depending on the location, so the thickness of the edge portion (401) may be much thicker than the thickness of the central portion (402).

[0081] Additionally, if the second part (42) is located on the upper surface of the fluorescent layer (30) as well as on a part of the side, the thickness of the second part (42) may also vary depending on the location. That is, in the second part (42), the thickness of the central part (402) of the reflective part (40a), that is, the part located on the upper surface of the fluorescent layer (30), may be thinner than the thickness of the remaining part located on the edge part (401) of the reflective part (40a), that is, the part located in contact with the side of the fluorescent layer (30).

[0082] In this example, the first portion (41) located in contact with the side of the fluorescent layer (30) may be located from the upper surface of the circuit board (10) to a height of approximately 50% to 100% of the total height of the side of the fluorescent layer (30).

[0083] If the height of the first part (41) is approximately 50% or more of the total height of the side of the fluorescent layer (30), the first part (41) can stably reflect light emitted toward the side of the light-emitting part (20) and the fluorescent layer (30) and prevent it from being transmitted to the outside.

[0084] In addition, when the height of the first part (41) is approximately 100% or less of the total height of the side of the fluorescent layer (30), the first part (41) is prevented from being located on the upper surface of the fluorescent layer (30), so that light emitted toward the upper surface of the fluorescent layer (30) can pass through the reflection part (40a) and be output to the outside.

[0085] In this example, the thickness (T41) of the first part (41) may be thicker than the maximum thickness (T421) of the second part (42), for example, the thickness (T421) of the second part (42) located at the edge part (401).

[0086] As previously described, the thickness (T41) of the edge portion (401) of the reflective portion (40a) located on the side of the fluorescent layer (30) may be thicker than the thickness (T42) of the central portion (402) of the reflective portion (40a) located on the upper surface of the fluorescent layer (30). For example, the thickness (T41) of the first portion (41) may have a size 5 to 10 times greater than the thickness (T42) of the second portion (42) located in the central portion (402) of the reflective portion (40a).

[0087] In this way, since the thickness (T42) of the second part (42) of the reflective part (40a) located on the upper surface of the light-emitting part (20) is thinner than the thickness (T41) of the first part (41) of the reflective part (40a) located on the side of the light-emitting part (20) which is unrelated to the light output, the light output from the light-emitting part (20) can be normally output to the outside even if the second part (42) of the reflective part (40a) is present.

[0088] In this example, the side thickness (W41) of the first part (41), that is, the thickness from the side of the adjacent fluorescent layer (30) to the end, may be greater than the thickness (T42) of the second part (42) located on the upper surface of the fluorescent layer (30).

[0089] Therefore, the light output from the light-emitting part (20) can pass through the fluorescent layer (30) and the second part (42) of the reflection part (40a) located above it and be output to the outside without loss.

[0090] On the other hand, light emitted from the side of the light-emitting part (20) can be reflected by the first part (41) of the thick reflective part (40a) and reflected back toward the light-emitting part (20) or toward the upper surface of the light-emitting part (20).

[0091] The first part (41) and the second part (42) of the reflective part (40a) may be made of materials having different characteristics.

[0092] For example, the reflective portion (40a) may contain silicon and titanium dioxide (TiO2).

[0093] At this time, the first part (41) and the second part (42) of the reflective part (40a) may have different titanium dioxide (TiO2) content.

[0094] The transparency of the reflective portion (40a) can change depending on the titanium dioxide (TiO2) content, and as the titanium dioxide (TiO2) content increases, the transparency of the reflective portion (40a) decreases and the opacity increases.

[0095] Accordingly, the first part (41) of the reflective part (40a), which is located on the side of the light-emitting part (20) and uses the light reflection and blocking function to reflect the light output from the light-emitting part (20) toward the side of the optical module (1a) back toward the light-emitting part (20), may have a relatively higher titanium dioxide (TiO2) content than the second part (42).

[0096] Conversely, the second part (42) of the reflective part (40a), which is located on the upper side of the light-emitting part (20) and diffuses the light output from the light-emitting part (20) to the outside by using the light diffusion function, may have a relatively lower titanium dioxide (TiO2) content than the first part (41).

[0097] Accordingly, in the total content of all components of the first part (41) of the reflective part (40a), the content of titanium dioxide (TiO2) may account for 20% or more (e.g., 20% to 30%).

[0098] In addition, in the total content of all components of the second part (42) of the reflective part (40a), the content of titanium dioxide (TiO2) may be 10% or more (e.g., 5% to 10%).

[0099] As a result, the first part (41) may have increased opacity instead of reduced light diffusion, and the second part (42) may have increased light diffusion instead of reduced opacity.

[0100] Accordingly, the second part (42) through which light output from the light-emitting part (20) is to be transmitted has improved transparency according to the titanium dioxide (TiO2) content, so that it can be fully transmitted and output to the outside without obstruction from the reflection part (40a).

[0101] When the titanium dioxide (TiO2) content of the first part (41) of the reflective part (40a) is 20% or more, the first part (41) has stable opacity that can block light, so that light output from the light-emitting part (20) can be prevented from passing through the first part (41) and being output to the outside.

[0102] When the titanium dioxide (TiO2) content of the first part (41) of the reflective part (40a) is 30% or less, the first part (41) maintains appropriate opacity and does not adversely affect the content of other components constituting the reflective part (40a), so that the reflective part (40a) can perform its function normally.

[0103] When the titanium dioxide (TiO2) content of the second part (42) of the reflective part (40a) is 5% or more, the second part (42) can secure safe transparency to transmit light and safe diffusion for light diffusion, so that light output from the light-emitting part (20) can pass through the second part (42) of the reflective part (40a) without loss and be output to the outside.

[0104] When the titanium dioxide (TiO2) content of the second part (42) of the reflective part (40a) is 10% or less, the second part (42) can perform the function of the reflective part (40a) normally while ensuring stable transparency and diffusivity.

[0105] FIG. 3 illustrates a light-emitting module (1b) according to another embodiment of the present invention.

[0106] Compared to FIG. 2, the light-emitting module (1b) illustrated in FIG. 3 may have different conditions at the boundary surface between the first part (41) and the second part (42) of the reflective part (40a).

[0107] In the case of FIG. 2, the boundary surface where the first part (41) and the second part (42) come into contact with each other is an uneven surface, whereas in the case of FIG. 3, the boundary surface where the first part (41) and the second part (42) come into contact with each other may be a flat surface.

[0108] Next, with reference to FIGS. 4a to 4g, a method for manufacturing a light-emitting module (1) according to one embodiment of the present invention by the operation of a worker or work equipment will be described.

[0109] First, as shown in FIG. 4a, a chip-shaped light-emitting part (20) is mounted on a circuit board (10), and then the mounted light-emitting part (20) can be electrically and physically connected to the circuit board (10) using surface mount technology (SMT), etc., so that the light-emitting part (20) can be positioned on the circuit board (10).

[0110] Accordingly, the first terminal (P20) and the second terminal (P20) of the light-emitting part (20) can be electrically and physically connected to the corresponding pad (P10) of the circuit board (10). For connecting these terminals (P20) and the pad (P10), a conductive paste, such as solder paste or silver paste (Ag paste), may be used.

[0111] This conductive paste can be cured by a reflow process to complete the connection operation between these terminals (P20) and pads (P10).

[0112] Next, as shown in FIG. 4b, a mask (M30) for a fluorescent layer can be placed on a circuit board (10) on which a light-emitting part (20) is mounted, and a material for a fluorescent layer (PM30) can be placed on the mask (M30) for a fluorescent layer.

[0113] At this time, the mask (M30) for the fluorescent layer is for determining the formation location of the fluorescent layer (30) and may be provided with an opening (OP30) for forming the fluorescent layer (30).

[0114] At this time, the location of the opening (OP30) can correspond to the location where the fluorescent layer (30) is formed.

[0115] In this example, the width of the opening (OP30) may be wider than the width of the light-emitting part (20) located within the opening (OP30) at the bottom, so that the upper surface of the light-emitting part (20), the side of the light-emitting part (20), and a part of the circuit board (10) adjacent to the side of the light-emitting part (20) may be exposed through the opening (OP30).

[0116] In this example, the mask (M30) for the fluorescent layer may be a metal mask or a masking film.

[0117] Then, as shown in FIG. 4c, a squeegee (SQ10) can be used to push the fluorescent material located on the fluorescent mask (M30) into the opening (OP30) and then the fluorescent mask (M30) can be removed.

[0118] At this time, the fluorescent layer material (PM30) may be composed of silicon and a fluorescent material of a desired color.

[0119] Accordingly, the fluorescent layer material (PM30) introduced into the opening (OP30) can be positioned on the circuit board (10) exposed through the exposed opening (OP30) and on the side and top surface of the light-emitting part (20). In this way, the fluorescent layer material introduced into the opening (OP30) and positioned within the opening (OP30) can form a preliminary fluorescent layer (301).

[0120] At this time, the width and thickness of the preliminary fluorescent layer (301) can be determined according to the width of the opening (OP30) of the fluorescent layer mask (M30) and the thickness of the fluorescent layer mask (M30).

[0121] However, in an alternative example, when forming a preliminary fluorescent layer (301), a fluorescent layer material (PM30) can be injected into an opening (OP30) of a fluorescent layer mask (M30) using a dispenser or the like, and then the exposed surface of the fluorescent layer material (PM30) injected into the opening (OP30) can be flattened using a squeegee (SQ10) to form the preliminary fluorescent layer (301).

[0122] Then, as shown in FIG. 4d, the pre-fluorescent layer (301) can be cured using a heat treatment operation or a drying operation to form a fluorescent layer (30) that is positioned on the circuit board (10) and is positioned in contact with the side and upper surfaces of the light-emitting part (20), respectively.

[0123] Then, as shown in FIG. 4e, a mask (M40) for the reflective part can be placed on the circuit board (10), and then a material for the reflective part (RM40) can be placed on the mask (M40) for the reflective part.

[0124] The mask (M40) for the reflective part is also for determining the formation location of the reflective part (40) and may be provided with an opening (OP40) that opens the formation location of the reflective part (40).

[0125] In this example, the mask (M40) for the reflective part may also be a metal mask or a masking film.

[0126] Then, as shown in FIG. 4f, a squeegee (SQ20) can be used to push the reflective material (RM40) located on the reflective mask (M40) into the opening (OP40) to form a preliminary reflective section (4011) by positioning the reflective material (RM40) on the side and top surfaces of the fluorescent layer (30).

[0127] In an alternative example, when forming a preliminary reflective layer (4011) as when forming a preliminary fluorescent layer (301), a reflective material (PM40) can be injected into an opening (OP40) of a reflective mask (M40) using a dispenser or the like, and then the exposed surface of the reflective material (PM40) injected into the opening (OP40) can be flattened using a squeegee (SQ20) to form the preliminary reflective layer (401).

[0128] Then, as shown in FIG. 4g, the pre-reflective portion (4011) can be cured using a heat treatment operation or a drying operation, etc., to form a reflective portion (40) that is positioned on the circuit board (10) and is positioned to be in contact with the side and top surfaces of the fluorescent layer (30), respectively, thereby completing the optical module (1) (see FIG. 1).

[0129] In an alternative example, when a plurality of light-emitting parts (20) are mounted on a circuit board (10) to manufacture a light-emitting module (1), after the reflective part (40) is completed, a cutting process is additionally performed to cut between adjacent reflective parts (40), i.e., in units of light-emitting modules, so that the light-emitting module (1) can be completed.

[0130] Next, a method for manufacturing the optical module (1a) illustrated in FIG. 2 will be explained with reference to FIG. 5a to 5e.

[0131] A light-emitting part (20) is mounted on a circuit board (10) in the same manner as shown in FIGS. 4a to 4c, and a fluorescent layer (30) is formed on the light-emitting part (20).

[0132] Then, as shown in FIG. 5a, a mask (M40a) for the reflection part can be placed on the circuit board (10).

[0133] At this time, the mask (M40a) for the reflective part may also be a metal mask or a masking film and may be provided with an opening (OP40a). The opening (OP40a) may be formed to correspond to the position of the reflective part (40a).

[0134] Next, as shown in FIG. 5b, a first reflective material (PM41) can be injected into the opening (OP40a) of the reflective mask (M40a) using a dispenser or the like to form a preliminary first part (41a).

[0135] Next, as shown in FIG. 5c and FIG. 5d, a second reflective material (RM42) is placed on a reflective mask (M40a), and then a squeegee (SQ20) is used to push the second reflective material (RM42) placed on the reflective mask (M40a) into the opening (OP40a), after which the second reflective material (RM42) can be removed.

[0136] As a result, a preliminary second part (42a) of a predetermined thickness can be formed on the preliminary first part (41a) and on the upper surface of the exposed fluorescent layer (30).

[0137] At this time, the thickness of the second preliminary part (42a) can be determined according to the distance between the upper surface of the first preliminary part (41a) and the surface of the reflective mask (M40a).

[0138] Then, as shown in FIG. 5e, the preliminary first part (41a) and the preliminary second part (42a) can be hardened by performing heat treatment or drying operations, and the preliminary first part (41a) and the preliminary second part (42a) can be formed into the first part (41) and the second part (42), respectively.

[0139] As a result, a reflective part (40a) is formed having a first part (41) located in contact with the side of the fluorescent layer (30) above the exposed circuit board (10) and a second part (42) located in contact with the upper surface of the fluorescent layer (30) above the first part (41), and thus a light-emitting module (1a) can be completed (see FIG. 2).

[0140] Next, a method for manufacturing the optical module (1b) illustrated in FIG. 3 will be explained with reference to FIG. 6a to 6e.

[0141] A light-emitting part (20) is mounted on a circuit board (10) in the same manner as shown in FIGS. 4a to 4c, and a fluorescent layer (30) is formed on the light-emitting part (20).

[0142] Then, as shown in FIG. 6a, a first reflective mask (M41) can be placed on the circuit board (10), and then a first reflective material (RM41) can be placed on the first reflective mask (M41).

[0143] At this time, the first reflective mask (M41) may also be a metal mask or a masking film, and may have an opening (e.g., first opening) (OP41) for the first part (41) of the reflective part (40).

[0144] Accordingly, the side of the fluorescent layer (30) and the adjacent circuit board (10) can be exposed through the first opening (OP41).

[0145] Then, as shown in FIG. 6b, the first reflective material (RM41) located on the first reflective mask (M41) can be pushed using a squeegee (SQ20) to introduce the first reflective material (RM41) into the opening (OP41), and then the first reflective mask (M41) can be removed.

[0146] Accordingly, a first reflective material (RM41) may be positioned with a predetermined thickness on the exposed circuit board (10) and on the side of the fluorescent layer (30) to form a preliminary first portion (41a). At this time, the thickness of the preliminary first portion (41a) positioned on the circuit board (10) may be determined according to the thickness of the first reflective mask (M41).

[0147] Next, as shown in FIG. 6c, a second reflective mask (M42) can be placed on the circuit board (10), and then a second reflective material (RM42) can be placed on the second reflective mask (M42).

[0148] At this time, the mask (M42) for the second reflective part may also be a metal mask or a masking film, and may be provided with an opening (e.g., a second opening) (OP42) for the second part (42) of the reflective part (40).

[0149] The width of the second opening (OP42) of the second reflective mask (M42) may be the same as the width of the first opening (OP41) of the first reflective mask (M41).

[0150] However, the thickness of the second reflective mask (M42) can be much thicker than the thickness of the first reflective mask (M41).

[0151] For example, the thickness of the first reflective mask (M41) may be approximately 50% to 100% of the maximum thickness of the fluorescent layer (30).

[0152] The thickness of the second reflective mask (M42) may be greater than the maximum thickness of the fluorescent layer (30), and in this case, the upper surface height of the second reflective mask (M42) may be higher than the upper surface height of the fluorescent layer (30).

[0153] Accordingly, the upper surface of the fluorescent layer (30) and the upper surface of the preliminary first part (41a) can be exposed through the second opening (OP42).

[0154] Then, as shown in FIG. 6d, the first reflective material (RM42) located on the second reflective mask (M42) can be pushed using a squeegee (SQ20) to introduce the second reflective material (RM42) into the opening (OP42), and then the second reflective mask (M42) can be removed.

[0155] Accordingly, a second reflective material (RM42) can be positioned with a predetermined thickness on the upper surface of the exposed fluorescent layer (30) and the upper surface of the first preliminary part (41a) to form a second preliminary part (42a). At this time, the thickness of the second preliminary part (42a) can also be determined according to the thickness of the second reflective mask (M42).

[0156] In this way, when a first reflective mask (M41) and a second reflective mask (M42) each having openings (OP41, OP42) at different locations are used to form a first reflective material (RM41) and a second reflective material (RM42) in sequence at the corresponding locations, then, as shown in FIG. 4e, the first reflective part (41a) and the second reflective part (42a) can be cured by performing a heat treatment or drying operation to form the first reflective part (41a) and the second reflective part (42a).

[0157] As a result, a reflective part (40a) is formed having a first part (41) located in contact with the side of the fluorescent layer (30) above the exposed circuit board (10) and a second part (42) located in contact with the upper surface of the fluorescent layer (30) above the first part (41), and thus the light-emitting module (1b) can be completed (see FIG. 3).

[0158] In an alternative example, as previously described, a reflective material (RM41) and a reflective material (RM42) are sequentially injected into the opening of the mask for the reflective part using a dispenser, etc., and then a surface flattening operation is performed using a squeegee to form a reflective part (40a) having a first part (41) and a second part (42).

[0159] As an alternative example, a first reflective material (RM41) can be injected into the opening of a first reflective mask, and then a first reflective material (RM41) located on the exposed surface of the exposed fluorescent layer (30) can be removed and the first reflective mask removed to form a preliminary first portion (41a).

[0160] Then, the second reflective material (RM42) can be injected again into the opening of the second reflective mask using a dispenser or the like to position the second reflective material (RM42) on the exposed surface of the exposed fluorescent layer (30) and the first reflective material (RM41), and then the surface of the exposed second reflective material (RM42) can be flattened using a squeegee and the second reflective mask removed to form a preliminary second part (42a).

[0161] Then, the curing operation of the first and second preparatory parts (41a, 42b) can be performed to form a reflective part (40a) having the first part (41) and the second part (42) on the side and top surface of the fluorescent layer (30).

[0162] In another alternative example, a first reflective material (RM41) can be injected into the opening of a reflective mask to a desired height using a dispenser, and then a second reflective material (RM42) can be injected to a desired height. Afterward, the exposed surface of the second reflective material (PM42) injected into the opening can be flattened using a squeegee, and the reflective mask can be removed to form a preliminary first part (41a) and a preliminary second part (42a). At this time, the flattening operation using a squeegee may be omitted.

[0163] Then, the curing operation of the preliminary first part (41a) and the preliminary second part (42a) can be performed to form a reflective part (40a) having the first part (41) and the second part (42) on the side and top surfaces of the fluorescent layer (30). In this case, a single mask can be used.

[0164] In addition, when a plurality of light-emitting parts (20) are mounted on a circuit board (10) to manufacture a light-emitting module (1a), after the reflective part (40a) is completed, a cutting process is additionally performed to cut between adjacent reflective parts (40a), that is, in units of light-emitting modules, so that the light-emitting module (1a) can be completed.

[0165] In this example, the first reflective material (RM41) and the second reflective material (RM42) may contain the same material, but the content of some of the materials contained may differ from each other.

[0166] For example, the first reflective material (RM41) and the second reflective material (RM42) may both contain silicon and titanium dioxide (TiO2), but the titanium dioxide (TiO2) content may differ from each other.

[0167] That is, in the reflection portion (40a), the first portion (41) may be a portion that reflects light and prevents light transmission, and the second portion (42) may be a portion that transmits light and diffuses light since it is located on the upper part of the fluorescent layer (30).

[0168] Therefore, the first part (41) must be opaque, and the second part (42) must be transparent and have good diffusion properties.

[0169] The transparency and opacity of the reflective material (RM41, RM42) can be determined by the content of titanium dioxide (TiO2), and the opacity may increase as the content of titanium dioxide (TiO2) increases.

[0170] Accordingly, the titanium dioxide (TiO2) content of the first reflective material (RM41) for the first part (41) may be greater than the titanium dioxide (TiO2) content of the second reflective material (RM42) for the second part (42).

[0171] The content of titanium dioxide (TiO2) contained in the first part (41) and the second part (42), respectively formed by the first reflective material (RM41) and the second reflective material (RM42), may also be different.

[0172] Accordingly, the content of titanium dioxide (TiO2) for each of the first part (41) and the second part (42) of the reflective part (40a) manufactured by the first reflective material (RM41) and the second reflective material (RM42) may each account for 20% or more (e.g., 20% to 30%) and 10% or less (e.g., 5% to 10%) of the total content of all components constituting the first part (41) and the second part (42).

[0173] The squeegees used in this example may be the same or different.

[0174] The technical features disclosed in each embodiment of the present invention are not limited to that embodiment only, and as long as they are not mutually incompatible, the technical features disclosed in each embodiment may be combined and applied to different embodiments.

[0175] Therefore, in each embodiment, the technical features are described primarily, but as long as the technical features are not mutually incompatible, they may be combined and applied together.

[0176] The present invention is not limited to the embodiments described above and the attached drawings, and various modifications and variations may be possible from the perspective of those skilled in the art to which the present invention belongs. Accordingly, the scope of the present invention should be defined not only by the claims of this specification but also by equivalents thereof. Explanation of the symbols

[0177] 1, 1a: Light-emitting module 10: Circuit board 20: Light-emitting part 30: Fluorescent layer 40, 40a: Reflective part 41: Part 1 42: Part 2 301: Preliminary fluorescent layer 401: Preliminary reflection section 41a: Preliminary Part 1 42a: Preliminary Part 2

Claims

Claim 1 A method for manufacturing a light-emitting module comprising: a step of positioning a light-emitting part on a circuit board; a step of positioning a mask for a fluorescent layer having a first opening that exposes the upper surface and side of the light-emitting part on the circuit board; a step of injecting a material for the fluorescent layer into the first opening and flattening the exposed surface of the injected material for the fluorescent layer using a squeegee to form a preliminary fluorescent layer located on the upper surface and side of the light-emitting part; a step of curing the preliminary fluorescent layer to form a fluorescent layer located on the upper surface and side of the light-emitting part; a step of positioning a mask for a reflective part having a second opening that exposes the upper surface and side of the fluorescent layer on the circuit board; a step of injecting a material for the reflective part into the second opening and flattening the exposed surface of the injected material for the reflective part using a squeegee to form a preliminary reflective part located on the upper surface and side of the fluorescent layer; and a step of curing the preliminary reflective part to form a reflective part located on the upper surface and side of the fluorescent layer. Claim 2 A method for manufacturing a light-emitting module comprising: a step of positioning a light-emitting part on a circuit board; a step of positioning a mask for a fluorescent layer having a first opening that exposes the upper surface and side of the light-emitting part on the circuit board; a step of injecting a material for the fluorescent layer into the first opening and flattening the exposed surface of the injected material for the reflective part using a squeegee to form a preliminary fluorescent layer located on the upper surface and side of the light-emitting part; a step of applying heat to the preliminary fluorescent layer to form a fluorescent layer located on the upper surface and side of the light-emitting part; a step of forming a preliminary first part located on the side of the fluorescent layer and forming a preliminary second part on the upper surface of the fluorescent layer and on the preliminary first part; and a step of curing the first preliminary part and the second preliminary part to form a reflective part including a first part located on the side of the fluorescent layer and a second part located on the upper surface of the fluorescent layer and on the first part. Claim 3 A method for manufacturing a light-emitting module according to claim 2, comprising the steps of forming a preliminary first portion and forming a preliminary second portion, the step of positioning a mask for a reflective portion having a second opening that exposes the side of the fluorescent layer on the circuit board; the step of injecting a material for the first reflective portion into the second opening to form a preliminary first portion located on the side of the fluorescent layer; and the step of injecting a material for the second reflective portion into the second opening and flattening the exposed surface of the injected material for the second reflective portion using a squeegee to form a preliminary second portion located above the preliminary first portion and on the upper surface of the light-emitting portion. Claim 4 A method for manufacturing a light-emitting module according to claim 2, wherein the steps of forming the preliminary first part and forming the preliminary second part comprise: a step of positioning a first reflective mask having a second opening that exposes the side of the fluorescent layer on the circuit board; a step of positioning a first reflective material on the first reflective mask and then using a squeegee to push the first reflective material into the second opening to form the preliminary first part; a step of positioning a second reflective mask having a third opening that exposes the preliminary first part and the upper surface of the fluorescent layer on the circuit board; and a step of positioning a second reflective material on the second reflective mask and then using a squeegee to push the second reflective material into the third opening to form the preliminary second part on the exposed upper surface of the fluorescent layer. Claim 5 A method for manufacturing a light-emitting module according to claim 1 or 2, wherein the fluorescent layer completely surrounds a portion of the exposed light-emitting part. Claim 6 A method for manufacturing a light-emitting module according to claim 1, wherein the reflective portion completely surrounds a portion of the exposed fluorescent layer. Claim 7 A method for manufacturing a light-emitting module according to claim 6, wherein the upper thickness of the reflector located on the upper surface of the fluorescent layer is smaller than the side thickness of the reflector located on the side of the fluorescent layer. Claim 8 A method for manufacturing a light-emitting module according to claim 2, wherein the first reflective material and the second reflective material have characteristics of each other. Claim 9 A method for manufacturing a light-emitting module according to claim 8, wherein the first reflective material and the second reflective material contain titanium dioxide, and the titanium dioxide content of the first reflective material and the titanium dioxide content of the second reflective material are different from each other. Claim 10 A method for manufacturing a light-emitting module according to claim 9, wherein the content of titanium dioxide in the first part is higher than the content of titanium dioxide in the second part. Claim 11 A method for manufacturing a light-emitting module according to claim 10, wherein the content of the titanium dioxide in the first part is 20% or more of the total content, and the content of the titanium dioxide in the second part is 10% or less of the total content. Claim 12 A method for manufacturing a light-emitting module according to claim 2, wherein the thickness of the second part of the reflective portion is 5 to 10 times the thickness of the first part of the reflective portion. Claim 13 A method for manufacturing a light-emitting module according to claim 2, wherein the first portion of the reflective portion is located from the upper surface of the circuit board to a height of 50% to 100% of the total height of the side of the fluorescent layer. Claim 14 A light-emitting module comprising: a circuit board; a light-emitting part located on the circuit board; a fluorescent layer located on the circuit board and completely surrounding the side and top surfaces of the exposed light-emitting part; and a reflective part located on the circuit board and completely surrounding the side and top surfaces of the exposed fluorescent layer. Claim 15 In claim 14, a light-emitting module in which the upper thickness of the reflector located on the upper surface of the fluorescent layer is smaller than the side thickness of the reflector located on the side of the fluorescent layer. Claim 16 In claim 14, the light-emitting module comprises: a first portion located on the circuit board and in contact with the side of the fluorescent layer; and a second portion located above the first portion and on the upper surface of the fluorescent layer. Claim 17 In claim 16, the light-emitting module having different characteristics in the first part and the second part. Claim 18 In claim 17, the first part and the second part contain titanium dioxide, and the light-emitting module has a higher titanium dioxide content than the titanium dioxide content of the first part and the titanium dioxide content of the second part. Claim 19 A light-emitting module according to claim 18, wherein the content of titanium dioxide in the first part is 20% or more of the total content, and the content of titanium dioxide in the second part is 10% or less of the total content. Claim 20 A light-emitting module according to claim 14, wherein the thickness of the second part is 5 to 10 times the thickness of the first part. Claim 21 In claim 14, the first portion is a light-emitting module located from the upper surface of the circuit board to a height of 50% to 100% of the total height of the side of the fluorescent layer.

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