Substrate processing system and substrate processing method

Abstract

The disclosed substrate processing system comprises a vacuum conveying module, a control unit, a plurality of process modules, an aligner, a memory unit, and a specific unit. The aligner has a stage and an optical sensor. The stage is configured to allow a ring member to be placed thereon. The optical sensor is configured to detect the shape of the ring member placed on the stage. The memory unit includes a table in which feature information is stored in relation to each identifier of a plurality of process modules. The feature information represents the characteristics of each of the plurality of ring members. The specific unit extracts feature information of the ring member from the shape of the ring member detected by the optical sensor, and, by referring to the table in the memory unit, specifies the process module among the plurality of process modules to which the ring member should be conveyed from the identifier stored in relation to the feature information.

Description

Technology Field

[0001] An exemplary embodiment of the present disclosure relates to a substrate processing system and a substrate processing method. Background Technology

[0002] A substrate processing system capable of performing various processes, such as plasma treatment, on a substrate is known. The substrate processing system comprises a process module having a processing chamber and a substrate support. The substrate support is provided within the processing chamber and supports a ring member disposed thereon. Patent document 1 below discloses a technique for exchanging a ring member disposed on a substrate support. Prior art literature

[0003] Patent Document 1: Japanese Patent Publication No. 2022-02255 The problem to be solved

[0004] The present disclosure provides a technique for specifying a process module corresponding to a ring member. means of solving the problem

[0005] In one exemplary embodiment, a substrate processing system is provided. The substrate processing system comprises a vacuum conveying module, a control unit, a plurality of process modules, an aligner, a memory unit, and a specific unit. The vacuum conveying module has a conveying chamber and a conveying robot. The conveying chamber is capable of depressurization. The conveying robot is configured to convey a substrate through the conveying chamber. The control unit is configured to control the conveying robot. A plurality of process modules each have a processing chamber and a substrate support. The processing chamber is connected to the conveying chamber. The substrate support is disposed within the processing chamber. A plurality of process modules each are configured to perform substrate processing on a substrate on the substrate support. The aligner has a stage and an optical sensor. The stage is configured to allow a ring member to be placed thereon. The optical sensor is configured to detect the shape of the ring member placed on the stage. The memory unit includes a table containing feature information associated with each identifier of a plurality of process modules. The feature information represents the features of each of a plurality of ring members. A specific part extracts feature information of a ring member from the shape of the ring member detected by an optical sensor, and by referring to a table in a memory part, identifies the process module among a plurality of process modules to which the ring member should be returned from an identifier stored in relation to the feature information. Effects of the invention

[0006] According to one exemplary embodiment, a process module corresponding to a ring member is specified. Brief explanation of the drawing

[0007] FIG. 1 is a drawing showing a substrate processing system according to one exemplary embodiment. FIG. 2 is a schematic drawing showing a plasma processing apparatus according to one exemplary embodiment. FIG. 3 is a partial enlarged cross-sectional view of a substrate support portion of a plasma processing device according to one exemplary embodiment. FIG. 4 is a perspective view showing a stoker module according to one embodiment. FIG. 5 is an end view of a stoker module according to one embodiment. FIG. 6 is a plan view of an edge ring and an aligner according to one embodiment. FIG. 7 is a plan view of a covering ring and an aligner according to one embodiment. FIG. 8 is a flowchart illustrating a substrate processing method according to one exemplary embodiment. Specific details for implementing the invention

[0008] Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, identical or substantial parts in each drawing will be given the same reference numerals.

[0009] FIG. 1 is a drawing illustrating a substrate processing system according to one exemplary embodiment. As shown in FIG. 1, the substrate processing system (PS) comprises a vacuum conveying module (VTM), a control unit (MC), a plurality of process modules (PM1 to PM6), an aligner (RAN), a memory unit (MU), and a specific unit (IU). In one embodiment, the substrate processing system (PS) may further comprise a stoker module (RSM), a loader module (LM), and at least one load lock module. The substrate processing system (PS) comprises two load lock modules (LL1, LL2) as at least one load lock module. The substrate processing system (PS) may further comprise at least one load port, a substrate inspection module (CM), an aligner (AN), and a storage (SR). The substrate processing system (PS) comprises four load ports (LP1 to LP4) as at least one load port.

[0010] The loader module (LM) is an example of an atmospheric return module. In one embodiment, the loader module (LM) includes a return chamber (ACH). The return chamber (ACH) is an example of another return chamber. The pressure inside the return chamber (ACH) of the loader module (LM) can be set to atmospheric pressure. The loader module (LM) may have a Fan Filter Unit (FFU). The loader module (LM) is, for example, an Equipment Front End Module (EFEM). The loader module (LM) is positioned between each of the load ports (LP1 to LP4) and each of the load lock modules (LL1, LL2). The load ports (LP1 to LP4) are arranged along one of a pair of edge portions along the longitudinal direction of the loader module (LM). The load lock modules (LL1, LL2) are arranged along the other of a pair of edge portions along the longitudinal direction of the loader module (LM). Each of the load ports (LP1 to LP4) is configured to support a cassette (CST) placed thereon. The cassette (CST) is a container that accommodates a plurality of substrates (W) within it. The cassette (CST) is, for example, a FOUP (Front-Opening Unified Pod).

[0011] In one embodiment, the loader module (LM) includes a transport robot (TR3). The transport robot (TR3) is an example of another transport robot. The transport robot (TR3) is provided inside the transport chamber (ACH) of the loader module (LM). The transport robot (TR3) may include a multi-joint arm (AR31) and an end effector (FK31). The end effector (FK31) is mounted on the tip of the multi-joint arm (AR31) and is configured to support a substrate (W) placed thereon. The transport robot (TR3) is configured to transport the substrate (W) through the transport chamber (ACH). For example, the transport robot (TR3) transports the substrate (W) based on an operation instruction output by a control unit (MC) described later. The return robot (TR3) returns the substrate (W) between any two of the cassette (CST), load lock module (LL1, LL2), aligner (AN), and storage (SR) that are placed on at least one of the load ports (LP1 to LP4).

[0012] An aligner (AN) is positioned along one of a pair of edge portions along the short direction of a loader module (LM). An aligner (AN) may also be positioned along an edge portion along the length direction of a loader module (LM). Additionally, an aligner (AN) may be positioned inside a return chamber (ACH) of a loader module (LM). An aligner (AN) has a stage, an optical sensor, etc. The stage of the aligner (AN) is rotatable and supports a substrate (W) placed thereon. The aligner (AN) detects the angular position of a marker (e.g., a notch) on the stage and the center position of the substrate (W) on the stage using an optical sensor. A control unit (MC) controls the rotation of the stage of the aligner (AN) to correct the angular position of a marker (e.g., a notch) on the stage to a reference angular position so as to correct the amount of shift of the angular position of the substrate (W). Additionally, the control unit (MC) controls the position of the end effector (FK31) when receiving the substrate (W) from the aligner (AN) onto the end effector (FK31) in order to position the center of the substrate (W) on a predetermined position of the end effector (FK31).

[0013] The storage (SR) is positioned along the edge portion along the longitudinal direction of the loader module (LM). The storage (SR) may also be positioned along the edge portion along the short direction of the loader module (LM). Additionally, the storage (SR) may be provided inside the loader module (LM). The storage (SR) is configured to accommodate a substrate (W) therein.

[0014] The substrate inspection module (CM) may be provided inside the loader module (LM) or the vacuum transport module (VTM). The substrate inspection module (CM) may be connected to the loader module (LM) below the load ports (LP1 to LP4). The substrate inspection module (CM) is not limited to the above locations and may be installed in any location. The substrate inspection module (CM) is configured to acquire an image of the substrate (W).

[0015] In one embodiment, the load lock modules (LL1, LL2) are connected to the loader module (LM). Each of the load lock modules (LL1, LL2) and the loader module (LM) may be connected via a gate valve G3. In the example shown in FIG. 1, each of the load lock modules (LL1, LL2) and the vacuum conveying module (VTM) are connected via a gate valve (G2). Each of the load lock modules (LL1, LL2) may be positioned between the vacuum conveying module (VTM) and the loader module (LM). Each of the load lock modules (LL1, LL2) provides a preliminary depressurization chamber.

[0016] A vacuum transfer module (VTM) has at least one transfer chamber and at least one transfer robot. In the example shown in FIG. 1, the vacuum transfer module (VTM) has a transfer chamber (VCH) and a transfer robot (TR) as at least one transfer chamber and at least one transfer robot. The transfer chamber (VCH) is configured to be depressurizable. The transfer robot (TR) is configured to transfer a substrate (W) through the transfer chamber (VCH). In one embodiment, an aligner (RAN) is connected to the transfer chamber (VCH) of the vacuum transfer module (VTM).

[0017] A plurality of process modules (PM1 to PM6) each have a processing chamber (10) and a substrate support (16) (see FIG. 2). The processing chamber (10) is connected to a vacuum transport module (VTM). In the example shown in FIG. 1, the process modules (PM1 to PM6) are connected to the vacuum transport module (VTM) through a gate valve (G1).

[0018] The transfer robot (TR) may include a multi-joint arm (AR11, AR12) and an end effector (FK11, FK12). The end effector (FK11) is mounted on the tip of the multi-joint arm (AR11) and is configured to support a substrate (W) placed thereon. The end effector (FK12) is mounted on the tip of the multi-joint arm (AR12) and is configured to support a substrate (W) placed thereon. For example, the transfer robot (TR) transfers the substrate (W) based on operation instructions output by a control unit (MC) described later. The transfer robot (TR) holds the substrate (W) by the end effectors (FK11, FK12). The transfer robot (TR) is configured to transfer the substrate (W) or ring member (R) between the passes of the load lock module (LL1, LL2), process module (PM1~PM6), and stoker module (RSM). In one embodiment, the ring member (R) is an edge ring (ER) (focus ring) or a cover ring (CR). The edge ring (ER) is used to surround the substrate (W) on the substrate support (16). The cover ring (CR) is used to surround the edge ring (ER). Details regarding the edge ring (ER) and the cover ring (CR) will be described later.

[0019] In one embodiment, the stoker module (RSM) is connected to the return chamber (VCH) of the vacuum return module (VTM). In one example, the stoker module (RSM) is connected to the return chamber (VCH) through a gate valve (G1). The stoker module (RSM) is configured to accommodate a ring member (R) inside it. The stoker module (RSM) is also called a ring stoker. In the example shown in FIG. 1, an aligner (RAN) is disposed within the stoker module (RSM). Details regarding the stoker module (RSM) and the aligner (RAN) will be described later.

[0020] In one embodiment, each of the process modules (PM1 to PM6) is configured to perform a dedicated process on the substrate (W). At least one of the process modules (PM1 to PM6) is a substrate processing device such as the plasma processing device (1) described later.

[0021] The control unit (MC) is configured to control each part of the substrate processing system (PS). The control unit (MC) may be a computer equipped with a processor, a memory device, an input device, a display device, etc. The control unit (MC) executes a control program stored in the memory device and controls each part of the substrate processing system (PS) based on recipe data stored in the said memory device. The conveying method according to various exemplary embodiments described below is executed in the substrate processing system (PS) by controlling each part of the substrate processing system (PS) by the control unit (MC). The control unit (MC) is configured to control the conveying robot (TR, TR3). The control unit (MC) may also serve as a memory unit (MU) and a specific unit (IU). Details regarding the memory unit (MU) and the specific unit (IU) will be described later.

[0022] Refer to FIG. 2 below. FIG. 2 is a schematic drawing of a plasma processing apparatus according to one exemplary embodiment. The plasma processing apparatus (1) shown in FIG. 2 is employed as at least one process module among process modules (PM1 to PM6). The plasma processing apparatus (1) is an example of a substrate processing apparatus.

[0023] The plasma processing device (1) is a capacitively coupled plasma processing device. The plasma processing device (1) is equipped with a processing chamber (10). The processing chamber (10) provides an internal space (10s) therein. The central axis of the internal space (10s) is an axis (AX) extending in the vertical direction.

[0024] In one embodiment, the processing chamber (10) includes a chamber body (12). The chamber body (12) has a roughly cylindrical shape. An internal space (10s) is provided within the chamber body (12). The chamber body (12) is made of, for example, aluminum. The chamber body (12) is electrically grounded. On the inner wall surface of the chamber body (12), that is, the wall surface that partitions the internal space (10s), a plasma-resistant film is formed. This film may be a ceramic film, such as a film formed by anodizing treatment or a film formed of yttrium oxide.

[0025] A passage (12p) is formed in the side wall of the chamber body (12). When a substrate (W) or ring member (R) is transported between the processing chamber (10) and the transport chamber (VCH), it passes through the passage (12p). To open and close this passage (12p), a gate valve (G1) is provided along the side wall of the chamber body (12).

[0026] The plasma processing device (1) further comprises a substrate support (16). The substrate support (16) is provided within the processing chamber (10). The substrate support (16) is configured to support a substrate (W) placed thereon. The substrate (W) has a roughly disc shape. Details regarding the substrate support (16) will be described later.

[0027] The plasma processing device (1) may further be provided with an upper electrode (30). The upper electrode (30) is provided above the substrate support (16). The upper electrode (30) closes the upper opening of the chamber body (12) together with the member (32). The member (32) has insulating properties. The upper electrode (30) is supported on the upper part of the chamber body (12) through this member (32).

[0028] The upper electrode (30) includes a top plate (34) and a support (36). The lower surface of the top plate (34) forms an internal space (10s). The top plate (34) provides a plurality of gas holes (34a). Each of the plurality of gas holes (34a) penetrates the top plate (34) in the plate thickness direction (vertical direction) and is open toward the internal space (10s). The top plate (34) is formed, for example, of silicon. Alternatively, the top plate (34) may have a structure in which a plasma-resistant film is provided on the surface of an aluminum member. This film may be a ceramic film, such as a film formed by anodizing treatment or a film formed of yttrium oxide.

[0029] The support body (36) detachably supports the top plate (34). The support body (36) is formed of a conductive material, such as aluminum, for example. The support body (36) provides a gas diffusion chamber (36a) and a plurality of gas holes (36b) within it. The plurality of gas holes (36b) extend downward from the gas diffusion chamber (36a) and are each connected to the plurality of gas holes (34a). The support body (36) has a gas introduction port (36c). The gas introduction port (36c) is connected to the gas diffusion chamber (36a). A gas supply pipe (38) is connected to the gas introduction port (36c).

[0030] In the gas supply pipe (38), a gas source group (40) is connected through a valve group (41), a flow controller group (42), and a valve group (43). The gas source group (40), the valve group (41), the flow controller group (42), and the valve group (43) constitute a gas supply unit (GS). The gas source group (40) includes a plurality of gas sources. Each of the valve group (41) and the valve group (43) includes a plurality of valves (e.g., open / close valves). The flow controller group (42) includes a plurality of flow controllers. Each of the plurality of flow controllers in the flow controller group (42) is a mass flow controller or a pressure-controlled flow controller. Each of the plurality of gas sources in the gas source group (40) is connected to the gas supply pipe (38) through a corresponding valve of the valve group (41), a corresponding flow controller of the flow controller group (42), and a corresponding valve of the valve group (43). The plasma treatment device (1) is capable of supplying gas from one or more selected gas sources among a plurality of gas sources of a gas source group (40) to an internal space (10s) at an individually adjusted flow rate.

[0031] The processing chamber (10) provides an exhaust passage around the substrate support (16). An exhaust pipe (52) is connected to the bottom portion of the processing chamber (10) below the exhaust passage. An exhaust device (50) is connected to the exhaust pipe (52). The exhaust device (50) has a pressure controller such as an automatic pressure control valve and a vacuum pump such as a turbo molecular pump, and can reduce the pressure of the internal space (10s).

[0032] The plasma processing device (1) further comprises a high-frequency power source (61). The high-frequency power source (61) is a power source that generates source high-frequency power. The source high-frequency power is used to generate plasma from the gas in the processing chamber (10). The frequency of the source high-frequency power (source frequency) is a frequency within the range of 27 to 100 MHz. The high-frequency power source (61) is connected to the upper electrode (30) through a matching circuit (61m). The matching circuit (61m) is configured to match the impedance of the load side (upper electrode (30) side) of the high-frequency power source (61) to the output impedance of the high-frequency power source (61). Additionally, the high-frequency power source (61) may be connected to a substrate support (16) (e.g., a lower electrode such as a base (18)) through the matching circuit (61m) instead of the upper electrode (30).

[0033] The plasma processing device (1) further comprises a bias power supply (62). The bias power supply (62) is electrically coupled to a substrate support (16) (e.g., a lower electrode such as a support (18)) and supplies an electric bias to the substrate support (16) to attract ions from the plasma to the substrate (W). The electric bias has a bias frequency. The bias frequency may be lower than the source frequency. The bias frequency is, for example, a frequency within the range of 100 kHz to 13.56 MHz.

[0034] The electric bias may be a bias high-frequency power having a bias frequency. In this case, the bias power supply (62) is connected to the substrate support (16) (e.g., a lower electrode such as the base (18) or another electrode of the substrate support (16)) through a matching circuit (62m). The matching circuit (62m) is configured to match the impedance on the load side of the bias power supply (62) to the output impedance of the bias power supply (62). Alternatively, the electric bias may be a sequence of voltage pulses. The voltage pulses may be pulses of DC voltage. In this case, the plasma processing device (1) does not have a matching circuit (62m).

[0035] The substrate support (16) includes a base (18) and an electrostatic chuck (20). The base (18) has a roughly disc shape. The substrate support (16) may further include a base (17) and an insulator (27). The base (18) may be formed of a metal such as aluminum and may form a lower electrode. The base (17) is provided on the bottom portion of the processing chamber (10). The insulator (27) is provided on the base (17). The insulator (27) is formed of an insulating material such as quartz and extends to surround the outer circumference of the base (18). The electrostatic chuck (20) is provided on the base (18).

[0036] Hereinafter, together with FIG. 2, FIG. 3 is referenced. FIG. 3 is a partial enlarged cross-sectional view of a substrate support portion of a plasma processing apparatus according to one exemplary embodiment. The upper surface of the electrostatic chuck (20) includes a substrate support surface (20a) and a ring support surface (20b). The substrate support surface (20a) is a roughly circular surface, and its center axis is the axis (AX). The electrostatic chuck (20) supports a substrate (W) placed on the substrate support surface (20a).

[0037] The ring support surface (20b) is a ring-shaped surface extending around the axis (AX) from the outer side of the substrate support surface (20a). The electrostatic chuck (20) supports an edge ring (ER) placed on the ring support surface (20b). The edge ring (ER) has a ring shape. The substrate (W) is placed within the area enclosed by the edge ring (ER). The edge ring (ER) is formed from a conductive material, such as silicon or silicon carbide, for example. The edge ring (ER) may also be formed from an insulating material, such as quartz.

[0038] The electrostatic chuck (20) has a dielectric portion (20c), a first chuck electrode (20d), and a second chuck electrode (20e). The dielectric portion (20c) is formed of a ceramic such as aluminum oxide. The dielectric portion (20c) has a roughly disc shape and provides a substrate support surface (20a) and a ring support surface (20b).

[0039] The first chuck electrode (20d) and the second chuck electrode (20e) are positioned within the dielectric portion (20c) and also below the substrate support surface (20a). When voltage is applied to the first chuck electrode (20d), the electrostatic chuck (20) generates an electrostatic attraction to pull and hold the substrate (W) to the substrate support surface (20a). The second chuck electrode (20e) is positioned within the dielectric portion (20c) and also below the ring support surface (20b). When voltage is applied to the second chuck electrode (20e), the electrostatic chuck (20) generates an electrostatic attraction to pull and hold the edge ring (ER) to the ring support surface (20b). Additionally, in the illustrated example, the electrostatic chuck (20) includes a unipolar electrostatic chuck that holds the substrate (W) and a bipolar electrostatic chuck that holds the edge ring (ER). However, a bipolar electrostatic chuck may be used instead of a unipolar electrostatic chuck, and a unipolar electrostatic chuck may be used instead of a bipolar electrostatic chuck.

[0040] On the outer side of the edge ring (ER), a cover ring (CR) is positioned to surround the edge ring (ER). The cover ring (CR) has a ring shape. The cover ring (CR) covers the upper surface of the insulator (27). The cover ring (CR) is formed from an insulating material, for example, quartz. The cover ring (CR) may also be formed from a conductive material, such as silicon or silicon carbide. The outer periphery of the edge ring (ER) is positioned to overlap with the inner periphery of the cover ring (CR) when viewed from above. Additionally, the outer periphery of the cover ring (CR) is positioned on the outer side of the outer periphery of the edge ring (ER) and surrounds the outer periphery of the edge ring (ER).

[0041] The plasma processing device (1) further includes a lifter (70). The lifter (70) includes a lifter (71) and a lifter (72). The lifter (71) includes a plurality of lift pins (711) and an actuator (712). Each of the plurality of lift pins (711) is inserted into a plurality of through holes (161) formed in the base (18) and the electrostatic chuck (20). The actuator (712) raises and lowers the plurality of lift pins (711). By raising and lowering by the actuator (712), the plurality of lift pins (711) can protrude upward from the substrate support surface (20a) and retract downward relative to the substrate support surface (20a). As the actuator (712), a piezo actuator can be used, for example, a motor such as a DC motor, a stepping motor, a linear motor, or an air driving mechanism such as an air cylinder. The lifter (71) raises and lowers a plurality of lift pins (711) when transferring a substrate (W) between the transfer robot (TR) and the substrate support (16).

[0042] The lifter (72) includes a plurality of lift pins (721) and an actuator (722). Each of the plurality of lift pins (721) is inserted into a plurality of through holes (162) formed in the insulator (27) and a plurality of through holes (CRh) formed in the cover ring (CR). The actuator (722) raises and lowers the plurality of lift pins (721). As the actuator (722), for example, the same as the actuator (712) can be used.

[0043] Each of the plurality of lift pins (721) includes a lower portion (723) and an upper portion (724). Each of the lower portion (723) and the upper portion (724) is rod-shaped. The diameter of the lower portion (723) is larger than the diameter of the upper portion (724). The upper portion (724) extends upward from the lower portion (723).

[0044] The diameter of each of the plurality of through holes (162) is slightly larger than the diameter of the lower portion (723) of each of the plurality of lift pins (721). The diameter of each of the plurality of through holes (CRh) is slightly larger than the diameter of the upper portion (724) of each of the plurality of lift pins (721) and smaller than the diameter of the lower portion (723) of each of the plurality of lift pins (721).

[0045] Each of the multiple lift pins (721) can be positioned in a standby position, a first support position, and a second support position, respectively. The standby position is a position where the upper surface (724t) of the upper portion (724) is lower than the lower surface of the edge ring (ER). When the multiple lift pins (721) are in the standby position, the edge ring (ER) and the cover ring (CR) are not lifted by the multiple lift pins (721) but are supported by the electrostatic chuck (20) and the insulator (27), respectively.

[0046] The first support position is a position above the standby position. When each of the multiple lift pins (721) is positioned at the first support position, the upper surface (724t) of the upper portion (724) is positioned above the upper surface of the cover ring (CR), and the upper surface (723t) of the lower portion (723) is positioned below the lower surface of the cover ring (CR). When the multiple lift pins (721) are positioned at the first support position, the upper surface (724t) of the upper portion (724) comes into contact with the surface that forms a partition of the concave portion (ERr) formed on the lower surface of the edge ring (ER). By doing so, the multiple lift pins (721) support the edge ring (ER).

[0047] The second support position is a position higher than the first support position. When each of the multiple lift pins (721) is positioned at the second support position, the upper surface (723t) of the lower portion (723) is positioned higher than the upper surface of the insulator (27). When the multiple lift pins (721) are positioned at the second support position, the upper surface (723t) of the lower portion (723) comes into contact with the lower surface of the cover ring (CR). By this, the multiple lift pins (721) support the cover ring (CR). Additionally, when the edge ring (ER) is positioned on the inner circumference of the cover ring (CR), the upper surface (724t) of the upper portion (724) comes into contact with the surface forming the concave portion (ERr), and the multiple lift pins (721) support both the cover ring (CR) and the edge ring (ER).

[0048] When the lifter (72) exchanges only the edge ring (ER) between the return robot (TR) and the substrate support (16), it moves a plurality of lift pins (721) to a first support position. When the lifter (72) exchanges both the edge ring (ER) and the cover ring (CR) or only the cover ring (CR) between the return robot (TR) and the substrate support (16), it moves a plurality of lift pins (721) to a second support position.

[0049] Hereinafter, details of the aligner (RAN) and the stoker module (RSM) will be described with reference to FIGS. 4 and 5. FIG. 4 is a perspective view showing a stoker module according to one embodiment. FIG. 4 is a partially cutaway perspective view showing the interior of the stoker module (RSM). FIG. 5 is a cross-sectional view of the stoker module according to one embodiment.

[0050] The stoker module (RSM) includes a chamber (RC). The chamber (RC) is configured to allow for depressurization of its internal space. FIG. 4 illustrates the chamber (RC) with a portion cut out to show its internal space. An aligner (RAN) and a cassette module (CTM) are disposed within the chamber (RC). The aligner (RAN) is positioned above the cassette module (CTM). The cassette module (CTM) includes a plurality of cassettes (CT). Each of the plurality of cassettes (CT) is configured to accommodate a ring member (R) within it.

[0051] A plurality of ring members (R) are accommodated in the cassette module (CTM). The plurality of ring members (R) may include an edge ring (ER) and a cover ring (CR). As shown in FIG. 5, the edge ring (ER) and the cover ring (CR) are arranged alternately in the cassette module (CTM). The aligner (RAN) and the cassette module (CTM) may be configured to be movable in the vertical direction. For example, a ring member (R) is ejected from a cassette (CT) placed at a transfer position within the chamber (RC). The cassette module (CTM) can move vertically so that the ejected ring member (R) is placed at a transfer position within the chamber (RC). In the cassette module (CTM), the ring member (R) may be ejected sequentially from the ring member (R) placed at the bottom among the plurality of ring members (R).

[0052] An aligner (RAN) has a stage (ST) and an optical sensor (S1). The stage (ST) is configured so that a ring member (R) is placed thereon. The optical sensor (S1) is configured to detect the shape of the ring member (R) placed on the stage (ST).

[0053] In one embodiment, the stage (ST) is configured to be rotatable together with a ring member (R) placed thereon. For example, the stage (ST) may be configured to be rotatable and may include a support member (RST) configured to support the ring member (R). The support member (RST) is formed of a material that transmits visible light. In one example, the support member (RST) is formed of glass. The support member (RST) may include a plurality of pads (PD). The plurality of pads may include a pad for an edge ring (ER) and a pad for a cover ring (CR). The pad for the edge ring (ER) is placed inside the pad for the cover ring (CR). An aligner (RAN) can move in an up-and-down direction so that the support member (RST) of the stage (ST) is placed at a conveying position within the chamber (RC).

[0054] In one embodiment, the optical sensor (S1) includes a line sensor (LS) and a light source (L). The line sensor (LS) is positioned to detect the outer edge and the inner edge of the ring member (R). The light source (L) emits light toward the line sensor (LS). In one example, the light source (L) may emit laser light. For example, the line sensor (LS) and the light source (L) are positioned to face each other in the vertical direction so that a stage (ST) is located between them. The line sensor (LS) may be positioned below the support member (RST) so that, when viewed from the light source (L), it intersects the inner edge of the ring member (R) and the outer edge of the ring member (R). In one example, when the stage (ST) and the ring member (R) placed on the stage are rotating together, the light source (L) emits light toward the line sensor (LS). The line sensor (LS) detects light projected from the inner edge of the ring member (R) and the outer edge of the ring member (R). The optical sensor (S1) detects the shape of the ring member (R) from the light detected by the line sensor (LS).

[0055] The aligner (RAN) may be configured to perform alignment of the position of the ring member (R) placed on the stage (ST). The optical sensor (S1) may be configured to optically detect the position of the ring member on the support member (RST). The aligner (RAN) may be configured to perform alignment of the position of the ring member (R) according to the position detected by the optical sensor (S1). In one embodiment, the aligner (RAN) is configured to enable detection of the edge ring (ER) and the cover ring (CR), and alignment of the positions of each thereof. In one example, the aligner (RAN) may be configured to enable alignment of the edge ring (ER) in the inner part of the line sensor (LS) and alignment of the cover ring (CR) in the outer part of the line sensor (LS).

[0056] In one embodiment, the stoker module (RSM) may further include an optical sensor (S2). The optical sensor (S2) is configured to detect the thickness of the ring member (R). In one example, the optical sensor (S2) is a mapping sensor. The optical sensor (S2) may include a light source that emits laser light in a horizontal direction and a light sensor that receives the laser light emitted from the light source. The cassette (CT) may include a side having a cutout formed therein. The cutout is positioned so that laser light is irradiated onto the ring member (R) housed within the cassette (CT).

[0057] Hereinafter, with reference to FIGS. 6 and 7, the shape of the ring member (R) and the characteristic information of the ring member (R) extracted from the shape of the ring member (R) will be described. FIG. 6 is a plan view of an edge ring and an aligner according to one embodiment. FIG. 6 shows an edge ring (ER) placed on a support portion (RST) of an aligner (RAN). FIG. 7 is a plan view of a cover ring and an aligner according to one embodiment. FIG. 7 shows a cover ring (CR) placed on a support portion (RST) of an aligner (RAN).

[0058] A specific part (IU) acquires feature information indicating the features of a ring member (R) from the shape of a ring member (R) acquired by an optical sensor (S1). In one embodiment, the features of the ring member (R) may include at least one of the inner diameter, outer diameter, and thickness of the ring member. The statement that it may include at least one means that the ring member (R) may include one of the inner diameter, outer diameter, or thickness as its features, or may include multiple of them. The inner diameter and outer diameter of the ring member may be obtained from the curvature of the inner edge and outer edge of the ring member.

[0059] In the examples of FIGS. 6 and 7, a first notch (NT1) and a second notch (NT2) are formed in the ring member (R). The ring member is characterized by including the first notch (NT1) and the second notch (NT2) as at least one notch. As shown in FIG. 6, in the edge ring (ER), the first notch (NT1) and the second notch (NT2) are formed on the outer edge thereof. As shown in FIG. 7, in the cover ring (CR), the first notch (NT1) and the second notch (NT2) are formed on the inner edge thereof. In one embodiment, the specific part (IU) may acquire the thickness of the ring member (R) detected by the optical sensor (S2) as characteristic information indicating the characteristics of the ring member (R).

[0060] In one embodiment, the characteristics of the ring member (R) may include the number of notches formed in the ring member (R). In the example of FIGS. 6 and 7, the number of at least one notch is two. If no notches are formed in the ring member (R), the number of notches is zero. In one embodiment, the characteristics of the ring member (R) may include the relative positional relationship between the first notch (NT1) and the second notch (NT2). The relative positional relationship between the first notch (NT1) and the second notch (NT2) is, for example, the angle between the first notch (NT1) and the second notch (NT2) with respect to the center of the ring member (R). The relative positional relationship between the first notch (NT1) and the second notch (NT2) may be the distance between the first notch (NT1) and the second notch (NT2).

[0061] Each of the plurality of ring members (R) is a ring member (R) for a corresponding process module among the plurality of process modules (PM1 to PM6). In the substrate processing system (PS), each of the plurality of ring members (R) is transferred to a corresponding process module. The memory unit (MU) includes a table in which feature information representing the characteristics of each of the plurality of ring members (R) is stored in relation to the identifier of each of the plurality of process modules (PM1 to PM6). For example, the table is stored such that feature information representing the characteristics of a specific ring member (R) corresponds to the identifier of a specific process module corresponding to the specific ring member (R).

[0062] The specific unit (IU) refers to the table of the memory unit (MU) and, from the identifier stored in association with feature information representing the characteristics of the ring member (R), specifies the process module among the plurality of process modules (PM1~PM6) to which the ring member (R) must be returned. The process module to which the ring member (R) must be returned is the process module among the plurality of process modules (PM1~PM6) that corresponds to the ring member (R).

[0063] Feature information indicating the characteristics of a ring member (R) is associated with an identifier of a process module corresponding to the ring member (R) and stored in a table of a memory unit (MU). According to the substrate processing system (PS), by referencing the table of the memory unit (MU), a process module corresponding to the ring member (R) is identified from the feature information indicating the characteristics of the ring member (R) extracted from the shape of the ring member (R).

[0064] The control unit (MC) controls the conveyor robot (TR). The control unit (MC) may control the conveyor robot (TR) to convey the ring member (R) between the pass of the cassette module (CTM) and the aligner (RAN) in the stoker module (RSM). The control unit (MC) may control the conveyor robot (TR) to convey the ring member (R) to a designated process module among a plurality of process modules (PM1 to PM6).

[0065] In one embodiment, the control unit (MC) transfers the ring member (R) onto the stage (ST) of the aligner (RAN) before transferring the ring member (R) to a designated process module among a plurality of process modules (PM1 to PM6). The control unit (MC) obtains the identifier of the process module to which the ring member (R) transferred onto the stage (ST) among the plurality of process modules (PM1 to PM6) is to be transferred by referring to a table using characteristic information of the ring member (R) transferred onto the stage (ST) in the specific unit (IU) as the identifier of the process module to which the ring member (R) transferred onto the stage (ST) is to be transferred. The control unit (MC) determines whether the identifier of the designated process module matches the identifier of the process module to which the ring member (R) is to be transferred.

[0066] In one embodiment, the control unit (MC) returns the ring member (R) to the stage (ST) of the aligner (RAN) after removing the ring member (R) from the process module. The control unit (MC) obtains the identifier of the process module to which the ring member (R) returned to the stage (ST) among the plurality of process modules (PM1 to PM6) is to be returned, by referring to a table using characteristic information of the ring member (R) returned to the stage (ST) in the specific unit (IU). The control unit (MC) determines whether the identifier of the process module from which the ring member (R) was removed matches the identifier of the process module to which it is to be returned.

[0067] FIG. 8 is a flowchart illustrating a substrate processing method according to one exemplary embodiment. Hereinafter, with reference to FIG. 8, an example of executing a substrate processing method (hereinafter referred to as "method MT") will be described. Method MT is executed using a substrate processing system (PS). Hereinafter, the configuration of each component of the substrate processing system (PS) and the control of each part in Method MT will also be described. Furthermore, Method MT may be performed using a substrate processing system other than the substrate processing system (PS).

[0068] Method MT begins at process ST1. In process ST1, a ring member (R) is transported to an aligner (RAN). In one example, the ring member (R) is transported by a transport robot (TR) from the cassette (CT) located at the bottom of the cassette modules (CTM) onto the stage (ST) of the aligner (RAN). In one embodiment, process ST1 may be performed before transporting the ring member (R) to a designated process module among a plurality of process modules (PM1 to PM6). In the example of FIG. 8, process ST1 is performed before process ST5, which transports the ring member to a designated process module.

[0069] After process ST1, process ST2 is performed. In process ST2, the shape of the ring member (R) returned to the aligner (RAN) is detected. For example, the shape of the inner edge and the outer edge of the ring member (R) are each detected by an optical sensor (S1). In one embodiment, the shape of the ring member (R) may be the thickness of the ring member (R). The thickness of the ring member (R) may be detected by an optical sensor (S2) placed in the stoker module (RSM) prior to process ST2.

[0070] After process ST2, process ST3 is performed. In process ST3, feature information representing the characteristics of the ring member (R) is extracted from the shape of the ring member (R). After the feature information is extracted, the table of the memory unit (MU) is referenced, and the process module to which the ring member (R) must be returned is specified among the plurality of process modules (PM1 to PM6) from the identifier of the process module stored in the table of the memory unit (MU) in relation to the feature information.

[0071] For example, the table of the memory unit (MU) stores the identifier of the process module (PM1) and the characteristic information of the ring member (R) corresponding to the process module (PM1) in association. The table of the memory unit (MU) stores the identifier of the process module (PM1) and the identifier of the ring member (R) corresponding to the process module (PM1) in association, and may also store the identifier of the ring member (R) and the characteristic information of the ring member (R) in association.

[0072] In one embodiment, the method MT may include process ST4. Process ST4 is performed after process ST3. In process ST4, it is determined whether the identifier of the designated process module to which the ring member (R) is returned matches the identifier of the process module to which the ring member (R) specified in process ST3 is to be returned. If it is not determined in process ST4 that they match (if the result of the determination in process ST4 of FIG. 8 is “NO”), the method MT may be terminated. In this case, for example, the method MT is terminated. Before the method MT is terminated, the substrate processing system (PS) may notify the operator that the identifier of the designated process module and the identifier of the process module to which the ring member (R) is to be returned do not match. If it is determined in process ST4 that they match (if the result of the determination in process ST4 of FIG. 8 is “YES”), process ST5 may be executed.

[0073] In one example, the method MT may include process ST5 and process ST6. In process ST5, the ring member (R) is returned to a designated process module among a plurality of process modules (PM1 to PM6). For example, the cover ring (CR) is returned via a lifter (70) onto the insulator (27) of the substrate support (16) in the processing chamber (10) of the designated process module. For example, the edge ring (ER) is returned via a lifter (70) onto the ring support surface (20b) of the substrate support (16) in the processing chamber (10) of the designated process module.

[0074] After process ST5, the substrate (W) can be returned to a designated process module (not shown). For example, the substrate (W) is returned onto a substrate support surface (20a) so as to be surrounded by an edge ring (ER) returned from process ST5.

[0075] Process ST6 is performed after process ST5. In process ST6, substrate treatment is performed on the substrate (W) on the substrate support (16). The substrate treatment may be plasma treatment. The substrate treatment may include etching treatment and film formation treatment.

[0076] After process ST6, the substrate (W) can be removed from the designated process module (not shown). For example, the substrate (W) is returned to the return chamber (ACH) through the return chamber (VCH).

[0077] In one embodiment, the method MT may include process ST7, process ST8, process ST9, and process ST10. Process ST7 is performed after process ST6. In process ST7, after the ring member (R) is removed from the designated process module, the ring member (R) is returned to the aligner (RAN). In one example, the ring member (R) is returned by a return robot (TR) from the substrate support (16) in the processing chamber (10) of the designated process module to the stage (ST) of the aligner (RAN).

[0078] Process ST8 is performed after Process ST7. In Process ST8, similar to Process ST2, the shape of the ring member (R) returned to the aligner (RAN) is detected. Process ST9 is performed after Process ST8. In Process ST9, similar to Process ST3, feature information indicating the characteristics of the ring member (R) is extracted from the shape of the ring member (R), and the process module to which the ring member (R) should be returned is specified.

[0079] Process ST10 is performed after Process ST9. In Process ST10, it is determined whether the identifier of the process module from which the ring member (R) was removed matches the identifier of the process module to which the ring member (R) specified in Process ST9 must be returned. If it is not determined in Process ST10 that they match (if the result of the determination in Process ST4 of FIG. 8 is "NO"), Method MT may be terminated. In this case, for example, Method MT is terminated abnormally. Before Method MT is terminated abnormally, the substrate processing system (PS) may notify the operator that the identifier of the designated process module does not match the identifier of the process module from which the ring member (R) was removed. If it is determined in Process ST10 that they match (if the result of the determination in Process ST4 of FIG. 8 is "YES"), Method MT may be terminated. In this case, for example, Method MT is terminated normally.

[0080] Although various exemplary embodiments have been described above, various additions, omissions, substitutions, and changes may be made without being limited to the exemplary embodiments described above. In addition, it is possible to form other embodiments by combining elements from different embodiments.

[0081] The substrate processing system (PS) is not necessarily limited to that shown in FIG. 1. For example, the number of process modules and / or the number of transport modules in the substrate processing system may differ from that shown in FIG. 1. For example, the number of load ports may be five or more, and the number of load ports may be any number. In addition, the substrate processing system may be a system in which a plurality of module groups, each including a process module and a load lock module, are connected to a loader module (so-called loader-type system). In addition, the substrate processing system may be a system in which two or more process modules are arranged around a transport module and connected to surround the transport module (so-called cluster-type system).

[0082] In one embodiment, the aligner (RAN) may be connected to the return chamber (ACH) of the loader module (LM). In this case, the stoker module (RSM) may be connected to the return chamber (ACH).

[0083] Method MT does not need to include processes ST5 to ST10. Method MT does not need to include processes ST1 to ST6. If Method MT does not include processes ST1 to ST6, Method MT starts at process ST7.

[0084] Hereinafter, various exemplary embodiments included in the present disclosure are described in [E1] to [E14] below.

[0085] [E1]

[0086] A vacuum transport module having a pressure-reducing transport chamber and a transport robot configured to transport a substrate through the transport chamber, and

[0087] A control unit configured to control the above-mentioned return robot, and

[0088] Each of the plurality of process modules has a processing chamber connected to the above-mentioned return chamber and a substrate support disposed within the processing chamber, and is configured to perform substrate processing on a substrate on the substrate support, and

[0089] An aligner having a stage configured to allow a ring member to be placed thereon, and an optical sensor configured to detect the shape of the ring member placed on the stage, and

[0090] A memory unit comprising a table containing feature information representing the characteristics of each of a plurality of ring members associated with the identifier of each of the plurality of process modules, and

[0091] A substrate processing system having a specific part that extracts feature information of the ring member from the shape of the ring member detected by the optical sensor, and specifies the process module among the plurality of process modules to which the ring member should be returned from the identifier stored in relation to the feature information by referring to the table of the memory part.

[0092] [E2]

[0093] The above features include at least one of the inner diameter, outer diameter, and thickness of the ring member,

[0094] Substrate processing system described in E1.

[0095] [E3]

[0096] The above features include the number of notches formed in the ring member,

[0097] A substrate processing system described in E1 or E2.

[0098] [E4]

[0099] A first notch and a second notch are formed in the above ring member, and

[0100] The above feature includes the relative positional relationship between the first notch and the second notch.

[0101] A substrate processing system described in any one of E1 to E3.

[0102] [E5]

[0103] The above ring member is an edge ring used to surround a substrate on the substrate support or a cover ring used to surround the edge ring,

[0104] A substrate processing system described in any one of E1 to E4.

[0105] [E6]

[0106] The above stage is configured to be rotatable together with the ring member placed thereon, and

[0107] The above optical sensor is

[0108] A line sensor positioned to detect the outer edge and inner edge of the ring member, and

[0109] A light source configured to emit light toward the above-mentioned line sensor,

[0110] A substrate processing system described in any one of E1 to E5.

[0111] [E7]

[0112] The substrate processing system

[0113] A load lock module connected to the transfer chamber of the above vacuum transfer module, and

[0114] The present transport module further comprises another transport chamber connected to the load lock module and another transport robot configured to transport the substrate through the other transport chamber, and

[0115] The above aligner is connected to the other return chamber of the above air return module,

[0116] A substrate processing system described in any one of E1 to E6

[0117] [E8]

[0118] The above aligner is connected to the transfer chamber of the above vacuum transfer module,

[0119] A substrate processing system described in any one of E1 to E6.

[0120] [E9]

[0121] The substrate processing system further comprises a stoker module connected to the transfer chamber of the vacuum transfer module and configured to accommodate the ring member therein, and

[0122] The above aligner is disposed within the above stoker module,

[0123] Substrate processing system described in E8

[0124] [E10]

[0125] The above features include the thickness of the ring member,

[0126] The above stoker module includes another optical sensor configured to detect the thickness,

[0127] Substrate processing system described in E9.

[0128] [E11]

[0129] The above control unit

[0130] Before returning the ring member to a designated process module among the plurality of process modules, the return robot is controlled to return the ring member onto the stage of the aligner, and

[0131] Among the plurality of process modules above, the identifier of the process module to which the ring member returned onto the stage is to be returned is obtained by referencing the table using the characteristic information of the ring member returned onto the stage in the specific part, and

[0132] To determine whether the identifier of the process module specified above matches the identifier of the process module to be returned,

[0133] Composed of,

[0134] A substrate processing system described in any one of E1 to E10.

[0135] [E12]

[0136] The above control unit

[0137] After removing the ring member from the process module, the conveying robot is controlled to convey the ring member onto the stage of the aligner, and

[0138] The identifier of the process module to which the ring member returned to the stage among the plurality of process modules is to be returned is obtained from the specific unit by extracting the characteristic information of the ring member returned to the stage and referring to the table of the memory unit, and

[0139] To determine whether the identifier of the process module from which the above ring member was removed matches the identifier of the process module to be returned,

[0140] Composed of,

[0141] A substrate processing system described in any one of E1 to E11

[0142] [E13]

[0143] As a substrate processing method executed in a substrate processing system,

[0144] The above substrate processing system

[0145] Each of the plurality of process modules configured to perform substrate processing, and

[0146] An aligner configured to detect the characteristics of a ring member, and

[0147] A memory unit comprising a table containing feature information representing the characteristics of each of a plurality of ring members associated with the identifier of each of the plurality of process modules.

[0148] The substrate processing method is equipped with

[0149] (a) A process of conveying a ring member to the above aligner, and

[0150] (b) a process of detecting the shape of the ring member returned to the aligner after the process of (a) above, and

[0151] (c) After the process of (b) above, a process of extracting feature information of the ring member from the shape of the detected ring member, and specifying the process module to which the ring member is to be returned from the identifier stored in relation to the feature information by referring to the table of the memory unit.

[0152] A substrate processing method comprising

[0153] [E14]

[0154] The above (a) is performed before returning the ring member to a designated process module, and

[0155] (d) further comprising, after (c) above, a process of determining whether the identifier of the designated process module and the identifier of the process module to be returned match,

[0156] Substrate processing method described in E13.

[0157] [E15]

[0158] The above (a) is performed after the ring member is removed from the process module, and

[0159] (e) further comprising, after (c) above, a process of determining whether the identifier of the process module from which the ring member was removed matches the identifier of the process module to be returned,

[0160] Substrate processing method described in E13 or E14.

[0161] The processing methods described in E13 to E15 may be carried out in the substrate processing system described in E1 to E12.

[0162] From the foregoing description, it will be understood that various embodiments of the present disclosure are described herein for illustrative purposes only and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, and the true scope and spirit are indicated by the appended claims. Explanation of the symbols

[0163] 10… processing chamber 16… PCB support ACH, VCH… return chamber CR… Covering ER… Edge Ring IU… specific part L… light source LL1, LL2… Load Lock Module LM… Loader Module LS… line sensor MC… Control unit MU… Memory Department NT1… 1st notch NT2… 2nd notch PM1~PM6… Multiple process modules PS… Substrate processing system R… ring absence RAN… Aligner RSM… Stalker Module S1, S2… Optical sensor ST… Stage TR… Return robot VTM… Vacuum conveying module W… board

Claims

Claim 1 A substrate processing system comprising: a vacuum conveying module having a conveying chamber capable of depressurizing and a conveying robot configured to convey a substrate through the conveying chamber; a control unit configured to control the conveying robot; a plurality of process modules each having a processing chamber connected to the conveying chamber and a substrate support disposed within the processing chamber, configured to perform substrate processing on a substrate on the substrate support; an aligner having a stage configured to place a ring member thereon and an optical sensor configured to detect the shape of the ring member placed on the stage; a memory unit including a table containing feature information representing the characteristics of each of the plurality of ring members associated with each identifier of the plurality of process modules; and a specific unit that extracts the feature information of the ring member from the shape of the ring member detected by the optical sensor and, by referring to the table of the memory unit, specifies the process module among the plurality of process modules to which the ring member should be conveyed from the identifier stored associated with the feature information. Claim 2 A substrate processing system according to claim 1, wherein the feature comprises at least one of the inner diameter, outer diameter, and thickness of the ring member. Claim 3 A substrate processing system according to claim 1, wherein the feature comprises the number of notches formed in the ring member. Claim 4 A substrate processing system according to claim 1, wherein the ring member has a first notch and a second notch formed therein, and the feature includes a relative positional relationship between the first notch and the second notch. Claim 5 A substrate processing system according to claim 1, wherein the ring member is an edge ring used to surround a substrate on the substrate support or a cover ring used to surround the edge ring. Claim 6 In claim 1, the stage is rotatably configured together with the ring member mounted thereon, and the optical sensor A line sensor positioned to detect the outer edge and inner edge of the ring member, and A substrate processing system comprising a light source configured to emit light toward the above-mentioned line sensor. Claim 7 In any one of claims 1 to 6, the substrate processing system A load lock module connected to the transfer chamber of the above vacuum transfer module, and A substrate processing system further comprising a standby transport module having another transport chamber connected to the load lock module and another transport robot configured to transport the substrate through the other transport chamber, wherein the aligner is connected to the other transport chamber of the standby transport module. Claim 8 A substrate processing system according to any one of claims 1 to 6, wherein the aligner is connected to the return chamber of the vacuum return module. Claim 9 A substrate processing system according to claim 8, wherein the substrate processing system further comprises a stoker module connected to the conveying chamber of the vacuum conveying module and configured to accommodate the ring member therein, and the aligner is disposed within the stoker module. Claim 10 A substrate processing system according to claim 9, wherein the feature includes the thickness of the ring member, and the stoker module includes another optical sensor configured to detect the thickness. Claim 11 In any one of claims 1 to 6, the control unit Before returning the ring member to a designated process module among the plurality of process modules, the return robot is controlled to return the ring member onto the stage of the aligner, and Among the plurality of process modules, the identifier of the process module to which the ring member returned to the stage is to be returned is obtained by referencing the table using the characteristic information of the ring member returned to the stage in the specific part, and A substrate processing system configured to determine whether the identifier of the process module specified above matches the identifier of the process module to be returned. Claim 12 In any one of claims 1 to 6, the control unit After removing the ring member from the process module, the conveying robot is controlled to convey the ring member onto the stage of the aligner, and Among the plurality of process modules, the identifier of the process module to which the ring member returned to the stage is to be returned is obtained by referencing the table using the characteristic information of the ring member returned to the stage in the specific part, and A substrate processing system configured to determine whether the identifier of the process module from which the above ring member was removed matches the identifier of the process module to be returned. Claim 13 As a substrate processing method executed in a substrate processing system, the substrate processing system Each of the plurality of process modules configured to perform substrate processing, and An aligner configured to detect the characteristics of a ring member, and The substrate processing method comprises a memory unit including a table containing feature information representing the characteristics of each of a plurality of ring members associated with each of the identifiers of each of the plurality of process modules, and the substrate processing method (a) A process of conveying a ring member to the above aligner, and (b) a process of detecting the shape of the ring member returned to the aligner after the process of (a) above, and (c) A substrate processing method comprising, after the process of (b) above, extracting feature information of the ring member from the shape of the ring member detected, and specifying the process module to which the ring member should be returned from the identifier stored in relation to the feature information by referring to the table of the memory unit. Claim 14 A substrate processing method according to claim 13, wherein (a) is performed before returning the ring member to a designated process module, and (d) after (c), further comprising a process of determining whether the identifier of the designated process module matches the identifier of the process module to be returned. Claim 15 A substrate processing method according to claim 13 or claim 14, wherein (a) is performed after the ring member is removed from the process module, and (e) further comprises a process of determining whether the identifier of the process module from which the ring member was removed matches the identifier of the process module to be returned after (c).

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