Method for recycling hetero joint rings made of dissimilar material

Abstract

A method for recycling heterogeneous bonded rings made of dissimilar materials is presented, wherein dimensional stability is ensured during the process of bonding a silicon carbide ring to a newly manufactured alumina ring. The method involves manufacturing a new first material ring, applying an adhesive to one surface of the first material ring, cleaning an existing second material ring, preheating the second material ring, laminating the preheated second material ring onto the first material ring, and bonding the first and second material rings by heating, wherein the coefficient of thermal expansion of the second material ring is greater than that of the first material ring.

Description

Technology Field

[0001] The present invention relates to a method for recycling heterogeneous bonding rings, and more specifically, to a method for recycling heterogeneous bonding rings formed by bonding different materials, such as silicon carbide (SiC) and alumina (Al2O3), which are applied to a plasma treatment device. Background Technology

[0002] A plasma processing device arranges an upper electrode and a lower electrode within a chamber, mounts a substrate such as a semiconductor wafer or a glass substrate on top of the lower electrode, and applies power between the two electrodes. Electrons accelerated by the electric field between the two electrodes, electrons emitted from the electrodes, or heated electrons cause ionization collisions with molecules of the processing gas, thereby generating plasma of the processing gas. As design rules in the manufacturing of microelectronic devices become increasingly miniaturized, higher dimensional precision is required, and consequently, significantly higher power than conventional methods is being utilized. The plasma processing device incorporates components affected by the plasma, such as an edge ring, a focus ring, a heterojunction ring, and a showerhead; among these, the heterojunction ring is used for thermal insulation.

[0003] Meanwhile, to reduce costs, methods for recycling the aforementioned parts have been disclosed in Korean registered patents No. 10-1974421 and No. 10-2393963, and Japanese published patent No. 2007-184495; however, a method for recycling heterogeneous bonded rings formed by joining different materials, such as silicon carbide (SiC) and alumina (Al2O3), has not yet been presented. In this case, since silicon carbide is relatively more expensive than alumina, it is desirable to recycle silicon carbide. To recycle silicon carbide rings, dimensional stability with newly manufactured alumina rings must be ensured. This is because the coefficients of thermal expansion of silicon carbide rings and alumina rings are different. The problem to be solved

[0004] The problem that the present invention aims to solve is to provide a method for recycling a heterogeneous bonded ring made of dissimilar materials, wherein dimensional stability is ensured during the process of bonding a silicon carbide ring to a newly manufactured alumina ring. means of solving the problem

[0005] A method for recycling a heterogeneous bonding ring made of heterogeneous materials to solve the problem of the present invention first manufactures a new first material ring. Then, an adhesive is applied to one surface of the first material ring. An existing second material ring is cleaned. The second material ring is preheated. The preheated second material ring is laminated onto the first material ring. The first material ring and the second material ring are heated and bonded. At this time, the coefficient of thermal expansion of the second material ring is greater than the coefficient of thermal expansion of the first material ring.

[0006] In a preferred method of the present invention, the first material ring may be an alumina ring, and the second material ring may be a silicon carbide ring. The second material ring contracts in conjunction with the first material ring. The adhesive may be a silicone-based adhesive. The preheating temperature may be determined by the degree of misalignment between the fastening hole provided in the second material ring and the fastening groove provided in the first material ring. An alignment portion may be provided in the first material ring, and an alignment groove corresponding to the alignment portion may be provided in the second material ring. In the step of laminating the preheated second material ring onto the first material ring, the alignment portion and the alignment groove may be aligned. Effects of the invention

[0007] According to the method for recycling heterogeneous bonding rings made of heterogeneous materials of the present invention, dimensional stability is ensured during the process of bonding a silicon carbide ring to a newly manufactured alumina ring by bonding the silicon carbide ring while the silicon carbide ring is in a preheated state. Alternatively, alignment errors can be resolved during the process of bonding the alumina ring to the silicon carbide ring by utilizing alignment portions and alignment grooves. Brief explanation of the drawing

[0008] FIG. 1 is an exploded perspective view showing the process of recycling a first heterogeneous bonding ring according to the present invention. Figure 2 is a flowchart illustrating the recycling process in Figure 1. FIG. 3 is an exploded perspective view showing the process of recycling a second heterogeneous bonding ring according to the present invention. Figure 4 is a flowchart illustrating the recycling process in Figure 3. Specific details for implementing the invention

[0009] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. The embodiments described below may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. The drawings are exaggerated for convenience of explanation. Meanwhile, in the drawings, the thickness of the films (layers, patterns) and regions may be exaggerated for clarity. Also, where a film (layer, pattern) is described as being on the upper, upper, lower, or one surface of another film (layer, pattern), it may be formed directly on the other film (layer, pattern) or another film (layer, pattern) may be interposed between them.

[0010] Embodiments of the present invention present a method for recycling heterogeneous bonded rings made of dissimilar materials, wherein dimensional stability can be ensured during the process of bonding a silicon carbide ring to a newly manufactured alumina ring by bonding the silicon carbide ring while it is in a preheated state. To this end, the preheating of the silicon carbide ring will be examined in detail, and the process of recycling the preheated silicon carbide ring into a heterogeneous bonded ring by bonding it to a new alumina ring will be explained in detail. The heterogeneous bonded ring according to the embodiment of the present invention is formed by bonding different dissimilar materials, such as silicon carbide (SiC) and alumina (Al2O3), and is primarily used for thermal insulation. Here, silicon carbide (SiC) and alumina (Al2O3) are presented as preferred examples, and other dissimilar materials may be applied within the scope of the present invention. For example, yttria-zirconia composite oxide may be adopted instead of silicon carbide (SiC).

[0011] FIG. 1 is an exploded perspective view showing the process of recycling a first heterogeneous bonding ring (100) according to an embodiment of the present invention, and FIG. 2 is a flowchart for explaining the recycling process in FIG. 1. However, it is not a drawing in the strict sense, and for convenience of explanation, there may be components not shown in the drawing.

[0012] Referring to FIGS. 1 and 2, the process of recycling the first heterogeneous bonding ring (100) first involves manufacturing a new alumina ring (10) (S10). At this time, the new alumina ring (10) may include a plurality of fastening grooves (12) for the alumina ring (10) to be bonded to the silicon carbide ring (20). Since the alumina ring (10) is relatively inexpensive and there is a high possibility of fine damage caused by plasma, it is preferable to manufacture it anew rather than recycle it. In practice, the alumina is more susceptible to plasma than the silicon carbide, so the surface of the alumina ring (10) is more severely corroded than that of the silicon carbide ring (20), and significantly more etching may occur compared to the silicon carbide ring (20). Nevertheless, the alumina ring (10) may not be manufactured anew, but the existing alumina ring (10) may be cleaned and used.

[0013] Afterward, an adhesive (14) is applied to the new alumina ring (10) (S12). Any adhesive (14) that meets the purpose of the present invention may be applied, and a silicone-based adhesive (14) is more preferable. Silicone-based adhesives (14) have superior electrical insulation, heat resistance, weather resistance, and adhesion to various substrates compared to general organic adhesives. Silicone-based adhesives (14) can be classified into adhesives cured by addition reactions, adhesives cured by condensation reactions, or adhesives cured by peroxides. For example, in peroxide-curable silicone-based adhesives (14), the physical properties of the adhesive (14) can be controlled by adjusting the amount of organic peroxide acting as a catalyst. Peroxide adhesives (14) include organopolysiloxanes having silanol groups, organopolysiloxane resins containing silanol groups, and peroxide-curable silicone-based pressure-sensitive adhesive compositions composed of organic peroxide and organic solvents.

[0014] For more stable bonding at high temperatures, the silicone adhesive (14) is a silicon solid solution Si 1-x R x(R; is a solid solution; x is an atomic weight ratio) an adhesive (14) can be applied. Specifically, the solid solution (R) is a material having a crystal structure similar to silicon, a similar atomic radius, a similar electronegativity, and a similar valence electron. In particular, a material that can maintain a liquid phase with silicon and be stably synthesized with silicon is preferred, especially in a silicon-rich region on the phase diagram. As solid solution (R) satisfying all these conditions, at least one selected from aluminum (Al), titanium (Ti), iron (Fe), magnesium (Mg), copper (Cu), and germanium (Ge) may be cited.

[0015] Accordingly, Si 1-x R x Since the alumina ring (10) and silicon carbide ring (20) to be bonded must satisfy the above conditions in an environment with a high temperature, for example, about 800°C or higher, the atomic weight ratio (x) of the adhesive (14) is preferably 10~70at% when the solid solution material (R) is aluminum, 14~18at% when titanium, 11~25at% when iron, 8~45at% when magnesium, 13~62at% when copper, and 10~90at% when germanium. Si according to the present invention satisfying the above atomic weight ratio (x). 1-x R x Since it has a melting point of at least 800°C or higher, it can be easily applied to the high-temperature environment sought in the present invention. Si 1-x R x The adhesive (14) can be prepared by mixing the silicone and solid solution (R) in powder form, and preferably by mixing them through ball milling. Specifically, the two powders with an average particle size of about 50 μm can be mixed through ball milling for about 6 hours.

[0016] In addition to the process of manufacturing the new alumina ring (10) described above (S10) and applying the adhesive (14) (S12), the existing silicon carbide ring (20) is cleaned (S20). The cleaning of the silicon carbide ring (20) can be applied regardless of whether it is dry or wet cleaning. For example, the silicon carbide ring (20) can be cleaned using a carbon dioxide cleaning device. The carbon dioxide cleaning device is a device that generates dry ice in the form of particles through the adiabatic expansion of liquid carbon dioxide and sprays dry ice particles to remove foreign substances such as organic matter, acid, hydrocarbon, metal film, fine particles, and impurities attached to the surface of various objects to be cleaned.

[0017] Next, the silicon carbide ring (20) is preheated (S22). The silicon carbide ring (20) is provided with a fastening hole (22) that communicates with the alumina ring (10). The preheating of the silicon carbide ring (20) takes into account the difference in the coefficients of thermal expansion between silicon carbide (SiC) and alumina (Al2O3). At this time, the coefficient of thermal expansion of silicon carbide (SiC) is 4.3 x 10⁻¹⁰ -6 It is / ℃, and the coefficient of thermal expansion of alumina (Al2O3) is 7.8 x 10⁻⁶ -6 / ℃. When the difference in the coefficient of thermal expansion is taken into account, dimensional stability is ensured during the bonding and cooling process of silicon carbide (SiC) and alumina (Al2O3). In order to ensure dimensional stability due to the difference in the coefficient of thermal expansion, the silicon carbide ring (20) is preheated and expanded in advance before proceeding with the bonding.

[0018] The preheating temperature at which the silicon carbide ring (20) is preheated can be set in advance to ensure the dimensional stability. The preheating temperature may vary depending on the shape and size of the silicon carbide ring (20). The dimensional change of the silicon carbide ring (20) can be measured in a known manner, and a non-contact method using an optical method such as a laser is preferred. Here, the dimensional change can be verified based on the fastening hole (22). Specifically, the optimal dimensional change can be determined by checking the degree of misalignment between the pre-set fastening hole (22) and the fastening groove (12) while the alumina ring (10) is laminated on the silicon carbide ring (20), thereby determining the preheating temperature that induces the optimal dimensional change.

[0019] Next, a preheated silicon carbide ring (20) is laminated onto an alumina ring (10) (S30). The lamination of the alumina ring (10) and the silicon carbide ring (20) is not strictly limited to this, but can be carried out at room temperature in a vacuum or inert atmosphere. The laminated alumina ring (10) and the silicon carbide ring (20) are heated and bonded to complete the first heterogeneous bonding ring (100) (S32). The heating temperature can be determined by considering the type of silicone adhesive (14), the size of the first heterogeneous bonding ring (100), etc. If necessary, pressure can be applied during the bonding process of the alumina ring (10) and the silicon carbide ring (20) to ensure that the bonding of the alumina ring (10) and the silicon carbide ring (20) is more stable.

[0020] In the process of bonding the preheated and expanded silicon carbide ring (20) to the alumina ring (10) and cooling it, the shrinkage of the silicon carbide ring (20) by means of the adhesive (14) is linked to the shrinkage of the alumina ring (10). When the shrinkage of the silicon carbide ring (20) is linked, dimensional stability is ensured during the process in which the silicon carbide ring (20) is bonded to the newly manufactured alumina ring (10) to form the first heterogeneous bonding ring (100).

[0021] FIG. 3 is an exploded perspective view showing the process of recycling a second heterogeneous bonding ring (200) according to an embodiment of the present invention, and FIG. 4 is a flowchart for explaining the recycling process in FIG. 3. At this time, the second heterogeneous bonding ring (200) is identical to the first heterogeneous bonding ring (100) except that it includes an alignment portion (16) and an alignment groove (24).

[0022] Referring to FIGS. 3 and 4, the process of recycling the second heterogeneous bonding ring (200) first involves manufacturing a new alumina ring (10) that includes an alignment portion (16) (S10). The alignment portion (16) is joined by being aligned with an alignment groove (24) provided in the silicon carbide ring (20). The alignment portion (16) protrudes from the alumina ring (10), and the alignment groove (24) is formed concavely in the silicon carbide ring (20). There are at least two alignment portions (16) so that the alumina ring (10) is aligned and stacked on the silicon carbide ring (20). In the drawings, three alignment portions (16) are shown. To this end, an existing silicon carbide ring (20) that includes an alignment groove (24) is cleaned (S20). A silicon carbide ring (20) with an alignment groove (24) is preheated (S22) to induce a predetermined expansion, and then aligned with the alignment portion (16) of an alumina ring (10) to form a bond (S30).

[0023] By joining the alignment part (16) to the alignment groove (24) and utilizing the adhesive (14), dimensional stability can be more firmly secured during the process of completing the second heterogeneous bonding ring (200). Specifically, during the process of bonding the preheated and expanded silicon carbide ring (20) to the alumina ring (10) and cooling it, the shrinkage of the silicon carbide ring (20) is linked to the shrinkage of the alumina ring (10) by means of the alignment part (16), the alignment groove (24), and the adhesive (14). When the shrinkage of the silicon carbide ring (20) is linked, dimensional stability is secured during the process of forming the second heterogeneous bonding ring (200) by bonding the silicon carbide ring (20) to the newly manufactured alumina ring (10). By joining the alignment part (16) to the alignment groove (24), alignment errors that may occur during the bonding process of the alumina ring (10) and the silicon carbide ring (20) can be eliminated. In other words, the alignment part (16) and the alignment groove (24) can ensure dimensional stability and resolve alignment errors during the process of recycling the second heterogeneous bonding ring (200).

[0024] Here, the alumina ring (10) and the silicon carbide ring (20) can be referred to as the first material ring (10) and the second material ring (20), and the second material ring is a material that is preheated. Accordingly, the preheating temperature described above, the degree of misalignment between the fastening hole (22) and the fastening groove (12), etc., vary depending on the materials of the first and second material rings (10, 20). For example, when zirconia is combined with silicon carbide, the coefficient of thermal expansion of zirconia is 9~11*10 -6 Since it is / ℃, the preheating temperature, the degree of misalignment between the fastening hole (22) and the fastening groove (12), etc., are set differently compared to the case where the alumina described above is combined with silicon carbide.

[0025] Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications are possible by those skilled in the art within the scope of the technical concept of the present invention. Explanation of the symbols

[0026] 10; Alumina ring 12; Fastening groove 14; Adhesive 20; silicon carbide ring 16; alignment part 22; Fastening hole 24; Alignment groove 100, 200; 1st and 2nd heterojunction rings

Claims

Claim 1 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, comprising the steps of: producing a new first material ring; applying an adhesive to one surface of the first material ring; cleaning an existing second material ring; preheating the second material ring; laminating the preheated second material ring onto the first material ring; and heating and bonding the first material ring and the second material ring, wherein the coefficient of thermal expansion of the second material ring is greater than the coefficient of thermal expansion of the first material ring. Claim 2 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, characterized in that, in claim 1, the first material ring is an alumina ring and the second material ring is a silicon carbide ring. Claim 3 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, characterized in that, in claim 1, the second material ring shrinks in conjunction with the first material ring. Claim 4 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, characterized in that, in claim 1, the adhesive is a silicone-based adhesive. Claim 5 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, characterized in that, in claim 1, the preheating temperature is determined by the degree of misalignment between the fastening hole provided in the second material ring and the fastening groove provided in the first material ring. Claim 6 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, characterized in that, in claim 1, the first material ring is provided with an alignment portion, and the second material ring is provided with an alignment groove that corresponds to the alignment portion. Claim 7 A method for recycling a heterogeneous bonding ring made of heterogeneous materials, characterized in that, in the step of laminating the preheated second material ring onto the first material ring according to claim 6, the alignment portion and the alignment groove are aligned.

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